JP2016174202A - Vibration piece, vibrator, vibration device, oscillator, electronic apparatus, and mobile - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration piece capable of reducing the equivalent series resistance.SOLUTION: A vibrator 100 includes a first excitation electrode 20a, a second excitation electrode 20b provided to overlap the first excitation electrode 20a in the plan view, a pair of first conductors 30, 32 arranged side by side in the X axis direction, so as to sandwich the first excitation electrode 20a in the plan view, and connected electrically with the second excitation electrode 20b, and a pair of second conductors 40, 42 arranged side by side in the X axis direction, so as to sandwich the second excitation electrode 20b in the plan view, and connected electrically with the first excitation electrode 20a. The first conductor 30 on one side of the X axis, out of the pair of first conductors 30, 32, and the second conductor 40 on one side of the X axis, out of the pair of second conductors 40, 42, overlap in the plan view, and the first conductor 32 on the other side of the X axis, out of the pair of first conductors 30, 32, and the second conductor 42 on the other side of the X axis, out of the pair of second conductors 40, 42, overlap in the plan view.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a resonator element, a vibrator, a vibration device, an oscillator, an electronic apparatus, and a moving body.

  Conventionally, a resonator element using quartz is known. Such a resonator element is widely used as a reference frequency source, an oscillation source, and the like for various electronic devices because of its excellent frequency-temperature characteristics. In particular, a resonator element using a quartz substrate cut at a cut angle called AT cut has a frequency-temperature characteristic that exhibits a cubic curve, and is therefore widely used in mobile communication devices such as mobile phones.

  For example, in Patent Document 1, protrusions are provided on both main surfaces of an AT-cut quartz substrate, excitation electrodes are provided on the protrusions, and stepped portions are provided so as to surround the protrusions and the excitation electrodes in plan view. Therefore, it is described that the thickness-shear vibration is prevented from propagating to the outer peripheral portion of the resonator element.

JP 2010-109527 A

  However, in the resonator element described in Patent Document 1, it is not possible to sufficiently suppress the thickness-shear vibration from propagating to the outer peripheral portion (end portion) of the resonator element, and an equivalent series resistance (CI (Crystal Impedance) value). May not be able to be reduced.

  One of the objects according to some aspects of the present invention is to provide a resonator element that can reduce the equivalent series resistance. Another object of some aspects of the present invention is to provide a vibrator, a vibration device, an oscillator, an electronic apparatus, and a moving body including the above-described vibration piece.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
The resonator element according to this application example is
A crystal axis of quartz, an X-axis as an electric axis, a Y-axis as a mechanical axis, and a Z-axis as an optical axis, the X-axis of a Cartesian coordinate system as a rotation axis, and the Z-axis as the rotation axis The axis tilted so that the + Z side rotates in the −Y direction of the Y axis is defined as the Z ′ axis, the axis tilted so that the + Y side rotates in the + Z direction of the Z axis is defined as the Y ′ axis, and the X axis A crystal substrate having a surface including an axis and the Z′-axis as a first surface and a second surface, and a thickness in the Y′-axis direction;
A first excitation electrode provided on the first surface of the quartz substrate;
A second excitation electrode provided on the second surface in front-back relation with the first surface so as to overlap the first excitation electrode in plan view;
A pair of first conductors arranged along the X-axis direction and electrically connected to the second excitation electrode so as to sandwich the first excitation electrode in plan view;
A pair of second conductors arranged in the X-axis direction and electrically connected to the first excitation electrode so as to sandwich the second excitation electrode in plan view;
Including
The first conductor on one side of the X-axis of the pair of first conductors and the second conductor on the one side of the X-axis of the pair of second conductors overlap in plan view. ,
The first conductor on the other side of the X-axis of the pair of first conductors and the second conductor on the other side of the X-axis of the pair of second conductors overlap in plan view. ing.

  In such a resonator element, vibration energy propagating to the outer peripheral portion (end portion) of the resonator element (vibration energy caused by thickness shear vibration) can be reduced, and the thickness shear vibration is concentrated in the central region of the quartz substrate. It becomes possible. As a result, with such a resonator element, the equivalent series resistance can be reduced.

[Application Example 2]
In the resonator element according to this application example,
The pair of first conductors and the pair of second conductors straddle a virtual center line along the X axis passing through the center of a region where the first excitation electrode and the second excitation electrode overlap in a plan view. It may be arranged as follows.

  In such a resonator element, the equivalent series resistance can be further reduced.

[Application Example 3]
In the resonator element according to this application example,
The distance Dx in the X-axis direction between each of the pair of first conductors and a region where the first excitation electrode and the second excitation electrode overlap in plan view is bending vibration generated in the quartz substrate. Where λ is the wavelength of
λ / 2 × (2n + 1) −0.1λ ≦ Dx ≦ λ / 2 × (2n + 1) + 0.1λ (where n is a positive integer)
May be satisfied.

  Such a vibrating piece can reduce the amplitude of flexural vibration generated in the quartz substrate.

[Application Example 4]
In the resonator element according to this application example,
The length Lx in the X-axis direction of each of the pair of first conductors is λ when the wavelength of bending vibration generated in the quartz substrate is λ.
λ / 2 × (2m + 1) −0.1λ ≦ Lx ≦ λ / 2 × (2m + 1) + 0.1λ (where m is a positive integer)
May be satisfied.

  Such a vibrating piece can reduce the amplitude of flexural vibration generated in the quartz substrate.

[Application Example 5]
The vibrator according to this application example is
A resonator element according to this application example;
A package containing the resonator element;
It has.

  Since such a vibrator includes the resonator element according to this application example, power consumption can be reduced.

[Application Example 6]
The device according to this application example is
A resonator element according to this application example;
An electronic element;
It has.

  Since such a vibrating device includes the resonator element according to this application example, power consumption can be reduced.

[Application Example 7]
In the vibrating device according to this application example,
The electronic element may be a temperature sensitive element.

  Since such a vibrating device includes the resonator element according to this application example, power consumption can be reduced.

[Application Example 8]
The oscillator according to this application example is
A resonator element according to this application example;
An oscillation circuit electrically connected to the resonator element;
It has.

  Since such an oscillator includes the resonator element according to this application example, power consumption can be reduced.

[Application Example 9]
The electronic device according to this application example is
The resonator element according to this application example is provided.

  Since such an electronic apparatus includes the resonator element according to this application example, it is possible to reduce power consumption.

[Application Example 10]
The mobile object according to this application example is
The resonator element according to this application example is provided.

  Since such a moving body includes the resonator element according to this application example, power consumption can be reduced.

FIG. 3 is a perspective view schematically showing a resonator element according to the embodiment. FIG. 6 is a plan view schematically showing the resonator element according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the resonator element according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the resonator element according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the resonator element according to the embodiment. The perspective view which shows an AT cut quartz substrate typically. FIG. 6 is a cross-sectional view schematically showing the resonator element according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the resonator element according to the embodiment. FIG. 6 is a cross-sectional view schematically showing the resonator element according to the embodiment. FIG. 6 is a plan view schematically showing a resonator element according to a first modification of the embodiment. FIG. 6 is a cross-sectional view schematically showing a resonator element according to a first modification of the embodiment. FIG. 10 is a plan view schematically showing a resonator element according to a second modification of the embodiment. FIG. 10 is a plan view schematically showing a resonator element according to a third modification example of the embodiment. FIG. 10 is a plan view schematically showing a resonator element according to a fourth modification example of the embodiment. FIG. 3 is a plan view schematically showing the vibrator according to the embodiment. FIG. 3 is a cross-sectional view schematically showing a vibrator according to the embodiment. FIG. 3 is a cross-sectional view schematically showing the vibration device according to the embodiment. Sectional drawing which shows typically the vibration device which concerns on the 1st modification of this embodiment. Sectional drawing which shows typically the vibration device which concerns on the 2nd modification of this embodiment. FIG. 3 is a cross-sectional view schematically showing the oscillator according to the embodiment. Sectional drawing which shows typically the oscillator which concerns on the modification of this embodiment. FIG. 3 is a plan view schematically showing the electronic apparatus according to the embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The top view which shows typically the mobile body which concerns on this embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, not all of the configurations described below are essential constituent requirements of the present invention.

1. First, the resonator element according to this embodiment will be described with reference to the drawings. FIG. 1 is a perspective view schematically showing a resonator element 100 according to the present embodiment. FIG. 2 is a plan view schematically showing the resonator element 100 according to the present embodiment. 3 is a cross-sectional view taken along the line III-III in FIG. 2 schematically showing the resonator element 100 according to the present embodiment. 4 is a cross-sectional view taken along line IV-IV in FIG. 2 schematically showing the resonator element 100 according to the present embodiment. FIG. 5 is a cross-sectional view taken along line VV in FIG. 2 schematically showing the resonator element 100 according to the present embodiment.

  As shown in FIGS. 1 to 5, the resonator element 100 includes a quartz substrate 10, excitation electrodes 20 a and 20 b, a pair of first conductors 30 and 32, and a pair of second conductors 40 and 42. Including.

  The quartz substrate 10 is made of an AT cut quartz substrate. Here, FIG. 6 is a perspective view schematically showing the AT-cut quartz crystal substrate 101.

  Piezoelectric materials such as quartz are generally trigonal and have crystal axes (X, Y, Z) as shown in FIG. The X axis is an electrical axis, the Y axis is a mechanical axis, and the Z axis is an optical axis. The quartz substrate 101 is a so-called rotated Y cut out from a piezoelectric material (for example, artificial quartz crystal) along a plane obtained by rotating an XZ plane (a plane including the X axis and the Z axis) by an angle θ around the X axis. It is a flat plate of a cut quartz substrate. Note that the Y axis and the Z axis are also rotated by θ around the X axis to be the Y ′ axis and the Z ′ axis, respectively. The quartz substrate 101 is a substrate having a plane including the X axis and the Z ′ axis as a main surface and a thickness along the direction along the Y ′ axis. Here, when θ = 35 ° 15 ′, the quartz substrate 101 is an AT-cut quartz substrate. Therefore, the AT-cut quartz crystal substrate 101 has the XZ ′ plane (a plane including the X axis and the Z ′ axis) orthogonal to the Y ′ axis as a main surface, and can vibrate with thickness shear vibration as the main vibration. The AT-cut quartz substrate 101 can be processed to obtain the quartz substrate 10.

As shown in FIG. 6, the quartz substrate 10 is a crystal axis of quartz, which is an X axis of an orthogonal coordinate system comprising an X axis as an electric axis, a Y axis as a mechanical axis, and a Z axis as an optical axis. , The axis tilted so that the Z-axis rotates in the -Y direction of the Y-axis + Z side is the Z 'axis, and the axis tilted so that the Y-axis rotates in the + Z direction of the Z-axis + Y side An AT-cut quartz crystal substrate having a surface including the X-axis and the Z′-axis as a main surface (first surface 10a and second surface 10b) and a thickness along the Y′-axis (Y′-axis direction). Consists of. 1 to 5 and FIGS. 7 to 14 shown below, the X axis, the Y ′ axis, and the Z ′ axis that are orthogonal to each other are illustrated.

  For example, as shown in FIG. 2, the quartz substrate 10 has the Y′-axis direction as the thickness direction, and is along the X-axis in a plan view from the Y′-axis direction (hereinafter also simply referred to as “plan view”). It has a rectangular shape with the long side as the long side (X-axis direction) and the short side as the direction along the Z′-axis (Z′-axis direction). The quartz substrate 10 has a peripheral portion 12 and a vibrating portion 14.

  The peripheral portion 12 is provided around the vibrating portion 14 as shown in FIG. The peripheral portion 12 is provided along the outer edge of the vibration portion 14. The peripheral portion 12 has a smaller thickness than the vibrating portion 14.

  As shown in FIG. 2, the vibrating portion 14 is surrounded by the peripheral portion 12 in plan view. The vibrating part 14 is a part having a thickness larger than that of the peripheral part 12. The vibration unit 14 has, for example, a side along the X axis and a side along the Z ′ axis. The planar view shape (shape seen from the Y′-axis direction) of the vibration unit 14 is, for example, a quadrangle. The vibration unit 14 includes a first portion 15 and a second portion 16.

  The first portion 15 of the vibrating portion 14 is thicker than the second portion 16. In the example shown in FIGS. 3 and 4, the first portion 15 is a portion having a thickness T1. The planar view shape of the first portion 15 is, for example, a quadrangle.

  The second portion 16 of the vibrating portion 14 is smaller in thickness than the first portion 15. In the example shown in FIGS. 3 and 4, the second portion 16 is a portion having a thickness T2. The second portion 16 is provided around the first portion 15. As described above, the vibration part 14 has the two types of parts 15 and 16 having different thicknesses, and the vibration piece 100 can be said to have a two-stage mesa structure.

  The vibration unit 14 can vibrate with thickness shear vibration as the main vibration. Since the vibrating portion 14 has a two-stage mesa structure, the vibrating piece 100 can have an energy confinement effect. “Thickness shear vibration” means that the direction of displacement of the quartz substrate is the direction along the main surface of the quartz substrate (in the example shown, the direction of displacement of the quartz substrate is the X-axis direction), and the direction of wave propagation is that of the quartz substrate. It is vibration in the thickness direction.

  The first excitation electrode 20a is provided on the first surface (a surface facing the + Y′-axis direction in the illustrated example) 10a of the quartz substrate 10. Specifically, the first excitation electrode 20 a is provided on the first surface 10 a of the first portion 15, the surface of the second portion 16, and the surface of the peripheral portion 12. The second excitation electrode 20 b is provided on the second surface 10 b (surface facing the −Y′-axis direction in the illustrated example) 10 b of the quartz crystal substrate 10. The second surface 10b is a surface having a front and back relationship with the first surface 10a. Specifically, the second excitation electrode 20 b is provided on the second surface 10 b of the first portion 15, the surface of the second portion 16, and the surface of the peripheral portion 12.

The first excitation electrode 20a and the second excitation electrode 20b are provided so as to overlap in a plan view. In the illustrated example, the excitation electrodes 20a and 20b are completely overlapped in plan view. The planar view shape of the excitation electrodes 20a and 20b is, for example, a quadrangle. In the illustrated example, the area of the excitation electrodes 20a and 20b is larger than the area of the vibration part 14 in plan view, and the vibration part 14 is provided inside the outer edges of the excitation electrodes 20a and 20b. The excitation electrodes 20a, 20b
This is an electrode for applying a voltage.

  The first excitation electrode 20a is electrically connected to the first electrode pad 24a through the first extraction electrode 22a. The second excitation electrode 20b is electrically connected to the second electrode pad 24b through the second extraction electrode 22b. The electrode pads 24 a and 24 b are electrically connected to, for example, an IC chip (not shown) for driving the resonator element 100. In the illustrated example, the electrode pads 24 a and 24 b are provided on the + X axis direction side of the peripheral portion 12. As the excitation electrodes 20a and 20b, the extraction electrodes 22a and 22b, and the electrode pads 24a and 24b (hereinafter also referred to as “excitation electrodes 20a and 20b” and the like), for example, chromium and gold are sequentially arranged from the quartz substrate 10 side. Use a laminate.

  The first conductors 30 and 32 are provided side by side along the X-axis direction so as to sandwich the first excitation electrode 20a in plan view. The first conductors 30 and 32 are provided on the surface of the peripheral portion 12 facing the + Y′-axis direction. In the illustrated example, the first conductor 30 is provided on the + X-axis direction side of the first excitation electrode 20a, and the first conductor 32 is provided on the −X-axis direction side of the first excitation electrode 20a. The first conductor 30 is a first conductor on one side of the X axis (in the illustrated example, + X axis direction side), and the first conductor 32 is the other side of the X axis (in the illustrated example, the −X axis). Direction side) first conductor.

  The first conductor 30 is electrically connected to the second electrode pad 24 b through the first wiring portion 31. The first conductor 32 is electrically connected to the second electrode pad 24 b through the first wiring part 33. Accordingly, the first conductors 30 and 32 are electrically connected to the second excitation electrode 20b and can have a polarity opposite to that of the first excitation electrode 20a (for example, the polarity of the first excitation electrode 20a is In the case of +, the polarity of the first conductors 30 and 32 is −). The first wiring parts 31 and 33 are provided on the surface of the peripheral part 12 facing the + Y′-axis direction.

  The second conductors 40 and 42 are provided side by side along the X-axis direction so as to sandwich the second excitation electrode 20b in plan view. The second conductors 40 and 42 are provided on the surface of the peripheral portion 12 facing the −Y′-axis direction. In the illustrated example, the second conductor 40 is provided on the + X-axis direction side of the second excitation electrode 20b, and the second conductor 42 is provided on the −X-axis direction side of the second excitation electrode 20b. The second conductor 40 is a second conductor on one side of the X axis (+ X axis direction side in the illustrated example), and the second conductor 42 is the other side of the X axis (−X axis in the illustrated example). Direction side) second conductor.

  The second conductor 40 is electrically connected to the first electrode pad 24a through the second wiring portion 41. The second conductor 42 is electrically connected to the first electrode pad 24 a through the second wiring portion 43. Therefore, the second conductors 40 and 42 are electrically connected to the first excitation electrode 20a and can have a polarity opposite to that of the second excitation electrode 20b (for example, the polarity of the second excitation electrode 20b is In the case of-, the polarity of the second conductors 40 and 42 is +). The second wiring parts 41 and 43 are provided on the surface of the peripheral part 12 facing the −Y′-axis direction.

  The first conductor 30 overlaps the second conductor 40 in plan view. The first conductor 32 overlaps the second conductor 42 in plan view. In the illustrated example, the conductors 30 and 40 are completely overlapped and the conductors 32 and 42 are completely overlapped in plan view. The planar view shape of the conductors 30, 32, 40, and 42 is, for example, a rectangle.

As shown in FIG. 2, the first conductors 30 and 32 and the second conductors 40 and 42 are arranged on the X axis passing through the center C of the region where the first excitation electrode 20a and the second excitation electrode 20b overlap in a plan view. It is arranged so as to straddle the virtual center line α along. The virtual center line α is, for example, parallel to the X axis. In the illustrated example, since the excitation electrodes 20a and 20b are completely overlapped in a plan view, the shape of the region where the excitation electrodes 20a and 20b overlap is the same as the excitation electrodes 20a and 20b in a plan view. The length of the first conductors 30 and 32 in the Z′-axis direction is, for example, half or more of the length of the first excitation electrode 20a in the Z′-axis direction. The length of the second conductors 40 and 42 in the Z′-axis direction is, for example, half or more of the length of the second excitation electrode 20b in the Z′-axis direction.

  The materials of the first conductors 30, 32, the second conductors 40, 42, the first wiring parts 31, 33, and the second wiring parts 41, 43 (hereinafter also referred to as “conductors 30, 40, etc.”) are: For example, it is the same as the excitation electrodes 20a and 20b.

  In the resonator element 100, the distance Dx in the X-axis direction between each of the first conductors 30 and 32 and the region where the first excitation electrode 20 a and the second excitation electrode 20 b overlap in plan view is the quartz substrate 10. When the wavelength of the flexural vibration generated in λ is λ, the relationship of the following formula (1) is satisfied.

  λ / 2 × (2n + 1) −0.1λ ≦ Dx ≦ λ / 2 × (2n + 1) + 0.1λ (where n is a positive integer) (1)

  In the illustrated example, the X-axis direction between each of the second conductors 40 and 42 and the region where the excitation electrodes 20a and 20b overlap in a plan view is also the distance Dx, which satisfies Expression (1).

  Further, in the resonator element 100, the length Lx in the X-axis direction of each of the first conductors 30 and 32 satisfies the relationship of the following formula (2).

  λ / 2 × (2m + 1) −0.1λ ≦ Dx ≦ λ / 2 × (2m + 1) + 0.1λ (where m is a positive integer) (2)

  In the illustrated example, the length of each of the second conductors 40 and 42 in the X-axis direction is also Lx, which satisfies Expression (2).

  The “wavelength of the bending vibration generated in the quartz substrate 10” is the wavelength of the bending vibration that is spurious (unnecessary vibration) generated in the quartz substrate 10. For example, the wavelength λ [mm] of the bending vibration is the vibration. When the resonance frequency of the piece 100 is f [MHz], it can be obtained by the following equation (3).

  λ / 2 = (1.332 / f) −0.0024 (3)

  In the expressions (1) and (2), “−0.1λ” and “+ 0.1λ” indicate dimensional variations (manufacturing variability). The influence on the characteristics of 100 can be sufficiently reduced. Specifically, bending vibration can be sufficiently reduced within this manufacturing variation range.

  By satisfying the expressions (1) and (2), as shown in FIG. 7, the side surfaces 2 and 3 of the conductors 30, 32, 40 and 42 are caused to have a maximum amplitude (mountain M) of the bending vibration generated in the quartz substrate 10. Alternatively, it can be provided so as to coincide with the position of the valley V). In the example shown in FIG. 7, the side surface 2 (the side surface on the side of the excitation electrodes 20 a and 20 b in plan view) is disposed in the valley V of the bending vibration generated in the quartz substrate 10, and the side surface 3 (the side surface opposite to the side surface 2) is In addition, it is arranged on a mountain M of bending vibration. Specifically, the side surfaces 2 and 3 are provided so as to pass through the maximum amplitude point (mountain M or valley V) of the bending vibration waveform W, and to be parallel to the virtual straight line β parallel to the Y ′ axis. FIG. 7 is a schematic diagram in which the amplitude of the bending vibration generated in the quartz substrate 10 is superimposed on the enlarged view of FIG.

In the example shown in FIG. 7, the distance Dx and the length Lx are values that are half the wavelength λ (λ / 2). Although not shown, the side surface 2 may be disposed in the bending vibration peak M, and the side surface 3 may be disposed in the bending vibration valley V. Further, the side surfaces 2 of the conductors 30 and 40 are arranged in the mountain M, and the conductors 32 and 4
The side surface 2 of 2 may be arranged in the valley V.

  Further, in the example shown in FIG. 7, the side surface 4 on the + Z′-axis direction side and the side surface 5 on the −Z′-axis direction side of the excitation electrodes 20 a and 20 b, and the side surface on the + Z′-axis direction side of the first portion 15 of the vibration unit 14. 6 and −Z′-axis side surface 7, and the + Z′-axis direction side surface 8 and −Z′-axis direction side surface 9 of the second portion 16 of the vibrating portion 14 are also bent vibrations generated in the quartz substrate 10. It is provided so as to coincide with the position of the maximum amplitude. In the example illustrated in FIG. 7, the side surfaces 2 to 9 are parallel to the Y ′ axis.

  As shown in FIG. 8, when the side surfaces 2 to 9 are inclined with respect to the Y ′ axis, the distance Dx is a distance between the centers of the two inclined side surfaces. The same applies to the length Lx. In this case, “the side surfaces 2 and 3 of the conductors 30, 32, 40 and 42 are provided so as to coincide with the position of the maximum amplitude (peak M or valley V) of the bending vibration generated in the quartz substrate 10”. As shown in FIG. 8, the center of the inclined side surfaces 2 and 3 is provided so as to coincide with the position of the maximum amplitude of the bending vibration generated in the quartz substrate 10.

  In the method for manufacturing the resonator element 100, the quartz substrate 10 is formed by, for example, photolithography and etching. Etching may be dry etching or wet etching. Next, the excitation electrodes 20a and 20b and the conductors 30 and 40 are formed on the quartz substrate 10. The excitation electrodes 20a, 20b, etc. and the conductors 30, 40, etc. are formed by forming a conductive layer (not shown) by sputtering or vacuum deposition, and patterning the conductive layer by photolithography and etching. . Through the above steps, the resonator element 100 can be manufactured.

  For example, the resonator element 100 has the following characteristics.

  In the resonator element 100, the first conductors 30 and 32 arranged in the X-axis direction and electrically connected to the second excitation electrode 20 b so as to sandwich the first excitation electrode 20 a in plan view, and the second excitation Second conductors 40 and 42 arranged in the X-axis direction and electrically connected to the first excitation electrode 20a so as to sandwich the electrode 20b are included. In plan view, the first conductor 30 and the second conductor 40 overlap, and the first conductor 32 and the second conductor 42 overlap. Therefore, as shown in FIG. 9, in the peripheral portion 12, it is possible to cause a movement that suppresses the thickness shear vibration propagated (leaked) from the vibrating portion 14 to the peripheral portion 12. Thereby, in the resonator element 100, vibration energy (vibration energy caused by thickness shear vibration) propagating to the outer peripheral portion (end) of the resonator element 100 can be reduced, and the thickness shear vibration is reduced in the central region of the quartz substrate 10. Can be concentrated on (vibrating unit 14). As a result, in the resonator element 100, the equivalent series resistance can be reduced. Further, in the resonator element 100, for example, the coupling between the thickness shear vibration mode and the bending vibration (unnecessary vibration) mode that is a cause of spurious can be suppressed, and the frequency characteristics can be stabilized.

  9 is a schematic diagram in which the vibration energy distribution resulting from the thickness shear vibration of the vibrating piece 100 and the displacement direction of the thickness shear vibration are combined with the cross-sectional view shown in FIG. In FIG. 9, the vibration energy (vibration energy distribution) E1 when the conductors 30, 32, 40, and 42 are provided is indicated by a solid line, and the vibration energy (vibration energy when the conductors 30, 32, 40, and 42 are not provided). Distribution) E2 is indicated by a broken line. Furthermore, in FIG. 9, the polarity (+ or-) of the excitation electrodes 20a and 20b and the conductors 30, 32, 40, and 42 is shown.

  In the example shown in FIG. 9, in the peripheral portion 12, the vibration energy E1 is smaller than the vibration energy E2, but in the first portion 15 of the vibration portion 14, the vibration energy E1 is the same size as the vibration energy E2.

  In the resonator element 100, the first conductors 30 and 32 and the second conductors 40 and 42 are disposed so as to straddle the virtual center line α. Therefore, in the resonator element 100, the equivalent series resistance can be further reduced.

  In the resonator element 100, the expressions (1) and (2) are satisfied. Therefore, in the resonator element 100, the side surfaces 2 and 3 of the conductors 30, 32, 40 and 42 can be provided so as to coincide with the position of the maximum amplitude of the bending vibration generated in the quartz substrate 10. Therefore, in the resonator element 100, the amplitude of the bending vibration generated in the quartz substrate 10 can be reduced.

  In the above description, the two-stage mesa structure in which the vibrating portion 14 has two types of portions 15 and 16 having different thicknesses has been described. However, the number of steps of the mesa structure of the resonator element according to the invention is not particularly limited. For example, the resonator element according to the present invention may have a three-stage mesa structure in which the vibration part has three types of parts having different thicknesses, a four-stage mesa structure, or a vibration part. May be a one-stage mesa structure that does not have portions with different thicknesses. Further, the resonator element according to the present invention may not have a mesa structure. That is, the thickness of the peripheral portion 12 and the thickness of the vibrating portion 14 may be the same.

  Further, in the above example, the vibration unit 14 has a portion protruding to the + Y′-axis direction side and a portion protruding to the −Y′-axis direction side from the peripheral portion 12, In the resonator element according to the aspect of the invention, the vibrating portion includes only one of a portion protruding to the + Y′-axis direction side and a portion protruding to the −Y′-axis direction side from the peripheral portion. It may be.

  In the above description, the example in which the vibration part 14 has a rectangular shape in plan view has been described. However, the vibration part of the resonator element according to the invention has a corner (corner part) chamfered in plan view. It may be. That is, the vibration part may have a shape in which a rectangular corner is cut off.

  In the above description, an example in which the quartz substrate 10 is an AT cut quartz substrate has been described. However, in the resonator element according to the invention, the quartz substrate is not limited to an AT cut quartz substrate, for example, an SC cut quartz substrate or a BT cut. A piezoelectric substrate that vibrates due to thickness-shear vibration such as a quartz substrate may be used.

2. 2. Modification of vibrating piece 2.1. First Modified Example Next, a resonator element according to a first modified example of the embodiment will be described with reference to the drawings. FIG. 10 is a plan view schematically showing the resonator element 200 according to the first modification example of the embodiment. FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 10 schematically showing a resonator element 200 according to a first modification of the present embodiment.

  Hereinafter, in the resonator element 200 according to the first modification of the present embodiment, members having the same functions as those of the constituent members of the resonator element 100 described above are denoted by the same reference numerals, and detailed description thereof is omitted. The same applies to the resonator element according to the second, third, and fourth modifications according to the present embodiment described below.

  In the vibrating piece 100 described above, as shown in FIGS. 2 and 5, the first wiring part 33 is provided on the surface of the peripheral part 12 facing the + Y′-axis direction, and the second wiring part 43 is provided on the peripheral part 12. It was provided on the surface facing the −Y′-axis direction.

On the other hand, in the resonator element 200, as shown in FIGS. 10 and 11, the first wiring part 33 is provided on the side surface 10c (of the peripheral part 12) of the quartz substrate 10, and the second wiring part 43 is made of quartz. It is provided on the side surface 10 d (of the peripheral portion 12) of the substrate 10. In the illustrated example, the side surface 10c is a surface facing the + Z′-axis direction, and the side surface 10d is a surface facing the −Z′-axis direction.

  In the resonator element 200, the first wiring portion 33 is provided on the side surface 10 c of the quartz substrate 10, and the second wiring portion 43 is provided on the side surface 10 d of the quartz substrate 10. The distance between the wiring parts 33 and 43 and the vibration part 14 can be reduced. Therefore, in the resonator element 200, the influence of the wiring portions 33 and 43 on the vibration of the vibration portion 14 can be reduced. In the resonator element 100, the wiring portions 33 and 43 are not formed on the side surfaces 10 c and 10 d of the quartz substrate 10, so that the interconnect portions 33 and 43 are easier to form than the resonator element 200, for example.

2.2. Second Modification Example Next, a resonator element according to a second modification example of this embodiment will be described with reference to the drawings. FIG. 12 is a plan view schematically showing a resonator element 300 according to the second modification example of the present embodiment.

  In the above-described vibration piece 100, as shown in FIG. 2, the area of the excitation electrodes 20a and 20b is larger than the area of the vibration part 14 in a plan view, and the vibration part 14 is located inside the outer edges of the excitation electrodes 20a and 20b. Was provided.

  On the other hand, in the resonator element 300, as shown in FIG. 12, the area of the excitation electrodes 20a and 20b is smaller than the area of the vibration part 14 in plan view, and the excitation electrodes 20a and 20b It is provided inside the outer edge of the one portion 15.

  In the resonator element 300, the distance Ex in the X-axis direction between each of the first conductors 30 and 32 and the vibrating portion 14 is expressed by the following formula (λ) where the wavelength of bending vibration generated in the quartz substrate 10 is λ. The relationship of 4) is satisfied.

  λ / 2 × (2p + 1) −0.1λ ≦ Ex ≦ λ / 2 × (2p + 1) + 0.1λ (where p is a positive integer) (4)

  In the illustrated example, the X-axis direction between each of the second conductors 40 and 42 and the vibrating portion 14 is also the distance Ex, which satisfies Expression (4). For example, Ex is a value half the wavelength λ (λ / 2).

  In the resonator element 300, the expressions (2) and (4) are satisfied. Therefore, in the resonator element 300, the side surfaces 2 and 3 of the conductors 30, 32, 40 and 42 can be provided so as to coincide with the position of the maximum amplitude of the bending vibration generated in the quartz substrate 10. Therefore, in the resonator element 300, the amplitude of the bending vibration generated in the quartz substrate 10 can be reduced.

2.3. Third Modification Next, a resonator element according to a third modification of the present embodiment will be described with reference to the drawings. FIG. 13 is a plan view schematically showing a resonator element 400 according to a third modification of the present embodiment.

  In the vibration piece 100 described above, as illustrated in FIG. 2, the vibration unit 14 has a quadrangular shape in plan view.

  On the other hand, in the resonator element 400, as shown in FIG. 13, the vibration part 14 has an elliptical shape in plan view. The vibration unit 14 has, for example, an elliptical shape in which the major axis is an axis parallel to the X axis, the minor axis is an axis parallel to the Z ′ axis, and the major axis a: minor axis b = 1.26: 1. Have.

In the resonator element 400, the vibration unit 14 has an elliptical shape in plan view. Therefore, for example, compared with a case where the vibration unit 14 has a quadrangular shape in plan view, vibration of thickness shear vibration is generated. Energy confinement can be performed more efficiently. Since the isobaric lines of vibration displacement energy are lines along an ellipse having a major axis a: minor axis b = 1.26: 1 in plan view, the shape of the vibration part 14 in plan view is represented by the major axis a: By adopting an elliptical shape with the minor axis b = 1.26: 1, the vibration energy of the thickness shear vibration can be confined more efficiently.

  In FIG. 11, the single-stage mesa structure resonator element 400 is illustrated, but the number of stages of the mesa structure is not particularly limited as described above.

2.4. Fourth Modified Example Next, a resonator element according to a fourth modified example of the embodiment will be described with reference to the drawings. FIG. 14 is a plan view schematically showing a resonator element 500 according to a fourth modification of the present embodiment.

  In the resonator element 100 described above, as shown in FIG. 2, the quartz substrate 10 has a rectangular shape in plan view.

  On the other hand, in the resonator element 500, as shown in FIG. 14, the corner (corner) in the −X-axis direction of the quartz substrate 10 is chamfered. In other words, it has a shape with rectangular corners cut off. For example, the corner in the + X axis direction of the quartz substrate 10 may be chamfered.

  Furthermore, in the resonator element 500, as shown in FIG. 14, a plurality of recesses 13 are provided in a portion of the peripheral portion 12 where the electrode pads 24a and 24b are provided. The number of the recessed parts 13 is not specifically limited.

  In the resonator element 500, since the corner portion of the quartz substrate 10 is chamfered, the possibility that burrs (for example, etching residues) are generated when the quartz substrate 10 is formed by etching can be reduced. Furthermore, when the resonator element 500 is mounted on the package, the possibility that the corner portion of the crystal substrate 10 contacts the package and is damaged can be reduced.

  Furthermore, since the resonator element 500 is provided with the plurality of concave portions 13, the contact area between the peripheral portion 12 and the electrode pads 24a and 24b can be increased. Therefore, in the resonator element 500, the adhesion between the peripheral portion 12 and the electrode pads 24a and 24b can be improved.

  The vibrating piece 500 is formed, for example, by cutting a connecting portion (not shown) that connects a frame portion (not shown) of the crystal wafer and the vibrating piece to separate the vibrating pieces. In the example shown in FIG. 14, the crystal substrate 10 is provided with a part of the connecting portion (removal mark) 19.

3. Next, the vibrator according to the present embodiment will be described with reference to the drawings. FIG. 15 is a plan view schematically showing the vibrator 700 according to the present embodiment. 16 is a cross-sectional view taken along the line XVI-XVI of FIG. 15 schematically showing the vibrator 700 according to the present embodiment. For convenience, the seal ring 713 and the lid 714 are omitted in FIG.

  The vibrator 700 includes the resonator element according to the invention. Below, the vibrator | oscillator 700 provided with the vibration piece 100 is demonstrated as a vibration piece which concerns on this invention. As shown in FIGS. 15 and 16, the vibrator 700 includes a vibrating piece 100 and a package 710.

The package 710 includes a box-shaped base 712 having a recess 711 opened on the upper surface, and a plate-shaped lid 714 joined to the base 712 so as to close the opening of the recess 711. Such a package 710 has an accommodation space formed by closing the recess 711 with a lid 714, and the resonator element 100 is accommodated and installed in the accommodation space in an airtight manner. That is, the resonator element 100 is accommodated in the package 710.

  The accommodation space (recess 711) in which the resonator element 100 is accommodated may be in a reduced pressure (vacuum) state, or may be filled with an inert gas such as nitrogen, helium, or argon. . Thereby, the vibration characteristics of the resonator element 100 can be improved.

  The material of the base 712 is, for example, various ceramics such as aluminum oxide. The material of the lid 714 is, for example, a material whose linear expansion coefficient approximates that of the base 712. Specifically, when the material of the base 712 is ceramics, the material of the lid 714 is an alloy such as Kovar.

  The base 712 and the lid 714 are joined by providing a seal ring 713 on the base 712, placing the lid 714 on the seal ring 713, and welding the seal ring 713 to the base 712 using, for example, a resistance welding machine. Is done by. The joining of the base 712 and the lid 714 is not particularly limited, and may be performed using an adhesive or may be performed by seam welding.

  A first connection terminal 730 and a second connection terminal 732 are provided on the bottom surface of the recess 711 of the package 710. The first connection terminal 730 is provided to face the first electrode pad 24 a of the resonator element 100. The second connection terminal 732 is provided to face the second electrode pad 24 b of the resonator element 100. The connection terminals 730 and 732 are electrically connected to the electrode pads 24a and 24b through the conductive fixing member 734, respectively.

  A first external terminal 740 and a second external terminal 742 are provided on the outer bottom surface of the package 710 (the bottom surface of the base 712). The first external terminal 740 is provided at a position overlapping the first connection terminal 730 in plan view, for example. The second external terminal 742 is provided at a position overlapping the second connection terminal 732 in a plan view, for example. The first external terminal 740 is electrically connected to the first connection terminal 730 through a via (not shown). The second external terminal 742 is electrically connected to the second connection terminal 732 through a via (not shown).

  As the connection terminals 730 and 732 and the external terminals 740 and 742, for example, Ni (nickel), Au (gold), Ag (silver), metallization layer (underlayer) such as Cr (chrome), W (tungsten), etc. A metal film in which respective films such as Cu (copper) are laminated is used. As the conductive fixing member 734, for example, solder, silver paste, a conductive adhesive (an adhesive in which a conductive filler such as metal particles is dispersed in a resin material), or the like is used.

  Since the vibrator 700 includes the resonator element 100 that can reduce the equivalent series resistance, power consumption can be reduced.

4). Next, the vibration device according to the present embodiment will be described with reference to the drawings. FIG. 17 is a cross-sectional view schematically showing the vibration device 800 according to this embodiment.

  Hereinafter, in the vibration device 800 according to the present embodiment, members having the same functions as those of the components of the vibrator 700 described above are denoted by the same reference numerals, and detailed description thereof is omitted.

The vibration device 800 includes the resonator element according to the invention. Below, the vibration device 800 provided with the vibration piece 100 is demonstrated as a vibration piece which concerns on this invention. As illustrated in FIG. 17, the vibration device 800 includes a vibration piece 100, a package 710, and a temperature sensitive element (electronic element) 810.

  The package 710 includes a housing portion 812 that houses the temperature sensitive element 810. The accommodating portion 812 can be formed, for example, by providing a frame-shaped member 814 on the lower surface side of the base 712 in plan view.

  The temperature sensing element 810 is, for example, a thermistor whose physical quantity, for example, electric resistance changes according to a temperature change. The electric resistance of the thermistor can be detected by an external circuit, and the detected temperature of the thermistor can be measured.

  It should be noted that other electronic components may be accommodated in the accommodation space (recess 711) of the package 710. Examples of such an electronic component include an IC chip that controls driving of the resonator element 100.

  Since the vibration device 800 includes the resonator element 100 that can reduce the equivalent series resistance, the power consumption can be reduced.

5. Modified example of vibration device 5.1. First Modified Example Next, a vibrating device according to a first modified example of the present embodiment will be described with reference to the drawings. FIG. 18 is a cross-sectional view schematically showing a vibrating device 900 according to a first modification of the present embodiment.

  Hereinafter, in the vibration device 900 according to the first modification of the present embodiment, members having the same functions as those of the components of the vibration device 800 described above are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the vibration device 800 described above, as illustrated in FIG. 17, the housing portion 812 that houses the temperature-sensitive element 810 is formed by providing the frame-shaped member 814 on the lower surface side of the base 712.

  On the other hand, in the vibration device 900, as shown in FIG. 18, a recess 912 is formed on the bottom surface of the package 710 (on the lower surface of the base 712), and the temperature sensing element 810 is accommodated in the recess 912. In the illustrated example, a third connection terminal 930 is provided on the bottom surface of the recess 912, and a temperature sensitive element 810 is provided below the third connection terminal 930 via a metal bump or the like. For example, the third connection terminal 930 is electrically connected to the external terminal 740 and the first connection terminal 730 through a via (not shown) formed in the base 712. The material of the third connection terminal 930 is the same as the material of the first connection terminal 730, for example.

5.2. Second Modified Example Next, a vibrating device according to a modified example of the present embodiment will be described with reference to the drawings. FIG. 19 is a cross-sectional view schematically showing a vibrating device 1000 according to a second modification of the present embodiment.

  Hereinafter, in the vibration device 1000 according to the second modification of the present embodiment, members having the same functions as those of the components of the vibration devices 800 and 900 described above are denoted by the same reference numerals, and detailed description thereof is omitted. .

In the vibration device 800, as shown in FIG. 17, the temperature sensing element 810 includes a frame-shaped member 814.
Is provided on the lower surface side of the base 712 to form the accommodating portion 812 that accommodates the temperature sensitive element 810.

  On the other hand, in the vibration device 1000, as shown in FIG. 19, a recess 912 is formed on the bottom surface of the recess 711 (on the upper surface of the base 712), and the temperature sensitive element 810 is accommodated in the recess 912. The temperature sensing element 810 is provided on the third connection terminal 930.

6). Oscillator Next, an oscillator according to this embodiment will be described with reference to the drawings. FIG. 20 is a cross-sectional view schematically showing an oscillator 1100 according to this embodiment.

  Hereinafter, in the oscillator 1100 according to this embodiment, members having the same functions as those of the components of the vibrator 700 described above are denoted by the same reference numerals, and detailed description thereof is omitted.

  The oscillator 1100 includes the resonator element according to the invention. Hereinafter, an oscillator 1100 including the resonator element 100 will be described as the resonator element according to the invention. As illustrated in FIG. 20, the oscillator 1100 includes a resonator element 100, a package 710, and an IC chip (chip component) 1110.

  In the oscillator 1100, the recess 711 is formed in the first recess 711a provided on the upper surface of the base 712, the second recess 711b provided in the center of the bottom surface of the first recess 711a, and the center of the bottom surface of the second recess 711b. And a third recess 711c provided.

  A first connection terminal 730 is provided on the bottom surface of the first recess 711a. An IC chip 1110 is provided on the bottom surface of the third recess 711c. The IC chip 1110 has a drive circuit (oscillation circuit) for controlling the drive of the resonator element 100. When the resonator element 100 is driven by the IC chip 1110, vibration having a predetermined frequency can be extracted. The IC chip 1110 overlaps with the resonator element 100 in plan view.

  A plurality of internal terminals 1120 that are electrically connected to the IC chip 1110 via wires 1112 are provided on the bottom surface of the second recess 711b. For example, one internal terminal 1120 of the plurality of internal terminals 1120 is electrically connected to the first connection terminal 730 via a wiring (not shown). Therefore, the IC chip 1110 is electrically connected to the resonator element 100. Note that the internal terminal 1120 may be electrically connected to the external terminal 740 through a via (not shown) formed in the base 712.

  Since the oscillator 1100 includes the resonator element 100 that can reduce the equivalent series resistance, power consumption can be reduced.

7). Next, an oscillator according to a modification of the present embodiment will be described with reference to the drawings. FIG. 21 is a cross-sectional view schematically showing an oscillator 1200 according to a modification of the present embodiment.

  Hereinafter, in the oscillator 1200 according to the modification of the present embodiment, members having the same functions as those of the components of the oscillator 1100 described above are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the oscillator 1100 described above, as shown in FIG. 20, the IC chip 1110 overlaps the resonator element 100 in plan view.

  On the other hand, in the oscillator 1200, as shown in FIG. 21, the IC chip 1110 does not overlap the resonator element 100 in plan view. The IC chip 1110 is provided on the side of the resonator element 100.

  In the oscillator 1200, a package 710 is configured by a plate-like base 712 and a convex lid 714. The lid 714 is hermetically sealed by melting the metallized 1210 provided in the peripheral portion of the base 712. At this time, the inside can be evacuated by performing the sealing step in a vacuum. As a sealing means, a means for melting and welding the lid 714 using laser light or the like may be used.

  For example, the first connection terminal 730 is electrically connected to the first external terminal 740 through a via (not shown) formed in the base 712. The internal terminal 1120 is electrically connected to the first external terminal 740 via a via (not shown) formed in the base 712. The internal terminal 1120 is electrically connected to the first connection terminal 730 via a wiring (not shown). The IC chip 1110 is provided on the internal terminal 1120 via metal bumps or the like.

8). Next, an electronic device according to the present embodiment will be described with reference to the drawings. The electronic device according to the present embodiment includes the resonator element according to the invention. Hereinafter, an electronic device including the resonator element 100 will be described as the resonator element according to the invention.

  FIG. 22 is a plan view schematically showing a smartphone 1300 as an electronic apparatus according to this embodiment. The smartphone 1300 includes an oscillator 1100 having a resonator element 100 as shown in FIG.

  The smartphone 1300 uses the oscillator 1100 as a timing device such as a reference clock oscillation source, for example. The smartphone 1300 can further include a display unit (such as a liquid crystal display or an organic EL display) 1310, an operation unit 1320, and a sound output unit 1330 (such as a microphone). The smartphone 1300 may also use the display unit 1310 as an operation unit by providing a contact detection mechanism for the display unit 1310.

  Note that an electronic device typified by the smartphone 1300 preferably includes an oscillation circuit that drives the resonator element 100 and a temperature compensation circuit that corrects a frequency variation associated with a temperature change of the resonator element 100.

  According to this, the electronic device represented by the smartphone 1300 includes the oscillation circuit that drives the resonator element 100 and the temperature compensation circuit that corrects the frequency variation accompanying the temperature change of the resonator element 100. Therefore, it is possible to provide temperature compensation for the resonance frequency at which oscillation occurs and to provide an electronic device having excellent temperature characteristics.

  FIG. 23 is a perspective view schematically showing a mobile (or notebook) personal computer 1400 as the electronic apparatus according to the present embodiment. As shown in FIG. 23, the personal computer 1400 includes a main body portion 1404 having a keyboard 1402 and a display unit 1406 having a display portion 1405. The display unit 1406 is a hinge structure portion with respect to the main body portion 1404. It is supported so that rotation is possible. Such a personal computer 1400 incorporates a resonator element 100 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 24 is a perspective view schematically showing a mobile phone (including PHS) 1500 as an electronic apparatus according to this embodiment. A cellular phone 1500 includes a plurality of operation buttons 1502, an earpiece 1504, and a mouthpiece 1506, and a display portion 1508 is disposed between the operation buttons 1502 and the earpiece 1504. Such a cellular phone 1500 incorporates a resonator element 100 that functions as a filter, a resonator, or the like.

  FIG. 25 is a perspective view schematically showing a digital still camera 1600 as the electronic apparatus according to the present embodiment. In FIG. 25, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1600 photoelectrically converts a light image of a subject with an image sensor such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1603 is provided on the back of a case (body) 1602 in the digital still camera 1600, and is configured to perform display based on an imaging signal from the CCD. The display unit 1603 displays an object as an electronic image. Functions as a viewfinder. A light receiving unit 1604 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1602.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1606, the CCD image pickup signal at that time is transferred and stored in the memory 1608. In the digital still camera 1600, a video signal output terminal 1612 and an input / output terminal 1614 for data communication are provided on the side surface of the case 1602. As shown in the figure, a television monitor 1630 is connected to the video signal output terminal 1612 and a personal computer 1640 is connected to the input / output terminal 1614 for data communication as necessary. Further, the imaging signal stored in the memory 1608 is output to the television monitor 1630 or the personal computer 1640 by a predetermined operation. Such a digital still camera 1600 incorporates a resonator element 100 that functions as a filter, a resonator, or the like.

  Since the smartphone 1300, the personal computer 1400, the mobile phone 1500, and the digital still camera 1600 include the resonator element 100 that can reduce the equivalent series resistance, power consumption can be reduced.

  Note that the electronic apparatus including the resonator element according to the invention is not limited to the above example. For example, an inkjet discharge device (for example, an inkjet printer), a laptop personal computer, a television, a video camera, a video tape recorder, and a car navigation system. Devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, videophones, security TV monitors, electronic binoculars, POS terminals, medical devices (eg electronic thermometers, blood pressure) Applied to blood glucose meters, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic endoscopes), fish detectors, various measuring instruments, instruments (eg, vehicles, aircraft, ship instruments), flight simulators, etc. Can do.

9. Next, the moving body according to the present embodiment will be described with reference to the drawings. The moving body according to the present embodiment includes the resonator element according to the invention. Below, the moving body provided with the vibration piece 100 is demonstrated as a vibration piece which concerns on this invention.

FIG. 26 is a plan view schematically showing an automobile 1700 as a moving body according to the present embodiment. As shown in FIG. 26, the automobile 1700 includes a controller 1720, a controller 1730, a controller 1740, a battery 1750, and a backup battery 1760 that perform various controls such as an engine system, a brake system, and a keyless entry system. Yes. Note that the automobile 1700 may have a configuration in which some of the components (parts) illustrated in FIG. 24 are omitted or changed, or other components are added.

  Since the automobile 1700 includes the resonator element 100 that can reduce the equivalent series resistance, the power consumption can be reduced.

  Various mobile bodies are conceivable as the mobile body according to the present embodiment, and examples include automobiles (including electric cars), aircraft such as jets and helicopters, ships, rockets, and artificial satellites.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is possible to appropriately combine each embodiment and each modification.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

2, 3, 4, 5, 6, 7, 8, 9 ... side face, 10 ... quartz substrate, 10a ... first surface, 10b ... second surface, 10c, 10d ... side face, 12 ... peripheral part, 13 ... concave part, DESCRIPTION OF SYMBOLS 14 ... Vibrating part, 15 ... 1st part, 16 ... 2nd part, 19 ... Breaking mark, 20a ... 1st excitation electrode, 20b ... 2nd excitation electrode, 22a ... 1st extraction electrode, 22b ... 2nd extraction electrode 24a ... first electrode pad, 24b ... second electrode pad, 30 ... first conductor, 31 ... first wiring part, 32 ... first conductor, 33 ... first wiring part, 40 ... second conductor, 41 ... 2nd wiring part, 42 ... 2nd conductor, 43 ... 2nd wiring part, 100 ... Vibrating piece, 101 ... AT cut crystal substrate, 200, 300, 400, 500 ... Vibrating piece, 700 ... Vibrator, 710 ... package, 711 ... recess, 711a ... first recess, 711b ... second recess, 711c ... 3 recesses, 712 ... base, 713 ... seal ring, 714 ... lid, 730 ... first connection terminal, 732 ... second connection terminal, 734 ... conductive fixing member, 740 ... first external terminal, 742 ... second external terminal , 800 ... vibration device, 810 ... temperature sensing element, 812 ... housing portion, 814 ... frame-shaped member, 900 ... vibration device, 912 ... recess, 930 ... third connection terminal, 1000 ... vibration device, 1100 ... oscillator, 1110 ... IC chip, 1112 ... wire, 1120 ... internal terminal, 1200 ... oscillator, 1210 ... metallized, 1300 ... smart phone, 1310 ... display unit, 1320 ... operation unit, 1330 ... sound output unit, 1400 ... personal computer, 1402 ... keyboard, 1404... Main unit, 1405. Display unit, 1406. Display unit, 1500. Telephone, 1502 ... Operation button, 1504 ... Earpiece, 1506 ... Mouthpiece, 1508 ... Display unit, 1600 ... Digital still camera, 1602 ... Case, 1603 ... Display unit, 1604 ... Light receiving unit, 1606 ... Shutter button, 1608 ... Memory, 1612 ... Video signal output terminal, 1614 ... Input / output terminal, 1630 ... TV monitor, 1640 ... Personal computer, 1700 ... Automobile, 1720, 1730, 1740 ... Controller, 1750 ... Battery, 1760 ... Backup battery

Claims (10)

A crystal axis of quartz, an X-axis as an electric axis, a Y-axis as a mechanical axis, and a Z-axis as an optical axis, the X-axis of a Cartesian coordinate system as a rotation axis, and the Z-axis as the rotation axis The axis tilted so that the + Z side rotates in the −Y direction of the Y axis is defined as the Z ′ axis, the axis tilted so that the + Y side rotates in the + Z direction of the Z axis is defined as the Y ′ axis, and the X axis A crystal substrate having a surface including an axis and the Z′-axis as a first surface and a second surface, and a thickness in the Y′-axis direction;
A first excitation electrode provided on the first surface of the quartz substrate;
A second excitation electrode provided on the second surface in front-back relation with the first surface so as to overlap the first excitation electrode in plan view;
A pair of first conductors arranged along the X-axis direction and electrically connected to the second excitation electrode so as to sandwich the first excitation electrode in plan view;
A pair of second conductors arranged in the X-axis direction and electrically connected to the first excitation electrode so as to sandwich the second excitation electrode in plan view;
Including
The first conductor on one side of the X-axis of the pair of first conductors and the second conductor on the one side of the X-axis of the pair of second conductors overlap in plan view. ,
The first conductor on the other side of the X-axis of the pair of first conductors and the second conductor on the other side of the X-axis of the pair of second conductors overlap in plan view. The vibrating piece. In claim 1,
The pair of first conductors and the pair of second conductors straddle a virtual center line along the X axis passing through the center of a region where the first excitation electrode and the second excitation electrode overlap in a plan view. Arranged so that the vibrating piece. In claim 1 or 2,
The distance Dx in the X-axis direction between each of the pair of first conductors and a region where the first excitation electrode and the second excitation electrode overlap in plan view is bending vibration generated in the quartz substrate. Where λ is the wavelength of
λ / 2 × (2n + 1) −0.1λ ≦ Dx ≦ λ / 2 × (2n + 1) + 0.1λ (where n is a positive integer)
Vibrating piece that satisfies the relationship. In any one of Claims 1 thru | or 3,
The length Lx in the X-axis direction of each of the pair of first conductors is λ when the wavelength of bending vibration generated in the quartz substrate is λ.
λ / 2 × (2m + 1) −0.1λ ≦ Lx ≦ λ / 2 × (2m + 1) + 0.1λ (where m is a positive integer)
Vibrating piece that satisfies the relationship. A vibrating piece according to any one of claims 1 to 4,
A package containing the resonator element;
A vibrator. A vibrating piece according to any one of claims 1 to 4,
An electronic element;
It is equipped with a vibration device. In claim 6,
The electronic device is a vibration device, which is a temperature sensitive device. A vibrating piece according to any one of claims 1 to 4,
An oscillation circuit electrically connected to the resonator element;
Equipped with an oscillator.   An electronic apparatus comprising the resonator element according to claim 1.   A moving body comprising the resonator element according to claim 1.