JP4855329B2 - Electronic component compression molding method and apparatus - Google Patents

Description

  The present invention relates to an electronic component compression molding method and apparatus for compressing an electronic component such as an IC, and in particular, a resin material is supplied to a compression molding die for an electronic component mounted in an electronic component compression molding apparatus. About things.

  Conventionally, as shown in FIG. 12, an electronic component mounted on a substrate is compression-molded with a granular resin material (granular resin) using an electronic component compression molding device (electronic component compression molding die). (Resin sealing molding) is performed, but is performed as follows.

  That is, first, in an electronic component compression molding die (comprising an upper mold 102 and a lower mold 103) mounted on an electronic component compression molding apparatus 101, granules are placed in a lower mold cavity 105 covered with a release film 104. The resin 106 is supplied and melted by heating. Next, the upper and lower molds 102 and 103 are clamped, and the electronic component 122 mounted on the substrate 121 is immersed in the resin material heated and melted in the lower mold cavity 105. At the same time, by applying a required resin pressure to the resin in the lower mold cavity 105 at the cavity bottom surface member 107, the electronic component is compression molded into a resin molded body (product) corresponding to the shape of the lower mold cavity 105. ing.

Incidentally, as shown in FIG. 12, a resin material supply mechanism 108 is used to supply the granular resin 106 into the lower mold cavity 105 covered with the release film 104.
The resin material supply mechanism 108 is provided with a resin material supply portion 109 and a shutter 110 provided on the lower side of the resin material supply mechanism 108. When the resin material is supplied by the resin material supply mechanism 108, the shutter is provided. By pulling and opening 110, the granular resin 106 is dropped from the supply unit 109 and supplied into the lower mold cavity 105.

JP 2004-216558 A

However, when the granular resin 106 is supplied into the lower mold cavity 105 coated with the release film 104, the dropped granule falls due to the considerable drop distance between the resin material supply mechanism 108 and the surface of the lower mold cavity 105. The powder adhering to the resin 106 is likely to rise.
Further, for that purpose, the granular resin 106 or the powder adhered to the granular resin 106 is scattered on the release film 104 coated on the mold surface of the lower mold 103 or on the mold surface of the lower mold 103 not coated with the release film. Therefore, when both the upper and lower molds 102 and 103 are clamped, foreign matter (cured material) such as resin residue is easily formed on the mold surface of the lower mold 103 or the substrate 121.
That is, it is necessary to clean and remove the foreign matter adhering to the mold surface of the lower mold 103, and a defect occurs due to the foreign matter adhering to the molded substrate, resulting in poor product yield. Product productivity cannot be improved efficiently.
In addition, when the granular resin 106 is supplied by pulling and opening the shutter 110, a failure such as the granular resin 106 being caught by the shutter 110 and the shutter 110 not being operated occurs. The production by (molds 102 and 103) must be stopped, and the productivity of the product cannot be improved efficiently.
Therefore, when a resin molded body (product) is compression molded by an electronic component compression molding apparatus (molds 102 and 103), the product is efficiently produced due to the occurrence of foreign matter and the failure of the resin material supply mechanism 108 described above. There is a negative effect that the product cannot be produced and the productivity of the product cannot be improved efficiently.
Further, when the granular resin 106 is dropped and supplied from the supply unit 109 of the resin material supply mechanism 108 by pulling the shutter 110, a part 106a of the required amount of the granular resin 106 remains on the supply unit 109 side. In some cases, the required amount of the granular resin 106 cannot be efficiently supplied into the lower mold cavity 105, and the reliability of the granular resin 106 supplied into the lower mold cavity can be improved efficiently. There is a harmful effect that it cannot be done.
Further, when the granular resin 106 is supplied into the lower mold cavity 105, the required drop distance exists between the resin material supply mechanism 108 and the surface of the lower mold cavity 105. Becomes a non-uniform thickness (for example, it is formed in a convex shape or the like and does not have a uniform thickness), and the granular resin 106 cannot be efficiently supplied into the lower mold cavity 105 with a uniform thickness. There is a harmful effect.
In addition, since the granular resin 106 does not have a uniform thickness in the lower mold cavity 105, the granular resin 106 cannot be efficiently and uniformly melted in the lower mold cavity 105, and is heated in the lower mold cavity. Due to the occurrence of mamako (spatter) in the molten resin material, the quality and reliability of the resin molded product (product) that is compression-molded in the lower mold cavity 105 is lowered, and high quality There is an adverse effect that a highly reliable product cannot be obtained.

That is, an object of the present invention is to efficiently improve the productivity of a product (resin molded product) that is compression molded in a compression molding cavity.
Another object of the present invention is to efficiently improve the reliability of the resin material supplied into the compression molding cavity with respect to the amount of resin.
Another object of the present invention is to efficiently supply a resin material with a uniform thickness into a cavity for compression molding.
Another object of the present invention is to obtain a product of high quality and high reliability for a product (resin molded product) that is compression molded in a compression molding cavity.

An electronic component compression molding method according to the present invention for solving the technical problem described above corresponds to the shape of a mold cavity by using an electronic component compression molding die mounted on an electronic component compression molding apparatus. Supplying a required amount of resin material to the film recess of the release film having a resin recess for placing the resin, and fitting and setting the film recess that supplied the required amount of resin material in the mold cavity, An electronic component compression molding method for compressing and molding the electronic component in the resin molded body corresponding to the shape of the cavity in the cavity by immersing the electronic component in the resin in the mold cavity, A step of preparing the above-described release film in a required size, and a film recess for placing the resin corresponding to the shape of the cavity described above are provided in the above-described release film. Te forming a recess with a film, comprising the steps of introducing the required amount of resin material into a film recess of the concave portion with the film described above, the films of the resin material injected into the recess and planarize a uniform thickness A step of forming a resin material, a step of engaging a film with a recess on which the above-described resin material is placed by an inloader, and a film recess provided in the above-described film with a recess by the above-described inloader A step of transporting the above-described resin material into the above-described mold cavity by fitting and setting the above-described film recess in the above-described mold cavity; It is characterized by including .

  In addition, in the compression molding method of the electronic component according to the present invention for solving the technical problem described above, the resin material put into the film recess is vibrated and flattened to form a resin material having a uniform thickness. Including the step of:

  In addition, the electronic component compression molding method according to the present invention for solving the technical problem described above is a step of pressing and flattening the resin material put into the film recess to form a resin material having a uniform thickness. It is characterized by including.

  In addition, an electronic component compression molding method according to the present invention for solving the technical problem described above uses an electronic component compression molding die mounted on an electronic component compression molding apparatus to cover a release film. A required amount of resin material is supplied into the mold cavity, and an electronic component is immersed in the resin in the mold cavity, so that a resin molded body corresponding to the shape of the cavity is formed in the cavity. An electronic component compression molding method for compressing and molding an electronic component as described above, the step of preparing the mold release film in a required size, and placing a frame for resin injection on the mold release film A step of introducing a required amount of resin material into the resin input portion of the frame, a step of flattening a required amount of resin material in the resin input portion, and the above-described frame. Removing the film from the release film and leaving the flattened resin material on the release film, and a resin-containing plate on the flattened resin material on the release film A step of accommodating the flattened resin material in the resin accommodating portion of the plate, and fixing the mold release film to the plate. Forming the resin-accommodated plate, engaging the resin-accommodated plate with an inloader, and transporting and placing the resin-accommodated plate with the inloader to the mold cavity position described above. And by vacuuming from the mold cavity, the release film is moved and adsorbed and coated in the mold cavity. A step, when the adsorption coating process of the mold release film to the the mold cavity, characterized in that it comprises a step of supplying to said that the release film described above a resin material covering the mold cavity.

In addition, the electronic component compression molding method according to the present invention for solving the technical problem described above is characterized in that the resin material is a powdery resin material having a required particle size distribution.

  The electronic component compression molding method according to the present invention for solving the above technical problem is characterized in that the resin material is a granular resin material.

  The electronic component compression molding method according to the present invention for solving the above technical problem is characterized in that the resin material is a powdered resin material.

An electronic component compression molding apparatus according to the present invention for solving the technical problem includes at least an electronic component compression molding die, an upper die provided in the above-described die, and the upper die. A lower mold disposed oppositely, a compression molding cavity provided in the lower mold, a substrate set part for supplying a substrate on which the electronic component provided in the upper mold is mounted, and a resin material provided in the mold Is a compression molding apparatus for electronic parts equipped with heating means for heating and melting the film, and forming a film with a recess by forming a film recess corresponding to the shape of the cavity described above on a release film of a required size a film forming mechanism for, spigot which engaged a resin material supply means to inject a resin material into a film in the recess provided, a recess with a film having a film recess and placing the resin material into the release film described above And da, characterized in that the flattening means is provided for flattening the resin material to a uniform thickness in the films recess.

Further, an electronic component compression molding apparatus according to the present invention for solving the technical problem described above includes at least an electronic component compression molding die, an upper die provided in the aforementioned die, and the upper die. A lower mold disposed opposite to the above, a compression molding cavity provided in the lower mold, a substrate set portion for supplying a substrate on which the electronic component provided in the upper mold is mounted, and a resin provided in the mold An electronic component compression molding apparatus provided with a heating means for heating and melting a material, wherein a release film cutting mechanism is formed by cutting a release film of a predetermined size from a release film in a wound roll state. When a frame for resin turned to be placed on the above-mentioned release film, a resin material supply mechanism to introduce the resin material into the resin feeding section in the mounted frame in the above-mentioned release film, and the On release film A flattening means for flattening the resin material put in the frame, a resin containing plate for containing the resin material flattened by the release film, and a resin material flattened by the release film And an inloader for engaging the resin containing plate containing therein, and a vacuum drawing mechanism for adsorbing and covering the aforementioned release film on the above-mentioned cavity by evacuating from the inside of the above-mentioned compression molding cavity. Features.

  Also, in the compression molding apparatus for electronic parts according to the present invention for solving the above technical problem, the flattening means for flattening the resin material to a uniform thickness is a vibration flattening mechanism. And

  Further, in the compression molding apparatus for electronic parts according to the present invention for solving the above technical problem, the flattening means for flattening the resin material to a uniform thickness is a press flattening mechanism. And

That is, according to the present invention, there is an excellent effect that the productivity of a product (resin molding) that is compression-molded in the compression-molding cavity can be efficiently improved.
Further, according to the present invention, there is an excellent effect that the reliability of the resin material supplied into the compression molding cavity with respect to the resin amount can be improved efficiently.
Further, according to the present invention, there is an excellent effect that the resin material can be efficiently supplied into the compression molding cavity with a uniform thickness.
Further, according to the present invention, there is an excellent effect that a product with high quality and high reliability can be obtained for a product (resin molded body) that is compression-molded in a compression-molding cavity.

The present invention compression-molds (resin-sealing) an electronic component mounted on a substrate in a mold cavity using the electronic component compression-molding apparatus (electronic component compression-molding die) according to the present invention. It is.
That is, in the resin material distribution means provided in the compression molding apparatus for electronic parts, first, a film corresponding to the shape of the lower mold cavity (recessed part) provided in the mold (both upper and lower molds) at the required location of the release film. Forming the recesses to form a film with a recess (release film), and then putting the required amount of granular resin material (granular resin) into the film recesses and flattening the required uniformity It is possible to obtain a film with a recess (flattened resin mounting film) having a film recess in which a granular resin retained in a proper thickness is disposed and mounted.
Next, the flattened resin placement film is attached to the inloader and conveyed to the lower mold cavity position.
At this time, the flattened resin placement film (inloader) is moved between the upper and lower molds and moved downward so that the film concave portion of the film with concave portions is fitted and fitted (fitted set) to the lower mold cavity (concave portion). The film recess (release film) can be coated to fit the cavity surface.
Therefore, it is possible to shape-hold (hold) and supply a resin material having a uniform thickness flattened in the lower mold cavity via the film recess.
That is, a required amount of the flattened granular resin can be loaded into the lower mold cavity for each release film (for each film with a recess having a film recess).
Therefore, next, by clamping the upper and lower molds, by immersing the electronic components mounted on the substrate supplied and set in the upper mold substrate set in the resin material heated and melted in the lower mold cavity In the lower mold cavity, the electronic component can be compression molded into a resin molded body (product) corresponding to the shape of the cavity.

In addition, for example, a vibration flattening mechanism (vibration flattening action) or a press flattening mechanism (press flattening action) is used to flatten the resin material in the film concave portion of the film with concaves described above.
In addition, regarding the configuration in which the resin material is flattened and formed in a uniform thickness in the film recess of the film with recesses, for example, outside the mold before transfer by the inloader, at the time of transfer by the inloader, or in the cavity A flattening configuration can be employed when setting to.
Alternatively, for the above-described flattening configuration, for example, when the flattened resin material is slightly collapsed during conveyance by the inloader or when being set in the cavity, the auxiliary and fine correction It is possible to adopt a structure for flattening.

That is, according to the present invention, as described above, in the lower mold cavity that covers the film recess (release film) corresponding to the shape of the lower mold cavity, a required amount of the flattened granular resin is applied to the film recess. Can be loaded together.
That is, since a part of the granule resin does not remain on the resin material supply mechanism side and the entire amount of the granule resin can be supplied into the lower mold cavity, the granule resin supplied into the compression molding cavity In (resin material), there is an excellent effect that the reliability with respect to the resin amount can be improved efficiently.
Further, according to the present invention, as described above, since the required amount of the flattened granular resin can be loaded into the lower mold cavity together with the film recesses, the resin material can be uniformly distributed in the compression molding cavity. Thus, an excellent effect that it can be supplied efficiently is obtained.
Further, according to the present invention, as described above, since the required amount of flattened granular resin (with a uniform thickness of granular resin) can be loaded into the lower mold cavity together with the film recesses, The granular resin can be heated and melted uniformly in the cavity.
Therefore, high quality and high reliability can be achieved for products (resin molded products) that are compression molded in the cavity for compression molding. It has an excellent effect that it can obtain a product with a high performance.

Further, according to the present invention, since the present invention is configured as described above, it is possible to efficiently prevent the adverse effects as shown in the conventional example.
That is, according to the present invention, a part of the granule resin remains in the resin material supply mechanism, and that the occurrence of mamako or the like in the resin material to be melted by heating is generated on the lower mold surface and the substrate. It is possible to efficiently prevent the necessity of cleaning due to the adhering foreign matter, the decrease in yield, or the failure of the shutter due to malfunction.
Therefore, according to the present invention, there is an excellent effect that the productivity of a product (resin molded body) that is compression-molded in the compression-molding cavity can be efficiently improved.

Hereinafter, based on an example figure, Example 1 concerning the present invention is described in detail.
1 (1), FIG. 1 (2), FIG. 1 (3), FIG. 2 (1), FIG. 2 (2), and FIG. 2 (3) are provided in the electronic component compression molding apparatus according to the first embodiment. It is a distribution means of the resin material.
1 (1), FIG. 1 (2), and FIG. 1 (3) show the state of film formation in the distribution means, and FIG. 2 (1) shows the state of resin material input in the distribution means. 2 (2) shows the vibration flattened state of the resin material in the distribution means described above, and FIG. 2 (3) shows another press flattened state in the distribution means described above.
FIGS. 3A and 3B are inloaders provided in the electronic device compression molding apparatus according to the first embodiment.
4 (1), FIG. 4 (2), FIG. 5 and FIG. 6 show the electronic component compression molding apparatus (mold for electronic component compression molding) according to the first embodiment.

(Configuration of electronic parts compression molding equipment)
First, an electronic component compression molding apparatus (mold) 1 will be described with reference to FIGS. 4 (1), 4 (2), 5, and 6. FIG.
In other words, the electronic component compression molding apparatus 1 includes an electronic component compression molding die (resin sealing molding die for electronic components) and a pre-molding material such as an electronic component 5 in the mold (1). An inloader 2 that supplies both the mounted substrate 6 and a resin material (for example, a granular resin material 7 described later) simultaneously or separately, and an unloader (not shown) that takes out a molded substrate compression-molded by the mold (1). None) is provided.
The electronic component compression molding die provided in the apparatus 1 shown in the figure is composed of a fixed upper die 3 and a movable lower die 4 disposed opposite to the upper die 3. 4 includes heating means (not shown) for heating the molds 3 and 4 to a required temperature, and mold clamping means (not shown) for clamping the molds 3 and 4 with a required clamping pressure. Is provided.
The mold surface of the upper mold 3 is provided with a substrate setting portion 8 for supplying and setting a substrate (substrate before molding) 6 on which the electronic component 5 is mounted with the electronic component 5 facing downward. The mold surface of the mold 4 is configured by being provided with a lower mold cavity 10 (cavity recess) for compression molding having a cavity opening 9 opened upward.
The bottom surface of the lower mold cavity 10 is provided with a cavity bottom member 11 that presses the resin (7) in the cavity 10 upward.

That is, first, the substrate 6 is supplied and set to the substrate setting portion 8 of the upper mold 3 with the electronic component 5 facing downward, and a granular resin material (granular resin is placed in the cavity 10 of the lower mold 4. ) 7 and the upper and lower molds 3 and 4 are clamped at a required clamping pressure to immerse the electronic component 5 in the resin material heated and melted in the lower mold cavity 10. it can.
Therefore, next, the resin in the lower mold cavity 10 is pressed by the cavity bottom member 11, thereby applying a required resin pressure to the resin in the lower mold cavity 10 and the shape of the cavity 10 in the lower mold cavity 10. The electronic component 5 can be compression molded (resin sealing molding) in the resin molded body 12 corresponding to the above.

Although not shown in the required portion of the lower mold cavity 10 surface or the required portion of the lower mold surface, a required number of suction holes (including a vacuum path such as a vacuum tube), A cavity evacuation mechanism such as a vacuum pump for forcibly sucking and exhausting air from the suction hole and evacuating it is provided.
Therefore, the cavity vacuuming mechanism forcibly sucks and exhausts air from the lower mold cavity 10 through the suction holes and evacuates it, so that a film 15 with a recess (separated) (described later) is placed in the lower mold cavity 10. The film recess 14 of the mold film 13) is sucked and matched and fitted (fitting set), and the film recess 14 (flattened granule resin 7) can be supplied into the lower mold cavity 10. It is configured.

(Resin distribution method)
In addition, a resin material distribution means (base) 21 for distributing the granular resin 7 to a film recess 14 of a film 15 with a recess to be described later is provided outside the molds 3 and 4 in the molding apparatus 1 described above. Has been.
Further, as will be described later, a resin material distribution means (base) 21 provided in the molding apparatus 1 (outside the molds 3 and 4) includes a film molding mechanism 22 and a resin material charging mechanism 23. And a vibration flattening mechanism (not shown) of the base.
Therefore, as will be described later, first, the film forming mechanism 22 forms the film recess 14 for placing the resin corresponding to the shape of the cavity 10 on the release film 13 having the required size, and then the resin material. A required amount of the granular resin 7 is metered and supplied into the film recess 14 by the feeding mechanism 23, and then the required amount of the granular resin 7 supplied into the film recess 14 is vibrated by the vibration flattening mechanism of the base. By flattening, the required amount of granular resin 7 in the film recess 14 can be shaped and formed in a uniform thickness [FIGS. 1 (1) and 1 (2). FIG. 1 (3), FIG. 2 (1), FIG. 2 (2), and FIG. 2 (3)].

(About film forming mechanism)
1 (1), 1 (2), and 1 (3), as described above, the resin material distribution means 21 includes a release film 13 having a required size and a lower mold cavity. A film forming mechanism 22 for forming a film recess 14 for resin placement corresponding to the shape of 10 to form a film 15 with a recess is provided.
Further, as shown in FIGS. 1 (1), 1 (2), and 1 (3), the film forming mechanism 22 is provided with a die 24 for supplying and forming a release film 13 (a common receiving set). And a pressing punch 25 for press-molding the release film 13, and the die 24 is installed on the base 21.
The die 24 on the base 21 includes a die recess 26 for forming a film having a recess shape corresponding to the shape of the lower mold cavity 10, and a die forming surface of the release film 13 provided on the upper surface of the die 24. 27 is provided.
Therefore, in the film forming mechanism 22, the release film 13 having a required size is supplied and set on the forming surface 27 of the die 24 and pressed by the punch 25, so that the die recess 26 is formed at a required portion of the release film 13. It is comprised so that the corresponding film recessed part 14 can be shape | molded (so-called press molding).
Further, after the film forming mechanism 22 is formed, the formed film recess 14 remains in a state of being disposed (set) in the recess 26 of the die 24 (receiving set base). ing.
Therefore, the die 24 is configured to be a common receiving set base 24 on which the film 15 with recesses (film recess 14) is disposed, and thereafter used for charging a resin material and engaging with an inloader. It is configured.
Further, since the film recess 14 formed in the film 15 with recesses corresponds to the lower mold cavity 10 (recess), the film recess 14 can be matched and fitted to the shape of the lower mold cavity 10. It is configured as follows.
Therefore, as will be described later, the film 15 with recesses having the film recesses 14 supplied with the granule resin 7 is conveyed to the molds 3 and 4 so that the film recesses 14 of the film 15 with recesses are fitted and fitted into the lower mold cavity 10. By mounting, the film recess 14 (with the flattened shape-retaining granule resin 7 disposed and placed) can be adsorbed into the lower mold cavity 10 and supplied.
Note that the film recess 14 extends due to suction by evacuation in the lower mold cavity 10, and may be slightly smaller than the shape of the lower mold cavity 10.

In the film forming mechanism 22 described above, although not shown, for example, a required die suction hole and air are forcibly sucked and discharged from the molding surface 27 including the concave portion 26 of the die 24. A configuration in which a die vacuuming mechanism such as a vacuum pump for vacuuming is provided can be employed.
Accordingly, the release film 13 having a required size is supplied and set on the molding surface 27 of the die 24 and air is forcibly sucked and discharged from the die suction hole, whereby the die recess 26 is formed at a required portion of the release film 13. The film recess 14 corresponding to the shape is formed so that the film 15 with recesses can be formed (so-called pressure forming).

(Resin material input mechanism)
Further, as described above, the resin material distribution means 21 is provided with the resin material charging mechanism 23 that measures and supplies a required amount of the granular resin 7 into the film recess 14 in the film 15 with recesses. Has been.
Therefore, as shown in FIG. 2 (1), the resin material supply mechanism 23 forms a required amount of granular resin in the film recess 14 of the recessed film 15 formed and set by the recess of the receiving set 24. 7 is configured so that it can be metered in.
The base 21 may be provided with a base resin material measuring mechanism (not shown) for measuring the granular resin 7 supplied to the film recess 14 integrally with the film 15 with the recess.
Accordingly, the granular resin 7 supplied to the film recess 14 can be measured integrally with the film 15 with recesses by using the resin material measuring mechanism of the base.

(About vibration flattening mechanism of base)
Further, although not shown, the molding apparatus 1 is provided with a vibration flattening mechanism (excitation flattening mechanism) for the base that vibrates the base 21 (for example, in the horizontal direction or the vertical direction). Is configured.
That is, as shown in FIG. 2 (2), the film of the recessed film 15 set on the receiving set base 24 on the base 21 by vibrating the base 21 by the vibration flattening mechanism of the base. The granule resin 7 in the recess 14 can be vibrationally flattened, and the granule resin (flattened shape-retaining granule resin) 7 having a required uniform thickness can be retained and formed in the film recess 14. It is configured as follows.
Accordingly, the flattened shape-retaining granule resin 7 can be arranged and placed in the film recess 14, and the film 15 with the recess having the film recess 14 and the flattened film in the film recess 14 are flattened. The flattened resin placement film 16 can be constituted by the shape-retaining granule resin 7.

As shown in FIG. 2 (3), the film is formed by pressing a required amount of the granule resin 7 placed in the film recess 14 disposed in the recess 26 of the receiving set 24 with a pressing flat tool 28. The structure which forms the granular resin 7 in the recessed part 14 in uniform thickness is employable.
That is, by pressing the required amount of granular resin 7 supplied into the film recess 14 disposed in the recess 26 of the receiving table 24 with the pressing flat tool 28, the required amount of granule resin in the film recess 14. 7 can be flattened to have a uniform thickness.
Therefore, the shape-retaining granular resin 7 can be formed by the pressing flat tool 28 in the film recess 14, and the flattened resin placement film 16 can be formed.
In addition, you may use "a spatula" as a means to planarize the above-mentioned granular resin 7. FIG.

(About inloader)
In other words, as described above, the molding apparatus 1 is provided with the inloader 2 (resin material supply mechanism) for supplying the granular resin 7 to the molds 3 and 4.
The inloader 2 includes, for example, a plate-shaped inloader body 31 and a release film suction fixing means (not shown) provided on the lower surface 32 of the inloader body 31, and the recessed film 15. The inloader main body 31 is configured to be able to be attached to the lower surface 32 by being sucked and fixed.
Further, although not shown in the drawings, the structure of the release film suction fixing means is a required inloader suction hole provided in the lower surface 32 of the inloader main body 31 and a vacuum for forcibly sucking and discharging air for vacuuming. An in-loader evacuation mechanism such as a pump, and a vacuum path such as a vacuum tube connecting the in-loader suction hole and the in-loader evacuation mechanism in communication with each other.
Therefore, air is forcibly sucked and discharged from the inloader suction hole (the lower surface 32 side of the inloader body 31) through the vacuum path by the inloader vacuuming mechanism, whereby the flattening resin placement film 16 (film 15 with a recess) is removed. It is configured so that it can be fixedly attached to the lower surface 32 of the main body 31 by suction.

Although not shown, the inloader body 31 is provided with a vibration flattening mechanism (excitation flattening mechanism) for the inloader that vibrates the inloader body 31.
Accordingly, the film 15 with the concave portion having the film concave portion 14 into which the granular resin 7 is charged is sucked and attached to the inloader 2 (the lower surface 32 of the main body 31), and the granular resin 7 in the film concave portion 14 is removed by the vibration flattening mechanism. By making it vibrate, the granular resin 7 in the film recess 14 can be flattened and formed to have a uniform thickness.
That is, the granular resin 7 put in the film recess 14 of the film 15 with recesses is vibrated by the inloader vibration flattening mechanism when transported by the inloader 2 by the resin material feeding mechanism 23, thereby The granule resin can be flattened (for example, from a convex shape) to efficiently retain and form a uniform thickness.
As for the vibration flattening at the time of conveying the granular resin 7 in the film recess 14, for example, the granular resin 7 formed in a uniform thickness on the receiving set table 24 described above collapses at the time of inloader conveyance and is not uniform. It can be adopted even when the thickness is reduced.

(Distribution of resin materials in electronic component compression molding methods)
First, a film 15 with a recess having a film recess 14 using a film forming mechanism 22 provided in a resin material distribution means (base 21) shown in FIGS. 1 (1), 1 (2), and 1 (3). Will be formed.
That is, first, as shown in FIG. 1 (1), a release film 13 having a required size is supplied and set on a die 24 provided on a base 21, and then, as shown in FIG. 1 (2). By pressing with a pressing punch 25, a film recess 14 is formed at a required portion of the release film 13 with a die recess 26 for film formation provided on the die 24, as shown in FIG. Thus, the concave film 15 (release film 13) can be formed.
Further, since the shape of the recess 26 provided in the die 24 is formed corresponding to the shape of the lower mold cavity 10, the shape of the film recess 14 formed by the die recess 26 is the shape of the lower mold cavity 10. It becomes a thing corresponding to.
Therefore, since this film recess 14 can be fitted and fitted (fitting set) by fitting to the mold cavity (recess) 10, the film 15 with the recess provided with this film recess 14 is placed in the lower mold cavity 10. The surface of the lower mold cavity 10 can be coated by being set to supply.

In addition, it can replace with the film shaping | molding by the film shaping mechanism 22 shown to FIG. 1 (1), FIG. 1 (2), and FIG. 1 (3), and the structure using only the die | dye 24 is employable.
That is, first, the release film 13 is supplied and set on the molding surface 27 of the die 24, and air is forcibly sucked and discharged from the die suction hole provided in the die recess 26, and the vacuum is drawn. The film recess 14 corresponding to the above may be formed to form the recessed film 15 (so-called pressure forming).

Next, as shown in FIG. 2 (1), a required amount of granular resin 7 is set in the die recess 26 using the resin material feeding mechanism 23 provided in the resin material distribution means (base 21). It can be put into the film recess 14 of the attached film 15.
Next, as shown in FIG. 2 (2), by vibrating the base 21 (die 24, film 15 with recesses) with a vibration flattening mechanism and applying vibration to the granular resin 7 in the film recesses 14, The granular resin 7 can be flattened in the film recess 14 to efficiently retain and form a uniform thickness.
That is, it is possible to efficiently obtain a film with recesses (flattened resin placement film 16) including the film recesses 14 supplied with the granular resin 7 having a uniform thickness.
Therefore, it is possible to efficiently form the granule resin 7 (flattened shape-retaining granule resin) having a uniform thickness in the film recess 14 by the vibration flattening mechanism.

Instead of the configuration using the vibration flattening mechanism shown in FIG. 2 (2), a configuration using the pressing flat tool 28 shown in FIG. 2 (3) may be adopted.
Therefore, the granule resin 7 is flattened in the film concave portion 14 by pressing the granular resin 7 in the film concave portion 14 of the film 15 with concave portions set in the die concave portion 26 with the pressing flat tool 28 so as to have a uniform thickness. It can be formed efficiently.

(Conveying resin materials in the compression molding method for electronic parts)
Next, as shown in FIGS. 3 (1), 3 (2), 4 (1), and 4 (2), the granular resin 7 having a uniform thickness is disposed in the inloader 2. A film 15 with a recess (flattened resin mounting film 16) having a film recess 14 placed thereon can be attached and conveyed to the molds 3 and 4.
That is, first, as shown in FIG. 3A, by moving the inloader downward, the film with recesses (flattened resin placing film 16) set on the receiving set base 24 is moved to the inloader 2 (the lower surface of the main body 31). 32), and then, as shown in FIG. 3 (2), the inloader 2 is moved up in a state where the film 15 with recesses is fixed to the inloader 2 (on the lower surface 32 side). The film 15 with recesses (flattened resin mounting film 16) including the film recesses 14 on which the granular resin 7 having a uniform thickness is disposed and mounted can be attached to the inloader 2.
Next, as shown in FIG. 4 (1), the inloader 2 to which the flattening resin mounting film 16 (film 15 with recesses) is attached is conveyed to the position of the lower mold cavity 10.
At this time, the inloader 2 with the flattening resin placement film 16 attached is moved between the upper and lower molds 3 and 4 and moved downward to directly move the inloader 2 to the mold surface (cavity 10 position) of the lower mold 3. Will be placed and joined.
Therefore, next, as shown in FIG. 4 (2), the film recess 14 of the film 15 with recesses is directly matched and fitted (fitting set) to the lower mold cavity 10 (recess), and the inloader 2 is used. The inloader 2 is moved upward by unlatching the flattening resin placement film 16 (film 15 with a recess).
At this time, as described above, the film recess 14 formed with the flattened granule resin 7 is fitted and fitted into the lower mold cavity 10 to directly cover the film recess 14 on the surface of the lower mold cavity 10. Therefore, the concave film 15 can be coated on the mold surface of the lower mold 4 including the lower mold cavity 10.
Accordingly, the required amount of the flattened granule resin 7 (the granule resin having a uniform thickness which is retained in shape) is directly applied to the lower mold cavity 10 covered with the film recess 14 (release film 13). Reliable and efficient supply is possible.

(About compression molding in electronic component compression molding method)
Next, as shown in FIGS . 5 and 6, the electronic component 5 mounted on the substrate 6 in the lower mold cavity 10 can be compression-molded (resin-sealed molding).
That is, first, as shown in FIG. 5, a film 15 with a recess (release film) is formed on the mold surface of the lower mold 4 including the surface of the lower mold cavity 10 (by releasing the engagement of the inloader 2 as described above). 13), and a required amount of the flattened granular resin 7 can be directly and surely and efficiently retained and supplied into the cavity 10 covered with the film recess 14.
Therefore, next, as shown in FIG. 6, the granular resin 7 having a uniform thickness supplied into the cavity 10 covered with the film recess 14 is heated and melted to clamp the upper and lower molds 3 and 4. Thus, the electronic component 5 mounted on the substrate 6 supplied and set to the upper mold 3 is immersed in the resin material heated and melted in the lower mold cavity 10.
At this time, a required resin pressure can be applied to the resin in the lower mold cavity 10 by pressing the resin in the lower mold cavity 10 with the cavity bottom surface member 11.
After the time required for curing has elapsed, the upper and lower molds 3 and 4 are opened to compress the electronic component 5 mounted on the substrate 6 into a resin molded body 12 corresponding to the shape of the lower mold cavity 10 ( Resin sealing molding).

(About the effects in the compression molding method of electronic parts)
That is, as described above, by supplying and setting the flattening resin placement film 16 to the lower mold 4 including the cavity 10, the film concave portion 14 of the film 15 with the concave portion is directly connected to the lower mold cavity 10 (concave portion). It can be mated and fitted (fitting set).
Further, in a state where the film recess 14 of the film 15 with a recess (release film 13) is coated in the lower mold cavity 10, the granular resin 7 having a uniform thickness of the required amount is directly applied to the lower mold cavity 10. In addition, the shape can be reliably and efficiently supplied (see FIGS. 4 (1), 4 (2), and 5).
Therefore, according to the first embodiment, it is possible to efficiently prevent the granular resin from being formed into a convex shape or the like in the lower mold cavity as in the conventional example. (Resin material) can be efficiently supplied with a uniform thickness.
Further, as described above, the granular resin 7 having a required amount of uniform thickness can be directly and surely supplied efficiently into the lower mold cavity 10.
Therefore, according to the first embodiment, it is possible to efficiently prevent the granular resin from remaining on the resin material supply mechanism side as in the conventional example, so that the resin material 7 supplied into the lower mold cavity 10 can be prevented. Reliability with respect to the amount of resin can be improved efficiently.
Further, as described above, since the granule resin 7 having a required amount of uniform thickness can be directly and surely supplied efficiently into the lower mold cavity 10, the granule resin 7 is contained in the lower mold cavity 10. Can be uniformly melted by heating.
Therefore, according to the first embodiment, as in the conventional example, it is possible to efficiently prevent the occurrence of mamako in the resin material heated and melted in the lower mold cavity 10, and the electronic component mounted on the substrate 6 can be prevented. 5 can be compression-molded in the resin molded body 12 (product), so that a product with high quality and high reliability can be obtained for the product (resin molded body 12) that is compression-molded in the cavity 10. .

Further, as described above, the indenter 2 is directly placed and bonded to the mold surface (the position of the cavity 10) of the lower mold 3, so that the film recess 14 in which the flattened granular resin 7 is formed is formed in the lower mold cavity 10 ( It can be directly matched and fitted in the recess).
Therefore, according to Example 1, as in the conventional example, when the granular resin is dropped and supplied, it is efficiently prevented that the granular resin or powder is scattered and adhered to the lower mold surface or the substrate to form foreign matters. Therefore, it is possible to efficiently remove the foreign matter adhered and formed on the mold surface by cleaning and to prevent the product yield from being deteriorated due to the foreign matter adhered to the molded substrate. The productivity of 12) can be improved efficiently.
Further, as described above, the film recess 14 in which the flattened granule resin 7 is formed is directly matched and fitted into the lower mold cavity 10 (recess) to supply and set the granule resin 7 in the lower mold cavity 10. be able to.
Therefore, according to the first embodiment, it is possible to efficiently prevent the occurrence of a failure such as the shutter not being activated when the granular resin is dropped and supplied as in the conventional example, and the product (resin molded body 12) Productivity can be improved efficiently.

Further, in Example 1, the granular resin 7 retained by applying vibration to a uniform thickness in the lower mold cavity 10 is mainly transmitted through the film recess 14 (release film 13). The heat of conduction from the surface of the mold cavity 10 is heated and melted sequentially and evenly from the lower side to the upper side.
In this case, since there are communication holes between the granule resins 7 as the shape-retaining granule resin 7, air and moisture contained in the individual granules 7 themselves are released through the communication holes.
Therefore, it is possible to efficiently prevent the generation of voids (bubbles) inside the resin molded body that is compression-molded in the lower mold cavity 10.

(About flattening of resin material in the compression molding method of electronic parts)
That is, in the first embodiment, as described above, in the resin material distribution means 21, first, the film forming mechanism 22 is used to form the film 15 with the recesses having the film recesses 14, and then the resin material input mechanism 23. Then, the granule resin 7 is put into the film recess 14 and, further, the granule resin 7 in the film recess 14 is vibrated by the vibration flattening mechanism (or pressed by the pressing flat tool 28). Exemplifies a configuration in which the granular resin 7 can be flattened (for example, from a convex shape) so as to have a uniform thickness.
In short, the structure in which the granular resin 7 flattened outside the molds 3 and 4 is held before being conveyed by the inloader 2 is illustrated.
Furthermore, in Example 1, the granular resin 7 put in the film concave portion 14 is vibrated by the inloader vibration flattening mechanism when transported by the inloader 2, so that the granular resin 7 in the film concave portion 14 is obtained. It is possible to adopt a configuration that can be flattened and efficiently shaped and formed to have a uniform thickness.
In Example 1, when the granular resin 7 charged in the film recess 14 is supplied and set to the lower mold cavity 10, the granule resin 7 is vibrated by the in-loader vibration flattening mechanism, so that the required amount of granules in the film recess 14 is obtained. A configuration in which the resin 7 is planarized and efficiently formed to have a uniform thickness can be employed.
It should be noted that the vibration flattening at the time of conveying the granular resin 7 in the film recess 14 and the vibration flattening at the time of setting the supply of the granular resin 7 into the lower mold cavity 10 by the inloader 2 are performed by the inloader 2. When the granular resin 7 is slightly collapsed and has a non-uniform thickness during transportation (when the flatness of the granular resin is slightly impaired), it can be used as an auxiliary and fine correction.

Next, Example 2 will be described with reference to FIGS. 7 (1) and 7 (2).
Further, the basic configuration of the electronic component compression molding apparatus [electronic component compression molding die (see FIG. 5 etc.)] shown in FIGS. 7A and 7B is shown in the first embodiment. Since it is the same as an apparatus, it attaches | subjects the same code | symbol.
That is, in the apparatus 41 shown in FIGS. 7A and 7B, the uniform thickness flattened on the lower mold 4, the lower mold cavity 10, the cavity bottom member 11, and the film recess 14 is obtained. The inloader 42 to which the film 15 with recesses (flattened resin placement film 16) formed with the granular resin 7 is attached is shown.
Further, the inloader 42 has an inloader body 44 having a through hole 43 and a resin scattering prevention lid member 45 that is closed with the through hole 43 closed (in this example, the lid member 45 is fitted in the through hole 43). Is in a state of being).
Further, similarly to the first embodiment, the lower surface 46 of the main body 44 of the inloader 42 is provided with suction holes for the inloader 42, and the flattened resin placement film 16 ( The concave film 15) can be adsorbed and engaged.
The inloader 42 including the lid member 45 according to the second embodiment is used when a plurality of required electronic components are collectively compression-molded in the lower mold cavity 10 (when the surface of the lower mold cavity 10 is wide). Can do.

Further, when the flattening resin placement film 16 is engaged by the inloader 42, a required interval S is provided between the lower surface 47 of the lid member 45 and the upper surface of the flattened granular resin 7. Yes.
Accordingly, when the flattening resin placement film 16 is attached by the inloader 42, the lower surface 47 of the lid member 45 and the upper surface of the granular resin 7 are configured to be in a non-contact state. It is possible to efficiently prevent the granular resin 7 from adhering to the lower surface 47.
For example, in the case of Example 1, when the flattening resin mounting film 16 is engaged with the inloader 2, the granular resin 7 in the film recess 14 comes into contact with the lower surface 32 of the inloader body 31, and the granular resin is placed on the inloader 2 side. 7 (or powder) may adhere.
However, in the second embodiment, as described above, since the required interval S is provided between the lower surface 47 of the lid member 45 and the upper surface of the flattened granular resin 7, the lower surface 47 of the lid member 45 is provided. In addition, it is possible to efficiently prevent the granular resin 7 from adhering.
The lower surface 47 of the lid member 45 corresponds to the lower surface 32 of the main body 31 of the inloader 2 shown in the first embodiment.

That is, as in the first embodiment, first, as shown in FIG. 7A, the planarizing resin mounting film 16 (granular resin 7 having a uniform thickness) is fastened to the inloader 42 to move up and down. Next, the indenter 42 can be moved downward to fit and fit the film recess 14 into the lower mold cavity (recess) 10 as shown in FIG. 7 (2). .
Next, in the same manner as in the first embodiment, the electronic component mounted on the substrate (6) in the lower mold cavity 10 in which the film load with concave portion 15 is disengaged by the inloader 42 and the film concave portion 14 is (adsorbed) coated. (5) can be compression molded into the resin molded body (12).
Accordingly, in the same manner as in the first embodiment, the inloader 42 (granular resin 7 having a uniform thickness) can be transported to the position of the lower mold cavity 10 and compression-molded. Can be obtained.

Next, Example 3 will be described with reference to FIGS. 8 (1) and 8 (2).
The basic configuration of the electronic component compression molding apparatus [electronic component compression molding die (see FIG. 5 etc.)] shown in FIGS. 8 (1) and 8 (2) is shown in the first embodiment. Since it is the same as an apparatus, it attaches | subjects the same code | symbol.

That is, in the apparatus 51 shown in FIGS. 8 (1) and 8 (2), the lower mold 4, the lower mold cavity 10, the cavity bottom member 11, and the concave portion with the granular resin 7 formed on the film concave portion 14 are provided. An inloader 52 with a film 15 attached thereto is shown.
The inloader 52 includes an inloader body 54 having a through-hole 53, a press flattening mechanism 55 for pressing and flattening the granule resin 7 in the film recess 14, and a film with recesses in which the granule resin 7 is formed in the film recess 14. The film fixing tool 57 which fixes 15 to the lower surface 56 of the inloader main body 54 is provided.
The press flattening mechanism 55 includes a press flattening member 58 that slides in the through hole 53 so as to be movable up and down, and an elastic member 59 such as a spring provided between the inloader body 54 and the press flattening member 58. And is configured so that the granule resin 7 in the film recess 14 can be pressed and flattened by the pressing surface of the pressing flattening member 58 so as to be shaped and formed to have a uniform thickness. Yes.
In addition, you may comprise the resin release layer 60 which has the mold release property with respect to resin, such as Teflon (trademark), for example in the press surface in the press planarization member 58.
Moreover, the structure which pulls the film 15 with a recessed part to the lower surface 56 of the inloader main body 54 with a required tensile force, and is engaged with the inloader 52 (lower surface 56 of the main body 54) can be employ | adopted.

That is, as in Example 1, first, as shown in FIG. 8 (1), a film 15 with a recess in which a granule resin 7 is placed and formed in a film recess 14 is engaged with an inloader 52 to form both upper and lower molds ( 4), then, as shown in FIG. 8 (2), the inloader 52 can be moved downward to fit and fit the film recess 14 into the lower mold cavity (recess) 10.
At this time, the granule resin 7 in the cavity 10 is flattened by pressing the granule resin 7 in the cavity 10 covered with the film recess 14 by the press flattening mechanism 55 (press flattening member 58). It can be shaped and formed with a uniform thickness.
Next, in the same manner as in the first embodiment, the electronic component mounted on the substrate (6) in the lower mold cavity 10 in which the film load with concave portion 15 is disengaged by the inloader 52 and the film concave portion 14 is (adsorbed) covered. (5) can be compression molded into the resin molded body (12).
Therefore, in the same manner as in Example 1, the granular resin 7 placed and formed in the film recess 14 of the film 15 with recesses is covered with the film recess 14 by fitting and fitting in the lower mold cavity 10 with the inloader 52. The granule resin 7 in the cavity 10 is pressed and flattened, and the electronic component (5) mounted on the substrate (6) in the cavity 10 can be compression molded into the resin molded body (12). The same effects as those of the first embodiment can be obtained.

First, the granular resin 7 is introduced into the film recess 14 of the recessed film 15 formed (or installed) by the receiving set shown in Example 1 by the resin material input mechanism 23, and then the operation is performed. When the recessed film 15 into which the granule resin 7 is introduced is engaged with the inloader 52 shown in Example 3, the granule resin 7 in the film recess 14 is pressed by the press flattening mechanism 55 (press flattening member 58). (For example, from a convex shape) can be adopted to adopt a configuration that is flattened to form a uniform thickness.
In Example 3, when the granular resin 7 engaged by the inloader 52 is conveyed, the granular resin 7 in the film recess 14 is pressed by the pressing flattening mechanism 55 (pressing flattening member 58) ( For example, it is possible to adopt a configuration in which the surface is flattened (from a convex shape) to have a uniform thickness.
In Example 3, when the granular resin 7 engaged with the inloader 52 is transported, or when the granular resin 7 is supplied and set in the lower mold cavity 10 with the inloader 52, the film concave portion of the film with concave portion 15 is provided. When the granule resin 7 flattened in 14 is slightly collapsed, the granule resin 7 in the film recess 14 is pressed by the press flattening mechanism 55 (press flattening member 58), so that it is supplementary and fine. A configuration for flattening in a corrective manner can be employed.

Next, FIGS. 9 (1), 9 (2), 9 (3), 10 (1), 10 (2), 10 (3), 11 (1), and 11 (2). Example 4 will be described with reference to FIG.
9 (1), FIG. 9 (2), and FIG. 9 (3) show resin material distribution means, and FIG. 10 (1), FIG. 10 (2), and FIG. 10 (3) show inloaders. 11 (1) and FIG. 11 (2) show an electronic component compression molding apparatus (electronic component compression molding die).
Moreover, in the figure example explaining Example 4, the same code | symbol is attached | subjected to the same structure as the basic composition shown in each above-mentioned Example.
In addition, unlike Example 1-3 mentioned above, Example 4 is a structure which does not shape | mold a film recessed part (14) in the release film 13 before supply of the granular resin material (granule resin) 7. FIG.
Further, when the flattened shape-retained granule resin 7 is supplied to the lower mold cavity 10 with the flattened shape-retained granule resin 7 placed on the release film 13, a vacuum is drawn from the lower mold cavity 10. Then, by forming a required portion of the release film 13 on the inner surface of the lower mold cavity 10 by suction coating, a recess equivalent to the film recess (14) corresponding to the shape of the lower mold cavity 10 is formed on the release film 13. is there.

(Configuration of electronic parts compression molding equipment)
In the electronic component compression molding apparatus 61 shown in the fourth embodiment, as in the first to third embodiments, the electronic component compression molding mold [fixed upper mold (see FIGS. 5 and 6) and the lower moving lower mold are used. 4], and a release film cutting mechanism (illustrated) for cutting and forming the release film 13 having a planar shape of a required size from the release film in a wound roll state. None) is provided.
In addition, outside the mold (4) in the molding apparatus 61 described above, the granule resin 7 is put on the release film 13 having a planar shape of a required size and flattened, whereby the release film 13 A resin material distribution means (base) 62 for distributing the granular resin 7 is provided on the flattened shape-retaining granular resin 7 placed on the release film 13 having a required size. An inloader 63 (resin loader) for transporting to the mold (4) is provided.
Accordingly, in the compression molding apparatus 61, the mold (4) is required by being engaged with the inloader 63 in a state where the flattened shape-retaining granular resin 7 is placed on the release film 13 having a planar shape having a required size. It is comprised so that it can convey to a position.

(About the structure of electronic parts compression molding mold)
In the mold (lower mold 4) used in the description of the fourth embodiment, the lower mold cavity 10, the cavity opening 9, and the cavity bottom surface member 11 are shown. In order to adsorb and coat the release film 13 in the cavity 10, a cavity vacuuming mechanism (not shown) such as a vacuum pump for forcibly sucking and discharging air from the lower mold cavity 10 is provided. It is configured.
Accordingly, as will be described later, it is configured so that the granular resin having a uniform thickness can be supplied into the lower mold cavity 10 coated with the release film 13, and the lower mold cavity 10 The electronic component (5) mounted on the substrate (6) can be compression molded into a resin molded body (12) corresponding to the shape of the lower mold cavity 10.

(Resin distribution method)
Moreover, in the distribution means 62 used for description of Example 4, the film mounting member 64 which arrange | positions the mold release film 13 which has a planar shape of a required magnitude | size, and the base 62 which mounts the film mounting member 64 A resin supply frame (frame) 65 installed on the release film 13 disposed on the film mounting member 64, and a frame 65 installed on the film mounting member 64 via the release film 13. A resin material charging mechanism 23 for measuring and charging a required amount of granular resin 7 therein, and an appropriate flattening means (not shown) for flattening (for example, convex shape) granular resin 7 charged in the frame 65 Is provided.
Further, the frame 65 is configured with a resin insertion portion 66 (through hole) for supplying a required amount of the granular resin 7 having a recess equivalent to the lower mold cavity 10 (corresponding to the shape of the lower mold cavity 10). In the example shown in FIG. 9 (2), the lower opening of the frame resin charging portion 66 is separated from the frame resin charging portion 66. The mold film 13 is closed.
Further, as in the first to third embodiments, the resin material distribution means 62 is not shown as a resin material flattening means, but a base 62 (film mounting member 64, release film). 13, the vibration flattening mechanism that vibrates and flattens the granular resin 7 in the resin charging portion 66 by vibrating the frame 65 (or press flattening that flattenes the granular resin 7 in the resin charging portion 66) A pressing flattening mechanism) is provided.
Therefore, the granular resin 7 charged in the resin charging portion 66 of the frame 65 installed on the base 62 via the planar release film 13 can be flattened to have a uniform thickness. It is configured.
The granular resin 7 flattened in the resin charging portion 66 of the frame 65 is flattened on the planar release film 13 disposed on the base 62 after the frame 65 is removed. (In a state where the shape is kept uniform).

(About inloader configuration)
As described above, the electronic device compression molding apparatus 61 shown in the fourth embodiment is provided with the inloader 63 (resin loader) for supplying the granular resin 7 into the lower mold cavity 10 as in the first to third embodiments. It is configured.
The inloader 63 is provided with an inloader body (63) and a resin containing plate 67 that is engaged with the lower side of the inloader body (63).
Further, the lower surface side of the plate 67 is configured to be provided with a resin accommodating portion 68 (a concave portion corresponding to the shape of the lower mold cavity 10) having a depression equivalent to that of the lower mold cavity 10, and the lower surface of the plate 67 is The resin container 68 is divided into an opening 69 (plate opening) and an outer peripheral plate peripheral edge 70.
Accordingly, as shown in FIGS. 10 (1) and 10 (2), the planar mold release on which the in-loader 63 engaged with the plate 67 is moved down and the flattened shape-retaining granular resin 7 is placed. By joining the lower surface of the plate 67 (the plate opening 69 and the plate peripheral portion 70) to the film 13, the resin containing portion 66 of the plate 67 is matched with the shape-retaining granular resin 7 flattened on the release film 13. It is comprised so that it can be accommodated and covered.
Further, when the shape-retaining granular resin 7 is conveyed to the mold side (lower mold cavity 10) by the plate 67 (inloader 63), the upper portion side of the resin accommodating portion 68 of the plate 67 is closed, so that the shape-retaining granular resin is closed. 7 is configured to be transported without being scattered.
As described above, since the shape-retaining granular resin 7 can be placed on the release film 13, the lower side (opening 69) of the resin container 68 is formed by the release film 13. It will be closed.
Further, since the shape-retaining granular resin 7 can be accommodated in the resin accommodating portion 68, it can be conveyed to the mold side while the flatness of the shape-retaining granular resin 7 is maintained by the plate 67.

Although not shown, the plate peripheral portion 70 is provided with a required number of suction holes for sucking and fixing the planar release film 13, and air is introduced into the suction holes from the lower surface of the plate. A plate vacuuming mechanism such as a vacuum pump that forcibly discharges and evacuates is connected in communication through a vacuum path such as a vacuum tube.
That is, by evacuating the lower surface (peripheral portion 70) of the plate 67, the plate 67
It is comprised so that the planar release film 13 can be adsorbed and fixed to the lower surface.
At this time, the plate opening 69 is closed by the release film 13.
Therefore, first, by covering the granular resin 7 retained on the release film 13 with the plate 67, the granular resin 7 flattened and retained in the resin accommodating portion 68 of the plate 67 is accommodated. By evacuating from the peripheral portion 70 of the plate 67, the release film 13 can be adsorbed and fixed to the plate peripheral portion 70 to form the resin-engaged plate 71.
At this time, the shape-retaining granular resin 7 in the resin accommodating portion 68 of the resin-engaged plate 71 (plate 67) is placed on the release film 13 that closes the plate opening 69.
In this state, the resin-engaged plate 71 is engaged with the inloader 63 and can be conveyed to the lower mold cavity 10 side.
In the case where the release film 13 is fixed by suction, a configuration in which a vacuum is drawn from the resin accommodating portion 68 of the plate 67 may be used as an auxiliary.

In addition, a plate opening / closing valve is provided on the plate side (suction hole), and a vacuum path is detachably provided to the opening / closing valve.
Therefore, after evacuating from the periphery of the plate, the plate opening / closing valve is closed to release the vacuum path from the opening / closing valve, and the resin-engaged plate is locked by the inloader and conveyed to the lower mold cavity. It is configured to be able to.

Further, the resin-engaged plate 71 is configured to be able to contact the position of the lower mold cavity 10 by the inloader 63.
At this time, the resin-attached plate 71 is configured to be placed on the mold surface of the lower mold 4 including the cavity opening 9 via the release film 13, and the plate opening 69, the cavity opening 9, Is configured to be joined via a release film 13.
That is, in this state, the mold release film 13 is moved in the cavity 10 by evacuation from the lower mold cavity 10 and can be adsorbed and coated in accordance with the shape of the lower mold cavity 10. ing.
At this time, the granule resin 7 flattened and kept in a uniform thickness in the plate resin container 71 drops and moves into the lower mold cavity 10 as the release film 13 moves downward. .
Therefore, it is possible to supply the granular resin 9 which is flattened and kept in a uniform thickness in the lower mold cavity 10 covered with the release film 13.
In this case, the shape-retained granular resin 7 can be heated and melted sequentially from the bottom surface side of the cavity 10 at a uniform rate by conduction heat from the bottom surface of the lower mold cavity 10.

(About electronic parts compression molding method)
Next, a method for compression-molding the electronic component (5) mounted on the substrate (6) using the granule resin 7 flattened and held in a uniform thickness in Example 4 will be described.
That is, as shown in FIG. 9A, first, a release film 13 having a required planar shape is prepared, and then the release film 13 is used as a base 62 in a resin material distribution means. The resin is placed on the upper surface of the film placing member 64 disposed above, and a resin charging frame 65 is placed on the placed release film 13.
Next, as shown in FIG. 9 (2), the resin material charging mechanism 23 measures and charges a required amount of the granular resin 7 into the resin charging portion 66 of the frame 65.
At this time, the granular resin 7 charged in the resin charging portion 66 of the frame 65 is formed in a convex shape, for example.
Next, as shown in FIG. 9 (3), the granule resin in which a predetermined amount of the granule resin 7 in the resin charging portion 66 of the frame 65 is vibrated and flattened by a vibration flattening mechanism and held in a uniform thickness. 7 can be formed.
Next, by removing the frame 65 from the state shown in FIG. 9 (3), it is flattened on the release film 13 and has a uniform thickness as in the state on the release film 13 in FIG. 10 (1). It can be formed by leaving the granular resin 7 retained in the shape.
Next, as shown in FIGS. 10 (1) and 10 (2), the inloader 63 to which the resin containing plate 67 is engaged is moved downward to release the lower surface of the plate 67 (opening 69, peripheral edge 70) and release. By joining the film 13, the plate 67 can be put on the granular resin 7 that is kept in a uniform thickness on the release film 13.
At this time, the flattened shape-retaining granular resin 7 can be accommodated in the resin accommodating portion 68 of the plate 67.
Next, by vacuuming from the peripheral edge 70 (suction hole) of the plate 67, the release film 13 can be adsorbed and fixed to the peripheral edge 70 of the plate to form the resin containing plate 71.
Therefore, next, the inloader 63 is moved up in this state, whereby the resin containing plate 71 can be engaged with the inloader 63 as shown in FIG. The finished plate 71 (flattened shape-retaining granule resin 7) can be moved between the upper and lower molds (4) and conveyed to the lower mold cavity 10 side.

Next, as shown in FIG. 11 (1), between the upper and lower molds (4), the inloader engaged with the resin-containing plate 71 is moved down 63 to place the resin-containing plate at the position of the lower mold cavity 10. By abutting 71, the resin-containing plate 71 can be placed on the mold surface of the lower mold 4.
At this time, the resin containing portion 68 (plate opening 69) containing the flattened shape-retaining granular resin 7 and the cavity opening 10 are joined via the release film 13.
Therefore, next, as shown in FIG. 11 (2), the release film 13 can be adsorbed and coated in accordance with the shape of the lower mold cavity 10 by evacuating the lower mold cavity 10 [ie, An equivalent to the film recess (14) shown in Examples 1 to 3 is formed.
At this time, the flattened shape-retaining granule resin 7 in the resin accommodating portion 68 of the plate 67 is in the same shape and is moved downward, that is, the flattened shape-retaining granule resin 7 is released. In the state of being placed on the mold film 13, it is dropped and supplied from the resin accommodating portion 68 of the plate into the lower mold cavity 10 covered with the release film 13.
At this time, since the granular resin 7 is efficiently shaped and formed in a uniform thickness in the lower mold cavity 10 covered with the release film 13, the flatness of the granular resin 7 is maintained. It will be.
When the flatness of the granular resin 7 in the lower mold cavity 10 is slightly broken, the granular resin 7 in the release film 13 covering the lower mold cavity 10 is vibrated by vibrating the inloader 63 (release film 13). May be flattened in an auxiliary and fine correction manner.
Therefore, next, by releasing the evacuation by the plate 67, the engagement of the release film 13 is released, and the inloader 63 is moved upward to be withdrawn from both the upper and lower molds (4).
At this time, since the release film 13 is coated and fixed corresponding to the shape of the lower mold cavity 10 and remains, it has a uniform thickness in the lower mold cavity 10 covered with the release film 13. The granular resin 7 can be supplied while being shaped.

Next, similarly to Examples 1 to 3, the shape-retaining granular resin 7 can be heated and melted in the lower mold cavity 10 covered with the release film 13.
At this time, the shape-retaining granular resin 7 can be heated and melted from the lower surface side at a uniform rate by the conduction heat from the bottom surface side of the lower mold cavity 10.
At this time, there is a gap between the vibrationally flattened granular resins 7 to form communication holes, and the shape-retaining granular resin 7 is heated and melted at a uniform speed from the lower surface side. Therefore, air and moisture contained in the granular resin 7 can be efficiently exhausted to the outside through this communication hole, and voids generated in the resin molded body (12) to be compression-molded in the lower mold cavity 10 (Bubbles) can be efficiently prevented.
Therefore, the upper and lower molds (4) are then clamped to attach the substrate (6) supplied and set to the substrate set section (8) provided in the upper mold in the heat-melted resin material. The resulting electronic component (5) is immersed.
At this time, a required resin pressure can be applied to the resin in the lower mold cavity 10 by the cavity bottom surface member 11.
After the time required for curing has elapsed, the electronic component (5) mounted on the substrate (6) is compression-molded (resin-sealed) in a resin molded body (12) corresponding to the shape of the lower mold cavity 10. Can do.

That is, according to Example 4, as described above, the release film 13 covered from the resin accommodating portion 68 of the plate 67 according to the movement of the release film 13 by evacuation from the lower mold cavity 10. Since the required amount of the granular resin 7 which has been flattened and has a uniform thickness can be supplied into the mold cavity 10 as it is, in the granular resin 7 supplied into the lower mold cavity 10 The reliability with respect to the resin amount can be improved efficiently.
Further, according to the fourth embodiment, as described above, since the required amount of the granulated resin 7 can be supplied into the lower mold cavity 10 covered with the release film 13, It is possible to efficiently supply the granular resin 7 with a uniform thickness.
Further, according to the fourth embodiment, as described above, since the required amount of the flattened granular resin 7 (the granular resin 7 having a uniform thickness) can be supplied into the lower mold cavity 10, The granular resin 7 can be uniformly heated and melted in the mold cavity 10.
Therefore, it is possible to efficiently prevent the occurrence of mamako in the heat-melted resin material, and the product [resin molded body (12)] that is compression molded in the lower mold cavity 10 has high quality and high quality. A reliable product can be obtained.

  In Example 4, instead of the above-described vibration flattening for the granular resin 7 in the resin accommodating portion 68 of the plate 67, or the flat vibration for the granular resin 7 in the lower mold cavity 10 covered with the release film 13. Instead of the above, it is possible to adopt a configuration in which the granular resin 7 is pressed and flattened.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention.

  In the above-described embodiments, the thermosetting resin material has been described. However, a thermoplastic resin material may be used.

Further, in the above-described embodiments it has been described with reference to granular resin material, powdery resin material (powder resin) having a required particle size distribution, powdery resin material (powder resin) Various, such as A resin material having a shape can be employed.

In the above-described embodiment, for example, a silicone resin material or an epoxy resin material can be used.
Moreover, in the said Example, various resin materials, such as the resin material which has transparency, the resin material which has translucency, a phosphorescent material, and the resin material containing a fluorescent substance, can be used.

1 (1), FIG. 1 (2), and FIG. 1 (3) are schematic longitudinal sectional views schematically showing a film forming mechanism in a resin material distributing means provided in an electronic component compression molding apparatus according to the present invention. 1 (1) shows a state before film formation, FIG. 1 (2) shows a state during film formation, and FIG. 1 (3) shows a state after film formation (implementation). Example 1). FIG. 2 (1) is a schematic longitudinal sectional view schematically showing a resin material charging mechanism provided in the electronic component compression molding apparatus according to the present invention, and FIG. 2 (2) is a diagram illustrating compression of the electronic component according to the present invention. It is a schematic longitudinal cross-sectional view which shows schematically the vibration flattening mechanism provided in the shaping | molding apparatus, FIG.2 (3) shows schematically the press flat tool provided in the compression molding apparatus of the electronic component which concerns on this invention. (Example 1) which is a schematic longitudinal cross-sectional view. 3 (1) and 3 (2) are schematic longitudinal sectional views schematically showing an inloader provided in the electronic device compression molding apparatus according to the present invention. FIG. FIG. 3 (2) shows a state in which the flattening resin placement film (having a film recess) is attached, and FIG. 3 (2) shows a state in which the flattening resin placement film is attached to the inloader (Example 1). . 3 (1) and 3 (2), the electronic component compression molding die (lower mold) provided in the electronic component compression molding apparatus according to the present invention and the flattening resin mounting film are engaged. FIGS. 3A and 3B are schematic longitudinal sectional views schematically showing the inloader, in which FIG. 3A shows a state in which the inloader is disposed at (above) the lower mold cavity, and FIG. A state in which the flattening resin mounting film attached to and fitted is fitted (a state in which the flattening resin is supplied and set) is shown (Example 1). FIG. 5 is a schematic longitudinal sectional view schematically showing a mold for compression molding of an electronic component provided in the compression molding apparatus for an electronic component according to the present invention, and shows a mold open state ( Example 1). FIG. 6 is a schematic longitudinal sectional view schematically showing a compression molding die for electronic parts corresponding to FIG. 5 and shows a mold clamping state (Example 1). FIG. 7 (1) and FIG. 7 (2) are schematic longitudinal sectional views schematically showing a mold for compression molding of an electronic component provided in another electronic component compression molding apparatus according to the present invention, Fig. 7 (1) shows the state where the inloader is disposed at the (upper) position of the lower mold cavity, and Fig. 7 (2) shows that the flattening resin mounting film attached to the inloader is fitted and fitted in the lower mold cavity. (The state in which the planarizing resin is supplied and set) is shown (Example 2). 8 (1) and FIG. 8 (2) are schematic longitudinal sectional views schematically showing a mold for compression molding of an electronic component provided in another electronic component compression molding apparatus according to the present invention, FIG. 8 (1) shows a state in which the inloader is disposed at the upper mold cavity (above), and FIG. 8 (2) shows that the flattening resin mounting film attached to the inloader is fitted and fitted in the lower mold cavity. (The state where the planarizing resin is supplied and set) is shown (Example 3). 9 (1), FIG. 9 (2), and FIG. 9 (3) are schematic longitudinal sectional views schematically showing a resin material distributing means provided in the compression molding apparatus for electronic parts according to the present invention. 9 (1) shows the order of installation of the distribution means before the resin material distribution, FIG. 9 (2) shows the state of the resin material input in the distribution means, and FIG. 9 (3) shows the flatness of the resin material in the distribution means. (Example 4). 10 (1), FIG. 10 (2), and FIG. 10 (3) are schematic longitudinal sectional views schematically showing an inloader (resin housing plate) provided in the electronic device compression molding apparatus according to the present invention. FIG. 10 (1) shows a state before a planar release film (without a film recess) on which a resin material flattened by an inloader (resin housing plate) is placed is attached. FIG. 10 (2) shows a state when a release film having a planar shape on which a resin material flattened by the inloader is mounted, and FIG. 10 (3) is a resin material flattened by the inloader. (Example 4) which has shown the state which fastened the planar release film which mounted | wore. FIG. 11 (1) and FIG. 11 (2) are planes on which a compression molding die (lower mold) for electronic parts and a flattened resin material are placed in the compression molding apparatus for electronic parts according to the present invention. FIG. 11A is a schematic longitudinal sectional view schematically showing an inloader to which a release film having a shape is attached, and FIG. 11A shows a state in which the inloader is disposed at the position of the lower mold cavity (above). 2) shows a state in which a planar release film in which a flattened resin material attached to an inloader is placed in the lower mold cavity is fitted and fitted (a state in which the flattened resin is supplied and set). (Example 4). FIG. 12 is a schematic longitudinal sectional view schematically showing a mold for compression molding of electronic components provided in a conventional compression molding apparatus for electronic components, and a resin material is provided in a lower mold cavity by a resin material supply mechanism. It shows a state in which the material is supplied by dropping.

DESCRIPTION OF SYMBOLS 1 Resin sealing molding apparatus of an electronic component 2 Inloader 3 Fixed upper mold | type 4 Movable lower mold | type 5 Electronic component 6 Board | substrate (substrate before shaping | molding)
7 Granular resin material (granular resin)
8 Substrate setting section 9 Cavity opening 10 Lower mold cavity (cavity recess)
DESCRIPTION OF SYMBOLS 11 Cavity bottom face member 12 Resin molding 13 Release film 14 Film recessed part 15 Film with recessed part 16 Flattening resin mounting film 21 Resin material distribution means (base)
22 Film forming mechanism 23 Resin material loading mechanism 24 Die (common receiving set stand)
DESCRIPTION OF SYMBOLS 25 Press punch 26 Die recessed part 27 Die shaping | molding surface 28 Press flat tool 31 Inloader main body 32 Lower surface of inloader 41 Resin sealing molding apparatus of electronic components 42 Inloader 43 Through-hole 44 Inloader main body 45 Cover member 46 Lower surface of inloader main body 47 Cover member The bottom surface of the electronic device 51 The resin sealing molding device for the electronic component 52 The inloader 53 The through hole 54 The inloader body 55 The pressure flattening mechanism 56 The bottom surface of the inloader main body 57 The film fixture 58 The pressure flattening member 59 The elastic member 60 The resin release layer 61 Resin sealing molding device 62 Resin material distribution means (base)
63 Inloader 64 Film mounting member 65 Resin loading frame 66 Frame resin loading section (through hole)
67 resin housing plate 68 plate resin housing portion 69 plate opening (opening portion of resin housing portion)
70 Plate peripheral edge 71 Resin-containing plate S Interval

Claims (11)

Using a mold for compression molding of electronic parts mounted on a compression molding apparatus for electronic parts , a required amount of resin material in the film recess of the release film having a resin recess for resin placement corresponding to the shape of the mold cavity And inserting and setting a film recess in which a required amount of resin material has been supplied into the mold cavity, and immersing the electronic component in the resin in the mold cavity, so that An electronic component compression molding method for compressing and molding the above electronic component in a resin molded body corresponding to the shape of the cavity,
Preparing the release film as described above in a required size;
A step of providing a film recess for resin placement corresponding to the shape of the cavity described above in the release film to form a film with a recess;
A step of introducing a required amount of resin material into the film recess of the film with recesses described above;
Flattening the resin material thrown into the film recess and forming a resin material having a uniform thickness;
A step of engaging the film with a recess on which the resin material is placed with an inloader;
A step of transporting the above-described resin material to the above-described mold in a state of being placed in the film recess provided in the above-described film with a recess with the above-described inloader;
A step of fitting and setting the above-described film recess in the above-described mold cavity, and supplying the above-described resin material into the above-described mold cavity . 2. The method of compression molding an electronic component according to claim 1, further comprising a step of vibrating and flattening the resin material put into the film recess to form a resin material having a uniform thickness. 2. The method of compression molding an electronic component according to claim 1, comprising a step of pressing and flattening the resin material put into the film recess to form a resin material having a uniform thickness. Using a mold for compression molding of electronic parts mounted on a compression molding apparatus for electronic parts, a required amount of resin material is supplied into a mold cavity coated with a release film, and the above-mentioned mold cavity An electronic component compression molding method for compressing and molding the electronic component in a resin molded body corresponding to the shape of the cavity in the cavity by immersing the electronic component in a resin,
Preparing the release film as described above in a required size;
A step of placing a frame for resin charging on the release film, and
A step of introducing a required amount of resin material into the resin input portion of the frame;
Flattening a required amount of the resin material in the resin charging section,
Removing the frame from the release film and leaving the planarized resin material on the release film;
Resin flattened in the resin accommodating portion of the above-described plate by covering the resin material flattened on the above-described release film with a resin-accommodating plate and joining the above-described release film and the plate surface. Containing the material; and
Fixing the aforementioned release film to the aforementioned plate to form a resin-containing plate;
A step of engaging the resin-containing plate with an inloader;
The above-described inloader transports and places the above-described resin-containing plate to the above-described mold cavity position; and
Vacuuming from the mold cavity described above, moving the mold release film to adsorb and coat the mold cavity;
And a step of supplying the resin material into the mold cavity coated with the release film during the adsorption coating process of the release film into the mold cavity. Molding method. 5. The compression molding method for an electronic component according to claim 1, wherein the resin material is a powdery resin material having a required particle size distribution. The compression molding method for an electronic component according to claim 1, wherein the resin material is a granular resin material. The compression molding method for an electronic component according to claim 1, wherein the resin material is a powdery resin material. At least a mold for compression molding of electronic parts, an upper mold provided on the above-described mold, a lower mold disposed opposite to the upper mold, a cavity for compression molding provided on the above-described lower mold, and the above-described a compression molding apparatus for electronic parts and the electronic component board setting section for supplying the substrate mounted, heating means for heating and melting the resin material provided on the a mold is provided which is provided in the mold, the required A film forming mechanism for forming a film with a recess by forming a film recess corresponding to the shape of the cavity in a release film of a size , and a resin material is put into the film recess provided in the release film Resin material input means, an inloader for engaging a film with a recess having a film recess on which the resin material is placed, and a flattening means for flattening the resin material in the film recess to a uniform thickness Compression molding apparatus for electronic parts, wherein a provided. At least a mold for compression molding of electronic parts, an upper mold provided on the above-described mold, a lower mold disposed opposite to the upper mold, a cavity for compression molding provided on the above-described lower mold, and the above-described a compression molding apparatus for electronic parts and the electronic component board setting section for supplying the substrate mounted, heating means for heating and melting the resin material provided on the a mold is provided which is provided in the mold, the winding A release film cutting mechanism that cuts and forms a release film of a required size from a release film in a roll state, a resin loading frame placed on the release film, and the release mold described above A resin material charging mechanism for charging a resin material into a resin charging portion in a frame placed on the film, a flattening means for flattening the resin material charged in the frame on the release film, and For release film A vacuum is drawn from the inside of the above-mentioned compression molding cavity, a resin containing plate for containing the flattened resin material, an inloader for engaging the resin containing plate containing the resin material flattened by the above-described release film, and Thus, the above-described cavity is provided with a vacuum drawing mechanism for adsorbing and covering the above-mentioned release film. 10. The electronic component compression molding apparatus according to claim 8, wherein the flattening means for flattening the resin material to a uniform thickness is a vibration flattening mechanism. 10. The electronic component compression molding apparatus according to claim 8, wherein the flattening means for flattening the resin material to a uniform thickness is a press flattening mechanism.

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