JP5505735B2 - Light-emitting diode support frame structure and manufacturing method thereof (2) - Google Patents

Description

The present invention relates to a light emitting diode, and more particularly, to a method for manufacturing a light emitting diode support frame structure.

In the constant evolution of science and technology, a number of light emitting diodes have already been applied to lighting fixtures or are manufactured as lamp bulbs, replacing conventional lighting fixtures and lamp bulbs. The production cost of light-emitting diodes has been in the direction of research and development and improvement in how to increase the brightness and heat dissipation effect of light-emitting diodes in the production of light-emitting diode lighting fixtures and lamp bulbs. Has also increased relatively.

The high manufacturing cost of light emitting diodes includes the manufacturing method as one aspect other than the factor of material selection. At present, the conventional light emitting diode fabrication method is as shown in FIGS. 1A and 1B (this is the application number No. 20101022A1 published in Taiwan), in which the lead frame 1a is stamped or etched. Then, a notch 12a is formed on the electrode sheet 11a of the lead frame 1a, a resin sealing body 2a is formed on the lead frame 1a, and after the manufacture of the resin sealing body 2a is completed, Processes such as die bonding, wire bonding and sealing are performed. After the die bonding, wire bonding, and sealing process, the vertical cutting 3a is performed with the notch 12a as a guide, and the horizontal cutting 4a is further performed after the vertical cutting 3a. Form.

Such a light-emitting diode lead frame 1a is integrated with a sheet metal, and individual light-emitting diodes cannot be formed unless secondary cutting such as vertical and horizontal cutting is performed. Since it takes time, process steps are increased, and the lead frame 1a of the light emitting diode is integrated with the sheet metal, it is impossible to confirm the quality by performing a lighting test during the production.

Therefore, the main object of the present invention is to solve the conventional drawbacks. In the present invention, the supporting frame structure of the light emitting diode is manufactured in a strip shape, and further, a precutting line is applied, so that cutting is performed during subsequent processing and manufacturing. In addition, the lighting test and quality can be confirmed during the manufacturing process.

In order to achieve the above object, in the present invention,
As a strip material provided with a plurality of rows of metal frames each including a plurality of sets of electrode plates, each one row is formed by processing a metal material,
Plating a metal layer on the surface of the metal frame,
Forming a long synthetic resin encapsulant having a plurality of hollow functional regions each exposing the electrode plate on each row of metal frame strips on which the metal layer is plated,
Provided is a method (2) for producing a support frame structure of a light emitting diode, including forming a pre-cutting portion between hollow functional regions of a synthetic resin sealing body.

Among these, each set of the electrode plates is configured to include a positive electrode plate and a negative electrode plate, and each set of the electrode plates is connected by two connecting portions, the synthetic resin sealing body The positive electrode plate, the negative electrode plate, and the connection portion are covered.

Of these, the metal layer is silver, gold or palladium.

Among these, each set of the electrode plates is configured to include a positive electrode plate and a negative electrode plate, each set of the electrode plates is connected by two connecting portions, and the upper set of the electrode plates A traction portion is connected to the negative electrode plate or the positive electrode plate of the lower electrode plate and the traction portion of the positive electrode plate or the negative electrode plate close to the strip material is connected to the strip material, A synthetic resin sealing body covers the positive electrode plate, the negative electrode plate, the connection portion, and the pulling portion.

Among these, each set of the electrode plates is configured to include a positive electrode plate and a negative electrode plate, and each of the positive electrode plate or the negative electrode plate in one row of the metal frame and the positive electrode plate or the negative electrode plate in the other metal row of the metal frame It is connected via an external pin of the strip material, and has a hollow hole between the positive electrode plate in a different row and the external pin connected to the negative electrode plate, and the synthetic resin sealing body is the positive electrode The plate and the negative electrode plate are covered.

Of these, the external pins are first cut before cutting the synthetic resin sealing body in the axial direction and pre-cutting.

In order to achieve the above object, a method (2) for producing a support frame structure of a light emitting diode according to the present invention comprises
A metal material is processed and formed as a strip material including a plurality of rows of metal frames each having one row connected by an external pin and each having a plurality of sets of electrode plates on each row,
Plating a metal layer on the surface of the metal frame,
On the strip material of each row of metal frames on which the metal layer is plated, a long synthetic resin sealing body having a plurality of hollow functional regions each exposing an electrode plate is formed,
Cutting external pins connected to each row of the metal frame,
Forming a precutting portion between two adjacent hollow functional regions in the synthetic resin sealing body.

Of these, two positive electrode plates and two negative electrode plates are provided on each set of the electrode plates, and a connecting portion is connected between each set of the positive electrode plate and the negative electrode plate. .

Of these, two positive electrode plates and two negative electrode plates are provided on each set of the electrode plates, and a connecting portion is connected between each set of the positive electrode plate and the negative electrode plate. And a traction portion is connected to the positive electrode plate or negative electrode plate of the upper electrode plate and the negative electrode plate or positive electrode plate of the lower electrode plate, and the traction portion of the positive electrode plate or negative electrode plate adjacent to the strip material After being connected to the strip material and cutting the synthetic resin sealing body in the axial direction, the pulling portion is simultaneously cut, and the synthetic resin sealing body forms a plurality of individual resin bases.

Among these, each pair of electrode plates is provided with two corresponding positive plates and negative plates, and each row of positive and negative plates of the metal frame and the positive and negative plates of the other row of metal frames. The plates are connected via external pins of the strip material, and a hollow hole is provided between the positive pins in different rows and the external pins connected to the negative plates.

In the present invention, since the support frame structure of the light emitting diode is manufactured in a strip shape method, after the subsequent sealing process is completed, the individual light emission can be performed simply by cutting in the axial direction (width direction) at the time of cutting. A resin base of the diode can be obtained, cutting costs can be reduced, and a lighting test and quality can be confirmed in the manufacturing process.

After die bonding, wire bonding, sealing and baking, cutting in the axial direction (width direction) at the time of cutting, and by simply cutting the traction part, a resin base of individual light emitting diodes can be obtained and cutting In addition, the lighting test and quality can be confirmed during the manufacturing process.

After the support frame structure is completed, a long synthetic resin sealing body is formed on the metal frame. After molding the synthetic resin sealing body, the left and right external pins are cut and the external pins are cut. Later (as shown in FIG. 10), the synthetic resin sealing body is pre-cut to obtain a resin base of individual light-emitting diodes, reducing cutting costs and lighting in the manufacturing process. Tests and quality checks can be performed.

The side view and top schematic diagram of the conventional light emitting diode. The side view and top schematic diagram of the conventional light emitting diode. It is the schematic of the manufacture procedure of the support frame structure of the light emitting diode of this invention. Schematic of the support frame structure of this invention. Schematic which shape | molds a synthetic resin sealing body on each one support frame structure of FIG. FIG. 5 is a schematic cutting diagram of a synthetic resin sealing body on the support frame structure of FIG. 4. The schematic of the other Example of the support frame structure of this invention. Schematic which shape | molds a synthetic resin sealing body on the metal frame of each row of the support frame structure of FIG. Schematic of the further another Example of the support frame structure of this invention. Schematic which shape | molds a synthetic resin sealing body on the metal frame of each row of the support frame structure of FIG. Schematic of external pin cutting and precutting of the synthetic resin sealing body of FIG.

Here, the technical contents and detailed description of the present invention will be described with reference to the drawings.

Please refer to FIG. 2 which is a schematic diagram of the manufacturing procedure of the light emitting diode support frame structure of the present invention. At the same time, reference should be made to those disclosed in FIGS. In the manufacturing method (2) of the light emitting diode support frame structure according to the present invention, first, in step 100, as a strip material 10 including a plurality of rows of metal frames 1 each including a plurality of sets of electrode plates 11 in each row. The metal material is formed by press punching or etching, and each set of the electrode plates 11 includes a positive electrode plate 12 and a negative electrode plate 12 ′. In addition, two connection portions 13 are connected between each pair of the electrode plates 11.

In step 101, a metal layer made of silver, gold or palladium is plated on the surface of the metal frame 1.

In step 102, a long synthetic resin sealing body 20 that covers the positive electrode plate 12, the negative electrode plate 12 ′, and the connecting portion 13 using a heat curing or injection technique of a synthetic resin material is arranged in a row of metal frames. 1 is molded. In addition, a plurality of hollow functional regions 21 that expose the positive electrode plate 12 and the negative electrode plate 12 ′ of the electrode plate 11 of the metal frame 1 are formed on the synthetic resin sealing body 20 after the molding (as shown in FIG. 4). .

In step 104, the LED chip 3 is mounted on one of the positive electrode plate 12 or the negative electrode plate 12 '(as shown in FIG. 5).

In step 106, after the die bonding, the wire bonding work of the gold wire 4 is performed (as shown in FIG. 5), and one end of the gold wire 4 is electrically connected to the LED chip 3, and the gold wire The other end of 4 is electrically connected to the positive electrode plate 12 or the negative electrode plate 12 ′ on which the LED chip 3 is not mounted.

In step 108, after wire bonding, a sealing operation is performed in the hollow functional region 21 with a resin material.

In step 110, after sealing, the resin material is baked to form the lens 5 of the hollow functional region 21 after drying and curing (shown in FIG. 5).

In step 112, after the resin material is baked, it is cut in the axial direction 30 using a cutting tool between the hollow functional regions 21 of the synthetic resin sealing body 20.

In step 114, the synthetic resin sealing body 20 is cut in the axial direction 30, and then individual light emitting diodes or precutting portions including the resin base 2 are formed.

In the present invention, since the support frame structure 10 of the light emitting diode is manufactured in a strip-like method, after the subsequent sealing process is completed, the cutting is performed in the axial direction (width direction) 30 at the time of cutting. The light emitting diode resin base 2 can be obtained, cutting costs can be reduced, and a lighting test and quality can be confirmed in the manufacturing process.

Reference is made to what is disclosed in FIGS. The light emitting diode support frame structure of the present invention includes a strip material 10, a synthetic resin sealing body 20, an LED chip 3, a gold wire 4, and a lens 5.

The strip material 10 includes a plurality of rows of metal frames 1 thereon, and a metal layer made of silver, gold, or palladium (not shown) on the surface of each row of the metal frames 1. In addition, a plurality of sets of electrode plates 11 are provided on each row of the metal frames 1, and two positive electrode plates 12 and a negative electrode plate 12 ′ are provided on each set of the electrode plates 11. A connecting portion 13 is connected between each pair of the positive electrode plate 12 and the negative electrode plate 12 ′.

The synthetic resin sealing body 20 covers the metal frame 1 and exposes the positive electrode plate 12 and the negative electrode plate 12 ′ of the electrode plate 11 corresponding to each set of the electrode plates 11. It has a plurality of hollow functional regions 21 to be made.

The at least one LED chip 3 is electrically connected on the positive electrode plate 12 or the negative electrode plate 12 '.

The at least one gold wire 4 has one end electrically connected to the LED chip 3 and the other end electrically connected to the positive electrode plate 12 or the negative electrode plate 12 '.

The lens 5 is provided on the hollow functional region 21 and seals the positive electrode plate 12, the negative electrode plate 12 ′, the LED chip 3, and the gold wire 4 in the hollow functional region 21.

The above-described light emitting diode can be obtained by cutting in the axial direction (width direction) 30 at the time of cutting after sealing is completed, and the resin base 2 of the individual light emitting diode can be obtained, and cutting costs can be reduced. The lighting test and quality can be confirmed during the manufacturing process.

Please refer to FIGS. 6 and 7 which are schematic views of another embodiment of the support frame structure of the present invention, and schematic views of molding a synthetic resin sealing body on a metal frame in each row of the support frame structure of FIG. . As shown in the figure, the support frame structure of the present embodiment and the above-described support frame structure are substantially the same, but different portions are formed in a plurality of rows on the strip material 10 when the fabrication of the support frame structure is completed. A metal frame 1 is provided, a metal layer made of silver, gold, or palladium is provided on each surface of the metal frame 1 (not shown), and a plurality of metal frames 1 are provided on each row. A pair of electrode plates 11 is provided, and two positive electrode plates 12 and two negative electrode plates 12 ′ are provided on each pair of electrode plates 11, and between each pair of electrode plates 11. The connection unit 13 is connected. In order to prevent the relative distance 14 between the positive electrode plate 12 and the negative electrode plate 12 ′ of the electrode plate 11 from being opened during the molding of the synthetic resin sealing body 20, the positive electrode plate 12 of the upper electrode plate 11 and A traction portion 14 is connected to the negative electrode plate 12 ′ and the negative electrode plate 12 ′ or the positive electrode plate 12 of the lower electrode plate 11, and the traction portion 14 of the positive electrode plate 12 or the negative electrode plate 12 ′ adjacent to the strip material 10 It is connected to the strip material 10.

After die bonding, wire bonding, sealing, and baking, it is possible to obtain individual resin bases 2 of light-emitting diodes by cutting in the axial direction (width direction) 30 at the time of cutting and cutting the traction portion 14. In addition to reducing cutting costs, lighting tests and quality checks can be performed during the manufacturing process.

Due to the action of the traction portion 14, the relative interval 14 between the positive electrode plate 12 and the negative electrode plate 12 ′ is opened at the time of molding and manufacturing the synthetic resin sealing body 20, and the synthetic resin sealing body 20. It is possible to prevent subsequent processing after the is formed from becoming difficult and to easily cause defective products.

Still another embodiment of the support frame structure of the present invention, molding a synthetic resin sealing body on each row of metal frames of the support frame structure of FIG. 8, and cutting the left and right external pins of the synthetic resin sealing body of FIG. And FIGS. 8, 9, and 10 which are schematic diagrams of pre-cutting. The support frame structure of the present embodiment is provided with a plurality of rows of metal frames 1 after processing and molding, and each of the metal frames 1 is provided with a metal layer made of silver, gold or palladium on the surface of each row (not shown). A plurality of sets of electrode plates 11 are provided on each row of the metal frames 1, and each set of the electrode plates 11 includes a positive electrode plate 12 and a negative electrode plate 12 ′. In addition, the positive electrode plate 12 or the negative electrode plate 12 ′ in each row of the metal frame 1 and the positive electrode plate 12 or the negative electrode plate 12 ′ in the other row of the metal frame 1 are connected by the external pins 101 of the strip material 10, and Hollow holes 102 are provided between the positive electrode plates 12 in different rows and the external pins 101 connected to the negative electrode plate 12 ′.

After the support frame structure is completed, a long synthetic resin sealing body 20 is formed on the metal frame 1, and after molding the synthetic resin sealing body 20, the left and right external pins 101 are cut, After the cutting of the external pins 101 (as shown in FIG. 10), the synthetic resin sealing body 20 is provided with a pre-cutting portion 40 to obtain a resin base 2 of individual light emitting diodes, thereby reducing the cost of cutting. In addition, a lighting test and quality confirmation can be performed during the manufacturing process.

The above are only preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any equivalent changes and additions made approximately by the scope of the claims of the present invention shall fall within the patent scope of the present invention.

Conventional technology:
1a Lead frame 11a Electrode plate 12a Notch 2a Resin sealing body 3a Longitudinal cutting 4a Lateral cutting
100 to 114 steps 10 strip material 101 external pin 102 hollow hole 1 metal frame 11 electrode plate 12 positive electrode plate 12 ′ negative electrode plate 13 connecting portion 14 pulling portion 20 synthetic resin sealing body 2 resin base 21 hollow functional area 3 LED chip 4 gold wire 5 lens 30 axial direction 40 pre-cutting part

Claims (8)

a) A metal material is processed and formed as a strip material including a plurality of rows of metal frames each including a plurality of sets of electrode plates, and each set of the electrode plates includes a positive electrode plate and a negative electrode plate. Each of the electrode plates is connected by two connecting portions, and the positive electrode plate or negative electrode plate of the upper electrode plate and the negative electrode plate or positive electrode plate of the lower electrode plate are pulled. Connecting the traction part of the positive electrode plate or the negative electrode plate close to the strip material with the strip material,
b) plating a metal layer on the surface of the metal frame;
c) forming a long synthetic resin encapsulant having a plurality of hollow functional regions each exposing the electrode plate on the strip material of each row of metal frames plated with the metal layer;
d) A method for producing a support frame structure for a light emitting diode, comprising: forming a precutting portion between two adjacent hollow functional regions in a synthetic resin encapsulant (2).   The method (2) for manufacturing a support frame structure according to claim 1, wherein the metal layer of step b is silver, gold or palladium.   The method (2) for producing a support frame structure according to claim 1, wherein the synthetic resin sealing body in step b covers the positive electrode plate, the negative electrode plate, the connection portion, and the pulling portion.   The method (2) for producing a support frame structure according to claim 1, wherein the synthetic resin sealing body in step c covers the positive electrode plate and the negative electrode plate. a), each one row are connected by an external pin, and as strip material comprising a plurality of rows of metal frame comprising a plurality of sets of electrode plates each on one row, a metallic material processed molded, set each of the electrode plate There are two corresponding positive plates and negative plates on the top, and a pair of each of the positive plates and the negative plates is connected by a connecting portion,
b) plating a metal layer on the surface of the metal frame;
c) forming a long synthetic resin encapsulant having a plurality of hollow functional regions each exposing the electrode plate on a strip material of a row of metal frames each plated with the metal layer;
d) cutting external pins connected to each row of the metal frames;
e), forming a pre-cutting portion between two adjacent hollow functional regions in the synthetic resin sealing body, and a method (2) for producing a support frame structure for a light-emitting diode. 6. The method (2) for manufacturing a support frame structure according to claim 5 , wherein the metal layer in step b is silver, gold or palladium. A traction portion is connected to the positive electrode plate or negative electrode plate of the upper electrode plate and the negative electrode plate or positive electrode plate of the lower electrode plate, and the traction portion of the positive electrode plate or negative electrode plate adjacent to the strip material is the strip. The method (2) for manufacturing a support frame structure according to claim 5 , wherein the support frame structure is connected to a material. The synthetic resin sealing body of step e with cutting in the axial direction, and cutting the tow portion, the synthetic resin sealing body forming a plurality of discrete resin-based, it claim 7, wherein Method of manufacturing support frame structure (2).