JP2014171152A - Vibration element, vibrator, oscillator, electric apparatus and movable body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration element, a vibrator, an oscillator, an electronic apparatus and a movable body, capable of reducing unwilling displacement when being fixed to an object.SOLUTION: A vibration element 1 includes a piezoelectric substrate 2 having a thick part 22, and a vibration part 21 having a thickness less than that of the thick part 22, and excitation electrodes 31 and 32 provided in the vibration part 21. The vibration element 1 is fixed to an object via one adhesive using the thick part 22. The piezoelectric substrate 2 has a longitudinal shape. A fixing part 23 to be fixed to the object via a fixing member is formed in a region positioned on one side in a longitudinal direction of the piezoelectric substrate 2 with respect to the vibration part 21, the region being one principal surface of the thick part 22. In a plan view of the piezoelectric substrate 2, a center of gravity G of the vibration element 1 and a center of gravity G' of the fixing part 23 are deviated from the center in a short direction of the piezoelectric substrate 2 to one side in the short direction.

Description

  The present invention relates to a vibration element, a vibrator, an oscillator, an electronic device, and a moving body.

AT-cut quartz resonators have thickness shear vibration as the main vibration mode to be excited, and are suitable for miniaturization and higher frequency, and exhibit a cubic curve with excellent frequency temperature characteristics. Used in many ways.
Patent Document 1 discloses an AT-cut crystal resonator having an inverted mesa structure in which a concave portion is formed in a part of a main surface to increase the frequency, and this AT-cut crystal resonator has two conductive properties. It is fixed to the package via an adhesive. Excitation electrodes are formed on the upper surface and the lower surface of the vibration part, and are electrically connected to the mounting terminals of the package via different conductive adhesives.

  Here, with the recent miniaturization of AT-cut quartz resonators, the arrangement space for the conductive adhesive is becoming smaller. For this reason, the conductive adhesives may come into contact with each other to cause a short circuit, or the conductive adhesive must be reduced in size, resulting in a decrease in the fixing strength of the AT-cut crystal resonator to the package. It was. In order to solve such a problem, a method of fixing an AT-cut quartz crystal resonator to a package with one conductive adhesive may be used. According to this method, the conductive adhesive can be made larger than in the case described above, so that the bonding strength can be improved, and furthermore, the occurrence of a short circuit is prevented due to the single conductive adhesive. can do. In this method, one excitation electrode is electrically connected to the mounting terminal via a conductive adhesive, and the other excitation electrode is electrically connected to the mounting terminal by wire bonding (metal wire) ( Patent Document 2).

  However, when the AT-cut quartz resonator is fixed to the package with one conductive adhesive, the following problems occur. The AT-cut quartz crystal unit is fixed to the package by pressing the AT-cut crystal unit against an uncured conductive adhesive applied to the package and curing the conductive adhesive. Here, when the center of gravity of the AT-cut crystal resonator is deviated from the center of gravity in the short direction, such as when the vibration part as shown in FIGS. After the AT-cut crystal unit is pressed against the conductive adhesive, the AT-cut crystal unit is at the center of gravity until the conductive adhesive is cured (that is, when the conductive adhesive is in a soft state). Along with the displacement (in plan view, the contact portion with the conductive adhesive is rotated around the center of gravity), the AT-cut crystal resonator is displaced, and further, the AT-cut crystal vibration is caused by the displacement. There is a problem that the child touches the package.

JP 2009-164824 A Japanese Patent Laid-Open No. 04-061507

  An object of the present invention is to provide a vibration element, a vibrator, an oscillator, an electronic device, and a moving body that can reduce unintended displacement when fixed to an object.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following application examples.
[Application Example 1]
The vibration element of the present invention includes a thick part,
A vibration part having a thickness smaller than the thick part and provided with an excitation electrode;
A fixed portion that is disposed on the thick-walled portion and is fixed to the object via one fixing member;
Comprising a substrate including
The substrate has a longitudinal shape in plan view,
The fixing portion is located on one side in the longitudinal direction of the substrate in plan view,
The center of gravity of the substrate and the center of the fixing portion are respectively shifted to one side in the short direction with respect to the center in the short direction of the substrate in plan view.
Thereby, the vibration element which can reduce the unintentional displacement at the time of fixation to a target object is obtained.

[Application Example 2]
In the resonator element according to the aspect of the invention, it is preferable that at least a part of the outer edge of the vibrating portion is exposed on the other side surface in the short direction of the substrate.
Thereby, size reduction of a vibration element can be achieved.
[Application Example 3]
In the resonator element according to the aspect of the invention, it is preferable that at least a part of the outer edge of the vibrating portion is exposed on the other side surface in the longitudinal direction of the substrate.
Thereby, size reduction of a vibration element can be achieved.

[Application Example 4]
In the vibration element according to the aspect of the invention, it is preferable that the fixing member is a conductive adhesive.
Thereby, a vibration element and a target object can be electrically connected via a fixing member.
[Application Example 5]
The vibrator of the present invention includes the vibration element of the present invention,
And a package for housing the vibration element.
Thereby, a highly reliable vibrator is obtained.

[Application Example 6]
The oscillator of the present invention includes the vibration element of the present invention,
And an oscillation circuit connected to the vibration element.
Thereby, a highly reliable oscillator can be obtained.
[Application Example 7]
An electronic apparatus according to the present invention includes the vibration element according to the present invention.
As a result, a highly reliable electronic device can be obtained.
[Application Example 8]
The moving body of the present invention includes the vibration element of the present invention.
Thereby, a mobile body with high reliability is obtained.

It is a top view of a vibration element concerning a 1st embodiment of the present invention. It is the sectional view on the AA line in FIG. It is a figure explaining the relationship between an AT cut quartz substrate and a crystal axis. It is sectional drawing which shows the state which fixed the vibration element shown in FIG. 1 to the target object. It is a top view of a vibration element concerning a 2nd embodiment of the present invention. It is sectional drawing of the vibration element concerning 3rd Embodiment of this invention. It is a top view of a vibration element concerning a 4th embodiment of the present invention. It is the BB sectional view taken on the line in FIG. It is sectional drawing which shows suitable embodiment of the vibrator | oscillator of invention. It is sectional drawing which shows suitable embodiment of the oscillator of this invention. 1 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device of this invention is applied. 1 is a perspective view schematically showing an automobile as an example of a moving object of the present invention.

Hereinafter, a resonator element, a vibrator, an oscillator, an electronic device, and a moving body of the present invention will be described in detail based on preferred embodiments shown in the drawings.
1. First, the vibration element of the present invention will be described.
<First Embodiment>
1 is a plan view of a resonator element according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a diagram illustrating a relationship between an AT-cut quartz substrate and a crystal axis. FIG. 4 is a cross-sectional view showing a state in which the vibration element shown in FIG. 1 is fixed to an object.
As illustrated in FIGS. 1 and 2, the vibration element 1 includes a piezoelectric substrate (substrate) 2 and an electrode 3 formed on the piezoelectric substrate 2.

(Piezoelectric substrate 2)
The piezoelectric substrate 2 is a plate-shaped quartz substrate. Here, the crystal that is the material of the piezoelectric substrate 2 belongs to the trigonal system, and has crystal axes X, Y, and Z orthogonal to each other as shown in FIG. The X axis, the Y axis, and the Z axis are referred to as an electric axis, a mechanical axis, and an optical axis, respectively. The piezoelectric substrate 2 of the present embodiment is composed of a rotated Y-cut quartz crystal substrate cut out along a plane obtained by rotating the XZ plane around the X axis by a predetermined angle θ. For example, in the case of an AT-cut quartz substrate, the angle θ is approximately 35 ° 15 ′.

  Hereinafter, the Y axis and the Z axis rotated around the X axis corresponding to the angle θ are referred to as a Y ′ axis and a Z ′ axis. That is, the plate-like piezoelectric substrate 2 has a thickness in the Y′-axis direction and has an extension in the XZ ′ plane direction. The piezoelectric substrate 2 is not limited to an AT-cut piezoelectric substrate as long as it can excite thickness-shear vibration. For example, a BT-cut piezoelectric substrate may be used.

  The piezoelectric substrate 2 has a rectangular shape in plan view. More specifically, the piezoelectric substrate 2 has a substantially rectangular shape with a long side (longitudinal) in the X-axis direction and a short side (short) in the Z′-axis direction in plan view. Here, comparing the frequency change when pressure is applied to both ends in the X-axis direction of the piezoelectric substrate 2 and the frequency change when the same pressure is applied to both ends in the Z′-axis direction, both ends in the Z′-axis direction are compared. When the pressure is applied, the frequency change is smaller than when the pressure is applied to both ends in the X-axis direction. Therefore, as in this embodiment, the outer shape of the piezoelectric substrate 2 is a rectangle whose X-axis direction is longer than the Z′-axis direction, and the piezoelectric substrate 2 is fixed at one end in the X-axis direction as will be described later. The frequency change due to stress can be reduced. The ratio of the length (the length in the X-axis direction) and the width (the length in the Z′-axis direction) of the piezoelectric substrate 2 is not particularly limited, but is preferably about 1.26: 1, for example. The outer shape of the piezoelectric substrate 2 is not limited to a rectangle, and may be, for example, a square, a pentagon or more polygon, or a circle (including a perfect circle, an ellipse, an ellipse, and the like). Further, when the planar view shape is a polygon, the corners may be chamfered.

  The piezoelectric substrate 2 includes a vibration part 21 including a thin vibration area 219 and a thick part 22 that is integrated with the vibration part 21 and is thicker than the vibration area 219. Such a piezoelectric substrate 2 can be easily formed by patterning a quartz substrate by wet etching. The vibration region 219 is a region where the vibration energy of the vibration element 1 is confined.

  The vibration part 21 has a rectangular shape in plan view. In addition, the outline of the vibration unit 21 has a first side 211, a second side 212, a third side 213, and a fourth side 214. The first side 211 and the second side 212 face each other in the X-axis direction, and both extend in the Z′-axis direction. The third side 213 extends in the X-axis direction, and connects the ends of the first side 211 and the second side 212 on the + Z′-axis side. The fourth side 214 extends in the X-axis direction, and connects the ends on the −Z′-axis side of the first side 211 and the second side 212.

  The surface of the thick portion 22 (the main surface on the + Y′-axis direction side) is provided so as to protrude to the + Y′-axis direction side from the surface of the vibrating portion 21 (the main surface on the + Y′-axis direction side). On the other hand, the back surface (the main surface on the −Y′-axis direction side) of the thick portion 22 is provided on the same plane as the back surface (the main surface on the −Y′-axis direction side) of the vibration unit 21.

  The thick portion 22 includes a first thick portion (a region located on one side in the longitudinal direction of the piezoelectric substrate 2 with respect to the vibration portion 21) 221 disposed along the first side 211 of the vibration portion 21. The second thick part 222 arranged along the second side 212 and the third thick part 223 arranged along the third side 213 are provided. That is, the thick portion 22 has a substantially “U” shape integrated along the three sides of the vibrating portion 21. Therefore, the vibration part 21 is opened (exposed) from the thick part 22 at the fourth side 214. As described above, by releasing the vibrating portion 21 from the thick portion 22 at the fourth side 214, in other words, by not providing the thick portion along the fourth side 214, the vibration element 1 can be reduced in size. (Weight reduction) can be achieved. Moreover, since the rigidity of the vibration part 21 can be sufficiently increased by surrounding the three sides of the vibration part 21 with the thick wall part 22, unnecessary vibration (occurrence of unnecessary vibration mode) of the vibration part 21 can be reduced. it can.

  The first thick part 221 is connected to the first side 211 of the vibration part 21, and has an inclined part (residue part) 221a whose thickness gradually increases in the + X-axis direction, and the + X-axis direction side of the inclined part 221a And a thick portion main body 221b having a substantially constant thickness. Similarly, the second thick part 222 is connected to the second side 212 of the vibration part 21 and has an inclined part (residue part) 222a whose thickness gradually increases in the −X-axis direction, and an inclined part 222a. -A thick portion main body 222b having a substantially constant thickness connected to the end edge on the X-axis direction side is provided. Similarly, the third thick part 223 is connected to the third side 213 of the vibration part 21 and has an inclined part (residue part) 223a whose thickness gradually increases in the + Z′-axis direction, and the inclined part 223a. And a thick portion main body 223b having a substantially constant thickness connected to the end edge on the + Z ′ axial direction side.

  A fixed portion (mount portion) 23 is set on the surface of the first thick portion 221 (thick portion main body 221b). The vibration element 1 is fixed to the object 7 via an adhesive (fixing member) 6 provided on the fixing portion 23. In the vibration element 1 of the present embodiment, the fixing portion 23 is provided on the surface of the thick portion 22, but the fixing portion 23 may be provided on the back surface of the thick portion 22.

  Here, the center of gravity G of the vibration element 1 is shifted to the + Z ′ side from the center (center) O in the Z-axis direction (short direction) because the vibration part 21 is unevenly distributed to the −Z′-axis side. Yes. The center of gravity (center) G ′ of the fixed portion 23 is also shifted to the + Z ′ side from the center O in correspondence with the shift of the center of gravity G of the vibration element 1. That is, when the regions divided by the line segment A that intersects the center O and is parallel to the X axis are S1 and S2 in the XZ ′ plan view, the centers of gravity G and G ′ are either one of the regions S1 and S2. Located in the area. Thereby, the unintentional displacement of the vibration element 1 at the time of fixing to the target object 7 by the adhesive agent 6 can be reduced.

  Specifically, since the vibration element 1 has the center of gravity G shifted from the center O, the vibration element 1 is fixed to the object 7 via the adhesive 6 until the adhesive 6 is cured. There is a possibility that the vibrating element 1 may rotate around the adhesive 6 during the interval (that is, when the adhesive 6 is in a soft state). If it is fixed in a rotated state from a desired posture, for example, the vibration element 1 may come into contact with the object 7 and a desired vibration characteristic may not be obtained. Therefore, as in the present embodiment, by shifting the center of gravity G ′ of the fixing portion 23 from the center O in accordance with the center of gravity G, the displacement of the adhesive 6 and the center of gravity G in the Z′-axis direction can be reduced, and vibration The rotation of the element 1 can be effectively reduced. According to such a configuration, since the vibration element 1 can be fixed to the object 7 in a desired posture more reliably, contact of the vibration element 1 with the object 7 can be prevented.

  In particular, the center of gravity G ′ is preferably positioned so as to overlap with the straight line B intersecting with the center of gravity G and parallel to the X axis in the XZ ′ plan view. By arranging the fixing portion 23 in such an arrangement, the above effect (rotation preventing effect) can be more effectively exhibited. Further, for example, when acceleration in the Y′-axis direction due to impact, vibration, or the like is applied to the vibration element 1, it is possible to reduce the rotation moment about the adhesive 6 being applied to the vibration element 1, and vibration due to acceleration. Changes in characteristics can be suppressed. Therefore, the vibration element 1 can exhibit stable vibration characteristics regardless of the presence or absence of vibration (acceleration).

  A method for fixing the vibration element 1 to the object 7 using the adhesive 6 is not particularly limited. For example, the adhesive 6 is first applied to the fixing portion 23, and then the adhesive 6 is applied to the object 7. The method of pressing on is mentioned. On the other hand, there is a method in which the adhesive 6 is first applied to the object 7 and then the vibrating element 1 is pressed against the adhesive 6 so that the adhesive 6 contacts the fixing portion 23.

(Electrode 3)
The electrode 3 includes a pair of excitation electrodes 31 and 32, a pair of pad electrodes 33 and 34, and a pair of lead electrodes 35 and 36.
The excitation electrode 31 is formed on the surface of the vibration region 219. The excitation electrode 32 is disposed on the back surface of the vibration region 219 so as to face the excitation electrode 31. The excitation electrodes 31 and 32 each have a quadrangular shape. Further, the area of the excitation electrode 32 on the back surface side is set larger than that of the excitation electrode 31 on the front surface side. This is because the energy confinement coefficient due to the mass effect of the excitation electrodes 31 and 32 is not increased more than necessary.

  The pad electrode 33 is formed in the fixed portion 23. The pad electrode 33 is electrically connected to the excitation electrode 31 via the lead electrode 35. The lead electrode 35 extending from the pad electrode 33 is connected to the pad electrode 33 from the surface of the vibration part 21 via the inclined part 223a and the thick part main body 223b. On the other hand, the pad electrode 34 is formed on the back surface of the thick portion main body 221b. The pad electrode 34 is electrically connected to the excitation electrode 32 via the lead electrode 36. The lead electrode 36 extending from the pad electrode 34 is connected to the pad electrode 34 via the edge of the back surface of the piezoelectric substrate 2.

  Here, in the present embodiment, the lead electrodes 35 and 36 are provided so as not to cross (oppose) each other via the piezoelectric substrate 2. With such an arrangement, an increase in capacitance can be suppressed. The arrangement of the pad electrodes 33 and 34 and the path of the lead electrodes 35 and 36 are not limited to those of the present embodiment. In the present embodiment, the pad electrodes 33 and 34 are arranged to face each other with the piezoelectric substrate 2 interposed therebetween. With such an arrangement, electrical connection by wire bonding can be more reliably performed as described in the vibrator 10 described later.

  Such excitation electrodes 31 and 32, pad electrodes 33 and 34, and lead electrodes 35 and 36 are, for example, metal films in which Au (gold) is laminated on an underlayer such as Cr (chromium) or Ni (nickel). Can be configured. For example, the configuration (material and thickness of each layer) may be different between the excitation electrodes 31 and 32, the pad electrodes 33 and 34, and the lead electrodes 35 and 36. For example, the excitation electrodes 31 and 32 may have a structure in which an Au thin film is laminated on a Ni underlayer, and the pad electrodes 33 and 34 and the lead electrodes 35 and 36 may have a structure in which an Au thin film is laminated on a Cr underlayer. Good. The thickness of the Au thin film of the excitation electrodes 31 and 32 is set so that the main vibration is in the confining mode and the adjacent in-harmonic mode is in the propagation mode (unconfined mode) as much as possible within a range where the ohmic cross does not increase. It is preferable to do this.

  In addition, although the shape of the excitation electrodes 31 and 32 was described as a quadrangle, the shape of the excitation electrodes 31 and 32 is not limited to this. For example, the excitation electrode 31 may be circular, and the excitation electrode 32 may be a quadrangle sufficiently larger than the area of the excitation electrode 31. Further, for example, the excitation electrode 31 may be elliptical, and the excitation electrode 32 may be a rectangle sufficiently larger than the area of the excitation electrode 31.

Second Embodiment
Next, a second embodiment of the resonator element according to the invention will be described.
FIG. 5 is a plan view of a resonator element according to the second embodiment of the invention.
Hereinafter, the resonator element according to the second embodiment will be described focusing on differences from the first embodiment described above, and description of similar matters will be omitted.
The vibration element according to the second embodiment of the present invention is the same as that of the first embodiment described above except that the configuration of the thick portion is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

In the vibration element 1 </ b> A shown in FIG. 5, the thick portion 22 includes the first thick portion 221 provided along the first side 211 of the vibration portion 21 and the first thick portion 22 provided along the third side. 3 thick portions 223. That is, the vibration element 1A has a configuration in which the second thick portion 222 is omitted from the vibration element 1 of the first embodiment described above. With such a configuration, a smaller vibration element can be obtained.
Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Third Embodiment>
Next, a third embodiment of the resonator element according to the invention will be described.
FIG. 6 is a cross-sectional view of a resonator element according to the third embodiment of the invention.
Hereinafter, the resonator element according to the third embodiment will be described focusing on differences from the first embodiment described above, and description of similar matters will be omitted.
The vibration element according to the third embodiment of the present invention is the same as that of the first embodiment described above except that the configuration of the thick portion is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

In the vibration element 1B shown in FIG. 6, the surface of the thick portion 22 (the main surface on the + Y′-axis direction side) is closer to the + Y′-axis direction side than the surface of the vibration portion 21 (the main surface on the + Y′-axis direction side). Protrusively provided. On the other hand, the back surface (the main surface on the −Y ′ axis direction side) of the thick portion 22 is provided so as to protrude toward the −Y ′ axis direction side from the back surface (the main surface on the −Y ′ axis direction side) of the vibration unit 21. ing.
Also according to the third embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
Next, a fourth embodiment of the resonator element according to the invention will be described.
FIG. 7 is a plan view of a resonator element according to the fourth embodiment of the invention, and FIG. 8 is a cross-sectional view taken along line BB in FIG.
Hereinafter, the vibration element according to the fourth embodiment will be described focusing on the differences from the first embodiment described above, and description of similar matters will be omitted.
The vibration element according to the fourth embodiment of the present invention is the same as that of the first embodiment described above except that the configuration of the fixing portion is different. In addition, the same code | symbol is attached | subjected to the structure similar to 1st Embodiment mentioned above.

  In the vibration element 1 </ b> C shown in FIGS. 7 and 8, the fixing portion 23 is set on the top surface of the convex portion 24 protruding from the surface of the thick portion 22. By using such a fixing portion 23, the fixing portion 23 can be easily visually confirmed, and work efficiency such as application of the adhesive 6 and fixing to the object 7 is increased, and these operations are accurately performed. Can be done. In addition, since the spread of the adhesive 6 around the fixed portion 23 can be reduced, variation in vibration characteristics can be reduced.

According to the fourth embodiment, the same effect as that of the first embodiment described above can be exhibited.
In addition, in this embodiment, although the fixing | fixed part 23 is set to the top face of the convex part 24, conversely, you may set to the bottom face of the recessed part formed in the surface of the thick part. Even with such a configuration, the same effects as in the present embodiment can be exhibited.

2. Next, a vibrator (the vibrator of the present invention) to which the above-described vibration element 1 is applied will be described.
FIG. 9 is a cross-sectional view showing a preferred embodiment of the vibrator of the present invention.
A vibrator 10 illustrated in FIG. 9 includes the above-described vibration element 1 and a package 4 that houses the vibration element 1.

(package)
The package 4 includes a box-shaped base 41 having a concave portion 411 that opens to the upper surface, and a plate-shaped lid 42 that closes the opening of the concave portion 411 and is joined to the base 41. The vibration element 1 is stored in the storage space S formed by closing the recess 411 with the lid 42. The storage space S may be in a reduced pressure (vacuum) state or may be filled with an inert gas such as nitrogen, helium, or argon.

  The constituent material of the base 41 is not particularly limited, but various ceramics such as aluminum oxide can be used. The constituent material of the lid 42 is not particularly limited, but may be a member whose linear expansion coefficient approximates that of the constituent material of the base 41. For example, when the constituent material of the base 41 is ceramic as described above, an alloy such as Kovar is preferable. In addition, joining of the base 41 and the lid 42 is not specifically limited, For example, you may join via an adhesive agent and may join by seam welding etc.

Connection electrodes 451 and 461 are formed on the bottom surface of the recess 411 of the base 41. External mounting terminals 452 and 462 are formed on the lower surface of the base 41. The connection electrode 451 is electrically connected to the external mounting terminal 452 through a through electrode (not shown) formed in the base 41, and the connection electrode 461 is externally connected through a through electrode (not shown) formed in the base 41. The mounting terminal 462 is electrically connected.
The configurations of the connection electrodes 451 and 461 and the external mounting terminals 452 and 462 are not particularly limited as long as they have electrical conductivity. For example, a metallized layer such as Cr (chrome) or W (tungsten) (lower It can be constituted by a metal film in which each film such as Ni (nickel), Au (gold), Ag (silver), Cu (copper), etc. is laminated on the (layer).

  The vibration element 1 housed in the housing space S is fixed to the base (object) 41 with a conductive adhesive (fixing member) 51 with the concave surface facing the base 41 side. The conductive adhesive 51 is provided in contact with the connection electrode 451 and the pad electrode 33. Thereby, the connection electrode 451 and the pad electrode 33 are electrically connected via the conductive adhesive 51. By supporting the vibration element 1 at one place (one point) using the conductive adhesive 51, for example, stress generated in the vibration element 1 due to a difference in thermal expansion coefficient between the base 41 and the piezoelectric substrate 2 can be suppressed. .

The conductive adhesive 51 is not particularly limited as long as it has conductivity and adhesiveness. For example, a conductive filler is added to an adhesive such as silicone, epoxy, acrylic, polyimide, or bismaleimide. A dispersed product can be used.
The pad electrode 34 of the vibration element 1 is electrically connected to the connection electrode 461 through the bonding wire 52. As described above, since the pad electrode 34 is disposed to face the pad electrode 33, the pad electrode 34 is located immediately above the conductive adhesive 51 in a state where the vibration element 1 is fixed to the base 41. Therefore, leakage of vibration (ultrasonic vibration) applied to the pad electrode 34 during wire bonding can be reduced, and the bonding wire 52 can be more reliably connected to the pad electrode 34.

3. Next, an oscillator to which the vibrator of the present invention is applied (the oscillator of the present invention) will be described.
FIG. 10 is a cross-sectional view showing a preferred embodiment of the oscillator of the present invention.
An oscillator 100 illustrated in FIG. 10 includes a vibrator 10 and an IC chip 110 for driving the vibration element 1. Hereinafter, the oscillator 100 will be described with a focus on differences from the above-described vibrator, and description of similar matters will be omitted.

As shown in FIG. 10, in the oscillator 100, the IC chip 110 is fixed to the recess 411 of the base 41. The IC chip 110 is electrically connected to a plurality of internal terminals 120 formed on the bottom surface of the recess 411. The plurality of internal terminals 120 include those connected to the connection electrodes 451 and 461 and those connected to the external mounting terminals 452 and 462. The IC chip 110 has an oscillation circuit for controlling the driving of the vibration element 1. When the vibration element 1 is driven by the IC chip 110, a signal having a predetermined frequency can be extracted.
In this embodiment, the oscillator has been described as an example. However, the present invention is not limited to this, and instead of the IC chip 110, a temperature sensor (temperature sensing element) such as a thermistor is mounted in the recess 411 of the base 41, The temperature in the base to which the vibrator 10 is exposed may be detected, and the temperature detected from the mounting terminal provided on the base may be output as an electrical signal.

4). Next, an electronic device (an electronic device of the present invention) to which the vibrator of the present invention is applied will be described.
FIG. 11 is a perspective view showing a configuration of a mobile (or notebook) personal computer to which the electronic apparatus of the present invention is applied. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 2000. The display unit 1106 rotates with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 has a built-in vibrator 10 (vibrating element 1) that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 12 is a perspective view showing a configuration of a mobile phone (including PHS) to which the electronic apparatus of the present invention is applied. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, a earpiece 1204, and a mouthpiece 1206, and a display unit 2000 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 has a built-in vibrator 10 (vibrating element 1) that functions as a filter, a resonator, or the like.

  FIG. 13 is a perspective view showing the configuration of a digital still camera to which the electronic apparatus of the present invention is applied. In this figure, connection with an external device is also simply shown. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an imaging device such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit is a finder that displays an object as an electronic image. Function. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 has a built-in vibrator 10 (vibrating element 1) that functions as a filter, a resonator, or the like.

  In addition to the personal computer of FIG. 11 (mobile personal computer), the mobile phone of FIG. 12, and the digital still camera of FIG. Inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, televisions Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments Class (eg, vehicle, aircraft) Gauges of a ship), can be applied to a flight simulator or the like.

5. Next, a moving body (moving body of the present invention) to which the vibrator of the present invention is applied will be described.
FIG. 14 is a perspective view schematically showing an automobile as an example of the moving object of the present invention. The automobile 1500 is equipped with the vibrator 10 (the vibration element 1). The vibrator 10 includes a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an anti-lock brake system (ABS), an air bag, a tire pressure monitoring system (TPMS), an engine control, a hybrid vehicle, The present invention can be widely applied to electronic control units (ECUs) such as battery monitors for electric vehicles, vehicle body posture control systems, and the like.

  As described above, the resonator element, the vibrator, the oscillator, the electronic device, and the moving body of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each part is the same. It can be replaced with any configuration having the above function. In addition, any other component may be added to the present invention. Moreover, you may combine each embodiment mentioned above suitably.

In the above-described embodiment, the vibration part is rectangular in plan view, but the shape of the vibration part is not limited to this. In other words, in the above-described embodiment, the first, second, third, and fourth sides of the contour of the vibration unit are each configured by a straight line, but each side is curved as a whole. It may be bent or bent in the middle. Further, the sides may be connected continuously.
In the above-described embodiment, the configuration in which the center of gravity G of the vibration element is shifted from the center O in the Z′-axis direction has been described, but the center of gravity G may coincide with the center O in the Z-axis direction ( That is, the center of gravity G may be positioned on the line segment A).

In the above-described embodiment, the configuration in which a part of the outline of the vibration part is opened from the thick part has been described. However, the vibration part may not have a part opened from the thick part. That is, the thick part may be formed along the entire contour of the vibration part.
In the above-described embodiment, the quartz substrate is used as the piezoelectric substrate, but various piezoelectric substrates such as lithium niobate and lithium tantalate may be used instead.

  DESCRIPTION OF SYMBOLS 1, 1A, 1B, 1C ... Vibrating element 2 ... Piezoelectric substrate 21 ... Vibrating part 211 ... 1st edge | side 212 ... 2nd edge | side 213 ... 3rd edge | side 214 ... 4th edge | side 219 ... Vibration region 22 ... Thickness Part 221 ... 1st thick part 221a ... Inclined part 221b ... Thick part main body 222 ... 2nd thick part 222a ... Inclined part 222b ... Thick part main part 223 ... 3rd thick part 223a ... Inclined part 223b ... Thick part body 23 ... Fixed part 24 ... Protruding part 3 ... Electrode 31, 32 ... Excitation electrode 33, 34 ... Pad electrode 35, 36 ... Lead electrode 4 ... Package 41 ... Base 411 ... Recess 42 ... Lid 451 ... Connection electrode 452 ... External mounting terminal 461 ... Connection electrode 462 ... External mounting terminal 51 ... Conductive adhesive 52 ... Bonding wire 6 ... Adhesive 7 ... Object 10 ... Vibrator 100 ... Source 110 ... IC chip 120 ... Internal terminal 1100 ... Personal computer 1102 ... Keyboard 1104 ... Main body 1106 ... Display unit 1200 ... Mobile phone 1202 ... Operation button 1204 ... Earpiece 1206 ... Mouthpiece 1300 ... Digital still camera 1302 ... Case 1304 Light receiving unit 1306 Shutter button 1308 Memory 1312 Video signal output terminal 1314 Input / output terminal 1430 Television monitor 1440 Personal computer 1500 Automobile 2000 Display unit G, G ′ Center of gravity O Center S Sacing space S1 , S2 ... area

Claims (8)

The thick part,
A vibration part having a thickness smaller than the thick part and provided with an excitation electrode;
A fixed portion that is disposed on the thick-walled portion and is fixed to the object via one fixing member;
Comprising a substrate including
The substrate has a longitudinal shape in plan view,
The fixing portion is located on one side in the longitudinal direction of the substrate in plan view,
The vibration element, wherein the center of gravity of the substrate and the center of the fixing portion are each shifted to one side in the short direction with respect to the center in the short direction of the substrate in plan view.   2. The vibration element according to claim 1, wherein at least a part of an outer edge of the vibration part is exposed on a side surface on the other side in a short direction of the substrate.   The vibrating element according to claim 1, wherein at least a part of an outer edge of the vibrating portion is exposed on a side surface on the other side in the longitudinal direction of the substrate.   The vibration element according to claim 1, wherein the fixing member is a conductive adhesive. The vibration element according to any one of claims 1 to 4,
And a package for housing the vibration element. The vibration element according to any one of claims 1 to 4,
And an oscillation circuit connected to the vibration element.   An electronic apparatus comprising the vibration element according to claim 1.   A moving body comprising the vibration element according to claim 1.

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