TWI679100B - Resin molding apparatus and resin molding product manufacturing method - Google Patents

Abstract

The present invention provides a resin molding device including: a resin material storage frame having an opening; and an adsorption mechanism for adsorbing a film on a resin material so as to cover a lower surface of the resin material storage frame including the opening. The lower surface of the storage frame; the film tension frame material is arranged to be able to rise and fall so as to surround the inner periphery of the resin material storage frame; the stopping portion stops the film tension frame material at a predetermined height position; the pressing member A film tension frame member is pressed upward; and a driving portion that moves the pressing member up and down. After the resin material stored inside the film tension frame material is supplied to the forming mold, the pressing member presses and releases the film tension frame material to reduce the contamination of the transport path by the resin material during the transportation of the film tension frame material and the like.

Description

Resin molding device and method for manufacturing resin molded product

The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product, which are used to manufacture resin molded products such as resin sealed products obtained by sealing electronic components such as semiconductor wafers with resin.

In order to protect electronic parts from light, heat, moisture and other environments, electronic parts are generally sealed with resin. Examples of the resin sealing method include a compression molding method and a transfer molding method. The compression molding method uses a forming mold composed of a lower mold and an upper mold, and supplies a resin material to the cavity of the lower mold. After the substrate on which the electronic components are mounted is mounted on the upper mold, the lower mold and the upper mold face each other. Both of them are clamped while heating, thereby forming. In the transfer molding method, after the substrate is installed in the cavity of one of the upper mold and the lower mold, the lower mold and the upper mold are heated while the two are clamped, and the resin is pressed into the cavity using a plunger. Thereby, molding is performed. The transfer molding method has the following problems. Not only a part of the resin remains in the path of feeding the resin from the plunger to the cavity, but also the semiconductor substrate or wiring is damaged due to the resin flow. Therefore, the compression molding method has become Mainstream.

Patent Document 1 describes a resin molding device characterized in that the resin molding device is a device for resin sealing by a compression molding method, and the resin material is transferred from the resin material supply device to a cavity of a lower mold. Resin material transfer section. This resin material transfer unit 90, as shown in FIG. 8, includes a resin material storage frame 91 provided with an opening portion 911 having the same planar shape as that of the cavity MC of the lower mold LM described below; an adsorption mechanism 92, It is used to adsorb the release film on the lower surface of the resin material storage frame 91 so as to cover the lower surface of the resin material storage frame 91 including the opening portion 911; the film tension frame material 93 surrounds the inside of the resin material storage frame 91. It can be installed in a wall-like manner and can be raised and lowered; a stopper portion 94 that stops the film tension frame member 93 at a predetermined height position; and a transport mechanism 95 that causes the resin material storage frame 91 to move between the resin material supply device and the mold cavity .

The suction mechanism 92 includes a groove provided on the lower surface of the resin material storage frame 91 and an suction device (not shown) that sucks air in the groove. The film tension frame member 93 is a frame having an inverted L-shape in cross section with a protruding portion on the outer peripheral side. The stopper portion 94 is formed by a lower end portion of the inner wall side of the resin material storage frame 91 protruding inward. When the above-mentioned protruding portion of the film tension frame member 93 abuts on the stopper portion 94, the film tension frame member 93 stops at a predetermined height position (see FIG. 8). On the other hand, the height of the film tension frame material 93 is greater than the height of the stop portion 94. After the resin material storage frame 91 is placed on a flat table, the film tension frame material 93 is separated from the stop portion 94 (see FIG. 9 (a )). The transport mechanism 95 includes a pair of resin material storage frame holding portions 951 that hold the resin material storage frame 91 from the side, and a film holding portion 952 that is provided under each resin material storage frame holding portion 951 and holds Release film F; and a moving means (not shown), which moves the resin material storage frame holding portion 951 and the film holding portion 952.

The operation of the resin material transfer unit 90 will be described with reference to FIG. 9. First, will leave After the release film F is placed on the flat table TB, the resin material storage frame 91 and the film tension frame material 93 are placed on the release film F by the transport mechanism 95 (FIG. 9 (a)). At this stage, the film tension frame member 93 is in a state of being separated from the stopper portion 94 as described above. Then, the resin material P is supplied from the resin material supply device to the inside of the film tension frame member 93 (FIG. 9 (b)). For the supply device and the supply method of the resin material P to the resin material transfer unit 90, known devices and methods are used (for example, refer to Patent Document 2).

Then, the release film F is attracted by the adsorption mechanism 92, and then the resin material storage frame 91 is clamped by the resin material storage frame holding portion 951, and the periphery of the release film F is held by the film holding portion 952. Then, the resin material storage frame 91 is raised by the transfer mechanism 95 (FIG. 9 (c)). At this time, since the suction strength of the release film F by the adsorption mechanism 92 is appropriately set in advance, the film tension frame member 93 is lowered to abut the stopper portion 94 due to its own weight, and the film tension is on the side of the release film F. The frame material 93 is pressed and unfolded to closely contact the lower surface of the resin material storage frame 91. In this manner, tension is applied to the release film F on which the resin material P in the film tension frame member 93 is placed, and the resin material containing portion PC is formed by the film tension frame member 93 and the release film F.

Then, the resin material transfer unit 90 is moved to a position directly above the cavity MC of the lower mold LM (FIG. 9 (d)) by the transfer mechanism 95 and then lowered (FIG. 9 (e)). Into the cavity MC. Then, the suction of the release film F by the adsorption mechanism 92 and the holding of the film holding portion 952 are performed, and then the resin material storage frame 91 is raised (FIG. 9 (f)). Thereby, the resin material P is supplied into the cavity MC with the release film F covering the inner surface of the cavity MC. In addition, the film tension frame member 93 rises together with the resin material storage frame 91 in a state where the stopped portion 94 is caught. Thereafter, the resin material transfer unit 90 returns to the resin material supply device to supply the next resin material.

[Prior technical literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-222760

[Patent Document 2] Japanese Patent Laid-Open No. 2007-125783

Recently, as electronic components and wiring have become more precise, in order to further reduce the movement of the resin while melting in the cavity, the particle size of the resin material used tends to be smaller. In addition, even in a flip-chip connection in which an electronic component and a substrate are connected by solder bumps, since the height of the solder bump (the distance between the electronic component and the substrate) becomes lower, the particle diameter of the filler contained in the resin material also changes small. So far, no technology has been proposed that can correspond to such smaller particle size resins or fillers.

The problem to be solved by the present invention is to provide a resin molding device and a method for manufacturing a resin molded product that can be used with a resin material containing a resin or a filler having a small particle diameter.

The resin molding apparatus of the present invention completed to solve the above-mentioned problems is characterized by including: a) a resin material storage frame having an opening; b) an adsorption mechanism for covering the resin material containing the opening including the opening The lower surface of the frame, the film is adsorbed on the lower surface of the resin material storage frame; c) the film tension frame material, which can lift the inner wall of the resin material storage frame D) a stop section that stops the film tension frame material at a predetermined height position; e) a pressing member that presses the film tension frame material from above; and f) a driving section that makes the pressing member up and down mobile.

The method for manufacturing a resin molded article according to the present invention is characterized by having the steps of: arranging a film so as to cover a lower surface of the resin material storage frame having an opening portion including the opening portion; and supplying the resin material to surround the resin material storage frame. The inner wall of the film tension frame, which can be raised and lowered; the film is adsorbed on the lower surface of the resin material storage frame while the resin material storage frame is raised while the film tension frame is raised The film is lowered to a predetermined height and stopped, whereby the film protrudes downward, and is formed in a resin material storage section containing a resin material inside; the resin material storage section is stored in a cavity of a molding die; the film is released from the resin Adsorption of the lower surface of the material containing frame causes the resin material containing frame to rise; and performing an operation of pressing the above-mentioned film tension frame material from above by a pressing member, and lifting the pressing member upward.

The resin molding apparatus and the method for manufacturing a resin molded product according to the present invention can be applied to a resin material containing a resin or a filler having a small particle diameter.

10‧‧‧Resin material transfer department

11, 91‧‧‧ Resin material storage frame

111、911‧‧‧ opening

12, 92‧‧‧ Adsorption mechanism

13, 93‧‧‧ film tension frame

131, 931‧‧‧ protrusion

14, 94‧‧‧ Stop

15, 95‧‧‧ transfer agencies

151, 951‧‧‧ Resin frame holding section

152, 952‧‧‧ membrane holding section

16‧‧‧Pressing member

161‧‧‧Pressing plate part

162‧‧‧Pin of pressing member

17‧‧‧Driver

171‧‧‧cylinder

172‧‧‧Piston

20‧‧‧Compression molding department

211‧‧‧ Lower fixed plate

212‧‧‧Upper fixed plate

22‧‧‧ connecting rod

23‧‧‧ movable platen

24‧‧‧ clamping device

251‧‧‧Lower heater

252‧‧‧upper heater

30‧‧‧Resin molding device

31‧‧‧Material receiving module

311‧‧‧Substrate receiving section

312‧‧‧Resin material supply department

32‧‧‧forming module

33‧‧‧Distribution module

331‧‧‧Resin molded product storage department

36‧‧‧Main Transfer Device

37‧‧‧Deputy transfer device

96‧‧‧Spring

FIG. 1 is a longitudinal sectional view showing the configuration of a resin material transfer section according to an embodiment of a resin molding apparatus of the present invention.

FIG. 2 (a) is a front view showing a state where the pressing member of the resin molding apparatus of this embodiment is raised, FIG. 2 (b) is a front view showing a state where the pressing member is lowered, and FIG. 2 (c) is a view showing the pressing member Side view of rising state.

FIG. 3 is a plan view of a resin material storage frame, a film tension frame material (solid line), and a pressing member (dashed line) of the resin molding apparatus of this embodiment.

FIG. 4 is a diagram showing each operation of the resin material transfer portion of the resin molding apparatus according to the embodiment before the resin material storage portion is introduced into the mold.

FIG. 5 is a diagram showing an operation for removing a resin material adhering to a film tension frame material among operations of a resin material transfer section of a resin molding apparatus according to this embodiment.

FIG. 6 is a schematic view showing an example of a compression-molded portion.

FIG. 7 is a schematic diagram showing an example of a resin molding apparatus including a material receiving module, a molding module, and a distribution module.

FIG. 8 is a longitudinal sectional view showing an example of a configuration of a resin material transfer section of a conventional resin molding apparatus.

Fig. 9 is a longitudinal sectional view showing the operation of a conventional resin material transfer section.

Fig. 10 is a longitudinal sectional view showing a modification of the configuration of a resin material transfer section of a conventional resin molding apparatus.

The resin molding device of the present invention covers the lower surface of the resin material containing frame After the film is adsorbed on the lower surface of the resin material storage frame by the adsorption mechanism, the resin material is supplied to the inside of the film tension frame material, and the resin material storage frame is raised, whereby the film tension frame material projects downward. Thus, the film protrudes downward, and a resin material accommodating portion that stores a resin material is formed on the inside. Then, after introducing the resin material accommodating portion into the cavity of the forming mold, the adsorption of the adsorption mechanism is released, and the resin material accommodating frame is raised. So far, it is the same as the conventional resin molding apparatus. Thereafter, the pressing member is moved up and down by the driving portion, and the film tension frame material is pressed by the pressing member repeatedly to release the resin or filler of the resin material attached to the film tension frame material from the film tension frame material. , Drop into the mold cavity.

Therefore, after the resin material is supplied into the cavity, in order to store the next resin material in the resin material storage portion, the resin material storage frame, the film tension frame material, and the like can be transferred to reduce the contamination of the transfer path by the resin or filler. The transfer path can also be used as a carry-in path to carry a substrate before resin molding into a molding die, or a carry-out path to carry a resin-molded resin molded product out of the molding die. Therefore, by reducing the pollution of the transfer path, Reduction of contamination of substrates or resin molded products with resin or filler. In addition, the resin material stored in the resin material storage portion is introduced into the cavity without being attached to the film tension frame material, so the required amount of resin material can be supplied into the cavity more accurately than the conventional technique. .

When the resin material is transferred to the forming mold, the film tension frame material may vibrate up and down relative to the resin material storage frame. If such vibration occurs in the conventional resin material transfer unit 90 described above, the resin material intrudes between the film tension frame material 93 and the release film F, resulting in adhesion from the lower surface of the film tension frame material 93 to the resin material storage. The lower surface of the frame 91. Patent Document 1 describes the use of a spring 96 (see FIG. 10) that biases the film tension frame member 93 downward to suppress vibration of the film tension frame member. In contrast, in order to solve such a problem, the present invention When the fat material is transferred to the forming mold, the state where the film tension frame material is pressed from above by the driving unit is maintained, and the state where the film tension frame material is pressed from the top toward the stopping member can be maintained. This can suppress the vibration of the film tension frame material, thereby reducing the intrusion of the resin material between the film tension frame material and the release film, so the resin material is compressed and it is difficult to be fixed to the film tension frame material. In addition, the common structure can exert the above-mentioned effect of detaching the resin material attached (uncompressed) to the film tension frame material, and the effect of reducing the penetration of the resin material between the film tension frame material and the release film.

The stopper may be formed integrally with the resin material storage frame, or may be constituted by a member different from the resin material storage frame.

In the above-mentioned method for manufacturing a resin molded product, it is preferable to maintain the pressing by a pressing member from above from the time when the resin material is supplied to the inside of the film tension frame material until the resin material receiving portion is stored in the cavity of the molding die. The state of the film tension frame.

Hereinafter, more specific embodiments of the resin molding apparatus and the method for manufacturing a resin molded product of the present invention will be described with reference to FIGS. 1 to 7.

The resin molding apparatus of this embodiment includes a resin material transfer section 10 shown in FIG. 1 and a compression molding section 20 (described below) including a clamping device and the like. First, the configuration and operation of the resin material transfer section 10 will be described.

The resin material transfer unit 10 includes a resin material storage frame 11, an adsorption mechanism 12, a film tension frame material 13, a stopper 14, a transport mechanism 15, a pressing member 16, and a drive unit 17.

The resin material housing frame 11 has a rectangular opening portion 111 corresponding to the planar shape of the cavity MC of the lower mold LM described below. The suction mechanism 12 includes a groove provided on the lower surface of the resin material housing frame 11 and an suction device (not shown) that sucks air in the groove. The film tension frame material 13 is a rectangular frame material corresponding to the shape of the opening portion 111, and has a protruding portion on the outer peripheral side. Section 131 is an inverted L-shaped frame. The stopper portion 14 is formed by a lower end portion of the inner wall side of the resin material housing frame 11 protruding inward. The film tension frame material 13 is relatively movable up and down relative to the resin material storage frame 11, and when the protruding portion 131 contacts the stop portion 14, the downward movement is stopped. The conveying mechanism 15 includes a pair of resin material storage frame holding portions 151, which hold the resin material storage frame 11 from the side, and a film holding portion 152, which is provided below each resin material storage frame holding portion 151, and Holding the release film; and a moving means (not shown), which moves the resin material housing frame holding portion 151 and the film holding portion 152.

The pressing member 16 is a member that presses the upper surface of the film tension frame material 13, and a pin 162 that is in contact with the film tension frame material 13 when pressed is mounted on the lower surface of the plate portion 161. The driving unit 17 includes a cylinder 171, a piston 172 that can be squeezed downward from the cylinder 171, and a power source (not shown) that moves the piston 172. The front end of the piston 172 is fixed to the upper surface of the plate portion 161 of the pressing member 16. With the configuration of the pressing members 16 and the driving portion 17, when the piston 172 is squeezed downward, the pressing member 16 is lowered and the film tension frame 13 is pressed. In this embodiment, two sets of articles are used in which two pins 162 are mounted on one plate portion 161 (there are two plate portions 161 and four pins 162 in total), and each plate portion 161 One piston 172 is used (therefore, there are two pistons 172 and one cylinder 171 in total) (FIG. 2). A total of four pins 162 press the four corners of the rectangular film tension frame 13 (FIG. 3).

The operation of the resin material transfer unit 10 of the resin molding apparatus according to this embodiment will be described with reference to Figs. 4 and 5. First, the release film F is stretched on the upper surface of the flat table TB. At this time, the release film F can be fixed on the table TB by a suction device which is provided in advance to suck gas from the upper surface of the table TB. Then, the resin material storage frame 11 and the film tension frame material 13 are placed on the release film F by the transport mechanism 15 (FIG. 4 (a)). Membrane tension frame material 13 The reaction of the upper surface of TB moves relatively upward with respect to the resin material housing frame 11, and the protruding portion 131 is separated from the stop portion 14. At this point in time, the pressing member 16 did not press the upper surface of the film tension frame material 13.

Then, the resin material P is supplied from the resin material supply device to the inside of the film tension frame material 13 (FIG. 4 (b)). As the resin material P, for example, a mixture of a resin composed of a powder of epoxy resin and a filler composed of a powder of silica can be used. As for the supply device and the supply method of the resin material P, for example, a known device and method described in Patent Document 2 can be used.

Then, the pressing member 16 is lowered by the driving portion 17, and the upper surface of the film tension frame 13 is pressed by the pressing member 16 (FIG. 4 (c)). Then, the release film F is attracted by the adsorption mechanism 12, the resin material storage frame 11 is sandwiched by the resin material storage frame holding portion 151, and the periphery of the release film F is held by the film holding portion 152. Then, the resin material storage frame 11 is raised by the conveyance mechanism 15 (FIG. 4 (d)). At this time, by appropriately setting the suction strength of the release film F by the adsorption mechanism 12 in advance, the film tension frame 13 is lowered due to its own weight until it contacts the stop portion 14, and at the same time the release film F is caused by the film tension frame 13 It is pressed while being unrolled, and is closely attached to the lower surface of the resin material housing frame 11. As a result, tension is applied to the release film F on which the resin material P in the film tension frame material 13 is placed, and a resin material storage portion PC is formed by the film tension frame material 13 and the release film F. Furthermore, if wrinkles are generated in the release film F at this time, the release film F can be stretched in the lateral direction of FIG. 4 (a) to FIG. 4 (g) by the film holding portion 152 to reduce the wrinkles. produce. In addition, in order to reliably suppress vibration when the resin material transfer unit 10 is moved as a whole as described later, a force for pressing the upper surface of the film tension frame 13 by the pressing member 16 may be increased at this stage (FIG. 4 (d)), and the pressure The state where the force is increased.

Then, while maintaining the upper surface of the film tension frame 13 by the pressing member 16 In the surface state, the entire resin material transfer unit 10 is moved directly above the cavity MC of the lower mold LM by the transfer mechanism 15 (FIG. 4 (e)). During this movement, the state in which the pressing member 16 presses the upper surface of the film tension frame 13 is maintained, and by maintaining the state in which the film tension frame 13 presses the stop portion 14 from above, the vibration of the film tension frame 13 during movement can be suppressed. . Therefore, intrusion of the resin material P between the film tension frame material 13 and the release film F or between the resin material storage frame 11 and the release film F can be reduced, so that the resin material P is compressed and difficult to be fixed to the film tension. Frame material 13 or resin material housing frame 11.

Then, the entire resin material transfer section 10 moved directly above the cavity MC is lowered, thereby introducing the resin material storage section PC into the cavity MC (FIG. 4 (f)). Then, after releasing the suction of the release film F by the adsorption mechanism 12 and the holding of the film holding portion 152, the resin material storage frame 11 is raised (FIG. 4 (g)).

Subsequently, the operation of moving the pressing member 16 up and down by the driving unit 17 is repeated (FIG. 5). By pressing the upper surface of the film tension frame material 13 repeatedly by hitting the pin 162 of the pressing member 16, the film tension frame material 13 is vibrated. In this way, the resin material P provided on the film tension frame material 13 is detached from the film tension frame material 13 and dropped into the cavity MC. Therefore, the resin material supplied from the resin material supply device to the resin material transfer unit 10 is introduced into the cavity MC without adhering to the film tension frame material, so that the required amount of resin material can be accurately supplied to the cavity MC.

Thereafter, the entire resin material transfer unit 10 is returned to the stage TB. At this time, the resin material P has been detached from the film tension frame material 13, so the resin material P has not fallen down to the transport path (transport path, return path), thereby reducing the transport path from being contaminated by the resin material P (resin and filler).

The compression molding section 20 is similar to the compression molding section in a conventional resin molding apparatus. Similarly, the configuration and operation will be briefly described below using FIG. 6.

The compression-molded portion 20 is provided with connecting rods 22 (four in total) standing at four corners of the lower fixing plate 211, and a rectangular upper fixing plate 212 is provided near the upper end of the connecting rod 22. A rectangular movable platen 23 is provided between the lower fixed plate 211 and the upper fixed plate 212. The movable pressure plate 23 is provided with holes at the four corners through which the connecting rod 22 passes, and can move up and down along the connecting rod 22. On the lower fixed plate 211, a clamping device 24, which is a device for moving the movable platen 23 up and down, is provided. A lower heater 251 is disposed on the upper surface of the movable platen 23, and a lower mold LM having a cavity MC is provided above the lower heater 251. A suction port (not shown) is provided on the inner surface of the mold cavity MC, and the resin material storage portion PC is sucked from the suction port when the resin material storage portion PC is introduced into the mold cavity MC as described above, whereby the resin material storage portion PC The release film F is closely attached to the inner surface of the cavity MC. An upper heater 252 is arranged on the lower surface of the upper fixed plate 212, and an upper mold UM is mounted below the upper heater 252. On the lower surface of the upper mold UM, a substrate S packaged with a semiconductor wafer can be mounted.

The operation of the compression molding section 20 is as follows. First, a substrate S on which a semiconductor wafer is packaged is mounted on a lower surface of an upper mold UM by a substrate moving mechanism (not shown). Next, the resin material receiving section PC is introduced into the cavity MC by the resin material transfer section 10 (described above), and is sucked from the suction port on the inner surface of the cavity MC, thereby bringing the release film F into close contact. On the inside. The pressing member 16 is repeatedly moved up and down. After the resin material P attached to the film tension frame material 13 is detached from the film tension frame material 13 (described above), the resin material transfer portion 10 is returned from the compression molding portion 20 to the table TB. . In addition, the mounting of the substrate S to the upper mold UM and the introduction of the resin material storage portion PC to the cavity MC may be performed in the reverse order to the above.

In this state, the resin material in the cavity MC is made by the lower heater 251 P is softened by heating, and the substrate S is heated by the upper heater 252. In a state where the resin material P and the substrate S are heated, the movable platen 23 is raised by the clamping device 24, and the molding die (upper mold UM and lower mold LM) is clamped to harden the resin material P. After the resin material P is hardened, the movable platen 23 is lowered by the clamping device 24 to open the mold. Thereby, a resin-sealed product (resin molded product) obtained by sealing a semiconductor wafer with a resin can be obtained. The obtained resin-sealed product was covered with a release film on the inner surface of the lower mold LM, and the film was smoothly removed from the lower mold LM.

Another embodiment of the resin molding apparatus of the present invention will be described with reference to FIG. 7. The resin molding apparatus 30 of this embodiment includes a material receiving module 31, a molding module 32, and a distribution module 33. The material receiving module 31 is a device for receiving the resin material P and the substrate S from the outside and sending it to the forming module 32, and has a substrate receiving section 311 and a resin material supplying section 312. One forming module 32 includes one set of The compression-molded portion 20. Although three forming modules 32 are shown in FIG. 7, an arbitrary number of forming modules 32 may be provided in the resin molding apparatus 30. Moreover, even after the resin molding apparatus 30 is assembled and used, the molding module 32 can be increased or decreased. The distribution module 33 is a person who carries in a resin molded product manufactured by the molding module 32 from the molding module 32 and stores it, and has a resin molded product storage unit 331.

A main substrate conveying device 36 for conveying the substrate S, the resin material transfer section 10, and the resin molded product is provided so as to penetrate the material receiving module 31, one or more forming modules 32, and the distribution module 33. Also, in each module, a substrate S, a resin material transfer section 10, and a sub-transfer device 37 for transferring resin between the main transfer device 36 and the devices in the module are provided. The main conveying device 36 and the sub conveying device 37 have a function as a moving means in the conveying mechanism 15 described above.

The operation of the resin molding apparatus 30 will be described. Substrate S The substrate receiving section 311 is stored in the material receiving module 31. The main transfer device 36 and the sub transfer device 37 transfer the substrate S from the substrate receiving portion 311 to the compression molding portion 20 located in one of the molding modules 32, and the substrate S is mounted on the compression molding portion 20 to mold UM. . Then, in the material receiving module 31, the resin material P is supplied to the resin material transfer section 10 in the above-described manner (FIGS. 4 (a) to (d)). Then, the main conveying device 36 and the auxiliary conveying device 37 provided in one of the molding modules 32 move the resin material transfer section 10 to the mold of the lower mold LM in the compression molding section 20 of the molding module 32. The cavity MC is directly above (FIG. 4 (e)), and the resin is supplied to the cavity MC by the above method (FIG. 4 (f), (g), FIG. 5). Then, after the resin material transfer section 10 is carried out to the material receiving module 31 by the main transfer device 36 and the sub transfer device 37, compression molding is performed in the compression molding section 20. During the compression molding in the compression molding section 20, the other compression molding sections 20 are operated in the same manner as before, so that the compression molding can be performed in parallel in a plurality of compression molding sections 20 by staggering the time. The resin molded product obtained by the compression molding is carried out from the compression molding section 20 by the main transfer device 36 and the sub transfer device 37, and is transferred to the resin molded product storage section 331 of the distribution module 33 for storage. The user can appropriately take out the resin molded product from the resin molded product storage unit 331.

The present invention is of course not limited to the above-mentioned embodiments, and various modifications can be made.

In addition, the resin molding apparatus of the present invention exhibits the above-mentioned effects particularly when a powdery resin material is used, but it can also be applied to a case where a resin material in other forms such as a pellet or a liquid is used. For example, a fine powder having a particle size smaller than that of the particles is attached to the surface of the particles of the granular resin material. Even if such fine powder temporarily adheres to the film tension frame material, the pressing member can be repeatedly moved up and down by the driving portion and the pressing structure can be used. The action of pressing the film tension frame material by the pieces can detach the fine powder from the film tension frame material, thereby reducing the contamination of the transport path by the fine powder.

Claims (3)

A resin molding device, comprising: a) a resin material storage frame having an opening; b) an adsorption mechanism for covering a lower surface of the resin material storage frame including the opening; The film is adsorbed on the lower surface of the resin material storage frame; c) the film tension frame material is provided so as to be able to rise and fall so as to surround the inner wall of the resin material storage frame; d) the stop portion which makes the film tension frame The material stops at a predetermined height position; e) a pressing member that presses the film tension frame material from above; and f) a driving unit that moves the pressing member up and down and moves the pressing member up and down to adhere to the film The resin material of the tension frame is dropped. A method for manufacturing a resin molded product, comprising the steps of: arranging a film so as to cover a lower surface of a resin material storage frame having an opening portion including the opening portion; and supplying a resin material to the resin material storage frame to surround the resin material storage frame. The inner side of the film tension frame material that can be raised and lowered; the film is adsorbed on the lower surface of the resin material storage frame while the resin material storage frame is raised while the film tension frame material is lowered. And stop at a predetermined height position, whereby the film protrudes downward and is formed in a resin material storage portion containing a resin material inside; the resin material storage portion is stored in a cavity of a molding die; the film is released from the above Adsorption of the lower surface of the resin material accommodating frame causes the resin material accommodating frame to rise; and pressing the film tension frame material from above by a pressing member, and pulling up the pressing member to adhere to the film tension The resin material of the frame material is dropped. For example, the method for manufacturing a resin molded product according to the second patent application range, wherein the resin material is supplied to the inside of the film tension frame material until the resin material storage portion is stored in the cavity of the molding mold, and the method is maintained by the above. A state where the pressing member presses the film tension frame material from above.