JP2011149789A - Manufacturing method of motion sensor and motion sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a motion sensor and a motion sensor for miniaturizing an outline shape thereof. <P>SOLUTION: The manufacturing method of a motion sensor includes the steps of: preparing a plurality of packages 30 each containing a sensor element; connecting each of the plurality of packages 30 to each of a plurality of lead frames 105; bending a lead 101 portion of at least one of the plurality of lead frames 105; connecting the lead 101 to connecting faces of leads 11a to 11d and 41a to 41d included in the lead frame 50 as a base substrate; and sealing the plurality of packages 30 so that a part of the leads 11a to 11d and 41a to 41d is protruded. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a motion sensor including a gyro sensor, an acceleration sensor, and the like, and a motion sensor.

  Conventionally, a lead frame has been used as a metal plate that supports, for example, an integrated circuit (IC) element as an electronic component inside an electronic device such as a motion sensor and draws a plurality of terminals of the IC element to the outside of the resin package. It is used.

  An electronic device manufacturing method using the lead frame will be described. FIGS. 15A and 15B are process diagrams showing a method of manufacturing an electronic device according to a conventional example. FIG. 15A is a plan view and FIG. 15B is a cross-sectional view showing upper and lower molds sandwiching a lead frame. is there.

  First, as shown in FIG. 15A, first, a lead frame 110 made of, for example, a copper plate is prepared. The lead frame 110 includes a die pad 111 for fixing the electronic component 121, a plurality of leads 112 for drawing out each terminal of the electronic component 121 fixed on the die pad 111, and a plurality of leads 112. And a dam bar 113 connected thereto. Then, the electronic component 121 is attached on the die pad 111. Then, each terminal included in the electronic component 121 and the lead 112 are connected using, for example, a gold wire 131 or the like.

  Next, as shown in FIG. 15B, the electronic component 121 and the gold wire 131 fixed on the die pad 111 are disposed between the upper mold 141 and the lower mold 142, and both molds are clamped. Thus, the cavity 143 is formed. Then, mold resin is injected into the cavity 143 and cured. Thereby, a resin package is formed, and the electronic component 121 is sealed in the resin package. Thereafter, the cavity 143 is opened to take out the resin package, and the dam bar 113 on the outside of the resin package is cut to separate the plurality of leads 112 from each other. In this way, the electronic device is completed.

Another conventional example is disclosed in Patent Documents 1 and 2, for example. In Patent Document 1, a stage portion on which electronic components are mounted is divided into a plurality of areas. For example, the first area is used as an element mounting region, the second area is used as a ground layer, and the third area is used as a power supply layer. It is described that. Further, this Patent Document 1 also describes that a stage part frame having first to third areas and a lead part frame having a predetermined number of leads are separately formed and stacked.
In Patent Document 2, a pair of leads in a sealing body (package) bends in the middle and extends obliquely upward, a semiconductor chip is fixed to the lower surface of one lead extending obliquely upward, and the other lead A structure in which one end of a wire is connected to the lower surface and the other end of the wire is connected to an electrode of a semiconductor chip is described.

Japanese Patent Laid-Open No. 7-231069 JP-A-8-31998

By the way, in the conventional example shown in FIGS. 15A and 15B, when two electronic components 121 and 122 are arranged in one resin package, for example, as shown in FIG. A method of arranging the electronic components 121 and 122 side by side on the die pad 111 is conceivable. However, as shown in FIG. 16B, when the electronic components 121 and 122 are larger than the die pad 111, a part of the electronic components 121 and 122 overlap in a plan view and contact (ie, interfere). End up.
As a method for avoiding such a situation, in the conventional technology, there is only a problem that the area of the die pad 111 is increased in accordance with the number and size of the electronic components 121 and 122, and the resin package is significantly increased in size. It was.

  Such a problem could not be solved even by the technique disclosed in Patent Document 1. In addition, Patent Document 2 does not originally assume that a plurality of electronic devices are arranged in one resin package.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

Application Example 1 A motion sensor manufacturing method according to this application example is a motion sensor manufacturing method having a plurality of sensor elements,
(A) preparing a plurality of packages containing the sensor elements;
(B) individually connecting the plurality of packages to a plurality of lead frames;
(C) bending a lead portion of at least one lead frame of the plurality of lead frames;
(D) connecting the leads of the plurality of lead frames to lead connection surfaces of the base substrate;
(E) sealing the plurality of packages so that a part of the leads of the base substrate protrudes.

  According to the method of manufacturing a motion sensor according to this application example, the lead portion of at least one lead frame of the plurality of lead frames is bent, and the leads of the plurality of lead frames are connected to the connection surfaces of the leads of the base substrate. Accordingly, it is possible to arrange a plurality of packages that overlap in a conventional manner at positions where they do not overlap. This makes it possible to reduce the area occupied by the plurality of packages in a plan view. That is, a small motion sensor can be provided.

  Application Example 2 In the motion sensor manufacturing method according to the application example described above, in the step (c), the lead frame lead is placed so that the main surface of the sensor element and the lead frame lead are substantially perpendicular to each other. It is characterized by bending.

  According to the method of manufacturing a motion sensor according to this application example, the lead is bent so that the angle formed between the main surface of the sensor element and the lead is substantially a right angle. Then, by connecting the bent lead to the lead connecting surface of the base substrate, the angle formed between the lead connecting surface of the base substrate and the main surface of the sensor element can be easily set to the base substrate. It becomes possible to connect.

  Application Example 3 In the motion sensor manufacturing method according to the application example, in the step (d), a main surface of at least one of the plurality of sensor elements is parallel to the connection surface of the base substrate. It is connected so that it may become.

  According to the method of manufacturing a motion sensor according to this application example, it is possible to easily connect to the base substrate so that the main surface of the sensor element and the connection surface of the lead are parallel to each other.

  Application Example 4 In the method of manufacturing a motion sensor according to the application example, in the step (d), the lead frame is attached to the base so that the principal surfaces of the plurality of sensor elements are substantially perpendicular to each other. A method of manufacturing a motion sensor, comprising connecting to a substrate.

  According to the method for manufacturing a motion sensor according to this application example, the lead frame can be easily connected to the base substrate so that the principal surfaces of the plurality of sensor elements form a substantially right angle relationship. As a result, it is possible to provide a motion sensor capable of measuring a physical quantity change in two or more axial directions.

Application Example 5 A motion sensor manufacturing method according to this application example is a motion sensor manufacturing method having a plurality of sensor elements,
(A) preparing a plurality of packages containing the sensor elements;
(B) a step of individually connecting a plurality of packages to a plurality of lead frames in the previous period;
(C) connecting the leads of the plurality of lead frames to the connection surfaces of the leads of the base substrate;
(D) bending at least one lead frame lead of the plurality of lead frames to cause the package; and (e) sealing the plurality of packages so that a part of the lead of the base substrate protrudes. And a step of stopping.

  According to the method of manufacturing a motion sensor according to this application example, it is possible to cause a package on the basis of one surface of the base substrate. In other words, since the cause angle of the package is determined without being affected by the dimensional variation of other components, the cause of the package from one surface (reference surface) of the base substrate is small, in other words, It is possible to cause the angle with high accuracy.

  [Application Example 6] In the motion sensor manufacturing method according to the application example, in the step (d), the lead angle of the package and the main surface of the sensor element are substantially perpendicular to each other. A method of manufacturing a motion sensor, wherein the lead is bent.

  According to the method of manufacturing a motion sensor according to this application example, the package can be caused to be substantially perpendicular with respect to one surface of the base substrate. In other words, since the package is not affected by the dimensional variation of other components, the package can be caused to be substantially perpendicular to the surface of the base substrate and the angle variation can be reduced.

  Application Example 7 In the motion sensor manufacturing method according to the application example, in the step (d), the leads are bent so that the principal surfaces of the plurality of sensor elements are substantially perpendicular to each other. A featured motion sensor manufacturing method.

  According to the method for manufacturing a motion sensor according to this application example, the lead frame can be easily connected to the base substrate so that the principal surfaces of the plurality of sensor elements form a substantially right angle relationship. As a result, it is possible to provide a motion sensor capable of measuring a physical quantity change in two or more axial directions.

  Application Example 8 A motion sensor according to this application example is a motion sensor having a plurality of sensor elements, and a plurality of packages in which the sensor elements are housed and a plurality of packages in which the plurality of packages are individually connected. A lead frame; a base substrate to which the plurality of lead frames are connected; and a sealing material for sealing the base substrate; and a lead of at least one lead frame of the plurality of lead frames is bent. It is characterized by being.

  According to the motion sensor of this application example, the lead portion of at least one lead frame of the plurality of lead frames is bent, and the leads of the plurality of lead frames are connected to the connection surfaces of the leads of the base substrate. Accordingly, it is possible to arrange a plurality of packages that overlap in a conventional manner at positions where they do not overlap. This makes it possible to reduce the area occupied by the plurality of packages in a plan view. That is, a small motion sensor can be provided.

  Application Example 9 In the motion sensor according to the application example described above, the at least one bent lead frame has the lead bent so that a main surface of the sensor element and a lead of the lead frame are substantially perpendicular to each other. It is characterized by being.

  According to the motion sensor according to this application example, it is possible to provide a motion sensor that can detect a change in a physical quantity to be measured in a direction substantially perpendicular to the connection surface of the base substrate.

  Application Example 10 In the motion sensor according to the application example described above, a main surface of at least one of the plurality of sensor elements is substantially parallel to a connection surface of the base substrate.

  According to the motion sensor according to this application example, it is possible to provide a motion sensor capable of detecting a change in a physical quantity to be measured in a direction substantially parallel to the connection surface of the base substrate.

Application Example 11 In the motion sensor according to the application example,
In the plurality of sensor elements, a main surface of each of the sensor elements is substantially perpendicular to each other.

  According to the motion sensor according to this application example, the lead frame can be easily connected to the base substrate so that the principal surfaces of the plurality of sensor elements form a substantially right angle relationship. As a result, it is possible to provide a motion sensor capable of measuring a physical quantity change in two or more axial directions.

  Application Example 12 The motion sensor according to the application example described above further includes a circuit unit that drives the plurality of sensor elements.

  According to the motion sensor according to this application example, it is possible to provide a motion sensor in which the sensor element and the circuit unit that drives the sensor element are combined.

(A)-(d) is a process flow figure showing a schematic structure and a manufacturing process of a gyro device. The schematic shape of a vibration gyro element is shown, (a) is a top view, (b) is a front sectional view. The schematic plan view explaining operation | movement of a vibration gyro element. The schematic plan view explaining operation | movement of a vibration gyro element. FIG. 2 is a front sectional view showing a schematic configuration of a gyro device. (A), (b) is a figure which shows schematic structure and manufacturing process of the gyro sensor of 1st Embodiment. (A), (b) is a figure which shows schematic structure and manufacturing process of the gyro sensor of 1st Embodiment. (A), (b) is a figure which shows schematic structure and manufacturing process of the gyro sensor of 2nd Embodiment. (A), (b) is a figure which shows schematic structure and manufacturing process of the gyro sensor of 2nd Embodiment. The schematic structure of the gyro sensor of 3rd Embodiment is shown, (a) is a top view, (b) is C-C 'sectional drawing of (a). The figure which shows schematic structure and manufacturing process of the gyro sensor of 4th Embodiment. The figure which shows schematic structure and manufacturing process of the gyro sensor of 5th Embodiment. The figure which shows schematic structure and manufacturing process of the gyro sensor of 5th Embodiment. The figure which shows schematic structure and manufacturing process of the gyro sensor of 6th Embodiment. Process drawing which shows the manufacturing method of the electronic device which concerns on a prior art example. The top view which shows the structural example of the electronic device which concerns on a prior art example.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
A gyro sensor as an example of a motion sensor according to the present invention will be described as a first embodiment with reference to FIGS. 1A to 1D are process flow diagrams showing a schematic configuration and manufacturing process of a gyro device used for a gyro sensor. FIG. 2 shows a schematic shape of a vibration gyro element as a sensor element, where (a) is a plan view and (b) is a front sectional view. 3 and 4 are schematic plan views for explaining the operation of the vibration gyro element. FIG. 3 shows the drive vibration state, and FIGS. 4A and 4B show the detected vibration state with the angular velocity added. Show. FIG. 5 is a front sectional view showing a schematic configuration of the gyro device. 6 (a), 6 (b), 7 (a), and 7 (b) are diagrams showing a schematic configuration and a manufacturing process of the gyro sensor.

<Description of gyro device>
A gyro device used for a gyro sensor will be described with reference to FIGS. The gyro device is an example of a sensor device.

  First, the process of connecting the package 30 containing the vibrating gyro element as the sensor element to the outer lead 101 included in the lead frame 105 will be described with reference to FIG.

The lead frame 105 has, for example, a lead including a plurality of outer leads 101, a first dam bar 102, a second dam bar 103, and a pair of support frames 104. Among these, the lead is used as a stage on which electronic components are mounted, and is also used as an outer lead 101 (that is, a terminal that is connected to the outside and used for transmitting and receiving signals and power, and is also called an external connection terminal). ) Is used as part. In the following description, the outer lead 101 will be described, but the outer lead 101 is continuous with a so-called inner lead used as a stage on which electronic components are mounted.
The first dam bar 102 stops the flow of the mold resin when sealing an electronic component (in this example, a package 30 containing a vibration gyro element described later) mounted on a plurality of leads with the mold resin. This is a part for preventing the mold resin from spreading outside the dam bar.
The second dam bar 103 connects the pair of support frames 104 to stop the flow of the mold resin as in the first dam bar 102 so that the mold resin does not spread outside the dam bar. Part.

  The pair of support frames 104 are outer frames of the lead frame 105 and are portions for supporting the first dam bar 102 and the second dam bar 103. In the lead frame 105, for example, an outer lead 101, a first dam bar 102, a second dam bar 103, and a pair of support frames 104 are integrated by etching or punching one copper plate using a die. Formed.

  A package 30 in which the case body 32 is sealed with a lid body 36 is connected to the outer lead 101 (inner lead) using, for example, solder, a conductive adhesive, or the like. An external terminal (not shown) that is electrically connected to a vibration gyro element (described later) housed in the case body 32 is provided on the outer surface of the case body 32 of the package 30, and is electrically connected to the outer lead 101. The connection is also taken.

  Although FIG. 1 shows an example in which one package 30 is connected, a long lead frame in which the same shape pattern is repeatedly provided so that a plurality of packages 30 can be connected in the same lead frame 105. It may be.

  Next, the process of housing the package 30 in the second package will be described with reference to FIG.

  The lead frame 105 to which the package 30 is connected is disposed between the upper mold 106 and the lower mold 107. Then, both dies (106, 107) are clamped so as to sandwich the first dam bar 102, the second dam bar 103, the support frame 104, and the like from above and below to form the cavity 108. Then, for example, a mold resin is injected into the cavity 108 and cured.

  Next, after the mold resin is cured, the upper mold 106 and the lower mold 107 are opened to form the second package 109 in which the package 30 is enclosed by the mold resin as shown in FIG. Is done. Thereafter, the first dam bar 102 and the second dam bar 103 outside the second package 109 are cut to separate the outer leads 101 from each other. Further, the first dam bar 102 and the second dam bar 103 are cut from the support frame 104 to separate the second package 109 from the support frame 104. Thereby, the gyro device 100a is completed. Each outer lead 101 has a function of an external connection terminal.

Next, as shown in FIG. 1D, the outer lead 101 of the gyro device 100a is bent so that the bending angle θ is substantially a right angle to form the gyro device 100b. At this time, since the bending reference is unified by bending with respect to the connection surface 101a of the outer lead 101 (the surface to which the outer lead 101 is connected later), it is possible to suppress variation in the bending angle.
In this example, the example in which the bending angle θ of the outer lead 101 is a substantially right angle has been described, but the bending angle can be arbitrarily set to a desired angle.
Hereinafter, the gyro device in which the outer lead 101 shown in FIG. 1C is not bent is referred to as a gyro device 100a, and the gyro device in which the outer lead 101 shown in FIG. 1D is bent is referred to as a gyro device 100b.

In the above description, the package 30 in which the vibration gyro element is stored is connected to the outer lead 101 of the lead frame 105 and then stored in the second package 109. However, the package 30 is stored in the second package 109. It is not always necessary. If the second package 109 is not to be stored, after the package 30 is connected to the outer lead 101, the first dam bar 102 and the second dam bar 103 on the outer side of the second package 109 are cut and each outer dam bar 103 is cut. The leads 101 are separated from each other. The subsequent steps (after the step of bending the outer lead 101) are the same as the steps described above.
In this case, the first dam bar 102 and the second dam bar 103 may not be provided with a function of stopping the flow of the mold resin. However, the first dam bar 102 and the second dam bar 103 can be provided for the purpose of reinforcing the outer lead 101, for example.

  Here, the configuration and operation of the above-described package 30 will be described in detail with reference to FIGS. 2 to 5. In FIGS. 3 and 4, each vibration arm is “ It is represented by a line.

  As shown in FIG. 2A, the vibrating gyro element 20 is formed in the XY plane. In this example, the vibrating gyro element 20 is made of quartz and is cut out in the plane direction of the X axis and the Y axis of the X axis called the electric axis, the Y axis called the mechanical axis, and the Z axis called the optical axis. It is a cut quartz substrate. The vibrating gyro element 20 is formed of a quartz substrate having a predetermined thickness. The planar shape of the vibrating gyro element 20 is developed on the XY plane in accordance with the crystal axis of the crystal, and has a 180 ° point-symmetric shape with respect to the center point G. The center point G is the position of the center of gravity of the vibrating gyro element 20. Although not shown, a predetermined electrode is formed on the surface of the vibrating gyro element 20.

  The vibrating gyro element 20 is formed with a rectangular base portion 21 having end faces parallel to the X-axis direction and the Y-axis direction, respectively. The base 21 is formed with two connecting arms 23a and 23b as support beams extending in the direction parallel to the X-axis from the center of the two end faces parallel to the Y-axis of the base 21. Further, the base 21 includes a detection arm 22a in the positive direction of the Y axis and a detection arm in the negative direction of the Y axis as detection parts extending in the direction parallel to the Y axis from the center of the two end faces parallel to the X axis of the base 21. 22b. A pair of drive arms extending in a direction orthogonal to the connection arm 23b is formed at the tip of each of the connection arms 23a and 23b. A driving arm 25a extends in the Y axis plus direction and a driving arm 25b extends in the Y axis minus direction at the tip of the connecting arm 23b. Further, a driving arm 24a extends in the Y-axis plus direction and a driving arm 24b extends in the Y-axis minus direction at the tip of the connecting arm 23a.

A wide first weight 27a is formed at the tip of the drive arms 24a, 24b, 25a, 25b. In addition, a wide-width second weight portion 26a having a width wider than that of the first weight portion 27a is formed at the distal ends of the detection arms 22a and 22b.
The drive arms 25a, 25b, 24a, and 24b have dimensions such as width and length so that drive vibration with a predetermined resonance frequency is generated. The detection arms 22a and 22b and the connecting arms 23a and 23b are set to have dimensions such as width and length so that detection vibrations having a predetermined resonance frequency are generated.

  The front and back surfaces formed in the XY plane shown in FIG. 2A are referred to as main surfaces (indicated by A1 and A2 in FIG. 2B).

  Next, the driving vibration state of the vibration gyro element 20 will be described with reference to FIG.

  First, when a drive signal is applied through a support portion (not shown), the vibration arms 20a, 24b, 25a, and 25b bend and vibrate in the direction indicated by the arrow E in a state where the angular velocity is not applied to the vibration gyro element 20. . In this bending vibration, a vibration state indicated by a solid line and a vibration state indicated by a two-dot chain line are repeated at a predetermined frequency.

Next, when the angular velocity ω about the Z-axis is applied to the vibrating gyro element 20 in the state where the driving vibration is performed, the vibrating gyro element 20 performs vibration as shown in FIG.
First, as shown in FIG. 4A, the Coriolis force in the direction of arrow B acts on the drive arms 24a, 24b, 25a, 25b and the connecting arms 23a, 23b constituting the drive vibration system. At the same time, the detection arms 22a and 22b are deformed in the arrow C direction in response to the Coriolis force in the arrow B direction.

Thereafter, as shown in FIG. 4B, a force returning in the direction of arrow B ′ is applied to the drive arms 24a, 24b, 25a, 25b and the connecting arms 23a, 23b. At the same time, the detection arms 22a and 22b are deformed in the direction of the arrow C ′ in response to the force in the direction of the arrow B ′.
The vibration gyro element 20 repeats this series of operations alternately to excite new vibration. The vibrations in the directions of arrows B and B ′ are vibrations in the circumferential direction with respect to the center of gravity G. In the vibrating gyro element 20, the detection electrode (not shown) formed on the detection arms 22a and 22b detects the distortion of the crystal generated by the vibration, thereby obtaining the angular velocity.

The vibrating gyro element 20 described above is housed in a case body 32 to form a package 30 as shown in FIG.
The package 30 includes the vibration gyro element 20, a support portion 29 of the vibration gyro element 20 housed in a recess of the case body 32 as a cage, a support substrate 31, a lid body 36, and the like.

  The case body 32 is made of, for example, ceramic. A support substrate 31 on which a circuit pattern (not shown) or the like is formed is fixed to the bottom surface of the recess formed at the center of the case body 32. One end of a plurality of support portions 29 is connected to the surface of the support substrate 31. The support portion 29 is formed of a flexible metal thin plate or the like, and the vibrating gyro element 20 is connected to an end portion opposite to the connection end with the support substrate 31. The support portion 29 has a shape bent upward at a portion protruding from the support substrate 31 in order to prevent contact between the support substrate 31 and the vibration gyro element 20. The support portion 29 is further bent near the end in the bent direction, and the vibrating gyro element 20 is connected to this portion. The lid 36 is fixed to the opening of the case body 32 using, for example, a seam welding method, a metal heat fusion method, or the like. The lid 36 is fixed in a state where the concave portion of the case body 32 is in a reduced pressure state (sometimes expressed as a vacuum). By fixing the lid 36, the inside of the recess of the case body 32 is hermetically sealed in a reduced pressure state. An external connection terminal (not shown) connected to an electrode (not shown) of the vibrating gyro element 20 via a support substrate 31 and a support portion 29 is formed outside the case body 32.

<Description of gyro sensor>
Next, a schematic configuration of a gyro sensor using two gyro devices 100a and 100b and a manufacturing method thereof will be described with reference to FIGS. 6 and 7 show a schematic configuration and a manufacturing process of the gyro sensor according to the first embodiment. FIG. 6A is a plan view, and FIG. 6B is a cross-sectional view taken along line BB ′ in FIG. 7A is a cross-sectional view showing the molding process, and FIG. 7B is a cross-sectional view showing a schematic configuration of the gyro sensor.

  First, as shown in FIGS. 6A and 6B, a lead frame 50 as a base substrate is prepared. The lead frame 50 includes, for example, a plurality of leads 11 a to 11 d, 21 a to 21 d, 31 a to 31 d, 41 a to 41 d, dam bars 13, 23, 33, 43, and the support frame 10.

Among these, the leads 11a to 11d and 41a to 41d are used as stages (lead connection surfaces) on which the gyro devices 100a and 100b are mounted, and are connected to external connection terminals (that is, connected to the outside, It is a part used as a terminal used for power transmission / reception.
When the dam bars 13, 23, 33, 43 seal the gyro devices 100a, 100b mounted on the leads 11a-11d, 41a-41d with resin (for example, mold resin), the flow of the mold resin is stopped. This is a part for preventing the mold resin from spreading outside the dam bar. The dam bar 13 connects the leads 11a to 11d, the dam bar 23 connects the leads 21a to 21d, the dam bar 33 connects the leads 31a to 31d, and the dam bar 43 connects the leads 41a to 41d. And each dam bar 13,23,33,43 is connected so that the area | region in which gyro device 100a, 100b is located may be enclosed. The other leads 21a to 21d and 31a to 31d may be mounted although the gyro devices 100a and 100b are not mounted in this example.

  The support frame 10 is an outer frame of the lead frame 50 and is a part for supporting the leads 11a to 11d, 21a to 21d, 31a to 31d, 41a to 41d, and the dam bars 13, 23, 33, and 43. The support frame 10 is provided with a through-hole that can be used for alignment when the resin frame is set in a later step. Such a lead frame 50 is formed by, for example, etching a single copper plate or punching it using a mold, thereby leading the leads 11a to 11d, 21a to 21d, 31a to 31d, 41a to 41d, and the dam bars 13, 23, 33. 43 and the support frame 10 are integrally formed.

Next, the gyro device 100b in which the outer lead 101 is bent is connected to the leads 11a to 11d with the bending angle θ set to a substantially right angle. This connection is made between the connection surface 101a of the outer lead 101 and the upper surfaces of the leads 11a to 11d as lead connection surfaces, and they are electrically connected to each other.
Similarly, the outer leads 101 of the gyro device 100a are electrically connected to the leads 41a to 41d, respectively. As a result, the main surface of the vibration gyro element (not shown) of the gyro device 100a faces the Z direction in the drawing, and the main surface of the vibration gyro element (not shown) of the gyro device 100b faces the X direction of the drawing. That is, the respective vibration gyro elements (not shown) of the gyro devices 100a and 100b are in a positional relationship in which their main surfaces are substantially perpendicular. Note that soldering, a conductive adhesive, or the like can be used for the connection here.

Next, as shown in FIG. 7A, the lead frame 50 to which the gyro devices 100a and 100b are connected is disposed between the upper mold 51 and the lower mold 52, and the lead frame 50 is moved up and down (lead frame 50). Both dies (51, 52) are clamped to form a cavity 53 so as to be sandwiched from the front and back surfaces.
Then, for example, a mold resin is injected into the cavity 53 and cured. Thus, a resin package 54 as a third package is formed, and the gyro devices 100 a and 100 b are sealed in the resin package 54. At this time, the leads 11a to 11d, 21a to 21d, 31a to 31d, and 41a to 41d are configured to protrude from the resin package 54.

  Thereafter, both molds 51 and 52, in other words, the cavity 53 is opened, and the resin package 54 as the third package is taken out. Then, the dam bars 13, 23, 33, and 43 outside the resin package 54 are cut to separate the leads 11a to 11d, 21a to 21d, 31a to 31d, and 41a to 41d. Further, the leads 11a to 11d, 21a to 21d, 31a to 31d, and 41a to 41d are cut from the support frame 10 to separate the resin package 54 from the support frame 10. Thereby, each lead 11a-11d, 21a-21d, 31a-31d, 41a-41d becomes an independent external connection terminal, respectively, and the gyro sensor 60 is completed.

  According to the method for manufacturing the gyro sensor 60 of the first embodiment, the gyro device 100b in which the package 30 is housed in the second package 109 and the outer lead 101 is bent is replaced with the leads 11a to 11d formed on the lead frame 50. Connect to the lead connection surface. As described above, the gyro device 100b has another outer gyro device that overlaps in plan view because the outer lead 101 is bent at a substantially right angle and the relative position between the second package 109 and the outer lead 101 is changed. It becomes possible to arrange | position 100a in the position which does not overlap. This makes it possible to reduce the area occupied by the gyro devices 100a and 100b in a planar manner. That is, a small gyro sensor 60 can be provided.

  Further, in the gyro device 100b, the outer lead 101 is bent so that the angle formed between the main surface (A) of the vibrating gyro element 20 and the connection surfaces of the leads 11a to 11d is substantially a right angle. As described above, since the gyro device 100b having the outer lead 101 bent in advance is connected to the leads 11a to 11d, the angle formed between the leads 11a to 11d and the main surface (A) of the vibration gyro element 20 is approximately. The gyro device 100b having a right angle can be easily mounted on the lead frame 50.

  Further, in the gyro sensor 60, the main surface of the vibration gyro element (not shown) of the gyro device 100a is directed in the Z direction in the figure, and the main surface of the vibration gyro element (not shown) of the gyro device 100b is in the X direction in the figure. It will be. In other words, the vibrating gyro elements (not shown) of the gyro devices 100a and 100b have a substantially perpendicular positional relationship between the principal surfaces, and can detect angular velocities in two orthogonal directions.

(Second Embodiment)
A second embodiment of a gyro sensor as an example of a motion sensor according to the present invention will be described with reference to FIGS. 8 and 9 show a schematic configuration and manufacturing process of the gyro sensor according to the second embodiment. FIG. 8A is a plan view, FIG. 8B is a cross-sectional view along BB ′ in FIG. 9A is a cross-sectional view showing the molding process, and FIG. 9B is a cross-sectional view showing a schematic configuration of the gyro sensor.

  This example is a gyro sensor using three gyro devices 100a, 100b (1), 100b (2). Since the gyro devices 100a, 100b (1), 100b (2) used in this example are the same as those in the first embodiment, the same reference numerals are given and the description thereof is omitted. The same configuration as that of the first embodiment described above will be described using the same reference numerals, and description thereof may be omitted.

  First, as shown in FIGS. 8A and 8B, a lead frame 50 as a base substrate is prepared. The lead frame 50 includes, for example, a plurality of leads 11 a to 11 d, 21 a to 21 d, 31 a to 31 d, 41 a to 41 d, dam bars 13, 23, 33, 43, and the support frame 10.

  Among these, the leads 11a to 11d, 21a to 21d, and 41a to 41d are used as stages (lead connection surfaces) on which the gyro devices 100a, 100b (1), and 100b (2) are mounted, and are connected externally. It is a part used as a terminal (that is, a terminal connected to the outside and used for transmission and reception of signals and power). Here, the gyro device 100b (1) and the gyro device 100b (2) are separated from each other for convenience because the two gyro devices 100b described in the first embodiment are used, and the configuration is the same. . The dam bars 13, 23, 33, and 43 are the same as those in the first embodiment described above, and a description thereof is omitted. The leads 31a to 31d may be mounted although the gyro devices 100a and 100b are not mounted in this example.

  The support frame 10 and the lead frame 50 are the same as those in the first embodiment described above, and thus description thereof is omitted.

Next, the connection surfaces 101a of the gyro device 100b (1) in which the outer leads 101 are bent are electrically connected to the leads 11a to 11d, respectively, with the bending angle θ being a substantially right angle.
Similarly, the connection surfaces (not shown) of the gyro device 100b (2) in which the outer lead 101 is bent are electrically connected to the leads 21a to 21d, respectively, with the bending angle θ being a substantially right angle.
Similarly, the outer leads 101 of the gyro device 100a are electrically connected to the leads 41a to 41d, respectively.

  As a result, the main surface of the vibrating gyro element (not shown) of the gyro device 100a faces in the Z direction shown in the figure, and the main surface of the vibrating gyro element (not shown) of the gyro device 100b (1) faces in the X direction shown in the figure. Thus, the main surface of the vibrating gyro element (not shown) of the gyro device 100b (2) is directed in the Y direction shown in the figure. That is, the vibrating gyro elements (not shown) of the gyro devices 100a, 100b (1), 100b (2) are in a positional relationship in which their principal surfaces form a substantially right angle, in other words, three orthogonal axial directions. The positional relationship is facing Note that soldering, a conductive adhesive, or the like can be used for the connection here.

Next, as shown in FIG. 9A, the lead frame 50 to which the gyro devices 100a, 100b (1), 100b (2) are connected is disposed between the upper mold 51 and the lower mold 52, and the leads Both dies (51, 52) are clamped so as to sandwich the frame 50 from above and below (front and back surfaces of the lead frame 50), thereby forming a cavity 53.
Then, for example, a mold resin is injected into the cavity 53 and cured. Thus, a resin package 54 as a third package is formed, and the gyro devices 100a, 100b (1), 100b (2) are sealed in the resin package 54.

  Thereafter, both molds 51 and 52, in other words, the cavity 53 is opened, and the resin package 54 as the third package is taken out. Then, the dam bars 13, 23, 33, and 43 outside the resin package 54 are cut to separate the leads 11a to 11d, 21a to 21d, 31a to 31d, and 41a to 41d. Further, the leads 11a to 11d, 21a to 21d, 31a to 31d, and 41a to 41d are cut from the support frame 10 to separate the resin package 54 from the support frame 10. Thereby, each lead 11a-11d, 21a-21d, 31a-31d, 41a-41d becomes an independent external connection terminal, respectively, and the gyro sensor 70 is completed.

  According to the method of manufacturing the gyro sensor 70 of the second embodiment, the gyro devices 100b (1) and 100b (2) in which the outer leads 101 are bent are connected to the leads 11a to 11d and 41a to 41d formed on the lead frame 50. Connect to the lead connection surface. Further, the third gyro device 100a is connected to the leads 21a to 21d. As described above, the gyro devices 100b (1) and 100b (2) are planarly overlapped because the outer lead 101 is bent at a substantially right angle and the relative position between the second package 109 and the outer lead 101 is changed. It becomes possible to make the arrangement not to be. This makes it possible to reduce the area occupied by the gyro devices 100a and 100b in a planar manner. That is, a small gyro sensor 70 can be provided.

  Also, the gyro devices 100b (1) and 100b (2) are previously set so that the angle formed between the main surface (A) of the vibrating gyro element 20 and the connection surfaces of the leads 11a to 11d and 41a to 41d is substantially a right angle. The outer lead 101 is bent. As described above, since the gyro devices 100b (1) and 100b (2) having the outer leads 101 bent in advance are connected to the leads 11a to 11d and 41a to 41d, the leads 11a to 11d and 41a to 41d The gyro devices 100b (1) and 100b (2) having an angle formed with the main surface (A) of the vibrating gyro element 20 at a substantially right angle can be easily mounted on the lead frame 50.

  In addition, since the three gyro devices 100b (1), 100b (2), and 100a are housed so that their main surfaces form a substantially right angle relationship with each other, detection in three orthogonal directions can be performed. A possible gyro sensor 70 can be provided.

(Third embodiment)
A third embodiment of a gyro sensor as an example of a motion sensor according to the present invention will be described with reference to FIG. FIG. 10 shows a schematic configuration of the gyro sensor of the third embodiment, where (a) is a plan view and (b) is a cross-sectional view along CC ′ of (a).

  This example is a gyro sensor that uses three gyro devices 100a, 100b (1), and 100b (2), and uses a ceramic package as a base substrate and a third package. Since the gyro devices 100a, 100b (1), 100b (2) used in this example are the same as those in the first embodiment, the same reference numerals are given and the description thereof is omitted.

  First, a package 64 as a third package that accommodates the three gyro devices 100a, 100b (1), 100b (2) is prepared. The package 64 is formed of ceramic or the like, for example, and has a recess surrounded by an outer frame portion 61 at the center, and a metal wiring portion (not shown) as a lead connection surface is formed on the bottom 62 of the recess. Has been. Thus, the bottom 62 of the recess has a function as a base substrate.

Next, the three gyro devices 100 a, 100 b (1), 100 b (2) are connected to the bottom 62 of the package 64. First, the gyro device 100a is connected to the bottom 62 (lead connection surface). The gyro device 100a bends the outer lead 101 so that the main surface of a vibration gyro element (not shown) faces the bottom 62 (Z direction in the drawing), and connects the connection surface of the outer lead 101 to a metal wiring portion (not shown). Next, the gyro device 100 b (1) is connected to the bottom 62. The gyro device 100b (1) connects the connection surface of the outer lead 101 to a metal wiring portion (not shown) so that the main surface of a vibration gyro element (not shown) faces the X direction in the drawing. Next, the gyro device 100 b (2) is connected to the bottom 62. The gyro device 100b (2) connects the connection surface of the outer lead 101 to a metal wiring portion (not shown) so that the main surface of a vibration gyro element (not shown) faces the Y direction in the drawing. As a result, the vibration gyro elements (not shown) of the gyro devices 100a, 100b (1), 100b (2) are in a positional relationship in which their main surfaces form a substantially right angle, in other words, in the three axial directions orthogonal to each other. The positional relationship is facing
In this example, the connection order in which the gyro device 100a is connected first is described. However, the connection order is not limited to this, and other connection orders may be used. For the connection here, soldering, conductive adhesive, or the like can be used.

  Next, the lid 63 is joined to the upper surface of the package 64 by a joining member (not shown) in a reduced pressure state (vacuum state), and the inside of the recess of the package 64 is hermetically sealed. As a result, a gyro sensor 65 as shown in FIG. 10B can be obtained.

  According to the above-described third embodiment, there are three gyro devices 100a, 100b (1), 100b (2) housed in a single package 64 so that their main surfaces are substantially perpendicular to each other. It becomes possible to easily form the gyro sensor 65. The gyro sensor 65 includes three gyro devices 100a, 100b (1), 100b (2) that are housed so that their main surfaces are in a substantially right angle relationship with each other. The direction can be detected.

(Fourth embodiment)
A fourth embodiment of a gyro sensor as an example of a motion sensor according to the present invention will be described with reference to FIG. 11A and 11B show a schematic configuration and a manufacturing process of the gyro sensor according to the fourth embodiment. FIG. 11A is a plan view, FIG. 11B is a sectional view taken along line BB ′ in FIG. 11D is a cross-sectional view taken along line BB ′ of FIG. 11C, FIG. 11E is a plan view, FIG. 11F is a cross-sectional view taken along line BB ′ of FIG. 11E, and FIG. It is front sectional drawing which shows a cavity part.

  This example is a gyro sensor using two gyro devices 100a. Since the gyro device 100a used in this example is the same as that of the first embodiment described above, the same reference numerals are given and description thereof is omitted. The same configuration as that of the first embodiment described above will be described using the same reference numerals, and description thereof may be omitted.

  First, as shown in FIGS. 11A and 11B, a lead frame 50 as a base substrate is prepared. The lead frame 50 includes, for example, a plurality of leads 11a to 11d, 21a to 21c, 31a to 31c, 41a to 41d, dam bars 13, 23, 33, and 43, and a support frame 10.

  Among these, the leads 11a to 11d and 41a to 41d are used as a stage (lead connection surface) on which the gyro devices 100a ′ and 100a are mounted, and are connected to external connection terminals (that is, connected to the outside to generate signals). And a terminal used for transmitting and receiving power). The dam bars 13, 23, 33, and 43 are the same as those in the first embodiment described above, and a description thereof is omitted. The leads 21a to 21c and 31a to 31c may be mounted although the gyro device 100a is not mounted in this example.

  The support frame 10 and the lead frame 50 are the same as those in the first embodiment described above, and thus description thereof is omitted.

Next, as shown in FIGS. 11A and 11B, the outer leads 101 of the gyro device 100a are electrically connected to the leads 11a to 11d, respectively.
Next, as shown in FIGS. 11C and 11D, the outer leads 101 of the connected gyro device 100 a are substantially perpendicular with respect to one reference plane (any one of the front and back surfaces) of the lead frame 50. To cause the gyro device 100a. The induced gyro device is referred to as a gyro device 100a ′.
Thus, since the outer lead 101 is bent after being connected, it is possible to bend including variations in the connection state at the time of connection (cancellation of variations), and bending with less angle variation can be performed.
Next, as shown in FIGS. 11E and 11F, the outer leads 101 of the second gyro device 100a are electrically connected to the leads 41a to 41d, respectively.
For connecting the leads 11a to 11d, 41a to 41d and the outer lead 101, soldering, conductive adhesive, or the like can be used.

  As a result, the main surface of the vibration gyro element (not shown) of the gyro device 100a ′ is directed in the X direction in the figure, and the main surface of the vibration gyro element (not shown) of the gyro device 100a is in the Z direction in the figure. . In other words, the vibrating gyro elements (not shown) of the gyro devices 100a 'and 100a have a positional relationship in which the main surfaces are substantially perpendicular.

Next, as shown in FIG. 11G, the lead frame 50 to which the gyro devices 100a ′ and 100a are connected is disposed between the upper mold 51 and the lower mold 52, and the lead frame 50 is moved up and down (lead frame). The molds (51, 52) are clamped so as to be sandwiched from the front and back surfaces of 50, thereby forming the cavity 53.
Then, for example, a mold resin is injected into the cavity 53 and cured. Thus, a resin package as a third package is formed, and the gyro devices 100a ′ and 100a are sealed in the resin package.

  Thereafter, both molds 51, 52, in other words, the cavity 53 is opened and a resin package (not shown) as a third package cured is taken out. Thereafter, the gyro sensor is completed through cutting of the dam bars 13, 23, 33, 43, etc., but since this step is the same as that of the first embodiment, description thereof is omitted here.

  According to the gyro sensor manufacturing method of the fourth embodiment, the outer lead 101 of the gyro device 100a connected to the leads 11a to 11d formed on the lead frame 50 is bent at a substantially right angle to form a gyro device 100a '. Thereafter, another gyro device 100a is connected to the leads 41a to 41d. This makes it possible to dispose another gyro device 100a that overlaps the plane in a conventional manner at a position that does not overlap the gyro device 100a '. Thereby, it is possible to reduce the area occupied by the gyro devices 100a 'and 100a in a plane. That is, a small gyro sensor can be provided.

  Further, since the gyro device 100a ′ bends the outer lead 101 after being connected to the leads 11a to 11d, the gyro device 100a ′ can be bent in consideration of variations in the connection state at the time of connection, and the variation in bending angle can be reduced. Is possible.

  Further, in the gyro sensor of the fourth embodiment, the principal surfaces of the vibrating gyro elements (not shown) of the gyro device 100a ′ and the gyro device 100a are substantially perpendicular to each other, and the angular velocities in two directions orthogonal to each other. Can be detected.

  Note that one reference surface of the lead frame 50 is desirably a connection surface of the outer lead when the outer lead is connected to another substrate or the like later. Accordingly, since the bending and attachment (connection) of the gyro sensor can be performed with the connection surface of the outer lead as the same reference, a more accurate and less perpendicular bending angle can be obtained.

(Fifth embodiment)
5th Embodiment of the gyro sensor as an example of the motion sensor concerning this invention is described using FIG. 12 and FIG. 12 and 13 show the schematic configuration and manufacturing process of the gyro sensor of the fifth embodiment. 12 (a) is a plan view, FIG. 12 (b) is a cross-sectional view along BB ′ in FIG. 12 (a), FIG. 12 (c) is a plan view, and FIG. 12 (d) is a cross-sectional view along BB ′ in FIG. FIG. 12 (e) is a plan view, and FIG. 12 (f) is a cross-sectional view taken along the line BB 'of FIG. 12 (e). 13 (g) is a plan view, FIG. 13 (h) is a cross-sectional view taken along line BB ′ of FIG. 13 (g), FIG. 13 (i) is a plan view, and FIG. 13 (j) is a line BB of (i). 'Cross sectional view, FIG. 13 (k) is a front sectional view showing a cavity portion.

  This example is a gyro sensor using three gyro devices 100a. Since the gyro device 100a used in this example is the same as that of the first embodiment described above, the same reference numerals are given and description thereof is omitted. Further, the gyro device 100c is different only in the protruding position of the outer lead, and the other configuration is the same as that of the first embodiment described above, and thus the description thereof is omitted. The same configuration as that of the first embodiment described above will be described using the same reference numerals, and description thereof may be omitted.

  First, as shown in FIGS. 12A and 12B, a lead frame 50 as a base substrate is prepared. The lead frame 50 includes, for example, a plurality of leads 11 a to 11 d, 21 a to 21 d, 31 a to 31 c, 41 a to 41 c, dam bars 13, 23, 33, 43, and the support frame 10.

  Among these, the leads 11a to 11d, 21a to 21d, and 31a to 31c are used as stages (lead connection surfaces) on which the gyro devices 100a (1), 100a (2), and 100c are mounted, and are connected externally. It is a part used as a terminal (that is, a terminal connected to the outside and used for transmission and reception of signals and power). Here, since the gyro device 100a (1) and the gyro device 100a (2) use the two gyro devices 100a described in the first embodiment, the symbols are divided into (1) and (2) for convenience. The configuration is the same. The dam bars 13, 23, 33, and 43 are the same as those in the first embodiment described above, and a description thereof is omitted. The leads 41a to 41c are not mounted with the gyro devices 100a (1), 100a (2), and 100c in this example, but other devices may be mounted.

  The support frame 10 and the lead frame 50 are the same as those in the first embodiment described above, and thus description thereof is omitted.

Next, as shown in FIGS. 12A and 12B, the outer leads 101 of the gyro device 100a (1) are electrically connected to the leads 11a to 11d, respectively.
Next, as shown in FIGS. 12C and 12D, the outer lead 101 of the connected gyro device 100 a (1) is referenced to one reference surface (any one of the front and back surfaces) of the lead frame 50. Are bent at substantially right angles to cause the gyro device 100a (1). The induced gyro device is referred to as gyro device 100a ′ (1).
Next, as shown in FIGS. 12E and 12F, the outer leads 101 of the second gyro device 100a (2) are electrically connected to the leads 21a to 21d, respectively.

Next, as shown in FIGS. 13G and 13H, the outer lead 101 of the connected gyro device 100a (2) is referenced to one reference surface (any one of the front and back surfaces) of the lead frame 50. As a result, the gyro device 100a (2) is formed. The induced gyro device is referred to as gyro device 100a ′ (2).
In the gyro device 100a ′ (1) and the gyro device 100a ′ (2), since the outer lead 101 is bent after being connected, it is possible to bend including variations in the connection state at the time of connection, resulting in angular variations. Can be bent with less.
Next, as shown in FIGS. 13I and 13J, the outer leads 101 of the gyro device 100c are electrically connected to the leads 31a to 31c, respectively.
For connecting the leads 11a to 11d, 31a to 31c, 41a to 41d and the outer lead 101, soldering, a conductive adhesive, or the like can be used.

  Thereby, the main surface of the vibration gyro element (not shown) of the gyro device 100a ′ (1) is directed in the X direction in the figure, and the main surface of the vibration gyro element (not shown) of the gyro device 100a ′ (2) is shown in the figure. The main surface of the vibrating gyro element (not shown) of the gyro device 100c is oriented in the Z direction shown in the figure. That is, the vibrating gyro elements (not shown) of the gyro devices 100a ′ (1), 100a ′ (2), and 100c are in a positional relationship in which their principal surfaces form a substantially right angle, in other words, 3 orthogonal. The positional relationship is directed in the axial direction.

Next, as shown in FIG. 13 (k), the lead frame 50 to which the gyro devices 100a ′ (1), 100a ′ (2), and 100c are connected is disposed between the upper mold 51 and the lower mold 52. Then, the molds (51, 52) are clamped so as to sandwich the lead frame 50 from above and below (front and back surfaces of the lead frame 50), thereby forming the cavity 53.
Then, for example, a mold resin is injected into the cavity 53 and cured. As a result, a resin package as a third package is formed, and the gyro devices 100a ′ (1), 100a ′ (2), and 100c are sealed in the resin package.

  Thereafter, both molds (51, 52) (cavity 53) are opened and a cured resin package (not shown) is taken out. Thereafter, the gyro sensor is completed through cutting of the dam bars 13, 23, 33, 43, etc., but since this step is the same as that of the first embodiment, description thereof is omitted here.

According to the gyro sensor manufacturing method of the fifth embodiment, the outer lead 101 of the gyro device 100a (1) connected to the leads 11a to 11d formed on the lead frame 50 is bent at a substantially right angle. Further, the outer lead 101 of the gyro device 100a (2) connected to the leads 21a to 21d is bent at a substantially right angle. Thereafter, another gyro device 100c is connected to the leads 41a to 41c.
This makes it possible to arrange the gyro devices 100a (1), 100a (2), and 100c, which conventionally overlap in a plane, at positions where they do not overlap. As a result, the area occupied by the gyro devices 100a (1), 100a (2), and 100c in a plane can be reduced. That is, a small gyro sensor can be provided.

  Further, since the gyro devices 100a (1) and 100a (2) bend the outer lead 101 after being connected to the leads 11a to 11d and 21a to 21d, the bending is performed in consideration of variations in the connection state at the time of connection. Thus, the bending angle variation can be reduced.

  In addition, the gyro sensor of the fifth embodiment has three gyro devices 100a (1), 100a (2), and 100c that are housed so that their principal surfaces form a substantially right angle relationship with each other. , Detection in three orthogonal directions is possible.

  Note that one reference surface of the lead frame 50 is desirably a connection surface of the outer lead when the outer lead is connected to another substrate or the like later. Accordingly, since the bending and attachment (connection) of the gyro sensor can be performed with the connection surface of the outer lead as the same reference, a more accurate and less perpendicular bending angle can be obtained.

(Sixth embodiment)
A sixth embodiment of a gyro sensor as an example of a motion sensor according to the present invention will be described with reference to FIG. FIG. 14 shows a schematic configuration and a manufacturing process of the gyro sensor of the sixth embodiment. 14A is a plan view showing a state where the gyro device is connected, FIG. 14B is a side view of FIG. 14A, and FIG. 14C is a plan view showing a state where the lead of the gyro device is bent. FIG.14 (d) is a side view of (c).

  This example is a gyro sensor using two gyro devices 100a (1) and 100a (2) and using a ceramic substrate as a base substrate. Note that the gyro devices 100a (1) and 100a (2) used in this example are the same as those in the first embodiment described above, and thus the same reference numerals are given and description thereof is omitted.

First, as shown in FIGS. 14A and 14B, a ceramic substrate 81 is prepared as a base substrate on which two gyro devices 100a (1) and 100a (2) are mounted. On the one surface of the ceramic substrate 81, a metal wiring portion (circuit pattern) (not shown) is formed. The metal wiring portion fixes and fixes the devices such as the gyro devices 100a (1), 100a (2), and other circuit elements to the ceramic substrate 81, and electrically connects the respective devices. It is provided to take.
Next, the gyro devices 100 a (1) and 100 a (2) are connected to the ceramic substrate 81. First, the outer lead 101 is connected to the connecting portion 82 (lead connecting surface) of the metal wiring portion so that the main surface (not shown) of the gyro device 100a (1) and the connecting surface of the ceramic substrate 81 are in a substantially parallel positional relationship. For example, it connects by soldering.

Further, the gyro device 100 a (2) is connected to the ceramic substrate 81. In the gyro device 100a (2), the main surface (not shown) of the gyro device 100a (2) and the connection surface of the ceramic substrate 81 have a substantially parallel positional relationship, and the outer leads 101 of the gyro device 100a (1) extend. The direction and the outer lead 101 of the gyro device 100a (2) are arranged so as to have a substantially right-angle positional relationship. In this connection, similarly to the gyro device 100a (1), for example, the connection is performed by soldering.
The outer leads 101 of the gyro devices 100a (1) and 100a (2) can be connected with a conductive adhesive or the like.

Next, as shown in FIGS. 14C and 14D, the outer leads 101 of the connected gyro devices 100 a (1) and 100 (2) are connected to one reference surface (front and back surfaces) of the ceramic substrate 81. The gyro devices 100a (1) and 100a (2) are caused to bend with respect to any one surface) so that the bending angle θ is substantially a right angle. The induced gyro devices are assumed to be gyro devices 100a ′ (1) and 100a ′ (2).
As a result, the gyro sensor 80 is formed.

In this example, the connection order in which the gyro device 100a (1) is connected first is described. However, the connection order is not limited to this, and the gyro device 100a (2) may be connected first.
In the gyro device 100a ′ (1) and the gyro device 100a ′ (2), since the outer lead 101 is bent after being connected to the ceramic substrate 81, it is possible to bend including variations in the connection state at the time of connection. Thus, bending can be performed with little angle variation.
In addition, the angles formed by the principal surfaces (not shown) of the raised gyro device 100a ′ (1) and the gyro device 100a ′ (2) are substantially perpendicular to each other. Thereby, the gyro sensor 80 of the sixth embodiment can detect angular velocities in two orthogonal directions.

  As described above, according to the manufacturing method of the gyro sensor 80 of the sixth embodiment, the outer leads 101 of the gyro device 100a (1) are bent after being connected to the leads 11a to 11d, so that the connection state at the time of connection is changed. Bending can be performed taking into account variations and the like, and bending angle variations can be reduced.

  In the gyro sensor of the sixth embodiment, the principal surfaces of the vibrating gyro elements (not shown) of the gyro device 100a (1) and the gyro device 100a (2) are substantially perpendicular to each other, and are orthogonal to each other. It is possible to detect angular velocities in two directions.

  In addition, although the gyro sensor demonstrated in the above-mentioned 1st-6th embodiment demonstrated by the structure which connects only a gyro device to a base substrate, it is not restricted to this. For example, in addition to the gyro device, a circuit unit having at least a function of driving the gyro device may be mounted (connected). According to the gyro sensor having such a configuration, it is possible to provide a compact gyro sensor in which the gyro device and the circuit unit are accommodated in one package. This can contribute to the realization of a compact electronic device.

  In the first to sixth embodiments described above, the gyro sensor using the gyro device as the motion sensor has been described as an example. However, the present invention is not limited to this. The motion sensor may be a pressure sensor using a pressure detection device, an acceleration sensor using an acceleration detection device, or the like.

  In the above description of the first to sixth embodiments, the positional relationship of the main surface of each vibration gyro element has been described. However, the positional relationship between the main surface of each vibration gyro element and the outer surface of each second package (for example, If the main surface of the vibration gyro element and the outer bottom surface of the second package are in a horizontal relationship, for example, the positional relationship between the outer surfaces of the respective second packages can be replaced.

  DESCRIPTION OF SYMBOLS 10 ... Support frame, 11a-11d, 21a-21d, 31a-31d, 41a-41d ... Lead, 13, 23, 33, 43 ... Dam bar, 20 ... Vibrating gyro element as sensor element, 30 ... Package, 32 ... Case 50, lead frame, 51 ... upper mold, 52 ... lower mold, 53 ... cavity, 54 ... resin package as third package, 60, 65 ... gyro sensor as motion sensor, 100a, 100a (1 ), 100a (2), 100b, 100b (1), 100b (2), 100c ... gyro device, 101 ... outer lead, 101a ... connection surface, 109 ... second package.

Claims (12)

A method of manufacturing a motion sensor having a plurality of sensor elements,
(A) preparing a plurality of packages containing the sensor elements;
(B) individually connecting the plurality of packages to a plurality of lead frames;
(C) bending a lead portion of at least one lead frame of the plurality of lead frames;
(D) connecting the leads of the plurality of lead frames to lead connection surfaces of the base substrate;
(E) sealing the plurality of packages such that a part of the leads of the base substrate protrudes;
The manufacturing method of the motion sensor characterized by including. In the manufacturing method of the motion sensor according to claim 1,
In the step (c),
A method of manufacturing a motion sensor, wherein the lead of the lead frame is bent so that a main surface of the sensor element and a lead of the lead frame are substantially perpendicular to each other. In the manufacturing method of the motion sensor of Claim 1,
In the step (d),
A method for manufacturing a motion sensor, wherein a main surface of at least one of the plurality of sensor elements is connected to be parallel to the connection surface of the base substrate. In the manufacturing method of the motion sensor according to any one of claims 1 to 3,
In the step (d),
A method of manufacturing a motion sensor, comprising: connecting the lead frame to the base substrate so that main surfaces of the plurality of sensor elements are substantially perpendicular to each other. A method of manufacturing a motion sensor having a plurality of sensor elements,
(A) preparing a plurality of packages containing the sensor elements;
(B) a step of individually connecting a plurality of packages to a plurality of lead frames in the previous period;
(C) connecting the leads of the plurality of lead frames to the connection surfaces of the leads of the base substrate;
(D) bending at least one lead frame lead of the plurality of lead frames to cause the package; and (e) sealing the plurality of packages so that a part of the lead of the base substrate protrudes. A process of stopping,
The manufacturing method of the motion sensor characterized by including. In the manufacturing method of the motion sensor according to claim 5,
In the step (d),
A method of manufacturing a motion sensor, characterized in that the lead is bent so that the lead angle of the package is substantially perpendicular to the connecting surface of the lead and the main surface of the sensor element. In the manufacturing method of the motion sensor of Claim 5 or Claim 6,
In the step (d),
A method of manufacturing a motion sensor, wherein the leads are bent so that main surfaces of the plurality of sensor elements form a substantially right angle relationship with each other. A motion sensor having a plurality of sensor elements,
A plurality of packages containing the sensor elements;
A plurality of lead frames in which the plurality of packages are individually connected;
A base substrate to which the plurality of lead frames are connected;
A sealing material for sealing the base substrate,
A motion sensor, wherein a lead of at least one lead frame of the plurality of lead frames is bent. The motion sensor according to claim 8,
The motion sensor according to claim 1, wherein the at least one bent lead frame is bent so that a main surface of the sensor element and a lead of the lead frame are substantially perpendicular to each other. The motion sensor according to claim 8, wherein
A motion sensor, wherein a main surface of at least one of the plurality of sensor elements is parallel to a connection surface of the base substrate. The motion sensor according to any one of claims 8 to 10,
In the plurality of sensor elements, a main surface of each of the sensor elements is substantially perpendicular to each other. The motion sensor according to any one of claims 8 to 11,
A motion sensor, further comprising a circuit unit for driving the plurality of sensor elements.

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