JP2002280616A - Package mold and light emitting device using the same - Google Patents
Package mold and light emitting device using the sameInfo
- Publication number
- JP2002280616A JP2002280616A JP2001077002A JP2001077002A JP2002280616A JP 2002280616 A JP2002280616 A JP 2002280616A JP 2001077002 A JP2001077002 A JP 2001077002A JP 2001077002 A JP2001077002 A JP 2001077002A JP 2002280616 A JP2002280616 A JP 2002280616A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead electrode
- resin
- package
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する分野】本発明は各種インジケーター、デ
ィスプレイ、光プリンターの書き込み光源及び液晶のバ
ックライト用光源などに利用可能な発光素子を用いた発
光装置に関し、特に発光装置の信頼性及び量産性の向上
を図った発光装置の構成に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device using a light emitting element which can be used for various indicators, displays, writing light sources for optical printers, and light sources for liquid crystal backlights, and more particularly to the reliability and mass productivity of light emitting devices. The present invention relates to a structure of a light-emitting device that is improved.
【０００２】[0002]
【従来の技術】近年、小型・薄型化を目的として、表面
実装タイプの発光装置がリードタイプの発光装置に代え
て多く使用されるようになって来ている。この面実装タ
イプの発光装置は、パッケージ成形体の内部に発光素子
チップが設けられ、そのパッケージは、発光素子チップ
の正負の電極がそれぞれ接続される正及び負のリード電
極が一体成形されてなる。尚、このパッケージにおい
て、正及び負のリード電極は、パッケージの接合面の両
端部でその接合面に沿って内側に折り曲げられてなり、
その内側に折り曲げられた部分ではんだ付けされるよう
に構成されている。このようにして、光学特性に優れた
発光装置とすることができる。2. Description of the Related Art In recent years, surface mount type light emitting devices have been increasingly used in place of lead type light emitting devices for the purpose of miniaturization and thinning. In this surface mount type light emitting device, a light emitting element chip is provided inside a package molded body, and the package is formed by integrally molding positive and negative lead electrodes to which positive and negative electrodes of the light emitting element chip are respectively connected. . In this package, the positive and negative lead electrodes are bent inward at both ends of the bonding surface of the package along the bonding surface,
It is configured to be soldered at the part bent inside. Thus, a light-emitting device having excellent optical characteristics can be obtained.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、発光装
置の利用分野の広がりと共に厳しい使用条件のもとで使
用されるようになってきた現在では、さらに高い信頼性
を有する発光装置が求められている。However, with the spread of the field of use of light-emitting devices and their use under severe operating conditions, light-emitting devices with even higher reliability are required. .
【０００４】そこで本発明は、厳しい環境条件のもとで
も十分高い信頼性を有し且つ歩留まり良く生産すること
が可能なパッケージ成形体及びそれを用いた発光装置を
提供することを目的とする。Accordingly, an object of the present invention is to provide a package molded body having sufficiently high reliability under severe environmental conditions and capable of being produced with high yield, and a light emitting device using the same.
【０００５】[0005]
【課題を解決するための手段】以上の目的を達成するた
めに、本発明に係るパッケージ成形体は、発光素子を収
納する凹部と正と負のリード電極とを有し、前記正と負
のリード電極の主面が前記凹部底面にてそれぞれ露出さ
れかつ前記正と負のリード電極のそれぞれの一端部が外
部に露出されてなるパッケージ成形体であって、側面上
に前記リード電極の側面と交差したパーティングライン
を有することを特徴とする。以上のように構成された本
発明に係る発光装置用のパッケージ成形体は、高い信頼
性を有し且つ製造歩留まり良く得ることができる。In order to achieve the above object, a package molded product according to the present invention has a concave portion for accommodating a light emitting element and positive and negative lead electrodes, A package molded body in which a main surface of a lead electrode is exposed at the bottom surface of the recess and one end of each of the positive and negative lead electrodes is exposed to the outside, and a side surface of the lead electrode on a side surface. It is characterized by having an intersecting parting line. The package molded product for a light emitting device according to the present invention configured as described above has high reliability and can be obtained with a high production yield.
【０００６】また、本発明の発光装置は、前記パッケー
ジ成形体と、該パッケージ成形体の凹部内底面に発光素
子を有し、前記凹部内に前記発光素子を覆うモールド部
材を有することを特徴とする。Further, the light emitting device of the present invention is characterized in that the light emitting device includes the package molded body, a light emitting element on a bottom surface in a concave portion of the package molded body, and a mold member for covering the light emitting element in the concave portion. I do.
【０００７】[0007]
【発明の実施の形態】以下、本発明に係る実施の形態の
発光装置について説明する。本発明に係る実施の形態の
発光装置は、以下のようにして構成される。本実施の形
態の発光装置において、パッケージ成形体は、例えば図
１（ａ）に示すように、正のリード電極２ａと負のリー
ド電極２ｂとが成形樹脂１により一体成形されて作製さ
れる。詳細に説明すると、パッケージ成形体の上面に
は、発光素子を収納する凹部を有し、その凹部の底面に
は、正のリード電極と負のリード電極とが互いに分離さ
れてそれぞれの主面が露出するように設けられる。尚、
本明細書において、パッケージ成形体の上面とは、発光
素子が載置される側の面をいい、下面とは、実装基板に
対向する面のことをいう。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a light emitting device according to an embodiment of the present invention will be described. The light emitting device according to the embodiment of the present invention is configured as follows. In the light emitting device of the present embodiment, the package molded body is manufactured by integrally molding a positive lead electrode 2a and a negative lead electrode 2b with the molding resin 1 as shown in FIG. More specifically, on the upper surface of the package molded body, there is a concave portion for accommodating the light emitting element, and on the bottom surface of the concave portion, the positive lead electrode and the negative lead electrode are separated from each other, and the respective main surfaces are formed. It is provided so as to be exposed. still,
In this specification, the upper surface of the package molded body refers to the surface on which the light emitting element is mounted, and the lower surface refers to the surface facing the mounting substrate.
【０００８】また、正のリード電極の一端と負のリード
電極の一端とは凹部の底部において互いに対向するよう
に設けられ、正のリード電極の一端と負のリード電極の
一端との間には成形樹脂が充填され、凹部の底面が形成
される。また、パッケージ成形体において、正のリード
電極の他端と負のリード電極の他端は、成形樹脂部の側
面から突き出すように設けられ、その突き出したアウタ
・リード部がパッケージ成形体の下面である接合面の内
側に折り曲げられて正負の接続端子部が構成される。Further, one end of the positive lead electrode and one end of the negative lead electrode are provided so as to face each other at the bottom of the concave portion, and between one end of the positive lead electrode and one end of the negative lead electrode. The molding resin is filled to form a bottom surface of the concave portion. In the molded package, the other end of the positive lead electrode and the other end of the negative lead electrode are provided so as to protrude from the side surface of the molded resin portion, and the protruding outer lead portion is formed on the lower surface of the molded package. It is bent inside a certain joint surface to form positive and negative connection terminal portions.
【０００９】このような構成を有する発光装置用パッケ
ージ成形体を用い、前記パッケージ成形体の凹部底面に
発光素子が電気的に接続され、これらを覆うように前記
凹部内にモールド部材である透光性樹脂が充填されて本
発明の発光装置が得られる。A light emitting device having the above structure is used, and a light emitting element is electrically connected to a bottom surface of a concave portion of the package molded body. The light emitting device of the present invention is obtained by filling with the conductive resin.
【００１０】ここで、特に本実施の形態の発光装置は、
パッケージ成形体の側面において、成形金型の合わせ目
により形成されるパーティングライン３がアウタ・リー
ド部２ａ、２ｂの側面と交差していることを特徴とし、
これによって本実施の形態の発光装置は、厳しい使用環
境下においても高い信頼性を有し且つ量産性良く得るこ
とができるという優れた効果を有する。Here, the light emitting device of the present embodiment is
On the side surface of the package molded body, the parting line 3 formed by the joint of the molding dies intersects the side surfaces of the outer lead portions 2a and 2b,
Thus, the light emitting device of this embodiment has an excellent effect that it has high reliability and can be mass-produced even in a severe use environment.
【００１１】すなわち本発明者は、種々の実験の結果、
リード電極と成形樹脂部材との密着性が悪いことに起因
して、信頼性の劣化や歩留まりの低下が起こることを見
いだし、その問題点を解決するために完成されたもので
ある。That is, the present inventor has conducted various experiments,
It has been found that reliability is degraded and yield is reduced due to poor adhesion between the lead electrode and the molded resin member, and the present invention has been completed to solve the problems.
【００１２】リード電極がインサートされ一体成形され
てなるパッケージ成形体は、前記リード電極を成形金型
により挟み込み、閉じられた前記金型内に溶融された樹
脂が注入及び硬化されて形成される。[0012] A package molded body in which a lead electrode is inserted and integrally molded is formed by sandwiching the lead electrode with a molding die, and injecting and curing a molten resin in the closed die.
【００１３】成形金型の合わせ面は、成形機により強力
に型締されてはいるものの、樹脂の射出圧力により金型
に変形やズレが生じ、前記合わせ面の僅かな隙間が生じ
る。本明細書において、前記隙間に形成される樹脂線を
パーティングラインと定義する。前記パーティングライ
ンは外見上問題なく実装することができる。Although the mating surface of the molding die is strongly clamped by the molding machine, the mold is deformed or displaced by the injection pressure of the resin, and a slight gap is formed between the mating surfaces. In the present specification, a resin line formed in the gap is defined as a parting line. The parting line can be implemented with no apparent problem.
【００１４】しかしながら、金型の合わせ面がだれてし
まったり、又は前記合わせ面の延長上に平面が存在した
りすると、前記パーティングラインから横方向に樹脂バ
リが生じる傾向にある。However, if the mating surface of the mold is dropped or if a flat surface exists on the extension of the mating surface, resin burrs tend to be generated in the lateral direction from the parting line.
【００１５】このような樹脂バリは、成形条件を修正し
たり型締力の大きい成形機を使用することにより抑制で
きる。Such resin burrs can be suppressed by modifying molding conditions or using a molding machine having a large mold clamping force.
【００１６】しかしながら、リード電極形成用金型の摩
耗の度合いにより挿入されるリード電極の形状は常に一
定ではなく、前記リード電極と成型金型との界面には多
少の隙間が生じてしまう。この隙間と前記金型の合わせ
目とが平行ライン上に位置していると、上記の対策では
十分に対処できず前記リード電極の面に沿って前記パー
ティングラインから横バリが生じてしまう。However, the shape of the inserted lead electrode is not always constant depending on the degree of wear of the lead electrode forming mold, and a slight gap is formed at the interface between the lead electrode and the molding die. If the gap and the joint of the mold are located on a parallel line, the above measures cannot sufficiently cope with it, and horizontal burrs will be generated from the parting line along the surface of the lead electrode.
【００１７】図３に示すように、リード電極の背面の延
長線上に成型金型の合わせ目により形成されたパーティ
ングラインを有するパッケージ成形体は、前記パーティ
ングラインから前記リード電極のアウタ・リード部の背
面に沿って横バリを有する傾向にある。前記横バリはフ
ォーミング工程において障害となり、発光装置が小型化
となるようにリード電極を成形樹脂部の側面に精度良く
沿わせて加工することが非常に困難となる。また、この
際にリード電極と成形部材との界面に縦方向に応力がか
かり、横方向に延びたバリの先端部分から前記界面に隙
間が生じ、更には横バリが剥がれたりする。As shown in FIG. 3, a package molded body having a parting line formed by a joint of a molding die on an extension of the back surface of the lead electrode is formed by the outer lead of the lead electrode from the parting line. It tends to have lateral burrs along the back of the part. The lateral burrs become an obstacle in the forming process, and it is extremely difficult to process the lead electrodes with high precision along the side surfaces of the molded resin portion so as to reduce the size of the light emitting device. At this time, stress is applied in the vertical direction to the interface between the lead electrode and the molded member, and a gap is formed at the interface from the tip of the burr extending in the horizontal direction, and the horizontal burr is peeled off.
【００１８】バリの剥がれは、成形部材のクラックの要
因となり、前記クラックから水分や不純物が侵入され発
光装置の信頼性がひどく低下してしまう。また、深くバ
リが剥れた場合には空壁が生じ外観不良となる。[0018] Peeling of burrs causes cracks in the molded member, and moisture and impurities penetrate from the cracks, and the reliability of the light emitting device is seriously degraded. In addition, when the burr is peeled deeply, an empty wall is formed, resulting in poor appearance.
【００１９】これに対して、本実施の形態で用いられる
パッケージ成形体は、インサートされたリード電極の側
面とパーティングラインとが交差するように構成される
ことにより、前記のような樹脂バリの発生を最小限に押
さえることができる。また、樹脂の充填ミス等により樹
脂バリが発生したとしても、樹脂漏れ口であるパーティ
ングラインとリード電極との接点が前記リード電極の側
面上にあるため、前記接点部分からの樹脂もれの流れは
リード電極の厚さ方向に導かれる。つまり樹脂バリは、
パーティングラインからリード電極の側面の厚さ方向に
沿って形成された縦バリのみとすることができる。前記
縦バリは、横バリと比べ縦方向の応力に比較的強く剥が
れにい。また本発明のパッケージ成形体はリード電極の
長手方向にバリを有しないためフォーミング工程を良好
に行うことができる。On the other hand, the molded package used in the present embodiment is configured such that the side surface of the inserted lead electrode intersects with the parting line, so that the resin burr as described above is formed. Occurrence can be minimized. Further, even if resin burrs occur due to a resin filling error or the like, since the contact between the parting line, which is a resin leakage port, and the lead electrode is on the side surface of the lead electrode, resin leakage from the contact portion. The flow is guided in the thickness direction of the lead electrode. In other words, resin burr is
Only vertical burrs formed along the thickness direction of the side surface of the lead electrode from the parting line can be used. The vertical burrs are relatively strong against the stress in the vertical direction as compared with the horizontal burrs and are not easily peeled. Further, since the package molded body of the present invention has no burrs in the longitudinal direction of the lead electrode, the forming step can be performed well.
【００２０】以下、本発明の発光装置の各構成について
詳述する。 （リード電極）リード電極は、鉄入り銅等の高熱伝導体
を用いて構成することができる。また、発光素子からの
光の反射率の向上及びリード基材の酸化防止等のため
に、リード電極の表面に銀、アルミ、銅や金等の金属メ
ッキを施すこともでき、またリード電極の表面の反射率
を向上させるため平滑にすることが好ましい。また、リ
ード電極の面積は大きくすることが好ましく、このよう
にすると放熱性を高めることができ、配置される発光素
子チップの温度上昇を効果的に抑制することができる。
これによって、発光素子チップに比較的多くの電力を投
入することが可能となり光出力を向上させることができ
る。Hereinafter, each configuration of the light emitting device of the present invention will be described in detail. (Lead electrode) The lead electrode can be formed using a high thermal conductor such as iron-containing copper. Also, in order to improve the reflectance of light from the light emitting element and prevent oxidation of the lead substrate, the surface of the lead electrode can be plated with a metal such as silver, aluminum, copper, or gold. It is preferable to make the surface smooth to improve the reflectance of the surface. In addition, it is preferable to increase the area of the lead electrode. In this case, the heat dissipation can be improved, and the temperature rise of the light emitting element chips to be arranged can be effectively suppressed.
As a result, a relatively large amount of power can be applied to the light emitting element chip, and the light output can be improved.
【００２１】リード電極は、例えば、０．１５ｍｍ厚の
銅合金属からなる長尺金属板をプレスを用いた打ち抜き
加工により各パッケージ成形体の正負のリード電極とな
る部分を形成する。プレス加工後の長尺金属板の各パッ
ケージ成形体に対応する部分において、正のリード電極
は、成形後のパッケージ凹部の底面でその一端面が負の
リード電極の一端面と対向するように負のリード電極と
は分離されている。The lead electrodes are formed, for example, by punching a long metal plate made of a copper alloy metal having a thickness of 0.15 mm using a press to form portions that become positive and negative lead electrodes of each package molded body. In the portion corresponding to each package molded body of the long metal plate after the press working, the positive lead electrode is negatively connected so that one end face of the bottom face of the molded package recess faces one end face of the negative lead electrode. Are separated from the lead electrodes of the above.
【００２２】またリード電極は、リード電極の一端面に
垂直な中心線を対称な軸とする開口部を有することが好
ましく、これにより成形樹脂との結合強度を強くするこ
とができる。この開口部はパッケージ成形体の端部の内
側と外側に跨って位置するように設けられ、リード電極
と成形樹脂との結合強度を強くすることができる。ま
た、パッケージ成形体の外壁から突き出した各リード電
極を、成形樹脂に大きな力がかからないように加工する
ことができ信頼性の低下が抑制される。It is preferable that the lead electrode has an opening having a center line perpendicular to one end face of the lead electrode as a symmetric axis, so that the bonding strength with the molding resin can be increased. The opening is provided so as to straddle the inside and outside of the end of the package molded body, so that the bonding strength between the lead electrode and the molding resin can be increased. Further, each lead electrode protruding from the outer wall of the package molded body can be processed so that a large force is not applied to the molding resin, so that a decrease in reliability is suppressed.
【００２３】更に、前記開口部は、射出成形後に少なく
ともそれぞれの開口部の一部が凹部底面から露出される
ことが好ましい。これにより成形樹脂とモールド樹脂と
接合強度が強化され、ダイボンディング及びワイヤーボ
ンディングによるリード電極の位置ズレを抑制すること
ができる。ここで、本実施の形態では、正のリード電極
の一端面に垂直な中心線と負のリード電極の一端面に垂
直な中心線は同一線上であり、その中心線が凹部底面の
縦軸（本明細書において、凹部底面の直交する２つの軸
のうちの上記中心軸と一致させる一方の軸を便宜上、縦
軸と称し、他方の軸を横軸と称する。）と一致してお
り、このようなパッケージ成形体を用いることで信頼性
が高く且つ指向特性に優れた発光装置が得られる。特
に、本実施の形態においては、凹部の底面に位置する正
のリード電極にパッケージの縦軸に対して左右対称に２
つの樹脂露出部が形成され、凹部の底面に位置する負の
リード電極にパッケージの縦軸に対して左右対称に２つ
の樹脂露出部が形成されているので、左右対称の配置を
とらない場合に比較して、透光性樹脂とパッケージ成形
体との接合をより強くできるとともに左右対称の指向特
性が得られ好ましい。Further, it is preferable that at least a part of each of the openings is exposed from the bottom surface of the recess after injection molding. Thereby, the bonding strength between the molding resin and the molding resin is enhanced, and the displacement of the lead electrode due to die bonding and wire bonding can be suppressed. Here, in the present embodiment, the center line perpendicular to one end face of the positive lead electrode and the center line perpendicular to one end face of the negative lead electrode are on the same line, and the center line is the vertical axis ( In the present specification, one of the two axes orthogonal to the bottom surface of the concave portion, which coincides with the central axis, is referred to as a vertical axis for convenience, and the other axis is referred to as a horizontal axis.) By using such a package molded product, a light emitting device having high reliability and excellent directivity characteristics can be obtained. In particular, in the present embodiment, the positive lead electrode located on the bottom surface of the concave portion is symmetrically arranged with respect to the longitudinal axis of the package.
Since two resin exposed portions are formed, and two resin exposed portions are formed symmetrically with respect to the longitudinal axis of the package on the negative lead electrode located on the bottom surface of the concave portion, when a symmetrical arrangement is not taken. In comparison, it is preferable because the bonding between the translucent resin and the package molded body can be further strengthened and symmetrical directional characteristics can be obtained.
【００２４】本発明の発光装置において、リード電極の
背面と側面との交わる角は曲線を帯びていることが好ま
しい。このように、樹脂を注入する方向に合わせてリー
ド電極の端部に丸びを設けると成形樹脂の流れがスムー
ズとなり、前記リード電極と成形樹脂部との密着性が強
化させる。また、パッケージ底面に露出された一対のリ
ード電極間の空間に隙間なく樹脂を充填させることがで
きる。また、成形樹脂部のリード電極との接合ライン
は、前記リード電極と対応した形状となる。よって上記
の形状を有するリード電極を用いると、成形樹脂部の側
面上の前記背面との接合ラインは、底角が曲線を帯びた
凹部形状とすることができる。これにより前記接合ライ
ンにおける応力集中が回避されパッケージ・クラックの
発生を抑制することができる。In the light emitting device according to the present invention, it is preferable that the angle at which the rear surface and the side surface of the lead electrode intersect is curved. As described above, when the end portion of the lead electrode is provided with a rounded portion in accordance with the direction in which the resin is injected, the flow of the molding resin becomes smooth, and the adhesion between the lead electrode and the molding resin portion is strengthened. In addition, the space between the pair of lead electrodes exposed on the bottom surface of the package can be filled with the resin without any gap. Further, the joining line of the molded resin portion with the lead electrode has a shape corresponding to the lead electrode. Therefore, when the lead electrode having the above shape is used, the joining line with the back surface on the side surface of the molded resin portion can have a concave shape having a curved base angle. As a result, stress concentration at the joining line is avoided, and the occurrence of package cracks can be suppressed.
【００２５】また更に、リード電極の主面と側面との交
わる角は鋭角に盛り上がっていることが好ましい。これ
により、パッケージ凹部底面から露出される正のリード
電極と負のリード電極との空間からパッケージ成形時に
注入される成形樹脂が各リード電極の主面上への流出を
阻止することができ、発光素子のダイボンディン不良及
びワイヤーボンディング不良を防止することができる。
また、リード電極とモールド樹脂との密着性が向上さ
れ、これらの界面での剥離を抑制することができる。Furthermore, it is preferable that the intersection between the main surface and the side surface of the lead electrode rises sharply. Thereby, the molding resin injected during the package molding from the space between the positive lead electrode and the negative lead electrode exposed from the bottom surface of the package concave portion can be prevented from flowing out onto the main surface of each lead electrode, and light emission can be prevented. Die bond failure and wire bonding failure of the element can be prevented.
In addition, the adhesion between the lead electrode and the mold resin is improved, and peeling at the interface between them can be suppressed.
【００２６】ここで、リード電極の主面とは、パッケー
ジ成形体の凹部から露出される面側をいい、背面とは成
形樹脂部と接する面側をいう。Here, the main surface of the lead electrode refers to the surface side exposed from the concave portion of the package molded body, and the back surface refers to the surface side in contact with the molded resin portion.
【００２７】また、パッケージ成形体の外壁から突き出
した正のリード電極と負のリード電極のアウタ・リード
部は、図１に示すようにパッケージ成形体の接合面の内
側に折り曲げられ、Ｊ−ベンド（Ｂｅｎｄ）型の正負の
接続端子部となる。尚、本発明の接続端子部の構造は、
Ｊ−ベンド（Ｂｅｎｄ）型に限られるものではなく、ガ
ルウィング型等の他の構造であってもよい。The outer lead portions of the positive lead electrode and the negative lead electrode protruding from the outer wall of the package molded body are bent inside the joint surface of the package molded body as shown in FIG. (Bend) type positive and negative connection terminals. The structure of the connection terminal portion of the present invention is as follows.
The structure is not limited to the J-bend type, but may be another structure such as a gull wing type.
【００２８】（成形樹脂部）本実施の形態の成形樹脂部
は、正及び負からなる一対のリード電極がインサートさ
れて閉じられた金型内に、パッケージ成形体の下面側に
あるゲートから溶融された成形樹脂を流し込み硬化して
形成される。また前記金型は、金型の合わせ目の両方
に、リード電極を配置させるために彫り込まれた凹部を
有する。つまりリード電極は、リード電極の側面が上下
の金型の合わせ目と交差するように金型間に挿入され
る。このようにして形成されたパッケージ成形体は、イ
ンサートされたリード電極の側面と交差したパーティン
グラインを有する。これにより、成形樹脂部形成の際の
樹脂量の調整ミス及び金型の型締圧の調整ミス等によ
り、金型の合わせ目から樹脂が余分に流出しても、パー
ティングライン部分から流れ生じる樹脂バリは前記リー
ド電極の厚さ方向に延びた縦バリとして形成されるた
め、リード電極の加工不良を抑制することができる。(Molding resin part) The molding resin part of the present embodiment is formed by melting a gate formed on the lower surface side of a package molded body into a mold closed by inserting a pair of positive and negative lead electrodes. It is formed by pouring and curing the molded resin. Further, the mold has concave portions carved to arrange lead electrodes at both joints of the mold. That is, the lead electrode is inserted between the dies such that the side surface of the lead electrode intersects the joint of the upper and lower dies. The package formed body thus formed has a parting line crossing the side surface of the inserted lead electrode. Due to this, due to an error in adjusting the amount of resin during the formation of the molded resin portion, an error in adjusting the mold clamping pressure of the mold, and the like, even if the resin excessively flows out from the joint of the mold, it flows from the parting line portion. Since the resin burrs are formed as vertical burrs extending in the thickness direction of the lead electrode, processing defects of the lead electrode can be suppressed.
【００２９】また、電極の実装接合面と成形樹脂の底面
とが略同一平面上となるように、成形樹脂部はゲートの
両側の接合面に峰状の第１凸部及び第２凸部を有し、且
つ前記第１凸部と第２凸部とが所定の空間を有するよう
に構成されると、前記空間内にフロー半田時の仮止め樹
脂を精度良く充填し、前記仮止め樹脂が前記リード電極
の主面側に付着することで起こる半田付け不良を抑制す
ることができ好ましい。The molding resin portion has peak-like first and second convex portions on the joining surfaces on both sides of the gate so that the mounting surface of the electrode and the bottom surface of the molding resin are substantially flush with each other. When the first convex portion and the second convex portion are configured to have a predetermined space, the temporary fixing resin at the time of flow soldering is accurately filled in the space, and the temporary fixing resin is It is preferable because poor soldering caused by adhering to the main surface of the lead electrode can be suppressed.
【００３０】また、成形樹脂部の側面は、パーティング
ラインから下面側にかけてテーパ形状であると、成形金
型から離型させる場合の成形樹脂部にかかる応力を緩和
することができる。またテーパー形状に沿ってリード電
極を加工することは容易であり、小型の発光装置が得ら
れ好ましい。更に、パーティングラインから下面側の成
形樹脂部の幅を前記パーティングライン上面側の成形樹
脂部よりリード電極の厚さ程度狭くすると、前記上面側
の成形樹脂部の幅以内にリード電極を納めることがで
き、密に実装することが可能な発光装置が得られる。Further, when the side surface of the molding resin portion is tapered from the parting line to the lower surface side, stress applied to the molding resin portion when the mold is released from the molding die can be reduced. Further, it is easy to process the lead electrode along the tapered shape, and a small light emitting device can be obtained, which is preferable. Further, when the width of the molding resin part on the lower surface side from the parting line is made smaller than the molding resin part on the parting line upper surface side by the thickness of the lead electrode, the lead electrode is accommodated within the width of the molding resin part on the upper surface side. Thus, a light-emitting device that can be densely mounted can be obtained.
【００３１】（発光素子）本実施の形態に用いられる発
光素子は、パッケージ成形体の凹部底面に露出された負
のリード電極又は正のリード電極上に配置され、そのｎ
電極と負のリード電極とがワイヤボンディングにより接
続され、同様にｐ電極と正のリード電極とがワイヤボン
ディングにより接続される。このように、リード電極上
に発光素子を配置させると発光素子の放熱性が向上され
好ましい。ここで、発光素子は、例えば、青色の発光が
可能な窒化ガリウム系化合物半導体素子であり、該素子
は、例えばサファイア基板上にｎ型層、活性層及びｐ型
層を含む窒化物半導体層が形成され、活性層及びｐ型層
の一部を除去して露出させたｎ型層の上にｎ電極が形成
され、ｐ型層の上にｐ電極が形成されてなる。(Light Emitting Element) The light emitting element used in the present embodiment is disposed on the negative or positive lead electrode exposed on the bottom surface of the concave portion of the package molded product.
The electrode and the negative lead electrode are connected by wire bonding, and the p electrode and the positive lead electrode are similarly connected by wire bonding. Thus, it is preferable to dispose the light emitting element on the lead electrode because the heat radiation of the light emitting element is improved. Here, the light-emitting element is, for example, a gallium nitride-based compound semiconductor element capable of emitting blue light, and the element includes, for example, a nitride semiconductor layer including an n-type layer, an active layer, and a p-type layer on a sapphire substrate. An n-electrode is formed on the n-type layer formed and exposed by removing a part of the active layer and the p-type layer, and a p-electrode is formed on the p-type layer.
【００３２】（モールド部材）前記発光素子を覆うよう
に、パッケージ成形体の凹部内にモールド部材として透
光性樹脂が充填される。透光性樹脂は、外力、水分等か
ら発光素子を保護することができる。また透光性樹脂
は、発光素子からの光を効率よく外部に等かさせるため
に高い光の透過性が要求される。尚、発光素子の電極と
リード電極との間をワイヤーで接続する構造においては
ワイヤーを保護する機能も有するものである。透光性樹
脂等の具体的材料としては、エポキシ樹脂、シリコーン
樹脂やアクリル樹脂等が適しており、透光性樹脂中には
ＬＥＤチップからの光に対して特定のフィルター効果等
を持たす為に着色染料や着色顔料を添加することもでき
る。(Mold member) Translucent resin is filled as a mold member in the recess of the package molded body so as to cover the light emitting element. The light-transmitting resin can protect the light-emitting element from external force, moisture, and the like. In addition, the translucent resin is required to have high light transmittance so that light from the light emitting element can be efficiently equalized to the outside. Incidentally, the structure in which the electrode of the light emitting element and the lead electrode are connected by a wire also has a function of protecting the wire. Epoxy resin, silicone resin, acrylic resin, etc. are suitable as specific materials such as translucent resin, and the translucent resin has a specific filter effect for light from the LED chip. Coloring dyes and coloring pigments can also be added.
【００３３】本実施の形態では、パッケージ成形体の凹
部の底面に、正のリード電極に形成された開口部を介し
て成形樹脂が凹部の底面露出し、負のリード電極に形成
された開口部を介して成形樹脂が凹部の底面に露出して
いるので、露出した成形樹脂とモールド樹脂とが強固に
接合され、モールド樹脂とパッケージ成形体との接合を
強くすることができる。In the present embodiment, the molding resin is exposed on the bottom surface of the concave portion of the package via the opening formed on the positive lead electrode, and the opening formed on the negative lead electrode. Since the molding resin is exposed to the bottom surface of the recess through the opening, the exposed molding resin and the mold resin are firmly joined, and the joining between the mold resin and the package molding can be strengthened.
【００３４】以上のように実装された実施の形態のパッ
ケージ成形体は、挿入されたリード電極の側面とパーテ
ィングラインとが交差している。このようなパッケージ
成形体を用いると、表面実装での高温／多湿環境に悪化
されることなく高い耐湿性を有する発光装置を得ること
ができる。In the package molded product of the embodiment mounted as described above, the parting line intersects the side surface of the inserted lead electrode. When such a package molded body is used, a light-emitting device having high moisture resistance can be obtained without being deteriorated by a high-temperature / humid environment in surface mounting.
【００３５】[0035]
【発明の効果】以上詳細に説明したように、本発明に係
るパッケージ成形体は、パーティングラインが挿入され
たリード電極の側面と交差しているため、樹脂バリの流
れる方向を所望の方向に調整することができ、高い信頼
性を有し且つ製造歩留まり良く製造することができる。
また、本発明に係る発光装置は、信頼性の高い発光装置
用のパッケージ成形体を有するため、信頼性及び光学特
性の優れた発光装置が得られる。As described above in detail, in the package molded body according to the present invention, since the parting line intersects with the side surface of the lead electrode in which the parting line is inserted, the resin burr flows in a desired direction. It can be adjusted, has high reliability, and can be manufactured with a high production yield.
In addition, since the light emitting device according to the present invention has a highly reliable light emitting device package, a light emitting device having excellent reliability and optical characteristics can be obtained.
【図面の簡単な説明】[Brief description of the drawings]
【図１】 本発明の実施の形態であるパッケージ成形体
の模式的側面図である。FIG. 1 is a schematic side view of a molded package according to an embodiment of the present invention.
【図２】 本発明の他の実施の形態であるパッケージ成
形体の模式的側面図である。FIG. 2 is a schematic side view of a molded package according to another embodiment of the present invention.
【図３】 従来例の問題点を説明するための模式的側面
図である。FIG. 3 is a schematic side view for explaining a problem of the conventional example.
【図４】 （ａ）は本発明の実施の形態である発光装置
の模式的指図であり、（ｂ）はその模式的断面図であ
る。FIG. 4A is a schematic diagram of a light emitting device according to an embodiment of the present invention, and FIG. 4B is a schematic sectional view thereof.
１…成形樹脂部、 ２ａ…正のリード電極、 ２ｂ…負のリード電極、 ３…パーティングライン、 ４…横バリ、 ５…発光素子、 ６…ワイヤ、 ７…モールド部材。 DESCRIPTION OF SYMBOLS 1 ... Molding resin part, 2a ... Positive lead electrode, 2b ... Negative lead electrode, 3 ... Parting line, 4 ... Horizontal burr, 5 ... Light emitting element, 6 ... Wire, 7 ... Mold member.
Claims (2)
ド電極とを有し、前記正と負のリード電極の主面が前記
凹部底面にてそれぞれ露出されかつ前記正と負のリード
電極のそれぞれの一端部が外部に露出されてなるパッケ
ージ成形体であって、 側面上に前記リード電極の側面と交差したパーティング
ラインを有することを特徴とするパッケージ成形体。1. A semiconductor device comprising: a recess for accommodating a light emitting element; and positive and negative lead electrodes, wherein main surfaces of the positive and negative lead electrodes are respectively exposed at the bottom of the recess and the positive and negative lead electrodes are provided. A package molded body having one end exposed to the outside, the package molded body having a parting line crossing a side surface of the lead electrode on a side surface.
該パッケージ成形体の前記凹部内底面に発光素子を有
し、前記凹部内に前記発光素子を覆うモールド部材を有
することを特徴とする発光装置。2. The package molded product according to claim 1,
A light emitting device comprising: a light emitting element on a bottom surface in the concave portion of the package molded body; and a mold member for covering the light emitting element in the concave portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001077002A JP4066608B2 (en) | 2001-03-16 | 2001-03-16 | Package molded body and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001077002A JP4066608B2 (en) | 2001-03-16 | 2001-03-16 | Package molded body and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002280616A true JP2002280616A (en) | 2002-09-27 |
| JP4066608B2 JP4066608B2 (en) | 2008-03-26 |
Family
ID=18933822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001077002A Expired - Fee Related JP4066608B2 (en) | 2001-03-16 | 2001-03-16 | Package molded body and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4066608B2 (en) |
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