JP2593702B2 - Method for manufacturing semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a technology for manufacturing a semiconductor device, particularly to a technology for improving the heat radiation performance of a pellet.
The present invention relates to a device which is effective when used in a semiconductor integrated circuit device (hereinafter, referred to as an IC) which is required to have a low thermal resistance, a small size and a low price.

[Conventional technology]

Generally, ICs with large power consumption such as so-called power ICs
, A heat sink is built in a resin-sealed package. If a heat sink is incorporated into the package, the heat sink will typically be mechanically and thermally bonded to the back of the tab to which the pellet is bonded.

As an example describing a power IC having a built-in heat sink, there is P135 published by Nikkei McGraw-Hill, Inc., “Microdevices No. 2”, issued on June 11, 1984.

In addition, high-density, high-speed ICs used in computers require high heat dissipation performance. For example, as described in JP-A-53-110371, a metal plate bonded with a semiconductor pellet is used. There is used a ceramic package type semiconductor device in which a heat sink is externally mounted.

As an example describing a semiconductor device in which a heat sink is provided in a resin-sealed package, see Japanese Patent Application Laid-Open No. 62-22 / 1987.
No. 4049, JP-A-60-97652, JP-A-63-29562
JP-A-61-77350 and JP-A-58-223353.

[Problems to be solved by the invention]

The technology of incorporating a heat sink in an IC package that has a resin-encapsulated package as described above is limited by the external dimensions of the package, so the number of pins (leads) that can be designed with respect to the external shape of the package is small. I c
It is currently applied only to (breeds).

In addition, it is difficult to mass-produce a ceramic package type semiconductor device to which a heat sink is externally attached, so that it is difficult to reduce the cost.

However, in recent years, as ICs become more multifunctional, highly integrated, and faster, even surface-mounted ICs with a large number of pins, ICs with a heat-sink built-in resin-encapsulated package with good heat dissipation properties are becoming increasingly popular. Development is requested.

A first object of the present invention is to provide a manufacturing method capable of manufacturing a semiconductor device having a resin-sealed package having high heat dissipation performance with good productivity.

A second object of the present invention is to provide a semiconductor device having good productivity and mountability, a low price, a reduction in size and an increase in the number of pins, and a high heat dissipation performance of a semiconductor device. It is an object of the present invention to provide a manufacturing method which can be manufactured by using the method.

The above and other objects and novel features of the present invention are as follows.
It will be apparent from the description and accompanying drawings herein.

[Means for solving the problem]

The outline of a representative invention among the inventions disclosed in the present application will be described as follows.

That is, a plurality of leads electrically connected to the semiconductor pellet are projected from four sides of the resin-sealed package having a square planar shape, and a heat sink is implanted in the resin-sealed package. A method of manufacturing a semiconductor device, wherein the lead group is wired in four directions from a space formed in the center, and the lead group is supported by a rectangular frame outside the center space. A plurality of unit lead frames, each of which has a heat sink connecting member at each of four corners of the rectangular frame;
A multiple lead frame preparation step in which multiple lead frames arranged in the longitudinal direction are prepared; and the heat sinks are disposed diagonally at four locations facing the heat sink coupling members, respectively. A step of preparing a plurality of heat sinks in which a plurality of the heat sinks are arranged in the longitudinal direction and connected to each other by a frame; and A coupling step in which the heat sink coupling members and the coupling members of the heat sink are aligned with the central space of the unit lead frame and opposed to each other at each of four corners of the rectangular frame. The semiconductor pellet is bonded to one main surface of the heat sink. A step of electrically connecting each electrode pad of the semiconductor pellet and each of the leads; a step of molding the resin-sealed package; and the quadrangular frame of the multiple lead frame. And a step of removing the frame of the multiple heat sink and dividing the semiconductor device into the semiconductor devices.

[Action]

According to the semiconductor device manufactured by the above-described means, since the heat sink is directly in contact with the pellet without the intermediary of the tab, the heat generated by the pellet is directly discharged to the outside through the heat sink. And sufficient heat radiation performance is ensured.

Since the joint portion of the heat sink with the lead frame is disposed in the corner portion of the rectangular resin sealed package where there is room for space, it is possible to prevent the resin sealed package from being enlarged even with the heat sink built-in type. be able to.

In addition, since the pellet, the lead group, and the heat sink are resin-sealed by the resin-sealed package, external force due to vibration during transportation when the semiconductor device is mounted on a printed wiring board or after the semiconductor device is mounted is reduced. Even in the case of joining the semiconductor device, it is possible to prevent an accident such as bending of a lead from occurring, and as a result,
Short circuit failure and disconnection failure can be prevented from occurring. Further, since the resin-sealed package is suitable for mass production, the cost can be reduced. In addition, since the lead frame and the heat sink are configured in multiples, it is suitable for mass production and the cost can be further reduced.

〔Example〕

1 (a) and 1 (b) are a front sectional view and a cross-sectional end view along a diagonal line showing a resin-sealed MSP · IC manufactured by a manufacturing method according to an embodiment of the present invention, and FIGS. FIG. 8 is an explanatory view showing a method of manufacturing the MSP · IC according to one embodiment of the present invention.

In the present embodiment, the method for manufacturing a semiconductor device according to the present invention includes a resin-sealed mini square package that is a semiconductor integrated circuit device (hereinafter, referred to as an IC) for realizing high-density mounting. It is configured as a method of manufacturing an IC (hereinafter, sometimes referred to as MSP · IC or simply IC).

This resin-sealed type MSP / IC 25 includes a silicon semiconductor pellet (hereinafter, referred to as a pellet) 21, a plurality of leads 9 arranged on four sides of the pellet, each electrode pad 21 a of the pellet, and each lead 9. Bonding wire 23 with both ends bonded and bridged
And the heat sink 11 to which the pellet is bonded
And a package 24 for sealing them with a resin. The MSP · IC is manufactured by the following manufacturing method.

Hereinafter, this resin-sealed type MSP · I which is an embodiment of the present invention
A method for manufacturing C will be described. By this explanation, the MSP ・ IC
The details of the configuration about will be disclosed together.

In this embodiment, a multiple lead frame 1 shown in FIG. 2 is used by a method of manufacturing a resin-sealed MSP / IC. The multiple lead frame 1 is formed by using a thin plate made of a spring material having relatively high mechanical strength such as an iron-nickel alloy or phosphor bronze, and by appropriate means such as punching press processing or etching processing. The multiple lead frames 1 are integrally formed, and the surface of the multiple lead frames 1 is subjected to a plating process using silver (Ag) or the like so that wire bonding described later is appropriately performed (not shown). In the multiple lead frame 1, a plurality of unit lead frames 2 are arranged in a row in the horizontal direction.

The unit lead frame 2 includes a pair of outer frames 3 each having a positioning hole 3a. The two outer frames 3 are arranged in parallel at a predetermined interval and extend in series. A pair of section frames 4 are arranged between the adjacent unit lead frames 2 and 2 in parallel with each other between the two outer frames 3 and 3 and are integrally built, and substantially formed by these outer frames and section frames. The unit lead frame 2 is formed in a square frame.

In each unit lead frame 2, a dam suspension member 5 is disposed at a connection portion between the outer frame 3 and the section bar 4 in a substantially right-angle direction, and integrally protrudes therefrom. The dam member 6 is arranged so as to have a substantially square frame shape and is integrally suspended. Each dam member 6 on the section frame 4 side is provided with a heat sink coupling member 7.
Each of the heat sink connecting members 7 is provided with a connecting hole 7a at a substantially central portion thereof.

Also, a plurality of leads 9 are arranged at equal intervals in the longitudinal direction of the dam member 6, are parallel to each other, and are integrally protruded so as to be orthogonal to the dam member 6. The parts are arranged so that the front ends surround the voids 8 for accommodating the pellets described later, thereby constituting the inner parts 9a. On the other hand, the outer extension of each of the leads 9 is separated from the outer frame 3 and the section frame 4 by separating the leading end from the outer frame 3 and the section frame 4, thereby forming the outer portions 9b. The portion between the adjacent leads 9 in the dam member 6 substantially constitutes a dam 9a that blocks the flow of the resin at the time of package molding described later. The unit lead frame 2 is not provided with a tab provided in a normal lead frame and a tab suspension lead for suspending the tab on an outer frame or the like. That is, a cavity 8 is formed at the center of the unit lead frame 2 instead of the tab.

In this embodiment, the heat sink 11 shown in FIG. 3 is used for the method of manufacturing the MSP · IC.

The heat sink 11 is made of a material having good thermal conductivity such as copper and is formed in a substantially square shape larger than the planar shape of the pellet, and the heat sink 11 has a plurality of annular grooves 12 on the pellet mounting surface. Article (In this embodiment, 2
), Are arranged concentrically outside the pellets, and are formed so as to surround the pellets and are respectively submerged. The annular grooves 12 extend the leak path after the resin-sealed package is formed, which will be described later, and increase the moisture resistance of the IC having the resin-sealed package by being shape-coupled to the resin.

The heat sink 11 is provided with four connecting pieces 13 arranged at four corners of a square and projecting radially in a substantially diagonal direction, and a connecting hole 13a is formed at a tip end of each of the connecting pieces 13. It is opened so as to correspond to the coupling hole 7a of the lead frame. Each coupling piece 13 is bent in a crank shape halfway to the coupling hole 13a, and the bending of the coupling piece 13 causes the upper surface of the heat sink 11 to have a predetermined dimension from the plane of the leads 9 as described later. It is designed to be separated.

And the heat sink 11 configured as described above,
As shown in FIG. 12, they are connected to each other by an outer frame in a state where they are arranged in a line, and are configured in a multiple structure.
According to this multiple heat sink, the handleability can be improved, and the stamping molding is easy.

As shown in FIG. 4, the multiple lead frame 1 for electrical connection leads and the heat sink 11 according to the above-described configuration are provided with a coupling hole 7a of the lead frame side coupling member 7 and a heat sink side coupling piece 13 While the coupling holes 13a are aligned one above the other with the alignment holes 13a aligned,
The rivet 14 is inserted into both the coupling holes 7a and 13a and fixedly coupled by caulking. In the multiple lead frame polymer 20 to which the heat sinks 11 are connected in this manner, the lower heat sink 11 is opposed to the space 8 in the upper multiple lead frame 1 and the bending of the connecting piece 13 is performed. Thus, the lead 9 group is not in contact with or interfered with.

The multiple lead frame polymer 20 is subjected to a pellet bonding operation for each unit lead frame 2 and then to a wire bonding operation. These bonding operations are sequentially performed for each unit lead frame 2 by feeding the multiple lead frame polymers 20 in the horizontal direction at a pitch.

Then, as shown in FIGS. 5 and 6, the pellet 21 as the semiconductor integrated circuit structure in which the integrated circuit is formed in the so-called previous process in the manufacturing process of the semiconductor device is formed by the pellet bonding operation. The unit lead frame 2 is arranged at a substantially central portion on the heat sink 11, and is bonded by being mechanically fixed by a bonding layer 22 formed between the heat sink 11 and the pellet 21. As a means for forming the pellet bonding layer, a bonding method using a gold-silicon eutectic layer, a soldering layer, a silver paste adhesive layer, or the like can be used. However, if necessary, it is preferable to form a bonding layer so as not to be a barrier for heat transfer from the pellet to the heat sink.

Subsequently, as shown in FIG. 5 and FIG. 6, the electrode pad 21a of the pellet 21 bonded on the heat sink 11 and the inner portion 9a of the lead 9 in each unit lead frame 2 are formed by wire bonding. By using a suitable wire bonding device (not shown) such as an ultrasonic thermocompression bonding wire bonding device, both ends of the bonding wire 23 are bonded and bridged. . This allows
The integrated circuit built in the pellet 21 has electrode pads
The wire 21 is electrically drawn to the outside via the bonding wire 23, the inner portion 9a and the outer portion 9b of the lead 9.

In the lead frame polymer 20 thus pelletized and wire-bonded, a package group for resin sealing for each unit lead frame is used by using a transfer molding apparatus 30 as shown in FIG. Simultaneously for the unit lead frame group.

The transfer molding apparatus shown in FIG. 7 includes a pair of an upper mold 31 and a lower mold 32 which are mutually clamped by a cylinder device or the like (not shown). On the mating surface, a plurality of sets of upper mold cavity recesses 33a and lower mold cavity recesses 33b are respectively provided so as to cooperate with each other to form a cavity 33. A pot 34 is opened on the mating surface of the upper die 31, and a plunger 35 moved forward and backward by a cylinder device (not shown) is provided in the pot 34.
Are inserted so that resin (hereinafter, referred to as resin) as a molding material can be fed. On the mating surface of the lower mold 32, a cull 36 is disposed at a position facing the pot 34 and is laid down, and a plurality of runners 37 are radially disposed so as to be connected to the pot 34 and laid down. ing. The other end of each runner 37 is connected to the lower cavity recess 33b, and a gate 38 is formed at the connection so that the resin can be injected into the cavity 33.

In order to allow the escape recess 39 to escape the thickness of the lead frame polymer 20 on the mating surface of the lower mold 32, it is a rectangle slightly larger than its outer shape, and is immersed in a certain depth with dimensions almost equal to its thickness. Has been established. Furthermore, on the bottom surface of the cavity concave portion 33b of the lower mold 32, the escape concave portion 33c is a square substantially equal to the outer shape, and is immersed to a certain depth of a slight dimension so that the escape concave portion 33c can slightly escape the thickness of the bottom of the heat sink 11. I have.

When transfer molding a resin-encapsulated package using the multiple lead frame polymer 20 according to the above configuration, the upper mold
Each cavity 33 in the lower mold 31 and the lower mold 32 corresponds to a space between the four dam members 6 in each unit lead frame 2.

At the time of transfer molding, the multiple lead frame polymer 20 according to the above-described configuration is placed in the escape recess 39 submerged in the lower die 32, and the pellet 21 of each unit lead frame 2 is placed.
Are arranged and set so as to be accommodated in the respective cavities 33. At this time, the bottom of the heat sink 11 is provided in the lower cavity recess 33b.
The pellet 21 is held in the cavity 33 while being bonded to the heat sink 11.

Subsequently, the upper mold 31 and the lower mold 32 are clamped, and a resin 40 as a molding material is fed from the pot 34 to the respective cavities 33 through the runner 37 and the gate 38 by the plunger 35 and press-fitted.

After the injection, when the resin 40 is thermally cured to form the resin-sealed package 24, the upper mold 31 and the lower mold 32 are opened, and the packages 24 are separated by ejector pins (not shown). Typed. In this manner, as shown in FIG. 8, the multiple lead frame polymer 20 in which the packages 24 are formed is detached from the transfer molding apparatus 30.

The pellet 21, the inner portion 9a of the lead 9, the bonding wire 23, and a part of the heat sink 11 are sealed with resin inside the resin molded package 24. In this state, one end surface of the heat sink 11 is separated from the one end surface of the resin-sealed package 24 by an escape recess.
It is in a state of being protruded and exposed by the amount immersed in 33c. The connecting piece 13 and the rivet 14 provided at each corner of the heat sink 11 are embedded in a resin-sealed package 24. A pair of base ends of the connecting member 17 Are protruded from the corners of the above-mentioned and are suspended from the dam member 6.

Thereafter, in the lead cutting and molding step, the multiple lead frame polymer 20 is sequentially used for each unit lead frame 2 by a lead cutting device (not shown), and the outer frame, the section frame, the base end of the heat sink member 7, and After each dam 6a is cut off, the outer portion 9b of the lead 9 is bent and formed into an eye (I) lead shape by a lead forming device (not shown). At this time, a pair of cutouts of the heat sink coupling member 7 are formed at the corners of the package.

The resin-sealed MSP · IC 25 manufactured as described above is mounted on a printed wiring board as shown in FIGS. 9 and 10.

9 and 10, the printed wiring board 26 has a plurality of lands 27 and a resin-sealed MSP to be mounted.
・ It is arranged to correspond to each lead 9 in IC25,
It is formed in a substantially rectangular thin plate shape using a solder material, and the leads 9 of the IC 25 are aligned and abutted on the lands 27, and the respective leads 9 and the lands 27 are formed by reflow soldering. It is electrically and mechanically connected by the solder layer 28 thus formed.

And, if necessary, this IC25 has a heat sink 11
A radiating fin (not shown) is attached to the device, or the heat sink 11 is pressed and fixed to the printed wiring board 26 by a presser (not shown).

In this mounting state, when the IC 25 is operated and the pellet 21 generates heat, the heat is directly conducted to the heat sink 11 from the pellet 21 and is radiated to the outside air from a large surface area of the heat sink 11, so that the relative heat is released. The pellet 21 is sufficiently cooled. Further, in the case where the heat sink 11 is provided with a radiating fin, a holding member, or the like, the heat of the heat sink 11 is conducted to a wider range through the radiating fin, the holding member, or the like. Get higher.

 According to the above embodiment, the following effects can be obtained.

(1) By directly bonding a heat sink to the pellet without using a tab, heat generated by the pellet can be directly transmitted to the heat sink and effectively released to the outside of the package, so that high heat radiation performance can be achieved. Can be secured.

(2) Since the connection of the heat sink to the lead frame is provided at the square corner in the mini-square package, the corner has a relatively large space. Enlargement of the sealed package can be avoided, and downsizing, high density, and low cost can be promoted.

(3) By separately bonding the pellets to a heat sink formed of a material having good thermal conductivity, separately from the leads for electrical connection, the heat radiation performance of (1) can be further improved.

(4) On the other hand, by forming the lead for electrical connection using a material having high mechanical strength separately from the heat sink, the lead group can be prevented from being bent or damaged, and the leads (1) and (2) can be prevented. According to (3), high heat dissipation performance can be secured.

(4) Since the pellet, the lead group, and a part of the heat sink are resin-sealed with a resin-sealed package, it is possible to prevent an accident such as bending of the lead, so that short-circuit failure or disconnection failure can be prevented. Occurrence can be avoided beforehand.

(5) By supporting the heat sink on a surface different from the surfaces of the plurality of leads disposed around the pellet, it is possible to reliably prevent a short circuit accident between the heat sink to which the pellet is bonded and each lead. Because you can
The quality and reliability of the semiconductor device can be improved.

(6) By exposing a part of the heat sink so as to slightly protrude from one end surface of the resin-sealed package,
It is possible to prevent resin burrs from being attached to one end surface of the sealing resin package, and it is possible to improve the attachment of the heat radiation fins to the heat sink and the adhesion of the heat sink to the substrate or the like.

By the way, as shown in FIG. 11, as an IC having a resin-sealed package with a built-in heat sink,
Heat sink 1 inside resin-sealed package 24 '
1 'is an insulating layer 1 on the back surface of the inner portion 9a group of the lead 9.
Some are fixedly joined via a 5 'and an adhesive layer 16' (see, for example, JP-A-61-77350 and JP-A-63-29562). However, an IC with a built-in heat sink in which a heat sink is bonded to the back surface of the lead group via an insulating layer has the following problems.

(1) Since the heat sink bonded to the back surface of the lead via an insulating layer increases the capacitance between the leads and lowers the insulation resistance, the electrical characteristics deteriorate.
It is not suitable for a semiconductor device that handles high-frequency signals.

(2) Since the insulating layer and the adhesive layer are entirely traversed inside the resin-sealed package, and the ions of the adhesive layer are near the pellet, the moisture resistance is reduced.

However, in this embodiment, the resin sealing package 24
The heat sink 11 is an inner part 9b of the lead 9
Since the power supply is completely electrically isolated from the power supply, such a problem can be avoided.

Although the invention made by the inventor has been specifically described based on the embodiment, the present invention is not limited to the embodiment, and it is needless to say that various modifications can be made without departing from the gist of the invention. Nor.

As shown in FIG. 13, the shape of the connecting portion of the lead frame for electrical connection with the heat sink may protrude so as to extend diagonally. In this case, one cutout of the joint is exposed at each of the four corners of the resin-sealed package.

The connecting means between the heat sink and the lead frame for electrical connection is not limited to the use of a rivet fastening structure, but may be an adhesive bonding structure using an adhesive or a welding structure using a solder material. In these cases, the coupling holes can be omitted.

The heat sink is not limited to be configured to slightly protrude from the resin-sealed package, but may be configured to be substantially flush with one end surface of the resin-sealed package (so-called flat surface).

The shape, size, structure, etc. of the heat sink correspond to various requirements such as required heat dissipation performance, mounting form (for example, whether or not holding tools and fastening bolts are used), pellet performance, size, shape, structure, etc. It is desirable to select the radiating fins, and if necessary, radiating fins, bolt insertion holes, internal threads, and the like can be provided.

The material for forming the heat sink is not limited to a copper-based material, but may be another metal material having good thermal conductivity such as an aluminum-based material. In particular, it has excellent thermal conductivity like silicon carbide (SiC),
It is desirable to use a material having a coefficient of thermal expansion substantially equal to that of silicon as a material of the pellet.

The operation of bonding the pellet to the heat sink may be performed before the heat sink is bonded to the lead frame.

In the above description, the case where the invention made by the present inventor is mainly applied to an IC having a surface mount type resin-encapsulated package, which is a field of application in the background, has been described, but the invention is not limited thereto. The present invention can be applied to a resin-sealed power transistor and other general electronic devices. In particular, an excellent effect can be obtained when used in a semiconductor device that is small, lightweight, has many pins, is inexpensive, and requires high heat radiation performance.

〔The invention's effect〕

The effect obtained by the representative one of the inventions disclosed in the present application will be briefly described as follows.

By attaching a heat sink to the back surface of the pellet, the heat of the pellet can be conducted directly to the heat sink, so that the heat dissipation performance can be improved even for ICs with a small resin-sealed package. In addition, it is possible to realize low thermal resistance even in ICs and the like that require high density and high speed performance. As a result, by realizing resin-encapsulated packaging for this type of IC, etc.,
Further, since the productivity is good, the cost can be significantly reduced.

[Brief description of the drawings]

1 (a) and 1 (b) are a front cross-sectional view and a cross-sectional end view along a diagonal line showing a resin-sealed MSP / IC manufactured by a manufacturing method according to an embodiment of the present invention. FIG. 8 explains the manufacturing method.
FIG. 2 is a partially omitted plan view showing a multiple lead frame, FIG. 3 is a perspective view showing a heat sink, FIG. 4 is an enlarged partial perspective view showing a step of connecting the heat sink to the lead frame, and FIG. FIG. 6 is a sectional view taken along the line VI-VI of FIG. 5, FIG. 7 is a partial longitudinal sectional view showing a resin-sealed package molding operation, and FIG. 8 is a package. FIG. 9 is a partial bottom view showing a state after molding, FIG. 9 is a perspective view showing a mounting state of the MSP / IC, and FIG. 10 is a partially cut front view of the same. FIG. 11 is a partial front sectional view showing another IC for explaining the operation. FIG. 12 is a partially omitted plan view showing one embodiment of the manufacture of the heat sink, and FIG. 13 is a partially omitted plan view showing a modification of the coupling structure between the heat sink and the lead frame. 1 Multiple lead frame 2 Unit lead frame 3 Outer frame 4 Section frame 5 Dam suspension member 6 Dam member 6a Dam 7 Heat sink connection Member 8, empty space 9, electrical connection lead,
11 ... heat sink, 12 ... annular groove, 13 ... lead frame connecting piece, 14 ... rivet, 20 ... multiple lead frame polymer, 21 ... pellet, 22 ... bonding layer,
23: Bonding wire, 24: Resin-sealed package, 25: MSP / IC (semiconductor device), 26: Printed wiring board, 27: Land pad, 30: Transfer molding device, 31: Upper die , 32 …… Lower mold, 33 …… Cavity,
34 …… Pot, 35 …… Plunger, 36 …… Cul, 37 ……
Runner, 38 ... gate, 39 ... recess, 40 ... resin.

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Tadatoshi Tanno 111, Nishiyokote-cho, Takasaki-shi, Gunma, Japan Inside the Takasaki Plant of Hitachi, Ltd. (56) References JP-A-58-223353 (JP, A) JP-A Sho 54-73565 (JP, A) Actually open 57-69244 (JP, U)

Claims (3)

(57) [Claims] A plurality of leads electrically connected to a semiconductor pellet are projected from four side surfaces of a resin-sealed package having a quadrangular planar shape. A method of manufacturing a semiconductor device in which a heat sink is implanted, wherein the lead group is wired in four directions from a space formed in the center, and the lead group is formed outside a center space in a rectangular frame. A plurality of unit lead frames, each of which has a heat sink coupling member at each of four corners of the rectangular frame, and a multiple lead frame arranged in the longitudinal direction. A plurality of lead frame preparing steps, wherein each of the connecting pieces is diagonally arranged at four positions where the heat sink faces each of the heat sink connecting members. Providing a plurality of heat sinks, wherein a plurality of the heat sinks are arranged in the longitudinal direction and connected to each other by a frame; and The heat sink coupling members and the coupling pieces of the heat sink, which are aligned with the central space in the unit lead frame of the frame and face each other at each of the four corner portions of the rectangular frame, are coupled to each other. A bonding step; a step of bonding the semiconductor pellet to one main surface of the heat sink; a step of electrically connecting each electrode pad of the semiconductor pellet to each of the leads; And forming the square lead frame and the front of the multiple lead frame. The method of manufacturing a semiconductor device, characterized in that the frame of the array type heat sink is provided with a step which is divided into the semiconductor device are removed. 2. In the step of molding the resin-sealed package, the resin-sealed package is molded such that a main surface of the heat sink opposite to the main surface to which the semiconductor pellet is bonded is exposed to the outside. 2. The method for manufacturing a semiconductor device according to claim 1, wherein: 3. The method according to claim 1, wherein in the connecting step, the heat sink connecting member of the lead frame and the connecting piece of the heat sink are fixed by caulking. The manufacturing method of the semiconductor device described in the above.