JP6481813B2 - Vibrator, vibrating device, oscillator, electronic device, and moving object - Google Patents

Description

  The present invention relates to a vibrator, a vibration device, an oscillator, an electronic apparatus, and a moving object.

  Conventionally, vibrators using quartz have been known. Such a vibrator is widely used as a reference frequency source and an oscillation source for various electronic devices because of its excellent frequency-temperature characteristics. In particular, a vibrator using a quartz substrate cut at a cut angle called AT cut has a frequency temperature characteristic exhibiting a cubic curve, and is therefore widely used in mobile communication devices such as mobile phones.

  For example, Patent Literature 1 discloses a crystal resonator including a crystal element, a lid made of crystal bonded to the crystal element via a bonding material, and a base formed of crystal bonded to the crystal element via a bonding material. Have been described.

JP 2012-178620 A

  However, in the vibrator described in Patent Document 1, bending vibration (unnecessary vibration) that is a cause of spurious generated in the crystal element cannot be sufficiently attenuated, and the bending vibration is coupled to the thickness shear vibration that is the main vibration. As a result, good electrical characteristics may not be obtained.

  One of the objects according to some aspects of the present invention is to provide a vibrator that can attenuate bending vibration. Another object of some aspects of the present invention is to provide an oscillator, a vibration device, an electronic apparatus, and a moving body that include the vibrator described above.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
The vibrator according to this application example is
An intermediate substrate that vibrates in thickness and has excitation electrodes on the front and back surfaces;
A first substrate bonded to the intermediate substrate via a first bonding material so as to cover one surface side of the intermediate substrate;
A second substrate bonded to the intermediate substrate via a second bonding material so as to cover the other surface side of the intermediate substrate;
Including
In plan view, one of the first end of the first bonding material on the excitation electrode side and the second end of the second bonding material on the excitation electrode side is arranged closer to the excitation electrode than the other.

  In such a vibrator, bending vibration generated in the intermediate substrate can be attenuated.

[Application Example 2]
In the vibrator according to this application example,
At least one of the first end and the second end may be disposed at a position of maximum amplitude of bending vibration generated in the intermediate substrate.

  In such a vibrator, bending vibration generated in the intermediate substrate can be further attenuated.

[Application Example 3]
In the vibrator according to this application example,
The first substrate has a first protrusion bonded to the intermediate substrate via the first bonding material,
The second substrate has a second convex portion bonded to the intermediate substrate via the second bonding material,
In plan view, one of the end on the excitation electrode side of the first protrusion and the end on the excitation electrode side of the second protrusion may be arranged closer to the excitation electrode than the other.

  In such a vibrator, bending vibration generated in the intermediate substrate can be attenuated.

[Application Example 4]
In the vibrator according to this application example,
The first substrate is
A first convex portion joined to the intermediate substrate via a first portion of the first joining material;
A third convex portion joined to the intermediate substrate via a second portion of the first joining material;
Have
The third convex portion is provided between the first convex portion and the excitation electrode in a plan view,
The end on the excitation electrode side of the second portion may be the first end.

  In such a vibrator, bending vibration generated in the intermediate substrate can be attenuated.

[Application Example 5]
The vibration device according to this application example is
A vibrator according to this application example;
An electronic element;
It has.

  Since such a vibrating device includes the vibrator according to this application example, it can have good electrical characteristics.

[Application Example 6]
In the vibrating device according to this application example,
The electronic element may be a temperature sensitive element.

  Since such a vibrating device includes the vibrator according to this application example, it can have good electrical characteristics.

[Application Example 7]
The oscillator according to this application example is
A vibrator according to this application example;
An oscillation circuit electrically connected to the vibrator;
It has.

  Since such an oscillator includes the vibrator according to this application example, it can have good electrical characteristics.

[Application Example 8]
The electronic device according to this application example is
The vibrator according to this application example is provided.

  Since such an electronic apparatus includes the vibrator according to this application example, it can have good electrical characteristics.

[Application Example 9]
The mobile object according to this application example is
The vibrator according to this application example is provided.

  Since such a moving body includes the vibrator according to this application example, it can have good electrical characteristics.

FIG. 3 is an exploded perspective view schematically showing the vibrator according to the embodiment. FIG. 3 is a cross-sectional view schematically showing a vibrator according to the embodiment. FIG. 3 is a plan view schematically showing the vibrator according to the embodiment. The perspective view which shows an AT cut quartz substrate typically. FIG. 3 is a cross-sectional view schematically showing a vibrator according to the embodiment. FIG. 3 is a cross-sectional view schematically showing a vibrator according to the embodiment. FIG. 6 is a cross-sectional view schematically showing a vibrator according to a first modification example of the embodiment. FIG. 6 is a plan view schematically showing a vibrator according to a first modification of the embodiment. Sectional drawing which shows typically the vibrator | oscillator which concerns on the 2nd modification of this embodiment. The top view which shows typically the vibrator | oscillator which concerns on the 2nd modification of this embodiment. Sectional drawing which shows typically the vibrator | oscillator which concerns on the 3rd modification of this embodiment. FIG. 3 is a cross-sectional view schematically showing the vibration device according to the embodiment. Sectional drawing which shows typically the vibration device which concerns on the modification of this embodiment. FIG. 3 is a cross-sectional view schematically showing the oscillator according to the embodiment. FIG. 3 is a plan view schematically showing the electronic apparatus according to the embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The top view which shows typically the mobile body which concerns on this embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, not all of the configurations described below are essential constituent requirements of the present invention.

1. First, the vibrator according to the present embodiment will be described with reference to the drawings. FIG. 1 is an exploded perspective view schematically showing a vibrator 100 according to the present embodiment. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1 schematically showing the vibrator 100 according to the present embodiment. FIG. 3 is a plan view schematically showing the vibrator 100 according to the present embodiment.

  As shown in FIGS. 1 to 3, the vibrator 100 includes an intermediate substrate 10, excitation electrodes 20 a and 20 b, a first substrate 30, a second substrate 40, a first bonding material 50, and a second bonding material. 60. In FIG. 3, (A) shows the second substrate 40, (B) shows the intermediate substrate 10, and (C) shows the first substrate 30.

  The intermediate substrate 10 is provided between the first substrate 30 and the second substrate 40. The intermediate substrate 10 is made of an AT cut crystal substrate. Here, FIG. 4 is a perspective view schematically showing the AT-cut quartz substrate 101.

  Piezoelectric materials such as quartz are generally trigonal and have crystal axes (X, Y, Z) as shown in FIG. The X axis is an electrical axis, the Y axis is a mechanical axis, and the Z axis is an optical axis. The quartz substrate 101 is a so-called rotated Y cut out from a piezoelectric material (for example, artificial quartz crystal) along a plane obtained by rotating an XZ plane (a plane including the X axis and the Z axis) by an angle θ around the X axis. It is a flat plate of a cut quartz substrate. Note that the Y axis and the Z axis are also rotated by θ around the X axis to be the Y ′ axis and the Z ′ axis, respectively. The quartz substrate 101 is a substrate having a plane including the X axis and the Z ′ axis as a main surface and a thickness along the direction along the Y ′ axis. Here, when θ = 35 ° 15 ′, the quartz substrate 101 is an AT-cut quartz substrate. Accordingly, the AT-cut quartz crystal substrate 101 has the XZ ′ plane (plane including the X axis and Z ′ axis) orthogonal to the Y ′ axis as the main surface (the main surface of the vibrating portion), and vibrates with thickness shear vibration as the main vibration. be able to. The AT substrate 10 can be obtained by processing the AT-cut quartz substrate 101.

  As shown in FIG. 4, the intermediate substrate 10 is a crystal axis of quartz, an X axis as an electric axis, a Y axis as a mechanical axis, and a Z axis as an optical axis. , The axis tilted so that the Z-axis rotates in the -Y direction of the Y-axis + Z side is the Z 'axis, and the axis tilted so that the Y-axis rotates in the + Z direction of the Z-axis + Y side It is composed of an AT-cut quartz crystal substrate having a 'axis, a plane including the X axis and the Z' axis as a main surface, and a thickness along the direction along the Y 'axis. 1 to 3 and FIG. 5 to FIG. 10 shown below, the X axis, the Y ′ axis, and the Z ′ axis that are orthogonal to each other are illustrated.

  The intermediate substrate 10 has, for example, a direction along the Y′-axis (Y′-axis direction) as a thickness direction and a plan view from the Y′-axis direction (hereinafter, also simply referred to as “plan view”), the X-axis The rectangular shape has a long side in the direction along the X axis (X-axis direction) and a short side in the direction along the Z′-axis (Z′-axis direction). The intermediate substrate 10 has a vibration part 12 and a frame part 14.

  The vibration part 12 has a portion of the intermediate substrate 10 that is sandwiched between the excitation electrodes 20a and 20b. In the illustrated example, the vibration unit 12 has a rectangular shape in plan view. The vibration unit 12 vibrates with thickness-shear vibration as main vibration. “Thickness shear vibration” means that the displacement direction of the quartz substrate is parallel to the main surface of the quartz substrate (in the example shown, the displacement direction of the quartz substrate is the X-axis direction), and the wave propagation direction is the thickness of the quartz substrate. It is the vibration of direction.

  The frame portion 14 has a frame shape. The frame part 14 is provided so as to surround the vibration part 12 in a plan view. In the illustrated example, the end on the + X-axis direction side of the vibration part 12 is connected to the frame part 14. An opening 16 is provided between the end portion on the −X-axis direction side, the end portion on the + Z′-axis direction side, the end portion on the −Z′-axis direction side of the vibration unit 12, and the frame portion 14. ing. The thickness of the frame part 14 is the same as the thickness of the vibration part 12, for example.

The first excitation electrode 20a and the second excitation electrode 20b are provided on the front and back surfaces (main surfaces 10a, 10b) of the intermediate substrate 10, respectively. In the illustrated example, the main surface 10a is a surface facing the + Y′-axis direction, and the main surface 10b is a surface facing the −Y′-axis direction. The excitation electrodes 20a and 20b are provided in the vibration unit 12 and overlap each other in plan view. In the illustrated example, the excitation electrode 20
a and 20b have a rectangular shape in plan view. The excitation electrodes 20 a and 20 b are electrodes for applying a voltage to the vibration unit 12.

  The first extraction electrode 22 a connects the first excitation electrode 20 a and the first connection terminal 24 a provided on the first substrate 10. In the illustrated example, the first extraction electrode 22a passes from the first excitation electrode 20a through the main surface 10a of the vibrating portion 12, the side surface (the surface facing the + Z′-axis direction side), and the main surface 10b of the frame portion 14. , Extending to the first connection terminal 24a. The second extraction electrode 22 b connects the second excitation electrode 20 b and the second connection terminal 24 b provided on the first substrate 10. In the illustrated example, the second extraction electrode 22b extends from the second excitation electrode 20b to the second connection terminal 24b through the main surface 10b of the vibration part 12 and the main surface 10b of the frame part 14. As the excitation electrodes 20a and 20b and the extraction electrodes 22a and 22b, for example, those obtained by laminating Cr (chrome) and Au (gold) in this order from the intermediate substrate 10 side are used.

  The first substrate 30 is bonded to the intermediate substrate 10 via the first bonding material 50. The first substrate 30 is provided so as to cover one surface side (for example, the main surface 10b side) of the intermediate substrate 10. In the illustrated example, the first substrate 30 has a rectangular shape in plan view. The length of the first substrate 30 in the X-axis direction is, for example, the same as the length of the intermediate substrate 10 in the X-axis direction. The length of the first substrate 30 in the Z′-axis direction is, for example, the same as the length of the intermediate substrate 10 in the Z′-axis direction. The material of the first substrate 30 is, for example, quartz or silicon. The first substrate 30 functions as a base that supports the intermediate substrate 10.

  A first recess 32 is provided on the main surface 30 a of the first substrate 30. In the illustrated example, the main surface 30a is a surface facing the + Y′-axis direction side. By providing the first concave portion 32 on the main surface 30a, the first substrate 30 has the first convex portion 34 provided around the first concave portion 32 in plan view. The first protrusion 34 is bonded to the intermediate substrate 10 via the first bonding material 50. The first recess 32 has, for example, a rectangular shape in plan view.

  The first convex portion 34 of the first substrate 30 has an end 36 on the excitation electrodes 20a and 20b side and an end 38 opposite to the end 36 in plan view. The end 36 is an inner end of the first convex portion 34 having a frame shape, and the end 38 is an outer end of the first convex portion 34 having a frame shape. The end 36 is an inner surface of the first recess 32 and is provided along the Y ′ axis in the example illustrated in FIG. 2, but may be inclined with respect to the Y ′ axis.

  Connection terminals 24 a and 24 b are provided on the first protrusion 34 of the first substrate 30. In the illustrated example, the connection terminals 24a and 24b are provided diagonally to each other. External terminals 26 a and 26 b are provided on the main surface 30 b of the first substrate 30. In the illustrated example, the main surface 30b is a surface facing the −Y′-axis direction side. The first connection terminal 24 a is connected to the first external terminal 26 a via an internal wiring (not shown) that penetrates the first substrate 30. The second connection terminal 24 b is connected to the second external terminal 26 b through an internal wiring that penetrates the first substrate 30. The external terminals 26a and 26b are electrically connected to the excitation electrodes 20a and 20b, respectively, and a voltage can be applied to the vibration unit 12 from the outside using the external terminals 26a and 26b. As the connection terminals 24a, 24b and the external terminals 26a, 26b, for example, Ni (nickel), Au (gold), Ag (silver), a metallized layer (underlayer) such as Cr (chrome), W (tungsten), etc. A metal film in which respective films such as Cu (copper) are laminated is used.

The second substrate 40 is bonded to the intermediate substrate 10 via the second bonding material 60. The second substrate 40 is provided so as to cover the other surface side (for example, the main surface 10a side) of the intermediate substrate 10. In the illustrated example, the second substrate 40 has a rectangular shape in plan view. For example, the length of the second substrate 40 in the X-axis direction is the same as the length of the intermediate substrate 10 in the X-axis direction. The length of the second substrate 40 in the Z′-axis direction is, for example, the same as the length of the intermediate substrate 10 in the Z′-axis direction. The material of the second substrate 40 is, for example, quartz or silicon. The second substrate 40 functions as a lid that seals the recess formed by the frame portion 14 of the intermediate substrate 10 and the first substrate 30. It can be said that the vibrator 100 has a CSP (Chip Scale Package) structure.

  A second recess 42 is provided on the main surface 40 b of the second substrate 40. In the illustrated example, the main surface 40b is a surface facing the −Y′-axis direction side. By providing the second concave portion 42 on the main surface 40b, the second substrate 40 has the second convex portion 44 provided around the second concave portion 42 in plan view. The second convex portion 44 is bonded to the intermediate substrate 10 via the second bonding material 60. The second recess 42 has, for example, a rectangular shape in plan view. The vibration part 12 of the intermediate substrate 10 is accommodated in the recesses 32 and 42. The recesses 32 and 42 may be in a reduced pressure (vacuum) state, for example, or may be filled with an inert gas such as nitrogen, helium, or argon. Thereby, the vibration characteristics of the vibrator 100 are improved.

  The second convex portion 44 of the second substrate 40 has an end 46 on the excitation electrode 20a, 20b side and an end 48 opposite to the end 46 in plan view. The end 46 is an inner end of the second convex portion 44 having a frame shape, and the end 48 is an outer end of the second convex portion 44 having a frame shape. The end 46 is an inner surface of the second recess 42 and is provided along the Y ′ axis in the example illustrated in FIG. 2, but may be inclined with respect to the Y ′ axis. In the illustrated example, the end 36 of the first convex portion 34 and the end 46 of the second convex portion 44 overlap each other in plan view, and the end 38 of the first convex portion 34 and the end 48 of the second convex portion 44. Is overlapping.

  The first bonding material 50 bonds the intermediate substrate 10 and the first substrate 30 together. For example, the first bonding material 50 is provided in a frame shape along the outer edge of the first substrate 30. The second bonding material 60 bonds the intermediate substrate 10 and the second substrate 40 together. For example, the second bonding material 60 is provided in a frame shape along the outer edge of the intermediate substrate 10. By overlapping the first substrate 30 provided with the first bonding material 50, the intermediate substrate 10 provided with the second bonding material 60, and the second substrate 40, the intermediate substrate 10 and the first substrate are overlapped. 30 and the intermediate substrate 10 and the second substrate 40 can be bonded. The material of the bonding materials 50 and 60 is, for example, polyimide resin or glass paste (low melting point glass mainly composed of vanadium).

  The first bonding material 50 has an end 52 on the excitation electrodes 20a and 20b side and an end 54 on the opposite side to the end 52 in plan view. The end 52 is an inner end of the first bonding material 50 having a frame shape, and the end 54 is an outer end of the first bonding material 50 having a frame shape. The second bonding material 60 has an end 62 on the excitation electrode 20a, 20b side and an end 64 on the opposite side to the end 62 in plan view. The end 62 is an inner end of the second bonding material 60 having a frame shape, and the end 64 is an outer end of the second bonding material 60 having a frame shape. In the illustrated example, the ends 36 and 52 are continuous, the ends 38 and 54 are continuous, the ends 46 and 62 are not continuous, and the ends 48 and 64 are continuous.

  As shown in FIG. 2, the width (distance between the ends 52 and 54) W1 of the first bonding material 50 is larger than the width (distance between the ends 62 and 64) W2 of the second bonding material 60. Although not shown, the width W1 may be smaller than the width W2.

  One of the end (first end) 52 of the first bonding material 50 and the end (second end) 62 of the second bonding material 60 is arranged closer to the excitation electrodes 20a and 20b than the other in plan view. In the illustrated example, the end 52 is disposed closer to the excitation electrodes 20 a and 20 b than the end 62. The end 54 of the first bonding material 50 and the end 64 of the second bonding material 60 overlap, for example, in plan view.

Here, FIG. 5 is a schematic view in which the amplitude (waveform W) of the bending vibration generated in the intermediate substrate 10 is superimposed on the cross-sectional view schematically showing the vibrator 100. At least one of the end 52 of the first bonding material 50 and the end 62 of the second bonding material 60 is disposed at the position of the maximum amplitude (crest M or valley V) of the bending vibration generated in the intermediate substrate 10 as shown in FIG. Has been. In the example shown in FIG. 5, the end 52 is disposed in the valley V of the bending vibration, and the end 62 is disposed in the mountain M of the bending vibration. Specifically, the ends 52 and 62 are arranged so as to pass through the maximum amplitude (mountain M or valley V) of the waveform W of the bending vibration generated in the intermediate substrate 10 and to be parallel to the Y ′ axis and coincide with the virtual line α. Yes. As described above, the ends 52 and 62 are provided to avoid the position of the node F of the waveform W of the bending vibration. In the example shown in FIG. 5, the distance between the ends 52 and 62 in the X-axis direction is a magnitude corresponding to a half wavelength (0.5 wavelength) of bending vibration.

  The “bending vibration generated in the intermediate substrate 10” refers to bending vibration that is spurious (unnecessary vibration) generated in the intermediate substrate 10. The “node F of the waveform W of the bending vibration” is a point that does not vibrate in the waveform W of the bending vibration, and is a point located between the peak M and the valley V in the X-axis direction.

  Further, in the example shown in FIG. 5, the end 54 of the first bonding material 50 and the end 64 of the second bonding material 60 are also located at the position of the maximum amplitude of bending vibration generated in the intermediate substrate 10 (the peak M in the illustrated example). Has been placed. Furthermore, the maximum amplitude of bending vibration (in the illustrated example, the peak M) is also applied to the end 21a of the first excitation electrode 20a (end on the + X axis direction side) 21a and the end of the second excitation electrode 20b (end on the + X axis direction side) 21b. ).

  In the example illustrated in FIG. 5, the end 52 of the first bonding material 50 and the end 62 of the second bonding material 60 are provided along the Y ′ axis. However, in the example illustrated in FIG. 62 is inclined with respect to the Y ′ axis. In this case, “the ends 52 and 62 are arranged at the position of the maximum amplitude of the bending vibration generated in the intermediate substrate 10” means that the contact between the ends 52 and 62 and the intermediate substrate 10 has the maximum bending vibration in plan view. It is arranged at the position of amplitude.

  In the method for manufacturing the vibrator 100, for example, the AT-cut quartz substrate is patterned by photolithography and etching to form the substrates 10, 30, and 40. Etching may be dry etching or wet etching. Next, excitation electrodes 20 a and 20 b and extraction electrodes 22 a and 22 b are formed on the intermediate substrate 10, and connection terminals 24 a and 24 b and external terminals 26 a and 26 b are formed on the first substrate 30. For the electrodes 20a, 20b, 22a, 22b and the terminals 24a, 24b, 26a, 26b, for example, a conductive layer (not shown) is formed by sputtering or vacuum evaporation, and the conductive layer is patterned by photolithography and etching. It is formed by doing. Next, for example, the first bonding material 50 is provided on the first substrate 30, the second bonding material 60 is provided on the second substrate 40, and the substrates 10, 30, and 40 are overlapped, thereby interposing the first bonding material 50. The substrates 10 and 30 are bonded together, and the substrates 10 and 40 are bonded via the second bonding material 60. Thus, the vibrator 100 can be manufactured.

  For example, the vibrator 100 has the following characteristics.

  In the vibrator 100, the end 52 on the excitation electrode 20 a, 20 b side of the first bonding material 50 is closer to the excitation electrode 20 a, 20 b side than the end 62 on the excitation electrode 20 a, 20 b side of the second bonding material 60 in the plan view. Is arranged. Therefore, at least one of the ends 52 and 62 can be arranged avoiding the position of the node F of the waveform W of the bending vibration generated in the intermediate substrate 10. Thereby, in the vibrator 100, the bending vibration generated in the intermediate substrate 10 can be attenuated. As a result, the vibrator 100 can suppress the bending vibration from being coupled to the thickness shear vibration, which is the main vibration, and can have good electrical characteristics. Furthermore, it can have good temperature characteristics.

For example, in a form in which the first end on the excitation electrode side of the first bonding material and the second end on the excitation electrode side of the second bonding material overlap in plan view, the first substrate and the second substrate are intermediate during manufacture. When the position of the substrate is shifted, both the first end and the second end may be provided at the position of the node F of the waveform W of the bending vibration, and the bending vibration may not be attenuated. In the vibrator 100, since the ends 52 and 62 do not overlap with each other in plan view, even if the position of the intermediate substrate 10 is shifted with respect to the substrates 30 and 40 when the vibrator 100 is manufactured, One of them is likely to be arranged avoiding the position of the node F.

  Specifically, in the vibrator 100, both ends 52 and 62 are arranged so as to avoid the position of the node F of the waveform W of the bending vibration. Therefore, the bending vibration generated in the intermediate substrate 10 can be attenuated step by step, and the cross-sectional shape of the vibrating portion 12 can be assumed to be a pseudo-convex shape (the shape represented by the one-dot chain line shown in FIG. 5). Thereby, the effect of confining the thickness shear vibration (vibration displacement energy) in the vibration part 12 can be enhanced. For convenience, the waveform W of the bending vibration shown in FIGS. 5 and 6 and FIGS. 7, 8, and 10 shown below shows a state where the vibration is not attenuated step by step.

  In the vibrator 100, at least one of the end 52 of the first bonding material 50 and the end 62 of the second bonding material 60 is disposed at the position of the maximum amplitude of the bending vibration generated in the intermediate substrate 10. Therefore, in the vibrator 100, the bending vibration can be further attenuated. Specifically, in the vibrator 100, one of the ends 52 and 62 is disposed at the position of the bending vibration peak M, and the other is disposed at the position of the bending vibration valley VM. Therefore, the bending vibration can be further attenuated.

  In the vibrator 100, the width W1 of the first bonding material 50 that bonds the first substrate 30 that functions as a base and the intermediate substrate 10 is such that the second substrate 40 that functions as a lid and the intermediate substrate 10 are bonded. The width W2 of the second bonding material 60 is larger. Therefore, in the vibrator 100, while the intermediate substrate 10 is firmly supported by the first substrate 30, the adverse effect of the stress generated in the intermediate substrate 10 due to the second bonding material 60 on the vibration of the vibration unit 12 is reduced. Can do.

  In the above description, the example in which the thickness of the vibrating portion 12 is uniform has been described. However, the vibrating portion 12 may include a first portion and a second portion having a thickness different from that of the first portion. . That is, the vibrator according to the present invention may have a mesa structure. Thereby, the vibration displacement energy produced in the vibration part 12 can be efficiently confined in the vibration part 12.

  In the above description, an example in which the intermediate substrate 10 is an AT-cut quartz substrate has been described. However, in the vibrator according to the present invention, the intermediate substrate is not limited to an AT-cut quartz substrate, for example, an SC-cut quartz substrate or a BT cut. A piezoelectric substrate that vibrates due to thickness-shear vibration such as a quartz substrate may be used.

2. 2. Modification of vibrator 2.1. First Modified Example Next, a vibrator according to a first modified example of the present embodiment will be described with reference to the drawings. FIG. 7 is a cross-sectional view schematically showing a vibrator 200 according to the first modification example of the present embodiment. FIG. 8 is a plan view schematically showing a vibrator 200 according to a first modification of the present embodiment, in which (A) shows the second substrate 40, (B) shows the intermediate substrate 10, C) shows the first substrate 30.

  Hereinafter, in the vibrator 200 according to the first modification of the present embodiment, members having the same functions as those of the constituent members of the vibrator 100 according to the present embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. To do. The same applies to the second and third modifications shown below.

  In the vibrator 100 described above, as shown in FIGS. 2 and 3, the end 36 of the first protrusion 34 and the end 46 of the second protrusion 44 overlap each other in plan view. On the other hand, in the vibrator 200, as shown in FIGS. 7 and 8, one of the end 36 of the first convex portion 34 and the end 46 of the second convex portion 44 is on the excitation electrodes 20a and 20b side in a plan view. Has been placed. In the example shown in FIG. 7, the distance between the ends 52 and 62 in the X-axis direction is the magnitude of 1.5 wavelengths of bending vibration.

  In the vibrator 200, similarly to the vibrator 100, bending vibration generated in the intermediate substrate 10 can be attenuated.

2.2. Second Modified Example Next, a vibrator according to a second modified example of the present embodiment will be described with reference to the drawings. FIG. 9 is a cross-sectional view schematically showing a vibrator 300 according to the second modification of the present embodiment. FIG. 10 is a plan view schematically showing a vibrator 300 according to a second modification of the present embodiment, in which (A) shows the second substrate 40, (B) shows the intermediate substrate 10, C) shows the first substrate 30.

  In the vibrator 100 described above, as shown in FIGS. 2 and 3, the first substrate 30 has the first convex portion 34. On the other hand, in the vibrator 300, as shown in FIGS. 9 and 10, the first substrate 30 has a first convex portion 34 and further has a third convex portion 330. The third convex portion 330 is provided between the first convex portion 34 and the excitation electrodes 20a and 20b in plan view. In the example illustrated in FIG. 9, the third convex portion 330 is provided on the −X axis direction side with respect to the first convex portion 34. The thickness of the 1st convex part 34 and the thickness of the 3rd convex part 330 are the same, for example.

  In the vibrator 300, as shown in FIG. 9, the first bonding material 50 includes a first portion 502 provided on the first convex portion 34 and a second portion provided on the third convex portion 330. 504. The first protrusion 34 is bonded to the intermediate substrate 10 via the first portion 502. The third protrusion 330 is joined to the intermediate substrate 10 via the second portion 504.

  The first portion 502 of the first bonding material 50 has an end 55 on the side of the excitation electrodes 20 a and 20 b and an end 54 opposite to the end 55. The second portion 504 has an end 52 on the side of the excitation electrodes 20 a and 20 b and an end 53 on the side opposite to the end 52. An end 52 of the second portion 504 is an end (first end) of the first bonding material 50 on the side of the excitation electrodes 20a and 20b. In the example illustrated in FIG. 9, the end 54 of the first portion 502 is disposed at the position of the bending vibration peak M generated in the intermediate substrate 10, and the end 55 of the first portion 502 is disposed at the position of the bending vibration peak M. The end 53 of the second portion 504 is disposed at the position of the bending vibration peak M, and the end 52 of the second portion 504 is disposed at the position of the bending vibration valley V.

  In the example shown in the figure, the end 55 of the first portion 502 of the first bonding material 50 and the end 62 of the second bonding material 60 overlap in plan view, but may not overlap.

  In the vibrator 300, similarly to the vibrator 100, bending vibration generated in the intermediate substrate 10 can be attenuated.

2.3. Third Modification Next, a vibrator according to a third modification of the present embodiment will be described with reference to the drawings. FIG. 11 is a cross-sectional view schematically showing a vibrator 400 according to the third modification of the present embodiment.

In the vibrator 100 described above, as shown in FIG. 2, the first substrate 30 has the first convex portion 34. On the other hand, in the vibrator 400, as shown in FIG. 11, the first substrate 30 has a first convex portion 34 and further has a fourth convex portion 430. The fourth convex portion 430 is first in plan view.
It is provided between the convex portion 34 and the excitation electrodes 20a and 20b. In the example illustrated in FIG. 11, the fourth convex portion 430 is provided on the −X axis direction side with respect to the first convex portion 34. The thickness of the 1st convex part 34 and the thickness of the 4th convex part 430 are the same, for example. The fourth convex portion 430 has an end 432 on the side of the excitation electrodes 20 a and 20 b and an end 434 on the side opposite to the end 432.

  In the vibrator 400, the intermediate substrate 10 has a fifth protrusion 410 protruding from the main surface 10b. The fifth convex portion 410 is in contact with the fourth convex portion 430. The fifth convex portion 410 has an end 412 on the excitation electrodes 20 a and 20 b side and an end 414 on the opposite side to the end 412. In the illustrated example, the ends 412 and 432 are continuous, and the ends 414 and 434 are continuous. The ends 412 and 432 are disposed at the position of the valley V of the bending vibration, and the ends 414 and 434 are disposed at the position of the peak M of the bending vibration.

  In the example shown in the figure, the end 52 of the first bonding material 50 and the end 62 of the second bonding material 60 overlap in plan view, but may not overlap.

  In the vibrator 400, similarly to the vibrator 100, bending vibration generated in the intermediate substrate 10 can be attenuated.

3. Next, the vibration device according to the present embodiment will be described with reference to the drawings. FIG. 12 is a cross-sectional view schematically showing the vibration device 800 according to this embodiment.

  The vibration device 800 includes the vibrator according to the present invention. Hereinafter, a vibrating device 800 including the vibrator 100 will be described as the vibrator according to the present invention. As shown in FIG. 12, the vibration device 800 includes a vibrator 100 and a temperature sensitive element (electronic element) 810.

  The temperature sensitive element 810 is provided in the third recess 812 formed in the main surface 30 b of the first substrate 30. In the illustrated example, the third recess 812 is provided with a third connection terminal 814, and the temperature sensitive element 810 is joined to the third connection terminal 814 via a metal bump (not shown) or the like. The third connection terminal 814 is connected to the external terminals 26 a and 26 b via, for example, internal wiring (not shown) provided on the first substrate 30. The material of the third connection terminal 814 is the same as the material of the external terminals 26a and 26b, for example.

  The temperature sensing element 810 is, for example, a thermistor whose physical quantity, for example, electric resistance changes according to a temperature change. The electric resistance of the thermistor can be detected by an external circuit, and the detected temperature of the thermistor can be measured.

  It should be noted that other electronic components may be accommodated in the recesses 32 and 42 that accommodate the vibrating portion 12. Examples of such an electronic component include an IC chip that controls driving of the vibrator 100.

  Since the vibrating device 800 includes the vibrator 100, it can have good electrical characteristics.

4). Next, a vibration device according to a modification of the present embodiment will be described with reference to the drawings. FIG. 13 is a cross-sectional view schematically showing a vibrating device 900 according to a modification of the present embodiment.

  Hereinafter, in the vibration device 900 according to the modification of the present embodiment, members having the same functions as those of the constituent members of the vibration device 800 according to the present embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the vibration device 800, as illustrated in FIG. 12, the third recess 812 that houses the temperature sensing element 810 is provided on the main surface 30 b of the first substrate 30. On the other hand, in the vibration device 900, the third recess 812 is provided on the main surface 30 a of the first substrate 30 as illustrated in FIG. 13. The third recess 812 communicates with the first recess 32.

  Since the vibration device 900 includes the vibrator 100, the vibration device 900 can have good electrical characteristics.

5. Oscillator Next, an oscillator according to this embodiment will be described with reference to the drawings. FIG. 14 is a cross-sectional view schematically showing an oscillator 1100 according to this embodiment.

  The oscillator 1100 includes the vibrator according to the present invention. Hereinafter, an oscillator 1100 including the vibrator 100 will be described as the vibrator according to the present invention. As shown in FIG. 14, the oscillator 1100 includes a vibrator 100 and an IC chip (chip component) 1110.

  In the oscillator 1100, the first recess 32 includes a first portion 32a provided on the main surface 30a of the first substrate 30, a second portion 32b provided at the center of the bottom surface of the first portion 32a, and a second portion. And a third portion 32c provided at the center of the bottom surface of 32b.

  An IC chip 1110 is provided on the bottom surface of the third portion 32 c of the first recess 32. The IC chip 1110 has a drive circuit (oscillation circuit) for controlling the drive of the vibrator 100. When the vibrator 100 is driven by the IC chip 1110, vibration having a predetermined frequency can be extracted.

  A plurality of fourth connection terminals 1120 that are electrically connected to the IC chip 1110 via wires 1112 are provided on the bottom surface of the second portion 32 b of the first recess 32. For example, one fourth connection terminal 1120 among the plurality of fourth connection terminals 1120 is electrically connected to the first external terminal 26a via a wiring (not shown). The other fourth connection terminal 1120 among the plurality of fourth connection terminals 1120 is electrically connected to the second external terminal 26b through a wiring (not shown). Therefore, the IC chip 1110 is electrically connected to the vibrator 100.

  Since the oscillator 1100 includes the vibrator 100, it can have good electrical characteristics.

6). Next, an electronic device according to the present embodiment will be described with reference to the drawings. The electronic apparatus according to the present embodiment includes the vibrator according to the present invention. Hereinafter, an electronic device including the vibrator 100 will be described as the vibrator according to the invention.

  FIG. 15 is a plan view schematically showing a smartphone 1300 as the electronic apparatus according to the present embodiment. The smartphone 1300 includes an oscillator 1100 having a vibrator 100 as shown in FIG.

The smartphone 1300 uses the oscillator 1100 as a timing device such as a reference clock oscillation source, for example. The smartphone 1300 can further include a display unit (such as a liquid crystal display or an organic EL display) 1310, an operation unit 1320, and a sound output unit 1330 (such as a microphone). The smartphone 1300 may also use the display unit 1310 as an operation unit by providing a contact detection mechanism for the display unit 1310.

  Note that an electronic device typified by the smartphone 1300 preferably includes an oscillation circuit that drives the vibrator 100 and a temperature compensation circuit that compensates for a frequency variation caused by a temperature change of the vibrator 100.

  According to this, the electronic device represented by the smartphone 1300 includes the oscillation circuit that drives the vibrator 100 and the temperature compensation circuit that compensates the frequency variation accompanying the temperature change of the vibrator 100. Therefore, it is possible to provide temperature compensation for the resonance frequency at which oscillation occurs and to provide an electronic device having excellent temperature characteristics.

  FIG. 16 is a perspective view schematically showing a mobile (or notebook) personal computer 1400 as the electronic apparatus according to the present embodiment. As shown in FIG. 16, the personal computer 1400 includes a main body portion 1404 having a keyboard 1402 and a display unit 1406 having a display portion 1405. The display unit 1406 is a hinge structure portion with respect to the main body portion 1404. It is supported so that rotation is possible. Such a personal computer 1400 includes a vibrator 100 that functions as a filter, a resonator, a reference clock, and the like.

  FIG. 17 is a perspective view schematically showing a mobile phone (including PHS) 1500 as an electronic apparatus according to this embodiment. A cellular phone 1500 includes a plurality of operation buttons 1502, an earpiece 1504, and a mouthpiece 1506, and a display portion 1508 is disposed between the operation buttons 1502 and the earpiece 1504. Such a cellular phone 1500 incorporates the vibrator 100 that functions as a filter, a resonator, or the like.

  FIG. 18 is a perspective view schematically showing a digital still camera 1600 as an electronic apparatus according to the present embodiment. Note that FIG. 18 also shows a simple connection with an external device. Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1600 photoelectrically converts a light image of a subject with an image sensor such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1603 is provided on the back of a case (body) 1602 in the digital still camera 1600, and is configured to perform display based on an imaging signal from the CCD. The display unit 1603 displays an object as an electronic image. Functions as a viewfinder. A light receiving unit 1604 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1602.

When the photographer confirms the subject image displayed on the display unit and presses the shutter button 1606, the CCD image pickup signal at that time is transferred and stored in the memory 1608. In the digital still camera 1600, a video signal output terminal 1612 and an input / output terminal 1614 for data communication are provided on the side surface of the case 1602. As shown in the figure, a television monitor 1630 is connected to the video signal output terminal 1612 and a personal computer 1640 is connected to the input / output terminal 1614 for data communication as necessary. Further, the imaging signal stored in the memory 1608 is output to the television monitor 1630 or the personal computer 1640 by a predetermined operation. Such a digital still camera 1600 includes a vibrator 100 that functions as a filter, a resonator, and the like.

  Since the electronic devices 1300, 1400, 1500, and 1600 include the vibrator 100, they can have good electrical characteristics.

  The electronic device including the vibrator of the present invention is not limited to the above example, and for example, an ink jet discharge device (for example, an ink jet printer), a laptop personal computer, a television, a video camera, a video tape recorder, and a car navigation system. Devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, videophones, security TV monitors, electronic binoculars, POS terminals, medical devices (eg electronic thermometers, blood pressure) Applied to blood glucose meters, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic endoscopes), fish detectors, various measuring instruments, instruments (eg, vehicles, aircraft, ship instruments), flight simulators, etc. Can do.

7). Next, the moving body according to the present embodiment will be described with reference to the drawings. FIG. 19 is a perspective view schematically showing an automobile as the moving body 1700 according to the present embodiment.

  The moving body according to the present embodiment includes the vibrator according to the present invention. Hereinafter, a moving body including the vibrator 100 will be described as the vibrator according to the present invention.

  The moving body 1700 according to the present embodiment further includes a controller 1720, a controller 1730, a controller 1740, a battery 1750, and a backup battery 1760 that perform various controls such as an engine system, a brake system, and a keyless entry system. ing. Note that the mobile body 1700 according to this embodiment may omit or change some of the components (respective parts) shown in FIG. 19, or may have a configuration in which other components are added.

  As such a moving body 1700, various moving bodies can be considered, and examples thereof include automobiles (including electric automobiles), aircraft such as jets and helicopters, ships, rockets, and artificial satellites.

  Since the moving body 1700 includes the vibrator 100, it can have good electrical characteristics.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is possible to appropriately combine each embodiment and each modification.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 10 ... Intermediate board | substrate, 10a, 10b ... Main surface, 12 ... Vibration part, 14 ... Frame part, 16 ... Opening part, 20a ... 1st excitation electrode, 20b ... 2nd excitation electrode, 21a, 21b ... End, 22a ... 1st 1 extraction electrode, 22b ... 2nd extraction electrode, 24a ... 1st connection terminal, 24b ... 2nd connection terminal, 26a ... 1st external terminal, 26b ... 2nd external terminal, 30 ... 1st board | substrate, 30a, 30b ... main 32, first concave portion, 32a, first portion, 32b, second portion, 32c, third portion, 34, first convex portion, 36, 38, end, 40, second substrate, 40b, main surface, 42 ... 2nd recessed part, 44 ... 2nd convex part, 46, 48 ... end, 50 ... 1st joining material, 52, 53, 54, 55 ... end, 60 ... 2nd joining material, 62, 64 ... end, 100 ... vibrator, 101 ... AT-cut quartz substrate, 200, 300 ... vibrator, 330 ... third convex part, 400 ... Moving element, 410 ... fifth convex part, 412, 414 ... end, 430 ... fourth convex part, 432, 434 ... end, 502 ... first part, 504 ... second part, 800 ... vibration device, 810 ... temperature sensing Element 812 ... Third recess 814 ... Third connection terminal 1100 ... Oscillator 1110 ... IC chip 1112 ... Wire 1120 ... Fourth connection terminal 1300 ... Smartphone 1310 ... Display unit 1320 ... Operation unit 1330 ... sound output unit, 1400 ... personal computer, 1402 ... keyboard, 1404 ... main body part, 1405 ... display unit, 1406 ... display unit, 1500 ... mobile phone, 1502 ... operation buttons, 1504 ... earpiece, 1506 ... mouthpiece, 1508: Display unit, 1600: Digital still camera, 1602 ... Case, 1603 ... Display unit, 1604 ... Light receiving unit 1606 ... Shutter button, 1608 ... Memory, 1612 ... Video signal output terminal, 1614 ... Input / output terminal, 1630 ... TV monitor, 1640 ... Personal computer, 1700 ... Mobile object, 1720 ... Controller, 1730 ... Controller, 1740 ... Controller, 1750 ... Battery, 1760 ... Backup battery

Claims (14)

An intermediate substrate provided with excitation electrodes on the front and back surfaces;
A first substrate disposed on one side of the intermediate substrate and bonded to the intermediate substrate via a first bonding material;
A second substrate disposed on the other surface side of the intermediate substrate and bonded to the intermediate substrate via a second bonding material;
Including
The first bonding material and the second bonding material surround the excitation electrode in a plan view, and are disposed along the outer edge of the intermediate substrate,
The first end of the first bonding material on the excitation electrode side and the second end of the second bonding material on the excitation electrode side do not overlap in plan view,
The distance between the first end of the first bonding material and the end opposite to the first end is the distance between the second end of the second bonding material and the end opposite to the second end. Unlike the distance between,
The intermediate substrate has thickness shear vibration as a main vibration,
At least one of the first end and the second end is a vibrator arranged at a position of maximum amplitude of bending vibration generated in the intermediate substrate. In claim 1 ,
An end portion of the excitation electrode is a vibrator arranged at a position of maximum amplitude of bending vibration generated in the intermediate substrate. An intermediate substrate provided with excitation electrodes on the front and back surfaces;
A first substrate disposed on one side of the intermediate substrate and bonded to the intermediate substrate via a first bonding material;
A second substrate disposed on the other surface side of the intermediate substrate and bonded to the intermediate substrate via a second bonding material;
Including
The first bonding material and the second bonding material surround the excitation electrode in a plan view, and are disposed along the outer edge of the intermediate substrate,
The first end of the first bonding material on the excitation electrode side and the second end of the second bonding material on the excitation electrode side do not overlap in plan view,
The distance between the first end of the first bonding material and the end opposite to the first end is the distance between the second end of the second bonding material and the end opposite to the second end. Unlike the distance between,
The intermediate substrate has thickness shear vibration as a main vibration,
The first substrate has a third protrusion between the first bonding material and the excitation electrode in a plan view on the surface on the intermediate substrate side,
The vibrator is bonded to the intermediate substrate via a third bonding material . An intermediate substrate provided with excitation electrodes on the front and back surfaces;
A first substrate disposed on one side of the intermediate substrate and bonded to the intermediate substrate via a first bonding material;
A second substrate disposed on the other surface side of the intermediate substrate and bonded to the intermediate substrate via a second bonding material;
Including
The first bonding material and the second bonding material surround the excitation electrode in a plan view, and are disposed along the outer edge of the intermediate substrate,
The first end of the first bonding material on the excitation electrode side and the second end of the second bonding material on the excitation electrode side do not overlap in plan view,
The distance between the first end of the first bonding material and the end opposite to the first end is the distance between the second end of the second bonding material and the end opposite to the second end. Unlike the distance between,
The intermediate substrate has thickness shear vibration as a main vibration,
The first substrate has a fourth protrusion between the first bonding material and the excitation electrode in plan view on the surface on the intermediate substrate side,
The intermediate substrate has a fifth protrusion on the first substrate side surface between the first bonding material and the excitation electrode in a plan view,
The fourth convex portion and the fifth convex portion are vibrators that overlap in a plan view . In any one of Claims 1 thru | or 4 ,
In the plan view, the first end is disposed closer to the excitation electrode than the second end. In any one of Claims 1 thru | or 5 ,
The opposite end of the first bonding material and the opposite end of the second bonding material are continuous with an outer edge of the intermediate substrate. In any one of claims 1 to 6 ,
The first substrate has a first convex portion that overlaps the first bonding material in a plan view on the surface on the intermediate substrate side,
The second substrate has a second convex portion that overlaps the second bonding material in a plan view on a surface on the intermediate substrate side. In claim 7 ,
A vibrator in plan view in which a third end of the first convex portion on the excitation electrode side and a fourth end of the second convex portion on the excitation electrode side do not overlap. In claim 8 ,
In the planar view, the third end is disposed closer to the excitation electrode than the fourth end. The vibrator according to any one of claims 1 to 9 ,
An electronic element;
It is equipped with a vibration device. In claim 10 ,
The electronic device is a vibration device, which is a temperature sensitive device. The vibrator according to any one of claims 1 to 9 ,
An oscillation circuit electrically connected to the vibrator;
Equipped with an oscillator. And a vibrator according to any one of claims 1 to 9, the electronic device. And a vibrator according to any one of claims 1 to 9, the moving body.