TWM552187U - Lead frame structure with lines - Google Patents

Description

Wire frame structure with lines

The present invention relates to a lead frame, in particular to a quad flat no-lead (QFN), which is a chip-on-lead manufacturing method for fixing a wafer and having double-sided line conduction. .

It is known that the current IC semiconductor wafer or the light-emitting diode of the LED is packaged after the wafer is fixed to the lead frame, and then the gold wire is electrically connected to electrically connect the wafer to the inner leg line. After the wire is formed on the wafer and the lead frame by using a resin, a package is formed and then cut into individual semiconductor elements.

The fabrication cost and yield of the above-mentioned semiconductor components are greatly related to the fabrication of the lead frame. In the prior art, the conventional lead frame 200 (see FIG. 1) is fabricated by punching or etching a metal plate 100. The lead frame 200 has a frame 201. The frame 201 is connected with a plurality of tie bars 202 connected to a metal wafer holder 203, and the link bars 202 are connected thereto. And a lead 204 connected to the frame 201 on the four sides of the metal wafer holder 203, and then the stamped or etched lead frame 200 is plated, and after the wire 200 is plated, the roughening process is performed. The post-production wafer and plastic have high bonding with the lead frame 200 to provide subsequent convenience of solid crystal bonding, wire bonding and sealing.

Since the lead frame 200 described above is manufactured by stamping technology through a die, the manufacturing process is long, the difficulty is high, the yield is not good, and the spacing between the pins 204 is limited and cannot be reduced.

Therefore, the main purpose of this creation is to solve the traditional lack. This creation provides a new technology. It does not need to open the mold for designing the lead, so that the design of the lead frame is flexible, and the line of the lead can be changed at any time. The spacing between the feet is reduced, the production cost is greatly reduced, and the production yield is improved.

For the above purposes, the present invention provides a lead frame structure having a line, comprising: a lead frame, a platform and a line. The lead frame has a frame, a plurality of connecting rods, a metal wafer holder and a through region, and the connecting rods are coupled to the frame and the metal wafer holder. The platform is disposed on the through area, the platform has a front surface and a back surface, the front surface of the platform has a plurality of grooves, each of the grooves has a consistent perforation, and the through holes penetrate the platform Front and back. The circuit is disposed in the trenches and the through holes to penetrate the front surface and the back surface of the platform.

In an embodiment of the present invention, the through region includes a first through region, a second through region, and a third through region, the first through region is located on four sides of the metal wafer holder, and the second through region is located The third through region is located on the metal wafer holder.

In an embodiment of the present invention, the grooves are located on a front surface of the platform of the first through region, and the bottom surface and the wall surface of the grooves are rough surfaces.

In one embodiment of the present creation, the platform is plastic.

In one embodiment of the present invention, the plastic is an epoxy encapsulating material.

In one embodiment of the present invention, the circuit has a plurality of conductive lines and a plurality of conductive portions, and the conductive lines are disposed in the plurality of trenches, and the conductive portions are disposed in the through holes.

In an embodiment of the present invention, a plurality of conductive terminals are further included, and the conductive terminals are electrically fixed to the conductive portions penetrating to the back surface of the platform.

Conventional knowledge

100‧‧‧Metal plates

200‧‧‧ lead frame

201‧‧‧Border

202‧‧‧Links

203‧‧‧metal wafer holder

204‧‧‧ pin

This creation

S100-S110‧‧‧Steps

10‧‧‧Metal plates

1‧‧‧ lead frame

11‧‧‧Border

12‧‧‧Links

13‧‧‧Metal wafer holder

14‧‧‧through areas

141‧‧‧First penetration area

142‧‧‧Second penetration area

143‧‧‧ third penetration area

2‧‧‧ platform

21‧‧‧ trench

211‧‧‧Rough surface

22‧‧‧through holes

3‧‧‧ lines

31‧‧‧Flexible wire

32‧‧‧Electrical Department

4‧‧‧Electrical terminals

FIG. 1 is a schematic view showing the appearance of a conventional lead frame; FIG. 2 is a schematic view showing the manufacturing process of the lead frame of the present invention; FIG. 3 is a schematic view showing the appearance of a metal frame of the lead frame of the present invention; FIG. 3 is a schematic view of the back side; FIG. 5 is a front view of the platform formed on the lead frame of FIG. 3; FIG. 6 is a schematic view of the back side of FIG. 5; FIG. 7 is a schematic view of the groove and the through hole formed on the front surface of the platform; 8, a partial enlarged view of the groove of FIG. 7; FIG. 9 is a schematic view of the back of FIG. 3; FIG. 10A is a schematic view of the groove and through-hole fabrication line and conductive portion of the platform; FIG. 10B, FIG. 10A FIG. 11 is a schematic side view of FIG. 10A; FIG. 12 is a side view of FIG. 10A.

The technical content and detailed description of this creation are described below with reference to the following drawings: Please refer to Figure 2, which is a schematic flow chart of the method for manufacturing the lead frame of the present invention, and also refers to Figure 3-12. As shown in the figure, the method for manufacturing the lead frame of the present invention is to first stamp a metal plate 10 into a lead frame 1, and then use the colloid to project a platform 2 on the lead frame 1 on the platform 2. Making a line 3 with a lead frame 1 so that the lead frame 1 is designed to project It is very large, so that the line 3 can be changed at any time and the line spacing between the lines 3 can be reduced smaller, and the production of the pins is also eliminated, which makes the production more simple, and the production cost is greatly reduced, and the production yield is improved. .

First, as in step S100, a metal plate 10 is provided. In the present drawing, the metal plate 10 is made of a copper metal material.

Step S102, the lead frame is fabricated, and the metal plate 10 is punched by a stamping technique. After the metal plate 10 is stamped, at least one lead frame 1 is formed. Each of the lead frames 1 has a frame 11 and a plurality of connecting rods (Tie a metal wafer holder 13 and a through region 14 , the connecting rod 12 is coupled to the frame 11 and the metal wafer holder 13 , the through region 14 includes a first through region 141 , a second through region 142 , and A third through region 143. The first through region 141 is located on four sides of the metal wafer holder 13 , and the second through region 142 is located on the metal wafer holder 13 , and the third through region 143 is located on the frame 11 .

Step S104, the platform is formed, and the plastic is molded into the first through region 141, the second through region 142 and the third through region 143 of the through region 14 by using an injection or hot pressing technique. Formed with a platform 2. In this figure, the plastic is an epoxy resin encapsulating material (EMC).

Step S106, the groove and the through hole are formed, and a photolithography is performed on one side of the platform 2 by a laser engraving machine (not shown), and a plurality of grooves are formed on one side of the platform 2 after photolithography. The groove 21 and the grooves 21 each have a uniform perforation 22 . The through holes 22 extend through the front and back surfaces of the platform 2, and the grooves 21 form a rough surface 211 on the bottom surface and the wall surface of the trenches 21 during photolithography, and the rough surface 211 forms a line 3 with the metal. The rough surface 211 can be firmly bonded to the line 3.

In step S108, after the trenches 21 and the through holes 22 of the platform 2 are completed, a thin film deposition technique is performed on the trenches 21 and the through holes 22 during the film deposition process. Depositing a metal material in the trenches 21 and the through holes 22 to form a line 3, the circuit 3 includes a plurality of conductive lines 31 and a plurality of conductive portions 32 electrically connected to the conductive lines 31. The conductive portions 32 are penetrated from the front surface of the platform 2 to the back surface of the platform 2.

In step S110, the conductive terminals are formed. After the circuit 3 is fabricated, the tin material is formed on the surface of the conductive portion 32 penetrating the back surface of the platform 2 by a processing technique to form a conductive terminal 4. In the figure, the conductive terminal 4 is a solder ball or a tin pad.

After the above-described steps are completed, the semiconductor package technology can be processed after the metal wafer holder 13 is crystallized, and then the wafer is wired and electrically connected to the line 3.

Please refer to FIG. 3-12, which is a schematic diagram of the fabrication structure of each part of the lead frame structure of the present invention. As shown in the figure, the lead frame structure of the present invention includes: a lead frame 1, a platform 2, a line 3 and a plurality of conductive terminals 4.

The lead frame 1 has a frame 11 , a plurality of tie bars 12 , a metal wafer holder 13 , and a through region 14 . The tie bars 12 are coupled to the frame 11 and the metal wafer holder 13 . The first through region 141, the second through region 142 and a third through region 143 are included. The first through region 141 is located on four sides of the metal wafer holder 13 , and the second through region 142 is located on the metal wafer holder 13 , and the third through region 143 is located on the frame 11 .

The platform 2 is disposed on the through-area 14 of the lead frame 1. The platform 2 has a plurality of grooves 21 on the front surface of the platform 2 of the first through-region 141. The bottom surface and the wall surface of the groove 21 are formed with a rough surface 211 which can be firmly bonded to the line 3 when the line 3 is formed with the metal. The grooves 21 each have a uniform through hole 22 penetrating the front and back sides of the platform 2 . In the figure, the platform 2 is a plastic, and the plastic is an epoxy resin encapsulating material (EMC).

The line 3 has a plurality of conductive lines 31 and a plurality of conductive portions 32. The conductive lines 31 are disposed in the plurality of trenches 21 , and the conductive portions 32 are disposed in the through holes 22 .

The conductive terminals 4 are electrically fixed to the surfaces of the conductive portions 32 that penetrate the back surface of the platform 2. The conductive terminals 4 are provided to be electrically fixed to a circuit board (not shown). In the figure, the conductive terminals 4 are solder balls or tin pads.

By making the line 3 on the above-mentioned platform 2, the design of the lead frame 1 is flexible, so that the line 3 can be changed at any time and the line spacing between the lines 3 can be reduced smaller, and the pin is also eliminated. Production makes the production easier, and the production cost is greatly reduced, and the production yield is improved.

However, the above description is only a preferred embodiment of the present invention, and it is not intended to limit the scope of patent protection of the present creation. Therefore, the equivalent changes made by using the present specification or the content of the schema are all included in the right of the creation. Within the scope of protection, it is given to Chen Ming.

10‧‧‧Metal plates

1‧‧‧ lead frame

11‧‧‧Border

12‧‧‧Links

13‧‧‧Metal wafer holder

14‧‧‧through areas

141‧‧‧First penetration area

142‧‧‧Second penetration area

143‧‧‧ third penetration area

2‧‧‧ platform

21‧‧‧ trench

3‧‧‧ lines

32‧‧‧Electrical Department

Claims (7)

A lead frame structure having a line includes: a lead frame having a frame, a plurality of connecting rods, a metal wafer holder and a through region, the connecting rods being coupled to the frame and the metal wafer holder; a platform Provided on the through area, the platform has a front surface and a back surface, the front surface of the platform has a plurality of grooves, each of the grooves has a consistent perforation, the through holes penetrating the front surface of the platform and The back surface; a line is disposed in the grooves and the through holes to penetrate the front surface and the back surface of the platform. The lead frame structure of the circuit of claim 1, wherein the through region comprises a first through region, a second through region and a third through region, wherein the first through region is located on the metal wafer The four sides of the seat are located on the metal wafer holder, and the third through area is located on the frame. The lead frame structure with a line as described in claim 1, wherein the grooves are located on a front surface of the platform of the first through region, and the bottom surface and the wall surface of the grooves are rough surfaces. The lead frame structure with a line as described in claim 1, wherein the platform is plastic. The lead frame structure with a line as described in claim 4, wherein the plastic is an epoxy resin encapsulating material. The lead frame structure of the circuit of claim 1, wherein the circuit has a plurality of conductive lines and a plurality of conductive portions, wherein the conductive lines are disposed in the trenches, and the conductive portions are disposed In the through holes. The lead frame structure of the circuit of claim 6, further comprising a plurality of conductive terminals electrically connected to the conductive portions penetrating to the back surface of the platform.