TW201448074A - Resin molding apparatus and resin molding method - Google Patents

Abstract

The object of present invention is to provide a technique for improving quality of moldings. In order to achieve the object, the present invention includes a lower mold 32 having a lower mold cavity piece 34 forming the bottom part of a cavity concave portion 33; a lower mold clamper 35 forming the side part of said cavity concave portion 33; film loader 57 for holding and conveying film F mounted with resin R, and absorbing portion 67 for absorbing the film F managed to cover the end face of lower mold clamper 35 and lower end face of lower mold cavity piece 34; wherein, the lower mold cavity piece 34 moves opposite to the lower mold clamper 35, the film loader 57 configurates to place the film F onto the lower mold 32 having horizontally maintained end faces of lower mold cavity piece 34, such that the resin R horizontally maintained is positioned on the lower cavity piece 34; while the absorbing portion 67 absorbs and keeps the film F following the inside of said cavity concave portion 33, and supply the resin R to the cavity concave portion 33.

Description

Resin molding device and resin molding method

The present invention relates to an effective technique applicable to a resin molding apparatus and a resin molding method.

For example, in a molding such as a WLP (Wafer Level Package), a large workpiece is placed in a lower mold (for example, a plurality of wafer parts mounted on a substrate and a substrate are electrically connected by wire bonding), and the upper mold is used to form a mold. The molding die of the cavity recess (which becomes a cavity when the workpiece is held) is performed. However, when the resin is supplied to the workpiece by the molding die and the compression molding is performed, the resin placed in the center of the workpiece overflows to the outside, and the molded product is likely to be caused by the shrinkage of the air or the lead offset due to the inclusion of air. Poor quality.

On the other hand, the lower mold uses a molding die constituting a cavity concave portion (lower mold cavity), and a resin is supplied to the cavity concave portion, and a wafer part or a bonding wire of the workpiece held in the upper mold can be immersed in the molten resin. , resin molding. Such resin molding in the lower mold cavity can reduce the quality defects of molded articles such as shrinkage holes and lead offsets. A molding die constituting such a lower mold cavity is described in, for example, JP-A-2004-148621 (Patent Document 1).

In Patent Document 1, it is described that the release film is deformed in the shape of the cavity concave portion outside the molding die, and the resin is supplied to the preform portion (bottom portion) corresponding to the bottom portion of the cavity concave portion, and the release film and the resin are carried into the molding die. Technology.

Advanced technical literature

Patent Document 1: JP-A-2004-148621

For example, the release film described in Patent Document 1 uses a film having a certain flexibility, stretchability, and heat resistance. Such a release film is heated to a certain degree of temperature, causing heat shrinkage to shrink toward the center thereof, or uneven wrinkles may occur. Further, for example, when the release film is deformed in accordance with the shape of the concave portion of the cavity, it can be said that the system is somewhat skewed.

Therefore, when the release film is placed in a shape of, for example, a cavity concave portion, when it is placed on a previously heated molding die, the release film cannot be maintained in a desired shape. It is possible for the release film to have wrinkles, for example, or to have overlapping slits. If the release film is wrinkled or overlapped as described above, there is a problem that the appearance of the molded article is transferred to the molded article or the resin is leaked from the overlapped portion.

It is an object of the present invention to provide a technique for improving the quality of a molded article. The above and other objects and novel features of the present invention will be apparent from the description and the appended claims.

The outline of a representative of the invention disclosed in the present invention will be briefly described below.

An embodiment of the resin molding apparatus of the present invention is a resin molding apparatus for molding a workpiece, and a resin molding apparatus for molding a workpiece, wherein the lower mold is provided with: a mold which is formed by molding a cavity below the concave portion of the cavity to fill the concave portion of the cavity, wherein: a lower mold core constituting a bottom portion of the cavity concave portion; a lower mold clamp constituting a side portion of the cavity concave portion; a film for holding the resin and a loader capable of being transported; and an adsorption portion for adsorbing and arranging (also Said mounting) is a film covering the end face of the mold and the end face of the clamp; the lower mold core is configured to move relative to the lower mold clamp, and the loader is attached to the end face of the lower mold Arranging on the lower mold which is horizontal (also referred to as no height difference, equivalent height) with the end surface of the lower mold clamp, so that the resin is located on the lower mold core, and the adsorption portion is configured to follow the mold cavity The inside of the concave portion is suction-held, and the resin is supplied to the cavity concave portion.

A resin molding apparatus according to another embodiment of the present invention is a resin molding apparatus for molding a workpiece, and a resin molding apparatus for molding a workpiece, wherein a first mold and a second mold having a cavity concave portion are formed to fill the concave portion of the cavity; The second mold has: a mold core constituting a bottom portion of the cavity of the cavity; a clamper constituting a side portion of the concave portion of the cavity; a movable portion capable of relatively moving the mold to the clamp; and an adsorption portion capable of adsorbing a film configured to cover the end face of the mold core and the end surface of the clamper; and a loader that conveys the film in a flat state while positioning the end face of the mold core with the end face of the clamper The same height (also referred to as horizontal, no height difference) is such that the film is kept in a flat state on the end face of the mold and the end face of the clamp.

A resin molding method according to an embodiment of the present invention is characterized in that a resin molding apparatus is used, and an upper mold and a resin mold formed by molding a mold under the concave portion of the cavity to fill the concave portion of the cavity, and a resin molding method for molding the workpiece The lower mold includes: a lower mold core constituting a bottom portion of the cavity concave portion; a lower mold clamp constituting a side portion of the cavity concave portion; a film for holding the resin and a loader capable of being transported; and an adsorption portion; The method is characterized in that: the film is configured to cover the end surface of the mold core and the end surface of the clamper; and comprises: (a) the lower mold of the lower mold mold end surface and the end surface of the lower mold clamp being horizontal; Configuring the film by the loader to place the resin on the lower mold core; (b) sucking the film by the adsorption portion, and moving the lower mold mold relative to the lower mold holder; The cavity concave portion is formed so as to be sucked and held along the inner surface of the cavity concave portion, and the resin is directly supplied to the cavity concave portion.

According to the present invention, the film can be disposed in a flat state, and the film can be deformed along the shape of the concave portion of the cavity, for example, wrinkles or overlapping of the film can be prevented. Therefore, it is possible to prevent the appearance of the molded article from being poor, or the resin leaking from the overlap to improve the quality of the molded article. Further, the lower mold constitutes a cavity recess, so that, for example, a wafer component (for example, a semiconductor wafer, a wafer capacitor) or a bonding wire is immersed in a resin melted in a cavity concave portion, and the quality of the molded article due to shrinkage holes or lead offset can be reduced. bad.

Further, in the resin molding apparatus according to the embodiment of the present invention, it is preferable that the loader includes an operation portion that has a holding surface that holds the film, and a recess that is recessed on the holding surface and is mounted on the film. a retreating recess of the resin; communicating with the holding surface around the recess to attract an air passage of the film.

Thereby, the state (shape and amount) of the resin mounted on the film can be maintained, and the resin can be supplied to the cavity concave portion. Further, the weight of the resin in the concave portion mounted on the film can adsorb and hold the film without bending it.

Further, in the resin molding apparatus according to the embodiment of the present invention, it is preferable that the loader includes a roller-shaped shutter portion that can switch the holding surface, and the shutter portion is supported and transported by the shutter portion in a closed state of the shutter portion. In the above film, the film is placed on the lower mold in a state where the shutter portion is opened.

Thereby, the weight of the resin in the concave portion mounted on the film can keep the film from being bent, and the film can be kept flat in the shutter portion. Further, when the film is placed on the lower mold, the shutter portion can be taken up to achieve a space saving effect.

Further, in the resin molding apparatus according to the embodiment of the present invention, it is preferable that the loader includes a heating unit and a cooling unit.

Thereby, heating or cooling of the film or the resin carried thereon can be easily assisted.

Further, in the resin molding apparatus according to the embodiment of the present invention, it is preferable that the upper portion of the lower mold core is detachably provided, and the lower portion The upper portion of the mold clamping mold is detachably disposed, and the upper portion of the lower mold core and the upper portion of the lower mold clamp are connected by a connecting member, and the loader is at an upper end surface of the lower mold core and an upper portion of the lower mold clamp When the end surface is horizontal, the film disposed to cover the end surface of the upper portion of the lower mold core and the end surface of the upper portion of the lower mold clamp is conveyed.

Thereby, the film and the resin mounted thereon can be placed on the molding die in a stable state.

Further, in the resin molding apparatus according to the embodiment of the present invention, it is preferable that the annular upper portion and the lower fixing plate are provided, and the lower fixing plate is formed with a recess from the side of the upper fixing plate at the peripheral end portion and extends in the circumferential direction. In the step portion, the film is interposed between the upper fixing plate and the lower fixing plate, and the lower fixing plate step portion is fitted to the inner fixing portion of the upper fixing plate and fitted to the upper fixing plate to form a diaphragm portion. The lower mold clamp has a step portion that is recessed from the end surface and extends in the circumferential direction at the peripheral end portion, so that the lower mold clamp step portion corresponds to the inner diameter portion of the lower fixing plate and is fitted to the diaphragm portion. .

Thereby, the flatness of the holding film can be easily configured, and it can be directly disposed in the lower mold in this state.

Further, in the resin molding apparatus according to the embodiment of the present invention, it is preferable that the upper portion of the lower mold core is detachably provided, and in the mold opening state, the upper portion of the lower mold core is supported by the floating, so that the lower portion The end face of the upper part of the die and the end face of the lower die clamp are horizontal.

Thereby, it is not necessary to press the lower mold clamp, for example, the conveyance unit, and the lower end surface of the lower mold clamp and the end surface of the lower mold clamp are horizontal, and the operation and structure of the conveyance unit can be simplified. Further, when the film is placed on the lower mold, since the upper portion of the lower mold core is in a floating state, heat shrinkage of the film can be prevented, and the resin loaded on the film can be prevented from being overheated, and heating adjustment can be more easily performed.

Further, in the resin molding apparatus according to the embodiment of the present invention, preferably, the lower mold holder includes a plurality of pins that are protruded from the end surface of the lower mold clamp and are supported by the floating, wherein the plurality of pins are from the above The end surface of the lower mold clamp protrudes and supports the workpiece, and the workpiece is housed inside the lower mold clamp while being clamped.

Thereby, it is possible to prevent the workpiece held by the upper mold from being dropped before being clamped.

110‧‧‧Processed material supply department

120‧‧‧Resin Supply Department

130‧‧‧Depression

140‧‧‧Department of Cooling

150‧‧‧ Hardening Department

160‧‧‧Processed material storage department

170‧‧‧Control Department

180‧‧‧Robots Department

190‧‧‧Loader

121‧‧‧Particle Resin Storage Department

122‧‧‧Small resin storage department

123‧‧‧ slot

124‧‧‧Connected components

125‧‧‧Support table

126‧‧‧ Holding components

127‧‧‧ cutting members

10‧‧‧Substrate

10a‧‧‧One side of the workpiece W

10b‧‧‧The workpiece W is opposite to 10a

11‧‧‧ wafer parts

11A‧‧‧Bumps

12‧‧‧1st fixture

12a‧‧‧1st opening

13‧‧‧2nd fixture

13a‧‧‧2nd opening

14, 15‧‧‧ Resin Molding Department

30‧‧‧Molding mould

31‧‧‧上模

32‧‧‧Down

33‧‧‧ cavity recess

34‧‧‧Down mold

34A‧‧‧plate fixture

35‧‧‧Down mold clamp

35A‧‧‧ fixture

36‧‧‧Upper mold base

37‧‧‧Upper insert

37A‧‧‧plate fixture

40‧‧‧Upper Mold Clamp

41‧‧‧through holes

41A‧‧ Air passage

42‧‧‧Flexible components

43‧‧‧ Sealing members

44‧‧‧Air passage

45‧‧‧Decompression Department

46‧‧‧ Lower mold base

47‧‧‧through holes

47A‧‧ Air passage

50‧‧‧Flexible components

51‧‧‧ Sealing members

52, 54‧‧ Air passage

53, 55‧‧ ‧ adsorption department

56‧‧‧Processed material loader

57, 57a‧‧" film loader

60‧‧‧Support board

61‧‧‧Support

62‧‧‧ Positioning Department

63‧‧‧Operation Department

64‧‧‧ Keep face

65, 65a, 65b‧‧ Air passage

66‧‧‧ recess

67‧‧‧Adsorption Department

67a‧‧‧Adsorption Department

67b‧‧‧Pressure

70‧‧‧ visor department

71‧‧‧ core

72‧‧‧The Ministry of Cooling

73‧‧‧heating department

74‧‧‧Connecting members

75, 76‧‧‧ Pressing Department

80‧‧‧Upper fixing plate

80a‧‧‧Upper fixing plate inner diameter

81‧‧‧Under the fixed plate

81a‧‧‧ under the fixed plate inner diameter

82, 83‧‧‧ Cascade Department

84, 86‧‧‧ latches

85, 87‧‧‧Flexible components

90‧‧‧Air passage

91‧‧‧Decompression Department

201‧‧‧Resin molding device

202‧‧‧上模

202a‧‧‧Upper mold base

202b‧‧‧Upper insert

202c‧‧‧Processed Object Maintenance Department

202d‧‧‧上模模仁

202e‧‧‧Upper Mold Clamp

202f‧‧‧Coil Spring

202g‧‧‧Upper mold cavity recess

203‧‧‧下模

203a‧‧‧ lower mold base

203b‧‧‧The lower mold

203c‧‧‧Down mold clamp

203d‧‧‧coil spring

203e‧‧‧Down mold cavity recess

203f‧‧‧Down inserts

203g‧‧‧Worked parts holding unit

204‧‧‧Molding mould

205‧‧‧Clamping mechanism

206‧‧‧Moulding Department

207‧‧‧Fixed template

208‧‧‧Big pillar

209‧‧‧Mobile template

209a‧‧‧Connecting Department

210‧‧‧Rolling screw mechanism

211‧‧‧ screw shaft

212‧‧‧1st drive motor

213‧‧‧Fixed nuts

214‧‧‧Toggle joint mechanism

215‧‧‧ screw shaft

216‧‧‧2nd drive motor

217‧‧‧ nuts

218‧‧‧Circular joint

219‧‧‧ Linked ring

220‧‧‧triangular ring

221‧‧‧Sliding ring

222‧‧‧Control Department

223‧‧‧pressure sensor

C‧‧‧ cavity

F‧‧‧ release film

R‧‧‧Resin

W‧‧‧Processed objects

Fig. 1 is a view showing the entire configuration of a resin molding apparatus according to an embodiment of the present invention in a plan view.

Fig. 2 is a view showing the operation of the resin supply unit for supplying the granular resin.

Fig. 3 is a schematic cross-sectional view showing a pressed portion in a resin molding step according to the first embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 3;

Figure 5 is a schematic cross-section of the pressed portion in the resin forming process of Figure 4. Figure.

Fig. 6 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 5;

Fig. 7 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 6;

Fig. 8 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 7;

Fig. 9 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 8.

Fig. 10 is a schematic cross-sectional view showing a pressed portion in a resin molding step according to a second embodiment of the present invention.

Fig. 11 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 10;

Fig. 12 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 11;

Fig. 13 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 12;

Fig. 14 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 13;

Fig. 15 is a schematic cross-sectional view showing a pressed portion in a resin molding step in a third embodiment of the present invention.

Fig. 16 is a continuation of the patterning of the pressing portion in the resin molding process in Fig. 15. Sectional view.

Fig. 17 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 16;

Fig. 18 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 17;

Fig. 19 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 18.

Figure 20 is a schematic cross-sectional view showing a pressed portion in a resin molding step in a fourth embodiment of the present invention.

Fig. 21 is an exploded cross-sectional view showing the diaphragm portion shown in Fig. 20.

Fig. 22 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 20;

Fig. 23 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 22;

Fig. 24 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 23;

Figure 25 is a schematic cross-sectional view showing a pressed portion in a resin molding step in a fifth embodiment of the present invention.

Fig. 26 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 25;

Figure 27 is a schematic cross-sectional view showing a pressed portion in a resin molding step in a sixth embodiment of the present invention.

Fig. 28 is a schematic cross-sectional view showing a pressed portion in a resin molding step of another configuration example of the present invention.

Fig. 29 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 28;

Fig. 30 is a schematic cross-sectional view showing a pressed portion in a resin molding step of another configuration example of the present invention.

Fig. 31 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 30.

Fig. 32 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 31.

Figure 33 is a schematic cross-sectional view showing a pressed portion in a resin molding step in a seventh embodiment of the present invention.

Figure 34 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 33.

Fig. 35 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 34.

Figure 36 is a schematic cross-sectional view showing the pressed portion in the resin molding step of Fig. 35.

Figure 37 is a front explanatory view showing a mold opening state of the resin molding apparatus in the eighth embodiment of the present invention.

Figure 38 is a plan view of the moving template of Figure 37.

Figures 39A and 39B are the continuation of the 37th figure in the process of clamping A cross-sectional view of the mold.

Fig. 40A to Fig. 40C are diagrams showing an example of a molding die and a cross-sectional explanatory view of the mold clamping operation.

Fig. 41A to Fig. 41C are diagrams showing other examples of the molding die and a cross-sectional explanatory view of the mold clamping operation.

The following embodiments of the present invention are described as being divided into a plurality of paragraphs as needed, but in principle, the respective paragraphs are not unrelated, and one of them is a part or all of the modifications and detailed descriptions of the other. Therefore, the same reference numerals are given to the components having the same functions, and the repeated description thereof may be omitted. Further, the same effects can be obtained by the same structure, and repeated explanation thereof may be omitted.

In addition, the number of components (including the number, the numerical value, the number, the range, and the like) is not limited to the specific number except for the case where it is specifically indicated or limited in principle to a specific number, and may be larger or smaller than the specific number. . Further, when a shape such as a constituent element is mentioned, it is substantially similar or similar to the shape, except that it is particularly expressive and apparently not obvious in principle.

<First embodiment>

First, the resin molding apparatus 100 of the present embodiment will be described with reference to Fig. 1 . Fig. 1 is a view showing the entire configuration of a resin molding apparatus 100 in a plan view. This resin molding apparatus 100 includes a structure for performing resin molding. In addition, it also includes a structure in which a workpiece (molded article) after resin molding is inspected, and a good product is subjected to heat curing (post curing).

The resin molding apparatus 100 includes a workpiece supply unit 110, a resin supply unit 120, a pressing unit 130, a workpiece inspection unit, a cooling unit 140, a curing unit 150 (hardening furnace), and a workpiece storage unit 160 as various processing units. Processing unit of the process. Further, the resin molding apparatus 100 includes a control unit 170 that controls each processing step. In each of the processing units, the resin supply unit 120 and the pressing unit 130 are each constituted by two (majority) components. As described above, in many cases, the processing time is more expensive than other processing units, and the overall operating rate of the resin molding apparatus 100 can be improved.

Further, the resin molding apparatus 100 includes a robot mechanism unit 180 that includes a transfer robot that transfers a workpiece or a resin between the processing units. The transport robot is, for example, a robot that can rotate between the processing units and move linearly, and has a robot hand at the front end of the multi-joint. Each of the resin molding apparatuses 100 surrounds the robot mechanism unit 180 (transport robot) and arranges the respective processing units. Therefore, the moving distance between the workpieces and the resin between the processing units is shortened (the movement of the workpiece or the resin is indicated by a broken line in the first drawing), and the workpiece can be efficiently conveyed. In addition, the robot mechanism unit 180 may be replaced by a transfer mechanism other than the transfer mechanism such as an air cylinder or a linear motor, and the workpiece and the resin may be transferred between the processing units.

The workpiece supply unit 110 (see FIG. 1 ) is a processing unit that supplies a workpiece to the press portion 130 of the resin molding. The workpiece supply unit 110 includes a cartridge (not shown) that can accommodate a plurality of workpieces (molded articles) before molding. The workpiece to be processed by the cartridge is temporarily placed on the workpiece mounting portion (not shown) including the robot mechanism unit 180 via the transfer robot of the robot mechanism unit 180, and the loader included in the press unit 130 190 (transport unit) is transported to the press unit 130.

The resin supply unit 120 (see FIG. 1 ) supplies the resin to the processing unit of the press unit 130 that performs resin molding. Here, the resin supply unit 120 will be described with reference to Fig. 2 . Fig. 2 is a view for explaining the operation of the resin supply unit 120 for supplying the particulate resin R (hereinafter referred to as a pellet resin).

As shown in FIG. 2, the resin supply unit 120 includes a resin storage portion 121 that can store the particulate resin R, a plurality of small resin storage portions 122, and a plurality of grooves 123 that supply the particulate resin R to the resin supply region (supply target). The pair of resin storage portions 122 and the grooves 123 communicate with each other and are provided to be movable by an XY drive mechanism (not shown). The resin storage portion 121 is provided to be fixed, and the particulate resin R can be stored in a large amount, and the particulate resin R divided into a small portion is supplied from the resin reservoir portion 122 to be smaller. Next, the particulate resin R is sent from the resin storage portion 122 to the groove 123 by an electromagnetic feeder (not shown), and is introduced into the resin supply field in a specific shape (for example, flat).

It is sufficient to provide at least one pair of the resin storage portion 122 and the groove 123, and a plurality of pairs (three pairs in the second drawing) can be provided to shorten the supply of the resin. The time in which the domain is charged with the particulate resin R. The three pairs of resin storage portions 122 and the grooves 123 are coupled by a joint member 124. By this connection, even if electromagnetic feeders are not provided in each pair, an electromagnetic feeder can simultaneously supply the same amount of resin to the resin supply field to have a desired shape. As described above, the resin supply structure can be quickly supplied with the correct amount of resin. In the same manner, a plurality of dispensers for supplying a liquid resin may be provided. At this time, the correct amount of the liquid resin can be quickly supplied.

The supply target of the resin supply unit 120 is the release film F. As the release film F, for example, a film having a certain flexibility, stretchability, and heat resistance such as a FEP film, a PET film, a fluorine-containing glass fiber, a polyvinylidene chloride, PTFE, or ETFE is used. The release film F to which the resin is supplied is pulled by the holding member 126 on the support table 125 in a state of a roll, and is held by the holding members 126 and 126 at a position of a specific width. The cutting member 127 (for example, a blade) is cut into a film width of a primary molding component and is in a state of a specific shape (for example, a short strip shape).

In the case where the resin is supplied to the release film F (resin supply area), first, each of the grooves 123 is supplied with the granular resin R while moving in the direction in which the first column is supplied (X direction), and the resin is supplied to the column in a rectangular shape. After the supply, move in the second column direction (Y direction). Then, each of the grooves 123 is supplied with the granular resin R while moving in the extending direction (X direction) of the second column supply region, and after the supply of the resin in one row is completed, the particles are moved in the third column direction (Y direction). Then, while extending to the third column of supply areas The resin resin R is supplied while moving in the (X direction), and after the supply of the resin in one row is completed, the resin supply to the entire resin supply region is completed.

According to the resin supply unit 120 as described above, the particulate resin R can be supplied (mounted) to the release film F at a specific region (area) and a specific thickness (height) for a specific period of time. The particulate resin R supplied to the release film F is transferred to the loader 190 by the robot mechanism unit 180 together with the release film F, and then carried into the press unit 130 by the loader 190. Therefore, the release film F is also a carrier film for conveying the resin R.

The pressing portion 130 (see Fig. 1) performs resin molding of the workpiece, and is a processing portion of the molded resin portion (molded portion). This processing procedure will be described in detail later. The workpiece to be processed is temporarily placed on the workpiece mounting unit (not shown) including the robot mechanism unit 180 by the loader 190, and sent to the transport robot of the robot mechanism unit 180.

The workpiece inspection unit and the cooling unit 140 (see FIG. 1) are processing units for inspecting the state of the workpiece (molded article) after molding, and are also processing units for cooling the workpiece after heating. The cooling unit can be installed separately from the workpiece inspection unit, but it can be placed in the free position of the workpiece inspection unit to make the structure more precise.

The inspection items of the workpiece inspection unit include, for example, thickness measurement of the workpiece, and visual inspection of the workpiece. These inspection results are transmitted to the control unit 170 for processing. The object to be inspected, for example, as a whole or a divided and molded product, is observed for appearance, and it is confirmed whether or not there is a molding failure such as unfilling. Good shape No, and if a defect is found, the defective type and the photographed image are stored in the memory portion of the control unit 170 as the operation information. When an abnormality is detected (more than expected unfilled, etc.), the overall operation of the device can be stopped for maintenance, thereby avoiding continuous production of defective products. After the inspection, the workpiece is transported from the workpiece inspection unit and the workpiece receiving position of the cooling unit 140 to the curing unit 150 by the transfer robot.

The curing portion 150 (see FIG. 1) is a processing portion that performs heat curing (secondary hardening) of the film-molded resin portion of the workpiece. The hardened portion 150 is closed to the outside by a switch piece (not shown), and is internally heated to a specific temperature. When the workpiece held by the transfer robot approaches the hardening furnace 150, the switch piece is opened, the workpiece is placed inside, and the transfer robot is retracted, the switch piece is closed, and the heat is hardened for a specific period of time. After that, the workpiece to be processed by the conveyance robot from the curing unit 150 is cooled by the workpiece inspection unit and the cooling unit 140, and then transferred to the workpiece storage unit 160.

The workpiece storage unit 160 (see FIG. 1 ) is the final step of the resin molding apparatus 100 , that is, the processing unit that stores the workpiece. The workpiece storage unit 160 includes a cartridge similar to the workpiece supply unit 110, and the robot (the molded article) is stored in the cartridge by the robot of the robot mechanism unit 180.

Next, the pressing portion 130 of the resin molding apparatus 100 in the present embodiment will be described with reference to Fig. 3 . Fig. 3 is a schematic cross-sectional view of the pressing portion 130 in the present embodiment. In the third figure, it is also shown as the state of the molded article. The workpiece W. The workpiece W is mounted on the substrate 10 (for example, a wiring substrate) on the wafer component 11 (for example, a semiconductor wafer) by die bonding, and the substrate 10 and the wafer component 11 are electrically connected by bonding wires (not shown).

The pressing portion 130 is provided with a molding die 30 (paired upper die 31 and lower die 32). In the description of the embodiment, the lower mold 32 is a movable mold, and the upper mold 31 is a fixed mold. However, the upper mold 31 may be a movable mold, the lower mold 32 may be a fixed mold, or both the upper mold 31 and the lower mold 32 may be used. It is a movable mold.

In the molding die 30, the upper mold 31 holds the workpiece W, and the lower mold 32 is provided with a cavity recess 33 (the cavity C is formed when the workpiece is held). The molding die 30 includes a lower die holder 34 that constitutes the bottom of the cavity recess 33, and a lower die clamper 35 that surrounds the lower die die 34 to form a side portion (wall portion) of the cavity recess 33. In the molding die 30, the lower die core 34 is relatively moved to the lower die clamper 35, and the depth (height) of the cavity concave portion 33 can be changed to change the volume of the cavity C.

The structure of the upper mold 31 will be specifically described below. The upper mold 31 is provided with an upper mold base 36, an upper mold insert 37, and an upper mold clamp 40. A heater (not shown) is provided on the lower surface of the upper mold base 36, and the mold insert 37 is fixedly attached to the workpiece W, and the upper mold clamp 40 is assembled to be movable in the vertical direction. . The upper mold clamp 40 is composed of a single plate-shaped mold, and is formed with a through hole 41 penetrating therethrough. The upper mold insert 37 is inserted into the through hole 41 of the upper mold clamp 40. That is, the upper mold insert 37 is surrounded by the upper mold clamp 40.

The upper mold clamp 40 is movable due to the upper mold base 36 The elastic member 42 (for example, a spring) of the portion is assembled to be movable in the up and down direction and supported by the suspension (floating support). Therefore, the relationship between the upper mold insert 37 and the movable upper mold clamp 40 relative to the upper mold base 36 is fixed, and the upper mold insert 37 is stretched by the elastic member 42 to the upper mold clamp 40. Relative movement.

The lower surface (lower end surface) of the upper mold insert 37 is located below the upper mold holder 40 (lower side) in a state where the elastic member 42 is not biased, for example, by an open mold or the like (in a state not affected from the outside). End face) higher position (upper position). In other words, the lower surface of the upper mold clamp 40 is located at a lower position (lower position) than the lower surface (lower end surface) of the upper mold insert 37. As will be described later, the height difference is produced as described above, and the upper mold clamp 40 and the lower mold clamp 35 constitute a sealed space at the time of mold clamping, and resin molding can be performed while reducing pressure. Further, the upper mold insert 37 is provided to be relatively movable with respect to the upper mold clamp 40, and the workpiece W can be held at a uniform height position regardless of the thickness of the workpiece W.

Further, the upper mold 31 includes a sealing member 43 (for example, an O-ring) provided between the outer circumferential surface of the upper mold insert 37 and the inner circumferential surface of the through hole 41 of the upper mold clamp 40. The sealing member 43 is configured to allow a pressure reduction in the cavity C formed when the workpiece is held, and a gap between the outer circumferential surface of the upper mold insert 37 and the inner circumferential surface of the through hole 41 of the upper mold clamp 40. The air passage 41A is formed and sealed (refer to Fig. 7).

In order to communicate with the air passage 41A, the upper mold clamp 40 is formed with an air passage from the inner peripheral surface of the through hole 41 to the outside of the mold. 44. This air passage 44 communicates with a pressure reducing portion 45 (for example, a pump) outside the mold. As will be described later, the pressure reducing portion 45 reaches the pressure reduction of the cavity C through the air passage 41A of the slit and the air passage 44.

Further, the upper mold 31 is provided with a workpiece holding portion that holds the workpiece W (see FIG. 27). The workpiece holding portion is provided with an air passage 90 communicating with the end surface of the upper mold insert 37, and is sucked by the pressure reducing portion 91 communicating with the air passage 90, so that the lower surface of the upper mold insert 37 and the workpiece W are The back surface of the substrate 10 is bonded to hold the workpiece W. Alternatively, the workpiece W may be held by the claw portion or the electrostatic chuck that is provided on the end surface of the upper mold insert 37.

The structure of the lower mold 32 will be specifically described below. The movable mold lower mold 32 is a well-known clamp mold for moving the lower mold by a driving mechanism (a connecting mechanism such as a toggle connecting rod or a screw shaft, etc.) driven by a driving source (electric motor). Institutions, to open and close the mold. At this time, the moving speed, the pressing force, and the like of the lower mold 32 can be arbitrarily set.

The lower mold 32 is provided with a lower mold base 46, a lower mold core 34, and a lower mold clamp 35. The lower mold core 34 is fixedly assembled to the upper surface of the lower mold base 46, and the lower mold clamp 35 is assembled to be movable in the vertical direction. The lower mold clamp 35 is composed of a single plate-shaped mold, and a through hole 47 is formed therein. The lower mold core 34 is inserted into the through hole 47 of the lower mold clamp 35. That is, the lower mold core 34 is surrounded by the lower mold clamp 35. Further, the lower mold core 34 is provided with a heater (not shown), and is a structure that can heat the resin R as will be described later.

The lower mold clamp 35 is assembled so as to be movable in the vertical direction and supported by the elastic member 50 (for example, a spring) which constitutes the movable portion of the lower mold base 46. Therefore, with respect to the lower mold base 46 being the relationship between the fixed lower mold core 34 and the movable lower mold clamp 35, the lower mold core 34 is stretched by the elastic member 50, and the lower mold clamp 35 is used. Relative movement.

The lower surface (upper end surface) of the lower mold core 34 is located on the upper surface (upper end surface) of the lower mold clamp 35, for example, in a state where the mold is not biased by the elastic member 50 (without being affected from the outside). Lower position (lower position). As will be described later, such as the above-described height difference, the lower mold core 34 is relatively moved to the lower mold clamp 35, and the depth of the cavity concave portion 33 (the volume of the cavity C) can be changed.

Further, the lower mold 32 is provided with a sealing member 51 (for example, an O-ring) provided between the outer circumferential surface of the lower mold core 34 and the inner circumferential surface of the through hole 47 of the lower mold clamp 35. In order to attract the release film F disposed on the parting surface of the lower mold 32, the sealing member 51 forms a slit between the outer peripheral surface of the lower mold core 34 and the inner peripheral surface of the through hole 47 of the lower mold clamp 35. The air passage 47A is sealed (refer to Fig. 5). Since the upper surface of the lower mold core 34 and the inner circumferential surface of the through hole 47 of the lower mold clamp 35 constitute the cavity concave portion 33, the air passage 47A communicates with the corner portion where the bottom portion and the side portion of the cavity concave portion 33 intersect.

In order to communicate with this air passage 47A, the lower mold holder 35 is formed with an air passage 52 from the inner peripheral surface of the through hole 47 to the outside of the mold. The air passage 52 is opposite to the adsorption portion 53 (for example, a pump) outside the mold. Connected. As will be described later, the central portion of the release film F is brought into the suction and hold along the shape of the cavity concave portion 33 by the adsorption portion 53 via the air passage 47A and the air passage 52.

Further, the lower mold clamp 35 is formed with an air passage 54 from the upper surface of the lower mold clamp 35 to the outside of the mold. This air passage 54 communicates with an adsorption portion 55 (for example, a pump) outside the mold. As will be described later, the outer peripheral portion of the release film F is adsorbed and held by the suction portion of the lower mold holder 35 via the air passage 54.

Further, adjacent to each of the pressing portions 130, there is provided a workpiece loader 56 that can transport the workpiece W to the upper mold 31, and a film loader 57 that can transport the resin R and the release film F to the mold 32. 190 (see Fig. 1). The loader 190 is configured such that the workpiece loader 56 and the film loader 57 can transport the workpiece W or the release film F from the robot mechanism unit 180 to the inside of the press unit 130, and the drive mechanisms (not shown) are different from each other. The system is driven to carry out the workpiece W or the release film F and carry it into the pressing unit 130. Further, the film loader 57 may be configured to receive the resin R and the release film F from the robot mechanism unit 180 in the loader 190, or may be transported from the robot mechanism unit 180 to the resin supply unit 120, and supply the resin R and the release type. Film F.

The workpiece loader 56 includes a support plate 60, a support portion 61, and a positioning portion 62. The size of the planar field of the support plate 60 is configured to be, for example, larger than the planar area of the through hole 41 of the upper mold holder 40. The upper surface of the support plate 60 is provided with a support portion 61 which is annular in plan view at a specific height. In addition, Yu Zhi The upper surface of the stay 60 and the outer side of the support portion 61 are provided with a plurality of positioning portions 62 (for example, plugs) at a specific height.

The support portion 61 is disposed such that the planar region thereof is along the inner side of the outer edge of the substrate 10 of the workpiece W, and is as close as possible to the planar region of the substrate 10. Further, the support portion 61 is provided to have a higher height than the member height of the substrate 10 mounted on the workpiece W (for example, the thickness of the wafer component 11 or the lead height of the bonding). Thereby, the support plate 60 does not The wafer component 11 and the bonding leads (not shown) are contacted (interfered), and the workpiece W is supported by the support portion 61 on the outer peripheral portion of the surface of the substrate 10.

The positioning portion 62 is configured to be in contact with the inner circumferential surface of the through hole 41 of the upper mold clamp 40, so that the workpiece loader 56 can position the upper mold insert 37. For example, the planar arrangement is set in the upper mold. The plan view of the clipper 40 is the respective corners of the rectangular through hole 41. Further, the positioning portion 62 is disposed such that its height is in contact with the inner circumferential surface of the through hole 41 before the workpiece W is delivered to the upper mold insert 37. Thereby, the workpiece W is positioned by the positioning portion 62 and disposed in a specific area below the upper mold insert 37.

According to the workpiece loader 56 configured as described above, the back surface of the substrate 10 of the workpiece W is brought into contact with the lower surface of the upper mold insert 37, and the workpiece W is delivered to the upper mold 31. At this time, the support portion 61 presses the substrate 10 against the lower surface of the upper mold insert 37, and the substrate 10 (the workpiece W) is held by the holding portion of the upper mold 31.

The film loader 57 includes a release film F on which the resin R is loaded, and The operation unit 63 is held. The operation unit 63 has a holding surface 64 (adsorption surface) that holds the release film F, an air passage 65 that communicates with the holding surface 64, and a concave portion 66 that is recessed from the holding surface 64.

The size of the holding surface 64 (the size of the plane of the operation portion 63) is a size that can be adsorbed along the outer periphery of the planar field of, for example, the short strip-shaped release film F. The concave portion 66 is disposed in the field of the holding surface 64, and is disposed in a matrix of, for example, n rows and m columns (at least one of n and m is 2 or more), and a plurality of the concave portions 66 are formed on the operation portion 63. The air passage 65 is formed on the operation portion 63 so as not to interfere with the concave portion 66, and communicates with the outside of the operation portion 63 from the holding surface 64 (for example, the outer circumferential portion of the holding surface 64 and the holding surface 64 between the concave portions 66). The air passage 65 that communicates with the holding surface 64 is provided around the recess 66 (between the recesses 66). Further, the air passage 65 communicates with an adsorption portion 67 (for example, a pump) outside the operation portion 63. In this way, the release film F on which the resin R is placed is surrounded by the resin R, and it is possible to hold the release film while applying a tensile force to the outer circumference, and the release film F is not bent by the weight of the resin R, so that it can be adsorbed and held flat. In addition, the release film F is a flat state, and the release film F is not bent or twisted, and the degree of the flat state of the resin R to be conveyed and placed on the molding die 30 does not necessarily cause a problem. Need to be a complete plane.

According to the film loader 57 as described above, the resin R having the release film F mounted on the concave portion 66 secures the escape recess, and the release film F is sucked from the air passage 65 around the concave portion 66. Thereby, the resin R and the release film F are sent to the state in which the release film F is held flat on the holding surface 64 (without deformation). Lower die 32. Further, since the recessed portion 66 secures the recessed portion of the resin R, the state (shape and amount) of the resin R on which the release film F is mounted can be maintained. Further, in the present embodiment, the resin R is mounted not in the entire surface of the release film F but in a plurality of regions (corresponding to the plurality of concave portions 66). Further, depending on the strength of the release film F or the weight of the resin R, it may be attracted and held only on the outer periphery of the release film F.

Next, a resin molding method (a method of operating the resin molding apparatus 100) using the resin molding apparatus 100 in the present embodiment will be described with reference to FIGS. 3 to 9. 3 to 9 are schematic cross-sectional views of the pressing portion 130 in the resin molding step of the present embodiment.

The resin molding apparatus 100 according to the present embodiment includes a release film F disposed on a parting surface of the lower mold 32. The use of the release film F prevents the resin of the slit of the lower mold core 34 and the lower mold clamp 35 from leaking out. Further, resin clogging between the lower mold core 34 and the lower mold clamp 35 can be prevented, and the lower mold core 34 is relatively moved to the lower mold clamp 35. Further, depending on the strength of the release film F or the weight of the resin R, it may be attracted and held only on the outer periphery of the release film F.

As shown in FIG. 3, in the state in which the molding die 30 is opened, the workpiece W is carried into the workpiece loader 56 from the outside of the mold.

Further, in a state in which the molding die 30 is opened, the resin R and the release film F are carried by the film loader 57. Before this, the resin R is mounted (supplied) on the roll-shaped release film F, and the release film F is cut into a specific shape (for example, a short strip shape) (see FIG. 2). The release film F is sucked by the adsorption unit 67, adsorbed on the holding surface 64, and carried in a flat state. In addition, the suction portion 67 is attracted The action is as indicated by the arrow (refer to Figure 3, etc.).

Next, as shown in FIG. 4, the workpiece loader 56 is raised, and the workpiece W is delivered to the upper mold 31. Specifically, when the workpiece loader 56 is raised, the positioning portion 62 is brought into contact with the inner circumferential surface of the upper mold clamp 40 through the hole 41, and then the back surface of the substrate 10 is brought into contact with the lower surface of the upper mold insert 37. . Next, the substrate 10 (subject W) is held by the workpiece holding portion (not shown) on the lower surface of the upper mold insert 37. The workpiece W is delivered from the workpiece loader 56 to the upper mold 31, as described above.

Further, as shown in Fig. 4, the film loader 57 is lowered, and the release film F on which the resin R is placed is delivered to the lower mold 32 to start the melting of the resin R. Specifically, first, the film holder 57 is lowered, and the holding surface 64 is brought into contact with the upper surface of the lower mold holder 35 via the release film F, and then the elastic member 50 is compressed (the movable portion is moved). That is, the lower mold holder 35 is depressed by the lowering of the film loader 57. Next, the film loader 57 is lowered until the upper surface (upper end surface) of the lower mold core 34 and the upper surface (upper end surface) of the lower mold clamp 35 are horizontal. Further, here, the operation of raising the lower mold 32 can be performed, and the release film F can be delivered to the lower mold 32 instead of the action of lowering the film loader 57.

At this time, the resin R on the release film F is further heated in the lower mold core 34 to start melting. Further, the film loader 57 holds the flat release film F on the holding surface 64. That is, on the lower mold 32 which is horizontal to the upper surface (upper end surface) of the lower mold core 34 and the upper surface (upper end surface) of the lower mold clamp 35, the flat release film F is disposed by the film loader 57 to make the resin R is located on the lower mold core 34. Further, the release film F may be flat as long as it is disposed (supplied) in the lower mold 32. In this case, as shown in Fig. 4, when the holding surface 64 of the film loader 57 is pressed against the release film F and pressed into the shape or size of the cavity concave portion 33, the film is loaded until it comes into contact with the end surface of the mold core 34. The mold 57 can supply the release film F to the lower mold 32 in a horizontal state by simply performing the pressing operation, and can be easily supplied without wrinkles or the like.

Next, in a state where the upper surface of the lower mold core 34 and the upper surface of the lower mold clamp 35 are horizontal, the upper and lower mold holders which are disposed to cover the lower mold core 34 are adsorbed and held by the adsorption portions 53 and 55. A release film F of a flat state above 35. Thereby, the resin R and the release film F are delivered from the film loader 57 to the lower mold 32. In addition, the adsorption sections 53, 55 may be different systems or the same system.

Next, as the workpiece W is held as will be described later, the workpiece loader 56 is lowered as shown in FIG. Thereby, the workpiece loader 56 is isolated from the workpiece W. The workpiece W is held only by the upper mold 31.

Further, as shown in Fig. 5, the flat release film F is sucked by the air passages 47A, 52, 54 by the suction portions 53, 55, and the film loader 57 is raised to extend the elastic member 50 (the movable portion is moved). With this elastic member 50, the lower mold core 34 is relatively moved to the lower mold clamp 35 to form the cavity concave portion 33. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity concave portion 33 of the release film F is adsorbed by the adsorption portion 53, so that the release film F follows the cavity concave portion 33. It is deformed inside. Thereby, the release film F follows The inner surface of the cavity concave portion 33 is adsorbed and held.

Further, the release film F is adsorbed and held along the inner surface of the cavity concave portion 33, and the resin R is directly supplied to the cavity concave portion 33. The resin R is disposed on the lower mold core 34 via the release film F by the film loader 57, so that the resin R remains even if the lower mold mold 34 is relatively moved to the lower mold clamp 35 to form the cavity concave portion 33. This state is supplied to the cavity concave portion 33. Therefore, the resin R can supply the resin R to the bottom of the cavity recess 33 without maintaining the shape and without changing the position. In the above-described manner, the resin R is supplied to the cavity concave portion 33 in a desired state, and the quality of the molded article such as the shrinkage hole or the lead offset can be reduced.

Next, as shown in Fig. 6, the workpiece loader 56 and the film loader 57 are retracted from the inside of the molding die 30.

Next, as shown in Fig. 7, the mold 32 is raised by the movable mold, and the molding die 30 is clamped (molded). Specifically, the lower mold 32 is raised to a position where the lower mold clamp 35 and the upper mold clamp 40 sandwich the release film F. Thereby, the inside of the molding die 30 including the cavity recess 33 is in an airtight state. At this time, the pressure reducing portion 45 is driven, and the inside of the molding die 30 including the cavity concave portion 33 is in a reduced pressure (degassing) state via the air passage 41A and the air passage 44. The inside of the molding die 30 is decompressed, and the air mixed in the resin R melted in the resin molding can be removed to prevent the molded article from shrinking.

Next, as shown in Fig. 8, the movable mold lower mold 32 is further raised, and the outer peripheral portion of the substrate 10 is brought into contact with the upper surface of the lower mold clamp 35 via the release film F. At this time, since the elastic member 42 is weaker than the elastic member 50, Due to the rise of the lower mold 32 (the lower mold clamp 35), the elastic member 42 is compressed via the upper mold clamp 40. Thereby, the upper mold insert 37 (upper mold 31) and the lower mold clamp 35 (lower mold 32) hold the workpiece W, and the surface of the substrate 10 and the lower surface of the upper mold clamp 40 are horizontal. For example, the upper mold insert 37 is relatively moved to the upper mold clamp 40, and the workpiece W can be held at a uniform height position regardless of the thickness of the workpiece W.

Next, as shown in Fig. 9, the lower mold 32 is moved upward, and the wafer component 11 is immersed in the resin R which is melted at the mold temperature, and then filled in the cavity C (cavity concave portion 33). The molten resin R is heat-hardened, and resin molding of the workpiece W is performed. At this time, the lower mold clamp 35 abuts against the upper mold 31 via the substrate 10, and the movement is hindered, so that the elastic member 50 is compressed by the rise of the lower mold 32 (the lower mold base 46). By adjusting the rising stop position of the lower mold 32 (in other words, the amount of shortening of the elastic member 50), resin molding can be performed at a desired molding thickness (forming position). Thereby, the molded product is roughly completed.

After that, the workpiece W (molded article) is held by the workpiece holding portion in the upper mold 31, and the release film F is opened by the adsorption portions 53 and 55 in the lower mold 32. At this time, the release film F can be used to easily release the workpiece W. As described above, the inspection unit, the cooling unit 140, and the curing unit 150 receive the workpiece W in the workpiece storage unit 160.

According to the resin molding apparatus 100 of the present embodiment, the release film F can be placed in a flat state and then follow the shape of the cavity concave portion 33 to form a release film. F deformation. For example, the molding die 30 is not supplied in a state where wrinkles or overlap occurs in the release film F. Therefore, it is possible to prevent the wrinkles of the release film F from being transferred to the appearance of the molded article or to leak the resin from the overlapped portion to improve the quality of the molded article. Further, the lower mold 32 constitutes the cavity concave portion 33, and the molten resin R supplied to the cavity concave portion 33 is successively immersed in the wafer component 11 or the bonding wire (not shown), and the flow of the resin R is suppressed to a minimum. Reduce the quality of molded products such as shrinkage holes or lead offsets.

<Second embodiment>

With respect to the above-described first embodiment, in the present embodiment, the workpiece W is placed (mounted) on the upper mold 31 in the same manner as the jig (the lower portion of the upper mold insert 37). The film loader 57 includes a heating unit, a cooling unit, and a shutter unit. Hereinafter, the difference will be mainly described with reference to FIGS. 10 to 14 . 10 to 14 are schematic cross-sectional views of the pressing portion 130 in the present embodiment.

The larger the area of the workpiece W (substrate 10), the larger the bending of the workpiece W. As in the first embodiment, the workpiece holder 56 (support portion 61) is simply held on the outer peripheral portion of the surface of the substrate 10. In the case of the workpiece W, the substrate 10 is bent by its own weight, which causes problems such as difficulty in holding in the mold and dropping during transportation. Therefore, in the present embodiment, the plate-like jig 37A (member) is prevented from being bent on the back surface of the large-area substrate 10, and the workpiece W is transported by the workpiece loader 56 together with the jig 37A. This jig 37A is made of, for example, the same material (stainless steel) as the upper mold insert 37. Therefore, rule The 37A can also be considered as a detachable lower portion of the upper mold insert 37.

Further, in the case where the film loader 57 is provided with a plurality of recessed portions 66 as in the first embodiment, in the field of the outer peripheral portion of the recessed portion 66 (the air passage 65 that communicates with the holding surface 64 is provided), The resin R cannot be mounted on the film F. However, when the operation portion 63 is formed with one recess 66 having a wide opening portion and the resin R is mounted on the release film F in a wide range, the weight of the resin R may excessively bend the release film F, and it is difficult to maintain flatness. Therefore, in the present embodiment, the shutter portion 70 capable of holding the release film F on which the resin R is mounted is provided under the opening of the operation portion 63.

The film loader 57 in the present embodiment will be specifically described here. The film loader 57 includes a drum-shaped shutter portion 70 that can switch the holding surface 64. The shutter portion 70 is a drive portion (not shown). When the holding surface 64 is opened (open state), the retraction is retracted from the holding surface 64, and when the holding surface 64 is closed (closed state), the holding portion is held. Face 64 is sent out. Therefore, the film loader 57 can support and transport the release film F to the shutter portion 70 when the shutter portion 70 is closed, and can dispose the release film F to the lower mold 32 when the shutter portion 70 is opened.

The shutter portion 70 is made of a material such as a sheet metal or a resin material. Further, the material of the shutter portion 70 is preferably a material or shape having a low frictional resistance to the release film F. Thereby, the release film F can be prevented from being skewed. Further, it is preferable that the shutter portion 70 has a support rod-like core 71 extending in a direction orthogonal to the take-up direction, and the release film F can be held flat.

According to the film loader 57 such as described above, the release sheet F can be flatly held (supported) by the shutter portion 70 so as not to be bent by the weight of the resin R in the concave portion 66 mounted on the release film F. Further, when the release film F is disposed in the lower mold 32, the shutter portion 70 can be wound up to save space. However, the shutter portion 70 does not necessarily have to be a reelable structure, and is a structure of a switchable plate member, and the release film F (that is, the resin R) can be held.

Further, the film loader 57 includes a cooling unit 72 and a heating unit 73. Thereby, the heating of the release film F or the resin R mounted thereon can be easily assisted and cooled. Further, the shutter portion 70 includes a heating portion, and the release film F can be preheated, so that the release film F more accurately mimics the shape of the cavity concave portion 33. In this case, for example, the core 71 may be a hot wire as a heating portion provided in the shutter portion 70.

Next, a resin molding method (a method of operating the resin molding apparatus 100) using the resin molding apparatus 100 in the present embodiment will be described.

As shown in Fig. 10, in the state in which the molding die 30 is opened, the workpiece W is carried into the workpiece loader 56 together with the jig 37A from the outside of the mold.

Further, in a state in which the molding die 30 is opened, the resin R and the release film F are carried by the film loader 57. At this time, if it is intended to prevent the radiant heat from the mold from heating the resin R, the cooling portion 72 can be opened (or closed), and the heating portion 73 can be closed to prevent the release film F or the resin R from being heated.

In addition, the shutter portion 70 in the closed state is held in the state of the resin R mounted on the release film F, and is carried into the molding die 30. This release film F, The suction unit 67 is sucked and adsorbed on the holding surface 64, and is carried in a flat state.

Next, as shown in Fig. 11, the workpiece loader 56 is raised, and the workpiece W is delivered to the upper mold 31 together with the jig 37A. Specifically, when the workpiece loader 56 is raised, the positioning portion 62 is brought into contact with the inner peripheral surface of the upper mold clamp 40 through the hole 41, and the jig 37A and the upper mold insert for holding the workpiece W are fixed. The bottom of 37 is abutted. Next, the workpiece W and the jig 37A are held by the workpiece holding portion (not shown) under the upper mold insert 37. The workpiece W is delivered from the workpiece loader 56 to the upper mold 31, as described above.

Further, as shown in Fig. 11, the film loader 57 is lowered. Specifically, first, since the film loader 57 is lowered, the retaining surface 64 is brought into contact with the upper surface of the lower mold clamp 35 via the release film F and the shutter portion 70, and the elastic member 50 is compressed (the movable portion is moved). ). That is, the lower mold clamp 35 is pressed down by the lowering of the film loader 57. Next, the film loader 57 is lowered until the upper surface of the lower mold core 34 and the upper surface of the lower mold clamp 35 are horizontal. Further, when the cooling unit 72 is in the open state, in order to prevent the mold temperature of the molding die 30 from being lowered, in the step shown in Fig. 11, it is preferable that the cooling portion 72 is in the closed state.

Next, as shown in Fig. 12, the workpiece loader 56 is lowered. Thereby, the workpiece loader 56 is separated from the workpiece W. The workpiece loader 56 is isolated from the workpiece W. The workpiece W is held by the mold 31 or more.

Further, as shown in Fig. 12, the release film F on which the resin R is placed is delivered to the lower mold 32. Specifically, first, the shutter portion 70 is taken up, and the horizontal lower mold 32 is held on the upper surface of the lower mold core 34 and the lower mold clamp 35, and the flat release film F is disposed by the film loader 57 to make the resin. R is located on the lower mold core 34. Next, the release portions 53 and 55 are placed on the upper surface of the lower mold core 34 and the lower mold mold 35 to form a horizontal lower mold 32, and the release film F in a flat state is adsorbed and held. Thereby, the resin R and the release film F are delivered from the film loader 57 to the lower mold 32. Further, when the heating portion 73 is in the open state, it can be heated from the lower mold 32 side (downward), and the resin R can be heated from above, and the time for melting it can be shortened. In this way, productivity can be improved.

Next, as shown in Fig. 13, the flat release film F is sucked by the air passages 47A, 52, 54 by the suction portions 53, 55, and the film loader 57 is raised to extend the elastic member 50 (the movable portion is moved). . By the elastic member 50, the lower mold core 34 is relatively moved to the lower mold clamp 35, and the cavity concave portion 33 is formed. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity concave portion 33 of the release film F is adsorbed by the adsorption portion 53, so that the release film F follows the cavity concave portion 33. Deformed from the surface. Thereby, the release film F is adsorbed and held along the inner surface of the cavity concave portion 33.

At this time, the release film F is adsorbed and held along the inner surface of the cavity concave portion 33, and the resin R can be directly supplied to the cavity concave portion 33 in this shape. In other words, the resin R is disposed on the lower mold core 34 via the release film F by the film loader 57, so that even the lower mold core 34 is relatively moved to the lower mold clamp 35 to form a cavity. In the concave portion 33, the resin R is still in this state and is supplied to the cavity concave portion 33. Therefore, the resin R can supply the resin R to the bottom of the cavity recess 33 without maintaining the shape and without changing the position.

Next, as shown in Fig. 14, the workpiece loader 56 and the film loader 57 are retracted from the inside of the molding die 30. Thereafter, the molded article is roughly completed by the steps described in the seventh embodiment to the ninth embodiment as described in the first embodiment.

<Third embodiment>

In the second embodiment, the film loading device 57 is configured to use the operation portion 63 that adsorbs and holds the release film F on the mounting surface side on which the resin R is mounted, and the shutter portion 70 that supports the release film F on the side opposite to the mounting surface. The situation. On the other hand, in the difference in the present embodiment, the film loader 57 uses the support resin R and the release film F, and the jig (member) directly disposed (mounted) the lower mold 32. The following will focus on this difference and refer to Fig. 15 to Fig. 19 for explanation. 15 to 19 are schematic cross-sectional views of the pressing portion 130 in the present embodiment.

In the shutter portion 70 that supports the release film F in the second embodiment, when the release film F is placed on the lower mold 32, the shutter portion 70 must be picked up (detached). At this time, there is a possibility that the resin R on the release film F is disintegrated or the like, resulting in uneven distribution. Therefore, in the present embodiment, the release film F is held in contact with the sheet-like jig 34A under the release film F, and the release film F is conveyed by the film loader 57 together with the jig 34A, and a release film is disposed. The fixture 34A of the state of F is regarded as the lower mold 32. That is, the jig 34A is, for example, the same material as the lower mold core 34 (not It is considered that the upper part of the lower mold core 34 is separable.

Here, the film loader 57 and the pressing portion 130 in the present embodiment will be specifically described. The film loader 57 is provided with a jig 34A detachably provided on the upper portion of the lower mold core 34 and a jig 35A detachably provided on the upper portion of the lower mold clamp 35. Further, the jig 34A is disposed in the through hole of the jig 35A, and the outer peripheral surface of the jig 34A and the inner peripheral surface of the jig 35A are connected by a plurality of connecting members 74, and the jig 34A is supported. The connecting member 74 can also be used as, for example, a plate spring, and the movable portion of the jig 35A movable in the vertical direction with respect to the jig 34A.

The thickness of the jig 34A and the jig 35 is different, and the thickness of the jig 34A is thinner than the jig 35A. The end surface of the jig 34A and the end surface of the jig 35A are horizontal with the connecting member 74 in a state where it is not externally affected. Further, in the pressing portion 130, for example, a mold opening or the like is not biased by the elastic member 50 (without being affected from the outside), the lower upper surface of the lower mold core 34 and the lower mold clamp 35 can be made. The lower part is at the same height position. In the present embodiment, a thickness difference (a height difference) such as the above-described jigs 34A, 35A is formed, and the jig 34A (the upper portion of the lower mold core 34) is provided as the jig 35A (the upper portion of the lower mold clamp 35). The relative movement is such that the cavity recess 33 depth (the volume of the cavity C) changes.

In addition, the pressing portion 130 (film loader 57) in the present embodiment includes pressing portions 75 and 76 that press the release film F from the upper surface (the surface on which the resin R is mounted). The pressing portion 75 is formed in a flange shape in which two angular ring members having different outer shapes are combined, and is disposed to face the end surface of the outer peripheral portion of the jig 34A. The release film F can be pressed around the resin R. Further, the pressing portion 76 is provided to face the end surface of the lower mold holder 35 and press the outer peripheral portion of the release film F so as to face the end surface of the jig 35A.

By the film loader 57, the end surface of the jig 34A and the end surface of the jig 35A are kept horizontal, and the release film F is held flat on the end faces and the release film F is conveyed. Thereby, the release film F and the resin R mounted thereon can be placed in the molding die 30 in a stable state.

Next, a resin molding method (a method of operating the resin molding apparatus 100) using the resin molding apparatus 100 of the present embodiment will be described.

As shown in Fig. 15, in the state in which the molding die 30 is opened, the workpiece W is carried into the workpiece loader 56 from the outside of the mold. Further, in a state in which the molding die 30 is opened, the resin R and the release film F are carried by the film loader 57.

In the resin supply unit 120, for example, the end surface of the jig 34A and the end surface of the jig 35A are horizontally fed, and the release film F of the roll shape is fed, and the resin is mounted (supplied) on the release film F. R. Next, the release film F is cut into a specific shape (for example, a short strip shape) (see FIG. 2). Since the end surface of the jig 34A and the jig 35A are horizontal, the release film F is placed on the same. It is flat. The robot mechanism unit 180 and the loader 190 are supplied to the pressing unit 130.

Next, as shown in Fig. 16, the workpiece loader 56 is raised, and the workpiece W is delivered to the upper mold 31.

Further, as shown in Fig. 16, the film loader 57 is lowered. Specifically, the jig 35A is brought into contact with the upper surface of the lower mold holder 35 by the lowering of the film loader 57. At this time, the lower end mold 32 is held horizontally on the end surface of the jig 34A (upper portion of the lower mold mold 34) and the end surface of the jig 35A (upper portion of the lower mold clamp 35), and the release film F is flatly disposed by the film loader 57. Further, at this time, the jig 34A is not in contact with the upper surface of the lower mold core 34.

Next, as shown in Fig. 17, the workpiece loader 56 is lowered. Thereby, the workpiece loader 56 is isolated from the workpiece W.

Further, as shown in Fig. 17, the release film F is sucked by the adsorption portions 53, 55. Specifically, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the central portion of the release film F is adsorbed by the adsorption portion 53, and the jig 34A that is movable in the vertical direction is provided with respect to the jig 35A, because the connecting member 74 and down (to make the movable part active).

This connecting member 74 causes the lower mold core 34 to move relative to the lower mold clamp 35 to form a cavity recess 33. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity concave portion 33 of the release film F is adsorbed by the adsorption portion 53, so that the release film F follows the cavity concave portion 33. It is deformed inside. Thereby, the release film F is adsorbed and held along the inner surface of the cavity concave portion 33.

Further, the release film F is adsorbed and held along the inner surface of the cavity concave portion 33, and the resin R is directly supplied to the cavity concave portion 33. The resin R is disposed on the jig 34A via the release film F by the film loader 57, so even if a cavity is formed The concave portion 33 holds the resin R in this state and is supplied to the cavity concave portion 33. Therefore, the resin R can supply the resin R to the bottom of the cavity recess 33 without maintaining the shape and without changing the position.

Next, as shown in Fig. 18, the release film F is sucked by the suction portions 53, 55 from the air passages 52, 54 to raise the film loader 57, and the resin R and the release film F are delivered to the lower mold 32.

Next, as shown in Fig. 19, the workpiece loader 56 and the film loader 57 are retracted from the inside of the molding die 30. Thereafter, the molded article is roughly completed by the steps described in the seventh embodiment to the ninth embodiment as described in the first embodiment.

<Fourth embodiment>

In the first embodiment, the film loader 57 has been described in which the release film F of the operation portion 63 is flatly adsorbed and held. On the other hand, in the difference in the present embodiment, the film loader 57 uses a jig (member) in which the release film F is supported by a plate and directly disposed (mounted) on the lower mold 32. Hereinafter, the difference will be mainly described with reference to FIGS. 20 to 24. Fig. 20 and Fig. 22 to Fig. 24 are schematic cross-sectional views of the pressing portion 130 in the present embodiment. Fig. 21 is an exploded cross-sectional view showing the film loader 57 (membrane portion) shown in Fig. 20.

The pressing portion 130 in the present embodiment will be specifically described below. The film loader 57 is provided with a ring-shaped upper fixing plate 80 and a lower fixing plate 81, and is sandwiched by the upper and lower sides, and is held in a state in which it can be stretched from the entire circumference of the release film F (see Fig. 21 in particular). In the example shown in Fig. 21, the self-fixing is formed at the peripheral end. The step portion 82 which is recessed on the side of the plate 80 and extends in the circumferential direction has the lower fixing plate 81 in a flange shape. The release film F is placed between the upper fixing plate 80 and the lower fixing plate 81, and the inner diameter portion 80a of the upper fixing plate 80 is fitted to the step portion 82 (small diameter portion) of the lower fixing plate 81 to fit the fixing plate 80. The diaphragm portion (film loader 57) (see Fig. 20 in particular). The release film F is laid flat on the inner circumference of the upper fixing plate 80 and the lower fixing plate 81.

Further, for example, the same annular upper fixing plate 80 and the lower fixing plate 81 may be used, and the diaphragm portion may be fixed by a bolt or the like (avoiding the position of the release film F).

Further, the lower mold clamper 35 is formed with a step portion 83 which is recessed from the end surface and extends in the circumferential direction at the peripheral end portion. The step portion 83 of the lower mold clamper 35 is fitted to the diaphragm portion (membrane loader 57) corresponding to the inner diameter portion 81a of the lower fixing plate 81, and is fixed. In the present embodiment, the release film F can be kept flat and the release film F can be placed in the lower mold 32 in a flat state.

Next, a resin molding method (a method of operating the resin molding apparatus 100) using the resin molding apparatus 100 of the present embodiment will be described.

As shown in Fig. 20, in the state in which the molding die 30 is opened, the workpiece W is carried into the workpiece loader 56 from the outside of the mold. Further, in a state in which the molding die 30 is opened, the resin R and the release film F are carried by the film loader 57.

Further, before this, as shown in Fig. 21, a film portion is formed between the upper fixing plate 80 and the lower fixing plate 81 with the release film F, and the film portion is formed. The resin R is mounted (supplied) on the release film F.

Next, as shown in Fig. 22, the workpiece loader 56 is raised, and the workpiece W is delivered to the upper mold 31.

Further, as shown in Fig. 22, the film loader 57 is lowered, and the release film F on which the resin R is placed is delivered to the lower mold 32. Specifically, first, the lower surface of the lower fixing plate 81 and the step portion 83 of the lower mold holder 35 are fixed by the lowering of the film loader 57, and then the elastic member 50 is compressed (the movable portion is moved). That is, the lower mold holder 35 is depressed by the lowering of the film loader 57. Next, the film loader 57 is lowered until the upper surface (upper end surface) of the lower mold core 34 and the upper surface (upper end surface) of the lower mold clamp 35 are horizontal.

At this time, the film loader 57 is stretched to maintain the flat release film F. That is, on the lower mold 32 which is horizontal to the upper surface (upper end surface) of the lower mold core 34 and the upper surface (upper end surface) of the lower mold clamp 35, the flat release film F is disposed by the film loader 57 to make the resin R is located on the lower mold core 34.

Next, in a state where the upper surface of the lower mold core 34 and the upper surface of the lower mold clamp 35 are horizontal, the upper portion of the lower mold core 34 and the lower mold clamp 35 are adsorbed and held by the adsorption portion 53. The release film F in the flat state above.

Next, as shown in Fig. 23, the workpiece loader 56 is lowered. Thereby, the workpiece loader 56 is isolated from the workpiece W. The workpiece W is held only by the upper mold 31. Next, the workpiece loader 56 is formed by molding. The mold 30 is internally retracted.

Further, as shown in Fig. 23, the flat release film F is sucked by the suction portions 53 by the air passages 47A, 52, and the film loader 57 is raised to extend the elastic member 50 (the movable portion is moved). By the elastic member 50, the lower mold core 34 is relatively moved to the lower mold clamp 35, and the cavity concave portion 33 is formed.

At this time, the inner diameter portion 81a of the lower fixing plate 81 and the step portion 83 of the lower mold clamper 35 are fitted to fix the outer peripheral portion of the release film F, and the concave portion of the cavity corresponding to the release film F is adsorbed by the adsorption portion 53. Since the portion of the corner portion 33 is formed, the release film F is deformed along the inner surface of the cavity concave portion 33. Thereby, the release film F is adsorbed and held along the inner surface of the cavity concave portion 33.

At this time, the release film F is adsorbed and held along the inner surface of the cavity concave portion 33, and the resin R can be directly supplied to the cavity concave portion 33 in this shape. In other words, the resin R is disposed on the lower mold core 34 via the release film F by the film loader 57, so that even if the lower mold core 34 is relatively moved to the lower mold clamp 35 to form the cavity concave portion 33, the resin R This state is maintained and supplied to the cavity concave portion 33. Therefore, the resin R can supply the resin R to the bottom of the cavity recess 33 without maintaining the shape and without changing the position. By supplying the resin R to the cavity concave portion 33 in a desired state as described above, it is possible to effectively reduce the quality defect of the molded article such as the shrinkage hole or the lead offset.

Next, as shown in Fig. 24, the mold 32 is raised by the movable mold, and the molding die 30 is clamped (molded). Thereby, the release film F is nipped, that is, the upper mold 31 and the lower mold 32 sandwich the diaphragm portion (film loader 57). Then, as described in the first embodiment, reference is made to Figs. 8 to 9 In the process, the molded product is roughly completed.

<Fifth Embodiment>

In the first embodiment, the lower mold holder 35 is pressed by the film loader 57 (operation portion 63) so that the upper surface of the lower mold core 34 and the upper mold clamp 35 are horizontal. On the other hand, in the present embodiment, the difference is the plate-shaped jig 34A (the upper portion of the lower mold core 34) in which the floating support is provided in the lower mold 32, and the upper surface of the jig 34A and the lower mold holder 35 are placed. Level. The following will focus on this difference and refer to Fig. 25 to Fig. 26 for explanation. Fig. 25 to Fig. 26 are schematic cross-sectional views of the pressing portion 130 in the present embodiment.

Here, the pressing portion 130 in the present embodiment will be specifically described. The pressing portion 130 is provided with a plate-like jig 34A in which the upper portion of the lower mold core 34 is detachably provided. Further, the pressing portion 130 is provided with a plurality of support pins 84 that support, for example, four corners of the plate-shaped jig 34A. Further, the pressing portion 130 is provided with the same number of elastic members 85 (for example, springs) as the supporting pins 84, and is assembled such that the lowering mold holder 46 of the supporting pin 84 can be moved in the vertical direction. Thereby, in the state of the mold opening, the elastic member 85 constituting the support pin 84 and the movable portion is floated to support the jig 34A, and the upper and lower mold holders 35 of the jig 34A (the upper portion of the lower mold core 34) are clamped. The top is horizontal. Further, the plate-like jig 34A may be a structure that can be lifted and lowered without using the elastic member 85 and using a drive mechanism such as an air cylinder or a servo motor. #

Next, a resin molding method (a method of operating the resin molding apparatus 100) using the resin molding apparatus 100 in the present embodiment will be described.

As shown in Fig. 25, in a state in which the molding die 30 is opened, the resin R and the release film F are carried and delivered to the lower mold 32. At this time, the release film F is attached to the upper mold 32 which is horizontal on the upper surface of the jig 34A (upper portion of the lower mold core 34) and the upper mold clamp 35, and is disposed flat by the film loader 57. Next, the release film F is started to be sucked by the adsorption portions 53 and 55.

Next, as shown in Fig. 26, the release film F is sucked by the adsorption portions 53, 55. Specifically, the outer peripheral portion of the release film F is adsorbed by the adsorption unit 55, and the air in the space below the release film F is adsorbed by the adsorption unit 53 and is provided on the side of the jig 34A movable in the vertical direction with respect to the lower mold clamp 35. The compression elastic member 85 is lowered (the movable portion is moved).

This elastic member 85 causes the jig 34A (the upper portion of the lower mold core 34) to relatively move toward the lower mold clamp 35 to form the cavity concave portion 33. At this time, the outer peripheral portion of the release film F is adsorbed by the adsorption portion 55, and the portion corresponding to the corner portion of the cavity concave portion 33 of the release film F is adsorbed by the adsorption portion 53, so that the release film F follows the inside of the cavity concave portion 33. Deformed from the surface. Thereby, the release film F is adsorbed and held along the inner surface of the cavity concave portion 33.

Further, the release film F is suction-held along the inner surface of the cavity concave portion 33, and the resin R is supplied to the cavity concave portion 33 in this shape. Since the resin R is disposed on the jig 34A via the release film F by the film loader 57, even if the cavity concave portion 33 is formed, it is maintained in this state and supplied to the cavity concave portion 33. Therefore, the resin R can supply the resin R to the bottom of the cavity recess 33 without maintaining the shape and without changing the position. Then, referring to FIG. 7 to FIG. 9 as in the first embodiment described above. In the process described in the figure, the molded product is roughly completed.

Thereby, it is not necessary to press the lower mold clamp 35 by the film loader 57, for example, the end surface of the lower mold core 34 and the end surface of the lower mold clamp 35 are horizontal, which simplifies the operation of the film loader 57, Structure (eg drive motor output, lower stroke). Further, when the release film F is placed on the lower mold 32, the jig 34A (the upper portion of the lower mold core 34) is in a floating state, so that heat shrinkage of the release film F can be prevented, and the resin mounted on the release film F can be prevented. R is overheated and it is easy to adjust the heating.

<Sixth embodiment>

In the first embodiment, the case where the inside of the molding die 30 including the cavity concave portion 33 after the mold clamping is airtight is described, and the inside of the molding die 30 is decompressed (degassed). At this time, when the workpiece holding portion (the air passage 90 and the suction portion 91) of the upper mold 31 adsorbs the substrate 10 (the workpiece W) and is held by the upper mold 31, the substrate is lowered due to the attraction force of the pressure reduction. The attractive attraction of the adsorption may cause the substrate 10 to fall. In the above-described first embodiment, the difference in the present embodiment is that the lower mold holder 35 floats and supports the plurality of pins and the decompression space is formed, and the substrate 10 is pressed to the upper mold 31 to support Structure. The following will focus on this difference and refer to Fig. 27 for explanation. Fig. 27 is a schematic cross-sectional view showing the pressing portion 130 in the present embodiment.

The pressing portion 130 is provided with a plurality of pins 86 provided around the through hole 47 of the lower mold clamp 35 and provided inside the lower mold clamp 35. In addition, pressure The molded portion 130 includes the same number of elastic members 87 (for example, springs) as the plug 86, and is assembled inside the lower mold clamp 35 so that the plug 86 can move in the vertical direction with respect to the lower mold clamp 35.

Therefore, in the state in which the decompression space is formed, the end surface of the lower mold holder 35 protrudes, and the release film F abuts against the surface of the substrate 10 to support the workpiece W, and the elastic member 87 constituting the movable portion floats. Support the latch 86. Next, in a state in which the workpiece W is nipped (refer to FIG. 8), the plug 86 is housed inside the lower mold clamp 35. Therefore, it is possible to prevent the workpiece W held by the upper mold 31 from being dropped before being clamped.

Further, when the pressure reducing space is formed in the pressure reducing portion 45 through the air passage 44 in Fig. 27, it seems that the suction passage is blocked. However, since the plug 86 is partially disposed, the pressure reduction is not hindered.

<Seventh embodiment>

In the first embodiment in which the resin is molded on one surface only on the workpiece W (substrate 10), the present embodiment differs in that the resin is molded on both surfaces of the workpiece W. This difference will be described below with reference to Figs. 33 to 36. Figs. 33 to 36 are schematic cross-sectional views of the pressing portion 130 in the resin molding step in the present embodiment.

The workpiece W in the present embodiment includes a substrate 10 having one surface 10a and the other surface 10b opposite thereto, and is provided on each of the plurality of spherical bumps 11A and 11A on both surfaces 10a and 10b (first part, The second part is configured, for example, in a wafer shape (plate shape). Resin molding on both sides 10a, 10b Each of the bumps 11A and 11A forms a resin molded portion 14 and 15 on both surfaces 10a and 10b (see FIG. 36), and the workpiece W substantially completes a resin molded product (molded article).

The resin molding of such a wafer-like workpiece W is called WLP (Wafer Level Package). Further, the component to be processed W is not limited to the bump 11A of the wiring component, and may be a wafer component (for example, a semiconductor wafer, a MEMS wafer, a wafer capacitor, or the like), or may be a wiring component or a wafer component. . The substrate 10 is not limited to a general substrate, and may be a carrier or a semiconductor wafer in which a plate member is temporarily mounted.

Further, in the present embodiment, the workpiece W is not resin-molded, and the two-faced parts (bumps 11A) are exposed (see Fig. 33), and only one side of the resin is molded, and the other parts (bumps 11A) are exposed ( Referring to Fig. 35), the robot mechanism unit 180 (see Fig. 1) is individually supplied. Therefore, the pressing unit 130 in the present embodiment includes the plate-shaped first jig 12 (see reference to Fig. 33) and the second jig 13 (see Fig. 35).

When the jigs 12 and 13 sandwich the workpiece W between the upper mold 31 and the lower mold 32, they are respectively replaceable under the upper mold insert 37. The jig 12 has a first opening 12a (a plurality of which are shown in FIG. 33), and is larger than the mounting area of the bump 11A mounted on the semiconductor wafer manufactured as a product on the surface 10a. In other words, the first opening 12a is formed by avoiding the components provided as the bumps 11A and overlapping the workpiece W and the jig 12. Further, the jig 13 has a second opening 13a larger than the opening 12a (one shown in Fig. 35).

When the jig 12 is used, the projection 11A is housed in the opening 12a (that is, the recessed portion of the projection 11A is secured by the opening 12a), and is mounted on the surface 10a of the workpiece W (see page 33). Figure). Further, when the jig 13 is used, the resin molded portion 15 is housed in the opening 13a (that is, the recessed portion of the resin molded portion 15 is secured by the opening 13a), and is mounted on the surface 10b of the workpiece W. (Refer to Figure 35). In the present embodiment, the jigs 12 and 13 can be used to prevent the projections 11A or the resin molded portion 15 from retreating from the recesses (avoiding), and the workpiece W can be held (see FIGS. 34 and 36).

Further, since the jigs 12 and 13 are replaceable, the molding die 30 can be shared when molding other products, and other jigs can be used. Further, the jigs 12 and 13 may be fixed to the upper mold 31 for use.

In the present embodiment, the loader 190 is attached to the workpiece W delivered by the robot mechanism unit 180, and the jig 12 or the jig 13 is overlapped and carried into the pressing unit 130. Further, the loader 190 removes the jig 12 or the jig 13 from the workpiece W that has been molded by the resin delivered from the press unit 130, and carries out the robot mechanism unit 180. As described above, the jig 12 or the jig 13 is prepared on the loader 190, and the workpiece W is delivered to the inside of the press unit 130 together with the jig 12 or the jig 13.

Next, a method of manufacturing a molded article (resin molded article) using the resin molding apparatus 100 (compression molding apparatus) of the present embodiment (resin molding method) will be described. Specifically, when the resin molded portions 14 and 15 are formed on both surfaces (surfaces 10a and 10b) of the workpiece W of the molded article, One-sided forming method (two-stage forming method of primary molding and secondary molding).

First, the workpiece W conveyed by the robot mechanism unit 180 can be accommodated in the opening 12a in the loader 190, and the jig 12 can be mounted on one surface 10a of the workpiece W. In this case, since the jig 12 is mounted on the loader 190, the robot mechanism unit 180 only needs to transport the workpiece W. Therefore, the robot mechanism unit 180 having a small load can be used, and the manufacturing cost of the device can be reduced.

Then, in the state in which the molding die 30 is opened, the workpiece W and the jig 12 are carried into the workpiece loader 56 (see FIG. 3) from the outside of the mold, and the workpiece W and the jig 12 are delivered to the upper mold. 31 (refer to Figure 33). Thereby, the workpiece W is held by the mold surface of the upper mold 31.

Specifically, in a state where the surface 10b of the workpiece W faces the lower mold 32, the jig 12 is brought into contact with the lower surface of the upper mold insert 37, and the workpiece holding portion (not shown) is placed on the upper mold 31. The mold surface of the upper mold insert 37 is held by the jig 12 to hold the workpiece W (substrate 10). The jig 12 is provided with an opening 12a that can be retracted by the bump 11A mounted on the surface 10a of the workpiece W (substrate 10), so that the bump 11A can be protected, for example. Alternatively, the jig 12 may be omitted, and a concave portion may be formed in the lower surface of the upper mold insert 37 to retract the projection 11A.

Further, in a state where the molding die 30 is opened, the resin R and the release film F are carried by the film loader 57 (see FIG. 3), and the resin R and the release film F are delivered from the film loader 57 to the lower mold 32. (Refer to Figure 33). At this time, order The shape of the release film F is deformed from flat to the lower mold cavity concave portion 33, and the mold surface of the lower mold 32 including the lower mold cavity concave portion 33 is sucked to hold the release film F, and the resin R is supplied to the lower mold. Cavity recess 33.

In addition, the use of the release film F prevents leakage of resin from the slits of the lower mold insert 34 and the lower mold clamp 35. However, if the resin leakage does not affect, the resin R may be directly transferred, or the release film F may not be used.

Next, as shown in Fig. 34, the mold 32 is raised by the movable mold, so that the bump 11A provided on the surface 10b is completely immersed in the resin R which is melted at the mold temperature, and the upper mold 31 and the lower mold 32 are held. The workpiece W moves the lower mold insert 34 to the molding position. Then, the resin R filled in the lower mold cavity C is heat-cured, and resin molding of the workpiece W is performed. Thereby, the resin molded portion 15 is formed on the surface 10b of the workpiece W.

After that, the workpiece W (molded article) is held in the upper mold 31 by the workpiece holding portion, and the release film F is held in the lower mold 32 by the adsorption portions 53 and 55. At this time, since the release film F is used, the workpiece W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 (see FIG. 1) through the inspection unit, the cooling unit 140, and the curing unit 150.

Then, the workpiece W included in the resin molded portion 15 formed on the surface 10b in the workpiece storage unit 160 is stored in the cartridge, so that the cartridge is moved to the workpiece supply unit 110. At this time, the workpiece W is reversed so that the resin molded portion 14 can be formed on the surface 10a of the workpiece W to complete the secondary formation. Type preparation. Moreover, the jig 12 and the jig 13 are exchanged, and the same process as the process of forming the resin molding part 15 is performed, and the resin molding part 14 is formed.

Then, the resin molded portion 15 of the workpiece W loaded into the loader 190 by the robot mechanism unit 180 can be housed in the opening 13a, and the jig 13 can be mounted on one surface 10b of the workpiece W. At this time, the opening 13a of the jig 13 is larger than the plane area of the resin molding portion 15, in other words, larger than the upper surface of the lower mold insert 34 constituting the cavity C below the resin molding portion 15.

Then, in the state in which the molding die 30 is opened, the workpiece W and the jig 13 are carried into the workpiece loader 56 (see FIG. 3) from the outside of the mold, and the workpiece W and the jig 13 are delivered to the upper portion. Module 31 (refer to Figure 35). The jig 13 is provided with an opening 13a that can be retracted by the resin molded portion 15 mounted on the workpiece W (substrate 10) 10b, so that the resin molded portion 15 can be protected, for example. Further, the concave portion may be formed on the lower surface of the upper mold insert 37 without using the jig 13, and the resin molded portion 15 may be retracted.

Further, in a state where the molding die 30 is opened, the resin R and the release film F are carried by the film loader 57 (see FIG. 3), and the resin R and the release film F are delivered from the film loader 57 to the lower mold 32. (Refer to Figure 33). At this time, the shape of the release film F is deformed from flat to the lower mold cavity concave portion 33, and the release film F is adsorbed and held on the mold surface of the lower mold 32 including the lower mold cavity concave portion 33, and the resin R is applied. It is supplied to the lower mold cavity recess 33.

This resin R is formed into the resin molded portion 14, so that it is of the same amount and homogeneity as the resin molded portion 15 which is formed first, and the bump 11A can be sealed to the same a shape. However, in the present embodiment, when the heights of the components mounted on the substrate 10 of the bumps 11A are different, the resin R of the respective applicable portions may be used. In this case, the resin R having different properties can be used for the purpose of bending due to the difference in the thickness of the resin molding or the function of the component to be mounted.

Next, as shown in Fig. 36, the mold 32 is raised by the movable mold, so that the bump 11A provided on the surface 10a is completely immersed in the resin R which is melted at the mold temperature, and the upper mold 31 and the lower mold 32 are held. The workpiece W moves the lower mold insert 34 to the molding position. Then, the resin R filled in the lower mold cavity C is heat-cured, and resin molding of the workpiece W is performed. Thereby, the resin molded portion 15 is formed on the surface 10a of the workpiece W.

After that, the workpiece W (molded article) is held in the upper mold 31 by the workpiece holding portion, and the release film F is held in the lower mold 32 by the adsorption portions 53 and 55. At this time, since the release film F is used, the workpiece W can be easily released. Then, as described above, the workpiece W is stored in the workpiece storage unit 160 (see FIG. 1) through the inspection unit, the cooling unit 140, and the curing unit 150.

In the subsequent workpiece W, the end faces of the resin molded portions 14 and 15 are ground, the bumps 11A are exposed, and a region corresponding to one wafer is singulated, and one package can be formed on both sides to form a connection terminal surface (resin molded product) ). Further, the bump 11A is attached to one surface of the substrate 10 disposed on one surface, and when used as the workpiece W, the substrate 10 is detached and then singulated in a region corresponding to one wafer, and can be efficiently molded. Formed on A single side forms a package that connects the terminal faces.

According to the present embodiment, each of the both surfaces 10a and 10b of the plate-shaped workpiece W can be resin-molded by a compression molding method. Further, since the resin R can be supplied to the lower mold cavity concave portion 33 (the lower mold cavity C) and resin molding is performed, even if it is a large workpiece W, it can be efficiently molded.

In addition, after the resin molding portion 15 is formed on one surface of the workpiece W, the workpiece W is not stored in the workpiece storage unit 160, and is carried into the pressing portion 130 to form the resin molding portion 14, and the resin molding portion can be continuously molded. 14,15.

Further, in the above-described embodiment, the resin-retaining plate-like member for flattening the holding resin R may be placed on the resin R and away from the shutter portion 70 provided to keep the resin R and the release film F flat. The release film F is conveyed in a state between the film F. For the plate-shaped member for holding the resin, for example, a metal plate, a glass plate, or a chopped silicon dioxide wafer or the like may be used, and a structure such as a lead frame or a substrate may be used. In this case, the plate-like member for resin retention can be peeled off after molding, and remains directly in the package as a heat releasing layer, an electromagnetic shielding layer, a filter layer, a lens layer, a wavelength conversion layer, a gas permeation preventing layer, or a wiring layer. Use the functional layer. By using the plate-shaped member for holding the resin, the plate-shaped member which is highly functional to be attached to the workpiece W is used, and the high-performance product can be easily manufactured by the flat transfer resin R and the release film F. Further, a resin-retaining plate-shaped member and a shutter portion 70 may be used in combination.

<Eighth Embodiment>

In the press portion of the resin molding apparatus according to the first embodiment, the mold clamping of the molding die is performed by a well-known holding mechanism. In the present embodiment, a resin molding apparatus in which a pressing portion is provided with a holding mechanism corresponding to a large-size (WLP) workpiece W is specifically described. According to the resin molding apparatus of the present embodiment, the parallelism of the moving template for the mold clamping operation can be maintained, the mold clamping can be performed with high precision, and the final resin pressure can be increased to high pressure, thereby improving the molding quality.

Hereinafter, a preferred embodiment of a resin molding apparatus having a clamping mechanism for a switch molding die according to the present invention will be described in detail with reference to the accompanying drawings. The resin molding apparatus 201 includes a molding die 204 having an upper die 202 and a lower die 203, and a chucking mechanism 205 that switches the molding die 204.

In Fig. 37, the clamping mechanism 205 is provided on the rectangular mold base portion 206. The die seat portion 206 and the fixed die plate 207 are connected by a large column 208 disposed at each corner portion (four places; see Fig. 38). The upper die 202 is supported by a fixed die plate 207, and the lower die 203 is supported on the front (upper) side of the movable die plate 209. The moving template 209 is guided up and down by a large column 208 that runs through the series.

The back side of the moving die plate 209 is provided with a ball screw mechanism 210 (first open mold clamping mechanism) which is coupled in series with the moving die plate 209, and molds the forming die 204 to the first mode-locking between the fixed die plate 207 and the fixed die plate 209. Force.

Specifically, the screw shaft 211 is provided at four places on the inner side of the large column 208 of the die holder portion 206, and the first drive motor 212 (servo motor) that rotationally drives the respective screw shafts 211 is provided at four places. The first drive motor 212 can be in multiple motors Synchronous drive to achieve high-precision speed control with servo control. Further, on the back side of the moving die plate 209, four fixing nuts 213 which are screwed into the screw shaft 211 are provided. In Fig. 38, the large post 208 and the screw shaft 211 are disposed at equal angular intervals from each other at the diagonal positions of the die holder portion 206 (moving die plate 209). Further, as long as the ball screw mechanism 210 is provided in three or more, a few may be provided.

A toggle link mechanism 214 (second open mold clamping mechanism) is provided at a central portion of the back side of the movable die plate 209. The toggle link mechanism 214 is clamped to a second clamping force that strengthens the clamping force more than the first clamping force in series with the moving die plate 209, and maintains the final resin pressure. Specifically, a central portion of the die holder portion 206 is provided with a second drive motor 216 (servo motor) that rotationally drives the screw shaft 215 and its screw shaft 215. The screw shaft 215 is screwed into the movable nut 217. The movable nut 217 is provided as an integral annular joint portion 218. Further, each of the drive motors 216 and 212 may be disposed on the side of the die holder portion 206 by a belt mechanism.

The toggle link mechanism 214, which is a so-called lever mechanism, is configured to increase (increase) the output of the second drive motor 216 by using the toggle link structure formed by the following ring members, and can output to the moving template. 209. Specifically, the annular connecting portion 218 is coupled to the connecting ring 219 so that one end of the connecting ring 219 is rotatable. The other end of the connecting ring 219 is coupled to the apex portion of the triangular ring 220 so that the triangular ring 220 can be reversed. The bottom corner portion of one of the triangular rings 220 is coupled to be retractable relative to the die holder portion 206, and the other bottom corner portion is coupled to the sliding ring 221 to be reversible at one end of the sliding ring 221 . The other end of the sliding ring 221 is disposed on the back of the moving template 209 The surface connecting portion 209a is coupled so that the connecting portion 209a can be reversed. With this configuration, the toggle link mechanism 214 can drive the second drive motor 216 that is screwed into the movable nut 217 to drive the connection portion 209a provided on the back surface of the movable die plate 209.

Further, the first drive motor 212 and the second drive motor 216 are driven and controlled by the control unit 222. Further, each of the large columns 208 is provided with a pressure sensor 223. The control unit 222 detects the nip pressure of the molding die 204 by the pressure sensor 223, and drives and controls the first drive motor 212 and the second drive motor 216 to control the mold by the ball screw mechanism 210 and the toggle link mechanism 214. Clamping action.

Specifically, after the mold clamping operation is started, the control unit 222 drives and synchronizes the first drive motor 212 and the second drive motor 216, and the workpiece supplied to the molding die 204 is moved by the ball screw mechanism 210 through the movable die plate 209. After being clamped by the first clamping force, the pressurized state of the ball screw mechanism 210 is delivered to the pressurized state caused by the toggle link mechanism 214, and the toggle link mechanism 214 clamps the moving die 209 to the ratio. The second clamping force with a large first clamping force.

An example of the molding die 204 will be described with reference to Fig. 40A. The upper mold 202 is mounted on the mold base 202a by the solid template 7. The upper mold insert 202b is assembled on the upper mold base 202a. The workpiece holding portion 202c that is formed by the workpiece W of the upper mold insert 202b and which is held and held without any difference in height is present.

The lower mold 20 lower mold base 203a is supported by the movable mold 209. The clamping surface of the lower mold base 203a is formed with a recess under which the recess is supported The mold core 203b and the lower mold clamp 203c are biased and supported by the coil spring 203d around them. The lower mold clamp 203c protrudes above the upper mold core 203b to form a lower mold cavity recess 203E. The release film F coats the lower mold cavity concave portion 203E and is adsorbed and held.

The release film F is adsorbed and held on the upper mold clamping surface. The release film F is preferably a thickness of about 0.5 mm, has heat resistance, is easily peeled off from the mold surface, and has flexibility and stretchability, such as PTFE, ETFE, PET, FEP film, fluorine-containing glass fiber, polypropylene film. A single layer or a multilayer film mainly composed of polyvinylidene chloride or the like.

Next, an example of the switching operation and the resin molding operation of the chucking mechanism 205 will be described with reference to FIGS. 37, 39A and 39B, and 40A to 40C.

In Fig. 37, in a state in which the molding die 204 is opened, the workpiece W is supplied to the molding die 204 by a supply device (not shown). Further, the lower mold cavity concave portion 203E of the lower mold 203 is previously coated and adsorbed and held by the release film F.

As shown in FIG. 40A, the workpiece W (for example, a substrate on which a semiconductor wafer is mounted, a semiconductor wafer, or the like) is adsorbed and held by the workpiece holding portion 202c of the upper mold 202, and is covered by the release film F. The cavity concave portion 203E is supplied with a film-forming resin R (liquid resin, particulate resin, granule resin (powdered resin), sheet-like resin, ingot resin, or the like). Further, the film-forming resin R may be supplied together with the release film F to the lower mold cavity concave portion 203E.

After the mold clamping operation is started, the control unit 222 drives the first drive motor 212 and the second drive motor 216 to synchronize them. In Fig. 39A, the ball screw mechanism 210 has four screw shafts 211 starting to rotate due to the driving of the first drive motor 212, and the moving template 209 which is screwed into the fixing nut 213 is rotated in accordance with the rotation of the screw shaft 211. The fixed template 207 rises in a state in which the parallelism is maintained. That is, the lower mold 203 (specifically, its parting surface) rises in a state in which the upper mold 202 (specifically, its parting surface) maintains parallelism.

Further, due to the driving of the second drive motor 216, the movable nut 217 in which the toggle link mechanism 214 is screwed into the screw shaft 215 is moved upward, and the connecting ring 219 connecting the both sides of the annular connecting portion 218 is horizontally directed to both sides. Pour, rotate to raise the triangular ring 220, and push the sliding ring 221 upward. At this time, the toggle link mechanism 214 does not receive the load through the movable die plate 209 due to the slit provided between the slide ring 221 and the joint portion 209a.

Further, as shown in Fig. 40B, the lower mold clamp 203c is compressed in a state in which the release film F abuts on the workpiece W (substrate) and the upper mold insert 202b. Thereby, a sealed space (decompression space, closed space) is formed in the molding die 204, and the resin R is filled into the cavity concave portion 203E (cavity). In this case, the moving template 209 is raised in a state in which the parallelism is maintained, and the fixed template 207 can also be approached in a state in which the parallelism is maintained. Therefore, the mold clamping of the upper mold 202 and the lower mold 203 can also be performed while maintaining the parallelism. Further, as shown in Fig. 40, as in the case where the resin R is supplied to the center of the lower mold cavity concave portion 203E, the resin R is directed toward the lower mold cavity. When the outer side of the concave portion 203E is enlarged and filled in the cavity concave portion 203E (cavity), the ball screw mechanism 210 can appropriately control the mold clamping speed.

In this case, the mold clamping is continued, and when the four pressure sensors 223 detect the first mold clamping pressure (for example, a total of 36 tons; the resin pressure of the film-mold resin R), the driving of the first driving motor 212 is stopped, and the second driving motor 216 is continuously driven. . Thereby, the pressurizing state of the moving template 209 by the ball screw mechanism 210 is received by the toggle connecting rod mechanism 214, and the pressure is applied to each of the pressure sensors 223 to detect the second clamping force higher than the first clamping pressure (for example, total 125 tons; the final resin pressure). Thereby, in the 39B, the movable nut 217 is further moved up along the screw shaft 215, and the sliding ring 221 connected to the connecting portion 209a of the movable die plate 209 is brought into an upright state with the triangular ring 220. Further, the driving of the first drive motor 212 may be stopped, and the moving template 209 may be pressurized by both the ball screw mechanism 210 and the toggle link mechanism 214. Further, the ball screw mechanism 210 may be in a state of being driven while not being pressurized.

At this time, as shown in Fig. 40C, in the state where the molding die 204 is in contact with the lower mold holder 203c, the pressing of the moving die plate 209 is reinforced, so that the spiral of the lower die clamp 203c The spring 203d is compressed, and the film-forming resin R is filled into the lower mold cavity concave portion 203E to maintain the final resin pressure to heat-harden the film-mold resin R.

As described above, the workpiece to be supplied to the molding die 204 can be sandwiched by the first clamping force by the ball screw mechanism 210 through the moving die plate 209, and a sealed space can be formed in the molding die 204. This ball screw mechanism 210 The resulting pressurized state will be received by the toggle link mechanism 214, with the toggle link mechanism 214 gripping the moving die plate 209 until a second clamping force greater than the first clamping force is applied to the final resin film. Plastic resin R.

Therefore, the parallelism of the movable die plate 209 during the mold clamping operation can be maintained, the high-precision mold clamping can be performed, and the final resin pressure can be made high, and the molding quality can be improved. In other words, the ball screw mechanism 210 accurately controls the amount of driving until the filling of the film-mold resin R, which is particularly important for the parallelism and the mode-locking speed, is performed, and after the film-molding resin R, which is particularly important for the application of the pressure, is filled, By the engagement and pressurization of the toggle link mechanism 214 which increases the output of the second drive motor 216, the required performance can be achieved before and after the mold 204 is clamped.

Further, as the chucking mechanism 205 of the switch molding die 204, the toggle link mechanism 214 that increases the output of the second drive motor 216 is used, and the mold clamping operation is performed without, for example, increasing the output mechanism and using only the linear motion mechanism. In comparison with the servo motor (the first drive motor 212 and the second drive motor 216) of the drive mechanism, the diameter of the screw shaft 211 can be made smaller, the size of the screw shaft 211 can be reduced, and the power consumption can be reduced and the power consumption can be reduced. manufacturing cost. Therefore, it is possible to increase the size of the workpiece W more inexpensively.

In the 40A to 40C, the workpiece W is held in the upper mold 202 of the molding die 204, and the film-forming resin R is supplied to the cavity formed in the lower mold 203, but the structure may be reversed.

That is, in Fig. 41A, the upper mold base 202a of the upper mold 202 is supported by the fixed die plate 207. The clamping surface of the upper mold base 202a is formed The concave portion supports the upper mold core 202d, and the upper mold clamp 202e is supported by the coil spring 202f and suspended by the upper mold clamp 202e. The upper mold clamp 202e protrudes below the lower surface of the upper mold core 202d, and the upper mold cavity concave portion 202g is formed. The release film F covers the upper mold cavity concave portion 202g and is adsorbed and held.

The lower mold base 203a of the lower mold 203 is supported by the moving mold 209. The lower mold base 203a is assembled with a lower mold insert 203F. The workpiece holder 203f is formed with a workpiece holding portion 203g that is held and held horizontally by the workpiece W and the nip surface.

As shown in FIG. 41A, the workpiece W (for example, a substrate on which a semiconductor wafer is mounted, a semiconductor wafer, or the like) is supplied to the workpiece holding portion 203g of the lower mold 203, and the film is supplied to the film. Plastic resin R (liquid resin, particulate resin, granule resin (powdered resin), sheet resin, ingot resin, etc.). The film-mold resin R may be supplied to the workpiece W in advance and supplied to the workpiece holding portion 203g. The upper mold cavity concave portion 202g of the upper mold 202 is covered by the release film F, and is adsorbed and held.

After the ball screw mechanism 210 is driven, after the mold clamping operation is started, as shown in FIG. 41B, the upper mold clamp 202e is in contact with the workpiece W (substrate) and the lower mold insert 203f via the release film F. Next, the coil spring 202f is compressed. Thereby, a sealed space (decompression space, closed space) is formed in the molding die 204, and in this state, the film-mold resin R is filled into the upper cavity portion 202g.

The molding die 204 reaches the first clamping force, and is pressurized from the ball screw mechanism 210 to be pressurized by the toggle link mechanism 214. As shown in Fig. 41C, the molding die 204 is clamped to the lower die insert 203f and the upper die. When the device 202e abuts, the pressurization of the moving die plate 209 is reinforced, so that the coil spring 202f of the upper die clamp 202e is compressed, and the resin pressure in the cavity concave portion rises to reach the final clamping pressure and maintain A state in which a specific resin pressure is applied to the film-mold resin R causes the film-mold resin R to be heat-hardened.

According to the above configuration, the control unit 222 starts the mold clamping operation, drives the ball screw mechanism 210 and the toggle link mechanism 214, and synchronizes them, and the ball screw mechanism 210 transmits the workpiece W to the molding die 204 through the moving die plate 209. The first clamping force is clamped to mold the molding die 204, and a sealed space is formed in the molding die 204. The pressurized state caused by the ball screw mechanism 210 will be received by the toggle link mechanism 214, and can be pressurized to the second die with the moving die plate 209 being clamped to a greater than the first clamping force by the toggle link mechanism 214. Until the end of the force, the film resin R is heat-hardened by the final resin pressure.

With the above-described model structure, it is possible to provide a resin molding apparatus that is small and can be molded at a low cost by maintaining the parallelism and the mold clamping speed of the molding die 204 with high precision in accordance with the enlargement of the workpiece W. 201. In addition, a hydraulic pressing mechanism may be provided instead of the toggle link mechanism 214. At this time, the parallelism of the moving template 209 during the mold clamping operation can be maintained, the high-precision mold clamping can be performed, and the final resin pressure can be increased to improve the molding quality. In addition, other lever mechanisms can be provided instead of the toggle joint rod machine. Structure 214.

Further, in addition to driving the movable die plate 209 by the ball screw mechanism 210 and performing the mold clamping operation to clamp the mold as described above, the toggle link mechanism 214 may also be the lower mold die 203b as shown in FIG. A structure that performs pressurization and driving. In this case, in addition to the through hole, the through hole is formed in the lower die holder 203a and the movable die plate 209, and the through hole is inserted through the pressing member of the lower mold die 203b, and is coupled to the joint portion 209a to drive the lower die separately. Ren 203b. Thereby, the pressure of the resin R and the clamping force caused by the lower mold core 203b can be individually controlled, so that the resin pressure can be increased and the clamping force can be suppressed arbitrarily. Even if the overall output of the device is suppressed, the resin pressure can be prevented from being formed. . Further, the switching drive state can be driven only by the ball screw mechanism 210 and by the ball screw mechanism 210 and the toggle link lever mechanism 214 in response to the required pressing force. Further, the lower mold core 203b can be raised separately and protruded from the lower mold 203, which makes it easier to clean the mold.

The present invention has been described in detail above with reference to the embodiments, and the invention is not limited thereto, and various modifications may be made without departing from the scope of the invention.

In the first embodiment described above, the case where the resin R is used as the resin R has been described. However, the resin R may be a film-like resin, or a film-like resin layer having a different size may be used in a mountain shape.

Specifically, molding using the workpiece W and the resin R as shown in Figs. 28 and 29 can be employed. As shown in the figure, the workpiece W can be flip-chip mounted on the substrate 10 using the wafer component 11. In this case, the resin R can be formed into a film-like resin having a high center, and a pellet resin supplied to a higher center can be used. In this case, in the process of molding the workpiece W and the resin R in the same manner as in the above embodiment, during the mold clamping after the mold clamping, as shown in Fig. 29, the wafer component 11 is immersed in the molten resin. In the case of R, the central portion of the wafer component 11 is sequentially immersed in the resin R. At this time, the molten resin R flows from the center of the substrate 10 to the outer peripheral side. Therefore, when the workpiece W of the wafer component 11 is mounted by sealing the flip chip, the filling between the wafer component 11 and the substrate 10 can be easily performed.

In the above-described first embodiment, the resin supply unit 120 has been described in which a plurality of grooves 123 are used, and the resin R of the same amount is supplied (mounted) to the release film F in the resin supply region. However, the present invention is not limited thereto, and a plurality of grooves 123 may be used instead of a multi-connecting nozzle having a fluid resin such as a pellet resin or a liquid resin. Thereby, it is possible to prevent a long supply time due to an increase in the amount of supply of the resin (larger in the field of resin supply). Further, for example, in the field of resin supply, each nozzle is distributed so that the resin supply is not uneven, and uniform supply can be achieved.

In the first embodiment described above, the elastic member 50 is expanded and contracted by the mold clamping of the mold clamping mechanism, and the lower mold core 34 is relatively moved to the lower mold clamp 35. However, the present invention is not limited thereto, and a mechanism that is driven separately from the clamp mechanism and whose height of the lower mold clamp 35 is variable may be used.

The variable mechanism of the cavity height can also be, for example, the lower mold core 34 The die holder 46 is movable to be connected to the driving source and assembled under the molding die 30, and the lower die holder 35 is fixedly assembled to the lower die holder 46.

In addition, the variable mechanism of the cavity height may be a plate thickness adjustment block (tapered block) formed between the lower die mold 34 and the lower die base 46 and having a tapered surface (inclined surface) at the overlapping interface. The wedge portion is provided, and one of the plate thickness adjusting blocks is a structure that can slide the driving source such as a cylinder or a motor.

In the first embodiment, the film loader 57 is connected to the adsorption unit 67 only by the holding surface 64, and air is sucked (see FIG. 3). However, the film loader 57a may be configured to be attracted to the air in the recess 66, or may be a structure in which the recess 66 is filled with air and pressurized. Specifically, a film loader 57a as shown in Figs. 30 to 32 can be used. Further, in the 30th to 32nd drawings, the upper mold 31 is omitted (see Fig. 3).

According to the film loader 57a, as shown in Fig. 30, when the release film F on which the resin R is placed is conveyed, the suction and addition of the system are different from the air passage 65a having the same function as the air passage 65 shown in Fig. 3. The pressure portion 67b and the air passage 65b connected to the recess 66 are attracted or pressurized. Specifically, the pressurization of the release film F by the weight of the resin R and the suction force (negative pressure) caused by the adsorption portion 67a are balanced, and the bending of the release film F due to the weight of the resin R can be prevented.

Further, according to the film loader 57a, as shown in FIGS. 31 and 32, when the release film F is placed in the cavity concave portion 33, air can be supplied from the suction and pressurizing portion 67b, and air can be filled into the concave portion 66. Internal pressure, stretch release film F wrinkles. Thereby, the suction film F can follow the shape of the cavity concave portion 33 from the portion corresponding to the corner portion of the cavity concave portion 33, and the wrinkle of the release film F can be pushed out from the end face of the mold core 34 to the outside. And removed, so that wrinkles can be prevented more reliably. Further, at this time, the air filled in the concave portion 66 can use heated air, and the occurrence of wrinkles can be prevented without lowering the mold temperature. Further, since the release film F is also heated, the release film F can be more reliably followed by the shape of the cavity recess 33.

In the first embodiment, the release film F in which the resin R is mounted in the film loader 57 is disposed on the lower mold 32. However, the present invention is not limited thereto, and the upper mold 31 may be disposed. In this case, the molding die 30 on the resin molding apparatus 100 is a structure in which the lower mold 32 and the upper mold 31 are vertically inverted, the lower mold (corresponding to the first mold in the present invention) and the upper portion in which the cavity is formed. The mold (corresponding to the second mold in the present invention) is closed by a resin molding of the workpiece W by a resin filled in the concave portion of the cavity. The upper mold may be the same as the lower mold 32 in the first embodiment, and may include a mold core constituting a bottom portion of the cavity portion of the cavity; a clamper constituting a side portion of the concave portion of the cavity; and the mold core may be opposite to the mold holder The moving movable portion; the adsorption portion, which is capable of attracting and adsorbing the release film F disposed to cover the end face of the mold and the end face of the clamp. In addition, the film loader is the same as the film loader 57 in the first embodiment, and the release film F is conveyed in a flat state, and the end face of the mold is equal to the end face of the mold, so that the release film F is kept flat. The state is disposed on the end face of the mold and the end face of the clamp. According to such a resin molding apparatus 100, it is possible to prevent the occurrence of wrinkles even when the pressing portion 130 is not carried together with the resin R. Raw and configured.

In the first embodiment, the case where the particulate resin R is supplied to the release film F in the resin supply unit 120 has been described. However, the present invention is not limited thereto, and the resin supply unit 120 may supply the liquid resin R. In this case, after the liquid resin R is supplied to the workpiece W by the resin supply unit 120, the entire workpiece W is carried into the pressing unit 130 by the robot mechanism unit 180. Further, the resin supply unit 120 may also supply the sheet-like resin R. In this case, the robot component unit 180 may overlap the sheet-like resin R supplied from the resin supply unit 120 with the release film F or the workpiece W, or may merely carry the resin R into the pressing portion 130.

Further, the workpiece W may have a plate-like member such as a wafer itself in which the wafer component 11 or the bump 11A is not mounted, if it has a surface to be protected. The surface of such a plate-like member may have a concavo-convex shape or a flat surface.

[Effects of the Invention]

Briefly, in the invention disclosed in the present invention, the effect obtainable by the representative can improve the quality of the molded article.

130‧‧‧Depression

11‧‧‧ wafer parts

30‧‧‧Molding mould

31‧‧‧上模

32‧‧‧Down

C‧‧‧ cavity

33‧‧‧ cavity recess

34‧‧‧Down mold

35‧‧‧Down mold clamp

36‧‧‧Upper mold base

37‧‧‧Upper insert

40‧‧‧Upper Mold Clamp

41‧‧‧through holes

41A‧‧ Air passage

42‧‧‧Flexible components

43‧‧‧ Sealing members

44‧‧‧Air passage

45‧‧‧Decompression Department

46‧‧‧ Lower mold base

47‧‧‧through holes

47A‧‧ Air passage

50‧‧‧Flexible components

51‧‧‧ Sealing members

52, 54‧‧ Air passage

53, 55‧‧ ‧ adsorption department

56‧‧‧Processed material loader

57‧‧‧ film loader

60‧‧‧Support board

61‧‧‧Support

62‧‧‧ Positioning Department

63‧‧‧Operation Department

64‧‧‧ Keep face

65‧‧‧Air passage

66‧‧‧ recess

67‧‧‧Adsorption Department

F‧‧‧ release film

R‧‧‧Resin

W‧‧‧Processed objects

Claims (14)

A resin molding apparatus characterized in that: an upper mold and a mold formed by a cavity concave portion to fill a resin in the concave portion of the cavity to mold a workpiece, the lower mold having: a bottom portion of the concave portion of the cavity a lower mold mold; a lower mold clamp constituting a side portion of the cavity concave portion; a loader for holding the film of the resin and capable of being transported; and an adsorption portion absorbing and disposing to cover the end face of the mold and the above a die of the end face of the clamper; the lower die die is configured to move relative to the lower die clamp, and the loader is horizontally attached to the end face of the lower die and the end face of the lower die clamp The lower mold is disposed such that the resin is positioned on the lower mold core, and the adsorption unit is attached to the inner side of the cavity concave portion to adsorb the film to supply the resin to the cavity concave portion. The resin molding apparatus according to claim 1, wherein the loader includes an operation unit that has a holding surface that holds the film, and a concave portion that is recessed on the holding surface, and the resin that is mounted on the film The retreating recess is used for communicating with the holding surface around the recess to attract the air passage of the film. The resin molding apparatus according to claim 2, wherein the loader includes a roller-shaped shutter portion that can switch the holding surface, and the film is supported and conveyed by the shutter portion when the shutter portion is closed. The film is placed on the lower mold when the shutter portion is opened. Such as the resin molding apparatus of claim 1 of the patent scope, wherein the above loading The carrier includes a heating unit and a cooling unit. The resin molding apparatus of claim 1, wherein the upper part of the lower mold core is detachably disposed, and the upper part of the lower mold clamp is detachably disposed, and the upper part of the lower mold core and the upper part of the lower mold clamp are The connecting members are connected, and the loader conveys an end surface of the lower mold core and the lower mold clamping mold in a state where an end surface of the upper portion of the lower mold core and an upper end surface of the lower mold mold are horizontal. The above-mentioned film disposed on the end surface of the upper portion of the device. The resin molding apparatus according to the first aspect of the invention, further comprising a ring-shaped upper portion and a lower fixing plate, wherein the lower fixing plate is formed with a step portion which is recessed from a surface of the upper fixing plate side and extends in a circumferential direction at a peripheral end portion. The film is interposed between the upper fixing plate and the lower fixing plate, and the lower fixing plate step portion is fitted to the inner fixing portion of the upper fixing plate and fitted to the upper fixing plate to form a diaphragm portion, and the lower mold holder The mold has a step portion which is recessed from the end surface and extends in the circumferential direction at the peripheral end portion, and the lower mold clamp step portion is fitted to the inner diameter portion of the lower fixing plate and fitted to the diaphragm portion. The resin molding apparatus of claim 1, wherein an upper portion of the lower mold core is disposed to be separable, and in an open state, an upper portion of the lower mold core is supported by a floating support, so that an upper portion of the lower mold core is The end faces and the end faces of the lower die clamp are horizontal. A resin molding apparatus according to any one of claims 1 to 7, The lower mold clamp has a plurality of pins protruding from the end surface of the lower mold clamp and supported by the floating, and the plurality of pins protrude from the end surface of the lower mold clamp to support the workpiece, and the processed The object is housed inside the lower mold holder in a state of being clamped. A resin molding apparatus characterized by a first mold and a second mold formed with a concave portion of a cavity for filling a resin to the concave portion of the cavity to mold a workpiece, and the second mold includes: forming the cavity a mold core at the bottom of the concave portion; a clamper constituting a side portion of the concave portion of the cavity; a movable portion capable of relatively moving the mold to the clamp; and an adsorption portion configured to be coated to cover the end surface of the mold a film of the end face of the clamper; and a loader for transporting the film in a flat state, wherein the end face of the die is at the same height as the end face of the clamper, and the film is kept in a flat state. The end face of the mold and the end face of the above clamp. A resin molding method characterized by using a resin molding apparatus, a resin molding method in which an upper mold and a mold mold formed below a concave portion of a cavity are filled to fill the concave portion of the cavity, and a resin molding method for molding the workpiece, wherein the above The mold includes: a lower mold core constituting a bottom portion of the cavity concave portion; a lower mold clamp constituting a side portion of the cavity concave portion; a film carrying the resin and a loader capable of being transported; and an adsorption portion capable of adsorbing a film configured to cover the end surface of the mold core and the end surface of the clamper; comprising: (a) on the lower mold of the end surface of the lower mold mold and the end surface of the lower mold clamp, using the loader Configuring the film so that the resin is placed on the lower mold core; (b) sucking on the adsorption portion Forming a film, and causing the lower mold mold to move relative to the lower mold clamp to form the concave portion of the cavity, so as to follow the inner surface of the concave portion of the cavity, and to hold the film in a state of adsorbing and holding the resin The process of supplying to the cavity recess. A resin molding apparatus comprising: a clamping mechanism for a switch molding die, wherein the clamping mechanism includes: a movable template for supporting at least one of the molding dies; a fixed template for supporting the other mold; and the moving template string And a first mold clamping mechanism for clamping the molding die to the first clamping force between the fixed die plates; and the moving template is connected in series and clamped to a clamping force higher than the first clamping force a second second mold clamping force for maintaining a final resin pressure; and a control unit for controlling a closing operation of the first and second mold opening clamping mechanisms; the control unit after starting the mold clamping operation And driving the first and second mold opening and closing mechanisms to synchronize, and the first mold opening and closing mechanism transmits the workpiece supplied to the molding die by the first mold clamping force through the moving template. Thereafter, the pressurized state of the first mold opening and closing mechanism is received by the second mold opening and closing mechanism, and the workpiece is held by the molding die through the movable die to be larger than the first mold clamping force. 2nd clamping force The resin molding apparatus according to claim 11, wherein the first mold opening and closing mechanism is disposed at equal intervals along a peripheral edge portion of the moving template, and the second mold opening and closing mechanism is disposed in the moving template. Central Department. A resin molding apparatus characterized by comprising a clamping mechanism for lifting and moving a movable template supporting the other mold of the molding die with respect to a fixed template supporting a square mold of the molding die, thereby forming a structure capable of switching the molding die The clamping mechanism includes a toggle connecting rod mechanism coupled to a center of the moving template, and is disposed at equal intervals along a peripheral edge portion of the moving template, and is connected to the moving template at the arrangement position, and has three The above ball screw mechanism. A resin molding method characterized in that a mold is formed by using a moving mechanism that supports one mold and a clamping mechanism that supports a fixed mold of the other mold to perform resin molding, and the method includes: forming the mold after the mold is opened. a step of supplying the workpiece and the resin; and the first mold clamping mechanism and the second mold clamping mechanism connected in series with the moving template are operated in synchronization, and the workpiece is processed by the first mold clamping mechanism a mold clamping step of clamping the first mold clamping force by the molding die; and receiving, by the second mold clamping mechanism, a pressurization state of the first mold clamping mechanism, and operating the movable die plate to move the mold a step of clamping with a second clamping force greater than the first clamping force; and maintaining a final resin pressure of the molding die by the second clamping force to heat and cure the resin.