JP2013069903A - Light emission diode support frame construction, and manufacturing method thereof (1) - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emission diode support frame construction and a manufacturing method thereof, capable of reducing cutting cost by manufacturing a metal frame in a separation state and in a direct manner, and capable of performing a lighting test and quality confirmation during a manufacturing process.SOLUTION: A metallic material is prepared which is processed as a strip material including a plurality of metal frames, to contain two electrode plates and two connection plates. Then a resin base for covering is molded on the metal frame. Further, the two electrode plates of the metal frame which are not covered with the resin base are cut. After the electrode plates are cut and only connection remains between the resin base and a connection part at a front end face of the two connection plates, die bonding, wire bonding, sealing, baking, and the like are further performed. Finally, the resin base of a light emission diode whose sealing has been completed is pushed and moved in a length direction, so that two connections of the two connection plates are separated from the resin base.

Description

The present invention relates to a light emitting diode, and more particularly, to a method for manufacturing a light emitting diode support frame structure.

In the constant evolution of science and technology, a number of light emitting diodes have already been applied to lighting fixtures or are manufactured as lamp bulbs, replacing conventional lighting fixtures and lamp bulbs. The production cost of light-emitting diodes has been in the direction of research and development and improvement in how to increase the brightness and heat dissipation effect of light-emitting diodes in the production of light-emitting diode lighting fixtures and lamp bulbs. Has also increased relatively.

The high manufacturing cost of light emitting diodes includes the manufacturing method as one aspect other than the factor of material selection. At present, the conventional light emitting diode fabrication method is as shown in FIGS. 1A and 1B (this is the application number No. 20101022A1 published in Taiwan), in which the lead frame 1a is stamped or etched. Then, a notch 12a is formed on the electrode sheet 11a of the lead frame 1a, a resin sealing body 2a is formed on the lead frame 1a, and after the manufacture of the resin sealing body 2a is completed, Processes such as die bonding, wire bonding and sealing are performed. After the die bonding, wire bonding, and sealing process, the vertical cutting 3a is performed with the notch 12a as a guide, and the horizontal cutting 4a is further performed after the vertical cutting 3a. Form.

Such a light-emitting diode lead frame 1a is integrated with a sheet metal, and individual light-emitting diodes cannot be formed unless secondary cutting such as vertical and horizontal cutting is performed. Since it takes time, process steps are increased, and the lead frame 1a of the light emitting diode is integrated with the sheet metal, it is impossible to confirm the quality by performing a lighting test during the production.

Therefore, the main object of the present invention is to solve the conventional drawbacks. In the present invention, the metal frame in the support frame structure of the light emitting diode is manufactured as an individual state directly, so that the cost of cutting in the subsequent processing and manufacturing can be reduced. In addition, the lighting test and quality can be confirmed during the manufacturing process.

In order to achieve the above object, in the present invention,
It is processed and formed as a strip material having a plurality of metal frames, and the metal frames are provided with two electrode plates and two connection plates after molding, two on the front end surfaces of the two connection plates. Prepare a metal material with a symmetric connection,
A resin base that covers the connection portions at the front ends of the two electrode plates and the two connection plates later is formed on the metal frame,
Cutting two electrode plates that are not covered with a resin base in a metal frame, the two electrode plates are bent after cutting, and the resin base is a connection portion on the front end face of the two connection plates Connected to
Provided is a method (1) for producing a support frame structure of a light emitting diode, which includes pushing a resin base in a longitudinal direction to separate two connection portions of the two connection plates from the resin base.

Of these, the processing is press punching or etching.

Among these, the resin base having a hollow functional region that exposes the two electrode plates after molding is molded on the metal frame with a thermosetting resin.

Among these, an LED chip is mounted on one of the two electrode plates.

Among these, at least one end of the gold wire is electrically connected to the LED chip, and the other end of the gold wire is electrically connected to the electrode plate on which the LED chip is not mounted.

Among these, a resin material is injected into the hollow functional region of the resin base.

Among these, after the resin material is baked, the resin material is dried and cured, and then formed as a lens of the hollow functional region.

In order to achieve the above object, the light emitting diode support frame structure (one) obtained by the method of manufacturing the light emitting diode support frame structure of the present invention is
A plurality of metal frames are provided thereon, the metal frames include two corresponding electrode plates and two corresponding connection plates, and the two electrode plates The two connecting plates have a perpendicular relationship with each other, and two strips each having two connecting portions symmetrical on the two connecting plates,
A resin base provided on the metal frame and covering two connection portions of the two electrode plates and the two connection plates; and
Of these, the portions not covered with the resin base by the two electrode plates are cut and bent to connect the resin base and the front end portions of the two connection plates.

Among these, the resin base is a thermosetting resin, and has a hollow functional region on which the two electrode plates are exposed.

Among these, at least one LED chip that is electrically connected to one electrode plate is further provided.

Among these, at least one gold wire is further provided with one end electrically connected to the LED chip and the other end electrically connected to an electrode plate on which the LED chip is not mounted.

Among these, the lens provided further on the hollow functional area | region of the said resin base is further provided.

After sealing, the light-emitting diode of the present invention is separated from the resin base after the two connecting portions of the two connecting plates are deformed by simply pushing the resin base in the longitudinal direction, and the sealing is completed. Individual light emitting diodes are obtained. The manufacture of the light emitting diode becomes easier and simpler, cutting costs can be reduced, and the lighting test and quality can be confirmed in the manufacturing process.

The side view and top schematic diagram of the conventional light emitting diode. The side view and top schematic diagram of the conventional light emitting diode. It is the schematic of the manufacture procedure of the support frame structure of the light emitting diode of this invention. The schematic of strip material provided with a plurality of metal frames of the present invention. FIG. 4 is an enlarged schematic view of one metal frame in FIG. 3. Schematic which has a resin base on the metal frame of FIG. Schematic which cuts the metal frame of FIG. FIG. 6B is a schematic side view that is further bent after the cutting of FIG. 6A. Schematic which mounts LED chip in the resin base of this invention, and wire-bonds and seals. The operation | movement schematic which isolate | separates the resin base and metal frame of FIG.

Here, the technical contents and detailed description of the present invention will be described with reference to the drawings.

Please refer to FIG. 2, which is a schematic diagram of the procedure of the method for manufacturing the light emitting diode support frame structure of the present invention. At the same time, reference should be made to those disclosed in FIGS. In the manufacturing method (1) of the light emitting diode support frame structure of the present invention, first, in step 100, a metal material formed as a strip material 10 including a plurality of metal frames 1 by a processing method such as press punching or etching is used. There are two electrode plates 11, 11 ′ and two connection plates 12, 12 ′ on each of the metal frames 1, and the two connection plates 12, 12 ′ are prepared. Two connecting portions 13 and 13 'extend symmetrically on the front end surface of the two.

Connection of the front end surfaces of the two electrode plates 11, 11 ′ and the two connection plates 12, 12 ′ after molding using a technique in which a thermosetting resin is heated, cured, and molded in step 102 The resin base 2 that covers the portions 13 and 13 ′ is formed on the metal frame 1. Moreover, the resin base 2 is molded so as to have a hollow functional region 21 that exposes the two electrode plates 11, 11 ′.

In step 104, when cutting is performed, a portion of the two electrode plates 11, 11 ′ not covered with the resin base 2 in the metal frame 1 is cut by a cutting tool using a press punching technique, and the two The electrode plates 11, 11 ′ are bent after cutting, and the connection portions 13, 13 ′ (A, FIG. 6A) of the side surface of the resin base 2 and the front end surfaces of the two connection plates 12, 12 ′. Only the connection with B) is left.

In step 106, the LED chip 3 is mounted on the one of the two electrode plates 11, 11 '(shown in FIG. 7).

In step 108, after die bonding, wire bonding work of the gold wire 4 is performed (shown in FIG. 7), and one end of the gold wire 4 is electrically connected to the LED chip 3, while The other end of the gold wire 4 is electrically connected to the electrode plate 11 or 11 ′ on which the LED chip 3 is not mounted.

In step 110, after wire bonding, a sealing operation is performed in the hollow functional region 21 of the resin base 2.

In step 112, after sealing, the resin material is baked to form the lens 5 of the hollow functional region 21 after drying and curing (shown in FIG. 7).

In step 114, it is not necessary to use a cutting tool after baking of the resin material, and by simply pushing the resin base 2 in the longitudinal direction, the two connection plates 12, 12 ' The connecting portions 13 and 13 ′ are deformed and separated from the resin base 2 (shown in FIG. 8), and individual light-emitting diodes that have been sealed are obtained.

In the present invention, the metal frame in the support frame of the light emitting diode is manufactured in an individual state, so that the cutting cost can be reduced and the lighting test and the quality can be confirmed in the manufacturing process.

Reference is made to what is disclosed in FIGS. The light emitting diode support frame structure of the present invention includes a strip material 10, a resin base 2, at least one LED chip 3, at least one gold wire, and a lens 5.

The strip material 10 includes a plurality of metal frames 1 thereon, and two electrode plates 11 and 11 'corresponding to two on the metal frame 1, and two corresponding to two sheets. The connection plates 12 and 12 ′ are provided, and the two connection plates 12 and 12 ′ and the two connection plates 12 and 12 ′ are in a correspondence relationship orthogonal to each other. In addition, two connection portions 13 and 13 'that are two symmetrical are provided on the connection plates 12 and 12', respectively.

The resin base 2 is provided on the metal frame 1, and the resin base 2 includes two connection portions 13 and 13 of the two electrode plates 11 and 11 ′ and the two connection plates 12 and 12 ′. 'Covering. Further, on the resin base 2, a hollow functional region 21 for exposing the two electrode plates 11, 11 'is provided. In addition, after the resin base 2 is mounted on the metal frame 1, the two electrode plates 11, 11 'of the metal frame 1 are cut and bent.

The at least one LED chip 3 is electrically connected on one electrode plate 11 or 11 '.

The at least one gold wire 4 has one end electrically connected to the LED chip 3 and the other end electrically connected to one electrode plate 11 or 11 '.

The lens 5 is provided on the metal frame 1 of the resin base 2 and seals the two electrode plates 11, 11 ′, the LED chip 3 and the gold wire 4 in the hollow functional region 21.

Before the light-emitting diode is sealed, the metal frame 1 is cut only once, and is cut at a place not covered with the resin base 2 by the two electrode plates 11 and 11 ′. And bent. Therefore, after sealing the light-emitting diode, the resin base 2 is simply pushed in the longitudinal direction, and after the two connection portions 13 and 13 ′ of the two connection plates 12 and 12 ′ are deformed, the resin base 2 To obtain individual light emitting diodes that are completely sealed. The manufacture of the light emitting diode becomes easier and simpler, cutting costs can be reduced, and the lighting test and quality can be confirmed in the manufacturing process.

The above are only preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Any equivalent changes and additions made approximately by the scope of the claims of the present invention shall fall within the patent scope of the present invention.

Conventional technology:
1a Lead frame 11a Electrode plate 12a Notch 2a Resin sealing body 3a Longitudinal cutting 4a Lateral cutting
100-114 process 10 strip material 1 metal frame 11, 11 ′ electrode plate 12, 12 ′ connection plate 13, 13 connection part 2 resin base 21 hollow functional area 3 LED chip 4 gold wire 5 lens

Claims (13)

a) processed and formed as a strip material comprising a plurality of metal frames, the metal frame comprising two electrode plates and two connection plates after molding, two on the front end surface of the connection plate Prepare a metal material with a symmetric connection,
b), forming a resin base made of a thermosetting resin covering the connection portions of the two electrode plates and the front end portions of the two connection plates on the metal frame;
c) cutting two electrode plates not coated with a resin base in a metal frame;
d) a method of manufacturing a support frame structure of a light emitting diode, comprising: pressing the resin base to separate the two connection portions of the two connection plates from the resin base; . The method (1) for producing a support frame structure according to claim 1, wherein the processing in step a is press punching or etching. The method (1) for producing a support frame structure according to claim 2, further comprising a hollow functional region that exposes the two electrode plates after the resin base molding in step b. The method (1) for producing a support frame structure according to claim 3, wherein in step c, the two electrode plates are bent after cutting. 5. The support frame structure according to claim 4, further comprising a step c1 of mounting an LED chip on one of the two electrode plates between the step c and the step d. Production method (1). After step c1, one end of at least one gold wire is electrically connected to the LED chip, and the other end of the gold wire is electrically connected to an electrode plate on which the LED chip is not mounted. A method (1) for producing a support frame structure according to claim 5, characterized in that The method (1) for producing a support frame structure according to claim 6, further comprising a step c3 of injecting a resin material into the hollow functional region of the resin base after the step c2. 8. The manufacturing of the support frame structure according to claim 7, further comprising a step c4 of forming the lens of the hollow functional region after baking the resin material and drying and curing the resin material after the step c3. Method (1). A plurality of metal frames are provided thereon, the metal frames include two corresponding electrode plates and two corresponding connection plates, and the two electrode plates The two connecting plates have a perpendicular relationship with each other, and two strips each having two connecting portions symmetrical on the two connecting plates,
A resin base made of a thermosetting resin provided on the metal frame and covering two connection portions of the two electrode plates and the two connection plates;
By cutting and bending a portion that is not covered with the resin base by the two electrode plates, and further pushing the resin base, two connection portions of the two connection plates are deformed, and the resin 1. A support frame structure for a light emitting diode, which is separated from a base (1). The support frame structure (1) according to claim 9, further comprising: a hollow functional region that exposes the two electrode plates on the resin base. The support frame structure (1) according to claim 10, further comprising at least one LED chip electrically connected to one electrode plate. It further comprises at least one gold wire having one end electrically connected to the LED chip and the other end electrically connected to an electrode plate on which the LED chip is not mounted. The support frame structure (1) according to claim 11. 13. The support frame structure (1) according to claim 12, further comprising a lens provided on the hollow functional region of the resin base.