JP2019169796A - Vibration device, electronic apparatus, and movable body - Google Patents

Abstract

To provide a vibration device that can reduce a stress generated in a vibration element, and to provide an electronic apparatus and a movable body including the vibration device.SOLUTION: A vibration device comprises: a vibration element; a circuit element; a relay board that is arranged between the vibration element and the circuit element; a package that accommodates the vibration element, the circuit element, and the relay board; bonding wires that connect the package with the circuit element; first metal bumps that join the circuit element to the relay board; and second metal bumps that join the relay board to the vibration element.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a vibration device, an electronic apparatus, and a moving object.

  2. Description of the Related Art Conventionally, as represented by a crystal oscillator, for example, a vibration device including a vibration element and a circuit element is known. For example, a surface-mount type crystal oscillator described in Patent Document 1 is hermetically sealed with a crystal vibrating piece and an integrated circuit element, a base for arranging and holding the crystal vibrating piece, and a base bonded to the base. Including a lid for Here, the integrated circuit element is bonded to the base and the crystal vibrating piece via metal bumps.

JP 2012-134792 A

  However, in the surface mount type crystal oscillator described in Patent Document 1, since the resonator element and the integrated circuit element are joined by the metal bump, the stress generated in the resonator element is caused by the difference in the linear expansion coefficient. There is a problem that the characteristics such as the frequency temperature characteristics become worse due to the increase.

One embodiment of the present invention includes a vibration element;
Circuit elements;
A relay substrate disposed between the vibration element and the circuit element;
A package containing the vibration element, the circuit element and the relay board;
A bonding wire connecting the package and the circuit element;
A first metal bump joining the circuit element and the relay substrate;
A vibration device comprising a second metal bump joining the relay substrate and the vibration element.

  In one aspect of the present invention, it is preferable that the circuit element is supported by the bonding wire in a state of floating from the package.

In one aspect of the invention, the package comprises
A base having a recess;
A lid joined to the base so as to close the opening of the recess,
The circuit element is preferably arranged with its active surface facing the lid side.

In one aspect of the present invention, the relay board is located on the lid side of the circuit element,
It is preferable that the vibration element is located on the lid side with respect to the relay substrate.

  In one aspect of the present invention, it is preferable that a connection portion between the circuit element and the bonding wire does not overlap the relay substrate and the vibration element when viewed from the thickness direction of the relay substrate.

  In one aspect of the present invention, it is preferable that the second metal bump does not overlap the first metal bump when viewed in the thickness direction of the relay substrate.

In one aspect of the present invention, the relay board includes:
A frame-like support portion joined to the circuit element via the first metal bump;
A base located inside the support and to which the vibration element is joined via the second metal bump;
It is preferable to have a beam part connecting the support part and the base part.

In one aspect of the present invention, the relay board includes:
A frame-like support portion joined to the circuit element via the first metal bump;
A base located inside the support and to which the vibration element is joined via the second metal bump;
A frame-shaped relay part located inside the support part and arranged so as to surround the base part;
A first beam part connecting the base part and the relay part along a first axis;
It is preferable to have a second beam portion that connects the relay portion and the support portion along a second axis that intersects the first axis.

  One embodiment of the present invention is an electronic device including the vibration device of one embodiment of the present invention.

  One embodiment of the present invention is a moving object including the vibration device of one embodiment of the present invention.

It is sectional drawing which shows the vibration device which concerns on 1st Embodiment of this invention. It is a top view which shows the vibration device of FIG. It is a top view which shows a relay board | substrate. It is a bottom view which shows a relay board | substrate. It is a top view which shows the modification of a relay board | substrate. It is a top view which shows the modification of a relay board | substrate. It is a top view which shows a vibration element. It is a bottom view which shows a vibration element. It is a figure explaining the cut angle of a crystal. It is a top view which shows the relationship between the crystal axis of a relay substrate and a vibration element. It is sectional drawing which shows the vibration device which concerns on 2nd Embodiment of this invention. It is sectional drawing which shows the vibration device which concerns on 3rd Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 4th Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 5th Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 6th Embodiment of this invention. It is a perspective view which shows the mobile body which concerns on 7th Embodiment of this invention.

  Hereinafter, a vibrating device, an electronic apparatus, and a moving object of one embodiment of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
First, the vibration device according to the first embodiment of the invention will be described.

  FIG. 1 is a cross-sectional view showing a vibrating device according to a first embodiment of the present invention. FIG. 2 is a top view showing the vibrating device of FIG. FIG. 3 is a top view showing the relay substrate. FIG. 4 is a bottom view showing the relay board. 5 and 6 are top views showing modifications of the relay board, respectively. FIG. 7 is a top view showing the vibration element. FIG. 8 is a bottom view showing the vibration element. FIG. 9 is a diagram illustrating the cut angle of crystal. FIG. 10 is a top view illustrating the relationship between the crystal axes of the relay substrate and the vibration element. In the following, for convenience of explanation, the upper side in FIG. 1 is also referred to as “upper” and the lower side is also referred to as “lower”.

  As shown in FIGS. 1 and 2, the vibration device 1 includes a vibration element 2, a relay substrate 3, a circuit element 4, and a package 5 that stores these. In the package 5, the relay board 3 is located above the circuit element 4, the vibration element 2 is located above the relay board 3, and the circuit element 4, the relay board 3, and the vibration element 2 have the thickness of the package 5. Overlapping along the direction. Thus, by arranging the circuit element 4, the relay substrate 3, and the vibration element 2 so as to overlap each other, the planar expansion of the vibration device 1 can be suppressed, and the vibration device 1 can be downsized.

  The vibration element 2 is supported by the relay board 3, and the relay board 3 is supported by the circuit element 4. Thus, by interposing the relay substrate 3 between the vibration element 2 and the circuit element 4, for example, stress due to thermal deflection of the circuit element 4 becomes difficult to be transmitted to the vibration element 2. A decrease in vibration characteristics can be suppressed. Hereinafter, each part of such a vibration device 1 will be described in detail sequentially.

[package]
As shown in FIG. 1, the package 5 has a storage space S inside, and the vibration element 2, the relay substrate 3, and the circuit element 4 are stored in the storage space S. Therefore, the vibration element 2, the relay substrate 3, and the circuit element 4 can be suitably protected from impact, dust, heat, moisture, and the like by the package 5. Such a package 5 has an upper surface 51a and a lower surface 51b which are two main surfaces, a base 51 having a recess 511 that opens to the upper surface 51a, and an upper surface 51a of the base 51 so as to close the opening of the recess 511. And a joined lid 52.

  The recess 511 includes a first recess 511a that opens to the upper surface 51a of the base 51, and a second recess 511b that opens to the bottom surface of the first recess 511a. The lid 52 has a plate shape and is joined to the upper surface 51 a of the base 51 so as to close the opening of the recess 511. In this way, the storage space S is formed by closing the opening of the recess 511 with the lid 52, and the vibration element 2, the relay substrate 3, and the circuit element 4 are stored in the storage space S. The storage space S is hermetically sealed and is in a reduced pressure state (preferably in a state closer to a vacuum). Thereby, the vibration element 2 can be driven stably. However, the atmosphere of the storage space S is not particularly limited, and may be atmospheric pressure, for example.

  The constituent material of the base 51 is not particularly limited, and for example, various ceramics such as aluminum oxide can be used. In this case, the base 51 can be manufactured by firing a laminate of ceramic sheets. On the other hand, the constituent material of the lid 52 is not particularly limited, but may be a member whose linear expansion coefficient approximates that of the constituent material of the base 51. For example, when the constituent material of the base 51 is ceramic as described above, an alloy such as Kovar is preferable.

  The base 51 includes a plurality of internal terminals 53 disposed on the bottom surface of the first recess 511 a and a plurality of external terminals 54 disposed on the bottom surface 51 b of the base 51. Each of the plurality of internal terminals 53 is electrically connected to a predetermined external terminal 54 via an internal wiring (not shown) formed inside the base 51. The plurality of internal terminals 53 are electrically connected to the circuit element 4 through bonding wires BW. In the illustrated configuration, eight internal terminals 53 are provided, but the number of internal terminals 53 is not particularly limited.

[Circuit elements]
The circuit element 4 is, for example, a semiconductor circuit board in which various circuit elements are formed on a silicon substrate, and includes, for example, an oscillation circuit that oscillates the vibration element 2. As shown in FIG. 1, the circuit element 4 is disposed in the package 5 with the active surface 40 facing upward, that is, the lid 52 side. And the circuit element 4 is connected to the bottom face of the 1st recessed part 511a via the bonding wire BW. The circuit element 4 is supported by the base 51 in a state where it is suspended from the bonding wire BW and floated from the base 51, that is, in a state where a gap G is formed between the bottom surface of the second recess 511b. Thus, by floating the circuit element 4 from the base 51, deformation (stress) due to thermal deflection or the like of the package 5 is hardly transmitted to the circuit element 4. For this reason, the stress is more difficult to be transmitted to the vibration element 2, and the deterioration of the vibration characteristics of the vibration element 2 can be suppressed.

  Further, as shown in FIG. 2, the circuit element 4 has a plurality of terminals 41 and 42 arranged on the active surface 40, and among these, the plurality of terminals 41 are respectively connected via bonding wires BW. It is electrically connected to a predetermined internal terminal 53. Here, as described above, since the active surface 40 of the circuit element 4 faces the lid 52 side, the capillary can be pressed against the active surface 40 from the opening side of the recess 511, and the circuit element 4 by the bonding wire BW Connection with the base 51 is facilitated.

  Here, the relay board 3 is located on the lid 52 side with respect to the circuit element 4, and the vibration element 2 is located on the lid 52 side with respect to the relay board 3. Thereby, for example, the relay substrate 3 and the vibration element 2 can be arranged using a space for securing the height of the bonding wire BW. In other words, the bonding wire BW can be arranged by utilizing the space formed by arranging the relay substrate 3 and the vibration element 2 above the circuit element 4. Therefore, the vibration device 1 can be reduced in size, particularly reduced in height.

  Further, each terminal 41 is disposed so as not to overlap the relay board 3 and the vibration element 2 when viewed from the thickness direction of the relay board 3. That is, each terminal 41 is located outside the relay substrate 3 and the vibration element 2 when viewed from the thickness direction of the relay substrate 3. Thereby, a capillary can be easily pressed to the terminal 41, and the circuit element 4 and the bonding wire BW can be easily connected.

  Note that all or part of the bonding wires BW for suspending the circuit element 4 from the package 5 may be electrically effective, or may be a dummy (for example, a non-energized one). Good. In order to make the circuit element 4 float from the base 51, for example, the circuit element 4 is temporarily supported on the base 51 using an adhesive, and then the bonding wire BW is connected, and then the adhesive is dissolved. It may be removed by, for example.

[Relay board]
As shown in FIG. 1, the relay substrate 3 is interposed between the circuit element 4 and the vibration element 2. Such a relay substrate 3 mainly has a function of making it difficult for stress generated by deformation of the circuit element 4 to be transmitted to the vibration element 2.

  As shown in FIGS. 3 and 4, the relay substrate 3 includes a substrate 31 and a pair of wirings 38 and 39 disposed on the substrate 31. The substrate 31 has a gimbal shape. Specifically, the substrate 31 includes a frame-shaped support portion 32 fixed to the circuit element 4 via the first metal bumps B1, a frame-shaped relay portion 33 positioned inside the support portion 32, and a relay portion. A pair of beam portions 351 and 352 (second beam portions) which are located inside 33 and connect the base portion 34 to which the vibration element 2 is fixed via the second metal bump B2 and the support portion 32 and the relay portion 33. And a pair of beam portions 361 and 362 (first beam portions) that connect the relay portion 33 and the base portion 34.

  The support portion 32 has a rectangular frame shape and includes four extending portions 321, 322, 323, and 324. And the support part 32 is being fixed to the active surface 40 of the circuit element 4 via the 2nd 1st metal bump B1, respectively in the center part of the extension direction of the extension parts 321,322. As described above, by fixing both sides of the support portion 32 to the circuit element 4, the posture of the relay substrate 3 is stabilized, and unnecessary displacement, vibration, and the like of the relay substrate 3 can be suppressed. However, the number and arrangement of the first metal bumps B1 are not particularly limited, and may be arranged at each corner of the support portion 32, for example.

  By joining the relay substrate 3 and the circuit element 4 using the first metal bump B1 as the joining member, for example, compared to the case of joining using a conductive resin material as the joining member, outgas from the joining member Can be reduced, and environmental changes in the storage space S, particularly an increase in pressure, can be effectively suppressed. Therefore, it is possible to effectively suppress fluctuations in the vibration characteristics of the vibration element 2 due to environmental changes.

  The first metal bump B1 has a circular shape in plan view. In addition, the shape of 1st metal bump B1 is not limited to the shape shown in figure, For example, cylindrical shape, polygonal column shape, truncated cone shape, etc. may be sufficient. Further, the constituent material of the first metal bump B1 is not particularly limited. For example, a metal such as gold (Au), silver (Ag), copper (Cu), aluminum (Al), platinum (Pt), or an alloy thereof. Lead-free solder, leaded solder and the like. Further, the first metal bump B1 can be formed by using, for example, a plating method, a bonding method, or the like, and can be joined by pressure welding, heat pressure, ultrasonic combined heat pressure welding, or the like.

  The relay portion 33 located inside the support portion 32 has a rectangular frame shape and includes four extending portions 331, 332, 333, and 334. The base portion 34 located inside the relay portion 33 has a rectangular plate shape and includes four edge portions 341, 342, 343, and 344.

  The pair of beam portions 361 and 362 are located on both sides of the base portion 34 and connect the base portion 34 and the relay portion 33 so as to support the base portion 34 at both ends. Specifically, the beam portion 361 connects the extending portion 331 and the central portion in the extending direction of the edge portion 341, and the beam portion 362 is the central portion in the extending direction of the extending portion 332 and the edge portion 342. They are connected to each other. Therefore, the base portion 34 is supported with respect to the relay portion 33 along the first axis L <b> 1 formed by the pair of beam portions 361 and 362.

  The pair of beam portions 351 and 352 are located on both sides of the relay portion 33, and connect the relay portion 33 and the support portion 32 so as to support the relay portion 33 at both ends. Specifically, the beam portion 351 connects the central portions in the extending direction of the extending portions 323 and 333, and the beam portion 352 connects the central portions in the extending direction of the extending portions 324 and 334. ing. Therefore, the relay portion 33 is formed of a pair of beam portions 351 and 352 with respect to the support portion 32 and is supported along a second axis L2 that intersects the first axis L1.

  According to the substrate 31 having such a configuration, it is possible to meander the stress transmission path from the support portion 32 fixed to the circuit element 4 to the base 34 to which the vibration element 2 is fixed, and the transmission path is It can be secured as long as possible. Further, the support part 32 and the relay part 33 are easily deformed. Therefore, the stress generated by the deformation of the circuit element 4 is effectively absorbed and relaxed between the support portion 32 and the base portion 34. Accordingly, changes in the drive characteristics of the vibration element 2, particularly fluctuations in the vibration frequency are unlikely to occur, and the vibration element 2 can exhibit excellent vibration characteristics.

  In particular, in the present embodiment, the first axis L1 and the second axis L2 are orthogonal to each other in a plan view of the relay substrate 3, and the intersection of the first axis L1 and the second axis L2 is the center O of the substrate 31. Match. Thereby, the relay part 33 is supported by the support part 32 in a balanced manner, and the base part 34 is supported by the relay part 33 in a balanced manner.

  The substrate 31 as described above is made of quartz and is formed by patterning the quartz substrate by wet etching. In the present embodiment, the substrate 31 is formed of a Z-cut quartz substrate, and the normal lines of both main surfaces of the substrate 31 coincide with the Z axis (optical axis) that is the crystal axis of the quartz. Since the Z-axis is preferentially etched in comparison with the X-axis (electrical axis) and the Y-axis (mechanical axis), which are other crystal axes of quartz, etching is performed by forming the substrate 31 from a Z-cut quartz substrate. Time can be shortened. Further, since the etched surface (side surface formed by etching) becomes steeper, the relay substrate 3 can be formed with excellent dimensional accuracy.

  The Z-cut quartz plate is a crystal whose cut surface is substantially perpendicular to the Z axis. The cut surface perpendicular to the Z axis is the direction from the Y axis to the Z axis when viewed from the positive side of the X axis. Those cut out in a state of rotating counterclockwise or clockwise in the range of 0 degrees to several degrees are also included. However, the substrate 31 is not particularly limited, and a quartz substrate other than the Z-cut quartz substrate, for example, an X-cut quartz substrate, a Y-cut quartz substrate, an AT-cut quartz substrate, a BT-cut quartz substrate, an SC-cut quartz substrate, or an ST-cut quartz substrate. It may be formed from a quartz substrate or the like.

  The wiring 38 is routed across the support portion 32 and the base portion 34, and one end portion thereof is a terminal 381 located on the support portion 32, and the other end portion is a terminal 382 located on the base portion 34. . Similarly, the wiring 39 is routed across the support portion 32 and the base portion 34, one end of which is a terminal 391 located on the support portion 32, and the other end is a terminal 392 located on the base portion 34. It has become. The terminals 381 and 391 are each electrically connected to the terminal 42 of the circuit element 4 via the first metal bump B1, and the terminals 382 and 392 are connected to the vibration element 2 via the second metal bump B2. And are electrically connected.

  The relay board 3 has been described above, but the configuration of the relay board 3 is not limited to the above-described configuration. For example, as shown in FIG. 5, the substrate 31 may have a configuration in which the relay portion 33 and the beam portions 361 and 362 are omitted, and the base portion 34 is connected to the support portion 32 via the beam portions 351 and 352. Good. Further, as shown in FIG. 6, the substrate 31 may have a single plate shape instead of a gimbal shape.

  Moreover, although the support part 32 and the relay part 33 have comprised frame shape, respectively, a part of the circumferential direction may be missing. The first and second axes L1 and L2 may intersect at an angle smaller than 90 °, and the intersection of the first and second axes L1 and L2 coincides with the center O of the substrate 31. It does not have to be. One of the pair of beam portions 351 and 352 may be omitted, or one of the pair of beam portions 361 and 362 may be omitted.

  In the present embodiment, the substrate 31 is made of quartz, but the constituent material of the substrate 31 is not limited to this. For example, lithium niobate, lithium tantalate, lithium tetraborate, langalite Further, it may be composed of a piezoelectric single crystal (single crystal piezoelectric material) such as potassium niobate or gallium phosphate, or may be composed of other piezoelectric single crystals. Moreover, you may be comprised with other materials, for example, a resin material, a metal material, a glass material etc.

[Vibration element]
As illustrated in FIGS. 7 and 8, the vibration element 2 includes a vibration substrate 21 formed of a quartz substrate and an electrode 22 disposed on the vibration substrate 21. The vibration substrate 21 has a thickness shear vibration as a main vibration, and is formed of an AT-cut quartz substrate in the present embodiment. As shown in FIG. 9, the AT-cut quartz substrate is a “rotated Y-cut quartz substrate” cut out along a plane obtained by rotating the XZ plane around the X axis by an angle θ (= 35 ° 15 ′). Since the AT-cut quartz substrate has a third-order frequency temperature characteristic, the vibration element 2 having excellent temperature characteristics can be obtained by forming the vibration substrate 21 from the AT-cut quartz substrate. Hereinafter, the Y axis and the Z axis rotated around the X axis corresponding to the angle θ are referred to as a Y ′ axis and a Z ′ axis. That is, the vibration substrate 21 has a thickness in the Y′-axis direction and a spread in the XZ ′ plane direction.

  Such a vibration substrate 21 has a rectangular shape in plan view. In the present embodiment, the vibration substrate 21 is a rectangle whose longitudinal direction is the X-axis direction, but is not limited thereto, and may be a rectangle whose longitudinal direction is the Z′-axis direction or a square. Also good. The planar view shape of the vibration substrate 21 is not limited to a rectangle, and may be, for example, a circle, an oval, an ellipse, a rectangle other than a rectangle, or a polygon that is a pentagon or more.

  The electrode 22 includes a first excitation electrode 221 disposed on the upper surface 211 of the vibration substrate 21 and a second excitation electrode 222 disposed on the lower surface 212 so as to face the first excitation electrode 221. Further, the electrode 22 includes a first electrode pad 223 and a second electrode pad 224 that are disposed on the lower surface 212 of the vibration substrate 21. The electrode 22 includes a first wiring 225 that electrically connects the first electrode pad 223 and the first excitation electrode 221, and a second electrode that electrically connects the second electrode pad 224 and the second excitation electrode 222. Wiring 226. Then, by applying a drive signal between the first and second excitation electrodes 221 and 222 through the first and second electrode pads 223 and 224, the vibration substrate 21 undergoes thickness-shear vibration.

  Such a vibration element 2 is fixed to the base 34 of the relay substrate 3 via a pair of second metal bumps B2. In addition, the first electrode pad 223 of the vibration element 2 and the terminal 382 of the relay substrate 3 are electrically connected through one second metal bump B2, and the second electrode pad 224 of the vibration element 2 and the relay substrate are connected. 3 terminals 392 are electrically connected via the other second metal bump B2. Therefore, the vibration element 2 is electrically connected to the circuit element 4 via the wirings 38 and 39 of the relay substrate 3. As described above, the mechanical connection and the electrical connection between the vibration element 2 and the relay substrate 3 are performed by the second metal bump B2, so that the number of components of the vibration device 1 can be reduced, and the vibration can be reduced. The device 1 can be downsized.

  In this way, by joining the vibration element 2 and the relay substrate 3 using the second metal bump B2 as the joining member, for example, compared with the case of joining using a conductive resin material as the joining member Outgas from the members is reduced, and environmental changes in the storage space S, particularly an increase in pressure, can be effectively suppressed. Therefore, it is possible to effectively suppress fluctuations in the vibration characteristics of the vibration element 2 due to environmental changes.

  The second metal bump B2 is disposed so as not to overlap the first metal bump B1 when viewed from the thickness direction of the relay substrate 3. Thereby, the stress generated in the vibration element 2 can be further reduced.

  The second metal bump B2 is circular in plan view. The shape of the second metal bump B2 is not limited to the illustrated shape, and may be, for example, a cylindrical shape, a polygonal column shape, a truncated cone shape, or the like. Further, the constituent material of the second metal bump B2 is not particularly limited. For example, a metal such as gold (Au), silver (Ag), copper (Cu), aluminum (Al), platinum (Pt), or an alloy thereof. Lead-free solder, leaded solder and the like. Further, the second metal bump B2 can be formed by using, for example, a plating method, a bonding method, or the like, and can be joined by pressure welding, heating and pressure, ultrasonic combined heating pressure welding, or the like.

  Here, the vibration element 2 has spurious vibrations (unnecessary vibrations) such as bending vibration, torsional vibration, and contour vibration in addition to the thickness-shear vibration that is the main vibration, as the vibration mode. If these spurious vibrations have a vibration frequency close to the vibration frequency of the main vibration, the spurious vibration may be coupled to the main vibration. That is, spurious vibrations may be excited together with the main vibration. Then, due to the difference in displacement distribution in the vibration element plane between the main vibration and the spurious vibration, vibration due to the spurious vibration leaks to the vicinity of the second metal bump B2, thereby deteriorating the vibration characteristics of the vibration element 2.

  As described above, the vibration element 2 has spurious vibration that leads to deterioration of vibration characteristics. However, the vibration element 2 and the relay substrate 3 are bonded to each other by using the second metal bump B2, for example. As compared with the case where the vibration element 2 and the relay substrate 3 are joined using the resin-based conductive adhesive, variation in the vibration frequency of the spurious vibration can be suppressed. That is, the vibration frequency of spurious vibration can be controlled with high accuracy. This is because the vibration frequency of spurious vibration varies depending on the portion where the vibration element 2 is fixed, that is, the arrangement and size of the bonding member that bonds the vibration element 2 and the relay substrate 3. This is because the arrangement and the diameter of the joining member can be controlled with higher accuracy than when a resin-based conductive adhesive is used. Thus, if the vibration frequency of the spurious vibration can be controlled with high accuracy, the vibration frequency of the spurious vibration can be sufficiently separated from the vibration frequency of the main vibration, and the coupling of the spurious vibration can be reduced more effectively. Can do.

  Although the vibration element 2 has been described above, the configuration of the vibration element 2 is not limited to the above-described configuration. For example, the vibration element 2 may be a mesa type in which the vibration region of the vibration substrate 21 protrudes from the periphery thereof, or conversely, may be a reverse mesa type in which the vibration region is recessed from the periphery thereof. . Further, bevel processing for grinding the periphery of the vibration substrate 21 and convex processing for making the upper surface 211 and the lower surface 212 convex surfaces may be performed.

  Further, the vibration element 2 is not limited to one that vibrates due to thickness-shear vibration. For example, the vibration element 2 may be a vibration element in which a plurality of vibration arms flexurally vibrate (tuning fork vibration), or a plurality of vibrations. A vibration element in which the arm bends and vibrates in the out-of-plane direction (walk vibration) may be used. Therefore, the vibration substrate 21 is not limited to the one formed from the AT cut quartz substrate, but a quartz substrate other than the AT cut quartz substrate, for example, an X cut quartz substrate, a Y cut quartz substrate, a Z cut quartz substrate, or a BT cut quartz substrate. It may be formed of a substrate, an SC cut crystal substrate, an ST cut crystal substrate, or the like.

  In addition, the constituent material of the vibration substrate 21 is not limited to quartz, but, for example, a piezoelectric single crystal (single material such as lithium niobate, lithium tantalate, lithium tetraborate, langalite, potassium niobate, gallium phosphate) (A piezoelectric material of a crystal body) or a piezoelectric single crystal other than these.

  Here, as described above, the substrate 31 included in the relay substrate 3 and the vibration substrate 21 included in the vibration element 2 are each made of quartz. As a result, the thermal expansion coefficients of the relay substrate 3 and the vibration element 2 are substantially equal, so that the relay substrate 3 and the vibration element 2 are hardly affected by distortion due to a change in ambient temperature. Therefore, it is difficult for stress to be applied to the vibration element 2, and a reduction in vibration characteristics of the vibration element 2 can be reduced.

  Further, as shown in FIG. 10, the crystal axis of the substrate 31 and the crystal axis of the vibration substrate 21 are shifted from each other. Specifically, the X axis of the substrate 31 extends in a direction different from the X axis of the vibration substrate 21, the Y axis of the substrate 31 extends in a direction different from the Y axis of the vibration substrate 21, and the Z axis of the substrate 31 is The vibration substrate 21 extends in a direction different from the Z-axis. Thereby, compared with the case where the crystal axes of the vibration board | substrate 21 and the board | substrate 31 correspond, for example, the mechanical resonance point of the vibration board | substrate 21 and the board | substrate 31 can be spaced apart. Therefore, it is possible to suppress an unintended resonance mode from being excited in the relay substrate 3 so as to resonate with the vibration of the vibration element 2, and the vibration characteristics of the vibration element 2 are degraded by the resonance mode of the relay substrate 3. Can be effectively suppressed.

  In particular, in this embodiment, the X axis of the substrate 31 is inclined about both the Y axis and the Z axis with respect to the X axis of the vibration substrate 21, and the Y axis of the substrate 31 is the Y axis of the vibration substrate 21. The Z axis of the substrate 31 is inclined about both the X axis and the Y axis with respect to the Z axis of the vibration substrate 21. That is, the crystal axis of the substrate 31 and the crystal axis of the vibration substrate 21 are in a twisted relationship. Therefore, the above-described effect becomes more prominent, and the mechanical resonance point between the vibration substrate 21 and the substrate 31 can be further separated. Therefore, the unintended vibration of the relay board 3 can be more effectively suppressed, and the deterioration of the vibration characteristics of the vibration element 2 due to the vibration of the relay board 3 can be more effectively suppressed.

  In the present embodiment, as described above, the cut angle of the vibration substrate 21 and the cut angle of the substrate 31 are different. Specifically, since the vibration substrate 21 of the vibration element 2 is formed from an AT cut crystal substrate, the substrate 31 of the relay substrate 3 is formed from a Z cut crystal substrate different from the AT cut crystal substrate. Thus, by making the cut angle of the vibration substrate 21 and the cut angle of the substrate 31 different, the crystal axis of the substrate 31 and the crystal axis of the vibration substrate 21 can be shifted from each other easily and reliably.

  In the present embodiment, the X-axis, Y-axis, and Z-axis of the substrate 31 are inclined with respect to the X-axis, Y-axis, and Z-axis of the vibration substrate 21, respectively. As long as two of the X-axis, Y-axis, and Z-axis of the substrate 31 are inclined with respect to the corresponding axes of the vibration substrate 21, the remaining one axis may be coincident. In addition, the X axis, Y axis, and Z axis of the substrate 31 may coincide with the X axis, Y axis, and Z axis of the vibration substrate 21, respectively.

  The vibration device 1 has been described above. As described above, the vibration device 1 includes the vibration element 2, the circuit element 4, the relay substrate 3 disposed between the vibration element 2 and the circuit element 4, the vibration element 2, and the circuit element 4. And a package 5 housing the relay board 3, a bonding wire BW connecting the package 5 and the circuit element 4, a first metal bump B1 joining the circuit element 4 and the relay board 3, 2nd metal bump B2 which joins the relay substrate 3 and the vibration element 2 is provided. According to such a vibration device 1, by using the first and second metal bumps B1 and B2 and the bonding wire BW, the vibration element 2, the relay substrate 3 and the circuit element with respect to the package 5 without using a resin material. 4 can be implemented. Therefore, even if heat treatment is performed after the package 5 is sealed, the problem caused by the gas (outgas) generated from the resin material in the package 5 can be solved. In addition, since the vibration element 2 is supported by the circuit element 4 via the relay substrate 3, the stress generated in the vibration element 2 can be reduced even if a metal bump is used. Furthermore, since the circuit element 4 is supported by the package 5 via the bonding wire BW, stress generated by deformation of the package 5 or the like is not easily transmitted to the circuit element 4. Therefore, the stress generated in the vibration element 2 can be reduced more effectively.

  Further, as described above, the circuit element 4 is supported in a state of being lifted from the package 5 by the bonding wire BW. That is, the circuit element 4 is disposed in a non-contact manner with the package 5. Thereby, the stress generated by the deformation of the package 5 or the like is further difficult to be transmitted to the circuit element 4. Therefore, the stress generated in the vibration element 2 can be further effectively reduced.

  As described above, the package 5 includes the base 51 having the recess 511 and the lid 52 joined to the base 51 so as to close the opening of the recess 511. The circuit element 4 is arranged with its active surface 40 facing the lid 52 side. Thus, by arranging the circuit element 4 with the active surface 40 facing the lid 52 side, the capillary can be pressed against the active surface 40 from the opening side, and the circuit element 4 and the base 51 are connected by the bonding wire BW. Becomes easy.

  Further, as described above, the relay board 3 is located on the lid 52 side with respect to the circuit element 4, and the vibration element 2 is located on the lid 52 side with respect to the relay board 3. Thereby, for example, the relay substrate 3 and the vibration element 2 can be arranged using a space for securing the height of the bonding wire BW. In other words, the bonding wire BW can be arranged by utilizing the space formed by arranging the relay substrate 3 and the vibration element 2 above the circuit element 4. Therefore, the vibration device 1 can be reduced in size, particularly reduced in height.

  Further, as described above, the connection portion between the circuit element 4 and the bonding wire BW, that is, the terminal 41 is disposed so as not to overlap the relay substrate 3 and the vibration element 2 when viewed from the thickness direction of the relay substrate 3. ing. Thereby, a capillary can be easily pressed to the terminal 41, and the circuit element 4 and the bonding wire BW can be easily connected.

  Further, as described above, the second metal bump B2 is arranged so as not to overlap the first metal bump B1 when viewed from the thickness direction of the relay substrate 3. Thereby, the stress generated in the vibration element 2 can be further reduced.

  Further, as described above, the relay substrate 3 is positioned inside the support portion 32 and the frame-like support portion 32 joined to the circuit element 4 via the first metal bump B1, and the second metal bump B2 And a base portion 34 to which the vibration element 2 is bonded, and beam portions 351, 352, 361, 362 connecting the support portion 32 and the base portion 34. By forming the relay substrate 3 in such a shape, the stress from the circuit element 4 is not easily transmitted to the vibration element 2. Therefore, the stress generated in the vibration element 2 can be effectively reduced.

  Further, as described above, the relay substrate 3 is positioned inside the support portion 32 and the frame-like support portion 32 joined to the circuit element 4 via the first metal bump B1, and the second metal bump B2 A base 34 to which the vibration element 2 is joined via a frame, a frame-shaped relay part 33 located inside the support part 32 and arranged so as to surround the base 34, and the base 34 and the relay part 33. The beam portions 361 and 362 as the first beam portions connected along the first axis L1, and the relay portion 33 and the support portion 32 are connected along the second axis L2 intersecting the first axis L1. Beam portions 351 and 352 as second beam portions. By forming the relay substrate 3 in such a shape, the stress from the circuit element 4 is further hardly transmitted to the vibration element 2. Therefore, the stress generated in the vibration element 2 can be reduced more effectively.

Second Embodiment
Next, a vibrating device according to a second embodiment of the invention will be described.

  FIG. 11 is a cross-sectional view showing a vibrating device according to the second embodiment of the invention.

  The vibration device according to the present embodiment is the same as the vibration device of the first embodiment described above except that the arrangement of the circuit elements 4 is different. In the following description, the vibration device of the second embodiment will be described with a focus on the differences from the first embodiment described above, and description of similar matters will be omitted. Moreover, in FIG. 11, the same code | symbol is attached | subjected about the structure similar to embodiment mentioned above.

  As shown in FIG. 11, in the vibrating device 1 of the present embodiment, the lower surface of the circuit element 4 is in contact with the bottom surface of the second recess 511b. However, the lower surface of the circuit element 4 is not joined to the bottom surface of the second recess 511b. That is, the circuit element 4 is in contact with the bottom surface of the second recess 511b without being joined. According to such a configuration, the transmission of stress from the package 5 to the circuit element 4 can be effectively reduced as in the first embodiment described above. Furthermore, when the circuit element 4 comes into contact with the bottom surface of the second recess 511b, the burden on the bonding wire BW is reduced, and for example, the disconnection of the bonding wire BW or the separation from the terminal 41 is effectively suppressed. Can do.

  Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited. In the present embodiment, the entire lower surface of the circuit element 4 is in contact with the bottom surface of the second recess 511b. However, the present invention is not limited to this, and a part of the lower surface of the circuit element 4 is in contact with the bottom surface of the second recess 511b. It may be in contact. The circuit element 4 may be bonded to the bottom surface of the second recess 511b via an adhesive or the like. Thereby, certainty can be further improved regarding the bonding of the bonding wire BW.

<Third Embodiment>
Next, a vibrating device according to a third embodiment of the invention will be described.

  FIG. 12 is a cross-sectional view showing a vibrating device according to the third embodiment of the invention.

  The vibration device according to the present embodiment is the same as the vibration device of the first embodiment described above except that the arrangement of the relay substrate 3 and the vibration element 2 is different. In the following description, the vibration device of the third embodiment will be described with a focus on the differences from the first embodiment described above, and description of similar matters will be omitted. Moreover, in FIG. 12, the same code | symbol is attached | subjected about the structure similar to embodiment mentioned above.

  As shown in FIG. 12, in the vibration device 1 of the present embodiment, the relay substrate 3 and the vibration element 2 are located below the circuit element 4, that is, on the bottom surface side of the second recess 511b. Although not shown, the terminal 42 is provided on the lower surface opposite to the active surface 40 in accordance with the above arrangement.

  Also according to the third embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
Next, an electronic apparatus according to a fourth embodiment of the invention will be described.

  FIG. 13 is a perspective view showing an electronic apparatus according to the fourth embodiment of the present invention.

  A mobile (or notebook) personal computer 1100 shown in FIG. 13 is an application of an electronic apparatus including the vibration device of the invention. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates the vibration device 1 used as an oscillator, for example.

  Such a personal computer 1100 (electronic device) includes the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed and high reliability can be exhibited.

<Fifth Embodiment>
Next, an electronic apparatus according to a fifth embodiment of the invention will be described.

  FIG. 14 is a perspective view showing an electronic apparatus according to the fifth embodiment of the present invention.

  A cellular phone 1200 (including PHS) illustrated in FIG. 14 is obtained by applying an electronic device including the vibration device of the invention. A cellular phone 1200 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display portion 1208 is disposed between the operation buttons 1202 and the earpiece 1204. . Such a cellular phone 1200 incorporates, for example, the vibration device 1 used as an oscillator.

  Such a cellular phone 1200 (electronic device) includes the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed and high reliability can be exhibited.

<Sixth Embodiment>
Next, an electronic apparatus according to a sixth embodiment of the invention will be described.

  FIG. 15 is a perspective view showing an electronic apparatus according to the sixth embodiment of the present invention.

  A digital still camera 1300 shown in FIG. 15 is an application of an electronic apparatus including the vibration device of the invention. A display unit 1310 is provided on the back surface of the case (body) 1302, and is configured to perform display based on an imaging signal from the CCD. The display unit 1310 functions as a finder that displays an object as an electronic image. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302. When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. Such a digital still camera 1300 incorporates, for example, a vibration device 1 used as an oscillator.

  Such a digital still camera 1300 (electronic device) includes the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed and high reliability can be exhibited.

  In addition to the personal computer, mobile phone, and digital still camera described above, the electronic device of the present invention includes, for example, a smartphone, a tablet terminal, a watch (including a smart watch), an inkjet discharge device (for example, an inkjet printer), Wearable terminals such as laptop personal computers, TVs, HMDs (head-mounted displays), video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices , Word processors, workstations, videophones, crime prevention TV monitors, electronic binoculars, POS terminals, medical equipment (eg electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic endoscopes), Group detector, various measuring instruments, mobile terminal the base station equipment, instruments (e.g., gages for vehicles, aircraft, and ships), a flight simulator, a network server or the like.

<Seventh embodiment>
Next, the moving body according to the seventh embodiment of the present invention will be described.

  FIG. 16 is a perspective view showing a moving body according to the seventh embodiment of the present invention.

  An automobile 1500 shown in FIG. 16 is an automobile to which a moving object including the vibration device of the present invention is applied. The automobile 1500 includes a vibration device 1 that is used as an oscillator, for example. The vibration device 1 is, for example, keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, tire pressure monitoring system (TPMS: Tire Pressure Monitoring System), engine control, hybrid The present invention can be widely applied to electronic control units (ECUs) such as battery monitors for automobiles and electric vehicles, and vehicle body attitude control systems.

  Such an automobile 1500 (moving body) includes the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed and high reliability can be exhibited.

  The moving body is not limited to the automobile 1500, and can be applied to, for example, an unmanned airplane such as an airplane, a ship, an AGV (automated guided vehicle), a bipedal walking robot, and a drone.

  As described above, the vibration device, the electronic apparatus, and the moving body of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each unit is an arbitrary configuration having the same function. Can be substituted. In addition, any other component may be added to the present invention. Further, the present invention may be a combination of any two or more configurations of the above embodiments.

  In the above-described embodiment, the configuration in which the vibration device is applied to the oscillator has been described. However, the present invention is not limited to this. For example, the vibration device may be applied to a physical quantity sensor that can detect physical quantities such as acceleration and angular velocity. . In this case, an element having a drive vibration mode and a detection vibration mode excited according to the received physical quantity is used as the vibration element 2, and the circuit element 4 is driven to drive the vibration element 2 in the drive vibration mode. A circuit and a detection circuit that detects a physical quantity based on a signal obtained from the detection vibration mode of the vibration element 2 may be formed.

  DESCRIPTION OF SYMBOLS 1 ... Vibration device, 2 ... Vibration element, 21 ... Vibration board, 211 ... Upper surface, 212 ... Lower surface, 22 ... Electrode, 221 ... 1st excitation electrode, 222 ... 2nd excitation electrode, 223 ... 1st electrode pad, 224 ... 2nd electrode pad, 225 ... 1st wiring, 226 ... 2nd wiring, 3 ... Relay board, 31 ... Board | substrate, 32 ... Support part, 321-324 ... Extension part, 33 ... Relay part, 331-334 ... Extension 34, base, 341 to 344, edge, 351, 352, 361, 362 ... beam, 38, 39 ... wiring, 381, 382, 391, 392 ... terminal, 4 ... circuit element, 40 ... active surface, 41, 42 ... terminal, 5 ... package, 51 ... base, 51a ... upper surface, 51b ... lower surface, 511 ... recess, 511a ... first recess, 511b ... second recess, 52 ... lid, 53 ... internal terminal, 54 ... external Terminal, 1100 ... Personal Computer 1102 ... Keyboard 1104 ... Main unit 1106 ... Display unit 1108 ... Display unit 1200 ... Mobile phone 1202 ... Operation button 1204 ... Earpiece 1206 ... Mouthpiece 1208 ... Display unit 1300 ... Digital still camera, 1302 ... case, 1304 ... light receiving unit, 1306 ... shutter button, 1308 ... memory, 1310 ... display unit, 1500 ... automobile, B1 ... first metal bump, B2 ... second metal bump, BW ... bonding wire, G ... Gap, L1 ... First axis, L2 ... Second axis, O ... Center, S ... Storage space, [theta] ... Angle

Claims (10)

A vibrating element;
Circuit elements;
A relay substrate disposed between the vibration element and the circuit element;
A package containing the vibration element, the circuit element and the relay board;
A bonding wire connecting the package and the circuit element;
A first metal bump joining the circuit element and the relay substrate;
A vibration device comprising: a second metal bump that joins the relay substrate and the vibration element.   The vibration device according to claim 1, wherein the circuit element is supported by the bonding wire in a state of floating from the package. The package is
A base having a recess;
A lid joined to the base so as to close the opening of the recess,
The vibrating device according to claim 1, wherein the circuit element is disposed with an active surface thereof facing the lid. The relay board is located on the lid side of the circuit element,
The vibration device according to claim 3, wherein the vibration element is located on the lid side with respect to the relay substrate.   5. The vibration device according to claim 1, wherein the connection portion between the circuit element and the bonding wire does not overlap the relay substrate and the vibration element when viewed from the thickness direction of the relay substrate. .   6. The vibration device according to claim 1, wherein the second metal bump does not overlap the first metal bump when viewed from a thickness direction of the relay substrate. The relay board is
A frame-like support portion joined to the circuit element via the first metal bump;
A base located inside the support and to which the vibration element is joined via the second metal bump;
The vibration device according to claim 1, further comprising a beam portion connecting the support portion and the base portion. The relay board is
A frame-like support portion joined to the circuit element via the first metal bump;
A base located inside the support and to which the vibration element is joined via the second metal bump;
A frame-shaped relay part located inside the support part and arranged so as to surround the base part;
A first beam part connecting the base part and the relay part along a first axis;
The vibration device according to claim 1, further comprising: a second beam portion that connects the relay portion and the support portion along a second axis that intersects the first axis.   An electronic apparatus comprising the vibration device according to claim 1.   A moving body comprising the vibration device according to claim 1.

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