JP2007281377A - Lid for electronic component and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component capable of shortening a tuning time by enhancing a trimmable range with one-time laser irradiation. <P>SOLUTION: The electronic component has a package base 50, a piezoelectric vibrating piece 10 mounted on the package base 50 and having a balance adjusting portion to be processed with a laser beam, and a lid 60 joined to the package base 50 with a joining material 57 used for hermetically sealing the surroundings of the piezoelectric vibrating piece 10 and provided with a diffusion lens 62. For the diffusion lens 62, a cylindrical lens and fresnel lens may be used in addition to an ordinary convex lens. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component lid and an electronic component using the lid as a part of a package, and in particular, the lid is made of a light-transmitting member, and the electronic component main body mounted inside is processed after the package is sealed. The present invention relates to an electronic component lid and an electronic component suitable for the case.

  Conventionally, it has been often performed to detect a rotational motion of an electronic device or apparatus by an angular velocity sensor. In recent years, along with miniaturization and high performance of electronic devices, portable electronic devices are also equipped with an angular velocity sensor to prevent camera shake based on detected acceleration. An angular velocity sensor mounted on a portable electronic device is desired to be small and light, and a vibration gyro sensor using a piezoelectric material is widely used. Many types of vibration gyro sensors have been developed. For example, there is one using the gyro sensor element shown in FIG.

  In FIG. 7, a gyro sensor element (piezoelectric vibrating piece) 10 is formed of, for example, a quartz crystal substrate, which is a piezoelectric substrate, and has a base 12 formed in a square shape at the center. The left and right sides of the piezoelectric vibrating piece 10 are symmetrical with respect to the center of the base 12, and support arms 14 are integrally formed on the left and right sides of the base 12. At the tips of these support arms 14, drive arms 16 (16 a to 16 d) are provided in the vertical direction of the support arms 14 so as to be orthogonal to the support arms 14. The piezoelectric vibrating reed 10 is vertically symmetrical with respect to the center of the base 12, and detection arms 18 (18 a, 18 b) are integrally formed on the upper and lower sides of the base 12.

  Each drive arm 16 is provided with a drive electrode, and the detection arm 18 is provided with a detection electrode (both not shown). When a voltage is applied to the drive electrode, each drive arm 16 vibrates at the same frequency in the plane formed by each drive arm 16 as indicated by arrows 20 to 26. And the vibration of each drive arm 16 is synchronizing, and the front-end | tip part of each drive arm 16 bends inside simultaneously, and bends outside simultaneously.

  The piezoelectric vibrating piece 10 is configured such that the detection arm 18 does not vibrate when the angular velocity in the plane parallel to the paper surface of FIG. 7 does not act on the piezoelectric vibrating piece 10 in a state where the drive arm 16 is flexibly vibrating. . However, due to variations associated with the manufacture of the gyro sensor element 10, the frequency of each drive arm 16 may differ, and the thickness and thickness may differ. For this reason, the vibration balance of each drive arm 16 is lost, the vibrations of the upper, lower, left and right drive arms 16 are not canceled out at the base 12, and the detection arm 18 vibrates and the angular velocity does not act. A detection signal is output.

Therefore, a balance adjustment unit 28 (28a to 28d) made of a thin gold film or the like is formed at the tip of each drive arm 16, and the balance adjustment unit 28 is irradiated with laser light to evaporate a part of the balance adjustment unit 28. The balance of each drive arm 16 is adjusted (tuned) so that the detection arm 18 does not vibrate when the angular velocity does not act. This tuning is preferably performed after the gyro sensor element 10 is vacuum-sealed in the package so that no tuning deviation occurs. In tuning fork type piezoelectric vibrators, etc., the tuning fork type piezoelectric vibrating piece is enclosed in a package, and then laser light is irradiated through a glass lid (lid) to adjust the frequency (for example, patents). Reference 1).
JP 2002-359536 A

  As described in Patent Document 1, a conventional glass lid is formed into a flat plate having a uniform thickness. The laser beam for tuning is condensed at an arbitrary angle so that the focal position through the glass lid is the position of the target element piece. However, since the laser beam is condensed, the range of the gold thin film that can be trimmed by one irradiation is narrow, and tuning may take time.

  Therefore, in the present invention, there is provided an electronic component lid and an electronic component that can efficiently use the energy of laser light, expand the range that can be trimmed by one laser light irradiation, and shorten the tuning time. The purpose is to provide.

  In order to achieve the above object, it is necessary to widen the spot diameter at the laser beam irradiation position while maintaining the energy of the laser beam at a sufficient level for trimming the gold thin film. The simplest method for realizing this is to replace the laser beam irradiation device, but prepare a laser irradiation device corresponding to each of various electronic components with different focal lengths and spot ranges. Is not realistic from various viewpoints. Therefore, the applicant of the present application pays attention to the electronic component to be tuned by the laser beam and the lid thereof, and has decided to solve the above-mentioned problem.

  Therefore, a lid for electronic parts according to the present invention for achieving the above object is characterized in that a diffusion lens portion is provided at a predetermined position of a lid main body made of a translucent member. By setting the lid in such a form, it is possible to perform irradiation through the diffusion lens when irradiating the laser beam. Thereby, the condensed laser light can be diffused within a predetermined range to be parallel light. Therefore, the range of the gold thin film that can be evaporated and removed by one laser light irradiation can be expanded. In addition, it is possible to shorten the tuning time achieved by removing the gold thin film.

  In the electronic component lid having the above-described characteristics, a plurality of the diffusing lens portions may be provided. By providing a plurality of diffusing lens portions, it becomes possible to effectively irradiate a plurality of adjustment locations with laser light.

  Further, in the electronic component lid having the above-described characteristics, the diffusing lens portion may be formed in a cylindrical lens shape. When the diffusion lens portion is a cylindrical lens, the degree of freedom of the laser light irradiation range with respect to the longitudinal direction of the lens is increased. For this reason, even if it is the irradiation object from which a shape differs, if it is in the range which a lens part covers, it will become possible to respond with the lid of one pattern. Naturally, the same effect as that of a normal diffusing lens (concave lens) can be obtained.

  Further, the diffusing lens portion may have a Fresnel lens shape. By adopting such a lens shape, the lens portion can be formed thinner than other lenses. That is, even when the lid itself is thinned, it is possible to form a lens portion corresponding to the lid.

  Further, an electronic component according to the present invention for achieving the above object is a package main body, an electronic component main body mounted on the package main body and having a processed part to be laser processed, joined to the package main body, The lid according to any one of the above, which hermetically seals the periphery of the electronic component main body. If it is an electronic component which has such a characteristic, when performing laser processing, the effect obtained by the said lid can be show | played.

  In the electronic component configured as described above, the electronic component body may be a piezoelectric vibration gyro element. By adopting the above-mentioned lid for an electronic component on which a piezoelectric vibration gyro element having a larger number of adjustment parts than a tuning fork type piezoelectric vibrating piece is employed, a high effect can be obtained in shortening the processing time and the like.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an electronic component lid and an electronic component according to the present invention will be described below in detail with reference to the drawings. The following embodiments are some embodiments according to the present invention, and the technical scope of the present invention is not limited to the following embodiments.

  First, a first embodiment of an electronic component according to the present invention will be described with reference to FIG. FIG. 1 is a diagram showing a cross-sectional configuration of the electronic component. In this embodiment, a piezoelectric device, particularly a vibration gyro sensor will be described as an example of the electronic component.

  The piezoelectric device 100 according to the present embodiment is basically composed of a gyro sensor element (piezoelectric vibrating piece) 10, an intermediate substrate 30, an IC chip 40, and a package 70 on which these are mounted. The package 70 is joined to a package base 50 having a recess 52 for accommodating the piezoelectric vibrating piece 10, the intermediate substrate 30, the IC chip 40, and the like, and an upper opening of the package base 50. It is comprised from the cover body (lid) 60 which seals the part 52. FIG.

  The package base 50 is generally formed by sintering a plurality of substrates made of an insulating member such as ceramic. The package base 50 in this embodiment can also be manufactured by a manufacturing method according to this. The recess 52 formed in the package base 50 is configured by forming a side wall 50b on the bottom plate 50a. The specific shape is a stepped shape formed so as to expand the opening from the bottom plate 50a toward the upper opening. Mount electrodes 54 and bonding electrodes 56 are provided on the upper surface of the stepped portion of the recessed portion 52 and the upper surface of the bottom plate 50a, and external terminals provided on each other or on the back surface of the bottom plate 50a, that is, on the back surface of the package base 50. 59 and the like.

  The lid 60 is formed of a substrate that transmits light (translucent substrate). Specific examples of the constituent material include glass, crystal, and sapphire. The light-transmitting substrate includes a resin material such as acrylic or plastic, but the former is desirable for ensuring reliability such as heat resistance and durability. A lens 62 is formed on the lid 60. The lens 62 is provided to adjust the irradiation range of the laser light irradiated to the balance adjusting unit 28 of the piezoelectric vibrating piece 10 described in the background art section. For this reason, the lens 62 is arranged so that it is positioned at least above the balance adjusting unit 28 when the lid 60 is joined to the top of the package base 50.

  The lens 62 is preferably a diffusive lens so that the balance adjusting unit 28 can be irradiated with the laser light irradiated so as to be condensed at a specific focal length as parallel light. A typical example is a concave lens. The lid 60 having such a lens 62 may be formed using a glass mold technique. The glass mold is a technique for producing a glass product by pressing, and specifically, is as follows. First, glass or a specific glass mold material is provided to a mold manufactured in the shape of a desired product (in this embodiment, a lid 60 having a lens 62). The glass or the like supplied in the mold is heated and softened. Thereafter, the mold is pressurized by a press machine, and the supplied glass or the like is processed into a desired shape. Then, the lid 60 having the lens 62 is completed by cooling the glass processed into a desired shape and removing it from the mold. Further, when quartz or sapphire is adopted as the constituent material of the lid 60, the lens may be formed by polishing.

  By providing a concave lens on the lid, a difference as shown in FIG. 3 occurs at the time of laser beam irradiation. FIGS. 3A and 3B are views showing images when the piezoelectric vibrating piece (irradiation target) is irradiated with laser light through a lid. FIG. 3A shows the case where laser light is irradiated using a lid that does not have a lens (concave lens), and FIG. 3B shows that the lid that has a lens (concave lens) is used. An example in the case of irradiation with laser light is shown. As can be seen from FIG. 3, in the case of irradiating the laser light through the ordinary lid shown in FIG. 3A, the laser light is condensed according to the focal length of the irradiation device (not shown). For this reason, the irradiation range of the laser beam reaching the irradiation target is extremely small. On the contrary, in the lid in which the concave lens as shown in FIG. 3B is formed, the condensed laser light is diffused at a predetermined angle, so that parallel light having a predetermined irradiation range can be created. it can. Even in the case where parallel light is irradiated in a predetermined range as described above, the energy of the laser light is sufficient for evaporating a gold thin film (not shown) formed on the irradiation target. Therefore, by irradiating laser light through such a lens, the area of the gold thin film processed by one laser light irradiation increases. For this reason, the processing time used for balance adjustment can be shortened. Moreover, since it has a wide laser beam irradiation range, it is possible to perform uniform processing in the range, reduce processing unevenness, and obtain high processing accuracy.

  Next, the intermediate substrate will be described. As shown in FIG. 2, the intermediate substrate includes a substrate body 32 and a plurality of leads 34 arranged on the back surface of the substrate body 32. The substrate body 32 has a frame shape having an opening at the center. The opening provided in the substrate main body 32 is an opening called a device hole 32a, and the lead 34 extends to the vicinity of the center of the device hole 32a. The lead 34 extended to the device hole 32 a is bent upward, and the piezoelectric vibrating piece 10 is joined to the tip 34 a of the bent lead 34. In the intermediate substrate 30 having such a configuration, the substrate body 32 is generally made of resin. In the above description, the lead 34 and the piezoelectric vibrating piece 10 can be joined using the bump 36. Further, the intermediate substrate 30 can join the base end portion 34 b of the lead 34 to the mount electrode 54 using the conductive adhesive 58.

  Here, the piezoelectric vibrating reed 10 to be bonded to the intermediate substrate 30 can employ the gyro sensor element shown in FIG. 7 described in the background section above, and thus detailed description thereof will be omitted.

  The IC chip 40 employed in the present embodiment is configured to supply an electric signal to the piezoelectric vibrating piece 10 and to input a signal output from the piezoelectric vibrating piece 10.

  Next, a method for manufacturing the piezoelectric device 100 having the above configuration will be described. First, the IC chip 40 is mounted on the upper surface of the bottom plate 50a of the package base 50 in which the recess 52 is formed, and the electrode pads 42 of the IC chip 40 and the bonding electrodes 56 of the package base 50 are mounted by wire bonding. The piezoelectric vibrating piece 10 is bonded to the intermediate substrate 30 in parallel with or before and after this. Although the joining of the intermediate substrate 30 and the piezoelectric vibrating piece 10 has been briefly described above, the following can be given as an example in detail. First, bumps 36 are formed on connection electrodes (not shown) formed on the back surface of the piezoelectric vibrating piece 10. Next, the piezoelectric vibrating reed 10 and the intermediate substrate 30 are arranged vertically so that the tip 34a of the lead 34 constituting the intermediate substrate 30 and the connection electrode overlap each other when viewed in plan. Thereafter, a bonding tool (not shown) is moved from the back surface side of the intermediate substrate 30 toward the piezoelectric vibrating piece 10 disposed on the front surface side of the intermediate substrate 30 to bond them together. Here, since the device hole 32 a is provided in the intermediate substrate 30, the bonding tool passes through the device hole 32 a and reaches the piezoelectric vibrating piece 10 without contacting the substrate body 32. At this time, since the bonding tool bends the lead 34, it is possible to realize a three-dimensional bonding state in which only the tip 34 a of the lead 34 contacts the connection electrode of the piezoelectric vibrating piece 10. Note that the connection electrode via the bump 36 and the tip 34a of the lead 34 may be joined using a technique such as thermocompression bonding or ultrasonic waves.

  When the above steps are completed, the conductive adhesive 58 is applied to the mount electrode 54 provided on the package base 50. Then, the intermediate substrate 30 that has undergone the above-described steps is mounted so that the leads 34 respectively assigned to the mount electrodes 54 are arranged.

  After the IC chip 40, the intermediate substrate 30, and the piezoelectric vibrating piece 10 are accommodated in the recess 52 of the package base, the upper opening of the recess 52 is sealed with the lid 60. The lid 60 is bonded to the package base 50 through a bonding material 57 such as low-melting glass. Specifically, the bonding material 57 is disposed on at least one of the lower surface peripheral portion of the lid 60 and the upper surface of the side wall of the package base 50. Thereafter, the package base 50 and the lid 60 are disposed via the bonding material 57. Thereafter, the lid 60 disposed on the upper surface of the side wall of the package base 50 is heated to melt the bonding material 57, and the package base 50 and the lid 60 are fused. Various methods can be used for heating the lid 60. For example, bonding can be performed by infrared heating using a halogen lamp. When heating with such a halogen lamp, an infrared reflection film (not shown) is preferably formed on the back side of the lid 60. This is because the temperature rise in the recessed portion 52 can be mitigated, and the occurrence of damage to the IC chip 40 due to heat can be prevented. When the IC chip 40 is disposed outside the recessed portion 52, there is no need to form the infrared reflecting film.

  Such a bonding of the package base 50 and the lid 60 is performed under a vacuum, and it is necessary to keep the recess 52 in a vacuum. When the package base 50 has a so-called sealing hole (not shown), the bonding between the package base 50 and the lid 60 is performed under atmospheric pressure, and only the sealing hole is sealed under vacuum. It can be said.

  After the recess 52 is vacuum-sealed, the piezoelectric vibrating piece 10 is tuned using laser light. As described above, the tuning of the piezoelectric vibrating piece 10 is performed by irradiating the balance adjusting unit 28 of the piezoelectric vibrating piece 10 with the laser beam and evaporating the gold thin film. By performing such tuning, the drive arm 16 can be balanced, so that noise can be prevented from being output when the piezoelectric device 100 is stationary. Note that the wavelength of visible light may be used for the laser light.

  According to the piezoelectric device 100 manufactured as described above, the laser beam is irradiated onto the piezoelectric vibrating piece 10 via the concave lens provided on the lid 60, so that the laser beam is evenly applied to the balance adjusting unit 28. Can be irradiated. Further, since the irradiation range of one laser beam is widened, the tuning time can be shortened.

  Further, with the piezoelectric device 100 configured as in the present embodiment, there is no possibility that the laser beam transmitted through the piezoelectric vibrating piece 10 may damage the package base 50. That is, when the package base 50 is damaged, fine particles scattered from the damaged portion deteriorate the degree of vacuum in the recess 52, or the fine particles adhere to the arm or the like of the piezoelectric vibrating piece 10, and the detection signal is output. May have adverse effects. On the other hand, according to the piezoelectric device 100 as in the present embodiment, even if the laser light is transmitted through the piezoelectric vibrating piece 10, the transmitted laser light is irradiated onto the intermediate substrate 30. Since the substrate main body 32 of the intermediate substrate 30 is made of resin or the like, even if it is irradiated with laser light, the irradiated portion is altered to the extent that it does not cause other influences such as scattering of fine particles. .

  In the above embodiment, the lens 62 provided on the lid 60 has been described as a concave lens. However, the lens 62 is not limited to this as long as it is a diffusion lens. That is, the lens may be a cylindrical lens 62a as shown in FIG. In this way, by making the lens 62a into an inverted saddle shape, the degree of freedom of the irradiation range in the width direction is increased, so that it is possible to cope with a plurality of piezoelectric vibrating piece forms with one pattern of lid. Become.

  The lens may be a meniscus lens 62c as shown in FIG. With such a lens shape, the refractive index of the laser light can be adjusted with high accuracy. Although not shown, the lens shape may be a Fresnel lens shape. By adopting such a lens shape, the lens can be formed thinner than other lenses. That is, even when the lid 60 is thinned, it is possible to cope with it.

  Next, a second embodiment according to the electronic component of the present invention will be described with reference to FIG. The electronic component according to the present embodiment is also a piezoelectric device, but is a so-called piezoelectric vibrator in which the shape of the piezoelectric vibrating piece mounted in the package is different from that of the first embodiment. 6A shows a cross-sectional view of the piezoelectric device, and FIG. 6B shows a plan view of the piezoelectric device.

  The piezoelectric device 200 of this embodiment has a basic configuration of a piezoelectric vibrating piece 110 and a package 170 on which the piezoelectric vibrating piece 110 is mounted. As described above, the piezoelectric vibrating piece 10 in the present embodiment is a tuning fork type piezoelectric vibrating piece having a shape different from that of the piezoelectric vibrating piece 10 in the first embodiment. The piezoelectric vibrating piece 10 of the present embodiment includes a base 112 for mounting on a package and two vibrating arms 114 (114a, 114b) extending from the base 112. The base 112 and the vibrating arms Each electrode 114 is provided with an electrode (not shown) for exciting the vibrating arm 114. The tip of the vibration arm 114 is provided with an adjustment unit 116 (116a, 116b) used for adjusting the resonance frequency of the piezoelectric vibrator. The adjustment unit 116 is composed of a thin gold film, and the resonance frequency is adjusted by evaporating and removing a part of the adjustment unit 116 with a laser beam in the same manner as the balance adjustment unit 28 in the first embodiment.

  As in the first embodiment, the package includes a package base 150 having a recessed portion 152 and a lid 160 having a lens 162. The recess 152 of the package base 150 is provided with at least a mount electrode 154 for mounting the piezoelectric vibrating piece 110, and the mount electrode 154 is connected to an external terminal (not shown) provided on the back surface of the package base. .

  In the piezoelectric device 200 of this embodiment composed of such components, the piezoelectric vibrating piece 110 may be mounted on the mount electrode 154 via a conductive adhesive 156. The package base 150 and the lid 160 may be bonded via a bonding material 157 such as low melting point glass.

  In the piezoelectric device 200 according to the present embodiment, after the lid 160 is bonded to the package base 150, the lens 162 provided on the lid 160 is the adjustment portion of the piezoelectric vibrating piece 110 accommodated in the recessed portion 152 of the package base 150. It will be located in the upper part of 116.

  With such a configuration, when the adjustment unit 116 is processed by laser light irradiation, the same effect as that of the piezoelectric device 100 according to the first embodiment can be obtained.

  In the above-described embodiment, the electronic component has been described by taking a piezoelectric device as an example, but the electronic component according to the present invention is not limited to the piezoelectric device. For example, the electronic component lid of the present invention can be applied to laser trimming of wiring of a component sealed in a package, and a plurality of wirings can be burned out by one laser light irradiation. It becomes. Therefore, the electronic component according to the present invention includes an electronic component having such a function, generally, one employing the electronic component lid according to the present invention.

It is sectional drawing of the electronic component which concerns on 1st Embodiment. It is explanatory drawing of the intermediate substrate which joins a piezoelectric vibrating piece. It is a figure explaining the change of the irradiation range of the laser beam by a lens. It is a figure which shows the example of the lid which used the lens part as the cylindrical lens shape. It is a figure which shows the example of the lid which made the lens part the meniscus lens shape. It is a figure which shows the electronic component which concerns on 2nd Embodiment. It is a figure which shows the structure of a gyro sensor element.

Explanation of symbols

  10 ... Gyro sensor element (piezoelectric vibrating piece) 30 ... Intermediate board 40 ... IC chip 50 ... Package base 60 ... Lid 62 62 Lens 70 Package, 100 ... Piezoelectric device.

Claims (6)

  A lid for electronic parts, characterized in that a diffusion lens portion is provided at a predetermined position of a lid main body made of a translucent member. In the lid for electronic components according to claim 1,
A lid for electronic parts, wherein a plurality of the diffusing lens portions are provided. In the lid for electronic parts according to claim 1 or 2,
The lid for electronic parts, wherein the diffusing lens portion has a cylindrical lens shape. In the lid for electronic parts according to claim 1 or 2,
The lid for electronic parts, wherein the diffusion lens portion is formed in a Fresnel lens shape. The package body;
An electronic component body mounted on the package body and having a workpiece to be laser processed;
The lid according to any one of claims 1 to 4, wherein the lid is bonded to the package body and hermetically seals the periphery of the electronic component body.
An electronic component comprising: The electronic component according to claim 5,
The electronic component main body is a piezoelectric vibration gyro element.

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