JP2010002427A - Inertial sensor, inertial sensor device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inertial sensor for setting a detection axis at a predetermined angle without deteriorating the detection performance of a detection element. <P>SOLUTION: Two or more leads providing electrical connections with a mounting substrate, a gyrosensor 10 of which installation angle is determined from the shape of a lead terminal 20 composed of the two or more leads and which includes a sensor responding to movements on the detection axis 70, and a mold which fixes the gyrosensor 10 and sets the angle between a line perpendicular to the underside 61 of a mold package and the detection axis 70 at a predetermined value, are included. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an inertial sensor such as an acceleration sensor and a gyro sensor, and a manufacturing method thereof, and is particularly suitable for an in-vehicle navigation device.

Car navigation devices are widely used. In such a car navigation device, when detecting the current position of a vehicle such as an automobile, a method of positioning using a so-called GPS (Global Positioning System), and the vehicle moving direction and moving distance are independently determined. The method to do is used together. For this reason, in a car navigation apparatus, an inertial sensor such as a gyro sensor (angular velocity sensor) or an acceleration sensor for detecting acceleration or angular velocity applied to the vehicle in order to independently determine the moving direction and moving distance of the vehicle is mounted. Has been.
When detecting an angular velocity, acceleration, or the like with such an inertial sensor, the detection axis needs to be directed in the direction to be detected. For example, in the case of a gyro sensor, the detection axis needs to be installed vertically upward. It was.

By the way, in recent years, the size of car navigation devices has been reduced, and a device main body (hereinafter referred to as “navigation main body”) that has been conventionally arranged under a seat or in a trunk room is interposed between a driver seat and a passenger seat. A type to be installed on the center console located has been developed.
FIGS. 15A and 15B are diagrams showing a navigation main body installed on the center console. FIG. 15A is an overall perspective view, and FIG. 15B is a diagram showing a gyro sensor mounted on the car navigation main body.
As shown in FIG. 15A, when the navigation main body 100 is installed on the center console 102, the display device is viewed from the viewpoint of the visibility of the display device 101 attached to the navigation main body 100 and the operability of an operation panel (not shown). 101 and the panel surface of the operation panel are preferably directed toward the driver's line of sight. That is, it is preferable that the navigation main body 100 is installed in the center console 102 while being inclined obliquely upward from the horizontal direction. However, when the navigation body 100 is tilted upward and installed on the center console 102, the detection axis of the gyro sensor 104 mounted on the printed circuit board 103 in the navigation body 100 as shown in FIG. Since G is inclined by the attachment angle (inclination angle) θ of the navigation main body 100 from the vertical direction V, which is the direction to be originally directed, an error occurs in the angular velocity detected by the gyro sensor 104.

In a normal car navigation apparatus, in order to correct a detection error of the gyro sensor 104 and the like generated by the mounting angle of the navigation main body 100, the detection result is corrected by software calculation processing. There is a limit to the processing. For example, when the inclination angle θ of the navigation main body 100 is 30 ° or more, the current state is that correction cannot be performed by software calculation processing.
For this reason, in car navigation devices, an inertial sensor that can detect accurately even when mounted obliquely, various types of such sensors have been proposed.

For example, Patent Document 1 discloses an angular velocity sensor in which the detection axis is inclined without changing the sensor shape or the sensor mounting method by inclining an angular velocity detection element inside the sensor with a holding member.
Further, in Patent Document 2, in a sensor device including a detection element that detects the direction and size of a physical quantity having a certain directionality, and a mounting portion that fixes and supports the detection element, the detection element is in the direction and size. Inclined by a preset reduction angle in a decreasing direction to reduce the angle difference predicted as the difference between the direction of the detection axis that is the reference for detecting the height and the direction of the physical quantity that is actually applied to the detection element during the detection. Thus, a sensor device is disclosed that is fixed to a mounting portion.
In Patent Document 3, the angle of the vibrator in the package is set by a leg portion for connecting the vibrator to the support substrate and an adhesive for connecting the support board and the package substrate, and the detection axis of the vibrator is set. A support structure for a vibrator is disclosed that is oriented in a desired direction.

International Publication No. 03/100350 Pamphlet JP 2003-227844 A JP 2005-249428 A

However, in the sensors disclosed in Patent Documents 1 and 2, since the crystal resonator as a detection element is directly fixed to the attachment portion, the attachment portion is free from vibration leakage from the crystal resonator, unnecessary vibration modes, and the like. There is a risk that the detection performance may be deteriorated.
Further, in the sensors disclosed in Patent Documents 1 and 2, since it is necessary to attach the detection element at an angle, a dedicated jig is required for each attachment angle, which causes an increase in manufacturing cost. In this way, a special jig is required for the sensors disclosed in Patent Documents 1 and 2, after attaching the detection element to the attachment portion, irradiating the detection element with laser and adjusting the sensor. Therefore, when the mounting angle of the detection element is changed, the focal point of the laser differs depending on the mounting angle, and the jig cannot be shared.
In Patent Document 2, a slit is formed in the detection element itself in order to attach the detection element at an angle. For this reason, the processing cost of the detection element is increased, and this leads to an increase in manufacturing cost.
Furthermore, in Patent Documents 1 and 2, since the detection element is inclined inside the sensor, the angle of the detection axis cannot be changed to an arbitrary angle when the sensor is mounted on the mounting board. There was a problem.

In Patent Document 3, the leg portion (bonding wire) that connects the resonator element (vibrator) to the support substrate is deeply related to vibration leakage from the resonator element and occurrence of unnecessary vibration modes, and the detection performance of the sensor is deteriorated. There is a case. In addition, changing the angle depending on the adhesive causes a large variation in manufacturing, and the accuracy of the set angle is poor.
In addition, the attachment part in Patent Documents 1 and 2 directly fixes the element, and the attachment part may cause vibration leakage from the vibrator or an unnecessary vibration mode, which may deteriorate the physical quantity detection performance. is there.
In view of this, the inventor has focused on a method in which a sensor device having a sensor element fixed by a conventional bonding method is bonded to a lead frame and molded. According to this method, since the sensor element is fixed by a conventional joining method, the occurrence of vibration leakage and unnecessary vibration modes can be suppressed, and the installation angle corresponding to the detection axis to which the sensor responds to operation depends on the shape of the lead frame. In addition to being controllable, mechanical strength can be secured by molding.
However, in this method, the sensor device containing the sensor is tilted with respect to the mounting surface according to the detection axis in which the sensor responds to the operation by controlling the shape of the lead frame. For this reason, when the sensor device is formed using a conventional molding method in which molding is performed along the outer shape of the sensor device, the outer shape of the sensor device is not parallel to the mounting surface. For this reason, there exists a possibility that the workability | operativity in a mounting process may worsen.

The present invention has been made in view of the above points, and an object thereof is to provide an inertial sensor capable of setting a detection axis at a predetermined angle without deteriorating the detection performance of the detection element, and a method for manufacturing the same.
In addition, the present invention can set the detection axis of the sensor with high accuracy even when it is mounted on a mounting surface having a predetermined inclination, and can set the detection axis of the sensor and the bottom and top surfaces of the mold at desired angles. It is an object of the present invention to provide a method for manufacturing an inertial sensor device having a good quality.

In order to achieve the above object, an inertial sensor of the present invention includes a detection element that detects the magnitude of a physical quantity in the detection axis direction, a plurality of flexible support members that support substantially the center of the detection element, and a detection element A plurality of support members extending in the direction of the X axis, the axis perpendicular to the plane of the detection element as the Y axis, and the axis perpendicular to the X axis and the Y axis as the Z axis. Sometimes the load component in the Y-axis direction of the detection element applied to the support member is substantially the same in the plurality of support members, and the load component in the Z-axis direction is substantially the same among the plurality of support members. To do.
If comprised in this way, since an equal effect | action acts on a some support member by acceleration, it can make it difficult to disturb the setting conditions of the mechanical resonance frequency of a support member with respect to the change of the force accompanying acceleration. That is, if the resonance frequency of the support member is disturbed to an unexpected value, and further, for example, the resonance frequency moves to the vicinity of the drive vibration of the inertial sensor in the process of changing the drive frequency of the inertial sensor with a temperature change. Thus, it is possible to prevent a problem that the inertial sensor output frequency jumps due to the drive frequency of the inertial sensor being coupled to the resonance frequency of the support member.

In the inertial sensor of the present invention, the detection element has a detection axis for detecting the angular velocity in the Z-axis direction, and an angle between the Z-axis and the vertical direction is θ, and the load component in the Y-axis direction and the Z-axis direction The load component obtained by combining the load components is a load component based on at least gravitational acceleration.
When the inertial sensor is configured in this way, even when the inertial sensor is tilted, an equal action is exerted on the plurality of support members due to the acceleration. Therefore, the mechanical resonance frequency of the support member is set with respect to a force change caused by the acceleration. Conditions can be made difficult to disturb. That is, if the resonance frequency of the support member is disturbed to an unexpected value, and further, for example, the resonance frequency moves to the vicinity of the drive vibration of the inertial sensor in the process of changing the drive frequency of the inertial sensor with a temperature change. Thus, it is possible to prevent a problem that the inertial sensor output frequency jumps due to the drive frequency of the inertial sensor being coupled to the resonance frequency of the support member.
In addition, the driving frequency of the inertial sensor can be inspected with the inertial sensor tilted, and the inspection process can be simplified.
Further, in this case, since the gravitational acceleration and the Z-axis direction coincide with each other, the Y-axis direction coincides with the traveling direction of the moving body. There is an advantage that it is difficult to disturb.

The inertial sensor of the present invention is characterized in that the angle formed by the Z axis and the vertical direction is θ by inclining the short direction of the inertial sensor.
If comprised in this way, when the said inertial sensor is integrated and the inertial sensor apparatus of an inclination structure is comprised, the shortening of an apparatus is realizable.

The present invention is characterized by an inertial sensor device including the inertial sensor of the present invention, a plurality of lead terminals electrically connected to the inertial sensor, and a mold package for housing the inertial sensor.
If the inertial sensor device is configured in this manner, the plurality of support members have the same effect due to the acceleration, so that it is difficult to disturb the setting condition of the mechanical resonance frequency of the support member with respect to a change in force accompanying the acceleration. it can. That is, if the resonance frequency of the support member is disturbed to an unexpected value, and further, for example, the resonance frequency moves to the vicinity of the drive vibration of the inertial sensor in the process of changing the drive frequency of the inertial sensor with a temperature change. Thus, it is possible to prevent a problem that the inertial sensor output frequency jumps due to the drive frequency of the inertial sensor being coupled to the resonance frequency of the support member.
In the inertial sensor of the present invention, the mold package has a lead terminal extending from a part of the mold package toward the bottom surface of the mold package, and a lead longer than the lead terminal from a part of the mold package facing the part. The terminal is configured to extend toward the bottom surface of the mold package, and the long lead terminal is configured to have a plurality of refracting portions toward the mold package.
With this configuration, it is possible to prevent the inertial sensor from being lifted due to solder rise when the inertial sensor is mounted on the mounting board.

In addition, the present invention has a plurality of lead terminals that are electrically connected to the mounting substrate, the installation angle is determined based on the lead frame constituted by the plurality of lead terminals, and the shape of the lead frame, and with respect to the detection axis. A method of manufacturing an inertial sensor device in which a sensor device including a sensor that responds to an operation is molded with a resin by a molding method, and a lower mold and an upper mold each having a recess formed after the sensor device is joined to a lead frame In a molding method in which a sensor device is accommodated in a cavity defined by stacking recess-forming surfaces with a lead frame sandwiched between molds, and the cavity is filled with a resin, the cavity is opposed to the lead frame. Upper and lower surfaces are formed to be inclined with respect to both main surfaces of the lead frame, and upper and lower surfaces Characterized by using a mold die consisting of lower die and upper die which recesses are formed in parallel.
According to this configuration, the sensor device whose installation angle with respect to the mounting surface of the sensor device corresponding to the detection axis that responds to the operation is adjusted can be molded with an outer shape parallel to the mounting surface. Thereby, an inertial sensor device with good workability when mounting can be manufactured.

According to the present invention, in the method of manufacturing an inertial sensor device, a mold mold in which the upper and lower surfaces facing the lead frame of the cavity are inclined with respect to both main surfaces of the lead frame at the same angle as the installation angle of the sensor device. It is characterized by using.
According to this configuration, the mold can be formed such that the bottom surface of the sensor device and the bottom surface of the inertial sensor device are obliquely arranged at an angle by using the mold mold having the above configuration. The normal line and the detection axis are formed at a predetermined angle.
Therefore, by setting the angle formed by the normal line of the bottom surface of the inertial sensor device and the detection axis to the same angle as the angle formed by the substrate surface of the inclined mounting substrate on which the inertial sensor device is mounted and the vertical direction, the inclination is set. Even if the inertial sensor device of the present invention is attached to the surface, it is possible to manufacture an inertial sensor device that can accurately set the detection axis of the sensor.

It is the figure which showed the structure of the gyro sensor apparatus of this embodiment, (a) is the top view. It is the figure which showed the example of mounting of the gyro sensor apparatus of this embodiment. It is explanatory drawing of the lead terminal unit used in the gyro sensor apparatus of this embodiment. It is a flowchart figure explaining the manufacturing process of a gyro sensor apparatus. It is the figure which showed the structure of the gyro sensor apparatus which concerns on 2nd Embodiment. It is a figure which shows the jig | tool for wire bonding which concerns on 2nd Embodiment. It is the figure which showed the structure of the gyro sensor apparatus which concerns on 3rd Embodiment. 2 is a cross-sectional view showing an internal configuration of the gyro sensor 10. FIG. 2 is a diagram illustrating a configuration of a support substrate provided in the gyro sensor 10. FIG. FIG. 2A is a plan view schematically showing a crystal resonator element 11, and FIG. 2B is a plan view showing vibration in a detection vibration mode of the crystal resonator element 11. It is operation | movement explanatory drawing of a gyro sensor. It is operation | movement explanatory drawing of the gyro sensor of this embodiment. (A) The top view which shows the wire 13 and the inclination direction of the state which does not apply this invention, (b) is inclination mounting of the gyro sensor apparatus which mounted the crystal vibration element 11 in the wire 13 shown to Fig.10 (a). FIG. 11C is a diagram showing the relationship between the resonance frequency of the wire 13 and the resonance frequency of the crystal resonator element 11 in the gyro sensor device shown in FIG. (A) The top view which shows the wire 13 and inclination direction of the state to which this invention is applied, (b) is the state of inclination mounting of the gyro sensor apparatus which mounted the crystal vibration element 11 in the wire 13 shown to Fig.10 (a). FIG. 11C is a diagram showing the relationship between the resonance frequency of the wire 13 and the resonance frequency of the crystal resonator element 11 of the gyro sensor device shown in FIG. It is the figure which showed the navigation main body installed in the center console, (a) is the whole perspective view, (b) is the figure which showed the gyro sensor mounted in the car navigation main body.

Hereinafter, embodiments of the present invention will be described.
In this embodiment, a gyro sensor will be described as an example of the inertial sensor of the present invention.
1A and 1B are diagrams showing the configuration of the gyro sensor device of the present embodiment, in which FIG. 1A is a top view and FIG. 1B is a side view.
The gyro sensor device 1 shown in FIG. 1 has an angular velocity detection axis G (detection axis G) of the gyro sensor 10 tilted by an angle θ with respect to a vertical line V on the upper surface of the gyro sensor device 1, for example. It is sealed by a resin portion 2 made of a molding material such as resin. A plurality of lead terminals 3 are drawn out from both sides of the resin part 2 in the longitudinal direction.
The upper surface of the gyro sensor device 1 and the surface on the mounting side of the gyro sensor device 1 are parallel. The lead terminal 3 is electrically connected to the gyro sensor 10 in the resin portion 2. In this case, the lead terminal 3 exposed from a position close to the bottom surface side of the resin portion 2 is bent inward at the refracting portions 4 a and 4 b in order to form the electrode terminal 8 on the bottom surface of the resin portion 2. I have to. On the other hand, the lead terminal 3 exposed from a position away from the bottom surface side of the resin portion 2 is also bent to form the electrode terminal 8 on the bottom surface of the resin portion 2. Since the lead portion of the lead terminal 3 exposed from the length becomes longer, the lead portions 3 are bent inward by the refracting portions 4c, 4d, and 4e.

FIG. 2 is a diagram showing an implementation example of the gyro sensor device of the present embodiment described above. As shown in FIG. 2A, if the lead terminal 3 of the gyro sensor device 1 of the present embodiment is connected to the pattern electrode 52 on the mounting substrate 51 by the solder 53, the detection axis G is mounted on the mounting surface of the mounting substrate 51. It can be mounted in a state inclined by an angle θ with respect to the vertical line (vertical direction V).
In the gyro sensor device 1 of the present embodiment, the refracting portions 4c, 4d, and 4e are provided on the lead terminal 3 exposed from a position away from the bottom surface for the following reason.
For example, as shown in FIG. 2B, when the refracting portion 4 e is not provided between the refracting portions 4 c and 4 d of the lead terminal 3 having a long lead portion, a larger amount of solder 53 than the lead terminal 3 having a short lead portion is provided. Adheres. For this reason, the balance difference in the surface tension of the solder 53 increases between the left and right, and there is a possibility that the lead terminal 3 having a short lead portion may float from the mounting surface 51. In other words, since the gyro sensor device 1 is attached with an inclination, there is a possibility that the inclination angle is distorted.
Therefore, in the gyro sensor device 1 of the present embodiment, the refracting portions 4c, 4d, and 4e are formed at three locations of the lead terminal 3 in order to limit the amount of solder rise of the lead terminal 3 having a long lead portion. With this configuration, it is possible to limit the amount of solder rise of the lead terminal 3 having a long lead portion, so that it is possible to prevent the inclination angle of the gyro sensor device 1 attached to the mounting substrate 51 from being out of order.
In particular, it is more preferable to configure the lead terminals 3 having a long lead portion so that the height positions of the refracting portions 4a of the lead terminals 3 are equal because the amount of solder rise of the left and right lead terminals 3 can be made equal.
Furthermore, even if the solder rises above the refracting portion 4d of the long lead terminal 3, the surface of the lead terminal 3 and the pattern electrode 52 in this portion do not face each other. In this case, the gyro sensor No surface tension that tilts the device 1 occurs.
Since the upper surface of the gyro sensor device 1 and the surface on the mounting side of the gyro sensor device 1 are parallel to each other, the upper surface of the gyro sensor device 1 is attracted to the mounting substrate 51 using the component mounting device. The gyro sensor device 1 can be moved and mounted in the vertical direction.
According to this, the gyro sensor device 1 is applied to the mounting substrate 51 in a state where an equal force is applied to the plurality of lead terminals 3 when mounted on the mounting substrate 51 or an equal force is applied to the bottom surface of the resin portion 2. Pressed down. Therefore, the parallelism between the mounting surface of the mounting substrate 51 and the upper surface of the gyro sensor device 1 is kept high. That is, the gyro sensor device 1 attached to the mounting substrate 51 is mounted on the mounting substrate 51 without causing an error in the angle θ between the detection axis G and the perpendicular to the mounting surface of the mounting substrate 51.
Further, the gyro sensor 10 of the present embodiment is configured such that the angle between the Z axis and the vertical direction becomes θ by inclining the short direction of the gyro sensor 10. If comprised in this way, when the gyro sensor 10 is integrated and the gyro sensor apparatus 1 is comprised, the shortening of an apparatus can be implement | achieved.

Next, a method for joining the lead terminal and the gyro sensor in the gyro sensor device of the present embodiment will be described.
3A is a view showing the structure of a lead terminal unit used in the gyro sensor device 1 of the present embodiment, FIG. 3B is a top view showing a state in which the gyro sensor is joined to the lead terminal unit, FIG. 3C is a rear view showing a state in which the gyro sensor is joined to the lead terminal unit, and FIG. 3D is a diagram showing a problem when the gyro sensor is joined to the lead terminal.
As shown in FIG. 3A, the lead terminal unit 61 used in the gyro sensor device 1 of this embodiment includes a die pad 5 together with a plurality of lead terminals 3. In the present embodiment, when connecting the gyro sensor 10 and the lead terminal 3, the suspension leads 62 are used between the lead terminals 3 and between the edge portions 63 in order to prevent the lead terminals from being bent. I try to connect.
The die pad 5 on the upper surface of the lead terminal unit 61 and the gyro sensor 10 are mechanically connected via an adhesive, for example. In addition, you may electrically connect using a conductive adhesive as an adhesive agent. Each lead terminal 3 of the lead terminal unit 61 is electrically connected to the electrode terminal 8 on the bottom surface of the gyro sensor 10 by a bonding wire or a conductive adhesive.

Here, for example, when there is no suspension lead 62 of the lead terminal 3, as shown in FIG. 3D, when the gyro sensor 10 is mounted on the lead terminal unit 61, the lead terminal 3 is bent and the die pad 5 is used as an axis. May rotate. As a result, the gyro sensor 10 cannot be mounted on the lead terminal 3 with high accuracy, and the tilt angle of the gyro sensor 10 may be distorted. On the other hand, in the gyro sensor device 1 of the present embodiment, the lead terminal 3 is fixed by the suspension lead 62, so that the bending of the lead terminal 3 is suppressed and the rotation of the gyro sensor 10 can be suppressed.
Thereby, the precision of the inclination angle of the gyro sensor device 1 of this embodiment can be improved. The lead terminal unit 61 shown in FIG. 3 (a) has three suspension leads 62 with the distal end side of the lead terminal 3 fixed, but the suspension leads 62 for fixing the distal end side of the lead terminal 3 are It is sufficient to provide at least two diagonal positions with the die pad 5 as a boundary. Then, the diagonal rotation of the gyro sensor 10 can also be suppressed. The suspension leads 62 are cut after the resin portion 2 is formed.

Next, a method for manufacturing the gyro sensor device according to the first embodiment will be described.
FIG. 4 is a flowchart for explaining the manufacturing process of the gyro sensor device.
First, in step S <b> 1, an adhesive (non-conductive adhesive, epoxy adhesive) is applied to the die pad 5 or the gyro sensor 10 constituting the lead terminal 3, and then the gyro sensor 10 is mounted on the die pad 5 and bonded thereto.
Next, in step S2, a wire is formed between the lead terminal 3 and the electrode terminal 8 on the bottom surface of the gyro sensor 10 by wire bonding to perform bonding wiring.
Next, in step S3, mold formation for molding the gyro sensor 10 with resin is performed. Mold formation is a so-called transfer molding method in which the lead terminal 3 is sandwiched between the upper mold and the lower mold in which the cavity is formed so that the gyro sensor 10 is accommodated in the cavity, and the cavity is filled with resin. To do. At this time, the lead out of the mold is in an extended state. The lead terminal 3 is formed with a plurality of patterns so that a plurality of gyro sensors 10 can be mounted.
In this process, first, the upper die and the lower die are heated and held at a predetermined temperature that matches the characteristics of the resin, and then the lower die is positioned by using the positioning pin of the lower die as a position reference. The lead terminal 3 to which the gyro sensor 10 is bonded is positioned and mounted thereon. Next, the resin tablet is placed in the plunger pot of the lower mold, the upper mold is stacked so that the lead terminal 3 is sandwiched between the lower mold, and the mold is uniformly clamped by applying a predetermined pressure. At this time, the gyro sensor 10 is accommodated in each cavity of the upper mold and the lower mold.
Next, the resin tablet in the plunger pot is preheated to a predetermined temperature to melt the resin, and the plunger is operated at a predetermined phase / speed / temperature to move the molten resin from the gates of the upper mold and the lower mold into the cavity. Inject. After the cavity is filled with the resin, the resin is molded by holding for a certain period of time. After the resin molding, the mold clamping is released and the upper mold is removed, and then the residual resin generated by the resin protruding around the cavity is removed, and the lead terminal 3 molded from the lower mold is taken out. And drying for a predetermined time in an oven at a predetermined temperature.

Next, in step S4, the ends of the lead terminals of the lead terminals 3 and the suspension leads between the leads are cut into individual pieces by pressing or the like. Next, in step S5, terminal plating for plating a bonding metal such as Sn (tin) or solder is performed on the lead terminal exposed from the mold. Then, the portion between the refracting portions 4a and 4c is fixed to the resin portion 2, and the refracting portions 4a and 4c are bent into a predetermined shape. Next, the refraction parts 4b and 4d and the resin part 2 are fixed, and the refraction parts 4b and 4d are bent to obtain the gyro sensor device 1 (step S6).
The terminal plating may be performed before cutting the lead, or may be performed after bending the lead after cutting the lead.
Finally, necessary inspections such as characteristic inspection and appearance inspection are performed (step S7), and the manufacturing process of the gyro sensor device 1 of the present embodiment is completed.
If comprised in this way, the manufacturing method which manufactures the gyro sensor apparatus 1 of this embodiment which set the detection axis | shaft of the gyro sensor 10 and the upper surface of the resin part 2 to the desired angle with high productivity can be provided. .

Next, in the manufacturing method of the gyro sensor device 1 described above, a mold die used for mold formation will be described with reference to the drawings.
FIG. 13 is a plan view for explaining a lower mold 110A of the upper mold and the lower mold constituting the mold mold, and FIG. 14 is a lower view for explaining the entire structure of the mold mold 110. FIG. 14 is a cross-sectional view taken along the line aa in FIG. 13 in a state where the upper mold 110B is attached with the lead frame 3 sandwiched between the mold 110A.
The mold 110 is composed of an upper mold 110B and a lower mold 110A. Here, in order to easily explain the configuration of the resin injection path and the like of the mold 110, the configuration of the lower mold 110A will be described with reference to FIG.
In the lower mold 110A, a plurality of recesses (cavities) are formed in the lower mold body 120 made of metal or the like, and the plurality of recesses are respectively connected in series by connecting passages (gates or the like) that are also recesses. It has a configuration.

The lower mold 110 </ b> A is provided with a plunger pot 115 in which a plunger (not shown) is installed in a cylindrical recess formed in the lower mold main body 120. A part of the side wall of the plunger pot 115 is open, and a grooved runner 116A extending from there as a communication passage is connected to the first cavity 111A, which is a rectangular cubic recess. A second cavity 112 is disposed on the opposite side of the connection portion of the first cavity 111A with the plunger pot 115, and the two cavities are connected by a groove-like gate 113A. Further, a gate 114 extends on the opposite side of the connection portion of the second cavity 112 with the first cavity 111A, and this gate 114 is connected in communication with the next cavity in the same manner, but is not shown. is doing. As described above, the plunger pot 115 and each of the cavities 111A and 112 and the required number of next cavities are connected in series through the runner 116A, the gates 113A and 114, and the required number of next gates, respectively. Yes.
In addition, the rectangular area shown with a dashed-two dotted line in the figure has shown the lead frame mounting position 3a at the time of resin sealing.
On the other hand, the upper mold 110B includes a plunger pot having an opening having the same shape at the same position on the surface overlapped with the lower mold 110A, a plurality of cavities, and a runner and a plurality of gates communicating these. Is formed. The upper mold 110B and the lower mold 110A are overlapped and fixed, whereby a plunger pot 115 and a plurality of cavities, which are container-like spaces, are connected to each other in series to form a resin communication path. And a plurality of gates are formed respectively.

Next, referring to FIG. 13, the mold 110 formed by the upper mold 110B and the lower mold 110A in a state where the lead frame 3 on which the gyro sensor 10 is mounted as a sensor device is molded, particularly the cavity mold. The cross-sectional shape will be mainly described.
As shown in FIG. 6, the concave bottom portion 161A of the cavity 111A, which is a concave portion formed in the lower mold body 120 of the lower mold 110A, is the same as the lead frame 3 when the lead frame 3 is mounted on the lower mold 110A. The parallel line 170 is inclined by an angle θ. The bottom surface of the gyro sensor device 1 is formed by the concave bottom portion 161A. Therefore, the gyro sensor device 1 in which the relationship between the normal line of the gyro sensor device 1 obtained by molding with the lower mold 110A and the detection axis G of the gyro sensor 10 is set to a desired angle θ is formed. It is like that.
Similarly, the concave bottom portion 161B of the cavity 111B, which is a concave portion formed in the upper mold main body 130 of the upper mold 110B shown in FIG. 14, is overlapped and fixed on the lower mold 110A on which the lead frame 3 is mounted. It is formed so as to be inclined by an angle θ with respect to the parallel line 270 with the lead frame 3 at that time. The upper surface of the gyro sensor device 1 is formed by the concave bottom portion 161B. Therefore, the gyro sensor device 1 in which the relationship between the normal line on the upper surface of the gyro sensor device 1 obtained by molding with the lower mold 110A and the detection axis G of the gyro sensor 10 is set to a desired angle θ is formed. It has come to be.

When the lead frame 3 on which the gyro sensor 10 is mounted is sandwiched and fixed (clamped) between the lower mold 110A and the upper mold 110B, the cavity 111A of the lower mold 110A and the cavity 111B of the upper mold 110B A cavity for molding the sensor device 10 is formed.
Further, the runner 116A of the lower mold 110A and the runner 116B of the upper mold 110B constitute one runner that serves as a resin injection path when the molten resin is filled into the one cavity from a plunger pot (not shown). .
Further, one gate formed by the gate 113A of the lower mold 110A and the gate 113B of the upper mold 110B serves as a resin injection path from the one cavity to the next cavity.

In the present embodiment, the runner 116B and the gate 113B of the upper mold 110B are formed larger in the thickness direction than the runner 116A and the gate 113A of the lower mold 110A. Thereby, when filling each cavity with molten resin, the flow of resin becomes stronger on the upper mold 110B side. This is to prevent the resin from strongly hitting the bonding portion of the gyro sensor 10 by the bonding wire and the gold ball when the molten resin is injected. However, the present invention is not limited to this, and the runner and the gate may be provided only on the upper mold 110B side, avoiding the bonding portion of the gyro sensor 10.
The side walls of the cavities 111 </ b> A and 111 </ b> B are formed so as to be inclined with respect to the contact surface with the lead frame 3 at an angle that is perpendicular or acute.

  Thus, in the manufacturing method of the gyro sensor device 1 of the present embodiment, the lower mold body 120 of the lower mold 110A is parallel to the lead frame 3 when the lead frame 3 is mounted on the lower mold 110A. A cavity 111A, which is a concave portion having a concave bottom portion 161A formed to be inclined by an angle θ with respect to the line 170, was formed. Further, the upper mold body 130 of the upper mold 110B is inclined by an angle θ with respect to the parallel line 270 with the lead frame 3 when it is fixed on the lower mold 110A on which the lead frame 3 is mounted. A cavity 111B, which is a formed recess, was formed. Then, the lead frame 3 is fixed so as to accommodate the gyro sensor 10 in the cavities 111A and 111B of the lower mold 110A and the upper mold 110B, and the molten mold resin is filled into the cavities 111A and 111B. In this way, the gyro sensor device 1 is formed.

According to this configuration, it is possible to manufacture a mold package 91 having a bottom surface formed by the concave bottom portion 161A of the lower mold 110A and a top surface formed by the concave bottom portion 161B of the upper mold 110B. Accordingly, a sensor that responds to an operation with respect to a predetermined detection axis G, a gyro sensor 10 that accommodates the sensor, a lead that conducts the terminal of the gyro sensor 10 and the mounting substrate, and a mold that fixes the gyro sensor 10. And a gyro sensor device that sets a detection axis G of the sensor and a bottom surface of the gyro sensor device at a desired angle can be provided.
Further, it is possible to manufacture the gyro sensor device in which the detection axis G of the gyro sensor and the bottom surface and top surface of the gyro sensor device are set at desired angles so that the bottom surface and top surface of the gyro sensor device are parallel to each other. Thus, when the gyro sensor device is mounted on a mounting board or the like, it can be picked up by a mounter in the same manner as a normal chip type electronic component. Moreover, it is not necessary to make a tray or a hoop-shaped packing material (taping) for packing the gyro sensor device into a special shape, and a conventional component tray or a hoop-shaped packing material can be used. Therefore, a gyro sensor device that can be mounted with high productivity can be manufactured.

In this embodiment, the runner 116B and the gate 113B of the upper mold 110B are formed larger in the thickness direction than the runner 116A and the gate 113A of the lower mold 110A.
According to this configuration, since the resin flow is stronger on the upper mold 110B side when filling each cavity with molten resin, the bonding wire of the gyro sensor 10 disposed on the lower mold 110A side and It is possible to reduce the stress caused by the resin on the bonding part by the gold ball. Thereby, cutting | disconnection of a bonding wire and generation | occurrence | production of the open defect of a bonding part can be suppressed.

  Furthermore, in the present embodiment, the side walls of the cavities 111A and 111B of the lower mold 110A and the upper mold 110B are formed so as to be inclined with respect to the contact surface with the lead frame 3 at an angle that is perpendicular or acute. The configuration. Thereby, the detachability when removing the lower mold 110A and the upper mold 110B after mold formation is improved, and workability can be improved.

FIG. 5 is a diagram illustrating a configuration of the gyro sensor device according to the second embodiment.
The gyro sensor device 20 shown in FIG. 5 is also sealed by the resin portion 2 in a state where the detection axis G of the gyro sensor 10 is inclined by an angle θ with respect to the vertical direction V of the mounting surface on which the gyro sensor device is mounted. It has been stopped.
In this case as well, a plurality of lead terminals 3 are drawn out from both sides in the longitudinal direction of the resin part 2, but the lead terminals 3 are bent at the refracting part 6 e, the refracting part 6 f and the refracting part 6 g in the resin part 2. As a result, the gyro sensor 10 is inclined with respect to the upper surface of the gyro sensor device 1 by an angle θ. When configured in this way, the length between the refracting part 6a and the refracting part 6b can be substantially equal to the length between the refracting part 6c and the refracting part 6d. Therefore, it is possible to prevent the inclination angle of the gyro sensor device 1 from being out of order when the mounting board 51 is attached.

Next, a method for manufacturing the gyro sensor device according to the second embodiment will be briefly described.
In this case, first, the lead terminal 3 is pressed so that the refracting portions 6e and 6g are convex and the refracting portion 6f is concave. Next, after applying an adhesive 53 (non-conductive adhesive, epoxy adhesive) to the die pad 5 or the gyro sensor 10 of the lead terminal 3, the gyro sensor 10 is placed on the die pad 5 and bonded thereto.
Next, by a wire bonding method, for example, a gold ball 9 b is placed on the lead terminal 3, and a wire 9 a starting from the gold ball 9 b and starting from the electrode terminal 8 on the bottom surface of the gyro sensor 10 is formed. The starting point and the ending point may be switched by placing a gold ball 9b on the electrode terminal 8. In wire bonding, a jig 80 shown in FIG. 6 is used. The jig 80 has a shape capable of fitting the upper surfaces of the plurality of gyro sensors 10 so as to correspond to the lead terminals 3. Here, the bottom surface 81 of the jig and the entire lead terminal 3 form an angle θ. Therefore, when the gyro sensor 10 is fitted, the bottom surface of the gyro sensor 10 and the jig bottom surface 81 are parallel to each other. When wire bonding is performed, the jig bottom surface 81 is placed substantially horizontally downward, so that the bottom surface of the gyro sensor 10 becomes substantially horizontal, and wire bonding is performed accurately.
Next, the gyro sensor 10 is molded with resin. At this time, the lead out of the mold is in an extended state. Next, the suspension leads between the ends 6 h and 6 i of the lead terminal 3 and the lead terminals 3 are cut. Next, the portion closer to the resin portion 2 than the lead refracting portions 6b and 6d is fixed, and the lead refracting portions 6b and 6d are bent. Next, the lead refracting portions 6a and 6c are fixed between the resin portion 2 and the lead refracting portions 6a and 6c are bent.
If comprised in this way, the gyro sensor apparatus 20 which set the detection axis G of the gyro sensor and the upper surface of the resin part 2 to the desired angle (angle (theta) with respect to the vertical direction V of the mounting surface which mounts a gyro sensor apparatus) will be provided. A manufacturing method for manufacturing with high productivity can be provided. The upper surface of the gyro sensor device 20 and the surface on which the gyro sensor device 20 is mounted are parallel to each other.

FIG. 7 is a diagram illustrating the configuration of the gyro sensor device according to the third embodiment.
The gyro sensor device 30 shown in FIG. 7 is also sealed by the resin portion 2 in a state where the gyro sensor 10 is inclined by an angle θ with respect to the vertical direction V of the mounting surface on which the gyro sensor device 30 is mounted. Yes.
Also in this case, a plurality of lead terminals 3 are drawn out from both sides in the longitudinal direction of the resin portion 2, but the lead terminals 3 are connected to the lead terminals 3 on both sides in the longitudinal direction by the refracting portions 7 e to 7 l in the resin portion 2. Is bent in a step shape so that the gyro sensor 10 is inclined with respect to the upper surface of the gyro sensor device 30 by an angle θ. When configured in this way, the length between the refracting portion 7a and the refracting portion 7b can be substantially equal to the length between the refracting portion 7c and the refracting portion 7d. Therefore, it is possible to prevent the inclination angle of the gyro sensor device 1 from being out of order when the mounting board 51 is attached.
Further, by arranging the gyro sensor 10 in parallel on the upper step portion of the lead terminal 3, the gyro sensor 10 can be arranged in parallel to the upper surface of the gyro sensor device 30. That is, by changing the position of the step portion where the gyro sensor 10 is disposed, the detection axis G of the gyro sensor 10 and the detection axis G inclined from the detection axis G by a desired angle θ can be produced.

Next, a gyro sensor manufacturing method according to the third embodiment will be described.
In this case, pressing is performed so that the refracting portions 7e, 7g, 7j, and 7l of the lead terminal 3 are convex and the refracting portions 7f, 7h, 7i, and 7k are concave. Although not shown, a plurality of lead terminals 3 are connected in the vertical and horizontal directions so that the bottoms of the plurality of gyro sensors 10 can be fitted.
Solder cream is applied to the electrode terminal 8 on the bottom surface of the gyro sensor 10 or the lead terminal near the refracting portion 7g and 47i, and the solder cream is heated to a temperature equal to or higher than the melting point and then returned to room temperature. And leads are mechanically and electrically connected.
Next, the gyro sensor 10 is molded with resin. At this time, the lead out of the mold is in an extended state. Next, the tip of the lead terminal 3 and each suspension lead are cut. Thereafter, the resin portion 2 side of the refraction portions 7b and 7d is fixed, and the refraction portions 7b and 7d are bent. Thereafter, the refracting portions 7a and 7c are bent while the refracting portions 7a and 7c and the resin portion 2 are fixed. If comprised in this way, the manufacturing method which manufactures the above gyro sensor apparatuses 30 with high productivity can be provided.

Next, the gyro sensor 10 mounted on the gyro sensor device of this embodiment will be described.
FIG. 8 is a cross-sectional view showing the internal configuration of the gyro sensor 10, and FIG. 9 is a diagram showing the configuration of a support substrate provided in the gyro sensor 10.
As shown in FIG. 8, the gyro sensor 10 includes a crystal vibrating element 11 as a detection element that detects angular velocity. As shown in FIGS. 9A and 9B, the crystal resonator element 11 is mechanically and electrically connected to the support substrate 12 by a wire 13 that is a flexible support member. The support substrate 12 is connected to the inner bottom surface of the ceramic package 17 by an adhesive 14. An opening 12a is formed at the center of the support substrate 12, and the wire 13 is disposed from the back surface side to the top surface side of the support substrate 12 through the opening portion 12a. A lid 16 made of metal is bonded to the upper surface of the ceramic package 17 by a sealing member 19 such as a low melting point metal. Thereby, the inside of the ceramic package 17 is vacuum-sealed. In addition, it is also possible to use a glass lid | cover as the cover body 16, and low melting glass etc. are used as the sealing member 19 in this case. Electrode terminals 8 are formed from the outer bottom surface to the side surface of the ceramic package 17. The electrode terminal 8 is connected to the crystal resonator element 11 via an internal conductor (not shown) formed in the ceramic package 17.
Of the six wires 13 shown in FIG. 8, the wires 13 as the support members that mainly support the crystal resonator element 11 are at least two wires 13 arranged in the center.

FIG. 10A is a plan view schematically showing the crystal resonator element 11 of the present embodiment, and FIG. 10B is a plan view showing vibration in the detection vibration mode of the crystal oscillator element 11.
The crystal resonator element 11 shown in FIG. 10 is provided at the base 31, a pair of detection vibrating pieces 32 a and 32 b protruding from the base 31, a pair of connecting portions 33 protruding from the base 31, and the tips of the connecting portions 33. Drive vibration pieces 34a, 34b, 34c, and 34d. The main surfaces of the drive vibration pieces 34a, 34b, 34c, and 34d are respectively formed with elongated grooves, and the cross-sectional shapes of the drive vibration pieces 34a, 34b, 34c, and 34d are substantially H-shaped. Yes. An excitation electrode (drive electrode, hereinafter the same) 36 is formed in the groove. A wide part or a weight part 38a, 38b, 38c, 38d is provided at each tip of each drive vibration piece 34a, 34b, 34c, 34d. Each main surface of each detection vibrating piece 32a, 32b is formed with an elongated groove, and the cross-sectional shape of each detection vibration piece 32a, 32b is substantially H-shaped. A detection electrode 37 is formed in the groove. A wide part or a weight part 35a, 35b is provided at the tip of each detection vibrating piece 32a, 32b.
FIG. 10A shows vibration in the drive mode. At the time of driving, each of the drive vibrating pieces 34a, 34b, 34c, 34d bends and vibrates as indicated by an arrow A around the root 39 to the connection portion 33. In this state, the crystal resonator element 11 is rotated at an angular velocity ω around a rotation axis G substantially perpendicular to the crystal resonator element 11. Then, as shown in FIG. 10B, Coriolis force F is applied to the weight portions 38a, 38b, 38c, and 38d in a direction that is perpendicular to both the bending vibration direction A and the rotation axis G. As a result, the connecting portion 33 bends and vibrates as indicated by an arrow B around the base 33a to the base portion 31. Each of the detection vibrating pieces 32a and 32b bends and vibrates as indicated by an arrow C around the base 40 of the base portion 31 by the reaction. A piezoelectric phenomenon is generated by the bending vibration of the arrow C, and the potential of the detection electrode 37 changes. By detecting this change in potential by a detection circuit (not shown), an angular velocity ω around the detection axis (rotation axis) G is obtained. Here, when the crystal axis direction of the + X axis / −X axis of the crystal resonator element 11 is set to the direction of the arrow A and the crystal axis direction of the Z axis of the crystal resonator element 11 is aligned with the rotation axis G, the detection efficiency is high. .
In addition, since the direction of the rotation axis G is the thickness direction of the crystal vibration element 11, the detection element composed of the crystal vibration element 11 having such a configuration has a tuning fork vibrator whose rotation axis matches the extension direction of the detection vibration piece. In comparison, the gyro sensor 10 can be configured to have a low profile.

Here, as shown in FIG. 8, the extending direction of the wire 13 that is a support member mounted on the gyro sensor 10 is the X axis, and the axis orthogonal to the X axis in the mounting surface of the crystal resonator element 11 is Y. Assume that the Z axis is an axis orthogonal to the axis, the X axis, and the Y axis, and the tilt direction of the gyro sensor 10 is made to coincide with the X axis direction as shown in FIGS. In this case, a frequency difference is generated between the resonance frequency of the wire 13a and the resonance frequency of the wire 13b shown in FIGS. 11A and 11B, and the operation state of the gyro sensor 10 may be unstable.
That is, as shown in FIG. 11B, when the wire 13a side is raised and the wire 13b side is lowered so that the detection axis G is inclined at an angle θ, the wire 13a has a direction of the X-axis component of gravitational acceleration. The extension direction and the extension direction of the wire 13b are opposite to each other. For this reason, the influence (direction of inertial force) of the acceleration applied to the wires 13a and 13b is different. For example, as shown in FIG. 11C, when the resonance frequency of the crystal resonator element 11 is fref and the resonance frequency of the wires 13a and 13b when the crystal resonator element 11 is horizontal is f0, the X axis of gravity acceleration in the tilted state. Due to the influence of the components, a stretching force is generated in the wire 13a, while a compressive force is generated in the wire 13b, so that the resonance frequency fa of the wire 13a is high and the resonance frequency fb of the wire 13b is low. Therefore, the resonance frequencies of the wires 13a and 13b may be greatly different. When the resonance frequencies of the wires 13a and 13b are greatly different from each other, the resonance frequency of the crystal resonator element 11 is approached, and resonance energy may be coupled, and the mounting state of the crystal resonator element 11 is likely to be unstable.
Therefore, in this embodiment, as shown in FIGS. 12A and 12B, the gyro sensor 10 is mounted on the gyro sensor device 1 so that the inclination direction of the gyro sensor 10 (quartz vibration element 11) is the Y-axis direction. I tried to do it. That is, when the wire 13a and the wire 13b are arranged symmetrically with the inclination direction as the central axis, even when acceleration is applied in the Y-axis direction, the acceleration similarly affects the wires 13a and 13b. Therefore, as shown in FIG. 12C, it is difficult for a frequency difference to occur in the resonance frequencies of the wires 13a and 13b. Therefore, for example, there is an advantage that management such as frequency adjustment is easy. Further, since the extension direction of the wires 13a and 13b does not coincide with the acceleration direction (Y-axis direction), the influence of the acceleration applied to the wire 13 is small. Therefore, as shown in FIG. 12C, there is an advantage that the amount of fluctuation in the resonance frequency of the wires 13a and 13b can be reduced, and resonance energy coupling hardly occurs.
Further, as shown in FIG. 12 (a), the wires 13a and 13b are arranged symmetrically with the inclination direction as the central axis, and the extension direction of the wire 13a and the extension direction of the wire 13b are relative to the inclination direction. In the case of the orthogonal configuration, even when the direction of acceleration in the Y-axis direction is reverse (G) when horizontal, the resonance frequency change characteristics of the wires 13a and 13b are almost the same. For example, the gyro according to this embodiment It is also possible to mount the sensor in a horizontal state.
In the gyro sensor device including the gyro sensor 10 having such a configuration, since the Y-axis direction and the acceleration direction of the vehicle are incorporated in the vehicle so as to coincide with each other, the wire 13a is also applied to the acceleration in the traveling direction of the vehicle. 13b can suppress the adverse effect on the gyro sensor device due to the change characteristics of the resonance frequency of 13b.
The support member 13 may be a lead-shaped member made of crystal integrated with the base 31 of the crystal resonator element 11.

  DESCRIPTION OF SYMBOLS 1, 20, 30 ... Gyro sensor apparatus, 2 ... Resin part, 3 ... Lead frame (lead terminal), 5 ... Die pad, 10 ... Gyro sensor (sensor device), 11 ... Quartz vibration element, 12 ... Support substrate, 13a, 13b ... wire, 14 ... adhesive, 16 ... lid, 17 ... ceramic package.

Claims (7)

A detection element for detecting the magnitude of the physical quantity in the detection axis direction;
A plurality of flexible support members that support substantially the center of the detection element;
A package substrate for housing the detection element,
When the extending direction of the plurality of support members is the X axis, the axis orthogonal to the plane of the detection element is the Y axis, and the axis orthogonal to the X axis and the Y axis is the Z axis,
The load component in the Y-axis direction of the detection element applied to the support member is substantially the same in the plurality of support members, and the load component in the Z-axis direction is substantially the same between the plurality of support members. Features inertial sensors. The detection element has a detection axis for detecting an angular velocity in the Z-axis direction, and an angle between the Z-axis and the vertical direction is θ,
The inertial sensor according to claim 1, wherein a load component obtained by combining the load component in the Y-axis direction and the load component in the Z-axis direction is a load component based on at least gravitational acceleration.   3. The inertial sensor according to claim 2, wherein the inertial sensor is configured such that an angle formed between the Z axis and the vertical direction is θ by inclining a short direction of the inertial sensor. An inertial sensor according to claims 1 to 3,
A plurality of lead terminals electrically connected to the inertial sensor;
An inertial sensor device comprising: a mold package for housing the inertial sensor.   A lead terminal extending from a part of the mold package toward a bottom surface of the mold package; and a lead terminal longer than the lead terminal from a part of the mold package facing the part. 5. The inertial sensor device according to claim 4, wherein the long lead terminal is configured to have a plurality of refracting portions toward the mold package side. It has a plurality of lead terminals that are electrically connected to the mounting board, the installation angle is determined based on the lead frame constituted by the plurality of lead terminals, and the shape of the lead frame, and responds to the operation with respect to the detection axis A method of manufacturing an inertial sensor device in which a sensor device including a sensor is molded with resin by a molding method,
After the sensor device is joined to the lead frame, the sensor is placed in a cavity defined by stacking the lower mold and the upper mold each having a recess formed between the recess forming surfaces with the lead frame interposed therebetween. In the molding method of housing a device and filling the cavity with a resin, the upper and lower surfaces of the cavity facing the lead frame are formed to be inclined with respect to both main surfaces of the lead frame, and A method of manufacturing an inertial sensor device, comprising using the lower mold in which the recesses are formed so that the upper and lower surfaces are parallel to each other and the mold mold including the upper mold. In the manufacturing method of the inertial sensor device according to claim 6,
The upper and lower surfaces of the cavity facing the lead frame are tilted at the same angle as the installation angle of the sensor device with respect to both main surfaces of the lead frame. Manufacturing method of inertial sensor device.

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