JP2011133299A - Sensor device, sensor device manufacturing method, motion sensor, and motion sensor manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sensor device that can avoid upsizing, a motion sensor using the same, and a motion sensor manufacturing method. <P>SOLUTION: A second sensor device 2 includes: connections 12 formed on one surface 11 of a plurality of leads 10; a vibration gyro element 20 of which one principal surface 20a is connected to the connections 12 through a wire 40; and a reinforcing plate 30 which is connected to the other surface 13 of the lead 10, which is the back of the one surface 11. The reinforcing plate 30 is provided across the plurality of leads 10 so that it overlaps with the connections 12 in the plan view. The lead 10 is bent so that the angle θ formed between the one surface 11 or the other surface 13 and the one principal surface 20a or the other principal surface 20b of the vibration gyro element 20 becomes nearly a right angle. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a sensor device, a sensor device manufacturing method, a motion sensor including the sensor device, and a motion sensor manufacturing method.

Conventionally, a vibrator device in which a vibrator is supported in a suspended state with respect to a base body by connecting a wire extending from the base body to a connection terminal portion provided in the vibrator by wire bonding is known ( For example, see Patent Document 1).
Patent Document 1 discloses a gyro sensor in which this vibrator device is housed in a package.

Japanese Patent Laying-Open No. 2005-167472 (FIGS. 1, 2, and 5)

In the vibrator device (hereinafter referred to as a sensor device), for example, the lead portion of a lead frame having a plurality of leads is used as a base, and the vertical relationship between the vibrator (hereinafter referred to as a sensor element) and the lead is reversed. A configuration in which the positional relationship between the vibrator 13 and the support substrate 12 is reversed in FIG.
At this time, when connecting the wire connected to the sensor element (vibrator 13) to the connection part of the lead (supporting substrate 12) by wire bonding, the sensor device does not interfere with the sensor element from the connection part. It is necessary to support the lead at a remote position.

For this reason, the sensor device has a thicker lead, for example, compared to the case where the back side of the connecting portion is supported so that the lead is not bent by a load applied during wire bonding. Therefore, it is necessary to increase the rigidity (bending strength) of the lead. As a result, the sensor device needs to have a large lead, such as an increase in lead width, an increase in the pitch between leads, and an increase in the curvature of the corner radius, due to processing limitations resulting from the increase in the plate thickness.
As a result, since it is necessary for the sensor device to have a large lead as a base as a whole, it may be difficult to avoid an increase in the size of the sensor device itself.

By the way, the gyro sensor (hereinafter referred to as motion sensor) of Patent Document 1 is arranged as a motion sensor corresponding to one axis so that the main surface of the sensor element of the sensor device is substantially parallel to the bottom surface of the package. Presumed to be.
In recent years, there has been a demand for motion sensors not only corresponding to such a single axis but also including a plurality of sensor devices and corresponding to two or three axes orthogonal to each other.

  In response to this, in the motion sensor including a plurality of sensor devices disclosed in Patent Document 1, in order to correspond to two or three axes orthogonal to each other, for example, the sensor is arranged so as to be substantially parallel to the bottom surface of the package. It is necessary to arrange the second sensor device on the side surface inside the package where the angle between the first sensor device and the bottom surface of the package is substantially a right angle. Further, in the case of supporting three axes, it is necessary to dispose the third sensor device on the other side surface whose angle with the side surface is substantially a right angle.

For this reason, when mounting each sensor device, the above-described motion sensor has a horizontal surface for mounting each sensor device, for example, as compared to the case where each sensor device is all disposed on a surface substantially parallel to the bottom surface of the package. There is a problem that the man-hour for mounting the sensor device increases due to the necessity of changing the attitude of the package each time.
In addition, in the above motion sensor, since each sensor device is arranged on each surface inside the package, the variation in the angle formed by the main surfaces of the sensor elements of each sensor device depends on the processing accuracy of the package. There is a problem.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A sensor device according to this application example includes a connection portion formed on one surface of a plurality of leads, a sensor element connected to the connection portion by a wire, and the one surface of the lead. And a reinforcing plate joined to the other surface forming a front-back relationship, and the reinforcing plate is provided across the plurality of leads so as to overlap the connecting portion in plan view. And

According to this, in the sensor device, since the reinforcing plate is provided across the plurality of leads so as to overlap the connecting portion in plan view, the load applied to the connecting portion of one lead is passed through the reinforcing plate. To other leads.
For this reason, the sensor device can avoid bending of the lead due to an external force applied to the connecting portion even when the lead plate is relatively thin.
Therefore, the sensor device does not need to increase the rigidity of the lead by increasing the thickness of the lead as in the conventional case, so that it is not necessary to increase the lead width, increase the pitch between leads, increase the curvature of the corner radius, etc. .
As a result, since the sensor device does not require an increase in the size of the lead, an increase in the size of the sensor device itself can be avoided.
Further, since the reinforcing plate is joined across a plurality of leads, it may have a role of fixing each lead at a predetermined position so that each lead does not fall apart.

  Application Example 2 In the sensor device according to the application example, the sensor element is supported in a suspended state by a wire connected to the lead.

  According to this, since the sensor device is supported in a suspended state by the wire connected to the lead, it is possible to reduce the generation of stress due to the connection of the sensor device to the other member and the inhibition of vibration. .

  Application Example 3 In the sensor device according to the application example, the lead is bent so that an angle formed between the one surface or the other surface and the main surface of the sensor element is substantially a right angle. It is preferable.

According to this, in the sensor device, the lead is bent so that the angle formed by one surface or the other surface of the lead and the main surface of the sensor element is substantially a right angle.
From this, the sensor device is configured such that the bent lead is mounted on, for example, a surface inside the package substantially parallel to the bottom surface of the package in which the sensor device is accommodated, thereby forming the bottom surface and the main surface of the sensor element. An angle can be made to become a substantially right angle.

In other words, the sensor device has an angle formed between the bottom surface and the main surface of the sensor element even if the sensor device is not disposed on the side surface inside the package where the angle formed with the bottom surface of the package is substantially a right angle as in the past. It can be made to be substantially perpendicular.
Therefore, the sensor device does not need to improve the processing accuracy such as the angle formed between the surfaces of the package.

  Application Example 4 A motion sensor according to this application example includes a connection portion formed on one surface of a plurality of leads, a sensor element connected to the connection portion by a wire, and the one surface of the lead. A sensor plate that is provided across the plurality of leads so as to overlap the connection portion in plan view, and a reinforcing plate joined to the other surface forming a front-back relationship; and A package for accommodating the sensor device therein, wherein the sensor device is accommodated in the package.

  According to this, the motion sensor can provide a motion sensor including the sensor device that exhibits the effect described in Application Example 1.

  Application Example 5 In the motion sensor according to the application example described above, it is preferable that the sensor device has the sensor element supported in a suspended state by a wire connected to the lead.

  According to this, since the sensor element of the sensor device is supported in a suspended state by the wire connected to the lead, the motion sensor generates stress due to the connection to the other member of the sensor element and inhibits vibration. Can be reduced.

  Application Example 6 In the motion sensor according to the application example described above, the lead is bent so that an angle formed between the one surface or the other surface of the lead and the main surface of the sensor element is substantially a right angle. Preferably it is.

According to this, in the motion sensor, the lead is bent so that the angle formed by one surface or the other surface of the lead of the sensor device and the main surface of the sensor element is substantially a right angle.
For this reason, the motion sensor forms the bent lead on the surface inside the package, for example, substantially parallel to the bottom surface of the package in which the sensor device is accommodated, thereby forming the bottom surface and the main surface of the sensor element. An angle can be made to become a substantially right angle.

In other words, in the conventional motion sensor, the angle formed between the bottom surface and the main surface of the sensor element is not provided on the side surface inside the package where the angle formed with the bottom surface of the package is substantially a right angle. It can be made to be substantially perpendicular.
Therefore, the motion sensor does not need to improve the processing accuracy such as the angle formed between the surfaces of the package.

  Application Example 7 In the motion sensor according to the application example described above, it is preferable that a circuit element for driving the sensor device is provided inside the package.

According to this, since the motion sensor includes a circuit element for driving the sensor device inside the package, the circuit element is protected from the external environment by the package, and compared with a case where the circuit element is provided outside. , Reliability can be improved.
The motion sensor is improved in usability as an electronic device by incorporating the sensor device and the circuit element in the package.

  Application Example 8 A motion sensor according to this application example includes a connection portion formed on one surface of a plurality of leads, a sensor element connected to the connection portion by a wire, and the one surface of the lead. A plurality of sensor devices that are provided across the plurality of leads so as to overlap the connection portion in plan view. And a package that accommodates the plurality of sensor devices therein, and the plurality of sensor devices have an angle formed between the principal surfaces of the sensor elements of each of the plurality of sensor devices that is substantially perpendicular. It is arrange | positioned and is accommodated in the inside of the said package.

According to this, the motion sensor has a plurality of sensor devices, and is arranged so that the angle formed between the principal surfaces of the sensor elements of each sensor device is substantially a right angle, and is accommodated inside the package. Yes.
Therefore, the motion sensor can provide a motion sensor corresponding to a plurality of axes.

  Application Example 9 In the motion sensor according to Application Example 8, it is preferable that the sensor elements included in the plurality of sensor devices are supported in a suspended state by wires connected to the leads.

  According to this, since the sensor element of each sensor device is supported in a suspended state by the wire connected to the lead, the motion sensor generates stress due to the connection to the other member of the sensor element and the vibration Inhibition can be reduced.

  Application Example 10 In the motion sensor according to Application Example 8 or 9, the at least one sensor device of the plurality of sensor devices includes the one surface of the lead or the other surface and the main surface of the sensor element. It is preferable that the lead be bent so that the angle formed by

According to this, in the motion sensor, the lead is bent so that an angle formed between one surface or the other surface of the lead of at least one sensor device and the main surface of the sensor element is substantially a right angle.
For this reason, the motion sensor forms the bent lead on the surface inside the package, for example, substantially parallel to the bottom surface of the package in which the sensor device is accommodated, thereby forming the bottom surface and the main surface of the sensor element. An angle can be made to become a substantially right angle.

In other words, in the conventional motion sensor, the angle formed between the bottom surface and the main surface of the sensor element is not provided on the side surface inside the package where the angle formed with the bottom surface of the package is substantially a right angle. It can be made to be substantially perpendicular.
Therefore, the motion sensor does not require an improvement in machining accuracy such as an angle formed between the surfaces of the package, and a multi-axis motion sensor can be easily provided.

  Application Example 11 In the motion sensor according to any one of the application examples 8 to 10, it is preferable that a circuit element for driving the sensor device is provided inside the package.

According to this, since the motion sensor includes a circuit element for driving the sensor device inside the package, the circuit element is protected from the external environment by the package, and compared with a case where the circuit element is provided outside. , Reliability can be improved.
In addition, the motion sensor can provide a multi-axis and small electronic device by incorporating the sensor device and the circuit element in one package.

  Application Example 12 In the motion sensor according to any one of the application examples 8 to 11, in at least one sensor device of the plurality of sensor devices, the main surface of the sensor element and the bottom surface of the package are substantially the same. It is preferable to be accommodated inside the package so as to be parallel.

According to this, in the motion sensor, at least one sensor device is accommodated inside the package such that the main surface of the sensor element and the bottom surface of the package are substantially parallel.
From this, the motion sensor can provide a motion sensor corresponding to an axis substantially orthogonal to the bottom surface of the package.

  Application Example 13 A sensor device manufacturing method according to this application example includes a step of preparing a lead frame having a plurality of leads having connection portions formed on one surface, a step of preparing a sensor element, and the lead Bonding a reinforcing plate straddling the plurality of leads so as to overlap the connecting portion in a plan view on the other surface forming a front-back relationship with the one surface of the wire, and bonding the reinforcing plate to the lead, And connecting the sensor and the sensor element, wherein the sensor element is supported in a suspended state by a wire connected to the lead.

According to this, in the manufacturing method of the sensor device, the reinforcing plate straddling the plurality of leads is joined to the other surface of the lead in a plan view so as to overlap the connecting portion, and then the lead connecting portion and the sensor element are connected by the wire. Connect.
From this, the manufacturing method of a sensor device can disperse | distribute the load added to the connection part of the said lead to another lead via a reinforcement board.
Thereby, the manufacturing method of the sensor device can avoid bending of the lead due to an external force applied to the connecting portion even when the back side of the connecting portion of the lead cannot be supported.
As a result, the manufacturing method of the sensor device can improve the connection reliability because the wire can be connected to the lead connecting portion and the sensor element by, for example, proven wire bonding.

  In addition, since the sensor element is supported in a suspended state by the wire connected to the lead, the sensor device manufacturing method can reduce the occurrence of stress and vibration inhibition due to the connection of the sensor element to other members. .

  Application Example 14 A motion sensor manufacturing method according to this application example includes a step of preparing a plurality of lead frames having a plurality of leads having connection portions formed on one surface, and a step of preparing a plurality of sensor elements. Bonding a plurality of reinforcing plates straddling the plurality of leads so as to overlap the connecting portion in plan view on the other surface forming a front-back relationship with the one surface of the lead; and After joining the plates, a step of connecting the connection portion and the sensor element by a wire to form a plurality of sensor devices, a step of preparing a package for housing the sensor devices, and the sensor device in the package The sensor element is supported in a suspended state by a wire connected to the lead, and the plurality of the sensor elements are Sensor device is characterized in that the angle between the main surfaces of the sensor elements each having the plurality of sensor device is arranged substantially at right angles.

According to this, in the manufacturing method of the motion sensor, the reinforcing plate straddling a plurality of leads is joined to the other surface of the lead in a plan view so as to overlap the connecting portion, and then the lead connecting portion and the sensor element are connected by the wire. Connect.
From this, the manufacturing method of a motion sensor can disperse | distribute the load added to the connection part of the said lead to another lead via a reinforcement board.
Thereby, the manufacturing method of the sensor device can avoid bending of the lead due to an external force applied to the connecting portion even when the back side of the connecting portion of the lead cannot be supported.
As a result, the manufacturing method of the motion sensor can improve the connection reliability because the wire can be connected to the connection portion of the lead and the sensor element by, for example, proven wire bonding.

  In addition, since the sensor element is supported in a suspended state by the wire connected to the lead, the motion sensor manufacturing method can reduce the generation of stress and vibration inhibition due to the connection of the sensor element to other members. .

  Application Example 15 The motion sensor manufacturing method according to the application example further includes a step of preparing a circuit element for driving the sensor element, and a step of accommodating the circuit element in the package. preferable.

  According to this, since the manufacturing method of a motion sensor prepares the circuit element which drives a sensor element, and accommodates it in the inside of a package, the reliability of a motion sensor and the usability as an electronic device can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic diagram which shows schematic structure of the sensor device of 1st Embodiment, (a) is the top view seen from the lead side, (b) is sectional drawing in the AA of (a), ( c) A plan view seen from the reinforcing plate side. The schematic plan view explaining operation | movement of a vibration gyro element. The schematic plan view explaining operation | movement of a vibration gyro element. It is a schematic diagram which shows schematic structure of the sensor device of 2nd Embodiment, (a) is the top view seen from the lead side, (b) is sectional drawing in the FF line of (a), (c) Is a plan view seen from the reinforcing plate side. It is a schematic diagram which shows schematic structure of the gyro sensor of 3rd Embodiment, (a) is the top view seen from the lid (lid) side, (b) is sectional drawing in the HH line | wire of (a). The flowchart which shows the manufacturing process of a gyro sensor. It is a schematic diagram explaining a manufacturing process, (a) is a top view seen from one surface side of the lead, (b) is a plan view seen from the other surface side of the lead. It is a schematic diagram explaining a manufacturing process, (a) is a top view which looked down from one surface side of a lead | read | reed, (b) is sectional drawing. The schematic cross section explaining a manufacturing process. The schematic cross section explaining a manufacturing process. The schematic cross section explaining a manufacturing process. It is a schematic diagram explaining a manufacturing process, (a) is the top view seen from the lid side, (b) is sectional drawing. The schematic diagram which shows schematic structure of the gyro sensor of the modification of 3rd Embodiment. The schematic diagram which shows schematic structure of the gyro sensor of 4th Embodiment. The schematic diagram which shows schematic structure of the gyro sensor of 5th Embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a schematic diagram illustrating a schematic configuration of the sensor device according to the first embodiment. 1A is a plan view seen from the lead side, FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A, and FIG. 1C is a reinforcing plate. It is the top view seen from the side.

As shown in FIG. 1, the first sensor device 1 as a sensor device includes a plurality of (here, six) leads 10, a vibrating gyro element 20 as a sensor element, a reinforcing plate 30, and a wire 40. ing.
Each lead 10 is a flat plate and is formed in an L shape and an inverted L shape in plan view, and three L-shaped and three inverted L-shaped are formed at the tip of the L-shaped and inverted L-shaped portions. The end faces are arranged side by side so as to face each other.

Examples of the material used for the lead 10 include metals such as copper alloys and iron alloys.
On one surface 11 of each lead 10, a connection portion 12 is formed in the vicinity of the tip portion, and a metal film such as gold or silver is formed on the connection portion 12.
In addition, the lead 10 is manufactured in a lead frame state, and the frame portion is later cut off to be a constituent element of the first sensor device 1.

A plurality (four in this case) of rectangular reinforcing plates 30 are bonded to the other surface 13 of the lead 10 that has a front-back relationship with one surface 11 by a bonding member 50 such as an adhesive.
The reinforcing plate 30 is disposed across the plurality of leads 10 so as to overlap the connecting portion 12 in plan view.
Specifically, the reinforcing plate 30a in the reinforcing plate 30 is disposed over the leads 10a and 10f in the lead 10, the reinforcing plate 30b is disposed over the leads 10a and 10b, and the reinforcing plate 30c is The leads 10a, 10b, 10c, 10d, 10e, and 10f are disposed over the leads 10d, and the reinforcing plate 30d is disposed over the leads 10e and 10f.
In addition, as a material used for the reinforcing plate 30, in order to avoid a short circuit between the leads 10 via the reinforcing plate 30, an insulating material such as ceramic, silicon, or resin is preferable.

The vibration gyro element 20 is formed by using a quartz crystal, which is a piezoelectric material, as a base material (material constituting a main part). The crystal has an X axis called an electric axis, a Y axis called a mechanical axis, and a Z axis called an optical axis.
The vibrating gyro element 20 is cut out along a plane defined by the X-axis and the Y-axis orthogonal to the crystal crystal axis and processed into a flat plate shape, and has a predetermined thickness in the Z-axis direction orthogonal to the plane. ing. The predetermined thickness is appropriately set depending on the oscillation frequency (resonance frequency), the outer size, workability, and the like.

Further, the flat plate forming the vibration gyro element 20 can tolerate errors in the cut-out angle from the quartz crystal in a certain range for each of the X axis, the Y axis, and the Z axis. For example, it is possible to use what is cut out by rotating in the range of 0 to 2 degrees around the X axis. The same applies to the Y axis and the Z axis.
The vibrating gyro element 20 is formed by etching (wet etching or dry etching) using a photolithography technique. It should be noted that a plurality of vibrating gyro elements 20 can be taken from a single quartz wafer.

As shown in FIG. 1C, the vibrating gyro element 20 has a configuration called a double T type.
The vibrating gyro element 20 is orthogonal to the base 21 located at the center, the pair of detection vibrating arms 22a and 22b extending from the base 21 along the Y axis, and the detection vibrating arms 22a and 22b. In addition, a pair of connecting arms 23a, 23b extending from the base portion 21 along the X axis and the detection vibrating arms 22a, 22b are parallel to the detection vibrating arms 22a, 22b from the tip side of the connecting arms 23a, 23b. And a pair of drive vibration arms 24a, 24b, 25a, 25b extending along the line.

In the vibrating gyro element 20, detection electrodes (not shown) are formed on the detection vibrating arms 22a and 22b, and drive electrodes (not shown) are formed on the driving vibration arms 24a, 24b, 25a and 25b.
The vibration gyro element 20 constitutes a detection vibration system that detects angular velocity by the detection vibration arms 22a and 22b, and the vibration arm gyro element 20 includes the connection arms 23a and 23b and the drive vibration arms 24a, 24b, 25a, and 25b. The drive vibration system which drives is comprised.

Further, weight portions 26a and 26b are formed at the respective distal end portions of the detection vibrating arms 22a and 22b, and weight portions 27a and 27b are formed at the respective distal end portions of the drive vibrating arms 24a, 24b, 25a and 25b. , 28a, 28b are formed.
Thereby, the vibration gyro element 20 is miniaturized and the detection sensitivity of the angular velocity is improved.

The vibration gyro element 20 is disposed on the other surface 13 side of the lead 10 so that the principal surface 20a faces the reinforcing plate 30 so as to overlap the lead 10 and the reinforcing plate 30 in plan view.
Here, a surface having terminals (electrodes) electrically connected to the outside is defined as one main surface 20a, and the other surface facing one main surface 20a is defined as the other main surface 20b.
The vibration gyro element 20 is connected to the connection portion 12 of the lead 10 by a plurality of (in this case, six) wires 40 in which the base 21 portion of one main surface 20a passes through the openings 10 of the leads 10 and the reinforcing plate 30. Has been. Note that the wire 40 is made of metal such as gold or aluminum.
On the base 21 portion of one main surface 20a of the vibration gyro element 20, a lead electrode (not shown) drawn from each of the detection electrodes and the drive electrodes is formed. A connection portion 12 between each lead electrode and each lead 10 is formed. Are electrically connected by a wire 40.

The vibrating gyro element 20 is supported by a wire 40 so that one main surface 20 a or the other main surface 20 b is substantially parallel to one surface 11 or the other surface 13 of the lead 10. The vibrating gyro element 20 is supported at a predetermined interval from the reinforcing plate 30 in order to avoid interference with the reinforcing plate 30.
Thus, in the first sensor device 1, when the lead 10 is supported by the external member so that a space is formed on the other main surface 20 b side of the vibration gyro element 20, the vibration gyro element 20 is suspended by the wire 40. It becomes a state.
The specifications including the material, wire diameter, length, and the like of the wire 40 are set as appropriate based on the suspended state.

Here, the operation of the vibration gyro element 20 of the first sensor device 1 will be described.
2 and 3 are schematic plan views for explaining the operation of the vibrating gyro element. FIG. 2 shows a driving vibration state, and FIGS. 3A and 3B show a detected vibration state in a state where an angular velocity is applied.
In FIGS. 2 and 3, each vibrating arm is represented by a line in order to simply express the vibration state.

With reference to FIG. 2, the drive vibration state of the vibration gyro element 20 will be described.
First, when a driving signal is applied from the outside via the lead 10 and the wire 40 (see FIG. 1), the vibrating gyro element 20 is driven by the driving vibrating arms 24a, 24b, 25a, 25b in a state where no angular velocity is applied. Bending vibration is performed in the direction indicated by arrow E. In this bending vibration, a vibration state indicated by a solid line and a vibration state indicated by a two-dot chain line are repeated at a predetermined frequency.

Next, when an angular velocity ω about the Z axis is applied to the vibrating gyro element 20 in a state where the driving vibration is performed, the vibrating gyro element 20 performs vibration as shown in FIG.
First, as shown in FIG. 3A, the Coriolis force in the direction of arrow B acts on the drive vibrating arms 24a, 24b, 25a, 25b and the connecting arms 23a, 23b constituting the drive vibration system. At the same time, the detection vibrating arms 22a and 22b are deformed in the arrow C direction in response to the Coriolis force in the arrow B direction.

Thereafter, as shown in FIG. 3 (b), the driving vibration arms 24a, 24b, 25a, 25b and the connecting arms 23a, 23b are subjected to a force returning in the arrow B ′ direction. At the same time, the detection vibrating arms 22a and 22b are deformed in the direction of the arrow C 'in response to the force in the direction of the arrow B'.
The vibration gyro element 20 repeats this series of operations alternately to excite new vibration.
The vibrations in the directions of arrows B and B ′ are vibrations in the circumferential direction with respect to the center of gravity G. In the vibrating gyro element 20, the angular velocity is obtained by the detection electrode formed on the vibrating arms for detection 22a and 22b detecting the distortion of the crystal generated by the vibration.

As described above, in the first sensor device 1 of the first embodiment, the reinforcing plate 30 is provided across the plurality of leads 10 so as to overlap the connection portion 12 in plan view. A load applied to the connecting portion 12 of the lead 10 is dispersed to the other leads 10 via the reinforcing plate 30.
From this, the first sensor device 1 can avoid the bending of the lead 10 due to the external force applied to the connecting portion 12 even when the lead 10 is relatively thin.
Therefore, the first sensor device 1 does not need to increase the individual rigidity of the lead 10 by increasing the thickness of the lead 10 as in the prior art, so the width of the lead 10 is increased, the pitch between the leads 10 is increased, It is not necessary to increase the curvature of the corner radius of the lead 10.
As a result, the first sensor device 1 can avoid the increase in size of the first sensor device 1 because the size of the lead 10 is not required.

In the first sensor device 1, when the lead 10 is supported by an external member so that a space is formed on the other main surface 20 b side of the vibration gyro element 20, the vibration gyro element 20 is connected to the lead 10. The wire 40 is suspended.
Thereby, the 1st sensor device 1 can reduce generation | occurrence | production of the stress resulting from the connection to the other member of the vibration gyro element 20, and inhibition of a vibration.
In the first embodiment, four reinforcing plates 30 are used. However, the four reinforcing plates 30 may be integrated into one by using the opening 31 as a through hole. This also applies to the following embodiments.

(Second Embodiment)
FIG. 4 is a schematic diagram illustrating a schematic configuration of the sensor device according to the second embodiment. 4A is a plan view seen from the lead side, FIG. 4B is a cross-sectional view taken along line FF in FIG. 4A, and FIG. 4C is a reinforcing plate. It is the top view seen from the side.
In addition, about the common part with the said 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted and it demonstrates centering on a different part from the said 1st Embodiment.

  As shown in FIG. 4, the second sensor device 2 as the sensor device has a lead 10 having one surface 11 or the other surface 13 and one main of the vibrating gyro element 20 as compared with the first sensor device 1. The difference is that the angle θ formed with the surface 20a or the other main surface 20b is bent so as to be substantially a right angle.

  According to this, in the second sensor device 2 of the second embodiment, in addition to the effect produced by the first sensor device 1, for example, the second sensor device 2 accommodates the one end portion 14 of the bent lead 10. By mounting on the inner surface of the package that is substantially parallel to the bottom surface of the package as an external member, the angle formed between the bottom surface and one main surface 20a or the other main surface 20b of the vibration gyro element 20 is substantially perpendicular. Can be.

That is, the second sensor device 2 can be provided with one of the bottom surface and the vibration gyro element 20 without arranging the sensor device on the side surface inside the package where the angle between the bottom surface and the bottom surface of the package is substantially a right angle. The angle formed by the main surface 20a or the other main surface 20b can be made to be a substantially right angle.
Therefore, the second sensor device 2 does not require an improvement in processing accuracy such as an angle between the surfaces of the package.
In FIG. 4B, the second sensor device 2 has the lead 10 bent downward (on the other surface 13) in the drawing, but may be bent upward (on the one surface 11). .

(Third embodiment)
FIG. 5 is a schematic diagram illustrating a schematic configuration of a gyro sensor as a motion sensor according to the third embodiment. FIG. 5A is a plan view seen from the lid (lid) side, and FIG. 5B is a cross-sectional view taken along the line HH in FIG. In the plan view, the lid is omitted for convenience.
In addition, portions common to the first and second embodiments are denoted by the same reference numerals, description thereof is omitted, and portions different from the first and second embodiments are mainly described.

  As shown in FIG. 5, the gyro sensor 3 as a motion sensor includes one first sensor device 1, two second sensor devices 2, and an IC as a circuit element that drives a vibration gyro element 20 of each sensor device. (Integrated Circuit) A chip 60 and a substantially rectangular parallelepiped package 70 that accommodates each sensor device therein, and each sensor device and IC chip 60 are accommodated inside the package 70.

The package 70 includes a package base 72 having a recess 71 and a lid 73 that covers the recess 71.
For the package base 72, an aluminum oxide sintered body obtained by forming, laminating and firing ceramic green sheets is used. The lid 73 is made of a metal such as Kovar, glass, ceramic, or the like.

The first sensor device 1 is accommodated in the package 70 so that one main surface 20a or the other main surface 20b of the vibrating gyro element 20 and the bottom surface 74 of the package 70 are substantially parallel to each other.
More specifically, in the first sensor device 1, the one end portion 14 of each lead 10 is formed by a bonding member 51 having conductivity such as a conductive adhesive or solder, and the bottom surface 74 of the package base 72 of the recess 71 of the package base 72. Are fixed to an internal electrode 76a formed on an inner bottom surface 75 substantially parallel to the inner surface 75a.
Thereby, the first sensor device 1 is electrically connected to the internal electrode 76a.

  In the two second sensor devices 2, the angle θ <b> 1 formed by one main surface 20 a or the other main surface 20 b of each vibration gyro element 20 is substantially perpendicular, and one main surface of each vibration gyro element 20. 20a or the other main surface 20b and one main surface 20a or the other main surface 20b of the vibrating gyro element 20 of the first sensor device 1 are accommodated inside the package 70 so that an angle θ2 is substantially a right angle. ing.

Specifically, in the two second sensor devices 2, one end portion 14 of each lead 10 is formed by the bonding member 51, and in the one second sensor device 2, the internal electrodes 76 a are arranged in the inner bottom surface 75 of the package base 72. It is fixed to the internal electrodes 76b arranged in the same direction, and in the other second sensor device 2, it is fixed to the internal electrodes 76c arranged in a direction orthogonal to the direction in which the internal electrodes 76a are arranged.
Thus, the two second sensor devices 2 are arranged on the inner bottom surface 75 of the package base 72 similarly to the first sensor device 1, and are electrically connected to the internal electrodes 76b and 76c.
In each sensor device, the angles θ1 and θ2 formed by one main surface 20a or the other main surface 20b of each vibration gyro element 20 are substantially perpendicular.

A recess 78 having a stepped portion 77 is formed on the inner bottom surface 75 of the recess 71 of the package base 72.
The IC chip 60 is fixed to the recess 78 with an adhesive (not shown). The IC chip 60 is provided with a drive circuit for driving and vibrating the vibration gyro element 20 of each sensor device and a detection circuit for detecting a detection vibration generated in the vibration gyro element 20 when an angular velocity is applied.

The connection terminal 61 of the IC chip 60 is connected to the internal terminal 79 formed on the stepped portion 77 of the package base 72 by the wire 41. The wire 41 is made of metal such as gold or aluminum.
On the bottom surface 74 of the package base 72, an external terminal 74a used when mounted on an external device or the like is formed.
The internal terminal 79 is connected to the internal electrodes 76a, 76b, 76c, the external terminal 74a, and the like by internal wiring (not shown).
Thereby, in the gyro sensor 3, the external terminal 74a, the internal terminal 79, each internal electrode, and the IC chip 60 are electrically connected.
The external terminal 74a, the internal terminal 79, and each internal electrode are made of a metal film in which a film made of nickel, gold or the like is laminated on a metallized layer such as tungsten by plating.

In the gyro sensor 3, the lid 73 is bonded to the package base 72 by a bonding member 52 such as a seam ring or low-melting glass in a state where each sensor device, IC chip 60, and the like are accommodated inside the package base 72. .
Thereby, the inside of the package 70 is hermetically sealed. Note that the inside of the package 70 is preferably maintained in a vacuum state (a high degree of vacuum) so that the vibration of the vibration gyro element 20 of each sensor device is not hindered.

Here, an outline of the operation of the gyro sensor 3 will be described.
Here, the bottom surface 74 of the package 70 (package base 72) is parallel to the X ′ axis, the Y ′ axis, and the Z ′ axis, which are three axes orthogonal to each other, parallel to the X ′ axis and the Y ′ axis, and Z ′. It shall be orthogonal to the axis.
As a result, when the attitude of the gyro sensor 3 changes due to an external force or the like and an angular velocity is applied, the one main surface 20a or the other main surface 20b of the vibration gyro element 20 and the bottom surface 74 of the package 70 become substantially parallel. As described above, the first sensor device 1 housed in the package 70 has the Z ′ axis because the one main surface 20a or the other main surface 20b of the vibrating gyro element 20 and the Z ′ axis are substantially orthogonal to each other. Detect the angular velocity with respect to the axis.

  On the other hand, an angle θ1 formed by one main surface 20a or the other main surface 20b of each vibration gyro element 20 is substantially a right angle, and one main surface 20a or the other main surface 20b of each vibration gyro element 20 is. And two second sensors housed in the package 70 so that an angle θ2 formed by one main surface 20a or the other main surface 20b of the vibration gyro element 20 of the first sensor device 1 is substantially a right angle. One of the devices 2 detects the angular velocity with respect to the X ′ axis because one main surface 20a or the other main surface 20b of the vibrating gyro element 20 and the X ′ axis are substantially orthogonal to each other. Since one main surface 20a or the other main surface 20b of the gyro element 20 and the Y ′ axis are substantially orthogonal to each other, the angular velocity with respect to the Y ′ axis is detected.

Accordingly, the gyro sensor 3 can detect angular velocities with respect to the X ′ axis, the Y ′ axis, and the Z ′ axis, which are three axes orthogonal to each other.
Therefore, the gyro sensor 3 is used for camera shake correction of an imaging device, vehicle attitude detection, attitude control, and the like in a mobile navigation system using GPS (Global Positioning System) satellite signals.

Here, the manufacturing method of the gyro sensor 3 including the manufacturing method of the 1st sensor device 1 and the 2nd sensor device 2 is demonstrated.
FIG. 6 is a flowchart showing the manufacturing process of the gyro sensor, and FIGS. 7 to 12 are schematic diagrams for explaining each manufacturing process.
FIG. 7A is a plan view seen from one surface side of the lead, and FIG. 7B is a plan view seen from the other surface side of the lead.
FIG. 8A is a plan view seen from one side of the lead, FIG. 8B is a cross-sectional view, and the cross-sectional position is the same as FIG. 1B.
FIG. 9 is a cross-sectional view, and the cross-sectional position is the same as that in FIG.
10 and 11 are cross-sectional views, and the cross-sectional positions are the same as those in FIG.
12A is a plan view seen from the lid side, FIG. 12B is a cross-sectional view, and the cross-sectional position is the same as FIG. 5B.

  As shown in FIG. 6, the manufacturing method of the gyro sensor 3 includes a lead frame preparation step S1, a reinforcing plate joining step S2, a vibrating gyro element preparation step S3, a wire connection step S4, a lead bending step S5, a lead It includes a cutting step S6, a package preparation step S7, an IC chip preparation step S8, an IC chip mounting step S9, a sensor device mounting step S10, and a lid bonding step S11.

[Lead frame preparation step S1]
First, as shown in FIG. 7A, a lead frame 15 having a plurality of leads 10 having connection portions 12 formed on one surface 11 is prepared.
The lead frame 15 is formed with a frame 16 so as to surround the plurality of leads 10, and the lead 10 is connected to one side 16 a of the frame 16. In general, the lead frame 15 is formed, for example, in a strip shape continuously in the vertical direction of the paper, and is formed such that a plurality of sets of leads 10 are connected.
Note that the lead frame 15 may be formed individually instead of in a strip shape.

[Reinforcing plate joining step S2]
Next, as shown in FIG. 7B, the reinforcing plate straddling the plurality of leads 10 so as to overlap the connecting portions 12 in plan view on the other surface 13 of the lead 10 that forms a front-back relationship with the one surface 11. 30 is joined by the joining member 50 (refer FIG. 1), such as an adhesive agent.

[Vibrating Gyro Element Preparation Step S3]
Next, a flat plate-like vibrating gyro element 20 having one main surface 20a and the other main surface 20b is prepared.

[Wire connection process S4]
Next, as shown in FIG. 8A, after joining the reinforcing plate 30 to the lead 10, the vibration gyro element 20 is located below the reinforcing plate 30 (back side in the drawing), and the base 21 of one main surface 20 a. A lead electrode (not shown) formed in the portion is disposed so as to be exposed from the opening 31, and the connection portion 12 of the lead 10 and the lead electrode of the vibration gyro element 20 are connected by the wire 40.

At this time, as shown in FIG. 8B, the vibrating gyro element 20 is set at a predetermined position of the concave portion of the jig 80 of the wire bonding apparatus and sucked (vacuum suction) from the through hole 81.
Next, the reinforcing plate 30 portion of the lead frame 15 is placed on the jig 80, the other surface 13 side of the lead 10 is supported via the reinforcing plate 30, and the wire 40 is connected by the capillary 82.
At this time, bending of the lead 10 is avoided by supporting the other surface 13 side of the lead 10 with the reinforcing plate 30. Further, the reinforcing plate 30 secures a space for the vibrating gyro element 20 not to contact the lead 10.
Thus, the vibrating gyro element 20 is supported in a suspended state by the wire 40 connected to the lead 10.

[Lead bending step S5]
Next, as shown in FIG. 9, after joining the reinforcing plate 30 to the lead 10, one main surface 20 a or the other main surface 20 b of the vibration gyro element 20, one surface 11 or the other surface 13 of the lead 10, The lead 10 is bent so that the angle θ formed by
At this time, since the reinforcing plate 30 straddles the plurality of leads 10, the bending angle variation (twist) between the leads 10 is suppressed.
Here, the bending direction is bent toward the other surface 13 side, but may be bent toward the one surface 11 side.
For the first sensor device 1, this process is not performed and the process proceeds to the lead cutting process S6.

[Lead cutting step S6]
Next, after bending the lead 10, the lead 10 is separated from the lead frame 15 in a state where the lead 10 and the vibration gyro element 20 are connected by the wire 40, thereby forming the second sensor device 2 as shown in FIG. 4.
In addition, about the 1st sensor device 1, after wire connection process S4, the lead | read | reed 10 is cut | disconnected from the lead frame 15, and the 1st sensor device 1 as shown in FIG. 1 is formed.
Thus far, the first sensor device 1 and the second sensor device 2 are manufactured.

[Package preparation step S7]
Next, as shown in FIG. 10, a package base 72 of a package 70 that accommodates each sensor device is prepared. The lid 73 may be prepared in this step, but may be prepared by the lid joining step S11 described later.

[IC chip preparation step S8]
Next, an IC chip 60 for driving the vibration gyro element 20 of each sensor device is prepared.

[IC chip mounting step S9]
Next, as shown in FIG. 11, the IC chip 60 is fixed to the recess portion 78 of the package base 72 with an adhesive (not shown), and the connection terminals 61 of the IC chip 60 and the internal portions formed in the stepped portion 77 of the package base 72 are formed. The terminal 79 is connected by the wire 41.
Thereby, the IC chip 60 is accommodated in the package 70 in the IC chip mounting step S9.

[Sensor device mounting step S10]
Then, as shown in FIG. 12, the first sensor device 1 is connected to the lead 10 so that the one main surface 20a or the other main surface 20b of the vibrating gyro element 20 and the bottom surface 74 of the package base 72 are substantially parallel. Is fixed to the internal electrode 76 a of the inner bottom surface 75 of the package base 72 by the bonding member 51.

Subsequently, the angle θ1 formed by one main surface 20a of each vibration gyro element 20 or the other main surface 20b of the two second sensor devices 2 is substantially a right angle, and one of the vibration gyro elements 20 is One end of the lead 10 so that an angle θ2 formed by the main surface 20a or the other main surface 20b and one main surface 20a or the other main surface 20b of the vibration gyro element 20 of the first sensor device 1 is substantially a right angle. The part 14 is fixed to the internal electrode 76b of the inner bottom surface 75 for one second sensor device 2, and is fixed to the internal electrode 76c of the inner bottom surface 75 for the other second sensor device 2.
In other words, the one end portion 14 of the lead 10 is set so that the angle θ3 formed by one main surface 20a or the other main surface 20b of each vibration gyro element 20 and the bottom surface 74 of the package base 72 is substantially a right angle. The one second sensor device 2 is fixed to the internal electrode 76b of the package base 72, and the other second sensor device 2 is fixed to the internal electrode 76c.
Thereby, each sensor device is accommodated in the package base 72 (package 70).

[Lid joining step S11]
Next, the lid 73 is joined to the package base 72 by the joining member 52 in a vacuum state (high vacuum state), and the inside of the package 70 is hermetically sealed. Thereby, the inside of the package 70 is kept in a vacuum state.

A gyro sensor 3 as shown in FIG. 5 is obtained through the above steps.
Note that the vibration gyro element preparation step S3, the package preparation step S7, and the IC chip preparation step S8 may be performed, for example, before the lead frame preparation step S1, or in short, may be performed up to the step of using the constituent elements. .
Further, the wire connecting step S4 may be performed between the lead bending step S5 and the lead cutting step S6.

  As described above, the gyro sensor 3 of the third embodiment includes the first sensor device 1 of the first embodiment and the second sensor device 2 of the second embodiment. It is possible to provide a gyro sensor including a sensor device that exhibits the same effects as those of the second embodiment and the second embodiment.

Further, the gyro sensor 3 has three sensor devices, and the packages are arranged so that the angles θ1 and θ2 formed by one main surface 20a or the other main surface 20b of each vibration gyro element 20 are substantially perpendicular. 70 is housed inside.
From this, the gyro sensor 3 can provide a gyro sensor corresponding to three axes orthogonal to each other.
In addition, the gyro sensor 3 determines the three axes from the Z ′ axis substantially orthogonal to the bottom surface 74 of the package 70 and the X ′ axis and Y ′ axis substantially parallel to the bottom surface 74 of the package 70 and orthogonal to each other. Can be.

The gyro sensor 3 fixes the one end portion 14 of the lead 10 of the first sensor device 1 to an inner bottom surface 75 substantially parallel to the bottom surface 74 of the package 70, and bends each second sensor device 2 to the same inner bottom surface 75. By fixing one end portion 14 of the lead 10 to the internal electrode 76b and the internal electrode 76c whose direction of alignment is orthogonal to each other, one main surface 20a or the other main surface 20b of the vibration gyro element 20 of each sensor device The angles θ1 and θ2 formed by each other can be substantially perpendicular.
As a result, the gyro sensor 3 is different from the conventional case in which each sensor device is arranged and fixed on each surface inside the package 70 in mounting each sensor device. Since work such as changing the posture can be abolished, the number of mounting steps can be reduced.

In addition, since the gyro sensor 3 can mount each sensor device on the inner bottom surface 75 which is the same surface inside the package 70, compared with the conventional case where each sensor device is mounted on each surface inside the package 70. Thus, variations in the angles θ1 and θ2 formed by one main surface 20a or the other main surface 20b of the vibration gyro element 20 of each sensor device do not depend on the processing accuracy of the package 70.
Therefore, the gyro sensor 3 does not need to improve the processing accuracy such as the angle formed between the surfaces of the package 70.

Further, since the gyro sensor 3 includes the IC chip 60 that drives the vibration gyro element 20 inside the package 70, the IC chip 60 is protected from the external environment by the package 70, and the IC chip 60 is provided outside. Compared to the case, the reliability can be improved.
Further, the gyro sensor 3 is improved in usability as an electronic device by incorporating the vibration gyro element 20 and the IC chip 60 in the package 70.

The gyro sensor 3 is manufactured by joining the reinforcing plate 30 straddling the plurality of leads 10 so as to overlap with the connecting portions 12 in plan view on the other surface 13 of the lead 10, and then connecting the leads 10 with the wires 40. The unit 12 and the vibration gyro element 20 are connected.
From this, the manufacturing method of the gyro sensor 3 can disperse the load applied to the connecting portion 12 of the lead 10 to the other leads 10 via the reinforcing plate 30.

Thereby, even if the manufacturing method of the gyro sensor 3 cannot support the back side of the connection part 12 of the lead | read | reed 10, the bending of the lead | read | reed 10 by the external force added to the connection part 12 can be avoided.
As a result, the manufacturing method of the gyro sensor 3 improves the connection reliability because the wire 40 can be connected to the connecting portion 12 of the lead 10 and the vibration gyro element 20 by wire bonding with a proven track record using a wire bonding apparatus. Can be made.

  In addition, since the vibrating gyro element 20 is supported in a suspended state by the wire 40 connected to the lead 10, the manufacturing method of the gyro sensor 3 generates stress due to the connection of the vibrating gyro element 20 to other members, Vibration inhibition can be reduced.

Further, the gyro sensor 3 is manufactured by joining the reinforcing plate 30 to the lead 10, and then connecting one main surface 20 a or the other main surface 20 b of the vibrating gyro element 20 and one surface 11 or the other surface 13 of the lead 10. The lead 10 is bent so that the angle θ formed by
Thereby, the manufacturing method of the gyro sensor 3 can suppress the dispersion | variation in the bending angle between each lead 10 at the time of bending of the lead 10 with the reinforcement board 30 joined ranging over the some lead 10. FIG.

  In addition, since the gyro sensor 3 is manufactured by preparing the IC chip 60 for driving the vibrating gyro element 20 and accommodating it in the package 70, the reliability of the gyro sensor 3 and the usability as an electronic device are improved. Can do.

(Modification)
Here, a modification of the third embodiment will be described.
FIG. 13 is a schematic diagram illustrating a schematic configuration of a gyro sensor as a motion sensor according to a modification of the third embodiment. 13A is a plan view seen from the lid side, and FIG. 13B is a cross-sectional view taken along line JJ of FIG. In the plan view, the lid is omitted for convenience.
In addition, portions common to the third embodiment are denoted by the same reference numerals, description thereof is omitted, and portions different from the third embodiment will be mainly described.

As shown in FIG. 13, in the gyro sensor 4 as a motion sensor, the connection terminals 61 of the IC chip 60 are connected to the internal terminals 179 by the bumps 42.
More specifically, in the gyro sensor 4, an internal terminal 179 is formed on the bottom surface of the recess 178 of the package base 172 of the package 170, and the IC chip 60 is disposed so that the internal terminal 179 and the connection terminal 61 face each other. The connection terminal 61 of the IC chip 60 is connected to the internal terminal 179 by a bump 42 made of a metal such as gold or solder.
For this connection, flip chip mounting is used.

According to this, the gyro sensor 4 does not require the wire 41 as compared with the third embodiment. Further, the gyro sensor 4 can reduce the total thickness by subtracting the thickness of the bump 42 and the thickness of the internal terminal 179 from the height of the unnecessary wire 41.
This modification is also applied to the following embodiments.
Further, the manufacturing method of the gyro sensor 4 conforms to the manufacturing method of the gyro sensor 3 except for the mounting method of the IC chip 60.

(Fourth embodiment)
FIG. 14 is a schematic diagram illustrating a schematic configuration of a gyro sensor as a motion sensor according to the fourth embodiment. FIG. 14A is a plan view seen from the lid side, and FIG. 14B is a cross-sectional view taken along line KK in FIG. In the plan view, the lid is omitted for convenience.
In addition, portions common to the third embodiment are denoted by the same reference numerals, description thereof is omitted, and portions different from the third embodiment will be mainly described.

As shown in FIG. 14, the gyro sensor 5 as the motion sensor is not mounted with the first sensor device 1 as compared with the third embodiment.
As a result, the gyro sensor 5 does not require the components related to the first sensor device 1 such as the recess portion 78 (see FIG. 5) of the package base 272 of the package 270 and the internal electrode 76a. A terminal 279 is formed, and the connection terminal 61 of the IC chip 60 fixed to the inner bottom surface 75 and the internal terminal 279 are connected by the wire 41.
Further, the two second sensor devices 2 are configured so that an angle θ3 formed by one main surface 20a or the other main surface 20b of each vibration gyro element 20 and the bottom surface 74 of the package base 272 is substantially a right angle. One end 14 of the lead 10 is fixed to the internal electrode 76b on the inner bottom surface 75 of the package base 272 for one second sensor device 2, and the internal electrode 76c on the inner bottom surface 75 for the other second sensor device 2. It is fixed to.

As described above, since the gyro sensor 5 according to the fourth embodiment includes the second sensor device 2 according to the second embodiment, the gyro sensor 5 includes a sensor device that achieves the same effects as the second embodiment. Gyro sensor can be provided.
In addition, the gyro sensor 5 of the fourth embodiment has an angle θ1 formed by one main surface 20a or the other main surface 20b of the vibration gyro element 20 of each second sensor device 2 and is substantially perpendicular to each other. A gyro sensor corresponding to two orthogonal axes can be provided.

Further, the gyro sensor 5 includes an internal electrode 76b and an internal electrode 76c in which the end portions 14 of the leads 10 of the respective second sensor devices 2 are arranged on the same surface (inner bottom surface 75) inside the package 270 and in which the arrangement directions are orthogonal to each other The angle θ1 formed by one main surface 20a or the other main surface 20b of the vibration gyro element 20 of each second sensor device 2 can be made substantially perpendicular.
From this, the gyro sensor 5 can have the same effects as those of the third embodiment when the second sensor devices 2 are mounted.

Further, the gyro sensor 5 is configured such that each second sensor device 2 has an angle θ3 formed by one main surface 20a or the other main surface 20b of the vibration gyro element 20 and the bottom surface 74 of the package 270 substantially at right angles. Further, it is housed inside the package 270.
Accordingly, the gyro sensor 5 can provide a gyro sensor corresponding to two axes of the X ′ axis and the Y ′ axis that are substantially parallel to the bottom surface 74 of the package 270 and orthogonal to each other.

Further, the gyro sensor 5 does not have the recess 78 (see FIG. 5) of the package base 272, the internal terminal 279 is formed on the inner bottom surface 75 of the package base 272, and the IC chip 60 is fixed to the inner bottom surface 75 of the package base 272. Therefore, compared with the third embodiment, the thickness of the portion including the bottom surface 74 of the package base 272 can be reduced.
As a result, the gyro sensor 5 can reduce the total thickness.
In addition, the manufacturing method of the gyro sensor 5 is based on the manufacturing method of the gyro sensor 3.

(Fifth embodiment)
FIG. 15 is a schematic diagram illustrating a schematic configuration of a gyro sensor as a motion sensor according to the fifth embodiment. FIG. 15A is a plan view seen from the lid side, and FIG. 15B is a cross-sectional view taken along line LL in FIG. In the plan view, the lid is omitted for convenience.
In addition, portions common to the third embodiment are denoted by the same reference numerals, description thereof is omitted, and portions different from the third embodiment will be mainly described.

As shown in FIG. 15, the gyro sensor 6 as a motion sensor is not provided with two second sensor devices 2 as compared with the third embodiment.
Thereby, the gyro sensor 6 does not require the components related to the two second sensor devices 2 such as the arrangement space of the two second sensor devices 2 and the internal electrodes 76b and 76c.
Accordingly, the gyro sensor 6 can reduce the planar size of the package base 372 and the lid 373 of the package 370 and reduce the thickness.

As a result, the gyro sensor 6 can provide a gyro sensor corresponding to one axis of the Z ′ axis perpendicular to the bottom surface 74 of the package 370, which has a smaller planar size and a thinner total thickness than the third embodiment.
Moreover, since the gyro sensor 6 of the fifth embodiment includes the first sensor device 1 of the first embodiment, the gyro sensor including the sensor device that exhibits the same effect as that of the first embodiment is provided. Can be provided.
In addition, the manufacturing method of the gyro sensor 6 is based on the manufacturing method of the gyro sensor 3.

In the third to fifth embodiments and the modified examples, the IC chip 60 for driving the vibrating gyro element 20 is built in each package. However, the present invention is not limited to this, and the IC chip 60 is externally attached. As an alternative, the vibration gyro element 20 may be driven from the outside.
According to this, each gyro sensor can simplify the structure inside each package.

In each of the above-described embodiments and modifications, the base material of the vibrating gyro element 20 is quartz, but is not limited to this. For example, lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B) ₄ O ₇ ), lithium niobate (LiNbO ₃ ), lead zirconate titanate (PZT), zinc oxide (ZnO), aluminum nitride (AlN), or other piezoelectric materials, or zinc oxide, aluminum nitride, etc. It may be silicon provided as

In each of the above-described embodiments and modifications, the vibration gyro element 20 is given as an example of the sensor element of each sensor device. However, the present invention is not limited to this. For example, an acceleration sensing element that reacts to acceleration, and a reaction to pressure. It may be a pressure sensing element, a weight sensing element that reacts to weight, or the like.
In the third to fifth embodiments and the modified examples, the gyro sensor is exemplified as the motion sensor. However, the present invention is not limited to this, and for example, a sensor device including the acceleration sensing element is used. An acceleration sensor, a pressure sensor using a sensor device including a pressure sensing element, a weight sensor using a sensor device including a weight sensing element, and the like may be used.

  DESCRIPTION OF SYMBOLS 1 ... 1st sensor device as a sensor device, 2 ... 2nd sensor device as a sensor device, 3 ... Gyro sensor as a motion sensor, 4 ... Gyro sensor as a motion sensor, 5 ... Gyro sensor as a motion sensor, 6 ... Gyro sensor as a motion sensor, 10 ... Lead, 10a, 10b, 10c, 10d, 10e, 10f ... Individual lead, 11 ... One surface, 12 ... Connector, 13 ... Other surface, 14 ... One end, DESCRIPTION OF SYMBOLS 15 ... Lead frame, 16 ... Frame, 16a ... One side, 20 ... Vibrating gyro element as sensor element, 20a ... One main surface, 20b ... The other main surface, 21 ... Base part, 22a, 22b ... Vibrating arm for detection, 23a, 23b ... connecting arm, 24a, 24b, 25a, 25b ... drive Vibrating arm, 26a, 26b, 27a, 27b, 28a, 28b ... weight, 30 ... reinforcing plate, 30a, 30b, 30c, 30d ... individual reinforcing plate, 31 ... opening, 40, 41 ... wire, 42 ... bump , 50, 51, 52 ... joining member, 60 ... IC chip, 61 ... connection terminal, 70 ... package, 71 ... recess, 72 ... package base, 73 ... lid, 74 ... bottom surface, 74a ... external terminal, 75 ... inner bottom surface 76a, 76b, 76c ... internal electrode, 77 ... stepped portion, 78 ... recessed portion, 79 ... internal terminal, 80 ... jig, 81 ... through hole, 82 ... capillary, 170 ... package, 172 ... package base, 178 ... Recessed portion, 179 ... internal terminal, 270 ... package, 272 ... package base, 279 ... internal terminal, 370 ... package, 372 ... package base, 373 Lid.

Claims (15)

A connecting portion formed on one surface of the plurality of leads;
A sensor element connected to the connection by a wire;
A reinforcing plate joined to the other surface of the lead that forms a front-back relationship with the one surface;
The reinforcing plate is provided across the plurality of leads so as to overlap the connecting portion in plan view.   The sensor device according to claim 1, wherein the sensor element is supported in a suspended state by a wire connected to the lead.   3. The sensor device according to claim 1, wherein the lead is bent so that an angle formed between the one surface or the other surface and a main surface of the sensor element is substantially a right angle. A sensor device characterized by that. A connecting portion formed on one surface of the plurality of leads;
A sensor element connected to the connection by a wire;
A reinforcing plate joined to the other surface forming a front-back relationship with the one surface of the lead;
A sensor device provided across the plurality of leads so that the reinforcing plate overlaps the connecting portion in plan view;
A package for accommodating the sensor device therein,
A motion sensor, wherein the sensor device is accommodated in the package.   5. The motion sensor according to claim 4, wherein the sensor device has the sensor element supported in a suspended state by a wire connected to the lead.   6. The motion sensor according to claim 4, wherein the lead is bent so that an angle formed between the one surface or the other surface of the lead and a main surface of the sensor element is substantially a right angle. A motion sensor characterized by   The motion sensor according to claim 4, further comprising a circuit element that drives the sensor device inside the package. A connecting portion formed on one surface of the plurality of leads;
A sensor element connected to the connection by a wire;
A reinforcing plate joined to the other surface forming a front-back relationship with the one surface of the lead;
Have
A plurality of sensor devices provided across the plurality of leads so that the reinforcing plate overlaps the connecting portion in plan view;
A package for accommodating the plurality of sensor devices therein,
The motion is characterized in that the plurality of sensor devices are arranged in such a manner that an angle formed between main surfaces of the sensor elements of each of the plurality of sensor devices is substantially perpendicular, and is accommodated in the package. sensor.   9. The motion sensor according to claim 8, wherein the sensor elements of the plurality of sensor devices are supported in a suspended state by wires connected to the leads.   10. The motion sensor according to claim 8, wherein at least one sensor device of the plurality of sensor devices is formed by the one surface or the other surface of the lead and the main surface of the sensor element. A motion sensor, wherein the lead is bent so that the angle is substantially a right angle.   11. The motion sensor according to claim 8, further comprising a circuit element that drives the sensor device inside the package.   12. The motion sensor according to claim 8, wherein in at least one sensor device of the plurality of sensor devices, the main surface of the sensor element and a bottom surface of the package are substantially parallel. The motion sensor is housed inside the package as described above. Preparing a lead frame having a plurality of leads having connection portions formed on one surface;
Preparing a sensor element;
Bonding a reinforcing plate straddling the plurality of leads so as to overlap the connecting portion in a plan view on the other surface forming a front-back relationship with the one surface of the lead;
After joining the reinforcing plate to the lead, the step of connecting the connection portion and the sensor element by a wire,
The method of manufacturing a sensor device, wherein the sensor element is supported in a suspended state by a wire connected to the lead. Preparing a plurality of lead frames having a plurality of leads having connection portions formed on one surface;
Preparing a plurality of sensor elements;
Bonding a plurality of reinforcing plates straddling the plurality of leads so as to overlap the connecting portion in a plan view on the other surface forming a front-back relationship with the one surface of the lead;
After joining the reinforcing plate to the lead, forming a plurality of sensor devices by connecting the connection portion and the sensor element by a wire;
Preparing a package containing the sensor device;
Containing the sensor device in the package,
The sensor element is supported in a suspended state by a wire connected to the lead, and the angle formed between the principal surfaces of the sensor elements of each of the plurality of sensor devices is substantially a right angle. A method of manufacturing a motion sensor, characterized by being arranged as described above. The method of manufacturing a motion sensor according to claim 14, wherein preparing a circuit element for driving the sensor element;
And a step of accommodating the circuit element in the package.

Images