JP6127660B2 - Light emitting element mounting lead frame, light emitting element mounting resin molded body and manufacturing method thereof, and transfer molding die - Google Patents

Description

  The present invention relates to a light emitting element mounting lead frame, a light emitting element mounting resin molding, a method for manufacturing the same, and a transfer molding die.

  A surface-mounted light-emitting device (hereinafter simply referred to as a “light-emitting device”) on which a light-emitting element such as a light-emitting diode (LED) or a laser diode (LD) is mounted has a high-luminance light with excellent visibility. In addition to being able to develop color, it has a number of advantages such as miniaturization, low power consumption, and long life. For this reason, the light-emitting device is used as, for example, a lighting device such as a light bulb, a downlight, a baselight, a streetlight, a traffic light, a backlight light source such as a liquid crystal display, and the use thereof is rapidly expanding.

  A light emitting device includes a unit mounting area composed of a first lead and a second lead that are spaced apart from each other and arranged in the lateral direction, and a resin that is formed on the surface of the unit mounting area and has a recess that exposes the unit mounting area on the bottom surface A layer, a light emitting element mounted in a unit mounting region on the bottom surface of the recess, and a transparent resin layer made of a transparent resin filled in the recess (see Patent Documents 1 and 2).

  14 and 15 are a perspective view and a plan view schematically showing a configuration of a conventional lead frame 100, respectively. In FIG. 14, each unit mounting area 110 is shown in a simplified manner. The light emitting device includes, for example, a transfer molding die on the surface of a lead frame 100 including an assembly of a plurality of unit mounting regions 110 that are arranged vertically and horizontally and a frame portion 111 that surrounds the assembly. A resin layer (not shown) having a concave portion at a position corresponding to each unit mounting region 110 is integrally molded, and the light emitting element is mounted in the concave portion so as to be able to conduct electricity with each lead, and a transparent resin layer is formed. After the assembly of the light emitting devices is manufactured, the assembly is manufactured by separating the assembly. A predetermined portion of the frame portion 111 of the lead frame 100 is an ejector pin abutting portion 113 that presses the ejector pin when the resin molded body is removed from the mold.

  FIG. 16 is a cross-sectional view schematically showing a step of removing the resin molding 101 from the transfer molding die 102. When the resin molded body 101 integrally molded with the resin layer 103 having the recesses on the lead frame 100 is removed from the transfer mold, the resin molded body 101 is configured as shown in FIGS. A plurality of ejector pin contact portions 113 of the frame portion 111 of the lead frame 100 are pressed with ejector pins (see Patent Document 3).

  More specifically, as shown in FIG. 16, an upper mold 120, a lower mold 121, a plurality of ejector pins 122 inserted in the thickness direction from the back of the upper and lower molds 120, 121, and a plurality of A resin molded body 101 is manufactured by integrally molding the resin layer 103 on the surface of the lead frame 100 using a transfer molding die 102 that includes an ejector plate 123 that supports an ejector pin 122 so as to be movable up and down (FIG. 5). 16 (a)). At this time, the surface of the resin layer 103 of the resin molded body 101 is in contact with the lower mold 121, and the surface (back surface) of the lead frame 100 is in contact with the upper mold 120.

  Next, the ejector pin 122 provided in the upper mold 120 is used to push the upper mold 120 in a state where the ejector pin contact portion 113 of the frame portion 111 in the lead frame 100 provided in the resin molded body 101 is pressed from the lead frame 100 side. The resin molded body 101 is removed from the upper mold 120 (FIG. 16B). Further, the lower die 121 is lowered while the ejector pin contact portion 113 of the frame portion 111 in the lead frame 100 provided in the resin molding 101 is pressed from the resin layer 103 side by the ejector pin 122 provided in the lower die 121. Then, the resin molding 101 is removed from the lower mold 121 (FIG. 16C). Thereby, the mold release of the resin molding 101 from the transfer molding die 102 is completed.

  However, in this method, since the resin layer 103 is easily attached to the lower mold 121, there is a problem that the releasability from the lower mold 121 of the resin layer 103 is deteriorated. As a result, in the step shown in FIG. 16C, when the lower mold 121 is lowered while pressing the resin layer 103 with the ejector pin 122, the resin molded body 101 is bent or deformed. A mold release stress is applied to 103 and cracks and chips are easily generated. As a result, when the resin molded body 101 is finally separated into pieces, many reflectors in which cracks and chips are generated in the resin layer 103 are generated, and the defective product rate is increased. Even if a light emitting element is mounted on such a reflector, it cannot be used as a product of a light emitting device. On the other hand, in order to increase the number of reflectors to be taken, the lead frame 100 and the resin layer 103 are increased in area, or the recesses in the resin layer 103 are deepened to reduce the area per reflector. Such a configuration further reduces the releasability of the resin layer 103 from the lower mold 121.

  As described above, when only the peripheral portion of the resin molded body 101 is pressed by the ejector pin 122, the resin molded body 101 is likely to be bent or deformed at the boundary between the peripheral portion and the central region. The generation of cracks and chips cannot be sufficiently suppressed. In addition, the peripheral portion of the resin molded body 101 (the frame portion 111 of the lead frame 100) is pressed by the ejector pin 122, and a predetermined portion selected from the assembly of the unit mounting regions 110 of the lead frame 100 in the resin molded body 101 is pressed. Even when the resin layer coated on the surface of the unit mounting area 110 is pressed with another ejector pin, local concentration of stress is likely to occur in the unit mounting area 110 of the predetermined portion and the resin layer on the surface, and the resin layer as a whole. Occurrence of bending or deformation of the molded body 101 cannot be avoided.

JP-A-11-307820 JP 2010-62272 A JP 2000-33637 A

The object of the present invention is to suppress the occurrence of cracks and chips in the resin layer of the resin molded body when the resin molded body for mounting a light emitting element is removed from the mold for transfer molding. It is an object to provide a lead frame for mounting a light emitting element that can increase the yield of the reflector and the light emitting device.
Another object of the present invention is to provide a resin molded body for mounting a light emitting element using the lead frame, a transfer molding die for manufacturing the resin molded body, and a method for manufacturing the resin molded body. .

  As a result of intensive research in order to solve the above problems, the present inventors, in a lead frame comprising an assembly of a plurality of unit mounting regions and a frame portion that surrounds and supports the assembly, A predetermined portion of the frame portion is used as a first ejector pin contact portion, and a portion including at least one of the unit mounting regions included in the aggregate is used as a continuous plate-like second ejector pin contact portion. Inspired by composition.

  When the present inventors remove the resin molded body produced using the lead frame having the first and second ejector pin contact portions from the transfer molding die, the first and second By pressing the resin layer coated directly on the surface of the corresponding ejector pin with the first and second ejector pins, almost no release stress is applied to the resin molded body. In addition, local concentration of stress does not occur in the second ejector pin abutting portion and its surroundings, and bending and deformation of the resin molded body are remarkably suppressed, and fine cracks in the resin layer of the resin molded body after demolding It has been found that the occurrence of chipping can be remarkably suppressed, and the yield of individual molded resin molded bodies (reflectors) and light-emitting devices used as products can be greatly increased, and the present invention has been completed.

  The present invention includes the following (1) to (4) light emitting element mounting lead frame, the following (5) and (6) light emitting element mounting resin moldings, the following (7) transfer molding molds and the following ( The manufacturing method of the resin molding for light emitting element mounting of 8) is provided.

  (1) A light emitting element mounting lead frame in which a plurality of unit mounting areas composed of two or more lead portions spaced apart from each other are arranged in a row in a vertical and horizontal direction. A connecting portion that is connected, and a frame portion that surrounds an assembly of a plurality of unit mounting areas that are connected vertically and horizontally through the connecting portion, and a predetermined portion of the frame portion is brought into contact with the first ejector pin A lead frame for mounting a light emitting element, wherein a portion including at least one of the unit mounting regions included in the assembly surrounded by the frame portion is used as a continuous plate-like second ejector pin contact portion.

(2) A plurality of second ejector pin contact portions are provided in the assembly surrounded by the frame portion, and the plurality of second ejector pin contact portions are partitioned by an arbitrary virtual line passing through the center of the assembly. The lead frame for mounting a light emitting element according to the above (1), which is distributed on both sides.
(3) The lead frame for mounting a light emitting element according to (2) above, wherein the second ejector pin abutting portions are provided dispersed in point-symmetric positions with respect to the center of the assembly.
(4) The light emitting element mounting according to any one of the above (1) to (3), wherein two or more aggregates of a plurality of unit mounting regions are provided, and the frame portion is a lattice-shaped frame portion surrounding each of the two or more aggregates. Lead frame.

(5) The light emitting element mounting lead frame according to any one of the above (1) to (4), and a resin layer that is integrally molded with the lead frame and has a plurality of recesses that expose the surface of each unit mounting region as a bottom surface. And a resin molded body for mounting a light emitting element.
(6) The resin molded body for mounting a light emitting element according to (5) above, wherein a resin layer is formed on the second ejector pin contact portion of the lead frame.

  (7) A light emitting element mounting resin using a light emitting element mounting lead frame including the first ejector pin contact portion and the second ejector pin contact portion according to any one of the above (1) to (4) A transfer mold having an upper mold and a lower mold for manufacturing a molded body, which is inserted from the back side of the upper mold and the lower mold, and is a first lead frame in the resin molded body The first ejector pin provided so as to be able to press the resin layer covering the ejector pin contact portion directly or on the corresponding contact portion is inserted from the back side of the upper mold and the lower mold, and the resin molded body A second ejector pin that is provided so that the second ejector pin abutting portion of the lead frame can be pressed directly or a resin layer that covers the corresponding portion can be pressed, and the first and second ejector pins are supported so as to be movable up and down. Eje Transfer mold comprising a Tapureto, the.

  (8) A method of producing a light-emitting element mounting resin molded body using the light-emitting element mounting lead frame of any one of (1) to (4) and the transfer molding die of (7) above. After the resin layer is integrally molded on the surface of the lead frame in the mold to produce a resin molded body, the first ejector pin contact portion of the lead frame in the resin molded body is coated directly or on the corresponding contact portion. The resin layer formed by pressing the resin layer with the first ejector pin and covering the second ejector pin contact portion of the lead frame in the resin molded body directly or on the corresponding contact portion with the second ejector pin A method for producing a resin molded body for mounting a light emitting element, wherein the resin molded body is removed from a mold by pressing.

  The light emitting element mounting lead frame of the present invention includes a plurality of unit mounting regions each having two or more lead portions spaced apart from each other in a vertically and horizontally spaced manner, and a connecting portion that connects the plurality of unit mounting regions vertically and horizontally. A frame portion surrounding the assembly of a plurality of unit mounting regions arranged vertically and horizontally through the connecting portion, and a predetermined portion of the frame portion as a first ejector pin contact portion, and the frame portion A portion including at least one of the unit mounting regions included in the assembly surrounded by the structure is configured as a continuous plate-like second ejector pin contact portion.

  When the resin molded body in which the resin layer is integrally molded on the surface of the lead frame having such a structure is removed from the transfer molding die, the lead frame frame portion (first part) in the resin molded body is conventionally used. (1 ejector pin contact portion) is not pressed by a plurality of first ejector pins, and at the same time, a continuous plate provided at a portion including at least one unit mounting area surrounded by the frame portion By pressing the second ejector pin abutting portion with the second ejector pin, the release stress from the mold of the resin molded body is reduced, and the resin layer in the resin layer accompanying bending or deformation of the resin molded body is reduced. The generation of fine cracks and chips is significantly suppressed. As a result, the yield of individualized resin molded bodies (hereinafter referred to as “reflectors”) and light emitting devices obtained from one resin molded body is increased, and the defective product rate and manufacturing cost can be reduced.

  In the present invention, a plurality of second ejector pin contact portions are provided in the assembly surrounded by the frame portion, and the plurality of second ejector pin contact portions are partitioned by an arbitrary virtual line passing through the center of the assembly. By being configured to be dispersed on both sides, the mold release stress when the molded resin is removed from the mold is further dispersed and alleviated, and the generation of fine cracks and chips in the resin layer is further suppressed. Is done.

  In the present invention, the plurality of second ejector pin contact portions are provided so as to be distributed at point-symmetric positions with respect to the center of the assembly, thereby reducing the number of second ejector pin contact portions. Even if there are at least two, the effect of dispersing and relaxing the mold release stress when the molded resin is removed from the mold can be sufficiently exhibited, and the occurrence of fine cracks and chips in the resin layer can be suppressed.

  In the present invention, a plurality of unit mounting region aggregates are provided, and a lead frame having a grid-like frame part surrounding each of the two or more aggregates is formed, thereby making a large number of the first as a whole. Since the first and second ejector pins can be pressed, the resin molded body can be removed from the mold stably and reliably while reducing the mold release stress, which is industrially advantageous. It is.

A resin molded body for mounting a light emitting element according to the present invention includes the lead frame, and a resin layer integrally formed on the surface of the lead frame, and having a plurality of concave portions where the surface of each unit mounting region is exposed as a bottom surface. In particular, not only the first ejector pin contact portion that is the frame portion of the lead frame but also the second ejector pin contact portion is provided in the assembly surrounded by the frame portion, so that release stress is not so much applied. In this state, the mold can be removed from the mold, and the yield of reflectors and light emitting devices that can be used as products increases.
In the present invention, the resin layer is coated on the second ejector pin abutting portion of the lead frame, so that the effect of dispersing and relaxing the stress when the second ejector pin is pressed is further increased as a product. The yield of usable reflectors and light emitting devices is increased.

  The transfer molding die of the present invention is inserted from the back side of the upper die and the lower die, and the first ejector pin abutting portion of the lead frame in the resin molding is formed directly or on the corresponding portion. The first ejector pin provided so as to be able to press the resin layer to be pressed, and the second ejector pin contact portion of the lead frame in the resin molded body directly or from the back side of the upper die and the lower die By providing a second ejector pin that is provided so as to be able to press the resin layer that is formed to cover the contact portion, and an ejector plate that supports the first and second ejector pins so as to be movable up and down, the first and first It can be suitably used for manufacturing a resin molded body for mounting a light emitting element using the lead frame provided with the ejector pin abutting portion.

  In addition, since the mold of the present invention can be obtained by only a small modification of providing the second ejector pin without greatly modifying the conventional mold having the first ejector pin, the manufacturing cost and maintenance of the mold can be achieved. In this respect, it is almost the same as the conventional mold and is industrially advantageous.

  Since the method for producing a resin molded body for mounting a light emitting element according to the present invention is carried out using the lead frame and the transfer molding die, the resin molded body can be removed from the mold with almost no release stress. Therefore, it is possible to increase the yield of reflectors and light-emitting elements obtained by dividing the resin molding into individual pieces, which is industrially advantageous in terms of a defective product rate and a reduction in manufacturing cost.

It is a top view which shows the structure of a unit mounting area | region typically. It is a top view which shows typically the structure of the unit mounting area | region of another form. 1 is a perspective view schematically showing a configuration of a lead frame according to a first embodiment of the present invention. It is a top view for demonstrating the method to demold the resin molding provided with the lead frame shown in FIG. 3 from a metal mold | die. FIG. 4 is a plan view schematically showing a configuration of a second ejector pin contact portion in the lead frame shown in FIG. 3. It is a top view which expands and shows typically the composition of the 2nd ejector pin contact part. It is a top view which shows typically the structure of the 2nd eject pin contact part of another form. It is a perspective view which shows typically the structure of the lead frame of 2nd Embodiment. It is a top view which expands and shows the structure of the principal part of the lead frame of another form. It is a top view which expands and shows the structure of the principal part of the lead frame of another form. It is drawing which shows typically the structure of one Embodiment of the metal mold | die for transfer molding of this invention. (A) is a top view of the upper mold and a bottom view of the lower mold. (B) And (c) is sectional drawing. It is drawing which shows typically the structure of one Embodiment of the resin molding of this invention. (A) is a plan view showing the surface on the front side of the resin molded body, (b) is a plan view showing the surface on the back side of the resin molded body, (c) is an enlarged view of the main part of (a), and (d) is It is sectional drawing in the XX cut surface line in (c). It is a perspective view which shows typically the structure of the light-emitting device produced using the reflector separated into pieces from the resin molding of this invention. It is a perspective view which shows typically the structure of the conventional lead frame. FIG. 15 is a plan view of the conventional lead frame shown in FIG. 14. It is sectional drawing which shows typically the demolding process from the metal mold | die for transfer molding of the conventional resin molding.

[Lead frame for mounting light emitting elements]
Hereinafter, the lead frame of this embodiment will be described in detail with reference to the drawings. FIG. 1 is a plan view schematically showing the configuration of the unit mounting area 10. FIG. 2 is a plan view schematically showing a configuration of a unit mounting region 10a of another form. FIG. 3 is a perspective view schematically showing the configuration of the lead frame 1 of the present embodiment. FIG. 4 is a perspective view for explaining a method of removing the resin molded body having the lead frame 1 shown in FIG. 3 from the transfer molding die. In FIGS. 3 and 4, the first and second ejector pins 14 a and 14 b are shown in a circular shape in order to clearly show the portion where the first and second ejector pins are pressed. The circular shape does not exist in the frame 1. FIG. 5 is a plan view schematically showing a configuration of a main part of the lead frame 1 shown in FIG. FIG. 6 is a plan view schematically showing the configuration of the second ejector pin contact portion 13 in the lead frame 1 shown in FIG.

  As shown in FIGS. 3 and 4, the lead frame 1 includes a plurality of unit mounting areas 10, a connecting portion 11 that connects the plurality of unit mounting areas 10 at intervals in the vertical and horizontal directions, and vertical and horizontal via the connecting portions 11. A frame portion 12 surrounding the assembly of a plurality of unit mounting regions 10 provided in series, and a predetermined portion of the frame portion 12, which is pressed against a first ejector pin provided in a transfer molding die described later. A portion including at least one of the unit mounting regions 10 included in the assembly of the unit mounting regions 10 surrounded by the first ejector pin abutting portion (not shown) and the frame portion 12 from two or more lead portions Instead of the original configuration of the unit mounting area, a second ejector pin abutting portion 13 configured in a continuous plate shape and pressing a second ejector pin provided in a transfer molding die to be described later, Have

  In the lead frame 1, a plurality of unit mounting areas 10 and four second ejector pin contact portions 13 are arranged in nine rows in the vertical and horizontal directions, but the number of rows in the vertical and horizontal directions is not particularly limited. It is appropriately selected according to various conditions such as the mechanical strength of 1 itself, the dimensions of the unit mounting area 10 and the second ejector pin contact portion 13, and the shape and dimensions of the molding space of the transfer molding die. Further, in the lead frame 1 of the present embodiment, the unit mounting area 10 is arranged at the center position 1A, but the second ejector pin contact portions 13 are arranged according to the number of columns in the vertical and horizontal directions. There are cases. The center position 1A is the center of the assembly of the unit mounting areas 10 surrounded by the frame portion 12, that is, the position that is the middle of the columns of the vertical and horizontal unit mounting areas 10, and has nine vertical and horizontal columns as in this embodiment. Is the fifth column from the top or bottom in the vertical direction and the fifth column from the right or left in the horizontal direction.

  As shown in FIG. 1, the unit mounting area 10 includes first and second lead portions 21 and 22 that are spaced apart from each other and are substantially parallel to each other. That is, the first and second lead portions 21 and 22 are divided into two by a space such as a slit between them, and the second ejector pin described later, which is a continuous metal plate. It is different from the contact portion 13. Each of the first and second lead portions 21 and 22 has a substantially rectangular shape in which the longitudinal direction is the longitudinal direction, and the peripheral portions 21a and 22a are half-etched, respectively. The thickness is thinner than other portions of the second lead portions 21 and 22. In the present embodiment, the shape of the first and second lead portions 21 and 22 is substantially rectangular. However, the shape is not limited to this, and the four corners of the rectangle are missing in the shape of a triangle, a rectangle, or the like, and the four corners of the rectangle are A rounded shape, a square shape, a rhombus shape, a semicircular shape, an oval shape, or the like may be used.

  When a light emitting device is manufactured by forming a resin layer in the unit mounting region 10 and mounting a light emitting element, the first lead portion 21 has, for example, a die pad function for mounting the light emitting element and one of positive and negative electrode functions. It is preferable that the second lead portion 22 has, for example, the other positive / negative electrode function. Needless to say, the first lead portion 21 may have only an electrode function, and the second lead portion 22 may have a die pad function and an electrode function.

  As a modification of the unit mounting area 10, a unit mounting area 10a shown in FIG. The unit mounting region 10a is separated from the first lead portion 23 and substantially parallel to the first lead portion 23 on both sides of the first lead portion 23 and the first lead portion 23 in the lateral direction. The second and third lead portions 24 and 25 are arranged in the same manner. Each of the first, second, and third lead portions 23, 24, and 25 has a substantially rectangular shape in which the longitudinal direction is the longitudinal direction, and the peripheral portions 23a, 24a, and 25a are half-etched. The thickness is thinner than other portions of the first, second, and third lead portions 23, 24, and 25, respectively. In the unit mounting area 10a, for example, the first lead portion 23 has a die pad function, the second lead portion 24 has one positive / negative electrode function, and the third lead portion 25 has a positive / negative other electrode function. It is preferable to have it.

  The surfaces of the first and second lead portions 21 and 22 in the unit mounting area 10 and the surfaces of the first, second, and third lead portions 23, 24, and 25 in the unit mounting area 10a have gold, silver, copper A metal layer made of aluminum or the like can be formed. The thickness of a metal layer is not specifically limited, It selects suitably according to the kind etc. of the metal which comprises a metal layer. For example, when the metal is silver, the thickness is preferably 0.5 μm to 20 μm, more preferably 1 μm to 15 μm, from the viewpoint of suppressing discoloration, heat generation, peeling, and the like of the metal layer. The metal layer can be formed using various methods such as electroplating, chemical plating, vapor deposition, sputtering, and diffusion. The lead frame 1 is formed by an etching method or the like using a metal material that is a good electrical conductor. The metal material is not particularly limited, but a metal material having a volume resistance of less than 0.07 Ω · m and a thermal conductivity of 60 W / (m · k) or more is preferable. For example, iron, copper, copper alloy (for example, Phosphor bronze).

  In this embodiment, the unit mounting regions 10 and 10a shown in FIGS. 1 and 2 are given as specific examples of the unit mounting region. However, the unit mounting regions 10 and 10a are not limited to this, and a die pad function for mounting a pair of positive and negative electrodes and a light emitting element is provided. Any known unit mounting area can be used as long as it has one.

The connecting portion 11 includes a connecting piece 11a for connecting the first lead portion 21 in the vertical direction, a connecting piece 11b for connecting the second lead 22 in the vertical direction, the first lead portion 21 and the left lateral direction thereof. It consists of the connection piece 11c which connects the 2nd lead part 22 adjacent to a horizontal direction.
The frame portion 12 is located at the periphery of the lead frame 1 and surrounds and integrally supports the assembly of the plurality of unit mounting regions 10 connected by the connecting pieces 11a, 11b, and 11c. A predetermined portion of the frame portion 12 serves as a first ejector pin contact portion, and as shown in FIGS. 3 and 4, the resin molded body in which the resin layer is integrally molded with the lead frame 1 is removed from the transfer mold. At this time, the plurality of first ejector pins 14a are pressed.

  The second ejector pin contact portion 13 is a portion that presses the second ejector pin 14b when the resin molded body is removed from the transfer molding die, and as shown in FIG. It is configured as a single continuous metal plate that is not separated by a large space. As shown in FIGS. 5 and 6, the second ejector pin contact portion 13 of the present embodiment is connected to the unit mounting area 10 in the vertical and horizontal directions by connecting pieces 11 a, 11 b, and 11 c, as in the unit mounting area 10. Has been.

  When the second ejector pin 14b is pressed against the second ejector pin abutting portion 13, the resin layer is formed by covering the surface of the corresponding contact portion 13 with the case of directly pressing the second ejector pin 14b. It may be pressed against the surface. By forming a resin layer on the second ejector pin abutting portion 13, the effect of stress distribution and relaxation when the second ejector pin 14 b is pressed is further increased. The yield of the device is increased.

  Further, the second ejector pin contact portion 13 is provided at a portion including at least one unit mounting region 10 in an aggregate of a plurality of unit mounting regions 10 surrounded by the frame portion 12 in the lead frame 1. In the present embodiment, a total of four unit mounting regions 10 in the second row in the vertical and horizontal directions with the center position 1A of the lead frame 1 as the first row are replaced with the second ejector pin contact portions 13. Thereby, on both sides defined by an imaginary line (not shown) passing through the center position 1A, preferably an arbitrary imaginary line (not shown) that passes through the center position 1A and does not pass over the second ejector pin contact portion 13. The second ejector pin contact portions 13 can be provided in a distributed manner. By configuring in this way, bending and deformation of the resin molded body when the resin molded body is removed from the transfer molding die are remarkably suppressed, and fine cracks and chips are generated in the resin layer. Remarkably suppressed.

  Further, in the present embodiment, the unit mounting area 10 at the center position 1A has a substantially rectangular shape as a whole, and therefore, the intersection of the rectangular diagonal lines is the center of the assembly of the unit mounting areas 10. It has become a point. The respective second ejector pin abutting portions 13 that face each other via the center point are dispersedly arranged at point-symmetric positions with respect to the center point. With this configuration, when the mold is removed from the transfer mold, almost uniform stress is applied to almost the entire area of the resin molded body, so that fine cracks and chips are generated in the resin layer. Can be further reduced, and the yield of reflectors and light-emitting devices that can be used as products can be further increased.

  Since the resin molded body is an ultra-thin molded product and the resin layer itself is extremely thin by simply pressing the first ejector pin 14a against a predetermined portion of the periphery of the resin molded body as in the prior art, By bending or deforming around the boundary between the peripheral edge and the center of the molded body, fine cracks and chips are very likely to occur in the resin layer of the entire resin molded body, particularly the resin layer around the boundary. . As a result, the number of reflectors and light-emitting devices that can be used as products obtained from a single resin molded body is reduced, the defective product rate is increased, and this is a factor in increasing the manufacturing cost of the light-emitting devices.

  On the other hand, the second ejector pin contact portion 13 as described above is provided, and the first ejector pin 14a is pressed against a predetermined portion of the periphery of the resin molded body when being removed from the transfer molding die, By pressing the second ejector pin 14b against a predetermined part of the assembly of the unit mounting region 10 in the resin molded body, a fine crack or a chip is generated in the resin layer due to the bending or deformation of the resin molded body. Remarkably suppressed. As a result, even if the number of unit mounting areas 10 in the lead frame 1 is reduced, the number of reflectors and light emitting devices that can be used as products is increased, the defective product rate is reduced, and the manufacturing cost of the light emitting devices is reduced. can do.

  The lead frame 1 is preferably integrally molded by subjecting a single metal plate to a known metal processing process such as a predetermined etching process. As a result, the plurality of unit mounting regions 10 and the second ejector pin contact portion 13 are connected to each other by the connecting portion 11, so that the bonding strength of the second ejector pin contact portion 13 to the connecting portion 11 is obtained. This increases the durability when pressing the second ejector pin 14b, and the effect of providing the second ejector pin contact portion 13 is reliably exhibited.

  FIG. 7 is a plan view schematically showing a modified example of the second ejector pin abutting portion, that is, the configuration of the second ejector pins 15 to 19 of another form.

  The second ejector pin contact portion 15 shown in FIG. 7A is provided on the substantially rectangular contact portion main body 15a connected in the vertical direction by the connecting piece 11e and on both lateral sides of the contact portion main body 15a. The first connection bodies 15b and 15c having a substantially rectangular shape for connecting the coupling pieces 11f and 11g, and the second connection body 15d for connecting the contact portion main body 15a and the first connection bodies 15b and 15c. And is a single continuous metal plate as a whole. Two second connecting members 15d are provided between the contact portion main body 15a and the first connecting members 15b and 15c so as to be separated from each other in the vertical direction. A substantially rectangular hole is formed between the two second connecting bodies 15d facing each other in the vertical direction. The second ejector pin contact portion 15 is connected to a unit mounting area (not shown) in the vertical and horizontal directions by connecting pieces 11e, 11f, and 11g.

  The contact portion main body 15a is connected to the first connection bodies 15b and 15c by a total of four second connection bodies 15d subjected to half-etching, and therefore has a structure rich in elasticity as a whole. As described above, the portion 26 that presses against the second ejector pin, the abutting portion main body 15a to which a stress is directly applied from the outside, and the stress loaded on the abutting portion main body 15a are transmitted to the unit mounting region 10. By adopting a structure in which the second connecting body 15d rich in elasticity is interposed by half etching between the first connecting bodies 15b and 15c, the second molded body is removed from the mold when the second molded body is removed. The stress applied by the ejector pin is sufficiently dispersed and relaxed. As a result, the resin molded body is smoothly demolded, and bending or deformation of the entire resin molded body (particularly around the second ejector pin contact portion 15) is suppressed. And generation | occurrence | production of the fine crack and notch | chip in the resin layer of a resin molding is suppressed notably, and the reduction of a defective product rate is achieved.

  The second ejector pin contact portion 16 shown in FIG. 7B is provided on the substantially rectangular contact portion main body 16a connected in the vertical direction by the connecting piece 11e, and on both lateral sides of the contact portion main body 16a. The contact portion main body 16a is located near the center of the first connector 16b, 16c having a substantially rectangular shape for connecting the connecting pieces 11f, 11g and the second ejector pin contact portion 16 in the vertical direction. And a first connecting body 16b, a second connecting body 16d for connecting the first connecting bodies 16b and 16c in the lateral direction, and a single continuous metal plate. The second ejector pin contact portion 16 is connected to a unit mounting region (not shown) in the vertical and horizontal directions by connecting pieces 11e, 11f, and 11g.

  In the second ejector pin abutting portion 16, the abutting portion main body 16a and the first connecting bodies 16b and 16c on both sides in the lateral direction are arranged such that the vertical width is the abutting portion main body 16a and the first connecting body 16b. The second ejector pin abutting portion 16 as a whole has a structure in which external stress is dispersed and relaxed by being coupled by a second connecting body 16d that is sufficiently smaller than 16c. As a result, even if the second ejector pin is pushed up against the contact portion main body 16a when the resin molded product is removed from the mold, the entire resin molded product (especially around the second ejector pin contact portion 16). , The occurrence of fine cracks and chips in the resin layer is remarkably suppressed, and a reduction in the defective product rate and a significant increase in the number of reflectors and light emitting devices can be achieved.

  The second ejector pin contact portion 17 shown in FIG. 7C includes a substantially rectangular contact portion main body 17a that presses the second ejector pin, and a contact portion in a state separated from the contact portion main body 17a. A first connection body 17b, which is a frame portion arranged so as to surround the periphery of the main body 17a, and a plurality of second connection bodies 17c that connect the contact portion main body 17a and the first connection body 17b in the vertical and horizontal directions. And is a single continuous metal plate as a whole. In the present embodiment, two second connection bodies 17c are provided in total, two each on the top, bottom, left and right of the contact part main body 17a, and the width dimension thereof is sufficiently smaller than the contact part main body 17a. And half etching is given. The second ejector pin contact portion 17 is connected to a unit mounting area (not shown) in the vertical and horizontal directions by connecting pieces 11a, 11b, and 11c.

  In the second ejector pin abutting portion 17, the second connecting body 17c for transmitting the external stress due to the second ejector pin loaded on the abutting portion main body 17a to the first connecting body 17b is abutted. The width is sufficiently smaller than the part main body 17a, and half-etching is performed so that the structure is rich in elasticity. For this reason, the external stress applied to the contact part main body 17a is dispersed and relaxed, and the stress transmitted to the unit mounting area around the second ejector pin contact part 17 becomes very small. As a result, when the resin molded body is removed from the mold, bending or deformation of the resin molded body is remarkably suppressed, and fine cracks and chips are generated in the resin layer, resulting in an increase in the defective product rate. Can be prevented.

  The second ejector pin contact portion 18 shown in FIG. 7 (d) is connected to unit mounting regions (not shown) adjacent in the vertical and horizontal directions by connecting pieces 11a, 11b, and 11c, and is connected to one continuous metal plate. A substantially circular hole 28 is formed at a predetermined interval, and all portions other than the hole 28 are half-etched portions 27 subjected to half-etching. Thus, by forming the plurality of holes 28 and making the other part the half-etched portion 27, the second ejector pin contact portion 18 has a structure rich in elasticity as a whole. For this reason, the external stress applied to the second ejector pin contact portion 18 is sufficiently dispersed and relaxed by the second ejector pin, and the second ejector pin is removed when the resin molded body is removed from the mold. The stress transmitted around the contact portion 18 is very small. As a result, bending and deformation of the entire resin molded body are remarkably suppressed, and it is possible to prevent the defective product rate from increasing due to generation of fine cracks or chips in the resin layer.

  In addition, although the circular hole 28 is formed in this embodiment, it is not limited to this, The hole of various shapes, such as a square, a rectangle, a polygon, an ellipse, can be formed. In the present embodiment, nine holes 28 are formed. However, the present invention is not limited to this, and any number of one or more holes can be formed.

  The second ejector pin contact portion 19 shown in FIG. 7 (e) is connected to unit mounting regions (not shown) adjacent in the vertical and horizontal directions by connecting pieces 11a, 11b, and 11c, and is connected to one continuous metal plate. A substantially rectangular hole 29 is formed on both sides in the lateral direction of the central portion where the second ejector pin is pressed. Even with such a structure, the external stress due to the second ejector pin can be dispersed and relaxed, the bending and deformation of the resin molded body can be suppressed, and fine cracks and chips can occur in the resin layer, resulting in a defective product rate. Can be prevented from rising.

  In each embodiment shown in FIG. 7, the configuration in which the unit mounting areas are connected to the top, bottom, left, and right of the second ejector pin contact portions 15 to 19 is not limited to this, but the second ejector pin contact is not limited to this. A plurality of second ejector pin contact portions 15 to 19 may be connected to the contact portions 15 to 19 in the up / down / left / right and diagonal directions. Moreover, in this embodiment, when the 2nd ejector pin is directly pressed on the surface of the 2nd ejector pin contact parts 15-19, and the 2nd ejector pin on the surface of the resin layer formed in the surface May be pressed.

  FIG. 8 is a perspective view schematically showing the configuration of the lead frame 2 of the second embodiment. The lead frame 2 has a structure similar to that of the lead frame 1, and common portions with the lead frame 1 are denoted by the same reference numerals and description thereof is omitted. The unit mounting area 10 is shown in a simplified manner.

  The lead frame 2 includes a plurality of unit mounting areas 10, a connecting portion 11 that connects the plurality of unit mounting areas 10 with vertical and horizontal intervals, and a group of unit mounting areas 10 that are connected by the connecting portions 11. A grid-like frame portion 12 that surrounds and supports the first ejector pin abutting portion (not shown) provided in a predetermined portion of the frame portion 12, and a predetermined portion in the assembly of the unit mounting regions 10 And a second ejector pin abutting portion 13 provided. There are two or more aggregates, and each aggregate is supported by being surrounded by a lattice-shaped frame portion 12. In other words, the lead frame 2 is formed by connecting four lead frames 1. In the present embodiment, the number of aggregates is four. However, the number of aggregates is not limited to this, and the number of aggregates may be any number of two or more.

  With this configuration, the number of first and second ejector pins pressed against the lead frame 2 at a time increases, so that the resin mold can be removed from the mold more smoothly. can do. As a result, it is possible to stably and reliably increase the yield of the reflector and the light emitting device obtained by dividing the resin molded body into pieces. Moreover, since many reflectors and light-emitting devices can be obtained by one molding, it is industrially advantageous.

  FIG. 9 is an enlarged plan view showing a configuration of a main part of the lead frames 3 to 6 of the third to sixth embodiments. The lead frames 3 to 6 have a structure similar to that of the lead frame 1, and portions common to the lead frame 1 are denoted by the same reference numerals and description thereof is omitted.

  The lead frame 3 shown in FIG. 9A is a lead frame in which the unit mounting areas 10 are arranged in even rows in the vertical and horizontal directions. In such a lead frame, the center position 1A can be arranged in a total of four in two rows. The lead frame 3 of the present embodiment is characterized in that the second ejector pin abutting portions 13 which are a total of four continuous metal plates are arranged at the center position 1A in two rows and two rows.

  In the present embodiment, a virtual line that passes through the center position 1A of the plurality of unit mounting regions 10 surrounded by a frame (not shown) in the vertical and horizontal directions and does not pass over the second ejector pin contact portion 13 is used. The second ejector pin contact portions 13 are arranged in a distributed manner on both sides of the division. In addition, each pair of second ejector pin contact portions 13 facing in the right oblique direction and the left oblique direction is configured to be point-symmetric with respect to the center of the assembly. Here, the center point of the aggregate is a line connecting the lower left and upper right corners in the space where the lower left, upper left, lower right and upper right corners of each second ejector pin contact portion 13 are opposed to each other. The intersection with the line connecting the lower right corner.

  By configuring in this way, when the resin molded body is removed from the mold, the center of the resin molded body by the plurality of first ejector pins and the pressing to the peripheral part of the resin molded body by the plurality of first ejector pins Since the pressing to the portion is performed simultaneously, the bending and deformation of the resin molded body is remarkably suppressed, and the yield of the reflector and the light emitting device can be increased.

  Note that, as in the present embodiment, it is not necessary that all the four central positions 1A serve as the second ejector pin contact portions 12, for example, two second ejector pin contact portions in one diagonal direction. 13 and two unit mounting regions 10 may be arranged in the other diagonal direction.

  Each of the lead frames 4 to 6 shown in FIGS. 9B to 9D is a lead frame in which the unit mounting regions 10 are arranged in odd rows in the vertical and horizontal directions. In such a lead frame, one unit mounting region 10 or the second ejector pin contact portion 13 that is in the middle of the odd-numbered array in the vertical direction and in the middle of the odd-numbered array in the horizontal direction is surrounded by the frame portion. The center of the assembly of the plurality of unit mounting areas 10, that is, the center position 1 </ b> A. In the following lead frames 4 to 6, the center position 1A is the first row.

  Further, an intersection of diagonal lines of the unit mounting area 10 or the second ejector pin contact portion 13 located at the center position 1A is set as a center point of the assembly. When the unit mounting area 10 is located at the center position 1A, the area includes the first and second lead portions 21 and 22 and the slit-shaped space separating the first and second lead portions 21 and 22. The intersection of diagonal lines is obtained for and is set as the center point of the aggregate.

  The lead frame 4 is characterized in that four second ejector pin abutting portions 13 are arranged in a substantially rhombus or square shape in the third row in the vertical and horizontal directions from the center position 1A. In the present embodiment, the second ejector pin contact portions 13 are arranged in a distributed manner on both sides defined by a virtual line (not shown) passing through the center (center position 1A) of the assembly in the lead frame 4. It is composed. Further, each pair of second ejector pin contact portions 13 facing each other through the center point of the aggregate is configured to be disposed at a point-symmetrical position with respect to the center of the aggregate. .

  The lead frame 5 is characterized in that a total of nine second ejector pin contact portions 13 are arranged in each of the center position 1A and the third row obliquely up, down, left and right from the center position 1A. In the present embodiment, a virtual line (not shown) passing through the center of the assembly (center position 1A) in the lead frame 5, preferably a virtual line passing through the center of the assembly (center position 1A) in the horizontal or vertical direction. The second ejector pin contact portions 13 are arranged in a distributed manner on both sides. Further, each pair of second ejector pin contact portions 13 facing each other through the center point of the aggregate is configured to be disposed at a point-symmetrical position with respect to the center of the aggregate. .

  The lead frame 6 is characterized in that a total of three second ejector pin abutting portions 13 are arranged in the center position 1A and the left and right third rows from the center position 1A. In the present embodiment, a phantom line (not shown) passing through the center of the assembly (center position 1A) in the lead frame 6, preferably the second position located at the center position 1A passing through the center of the assembly (center position 1A). The second ejector pin abutting portions 13 are arranged in a distributed manner on both sides defined by a virtual line that does not pass through the corresponding contact portion 13 other than the ejector pin abutting portion 13. Further, the pair of second ejector pin contact portions 13 facing each other through the center point of the aggregate is configured to be disposed at a point-symmetrical position with respect to the center of the aggregate.

  With such a configuration, when the resin molded body is removed from the mold, the resin molded body is pressed by the plurality of first ejector pins to the peripheral portion of the resin molded body and the plurality of second ejector pins. Since the central portion is pressed simultaneously and the external stress due to the second ejector pin is dispersed and alleviated by the plurality of second ejector pin abutting portions 13 arranged at predetermined positions, the resin molded body Is significantly suppressed, and the yield of reflectors and light emitting devices can be increased.

  FIG. 10 is an enlarged plan view showing a configuration of a main part of the lead frames 7 to 9 according to the seventh to ninth embodiments. The lead frames 7 to 9 have a structure similar to that of the lead frame 1, and portions common to the lead frame 1 are denoted by the same reference numerals and description thereof is omitted.

  Each of the lead frames 7 to 9 shown in FIGS. 10A to 10C is a lead frame in which the unit mounting regions 10 are arranged in odd rows in the vertical and horizontal directions. In the lead frames 7 to 9, one second ejector pin contact portion 13 that is in the middle of the odd-numbered array in the vertical direction and in the middle of the odd-numbered array in the horizontal direction is surrounded by a frame portion (not shown). The unit mounting area 10 is arranged at the center position 1A of the aggregate. In the following lead frames 7 to 9, the center position 1A is the first row.

  The intersection of the diagonal lines of the second ejector pin contact portion 13 located at the center position 1A is set as the center point of the assembly. When the second ejector pin contact portion 13 is a pentagon or more polygon or ellipse, the intersection of the smallest square or rectangular diagonal lines including the second ejector pin contact portion 13 The center point. When the second ejector pin contact portion 13 is circular, the center of the circle is the center point of the assembly.

  In the lead frame 7 shown in FIG. 10A, one second ejector pin contact portion 13 which is a continuous metal plate is disposed at the center position 1A of the assembly. In the lead frame 8 shown in FIG. 10 (b), one second ejector pin abutting portion 13a, which is a continuous metal plate, is disposed at the central position 1A of the assembly, and the second ejector pin The area of the contact portion 13a is smaller than one area of the unit mounting region 10 (region combining the first and second lead portions 21 and 22 and the slit-like space portion separating them). It is configured as follows. In the lead frame 9 shown in FIG. 10 (c), one second ejector pin abutting portion 13b, which is a continuous metal plate, is disposed at the central position 1A of the assembly, and the second ejector pin The area of the contact portion 13 b is configured to be larger than one area of the unit mounting region 10.

  In this way, even when the second ejector pin contact portion is provided only at the center position 1A of the assembly, when the resin molded body is removed from the mold, bending or deformation of the resin molded body is suppressed, The yield of reflectors and light emitting devices can be increased. Further, even if the area of the second ejector pin contact portions 13a and 13b is made smaller or larger than the area of the unit mounting region 10 as in the lead turmes 8 and 9, the resin molded body is removed from the mold. The effect which suppresses the bending, a deformation | transformation, etc. of the resin molding at the time is acquired.

[Method for producing resin molded body for mounting light emitting element and transfer molding die]
In the method for producing a resin molded body of the present invention, a resin layer is integrally molded on the surface of the lead frame of the present invention, that is, the lead frame provided with the first and second ejector pin contact portions in a transfer molding die. After the resin molded body is manufactured, the first ejector pin abutting portion of the lead frame in the resin molded body is pressed directly or with the first ejector pin on the resin layer formed on the corresponding contact portion. A resin mold is formed by transferring the resin layer formed by coating the second ejector pin abutting portion of the lead frame directly or directly on the corresponding contact portion with the second ejector pin. It is characterized by demolding.

  More specifically, in the resin molded body of the present invention, for example, a lead frame having first and second ejector pin contact portions is sandwiched between transfer molding dies (hereinafter simply referred to as “molds”). And fixing (1), injecting a liquid curable resin into the mold (2), and curing the liquid curable resin injected into the mold to produce a resin molding. It can be manufactured by a manufacturing method including the step (3) and the step (4) of removing the resin molding from the mold using the first and second ejector pins provided in the mold.

  The mold of the present invention used here is inserted from the upper mold, the lower mold, and the back side of the upper mold and the lower mold, and comes into contact with the first ejector pin of the lead frame in the resin molded body. A first ejector pin that is provided so that the resin layer that is formed so as to cover or directly cover the corresponding part can be pressed, and the second of the lead frame in the resin molded body is inserted from the back side of the upper mold and the lower mold. A second ejector pin that is provided so as to be able to press the resin layer that directly or directly covers the ejector pin contact portion, and an ejector plate that supports the first and second ejector pins so as to move up and down. It is characterized by providing.

  That is, the mold of the present invention includes a second ejector pin that presses the second ejector pin contact portion of the lead frame included in the resin molded body when the resin molded body is removed from the mold. Can adopt the same structure as a conventional transfer mold. FIG. 11 is a drawing schematically showing a configuration of a transfer molding die 30 (hereinafter simply referred to as “die 30”) according to an embodiment of the present invention. 2A is a top view of the upper mold 40 and a bottom view of the lower mold 41. FIG. (B) And (c) is sectional drawing.

  The mold 30 is supported so as to be movable up and down and has an upper mold 40 having a concave portion of a predetermined shape on the lower surface 40a thereof, and a lower mold 41 supported so as to be movable up and down and having a concave portion of a predetermined shape on the upper surface 41a thereof. When the upper die 40 and the lower die 41 are clamped (FIG. 11 (c)), the inside of the cavity formed by the concave portion of the lower surface 40a of the upper die 40 and the concave portion of the upper surface 41a of the lower die 41 A resin injection means 42 for injecting a curable resin into the cavity, a suction means (not shown) for sucking the inside of the cavity, a mold heating means (not shown) for heating the upper mold 40 and the lower mold 41, and an upper mold A plurality of first ejector pins 43 inserted through the mold 40 and the lower mold 41 from the back surfaces 40b and 41b, respectively, and supported so as to press the first ejector pin contact portions of the lead frame in the resin molded body, And Lee in resin moldings The second ejector pin 44 supported so as to be able to press the second ejector pin abutting portion of the frame and the back surfaces 40b and 41b of the upper die 40 and the lower die 41 are arranged respectively. And ejector plates 45 that support the ejector pins 43 and 44 so as to be movable up and down.

  The upper mold 40 and the lower mold 41 are arranged so that the lower surface 40a and the upper surface 41a are substantially parallel in the vertical direction, and are supported by a driving means (not shown) so as to be movable up and down. The lower surface 40a is formed with a recess capable of accommodating a lead frame. On the upper surface 41a, a concave portion having a three-dimensional unevenness corresponding to a resin layer with holes formed on the front surface of the lead frame is formed. At the time of mold clamping, the lower surface 40a and the upper surface 41a are joined together to form a cavity.

  The resin injection means 42 is provided in the vicinity of one end of the lower surface 40a, and has a convex portion 50 having a tapered shape whose cross section gradually increases in the center direction of the lower surface 40a, and the convex portion when the mold is clamped. 50, a resin injection hole 51 for introducing a liquid curable resin into the cavity, and a convex portion when the mold is clamped. 50 and an upper surface 41b, and a runner 52 that guides the liquid curable resin to the resin injection hole 51, and an internal space that is in communication with the runner 52 and can be filled with the curable resin, are filled in the internal space. A plunger pot 53 that liquefies the curable resin by heating, and a through hole formed in the thickness direction of the lower mold 41 so as to be movable up and down, forming the through hole and the plunger pot 53, Heated to And a plunger 54 for the stage.

  The tablet of curable resin filled in the plunger pot 53 is liquefied by the heating means of the plunger 54, and the obtained liquid curable resin is moved up from the plunger pot 53 by moving the plunger 54 upward. 52 and the resin injection hole 51 are supplied into the cavity. The plunger pot 53 may be filled with a liquid curable resin.

When supplying the liquid curable resin from the plunger pot 53 into the cavity through the runner 52 and the resin injection hole 51, the suction means makes the inside of the cavity in a reduced pressure state, and the liquid curable resin is smoothly put into the cavity. To be supplied to. For example, a vacuum pump or the like is used as the suction means.
The mold heating means heats the mold to heat and cure the liquid curable resin filled in the cavity, and a resin layer is integrally formed on the surface of the lead frame 1 to produce a resin molded body.

  The plurality of first ejector pins 43 are inserted into the upper mold 40 and the lower mold 41 from the back surfaces 40b and 41b, respectively, and are provided with a plurality of predetermined portions (provided on the frame portion of the lead frame 1 in the resin molded body). The surface of the first ejector pin abutting portion) is erected at a position corresponding to the predetermined portion on the surface of the ejector plate 44 so that the surface of the resin layer coated on the predetermined portion can be pressed. The plurality of second ejector pins 44 are inserted into the upper mold 40 and the lower mold 41 from the back surfaces 40b and 41b, respectively, so that four predetermined portions (in the assembly of the lead frame 1 in the resin molded body ( The surface of the second ejector pin abutting portion) is erected at a position corresponding to the predetermined portion of the surface of the ejector plate 44 so that the surface of the resin layer coated on the predetermined portion can be pressed.

  The ejector plate 45 has a plurality of first and second ejector pins 43 and 44 erected at predetermined positions on the lower surface of the upper mold 40 on the back surface 40b side, and the upper surface of the lower mold 41 on the back surface 41b side. A plurality of first and second ejector pins 43 and 44 are erected at predetermined portions. The ejector plate 45 is supported by a drive means (not shown) so as to be movable up and down, thereby supporting the first and second ejector pins 43 and 44 so as to be movable up and down.

  Hereinafter, the manufacturing method of the resin molding of this invention using the lead frame 1 and the metal mold | die 30 is demonstrated in detail.

  In step (1), the upper mold 40 and the lower mold 41 are clamped (FIG. 11C), and the inside of the cavity formed by the lower surface 40a of the upper mold 40 and the upper surface 41a of the lower mold 41 is formed. The lead frame 1 is clamped and fixed to the wire. At this time, the lead frame 1 is fixed so that the front surface on which the resin layer is integrally formed faces downward in the vertical direction.

  In step (2), a liquid curable resin is injected into the cavity in the mold 30 from the resin injection hole 51. At this time, the liquid curable resin is injected while the cavity is being decompressed by the suction means.

  In the step (3), the mold 30 in which the cavity is filled with the liquid curable resin is heated to a predetermined temperature by the mold heating means to cure the liquid curable resin, and the lead frame 1. The resin layer is integrally molded at a predetermined position to produce a resin molded body.

  In step (4), the resin molded body is removed from the mold 30 using the first and second ejector pins 43 and 44. For example, first, the first and second ejector pins 43 and 44 provided in the upper mold 40 are lowered, and the first and second eject pin abutting portions of the lead frame 1 in the resin molding are directly or the corresponding contact portions. The upper mold 40 is raised while pressing the resin layer formed on the cover, and the first and second ejector pins 43 and 44 are raised when the resin molding is removed from the upper mold 40. Next, the first and second ejector pins 43 and 44 provided in the lower die 41 are raised, and the first and second eject pin abutting portions of the lead frame 1 in the resin molded body are directly or directly connected to the corresponding portions. The lower mold 41 is lowered in a state where the coated resin layer is pressed, and the resin molded body is removed from the lower mold 41. Thereby, the mold release from the mold 30 of the resin molded body is completed, and a resin molded body is obtained.

  The obtained molded resin is removed from the mold 30 using the first and second ejector pins 43 and 44, so that bending or deformation at the time of removal is prevented, and a fine crack is formed in the resin layer. Since almost no chipping occurs, the number of reflectors and light emitting devices that can be used as products can be greatly increased. The resin molded body may be divided into individual pieces after mounting the light emitting elements in the respective concave portions on the surface thereof, or may be divided into individual pieces to produce reflectors, and the light emitting elements may be mounted on the individual reflectors.

  In the present embodiment, the first and second ejector pins 43 and 44 are provided on both the upper mold 40 and the lower mold 41, but only the first ejector pin 43 is provided on the upper mold 40, and The lower mold 41 may be provided with first and second ejector pins 43 and 44.

  Molding may be performed at a constant temperature, but the temperature may be changed in multiple steps or continuously as required. It is preferable that the reaction is carried out while raising the temperature in a multistage or continuous manner, rather than at a constant temperature, in that a uniform resin molded body without distortion can be easily obtained. On the other hand, in terms of shortening the molding cycle, it is preferable to perform at a constant temperature.

  Although various curing times can be set, it is preferable to react at a relatively low temperature for a long time because a uniform cured resin body without distortion can be easily obtained. On the other hand, in terms of shortening the molding cycle, it is preferable to react at a high temperature in a short time.

  The pressure at the time of molding can be variously set as required, and the molding can be performed at normal pressure, high pressure, or reduced pressure. It is preferable to cure under reduced pressure in terms of suppressing the generation of voids, improving the filling property, and easily removing volatile components generated in some cases. On the other hand, it is preferable to cure in a pressurized state in terms of preventing the occurrence of cracks and chips in the resin layer of the resin molded body.

  FIG. 12 is a schematic diagram illustrating a configuration of an embodiment of a resin molded body 31 manufactured using the lead frame 1. (A) is a top view which shows the surface 31a of the front side of the resin molding 31. FIG. FIG. 2B is a plan view showing a back surface 31 b of the resin molded body 31. (C) is the principal part enlarged view of the surface 31a. (D) is sectional drawing in the XX cut surface line shown in (c).

  The resin molded body 31 has a thin plate shape, and includes the lead frame (lead frame 1) of the first embodiment and a resin layer 34 integrally molded on the surface of the lead frame. In the surface 31a on the front side of the resin molded body 31, the resin layer 34 has a plurality of recesses 33 in which the unit mounting area 10 is exposed on the bottom surface (FIGS. 12A and 12C). Moreover, in the surface 31b on the back side of the resin molded body 31, the portions of the lead portions 21 and 22 that are not half-etched are exposed, and the slit portions that insulate the portions that are half-etched and the lead portions 21 and 22 are exposed. In the space 32, the resin layer 34 is formed integrally with the front resin layer 34 and exposed (FIG. 12B). The resin molded body 31 can be produced, for example, by performing transfer molding on the lead frame.

  As shown in FIG. 12 (d), the first lead portion 21 includes a first inner lead portion exposed on the bottom surface of the recess 33 and a first outer lead portion connected to the first inner lead portion and in contact with the resin layer 34. With. The second lead portion 22 includes a second inner lead portion exposed on the bottom surface of the recess 33 and a second outer lead portion connected to the second inner lead portion and in contact with the resin layer 34.

  The resin layer 34 is formed so as to rise from the surface of the unit mounting region 10, and reflects and reflects light from the light emitting element forward (an inclined surface facing the recess 51), and fills and cures in the slit-shaped space 32. And an insulating portion that is interposed between the first and second lead portions 21 and 22 to insulate them. The shape of the resin layer 34 and the recessed part 33 is not specifically limited, It can select from a well-known shape suitably.

  Since the resin molded body 31 having the above-described configuration is manufactured using the lead frame of the present embodiment having the first and second ejector pin contact portions, the first and second ejector pins are used. When removing from the mold, the local concentration of stress at the second ejector pin abutting portion and its periphery, in particular, due to the pressing of the second ejector pin is suppressed, and the mold can be removed from the mold without receiving a large release stress. Demolding is possible. Therefore, the occurrence of cracks and chips in the resin layer 34 in the resin molded body 31 after demolding is remarkably suppressed, and the number of reflectors and light emitting devices that can be used as products can be greatly increased.

  The light emitting device may be manufactured by mounting a light emitting element in each recess 33 of the resin molded body 31 and forming a transparent resin layer, and then separating the resin molded body 31 with a cutting blade. It may be produced by dividing into individual pieces, mounting the light emitting element in the concave portion 33 of the obtained reflector, and forming a transparent resin layer. Moreover, the structure shown in FIG.12 (d) is the same as the structure of the reflector of this invention.

  FIG. 13 is a perspective view schematically showing a configuration of a light emitting device 35 according to an embodiment of the present invention. The light emitting device 35 includes a unit mounting area 10 of a lead frame, a resin layer 34 that is integrally formed in the unit mounting area 10 and has a recess 33 in which the surface of the unit mounting area 10 is exposed on the bottom surface, and a bottom surface of the recess 33. A transparent resin layer (not shown) made of a light-emitting element 36 which is mounted on the exposed surface of the unit mounting region 10 so as to be energized with the first and second lead portions 21 and 22 and a transparent resin filled in the recess 33. ).

  In the light emitting device 35, the unit mounting region 10 exposed on the bottom surface of the recess 33 has a resin layer (insulating portion) filled in the first and second lead portions 21 and 22 and the slit-like space 32 that insulates them. Each part is exposed. The light emitting element 36 is fixed to the surface of the first lead portion 21, and the other end of one wire bonding 37 out of two wire bondings 37, 38 such as two gold wires whose one ends are connected to the light emitting element 36. Is connected to the first lead portion 21 and the other end of the other wire bonding 38 is connected to the second lead portion 22, whereby the light emitting element 36 is mounted on the bottom surface of the recess 33. After mounting the light emitting element 36, the recess 33 is filled with a liquid transparent resin to form a transparent resin layer.

  The light emitting device 35 has the advantage that the occurrence of cracks, chips, etc. in the resin layer 34 is remarkably suppressed, so that the deterioration due to moisture absorption is very small and the long-term durability is excellent.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and can of course be implemented in various forms without departing from the gist of the present invention.

1, 2, 3, 4, 5, 6, 7, 8, 9 Lead frame 1A Center position 10, 10a Unit mounting area 11 Connection portion 11a, 11b, 11c Connection piece 12 Frame portion 13, 15, 16, 17, 18 , 19 Second ejector pin contact portion 14a First ejector pin 14b Second ejector pin 21, 23 First lead portion 22, 24 Second lead portion 25 Third lead portion 30 Transfer molding die DESCRIPTION OF SYMBOLS 31 Resin molding 32 Slit-like space 33 Recess 34 Resin layer 35 Light emitting device 36 Light emitting element 37, 38 Wire bonding 40 Upper die 41 Lower die 42 Resin injection means 43 First ejector pin 44 Second ejector pin 45 Ejector Plate 50 Projection 51 Resin injection hole 52 Runner 53 Plunger pot 54 Plunger

Claims (5)

A light-emitting element mounting resin frame comprising a light-emitting element mounting lead frame and a resin layer integrally molded with the lead frame,
The lead frame is a unit mounting region consisting lead portion away two or more mutually are more continuously arranged in a state spaced vertically and horizontally,
A connecting portion connecting the plurality of unit mounting areas with a plurality of connecting pieces at intervals in the vertical and horizontal directions;
A frame that surrounds the assembly of the plurality of unit mounting areas arranged vertically and horizontally via the connecting portion, and
A predetermined portion of the frame portion is a first ejector pin contact portion, and a portion including at least one of the unit mounting regions included in the assembly surrounded by the frame portion is a continuous plate-like first 2 ejector pin abutting portions , the second ejector pin abutting portion is connected to the unit mounting region in the vertical and horizontal directions by the connecting piece,
The resin layer has a plurality of recesses where the surface of each unit mounting region is exposed as a bottom surface,
A resin molded body for mounting a light emitting element , wherein the resin layer is coated on the second ejector pin contact portion of the lead frame . The light emitting element mounting lead frame includes a plurality of the second ejector pin contact portions provided in the assembly surrounded by the frame portion, and the plurality of second ejector pin contact portions are provided on the assembly. The resin molded body for mounting a light emitting element according to claim 1, wherein the resin molded body is distributed on both sides defined by an arbitrary virtual line passing through the center. 3. The light emitting element mounting resin frame according to claim 2 , wherein the light emitting element mounting lead frame is formed by dispersing the second ejector pin abutting portions at points symmetrical with respect to the center of the assembly. The body . 4. The light emitting element mounting lead frame according to claim 1, wherein two or more aggregates of the plurality of unit mounting regions are provided, and the frame portion is a grid-like frame portion surrounding each of the two or more aggregates. 2. A resin molded body for mounting a light-emitting element according to item 1. A method of manufacturing a light emission device for mounting a resin molded body according to any one of claims 1 to 4,
A resin layer is integrally formed on the surface of the lead frame in a mold to produce the resin molded body, and then the first ejector pin contact portion of the lead frame in the resin molded body is directly or correspondingly connected. the resin layer coated formed is pressed by the first ejector pin, and the second ejector pin abutment resin layer coated formed on the lead frame in the resin molded body in a second ejector pin A method for producing a resin molded body for mounting a light emitting element, wherein the resin molded body is removed from the mold by pressing.

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