CN209050934U - A kind of LED encapsulating mould for pcb board - Google Patents
A kind of LED encapsulating mould for pcb board Download PDFInfo
- Publication number
- CN209050934U CN209050934U CN201821514757.2U CN201821514757U CN209050934U CN 209050934 U CN209050934 U CN 209050934U CN 201821514757 U CN201821514757 U CN 201821514757U CN 209050934 U CN209050934 U CN 209050934U
- Authority
- CN
- China
- Prior art keywords
- pedestal
- mold
- sliding sleeve
- gear
- pcb board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 208000002925 dental caries Diseases 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 abstract description 8
- 238000005538 encapsulation Methods 0.000 abstract description 7
- 230000003139 buffering effect Effects 0.000 abstract description 5
- 238000013016 damping Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
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- Casting Devices For Molds (AREA)
Abstract
The utility model discloses a kind of LED encapsulating moulds for pcb board, including pedestal, the upper end of the pedestal is fixedly connected with lower mold, the upper end sliding sleeve of the lower mold is connected to upper mold, the upper end of the upper mold is fixedly connected with cover board, the two sides of the pedestal are equipped with positioning mechanism, and separating mechanism is equipped between the cover board and pedestal.The utility model passes through the damping, buffering effect of spring, it is being inserted into inserted link, when unclamping cover board, cover board and upper mold will not quickly be fallen, it moves down and slows, and upper mold and lower mold will not hard hit, thus ensure that encapsulation stability and internal structure it is intact, also extend service life, the handle of rotation two sides drives Roof to open upper mold, make upper mold and lower mold separation, when avoiding mobile upper mold, the problem of lower mold and pedestal move together.
Description
Technical field
The utility model relates to encapsulating mould technical field more particularly to a kind of LED encapsulating moulds for pcb board.
Background technique
Currently, the industrial production method through frequently with ejection formation manufactures product, it is specifically exactly to be put into particles
Jet forming machine injects mold to form product shape, through cooling and solidifying after barrel heating and melting, then by the glue that melts of molten
After molding, that is, it can be taken off.The processing method of above-mentioned ejection formation is also widely used in the encapsulation of light-emitting diode (LED).
In the prior art, the sealing of pcb board LED is molded in a set of mutually matched upper mold and lower mold, for producing each LED
Semi-finished product.
In process of production, sealing is poured into the mold, after the completion of cooling, opens encapsulating mould, but due to filling
The colloid solidification entered, separation upper/lower die is relatively difficult, and when playing mold in separation, mobile upper mold may will drive lower die tool
It is mobile, so that the work to staff brings trouble.
Utility model content
Purpose of the utility model is to solve due to pouring into sealing in the mold, cooling is completed in the prior art
Afterwards, the relatively difficult problem of separation upper/lower die, and a kind of LED encapsulating mould for pcb board proposed.
To achieve the goals above, the utility model adopts the technical scheme that
A kind of LED encapsulating mould for pcb board, including pedestal, the upper end of the pedestal are fixedly connected with lower mold, institute
The upper end sliding sleeve for stating lower mold is connected to upper mold, and the upper end of the upper mold is fixedly connected with cover board, the pedestal
Two sides are equipped with positioning mechanism, and separating mechanism is equipped between the cover board and pedestal.
Preferably, the positioning mechanism includes four fixed links being welded on pedestal, the upper end of each fixed link
Slot is offered, the inside of each slot is equipped with inserted link, and the upper end of the inserted link is fixedly connected with the bottom end of cover board,
The lower end of the inserted link is equipped with buffer gear integrally formed with thin bar, the lower end of the inserted link.
Preferably, the buffer gear includes the sliding sleeve that sliding sleeve is connected in thin bar, in the thin bar of sliding sleeve lower end
Sliding sleeve is connected to spring, and the upper end of the spring is fixedly connected with sliding sleeve, the fixed company in the lower end of the spring and the bottom end of slot
It connects.
Preferably, the two sides of the slot offer sliding slot, and the inside of two sliding slots slidably connects sliding block,
Two sliding block sides close to each other are fixedly connected with sliding sleeve.
Preferably, the separating mechanism includes two fixed plates for being symmetrically welded at pedestal two sides, two fixed plates
Inside offer cavity, the inside of two cavitys is equipped with rack gear, and the upper end of two rack gears runs through fixed
Plate is simultaneously welded with top plate, and connecting shaft is inserted on the side wall of the cavity, and the other end of the connecting shaft through fixed plate and is consolidated
Surely it is socketed with handle, gear, the wheel and rack engagement have been fixedly attached in the connecting shaft of cavity inside.
Preferably, the rack gear is equipped with slide bar far from the side of gear, and the both ends of the slide bar are plugged in the side of cavity
In wall, limited block is slidably socketed on the slide bar, the limited block is fixedly connected close to the side of rack gear with rack gear.
The utility model has the beneficial effects that passing through the damping, buffering effect of spring, it is being inserted into inserted link, is unclamping cover board
When, cover board and upper mold will not quickly be fallen, move down and slow, and upper mold and lower mold will not hard hit,
To ensure that encapsulation stability and internal structure it is intact, also extend service life；After the completion of use, two sides are rotated
Handle, drive connecting shaft rotation, rotate gear, gear band carry-over bar moves up, and so that Roof is uncapped plate, thus convenient
The separation of upper mold and lower mold, when avoiding mobile upper mold, the problem of lower mold and pedestal move together；Limited block is in cunning
It is slided on bar, plays position-limiting action, avoided the mobile offset of rack gear, allow rack gear and gear stable engagement.
In conclusion the utility model passes through the damping, buffering effect of spring, it is being inserted into inserted link, when unclamping cover board,
Cover board and upper mold will not quickly be fallen, and moved down and slowed, and upper mold and lower mold will not hard hit, thus
Ensure that encapsulation stability and internal structure it is intact, also extend service life, rotate two sides handle drive Roof
Upper mold is opened, upper mold and lower mold separation are made, when avoiding mobile upper mold, the problem of lower mold and pedestal move together.
Detailed description of the invention
Fig. 1 be the utility model proposes a kind of LED encapsulating mould for pcb board structural schematic diagram；
Fig. 2 be the utility model proposes a kind of LED encapsulating mould for pcb board side view.
In figure: 1 pedestal, 2 lower molds, 3 upper molds, 4 cover boards, 5 fixed links, 6 slots, 7 inserted links, 8 springs, 9 sliding sleeves, 10 are slided
Block, 11 fixed plates, 12 top plates, 13 rack gears, 14 limited blocks, 15 slide bars, 16 gears, 17 connecting shafts.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Referring to Fig.1-2, a kind of LED encapsulating mould for pcb board, including pedestal 1, the upper end of pedestal 1 are fixedly connected with
Lower mold 2, the upper end sliding sleeve of lower mold 2 are connected to upper mold 3, and the upper end of upper mold 3 is fixedly connected with cover board 4, and the two of pedestal 1
Side is equipped with positioning mechanism, and positioning mechanism includes four fixed links 5 being welded on pedestal 1, and the upper end of each fixed link 5 is opened
Equipped with slot 6, the inside of each slot 6 is equipped with inserted link 7, and the upper end of inserted link 7 is fixedly connected with the bottom end of cover board 4, inserted link 7
Integrally formed with thin bar, thin bar diameter is small to facilitate insertion slot 6 for lower end.
The lower end of inserted link 7 is equipped with buffer gear, and buffer gear includes the sliding sleeve 9 that sliding sleeve is connected in thin bar, under sliding sleeve 9
Sliding sleeve is connected to spring 8 in the thin bar at end, and the upper end of spring 8 is fixedly connected with sliding sleeve 9, the lower end of spring 8 and the bottom end of slot 6
It is fixedly connected, by the damping, buffering effect of spring 8, is being inserted into inserted link 7, when unclamping cover board 4, cover board 4 and upper mold 3 are not
Can quickly fall, move down and slow, and upper mold 3 and lower mold 2 will not hard hit, to ensure that encapsulation
Stability and internal structure it is intact, also extend the service life of mold.
The two sides of slot 6 offer sliding slot, and the inside of two sliding slots slidably connects sliding block 10, two 10 phases of sliding block
Mutually close side is fixedly connected with sliding sleeve 9, and position-limiting action is played in the movement in sliding slot of sliding block 10, and the pop-up of sliding sleeve 9 is avoided to slide
Slot.
Be equipped with separating mechanism between cover board 4 and pedestal 1, separating mechanism include be symmetrically welded at two of 1 two sides of pedestal it is solid
Fixed board 11, the inside of two fixed plates 11 offer cavity, and the inside of two cavitys is equipped with rack gear 13, two rack gears 13
Upper end runs through fixed plate 11 and is welded with top plate 12, and connecting shaft 17, the other end of connecting shaft 17 are inserted on the side wall of cavity
Through fixed plate 11 and fixing sleeve is connected to handle, has been fixedly attached gear 16 in the connecting shaft 17 of cavity inside, gear 16 with
Rack gear 13 engages, and after the completion of use, rotates the handle of two sides, connecting shaft 17 is driven to rotate, rotate gear 16,16 band of gear
Carry-over bar 13 moves up, and top plate 12 is made to open cover board 4, to facilitate the separation of upper mold 3 and lower mold 2, avoids moving
When upper mold 3, the problem of lower mold 2 and pedestal 1 move together.
Rack gear 13 is equipped with slide bar 15 far from the side of gear 16, and the both ends of slide bar 15 are plugged in the side wall of cavity, sliding
Limited block 14 is slidably socketed on bar 15, limited block 14 is fixedly connected close to the side of rack gear 13 with rack gear 13, and limited block 14 exists
It is slided on slide bar 15, plays position-limiting action, avoided the mobile offset of rack gear 13, allow rack gear 13 and 16 stable engagement of gear.
Utility model works principle can be implemented by following operation:
In the utility model, be inserted into slot 6 by thin bar, facilitate staff that can quickly position, due to mold and
Cover board 4 generally has metal to be made, and quality is very big, and when putting down, upper mold 3 and lower mold can be all shaken, to influence
The integrality of encapsulation and internal structure, and pass through the damping, buffering effect of spring 8, it is being inserted into inserted link 7, when unclamping cover board 4,
Cover board 4 and upper mold 3 will not quickly be fallen, and moved down and slowed, and upper mold 3 and lower mold 2 will not hard hit,
To ensure that encapsulation stability and internal structure it is intact, also extend service life, after the completion of use, rotate two sides
Handle, drive connecting shaft 17 to rotate, rotate gear 16, gear 16 moves up with carry-over bar 13, and top plate 12 is made to open lid
Plate 4, to facilitate the separation of upper mold 3 and lower mold 2, when avoiding mobile upper mold 3, lower mold 2 and pedestal 1 are moved together
The problem of.
The above embodiments are only for explaining the technical ideas and features of the present invention, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and implement accordingly, do not limit the protection scope of the present invention,
All equivalent change or modifications according to made by the spirit of the present invention essence, should all cover the protection scope of the utility model it
It is interior.
Claims (6)
1. a kind of LED encapsulating mould for pcb board, including pedestal (1), which is characterized in that the upper end of the pedestal (1) is fixed
It is connected with lower mold (2), the upper end sliding sleeve of the lower mold (2) is connected to upper mold (3), and the upper end of the upper mold (3) is solid
Surely it is connected with cover board (4), the two sides of the pedestal (1) are equipped with positioning mechanism, are equipped between the cover board (4) and pedestal (1)
Separating mechanism.
2. a kind of LED encapsulating mould for pcb board according to claim 1, which is characterized in that the positioning mechanism packet
Four fixed links (5) being welded on pedestal (1) are included, the upper end of each fixed link (5) offers slot (6), each
The inside of the slot (6) is equipped with inserted link (7), and the upper end of the inserted link (7) is fixedly connected with the bottom end of cover board (4), described
The lower end of inserted link (7) is equipped with buffer gear integrally formed with thin bar, the lower end of the inserted link (7).
3. a kind of LED encapsulating mould for pcb board according to claim 2, which is characterized in that the buffer gear packet
The sliding sleeve (9) that sliding sleeve is connected in thin bar is included, sliding sleeve is connected to spring (8), the bullet in the thin bar of sliding sleeve (9) lower end
The upper end of spring (8) is fixedly connected with sliding sleeve (9), and the lower end of the spring (8) is fixedly connected with the bottom end of slot (6).
4. a kind of LED encapsulating mould for pcb board according to claim 3, which is characterized in that the slot (6)
Two sides offer sliding slot, and the inside of two sliding slots slidably connects sliding block (10), and two sliding blocks (10) are mutual
Close side is fixedly connected with sliding sleeve (9).
5. a kind of LED encapsulating mould for pcb board according to claim 1, which is characterized in that the separating mechanism packet
Two fixed plates (11) for being symmetrically welded at pedestal (1) two sides are included, the inside of two fixed plates (11) offers cavity,
The inside of two cavitys is equipped with rack gear (13), and the upper end of two rack gears (13) is run through fixed plate (11) and welded
Have top plate (12), be inserted on the side wall of the cavity connecting shaft (17), the other end of the connecting shaft (17) runs through fixed plate
(11) and fixing sleeve is connected to handle, has been fixedly attached gear (16), the gear in the connecting shaft (17) of cavity inside
(16) it is engaged with rack gear (13).
6. a kind of LED encapsulating mould for pcb board according to claim 5, which is characterized in that the rack gear (13) is remote
Side from gear (16) is equipped with slide bar (15), and the both ends of the slide bar (15) are plugged in the side wall of cavity, the slide bar
(15) it has been slidably socketed on limited block (14), the limited block (14) is close to the side of rack gear (13) and rack gear (13) fixed company
It connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821514757.2U CN209050934U (en) | 2018-09-17 | 2018-09-17 | A kind of LED encapsulating mould for pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821514757.2U CN209050934U (en) | 2018-09-17 | 2018-09-17 | A kind of LED encapsulating mould for pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209050934U true CN209050934U (en) | 2019-07-02 |
Family
ID=67048865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821514757.2U Expired - Fee Related CN209050934U (en) | 2018-09-17 | 2018-09-17 | A kind of LED encapsulating mould for pcb board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209050934U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109318433A (en) * | 2018-09-17 | 2019-02-12 | 盐城东紫光电科技有限公司 | A kind of LED encapsulating mould for pcb board |
| CN111294559A (en) * | 2020-02-11 | 2020-06-16 | 深圳供电局有限公司 | Electric power identification pile |
| CN111469384A (en) * | 2020-04-26 | 2020-07-31 | 江苏赛尔橡胶股份有限公司 | Mould for producing and forming rubber gangway ladder |
-
2018
- 2018-09-17 CN CN201821514757.2U patent/CN209050934U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109318433A (en) * | 2018-09-17 | 2019-02-12 | 盐城东紫光电科技有限公司 | A kind of LED encapsulating mould for pcb board |
| CN109318433B (en) * | 2018-09-17 | 2024-03-19 | 山东乾元半导体科技有限公司 | LED packaging mold for PCB |
| CN111294559A (en) * | 2020-02-11 | 2020-06-16 | 深圳供电局有限公司 | Electric power identification pile |
| CN111469384A (en) * | 2020-04-26 | 2020-07-31 | 江苏赛尔橡胶股份有限公司 | Mould for producing and forming rubber gangway ladder |
| CN111469384B (en) * | 2020-04-26 | 2022-01-04 | 江苏赛尔橡胶股份有限公司 | Mould for producing and forming rubber gangway ladder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190702 |