CN109318433B - LED packaging mold for PCB - Google Patents
LED packaging mold for PCB Download PDFInfo
- Publication number
- CN109318433B CN109318433B CN201811092790.5A CN201811092790A CN109318433B CN 109318433 B CN109318433 B CN 109318433B CN 201811092790 A CN201811092790 A CN 201811092790A CN 109318433 B CN109318433 B CN 109318433B
- Authority
- CN
- China
- Prior art keywords
- base
- die
- fixedly connected
- rack
- sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims 1
- 230000003139 buffering effect Effects 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- 238000013016 damping Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
- B29C45/2606—Guiding or centering means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The invention relates to an LED packaging die for a PCB (printed circuit board), which comprises a base, wherein the upper end of the base is fixedly connected with a lower die, the upper end of the lower die is in sliding sleeve connection with an upper die, the upper end of the upper die is fixedly connected with a cover plate, positioning mechanisms are arranged on two sides of the base, and a separation mechanism is arranged between the cover plate and the base. According to the invention, through the damping and buffering effects of the springs, the insert rod is inserted, when the cover plate is loosened, the cover plate and the upper die cannot rapidly fall down, the downward moving speed is reduced, and the upper die and the lower die cannot be impacted severely, so that the stability of packaging and the integrity of an internal structure are ensured, the service life is prolonged, the handles at two sides are rotated to drive the top plate to prop up the upper die, the upper die and the lower die are separated, and the problem that the lower die and the base move together when the upper die is moved is avoided.
Description
Technical Field
The invention relates to the technical field of packaging molds, in particular to an LED packaging mold for a PCB.
Background
At present, products are manufactured in a production mode of injection molding frequently in industry, specifically, plastic particles are put into an injection molding machine, heated and melted by a charging barrel, melted glue is injected into a mold to form the shape of the products, and the products are taken out after cooling, solidifying and molding. The above-described injection molding process is also widely used for packaging Light Emitting Diodes (LEDs). In the prior art, the sealing glue of the PCB LED is formed in a set of upper die and lower die which are matched with each other so as to produce semi-finished products of the LEDs.
In the production process, the sealing glue is filled into the set of dies, after cooling is finished, the sealing dies are opened, but the upper and lower dies are difficult to separate due to solidification of the filled glue, and when the upper and lower dies are separated, the lower dies can be driven to move by moving the upper die, so that troubles are brought to the work of staff.
Disclosure of Invention
The invention aims to solve the problem that in the prior art, the upper and lower dies are difficult to separate after cooling is finished due to the fact that sealing glue is filled into the set of dies, and provides an LED packaging die for a PCB.
In order to achieve the above purpose, the present invention adopts the following technical scheme: the utility model provides a LED encapsulation mould for PCB board, includes the base, the upper end fixedly connected with bed die of base, the upper end sliding sleeve of bed die has gone up the mould, the upper end fixedly connected with apron of going up the mould, the both sides of base all are equipped with positioning mechanism, be equipped with separating mechanism between apron and the base.
Preferably, the positioning mechanism comprises four fixing rods welded on the base, slots are formed in the upper ends of the fixing rods, inserting rods are arranged in the slots, the upper ends of the inserting rods are fixedly connected with the bottom end of the cover plate, thin rods are integrally formed in the lower ends of the inserting rods, and a buffer mechanism is arranged at the lower ends of the inserting rods.
Preferably, the buffer mechanism comprises a sliding sleeve sleeved on the thin rod in a sliding manner, a spring is sleeved on the thin rod at the lower end of the sliding sleeve in a sliding manner, the upper end of the spring is fixedly connected with the sliding sleeve, and the lower end of the spring is fixedly connected with the bottom end of the slot.
Preferably, both sides of the slot are provided with sliding grooves, the inside of each sliding groove is connected with a sliding block in a sliding way, and one side, close to each other, of each sliding block is fixedly connected with the sliding sleeve.
Preferably, the separating mechanism comprises two fixing plates symmetrically welded on two sides of the base, a cavity is formed in each fixing plate, racks are arranged in each cavity, the upper ends of the racks penetrate through the fixing plates and are welded with top plates, connecting shafts are inserted into the side walls of the cavities, the other ends of the connecting shafts penetrate through the fixing plates and are fixedly sleeved with handles, gears are fixedly sleeved on the connecting shafts in the cavities, and the gears are meshed with the racks.
Preferably, a sliding rod is arranged on one side, far away from the gear, of the rack, two ends of the sliding rod are inserted into the side wall of the cavity, a limiting block is sleeved on the sliding rod in a sliding mode, and one side, close to the rack, of the limiting block is fixedly connected with the rack.
Compared with the prior art, the invention has the beneficial effects that: through the damping and buffering effects of the springs, the inserted link is inserted, when the cover plate is loosened, the cover plate and the upper die cannot rapidly fall down, the downward moving speed is reduced, and the upper die and the lower die cannot be impacted severely, so that the stability of encapsulation and the integrity of an internal structure are ensured, and the service life is prolonged; after the use is finished, the handles at the two sides are rotated to drive the connecting shaft to rotate, so that the gear rotates, the rack is driven by the gear to move upwards, and the cover plate is pushed open by the top plate, thereby facilitating the separation of the upper die and the lower die and avoiding the problem that the lower die and the base move together when the upper die is moved; the limiting block slides on the sliding rod to play a limiting role, so that the movement deviation of the rack is avoided, and the rack can be stably meshed with the gear.
In summary, the invention makes the insert rod insert through the shock absorption and buffering effect of the spring, when the cover plate is loosened, the cover plate and the upper die cannot fall down rapidly, the downward moving speed is reduced, and the upper die and the lower die cannot impact violently, so that the stability of encapsulation and the integrity of an internal structure are ensured, the service life is prolonged, the handles at two sides are rotated to drive the top plate to prop up the upper die, the upper die and the lower die are separated, and the problem that the lower die and the base move together when the upper die is moved is avoided.
Drawings
Fig. 1 is a schematic structural diagram of an LED package mold for a PCB according to the present invention;
fig. 2 is a side view of an LED package mold for a PCB according to the present invention.
In the figure: 1 base, 2 lower mould, 3 upper mould, 4 apron, 5 dead levers, 6 slots, 7 inserted bars, 8 springs, 9 sliding sleeves, 10 sliding blocks, 11 fixed plates, 12 top plates, 13 racks, 14 limiting blocks, 15 sliding rods, 16 gears and 17 connecting shafts.
Detailed Description
The preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Referring to fig. 1-2, an LED package mold for a PCB board includes a base 1, the upper end fixedly connected with bed die 2 of base 1, the upper end slip of bed die 2 has cup jointed upper die 3, the upper end fixedly connected with apron 4 of upper die 3, the both sides of base 1 all are equipped with positioning mechanism, positioning mechanism includes four dead levers 5 welded on base 1, slot 6 has all been seted up to the upper end of every dead lever 5, the inside of every slot 6 all is equipped with inserted bar 7, the upper end of inserted bar 7 and the bottom fixed connection of apron 4, the lower extreme integrated into one piece of inserted bar 7 has the thin pole, the thin pole diameter is little convenient to insert slot 6.
The lower extreme of inserted bar 7 is equipped with buffer gear, buffer gear has cup jointed sliding sleeve 9 on the thin pole including sliding, sliding sleeve has cup jointed spring 8 on the thin pole of sliding sleeve 9 lower extreme, the upper end and the 9 fixed connection of sliding sleeve of spring 8, the lower extreme and the bottom fixed connection of slot 6 of spring 8, through the shock attenuation buffering effect of spring 8, make inserted bar 7 insert, when unclamping apron 4, apron 4 and last mould 3 can not quick whereabouts, downward movement speed slows down, and go up mould 3 and bed die 2 can not violently strike, thereby guaranteed the stability of encapsulation and the intact of inner structure, also prolonged the life of mould.
The both sides of slot 6 have all been seted up the spout, and the inside of two spouts is all sliding connection has slider 10, and one side that two sliders 10 are close to each other all with sliding sleeve 9 fixed connection, slider 10 removes in the spout and plays spacing effect, avoids sliding sleeve 9 to pop out the spout.
The separating mechanism is arranged between the cover plate 4 and the base 1 and comprises two fixing plates 11 symmetrically welded on two sides of the base 1, cavities are formed in the two fixing plates 11, racks 13 are arranged in the two cavities, the upper ends of the two racks 13 penetrate through the fixing plates 11 and are welded with a top plate 12, a connecting shaft 17 is inserted into the side wall of the cavity, the other end of the connecting shaft 17 penetrates through the fixing plates 11 and is fixedly sleeved with a handle, a gear 16 is fixedly sleeved on the connecting shaft 17 in the cavity, the gear 16 is meshed with the racks 13, after the separating mechanism is used, the handles on two sides are rotated to drive the connecting shaft 17 to rotate, the gear 16 is enabled to rotate, the gear 16 drives the racks 13 to move upwards, and the top plate 12 is enabled to jack the cover plate 4, so that separation of an upper die 3 and a lower die 2 is facilitated, and the problem that the lower die 2 and the base 1 move together when the upper die 3 is prevented from moving is solved.
One side of the rack 13, which is far away from the gear 16, is provided with a slide bar 15, two ends of the slide bar 15 are inserted into the side wall of the cavity, a limiting block 14 is sleeved on the slide bar 15 in a sliding manner, one side of the limiting block 14, which is close to the rack 13, is fixedly connected with the rack 13, and the limiting block 14 slides on the slide bar 15 to play a limiting role, so that the movement deviation of the rack 13 is avoided, and the rack 13 can be stably meshed with the gear 16.
The working principle of the invention can be realized by the following operations:
in the invention, the thin rod is inserted into the slot 6, so that a worker can conveniently and quickly position, as the die and the cover plate 4 are generally made of metal, the quality is very high, when the die is put down, the upper die 3 and the lower die are vibrated, so that the integrity of the packaging and the internal structure is affected, the insert rod 7 is inserted through the damping and buffering effects of the spring 8, when the cover plate 4 is released, the cover plate 4 and the upper die 3 cannot quickly fall down, the downward moving speed is slowed down, the upper die 3 and the lower die 2 cannot violently strike, so that the packaging stability and the integrity of the internal structure are ensured, the service life is prolonged, after the die is used, the handles on two sides are rotated, the connecting shaft 17 is driven to rotate, the gear 16 is driven to rotate, the rack 13 is driven to move upwards, so that the top plate 12 jacks the cover plate 4, the upper die 3 and the lower die 2 are conveniently separated, and the problem that the lower die 2 and the base 1 move together when the upper die 3 is moved is avoided.
The above embodiments are provided to illustrate the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (3)
1. The utility model provides a LED encapsulation mould for PCB board, includes base (1), its characterized in that, the upper end fixedly connected with bed die (2) of base (1), the upper end slip of bed die (2) has cup jointed last mould (3), the upper end fixedly connected with apron (4) of last mould (3), both sides of base (1) all are equipped with positioning mechanism, be equipped with separating mechanism between apron (4) and base (1); the positioning mechanism comprises four fixing rods (5) welded on a base (1), slots (6) are formed in the upper end of each fixing rod (5), inserting rods (7) are arranged in each slot (6), the upper ends of the inserting rods (7) are fixedly connected with the bottom end of a cover plate (4), thin rods are integrally formed at the lower ends of the inserting rods (7), and a buffer mechanism is arranged at the lower ends of the inserting rods (7); the buffer mechanism comprises a sliding sleeve (9) which is sleeved on a thin rod in a sliding manner, a spring (8) is sleeved on the thin rod at the lower end of the sliding sleeve (9) in a sliding manner, the upper end of the spring (8) is fixedly connected with the sliding sleeve (9), and the lower end of the spring (8) is fixedly connected with the bottom end of the slot (6); the utility model discloses a separating mechanism, including symmetry welding two fixed plates (11) in base (1) both sides, two cavity has all been seted up to the inside of fixed plate (11), two the inside of cavity all is equipped with rack (13), two the upper end of rack (13) all runs through fixed plate (11) and welds roof (12), it has connecting axle (17) to insert on the lateral wall of cavity, the other end of connecting axle (17) runs through fixed plate (11) and fixed the cup joint has the handle, inside at the cavity fixed cup joint gear (16) on connecting axle (17), gear (16) and rack (13) meshing.
2. The LED packaging die for the PCB according to claim 1, wherein sliding grooves are formed in two sides of the slot (6), sliding blocks (10) are slidably connected in the two sliding grooves, and one sides, close to each other, of the two sliding blocks (10) are fixedly connected with the sliding sleeve (9).
3. The LED packaging die for the PCB according to claim 1, wherein a slide bar (15) is arranged on one side, far away from the gear (16), of the rack (13), two ends of the slide bar (15) are inserted into the side wall of the cavity, a limiting block (14) is sleeved on the slide bar (15) in a sliding manner, and one side, close to the rack (13), of the limiting block (14) is fixedly connected with the rack (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811092790.5A CN109318433B (en) | 2018-09-17 | 2018-09-17 | LED packaging mold for PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811092790.5A CN109318433B (en) | 2018-09-17 | 2018-09-17 | LED packaging mold for PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109318433A CN109318433A (en) | 2019-02-12 |
| CN109318433B true CN109318433B (en) | 2024-03-19 |
Family
ID=65266087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811092790.5A Active CN109318433B (en) | 2018-09-17 | 2018-09-17 | LED packaging mold for PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109318433B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111294559B (en) * | 2020-02-11 | 2021-11-16 | 深圳供电局有限公司 | Electric power identification pile |
| CN112589034B (en) * | 2020-12-18 | 2022-09-16 | 山东华民钢球股份有限公司 | Righting device for crank press blank and working method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203391230U (en) * | 2013-07-02 | 2014-01-15 | 单井精密工业(昆山)有限公司 | LED (Light Emitting Diode) packaging mould for PCB (Printed Circuit Board) |
| CN203737855U (en) * | 2014-04-02 | 2014-07-30 | 慈溪市连赢模具有限公司 | Die for engineering |
| DE202016103927U1 (en) * | 2016-07-20 | 2016-08-04 | Shu-Hung Lin | Housing technology for CSP LEDs |
| CN205551242U (en) * | 2016-04-01 | 2016-09-07 | 孟飞 | Mould |
| CN108032476A (en) * | 2017-12-01 | 2018-05-15 | 柳州市钜嘉机械有限公司 | A kind of automobile ceiling molding mould |
| CN209050934U (en) * | 2018-09-17 | 2019-07-02 | 盐城东紫光电科技有限公司 | A kind of LED encapsulating mould for pcb board |
-
2018
- 2018-09-17 CN CN201811092790.5A patent/CN109318433B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203391230U (en) * | 2013-07-02 | 2014-01-15 | 单井精密工业(昆山)有限公司 | LED (Light Emitting Diode) packaging mould for PCB (Printed Circuit Board) |
| CN203737855U (en) * | 2014-04-02 | 2014-07-30 | 慈溪市连赢模具有限公司 | Die for engineering |
| CN205551242U (en) * | 2016-04-01 | 2016-09-07 | 孟飞 | Mould |
| DE202016103927U1 (en) * | 2016-07-20 | 2016-08-04 | Shu-Hung Lin | Housing technology for CSP LEDs |
| CN108032476A (en) * | 2017-12-01 | 2018-05-15 | 柳州市钜嘉机械有限公司 | A kind of automobile ceiling molding mould |
| CN209050934U (en) * | 2018-09-17 | 2019-07-02 | 盐城东紫光电科技有限公司 | A kind of LED encapsulating mould for pcb board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109318433A (en) | 2019-02-12 |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20240219 Address after: 274900 1 km south of the station in Wanfeng Town, Juye County, Heze City, Shandong Province, west of Provincial Highway 242 Applicant after: Shandong Qianyuan Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 224000 Photoelectric Industrial Park, No. 66 Lijiang Road, Yancheng Economic and Technological Development Zone, Jiangsu Province Applicant before: YANCHENG DONGZI OPTOELECTRONICS TECHNOLOGY CO.,LTD. Country or region before: China |
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