JPH08241940A - Semiconductor device and its manufacture - Google Patents

Abstract

PURPOSE: To provide a low-cost BGA IC which is of high pin counts and whose heat dissipating performance is high. CONSTITUTION: In a low thermal resistance-type BGA IC 53, a pellet 31 is arranged facedown on a wiring board 10, it is bonded to a group of internal terminals 12 by a TAB operation, a heat spreader 6 is connected to the main face on the opposite face of the pellet, and one end of a spring 7 the other end of which has been coupled to an anchor 4 fixed to the main face on the pellet side of the wiring board 10 is coupled to the heat spreader 6. In its manufacture, unit heat spreader frames in which the anchor 4 from which the heat spreader is suppressed independently is suspended and held by a frame are molded in a multiple manner, and the wiring board 10 is assembled at every unit frame. Consequently, heat generated from the pellet is conducted to the heat spreader, and the pellet is cooled effectively. When the heat spreader is constituted in a multiple manner, it is not required to constitute a high-cost wiring board in a multiple manner.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for manufacturing a semiconductor device, and more particularly to a technique for improving the heat dissipation performance of a semiconductor integrated circuit device in which a semiconductor pellet is arranged on one main surface of a wiring board and resin-sealed. For example, the present invention relates to a semiconductor integrated circuit device (hereinafter referred to as an IC) which has a large number of pins, a low thermal resistance, and is required to be small and low in price.

[0002]

2. Description of the Related Art Today, as the number of pins increases, quad flat package ICs and tape carrier packages I
In a package in which pins (external terminals) are taken out from the peripheral portion such as C, the pitch is narrowed, and thus the manufacturing limit of the package and the limit of the board assembly are approached. Therefore, an IC equipped with a ball grid array package (hereinafter, referred to as BGA.BGA) as a surface mount type IC that realizes a large number of pins without increasing the size of the package by arranging external terminals on the entire main surface of the package. IC) is proposed.

That is, in this BGA IC, an internal terminal group and an external terminal group are formed on the front main surface and the back main surface, respectively, and each internal terminal and each external terminal are electrically connected to each other. The wiring board is provided with a semiconductor pellet bonded to the main surface of the wiring board on which the internal terminals are formed, and the internal terminals are electrically connected by bonding wires. The main surface on the semiconductor pellet side including the semiconductor pellet is resin-sealed by a resin sealing body. Then, solder bumps are provided in a protruding manner on the respective external terminals exposed on the opposite main surface of the wiring board.

As an example in which BGA / IC is mentioned, "VLSI packaging technology (below)" issued by Nikkei BP Co., Ltd. May 31, 1993 P173-P
There are 178.

[0005]

By the way, in recent years, as ICs have become more multifunctional, highly integrated, and faster, BGA
-There is a demand for the development of IC packages with good heat dissipation performance (heat dissipation performance) or low thermal resistance packages. Further, it is generally considered to attach a heat radiation fin to improve the heat radiation performance of the package in the conventional BGA / IC.

However, when the conventional BGA / IC is provided with a radiation fin, it is adhered to the surface of the resin encapsulant, so that the radiation efficiency is low and there is a limit to improvement of the radiation performance.

An object of the present invention is to provide a semiconductor device having a large number of pins and capable of exhibiting high heat dissipation performance.

Another object of the present invention is to provide a method of manufacturing a semiconductor device which can suppress an increase in manufacturing cost.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

The typical ones of the inventions disclosed in the present application will be outlined below.

That is, in the semiconductor device, the semiconductor pellets are arranged face-down on the wiring board and collectively bonded to the internal terminal group, and the heat spreader is thermally connected to the opposite main surface of the semiconductor pellets. In addition, one end of a spring, the other end of which is connected to an anchor fixed to the semiconductor pellet side main surface of the wiring board, is connected to the heat spreader.

In this method of manufacturing a semiconductor device, a multiple heat spreader frame is prepared in advance, in which a number of unit heat spreader frames in which anchors for suspending the heat spreader independently are hung on the frame are prepared in advance, and the multiple heat spreader frame is prepared. Each wiring board is assembled to each unit heat spreader frame before or after the semiconductor pellet is bonded.

[0013]

According to the above semiconductor device, the heat generated by the semiconductor pellets is directly transferred to the heat spreader by heat conduction, so that the semiconductor pellets are relatively effectively cooled.

Further, in manufacturing the above-described semiconductor device, since the multiple heat spreader frame is used, it is not necessary to form a high-priced wiring board in multiple rows, so that the material yield of the wiring board can be reduced. As much as I can
The manufacturing cost can be reduced. On the other hand, by assembling each wiring board to each unit heat spreader frame of the multiple heat spreader frame, it is possible to handle a large number of intermediate products at one time in each assembly process. Can be suppressed.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a low thermal resistance type B which is an embodiment of the present invention.
GA / IC is shown, (a) is a partially cut front view,
(B) is a partially cut plan view on the left half and a partially cut bottom view on the right half. FIG. 2 and subsequent drawings are explanatory views showing a method of manufacturing the BGA / IC, which is an embodiment of the present invention.

In the present embodiment, the semiconductor device according to the present invention is a semiconductor integrated circuit device (hereinafter referred to as IC) for realizing low thermal resistance, which is a BGA having good heat dissipation.
It is configured as an IC (hereinafter referred to as a low thermal resistance type BGA / IC). This low thermal resistance type BGA / IC53 is constructed as shown in FIG.

That is, the low thermal resistance type BGA / IC 53 includes a wiring board 10 in which a group of internal terminals 12 and a group of external terminals 13 are formed on the front main surface and the back main surface, respectively. Each external terminal 13 is a wiring board 10
Through the main body 11 and are electrically connected to each other.
A semiconductor pellet 31 (hereinafter, referred to as a pellet) in which a semiconductor integrated circuit including a semiconductor element group is formed is arranged face down on the main surface of the wiring board 10 on the internal terminal 12 side, and is tape automated to the internal terminal 12 group.・
They are electrically and mechanically connected by bonding (hereinafter referred to as TAB). A heat spreader 6 is thermally connected to the main surface of the pellet 31 opposite to the TAB side, and the other end of the heat spreader 6 is connected to an anchor 4 fixed to the main surface of the wiring board 10 on the pellet 31 side. One end of the formed spring 7 is connected. A resin encapsulant 38 is formed on the main surface and side surface of the wiring board 10 on the side of the pellet 31 for resin encapsulation of the pellet 31, the internal terminal 12 group, the spring 7 and the anchor 4, and the pellet 31 of the heat spreader 6 is formed. The main surface on the opposite side is exposed from one main surface of the resin sealing body 38.
Further, solder bumps 52 are provided in a protruding manner on the respective external terminals 13 exposed on the opposite main surface of the wiring board 10. The low thermal resistance type BGA / IC53 is manufactured by the manufacturing method described below.

A method of manufacturing the low thermal resistance type BGA / IC which is an embodiment of the present invention will be described below. With this description, the details of the configuration of the low thermal resistance type BGA IC53 will be clarified together.

In this embodiment, a low thermal resistance type BGA · I
The multiple heat spreader frame 1 shown in FIG. 2 is used for the manufacturing method of C. The multiple heat spreader frame 1 uses a thin plate made of a copper-based material (copper or copper alloy) or an iron-based material (iron or its alloy), which is an example of a material having good thermal conductivity, and is punched or pressed or etched. It is integrally molded by an appropriate means such as processing. The multiple heat spreader frame 1 is configured by arranging a plurality of unit heat spreader frames (hereinafter, referred to as heat spreader frames) 2 side by side in a row in a row. In the multiple heat spreader frame 1, since the pattern between the alternate long and short dash lines in FIG. 2 is repeated, the description and illustration are made in principle for one unit.

The heat spreader frame 2 includes a frame (outer frame) 3 in which a top rail, a bottom rail, and a pair of side rails are assembled in a square frame shape. The inner shape of the frame 3 of the frame 3 as viewed from the plane corresponds to the outer shape of the resin sealing body 38 as viewed from the plane, and this frame substantially constitutes a dam during transfer molding described later. ing. Pilot holes 3a are formed in the top rail and the bottom rail of the frame 3, respectively.

An anchors 4 formed in a square frame shape having a smaller diameter than that of the frame 3 are concentrically arranged in the frame 3 and are suspended by a suspension member 5. Further, in the square frame of the anchor 4, a heat spreader 6 formed in a square flat plate shape having a smaller diameter than the anchor 4 is concentrically arranged and is suspended by three springs 7. The square of the heat spreader 6 is set to be substantially equal to the pellet 31. The three springs 7 are arranged at three corners of the heat spreader 6, respectively, and are installed so as to connect the corners of the heat spreader 6 and the anchors 4. One corner portion in which the spring 7 is not arranged is set so that a gate in a transfer molding device described later can be arranged.

The spring 7 substantially constitutes a connecting piece connecting the heat spreader 6 and the anchor 4.
The spring 7 is formed by alternately arranging a plurality of cuts 8 on both ends of the connecting piece, and the spring 7 expands or contracts the intervals between the cuts 8. To expand and contract. Therefore, the heat spreader 6 is attached to the anchor 4 by the spring 7
It is in a state of being independently suspended by the elastic force of.

In this embodiment, a low thermal resistance type BGA · I
The wiring board 10 shown in FIG. 3 is used in the method of manufacturing C. The wiring board 10 is provided with a base 11 formed in a square flat plate shape using an insulating board. The outer diameter of the base 11 is set to be larger than the outer diameter of the pellet 31 and smaller than the outer diameter of the resin sealing body 38. In this embodiment, the base 11 is formed in a multi-layer structure (not shown) by using glass epoxy resin in which glass fiber is impregnated with epoxy resin. However,
The base 11 can be formed using another insulating substrate such as ceramic.

An internal terminal 1 formed in a circular thin plate shape having a small diameter on one main surface (hereinafter referred to as an upper surface) of the base 11.
A plurality of 2 (the number corresponding to the electrode pad of the pellet 31) are aligned and fixed on a square line.
In addition, on the lower surface of the base 11, the number of external terminals 13 formed in the shape of a circular thin plate having a small diameter corresponding to the number of the internal terminals 12,
It is arranged and fixed in a scattered manner so as to be substantially even on the entire surface of the square. In this embodiment, the internal terminals 12 and the external terminals 13 are formed by patterning a copper foil attached to the surface of the base 11 by a lithographic process and an etching process. However, the internal terminal 12 and the external terminal 13 can be formed by a screen printing method, a plating method, a vapor deposition method using a metal mask, or the like.

Internal terminal 1 arranged on the upper surface of base 11
2 and the external terminals 13 arranged on the upper surface of the base 11 are electrically isolated from each other by the internal terminals 12 and the external terminals 13, and are electrically connected to each other by the electric wiring 14 wired inside the base 11. It is connected to the. The electrical wiring 14 in which a large number of wirings are electrically insulated from each other is a so-called multi-layered structure in which the upper layer and the lower layer are connected to each other by through holes after being patterned on each layer of the base 11 formed in a multilayer structure. It is formed in a wiring structure.

In this embodiment, bonding pads 15 for assembling the wiring board 10 to the heat spreader frame 2 are fixed to the corners on the upper surface of the base 11, and the bonding pads 15 are used for the heat spreader frame 2. The anchor 4 is formed in a circular flat plate shape that is large enough to face the corner portion of the anchor 4 and cover it. The bonding pad 15 is an internal terminal 12
It is formed by patterning together with the group.

The wiring boards 10 having the above-mentioned structure are fixedly assembled one by one on the heat spreader frame 2 of the multiple heat spreader frame 1 having the above structure as shown in FIG. That is, after the bonding agent is applied to each bonding pad 15 of the wiring board 10 and / or each corner portion of the anchor 4 of the heat spreader frame 2, the wiring board 10 has each bonding pad 15 at each corner portion of the anchor 4. The heat spreader frame 2 and the heat spreader frame 2 are arranged so as to be aligned with each other. When the adhesive is hardened in a state where the wiring board 10 and the heat spreader frame 2 are overlapped with each other, the wiring board 10 is bonded to the anchor 4 of the heat spreader frame 2 by each adhesive layer 16.

The adhesive application work, the overlaying work and the adhesive hardening work can be carried out simultaneously for a plurality of heat spreader frames 2 and wiring boards 10. Therefore, workability is extremely good.

In the combined body 17 in which the heat spreader frame 2 and the wiring board 10 are vertically overlapped and combined with each other in this way, the anchor 4 in the upper heat spreader frame 2 is the outer peripheral edge of the base 11 in the lower wiring board 10. It is fixed to the base 11 by the adhesive layers 16 at four places in a state where the part slightly enters the inside as viewed from above and overlaps. Further, the heat spreader 6 has a lower surface from the upper surface of the base 11 of the wiring board 10 to the adhesive layer 1
With the thickness of 6 slightly lifted, the base 1 is made by three springs 7 connected to each corner.
Floatingly supported with respect to 1.

In the combined body 17 in which the heat spreader frame 2 and the wiring board 10 are combined as described above, the pellet TAB structure 20 is attached to the wiring board 10 and the outer lead bonding step shown in FIG. 6 described later. At, each heat spreader frame 2 is electrically and mechanically connected. At this time, since the connecting bodies 17 are configured in multiples, this connecting work is sequentially performed for each unit by the connecting bodies 17 being pitch-fed in the longitudinal direction.

In this embodiment, the pellet 31 is TAB.
The structure is applied to a method for manufacturing a low thermal resistance type BGA / IC. The pellet TAB structure 20 is manufactured from the tape carrier 21 shown in FIG.

In FIG. 5, the carrier tape 22 which is the main body of the tape carrier 21 is integrally molded using an insulating resin such as polyimide so that the same pattern is continuous in the longitudinal direction. However, the description and illustration are given for only one unit. Small holes 23 used for positioning and the like are arranged at equal intervals on both side edges of the carrier tape 22 in the width direction, and a support ring 24 is provided between the small holes 23 on both sides with an equal pitch. It is formed by arranging in a single column. Support ring 2
4 is formed in a substantially square frame shape, and a pellet storage portion 25 for storing a pellet 31 described later is substantially formed in an inner space of the frame. Holding members 27 are arranged at four corners in the outer space 26 of the support ring 24, and are integrally installed so as to hold the support ring 24.

A plurality of leads 28 for electrically pulling out the integrated circuit to the outside are arranged on one side plane (hereinafter referred to as the first main surface) of the carrier tape 22, and are made of copper foil or the like. It is fixedly attached by a suitable means such as welding or adhesion using a conductive material. The group of leads 28 is divided into four sides in the support ring 24, and is arranged so as to penetrate the support ring 24 in the radial direction. The leads 28 are formed so as to be electrically disconnected from each other. There is. Pellet accommodating portion 2 in each lead 28
An inner lead 29 as an inner portion is formed by the inner tip portion projecting inside 5, and an outer lead as an outer portion is formed by an outer end portion of each lead 28 that projects outwardly across the outer space 26. 30 are configured. The outer leads 30 are fixed onto the carrier tape 22, and a tin-plated film (not shown) is applied to the surface of the lead group 28 in order to enhance the solderability.

On the other hand, although a detailed description is omitted, the pellet 31 used in this low thermal resistance type BGA / IC has a desired semiconductor element group in a wafer state in a so-called pre-process in a semiconductor device manufacturing process. The circuit is built in appropriately. Then, the pellet 31 in which the integrated circuit (not shown) is formed is the pellet storage portion 2 of the support ring 24.
5 is diced into a substantially square piece that can be accommodated in 5, and a plurality of bumps 32 formed by using a gold-based material are formed on the peripheral portion of one main surface (hereinafter referred to as the first main surface). , Each inner lead 2 on the carrier tape 22
It is arranged so as to be able to match 9 and is projected.

The pellet 31 having the above structure is TA
In the so-called inner lead bonding step in the method of manufacturing an IC according to B, it is attached to the carrier tape 22. At this time, the carrier tape 22 is stretched between a plurality of sprockets and guide rails (not shown) and intermittently fed in one direction. Then, in the inner lead bonding stage arranged midway on the stretched carrier tape 22, the pellet 31 is transferred to the pellet accommodating portion 25.
By accommodating the bumps from below the support ring 24, aligning the bumps with the inner leads 29 and thermocompression bonding with a bonding tool,
It is attached to the carrier tape 22. That is, since a gold-tin eutectic crystal is formed between the tin plating film deposited on the surface of the lead 28 and the bump 32 made of a gold-based material, the inner lead 29 of the lead 28 and the bump 32 are formed.
And will be integrally combined.

When the pellets 31 are assembled to the carrier tape 22 in this way, the tape carrier 21 is assembled. In the assembled state of the tape carrier 21, the pellet 31 undergoes an inspection such as an electrical characteristic test. Usually, the inspected pellets 31 are supplied to the outer lead bonding process in the state of the tape carrier 21. Then, in the outer lead bonding process, the outer lead 30 group is cut at a position outside the support ring 24 in the tape carrier 21, whereby the pellet TAB structure 20 is manufactured.
By the way, after the inspection, even if the pellet TAB structure 20 is supplied to the outer lead bonding step in a state where the pellet TAB structure 20 is cut out from the tape carrier 21 and transferred to a carrier jig such as a tray. Good.

In the outer lead bonding step shown in FIG. 6, the combined body 17 holds the heat spreader 6 by vacuum suction by the heat spreader holding collet 33 and lifts it from the upper surface of the wiring board 10 by a predetermined distance. When the heat spreader 6 is floated from the wiring board 10 by a predetermined distance, the pellet TAB structure 20 in which the second main surface of the pellet 31 is vacuum-adsorbed and held by the pellet TAB structure holding collet 34 is used as the heat spreader 6 and the wiring board 10. It is inserted horizontally between and. With this insertion, the TAB structure 20 of the pellet
The outer leads 30 of the internal terminals 12 of the wiring board 10 are
Are aligned and brought into contact with each other. Here, the wiring board 1
Cream solder (not shown) is previously applied to the upper surface of each internal terminal 12 of No. 0, and when each outer lead 30 is aligned with and abutted against each internal terminal 12, each outer lead 30 is connected to each internal terminal 12. It becomes a state of being adhered by cream solder.

Then, when the pellet TAB structure holding collet 34 is pulled out from between the heat spreader 6 and the wiring substrate 10, the holding of the heat spreader holding collet 33 is released. When the holding is released, the heat spreader 6 is pulled downward by the elastic force of the spring 7, so that the heat spreader 6 is pressed against the upper surface of the pellet 31 to maintain the adhesion between the outer leads 30 and the internal terminals 12 by the cream solder. To do. In this state, the space between the outer lead 30 and the internal terminal 12 is reflow-soldered, and the soldering portion 3 formed by cream soldering is used.
5, the outer lead 30 and the internal terminal 12 are electrically and mechanically connected. At this time, since the tin plating film is deposited on the surface of the lead 28, the solderability becomes good.

Before the pellet 31 is bonded to the wiring board 10, an elastic body 36 such as silicone rubber is provided between the opposing surfaces of the pellet 31 and the wiring board 10 by a suitable means such as coating. .

In this way, the pellets 3 are formed on the wiring board 10.
When 1 is electrically and mechanically connected, an assembly (hereinafter referred to as an assembly) 37 of the wiring board and the pellets 37 shown in FIG. 6B is manufactured. Since this assembly 37 is in the state of being assembled to the combined body 17, it constitutes a multiple assembly.

Next, a resin sealing body 38 is molded for each assembly 37 in this multiple assembly using the transfer molding apparatus 40 shown in FIG.

The transfer molding apparatus 40 shown in FIG. 7 comprises a pair of upper and lower dies 41 and 42 which are clamped together by a cylinder device (not shown). A plurality of sets (only one set is shown) are recessed so that the upper mold cavity concave portion 43a and the lower mold cavity concave portion 43b cooperate with each other to form the cavity 43 on the mating surface with. Has been done. A pot 44 is opened on the mating surface of the upper die 41, and a plunger 45, which is advanced and retracted by a cylinder device (not shown), feeds resin (hereinafter referred to as resin) as a molding material to the pot 44. Has been inserted to get. On the mating surface of the lower mold 42, the culls 46 are arranged so as to be opposed to the pots 44, and a plurality of runners 47 are radially arranged so as to be connected to the pots 44, respectively. ing. The other end of each runner 47 is connected to the lower cavity recess 43b, and a gate 48 is formed at that connection so that the resin can be injected into the cavity 43. Further, the multiple heat spreader frame 1 is provided so that an escape recess 49 can escape the thickness of the multiple heat spreader frame 1 on the mating surface of the lower mold 42.
It has a rectangular shape slightly larger than the outer shape, and is submerged at a constant depth of a size approximately equal to its thickness.

At the time of transfer molding, the multiple assembly is housed in the escape recess 49 which is recessed in the lower mold 42. As a result, the inner peripheral edge of the frame 3 in the heat spreader frame 2 is in a state of being along the outer peripheral edge of the lower mold cavity recess 43b to form a dam. Then, the wiring board 10, the anchor 4, the support ring 24, and the pellet TAB structure 20 are accommodated in the lower mold cavity recess 43b. In addition, the lower surface of the base 11 of the wiring board 10 has a lower die carrier recess 43.
It comes into contact with the bottom surface of b.

Subsequently, the upper mold 41 and the lower mold 42 are clamped. As a result, the upper surface of the heat spreader 6 is placed on the upper die 4
It is pressed against the ceiling surface of 1. Here, since the elastic body 36 of silicone rubber or the like is previously interposed between the upper surface of the wiring board body 11 and the lower surface of the pellet 31, the heat spreader 6 reliably presses the upper mold 41 without a gap. That is, since the pellets 31 are pushed up by the elastic body 36 having a reaction force against the wiring board 10 that is in contact with the bottom surface of the lower die 42, the heat spreader 6 that is pressed against the upper surface of the pellet 31 is pushed onto the ceiling surface of the upper die 41. It will be in contact with you.

Thereafter, the resin 50 is fed from the pot 44 to the respective cavities 43 through the runner 47 and the gate 48 by the plunger 45 and press-fitted. At this time, since the gate 48 is opened in the corner portion of the heat spreader frame 2 where the spring 7 is not arranged, the resin 50 is satisfactorily press-fitted into the cavity 43 without being interfered by the spring 7.

After the injection, when the resin is thermoset to mold the resin encapsulant 38, the upper die 41 and the lower die 42 are opened, and the resin encapsulant is ejected by an ejector pin (not shown). 38 groups are released.

Through the above transfer molding process, the molded product 51 shown in FIG. 8 is molded.
In FIG. 8, the pellet 3 is provided inside the resin sealing body 38.
1, the lead 28 group, the support ring 24, a part of the heat spreader 6 coupled to the second main surface of the pellet 31, and a part of the wiring board 10 are also resin-sealed.
In this state, the end surface of the wiring board 10 opposite to the pellet mounting surface of the base 11 is exposed from the surface of the lower surface of the resin sealing body 38, and the external terminals 13 are exposed. Further, the end surface of the heat spreader 6 opposite to the pellet mounting surface is exposed from the surface of the upper surface of the resin sealing body 38. Incidentally, the exposed heat spreader 6 may have a radiation fin attached thereto or a pressing tool for pressing it against the printed wiring board, if necessary.

Thereafter, solder bumps 52 are provided on the external terminals 13 exposed on the lower surface of the base 11 of the wiring board 10 by a suitable method such as a screen printing method or a metal mask vapor deposition method. Then, the hanging member 5 of the heat spreader frame 2 is cut at the base end portion of the resin encapsulant 38, whereby the low thermal resistance type BGA / IC 53 having the configuration shown in FIG. 1 is manufactured. .

This low thermal resistance type BGA / IC 53 is electrically and mechanically processed by a reflow soldering process in which each solder bump 52 is aligned with a pad of the printed wiring board on a printed wiring board (not shown). Connected.

In this mounted state, a low thermal resistance type BG
When the A / IC 53 is operated and the pellet 31 generates heat, the heat is directly conducted from the pellet 31 to the heat spreader 6 and is radiated to the outside air from the large surface area of the heat spreader 6, so that the pellet 31 is relatively discharged. Is sufficiently cooled. Further, when the heat spreader 6 is provided with a radiation fin, a retainer, and the like,
Since the heat of the heat spreader 6 is conducted to a wider area through the heat radiation fins, the pressing tool, etc., the heat radiation effect is further enhanced.

According to the above embodiment, the following effects can be obtained. (1) The pellets are arranged in a face-down manner on the wiring board and bonded together to the internal terminal group, and the heat spreader is thermally connected to the main surface on the opposite side of the pellets, so that the heat generated by the pellets is conducted to the heat spreader. As a result, the pellets can be cooled very effectively and the heat dissipation performance can be improved.

(2) By adopting the above (1) in the BGA IC capable of realizing a large number of pins without increasing the size of the package, a low thermal resistance type BGA I
C can be realized.

(3) A multiple heat spreader frame, in which a number of unit heat spreader frames in which anchors that suspend the heat spreader independently via springs are suspended by the frame, are provided in advance, and each of the multiple heat spreader frames is prepared. By assembling each wiring board to the unit heat spreader frame before bonding the pellets, it is not necessary to construct a high-cost wiring board in multiple rows, so that the material yield of the wiring board can be reduced and the manufacturing cost is reduced. Can be reduced.

(4) Further, by assembling each wiring board to each unit heat spreader frame of the multiple heat spreader frame, a large number of intermediate products can be handled collectively in each assembling process, so that a heat spreader can be attached. Nevertheless, it is possible to suppress an increase in manufacturing cost.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the wiring board is not limited to being assembled to each unit heat spreader frame of the multiple heat spreader frame before bonding the pellets, but may be assembled to each unit heat spreader frame of the multiple heat spreader frame after the pellets are bonded. In this case, the outer lead bonding work of the TAB structure of the pellet on the wiring board becomes easy.

The outer lead bonding process of the pellet TAB structure to the wiring board is not limited to the soldering process, but an anisotropic conductive adhesive may be used.

Further, the pellets are not limited to being bonded to the wiring board by the TAB structure, but may be collectively bonded by a face-down bonding method such as the CCB method or the flip chip method.

The external terminals of the wiring board are not limited to the protruding solder bumps, but pins may be protruding.

The shapes of the resin sealing body and the heat spreader are not limited to the square shape, but may be formed in a quadrilateral shape such as a rectangle. In particular, the heat spreader is not limited to a regular quadrangle, but may be formed in a circle or a polygon.

The heat spreader is not limited to be partially embedded inside the resin encapsulant, but may be entirely embedded.

In the above description, the invention made by the present inventor is the field of application which is the background of the invention.
Although the case of application to an IC has been described, the present invention is not limited to this, and an IC (P-PGA IC) equipped with a resin-sealed pin grid array package.
The present invention can be applied to an IC, a power transistor provided with the package, and other electronic devices in general by arranging external terminals such as the above all over the package. In particular, the invention is
It is compact, lightweight, has a large number of pins, is low in price, and can be used in a semiconductor device that requires high heat dissipation performance, and can achieve excellent effects.

[0063]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

The semiconductor pellets are arranged on the wiring board in a face-down manner and bonded together to the internal terminal group, and the heat spreader is thermally connected to the main surface on the opposite side of the semiconductor pellets, so that the heat generated by the semiconductor pellets can be reduced. Since the heat can be directly transferred to the semiconductor pellets, the semiconductor pellets can be cooled extremely effectively, and the heat dissipation performance can be improved.

A multiple heat spreader frame in which a number of unit heat spreader frames in which an anchor, in which a heat spreader is independently suspended via a spring, is suspended in a frame is continuously provided, is prepared in advance, and each unit heat spreader frame of this multiple heat spreader frame is prepared. By assembling each wiring board before bonding semiconductor pellets to each other, it is not necessary to form a high-priced wiring board in multiples, so that the material yield of the wiring board can be reduced and the manufacturing cost is reduced. Also, by assembling each wiring board to each unit heat spreader frame of the multiple heat spreader frame, it is possible to handle a large number of intermediate products at one time in each assembly process. Notwithstanding, it is possible to suppress an increase in manufacturing cost.

[Brief description of drawings]

FIG. 1 is a low thermal resistance type BGA · I which is an embodiment of the present invention.
C is a front sectional view, (b) is a partially cut plan view of the left half and partially cut bottom view of the right half.

2A and 2B show a multiple heat spreader frame used in the manufacturing method of the BGA / IC, which is one embodiment of the present invention, in which FIG. 2A is a partially omitted plan view and FIG. 2B is a front sectional view. is there.

3A and 3B also show a wiring board, in which FIG. 3A is a plan view of the left half, a bottom view of the right half, and FIG.

FIG. 4 shows a combined body after the bonding step of the heat spreader frame and the wiring board in the manufacturing method,
(A) is a plan view on the left half and a bottom view on the right half,
(B) is a front sectional view.

FIG. 5 shows a tape carrier for manufacturing a TAB structure of pellets used in the manufacturing method, in which (a) is a plan view of the left half and bottom view of the right half, and (b) is a part thereof. It is a cutting front view.

FIG. 6 shows an outer lead bonding step in the manufacturing method, wherein (a) is a perspective view and (b) is a front sectional view after bonding.

FIG. 7 is a vertical cross-sectional view showing a resin sealing body molding step in the manufacturing method.

8A and 8B show a state after molding the resin encapsulant, wherein FIG. 8A is a left half plan view, a right half bottom view, and FIG. 8B is a partially cut front view.

[Description of sign]

1 ... Multiple heat spreader frame, 2 ... Unit heat spreader frame (heat spreader frame), 3 ...
Frame (outer frame) 3a ... Pilot hole, 4 ... Anchor, 5 ... Hanging member, 6 ... Heat spreader, 7 ... Spring, 8 ... Notch, 10 ... Wiring board, 11 ... Base, 12 ... Internal terminal, 13 ... External Terminals, 14 ... Electric wiring, 15 ... Pads, 16 ... Adhesive layer, 17 ... Combined body of heat spreader frame and wiring board, 20 ... Pellet TAB structure, 21 ... Tape carrier, 22 ... Carrier tape, 23 ... Small Hole, 24 ... Support ring, 25 ...
Pellet accommodating portion, 26 ... Outer space, 27 ... Holding member, 2
8 ... Lead, 29 ... Inner lead, 30 ... Outer lead, 31 ... Pellet, 32 ... Bump, 33 ... Heat spreader holding collet, 34 ... Pellet TAB structure holding collet, 35 ... Soldering part, 36 ... Elastic body,
37 ... Assembly of wiring board and pellets, 38 ... Resin sealing body, 40 ... Transfer molding device, 41 ... Upper mold, 42 ...
Lower mold, 43 ... Cavity, 43a ... Upper mold cavity recess, 43b ... Lower mold cavity recess, 44 ... Pot,
45 ... Plunger, 46 ... Cull, 47 ... Lanna, 48 ...
Gate, 49 ... Escape recess, 50 ... Resin, 51 ... Molded product, 52 ... Solder bump, 53 ... Low thermal resistance type BGA / I
C (semiconductor device).

Claims (7)

[Claims] 1. A semiconductor pellet is disposed on one main surface of a wiring board and electrically connected to an internal terminal group, and a main surface of the wiring board on the semiconductor pellet side is covered with a resin sealing body including the semiconductor pellet. In a semiconductor device which is resin-sealed and in which the external terminal group is arranged on the opposite main surface of the wiring board, the semiconductor pellets are arranged face down on the wiring board and collectively bonded to the internal terminal group. The heat spreader is thermally connected to the opposite main surface of the semiconductor pellet, and the heat spreader has a spring whose other end is connected to an anchor fixed to the semiconductor pellet side main surface of the wiring board. A semiconductor device having one end connected. 2. The semiconductor device according to claim 1, wherein the semiconductor pellet is electrically and mechanically bonded to the wiring board by a tape automated bonding structure. 3. The semiconductor device according to claim 1, wherein a main surface of the heat spreader opposite to the semiconductor pellet is exposed from one main surface of the resin sealing body. 4. The method for manufacturing a semiconductor device according to claim 1, further comprising a step of preparing a multiple heat spreader frame in which a plurality of unit heat spreader frames in which the anchor is hung on the frame are continuously arranged. A method for manufacturing a semiconductor device, comprising: 5. The spring is formed integrally with the unit heat spreader frame, and a plurality of notches are alternately formed on both end sides of a connecting piece connecting the heat spreader and the frame. The method of manufacturing a semiconductor device according to claim 4, wherein 6. The method of manufacturing a semiconductor device according to claim 4, wherein the wiring board is assembled to each unit heat spreader frame of the multiple heat spreader frame before the semiconductor pellet is bonded. 7. The method of manufacturing a semiconductor device according to claim 4, wherein the wiring board is assembled to each unit heat spreader frame of the multiple heat spreader frame after the semiconductor pellet is bonded.