TWI657030B - Film conveying device, film conveying method, and resin molding device - Google Patents

Abstract

A film conveying device is provided. The film conveying device can transfer a single piece of film and transfer it to a concave portion of a mold cavity without wrinkles by imparting a moderate tension.

With the film chuck 13c holding the outer peripheral portion of the single-piece film F so as to be offset from the fulcrum frame 13b, and with the predetermined tension applied to the single-plate film F, together with the fulcrum frame 13 and the single piece The film F is carried together to the molding die.

Description

Film conveying device, film conveying method, and resin molding device

The present invention relates to a film transfer device, a film transfer method, and a resin molding device that transfer a single piece of film together with a molding resin toward a molding die.

The single-piece film is a film formed by cutting a long or large-size film into a predetermined size including an individual film formed in a predetermined size in advance.

Regarding the resin molding devices currently used in semiconductor manufacturing plants, for the molding of WLP (Wafer Level Package) or PLP (Panel Level Package) as workpieces, for example, the size is 8 inches or A 12-inch semiconductor wafer is resin-molded and resin-molded using a rectangular panel (substrate, carrier, etc.) with dimensions ranging from 300mm to 600mm (300mm to 600mm on each side).

At this time, in the case of a molding die provided with a cavity recess in the upper die, generally, a resin having a high viscosity is once supplied to a center position on a workpiece to be molded. In this case, in order to fill the resin supplied to the workpiece into the cavity, it is necessary to make the molding resin flow greatly, and therefore, there may be a case where the molding resin is not filled. For this, there is also a method of providing a cavity recess in the lower mold, and holding the lower mold clamping surface containing the cavity recess of the lower mold. The film is covered with a film and the molding resin is supplied at an equal thickness, and the workpiece held in the upper mold is dipped in the molten molding resin for resin molding.

In this way, when using a film for resin molding, in order to improve the fit to the cavity recess to prevent the occurrence of wrinkles and improve the quality of the molded product, the applicant of this application proposes a method of holding and retaining the outer peripheral edge portion of the film carrier by adsorption. Resin molding apparatus and method for adsorbing and holding a thin film to a concave portion of a lower mold cavity (see Patent Document 1).

Prior art literature Patent literature

Patent Document 1 Japanese Patent Application Publication No. 2014-231185

In this way, in order to reduce mold maintenance and prevent resin leakage, a resin is molded using a film. However, when a film wound between a pair of rollers is continuously supplied to a molding mold for resin molding, The films on the upstream and downstream sides in the film conveying direction are also deformed by receiving radiant heat from the molding die. Therefore, the amount of film used in a single resin molding operation increases and there is a problem that the running cost increases. Therefore, in order to reduce the amount of film used, it is considered to use a single film instead of a long continuous film (a film of a predetermined size and a predetermined shape is formed in advance).

However, in particular, in order to mold large-sized and rectangular workpieces, such as rectangular workpieces with 600 mm on each side, a film larger than that should be appropriately treated, and the lower mold should be moulded without wrinkles. When the cavity recesses cater to adsorption, it is necessary to apply a moderate tension to the entire film. force. In addition, when the molding resin is carried into the lower mold while the molding resin is placed on the single film, there is a possibility that the large amount of the molding resin is biased into the film when the single film is flexed.

Furthermore, since it is necessary to use a film that is substantially larger than the overall dimensions of the workpiece, the film transport mechanism is also increased in size, the installation area of the device is also increased, and the area in a clean room is increased (foot print). 2. Increasing equipment cost.

An object of the present invention is to provide a film conveying device that solves the problems of the conventional technology described above. The film conveying device can transfer a single piece of film with moderate tension and transfer it to a cavity of a mold cavity without wrinkles.

In addition, the present invention provides a resin molding device provided with the above-mentioned film conveying device to reduce the amount of film used and to reduce the running cost, improve the molding quality of a large-sized molded product, and suppress the installation area.

Furthermore, a film conveying method is provided in which the resin can be conveyed without bias even if the molding resin is placed on a single sheet of film.

To achieve the above object, the present invention has the following configuration.

A film conveying device is used for conveying a single piece of film for molding to a molding die while maintaining a state where tension is imparted. The film conveying device is characterized by having a fulcrum frame which surrounds and surrounds a cavity in a cavity of a mold. The frame having a predetermined shape corresponding to the mold clamping surface is a fulcrum portion that applies tension to the single sheet of film that is held while covering the opening of the frame; the film holding portion is attached to the outside of the fulcrum frame to hold the single An outer peripheral edge portion of the sheet film; and a shifting mechanism that shifts the film holding portion away from the fulcrum portion, and the outer peripheral edge portion of the single sheet film is held by the film holding portion with respect to the fulcrum portion It is shifted and transferred to the molding die together with the fulcrum frame and the single film in a state in which the single film is given the required tension.

According to the above configuration, the outer peripheral edge portion of the single-piece film is held by the film holding portion to be offset from the fulcrum portion, and the fulcrum frame and the single-piece are provided in a state where the required tension is provided throughout the entire circumference of the single-piece film. The films are transported together to the mold, so the single film can be transported and transferred to the mold without wrinkles. Therefore, the single sheet of film can be adapted to the mold clamping surface of the cavity recessed portion of the molding mold, and can be adsorbed and held.

It is also possible to carry a mold resin for molding on a single sheet of film which is given a desired tension, and to transport it together with the fulcrum frame.

Therefore, even if the molding resin is carried on a single film, the single film does not deflect, no resin leakage or resin bias occurs, and no air entrainment into the molding resin occurs.

Preferably, the film holding portion holds each side of the rectangular single-piece film.

According to this, tension can be applied to each side through the film holding portion provided on the opposite side of the rectangular single-piece film, and the occurrence of wrinkles can be effectively prevented.

The film holding portion may also be divided into a plurality of holding portions on each side of a single sheet of film for setting.

Therefore, by changing the offset between the divided film holding portion and the fulcrum portion and applying tension in a manner that twists the single film in accordance with the direction or size of the wrinkles generated by the single film, the occurrence of the film's inherent wrinkles can be eliminated.

Preferably, the film holding portion is provided so that the offset can be adjusted for each side of the single film.

Therefore, by adjusting the shift amount of the film holding portion for each side of the single film, it is possible to suppress the occurrence of extremely fine wrinkles.

The offset mechanism may be configured to separate the film holding portion from the fulcrum portion by rotating the film holding portion around a rotation axis provided in the frame as a center.

Therefore, by rotating the film holding portion around the rotation axis to separate the film holding portion from the fulcrum portion, the amount of winding around the fulcrum portion of the single film can be changed to adjust the tension. In particular, since the tension can be adjusted by rotating the film holding portion around the rotation axis, the film transport device can be miniaturized.

Preferably, a ratchet mechanism is provided which allows a rotating member for holding the film holding portion to rotate only in a direction away from the fulcrum portion with the rotation axis as a center. Therefore, by stopping the film holding portion at the rotated position, it is possible to carry the film while maintaining the tension applied to the single film.

The resin molding apparatus is characterized by including: any one of the above-mentioned film conveying devices; and a film carrier that conveys the film conveying device to a molding mold.

Accordingly, it is possible to provide a resin molding device that uses a film transfer device that transfers a single film to reduce the amount of film used to reduce running costs, can improve the molding quality of a large-sized molded product, and suppresses the installation area.

Preferably, a tension adding mechanism is provided. When the single film is carried into the mold together with the fulcrum frame, the offset amount of the film holding portion is increased to further strengthen the direction generated by the offset mechanism. Film tension.

Therefore, when the monolithic film F is carried into the molding mold, the monolithic film F may be stretched due to radiant heat, but the tension of the monolithic film can be increased by the tension adding mechanism to prevent the The film was wrinkled.

In addition, a film transfer method is to transfer a single piece of film for molding to a molding die while maintaining a state where tension is imparted. The film transfer method is characterized by corresponding to a mold clamping surface surrounding a cavity recess On the frame of the predetermined shape, on the outside of the fulcrum frame serving as a fulcrum portion on the single sheet of film held and covering the opening of the frame, the outer peripheral edge portion of the single sheet of film is held by a film holding portion, In the state where the outer peripheral edge portion of the single sheet of film is held by the film holding portion in a direction away from the fulcrum portion and the required tension is given to the single sheet of film, together with the fulcrum frame and the single sheet of film, The aforementioned mold is transported.

Therefore, since the outer peripheral edge portion of the single-piece film is held by the film holding portion, the single-piece film is moved to the molding die while being offset from the fulcrum portion and in a state where a required tension is given throughout the entire circumference of the single-piece film. It can be transported and transferred to the mold without causing wrinkles on the single film. Therefore, even if the molding resin is placed on a single sheet of film, the resin can be conveyed without biasing the resin, and the single sheet of film can be fitted to the mold clamping surface of the cavity recessed portion of the molding mold and held by suction.

If the above-mentioned film conveying device is used, the single film can be conveyed without wrinkles and can be transferred to the mold clamping surface formed with the cavity recess. Even if the molding resin is placed on the single film, the Carrying under bias.

Moreover, in the resin molding apparatus provided with the above-mentioned film conveying device, it is possible to reduce the use amount of the film to reduce the running cost, improve the molding quality of a large-sized molded product, and suppress the installation area.

Ud‧‧‧ Distribution Unit

Up‧‧‧Press Unit

Uw‧‧‧Workpiece processing unit

W‧‧‧ Workpiece

1‧‧‧Workpiece supply department

2‧‧‧formed product storage section

M‧‧‧formed product

3‧‧‧hardening furnace

4‧‧‧ robot transfer device

4a‧‧‧ robot arm

5‧‧‧Press Department

5a‧‧‧post

6‧‧‧Mould

6A‧‧‧Mould

6B‧‧‧Die

6C‧‧‧Die cavity of lower mold cavity

6a‧‧‧ Upper mold clamping surface

6b‧‧‧Air suction hole

6c‧‧‧Air suction road

6d‧‧‧Work holding pin

6e‧‧‧Under Module

6f‧‧‧Lower mold cavity block

6g‧‧‧ Lower mold movable holder

6g1, 6g2‧‧‧Air suction road

6h‧‧‧ Coil Spring

6i‧‧‧sealing ring

6j‧‧‧ Push Device

8‧‧‧ Film Supply Department

8a‧‧‧film roller

F‧‧‧Single film

9‧‧‧ Distributor

10‧‧‧ Panel carrier

11‧‧‧ film carrier

12‧‧‧ Film Recycling Department

13, 19‧‧‧ film handling device

13a‧‧‧ rectangular frame

13b, 19d ‧‧‧ fulcrum frame

13c, 19a‧‧‧ film chuck

13d‧‧‧Rotary lever

13e‧‧‧rotation shaft

13f‧‧‧ Ratchet mechanism

13g, 19g‧‧‧ Inclined

13h1‧‧‧Guide members

13h2‧‧‧movable member

13i‧‧‧Support member

13j‧‧‧ Containment Department

13k‧‧‧ film pressing part

13m‧‧‧Press spring

14‧‧‧rail

15‧‧‧ Top pin

16‧‧‧ Trench

17‧‧‧ stage

18‧‧‧ cutter

19b‧‧‧Chuck holding section

19c‧‧‧ slider

19e‧‧‧ flange

19f‧‧‧ Fulcrum

20‧‧‧ Film drop detection unit

30‧‧‧ Reversal Department

FIG. 1 is a plan view showing a schematic configuration of a resin molding apparatus.

FIGS. 2 (A) to 2 (F) are explanatory diagrams showing the preparation steps for the conveyance of a single film and the supply steps of the molding resin.

Fig. 3 is a plan view of a film transfer device.

Fig. 4 is a sectional view showing the structure of a molding die.

5 (A) to 5 (C) are explanatory views showing the steps of supplying a single film and a molding resin to the lower mold of FIG. 4.

6 (D) to (F) are explanatory diagrams showing the supply steps of the single-layer film and the molding resin following FIG. 5.

7 (A) to (D) are explanatory diagrams showing a resin molding step following FIG. 6.

FIGS. 8 (A) to 8 (C) are explanatory diagrams showing a single film and a molding resin supply process of a film transfer device of another example.

FIG. 9 is a plan view of the film transfer device of FIG. 8. FIG.

FIG. 10 is a partial cross-sectional view of a film transfer device of another example.

Hereinafter, preferred embodiments of the film conveying device and the resin molding device including the same according to the present invention will be described in detail together with the attached drawings. In the following, a resin molding apparatus that uses a rectangular workpiece having sides of about 600 mm for each workpiece, and a resin molding using a single-piece film having a size larger than that for the film, will be described. Of course, in terms of workpieces, not only the large ones as described above, but also small narrow rectangular shaped pieces of about 300 mm × 100 mm. In addition, as an example of the resin molding apparatus, it will be described that the lower mold is a movable mold and the upper mold is a fixed mold. Although the resin molding apparatus includes a mold opening and closing mechanism, the illustration is omitted, and the configuration of the molding mold will be mainly described.

First, a schematic configuration of a resin molding apparatus will be described with reference to FIG. 1. In this resin molding apparatus, a control section (not shown) controls each section described later to perform various operations. The molding apparatus in this embodiment is constructed by connecting a workpiece processing unit Uw, two press units Up, and a distribution unit Ud (supply unit) to automatically resin-mold the workpiece W in the apparatus.

The work processing unit Uw includes, for example, a work supply unit 1, a molded product storage unit 2, a cure stove 3, and a robot transfer device 4. A workpiece W of a rectangular panel (substrate, carrier, etc.) having a size of about 600 mm on each side is stored in the workpiece supply unit 1. In a molded product The storage section 2 stores a molded product M which is resin-molded in a press section 5 described later. The curing furnace 3 is configured to heat-harden the resin encapsulation portion by storing the molded products M molded by resin in the press section 5 described later in a multilayer shelf provided in the furnace and performing after curing. The robot transfer device 4 transfers and transfers the workpiece W and the molded product M between the respective parts that are arranged to surround the robot transfer device 4. This robot transfer device 4 removes and supplies the workpiece W from the workpiece supply unit 1, for example, and transfers the molded product M to the curing furnace 3, and sequentially transfers and stores the cured product 3 to the molded product storage unit 2. The robot transfer device 4 uses, for example, a vertical multi-joint type, a horizontal multi-joint type, or a multi-joint type compounded together, and holds and transfers the workpiece W or the molded product M to the robot arm 4 a by suction or holding. Further, in the workpiece processing unit Uw, a cooling section that cools the molded product M, an inspection section that performs an appearance inspection of the molded product, a data reading section that reads the molding conditions attached to each workpiece W, and a reversed workpiece W Or the reversing part 30 on the front and back surfaces of the molded product M is arranged around the robot transfer device 4. For example, the reversing section 30 is such that when the surface (molding surface) on which the resin molding of the workpiece W is formed in the workpiece feeding section 1 is fed upward, the molding surface is directed downward. In addition, the reversing section 30 is reversed so that the molding surface faces upward before the molded product M after molding the resin is stored in the molded product storage section 2.

The press section 5 in the press unit Up is provided with a compression mold 6 (upper mold 6A and upper mold 6A) for compression molding that opens and closes a platen with a well-known mold opening and closing mechanism with respect to columns 5a provided at four corners. Lower die 6B). In this embodiment, the press unit Up is provided at two places, but it may be provided at one place, and may be provided at three or more places.

The film handling device 13 (film handling device) is a state in which a single piece of film F supplied by the film supply unit 8 in the distribution unit Ud is supplied with a molding resin (for example, granular resin or powder resin) by the dispenser 9. It is carried in the mold 6 of the press part 5. The film supply unit 8 is provided with a film roll 8a in which a long film is wound in a roll shape. In a state where the film roll 8a is pulled out of the film end by this, the rectangular shape of an arbitrary size is cut (cut) and prepared on a stage 17 as a single sheet of film F.

In a state where a single sheet of film F is supported by applying a desired tension to a film conveying device 13 described later, the dispenser 9 supplies a molding resin R (pellet resin) required for a single resin molding to On a single sheet of film F. In addition, a powder resin, a liquid resin, or a flake resin may be used in combination instead of the particulate resin.

Monolithic film F is heat-resistant and easily peeled from the mold surface, and has flexibility and stretchability. For example, PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene film, and polydichloride can be suitably used. Single-layer film or multi-layer film with ethylene as the main component.

The panel carrier 10 receives the workpiece W from the robot arm 4 a of the robot transfer device 4 and carries the workpiece W into the molding die 6 (upper die 6A) of the press section 5. The panel carrier 10 receives the molded product M from the molding die 6 a and transfers it to the robot arm 4 a of the robot transfer device 4. When the panel carrier 10 takes out the molded product M from the molding die 6, the used single-piece film F is sucked and held and taken out, and the taken-out single-piece film F is collected toward the film recovery unit 12.

The film carrier 11 receives a single sheet of film F that is held and held by the film conveying device 13 and is supplied to the film. The molding resin R (pellet resin) on F is conveyed toward the molding die 6 (lower die 6B). The panel carrier 10 and the film carrier 11 are installed so as to reciprocate a plurality of guide rails 14 that are laid along the longitudinal direction of the device. In addition, a carrier conveying device (not shown) is moved toward each part (for example, the press part 5), and the position from the guide rail 14 is orthogonal.

Here, the configuration of the film transport device 13 will be described with reference to FIGS. 2 and 3.

As shown in FIG. 2 (B), the film conveying device 13 includes a frame (for example, a rectangular frame 13a) having a predetermined shape corresponding to a lower mold holding surface surrounding a lower mold cavity recessed portion 6C described later.

In addition, the fulcrum frame 13b, which serves as a fulcrum portion of the film conveying device 13, applies tension to the single film F, and is formed in a rectangular shape along the rectangular frame 13a (see FIG. 3). Instead of providing the fulcrum frame 13b, an outer corner portion of the rectangular frame 13a may be used as the fulcrum portion.

Further, a plurality of film chucks 13c (film holding portions) are provided on the outside of the film conveying device 13 to hold the outer peripheral edge portion of the single film F over the entire circumference. Specifically, as shown in FIG. 2 (B), a pair of film chucks 13c (film holding portions) are provided on the opposite sides in order to hold and transport the rectangular single film F. The pair of film chucks 13c is an open-close type chuck, and the outer peripheral edge portion of the rectangular single-piece film F is sandwiched and held on each side. Both ends of the pair of film chucks 13c in the longitudinal direction are supported by a pair of rotating rods 13d (rotating members), respectively. A pair of rotating levers 13d are provided in the rectangular frame 13a so as to be rotatable around a rotating shaft 13e formed on the inner side of the film chuck 13c. Therefore, the pair of film chucks 13c are arranged on the rotating lever 13d. Opposite side of the rotation shaft 13e. The rotation lever 13d is provided with an offset mechanism that rotates only in a direction offset from the fulcrum frame 13b. Specifically, as shown in FIG. 3, a ratchet mechanism 13 f is provided on the rotation shaft 13 e of the film chuck 13 c to allow the ratchet teeth and the pawls to mesh with each other. The ratchet mechanism 13f allows the film chuck 13c to rotate around the rotation axis 13e only in a direction away from the fulcrum frame 13b (the direction of the arrow in FIG. 2 (C)) by a predetermined angle. Therefore, by stopping the film chuck 13c at a predetermined rotation position after rotating in one direction, the film chuck 13c can be transported while maintaining the tension applied to the single film F. In addition, instead of the ratchet mechanism 13f, a drive mechanism such as a servo motor or a torque motor may be used instead to apply arbitrary tension to the single film F and maintain the tension applied thereto. In this case, it is easier to increase the size of the film conveying device 13 than the configuration in which the ratchet mechanism 13f is provided, but it is preferable to adjust the tension applied to the single film F at any time.

As shown in FIG. 2 (C), the outer peripheral edge portion (four sides) of the single film F is held by a pair of film chucks 13c, and a lift driving mechanism (cylinder drive, spiral) Tube driving, motor driving, etc.) and the upper ejection pin 15 lifts the rotating rod 13d upward. At this time, the rotation lever 13d is rotated around the rotation axis 13e to shift the film chuck 13c in a direction (arrow direction) away from the fulcrum frame 13b. Therefore, the ends of the single-piece film F covering the opening of the frame of the film conveying device 13 are increased by being pulled apart via the fulcrum frame 13b, and are held integrally with a required tension applied. . In addition, when the rotating lever 13d returns to its original position, when the upper lever 15 is used to push the rotating lever 13d up to a predetermined angle again, the engagement of the ratchet mechanism 13f (see FIG. 3) is released, and the rotating lever 13d can be returned to the original position. position.

As shown in the same figure, the film chuck 13c is separated from the fulcrum frame 13b by rotating the film chuck 13c around the rotation axis 13e. The ends of the single film F are separated from each other by the fulcrum frame 13b. The amount can increase tension. In particular, the tension of the single film F can be adjusted for each side of the film through each rotation centered on the rotation axis 13e of the film chuck 13c arranged on the four sides, so that it is possible to apply an appropriate tension to the single film F. The film conveying device 13 has a small and simple structure.

The molding resin R (pellet resin) required for one-time resin molding is supplied from the dispenser 9 (refer to FIG. 1) via, for example, a trough 16 (refer to FIG. 2 (D)) to what is required to impart the same. The tensioned single-sheet film F is similarly supplied without bias on the single-sheet film F (see FIG. 2 (E)). In addition, the upper opening of the rectangular frame body 13a is formed with an inclined portion 13g that becomes wider in diameter as the opening end portion having a rectangular shape in plan view becomes closer. By supplying the molding resin R to the inside of this inclined portion 13g, the molding resin R can be supplied to the single sheet F in an arbitrary shape.

In this case, the inclined resin 13g prevents the molding resin R supplied onto the single sheet film F from climbing up the rectangular frame 13a. In addition, the inside of the rectangular frame body 13a may be formed into a circular shape together with the inclined portion 13g, and the molding resin R may be supplied in a circular area on the single sheet F. According to this, only a part of the structure is changed, and regardless of the shape of the mold cavity such as a circular shape or a rectangular shape, the same single sheet F transport structure can be used.

Further, as shown in FIG. 2 (F), in a state where the single-piece film F is supplied with the molding resin R, the film carrier 11 (the rectangular frame 13a) is held toward the molding die 6 by the film carrier 11. Transport.

Here, when the single-piece film F is lifted from the stage 17 by the film carrier 11, when the tension is insufficient, the single-piece film F may sag in the center or the like due to the weight of the molding resin R. Accordingly, the film-down detection unit 20 can be provided at a position close to the stage 17. The film droop detection unit 20 may be configured to include a laser sensor that includes a light emitting unit and a light receiving unit and detects a shielding state or a shielding position therebetween. As an example, a configuration in which a light-emitting section and a light-receiving section are provided at a position where the film transport device 13 is sandwiched may be adopted. In addition, as the film droop detection unit 20, by detecting a shield in the space on the stage 17, it is possible to detect when the single film F is dropped from an appropriate position when the film transport device 13 is lifted. The film sagging detection unit 20 may be provided with only one set so as to detect the sagging in one direction, or may be provided with two sets so as to be able to detect in two directions crossing as shown in FIG. 3. The film sag detection unit 20 may have any configuration as long as it can detect the sag of the single film F. For example, a touch sensor (switch) may be used, and a configuration may be adopted in which a contact with a hanging film is detected when the film conveying device 13 is lifted to a predetermined height.

In addition, the film chuck 13 c holding each side of the rectangular single-piece film F shown in FIG. 3 may be uniform or different from each other on the sides. In this case, for example, by setting the upper amount of the upper pins 15 provided on the side of the single-piece film F to be uniform, a tension corresponding to the amount of rotation around the rotation axis 13e can be applied. In addition, the amount of the upper part may be changed depending on the pair of film chucks 13c on the opposite sides. In this case, depending on the length of each side of the single film F or the easy stretchability of the film according to the direction in which the film roll 8a is drawn out, etc., The amount of top-up varies depending on the group of the film chucks 13c, and the tension applied to each side of the single film F can be made uniform. For example, if the film is a horizontally long film as shown in FIG. 3, as long as the pair of film chucks 13c in the two sides (right and left) pulled in the long side direction (the left and right direction of the same figure) is lifted, The upper amounts of the pair of film chucks 13c on the two sides (upper and lower sides) pulled in the short-side direction (upper and lower directions in the same figure) may be different. That is, the upper amount of the film chuck 13c in the long-side direction can be made larger than the upper amount of the film chuck 13c in the short-side direction. In other words, by pulling more on the longer side, it can be made to be pulled uniformly regardless of the length of the side. Accordingly, the tension applied to the single sheet of film F in the long-side direction and the short-side direction can be made uniform.

Moreover, the invention is not limited to the case where the single film F is integrally held on each side as shown in the same figure, and a plurality of films may be provided on one side of the film chuck 13c. In this case, by applying the tension by twisting the position of the film chuck 13c on the side by changing the state (position) of the wrinkles generated in the single film F, the state of wrinkles can be extended maintain. For example, when part of the tension is increased, wrinkles are generated outside the position. Therefore, first, a structure can be formed in which the film chuck 13c is uniformly pushed up and tensioned, and when wrinkles are generated, the tension of the portion is reduced and the tension other than the portion is increased. In addition, the film chuck 13c is not only configured to hold on the side of the single-piece film F with a predetermined length in order to pull in a crosswise direction in the side extension direction, but also can be constructed so as to reach The structure which grips the corner | angular part of the single film F is extended | stretched from the center direction.

Therefore, by changing the offset of the divided film chuck 13c from the fulcrum frame 13b, and applying tension in a manner that twists the single film F in accordance with the direction or the size of the wrinkles generated on the single film F, Can eliminate the occurrence of the film's inherent wrinkles.

Next, the configuration of the mold 6 provided in the press section 5 will be described with reference to FIG. 4. This embodiment illustrates a mold 6 for compression molding. This molding die 6 is provided with a heater (not shown) at an arbitrary position, and heat-hardens the molding resin R to mold the workpiece W with the resin to produce a molded product M. In the upper mold holding surface 6a of the upper mold 6A, an air suction hole 6b and an air suction path 6c communicating therewith are formed in order to suck and hold the workpiece W. Further, on the outer edge portion of the rectangular workpiece W, the workpiece holding pins 6d are provided at facing positions at a plurality of locations. The work holding pin 6d presses and holds the outer peripheral surface of the work W. The workpiece holding pin 6d may be a cylindrical pin or an angular columnar pin, and it is preferable that the workpiece holding pin 6d is configured to push against the workpiece W through an elastic body. The work holding pin 6d may be a guide for centering the work W when the work W is sucked and held. According to this configuration, for example, the area of the cavity can be increased compared to the configuration in which the outer periphery of the workpiece W is held by the claw-shaped hook of the L shape.

The lower die 6B is such that the lower die cavity block 6f forming the bottom of the lower die cavity is integrally supported by the lower module 6e. Around the lower mold cavity block 6f, a lower mold movable holder 6g forming a side portion of the lower mold cavity is floatingly supported on the lower module 6e by a coil spring 6h. The lower mold cavity recess 6C is formed by the lower mold cavity block 6f and the lower mold movable holder 6g. A seal ring 6i (O-ring) is provided between the lower mold movable holder 6g and the lower mold cavity block 6f to be sealed. In addition, the lower mold movable holder 6g is provided with a single film F adsorbs and holds each of the air suction paths 6g1, 6g2 on the lower die surface of the lower die cavity recess 6C. The air suction path 6g1 is formed to adsorb the inner peripheral side of the film from the gap between the lower mold cavity block 6f and the lower mold movable holder 6g, and the air suction path 6g2 is attached to the outer peripheral side of the film to the holding surface of the lower mold movable holder 6g. . Therefore, the single-piece film F is sucked in accordance with the concave shape of the lower mold cavity recessed portion 6C. In addition, a pair of upper and lower clamping blocks (not shown) may be provided between the upper mold 6A and the lower mold 6B to form a decompression space in the mold when the mold clamping operation is started.

A pusher 6j (tension applying mechanism) is provided outside the lower die movable holder 6g of the lower die 6B. The pushing device 6j is provided to further strengthen the tension toward the single-film F. For example, when the single film F is carried into the lower die 6B together with the film transfer device 13 through the film carrier 11, the single film F is elongated due to the radiant heat from the lower die 6B and the tension is reduced. In this case, when the tension of the monolithic film F is reduced to cause slack, the central portion of the monolithic film F hangs due to the self-weight of the monolithic film F or the weight of the supplied molding resin R. In this case, when the single-piece film F is placed on the lower mold 6B, the single-piece film F may be loosened and become wrinkles. Further, when the central portion of the single-piece film F sags and becomes large, it is conceivable that the molding resin R is concentrated in the center, and it is difficult to uniformly supply the molding resin R in the cavity. Therefore, the pushing device 6j is constructed to be provided at a position corresponding to the rotating rod 13d of the lower mold 6B, and can be rotated through a lifting driving mechanism (such as a driving mechanism of a cylinder drive, a solenoid drive, a motor drive, etc.) to be rotatable. Rotate the lever 13d. This pushing device 6j is provided in order to increase the offset of the pair of film chucks 13c to further increase the tension on the single film F. The pushing device 6j can also be used for releasing the ratchet mechanism 13f.

When the single-piece film F is placed on the lower die 6B (the lower die movable holder 6g) together with the film conveying device 13 by the film carrier 11, the pushing device 6j disposed directly under the rotating rod 13d is actuated. The rotation lever 13d is rotated in a direction to increase the offset amount of the film chuck 13c. Thereby, it is possible to prevent the tension of the single film F from being lowered before the mold is clamped. Of course, when the single film F is close to the lower die 6B, the film chuck 13c can also be rotated in a direction that increases the offset amount of the film chuck 13c.

Next, an example of a preparation operation for conveying a single sheet of film F to the mold 6 using the film conveying device 13 will be described with reference to FIG. 2.

In FIG. 2A, the long film F with which the film end is pulled out from the film roll 8 a onto the stage 17 in the film supply unit 8 (see FIG. 1) is cut with a cutter 18 to a predetermined size. In this embodiment, it is cut to a size larger than the outer shape of the lower die movable holder 6g.

Next, in FIG. 2 (B), the film conveying device 13 is superimposed on the cut single film F, and the outer peripheral edge portions of each side of the single film F are sandwiched by the film chuck 13c.

Next, in FIG. 2 (C), a driving source (not shown) is actuated to lift the upper ejector pin 15 and rotate the rotation lever 13d about the rotation shaft 13e. The rotation direction is a direction in which the film chuck 13c is shifted (isolated) from the fulcrum frame 13b. Thereby, since the single-piece film F is pulled from both sides by the film chuck 13c, the end portion of the single-piece film F is pulled apart via the fulcrum frame 13b, that is, the angle at which the single-piece film F is wound is increased. The film tension between the fulcrum frames 13b increases. At this time, as the ratchet mechanism 13f shown in FIG. 3 is activated, the position of the rotation lever 13d after the rotation is maintained, Therefore, it can be maintained in a state where the film tension covering the frame opening of the rectangular frame 13a is increased.

As described above, the structure in which the film chuck 13c is moved up and down relative to the fulcrum frame 13b (fulcrum portion) to press the single film F is made, for example, a structure in which the film chuck 13c is pulled in the lateral direction to apply tension. In contrast, tension can be effectively applied to the single film F. The device for applying tension to the single film F can be miniaturized in a plan view. That is, the larger the single-piece film F is, the larger the amount of pulling will be in order to apply the same tension. However, when the film chuck 13c is pulled in the horizontal direction, the area corresponding to the amount of pulling must be ensured. The size of the device cannot be avoided in the device. On the other hand, according to the configuration of the present embodiment described above, even if the amount of pulling is increased in order to increase the tension toward the single sheet film F, the device area is not increased, and the device can be effectively suppressed from being enlarged. In addition, since the film chuck 13c can be rotated around the rotation axis 13e, and the film chuck 13c side of the rotation lever 13d is pushed up and rotated by the upper ejector pin 15, it can be directed toward the single film F with a small force. Apply tension.

In FIG. 2 (D), the granular resin R is similarly supplied from the dispenser 9 (refer to FIG. 1) via the grooves 16 to the single film F which closes the opening of the rectangular body 13a. The granular resin R is supplied in an amount required for a one-time resin molding operation. The state in which the particulate resin R is supplied to the single film F is shown in FIG. 2 (E).

Next, the film carrier 11 is moved to the upper part of the film conveying device 13. As shown in FIG. 2 (F), the film carrier 11 holds the rectangular frame 13a on the film conveying device 13 to be supplied with the granular resin R lift. In this case, for example, when the weight of the supplied molding resin R is too large and the molding resin R cannot be properly conveyed by the tension applied to the single-sheet film F, the single-sheet film F hangs at the center or the like. Therefore, when the film conveying device 13 is lifted to an arbitrary detection position, the operation is stopped, and the film hanging detection unit 20 can detect the shielding state of the space on the stage 17. That is, when the tension of the single film F is insufficient and the single film F hangs at the center or the like, the film conveying device 13 is lowered, and the upper ejector pin 15 is actuated as if tension is applied again.

By repeating such operations appropriately as needed, the single-sheet film F can be conveyed after an appropriate tension is applied.

In addition, it can be assumed that the molding resin R is biasedly supplied onto the single-piece film F depending on the mounting state of the sheet in the workpiece W and the like. In this case, it can be assumed that a non-central portion (a biased position) in the single film F hangs down. Therefore, when two sets of film drop detection units 20 are provided in two directions crossing as shown in FIG. 3, even when a non-central portion of the single film F is suspended, the detection of the single film F in the position can be detected. Hanging down. Therefore, it is possible to appropriately detect the suspended state of the single film F, and to transport the single film F after applying an appropriate tension.

Next, the film carrier 11 picks up the film conveying device 13, carries it along the guide rail 14 in FIG. 1, and carries it into the molding die 6 (lower die 6B) of the predetermined press section 5. Here, the film conveying device 13 is supplied into the molding die 6 through the gap between the pillars 5 a in the press section 5. In this case, the film conveying device 13 is configured to move the film chuck 13c up and down with respect to the fulcrum frame 13b (fulcrum portion) to apply tension without pulling the film chuck 13c in a horizontal direction because it can be constructed. small Since the film conveying device 13 can be carried into the mold 6 through a limited gap between the columns 5a. In addition, the same effect can be obtained even in a press structure in which the side of the platform is held by the frame section 5 in the press section 5 without using the upright 5a.

By using the film conveying device 13 described above, the film can be conveyed while maintaining a predetermined tension. Therefore, the film can be transferred to the molding die 6 without wrinkles on the single film F.

Next, the operation of supplying the single film F and the molding resin R to the molding die 6 by the film transfer device 13 will be described with reference to FIGS. 5 and 6. 5 and 6 illustrate only the lower die 6B.

In FIG. 5 (A), the film carrier 11 holding the film conveying device 13 enters the upper mold 6B of the opened mold 6 and performs alignment. The positioning is performed such that the mounting surface of the granular resin R of the single-piece film F and the upper surface of the lower mold cavity block 6f overlap, and the rectangular frame 13a and the lower mold movable holder 6g overlap.

Next, as shown in FIG. 5 (B), the film carrier 11 is lowered, and the rectangular frame 13a is lowered until it comes into contact with the lower mold movable holder 6g. At this time, the pushing device 6j provided in the lower die 6 is arranged at a position corresponding to the rotation lever 13d.

When the single film F is close to the lower mold 6B, problems such as elongation of the single film F and the sagging of the film may occur due to radiant heat from the lower mold 6B. Therefore, as shown in FIG. 5 (C), a driving source (not shown) is actuated to push the pushing device 6j up, and the rotation lever 13d is rotated around the rotation shaft 13e as a center. The rotation direction is a direction in which the film chuck 13c is offset (isolated) from the fulcrum frame 13b. By this, since the single-piece film F is filmed The chuck 13c is pulled again from both sides, so the winding angle of the film F relative to the fulcrum frame 13b is further increased. In other words, the end of the single piece of film F held by the film chuck 13c is removed from the fulcrum frame 13b. The (pivot point portion) is shifted (away), so that the single film F is pulled inside the fulcrum frame 13b, and the film tension between the fulcrum frames 13b is increased. At this time, the ratchet mechanism 13f shown in FIG. 3 is actuated, and the rotation lever 13d is held at the rotated position, so that the state of the film tension that closes the opening of the rectangular frame body 13a is maintained.

In FIG. 6 (D), the air suction operation is started from the air suction paths 6g1 and 6g2 provided in the lower mold movable holder 6g, and the inner and outer circumferences of the single film F are sucked and held along the recess 6C of the lower mold cavity. Since the single film F is adsorbed and held in a state where the film tension is enhanced, it is possible to effectively prevent the occurrence of wrinkles.

Next, in FIG. 6 (E), when the pushing device 6j is temporarily moved upwards and downwards as a driving source (not shown), the ratchet mechanism 13f (see FIG. 3) is released, so the rotation lever 13d approaches to The direction (arrow direction) of the fulcrum frame 13b rotates. At this time, the film chuck 13c returns to a horizontal posture parallel to the clamping surface of the lower mold movable clamper 6g. In this state, the holding of the film chuck 13c holding the outer peripheral edge portion of the single film F is released. According to this, the monolithic film F can be transferred together with the particulate resin R in a state of being adsorbed and held in the lower mold 6B. In addition, during these operations, the single-piece film F is in a state of being adsorbed and held by the concave portion 6C of the mold cavity, including the adsorption by the lower mold movable holder 6g. Therefore, the single-piece film F is not damaged even if the holding is released. The adsorption remains in the state.

Next, as shown in FIG. 6 (F), the film carrier 11 keeps holding the film conveying device 13 (rectangular frame body 13 a) while moving upward and retracts from the press section 5. As described above, the step of supplying the single film F and the particulate resin R to the lower mold 6B is completed.

According to the operation of supplying the single film F to the molding die 6 as described above, the single film F can be supplied to the molding die 6 without wrinkles. In addition, when the single sheet of film F is carried into the mold 6, the single sheet of film F may be stretched due to radiant heat. However, it is possible to prevent the setting of the single sheet of film F toward the mold 6 by using the pushing device 6j (tension increasing mechanism) to increase the tension. When a single sheet of film F is used, wrinkles may occur.

Next, an example of the resin molding operation following FIG. 5 and FIG. 6 will be described with reference to FIG. 7.

In FIG. 7 (A), as described above, the single film F and the particulate resin R are carried into the lower mold 6B by the film carrier 11.

In FIG. 7 (A), a large-sized workpiece W (rectangular panel, rectangular substrate, etc.) having a size of 600 mm on each side is carried into the upper mold 6A by the panel carrier 10 (see FIG. 1), and the upper mold 6A is used for clamping. The air suction hole 6b and the air suction path 6c of the surface 6a are sucked and held. At this time, the outer peripheral surface of the rectangular workpiece W is transferred to the upper die 6A by the workpiece holding pins 6d provided at the opposing positions at a plurality of positions by pressing and holding the outer peripheral surface of the workpiece W. The rectangular workpiece W is centered by the workpiece holding pin 6d by uniformly pressing the outer peripheral surface of the workpiece W by the workpiece holding pin 6d. In addition, the loading of the monolithic film F and the granular resin R and the loading of the workpiece W may be performed simultaneously, or the loading of the workpiece W and the loading of the monolithic film F and the granular resin R may be performed simultaneously.

Next, as shown in FIG. 7 (B), the mold 6 is closed. For example, the lower die 6B is raised to clamp the work W between the lower die 6B and the upper die 6A. In addition, it is preferable that the mold space between the upper mold 6A and the lower mold 6B is closed to form a reduced pressure space before the upper mold 6A and the lower mold 6B clamp the workpiece W, and the molding is performed under a reduced pressure ambient gas. Forming.

Next, by further clamping the molding die 6, the coil spring 6h is pushed and contracted, and the lower die movable holder 6g moves close to the lower die 6e. Therefore, by reducing the height (depth) (shrinking) of the cavity in the lower cavity 6C of the lower mold, the workpiece W is immersed in the particulate resin R melted in the lower cavity 6C and the resin pressure is increased to perform heating and pressing. . FIG. 7 (C) shows a state in which the mold clamping operation of the molding die 6 is completed, and the workpiece W is immersed in the granular resin R melted in the recessed portion 6C of the lower die, and is heated and pressurized to harden (compressively).

When the heat curing in the molding die 6 is completed, the mold opening of the molding die 6 is performed. Here, the state in which the molded product M is held and held by the upper die holding surface 6a of the upper die 6A and the single film F is held by the lower die holding surface including the lower die cavity recessed portion 6C is maintained, and the mold is opened. . Therefore, as shown in FIG. 7 (D), in the state where the mold is opened, the molded product M is held and held by the upper mold clamping surface 6a of the upper mold 6A, and the single film F is included in the lower mold cavity. The lower die clamping surface of the recessed portion 6C is in a state of being held by suction. In this way, by keeping the molded product M and the used single-piece film F in separate molds, the steps can be simplified by taking them out from the press section 5 and transporting them to each storage / storage place.

Next, in FIG. 1, the molded product M is desorbed by the upper mold 6A and transferred to the panel carrier 10 (upper surface side). Also, used The monolithic film F is transferred by the lower mold 6B by the panel carrier 10 (lower side). At this time, since the molded product M is transferred from the upper mold holding surface 6a to the panel carrier 10, compressed air is ejected from the air suction hole 6b, and the single-piece film F is transferred from the lower mold surface to the panel carrier 10, It is preferable to eject compressed air from the air suction paths 6g1 and 6g2. The molded product M is transferred from the panel carrier 10 to the robot arm 4 a of the robot transfer device 4. The used single sheet of film F is discharged from the panel carrier 10 toward the film recovery section 12 and is recovered. The robot arm 4 a holds the molded product M and carries it into the predetermined curing furnace 3. Post-curing of the molded product M is performed in the curing furnace 3. Next, the molded product M is taken out from the hardening furnace 3 via the robot arm 4a, and all the steps for the workpiece W are completed and the manufacturing steps of the molded product M are completed. Next, the molded product M is carried into the molded product storage unit 2, and the molded product M is stored.

As described above, according to the present embodiment, by using the film transport device 13 that transports the single-layer film F described above, the amount of film used is reduced to reduce the running cost, and the molding quality of a large-sized molded product can be improved and the installation area can be suppressed.

Next, other examples of the film transfer device will be described with reference to FIGS. 8 and 9.

The above-mentioned embodiment has described the case where the rectangular workpiece W is resin-molded using a rectangular single-piece film F, and the following description is directed to a circular workpiece W (for example, a semiconductor wafer, a circular or ring-shaped carrier). (E.g.) A case where resin molding is carried out and a molded resin R supplied in a circular shape is conveyed together with a rectangular single film F is described.

In FIG. 9, the film conveying device 13 includes a pair of annular film chucks 19a, a chuck holding portion 19b that holds the film chuck 19a, and a slider 19c that is integrated with the chuck holding portion 19b. And the ring-shaped fulcrum frame 19d whose frame opening part is covered with the rectangular single-piece film F.

In the fulcrum frame 19d, a flange portion 19e having an outer shape larger than that of the single-piece film F is formed at the upper end portion. In the fulcrum frame 19d, the lower outer corner portion is a fulcrum portion 19f that has a circular shape other than the fulcrum when a tension is applied to the single sheet of film F. The upper portion of the fulcrum frame 19d is opened with an inclined portion 19g (see FIG. 9) that has a wider diameter as the end portion of the opening having a circular shape in plan view becomes closer. In addition, a ring-shaped fulcrum frame may be provided at the lower end portion of the fulcrum frame 19d instead of the fulcrum portion 19f. The slider 19c is slidably coupled to the flange portion 19e. The slider 19c is provided with a ratchet mechanism. The ratchet mechanism allows the slider 19c to move only in the upper direction before reaching the predetermined height with respect to the flange portion 19e. Therefore, it becomes possible to maintain the tension | tensile_strength with respect to the single sheet film F. The slider 19c and the chuck holding portion 19b are provided around the fulcrum frame 19d, for example, at positions facing each other. In addition, the slider 19c and the chuck holding portion 19b may be provided at more than four places. Further, as the slider 19c, a helical shaft provided vertically so as to penetrate through the chuck holding portion 19b and the flange portion 19e may be constructed so that the chuck holding portion 19b (in other words, the film chuck 19) can be raised and lowered.

An example of the feeding operation of the mold resin R and the single-piece film F in the film conveying device 13 will be described with reference to FIG. 8.

As in FIG. 2 (A), the film end of the film supply unit 8 (see FIG. 1) is drawn from the film roll 8a to the long film F on the stage 17, The cutter 18 is cut into a predetermined size (for example, each side is 800 mm), and a single sheet of film F is prepared. Next, a pair of ring-shaped film chucks 19a are placed on top of the single film F and sandwiched therebetween. In this case, for example, the film F is supplied with the lower-side annular film chuck 19 a prepared on the outside of the stage 17 so that the upper-side annular film chuck 19 a overlaps. Next, as shown in FIG. 8 (A), the fulcrum frame 19d of the film carrying device 13 is superimposed on the cut single film F, and the film chuck 19a positions the single film F at a position facing in the radial direction. The outer peripheral edge portion is sandwiched by the chuck holding portion 19b at a total of four places (see FIG. 9).

Next, in FIG. 8 (B), a driving source (not shown) is actuated to lift the upper ejector pin 15 to raise the slider 19c and the chuck holding portion 19b relative to the fulcrum frame 19d. Therefore, the entire circumference of the single-piece film F is pulled by the annular film chuck 19a, and the single-piece film F is pulled away from the circular fulcrum portion 19f. In other words, the annular film chuck 19a is offset from the circular fulcrum portion 19f. Therefore, the film tension is increased in the circular region formed in the circular fulcrum portion 19f. In this case, the difference from the above embodiment is that the same tension is applied to the entire circumference of the inside of the circular fulcrum portion 19f. At this time, a ratchet mechanism (not shown) is operated between the slider 19c and the flange portion 19e, and the film chuck 19a is held in a raised position. Therefore, it maintains in the state which required tension | tensile_strength to the single sheet film F which covers the frame opening part of the fulcrum frame 19d.

In FIG. 8 (B), the mold resin R (pellet resin) is supplied from the dispenser 9 (refer to FIG. 1) through the groove 16 to the single film F covering the opening of the frame body of the fulcrum frame 19d in the same manner. . In this case, for example For example, if the operation of dropping the molded resin R from the groove 16 is moved only a predetermined distance in a predetermined direction to perform repeated strip feeding, the plurality of strip-shaped resin feeding regions may be arranged and combined to form a circular covering region. Resin supply area. In addition, as shown in FIG. 9, by forming an inclined portion 19 g having a wider opening diameter at the upper end of the fulcrum frame 19 d as the opening has a circular shape in a plan view, the entire molding resin R can be supplied without a gap.

The film conveying device 13 for supplying the granular resin R to the single-piece film F is conveyed toward the molding die 6 of the press section 5 by the film carrier 11 holding the fulcrum frame 19d as shown in FIG. 8 (C). In this case, since the single film F is held in a state where a required tension is applied between the fulcrum portions 19f, the single film F can be effectively prevented from being deflected. In addition, for the resin molding of the circular workpiece W, the molding resin R can be supplied and conveyed to the rectangular single-piece film F to form a circular shape. Therefore, even if the circular workpiece W is resin-molded, In this case, a single sheet of film F can be prepared simply by cutting the film into a rectangular shape with a desired size.

Next, another example of the film conveying device 13 will be described with reference to FIG. 10. The same components as those in FIG. 2 (B) are assigned the same reference numerals and explanations are referred to. The film conveying device 13 shown in the same figure is weakly pressed toward the single sheet F through the inner part of the film conveying device 13 constituting the guide member 13h1, and the molded resin R can be prevented from entering the film conveying device 13 and the single film. F clearance.

Specifically, as shown in FIG. 10, a movable member 13h2 provided on the inner side and a guide member 13h1 provided on the outer side are combined and hooked on the inner peripheral surface side of the rectangular frame 13a.

A support member 13i is protruded from a radially inner side of the guide member 13h1. A surface overlapping the guide member 13h1 of the movable member 13h2 is formed with a receiving portion 13j that is hollowed out. The support member 13i is accommodated in the accommodation portion 13j. A pressing spring 13m is provided between the support member 13i and the film pressing portion 13k provided at the lower end portion of the movable member 13h2. By elastically mounting the pressing spring 13m, the movable member 13h2 is always energized in a direction protruding downward with respect to the guide member 13h1.

Therefore, when the granular resin R is placed on the single film F covering the opening (lower opening) of the frame of the rectangular frame 13a, the tension applied to the single film F is difficult to sag against the weight of the resin, even if it is small. The gap is opened on the single sheet of film F. Since the movable member 13h2 moves protrudingly relative to the guide member 13h1 and is buried in the single sheet of film F, it acts as a gap, so it can effectively prevent, for example, granular molding. The resin R enters the gap.

Moreover, the above-mentioned embodiment explained the case where the single film F was conveyed and transferred toward the lower mold holding surface in which the lower mold cavity recessed part 6C of the molding mold 6 was formed, but the upper mold was also formed The upper die clamping surface of the cavity recessed portion transfers and transfers a single sheet of film F. In this case, it is also possible to reduce the use amount of the single film F to reduce the running cost. Similarly, only a single sheet of film F may be transferred to and transferred from the lower mold holding surface in which the lower mold cavity is formed. Furthermore, a single film F may be supplied to both the upper mold and the lower mold in the same manner as described above.

Although the mold 6 has been described using a mold for compression molding, it may be a mold for transfer molding.

The film conveying devices 13 and 19 described above can be suitably used for resin molding a workpiece W having an arbitrary shape such as a circular shape and a rectangular shape. For example, in order to perform resin molding of a rectangular-shaped workpiece W using the configuration of the film conveying device 19, the molding resin R may be supplied by forming each portion configured as a circle or a ring in the above-mentioned configuration into a rectangular shape. A rectangular shape is formed, and a rectangular workpiece W is molded in a rectangular cavity.

In addition, according to the film conveying devices 13 and 19 described above, in addition to a configuration in which a single film F that is elongated due to radiant heat in the mold 6 is increased in tension, it can also be made to pass through before being supplied to the mold 6. And increased composition. In this case, for example, even when it is necessary to preheat a resin that is difficult to be transported and then transport it, if the mold film R can be supplied and preheated while applying tension to the single-piece film F, the preheating caused by the preheating can be eliminated. The resulting single-piece film F is transported after being loosened. The resin that is difficult to transport refers to powdered resin that may spread due to the flow of ambient gas and cause the powdered resin to be scattered upward.

In addition, the distribution unit Ud may be assembled and used in the resin molding apparatus described above, or may be used as a single unit. In this case, a step of preparing a film conveying device 13 for holding the single film F to which a predetermined tension is applied in the distribution unit Ud, and supplying the press unit Up separately provided for each film conveying device may be considered. In such a case, the effect of using the above-mentioned distribution unit Ud and the film conveying device 13 can also be obtained.

In addition, for example, the reversed portion 30 on the front and back surfaces of the workpiece W or the molded product M may be used to perform resin molding on both surfaces of the workpiece W. shape. In this case, resin molding is performed on one side of the workpiece W, and the workpiece is returned to the workpiece processing unit Uw. After the molded product M is reversed by the reversing portion 30, resin molding is performed on the other side of the workpiece W (molded product M). Shaped. In addition, a robot transfer device 4 capable of reversing the robot arm 4 a can be created instead of the reversing unit 30.

Claims (10)

A film conveying device is used for conveying a single piece of film for molding to a molding die while maintaining a state where tension is imparted. The film conveying device is characterized by having a fulcrum frame which surrounds and surrounds a cavity in a cavity of a mold. The frame having a predetermined shape corresponding to the mold clamping surface is a fulcrum portion that applies tension to the single sheet of film that is held while covering the opening of the frame; the film holding portion is attached to the outside of the fulcrum frame to hold the An outer peripheral edge portion of the single sheet of film; and a shifting mechanism that shifts the film holding portion away from the fulcrum portion, and the outer peripheral edge portion of the single sheet is held by the film holding portion with respect to the fulcrum The part is shifted, and the required tension is given to the single film, and the fulcrum frame and the single film are transported to the molding die together with the fulcrum frame and the single film. The film transfer device according to claim 1, wherein a molding resin for molding is mounted on the aforementioned single sheet of film to which a desired tension is given, and is transported together with the fulcrum frame. According to the film transfer device of claim 1 or 2, wherein the film holding portion holds each side of the rectangular monolithic film. For example, the film conveying device of claim 3, wherein the film holding portion is divided into a plurality of holding portions on each side of the single sheet of film to be set. For example, the film conveying device according to claim 3, wherein the film holding portion is provided with an adjustable offset amount according to each side of the single film. According to the film conveying device of claim 1 or 2, wherein the offset mechanism rotates the film holding portion around a rotation axis provided in the frame as a center, the film holding portion is separated from the fulcrum portion. The film conveying device according to claim 6, further comprising a ratchet mechanism that allows a rotating member for holding the film holding portion to rotate only in a direction away from the fulcrum portion with the rotation axis as a center. A resin molding device, comprising: the aforementioned film transfer device according to claim 1 or 2; and a film carrier for transferring the aforementioned film transfer device to the aforementioned molding die. For example, the resin molding device of claim 8 includes a tension adding mechanism that increases the shift amount of the film holding portion when the single film is moved into the molding die together with the fulcrum frame. The tension generated by the offset mechanism toward the single film is further strengthened. A film transfer method is to transfer a single piece of film for molding to a molding die while maintaining a state of imparting tension. The film transfer method is characterized in that it corresponds to a predetermined mold holding surface surrounding a cavity of a cavity. On the outside of the fulcrum frame which is a fulcrum portion on the single-piece film held and covering the opening of the frame body, the outer periphery of the single-piece film is held by the film holding portion, The film holding portion holds the outer peripheral edge portion of the single-piece film in a state of being deviated from the fulcrum portion and imparts the required tension to the single-piece film, together with the fulcrum frame and the single-piece film to the mold together. Mold transfer.