JP2001135767A - Semiconductor device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reliability in a small-sized semiconductor device having a structure with an exposed tab. SOLUTION: In the device, there are provided a sealed portion 3 formed by resinsealing a semiconductor chip 2 and an exposed surface 1h, which supports the semiconductor chip 2 and is exposed from backside 3a of the sealed portion 3. There are also provided a tab 1c having a bent portion 1f bent to the sealed portion 3 side at an end 1g, inner leads 1a, which are a plurality of leads disposed around the tab 1c, outer leads 1b, which are connected to the inner leads and projected outside from the sealed portion 3, and a bonding wire 4 for connecting pads 2a of the semiconductor chip 2 and the inner leads corresponding thereto. The bent portion 1f is formed at the end 1g if the tab 1c, by having this bent portion 1f bite into the sealed portion 3, so that the contact area of the sealed portion 3 and the tab 1c is increased and thus the adhesion therebetween is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing technology, and more particularly to a technology effective when applied to improve the reliability of a small semiconductor device having a tab exposed structure.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

[0003] As a miniaturized semiconductor device, CSP is used.
A small package called a “Chip Size Package or Chip Scale Package” or a QFN (Quad Flat Non-leaded Package), which is slightly larger than a chip size or a semiconductor chip, has been developed. TSOP (Thin Small Outline) is a thin semiconductor device.
A package called Package) has been developed.

[0004] Among these small and thin packages, there is a relatively small pin type package that can be assembled using a lead frame for cost reduction. System IC (Integrated
For example, a circuit having a structure that exposes a tab supporting the semiconductor chip to the back surface of the sealing portion (the surface on the semiconductor device mounting side) has been devised because a heat dissipation function is required in the circuit.

The structures of various CSPs and QFNs are described in, for example, Press Journal Inc., July 1998.
Published on March 27, "Monthly Semiconductor W
old special issue '99 semiconductor assembly and inspection technology ", 47-5
It is described on page 7.

[0006]

However, in the package having the tab-exposed structure according to the above-described technology, one surface of the tab is exposed on the back surface of the sealing portion, so that the tab and the resin (sealing portion) are not connected to each other. Small contact area.

Therefore, the adhesion between the tab and the resin is poor, and there is a problem that the separation between the tab and the resin occurs, thereby deteriorating the moisture resistance of the package.

[0008] In a package having a tab-exposed structure, lamination molding is performed in which a film sheet is placed in a cavity and molded to expose the tab from a sealing portion.

In this method, the back surface of the tab, which is the surface opposite to the surface on the chip supporting side of the tab, is brought into close contact with the film sheet and molding is performed to expose the back surface of the tab.

However, molding may be performed in a state where the tab is warped due to minute steps of the film sheet suction part at the bottom of the cavity or burrs remaining at the bottom of the cavity. As a result, the tab may be shrunk by heat shrinkage after curing. Phenomena such as warpage to the opposite side occur, and the tab is deformed.

That is, in the semiconductor device (package) having the tab-exposed structure, the tab is easily affected by the outside, which causes a problem that the tab is easily deformed.

An object of the present invention is to provide a semiconductor device having a tab exposed structure for improving reliability and a method of manufacturing the same.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0014]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, in the semiconductor device of the present invention, a sealing portion formed by sealing a semiconductor chip with a resin, and an exposed portion that supports the semiconductor chip and is exposed on a surface of the sealing portion on the semiconductor device mounting side. A tab provided with a surface, a step provided with a stepped portion at a contact portion with the sealing portion, a plurality of leads arranged around the tab, a surface electrode of the semiconductor chip and the corresponding lead. And a connection member for connection.

Further, in the semiconductor device of the present invention, a sealing portion formed by sealing the semiconductor chip with a resin, and an exposed portion that supports the semiconductor chip and is exposed on the semiconductor device mounting side surface of the sealing portion. A tab having a surface, a bent portion bent to the sealing portion side provided at an end, a plurality of leads arranged around the tab, a surface electrode of the semiconductor chip, and the lead corresponding thereto And a connection member for connecting

Accordingly, by providing a step portion such as a bent portion on the tab and making the step portion bite into the sealing portion, the contact area between the tab and the sealing portion can be increased.

Thus, the adhesion (bonding strength) between the tab and the sealing portion can be improved, and as a result, the occurrence of peeling at the interface between the tab and the sealing portion can be prevented.

Therefore, the moisture resistance of the semiconductor device can be improved, and thereby the reliability of the semiconductor device having the tab exposed structure can be improved.

Further, a method of manufacturing a semiconductor device according to the present invention
A lead frame having an exposed surface that is exposed on a semiconductor device mounting side surface of a sealing portion formed by resin-sealing a semiconductor chip, and having a tab provided with a step portion at a contact portion with the sealing portion. Preparing, bonding the tab of the lead frame to the semiconductor chip, connecting a surface electrode of the semiconductor chip and a corresponding lead of the lead frame by a connecting member, A step of forming the sealing portion by resin sealing the chip so that the step portion of the tab bites into the sealing portion, and exposing the exposed surface of the tab to the surface on the semiconductor device mounting side; Separating the plurality of leads from the frame of the lead frame.

[0021]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, members having the same functions are denoted by the same reference numerals, and the repeated description thereof will be omitted.

FIG. 1 is a sectional view showing an embodiment of the structure of a semiconductor device according to the present invention, FIG. 2 is a partial plan view of a lead frame used for manufacturing the semiconductor device shown in FIG.
FIG. 3 is a manufacturing process diagram showing an example of an embodiment of the method of manufacturing the semiconductor device shown in FIG.
5 is a cross-sectional view illustrating an example of a method of bending a tab in the method of manufacturing the semiconductor device illustrated in FIG. 1, and FIG. 5 is a partial cross-sectional view illustrating an example of a structure of the semiconductor device illustrated in FIG.

The semiconductor device shown in FIG. 1 is a thin type, resin-sealed type, and a surface mount type. In this embodiment, as an example of this semiconductor device, TSOP5 (Thin Small O
utline Package).

The TSOP 5 is thin and has a relatively small number of pins. For example, the TSOP 5 is incorporated in a small-sized portable electronic device or the like. Side and opposite side)
Is a tab-exposed structure that is exposed on a surface on the semiconductor device mounting side (hereinafter referred to as a back surface 3a) of a sealing portion 3 formed by a resin mold.

That is, the semiconductor chip 2 mounted on the TSOP 5 has a power or communication LSI (Large).
Scale integration) is formed, and the semiconductor chip 2 relatively needs heat radiation.

However, the TSOP 5 is not limited to a small and portable electronic device, but may be incorporated in another electronic device or a communication device.

Referring to FIGS. 1 to 5, the TSOP shown in FIG.
The configuration of the semiconductor device 2 will be described. The sealing portion 3 is formed by sealing the semiconductor chip 2 with a resin, and the exposed surface 1 that supports the semiconductor chip 2 and is exposed on the back surface 3 a of the sealing portion 3.
h, and a bent portion 1f bent toward the sealing portion 3
A tab 1c provided with an end portion 1g (step portion);
c, a plurality of inner leads 1a, outer leads 1b connected to the inner leads 1a and protruding outside from the sealing portion 3, and pads 2a of the semiconductor chip 2.
(Surface electrode) and a bonding wire 4 (connection member) for connecting the corresponding inner lead 1a,
A bent portion 1f is formed at the end 1g of the tab 1c, and the bent portion 1f is cut into the sealing portion 3 (mold resin), so that the contact area between the sealing portion 3 and the tab 1c is increased, and the two are in close contact with each other. It improves the properties (joining strength).

Here, the bent portion 1f formed on the end 1g of the tab 1c is formed on the tab 1c at the stage of manufacturing the lead frame 1 shown in FIG. 2, and is opposite to the exposed surface 1h of the tab 1c. It is formed by bending in the direction of the surface on the side, that is, in the direction of cutting into the sealing portion 3 when resin sealing is performed.

In the TSOP 5, as shown in FIG. 1, the position (height) of the tab 1c is lower than the position (height) of the inner lead 1a, and the tab is lowered. Therefore, at the time of the tab lowering process in the manufacturing process of the lead frame 1, the bent portion 1f of the end 1g of the tab 1c is formed together with this.

The amount of bending of the bent portion 1f at this time is such that the bonding operation by the bonding tool during wire bonding is not hindered.

That is, it is preferable that the bending amount is such that the tip of the bent portion 1f does not approach the main surface 2b of the semiconductor chip 2.

Further, in the present embodiment, the bent portion 1f of the tab 1c is bent toward the sealing portion 3 substantially at right angles to the exposed surface 1h.

Further, since the TSOP 5 has a structure in which the outer leads 1b protrude in opposite directions on a pair of opposing sides of the sealing portion 3, the bent portion 1f has the tab 1c as shown in FIG. It is formed at each end 1g of a pair of opposing sides.

It should be noted that the tab suspension leads 1e are left on a pair of opposing sides of the tab 1c where the bent portion 1f is not formed.

The outer lead 1b is formed in a gull wing shape as shown in FIG.

The exposed surface 1h of the tab 1c exposed on the back surface 3a of the sealing portion 3 emits heat generated from the semiconductor chip 2 to the outside. Therefore, in the TSOP 5 of this embodiment, the exposed surface 1h The heat can be efficiently dissipated.

The semiconductor chip 2 is fixed on the tab 1c by a die bonding material (for example, a silver paste or a thermoplastic adhesive).

The bonding wire 4 (connection member) for electrically connecting the pad 2a of the semiconductor chip 2 and the corresponding inner lead 1a is, for example, a gold wire or an aluminum wire.

The sealing portion 3 is formed by resin sealing by a molding method, and a sealing resin used at this time is, for example, a thermosetting epoxy resin.

Further, the inner lead 1a, the outer lead 1b and the tab 1c are made of, for example, Cu, Fe or Fe.
-A thin plate made of Ni or the like.

Next, a method of manufacturing the TSOP 5 according to the present embodiment will be described with reference to a manufacturing process diagram shown in FIG.

The method of manufacturing TSOP5 is described in FIG.
This is performed using the lead frame 1 shown in FIG.

First, the semiconductor chip 2 is provided with an exposed surface 1h exposed on the back surface 3a of the sealing portion 3 formed by resin sealing, and a bent portion 1f bent toward the sealing portion 3 has an end 1g. A thin lead frame 1 having the provided tab 1c is prepared.

That is, the lead frame 1 shown in FIG. 2 in which a bent portion 1f is formed in advance at each end 1g of a pair of opposing sides of the tab 1c is prepared.

The bending of the bent portion 1f of the tab 1c is performed by pressing using a bending die 6 and a press 7, which are pressing dies, as shown in FIG.

That is, at the time of the tab lowering process in the manufacturing process of the lead frame 1, the pressing is performed together with the tab lowering process.

Each shape pattern such as the inner lead 1a and the outer lead 1b, and the guide elongated hole 1j and the positioning hole 1k is formed by punching or etching.

The lead frame 1 shown in FIG.
A plurality of TSOPs 5 can be manufactured from a single lead frame 1, so that one lead frame 1 has one TSOP.
A plurality of package regions corresponding to No. 5 are formed.

Further, a plurality of guide long holes 1j and positioning holes 1k for transporting the lead frame 1 at the time of die bonding or wire bonding are formed in the opposing outer frame portion 1i.
A dam bar 11 for preventing outflow of the mold resin at the time of molding is provided near the outside of the portion where the sealing portion 3 is formed in the gap between b.

The material of the lead frame 1 is, for example, copper (Cu), iron (Fe), or an alloy of iron and nickel (Fe-Ni). The thickness is about 1 to 0.15 mm, but the material and the thickness are not limited to these.

On the other hand, a semiconductor chip 2 having a semiconductor integrated circuit formed on the main surface 2b is prepared based on step S1 in FIG.

Subsequently, as in step S2, the lead frame 1 shown in FIG. 2 is supplied, and then the tab 1c of the lead frame 1 and the back surface 2c of the semiconductor chip 2 (the surface opposite to the main surface 2b) are connected. Join.

That is, as shown in step S3 of FIG. 3, die bonding is performed to fix the semiconductor chip 2 to the tab 1c of the lead frame 1 via the die bonding material (for example, silver paste) with the main surface 2b facing upward. (Also referred to as pellet bonding or chip mounting).

Thereafter, the pad 2a of the semiconductor chip 2
The corresponding inner lead 1a is electrically connected by wire bonding (step S4).

Thus, the pad 2a of the semiconductor chip 2
And the corresponding inner leads 1a are electrically connected by bonding wires 4.

Thereafter, as shown in step S5, resin sealing of the semiconductor chip 2 by molding is performed.

Here, the semiconductor chip 2 is sealed with a resin by molding, so that the bent portion 1 of the tab 1c is formed.
f is cut into the sealing portion 3 (mold resin), and the sealing portion 3 is formed such that the exposed surface 1h of the tab 1c is exposed on the back surface 3a (the surface on the semiconductor device mounting side).

As a result, the bent portion 1f of the tab 1c is cut into the sealing portion 3, so that the tab 1c
The tab 1c and the sealing portion 3 (mold resin) are also provided in the structure in which the exposed surface 1h of the c is exposed to the back surface 3a side of the sealing portion 3.
The contact area between the tab 1c and the sealing portion 3 can be improved.

The sealing section 3 of the TSOP 5 of the present embodiment is formed by molding using a film sheet.

That is, at the time of molding, the mold resin is filled in the cavity while the film sheet is arranged at the bottom of the cavity and the back surface 1d of the tub 1c is in close contact with the film sheet, whereby the back surface 1d of the tab 1c is formed.
Is exposed on the back surface 3 a of the sealing portion 3.

Thereafter, a plurality of leads, that is, the outer leads 1b are cut off from the frame 1i of the lead frame 1 by cutting (step S6), and the outer leads 1b including the sealing portions 3 from the frame 1i of the lead frame 1 are removed. To separate. In addition, the outer lead 1
b is formed into a gull-wing shape.

Thus, TSOP5 shown in FIG. 1 is completed (step S7).

FIG. 5 shows an embodiment of the completed TSOP5.

FIG. 5 shows TSOP5 by reflow or the like.
Is mounted on the mounting board 8.

That is, TS is determined by solder reflow or the like.
The outer lead 1b of the OP5 is electrically connected to the terminal 8a of the mounting substrate 8, and thereby, the T
The SOP 5 can be mounted on a mounting board 8 such as a printed wiring board by surface mounting, similarly to a semiconductor device such as a QFP (Quad Flat Package).

When the ground pad 2a of the semiconductor chip 2 is electrically connected to the tab 1c by wire bonding, that is, when the tab 1c is grounded, the exposed surface 1h of the tab 1c is connected. Can be used as a ground terminal. In this case, the terminal 8a of the mounting board 8 and the exposed surface 1h of the tab 1c may be connected by soldering, so that the electrical mounting board is connected via the tab 1c. 8 and the heat can be transmitted from the tab 1c to the mounting board 8, so that the heat dissipation of the TSOP 5 can be further improved.

TSOP5 (semiconductor device) of the present embodiment
According to the method and the method for manufacturing the same, the following effects can be obtained.

That is, the bent portion 1f (step portion) is provided on the tab 1c, and the bent portion 1f is cut into the sealing portion 3 (mold resin), thereby increasing the contact area between the tab 1c and the sealing portion 3. be able to.

As a result, the adhesion (bonding strength) between the tab 1c and the sealing portion 3 can be improved, and therefore, the occurrence of peeling at the interface between the tab 1c and the sealing portion 3 can be prevented.

As a result, the moisture resistance of TSOP5 can be improved.

That is, even when moisture is absorbed from the back surface 3a of the sealing portion 3 in the TSOP 5, it is possible to prevent moisture from entering the inside of the package.

As a result, the reliability of the TSOP 5 having the tab exposed structure can be improved.

By providing the bent portion 1f on the tab 1c, the rigidity of the tab 1c can be increased. Therefore, deformation of the tab 1c such as tab warpage caused by thermal stress or external stress can be reduced.

As a result, it is possible to realize the TSOP 5 having a thin and small tab exposed structure that reduces the deformation of the tab 1 c.

Since the TSOP 5 has a tab-exposed structure, the TSO 5 has a structure in which the tab 1c such as QFP is not exposed.
Compared with P5, TSOP5 can be made thinner and the rigidity of the tab 1c can be increased.

Therefore, the thin semiconductor device TS
The reliability can also be improved in OP5.

Although the invention made by the inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the embodiments of the invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, in the above-described embodiment, the bent portion 1f formed at the end 1g of the tab 1c is connected to the back surface 1d.
Although the case where it is bent substantially at right angles to (exposed surface 1h) has been described, the bending angle of the bent portion 1f is as follows.
It does not necessarily have to be perpendicular to the back surface 1d.

That is, as shown in FIGS. 6B and 7B, the bending angle of the bent portion 1f may be an obtuse angle (bending angle> 90 °) with respect to the back surface 1d of the tab 1c. , An acute angle (bending angle <90 °).

FIG. 6B is a sectional view taken along the line AA of FIG.
This shows a cross section, and is a bent portion 1f formed by bending using a press. On the other hand, FIG.
FIG. 3A is a cross-sectional view taken along the line BB in FIG. 3A, which is a bent portion 1f formed by etching.

FIG. 8A shows the end 1g of the tab 1c.
The heat radiation fins 1m are formed by etching on the back surface 1d while forming the bent portions 1f on the rear surface. However, the heat radiation fins 1m can be formed by coining as shown in FIG. 8B. .

It should be noted that the tab 1c shown in FIGS. 6 to 8 can provide substantially the same operation and effect as the tab 1c of the above-described embodiment, and can be applied to the back surface 1d as in the case of the tab 1c shown in FIGS. By setting the bending angle to an angle other than 90 °, it is possible to prevent the tab 1c from falling off the sealing portion 3.

Further, the radiation effect of the semiconductor chip 2 can be further improved by forming the radiation fin 1m on the back surface 1d like the tab 1c shown in FIG.

In the above-described embodiment, the case where the step provided on the tab 1c is the bent portion 1f has been described. However, as shown in the modified examples of FIGS. It may be at least one of 1n and the recess 1p.

FIGS. 9 (a) and 9 (b) show a plurality of rib-shaped convex portions 1n (recesses 1p) formed on the surface of the tab 1c on the chip supporting side by processing such as coining. This is to increase the contact area with the stop portion 3 (mold resin).

FIGS. 10 and 11 show a modification of the tab 1c for forming the recess 1p by etching.

FIGS. 10A and 10B show a modification in which a recess 1p is formed on the outer periphery of the surface of the tab 1c on the chip supporting side.
On the other hand, FIGS. 11A and 11B are modified examples in which a concave portion 1p is formed on the outer periphery of the back surface 1d of the tab 1c.

Note that the tab 1 of the modified example shown in FIGS.
By providing a step portion such as the convex portion 1n or the concave portion 1p depending on c, the degree of adhesion (bonding strength) between the tab 1c and the sealing portion 3 (mold resin) can be improved.

The method of manufacturing the semiconductor device using the tab 1c shown in FIGS. 6 to 11 is the same as the method of manufacturing the TSOP 5 of the above embodiment.

That is, the bent portion 1 is previously attached to the tab 1c.
f, the lead frame 1 provided with the stepped portion such as the convex portion 1n or the concave portion 1p is prepared.
And manufactured by the same manufacturing method as TSOP5.

Since the TSOP 5 of the above embodiment has a tab exposed structure, a heat radiating member such as a heat sink 9 is attached to the exposed surface 1h of the tab 1c as in the TSOP 5 of another embodiment shown in FIG. As a result, TSO
The heat radiation of P5 can be further improved.

Further, even when the heat sink 9 or the like is attached to the exposed surface 1h of the tab 1c, the heat sink 9 may be soldered to the terminal 8a of the mounting board 8 shown in FIG. Further, it is not necessary to make a solder connection.

In the above embodiment, the case where the semiconductor device having the tab exposed structure is TSOP5 has been described. However, the semiconductor device is not limited to TSOP5 as long as it is a resin-sealed type and has a tab exposed structure. For example, it may be a small package QFN10 as shown in FIG.

At this time, in the TSOP5 (semiconductor device) of the above embodiment, the case where the number of pins is relatively small (TSOP5 is 10 pins) has been described, but the number of pins of the semiconductor device is not limited to 10 pins. Any number of pins other than 10 pins or multiple pins may be used.

In the above-described embodiment, the case where the TSOP 5 is incorporated in a small / portable electronic device or a communication device has been described. However, a small TV (television)
Or may be incorporated in a personal computer or a workstation.

In the above-described embodiment, when preparing the lead frame 1, the lead frame 1 in which the tab 1c is formed with a stepped portion such as the bent portion 1f, the convex portion 1n, or the concave portion 1p in advance is prepared. However, the lead frame 1 in which the step is not formed is prepared,
After the lead frame 1 is carried in, the step of manufacturing the semiconductor device may include a step of forming the step portion on the tab 1c of the lead frame 1.

[0097]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). By providing a step portion such as a bent portion on the tab, and making this step portion bite into the sealing portion,
The adhesion (joining strength) between the tab and the sealing portion can be improved. As a result, the moisture resistance of the semiconductor device can be improved,
The reliability of the semiconductor device having the tab exposed structure can be improved.

(2). By providing the bent portion on the tab, the rigidity of the tab can be increased. This allows
A semiconductor device having a thin and small tab exposed structure that reduces the deformation of the tab can be realized.

(3). By attaching the heat dissipation member to the exposed surface of the tab, the heat dissipation of the semiconductor device having the tab exposed structure can be further improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of an embodiment of a structure of a semiconductor device according to the present invention.

FIG. 2 is a partial plan view of a lead frame used for manufacturing the semiconductor device shown in FIG.

3A and 3B are a manufacturing process diagram showing an example of an embodiment of the method for manufacturing the semiconductor device shown in FIG. 1, and a cross-sectional view showing each step.

FIG. 4 is a cross-sectional view showing an example of a method of bending a tab in the method of manufacturing the semiconductor device shown in FIG.

5 is a partial cross-sectional view showing an example of a structure of the semiconductor device shown in FIG. 1 in a state of being mounted on a mounting substrate.

6A and 6B are diagrams showing a structure of a modified example of a tub used in the semiconductor device of the present invention, wherein FIG. 6A is a plan view, and FIG. 6B is an AA of FIG. It is sectional drawing which follows a line.

FIGS. 7A and 7B are diagrams showing a structure of a modified example of a tub used in the semiconductor device of the present invention, wherein FIG. 7A is a plan view and FIG. 7B is a BB line of FIG. It is sectional drawing which follows a line.

8A and 8B are diagrams showing a structure of a modified example of the tab used in the semiconductor device of the present invention, wherein FIG. 8A is a cross-sectional view, and FIG. It is sectional drawing which shows a method.

FIGS. 9A and 9B are diagrams showing a structure of a modified example of the tab used in the semiconductor device of the present invention, wherein FIG. 9A is a sectional view and FIG. 9B is a plan view.

FIGS. 10A and 10B are diagrams showing the structure of a modified example of the tab used in the semiconductor device of the present invention, wherein FIG. 10A is a plan view and FIG. 10B is a CC of FIG. It is sectional drawing which follows a line.

FIGS. 11A and 11B are diagrams showing a structure of a modified example of the tab used in the semiconductor device of the present invention, wherein FIG. 11A is a plan view, and FIG. 11B is a DD diagram of FIG. It is sectional drawing which follows a line.

FIG. 12 is a sectional view showing the structure of a semiconductor device according to another embodiment of the present invention;

FIG. 13 is a sectional view showing the structure of a semiconductor device according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame 1a Inner lead (lead) 1b Outer lead (lead) 1c Tab 1d Back side 1e Tab suspension lead 1f Bend part (step part) 1g End part 1h Exposed surface 1i Frame part 1j Slot for guide 1k Positioning hole 11l Dam bar 1m Heat radiation Fin 1n Convex portion (step portion) 1p Concave portion (step portion) 2 Semiconductor chip 2a Pad (surface electrode) 2b Main surface 2c Back surface 3 Sealing portion 3a Back surface (semiconductor device mounting side) 4 Bonding wire (connection member) 5 TSOP (semiconductor device) 6 bending die 7 press 8 mounting substrate 8a terminal 9 heat sink (heat dissipation member) 10 QFN (semiconductor device)

Continued on the front page F term (reference) 4M109 AA01 BA01 CA21 DB03 DB16 FA04 GA05 5F061 AA01 BA01 CA21 DD12 FA05 5F067 AA04 AB03 BE02 CA04 DE01

Claims (8)

[Claims] 1. A resin-sealed semiconductor device, comprising: a sealing portion formed by resin-sealing a semiconductor chip; and a surface of the sealing portion supporting the semiconductor chip on a semiconductor device mounting side. A tab provided with an exposed surface that is exposed to the sealing portion and provided with a stepped portion in a contact portion with the sealing portion; a plurality of leads arranged around the tab; and a surface electrode of the semiconductor chip and corresponding thereto. A semiconductor device having a connection member for connecting the lead. 2. A resin-sealed semiconductor device, comprising: a sealing portion formed by resin-sealing a semiconductor chip; and a surface of the sealing portion supporting the semiconductor chip on a semiconductor device mounting side. A tab provided with an exposed surface that is exposed at the end, and a bent portion bent toward the sealing portion side provided at an end; a plurality of leads arranged around the tab; a surface electrode of the semiconductor chip; A connection member for connecting to the corresponding lead. 3. The semiconductor device according to claim 2, wherein the bent portion of the tab is bent toward the sealing portion at an angle other than 90 ° with respect to the exposed surface of the tab. A semiconductor device characterized by the above-mentioned. 4. A resin-sealed semiconductor device, comprising: a sealing portion formed by resin-sealing a semiconductor chip; and a surface of the sealing portion supporting the semiconductor chip on a semiconductor device mounting side. A tab provided with an exposed surface that is exposed to at least one of a convex portion and a concave portion at a contact portion with the sealing portion; a plurality of leads arranged around the tab; A semiconductor device comprising a surface electrode and a connection member for connecting the lead to the surface electrode. 5. The semiconductor device according to claim 1, wherein a heat radiation member is provided on the exposed surface of the tub. 6. A method for manufacturing a resin-encapsulated semiconductor device, comprising: an exposed surface that is exposed on a semiconductor device mounting side surface of a sealing portion formed by resin-sealing a semiconductor chip; A step of preparing a lead frame having a tab provided with a step portion at a contact portion with a stop, a step of joining the tab of the lead frame and the semiconductor chip, and a surface electrode of the semiconductor chip and Connecting a corresponding lead of the lead frame with a connecting member, and sealing the semiconductor chip with a resin so that the step portion of the tab bites into the sealing portion, and the exposed surface of the tab is A semiconductor device comprising: a step of forming the sealing portion by exposing the sealing portion to a surface on a semiconductor device mounting side; and a step of separating the plurality of leads from a frame portion of the lead frame. The method of production. 7. A method for manufacturing a resin-encapsulated semiconductor device, comprising: an exposed surface that is exposed on a semiconductor device mounting side surface of a sealing portion formed by resin-sealing a semiconductor chip; A step of preparing a lead frame having a tab provided with a bent portion bent to a stop portion side at an end; a step of joining the tab of the lead frame to the semiconductor chip; and a surface electrode of the semiconductor chip. A step of connecting a lead of the lead frame to a corresponding one of the leads by a connecting member; sealing the semiconductor chip with a resin so that the bent portion of the tab bites into the sealing portion; and the exposed surface of the tab. Exposing the lead to the semiconductor device mounting side surface to form the sealing portion; and separating the plurality of leads from a frame portion of the lead frame. The method of manufacturing a semiconductor device to be. 8. A method for manufacturing a resin-encapsulated semiconductor device, comprising: an exposed surface that is exposed on a semiconductor device mounting side surface of a sealing portion formed by resin-sealing a semiconductor chip; A step of preparing a lead frame having a tab provided with at least one of a convex portion and a concave portion in a contact portion with a stop portion; a step of joining the tab of the lead frame to the semiconductor chip; A step of connecting a surface electrode of the chip and a lead of the lead frame corresponding to the surface electrode by a connecting member; and sealing the semiconductor chip with a resin to seal at least one of the protrusion or the recess of the tab. Forming the sealing portion by exposing the exposed surface of the tab to the surface on the semiconductor device mounting side, and forming the plurality of leads into the lead frame. The method of manufacturing a semiconductor device characterized by a step of separating from the frame portion of the arm.