CN102735228B - Sensor assembly, sensor component and manufacture method thereof and electronic equipment - Google Patents

Sensor assembly, sensor component and manufacture method thereof and electronic equipment Download PDF

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Publication number
CN102735228B
CN102735228B CN201210090767.9A CN201210090767A CN102735228B CN 102735228 B CN102735228 B CN 102735228B CN 201210090767 A CN201210090767 A CN 201210090767A CN 102735228 B CN102735228 B CN 102735228B
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CN
China
Prior art keywords
chip
sensor
support component
supporting surface
sensor assembly
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Expired - Fee Related
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CN201210090767.9A
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Chinese (zh)
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CN102735228A (en
Inventor
小山裕吾
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Seiko Epson Corp
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Seiko Epson Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0074—3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
    • G01C19/5621—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks the devices involving a micromechanical structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3192—Multilayer coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/025—Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Abstract

The invention provides the deterioration the sensor assembly realizing slimming, sensor component and manufacture method thereof and electronic equipment that can suppress examine repair.Sensor assembly has support component, IC chip and has the gyrotron element of connecting electrode, and support component has: the 1st plane; 2nd plane, it is connected with the 1st plane orthogonal; 3rd plane, it is connected with the 1st plane and the 2nd plane orthogonal; And the 4th plane, it is relative with the 1st plane, and as being installed to the installed surface of external component, 1st plane has the supporting surface from the 1st planar recess, IC chip has splicing ear in active face side, and the inactive face side along active face is installed on each face of support component respectively, and gyrotron element is configured in the active face side of IC chip, and with interarea respectively along the mode in each face of support component, connecting electrode is installed on the splicing ear of IC chip.

Description

Sensor assembly, sensor component and manufacture method thereof and electronic equipment
Technical field
The present invention relates to sensor assembly, there is the sensor component of sensor assembly, the manufacture method of sensor component and there is the electronic equipment of sensor assembly.
Background technology
In the past, acceleration or angular velocity etc. are being sensed in the sensor component of (detection), be known to the mode adopting sensor assembly, this sensor assembly has sensor element and possesses the circuit component to the function that this sensor element drives, and the inscape comprising sensor element and circuit component is installed on the support component of rectangular shape.
Such as, Patent Document 1 discloses a kind of sensor unit (Fig. 7 with reference to patent documentation 1), 3 fibre optic gyroscopes (FOG) as sensor assembly are arranged on orthogonal 3 faces of the mounting blocks of rectangular shape by this sensor unit respectively, and this fibre optic gyroscope has the optics portion as sensor element and the electronic circuit portion as circuit component.
[patent documentation 1] Japanese Unexamined Patent Publication 2000-121369 publication (Fig. 7)
3 fibre optic gyroscopes of the sensor assembly (hereinafter referred to as described sensor assembly) of patent documentation 1 are installed on orthogonal 3 faces of the mounting blocks (below mounting blocks being called support component) of rectangular shape respectively.Further, the state that the part that described sensor assembly is installed into each fibre optic gyroscope is given prominence to from each installed surface.
Further, the face (opposite face) relative with 1 face in described 3 faces do not had in gyrostatic of installing optical fibres of described sensor assembly, is installed on the installed surface of the external components such as electronic equipment.
In recent years, surging along with what require the small-sized slimming of electronic equipment, inner have the various devices such as the sensor component of described sensor assembly for being installed on, being also strongly required can flattening (slimming).
But, the state that the part that described sensor assembly is installed into each fibre optic gyroscope (hereinafter referred to as sensor element and circuit component) is given prominence to from each installed surface of support component, thus support component correspondingly increases this outstanding amount apart from the height of opposite face (being installed to the installed surface of the external components such as electronic equipment), there is the problem hindering the slimming of sensor component.
Improvement measure as the problems referred to above can consider following structure, rectangular shape (block-shaped) is not adopted to support component, such as, the flat board at top view being L-shaped is made the shape vertically turned up in the midway of the part extended from the bend of L word to all directions, the plane of the bend of L word installs each sensor element and circuit component with turning up in plane partly.
But in said structure, the rigid phase turning up part of support component dies down than during rectangular shape, thus there is the such as easy problem vibrating (displacement) because of external force.
As a result, in said structure, likely decline at the examine repair such as accuracy of detection, detection sensitivity turning up each sensor element that the plane of part is installed of support component.
Summary of the invention
The present invention, just in order to solve completing at least partially in above-mentioned problem, can be used as and realize with under type or application examples.
[application examples 1] should the feature of sensor assembly of use-case be, this sensor assembly has: support component, it has parallel with the 1st reference plane and is configured at the 1st supporting surface in pit, is provided with the support component base portion of described 1st supporting surface, gives prominence to and comprise the sidewall portion of the side of described pit and 2nd supporting surface parallel with the 2nd reference plane from described support component base portion, described 2nd reference plane is vertical or inclination relative to described 1st reference plane, and described 2nd supporting surface is configured to cross over described support component base portion and described sidewall portion, 1st IC chip, it is installed in described 1st supporting surface, has the 1st splicing ear in one side side, and the another side side along this one side is the installed surface being installed to described 1st supporting surface, 2nd IC chip, it is installed in described 2nd supporting surface, has the 2nd splicing ear in one side side, and the another side side along this one side is the installed surface being installed to described 2nd supporting surface, 1st sensor element, its described one side side being configured in described 1st IC chip makes interarea along this one side, and has the 1st connecting electrode being installed in described 1st splicing ear, and the 2nd sensor element, it is configured in the described one side side of described 2nd IC chip, make interarea along this one side, and there is the 2nd connecting electrode being installed in described 2nd splicing ear, on the thickness direction of described 2nd sensor element, the gauge of described support component base portion is greater than the gauge in described sidewall portion, erection space between described 2nd IC chip and described support component base portion is greater than the erection space between described sidewall portion, when observing from the direction vertical with the interarea of described 2nd sensor element, described 2nd sensor element overlapping with described support component base portion at least partially.
Thus, sensor assembly is separately installed with the 1st IC chip and the 2nd IC chip on the mutually vertical of support component or the 1st supporting surface tilted and the 2nd supporting surface, is separately installed with the 1st sensor element and the 2nd sensor element in the one side side of the 1st IC chip and the 2nd IC chip.
Now, the interarea that sensor assembly is installed into the 1st sensor element and the 2nd sensor element is along the one side of the 1st IC chip and the 2nd IC chip, therefore, such as, by being accommodated in the inside of an encapsulation, the sensor component corresponding with two axles of at least different directions from each other can be provided.
At this, in sensor assembly, 1st supporting surface of support component is configured in pit, therefore, such as using the opposite face of the 1st supporting surface in support component as when being installed to the installed surface of external component, compare the existing structure of patent documentation 1, the height step-down (flattening) from the installed surface to the 1st sensor element being installed to external component can be made.
Thus, sensor assembly can contribute to the slimming of the sensor component receiving sensor assembly.
In addition, in sensor assembly, 2nd supporting surface of support component is configured to cross over support component base portion and sidewall portion, the gauge of support component base portion is greater than the gauge in sidewall portion, erection space between 2nd IC chip and support component base portion is greater than the erection space between sidewall portion, the 2nd sensor element overlapping with support component base portion at least partially.
Result, in sensor assembly, even if be subject to the physical shock from outside at the support component base portion thicker than sidewall portion, also be difficult to produce unnecessary vibration, thus can reduce the harmful effect to the 2nd sensor element, the 2nd sensor element is installed on the 2nd larger IC chip of erection space between support component base portion.
[application examples 2] in the sensor assembly of above-mentioned application examples, the depth dimensions of preferred described pit be from described 1st supporting surface to the height dimension of described 1st sensor element more than.
Thus, in sensor assembly, the depth dimensions of pit be from the 1st supporting surface to the height dimension of the 1st sensor element more than.
Therefore, sensor assembly can make the installed surface (described opposite face) being installed to external component from support component identical with the height of support component monomer to the height of the 1st sensor element.
Now, in sensor assembly, if make pit to the depth dimensions of the 1st supporting surface of support component with close to the height dimension of the 1st sensor element from the 1st supporting surface, then the rigidity of the support component that the 1st supporting surface by arranging depression can be produced declines and is suppressed to Min..
And, in sensor assembly, if pit significantly exceedes the state from the 1st supporting surface to the height dimension of sensor element to the depth dimensions of the 1st supporting surface of support component, even such as when the 1st sensor element or the 1st IC chip attach have other parts, the state making the height of sensor assembly identical with the height of support component monomer also can be kept.
[application examples 3], in the sensor assembly of above-mentioned application examples, at least one party preferably in described 1st IC chip and the 2nd IC chip has external connection terminals in described one side side, and described external connection terminals is provided with flexible circuit board.
Thus, in sensor assembly, at least one party in 1st IC chip and the 2nd IC chip has external connection terminals in one side side, at external connection terminals, flexible circuit board is installed, thus regardless of the posture of IC chip, flexible circuit board can both be bent and partly become horizontality.
Therefore, sensor assembly easily can carry out the connection with external components such as such as encapsulating by the flexible circuit board of horizontality.
[application examples 4] is in the sensor assembly of above-mentioned application examples, preferably at described flexible circuit board with on the face of described 1st IC chip and the 2nd IC chip side opposition side, when overlooking from being installed to the installation region of described external connection terminals in the scope of end exceeding described 1st IC chip and the 2nd IC chip, be provided with the rib of the rigidity improving described flexible circuit board.
Thus, in sensor assembly, at flexible circuit board with on the face of the 1st IC chip and the 2nd IC chip side opposition side, when overlooking from being installed to the installation region of external connection terminals of the 1st IC chip and the 2nd IC chip in the scope of the end more than the 1st IC chip and the 2nd IC chip, be provided with the rib of the rigidity improving flexible circuit board.
Therefore, in sensor assembly, at flexible circuit board from being installed to the installation region of external connection terminals of the 1st IC chip and the 2nd IC chip in the scope of the end more than the 1st IC chip and the 2nd IC chip, rigidity is improved.
Result, to when the external component sensor installation module such as such as to encapsulate, not easily produce the contact of the end of wiring pattern and the 1st IC chip and the 2nd IC chip formed due to the bending of flexible circuit board, the short circuit of flexible circuit board and the 1st IC chip and the 2nd IC chip can be avoided.
[application examples 5], in the sensor assembly of above-mentioned application examples, the described rib of preferred described flexible circuit board contains metal.
Thus, in sensor assembly, the rib of flexible circuit board contains metal, thus such as can remaining in above-mentioned scope by making a part for the metal covering film of the wiring of flexible circuit board (be Copper Foil as an example), forming rib.
Therefore, sensor assembly reasonably can arrange the rib of flexible circuit board.
[application examples 6], in the sensor assembly of above-mentioned application examples, preferably described 1st splicing ear of described 1st IC chip and the 2nd IC chip and the 2nd splicing ear are the projected electrodes gone out to a described pleurapophysis.
Thus, in sensor assembly, the splicing ear of the 1st IC chip and the 2nd IC chip is the projected electrode gone out to a pleurapophysis, thus gap can be set between the 1st sensor element and the 2nd sensor element and the 1st IC chip and the 2nd IC chip, reliably can avoid the contact of the 1st sensor element and the 2nd sensor element and the 1st IC chip and the 2nd IC chip.
Therefore, sensor assembly stably can drive the 1st sensor element and the 2nd sensor element.
[application examples 7], in the sensor assembly of above-mentioned application examples, at least one party preferably in described 1st supporting surface and described 2nd supporting surface is provided with recess.
Thus, in sensor assembly, at least one party in the 1st supporting surface and the 2nd supporting surface is provided with recess, thus by being configured in recess by least one party in the 1st IC chip and the 2nd IC chip, at least one party in the 1st IC chip and the 2nd IC chip can be arranged on accurately the precalculated position in each face.
[application examples 8] should the feature of sensor component of use-case be, this sensor component has: the sensor assembly described in any example in above-mentioned application examples; And receive the encapsulation of described sensor assembly, described sensor assembly is incorporated in described encapsulation.
Thus, in sensor component, in encapsulation, be accommodated with the sensor assembly described in any example in above-mentioned application examples, thus the sensor component of the effect described in any example played in above-mentioned application examples can be provided.
[application examples 9] should the feature of electronic equipment of use-case be, this electronic equipment has the sensor assembly described in any example in above-mentioned application examples.
Thus, electronic equipment has the sensor assembly described in any example in above-mentioned application examples, thus can provide the electronic equipment of the effect described in any example played in above-mentioned application examples.
[application examples 10] should the feature of manufacture method of sensor component of use-case be, this manufacture method comprises following operation: prepare support component, this support component has and 1st supporting surface that be configured at pit in and with 2nd reference plane parallel 2nd supporting surface parallel with the 1st reference plane, and described 2nd reference plane is vertical or tilt relative to described 1st reference plane; Prepare the 1st IC chip and the 2nd IC chip, described 1st IC chip has the 1st splicing ear and external connection terminals in one side side, another side side along this one side is the installed surface being installed to described 1st supporting surface, described 2nd IC chip has the 2nd splicing ear and external connection terminals in one side side, and the another side side along this one side is the installed surface being installed to described 2nd supporting surface; Prepare the 1st sensor element and the 2nd sensor element, described 1st sensor element has the 1st connecting electrode, and described 2nd sensor element has the 2nd connecting electrode; Prepare multiple flexible circuit board, flexible circuit board with on the face of described 1st IC chip and the 2nd IC chip side opposition side described at least one, when overlooking from being installed to the installation region of described external connection terminals of described 1st IC chip and the 2nd IC chip in the scope of end exceeding described 1st IC chip and the 2nd IC chip, be provided with the rib improving rigidity; Prepare the encapsulation of each inscape of storage; The described external connection terminals of described 1st IC chip and the 2nd IC chip installs described flexible circuit board respectively; Described 1st sensor element and the 2nd sensor element is configured in the described one side side of described 1st IC chip and the 2nd IC chip, in the mode of the interarea of described 1st sensor element and the 2nd sensor element along described one side or described another side, on described 1st splicing ear that described 1st connecting electrode of described 1st sensor element and the 2nd sensor element and the 2nd connecting electrode are respectively installed to described 1st IC chip and the 2nd IC chip and the 2nd splicing ear; Adjustment and the characteristic check of described 1st sensor element and the 2nd sensor element and described 1st IC chip and the 2nd IC chip is carried out by described flexible circuit board; By have in multiple sensor unit the 2nd sensor unit of described 2nd IC chip, the described another side side of described 2nd IC chip, be installed on described 2nd supporting surface of described support component, described multiple sensor unit possesses the described 1st IC chip and the 2nd IC chip that are provided with described 1st sensor element and the 2nd sensor element and described flexible circuit board respectively; The face relative with described 1st supporting surface being provided with the described support component of described 2nd sensor unit is installed on the support component composition surface of described encapsulation; On described 1st supporting surface of the described support component on the described support component composition surface being installed to described encapsulation, install in described sensor unit described another side side that have the 1st sensor unit of described 1st IC chip, described 1st IC chip, described 1st IC chip is provided with the described flexible circuit board with described rib; And the described flexible circuit board of described 1st sensor unit and the 2nd sensor unit is installed on the described support component composition surface of described encapsulation.
Thus, the manufacture method of sensor component can manufacture and provide the sensor component of the effect played described in above-mentioned application examples 8.
Further, in the manufacture method of sensor component, first the 2nd sensor unit is installed on the 2nd supporting surface of support component.
Thus, in the manufacture method of sensor component, such as adsorbent equipment etc. can be utilized to keep the 1st supporting surface on the support component composition surface along encapsulation of support component, and on the 1st supporting surface, install the 1st sensor unit, therefore the process of support component becomes easy later.
As a result, in the manufacture method of sensor component, easily support component is installed in encapsulation, therefore, it is possible to improve productivity.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the schematic configuration of the sensor assembly that the 1st embodiment is shown, (a) is vertical view, and (b) is the side view observed from the arrow A direction of (a).
Side view when (a) of Fig. 2 observes from the arrow B direction of Fig. 1 (a), the side view that (b) observes from the arrow C direction of Fig. 1 (a).
Fig. 3 is along the cut-open view of the D-D line in Fig. 1 (a).
Fig. 4 is the amplification plan view of sensor element.
Fig. 5 is the diagrammatic top view of the action that gyrotron element is described.
(a), (b) of Fig. 6 is the diagrammatic top view of the detection vibrational state representing gyrotron element.
Fig. 7 is the amplification plan view of the major part of sensor assembly.
Fig. 8 is the amplification view of the major part of sensor assembly.
Fig. 9 is the schematic diagram of the schematic configuration of the sensor assembly that the 2nd embodiment is shown, (a) is vertical view, and (b) is the side view observed from the arrow A direction of (a).
Figure 10 is the schematic diagram of the schematic configuration of the gyro sensor that the 3rd embodiment is shown, (a) is the vertical view overlooked from lid (lid) side, and (b) is the cut-open view of the J-J line in (a).
Figure 11 is the process flow diagram of the manufacturing process that gyro sensor is shown.
Figure 12 is the schematic isometric that support component preparatory process is described.
Figure 13 is the schematic diagram that flexible circuit board bonding process is described, (a) is vertical view, and (b) is side view.
Figure 14 is the schematic diagram that gyrotron element bonding process is described, (a) is vertical view, and (b) is side view.
Figure 15 is the schematic diagram that sensor unit the 1st bonding process is described, (a) is vertical view, and (b) is the side view observed from the arrow K direction of (a).
Figure 16 is the schematic diagram that support component bonding process is described, (a) is vertical view, and (b) is the cut-open view of the M-M line in (a).
Figure 17 is the schematic diagram that sensor unit the 2nd bonding process is described, (a) is vertical view, and (b) is the cut-open view of the N-N line in (a).
Label declaration
1,2 sensor assemblies; 3 as the gyro sensor of sensor component; 10 support components; 11 the 1st planes; 11a is as the supporting surface of the 1st supporting surface; 12 as the supporting surface of the 2nd supporting surface; 13 the 3rd planes; 14 the 4th planes; 20 as the IC chip of the 1st IC chip and the 2nd IC chip; 21 as active face simultaneously; 22 as the splicing ear of the 1st splicing ear and the 2nd splicing ear; 23 external connection terminals; 24 the 1st electrodes; 25 stress relaxation layers; 26 the 1st insulation courses; 26a peristome; 27 wirings; 28 the 2nd insulation courses; 28a, 28b peristome; 29 as the inactive face of another side; 30 as the gyrotron element of the 1st sensor element and the 2nd sensor element; 30a interarea; Another interarea of 30b; 31 base portions; 32a, 32b detection shaker arm; 32c, 32d increase the weight of portion; 33a, 33b linking arm; 34a, 34b driving shaker arm; 34c, 34d increase the weight of portion; 35a, 35b driving shaker arm; 35c, 35d increase the weight of portion; 36a, 36b, 37a, 37b sway brace; 38a, 38b support portion; 39 as the connecting electrode of the 1st connecting electrode and the 2nd connecting electrode; 40,40a flexible circuit board; 41 basalises; 42 wiring diagram pattern layer; 43 as the enhancement Layer of rib; 44 1 ends; 45 another ends; 50 insulativity bonding agents; 51,52,53 attachment; 60 worktable (external component); 90 encapsulation; 91 encapsulation bases; 92 recesses; 93 lids; 94 as the upper surface on support component composition surface; 95,96,97 internal terminals; 98 lower surfaces; 99 outside terminals; 101 as the sensor unit of the 1st sensor unit; 102 as the sensor unit of the 2nd sensor unit; 103 as the sensor unit of the 3rd sensor unit.
Embodiment
Below, with reference to accompanying drawing, specific embodiment of the present invention is described.
(the 1st embodiment)
Fig. 1, Fig. 2 are the schematic diagram of the schematic configuration of the sensor assembly that the 1st embodiment is shown.(a) of Fig. 1 is vertical view, the side view that (b) of Fig. 1 observes from the arrow A direction of Fig. 1 (a).The side view that (a) of Fig. 2 observes from the arrow B direction of Fig. 1 (a), the side view that (b) of Fig. 2 observes from the arrow C direction of Fig. 1 (a).
Fig. 3 is along the cut-open view of the D-D line in Fig. 1 (a), and Fig. 4 is the amplification plan view of sensor element.In addition, comprise after accompanying drawing each width figure in the dimensional ratios of each inscape different from reality.
As shown in Figure 1 and Figure 2, sensor assembly 1 has support component 10,3 IC chips 20, as 3 gyrotron elements (gyroscope vibrating reed) 30 of sensor element and two kind of flexible circuit board 40,40a.
Support component 10 roughly in rectangular shape, has: the 1st plane 11; 2nd plane 12, it is connected with the 1st plane 11 is vertical; 3rd plane 13, it is with the 1st plane 11 and the 2nd plane 12 is vertical is connected; And the 4th plane 14, it is relative with the 1st plane 11, and as being installed to the installed surface of external component.
Further, the 1st plane 11 of support component 10 has the supporting surface 11a as the 1st supporting surface caved in from the 1st plane 11, and this supporting surface 11a is parallel with the 1st not shown reference plane, and is configured in pit.Specifically, supporting surface 11a refers to the rectangular area of slightly leaving the 2nd plane 12 and the 3rd plane 13 in the 1st plane 11 relative to the 1st plane 11 abreast to the plane of the 4th plane 14 side depression (movement).
Wherein, the 2nd plane 12 corresponds to 2nd supporting surface parallel with the 2nd not shown reference plane, and the 2nd reference plane is vertical or inclination relative to the 1st reference plane.
Supporting surface 11a, by the side 11b relative with the 2nd the plane 12 and side 11c relative with the 3rd plane 13, is connected with the 1st plane 11.In addition, side 11b, 11c is interconnected.
Thus, support component 10 define from supporting surface 11a towards the 1st plane 11 outstanding, top view is the sidewall portion of L-shaped.
In other words, support component 10 comprises: the support component base portion (from supporting surface 11a to the part of the 4th plane 14) of rectangular shape; 1st sidewall portion, it has the 2nd plane 12 and side 11b, and gives prominence to from support component base portion; 2nd sidewall portion, it has the 3rd plane 13 and side 11c, and gives prominence to from support component base portion.
Thus, the 2nd plane 12 is configured to cross over support component base portion and the 1st sidewall portion, and the 3rd plane 13 is configured to cross over support component base portion and the 2nd sidewall portion.
In addition, also can implement radian or rounding process to each bight of support component 10, in the present embodiment, even if implement radian or rounding process to each bight, also form rectangular shape.
In support component 10, as mentioned above, supporting surface 11a (the 1st plane 11) is at 90 degree (right angles) with the 3rd plane 13 angulation θ 3 with the 2nd plane 12 angulation θ the 1, the 2nd plane 12 and the 3rd plane 13 angulation θ 2 and supporting surface 11a (the 1st plane 11).In addition, about angle θ 1 ~ θ 3, in the scope not affecting sensing function, some errors (such as 0 degree ~ about 2 degree) are allowed.
About the material of support component 10, shaped steel can be enumerated, stainless steel, copper, brass, phosphor bronze, zinc, nickel, chromium, titanium, the metals such as packfong (comprising single metal or their alloy), or aluminum oxide sintered body (aluminium oxide ceramics), aluminum nitride sintered body (aluminium nitride ceramics), silicon carbide-based sintered (silicon carbide ceramics), silicon nitride based sintered material (silicon nitride ceramics), vitreous sintered body (glass ceramics), the potteries such as mullite sintered body, or epoxy resin, polyimide resin, acrylic resin, phenolics, the resin of the thermosettings such as vibrin or ultraviolet hardening, the compound substance etc. of the inorganic material such as pottery and resin.
In addition, consider the short circuit etc. with flexible circuit board 40, more preferably the material of support component 10 is materials that pottery, resin etc. have insulativity.
As shown in Figure 3, the IC chip 20 of the 1st IC chip and the 2nd IC chip has splicing ear 22 as the 1st splicing ear and the 2nd splicing ear and external connection terminals 23 in active face 21 side as one side.
And, about IC chip 20, the face of the opposition side of active face 21, namely along the inactive face 29 as another side of active face 21, to be installed in the supporting surface 11a of support component 10, the 2nd plane 12, the 3rd plane 13 (hereinafter referred to as each face) with the state insulated with support component 10 by insulativity bonding agent 50.
Specifically, in IC chip 20, be formed in active face 21 side and comprise the semiconductor element such as transistor, memory component and the integrated circuit (not shown) formed.Have in this integrated circuit: carry out for driving gyrotron element 30 driving circuit vibrated; And the testing circuit of the detection vibration produced by gyrotron element 30 is detected when applying angular velocity.
IC chip 20 has: the 1st electrode 24 being arranged on active face 21 side; The splicing ear 22 of active face 21 side is arranged on the 1st electrode 24 ground connection that is electrically connected; Be arranged on the stress relaxation layer 25 between active face 21 and splicing ear 22; And be arranged on the external connection terminals 23 of active face 21 side.
1st electrode 24 is formed as conducting direct with the integrated circuit of IC chip 20.In addition, active face 21 is formed with the 1st insulation course 26 as passivating film, in the 1st insulation course 26, the 1st electrode 24 is formed with peristome 26a.
According to this structure, the 1st electrode 24 becomes the state being exposed to outside in peristome 26a.
On the 1st insulation course 26, on the position avoiding the 1st electrode 24 and other electrodes, be formed with the stress relaxation layer 25 be made up of insulating resin.
In addition, on the 1st electrode 24, in the peristome 26a of the 1st insulation course 26, the wiring 27 as laying-out and wiring is again connected to.This wiring 27 for carrying out the configuration again of the electrode of integrated circuit, and is be formed extended at both sides from the 1st electrode 24 of the predetermined position being configured in IC chip 20, and then is formed into round on stress relaxation layer 25.
Wiring is carried out between 1st electrode 24 of this wiring 27 pairs of IC chips 20 and splicing ear 22, therefore laying-out and wiring is again generally known as, it is the important feature key element realizing following object, namely relative to the 1st electrode 24 having larger position to restrict because of trickle design, can the position of splicing ear 22 be moved arbitrarily and be configured, that improve IC chip 20 with degree of freedom that the is link position of gyrotron element 30.
In addition, the 2nd insulation course 28 of the thermotolerance be made up of resin is formed with in active face 21 side of IC chip 20, to cover wiring 27, stress relaxation layer 25 and the 1st insulation course 26.In addition, the 2nd insulation course 28 also can be solder resist.
In the 2nd insulation course 28, the wiring 27 on stress relaxation layer 25 is formed with peristome 28a.According to this structure, a part for wiring 27 becomes the state being exposed to outside in peristome 28a.
Further, the wiring 27 of exposing in this peristome 28a is equipped with splicing ear 22.This splicing ear 22 is such as the projected electrode using soldered ball, gold thread, aluminum steel etc. to be formed as projection shape.Herein, as splicing ear 22, the surface that also can be used in resin projection is arranged metal film or conductive adhesive etc. and the projection (such as resin core projection) that formed.In addition, also can arrange conductive adhesive etc. on the surface of metal coupling makes the electrical connection of splicing ear 22 more reliable.
Based on this structure, the integrated circuit be formed on IC chip 20 is electrically connected with gyrotron element 30 via the 1st electrode 24, wiring 27, splicing ear 22.
Now, in sensor assembly 1, because splicing ear 22 becomes projected electrode, therefore between gyrotron element 30 and IC chip 20, be provided with enough gaps.By this gap, sensor assembly 1 ensure that the driving vibration of gyrotron element 30 and detects the space of vibration.
In addition, in the integrated circuit being formed at IC chip 20, except the 1st electrode 24, other not shown electrodes are also formed with.These other electrodes are same with the situation of the 1st electrode 24, are connected with laying-out and wiring again, and in the peristome 28b of the 2nd insulation course 28, and are exposed to outside external connection terminals 23 and are connected.
External connection terminals 23 is such as the projected electrode using soldered ball, gold thread, aluminum steel etc. to be formed as projection shape, and is installed on flexible circuit board 40,40a.
1st electrode 24, other electrodes, wiring 27 etc. again laying-out and wiring are formed by gold (Au), copper (Cu), silver (Ag), titanium (Ti), tungsten (W), titanium tungsten (TiW), titanium nitride (TiN), nickel (Ni), nickel vanadium (NiV), chromium (Cr), aluminium (Al), palladium (Pd) etc.
In addition, as these laying-out and wirings again such as 27 grades that connects up, can be not only the single layer structure realized with above-mentioned material, also can be the stepped construction being combined with multiple above-mentioned material.In addition, about these laying-out and wirings again such as 27 grades that connects up, normally being formed in same operation, is therefore mutually the same material.
In addition, as the resin for the formation of the 1st insulation course 26, the 2nd insulation course 28, such as, can adopt polyimide resin, silicone modified polyimide resin, epoxy resin, silicone modified epoxy resin, acrylic resin, phenolic resin, BCB (benzocyclobutene: benzocyclobutene) and PBO (polybenzoxazole: polybenzoxazole) etc.
In addition, about the 1st insulation course 26, also monox (SiO can be utilized 2), silicon nitride (Si 3n 4) etc. inorganic insulating material formed.
The inactive face 29 of IC chip 20, by insulativity bonding agents 50 such as polyimide, epoxies, silicones, is arranged on each face 11a, 12,13 of support component 10 with state of insulation.
In addition, in the partial graph outside Fig. 3, for convenience of explanation, the 2nd insulation course 28 of IC chip 20 is expressed as active face 21.
As shown in Figure 4, as the gyrotron element 30 of the 1st sensor element and the 2nd sensor element (below also referred to as sensor element), formed using the quartz as piezoelectric for base material (being formed the material of major part).Quartz have be referred to as electric axis X-axis, be referred to as the Y-axis of mechanical axis and be referred to as the Z axis of optical axis.
Further, gyrotron element 30 carries out cutting and being processed into tabular along the plane specified by X-axis orthogonal in quartzy crystallographic axis and Y-axis, and with the Z-direction of plane orthogonal on there is predetermined thickness.In addition, predetermined thickness suitably can set according to oscillation frequency (resonance frequency), physical dimension, processability etc.
In addition, the flat board forming gyrotron element 30, for X-axis, Y-axis and Z axis, can allow the quartz of scope slightly to cut the error of angle respectively.Such as, can to adopt centered by X-axis the scope inward turning of 0 degree to 7 degree then the flat board cut out.This for Y-axis and Z axis like this too.
Gyrotron element 30 is etching (wet etching or dry ecthing) by have employed photoetching technique and is formed.In addition, multiple gyrotron element 30 can be obtained from 1 piece of quartz wafer.
Gyrotron element 30 is referred to as double-T shaped structure.
Gyrotron element 30 has: the base portion 31 being positioned at core; Along a pair detection shaker arm 32a, 32b as vibration section that Y-axis extends from base portion 31; With the mode vertical with detection shaker arm 32a, 32b from base portion 31 along a pair linking arm 33a, 33b that X-axis extends; In the mode almost parallel with detection shaker arm 32a, 32b, along each a pair driving shaker arm 34a, 34b, 35a, 35b as vibration section that Y-axis extends from the end side of each linking arm 33a, 33b.
In addition, gyrotron element 30 has: from base portion 31 between each shaker arm (such as between detection shaker arm 32a and driving shaker arm 34a etc.) roughly along sway brace 36a, 36b, 37a, 37b that Y-axis extends; Cross over the support portion 38a arranged with the terminal part of sway brace 36a, 37a of equidirectional extension; Cross over the support portion 38b arranged with the terminal part of sway brace 36b, 37b of equidirectional extension.
Support portion 38a, 38b extend along a pair linking arm 33a, 33b through the end of each shaker arm.
Sway brace 36a, 36b, 37a, 37b have the function absorbed as the physical shock of error detection factor.Specifically, have following functions: when the physical shock as error detection factor is applied on gyrotron element 30, there is distortion such as bending or bend in sway brace 36a, 36b, 37a, 37b, thus absorbs this physical shock.
Therefore, gyrotron element 30 can suppress the physical shock as error detection factor to be delivered to driving shaker arm 34a, 34b, 35a, 35b and detection shaker arm 32a, 32b.
In addition, gyrotron element 30 is formed with not shown detecting electrode on detection shaker arm 32a, 32b, and is formed with not shown drive electrode on driving shaker arm 34a, 34b, 35a, 35b.
In gyrotron element 30, constituted the detection vibrational system of detection angle speed by detection shaker arm 32a, 32b, constitute by linking arm 33a, 33b and driving shaker arm 34a, 34b, 35a, 35b the driving vibrational system that gyrotron element 30 is driven.
In addition, be formed with the portion that increases the weight of 32c, 32d at detection shaker arm 32a, 32b terminal part separately, be formed with the portion that increases the weight of 34c, 34d, 35c, 35d at driving shaker arm 34a, 34b, 35a, 35b terminal part separately.
Thus, gyrotron element 30 achieves the raising of miniaturization and angular velocity detection sensitivity.
In a top view, gyrotron element 30 is configured in active face 21 side of IC chip 20 in the mode overlapping with IC chip 20.
In addition, gyrotron element 30 with comprise base portion 31, each shaker arm, each support portion the pros and cons of flat board for interarea.In the present embodiment, the face with external electrical connections is called an interarea 30a, the face (face of opposition side) relative with interarea 30a is called another interarea 30b.
On an interarea 30a of support portion 38a, 38b of gyrotron element 30,6 connecting electrodes 39 as the 1st connecting electrode and the 2nd connecting electrode of be provided with above-mentioned each detecting electrode, drawing from each drive electrode.
As shown in Figure 3, for gyrotron element 30, with an interarea 30a (another interarea 30b) along support component 10 each face 11a, 12, the mode of 13 (almost parallel), each connecting electrode 39 to be installed on each splicing ear 22 of IC chip 20 (electrically and the connection of mechanical system).
In other words, for gyrotron element 30, with an interarea 30a (another interarea 30b) along the active face 21 of IC chip 20 or the mode of inactive face 29, each connecting electrode 39 to be installed on each splicing ear 22 of IC chip 20 (electrically and the connection of mechanical system).
Herein, the action of the gyrotron element 30 of sensor assembly 1 is described.
Fig. 5 and Fig. 6 is the schematic plan of the action that gyrotron element is described.Fig. 5 shows driving vibrational state, and (a) of Fig. 6, (b) of Fig. 6 show the detection vibrational state under the state applying angular velocity.
In addition, in fig. 5 and fig., in order to show vibrational state simply, represent each shaker arm with line, and eliminate each sway brace and each support portion.
In Figure 5, the driving vibrational state of gyrotron element 30 is described.
First, drive singal is applied from the integrated circuit (driving circuit) of IC chip 20, thus, under the state that gyrotron element 30 is not applied to angular velocity, the enterprising line bend vibration in driving shaker arm 34a, 34b, 35a, 35b direction shown in arrow E.These flexural vibrations be with preset frequency repeatedly the vibration posture shown in solid line and the vibration posture shown in double dot dash line.
Then, under the state of having carried out this driving vibration, when applying the angular velocity omega around Z axis to gyrotron element 30, gyrotron element 30 carries out the vibration shown in Fig. 6.
First, as shown in (a) of Fig. 6, to forming the Coriolis force driving the driving of vibrational system shaker arm 34a, 34b, 35a, 35b and linking arm 33a, 33b action arrow F direction.And meanwhile, the Coriolis force in detection shaker arm 32a, 32b and arrow F direction in concert with deforms on arrow H direction.
Afterwards, as shown in (b) of Fig. 6, on arrow F ' direction, the power returned is acted on to driving shaker arm 34a, 34b, 35a, 35b and linking arm 33a, 33b.And meanwhile, the power in detection shaker arm 32a, 32b and arrow F ' direction in concert with deforms on arrow H ' direction.
Gyrotron element 30 alternately repeatedly carries out this series of action and encourages the vibration made new advances.
In addition, the vibration in arrow F, F ' direction vibrates about the circumferencial direction of center of gravity G.Further, in gyrotron element 30, be formed in detecting electrode on detection shaker arm 32a, 32b and obtain angular velocity omega around Z axis by the distortion detecting the quartz produced because of vibration.
Return Fig. 3, flexible circuit board 40 has: basalis 41, and it has flexible resin based on such as polyimide etc.; And wiring diagram pattern layer 42, it engages with basalis 41, to be patterned into the Copper Foil of intended shape.
And, in flexible circuit board 40, at basalis 41 with on the face of the opposition side, active face 21 side of IC chip 20, from being installed to the installation region of external connection terminals 23 of IC chip 20 in the scope of the end 20a more than IC chip 20, be provided with the enhancement Layer 43 as rib of the rigidity improving flexible circuit board 40.
The island that enhancement Layer 43 is formed with independently rectangular shape, is arranged on the position with each wiring pattern of wiring diagram pattern layer 42 corresponding (relative).
Enhancement Layer 43 metal covering film (metal) that comprise based on Copper Foil same with wiring diagram pattern layer 42.
That is, the metal covering film that two sides can be made to have a face of the double-faced flexible circuit board of metal covering film (such as Copper Foil) is left above-mentioned intended shape, arranges enhancement Layer 43 thus.
Thus, flexible circuit board 40 becomes the stepped construction with basalis 41, wiring diagram pattern layer 42, enhancement Layer 43.
The wiring diagram pattern layer 42 mounted (joint) of the side, an end 44 of flexible circuit board 40 is in the external connection terminals 23 of IC chip 20.
In addition, flexible circuit board 40a eliminates enhancement Layer 43 from flexible circuit board 40 and obtains.
Flexible circuit board 40,40a owing to having flexibility, therefore, it is possible to the degree correspondingly free folding of flexibility.
Thus, as shown in FIG. 1 to 3, no matter how the posture of flexible circuit board 40,40a IC chip 20 is all from midway bending, therefore, with the 4th plane 14 for mounting surface, can arrange along the worktable 60 (external component) loading support component 10.
Now, because flexible circuit board 40 has enhancement Layer 43, therefore the rigidity of this part improves, thus, be difficult to because of as shown in Figure 3 to IC chip 20 inactive face 29 lateral buckling and cause the contact of wiring diagram pattern layer 42 and the end 20a of IC chip 20.
The enhancement Layer 43 be arranged on flexible circuit board 40 is preferably formed by the material that Young modulus is larger than the material of the basalis 41 of flexible circuit board 40.Thus, enhancement Layer 43 can more effectively suppress flexible circuit board 40 to the flexure of IC chip 20 side.
In addition, flexible circuit board 40,40a also can be formed as: the spacing between the wiring pattern of wiring diagram pattern layer 42 is wider than IC chip 20 (end 44) side in another side, end 45.
In addition, flexible circuit board 40,40a also can have protective seam, and this protective seam is drape line chart pattern layer 42 partly, and carry out insulation protection from outside to wiring diagram pattern layer 42.
In the present embodiment, the parts after IC chip 20 has been installed gyrotron element 30 and flexible circuit board 40,40a are called sensor unit.
In other words, so-called sensor unit, refers to the parts of IC chip 20 possessing and be installed with gyrotron element 30 and flexible circuit board 40,40a.
And, the 1st sensor unit be arranged on the supporting surface 11a of support component 10 is expressed as sensor unit 101, the 2nd sensor unit be arranged in the 2nd plane 12 is expressed as sensor unit 102, the 3rd sensor unit be arranged in the 3rd plane 13 is expressed as sensor unit 103.
In addition, in the present embodiment, the IC chip 20 of sensor unit 101 corresponds to the 1st IC chip, the IC chip 20 of sensor unit 102 corresponds to the 2nd IC chip, the gyrotron element 30 of sensor unit 101 corresponds to the 1st sensor element, and the gyrotron element 30 of sensor unit 102 corresponds to the 2nd sensor element.
And, the splicing ear 22 of the IC chip 20 of sensor unit 101 corresponds to the 1st splicing ear, the splicing ear 22 of the IC chip 20 of sensor unit 102 corresponds to the 2nd splicing ear, the connecting electrode 39 of the gyrotron element 30 of sensor unit 101 corresponds to the 1st connecting electrode, and the connecting electrode 39 of the gyrotron element 30 of sensor unit 102 corresponds to the 2nd connecting electrode.
In addition, in sensor unit 101, adopt flexible circuit board 40, in sensor unit 102 and sensor unit 103, adopt flexible circuit board 40a.
Return Fig. 1, Fig. 2, X ' axle, Y ' axle and Z ' axle are orthogonal axles.Further, supporting surface 11a and the Z ' axle of support component 10 is vertical, and the 2nd plane 12 is vertical with X ' axle, and the 3rd plane 13 is vertical with Y ' axle.
Thus, in the sensor unit 101 be installed on supporting surface 11a, an interarea 30a (another interarea 30b) of gyrotron element 30 is vertical with Z ' axle, therefore, it is possible to detect the angular velocity (angular velocity around Z ' axle) relative to Z ' axle.
Equally, be installed in the sensor unit 102 in the 2nd plane 12, an interarea 30a (another interarea 30b) of gyrotron element 30 is vertical with X ' axle, therefore, it is possible to detect the angular velocity (angular velocity around X ' axle) relative to X ' axle.
In addition, equally, be installed in the sensor unit 103 in the 3rd plane 13, an interarea 30a (another interarea 30b) of gyrotron element 30 is vertical with Y ' axle, therefore, it is possible to detect the angular velocity (angular velocity around Y ' axle) relative to Y ' axle.
Therefore, the sensor assembly 1 with sensor unit 101,102,103 can detect the angular velocity (angular velocity around these 3 axles) relative to orthogonal X ' axle, Y ' axle and these 3 axles of Z ' axle.
At this, as shown in (b) of Fig. 1, in sensor assembly 1, depth dimensions D1 from the 1st plane 11 of support component 10 to supporting surface 11a, becomes more than the height dimension H1 (D1>H1) being installed in the gyrotron element 30 of supporting surface 11a from supporting surface 11a to sensor unit 101 by IC chip 20.
Further, in sensor assembly 1, as the bond area between the IC chip 20 of the 2nd IC chip of sensor unit 102 and support component base portion, the bond area as the erection space between this IC chip 20 and the 1st sidewall portion of support component 10 is greater than.In addition, preferably like this too for sensor unit 103.
And, in sensor assembly 1, in the side view preferably observed in the direction vertical from an interarea 30a of the gyrotron element 30 with the 2nd sensor element as sensor unit 102, the gyrotron element 30 of sensor unit 102 overlapping with support component base portion at least partially, more preferably the center (center in the direction parallel with an interarea 30a of gyrotron element 30) of the gyrotron element 30 of sensor unit 102 is overlapping with support component base portion.In addition, preferably like this too for sensor unit 103.
Thus, in sensor assembly 1, even if support component base portion thicker than the 1st sidewall portion in support component 10 is subject to the physical shock from outside, be also difficult to produce unnecessary vibration.Therefore, by the part (preferred majority) with the support component base portion gyrotron element 30 of sensors configured unit 102 overlappingly, sensor assembly 1, when being subject to the physical shock from outside, can reduce the unnecessary vibration of transmitting to gyrotron element 30.In addition, if sensor unit 103 is also identical structure, then identical effect can be obtained.
As mentioned above, in the sensor assembly 1 of the 1st embodiment, the orthogonal supporting surface 11a of support component 10, the 2nd plane 12, the 3rd plane 13 are provided with IC chip 20, in active face 21 side of IC chip 20, gyrotron element 30 are installed.
Now, in sensor assembly 1, an interarea 30a (another interarea 30b) of gyrotron element 30 is installed into each face 11a, 12,13 along being provided with IC chip 20, and therefore an interarea 30a (another interarea 30b) of gyrotron element 30 is mutually vertical.
Therefore, such as, by sensor assembly 1 being received into the inside of an encapsulation, thus the sensor component corresponding to 3 axles can be provided.
At this, in sensor assembly 1, the supporting surface 11a of the 1st plane 11 of support component 10 caves in (depression) from the 1st plane 11, thus comparing the existing structure of patent documentation 1, can making from as being installed to the 4th plane 14 of installed surface of the external components such as encapsulation to the height step-down (flattening) of gyrotron element 30 of sensor unit 101 being installed on supporting surface 11a.
Thus, sensor assembly 1 can contribute to the slimming of the sensor component receiving sensor assembly 1.
In addition, in sensor assembly 1, support component 10 is roughly in rectangular shape, 1st plane 11, the 2nd plane 12 and the 3rd plane 13 are interconnected, thus compared with the aforesaid structure that flat board is turned up, the rigidity of support component 10 strengthens extraordinarily, and the 1st plane 11 (comprising supporting surface 11a), the 2nd plane 12 and the 3rd plane 13 are not easy due to such as external force and vibrate (displacement).
As a result, sensor assembly 1 can suppress to result to be applied to the external force of support component 10, the deterioration of the examine repair such as accuracy of detection, detection sensitivity of each gyrotron element 30 and IC chip 20.
Therefore, sensor assembly 1 can suppress the deterioration of the examine repair such as accuracy of detection, detection sensitivity of each gyrotron element 30 and IC chip 20, and contributes to the slimming of the sensor component receiving sensor assembly 1.
And, in sensor assembly 1, the depth dimension D1 from the 1st plane 11 of support component 10 to supporting surface 11a is more than the height dimension H1 (D1>H1) of the gyrotron element 30 from supporting surface 11a to sensor unit 101.
Therefore, sensor assembly 1 can make the height from the 4th plane 14 of support component 10 to the gyrotron element 30 of sensor unit 101, identical with the height of the 4th plane 14 to the 1 plane 11 from support component 10 and the height of support component 10 monomer.
Now, in sensor assembly 1, if make the depth dimensions D1 from the 1st plane 11 of support component 10 to supporting surface 11a, close with the height dimension H1 from supporting surface 11a to the gyrotron element 30 of sensor unit 101, then the rigidity of the support component 10 (being especially provided with the wall portion of side 11b, 11c) that the supporting surface 11a by arranging depression in the 1st plane 11 can be caused declines and is suppressed to Min..
And, in sensor assembly 1, if the depth dimensions D1 from the 1st plane 11 of support component 10 to supporting surface 11a significantly exceedes the state of the height dimension H1 of the gyrotron element 30 from supporting surface 11a to sensor unit 101, even be such as attached with other parts at the gyrotron element 30 of sensor unit 101 or IC chip 20, when the height of sensor unit 101 is raised, also can keep the state making the height of sensor assembly 1 identical with the height of support component 10 monomer.
In addition, as shown in the double dot dash line in Fig. 1, in sensor assembly 1, even if such as when from supporting surface 11a to the thickness T1 of the 4th plane 14 with from the 2nd plane 12 to side 11b and identical to the thickness T2 of side 11c from the 3rd plane 13 (in other words, when the shape with the aforesaid structure proximate that flat board is turned up), 1st plane the 11 ~ 3rd plane 13 is also interconnected, and thus can say that rigidity is enhanced compared with the aforesaid structure turned up by flat board.
Further, in sensor assembly 1, flexible circuit board 40,40a have flexibility, thus regardless of the posture of IC chip 20, flexible circuit board 40,40a can both be bent and partly become horizontality.
Therefore, sensor assembly 1 by flexible circuit board 40, the 40a of horizontality, such as, can be easily mounted to the external components such as encapsulation, and carries out the characteristic check etc. of IC chip 20 and gyrotron element 30.
As a result, sensor assembly 1 can improve productivity.
In addition, sensor assembly 1 can be formed as: the spacing between the wiring pattern of the wiring diagram pattern layer 42 of flexible circuit board 40,40a is wider than IC chip 20 side (side, an end 44) in another side, end 45.
Therefore, sensor assembly 1 can easily make probes touch wiring diagram pattern layer 42 to carry out adjustment and the characteristic check of gyrotron element 30 and IC chip 20, and is installed to the external components such as encapsulation.
As a result, sensor assembly 1 can improve productivity.
And, in sensor assembly 1, the external connection terminals 23 of the IC chip 20 of sensor unit 101 is provided with flexible circuit board 40, at flexible circuit board 40 with on the face of opposition side, IC chip 20 side, from being installed to the installation region of external connection terminals 23 of IC chip 20 in the scope of the end 20a more than IC chip 20, be provided with the rib 43 improving rigidity.
Thus, in sensor assembly 1, at flexible circuit board 40 from being installed to the installation region of external connection terminals 23 of IC chip 20 in the scope of the end 20a more than IC chip 20, the rigidity of flexible circuit board 40 is improved.
Therefore, in sensor assembly 1, to such as to encapsulate etc. external component install time, very difficult generation as described above, situation that flexible circuit board 40 easily bends (flexure) and contacts with the end 20a of IC chip 20.
Result, for sensor assembly 1, the situation exposing active face 21 at the end 20a of IC chip 20 such as can be avoided inferior, the short circuit because of the contact of flexible circuit board 40 and IC chip 20 and between the wiring diagram pattern layer 42 of flexible circuit board 40 caused and the short circuit of IC chip 20 and the wiring pattern of wiring diagram pattern layer 42 that causes via IC chip 20.
In addition, in sensor assembly 1, the enhancement Layer 43 of flexible circuit board 40 is metal covering films, therefore, a part for double-faced flexible circuit board metal covering film (Copper Foil) such as can be made to be left above-mentioned shape, to form enhancement Layer 43 thus.
Therefore, sensor assembly 1 reasonably can arrange the enhancement Layer 43 of flexible circuit board 40, and not necessarily needs to prepare new miscellaneous part.
In addition, in sensor assembly 1, the splicing ear 22 of IC chip 20 is to the outstanding projected electrode in active face 21 side, therefore, gap can be set between gyrotron element 30 and IC chip 20, the contact of gyrotron element 30 and IC chip 20 can be avoided.
Thus, sensor assembly 1 can carry out the stabilized driving of gyrotron element 30.
In addition, in sensor assembly 1, even if when using electric conductor as the material of support component 10 or using the mother metal of insulator as support component 10, by enclosing the coverlay be made up of conductive material to the surface of support component 10, the unnecessary capacitive coupling of IC chip 20 between different detection axis and gyrotron element 30 can be suppressed thus.That is, sensor assembly 1 by the shielding effect of support component 10, can reduce the unnecessary capacitive coupling between sensor unit 101,102,103.
In addition, in sensor assembly 1, as shown in the amplification plan view of the major part of the sensor assembly of Fig. 7, the shape of the enhancement Layer 43 of flexible circuit board 40 also can be across wiring diagram pattern layer 42 wiring pattern between rectangular shape.
Also according to the rigidity expected, from the above-mentioned shape etc. of shape comprising present embodiment, the flat shape of the enhancement Layer 43 of flexible circuit board 40 can suitably be selected.
In addition, in sensor assembly 1, also can in sensor unit 102,103, the flexible circuit board 40 with enhancement Layer 43 be used to carry out alternative flexible circuit board 40a.
Thus, in sensor assembly 1, by making the flexible circuit board 40a in sensor unit 102,103 become flexible circuit board 40, both short circuits caused to IC chip 20 lateral buckling (flexure) caused by flexible circuit board 40a can be avoided.
In addition, in sensor assembly 1, also can be made up of the enhancement Layer 43 of flexible circuit board 40 parts such as comprising the resin such as polyimide, epoxies.
In addition, in sensor assembly 1, as shown in the amplification view of the major part of the sensor assembly of Fig. 8, also recess 15 can be set on each face 11a, 12,13 of support component 10.
Thus, in sensor assembly 1, by IC chip 20 is configured in recess 15, IC chip 20 can be installed to accurately each face 11a, 12, the pre-position of 13.
In addition, each face 11a, 12, in the normal view (vertical view) of 13, preferred recess 15 is the shape of the complete cycle surrounding IC chip 20, but also can be the shape of the avris not surrounding IC chip 20.
In addition, sensor assembly 1 also can be the structure (only having installed the structure of sensor unit 102) eliminating sensor unit 101,103.Or sensor assembly 1 can also be the structure (only having installed the structure of sensor unit 103) eliminating sensor unit 101,102.
Thus, sensor assembly 1 can provide with the posture of plane perpendicular of encapsulation come the interarea of sensor installation element (gyrotron element 30), corresponding to the reliable mounting structure of the sensor element in the sensor component of single shaft.
In addition, sensor assembly 1 also can be following structure: remove any one in sensor unit 101,102,103, detect the angular velocity of 2 relative to each other vertical axles.
In addition, sensor assembly 1 also can be following structure: by arranging 6 connecting electrodes 39 of gyrotron element 30 on an interarea 30a of base portion 31, eliminate sway brace 36a, 36b, 37a, 37b and support portion 38a, 38b of gyrotron element 30 thus.
Thus, in sensor assembly 1, do not need to make the planar dimension of IC chip 20 be greater than the planar dimension of gyrotron element 30, the planar dimension of IC chip 20 thus can be made less than the planar dimension of gyrotron element 30.
As a result, sensor assembly 1 can realize small-sized slimming further.
In addition, sensor assembly 1 also can be following structure: make each face 11a, 12,13 mutually vertical according to the characteristic of sensor element (gyrotron element 30), thus angle θ 1, θ 2, θ 3 become acute angle or obtuse angle (each face 11a, 12,13 structures mutually tilted).
In addition, sensor assembly 1 also can not adopt flexible circuit board 40,40a.In this case, the external connection terminals 23 of IC chip 20, by other attachment such as closing line, conductive adhesive, is installed (joint) to external component by sensor assembly 1.
(the 2nd embodiment)
Fig. 9 is the schematic diagram of the schematic configuration of the sensor assembly that the 2nd embodiment is shown.(a) of Fig. 9 is vertical view, the side view that (b) of Fig. 9 observes from the arrow A direction of Fig. 9 (a).
In addition, the part identical with above-mentioned 1st embodiment marked identical label and omitted the description, being described centered by the part different from above-mentioned 1st embodiment.
As shown in Figure 9, in sensor assembly 2, support component 110 be formed as from the support component 10 of the 1st embodiment eliminate the 1st sidewall portion and the 2nd sidewall portion (Fig. 1, being provided with the part of side 11b, 11c), be only the rectangular shape of support component base portion.Thus, the supporting surface 11a of sensor assembly 2 becomes the 1st plane 11.
Further, thus in sensor assembly 2, the IC chip 20 of sensor unit 102,103 is outstanding to the top of the supporting surface 11a of support component 110.
In sensor assembly 2, support component 110 does not need sidewall portion, correspondingly compared with the 1st embodiment, can reduce the planar dimension of support component 110.As a result, sensor assembly 2 can miniaturization further.
Further, in sensor assembly 2, support component 110 becomes rectangular shape, thus compared with the 1st embodiment, easily manufactures support component 110.
Therefore, sensor assembly 2 can improve productivity.
(the 3rd embodiment)
Figure 10 is the schematic diagram of the schematic configuration of the gyro sensor of the sensor component illustrated as the 3rd embodiment.(a) of Figure 10 is the vertical view overlooked from lid (lid) side, and Figure 10 (b) is along the cut-open view of the J-J line in Figure 10 (a).
In addition, eliminate lid for convenience of explanation in a top view, and represent the inner wall shape of lid with double dot dash line.
In addition, the part identical with above-mentioned 1st embodiment marked identical label and omitted the description, being described centered by the part different from above-mentioned 1st embodiment.
As shown in Figure 10, gyro sensor 3 has the encapsulation 90 of sensor assembly 1 and storage sensor assembly 1, and sensor assembly 1 is configured and is accommodated in the inside of encapsulation 90.
Encapsulation 90 is made up of with lid 93 etc. the encapsulation base 91 of rectangular flat shape, and lid 93 has recess 92 and covers encapsulation base 91.
Encapsulation base 91 have employed and carries out shaping and the aluminum oxide sintered body, quartz, glass etc. firing and obtain to ceramic green sheet.
Lid 93 adopts the material identical with encapsulation base 91, or the metal such as fernico, 42 alloys, stainless steel.
On the upper surface 94 (face that tegmentum 93 covers) of encapsulation base 91, the flexible circuit board 40 of each sensor unit 101,102,103 with sensor assembly 1, position that 40a is corresponding are provided with internal terminal 95,96,97.
On the lower surface 98 (face along upper surface 94 as the bottom surface of encapsulation 90) of encapsulation base 91, be provided with the multiple outside terminals 99 used when being installed to external unit (external component) etc.
Internal terminal 95,96,97 is connected with outside terminal 99 by not shown internal wiring.
Internal terminal 95,96,97 and outside terminal 99 are such as made up of metal covering film, and this metal covering film is formed by the various coverlay such as stacked nickel (Ni), gold (Au) on the such as metal layer such as tungsten (W) or molybdenum (Mo) such as plating.
In addition, encapsulation also can be made up of the flat lid etc. of the encapsulation base and covering encapsulation base with recess.In addition, encapsulation also all can have recess on encapsulation base and lid two sides.
Sensor assembly 1 is positioned on the upper surface 94 of encapsulation base 91, and the 4th plane 14 is installed on upper surface 94 by the attachment such as bonding agent 51,4th plane 14 is relative with the 1st plane 11 (supporting surface 11a), and as being installed to the installed surface of external component (referring to encapsulation base 91 herein).
And, in sensor assembly 1, the wiring diagram pattern layer 42 of another end 45 in the flexible circuit board 40 of sensor unit 101, has the attachment 52 of electric conductivity by conductive adhesive, anisotropic conductive film, scolding tin etc. and is installed on the internal terminal 95 of encapsulation base 91.
Equally, in sensor assembly 1, the wiring diagram pattern layer 42 of another end 45 in the flexible circuit board 40a of sensor unit 102, is installed on the internal terminal 96 of encapsulation base 91 by attachment 52.
In addition, equally, in sensor assembly 1, the wiring diagram pattern layer 42 of another end 45 in the flexible circuit board 40a of sensor unit 103, is installed on the internal terminal 97 of encapsulation base 91 by attachment 52.
Thus, in gyro sensor 3, each sensor unit of sensor assembly 1 101,102,103, internal terminal 95,96,97 and outside terminal 99 be electrically connected to each other.
In gyro sensor 3, under the state that sensor assembly 1 is installed on the upper surface 94 of encapsulation base 91 as described above, encapsulation base 91 is covered with lid 93, and with attachment 53 such as endless loop, low-melting glass, bonding agents, lid 93 is installed on encapsulation base 91, thus the inside of encapsulation 90 is sealed airtightly.
In addition, preferably the inside of encapsulation 90 is remained vacuum state (state that vacuum tightness is high), not hinder the vibration of the gyrotron element 30 of each sensor unit 101,102,103.
In gyro sensor 3, due to the sensor assembly 1 of the angular velocity of the X ' axle, Y ' axle and these 3 axles of Z ' axle that are equipped with detection relative to each other vertical in encapsulation 90, therefore become the gyro sensor corresponding to 3 axles.
Therefore, gyro sensor 3 such as can be used for the attitude detection, ability of posture control etc. of the hand shaking correction of picture pick-up device, the vehicle employed in the mobile navigation system of GPS (GlobalPositioning System: GPS) satellite-signal etc.
Herein, an example of the manufacture method of gyro sensor 3 is described.
Figure 11 is the process flow diagram of the manufacturing process that gyro sensor is shown, Figure 12 ~ Figure 17 is the schematic diagram that main manufacturing process is described.
As shown in figure 11, the manufacture method of gyro sensor 3 comprises: support component preparatory process S1, IC chip preparatory process S2, gyrotron element preparatory process S3, flexible circuit board preparatory process S4, encapsulation preparatory process S5, flexible circuit board bonding process S6, gyrotron element bonding process S7, adjustment and characteristic check operation S8, sensor unit the 1st bonding process S9, support component bonding process S10, sensor unit the 2nd bonding process S11, lid bonding process S12.
[support component preparatory process S1]
First, as shown in figure 12, prepare aforesaid support component 10, this support component 10 has orthogonal 1st plane 11 (supporting surface 11a), the 2nd plane 12, the 3rd plane 13, relative with the 1st plane 11 (supporting surface 11a) and as the 4th plane 14 of installed surface being installed to external component.
[IC chip preparatory process S2]
Then, the IC chip 20 (with reference to Figure 13) in active face 21 side with splicing ear 22 and external connection terminals 23 is prepared.
[gyrotron element preparatory process S3]
Then, the gyrotron element 30 shown in set-up dirgram 4, this stabilizer unit 30 has: base portion 31; Each shaker arm (32a etc.) of extension from base portion 31; And the connecting electrode 39 be arranged on each support portion 38a, 38b.
[flexible circuit board preparatory process S4]
Then, prepare that there is flexible flexible circuit board 40,40a (with reference to Figure 13).In addition, as mentioned above, on flexible circuit board 40, being provided with the enhancement Layer 43 for improving rigidity in the scope of the end 20a more than IC chip 20 from the installation region of the external connection terminals 23 being installed to IC chip 20.
[encapsulation preparatory process S5]
Then, prepare encapsulation 90 (encapsulation base 91, lid 93 etc.) (with reference to Figure 10) of the above-mentioned each inscape of storage.
In addition, the order of each preparatory process S1 ~ S5 is not limited to said sequence, also can be different orders.
[flexible circuit board bonding process S6]
Then, as shown in figure 13, utilize ultrasonic bonding method, heating pressurization bonding method etc., the wiring diagram pattern layer 42 of an end 44 of flexible circuit board 40,40a is installed (joint) to (details of bonding part is with reference to Fig. 3) on the external connection terminals 23 of IC chip 20.
In addition, in fig. 13, that flexible circuit board 40,40a are loaded and be installed on IC chip 20, but, also flexible circuit board 40,40a can be overturn and be placed on worktable (operation post), IC chip 20 after upset is placed on flexible circuit board 40,40a, and the external connection terminals 23 of IC chip 20 is installed in the wiring diagram pattern layer 42 of flexible circuit board 40,40a.
[gyrotron element bonding process S7]
Then, as shown in figure 14, at active face 21 (the 2nd insulation course 28) side of IC chip 20 configuration gyrotron element 30, in the mode (almost parallel mode) of gyrotron element 30 interarea 30a (another interarea 30b) along active face 21 (the 2nd insulation course 28) or inactive face 29, the connecting electrode 39 of gyrotron element 30 is installed (joint) to (details of bonding part is with reference to Fig. 3) on the splicing ear 22 of IC chip 20.
Thus, the sensor unit 101,102,103 of gyrotron element 30 and flexible circuit board 40,40a is obtained being installed with on IC chip 20.
[adjustment and characteristic check operation S8]
Then, adjustment and the characteristic check of gyrotron element 30 and IC chip 20 is carried out by flexible circuit board 40,40a.
Specifically, sensor unit 101,102,103 is set on not shown adjusting gear, characteristic check device, and to the gold (Au) respectively increasing the weight of that portion is arranged, the silver metal covering film irradiating laser such as (Ag), chromium (Cr) and film is removed of each shaker arm at gyrotron element 30, thus, the various characteristic checks of the adjustment operations such as the balanced adjustment (balanced tunable) of the mass balance for obtaining each shaker arm and gyrotron element 30 and IC chip 20 are carried out.
[sensor unit the 1st bonding process S9]
Then, as shown in figure 15, sensor unit 102,103 is installed on (joint) to the 2nd plane 12, the 3rd plane 13 of support component 10.
Specifically, utilize insulativity bonding agent 50, with the state insulated with support component 10, be installed to inactive face 29 side of the IC chip 20 of sensor unit 102,103 in the 2nd plane 12 in each face 11a, 12,13 of support component 10, the 3rd plane 13, the 2nd plane 12, the 3rd plane 13 are faces vertical with the upper surface 94 of the encapsulation base 91 on the support component composition surface as encapsulation 90.
That is, sensor unit 102 is installed in the 2nd plane 12, sensor unit 103 is installed in the 3rd plane 13.
Now, an interarea 30a (another interarea 30b) of each gyrotron sensor element 30 becomes respectively along the state of the 2nd plane 12, the 3rd plane 13.
[support component bonding process S10]
Then, as shown in figure 16, with the supporting surface 11a of not shown adsorption device adsorbs along the upper surface 94 of encapsulation base 91, the support component 10 being installed with each sensor unit 102,103 is carried, and uses attachment 51 the 4th plane 14 of support component 10 to be installed on the upper surface 94 of encapsulation base 91.
In addition, for attachment 51, from the aspect preventing short circuit, preferably there is the bonding agent of insulativity.
[sensor unit the 2nd bonding process S11]
Then, as shown in figure 17, sensor unit 101 is installed to along on the supporting surface 11a of the upper surface 94 of encapsulation base 91.
Specifically, utilize insulativity bonding agent 50, with the state insulated with support component 10, inactive face 29 side of the IC chip 20 of sensor unit 101 is installed on the supporting surface 11a of support component 10.
Then, attachment 52 are utilized the wiring diagram pattern layer 42 of the flexible circuit board 40 of sensor unit 101,102,103, another end 45 of 40a to be respectively installed on the internal terminal 95,96,97 of the upper surface 94 of encapsulation base 91.
Just constitute sensor assembly 1 thus, and sensor assembly 1 is configured in the inside of encapsulation 90.
[lid bonding process S12]
Then, return Figure 10, under vacuum state (state that vacuum tightness is high), utilize attachment 53 to be installed on encapsulation base 91 by lid 93, the inside of encapsulation 90 is sealed airtightly.Thus, the inside of encapsulation 90 is remained vacuum state.Further, thus sensor assembly 1 is accommodated in the inside of encapsulation 90.
In addition, also can be: in an atmosphere lid 93 is installed on encapsulation base 91, then reduce pressure via the inside of through hole to encapsulation 90 arranged on encapsulation base 91 or lid 93, and through hole is sealed, the inside of encapsulation 90 is remained vacuum state (state that vacuum tightness is high) thus.
Through each operation above-mentioned etc., obtain the gyro sensor 3 shown in Figure 10.
In addition, the order of each operation above-mentioned can also suitably be exchanged as required.Such as, before support component preparatory process S1 also can be next to sensor unit the 1st bonding process S9, before encapsulation preparatory process S5 also can be next to support component bonding process S10, flexible circuit board bonding process S6 and gyrotron element bonding process S7 also can reversed order mutually.
In addition, also in sensor unit the 1st bonding process S9, sensor unit 102,103 can be installed on the internal terminal 96,97 of flexible circuit board 40a.
As mentioned above, the gyro sensor 1 of the 1st embodiment is accommodated in encapsulation 90 by the gyro sensor 3 of the 3rd embodiment, therefore, it is possible to play the effect identical with the 1st embodiment.
As main efficacy results, gyro sensor 3 has received the sensor assembly 1 corresponding with these 3 axles of X ' axle, Y ' axle and Z ' axle in the inside of an encapsulation 90, can provide the gyro sensor corresponding to 3 axles thus.
Now, in gyro sensor 3, the supporting surface 11a of the 1st plane 11 of the support component 10 of sensor assembly 1 caves in (depression) from the 1st plane 11, thus comparing the existing structure of patent documentation 1, can making from as being installed to the 4th plane 14 of installed surface of encapsulation 91 to the height step-down (flattening) of gyrotron element 30 of sensor unit 101 being installed on supporting surface 11a.
Thus, gyro sensor 3 can provide corresponding to 3 axles and the gyro sensor of slimming.
In addition, in gyro sensor 3, the external connection terminals 23 of the IC chip 20 of sensor unit 101 is provided with flexible circuit board 40, at flexible circuit board 40 with on the face of opposition side, IC chip 20 side, from being installed to the installation region of external connection terminals 23 of IC chip 20 in the scope of the end 20a more than IC chip 20, be provided with the enhancement Layer 43 for improving rigidity.
Thus, in gyro sensor 3, in flexible circuit board 40 from being installed to the installation region of external connection terminals 23 of IC chip 20 in the scope of the end 20a more than IC chip 20, rigidity is improved.
Therefore, for gyro sensor 3, when sensor assembly 1 is installed on encapsulation base 91, very difficult generation as described above, flexible circuit board 40 easily bending and the situation that contacts with the end 20a of IC chip 20.
Result, for gyro sensor 3, the situation exposing active face 21 at the end 20a of IC chip 20 such as can be avoided inferior, the short circuit because of the contact of flexible circuit board 40 and IC chip 20 and between the wiring diagram pattern layer 42 of flexible circuit board 40 caused and the short circuit of IC chip 20 and the wiring pattern of wiring diagram pattern layer 42 that causes via IC chip 20.
In addition, gyro sensor 3, by removing any one in each sensor unit 101,102,103 of sensor assembly 1, can provide the gyro sensor corresponding to 2 axles.
In addition, gyro sensor 3 by retaining any one (the removing other two) in each sensor unit 101,102,103 of sensor assembly 1, can provide with detection axis (X ' axle, Y ' axle, Z ' axle) direction have nothing to do and do not need the gyro sensor corresponding to single shaft of the mounting position changing encapsulation 90.
In addition, utilize the manufacture method of gyro sensor 3 to manufacture and the gyro sensor playing above-mentioned effect is provided.
In addition, in the manufacture method of gyro sensor 3, before engaging with supporting surface 11a, first sensor unit 102,103 is joined in the 2nd in each face 11a, 12,13 of support component 10, vertical with the upper surface 94 of encapsulation base 91 plane 12, the 3rd plane 13.
Thus, in the manufacture method of gyro sensor 3, can utilize adsorbent equipment etc. adsorb the upper surface 94 along encapsulation base 91 in support component 10, the supporting surface 11a of not yet engagement transducer unit 101, keep support component 10, therefore the process (conveying) of support component 10 becomes easy.
As a result, in the manufacture method of gyro sensor 3, the installation of support component 10 on encapsulation base 91 being installed with sensor unit 102,103 is very easy, therefore, it is possible to improve productivity.
In addition, gyro sensor 3 also can adopt the sensor assembly 2 of the 2nd embodiment to replace sensor assembly 1.
Thus, gyro sensor 3 can provide the gyro sensor playing effect same as described above and the distinctive effect of the 2nd embodiment.
In addition, in the respective embodiments described above, the base material of gyrotron element 30 is quartz, but is not limited thereto, such as, also can be lithium tantalate (LiTaO 3), lithium tetraborate (Li 2b 4o 7), lithium niobate (LiNbO 3), the semiconductor such as piezoelectrics or silicon (Si) such as lead zirconate titanate (PZT), zinc paste (ZnO), aluminium nitride (AlN).
In addition, gyrotron element 30, except double-T shaped, also can use the various stabilizer unit (sensor element) such as double-legged tuning fork, tripod tuning fork, H type tuning fork, interdigitated electrode structure, vertical-type, prismatic.
In addition, stabilizer unit also can be the element beyond oscillating mode.
In addition, the driving method of the vibration of gyrotron element 30 and detection method, except employing the method for the piezo-electric type of the piezoelectric effect of piezoelectrics, also can be the methods of the electrostatic that make use of Coulomb force or make use of the method etc. of Lorentzian type of magnetic force.
In addition, the detection axis (sensitive axis) of sensor element, except the axle vertical with the interarea of sensor element, also can be the axle with the main surface parallel of sensor element.
In addition, in the respective embodiments described above, as the sensor element of sensor assembly, for the example of gyrotron element, but be not limited thereto, such as, also can be the acceleration induction element that acceleration is made a response, the pressure induction element that pressure is made a response, weight induction element etc. that weight is made a response.
In addition, in above-mentioned 3rd embodiment, as sensor component, for the example of gyro sensor, but be not limited thereto, such as, the acceleration transducer that also can be the use of the sensor assembly with above-mentioned acceleration induction element, the pressure transducer employing the sensor assembly with pressure induction element, employ the weight sensor etc. of the sensor assembly with weight induction element.
(electronic equipment)
The sensor components such as above-mentioned gyro sensor, acceleration transducer, pressure transducer, weight sensor are suitable for the device as having sensing function, be used in the electronic equipments such as digital still camera, video camera, guider, car body gesture detection means, pointing device, game console, mobile phone, head mounted display, in either event, the electronic equipment playing the effect illustrated in the respective embodiments described above can both be provided.

Claims (10)

1. a sensor assembly, is characterized in that, this sensor assembly has:
Support component, it has parallel with the 1st reference plane and is configured at the 1st supporting surface in pit, is provided with the support component base portion of described 1st supporting surface, gives prominence to and comprise the sidewall portion of the side of described pit and 2nd supporting surface parallel with the 2nd reference plane from described support component base portion, described 2nd reference plane is vertical or inclination relative to described 1st reference plane, and described 2nd supporting surface is configured to cross over described support component base portion and described sidewall portion;
1IC chip, it is installed in described 1st supporting surface, has the 1st splicing ear in one side side, and the another side side along this one side is the installed surface being installed to described 1st supporting surface;
2IC chip, it is installed in described 2nd supporting surface, has the 2nd splicing ear in one side side, and the another side side along this one side is the installed surface being installed to described 2nd supporting surface;
1st sensor element, it is configured in the described one side side of described 1IC chip, makes interarea along this one side, and has the 1st connecting electrode being installed in described 1st splicing ear; And
2nd sensor element, it is configured in the described one side side of described 2IC chip, makes interarea along this one side, and has the 2nd connecting electrode being installed in described 2nd splicing ear,
On the thickness direction of described 2nd sensor element, the gauge of described support component base portion is greater than the gauge in described sidewall portion,
Erection space between described 2IC chip and described support component base portion is greater than the erection space between described sidewall portion,
When observing from the direction vertical with the interarea of described 2nd sensor element, described 2nd sensor element overlapping with described support component base portion at least partially.
2. sensor assembly according to claim 1, is characterized in that,
The depth dimensions of described pit be from described 1st supporting surface to the height dimension of described 1st sensor element more than.
3. sensor assembly according to claim 1 and 2, is characterized in that,
At least one party in described 1IC chip and 2IC chip has external connection terminals in described one side side, and described external connection terminals is provided with flexible circuit board.
4. sensor assembly according to claim 3, is characterized in that,
At described flexible circuit board with on the face of described 1IC chip and 2IC chip side opposition side, when overlooking from being installed to the installation region of described external connection terminals in the scope of end exceeding described 1IC chip and 2IC chip, be provided with the rib of the rigidity improving described flexible circuit board.
5. sensor assembly according to claim 4, is characterized in that,
The described rib of described flexible circuit board contains metal.
6. sensor assembly according to claim 1 and 2, is characterized in that,
Described 1st splicing ear and the 2nd splicing ear of described 1IC chip and 2IC chip are the projected electrodes gone out to a described pleurapophysis.
7. sensor assembly according to claim 1 and 2, is characterized in that,
At least one party in described 1st supporting surface and described 2nd supporting surface is provided with recess.
8. a sensor component, is characterized in that, this sensor component has:
Sensor assembly described in any one in claim 1 ~ 7; And
Receive the encapsulation of described sensor assembly,
Described sensor assembly is incorporated in described encapsulation.
9. an electronic equipment, is characterized in that, this electronic equipment has the sensor assembly described in any one in claim 1 ~ 7.
10. a manufacture method for sensor component, is characterized in that, this manufacture method comprises following operation:
Prepare support component, this support component has and 1st supporting surface that be configured at pit in and with 2nd reference plane parallel 2nd supporting surface parallel with the 1st reference plane, and described 2nd reference plane is vertical or inclination relative to described 1st reference plane;
Prepare 1IC chip and 2IC chip, described 1IC chip has the 1st splicing ear and external connection terminals in one side side, another side side along this one side is the installed surface being installed to described 1st supporting surface, described 2IC chip has the 2nd splicing ear and external connection terminals in one side side, and the another side side along this one side is the installed surface being installed to described 2nd supporting surface;
Prepare the 1st sensor element and the 2nd sensor element, described 1st sensor element has the 1st connecting electrode, and described 2nd sensor element has the 2nd connecting electrode;
Prepare multiple flexible circuit board, flexible circuit board with on the face of described 1IC chip and 2IC chip side opposition side described at least one, when overlooking from being installed to the installation region of described external connection terminals of described 1IC chip and 2IC chip in the scope of end exceeding described 1IC chip and 2IC chip, be provided with the rib improving rigidity;
Prepare the encapsulation of each inscape of storage;
The described external connection terminals of described 1IC chip and 2IC chip installs described flexible circuit board respectively;
Described 1st sensor element and the 2nd sensor element is configured in the described one side side of described 1IC chip and 2IC chip, in the mode of the interarea of described 1st sensor element and the 2nd sensor element along described one side or described another side, on described 1st splicing ear that described 1st connecting electrode of described 1st sensor element and the 2nd sensor element and the 2nd connecting electrode are respectively installed to described 1IC chip and 2IC chip and the 2nd splicing ear;
Adjustment and the characteristic check of described 1st sensor element and the 2nd sensor element and described 1IC chip and 2IC chip is carried out by described flexible circuit board;
By have in multiple sensor unit the 2nd sensor unit of described 2IC chip, the described another side side of described 2IC chip, be installed on described 2nd supporting surface of described support component, described multiple sensor unit possesses the described 1IC chip and 2IC chip that are provided with described 1st sensor element and the 2nd sensor element and described flexible circuit board respectively;
The face relative with described 1st supporting surface being provided with the described support component of described 2nd sensor unit is installed on the support component composition surface of described encapsulation;
On described 1st supporting surface of the described support component on the described support component composition surface being installed to described encapsulation, install in described sensor unit described another side side that have the 1st sensor unit of described 1IC chip, described 1IC chip, described 1IC chip is provided with the described flexible circuit board with described rib; And
The described flexible circuit board of described 1st sensor unit and the 2nd sensor unit is installed on the described support component composition surface of described encapsulation.
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