CN109318433B - LED packaging mold for PCB - Google Patents
LED packaging mold for PCB Download PDFInfo
- Publication number
- CN109318433B CN109318433B CN201811092790.5A CN201811092790A CN109318433B CN 109318433 B CN109318433 B CN 109318433B CN 201811092790 A CN201811092790 A CN 201811092790A CN 109318433 B CN109318433 B CN 109318433B
- Authority
- CN
- China
- Prior art keywords
- base
- die
- fixedly connected
- rack
- sliding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims 1
- 230000003139 buffering effect Effects 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- 238000013016 damping Methods 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
- B29C45/2606—Guiding or centering means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Closing Of Containers (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811092790.5A CN109318433B (en) | 2018-09-17 | 2018-09-17 | LED packaging mold for PCB |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811092790.5A CN109318433B (en) | 2018-09-17 | 2018-09-17 | LED packaging mold for PCB |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109318433A CN109318433A (en) | 2019-02-12 |
CN109318433B true CN109318433B (en) | 2024-03-19 |
Family
ID=65266087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811092790.5A Active CN109318433B (en) | 2018-09-17 | 2018-09-17 | LED packaging mold for PCB |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109318433B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111294559B (en) * | 2020-02-11 | 2021-11-16 | 深圳供电局有限公司 | Electric power identification pile |
CN112589034B (en) * | 2020-12-18 | 2022-09-16 | 山东华民钢球股份有限公司 | Righting device for crank press blank and working method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203391230U (en) * | 2013-07-02 | 2014-01-15 | 单井精密工业(昆山)有限公司 | LED (Light Emitting Diode) packaging mould for PCB (Printed Circuit Board) |
CN203737855U (en) * | 2014-04-02 | 2014-07-30 | 慈溪市连赢模具有限公司 | Die for engineering |
DE202016103927U1 (en) * | 2016-07-20 | 2016-08-04 | Shu-Hung Lin | Housing technology for CSP LEDs |
CN205551242U (en) * | 2016-04-01 | 2016-09-07 | 孟飞 | Mould |
CN108032476A (en) * | 2017-12-01 | 2018-05-15 | 柳州市钜嘉机械有限公司 | A kind of automobile ceiling molding mould |
CN209050934U (en) * | 2018-09-17 | 2019-07-02 | 盐城东紫光电科技有限公司 | A kind of LED encapsulating mould for pcb board |
-
2018
- 2018-09-17 CN CN201811092790.5A patent/CN109318433B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203391230U (en) * | 2013-07-02 | 2014-01-15 | 单井精密工业(昆山)有限公司 | LED (Light Emitting Diode) packaging mould for PCB (Printed Circuit Board) |
CN203737855U (en) * | 2014-04-02 | 2014-07-30 | 慈溪市连赢模具有限公司 | Die for engineering |
CN205551242U (en) * | 2016-04-01 | 2016-09-07 | 孟飞 | Mould |
DE202016103927U1 (en) * | 2016-07-20 | 2016-08-04 | Shu-Hung Lin | Housing technology for CSP LEDs |
CN108032476A (en) * | 2017-12-01 | 2018-05-15 | 柳州市钜嘉机械有限公司 | A kind of automobile ceiling molding mould |
CN209050934U (en) * | 2018-09-17 | 2019-07-02 | 盐城东紫光电科技有限公司 | A kind of LED encapsulating mould for pcb board |
Also Published As
Publication number | Publication date |
---|---|
CN109318433A (en) | 2019-02-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240219 Address after: 274900 1 km south of the station in Wanfeng Town, Juye County, Heze City, Shandong Province, west of Provincial Highway 242 Applicant after: Shandong Qianyuan Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 224000 Photoelectric Industrial Park, No. 66 Lijiang Road, Yancheng Economic and Technological Development Zone, Jiangsu Province Applicant before: YANCHENG DONGZI OPTOELECTRONICS TECHNOLOGY CO.,LTD. Country or region before: China |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240529 Address after: Building 1 and 3, Qilin Communication Electronics Industrial Park, No. 006 Liaoyuan Road, Fenghuang Street Office, Juye County, Heze City, Shandong Province, 274900 Patentee after: Shandong Daning Semiconductor Co.,Ltd. Country or region after: China Address before: 274900 1 km south of the station in Wanfeng Town, Juye County, Heze City, Shandong Province, west of Provincial Highway 242 Patentee before: Shandong Qianyuan Semiconductor Technology Co.,Ltd. Country or region before: China |