TW201700381A - Thin film transport apparatus and thin film transport method and resin molding apparatus wherein the thin film transport apparatus can transport a single piece of thin film while imparting a proper tension to the thin film without causing wrinkles and yet fitting the recess of mold cavity - Google Patents

Abstract

The present invention provides a thin film transport apparatus, which can transport a single piece of thin film while imparting a proper tension to the thin film without causing wrinkles and yet fitting the recess of mold cavity. In a state where the outer peripheral portion of the single piece of thin film F is gripped by a film clamping chuck 13c to make it offset relative to the pivot frame 13b and a predetermined tension is applied to the single piece of thin film F, the pivot frame 13b and the single piece of thin film F are altogether transferred to the molding die.

Description

Film conveying device, film conveying method, and resin molding device

The present invention relates to a film conveying device, a film conveying method, and a resin molding device for conveying a single film together with a molding resin toward a molding die.

Further, the single-sheet film is a film formed by cutting a film having a predetermined size into a predetermined size and cutting it into a predetermined size from a long or large-sized film.

For the resin molding apparatus used in semiconductor manufacturing plants, for example, WLP (Wafer Level Package) or PLP (Panel Level Package) is used as a workpiece. 8吋 or The 12-inch semiconductor wafer was resin-molded, and a rectangular panel (substrate, carrier, etc.) having a side length of 300 mm to a side length of 600 mm (each side of 300 mm to 600 mm) was resin-molded.

At this time, in the case of a molding die having a cavity recessed portion in the upper die, the resin having a high viscosity is generally supplied to the center position on the workpiece at a time for molding. In this case, in order to fill the cavity of the resin supplied to the workpiece, it is necessary to cause the molding resin to flow largely. Therefore, there is a case where a region where the molding resin is not filled occurs. In this regard, there is also a recess for holding the cavity in the lower mold, and the lower mold clamping surface containing the concave portion of the lower mold cavity The mold resin is covered with a film and supplied with a uniform thickness, and the workpiece held in the upper mold is immersed in the molten mold resin for resin molding.

Thus, in the case of resin molding using a film, in order to improve the affinity for the concave portion of the cavity to prevent wrinkles from occurring to improve the quality of the molded article, the applicant proposes a method of adsorbing and holding the outer peripheral edge portion of the film carrier by the transfer. A resin molding apparatus and method for adsorbing and holding a film on a concave portion of a lower mold cavity (refer to Patent Document 1).

Prior technical literature Patent literature

Patent Document 1 Japanese Patent Laid-Open Publication No. 2014-231185

In this way, in order to reduce mold maintenance and prevent resin leakage, a film is used for resin molding. However, when a film wound between a pair of rolls is continuously supplied to a molding die for resin molding, the mold clamping surface is used. Further, since the film on the upstream side and the downstream side in the film transport direction is deformed by the radiant heat from the mold, the amount of the film used increases during the single resin molding operation, which increases the running cost. Therefore, in order to reduce the amount of film used, it is conceivable to use a single film (a film having a predetermined size and a predetermined shape in advance) instead of a long continuous film.

However, in particular, in order to mold a large-sized and rectangular-shaped workpiece, for example, a rectangular workpiece having sides of 600 mm, a film of a larger size is appropriately treated, and the lower mold is made to be free from wrinkles. When the concave portion of the cavity meets the adsorption, it is necessary to give a moderate amount of sheet to the entire film. force. Further, when the mold resin is placed on the single film in a state where it is placed on the single film, when the single film is bent, a large amount of the molded resin is carried in a state where the film is biased.

Further, since a film which is substantially larger than the outer shape of the workpiece is used, the film transport mechanism is also increased in size, and the installation area of the device is also increased, and the foot print in the clean room is increased. The tendency of the device cost to increase.

An object of the present invention is to provide a film transporting apparatus which solves the above-described problems of the prior art, which can impart a moderate tension to convey a single film and transfer it to the cavity recess without wrinkles.

Further, there is provided a resin molding apparatus which is provided with the above-described film conveying apparatus to reduce the amount of use of the film and to reduce the running cost, and to improve the molding quality of a molded article of a large size and to suppress the installation area.

Further, there is provided a film transport method in which a resin is transported without bias even if a resin is placed on a single film.

The present invention has the following configuration in order to achieve the above object.

A film transfer device that transports a single film for molding into a mold while maintaining tension, and the film transfer device is characterized in that it has a fulcrum frame that surrounds and surrounds the cavity recess a frame having a predetermined shape corresponding to the mold clamping surface is a fulcrum portion that applies tension to the single film that is held by the opening of the frame; and the film holding portion holds the outer side of the fulcrum frame single An outer peripheral edge portion of the sheet film; and an offset mechanism for shifting the film holding portion in a direction away from the fulcrum portion, wherein the film holding portion holds an outer peripheral edge portion of the single film and is opposite to the fulcrum portion The transfer is carried out in conjunction with the fulcrum frame and the monolithic film in a state in which the desired tension is applied to the single-piece film.

According to the above configuration, the outer peripheral edge portion of the single film is held by the film holding portion to be offset from the fulcrum portion, and the desired tension is applied throughout the entire circumference of the single film, together with the fulcrum frame and the single piece. The film is conveyed together to the molding die, so that the single film can be conveyed and transferred to the molding die without wrinkles. Thus, the single film can be brought into contact with the mold holding surface of the cavity recess in which the molding die is formed and adsorbed and held.

It is also possible to carry a molding resin for molding into a single film which imparts a desired tension, and carry it together with the fulcrum frame.

Therefore, even if a single film is loaded with a molding resin and carried in, the single film does not bend, and resin leakage or resin bias does not occur, and air is not caught in the molding resin.

Preferably, the film holding portion holds each side of the rectangular single film.

According to this, it is possible to impart tension to each of the two sides by the film holding portion provided on the opposite side of the rectangular single-piece film, and it is possible to effectively prevent the occurrence of wrinkles.

The film holding portion may be divided into a plurality of grip portions on each side of the single film.

Therefore, by changing the amount of deviation between the divided film holding portion and the fulcrum portion, tension can be applied to twist the single film in a direction of wrinkles or wrinkles generated in the single film, and the occurrence of wrinkles inherent to the film can be eliminated.

Preferably, the film holding portion is arranged to adjust the offset amount on each side of the single film.

Therefore, by adjusting the offset amount of the film holding portion by the respective sides of the single film, it is possible to suppress the occurrence of extremely fine wrinkles.

The offset mechanism may be configured such that the film holding portion is rotated about a rotation axis provided in the frame to separate the film holding portion from the fulcrum portion.

Therefore, by moving the film holding portion around the rotation axis to separate the film holding portion from the fulcrum portion, the amount of winding of the single film around the fulcrum portion is changed to adjust the tension. In particular, since the tension can be adjusted by rotating the film holding portion around the rotation axis, the film conveying device can be downsized.

Preferably, the ratchet mechanism is configured to allow the rotating member for holding the film holding portion to rotate only in a direction away from the fulcrum portion around the rotating shaft. Therefore, by stopping the film holding portion at the position after the rotation, the conveyance can be performed while maintaining the tension applied to the single film.

The resin molding apparatus is characterized by comprising: any one of the above-described film conveying devices; and a film carrier that conveys the film conveying device to the molding die.

In this way, it is possible to provide a resin molding apparatus which can improve the molding quality of a molded article of a large size and suppress the installation area by reducing the amount of use of the film by using a film transfer device that transports a single film.

Preferably, the tension attachment mechanism is provided to increase the offset of the film gripping portion when the single-piece film is loaded into the molding die together with the fulcrum frame, and is further strengthened by the offset mechanism toward the single sheet. The tension of the film.

Therefore, when the single film F is carried into the molding die, the single film F is stretched due to the radiant heat, but the tension of the single film is further enhanced by the tension applying mechanism to prevent the single film from being set in the mold. The film is wrinkled.

Further, a film transfer method is carried out by applying a tension to a molding die in a state in which a tension is applied to a single film for molding, and the film transfer method is characterized in that it corresponds to a die clamping surface surrounding a cavity concave portion. The frame of the predetermined shape is placed on the outer side of the fulcrum frame which is a fulcrum portion on the single film which is held by the opening of the frame, and the outer peripheral edge portion of the single film is held by the film holding portion. The film holding portion holds the outer peripheral edge portion of the one-piece film in a direction away from the fulcrum portion and is applied to the tension required for the single film, together with the fulcrum frame and the single film. The aforementioned molding die is conveyed.

Therefore, the outer peripheral edge portion of the single film is held by the film holding portion to be offset from the fulcrum portion, and the desired tension is applied over the entire circumference of the single film, so that the single film is moved to the molding die. After being sent, it can be transferred and transferred to the molding die without causing wrinkles in the single film. Therefore, even if the resin is placed on a single film, the resin can be conveyed without biasing the resin, and the single film can be brought into contact with the mold holding surface of the cavity recess in which the molding die is formed, and can be adsorbed and held.

When the film transfer device described above is used, the single film can be transported without wrinkles and can be transferred to the mold holding surface where the cavity recess is formed. Even if the resin is placed on the single film, the resin can be used. Transfer under the bias of life.

Further, in the resin molding apparatus including the above-described film conveying device, the amount of the film used is reduced to reduce the running cost, and the molding quality of the molded article of a large size can be improved and the installation area can be suppressed.

Ud‧‧ distribution unit

Up‧‧‧ Press unit

Uw‧‧‧ workpiece processing unit

W‧‧‧Workpiece

1‧‧‧Workpiece Supply Department

2‧‧‧Formed product storage department

M‧‧‧Formed products

3‧‧‧hardening furnace

4‧‧‧Robot transport device

4a‧‧‧Machine arm

5‧‧‧ Press Department

5a‧‧‧ column

6‧‧‧Molding mould

6A‧‧‧上模

6B‧‧‧Down

6C‧‧‧ Lower mold cavity recess

6a‧‧‧Upper clamping surface

6b‧‧‧Air adsorption hole

6c‧‧‧Air attraction road

6d‧‧‧Workpiece retention pin

6e‧‧‧Next module

6f‧‧‧Down mold block

6g‧‧‧Down mold movable gripper

6g1, 6g2‧‧‧ air attraction road

6h‧‧‧Helical spring

6i‧‧‧Seal ring

6j‧‧‧Pushing device

8‧‧‧ Film Supply Department

8a‧‧‧ Film Roller

F‧‧‧Single film

9‧‧‧Distributor

10‧‧‧ Panel Carrier

11‧‧‧film carrier

12‧‧‧ Film Recycling Department

13, 19‧‧ ‧ film handling device

13a‧‧‧Rectangular frame

13b, 19d‧‧‧ pivot frame

13c, 19a‧‧‧ film chuck

13d‧‧‧Rotary rod

13e‧‧‧Rotary axis

13f‧‧‧ratchet mechanism

13g, 19g‧‧‧ inclined section

13h1‧‧‧Guide members

13h2‧‧‧ movable member

13i‧‧‧Support members

13j‧‧‧Receiving Department

13k‧‧‧film pressing department

13m‧‧‧ Pressing spring

14‧‧‧ rails

15‧‧‧Uploading

16‧‧‧ trench

17‧‧‧stage

18‧‧‧Tools

19b‧‧‧ chuck holder

19c‧‧‧ Slider

19e‧‧‧Flange

19f‧‧‧ fulcrum department

20‧‧‧ Film Drop Detection Department

30‧‧‧Reversal Department

Fig. 1 is a plan view showing a schematic configuration of a resin molding apparatus.

2(A) to (F) are explanatory views showing the preparation for transporting a single film and the step of supplying a molded resin.

Figure 3 is a plan view of a film transfer device.

Fig. 4 is a cross-sectional view showing the constitution of a molding die.

5(A) to 5(C) are explanatory views showing a supply step of supplying a single film and a molding resin to the lower mold of Fig. 4.

6(D) to 6(F) are explanatory views showing the supply steps of the single-piece film and the mold resin subsequent to FIG. 5.

7(A) to (D) are explanatory views showing the resin molding step subsequent to Fig. 6.

8(A) to 8(C) are explanatory views showing a supply process of a single film and a molding resin of a film conveying device of another example.

Figure 9 is a plan view of the film transporting apparatus of Figure 8.

Fig. 10 is a partial cross-sectional view showing a film transporting apparatus of another example.

Hereinafter, preferred embodiments of the film conveying device and the resin molding device including the same according to the present invention will be described in detail together with the attached drawings. In the following, in the case of a workpiece, for example, a rectangular workpiece having a side of about 600 mm is used, and a resin molding device in which a resin is molded using a single film having a size larger than the above is used. Of course, the workpiece is not only a large one as described above, but also a small narrow rectangular workpiece of about 300 mm × 100 mm. Further, as an example of the resin molding apparatus, the following mold is a movable mold, and the upper mold is a fixed mold. In addition, the resin molding apparatus includes a mold opening and closing mechanism, but is not shown in the drawings, and the description will be centered on the configuration of the mold.

First, a schematic configuration of a resin molding apparatus will be described with reference to Fig. 1 . In this resin molding apparatus, a control unit (not shown) controls each unit to be described later to perform various operations. The molding apparatus in this embodiment is constructed by connecting a workpiece processing unit Uw, two press units Up and a distribution unit Ud (supply unit), and automatically performs resin molding on the workpiece W in the apparatus.

The workpiece processing unit Uw includes, for example, a workpiece supply unit 1 , a molded article storage unit 2 , a cure stove 3 , and a robot transfer device 4 . For example, a workpiece W of a rectangular panel (substrate, carrier, or the like) having a size of about 600 mm on each side is housed in the workpiece supply unit 1. In molded article The accommodating part 2 accommodates the molded article M which resin-molded in the press part 5 mentioned later. In the hardening furnace 3, the molded article M which is resin-molded in the press unit 5 which will be described later is separately stored in a multilayer scaffold provided in the furnace, and post-cured to heat-harden the resin package portion. The robot transfer device 4 transfers and transports the workpiece W and the molded article M between the respective portions that are arranged to surround the robot. In the robot transfer device 4, for example, the workpiece W is taken out from the workpiece supply unit 1 and supplied, and the molded product M is transported to the hardened furnace 3, and the hardened furnace 3 is sequentially transported and stored in the molded product storage unit 2. In the robot transfer device 4, for example, a multi-joint type robot in which a vertical multi-joint type, a horizontal multi-joint type, or the like is used, and the workpiece W or the molded product M is held by the robot arm 4a by suction or holding. In the workpiece processing unit Uw, the cooling unit for cooling the molded product M, the inspection unit for performing the visual inspection of the molded article, and the data reading unit for reading the molding conditions attached to each workpiece W or the reverse workpiece W may be used. The reverse portion 30 of the front and back surfaces of the molded article M is disposed around the robot transfer device 4. For example, when the surface of the workpiece W on which the resin molding is formed (formed surface) is supplied upward in the workpiece supply unit 1, the inversion portion 30 faces the lower surface. In addition, the reversing portion 30 is reversed so that the molding surface M having the molded resin molded form is placed in the molded article housing portion 2 with the molding surface facing upward.

The press unit 5 in the press unit Up includes a molding die 6 for compression molding in which a known mold opening and closing mechanism is opened and closed with respect to a column 5a provided at four corners (the upper mold 6A and the platen) Lower die 6B). In this embodiment, the press unit Up is disposed at two places, but may be disposed at one place, and may be disposed at three or more places.

The film conveyance device 13 (film conveyance device) is in a state where the single film F supplied from the film supply unit 8 in the distribution unit Ud is supplied with a molding resin (for example, a pellet resin or a powder resin) by the dispenser 9. It is conveyed in the molding die 6 of the press unit 5. The film supply unit 8 is provided with a film roll 8a in which a long film is wound in a roll shape. The film roll 8a is pulled out of the film end, and the rectangular shape of any size is cut (cut) and placed on the stage 17 as a single film F.

The dispenser 9 supplies the molding resin R (granular resin) required for the primary resin molding to the state in which the single film F is supported by a desired tension to the film conveying device 13 to be described later. Monolithic film F. Further, a powder resin, a liquid resin or a sheet resin may be used, and these may be used in combination to replace the particulate resin.

The single-sheet film F is heat-resistant and easily peeled off from the mold surface to have flexibility and stretchability. For example, PTFE, ETFE, PET, FEP film, fluorine-impregnated glass cloth, polypropylene film, and polydichloro can be suitably used. A single layer film or a double layer film mainly composed of ethylene or the like.

The panel carrier 10 picks up the workpiece W from the robot arm 4a of the robot transfer device 4 and carries it into the molding die 6 (upper die 6A) of the press unit 5. Moreover, the panel carrier 10 picks up the molded article M from the molding die 6a and transfers it to the robot arm 4a of the robot transfer device 4. When the molded product M is taken out from the molding die 6, the panel carrier 10 is also sucked and held by the used single-piece film F, and the taken-out single-film F is collected toward the film collecting portion 12.

The film carrier 11 is attached to the film transfer device 13 to be supplied with a desired tension and held by a single film F and supplied to the film. The molded resin R (granular resin) on F is conveyed toward the molding die 6 (lower die 6B). The panel carrier 10 and the film carrier 11 are provided in such a manner that a plurality of guide rails 14 laid in the longitudinal direction of the device reciprocate. Further, a carrier conveying device (not shown) is moved toward each portion (for example, the press portion 5) so as to be orthogonal to the position on the guide rail 14.

Here, the configuration of the film conveying device 13 will be described with reference to Figs. 2 and 3 .

As shown in FIG. 2(B), the film conveying device 13 is provided with a frame (for example, a rectangular frame body 13a) having a predetermined shape corresponding to a lower mold cavity holding surface of a lower mold cavity recessed portion 6C to be described later.

In addition, the fulcrum frame 13b which applies tension to the single film F in the film conveying device 13 as a fulcrum portion is formed in a rectangular shape along the rectangular frame body 13a (see FIG. 3). Instead of providing the fulcrum frame 13b, the outer corner portion of the rectangular frame 13a may be used as the fulcrum portion.

Further, on the outer side of the film conveying device 13, a plurality of film chucks 13c (film holding portions) for holding the outer peripheral edge portion of the single film F over the entire circumference are provided. Specifically, as shown in FIG. 2(B), in order to convey and hold the rectangular single-piece film F, a pair of film chucks 13c (film holding portions) are provided on the opposite sides. In the pair of film chucks 13c, an open-close type chuck is used, and the outer peripheral edge portion of the rectangular single-piece film F is sandwiched and held on each side. Both ends of the pair of film chucks 13c in the longitudinal direction are supported by a pair of rotating rods 13d (rotating members). The pair of rotating levers 13d are provided in the rectangular frame body 13a so as to be rotatable about the rotation shaft 13e formed inside the film chuck 13c. Therefore, the pair of film chucks 13c are disposed on the rotating rod 13d. The opposite side of the rotating shaft 13e. The rotating lever 13d is provided with an offset mechanism that rotates only in a direction offset from the fulcrum frame 13b. Specifically, as shown in Fig. 3, a ratchet mechanism 13f for engaging the ratchet and the pawl is provided on the rotary shaft 13e of the film chuck 13c. The ratchet mechanism 13f allows the film chuck 13c to rotate only a predetermined angle in the direction away from the fulcrum frame 13b (the direction of the arrow in FIG. 2(C)) around the rotation shaft 13e. Therefore, by stopping the film chuck 13c at a predetermined rotational position after being rotated in one direction, it is possible to carry out the conveyance while maintaining the tension applied to the single film F. Further, instead of the ratchet mechanism 13f, an arbitrary tension may be applied to the single-piece film F by a drive mechanism such as a servo motor or a torque motor, and the tension applied thereto may be maintained. In this case, the film conveying device 13 is likely to be larger than the configuration in which the ratchet mechanism 13f is provided, but conversely, it is preferable to adjust the tension applied to the single film F at any time.

As shown in Fig. 2(C), the outer peripheral edge portion (four sides) of the single film F is held by the pair of film chucks 13c, and the lifting drive mechanism (cylinder drive, spiral) The upper top pin 15 that is lifted and lowered by the tube drive, the motor drive, and the like pushes the rotating rod 13d upward. At this time, the rotating lever 13d is rotated about the rotating shaft 13e to shift the film chuck 13c in a direction (arrow direction) that is separated from the fulcrum frame 13b. Therefore, the end portions of the single-piece film F covering the opening of the casing of the film conveying device 13 are increased by the amount of being pulled apart from each other via the fulcrum frame 13b, and are integrally held in a state where the required tension is applied. . Further, in the case where the rotary lever 13d returns to the home position, when the upper lever 15 is used again to raise the rotary lever 13d to a predetermined angle, the engagement of the ratchet mechanism 13f (refer to FIG. 3) is released, and the rotary lever 13d is returned to the original position. position.

As shown in the same figure, the film chuck 13c is separated from the fulcrum frame 13b by rotating the film chuck 13c around the rotation shaft 13e, and the ends of the single film F are pulled apart from each other via the fulcrum frame 13b. The amount can increase the tension. In particular, the tension of the single film F can be adjusted for each side of the film by the respective rotations about the rotation axis 13e of the film chuck 13c disposed on the four sides, so that the appropriate tension can be applied to the single film F. The film conveying device 13 is configured to be small and simple.

The molding resin R (particulate resin) required for the one-component resin molding is supplied from the dispenser 9 (refer to FIG. 1) via, for example, a trough 16 (refer to FIG. 2(D)) to give the desired The single-piece film F of the tension is similarly supplied on the single-piece film F without bias (see FIG. 2(E)). Further, the upper portion of the rectangular frame 13a is formed with an inclined portion 13g whose width becomes wider toward the opening end portion which is rectangular in plan view. By supplying the mold resin R to the inside of the inclined portion 13g, the mold resin R can be supplied to the single film F in an arbitrary shape.

In this case, the molding resin R supplied onto the single film F is prevented from climbing up the rectangular frame 13a by the inclined portion 13g. Further, the molded resin R may be supplied in a circular area on the single film F by forming a circular shape inside the rectangular frame 13a together with the inclined portion 13g. According to this, only the structure of the changed portion can be used regardless of the shape of the cavity such as a circular shape or a rectangular shape, and the same transfer structure of the single film F can be used.

Further, as shown in FIG. 2(F), in a state where the single-piece film F is supplied with the mold resin R, the film carrying device 13 (rectangular frame 13a) is held by the film carrier 11 and faces the molding die 6 Transfer.

Here, when the single-piece film F is lifted from the stage 17 by the film carrier 11, when the tension is insufficient, the single-film F may sag in the center or the like due to the weight of the molding resin R. Thus, the film hanging down detecting portion 20 can be provided at a position close to the stage 17. As the film hanging down detecting unit 20, a laser sensor having a light-emitting portion and a light-receiving portion and having a shielding state or a shielding position between the light-emitting portion and the light-receiving portion can be provided. As an example, a configuration in which the light-emitting portion and the light-receiving portion are provided at a position where the film transport device 13 is sandwiched can be provided. Further, as the film hanging down detecting unit 20, by detecting the shielding in the space on the stage 17, it is possible to detect when the single film F is suspended from an appropriate position when the film conveying device 13 is lifted. The film hanging down detecting unit 20 may be provided with only one set so that the sagging in one direction can be detected, or two sets can be provided in the two directions that can be crossed as shown in FIG. Further, the film hanging down detecting unit 20 may have any configuration as long as it can detect the sagging of the single film F. For example, it may be configured as a contact sensor (switch), or may be configured to detect a contact with a hanging film when the film transport device 13 is lifted to a predetermined height.

Further, the film chuck 13c held by each side of the rectangular single-piece film F shown in Fig. 3 can have a uniform amount or a different amount on the top side. In this case, by, for example, the top amount of the upper top pin 15 provided in accordance with the side of the single film F is made uniform, the tension corresponding to the amount of rotation around the rotating shaft 13e can be applied. Further, the amount of the top top may be different depending on the group of the pair of film chucks 13c on the opposite sides. In this case, depending on the length of each side of the single film F or the ease of elongation of the film in accordance with the direction in which the film roll 8a is drawn, etc., The amount of the top top varies depending on the group of the film chucks 13c, and the tension applied to each side of the single film F can be made uniform. For example, in the case of the horizontally long film shown in FIG. 3, the top and bottom of the pair of film chucks 13c in the two sides (right and left sides) pulled in the longitudinal direction (the left and right direction of the same figure) are placed on top of each other. The pair of film chucks 13c of the two sides (upper and lower sides) pulled in the short-side direction (upper and lower directions of the same drawing) may have different top amounts. That is, the top amount of the film chuck 13c in the longitudinal direction can be set to be larger than the top amount of the film chuck 13c in the short side direction. In other words, by pulling more on the long side, the length can be uniformly pulled regardless of the length of the side. According to this, the tension applied to the single-piece film F in the directions of the longitudinal direction and the short-side direction can be made uniform.

Further, it is not limited to the case where the single-piece film F is integrally held on each side as shown in the same figure, and a plurality of pieces may be divided and disposed on one side of the film chuck 13c. In this case, by applying a tension in a state (position) of the wrinkles generated in the single film F, by changing the amount of rotation of the position of the film chuck 13c on the side, the tension is applied, and the wrinkle state can be extended. maintain. For example, when the partial tension is increased, wrinkles are generated outside the position. Therefore, first, it is possible to form a structure in which the film chuck 13c is topped and tension is applied uniformly, and when wrinkles are generated, the tension of the portion is weakened and the tension other than the portion is increased. Further, the film chuck 13c is configured not only to be pulled by a predetermined length on the side of the single film F in order to be pulled in the extending direction of the side, but also to be formed at the corner of the single film F. The structure in which the corners of the single-piece film F are gripped is elongated in the direction in which the center is pulled apart.

Therefore, by changing the offset amount of the divided film chuck 13c from the fulcrum frame 13b, and applying tension in a manner of twisting the single film F in the direction of the wrinkles or the size of the wrinkles generated on the single film F, It can eliminate the occurrence of inherent wrinkles in the film.

Next, the configuration of the molding die 6 provided in the press unit 5 will be described with reference to Fig. 4 . This embodiment exemplifies a molding die 6 for compression molding. In the mold 6, a heater (not shown) is provided at an arbitrary position, and the mold resin R is heat-cured to mold the workpiece W with a resin to produce a molded article M. In the upper mold clamping surface 6a of the upper mold 6A, in order to adsorb and hold the workpiece W, an air suction hole 6b and an air suction path 6c communicating therewith are formed. Moreover, the workpiece holding pin 6d is provided at the opposite position on the outer edge portion of the rectangular workpiece W at a plurality of positions. The workpiece holding pin 6d presses and holds the outer peripheral surface of the workpiece W. The workpiece holding pin 6d may be a cylindrical pin or a columnar pin, and is preferably configured to be pushed against the workpiece W through the elastic body. Further, the workpiece holding pin 6d may be formed as a guide for centering the workpiece W while adsorbing and holding the workpiece W. According to this configuration, for example, the area of the cavity can be increased as compared with the configuration in which the outer circumference of the workpiece W is held by the L-shaped claw-shaped hook.

The lower mold 6B is such that the lower mold cavity 6f forming the bottom of the lower mold cavity is integrally supported by the lower module 6e. Around the lower mold cavity 6f, the lower mold movable gripper 6g forming the side portion of the lower mold cavity is floatingly supported by the lower module 6e by the coil spring 6h. The lower mold cavity recess 6C is formed by the lower mold cavity 6f and the lower mold movable clamp 6g. A seal ring 6i (O-ring) is provided in the gap between the lower mold movable gripper 6g and the lower mold cavity block 6f to be sealed. Further, in the lower mold movable holder 6g, a single film is provided F adsorbs and holds the respective air suction paths 6g1, 6g2 of the lower mold surface of the lower mold cavity recess 6C. The air suction path 6g1 is formed on the inner peripheral side of the gap from the lower mold cavity 6f and the lower mold movable gripper 6g, and the air suction path 6g2 is attached to the outer surface of the lower surface movable gripper 6g. . Therefore, the single-piece film F is adsorbed in conformity with the concave shape of the lower mold cavity recessed portion 6C. Further, a pair of upper and lower clamping blocks (not shown) for forming a decompression space in the mold when the mold clamping operation is started may be provided between the upper mold 6A and the lower mold 6B.

Further, a pushing device 6j (tension applying mechanism) is provided outside the lower mold movable gripper 6g of the lower mold 6B. This pushing device 6j is provided to further strengthen the tension toward the single film F. For example, when the single film F is carried into the lower mold 6B together with the film conveying device 13 through the film carrier 11, the tension of the single film F is lowered due to the radiant heat from the lower mold 6B, and the tension is lowered. In this case, when the tension of the single film F is lowered to cause slack, the center portion of the single film F is suspended by the weight of the single film F or the weight of the molded resin R to be supplied. In this case, when the single-piece film F is placed on the lower mold 6B, the slack of the single-film F may become wrinkles. Further, when the central portion of the single-piece film F is drooped up, it is conceivable that the mold resin R is concentrated at the center, and it is difficult to uniformly supply the mold resin R in the cavity. Therefore, the pushing device 6j is configured to be disposed at a position corresponding to the rotating lever 13d provided in the lower mold 6B, and can be rotated by a lifting mechanism such as a driving mechanism such as a cylinder driving, a solenoid driving, or a motor driving. Rotating rod 13d. This pushing device 6j is provided to increase the displacement of the pair of film chucks 13c to further strengthen the tension of the single film F. Further, the push device 6j can also be used to release the ratchet mechanism 13f.

When the single film F is placed on the lower mold 6B (the lower mold movable holder 6g) together with the film conveying device 13 by the film carrier 11, the pushing device 6j disposed directly below the rotating rod 13d is actuated. The rotating lever 13d rotates in the direction of increasing the offset amount of the film chuck 13c. Thereby, the tension of the single piece of film F can be prevented from being lowered before the mold is held. Of course, when the single film F is close to the lower mold 6B, it is also possible to rotate in the direction of increasing the offset amount of the film chuck 13c.

Next, an example of the preparation operation for transporting the single-piece film F to the molding die 6 by the film conveying device 13 will be described with reference to FIG. 2 .

In Fig. 2(A), the long film F which is taken out from the film roll 8a to the stage 17 in the film supply unit 8 (see Fig. 1) is cut into a predetermined size by the cutter 18. In the present embodiment, it is cut to a size larger than the outer shape of the lower mold movable holder 6g.

Next, in Fig. 2(B), the film conveying device 13 is superposed on the cut single film F, and the outer peripheral edge portions of the respective sides of the single film F are sandwiched by the film chuck 13c.

Next, in Fig. 2(C), the driving source (not shown) is actuated to push the upper top pin 15 up, and the rotating lever 13d is rotated about the rotating shaft 13e. The direction of rotation is the direction in which the film chuck 13c is offset (isolated) from the fulcrum frame 13b. Thereby, since the single-piece film F is pulled from both sides by the film chuck 13c, the end portion of the single-piece film F is pulled apart by the fulcrum frame 13b, that is, the angle at which the single-piece film F is wound is increased. The film tension between the fulcrum frames 13b is increased. Further, at this time, since the ratchet mechanism 13f shown in Fig. 3 is actuated, the rotary lever 13d is held at the position after the rotation. Therefore, it can be maintained in a state in which the film tension of the opening of the frame covering the rectangular frame 13a is enhanced.

In this manner, the film chuck 13c is moved in the vertical direction with respect to the fulcrum frame 13b (the fulcrum portion) to press the single film F, and for example, the film chuck 13c is pulled in the lateral direction to apply tension. Lower, the tension can be effectively applied to the single film F. Further, the device for applying tension to the single film F can be miniaturized in plan view. In other words, the larger the size of the single-piece film F, the larger the amount of pulling is to apply the same tension, but in the case where the film chuck 13c is pulled in the lateral direction, it is necessary to secure the area of the amount to be pulled. In the device, the size of the device cannot be avoided. On the other hand, according to the configuration of the above-described embodiment, even if the amount of pulling is increased to increase the tension toward the single-piece film F, the device area is not increased, and the size of the apparatus can be effectively suppressed. Further, since the film chuck 13c can be rotated about the rotation shaft 13e, the film chuck 13c side of the rotary lever 13d is topped and rotated by the upper top pin 15, so that the film 31 can be made with a small force toward the single film F. Apply tension.

In Fig. 2(D), the granular resin R is supplied from the dispenser 9 (see Fig. 1) to the single-piece film F that closes the opening of the rectangular body 13a via the groove 16 in the same manner. The particulate resin R is supplied in an amount required for the one-component resin molding operation. The state in which the particulate resin R is supplied to the monolithic film F is shown in Fig. 2(E).

Next, the film carrier 11 is moved to the upper portion of the film conveying device 13, and as shown in Fig. 2(F), the film carrier 11 holds the rectangular frame 13a to be supplied to the film conveying device 13 of the particulate resin R. lift. In this case, for example, when the weight of the molded resin R to be supplied is too large and the molding resin R cannot be appropriately conveyed by the tension applied to the single film F, the single film F is suspended at the center or the like. Therefore, when the film conveying device 13 is lifted to an arbitrary detection position, the operation is stopped, and the film hanging down detecting unit 20 can detect the shielding state of the space on the stage 17. That is, when the tension of the single-piece film F is insufficient and the single-piece film F is suspended at the center or the like, the film conveying device 13 is lowered and the upper top pin 15 is again operated by applying tension.

By repeating such an operation as appropriate in response to the demand, the single film F can be conveyed after applying an appropriate tension.

In addition, it is assumed that the molding resin R is biased to the single film F depending on the mounting state of the sheet in the workpiece W or the like. In this case, a case where the non-central portion (bias position) of the single film F is suspended may be assumed. Therefore, when two sets of film hanging detection portions 20 are provided in the two directions intersecting as shown in FIG. 3, even when the non-central portion of the single film F is suspended, the single film F in the position can be detected. Hang down. Therefore, the hanging state of the single film F can be appropriately detected, and the single film F can be conveyed after applying an appropriate tension.

Next, the film carrier 11 picks up the film conveying device 13, carries it along the guide rail 14 of FIG. 1, and carries it into the molding die 6 (lower die 6B) of the predetermined press part 5. Here, the film conveyance device 13 is supplied into the molding die 6 through the gap of the uprights 5a in the press unit 5. In this case, the film conveying device 13 is configured such that the film chuck 13c is not pulled in the lateral direction, and the film chuck 13c is moved in the vertical direction with respect to the fulcrum frame 13b (the fulcrum portion) to apply tension, because the structure can be constructed. small Since the film conveying device 13 can be carried into the molding die 6 through the gap of the limited column 5a. Further, even in the case where the column 5a is not used, the same effect can be obtained in the press structure in which the press unit 5 holds the side surface of the stage by the frame plate.

By using the above-described film conveying device 13, the film can be conveyed while maintaining a predetermined tension, so that it can be transferred to the molding die 6 without wrinkles on the single film F.

Next, an operation of supplying the single film F and the mold resin R to the molding die 6 by the film conveying device 13 will be described with reference to Figs. 5 and 6 . 5 and 6 show only the lower mold 6B.

In Fig. 5(A), the film carrier 11 holding the film conveying device 13 is placed in alignment with the lower mold 6B of the mold 6 to be opened. The mounting surface of the granular resin R of the single-piece film F and the upper surface of the lower mold cavity 6f are overlapped, and the rectangular frame 13a and the lower mold movable holder 6g are aligned to be aligned.

Next, as shown in Fig. 5(B), the film carrier 11 is lowered, and the rectangular frame 13a is lowered to abut against the lower mold movable holder 6g. At this time, the pushing device 6j provided in the lower mold 6 is disposed at a position corresponding to the rotating lever 13d.

When the single-piece film F is close to the lower mold 6B, problems such as elongation of the single-piece film F and sagging of the film as described above occur due to the radiant heat from the lower mold 6B. Therefore, as shown in FIG. 5(C), the driving device (not shown) is actuated to push the pushing device 6j up, and the rotating lever 13d is rotated about the rotating shaft 13e. The direction of rotation is the direction in which the film chuck 13c is offset (isolated) from the fulcrum frame 13b. Thereby, since the single film F is film Since the chuck 13c is pulled again from both sides, the angle at which the film F is wound with respect to the fulcrum frame 13b is further increased, in other words, the end of the single film F held by the film chuck 13c is taken from the fulcrum frame 13b. (the fulcrum portion) is offset (away), and the single film F is pulled inside the fulcrum frame 13b, and the film tension between the fulcrum frames 13b is increased. At this time, the ratchet mechanism 13f shown in FIG. 3 is actuated, and the rotating lever 13d is held at the position after the rotation, so that the state in which the film tension of the opening of the rectangular frame 13a is closed is maintained.

In Fig. 6(D), the air suction operation is started from the air suction paths 6g1, 6g2 provided in the lower mold movable holder 6g, and the inner and outer circumferences of the single film F are suction-held along the lower mold cavity concave portion 6C. Since the single-piece film F is adsorbed and held in a state in which the film is stretched by the reinforced film, wrinkles can be effectively prevented from occurring.

Next, in Fig. 6(E), when the driving device (not shown) causes the pushing device 6j to temporarily retreat to the top and then retracts downward, the ratchet mechanism 13f (see Fig. 3) is released, so that the rotating lever 13d is close to The direction of the fulcrum frame 13b (the direction of the arrow) is rotated. At this time, the film chuck 13c is returned to the horizontal posture parallel to the clamping surface of the lower mold movable holder 6g. In this state, the holding of the film chuck 13c that grips the outer peripheral edge portion of the one-piece film F is released. According to this, the single-piece film F can be transferred while being held together with the particulate resin R and held in the lower mold 6B. In addition, in the above-described operation, the single-film F is contained in the state in which it is adsorbed and held by the cavity recess 6C by the lower mold movable gripper 6g. Therefore, even if the holding is released, the single-film F is not damaged. The adsorption is maintained in the state.

Next, as shown in FIG. 6F, the film carrier 11 is kept moving up from the press unit 5 while holding the film conveying device 13 (rectangular frame 13a). According to the above, the step of supplying the single-piece film F and the particulate resin R to the lower mold 6B is completed.

According to the above operation of supplying the single-piece film F to the molding die 6, the single-sheet film F can be supplied to the molding die 6 without wrinkles. Further, when the single-piece film F is carried into the molding die 6, the single-film F is elongated due to radiant heat, but the tension is again enhanced by the pushing device 6j (tension attachment mechanism) to prevent setting in the molding die 6. Wrinkles occur when a single film F is formed.

Next, an example of the resin molding operation following FIGS. 5 and 6 will be described with reference to FIG. 7.

In Fig. 7(A), as described above, the single film F and the particulate resin R are carried into the lower mold 6B by the film carrier 11.

In FIG. 7(A), a large-sized workpiece W (a rectangular panel, a rectangular substrate, or the like) having a side of 600 mm on each side is carried into the upper mold 6A by the panel carrier 10 (see FIG. 1), and is held by the upper mold. The air suction hole 6b of the surface 6a and the air suction path 6c are suction-held. At this time, the outer peripheral surface of the rectangular workpiece W is transferred to the upper mold 6A by pressing and holding the outer peripheral surface of the workpiece W by the workpiece holding pin 6d provided at the opposite position. Further, the rectangular workpiece W is passed through the workpiece holding pin 6d so that the outer peripheral surface of the workpiece W is uniformly pressed and centered by the workpiece holding pin 6d. Further, the loading of the single-sheet film F and the particulate resin R and the loading of the workpiece W may be performed simultaneously, and the single-film F and the particulate resin R may be carried after the workpiece W is carried.

Next, as shown in Fig. 7(B), the molding die 6 is closed. For example, the lower mold 6B is raised to sandwich the workpiece W between it and the upper mold 6A. Further, it is preferable that the mold space between the upper mold 6A and the lower mold 6B is closed to form a decompression space before the upper mold 6A and the lower mold 6B sandwich the workpiece W, and molded under a reduced-pressure atmosphere gas. Forming.

Next, by further clamping the molding die 6, the coil spring 6h is pushed, and the lower die movable gripper 6g moves similarly to the lower module 6e. Therefore, by lowering the height (depth) (lightening) of the cavity in the lower die cavity recess 6C, the workpiece W is immersed in the particulate resin R melted in the lower die cavity recess 6C and the resin pressure is increased to heat and pressurize the workpiece. . Fig. 7(C) shows a state in which the mold clamping operation of the molding die 6 is completed, and the workpiece W is immersed in the particulate resin R melted in the lower die cavity recessed portion 6C, and is heated and pressurized to be hardened (compressed and formed).

When the heat hardening in the molding die 6 is completed, the mold opening of the molding die 6 is performed. Here, the mold M is sucked and held by the upper mold clamping surface 6a of the upper mold 6A, and the single film F is sucked and held toward the lower mold holding surface including the lower mold cavity concave portion 6C, and the mold is opened. . Therefore, as shown in Fig. 7(D), in the state in which the mold is opened, the molded product M is sucked and held by the upper mold holding surface 6a of the upper mold 6A, and the single film F is included in the lower mold cavity. The lower mold clamping surface of the recessed portion 6C is in a state of being sucked and held. In this way, the mold M and the used single-piece film F are held in separate molds, and the steps of removing the molded product M from the press unit 5 to the respective storage/storage locations can be simplified.

Next, in Fig. 1, the molded product M is unabsorbed by the upper mold 6A and transferred to the panel carrier 10 (upper side). Also, already used The single-piece film F is transferred by the lower mold 6B by the panel carrier 10 (lower side). At this time, since the molded product M is transferred from the upper mold clamping surface 6a to the panel carrier 10, compressed air is ejected from the air suction hole 6b, and the single film F is transferred from the lower mold surface to the panel carrier 10, so It is preferable that the compressed air is ejected from the air suction paths 6g1 and 6g2. The molded product M is transferred from the panel carrier 10 to the robot arm 4a of the robot transfer device 4. The used single-piece film F is discharged from the panel carrier 10 toward the film recovery portion 12 and is recovered. The robot arm 4a holds the molded product M and carries it into a predetermined hardening furnace 3. The post-hardening of the molded product M is performed in the hardening furnace 3. Next, the molded product M is taken out from the hardening furnace 3 via the robot arm 4a, and all the steps for the workpiece W are completed and the manufacturing process of the molded product M is completed. Then, the molded product M is carried into the molded article storage unit 2, and the molded product M is stored.

According to the present embodiment, by using the film conveying device 13 that transports the above-described single-piece film F, the amount of film used can be reduced to reduce the running cost, and the molding quality of the molded article of a large size can be improved and the installation area can be suppressed.

Next, another example of the film conveying device will be described with reference to Figs. 8 and 9 .

The above embodiment describes a case where the rectangular workpiece W is resin-molded using a rectangular single-piece film F. The following description is directed to a circular workpiece W (for example, a semiconductor wafer, a circular or a ring-shaped carrier). The case where the resin resin M is supplied and the molded resin R supplied in a circular shape is conveyed together with the rectangular single-piece film F will be described.

In Fig. 9, the film conveying device 13 includes: a pair of annular film chucks 19a; a chuck holding portion 19b holding the film chuck 19a; and a slider 19c integrally coupled with the chuck holding portion 19b; And an annular fulcrum frame 19d in which the opening of the casing is covered by the rectangular single-piece film F.

In the fulcrum frame 19d, a flange portion 19e having a larger outer shape than the single-piece film F is formed at the upper end portion thereof. In the fulcrum frame 19d, the lower end outer corner portion is a fulcrum portion 19f which becomes a circumscribed shape and has a circular shape when tension is applied to the single film F. The upper portion of the fulcrum frame 19d is opened, and an inclined portion 19g having a larger opening toward the opening end in the plan view is formed (see FIG. 9). Further, instead of the fulcrum portion 19f, an annular fulcrum frame may be additionally provided at the lower end portion of the fulcrum frame 19d. Further, the slider 19c is slidably coupled to the flange portion 19e. A ratchet mechanism is provided on the slider 19c. The ratchet mechanism is allowed to move only in the upward direction before the slider 19c reaches a predetermined height with respect to the flange portion 19e. Therefore, the tension against the single-piece film F can be maintained. The slider 19c and the chuck holding portion 19b are provided at positions facing each other around the fulcrum frame 19d, for example, at four places. Further, the slider 19c and the chuck holding portion 19b may be provided in more than four places. Further, as the slider 19c, a screw shaft that is vertically disposed so as to pass through the chuck holding portion 19b and the flange portion 19e can be formed to raise and lower the chuck holding portion 19b (in other words, the film chuck 19).

An example of the supply operation of the molded resin R and the one-piece film F in the film conveying device 13 will be described with reference to Fig. 8 .

Similarly to Fig. 2(A), in the film supply unit 8 (see Fig. 1), the film F is drawn from the film roll 8a to the long film F on the stage 17, The single piece of film F is prepared by cutting the cutter 18 into a predetermined size (for example, each side is 800 mm). Next, a state in which a pair of annular film chucks 19a are vertically overlapped from the single film F is placed. In this case, for example, the film F is supplied in a state where the lower annular film chuck 19a is prepared on the outer side of the stage 17, and the upper annular film chuck 19a is overlapped. Next, as shown in Fig. 8(A), the fulcrum frame 19d of the film conveying device 13 is superposed on the cut single film F, and the film chuck 19a is placed at a position facing the radial direction. The outer peripheral edge portion is sandwiched by the chuck holding portion 19b at a total of four places (see Fig. 9).

Next, in Fig. 8(B), the drive pin (not shown) is actuated to raise the upper top pin 15, and the slider 19c and the chuck holding portion 19b are raised with respect to the fulcrum frame 19d. Therefore, the entire circumference of the single film F is pulled by the annular film chuck 19a, and the single film F is pulled apart with respect to the circular fulcrum portion 19f. In other words, the annular film chuck 19a is offset with respect to the circular fulcrum portion 19f. Therefore, the film tension increases in the circular region formed in the circular fulcrum portion 19f. In this case, the difference from the above embodiment is that the same tension is applied to the inner side of the circular fulcrum portion 19f. Further, at this time, the ratchet mechanism (not shown) is moved between the slider 19c and the flange portion 19e, and the film chuck 19a is held at the raised position. Therefore, it is maintained in a state in which a desired tension is applied to the single film F covering the opening of the frame of the fulcrum frame 19d.

In Fig. 8(B), the molded resin R (particulate resin) is supplied from the dispenser 9 (see Fig. 1) to the single film F covering the opening of the frame of the fulcrum frame 19d via the groove 16 in the same manner. . In this case, an example When the operation of dropping the mold resin R from the groove 16 is performed by moving only a predetermined distance in a predetermined direction to repeat the strip supply, the plurality of strip-shaped resin supply regions are arranged and combined to form a circular area. Resin supply area. In addition, as shown in FIG. 9, the inclined portion 19g whose opening end portion has a circular opening shape in the plan view is formed in the upper opening of the fulcrum frame 19d, and the molded resin R can be completely supplied without a gap.

The film conveying device 13 that supplies the granular resin R to the single-piece film F is conveyed toward the molding die 6 of the press unit 5 by the film carrier 11 holding the fulcrum frame 19d as shown in Fig. 8(C). In this case, since the single-piece film F is held in a state where a desired tension is applied between the fulcrum portions 19f, the deflection of the single-piece film F can be effectively prevented. In addition, in order to perform resin molding of the circular workpiece W, the molded resin R can be supplied and conveyed to form a circular shape on the rectangular single-piece film F. Therefore, even a circular workpiece W is molded by resin. In the case where the film is cut into a rectangular shape only in a desired size, the single film F can be easily prepared.

Next, another example of the film conveying device 13 will be described with reference to Fig. 10 . The same members as those in Fig. 2(B) are given the same reference numerals and the explanations are used. The film conveying device 13 shown in the same figure is weakly pressed toward the side of the single film F by the inner portion of the film conveying device 13 constituting the guiding member 13h1, thereby preventing the molding resin R from entering the film conveying device 13 and the single film. F gap.

Specifically, as shown in FIG. 10, on the inner peripheral surface side of the rectangular frame body 13a, the movable member 13h2 provided inside is combined with the guide member 13h1 provided in the outer side, and is mutually hooked.

A support member 13i is protruded from the radially inner side of the guiding member 13h1. A surface overlapping the guide member 13h1 of the movable member 13h2 is formed with a accommodating portion 13j that is hollowed out. The support member 13i is housed in the accommodating portion 13j. A pressing spring 13m is provided between the support member 13i and the film pressing portion 13k provided at the lower end portion of the movable member 13h2. By elastically attaching the pressing spring 13m, the movable member 13h2 is always attached in a direction protruding downward with respect to the guiding member 13h1.

Therefore, when the granular resin R is placed on the single-piece film F covering the opening (lower end opening) of the frame of the rectangular frame 13a, the tension applied to the single-film F is less likely to sag against the weight of the resin, even if it is minute. The gap is formed on the single-piece film F, and since the movable member 13h2 is projected to move in a manner similar to the guide member 13h1 and is buried in the gap on the single-piece film F, it is possible to effectively prevent, for example, a pellet-like molding. The resin R enters the gap.

Further, in the above-described embodiment, the case where the single film F is transferred and transferred to the lower die holding surface of the lower mold cavity recessed portion 6C of the molding die 6 is described, but the upper die may be formed. The upper mold clamping surface of the cavity recess conveys and transfers the single film F. In this case, the amount of use of the single film F can also be reduced to reduce the running cost. Similarly, only the single film F can be transferred and transferred to the lower mold clamping surface on which the lower mold cavity recess is formed. Further, the single film F may be supplied to both the upper mold and the lower mold in the same manner as described above.

Further, the molding die 6 has been described using a die for compression molding, but may be a die for transfer molding.

Further, the above-described film conveying devices 13 and 19 can be suitably used for resin molding a workpiece W having an arbitrary shape such as a circular outer shape or a rectangular outer shape. For example, in order to perform resin molding of the workpiece W having a rectangular outer shape by the configuration of the film conveying device 19, each of the portions which are formed in a circular shape or a ring shape in the above-described configuration may be rectangular, and the molding resin R may be supplied. The rectangular shape is formed into a rectangular shape, and the rectangular workpiece W is molded in a rectangular cavity.

Further, in addition to the configuration in which the tension is applied to the single-film F which is elongated by the radiant heat in the molding die 6 in addition to the above-described film conveying devices 13 and 19, the film conveying device 13 and 19 may be added before the supply of the molding die 6 And the composition of the increase. In this case, for example, even if it is necessary to preheat the resin which is difficult to convey and then carry out the conveyance, if the tension can be applied to the single film F when the molding resin R is supplied and preheated, the preheating can be eliminated. The single-sheet film F is transported after being loosened, and the resin that is difficult to transport refers to a powdery resin that causes the powdery resin to be scattered and scattered due to the flow of the ambient gas during transportation.

Further, the distribution unit Ud may be used in the above-described resin molding apparatus, or may be used as a single unit. In this case, a step of preparing the film conveying device 13 for holding the single film F to which a predetermined tension is applied is prepared in the dispensing unit Ud, and supplying the separately provided press unit Up to each film conveying device. In such a case, the effect of using the above-described dispensing unit Ud and the film conveying device 13 can also be obtained.

Further, it is also possible to perform resin molding on both sides of the workpiece W by, for example, inverting the workpiece W or the inversion portion 30 of the front and back surfaces of the molded article M. shape. In this case, the resin molding is performed on one surface of the workpiece W, and then returned to the workpiece processing unit Uw. After the molded product M is inverted by the inversion portion 30, the resin mold is applied to the other surface of the workpiece W (molded article M). Forming. Further, instead of the inverting unit 30, the robot transfer device 4 that can reverse the robot arm 4a can be formed.

8‧‧‧ Film Supply Department

8a‧‧‧ Film Roller

13‧‧‧ Film handling device

13a‧‧‧Rectangular frame

13b‧‧‧ pivot frame

13c‧‧‧film chuck

13d‧‧‧Rotary rod

13e‧‧‧Rotary axis

13g‧‧‧ inclined section

15‧‧‧Uploading

16‧‧‧ trench

17‧‧‧stage

18‧‧‧Tools

20‧‧‧ Film Drop Detection Department

R‧‧·Molded resin

F‧‧‧Single film

Claims (10)

A film transfer device that transports a single film for molding into a mold while maintaining tension, and the film transfer device is characterized in that it has a fulcrum frame that surrounds and surrounds the cavity recess a frame having a predetermined shape corresponding to the mold clamping surface is a fulcrum portion that applies tension to the single film that is held by the opening of the frame; and the film holding portion holds the outer side of the fulcrum frame An outer peripheral edge portion of the single-piece film; and an offset mechanism for shifting the film holding portion in a direction away from the fulcrum portion, wherein the film holding portion holds an outer peripheral edge portion of the single film and is opposite to the fulcrum The portion is offset and conveyed to the molding die together with the fulcrum frame and the single film in a state in which the desired tension is applied to the single film. The film transporting apparatus according to claim 1, wherein the molding resin for molding is carried on the single film to which the desired tension is applied, and is carried along with the fulcrum frame. The film transporting apparatus according to claim 1 or 2, wherein the film holding portion holds each side of the rectangular one-piece film. The film transporting apparatus according to claim 3, wherein the film holding portion is divided into a plurality of gripping portions by the respective sides of the single film. The film transfer device of claim 3, wherein the film holding portion is provided at an adjustable offset amount on each side of the single film. The film transporting apparatus according to claim 1 or 2, wherein the offset mechanism transmits the film gripping portion around the rotation axis of the housing, and the film gripping portion is separated from the fulcrum portion. The film transporting apparatus according to claim 6, further comprising a ratchet mechanism that allows the rotating member for holding the film holding portion to rotate only in a direction away from the fulcrum portion around the rotating shaft. A resin molding apparatus comprising: the film conveying device according to claim 1 or 2; and a film carrier that conveys the film conveying device to the molding die. The resin molding apparatus according to claim 8, further comprising: a tension applying mechanism that increases an offset amount of the film holding portion when the single piece film is carried into the molding die together with the fulcrum frame The tension generated by the offset mechanism toward the monolithic film is further enhanced. A film transporting method is carried out by applying a tension to a molding die in a state in which a tension is applied to a single film for molding, and the film transporting method is characterized by a predetermined corresponding to a die holding surface surrounding the cavity concave portion. In the frame of the shape, the outer side of the fulcrum frame which is a fulcrum portion is formed on the single film which is held by the opening of the frame, and the outer peripheral edge portion of the single film is held by the film holding portion. The film holding portion biases the outer peripheral edge portion of the single film to be offset from the fulcrum portion and gives the single piece In the state of the tension required for the film, the fulcrum frame and the monolithic film are conveyed together to the molding die.