JP2003007946A - Lead frame for surface-mounting led and manufacturing method thereof - Google Patents
Lead frame for surface-mounting led and manufacturing method thereofInfo
- Publication number
- JP2003007946A JP2003007946A JP2001194536A JP2001194536A JP2003007946A JP 2003007946 A JP2003007946 A JP 2003007946A JP 2001194536 A JP2001194536 A JP 2001194536A JP 2001194536 A JP2001194536 A JP 2001194536A JP 2003007946 A JP2003007946 A JP 2003007946A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead frame
- semiconductor chip
- outer lead
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000004065 semiconductor Substances 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 17
- 238000005452 bending Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005336 cracking Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 235000001630 Pyrus pyrifolia var culta Nutrition 0.000 description 1
- 240000002609 Pyrus pyrifolia var. culta Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、表面実装型ＬＥＤ
用リードフレーム及びその製造方法に関する。表面実装
型ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｓｉｏｎ Ｄｉｏｄｅ）
は表面実装デバイス（ＳＭＤ：Ｓｕｒｆａｃｅ Ｍｏｕ
ｎｔ Ｄｅｖｉｃｅ）の１つであり、基板の表面へ直接
はんだ付けして取付けるＬＥＤデバイスである。TECHNICAL FIELD The present invention relates to a surface mount LED.
And a manufacturing method thereof. Surface mount LED (Light Emission Diode)
Is a surface mount device (SMD: Surface Mou
It is an LED device that is directly soldered and attached to the surface of the substrate.
【０００２】[0002]
【従来の技術】表面実装型ＬＥＤリードフレームは、従
来、図２に示すような工程によって製造されていた。長
尺の金属条材はコイルからアンコイルされそりを矯正さ
れて、長尺の平板となり、多段トランスファープレスへ
搬送され、プレス打抜きされる。金属条材として、ＡＬ
ＬＯＹ１９４など銅系合金が一般に使用され、必要に応
じて、ＡｇまたはＰｄを全面メッキした材料を用いる。2. Description of the Related Art Surface mount LED lead frames have conventionally been manufactured by the process shown in FIG. The long metal strip is uncoiled from the coil, the warp is straightened, becomes a long flat plate, is conveyed to a multi-stage transfer press, and is punched. AL as a metal strip
A copper alloy such as LOY194 is generally used, and if necessary, a material obtained by plating Ag or Pd on the entire surface is used.
【０００３】図４はプレス打抜き加工後の従来の半製品
リードフレームの平面図である。チップパッド部１０１
の横にインナーリード部１０２が離れて配置され、イン
ナーリード部１０２にアウターリード部１０３が連続し
ているが、まだ、アウターリード部１０３の周囲は打抜
かれていない。次にアウターリード部１０３の周囲を打
抜き、続いて、アウターリード部１０３以外のリードフ
レーム１の中央には樹脂２がインサートモールドによっ
て付着・固化される。二分割金型の間に金属条材を搬送
し、型を閉じて、型の中に加熱溶融した樹脂を加圧注入
し、冷却、固化して、金属条材の所定の位置に、所定の
形状の樹脂を付着・固化させるものである。樹脂２の側
面２０１、２０２はリードフレームの一部１０４のみと
連結している。樹脂２の側面２０３、２０４からは側方
へアウターリード部１０３が真直ぐに突出している。FIG. 4 is a plan view of a conventional semi-finished lead frame after press punching. Chip pad section 101
The inner lead portions 102 are arranged apart from each other and the outer lead portions 103 are continuous with the inner lead portions 102, but the periphery of the outer lead portions 103 has not been punched yet. Next, the periphery of the outer lead portion 103 is punched out, and subsequently, the resin 2 is attached and solidified by insert molding in the center of the lead frame 1 other than the outer lead portion 103. The metal strip is conveyed between the two-divided dies, the mold is closed, the heated and melted resin is injected under pressure, cooled, and solidified, and the metal strip is placed at a predetermined position on the metal strip. It is for adhering and solidifying shaped resin. The side surfaces 201 and 202 of the resin 2 are connected to only a part 104 of the lead frame. The outer lead portion 103 projects straight from the side surfaces 203 and 204 of the resin 2 to the side.
【０００４】従来は金属条材をプレス打抜き加工した後
に、樹脂をインサートモールドしたままの状態で、すな
わち、樹脂２の側面２０３、２０４からアウターリード
部１０３が真直ぐに突出した状態で定尺カットし、リー
ドフレーム半製品を半導体アセンブリ・メーカーへ出荷
している。Conventionally, a metal strip is press-punched and then cut to length with the resin being still insert-molded, that is, with the outer lead portions 103 protruding straight from the side surfaces 203 and 204 of the resin 2. , Semi-finished lead frame products are shipped to semiconductor assembly manufacturers.
【０００５】半導体アセンブリ・メーカーでは、チップ
パッド部１０１の上に半導体チップ３を載せて接着、固
定する。半導体チップ３はインナーリード部１０２とは
接触せず、離れている。次に、半導体チップ３の電極部
３０１とインナーリード部１０２との間をＡｕ線４等に
よってワイヤーボンディングする。その後に、半導体チ
ップ及びＡｕ線を樹脂等によって封止する。この工程は
ディスペンスとも呼ばれている。続いて、アウターリー
ド部１０３を所定の長さにカットし、Ｊ折り曲げ加工し
て、表面実装型ＬＥＤを製造している。In a semiconductor assembly maker, the semiconductor chip 3 is placed on the chip pad portion 101 and adhered and fixed. The semiconductor chip 3 does not contact the inner lead portion 102, but is separated. Next, the electrode portion 301 of the semiconductor chip 3 and the inner lead portion 102 are wire-bonded with the Au wire 4 or the like. After that, the semiconductor chip and the Au wire are sealed with resin or the like. This process is also called dispensing. Subsequently, the outer lead portion 103 is cut into a predetermined length and subjected to J-bending processing to manufacture a surface mount LED.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、アウタ
ーリード部をＪ折り曲げ加工した後に、モールドした樹
脂２とリードフレームとの間の密着性が悪くなり、剥離
に至っていることがあり問題である。また半導体チップ
３とリードフレームとの間の密着性が不良となったり、
剥離していることもあり問題である。さらには、半導体
チップ３にクラックが生じ問題である。このほかワイヤ
ーの接続不良や断線が発見されることもあり問題であ
る。However, there is a problem in that the adhesion between the molded resin 2 and the lead frame deteriorates after the outer lead portion is J-folded, and peeling may occur, which is a problem. In addition, the adhesion between the semiconductor chip 3 and the lead frame becomes poor,
It may be peeled off, which is a problem. Further, there is a problem that the semiconductor chip 3 is cracked. In addition to this, there are cases in which poor wire connections and broken wires are discovered, which is a problem.
【０００７】本発明は、上記問題点を解決するために鋭
意研究開発を行い、得られたものであるが、その目的
は、密着性不良や剥離やワイヤー接続不良や半導体チッ
プ・クラックが生じにくい表面実装型ＬＥＤ用リードフ
レームの製造方法を提供することである。The present invention has been made by earnest research and development for solving the above-mentioned problems. The purpose of the present invention is to prevent poor adhesion, peeling, wire connection failure, and semiconductor chip cracking. It is an object of the present invention to provide a method for manufacturing a lead frame for a surface mount LED.
【０００８】[0008]
【課題を解決するための手段】上記目的は、請求項１に
記載の表面実装型ＬＥＤ用リードフレームの製造方法、
すなわち、金属条材をプレス打抜き加工し、樹脂インサ
ートモールド加工した後であり、かつ、インサートモー
ルドした樹脂に半導体チップを取付ける前に、アウター
リード部を曲げ加工することを特徴とする表面実装型Ｌ
ＥＤ用リードフレームの製造方法によって、達成され
る。The above object is to provide a method of manufacturing a lead frame for a surface mount LED according to claim 1.
That is, the surface mount type L is characterized in that the outer lead portion is bent after the metal strip is press-punched and resin insert-molded and before the semiconductor chip is mounted on the insert-molded resin.
This is achieved by the manufacturing method of the lead frame for ED.
【０００９】また、上記目的は、請求項２に記載の表面
実装型ＬＥＤ用リードフレーム、すなわち、半導体チッ
プを取り付けるチップパッド部と、ワイヤーによって半
導体チップの電極と接続させるインナーリード部と、イ
ンナーリード部と連続するアウターリード部であって、
基板と接続されるアウターリード部とを形成した金属リ
ードフレームにインサートモールドによって樹脂を付着
・固化し、チップパッド部とインナーリード部を樹脂に
よって形成された凹部の底面に露出させ、アウターリー
ド部を樹脂の側面から突出させ、その後に、半導体チッ
プを取り付けていない状態で、アウターリード部を曲げ
加工し、樹脂側面に沿い、９０°曲がり、下面へ至るよ
うに成形してなる表面実装型ＬＥＤ用リードフレームに
よっても、達成される。Further, the above object is to provide a surface mount type LED lead frame according to claim 2, that is, a chip pad portion for mounting a semiconductor chip, an inner lead portion for connecting to an electrode of the semiconductor chip by a wire, and an inner lead. The outer lead portion that is continuous with the
The resin is attached and solidified by insert molding on the metal lead frame that forms the outer lead part that is connected to the substrate, and the chip pad part and the inner lead part are exposed on the bottom surface of the recess formed by the resin, and the outer lead part is For surface mount type LED, which is made by projecting from the side surface of the resin and then bending the outer lead part without mounting the semiconductor chip and bending it by 90 ° along the resin side surface to reach the lower surface. It is also achieved by the lead frame.
【００１０】[0010]
【発明の実施の形態】以下、本発明の実施形態につい
て、添付図面を参照しつつ、説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings.
【００１１】図１は、本発明に係る表面実装型ＬＥＤ用
リードフレームの製造方法の実施形態を示す工程図であ
る。長尺の金属条材はコイルからアンコイルされ、そり
を矯正されて、平坦な平板となり、多段トランスファー
プレス機へ搬送される。金属板は多段トランスファープ
レス機によってプレス打抜きされつつ、送られる。プレ
ス打抜きされた長尺金属板は樹脂射出成形機へ搬送さ
れ、２分割金型によって金属板の所定部分がはさまれ、
金型の中空部内に溶融樹脂が加圧注入され、続いて冷却
固化されて、所定形状・寸法の樹脂がインサート・モー
ルド加工される。インサートモールドされた金属板をそ
の直後に、別の多段トランスファープレス機へ搬送し、
プレス打抜き加工を行い、アウターリード部をＪ折り曲
げ加工する。FIG. 1 is a process drawing showing an embodiment of a method of manufacturing a surface mount LED lead frame according to the present invention. The long metal strip is uncoiled from the coil, the warp is straightened, becomes a flat plate, and is conveyed to the multi-stage transfer press machine. The metal plate is sent while being punched by a multi-stage transfer press machine. The press-punched long metal plate is conveyed to a resin injection molding machine, and a predetermined portion of the metal plate is sandwiched by a two-divided mold,
Molten resin is injected under pressure into the hollow portion of the mold, and subsequently cooled and solidified, and a resin having a predetermined shape and size is insert-molded. Immediately after that, the insert-molded metal plate is transferred to another multi-stage transfer press machine,
Press punching is performed, and the outer lead portion is J-bent.
【００１２】図３は、本発明に係る表面実装型ＬＥＤリ
ードフレームの実施形態を示す説明図であり、（ａ）は
その正面断面図であり、（ｂ）はその平面図である。リ
ードフレームのチップパッド部１０１の下面及びインナ
ーリード部１０２の下面には樹脂２がインサートモール
ドによって付着、固化されている。インナーリード部１
０２の上面一部にも樹脂２が付着されている。樹脂２の
上面から傾斜面によって樹脂によって封止される空間２
０７が形成されているが、空間２０７の下面にはリード
フレームのチップパッド部１０１及びインナーリード部
１０２の一部（ワイヤーを溶接する部分）が露出してい
る。樹脂２の側面のうち、搬送方向前後の側面２０３、
２０４からはアウターリード部１０３が当初は水平方向
へ真直ぐに突出していたものをプレス曲げ加工によっ
て、下方へ９０°曲げて、アウターリード部１０３を側
面２０３、２０４にほぼ密着させ、アウターリード部１
０３の先端近くをされに９０°曲げて、水平方向へ向
け、樹脂２の底面２０５にほぼ密着させる。アウターリ
ード部１０３の先端部１０５の下面と樹脂２の底面中央
２０６はほぼ同一面上にある。FIG. 3 is an explanatory view showing an embodiment of a surface mount LED lead frame according to the present invention, (a) is a front sectional view thereof, and (b) is a plan view thereof. The resin 2 is attached and solidified by insert molding on the lower surface of the chip pad portion 101 and the lower surface of the inner lead portion 102 of the lead frame. Inner lead part 1
The resin 2 is also attached to a part of the upper surface of 02. Space 2 sealed from the top surface of resin 2 by the inclined surface
Although 07 is formed, part of the chip pad portion 101 and the inner lead portion 102 of the lead frame (the portion where the wire is welded) is exposed on the lower surface of the space 207. Of the side surfaces of the resin 2, side surfaces 203 before and after the carrying direction,
At first, the outer lead portion 103 that originally protruded straight in the horizontal direction from the portion 204 is bent downward by 90 ° by press bending so that the outer lead portion 103 is brought into close contact with the side surfaces 203 and 204.
The tip of 03 is bent by 90 ° so that it is oriented in the horizontal direction and is brought into close contact with the bottom surface 205 of the resin 2. The lower surface of the tip portion 105 of the outer lead portion 103 and the center 206 of the bottom surface of the resin 2 are substantially on the same plane.
【００１３】本発明の表面実装型ＬＥＤ用リードフレー
ムは半導体チップをリードフレームのチップパッド部に
接着する時点より前にアウターリード部を上記のように
Ｊ曲げ加工している点に注目していただきたい。It should be noted that, in the surface mount LED lead frame of the present invention, the outer lead portion is J-bent as described above before the semiconductor chip is bonded to the chip pad portion of the lead frame. I want to.
【００１４】その後に、長尺金属板を長手方向所定の長
さにカットして中間製品を得て、アセンブリ・メーカー
へ運送する。アセンブリ・メーカーにおいては、定尺に
カットされたリードフレーム半製品について、チップパ
ッド部１０１の上に半導体チップを載せ、接着剤等によ
って接着、固定する。次に半導体チップの電極部とイン
ナーリード部との間を導線によってワイヤーボンディン
グする。その後に、半導体チップ及び導線を完全に覆う
ように樹脂等によって封止する。必要であれば、樹脂等
を固化安定させるキュア処理を行う。このようにしてリ
ードフレーム最終製品を得る。After that, the long metal plate is cut into a predetermined length in the longitudinal direction to obtain an intermediate product, which is then transported to the assembly maker. In the assembly maker, a semiconductor chip is placed on the chip pad portion 101 of the semi-finished lead frame product that has been cut to a standard size, and is bonded and fixed with an adhesive or the like. Next, a wire is wire-bonded between the electrode portion of the semiconductor chip and the inner lead portion. After that, the semiconductor chip and the conductive wire are sealed with a resin or the like so as to completely cover the semiconductor chip and the conductive wire. If necessary, a curing treatment for solidifying and stabilizing the resin or the like is performed. In this way, the lead frame final product is obtained.
【００１５】[0015]
【発明の効果】本発明に係る表面実装型ＬＥＤリードフ
レームの製造方法によれば、インサートモールドした樹
脂上に半導体チップを取付ける前にアウターリード部を
曲げ加工するので、半導体チップと樹脂との間の剥離や
半導体チップとチップパッド部との間の剥離や導線と半
導体チップ電極部との間の接続不良や導線とインナーリ
ード部との間の接続不良が生じにくい。その結果とし
て、得られる表面実装型ＬＥＤデバイスの不良率が低下
し、製造歩留りが向上するという効果が得られる。According to the method of manufacturing a surface mount LED lead frame according to the present invention, the outer lead portion is bent before mounting the semiconductor chip on the insert-molded resin. It is unlikely that peeling of the wire, peeling between the semiconductor chip and the chip pad portion, connection failure between the conductor wire and the semiconductor chip electrode portion, or connection failure between the conductor wire and the inner lead portion occurs. As a result, the yield rate of the obtained surface mount LED device is reduced, and the manufacturing yield is improved.
【図１】本発明に係る表面実装型ＬＥＤ用リードフレー
ムの製造方法の実施形態を示す工程図である。FIG. 1 is a process drawing showing an embodiment of a method for manufacturing a surface mount LED lead frame according to the present invention.
【図２】従来の表面実装型ＬＥＤリードフレームの製造
工程図である。FIG. 2 is a manufacturing process diagram of a conventional surface mount LED lead frame.
【図３】本発明に係る表面実装型ＬＥＤリードフレーム
の実施形態を示す説明図であり、（ａ）はその正面断面
図であり、（ｂ）はその平面図である。FIG. 3 is an explanatory view showing an embodiment of a surface mount LED lead frame according to the present invention, (a) is a front sectional view thereof, and (b) is a plan view thereof.
【図４】プレス打抜き加工後の従来の半製品リードフレ
ームの平面図である。FIG. 4 is a plan view of a conventional semi-finished product lead frame after press punching.
１ リードフレーム １０１ チップパッド部 １０２ インナーリード部 １０３ アウターリード部 １０４ リードフレームの一部 １０５ 先端部 ２ 樹脂 ２０１ 側面 ２０２ 側面 ２０３ 側面 ２０４ 側面 ２０５ 底面 ２０６ 底面中央 ２０７ 空間 ３ 半導体チップ ３０１ 電極部 ４ Ａｕ線 1 lead frame 101 Chip pad part 102 Inner lead part 103 Outer lead part 104 Part of lead frame 105 tip 2 resin 201 side 202 side 203 side 204 side 205 bottom 206 Bottom center 207 space 3 semiconductor chips 301 Electrode part 4 Au line
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小川 秀雄 山梨県北都留郡上野原町上野原2222番地 株式会社エノモトリードフレーム事業部内 Ｆターム(参考） 5F041 DA07 DA17 DA25 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Hideo Ogawa 2222 Uenohara, Uenohara-cho, Kitatsuru-gun, Yamanashi Prefecture Enomoto Lead Frame Division F-term (reference) 5F041 DA07 DA17 DA25
Claims (2)
ンサートモールド加工した後であり、かつ、インサート
モールドした樹脂に半導体チップを取付ける前に、アウ
ターリード部を曲げ加工することを特徴とする表面実装
型ＬＥＤ用リードフレームの製造方法。1. A surface characterized by bending an outer lead portion after a metal strip is press-punched and resin insert-molded and before a semiconductor chip is attached to the insert-molded resin. A manufacturing method of a lead frame for a mounted LED.
部と、ワイヤーによって半導体チップの電極と接続させ
るインナーリード部と、インナーリード部と連続するア
ウターリード部であって、基板と接続されるアウターリ
ード部とを形成した金属リードフレームにインサートモ
ールドによって樹脂を付着・固化し、チップパッド部と
インナーリード部を樹脂によって形成された凹部の底面
に露出させ、アウターリード部を樹脂の側面から突出さ
せ、その後に、半導体チップを取り付けていない状態
で、アウターリード部を曲げ加工し、樹脂側面に沿い、
９０°曲がり、下面へ至るように成形してなる表面実装
型ＬＥＤ用リードフレーム。2. A chip pad portion for mounting a semiconductor chip, an inner lead portion for connecting to an electrode of the semiconductor chip by a wire, an outer lead portion continuous with the inner lead portion, and an outer lead portion for connecting to a substrate. The resin is attached and solidified by insert molding on the metal lead frame on which the chip is formed, the chip pad part and the inner lead part are exposed on the bottom surface of the recess formed by the resin, and the outer lead part is projected from the side surface of the resin. , With the semiconductor chip not attached, bend the outer lead part, along the resin side,
A surface-mount type LED lead frame formed by bending 90 ° to reach the lower surface.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001194536A JP2003007946A (en) | 2001-06-27 | 2001-06-27 | Lead frame for surface-mounting led and manufacturing method thereof |
| CN 200610075125 CN1855563A (en) | 2001-06-27 | 2002-06-03 | Lead frame for surface-mounting LED and manufacturing method thereof |
| CN 02122175 CN1256776C (en) | 2001-06-27 | 2002-06-03 | Lead frame for surface fixing type LED and mfg. method thereof |
| TW91113834A TW550837B (en) | 2001-06-27 | 2002-06-25 | Lead frame for surface-mounting led and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001194536A JP2003007946A (en) | 2001-06-27 | 2001-06-27 | Lead frame for surface-mounting led and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003007946A true JP2003007946A (en) | 2003-01-10 |
Family
ID=19032653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001194536A Pending JP2003007946A (en) | 2001-06-27 | 2001-06-27 | Lead frame for surface-mounting led and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2003007946A (en) |
| CN (2) | CN1855563A (en) |
| TW (1) | TW550837B (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006203052A (en) * | 2005-01-21 | 2006-08-03 | Stanley Electric Co Ltd | Surface-mounting semiconductor element |
| JP2006303397A (en) * | 2005-04-25 | 2006-11-02 | Matsushita Electric Works Ltd | Light emitting device |
| WO2007122516A2 (en) | 2006-04-26 | 2007-11-01 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
| CN100454588C (en) * | 2003-11-06 | 2009-01-21 | 夏普株式会社 | Package structure for optical device |
| JP2010145285A (en) * | 2008-12-19 | 2010-07-01 | Alps Electric Co Ltd | Magnetic detection device and method of manufacturing the same |
| JP2013069903A (en) * | 2011-09-22 | 2013-04-18 | Fusheng Industrial Co Ltd | Light emission diode support frame construction, and manufacturing method thereof (1) |
| CN105261603A (en) * | 2015-09-10 | 2016-01-20 | 济南市半导体元件实验所 | Heavy-current glass sealed schottky diode and preparation technology |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
| US10892383B2 (en) | 2007-10-31 | 2021-01-12 | Cree, Inc. | Light emitting diode package and method for fabricating same |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100377374C (en) * | 2004-12-30 | 2008-03-26 | 大铎精密工业股份有限公司 | Method for fabricating lead wire rack of light emitting diode |
| CN100428457C (en) * | 2005-07-12 | 2008-10-22 | 周万顺 | Light-emitting diodes surface-adhered foundation support and its production |
| JP4549406B2 (en) * | 2008-05-19 | 2010-09-22 | 三菱電機株式会社 | Electronic component mounting structure and in-vehicle sensor |
| CN106332450A (en) * | 2016-08-31 | 2017-01-11 | 王欣 | Conductor hollow circuit board and manufacturing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03268349A (en) * | 1990-03-16 | 1991-11-29 | Yamada Seisakusho Co Ltd | Method of bending external lead and forming device using the method |
| JPH06176987A (en) * | 1992-12-08 | 1994-06-24 | Rohm Co Ltd | Bending and working method of lead terminal in face-mounting-type electronic component |
| JPH0878561A (en) * | 1994-08-31 | 1996-03-22 | Sony Corp | Manufacturing method of semiconductor device |
| JP2001168398A (en) * | 1999-12-13 | 2001-06-22 | Nichia Chem Ind Ltd | Light emitting diode and its manufacturing method |
| JP2002280616A (en) * | 2001-03-16 | 2002-09-27 | Nichia Chem Ind Ltd | Package mold and light emitting device using the same |
-
2001
- 2001-06-27 JP JP2001194536A patent/JP2003007946A/en active Pending
-
2002
- 2002-06-03 CN CN 200610075125 patent/CN1855563A/en active Pending
- 2002-06-03 CN CN 02122175 patent/CN1256776C/en not_active Expired - Fee Related
- 2002-06-25 TW TW91113834A patent/TW550837B/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03268349A (en) * | 1990-03-16 | 1991-11-29 | Yamada Seisakusho Co Ltd | Method of bending external lead and forming device using the method |
| JPH06176987A (en) * | 1992-12-08 | 1994-06-24 | Rohm Co Ltd | Bending and working method of lead terminal in face-mounting-type electronic component |
| JPH0878561A (en) * | 1994-08-31 | 1996-03-22 | Sony Corp | Manufacturing method of semiconductor device |
| JP2001168398A (en) * | 1999-12-13 | 2001-06-22 | Nichia Chem Ind Ltd | Light emitting diode and its manufacturing method |
| JP2002280616A (en) * | 2001-03-16 | 2002-09-27 | Nichia Chem Ind Ltd | Package mold and light emitting device using the same |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100454588C (en) * | 2003-11-06 | 2009-01-21 | 夏普株式会社 | Package structure for optical device |
| JP4698234B2 (en) * | 2005-01-21 | 2011-06-08 | スタンレー電気株式会社 | Surface mount semiconductor device |
| JP2006203052A (en) * | 2005-01-21 | 2006-08-03 | Stanley Electric Co Ltd | Surface-mounting semiconductor element |
| US7595549B2 (en) | 2005-01-21 | 2009-09-29 | Stanley Electric Co., Ltd. | Surface mount semiconductor device |
| JP2006303397A (en) * | 2005-04-25 | 2006-11-02 | Matsushita Electric Works Ltd | Light emitting device |
| EP2011149B1 (en) * | 2006-04-26 | 2017-09-06 | Cree, Inc. | Surface mount device |
| WO2007122516A2 (en) | 2006-04-26 | 2007-11-01 | Cree Hong Kong Limited | Apparatus and method for use in mounting electronic elements |
| US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| US10892383B2 (en) | 2007-10-31 | 2021-01-12 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US11791442B2 (en) | 2007-10-31 | 2023-10-17 | Creeled, Inc. | Light emitting diode package and method for fabricating same |
| JP2010145285A (en) * | 2008-12-19 | 2010-07-01 | Alps Electric Co Ltd | Magnetic detection device and method of manufacturing the same |
| US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
| JP2013069903A (en) * | 2011-09-22 | 2013-04-18 | Fusheng Industrial Co Ltd | Light emission diode support frame construction, and manufacturing method thereof (1) |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
| CN105261603A (en) * | 2015-09-10 | 2016-01-20 | 济南市半导体元件实验所 | Heavy-current glass sealed schottky diode and preparation technology |
| CN105261603B (en) * | 2015-09-10 | 2018-01-16 | 济南市半导体元件实验所 | High current glass seals Schottky diode and manufacture craft |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1393941A (en) | 2003-01-29 |
| TW550837B (en) | 2003-09-01 |
| CN1256776C (en) | 2006-05-17 |
| CN1855563A (en) | 2006-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003007946A (en) | Lead frame for surface-mounting led and manufacturing method thereof | |
| US6291262B1 (en) | Surface mount TO-220 package and process for the manufacture thereof | |
| TWI322493B (en) | Leadframe strip, semiconductor device, and the method of fabricating a leadframe | |
| US20030030131A1 (en) | Semiconductor package apparatus and method | |
| CN100416815C (en) | Lead frame with included passive devices | |
| US7541664B2 (en) | Lead frame and semiconductor device having the lead frame | |
| US9698084B2 (en) | Semiconductor device and lead frame having two leads welded together | |
| JPH05144992A (en) | Semiconductor device and its production, lead frame used for semiconductor production and its production | |
| KR20050051572A (en) | Method of manufacturing semiconductor device | |
| US6780679B2 (en) | Semiconductor device and method of manufacturing the same | |
| US20100001413A1 (en) | Semiconductor Device and Semiconductor Device Manufacturing Method | |
| US12119263B2 (en) | Methods and apparatus for an improved integrated circuit package | |
| US8110492B2 (en) | Method for connecting a die attach pad to a lead frame and product thereof | |
| JPH03250756A (en) | Outer lead molding process of semiconductor element | |
| US20180233438A1 (en) | Leadframe, semiconductor package including a leadframe and method for forming a semiconductor package | |
| US7795712B2 (en) | Lead frame with non-conductive connective bar | |
| US20190067033A1 (en) | Surface Mount Semiconductor Device and Method of Manufacture | |
| JP2528192B2 (en) | Semiconductor device | |
| JPH11284117A (en) | Manufacture for semiconductor device and semiconductor lead frame | |
| US20240274572A1 (en) | Power leadframe package with lead sidewall surface that is fully solder wettable | |
| JPH07147292A (en) | Manufacture of semiconductor device | |
| JPH03276667A (en) | Semiconductor device and manufacture thereof and applicable leadframe thereto | |
| JP2000150761A (en) | Resin sealed semiconductor device and its manufacture | |
| JPH11340373A (en) | Thin small-sized plastic molded package | |
| JP2554416Y2 (en) | Electronic components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040122 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20040302 |