JP2019022140A - Vibrating device, manufacturing method of vibration device, oscillator, electronic device, and moving body - Google Patents

Abstract

To provide an oscillating device capable of suppressing an increase in CI value while suppressing the influence of disturbance, a manufacturing method of the oscillating device, an oscillator including the oscillating device, an electronic device, and a moving body.SOLUTION: An oscillating device includes: an oscillating element having a pad electrode; a support member on which a connection electrode is disposed; and a conductive joining member joining the oscillating element and the support member and coming into contact with the pad electrode and the connection electrode to electrically connect the pad electrode and the connection electrode, in which when an area of the smallest rectangular region which encompasses the entire region of the joint between the joining member and the oscillating element in a plan view along the direction in which the oscillating element, the joining member, and the support member are arranged is S1 and an area of the joint is S2, the relationship 0.3≤S2/S1≤0.75 is satisfied.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a vibration device, a method for manufacturing the vibration device, an oscillator, an electronic apparatus, and a moving body.

  A thickness shear vibration element in which the vibration mode of the main vibration to be excited is thickness shear vibration is suitable for downsizing and higher frequency. Therefore, the thickness shear vibration element is used in various fields such as a piezoelectric oscillator and an electronic device. Patent Document 1 discloses a vibrator having an AT-cut vibration element that vibrates in thickness, a package that houses the AT-cut vibration element, and a conductive adhesive that fixes the AT-cut vibration element to the package. Yes.

JP 2001-77652 A

  Moreover, in patent document 1, in order to make it difficult to receive the influence of the disturbance (external vibration) of the vibration frequency band to 12 kHz, it defines about the hardness and thickness of a conductive adhesive. However, depending on the purpose of use (for example, for in-vehicle use), it is desired to make it less susceptible to disturbance in a higher vibration frequency band.

  Therefore, in the configuration of Patent Document 1, it is conceivable to increase the diameter of the conductive adhesive (joint area with the thickness-shear vibration element) in order to make it less susceptible to the disturbance in the vibration frequency band higher than 12 kHz. . However, when the diameter of the conductive adhesive is increased, the main vibration of the thickness shear vibration element is liable to leak to the package through the conductive adhesive, and the CI (crystal impedance) value of the thickness shear vibration element is increased.

  An object of the present invention is to provide a vibration device that can suppress an increase in CI value while being hardly affected by a disturbance, a method for manufacturing the vibration device, an oscillator including the vibration device, an electronic apparatus, and a moving body. It is in.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or modes.

A vibrating device according to an aspect of the present invention includes a vibrating element having a pad electrode;
A support member on which a connection electrode is disposed;
A conductive bonding member that bonds the vibration element and the support member, and contacts the pad electrode and the connection electrode to electrically connect the pad electrode and the connection electrode; Have
In plan view along the direction in which the vibration element, the bonding member, and the support member are arranged, the area of the smallest rectangular region including the entire area of the bonding portion between the bonding member and the vibration element is S1, and the bonding portion When the area of S2 is S2, the relationship of 0.3 ≦ S2 / S1 ≦ 0.75 is satisfied.
As a result, it is possible to obtain a vibration device that is less susceptible to disturbance and can suppress an increase in CI value.

In the vibration device according to the aspect of the invention, the pad electrode may be provided at one end of the vibration element, and a direction from the one end toward the other end of the vibration element may be a first direction, When the direction crossing the first direction is the second direction, the joining portion extends along the first direction and the second direction in the plan view, and extends along the first direction. It is preferable to have the 2nd extension part extended.
As a result, the shape of the joint becomes relatively simple.

In the vibration device according to the aspect of the invention, it is preferable that the first extension portion and the second extension portion each extend along an outer edge of the vibration element in the plan view.
Thereby, a junction part can be arrange | positioned as far as possible from the vibration part of a vibration element. Therefore, the vibration of the vibration element is difficult to leak to the support member via the bonding member. Therefore, an increase in the CI value of the vibration element can be more effectively suppressed.

In the vibration device according to the aspect of the invention, the vibration device further includes a connection portion that connects an end portion of the first extension portion and an end portion of the second extension portion,
It is preferable that the width of the connection part is larger than the width of the first extension part and the width of the second extension part.
Thereby, for example, compared with the case where these are separated, the area of a junction part can be enlarged and the joining strength of a joining member and a vibration element can be raised.

In the vibration device according to the aspect of the invention, it is preferable that the resonance frequency when the vibration element is a cantilever is 20 kHz or more and 100 kHz or less.
As a result, the vibration device is less susceptible to disturbance.

The method for manufacturing a vibrating device of the present invention includes a step of preparing a vibrating element having a pad electrode and a support member on which a connection electrode is disposed,
The vibration element and the support member are bonded to each other via a conductive bonding member, and the bonding member is brought into contact with the pad electrode and the connection electrode to electrically connect the pad electrode and the connection electrode. Connecting, and
In plan view along the direction in which the vibration element, the bonding member, and the support member are arranged, the area of the smallest rectangular region including the entire area of the bonding portion between the bonding member and the vibration element is S1, and the bonding portion When the area of S2 is S2, the relationship of 0.3 ≦ S2 / S1 ≦ 0.75 is satisfied.
As a result, it is possible to obtain a vibration device that is less susceptible to disturbance and can suppress an increase in CI value.

In the method for manufacturing a vibration device according to the aspect of the invention, it is preferable that the bonding member is applied to at least one of the vibration element and the support member in a plurality of times.
Thereby, a joining member can be made into a desired shape comparatively easily.

In the vibrating device manufacturing method of the present invention, the pad electrode is provided at one end of the vibrating element,
When the direction from the one end to the other end of the vibration element is the first direction and the direction intersecting the first direction is the second direction,
The joining member is applied to the support member along each of the first direction and the second direction, the vibration element is disposed on the joining member, and the first member extends along the first direction. It is preferable that the supporting member and the vibration element are bonded via a bonding portion having a first extending portion and a second extending portion extending along the second direction.
Thereby, application | coating of a joining member becomes easy, and a support member and a vibration element can be joined more reliably.

The oscillator of the present invention includes the vibration device of the present invention,
And an oscillation circuit that oscillates the vibration element.
Thereby, the effect of the vibration device of the present invention can be enjoyed, and a highly reliable oscillator can be obtained.

An electronic apparatus according to the present invention includes the vibration device according to the present invention.
Thereby, the effect of the vibration device of this invention can be enjoyed and a reliable electronic device can be obtained.

The moving body of the present invention includes the vibration device of the present invention.
Thereby, the effect of the vibration device of this invention can be enjoyed and a reliable mobile body is obtained.

It is sectional drawing of the vibration device which concerns on 1st Embodiment of this invention. It is a top view of the vibration element which the vibration device shown in FIG. 1 has. FIG. 3 is a side view of the vibration element shown in FIG. 2. It is a figure for demonstrating the cut angle of a quartz substrate. FIG. 6 is a plan view illustrating a modification of the vibration element illustrated in FIG. 2. FIG. 3 is a rear view of the vibration element shown in FIG. 2. It is a side view of a vibration device. It is a graph which shows the relationship between S2 / S1 and the resonance frequency of a cantilever. It is a flowchart which shows the manufacturing process of the vibration device shown in FIG. It is a top view for demonstrating the manufacturing method of the vibration device shown in FIG. It is a top view for demonstrating the manufacturing method of the vibration device shown in FIG. It is a back view of the vibration element which the vibration device which concerns on 2nd Embodiment of this invention has. It is a back view of the vibration element which the vibration device which concerns on 3rd Embodiment of this invention has. It is a reverse view of the vibration element which the vibration device which concerns on 4th Embodiment of this invention has. It is sectional drawing which shows the oscillator which concerns on 5th Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 6th Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 7th Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 8th Embodiment of this invention. It is a perspective view which shows the mobile body which concerns on 9th Embodiment of this invention. It is a reverse view of the vibration element for demonstrating the modification of a junction part. It is a reverse view of the vibration element for demonstrating the modification of a junction part. It is a reverse view of the vibration element for demonstrating the modification of a junction part. It is a reverse view of the vibration element for demonstrating the modification of a junction part. It is a reverse view of the vibration element for demonstrating the modification of a junction part. It is a reverse view of the vibration element for demonstrating the modification of a junction part. It is a reverse view of the vibration element for demonstrating the modification of a junction part. It is a reverse view of the vibration element for demonstrating the modification of a junction part.

  Hereinafter, a vibrating device, a vibrating device manufacturing method, an oscillator, an electronic apparatus, and a moving object according to the present invention will be described in detail based on preferred embodiments shown in the drawings.

<First Embodiment>
First, the vibration device according to the first embodiment of the invention will be described.

  FIG. 1 is a cross-sectional view of the vibration device according to the first embodiment of the invention. FIG. 2 is a plan view of a vibration element included in the vibration device shown in FIG. FIG. 3 is a side view of the vibration element shown in FIG. 2. FIG. 4 is a diagram for explaining the cut angle of the quartz substrate. FIG. 5 is a plan view showing a modification of the vibration element shown in FIG. 6 is a rear view of the vibration element shown in FIG. FIG. 7 is a side view of the vibrating device. FIG. 8 is a graph showing the relationship between S2 / S1 and the resonant frequency of the cantilever beam. FIG. 9 is a flowchart showing manufacturing steps of the vibration device shown in FIG. 10 and 11 are plan views for explaining a method of manufacturing the vibrating device shown in FIG.

  In each drawing, an X axis (first direction), a Y ′ axis (third direction), and a Z ′ axis (second direction) are shown as three axes orthogonal to each other. Hereinafter, a direction parallel to the X-axis is also referred to as an “X-axis direction”, a direction parallel to the Y′-axis is referred to as a “Y′-axis direction”, and a direction parallel to the Z′-axis is referred to as a “Z′-axis direction”. Further, the arrow tip side of each axis is also referred to as “plus side”, and the opposite side is also referred to as “minus side”.

  As illustrated in FIG. 1, the vibration device 1 of the present embodiment includes a vibration element 2, a package 7 that houses the vibration element 2, and joining members 91 and 92 that fix the vibration element 2 to the package 7. ing. Hereinafter, each of these units will be sequentially described.

  As shown in FIGS. 2 and 3, the vibration element 2 includes a quartz crystal substrate 3 that is a piezoelectric substrate and an electrode 4 disposed on the quartz crystal substrate 3. The quartz crystal substrate 3 belongs to the trigonal system and has crystal axes X, Y, and Z that are orthogonal to each other. The X axis, the Y axis, and the Z axis are referred to as an electric axis, a mechanical axis, and an optical axis, respectively. As shown in FIG. 4, the quartz substrate 3 of the present embodiment is a “rotated Y-cut quartz substrate” cut along a plane obtained by rotating the XZ plane around the X axis by a predetermined angle θ. A substrate when cut along a plane rotated by = 35 ° 15 ′ is referred to as an “AT-cut quartz substrate”. By using such a quartz substrate 3, the vibration element 2 having excellent temperature characteristics is obtained. However, the quartz substrate 3 is not limited to the AT-cut quartz substrate as long as the thickness-shear vibration can be excited. For example, a BT-cut quartz substrate may be used.

  Hereinafter, the Y axis and the Z axis rotated around the X axis corresponding to the angle θ are referred to as a Y ′ axis and a Z ′ axis. That is, the quartz substrate 3 has a thickness in the Y′-axis direction and has a spread in the XZ ′ plane direction.

  As shown in FIGS. 2 and 3, the quartz substrate 3 includes a vibrating portion 31 that vibrates in thickness and a thin wall that is located around the vibrating portion 31 and is integrated with the vibrating portion 31 and is thinner than the vibrating portion 31. Part 32. The vibrating portion 31 protrudes on both the + Y ′ side and the −Y ′ side of the thin portion 32. That is, the quartz substrate 3 has a mesa shape.

  The crystal substrate 3 has a substantially long shape with the X-axis direction as a long side and the Z′-axis direction as a short side in a plan view from the Y′-axis direction, and has an end portion on the minus side in the X-axis direction. 321 and an end 322 on the X axis direction plus side. The end 321 is a fixed end fixed by the joining members 91 and 92, and the end 322 is a free end. However, the shape of the quartz substrate 3 in plan view is not particularly limited, and for example, the quartz substrate 3 may have a square shape with substantially the same length in the X-axis direction and the Z′-axis direction, and the X-axis direction is a short side. , A long shape having the long side in the Z′-axis direction may be formed. Two corners located on the base end side in the X-axis direction may be chamfered on the C-plane or R-plane, respectively.

  Further, as shown in FIG. 5, notch portions 38 may be provided at two corner portions located on the minus side in the X-axis direction of the quartz crystal substrate 3, and the notch portion 38 may be provided with a folding portion 39. Some may remain connected. The folding part 39 is a part for connecting the quartz substrate 3 formed in the quartz wafer to the quartz wafer, and the quartz substrate 3 is detached from the quartz wafer by folding the folding part 39. In some cases, when the folding part 39 is folded, a part of the folding part 39 may remain on the quartz substrate 3.

  As shown in FIG. 2, the electrode 4 disposed on the quartz substrate 3 includes a pair of excitation electrodes 411 and 421, a pair of pad electrodes 412 and 422, and a pair of extraction electrodes 413 and 423. . The excitation electrode 411 is disposed on the surface of the vibrating portion 31 (Y′-axis direction minus main surface), and the excitation electrode 421 is on the back surface of the vibrating portion 31 (Y′-axis direction plus main surface). It is arranged to face the excitation electrode 411. The pad electrodes 412 and 422 are respectively arranged in the Z′-axis direction on the back surface of the end portion 321 (first end portion) on the minus side in the X-axis direction of the thin portion 32. An extraction electrode 413 is disposed so as to connect the excitation electrode 411 and the pad electrode 412, and an extraction electrode 423 is disposed so as to connect the excitation electrode 421 and the pad electrode 422.

  The configuration of such an electrode 4 is not particularly limited. For example, a base layer such as Cr (chromium) or Ni (nickel) is mainly composed of a metal such as Au (gold) or Al (aluminum), Au, or Al. It can be comprised with the metal film which laminated | stacked the alloy used as a component.

  Although the vibration element 2 has been described above, the vibration element 2 is not particularly limited. For example, the inverted mesa type in which the thickness of the vibration part 31 is thinner than the thickness of the thin part 32 may be used, or the flat type in which the thickness of the vibration part 31 and the thickness of the thin part 32 are equal. Moreover, the bevel process which grinds the circumference | surroundings of the quartz substrate 3, and the convex process which makes an upper surface and a lower surface convex surface may be performed.

  The size (length, width) of the vibration element 2 is not particularly limited. The length Lx of the vibration element 2 in the X-axis direction can be, for example, 1.2 mm or more and 2.0 mm or less. Further, the length Lz of the vibration element 2 in the Z′-axis direction can be set to, for example, 0.9 mm or more and 1.5 mm or less. Further, the length Lx1 of the excitation electrodes 411 and 421 in the X-axis direction can be set to 0.7 mm or more and 1.2 mm or less, for example. Further, the length Lz1 of the excitation electrodes 411 and 421 in the Z′-axis direction can be set to 0.7 mm or more and 1.2 mm or less, for example. Further, the length Lx2 of the pad electrodes 412 and 422 in the X-axis direction can be set to 0.2 mm or more and 0.4 mm or less, for example. Further, the length Lz2 of the pad electrodes 412 and 422 in the Z′-axis direction can be set to 0.4 mm or more and 0.6 mm or less, for example. Note that the resonance frequency of the vibration element 2 (resonance frequency of the thickness shear vibration) is inversely proportional to the thickness T of the vibration part 31. Therefore, the thickness T of the vibration unit 31 is appropriately set according to the required driving frequency, and can be set to, for example, 10 μm or more and 200 μm or less.

  As shown in FIG. 1, the package 7 includes a cavity-like base 71 having a recess 711 opened on the upper surface, and a plate-like lid 72 joined to the base 71 so as to close the opening of the recess 711. ing. The recess 711 is blocked by the lid 72 to form a storage space S, and the vibration element 2 is stored in the storage space S. The atmosphere of the storage space S is not particularly limited, and may be in a reduced pressure (vacuum) state, for example. The storage space S may be filled with an inert gas such as nitrogen, helium, or argon. In addition, joining of the base 71 and the lid 72 is not specifically limited, For example, you may join via an adhesive material and may join by seam welding etc.

  The constituent material of the base 71 is not particularly limited, and various ceramics such as oxide ceramics such as alumina, silica, titania and zirconia, and nitride ceramics such as silicon nitride, aluminum nitride and titanium nitride can be used. . Further, the constituent material of the lid 72 is not particularly limited, but is preferably a material whose linear expansion coefficient approximates that of the constituent material of the base 71. For example, when the constituent material of the base 71 is ceramic as described above, it is preferable to use an alloy such as Kovar as the constituent material of the lid 72.

  Internal terminals 731 and 732 are disposed on the bottom surface of the recess 711. Further, external terminals 741 and 742 are disposed on the lower surface of the base 71. The internal terminal 731 and the external terminal 741 are electrically connected via an internal wiring (not shown), and the internal terminal 732 and the external terminal 742 are electrically connected via an internal wiring (not shown).

  As shown in FIG. 1, the vibration element 2 is housed in the housing space S with the back surface (main surface on the Y′-axis direction plus side) facing the bottom surface of the recess 711, and has two conductive properties at the end 321. These are joined and fixed to the bottom surface of the recess 711 via the joining members 91 and 92. The bonding member 91 is provided in contact with the internal terminal 731 and the pad electrode 412. Therefore, the internal terminal 731 and the pad electrode 412 are electrically connected via the bonding member 91. On the other hand, the bonding member 92 is provided in contact with the internal terminal 732 and the pad electrode 422. Therefore, the internal terminal 732 and the pad electrode 422 are electrically connected via the bonding member 92.

  Note that the joining members 91 and 92 are not particularly limited as long as they have conductivity and adhesiveness. For example, the bonding members 91 and 92 are made of, for example, an adhesive material such as silicone, epoxy, acrylic, polyimide, or bismaleimide. What disperse | distributed electroconductive fillers, such as (gold), Ag (silver), and Cu (copper), can be used.

  Further, the hardness of the joining members 91 and 92 is not particularly limited, but the pencil hardness is preferably B or more. As a result, the joining members 91 and 92 become sufficiently flexible. For example, even if external vibration is applied to the vibration device 1, the vibration is transmitted by the joining members 91 and 92 until the vibration is transmitted from the package 7 to the vibration element 2. Or relaxed. Therefore, it is difficult for external vibrations to be transmitted to the vibration element 2, and the deterioration of the vibration characteristics of the vibration element 2 can be suppressed. Further, the internal stress generated due to the difference in thermal expansion coefficient between the quartz crystal substrate 3 and the base 71 is also absorbed and relaxed by the joining members 91 and 92. Therefore, unnecessary stress is hardly applied to the vibration element 2, and the vibration element 2 can exhibit stable vibration characteristics. In addition, pencil hardness can be measured by the method (pencil method) according to JIS K5600, for example.

  Next, the shape of the joint 80 between the joining members 91 and 92 and the vibration element 2 will be described. In addition, since the joining part 80 of the joining member 91 and the vibration element 2 and the joining part 80 of the joining member 92 and the vibration element 2 have the same configuration, in the following, the joining member 91 and the vibration element 2 will be described. The joint 80 will be described as a representative, and the description of the configuration of the joint 80 between the joint member 92 and the vibration element 2 will be omitted.

  As shown in FIG. 6, the joining portion 80 is substantially L-shaped so as to straddle the corner of the vibration element 2 in a plan view from the Y′-axis direction plus side (that is, the back surface side of the vibration element 2). I am doing. Specifically, the joint portion 80 includes a first extension portion 81 that extends along the X-axis direction and a second extension portion 82 that extends along the Z′-axis direction. . Then, the end portion on the minus side in the X-axis direction of the first extension portion 81, the end portion on the minus side in the Z′-axis direction of the second extension portion 82, and the corner portion of the vibration element 2 are connected. Further, the first extending portion 81 is disposed along the outer edge 21 extending in the X-axis direction of the vibration element 2, and the second extending portion 82 is formed on the outer edge 22 extending in the Z′-axis direction of the vibrating element 2. Are arranged along.

  Here, in a plan view from the Y′-axis direction, the pair of opposing second sides Qz and the pair of opposing first sides Qx and the Z′-axis direction along the X-axis direction include the entire region of the joint portion 80. A rectangular area Q that forms a rectangle having the following is set, and its minimum area is S1. That is, the minimum area S1 is an area of the rectangular region Q (indicated by dots in FIG. 6) in a state where the rectangular region Q is the smallest as long as the entire region of the joint 80 can be included. On the other hand, the area of the joint 80 (indicated by hatching in FIG. 6) is S2. In the vibrating device 1, the minimum area S1 and the area S2 satisfy the relationship of 0.3 ≦ S2 / S1 ≦ 0.75. Thereby, S2 / S1 is set without excess and deficiency, and as a result, an increase in CI (crystal impedance) value of the vibration element 2 can be suppressed while being hardly affected by disturbance. Such effects will be described in detail below.

  As shown in FIG. 7, the shorter the free end length L of the vibration element 2, the resonance frequency when the vibration element 2 is the cantilever 10 (hereinafter, also simply referred to as “resonance frequency of the cantilever 10”). .) Becomes higher. Therefore, for example, as shown by a chain line in FIG. 7, the length of the joining portion 80 in the X-axis direction is lengthened to shorten the length L of the free end of the vibration element 2, thereby resonating the cantilever 10. The frequency can be increased. As a result, for example, the resonance frequency of the cantilever 10 can be moved away from the vibration frequency of about 20 kHz, and is less susceptible to disturbance (external vibration) in the vibration frequency band up to about 20 kHz. However, when the width in the X-axis direction of the joint portion 80 is increased, the area S2 of the joint portion 80 becomes too large, and the vibration of the vibration element 2 is likely to leak through the joint members 91 and 92. For this reason, the CI value of the vibration element 2 becomes large, and the vibration element 2 becomes difficult to oscillate.

  Therefore, in order to increase the width in the X-axis direction of the joint 80 while suppressing the area S2 of the joint 80, the present embodiment satisfies the relationship of 0.3 ≦ S2 / S1 ≦ 0.75. . By satisfying such a relationship, the area S2 of the joint 80 can be sufficiently reduced, and an increase in the CI value of the vibration element 2 can be suppressed. In addition, by ensuring a sufficient width in the X-axis direction of the joint portion 80, the length L of the free end of the vibration element 2 can be shortened, and the resonance frequency of the cantilever 10 can be increased. Therefore, for example, the resonance frequency of the cantilever 10 can be moved away from the vibration frequency of about 20 kHz, and is hardly affected by disturbance (external vibration) in the vibration frequency band up to about 20 kHz. As described above, according to the vibration device 1 of the present embodiment, it is possible to suppress an increase in the CI value of the vibration element 2 while being hardly affected by disturbance.

  Note that, in the relationship of S2 / S1 <0.3, the joining portion 80 becomes too small, and the joining strength between the joining members 91 and 92 and the vibration element 2 cannot be sufficiently ensured. On the other hand, in the relationship of 0.75 <S2 / S1, it becomes too large and the vibration of the vibration element 2 easily leaks through the joining members 91 and 92.

  Here, FIG. 8 is a graph showing the relationship between the resonance frequency of the cantilever 10 and S2 / S1. The graph shown in FIG. 8 plots the data shown in Table 1 below.

  8 that the resonance frequency of the cantilever 10 increases as S2 / S1 decreases.

  Further, when the length of the joint 80 in the X-axis direction (the length of the first extending portion 81) is L ′, the lengths Lx and L ′ are 0.1 ≦ L ′ / Lx ≦ 0.4. It is preferable to satisfy this relationship, and it is more preferable to satisfy the relationship 0.1 ≦ L ′ / Lx ≦ 0.3. Thereby, the area of the joining part 80 can be ensured moderately. Therefore, it is possible to sufficiently secure the bonding strength between the bonding members 91 and 92 and the vibration element 2 and to effectively suppress vibration leakage of the vibration element 2. Furthermore, the length of the 1st extension part 81 can be fully lengthened, and the resonant frequency of the cantilever 10 can be made high effectively.

  Further, when the area of the entire vibration element 2 is S3 in a plan view from the Y′-axis direction, the areas S2 and S3 may satisfy a relationship of 0.01 ≦ S2 / S3 ≦ 0.1, for example. preferable. Thereby, it can suppress that the junction part 80 becomes large with respect to the vibration element 2, ensuring sufficient joining strength. Therefore, vibration leakage of the vibration element 2 can be effectively suppressed.

  In particular, in the present embodiment, the joining portion 80 includes a first extending portion 81 extending along the X-axis direction and a first extending portion extending along the Z′-axis direction in a plan view from the Y′-axis direction. 2 extending portion 82, and is substantially L-shaped. As a result, the shape of the joint 80 is relatively simple. In the case of such a configuration, the first extending portion 81 mainly has a function of increasing the resonance frequency of the cantilever 10, and the second extending portion 82 mainly includes the joining members 91 and 92. And a function of increasing the bonding strength between the vibration element 2.

  Further, as described above, the first extending portion 81 is disposed along the outer edge 21 extending in the X axis direction of the vibration element 2 in a plan view from the Y ′ axis direction, and the second extending portion 82. Are arranged along the outer edge 22 extending in the Z′-axis direction of the vibration element 2. Thereby, the joining part 80 can be arranged as far as possible from the center part of the vibration part 31. Therefore, the vibration of the vibration element 2 is difficult to leak into the package 7 through the joining members 91 and 92. Therefore, an increase in the CI value of the vibration element 2 can be more effectively suppressed.

  In the present embodiment, a part of the bonding portion 80 protrudes from the pad electrode 412 and is located on the quartz substrate 3. Since the bonding member 91 is more firmly bonded to the quartz crystal substrate 3 than the pad electrode 412, the bonding strength between the bonding member 91 and the vibration element 2 can be further increased with this configuration.

  It should be noted that depending on the use of the vibration device 1 (for example, for in-vehicle use), it is desired that the vibration device 1 is hardly affected by disturbance in the vibration frequency band up to about 15 kHz, preferably 20 kHz, and more preferably about 25 kHz. Therefore, the resonance frequency of the cantilever 10 is not particularly limited, but is preferably 20 kHz or more, more preferably 30 kHz or more, and further preferably 40 kHz or more, for example. Thereby, the resonant frequency of the cantilever 10 can be kept away from the vibration frequency up to about 15 kHz, and the vibration device 1 is less susceptible to the influence of disturbance.

  Further, the resonance frequency of the cantilever 10 is not particularly limited, but for example, is preferably 100 kHz or less, more preferably 90 kHz or less, and further preferably 80 kHz or less. Thereby, the resonance frequency of the cantilever 10 can be sufficiently separated from the resonance frequency of the vibration element 2 (resonance frequency of the thickness shear vibration which is the main vibration), and the increase in the CI value of the vibration element 2 can be more effectively performed. Can be suppressed.

  The vibration device 1 has been described above. As described above, the vibration device 1 includes the vibration element 2 having the pad electrodes 412 and 422, the base 71 (support member) on which the internal terminals 731 and 732 (connection electrodes) are disposed, and the vibration element 2. And the base 71, and a conductive joint that contacts the pad electrodes 412, 422 and the internal terminals 731, 732 and electrically connects the pad electrodes 412, 422 and the internal terminals 731, 732. Members 91 and 92. Further, the area of the smallest rectangular region Q that includes the entire region of the joint 80 between the joining members 91 and 92 and the vibration element 2 in a plan view along the direction in which the vibration element 2, the joining members 91 and 92, and the base 71 are arranged. Is S1, and the area of the joint 80 is S2, the relationship of 0.3 ≦ S2 / S1 ≦ 0.75 is satisfied. Thereby, as described above, it is possible to obtain the vibration device 1 that can suppress an increase in the CI value of the vibration element 2 while being hardly affected by disturbance.

  In the present embodiment, the base 71 is used as a support member, but the present invention is not limited to this, and a plate shape may be used. In other words, in this embodiment, the base 71 and the lid 72 constitute the package 7 that houses the vibration element 2. However, the plate-like base 71 supports the vibration element 2, and the vibration element 2 is exposed to the outside. The structure which is carrying out may be sufficient.

  Further, as described above, in the vibration device 1, in the plan view from the Y′-axis direction, the joint portion 80 includes the first extending portion 81 extending along the X-axis direction and the Z′-axis direction. 2nd extension part 82 extended along. Thereby, the shape of the joining part 80 becomes comparatively simple. Therefore, the vibration device 1 can be manufactured relatively easily.

  Further, as described above, in the vibration device 1, the first extension portion 81 and the second extension portion 82 extend along the outer edge of the vibration element 2 in a plan view from the Y′-axis direction, respectively. ing. Thereby, the joining part 80 can be arranged as far as possible from the center part of the vibration part 31. Therefore, the vibration of the vibration element 2 is difficult to leak to the package 7 via the joining members 91 and 92. Therefore, an increase in the CI value of the vibration element 2 can be more effectively suppressed.

  Further, as described above, in the vibration device 1, the end portion of the first extending portion 81 and the end portion of the second extending portion 82 are connected. Thereby, compared with the case where these are separated, for example, the area S2 of the joining portion 80 can be increased, and the joining strength between the joining members 91 and 92 and the vibration element 2 can be increased.

  As described above, in the vibration device 1, the resonance frequency when the vibration element 2 is the cantilever 10 is preferably 20 kHz or more and 100 kHz or less. As a result, as described above, the resonance frequency of the cantilever 10 can be kept away from the vibration frequency up to about 20 kHz, and the vibration device 1 is less susceptible to the influence of disturbance. In addition, an increase in the CI value of the vibration element 2 can be more effectively suppressed.

  Next, a method for manufacturing the vibration device 1 will be described. As shown in FIG. 9, the method for manufacturing the vibration device 1 includes a preparation process, a vibration element arranging process, and a sealing process.

[Preparation process]
First, the base 71 and the vibration element 2 are prepared.

[Vibration element placement process]
Next, as illustrated in FIG. 10, uncured bonding members 91 and 92 are applied to the bottom surface of the recess 711 of the base 71 using, for example, a dispenser. At this time, by applying the joining members 91 and 92 in a plurality of times, the joining members 91 and 92 can be formed in a desired shape (ie, substantially L-shaped) relatively easily. For example, in this embodiment, the joining members 91 and 92 are applied eight times along the X-axis direction and the Z′-axis direction, respectively. In addition, the planar view shape of the joining members 91 and 92 in this state is substantially L-shaped.

  Next, as shown in FIG. 11, the vibration element 2 is disposed on the joining members 91 and 92, and the joining members 91 and 92 are cured. Thereby, the vibration element 2 is fixed to the base 71 via the joining members 91 and 92. Further, the internal terminal 731 and the pad electrode 412 are electrically connected via the bonding member 91, and the internal terminal 732 and the pad electrode 422 are electrically connected via the bonding member 92. Here, as described above, since the uncured bonding members 91 and 92 are applied in a substantially L shape in advance, the bonding portion 80 between the bonding members 91 and 92 and the vibration element 2 is also the same as this. It is substantially L-shaped.

  In this state, the relationship of 0.3 ≦ S2 / S1 ≦ 0.75 is satisfied. Thereby, as described above, the vibration device 1 that can suppress an increase in the CI value of the vibration element 2 while being hardly affected by the disturbance is obtained.

[Sealing process]
Next, the lid 72 is prepared, and the lid 72 is joined to the upper surface of the base 71 in a state where the inside of the recess 711 is in a desired atmosphere. Thereby, a storage space S for storing the vibration element 2 is formed, and the vibration device 1 is obtained.

  The method for manufacturing the vibration device 1 has been described above. As described above, the method for manufacturing the vibration device 1 includes the vibration element 2 having the pad electrodes 412 and 422, the base 71 (support member) on which the internal terminals 731 and 732 (connection electrodes) are disposed, And the vibration element 2 and the base 71 are bonded via the conductive bonding members 91 and 92, and the bonding members 91 and 92 are brought into contact with the pad electrodes 412 and 422 and the internal terminals 731 and 732. The pad electrodes 412 and 422 and the internal terminals 731 and 732 are electrically connected to each other. The area of the smallest rectangular region Q that includes the entire region of the joint 80 between the joining members 91 and 92 and the vibration element 2 in a plan view along the direction in which the vibration element 2, the joining members 91 and 92, and the base 71 are arranged. Is S1, and the area of the joint 80 is S2, the relationship of 0.3 ≦ S2 / S1 ≦ 0.75 is satisfied. As a result, it is possible to obtain the vibration device 1 that can suppress an increase in the CI value of the vibration element 2 while being hardly affected by disturbance.

  As described above, in the method for manufacturing the vibration device 1, the joining members 91 and 92 are applied to at least one of the vibration element 2 and the base 71 in a plurality of times. Thereby, the joining members 91 and 92 can be made into a desired shape relatively easily. In the present embodiment, the uncured bonding members 91 and 92 are applied to the base 71, but the present invention is not limited to this, and may be applied to the vibration element 2. Further, a part of the joining members 91 and 92 (for example, a part forming the first extending part 81) is applied to the base 71, and the rest (for example, a part forming the second extending part 82) is applied to the vibration element 2. You may apply to.

  Further, as described above, the pad electrodes 412 and 412 are provided at one end of the vibration element 2. When the direction from the one end to the other end of the vibration element 2 is the first direction (X-axis direction) and the direction intersecting the first direction is the second direction (Z′-axis direction) The joining members 91 and 92 are applied to the base 71 along the first direction and the second direction, respectively, and the vibration element 2 is disposed on the joining members 91 and 92, and extends along the X-axis direction. The base 71 and the vibration element 2 are joined via the joint portion 80 having the first extension portion 81 and the second extension portion 82 extending along the Z′-axis direction. Thereby, application | coating of the joining members 91 and 92 becomes easy, and the base 71 and the vibration element 2 can be joined more reliably.

Second Embodiment
Next, a vibrating device according to a second embodiment of the invention will be described.

  FIG. 12 is a back view of the resonator element included in the resonator device according to the second embodiment of the invention.

  Hereinafter, the vibration device according to the second embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted.

  The vibration device according to the second embodiment of the present invention is mainly the same as the first embodiment described above except that the shape of the joint 80 is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 12, the joint portion 80 of the present embodiment includes the first extension portion 81 extending along the X-axis direction and the Z′-axis direction, as in the first embodiment described above. And a second extending portion 82 that extends. The first extending portion 81 includes a connecting portion 83 that connects the end portion on the minus side in the X-axis direction and the end portion on the minus side in the Z′-axis direction of the second extending portion 82. The width W3 of the first extending portion 81 is larger than the width W1 of the first extending portion 81 and the width W2 of the second extending portion 82. In the first embodiment described above, the relationship of W3> W1 and W2 is satisfied, but in this embodiment, W3 is larger than that. Therefore, when the imaginary line LLx along the inner edge 811 of the first extending portion 81 and the imaginary line LLz along the inner edge 821 of the second extending portion 82 are set, the inner edge 831 of the connecting portion 83 is the virtual lines LLx and LLz. It is located inside the vibration element 2 (center side) from the intersection P. Thereby, for example, compared to the first embodiment described above, the bonding strength between the bonding members 91 and 92 and the vibration element 2 can be increased.

  In the present embodiment, the inner edge 831 of the connecting portion 83 is curved in a concave shape, but is not limited thereto, and may be curved in a convex shape or may be linear, for example.

  Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Third Embodiment>
Next, a vibrating device according to a third embodiment of the invention will be described.
FIG. 13 is a back view of the resonator element included in the resonator device according to the third embodiment of the invention.

  Hereinafter, the vibration device according to the third embodiment will be described with a focus on differences from the first embodiment described above, and description of similar matters will be omitted.

  The vibration device according to the third embodiment of the present invention is mainly the same as that of the first embodiment described above except that the shape of the joint 80 is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 13, the joint portion 80 of the present embodiment includes a first extension portion 81 extending along the X-axis direction and a Z′-axis direction, as in the first embodiment described above. And a second extending portion 82 that extends. However, unlike the first embodiment described above, the end of the first extending portion 81 on the minus side in the X-axis direction and the end of the second extending portion 82 on the minus side in the Z′-axis direction are connected. Absent. In other words, the first extending portion 81 and the second extending portion 82 are arranged apart from each other. Thereby, the freedom degree of arrangement | positioning of the 1st extension part 81 and the 2nd extension part 82 increases compared with 1st Embodiment mentioned above, for example.

  Also according to the third embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
Next, a vibrating device according to a fourth embodiment of the invention will be described.

  FIG. 14 is a back view of the vibration element included in the vibration device according to the fourth embodiment of the invention.

  Hereinafter, the vibration device according to the fourth embodiment will be described focusing on the differences from the first embodiment described above, and description of similar matters will be omitted.

  The vibration device according to the fourth embodiment of the present invention is mainly the same as the first embodiment described above except that the shape of the joint 80 is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  As shown in FIG. 14, the joint portion 80 of the present embodiment includes a first extension portion 81 extending along the X-axis direction and a Z′-axis direction, as in the first embodiment described above. A second extending portion 82 that extends, an end portion on the minus side in the X-axis direction of the first extending portion 81, an end portion on the minus side in the Z′-axis direction of the second extending portion 82, Is connected. However, unlike the first embodiment described above, the inner edge 811 of the first extending portion 81 and the inner edge 821 of the second extending portion 82 are configured by a continuous curve. That is, the inner edge 801 of the joint 80 is configured by a curved curve (for example, an arc, a hyperbola, a parabola) that is concavely curved. Thereby, for example, even if the length of the 1st extension part 81 and the 2nd extension part 82 is the same, compared with 1st Embodiment mentioned above, the 1st extension part 81 and the 2nd extension part 82 are the same. The tip portion can be separated from the vibrating portion 31. Therefore, vibration leakage of the vibration element 2 can be more effectively suppressed. In addition, the inner edge 801 may be configured by a line partially having a curve.

  According to the fourth embodiment, the same effect as that of the first embodiment described above can be exhibited.

<Fifth Embodiment>
Next, an oscillator according to a fifth embodiment of the invention will be described.
FIG. 15 is a sectional view showing an oscillator according to the fifth embodiment of the invention.

  An oscillator 100 illustrated in FIG. 15 includes the vibration device 1 and a circuit element 110 (IC). The circuit element 110 is fixed to the recess 711 of the base 71 and is electrically connected to the vibration element 2. The circuit element 110 has an oscillation circuit for oscillating the vibration element 2. When the vibration element 2 is oscillated by the circuit element 110, a signal having a predetermined frequency can be extracted from the oscillator 100. In addition, as the vibration device 1, the thing of each embodiment mentioned above can be used, for example.

  Such an oscillator 100 includes the vibration device 1 and a circuit element 110 including an oscillation circuit that causes the vibration element 2 to oscillate. Therefore, the effect of the vibration device 1 described above can be enjoyed and high reliability can be exhibited.

  In the present embodiment, the circuit element 110 is disposed in the storage space S, but is not limited thereto, and may be disposed outside the storage space S, for example, on the lower surface of the base 71.

<Sixth Embodiment>
Next, an electronic apparatus according to a sixth embodiment of the invention will be described.
FIG. 16 is a perspective view showing an electronic apparatus according to the sixth embodiment of the present invention.

  A mobile type (or notebook type) personal computer 1100 shown in FIG. 16 is an application of an electronic apparatus including the vibration device of the invention. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 has a built-in oscillator 100 (vibration device 1). The oscillator is not particularly limited. For example, the oscillator described in the above embodiment can be used.

  Such a personal computer 1100 (electronic device) has the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed and high reliability can be exhibited.

<Seventh embodiment>
Next, an electronic apparatus according to a seventh embodiment of the invention will be described.
FIG. 17 is a perspective view showing an electronic apparatus according to the seventh embodiment of the present invention.

  A cellular phone 1200 (including PHS) shown in FIG. 17 is an application of an electronic device including the vibration device of the invention. In this figure, a cellular phone 1200 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is provided between the operation buttons 1202 and the earpiece 1204. Has been placed. Such a cellular phone 1200 incorporates an oscillator 100 (vibration device 1). The oscillator is not particularly limited. For example, the oscillator described in the above embodiment can be used.

  Such a cellular phone 1200 (electronic device) has the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed and high reliability can be exhibited.

<Eighth Embodiment>
Next, an electronic apparatus according to an eighth embodiment of the invention will be described.
FIG. 18 is a perspective view showing an electronic apparatus according to the eighth embodiment of the present invention.

  A digital still camera 1300 shown in FIG. 18 is an application of an electronic apparatus including the vibration device of the invention. In this figure, a display unit 1310 is provided on the back of a case (body) 1302, and is configured to display based on an image pickup signal by a CCD. The display unit 1310 is a finder that displays an object as an electronic image. Function. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302. When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. Such a digital still camera 1300 incorporates an oscillator 100 (vibration device 1).

  Such a digital still camera 1300 (electronic device) has the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed and high reliability can be exhibited.

  In addition to the personal computer, mobile phone, and digital still camera described above, the electronic device of the present invention includes, for example, a smartphone, a tablet terminal, a watch (including a smart watch), an inkjet discharge device (for example, an inkjet printer), Wearable terminals such as laptop personal computers, TVs, HMDs (head-mounted displays), video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices , Word processors, workstations, videophones, crime prevention TV monitors, electronic binoculars, POS terminals, medical equipment (eg electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic endoscopes), Group detector, various measuring instruments, mobile terminal the base station equipment, instruments (e.g., gages for vehicles, aircraft, and ships), a flight simulator, a network server or the like.

<Ninth Embodiment>
Next, a moving body according to a ninth embodiment of the invention will be described.
FIG. 19 is a perspective view showing a moving body according to the ninth embodiment of the present invention.

  An automobile 1500 shown in FIG. 19 is an automobile to which a moving object including the vibration device of the present invention is applied. In this figure, an automobile 1500 incorporates an oscillator 100 (vibration device 1). The oscillator 100 (vibration device 1) includes, for example, a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an anti-lock brake system (ABS), an air bag, a tire pressure monitoring system (TPMS: Tire Pressure Monitoring System), It can be widely applied to electronic control units (ECUs) such as engine controls, battery monitors for hybrid vehicles and electric vehicles, and vehicle attitude control systems.

  Such an automobile 1500 (moving body) has the vibration device 1. Therefore, the effect of the vibration device 1 described above can be enjoyed and high reliability can be exhibited.

  The moving body is not limited to the automobile 1500, and can be applied to, for example, an unmanned airplane such as an airplane, a ship, an AGV (automated guided vehicle), a bipedal walking robot, and a drone.

  As described above, the vibrating device, the manufacturing method of the vibrating device, the oscillator, the electronic device, and the moving body of the present invention have been described based on the illustrated embodiment, but the present invention is not limited to this, and the configuration of each part is as follows. Any structure having a similar function can be substituted. In addition, any other component may be added to the present invention. Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  In the above-described embodiment, the configuration in which the vibration device is applied to the oscillator has been described. However, the present invention is not limited to this. For example, the vibration device may be applied to a physical quantity sensor that can detect physical quantities such as acceleration and angular velocity. .

  Further, the configuration of the joint portion 80 is not particularly limited, and for example, as shown in FIGS. 20 to 27 in addition to the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment described above. Such a configuration may be adopted.

  20 and FIG. 21, the first extending portion 81 is disposed separately from the outer edge 21 of the vibration element 2. In particular, in FIG. 20, the first extending portion 81 extends from the middle of the extending direction of the second extending portion 82, and in FIG. 21, the end portion on the opposite side of the outer edge 21 of the second extending portion 82. The 1st extension part 81 is extended from.

  22 and 23, the second extending portion 82 is disposed so as to be separated from the outer edge 22 of the vibration element 2. In particular, in FIG. 22, the second extending portion 82 extends from the middle of the extending direction of the first extending portion 81, and in FIG. 23, the end portion of the first extending portion 81 opposite to the outer edge 22. The 2nd extension part 82 is extended from.

  24 and 25, the first extending portion 81 is disposed away from the outer edge 21 of the vibration element 2 and the second extending portion 82 is separated from the outer edge 22 of the vibration element 2. Are arranged. Further, in the joint portion 80 shown in FIG. 26, a plurality of joint regions 85 are arranged in a matrix (matrix). The joint 80 shown in FIG. 27 has a frame shape. That is, the joining portion 80 has a pair of first extending portions 81 and a pair of second extending portions 82.

  In the above-described embodiment, the shape of the joining portion 80 is the same (symmetric) in the joining members 91 and 92, but the present invention is not limited to this. Good.

  DESCRIPTION OF SYMBOLS 1 ... Vibration device, 10 ... Cantilever, 2 ... Vibrating element, 21 and 22 ... Outer edge, 3 ... Quartz substrate, 31 ... Vibrating part, 32 ... Thin part, 321, 322 ... End part, 38 ... Notch part, 39 ... Folding part, 4 ... electrode, 411 ... excitation electrode, 412 ... pad electrode, 413 ... extraction electrode, 421 ... excitation electrode, 422 ... pad electrode, 423 ... extraction electrode, 7 ... package, 71 ... base, 711 ... Recess, 72 ... Lid, 731, 732 ... Internal terminal, 741, 742 ... External terminal, 80 ... Joining part, 801 ... Inner edge, 81 ... First extension part, 811 ... Inner edge, 82 ... Second extension part, 821 ... Inner edge, 83 ... Connection part, 831 ... Inner edge, 85 ... Joining region, 91, 92 ... Joining member, 100 ... Oscillator, 110 ... Circuit element, 1100 ... Personal computer, 1102 ... Keyboard, 1104 ... Body part, 106: Display unit, 1108: Display unit, 1200: Mobile phone, 1202 ... Operation button, 1204 ... Earpiece, 1206 ... Mouthpiece, 1208 ... Display unit, 1300 ... Digital still camera, 1302 ... Case, 1304 ... Light receiving unit DESCRIPTION OF SYMBOLS 1306 ... Shutter button, 1308 ... Memory, 1310 ... Display part, 1500 ... Automobile, LLx ... Virtual line, LLz ... Virtual line, P ... Intersection, Q ... Rectangular area, Qx ... First side, Qz ... Second side, S: Storage space, θ: Angle

Claims (11)

A vibrating element having a pad electrode;
A support member on which a connection electrode is disposed;
A conductive bonding member that bonds the vibration element and the support member, and contacts the pad electrode and the connection electrode to electrically connect the pad electrode and the connection electrode; Have
In plan view along the direction in which the vibration element, the bonding member, and the support member are arranged, the area of the smallest rectangular region including the entire area of the bonding portion between the bonding member and the vibration element is S1, and the bonding portion A vibration device characterized by satisfying a relationship of 0.3 ≦ S2 / S1 ≦ 0.75, where S2 is an area of the substrate. The pad electrode is provided at one end of the vibration element,
When the direction from the one end to the other end of the vibration element is the first direction and the direction intersecting the first direction is the second direction,
In the plan view, the joint portion includes a first extension portion extending along the first direction and a second extension portion extending along the second direction. The vibrating device according to claim 1.   3. The vibrating device according to claim 2, wherein each of the first extending portion and the second extending portion extends along an outer edge of the vibrating element in the plan view. A connection portion connecting the end portion of the first extension portion and the end portion of the second extension portion;
The vibration device according to claim 3, wherein a width of the connection portion is larger than a width of the first extension portion and a width of the second extension portion.   The vibration device according to any one of claims 1 to 4, wherein a resonance frequency when the vibration element is a cantilever is 20 kHz or more and 100 kHz or less. Preparing a vibration element having a pad electrode and a support member on which a connection electrode is disposed;
The vibration element and the support member are bonded to each other via a conductive bonding member, and the bonding member is brought into contact with the pad electrode and the connection electrode to electrically connect the pad electrode and the connection electrode. Connecting, and
In plan view along the direction in which the vibration element, the bonding member, and the support member are arranged, the area of the smallest rectangular region including the entire area of the bonding portion between the bonding member and the vibration element is S1, and the bonding portion A method of manufacturing a vibration device, wherein the relationship of 0.3 ≦ S2 / S1 ≦ 0.75 is satisfied, where S2 is an area of the above.   The method for manufacturing a vibration device according to claim 6, wherein the joining member is applied to at least one of the vibration element and the support member in a plurality of times. The pad electrode is provided at one end of the vibration element,
When the direction from the one end to the other end of the vibration element is the first direction and the direction intersecting the first direction is the second direction,
The joining member is applied to the support member along each of the first direction and the second direction, the vibration element is disposed on the joining member, and the first member extends along the first direction. 8. The vibration device according to claim 6, wherein the support member and the vibration element are bonded to each other through a bonding portion having a first extending portion and a second extending portion extending along the second direction. Production method. A vibrating device according to any one of claims 1 to 5,
And an oscillation circuit that oscillates the vibration element.   An electronic apparatus comprising the vibration device according to claim 1.   A moving body comprising the vibration device according to claim 1.

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