JP6519122B2 - Sensor device, electronic device and mobile - Google Patents

Description

  The present invention relates to a sensor device, a support substrate assembly, an electronic device, and a movable body.

  For example, in Patent Document 1, the first substrate on which the first angular velocity sensor is disposed, the second substrate on which the second angular velocity sensor is disposed, and the third substrate on which the third angular velocity sensor is disposed are orthogonal to each other. A three-axis gyro sensor module assembled as such is disclosed. However, in the three-axis gyro sensor module of Patent Document 1, the first substrate and the second substrate, and the first substrate and the third substrate are respectively fixed by solder, and electrical conduction is achieved via the solder. There is. As described above, in the configuration in which the first and second substrates and the first and third substrates are fixed by soldering, it is difficult to accurately position the second and third substrates with respect to the first substrate. Therefore, the detection axes of the second and third angular velocity sensors are easily displaced with respect to the detection axis of the first angular velocity sensor, and the detection accuracy may be lowered.

JP, 2013-165237, A

  An object of the present invention is to provide a sensor device, a support substrate assembly, an electronic device, and a movable body capable of reducing the displacement of a detection axis.

  The present invention has been made to solve at least a part of the above-mentioned problems, and can be realized as the following application example.

Application Example 1
The sensor device according to the application example includes: a first sensor unit in which a first engagement unit is formed;
And a second sensor unit in which a second engagement unit is formed,
The detection axis of the first sensor unit and the detection axis of the second sensor unit cross each other, and the first engagement unit and the second engagement unit are engaged with each other.
This provides a sensor device capable of reducing the displacement of the detection axis.

Application Example 2
In the sensor device of this application example, the first sensor unit is
A first sensor component having the detection axis;
A first support substrate having a first component mounting surface on which the first engagement portion is formed and the first sensor component is disposed;
Have
The second sensor unit is
A second sensor component having the detection axis;
A second support substrate having a second component mounting surface on which the second engagement portion is formed and the second sensor component is disposed;
Have
It is preferable that a first virtual plane including the first component mounting surface intersects with a second virtual plane including the second component mounting surface.

  Thereby, the first support substrate and the second support substrate can be accurately positioned, and the deviation between the detection axis of the first sensor component and the detection axis of the second sensor component can be reduced.

Application Example 3
In the sensor device of this application example, it is preferable that one of the first engagement portion and the second engagement portion includes a protrusion, and the other includes a recess that engages with the protrusion.

  As a result, the configuration of the first and second engaging portions is simplified, and these can be easily engaged.

Application Example 4
In the sensor device according to the application example, the first support substrate is electrically connected to the first sensor component, and a power signal terminal to which a power supply voltage of the first sensor component is applied, and the first sensor component Electrically connected and having a digital signal terminal to which a digital signal is applied;
The power signal terminal and the digital signal terminal are disposed along one side forming the outer shape of the first support substrate,
The first engaging portion preferably includes a recess formed between the power signal terminal and the digital signal terminal on the first support substrate.

  Thereby, the digital signal terminal and the power signal terminal can be separated as much as possible. Therefore, the capacitive coupling between the digital signal terminal and the power supply signal terminal can be reduced, and the mixing of noise from the digital signal terminal to the power supply signal terminal can be reduced. Thus, the first sensor component can be stably driven.

Application Example 5
In the sensor device according to the application example, the second support substrate is electrically connected to the second sensor component, and a power signal terminal to which a power supply voltage of the second sensor component is applied, and the second sensor component Electrically connected and having a digital signal terminal to which a digital signal is applied;
The power signal terminal and the digital signal terminal are disposed along one side forming the outer shape of the second support substrate.
It is preferable that the second engagement portion includes a convex portion that protrudes from a portion between the power signal terminal and the digital signal terminal in the second support substrate.

  Thereby, the digital signal terminal and the power signal terminal can be separated as much as possible. Therefore, the capacitive coupling between the digital signal terminal and the power supply signal terminal can be reduced, and the mixing of noise from the digital signal terminal to the power supply signal terminal can be reduced. Therefore, the second sensor component can be driven stably.

Application Example 6
In the sensor device of this application example, it is preferable to have a bonding member for bonding the first support substrate and the second support substrate.
Thereby, the first support substrate and the second support substrate can be firmly fixed.

Application Example 7
In the sensor device of this application example, the bonding member has conductivity.
Wiring is provided on each of the first support substrate and the second support substrate, and the wiring of the first support substrate and the wiring of the second support substrate are electrically connected through the bonding member. Is preferred.
This simplifies the device configuration.

Application Example 8
In the sensor device according to the application example, each of the first sensor unit and the second sensor unit performs a detection process based on a sensor element and a signal from the sensor element, and outputs detection data. An interface unit for communicating with a host device which is a master, and a storage unit for storing information of its own data transmission order;
When the host device issues a read command by designating a common address having the first sensor unit and the second sensor unit as common destinations, the interface unit transmits the read command to the host device in the data transmission order. Preferably, detection data is transmitted.

  As a result, the number of wires can be reduced, and the sensor device can be miniaturized. In addition, the readout of detection data from the first and second sensor units can be made more efficient, and the time required to read out the detection data can be shortened.

Application Example 9
In the sensor device according to the application example, when the host device designates an individual address and issues a read command, the interface unit transmits the read command to the host device when the individual address matches the individual address of the host device. Preferably, detection data is transmitted.

  As a result, it is possible to designate a desired sensor unit out of the first and second sensor units, and to transmit only detection data from the sensor unit.

Application Example 10
The sensor device according to the application example further includes a third sensor unit in which the third engagement unit is formed,
A fourth engagement portion is formed on the first sensor portion,
The detection axis of the first sensor portion, the detection axis of the second sensor portion, and the detection axis of the third sensor portion intersect with each other, and the first engagement portion and the second engagement portion are engaged with each other Preferably, the third engagement portion and the fourth engagement portion are engaged with each other.
As a result, three detection axes are provided, and more detailed detection is possible.

Application Example 11
In the sensor device of this application example, a fifth engagement portion is formed in the third sensor portion,
A sixth engagement portion is formed on the second sensor portion,
Preferably, the fifth engagement portion and the sixth engagement portion are engaged with each other.

  As a result, the first, second and third sensor portions engage with each other, so that positioning of these can be performed with higher accuracy.

Application Example 12
In the sensor device according to the application example, the third sensor unit includes a third sensor component having the detection axis, and a third component mounting in which the third engagement unit is formed and the third sensor component is disposed. And a third support substrate having a surface.

  Thereby, the first support substrate and the third support substrate can be accurately positioned, and the deviation between the detection axis of the first sensor component and the detection axis of the third sensor component can be reduced.

Application Example 13
In the supporting substrate assembly of this application example, a first supporting substrate having a first component mounting surface and having a first engaging portion formed thereon;
A second support substrate having a second component mounting surface and having a second engaging portion formed thereon;
When a first virtual plane including the first component mounting surface intersects with a second virtual plane including the second component mounting surface, the first engagement portion and the second engagement portion are engaged with each other It is characterized by

  Thereby, positioning of the 1st support substrate and the 2nd support substrate can be performed with sufficient accuracy. Therefore, it is possible to reduce the deviation between the detection axis of the sensor component mounted on the first component mounting surface and the detection axis of the sensor component mounted on the second component mounting surface.

Application Example 14
The electronic device of this application example is characterized by including the sensor device of the above application example.
Thus, highly reliable electronic devices can be obtained.

Application Example 15
The mobile unit of this application example is characterized by including the sensor device of the above application example.
Thereby, a highly reliable mobile body is obtained.

It is a perspective view of a sensor device concerning a 1st embodiment of the present invention. It is sectional drawing of the 1st sensor component which the sensor device shown in FIG. 1 has. It is a top view of the 1st sensor part shown in FIG. It is a top view explaining the drive of the 1st sensor part shown in FIG. It is an expanded view of the sensor device shown in FIG. It is a top view of the sensor device shown in FIG. It is a partial enlarged plan view of the sensor device shown in FIG. It is a partial enlarged plan view of the sensor device shown in FIG. It is a figure which shows the circuit structure of the sensor device shown in FIG. It is a figure which shows the state which has arrange | positioned the sensor device shown in FIG. 1 to a target object. It is a figure which shows the modification of the sensor device shown in FIG. It is a perspective view of a sensor device concerning a 2nd embodiment of the present invention. It is an expanded view of a sensor device shown in FIG. FIG. 13 is a partial enlarged cross-sectional view of the sensor device shown in FIG. 12; It is a figure which shows the state which has arrange | positioned the sensor device shown in FIG. 12 to a target object. It is a partial enlarged plan view of a sensor device concerning a 3rd embodiment of the present invention. It is a perspective view of a sensor device concerning a 4th embodiment of the present invention. It is an expanded view of the sensor device shown in FIG. It is a top view of the sensor device shown in FIG. FIG. 18 is a partial enlarged cross-sectional view of the sensor device shown in FIG. FIG. 18 is a partial enlarged cross-sectional view of the sensor device shown in FIG. FIG. 18 is a partially enlarged perspective view of the sensor device shown in FIG. It is a figure which shows the circuit structure of the sensor device shown in FIG. It is a figure which shows the state which has arrange | positioned the sensor device shown in FIG. 17 to a target object. It is a perspective view of the sensor device concerning a 5th embodiment of the present invention. It is an expanded view of a sensor device shown in FIG. FIG. 26 is a plan view of the sensor device shown in FIG. 25. FIG. 26 is a partial enlarged perspective view of the sensor device shown in FIG. 25. It is a perspective view showing composition of a mobile type (or note type) personal computer to which an electronic device of the present invention is applied. It is a perspective view which shows the structure of the mobile telephone (including PHS) which applied the electronic device of this invention. It is a perspective view which shows the structure of the digital still camera which applied the electronic device of this invention. It is a perspective view showing a car to which a mobile of the present invention is applied.

  Hereinafter, the sensor device, the support substrate assembly, the electronic device, and the movable body of the present invention will be described in detail based on the embodiments shown in the attached drawings.

First Embodiment
FIG. 1 is a perspective view of a sensor device according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of a first sensor component of the sensor device shown in FIG. FIG. 3 is a plan view of the first sensor component shown in FIG. FIG. 4 is a plan view for explaining the driving of the first sensor component shown in FIG. FIG. 5 is a developed view of the sensor device shown in FIG. 6 is a plan view of the sensor device shown in FIG. FIG. 7 is a partially enlarged plan view of the sensor device shown in FIG. FIG. 8 is a partially enlarged plan view of the sensor device shown in FIG. FIG. 9 is a diagram showing a circuit configuration of the sensor device shown in FIG. FIG. 10 is a view showing a state in which the sensor device shown in FIG. 1 is disposed on an object. FIG. 11 is a view showing a modified example of the sensor device shown in FIG.

  In the following, as shown in FIG. 1 and the like, three axes orthogonal to each other are taken as an X axis, a Y axis, and a Z axis. In the following, a direction parallel to the X axis is also referred to as “X axis direction”, a direction parallel to the Y axis as “Y axis direction”, and a direction parallel to the Z axis as “Z axis direction”.

  The sensor device 1 shown in FIG. 1 is an angular velocity sensor device capable of detecting angular velocities ωx and ωy around each of the X axis and the Y axis. Such a sensor device 1 mainly includes a support substrate assembly 10 assembled by crossing two support substrates (first and second support substrates 29 and 39) at approximately 90 °, and a support substrate assembly. And two angular velocity sensor components (first and second sensor components 21 and 31) mounted on the solid body 10. Hereinafter, the configuration of the sensor device 1 will be described in detail.

  The sensor device 1 includes a first sensor unit 2 that detects an angular velocity ωx around the X axis, and a second sensor unit 3 that detects an angular velocity ωy around the Y axis. The first sensor unit 2 has a first sensor component 21 for detecting an angular velocity ωx, and a first support substrate 29. The first sensor unit 2 has a first component mounting surface 291 which is one main surface of the first support substrate 29 1 Sensor part 21 is mounted (arranged). Similarly, the second sensor unit 3 includes a second sensor component 31 for detecting an angular velocity ωy and a second support substrate 39, and is a second component mounting surface which is one main surface of the second support substrate 39. The second sensor component 31 is mounted (arranged) on 391. In addition, in the sensor device 1 of this embodiment, the 1st sensor part 2 and the 2nd sensor part 3 become the same structure. Thereby, parts can be shared, and the manufacturing cost of the sensor device 1 can be reduced.

«First and second sensor parts»
The first and second sensor components 21 and 31 are not particularly limited as long as they can detect an angular velocity, and, for example, vibration of an electrostatic capacitance detection type formed of a quartz oscillator or a Si substrate The configuration can be made using a child, and as an example thereof, the following configuration can be made. In addition, since the configurations of the first and second sensor components 21 and 31 are the same as each other, the first sensor component 21 will be representatively described below, and the description of the second sensor component 31 will be omitted. .

  As shown in FIG. 2, the first sensor component 21 includes a package 22, an angular velocity sensor element 23 housed in the package 22, a support substrate 27, and an IC chip (detection device) 24.

  As shown in FIG. 3, the angular velocity sensor element 23 extends laterally from the base 231, and first and second detection arms 232a and 232b extending from the base 231 longitudinally to both sides, and from the base 231. First and second connecting arms 233a and 233b, first and second driving arms 234a and 234b extending to both sides in the longitudinal direction from the tip of the first connecting arm 233a, and the tip of the second connecting arm 233b And third and fourth drive arms 234c and 234d extending to both sides in the longitudinal direction from the portion.

  The first to fourth drive arms 234a to 234d are provided with drive electrodes (not shown), and by applying a voltage to the drive electrodes, a drive mode as shown in FIG. 4A is excited. Then, when the angular velocity ω around the detection axis J is applied while the first to fourth drive arms 234 a to 234 d are vibrated in the drive mode, the detection mode as shown in FIG. As a result, the first and second detection arms 232a and 232b vibrate. Detection electrodes (not shown) are provided on the first and second detection arms 232a and 232b, and signals (charges) generated by the vibration of the first and second detection arms 232a and 232b are extracted from the detection electrodes and extracted. The angular velocity ω can be detected based on the received signal.

  The package 22 has a box-like base substrate 25 having a recess 251 opened on the upper surface, and a plate-like lid 26 that is joined to the base substrate 25 so as to close the opening of the recess 251. The angular velocity sensor element 23, the support substrate 27, and the IC chip 24 are accommodated in an internal space S formed by closing the opening of the recess 251 by the lid 26. The atmosphere in the internal space S is in a vacuum state (e.g., a reduced pressure state of 10 Pa or less) in order to cause the angular velocity sensor element 23 to vibrate efficiently.

  The IC chip 24 is disposed on the bottom surface of the recess 251 and externally mounted terminals 252 provided on the bottom surface of the angular velocity sensor element 23 and the base substrate 25 via bonding wires and internal wiring provided on the base substrate 25. Are connected electrically. Such an IC chip 24 as shown in FIG. 9 is an interface section 241 which communicates with other electronic components in a predetermined communication method, and a drive / detection circuit which drives the angular velocity sensor element 23 and detects the angular velocity ω A detection circuit) 242 and a storage unit 243 for storing predetermined information are included.

  The support substrate 27 is a substrate for TAB (Tape Automated Bonding) mounting, is interposed between the base substrate 25 and the angular velocity sensor element 23, supports the angular velocity sensor element 23, and supports the angular velocity sensor element 23 as a base substrate 25. It is fixed to The support substrate 27 has a frame-shaped base 271 and six bonding leads 272-277 provided on the base 271. The tips of the bonding leads 272 to 277 and the angular velocity sensor element 23 are fixed via the conductive adhesive, whereby the angular velocity sensor element 23 is fixed to the bonding leads 272 to 277 and the bonding lead 272 277 and the angular velocity sensor element 23 are electrically connected. By interposing such a support substrate 27 between the angular velocity sensor element 23 and the base substrate 25, it becomes an angular velocity sensor component capable of exhibiting excellent detection accuracy with less vibration leakage.

«First and second support substrate»
The first and second support substrates 29 and 39 are not particularly limited, and for example, a glass epoxy substrate can be used.

  As shown in FIG. 5A, the first support substrate 29 has a plate shape having a substantially rectangular shape in a plan view, and the four sides 29a, 29b, which form an outer shape (outline) in a plan view. It has 29c and 29d. Among the sides, sides 29a and 29b constitute short sides, respectively, and are disposed to face each other, and sides 29c, 29d each constitute long sides and are disposed to face each other. The first support substrate 29 also has a recess (first engagement portion) 293 recessed from the side 29 b. The recess 293 is provided so as to avoid the end of the side 29 b, and is provided at a position deviated from the center of the side 29 b to one end. Although the first support substrate 29 of the present embodiment has the convex portion 294 protruding from the side 29 a, as described above, the convex portion 294 includes the first and second sensor portions 2 and 3. It is formed to have the same configuration, and may be omitted.

  Further, the first support substrate 29 is provided with a wiring group 28 electrically connected to the first sensor component 21. Wiring group 28 includes ground wiring 281 for ground GND, digital signal wiring 282 for slave select signal SS, digital signal wiring 283 for data input signal MOSI, digital signal wiring 284 for clock signal SCLK, and data A digital signal wiring 285 for the output signal MISO, a power supply signal wiring 286 for the power supply (power supply voltage) VDDI of the interface unit 241, and a power supply signal wiring 287 for the power supply (power supply voltage) VDDM of the drive / detection circuit 242 Have. The wirings included in the wiring group 28 are not limited to this. For example, the power supply signal wiring 286 and the power supply signal wiring 287 may be combined into one wiring, and in order to transmit and receive other signals. May be provided.

  Further, one ends of the wires 281 to 287 are terminals 281a to 287a, and these terminals 281a to 287a are arranged along the side 29a on the first component mounting surface 291 in this order. Further, a convex portion 294 is located between the terminals 281a to 285a and the terminals 286a and 287a, and the terminals 281a to 285a and the terminals 286a and 287a are divided into opposite sides with the convex portion 294 as a boundary. It is done. On the other hand, the other ends of the wires 281 to 287 are terminals 281 b to 287 b, and these terminals 281 b to 287 b are arranged in this order along the side 29 b on the back surface 292. In addition, a recess 293 is located between the terminals 281b to 285b and the terminals 286b and 287b, and the terminals 281b to 285b and the terminals 286b and 287b are separately disposed on the opposite side with the recess 293 as a boundary. There is.

  By arranging the wiring group 28 in such a manner, the digital signal wirings 282 to 285 (digital signal terminals 282a (282b) to 285a (285b)) and the power signal wiring 287 (power signal terminal 287a (287b)) 1 can be separated as much as possible on the support substrate 29, and noise contamination from the digital signal wires 282 to 285 to the power supply signal wire 287 can be reduced. Thereby, it is possible to reduce the decrease in the detection accuracy of the angular velocity ωx of the first sensor component 21.

  In addition, test terminals 281c to 287c are provided on the first component mounting surface 291 in the middle of the wires 281 to 287 for bringing the pin header into contact at the time of operation check test, adjustment (data input, etc.) Is provided. Thereby, the operation test, the adjustment, and the like of the first sensor unit 2 can be easily performed. However, such test terminals 281c to 287c may be omitted.

  Next, although the second support substrate 39 will be described, the second support substrate 39 has the same configuration as the first support substrate 29 including the shape (including the size) and the material.

  As shown in FIG. 5B, the second support substrate 39 has a plate shape having a substantially rectangular shape in a plan view, and the four sides 39a, 39b, which form an outer shape (outline) in a plan view. It has 39c and 39d. Among the sides, sides 39a and 39b constitute short sides, respectively, and are disposed to face each other, and sides 39c and 39d each constitute long sides and are disposed to face each other. The second support substrate 39 also has a convex portion (second engagement portion) 394 protruding from the side 39a. The convex portion 394 is provided to avoid the end of the side 39a, and is provided at a position deviated from the center of the side 39a to one end.

  Although the second support substrate 39 of the present embodiment has the recess 393 recessed from the side 39 b, as described above, the recess 393 is the same as the first and second sensor portions 2 and 3. It is formed because it was composition, and may be omitted.

  In addition, a wiring group 38 electrically connected to the second sensor component 31 is provided on the second support substrate 39. Wiring group 38 includes ground wiring 381 for ground GND, digital signal wiring 382 for slave select signal SS, digital signal wiring 383 for data input signal MOSI, digital signal wiring 384 for clock signal SCLK, and data A digital signal wiring 385 for the output signal MISO, a power supply signal wiring 386 for the power supply VDDI of the interface unit 341, and a power supply signal wiring 387 for the power supply VDDM of the drive / detection circuit 342 are provided. The wirings included in the wiring group 38 are not limited to this. For example, the power supply signal wiring 386 and the power supply signal wiring 387 may be combined into one wiring, and in order to transmit and receive other signals. May be provided.

  Further, one ends of the wires 381 to 387 are terminals 381a to 387a, and the terminals 381a to 387a are arranged along the side 39a in this order on the second component mounting surface 391. Further, a convex portion 394 is located between the terminals 381a to 385a and the terminals 386a and 387a, and the terminals 381a to 385a and the terminals 386a and 387a are divided into opposite sides with the convex portion 394 as a boundary. It is done. On the other hand, the other ends of the wires 381 to 387 are terminals 381b to 387b, and these terminals 381b to 387b are arranged in this order along the side 39b on the back surface 392. In addition, a recess 393 is located between the terminals 381b to 385b and the terminals 386b and 387b, and the terminals 381b to 385b and the terminals 386b and 387b are separately disposed on opposite sides of the recess 393 as a boundary. There is.

  By arranging the wiring group 38 in such a manner, the digital signal wirings 382 to 385 (digital signal terminals 382 a (382 b) to 385 a (385 b)) and the power signal wiring 387 (power signal terminal 287 a (287 b)) 2 can be separated as much as possible on the support substrate 39, and noise contamination from the digital signal wires 382 to 385 to the power supply signal wire 387 can be reduced. Thereby, the fall of detection accuracy of angular velocity omega y of the 2nd sensor part 31 can be reduced.

  In addition, test terminals 381c to 387c are provided on the second component mounting surface 391 in the middle of the wires 381 to 387, and are for contacting the pin header at the time of operation check test, adjustment (data input etc.) Is provided. Thus, the operation test, adjustment, and the like of the second sensor unit 3 can be easily performed. However, such test terminals 381 c to 387 c may be omitted.

  The first and second support substrates 29 and 39 have been described above. As shown in FIG. 6, in the first and second support substrates 29 and 39, the virtual plane F1 including the first component mounting surface 291 and the virtual plane F2 including the second component mounting surface 391 are substantially perpendicular (90 °) It is assembled to cross). As a result, the detection axes Jx and Jy of the first and second sensor components 21 and 31 are substantially orthogonal to each other.

  When the first and second support substrates 29 and 39 are assembled, as shown in FIG. 7, the concave portion 293 of the first support substrate 29 and the convex portion 394 of the second support substrate 39 are engaged with each other. The first and second support substrates 29 and 39 are positioned. As described above, the first and second support substrates 29 and 39 can be positioned with high accuracy by the concavo-convex engagement of the first and second support substrates 29 and 39 with each other. Therefore, the relative displacement of the detection axes Jx and Jy can be reduced. In particular, by forming the engaging portion by the concave portion 293 and the convex portion 394, the structure can be simplified, and these can be easily engaged.

  More specifically, in the engagement of the first and second support substrates 29 and 39, as shown in FIG. 7, the end face 399 where the convex portion 394 of the second support substrate 39 is formed. Is abutted against the back surface 292 (precisely, the terminals 281b to 287b) of the first support substrate 29, and the main surface 394a of the projection 394 abuts against the bottom surface 293a of the recess 293 as shown in FIG. ing. As described above, by applying two surfaces substantially orthogonal to each other, the first and second support substrates 29 and 39 can be positioned more accurately so as to be substantially orthogonal to each other.

Moreover, than the width W ₁ of the recess 293 has become thicker width W ₂ of the convex portion 394 is slightly because the convex portion 394 has a configuration to fit into the recess 293, can maintain a positioning posture It is supposed to be. The thickness T ₁ of the recess 293 are substantially equal to the length L ₂ of the convex portion 394, which makes it possible to engage more firmly engage the recess 293 and the convex portion 394, the first support The protrusion 394 can be prevented from protruding from the first component mounting surface 291 of the substrate 29. As the length _{L 2} of the convex portion 394 is not particularly limited, for _{example, T} 1/3 or more, preferably _{T 1} or _{less, T} 1/2 or more, more preferably at _{T 1} or less . Thereby, the same effect as the above can be exhibited.

The first and second support substrates 29 and 39 have first and second component mounting surfaces 291 and 391 outside the pocket space S1 which is partially surrounded by the first and second support substrates 29 and 39. It is assembled to be located. The length _{L 1} of the recess 293 is longer than the thickness _{T 2} of the convex portion 394, the first outside the pocket space S1, the corners 101 through the back 292 and the second component mounting surface 391 It is formed.

  In the corner portion 101, the terminals 281b to 287b and the terminals 381a to 387a are arranged side by side. Further, solder (bonding members) H1 to H7 are provided at the corner portion 101 so as to extend across the first support substrate 29 and the second support substrate 39. The first supporting substrate 29 and the second supporting substrate 39 are fixed (joined) by the solders H1 to H7, and the terminals 281b to 287b and the terminals 381a to 387a are electrically connected. According to such a configuration, the first and second support substrates 29 and 39 can be fixed by the fitting of the concave portion 293 and the convex portion 394 and the bonding by the solder H1 to H7. The supporting substrates 29 and 39 can be fixed more firmly. Further, since the solders H1 to H7 also serve as the conduction members, the device configuration can be simplified and the manufacturing cost can be reduced.

  The bonding member for bonding the first and second support substrates 29 and 39 is not limited to solder, and a metal bonding material other than solder such as gold solder or silver solder may be used, or a conductive adhesive May be used. Alternatively, a bonding member having no conductivity may be used. In this case, for example, the terminals 281b to 287b and the terminals 381a to 387a may be electrically connected by another means such as a bonding wire.

Next, the circuit configuration of the sensor device 1 will be described.
As shown in FIG. 9, in the sensor device 1, GND, SS, MOSI, SCLK, MISO, VDDI and VDDM are shared by the first and second sensor components 21 and 31, and GND, SS, and the like of the host device 100. It is commonly connected to signal lines of MOSI, SCLK, MISO, VDDI and VDDM. As described above, by sharing each signal wiring with the first and second sensor components 21 and 31, the number of wirings can be reduced, and the apparatus can be miniaturized. In addition, the degree of freedom of wiring can be improved. Note that electrical connection between the host device (master) 100 and the sensor device 1 can be performed, for example, through the terminals 281 a to 287 a and the terminals 381 b to 387 b.

  The interface unit 241 included in the first sensor component 21 and the interface unit 341 included in the second sensor component 31 use the clock signal SCLK, the data input signal MOSI, and the data output signal MISO to communicate with the host device 100, respectively. For example, communication is performed by a communication method of SPI (Serial Peripheral Interface: registered trademark).

  Further, the storage unit 243 included in the first sensor component 21 stores information on the data transmission order of its own IC chip 24, and the storage unit 343 included in the second sensor component 31 is an IC of its own. Information on the data transmission order of the chip 34, an individual address and the like are stored. The data transmission order information may be the data transmission order itself or may be an order for specifying the data transmission order. For example, non-volatile memory such as EPROM and OTP, or other semiconductor memory can be used as such storage units 243 and 343.

  For example, when the host device 100 issues a read command by designating a common address with the IC chips 24 and 34 as common destinations, the IC chips 24 and 34 follow the data transmission order stored in the storage units 243 and 343. , Transmit detection data to the host device 100. For example, when the data transmission order of the IC chip 24 is No. 1 and the data transmission order of the IC chip 34 is No. 2, first, the IC chip 24 transmits detection data to the host device 100, and then, the IC chip 34. Sends detection data to the host device 100.

  On the other hand, when the host device 100 issues a read command by designating an individual address (slave address), the IC chips 24, 34 execute the host when the individual address designated by the host device 100 matches the individual address of itself. The detection data is transmitted to the device 100. That is, for example, when the host device 100 designates only the IC chip 24 and issues a read command, the IC chip 24 transmits detection data to the host device 100, but the IC chip 34 transmits the detection data to the host device 100. Does not send detection data.

  The sensor device 1 has been described above. Such a sensor device 1 can be disposed on the object A as shown in FIG. 10, for example. As described above, since the first and second sensor components 21 and 31 and the solders H1 to H7 are not disposed on the pocket space S1 side, the sensor device is disposed by disposing the object A in the pocket space S1. It becomes easy to arrange 1 on the object A. In this case, since the terminals 281a to 287a are not hidden by the object A, it is preferable to connect to the host device 100 through the terminals 281a to 287a.

  Further, as a modified example of the present embodiment, as shown in FIG. 11, a connector 6 connected to the wires 281 to 287 is provided on the first component mounting surface 291 instead of the terminals 281a to 287a. The flexible wiring board 7 may be connected to the host device 100 via the flexible wiring board 7.

  In the present embodiment, the first support substrate 29 has one recess 293, and the second support substrate 39 has one protrusion 394. The number of the recesses 293 and the protrusions 394 is as follows. The number is not limited to one, and may be two or more. By providing a plurality of the first and second support substrates 29 and 39, positioning of the first and second support substrates 29 and 39 can be performed with higher accuracy.

Second Embodiment
FIG. 12 is a perspective view of a sensor device according to a second embodiment of the present invention. FIG. 13 is a development view of the sensor device shown in FIG. FIG. 14 is a partial enlarged cross-sectional view of the sensor device shown in FIG. FIG. 15 is a view showing a state in which the sensor device shown in FIG. 12 is disposed on an object.

  The sensor device according to the present embodiment is the same as the sensor device according to the first embodiment described above, except that the orientations of the first and second support substrates are mainly different.

  In the following description, the sensor device of the second embodiment will be described focusing on differences from the above-described embodiment, and the description of the same matters will be omitted. Further, in FIG. 12 to FIG. 15, the same components as those in the above-described embodiment are denoted by the same reference numerals.

  As shown in FIG. 13A, in the first support substrate 29, the terminals 281b to 287b are disposed along the side 29b on the first component mounting surface 291. Similarly, as shown in FIG. 13B, in the second support substrate 39, the terminals 381b to 387b are disposed along the side 39b of the second component mounting surface 391.

  Such first and second support substrates 29 and 39 are assembled such that the first and second component mounting surfaces 291 and 391 are located on the pocket space S1 side, as shown in FIG. Further, at the connection portion of the first and second support substrates 29 and 39, a corner 102 facing the pocket space S1 is formed, and at this corner 102, the terminals 281b to 287b and the terminals 381a to 387a are formed. They are arranged side by side. Furthermore, solders H 1 to H 7 are provided at the corner 102 across the first support substrate 29 and the second support substrate 39. The first supporting substrate 29 and the second supporting substrate 39 are fixed (joined) by the solders H1 to H7, and the terminals 281b to 287b and the terminals 381a to 387a are electrically connected.

Further, as shown in FIG. 14, the length L ₁ of the recess 293 is approximately equal to the thickness T ₂ of the protrusion 394, and the thickness T ₁ of the recess 293 is approximately equal to the length L ₂ of the protrusion 394. Therefore, the concave portion 293 and the convex portion 394 can be engaged more firmly, and the projection of the first and second support substrates 29 and 39 in these engaging portions can be prevented. That is, the corner portion 101 as in the first embodiment described above can be omitted. However, the sizes of the concave portion 293 and the convex portion 394 are not particularly limited as long as they can be engaged with each other.

  The sensor device 1 has been described above. Such a sensor device 1 can be disposed on the object A as shown in FIG. 15, for example. As described above, since the first and second sensor components 21 and 31 and the solders H1 to H7 are disposed in the pocket space S1, the sensor device 1 is disposed by disposing the object A outside the pocket space S1. Can be easily arranged on the object A.

  Also by such a second embodiment, the same effect as that of the first embodiment described above can be exhibited.

Third Embodiment
FIG. 16 is a partial enlarged plan view of a sensor device according to a third embodiment of the present invention.

  The sensor device according to the present embodiment is the same as the sensor device according to the first embodiment described above, except that the bonding method of the first and second support substrates is mainly different.

  In the following description, the sensor device of the third embodiment will be described focusing on differences from the above-described embodiment, and the description of the same matters will be omitted. Further, in FIG. 16, the same components as those in the embodiment described above are denoted by the same reference numerals.

  As shown in FIG. 16, in the second support substrate 39, the terminals 381a to 387a are provided so as to extend to the end face 399. And in this embodiment, the 1st, 2nd support substrates 29 and 39 are being fixed not via solder but via the anisotropic conductive adhesive B. The anisotropic conductive adhesive B is disposed between the end face 399 of the second support substrate 39 and the back surface 292 of the first support substrate 29, whereby the first support substrate 29 and the second support substrate 39 are formed. The terminals 281b to 287b and the terminals 381a to 387a are electrically connected. The anisotropic conductive adhesive B has sufficient conductivity in the thickness direction but has sufficient insulation in the in-plane direction. Therefore, a short circuit is prevented between the terminals 281b to 287b.

  Also by such a third embodiment, the same effect as that of the first embodiment described above can be exhibited.

Fourth Embodiment
FIG. 17 is a perspective view of a sensor device according to a fourth embodiment of the present invention. FIG. 18 is a development view of the sensor device shown in FIG. FIG. 19 is a plan view of the sensor device shown in FIG. FIG. 20 is a partial enlarged cross-sectional view of the sensor device shown in FIG. FIG. 21 is a partial enlarged cross-sectional view of the sensor device shown in FIG. FIG. 22 is a partial enlarged perspective view of the sensor device shown in FIG. FIG. 23 is a diagram showing a circuit configuration of the sensor device shown in FIG. FIG. 24 is a view showing the sensor device shown in FIG. 17 placed on an object.

  The sensor device according to the present embodiment is the same as the sensor device according to the first embodiment described above except that a third sensor portion is further added to the first and second sensor portions. .

  In the following description, the sensor device of the fourth embodiment will be described focusing on differences from the above-described embodiment, and the description of the same matters will be omitted. Further, in FIG. 17 to FIG. 24, the same components as those in the embodiment described above are denoted by the same reference numerals.

  The sensor device 1 illustrated in FIG. 17 is an angular velocity sensor device capable of detecting angular velocities ωx, ωy, and ωz about the X axis, the Y axis, and the Z axis. Such a sensor device 1 mainly includes a support substrate assembly in which three support substrates (first, second, and third support substrates 29, 39, 49) cross each other at approximately 90 °. 10 and three angular velocity sensor components (first, second, and third sensor components 21, 31, 41) mounted on the support substrate assembly 10. Hereinafter, the configuration of the sensor device 1 will be described in detail.

  The sensor device 1 includes a first sensor unit 2 that detects an angular velocity ωx around the X axis, a second sensor unit 3 that detects an angular velocity ωy around the Y axis, and a third sensor unit that detects an angular velocity ωz around the Z axis 4 and.

  The first sensor unit 2 has a first sensor component 21 for detecting an angular velocity ωx, and a first support substrate 29. The first sensor unit 2 has a first component mounting surface 291 which is one main surface of the first support substrate 29 1 sensor part 21 is mounted. Similarly, the second sensor unit 3 includes a second sensor component 31 for detecting an angular velocity ωy and a second support substrate 39, and is a second component mounting surface which is one main surface of the second support substrate 39. The second sensor component 31 is mounted at 391. Similarly, the third sensor unit 4 includes a third sensor component 41 that detects an angular velocity ωz, and a third support substrate 49, and is a third component mounting surface that is one main surface of the third support substrate 49. The third sensor component 41 is mounted at 491.

«First, second and third sensor parts»
The first, second, and third sensor components 21, 31, and 41 are not particularly limited as long as they can detect an angular velocity, and, for example, the configuration described in the first embodiment described above (FIGS. 4).

<< First, Second, and Third Support Substrates 29, 39, 49 >>
The first, second, and third support substrates 29, 39, and 49 are not particularly limited, and, for example, glass epoxy substrates can be used.

  As shown in FIG. 18, the first support substrate 29 has a plate shape having a substantially rectangular shape in a plan view, and has four sides 29a, 29b, 29c, and 29d forming an outer shape in a plan view. ing. Among the sides, sides 29a and 29b constitute short sides, respectively, and are disposed to face each other, and sides 29c, 29d each constitute long sides and are disposed to face each other. The first support substrate 29 also has a recess (first engaging portion) 293 recessed from the side 29 b and a recess (third engaging portion) 295 recessed from the side 29 d.

  In addition, although the 1st support substrate 29 of this embodiment has the convex part 294 which protrudes from edge | side 29a, since this convex part 294 made the 1st, 2nd sensor part 2 and 3 the same structure It is formed and may be omitted.

  Further, the first support substrate 29 is provided with a wiring group 28 electrically connected to the first sensor component 21. The wiring group 28 includes a ground wiring 281, digital signal wirings 282 to 285, and power supply signal wirings 286 and 287, as in the first embodiment described above. The wires 281 to 287 have terminals 281 a to 287 a, and the terminals 281 a to 287 a are disposed along the side 29 d on the first component mounting surface 291. Also, the ground wiring 281 is arranged so as to be aligned with the terminal 381 b of the second support substrate 39 when engaged with the terminal 281 b arranged along the side 29 a and the second support substrate 39. And a terminal 281 d located at

  Next, although the second support substrate 39 will be described, the second support substrate 39 has the same configuration as the first support substrate 29 including the shape (including the size) and the material. That is, as shown in FIG. 18, the second support substrate 39 has a plate shape having a substantially rectangular shape in a plan view, and in a plan view, four sides 39a, 39b, 39c, and 39d forming an outer shape. Have. Further, the second support substrate 39 has a convex portion (second engaging portion) 394 protruding from the side 39 a and a concave portion (fifth engaging portion) 395 recessed from the side 39 d.

  Although the second support substrate 39 of the present embodiment has a recess 393 recessed from the side 39 b, the recess 393 is formed because the first and second sensor portions 2 and 3 have the same configuration. It may be omitted.

  In addition, a wiring group 38 electrically connected to the second sensor component 31 is provided on the second support substrate 39. The wiring group 38 includes a ground wiring 381, digital signal wirings 382 to 385, and power supply signal wirings 386 and 387, as in the first embodiment described above. In addition, one ends of the wires 381 to 387 are terminals 381a to 387a, and the terminals 381a to 387a are arranged along the side 39d on the second component mounting surface 391. The ground wiring 381 further includes a terminal 381 b and a terminal 381 d disposed along the side 39 a.

  Next, the third support substrate 49 will be described. As shown in FIG. 18, the third support substrate 49 has a substantially rectangular plate shape in plan view, and has four sides 49a, 49b, 49c, 49d forming an outer shape in plan view. ing. Among the sides, sides 49a and 49b constitute short sides, respectively, and are disposed to face each other, and sides 49c, 49d each constitute long sides and are disposed to face each other. Further, the third support substrate 49 is provided with a convex portion (fourth engagement portion) 494 formed by being sandwiched by a pair of concave portions 493 recessed from the side 49c, and a pair of concave portions 495 concaved from the side 49b. And a convex portion (sixth engaging portion) 496 formed by being sandwiched between the two. In the present embodiment, the recess 493 on the side 49b of the pair of recesses 493 and the recess 495 on the side 49c of the pair of recesses 495 are connected, and the corner of the third support substrate 49 is It has a shape like a defect.

  Further, the third support substrate 49 is provided with a wiring group 48 electrically connected to the third sensor component 41. Wiring group 48 includes ground wiring 481 for ground GND, digital signal wiring 482 for slave select signal SS, and digital signal wiring 483 for data input signal MOSI, similarly to first and second support substrates 29 and 39. Digital signal wiring 484 for the clock signal SCLK, digital signal wiring 485 for the data output signal MISO, power signal wiring 486 for the power supply VDDI of the interface unit 441, and power supply for the power supply VDDM of the drive / detection circuit 442 And a signal wiring 487.

  The wires 481 to 487 are electrically connected to a connector 47 having one end portion provided on the back surface 492 and the other end branched into terminals 481 a to 487 a and terminals 481 b to 487 b. The terminals 481 a to 487 a are disposed on the third component mounting surface 491 along the side 49 c and between the pair of concave portions 493. The terminals 481 b to 487 b are disposed on the third component mounting surface 491 along the side 49 b and between the pair of concave portions 495.

  The first, second, and third support substrates 29, 39, 49 have been described above. As shown in FIG. 19, the first, second, and third support substrates 29, 39, 49 have a virtual plane F 1 including the first component mounting surface 291 and a virtual plane F 2 including the second component mounting surface 391. An imaginary plane F3 including the third component mounting surface 491 is assembled so as to intersect each other substantially at right angles (90 °). As a result, the detection axes Jx, Jy, and Jz of the first, second, and third sensor components 21, 31, and 41 are substantially orthogonal to each other.

  Further, in the assembled state, the first, second and third component mounting surfaces 291, 391 and 491 face the pocket space S1, respectively, and accordingly, the first, second and third sensor components 21, 31, 41 Is located in the pocket space S1.

  In the assembled state, the concave portion 293 of the first support substrate 29 and the convex portion 394 of the second support substrate 39 are engaged with each other, whereby the first and second support substrates 29 and 39 are positioned. . At the same time, the concave portion 295 of the first support substrate 29 and the convex portion 494 of the third support substrate 49 are engaged, whereby the first and third support substrates 29 and 49 are positioned. Furthermore, the concave portion 395 of the second support substrate 39 and the convex portion 496 of the third support substrate 49 are engaged with each other, whereby the second and third support substrates 39, 49 are positioned. Thus, the first, second, and third support substrates 29, 39, 49 are positioned more accurately by the first, second, and third support substrates 29, 39, 49 engaging with each other in a concavo-convex manner. ing.

  In the engagement of the first and third support substrates 29 and 49, as shown in FIG. 20A, the bottom surface 295a of the recess 295 is the main surface 494a of the protrusion 494. (To be precise, it is abutted against the terminals 481a to 487a) and, as shown in FIG. The main surface 296a) of the third support substrate 49 abuts on the bottom surface 493a of the recess 493 of the third support substrate 49. As described above, by applying two substantially orthogonal surfaces to each other, the first and third support substrates 29 and 49 can be positioned more accurately so as to be substantially orthogonal to each other.

Further, since the width W ₃₁ of the convex portion 494 is slightly larger than the width W _{11 of} the concave portion 295, and the convex portion 494 fits in the concave portion 295, the positioned posture can be maintained. It is supposed to be. Further, since the length L ₁₁ of the recess 295 is substantially equal to the thickness T ₃₁ of the protrusion 494 and the thickness T ₁₁ of the recess 295 is substantially equal to the length L ₃₁ of the protrusion 494, The projections 494 can be engaged more firmly, and the projections of the first and third support substrates 29 and 49 can be prevented at these engagement portions. However, the sizes (length, width, and thickness) of the concave portion 295 and the convex portion 494 are not particularly limited as long as they can be engaged with each other.

  At the connection portion of the first and third support substrates 29 and 49, corner portions 103 located in the pocket space S1 are formed, and at the corner portions 103, the terminals 281a to 287a and the terminals 481a to 487a are arranged. It has been placed in the Furthermore, solders H 11 to H 17 are provided at the corner portion 103 so as to extend across the first support substrate 29 and the third support substrate 49. The first supporting substrate 29 and the third supporting substrate 49 are fixed (bonded) by the solders H11 to H17, and the terminals 281a to 287a and the terminals 481a to 487a are electrically connected.

  Next, in the engagement of the second and third support substrates 39, 49, as shown in FIG. And the second component mounting surface 391 of the second support substrate 39 (the main surfaces 396a of the protrusions 396 located on both sides of the recess 395) of the second support substrate 39 as shown in FIG. 21 (b). It abuts on the bottom surface 495 a of the recess 495 of the substrate 49. As described above, by applying two substantially orthogonal surfaces to each other, the second and third support substrates 39 and 49 can be positioned more accurately so as to be substantially orthogonal to each other.

Further, since the width W ₃₂ of the convex portion 496 is slightly larger than the width W _{21 of} the concave portion 395 and the convex portion 496 fits into the concave portion 395, the positioned posture can be maintained. It is supposed to be. Further, since the length L ₂₁ of the recess 395 is approximately equal to the thickness T ₃₂ of the protrusion 496 and the thickness T ₂₁ of the recess 395 is approximately equal to the length L ₃₂ of the protrusion 496, While being able to engage with convex part 496 more firmly, a projection of the 2nd and 3rd support boards 39 and 49 in an engaging part can be prevented. However, the sizes of the concave portion 395 and the convex portion 496 are not particularly limited as long as they can be engaged with each other.

  A corner portion 104 located in the pocket space S1 is formed at the connection portion of the second and third support substrates 39 and 49, and at this corner portion 104, the terminals 381a to 387a and the terminals 481b to 487b are arranged. It has been placed in the Furthermore, solders H 21 to H 27 are provided at the corner portion 104 so as to extend across the second support substrate 39 and the third support substrate 49. The second support substrate 39 and the third support substrate 49 are fixed (joined) by the solders H21 to H27, and the terminals 381a to 387a and the terminals 481b to 487b are electrically connected.

  Next, in the engagement of the first and second support substrates 29 and 39, as shown in FIG. 22, the end face 399 on which the convex portion 394 of the second support substrate 39 is formed is the first of the first support substrate 29. The main surface 394 a of the convex portion 394 abuts on the bottom surface 293 a of the concave portion 293 while abutting on the component mounting surface 291. As described above, by applying two surfaces substantially orthogonal to each other, the first and second support substrates 29 and 39 can be positioned more accurately so as to be substantially orthogonal to each other.

Further, since the width W ₂₂ of the convex portion 394 is slightly larger than the width W _{12 of} the concave portion 293 and the convex portion 394 is fitted to the concave portion 293, the positioned posture can be maintained. It is supposed to be. Further, since the length _{L 12} of the recess 293 is substantially equal to the thickness _{T 22} of the convex portion 394, the thickness _{T 12} of the recess 293 is substantially equal to the length _{L 22} of the convex portion 394, the recess 293 and the convex While being able to engage more firmly with the part 394, the protrusion of the 1st, 2nd support substrates 29 and 39 in an engaging part can be prevented. However, the sizes of the concave portion 293 and the convex portion 394 are not particularly limited as long as they can be engaged with each other.

  A corner portion 105 positioned in the pocket space S1 is formed at the connection portion of the first and second support substrates 29 and 39, and in this corner portion 105, the terminal 281d and the terminal 381b are arranged side by side. It is in the state. Further, solder H 31 is provided at the corner portion 105 so as to straddle the first support substrate 29 and the second support substrate 39. The first support substrate 29 and the second support substrate 39 are fixed (joined) by the solder H31, and the terminal 281d and the terminal 381b are electrically connected.

Next, the circuit configuration of the sensor device 1 will be described.
As shown in FIG. 23, in the sensor device 1, GND, SS, MOSI, SCLK, MISO, VDDI and VDDM are shared by the first, second, and third sensor components 21, 31, 41, and the host device 100. Are commonly connected to the GND, SS, MOSI, SCLK, MISO, VDDI and VDDM signal lines. The electrical connection between the host device 100 and the sensor device 1 can be made via the connector 47 on the third support substrate 49.

  The interface unit 241 included in the first sensor component 21, the interface unit 341 included in the second sensor component 31, and the interface unit 441 included in the third sensor component 41 respectively have the clock signal SCLK and the data input signal MOSI. Communication is performed with the host device 100 using, for example, the SPI communication method using the data output signal MISO.

  Further, the storage unit 243 included in the first sensor component 21 stores information on the data transmission order of its own IC chip 24, and the storage unit 343 included in the second sensor component 31 is an IC of its own. The information on the data transmission order of the chip 34, the individual address and the like are stored, and the storage unit 443 included in the third sensor component 41 stores information on the data transmission order of its own IC chip 24.

  For example, when the host device 100 issues a read command by designating a common address with the IC chips 24, 34, 44 as a common destination, the IC chips 24, 34, 44 are stored in the storage units 243, 343, 443. The detection data is transmitted to the host device 100 in accordance with the data transmission order. For example, when the data transmission order of the IC chip 24 is 1st, the data transmission order of the IC chip 34 is 2nd, and the data transmission order of the IC chip 44 is 3rd, the IC chip 24 sends the host device 100 first. The detection data is transmitted, the IC chip 34 transmits the detection data to the host device 100, and the IC chip 44 then transmits the detection data to the host device 100.

  On the other hand, when the host device 100 issues a read command by designating an individual address (slave address), the IC chips 24, 34, 44 indicate that the individual address designated by the host device 100 matches the individual address of itself. , Transmit detection data to the host device 100. That is, for example, when the host device 100 designates the IC chip 24 and issues a read command, the IC chip 24 transmits detection data to the host device 100, but the IC chips 34 and 44 transmit the detection data to the host device 100. Do not send detection data to

  The sensor device 1 has been described above. Such a sensor device 1 can be disposed on the object A as shown in FIG. 24, for example. As described above, since the first, second, and third sensor components 21, 31, 41 and the solders H11 to H17, H21 to H27 are disposed in the pocket space S1, the object A is outside the pocket space S1. By arranging the sensor device 1 on the object A, the sensor device 1 can be easily arranged on the object A. Also, by connecting the connector of the object to the connector 47, mechanical connection and electrical connection can be performed collectively.

Fifth Embodiment
FIG. 25 is a perspective view of a sensor device according to a fifth embodiment of the present invention. FIG. 26 is a development view of the sensor device shown in FIG. FIG. 27 is a plan view of the sensor device shown in FIG. FIG. 28 is a partial enlarged perspective view of the sensor device shown in FIG.

  The sensor device according to the present embodiment is mainly the same as the sensor device according to the first embodiment described above, except that the orientations of the first, second, and third support substrates are mainly different.

  In the following description, the sensor device of the fifth embodiment will be described focusing on differences from the above-described embodiment, and the description of the same matters will be omitted. Further, in FIG. 25 to FIG. 28, the same reference numerals are given to the same configuration as the embodiment described above.

  In the sensor device 1 shown in FIG. 25, the first, second, and third sensor components 21, 31, 41 are respectively disposed outside the pocket space S1.

<< First, Second, and Third Support Substrates 29, 39, 49 >>
First, the first support substrate 29 will be described. As shown in FIG. 26, the first support substrate 29 has a concave portion (first engaging portion) 293 recessed from the side 29b and a convex portion (third engaging portion) 297 projecting from the side 29d. doing. In the first support substrate 29, the terminals 281 a to 287 a are disposed on the back surface 292 along the side 29 d (the top side of the convex portion 297).

  Next, the second support substrate 39 will be described. As shown in FIG. 26, the second support substrate 39 has a convex portion (second engaging portion) 394 protruding from the side 39a and a convex portion (fifth engaging portion) 397 protruding from the side 39d. doing. In the second support substrate 39, the terminals 381a to 387a are arranged on the back surface 292 along the side 39d (the top side of the convex portion 397).

  Next, the third support substrate 49 will be described. As shown in FIG. 26, the third support substrate 49 has a recess (fourth engagement portion) 498 recessed from the side 49c and a recess (sixth engagement portion) 499 recessed from the side 49b. doing. Further, in the third support substrate 49, the terminals 481a to 487a are disposed along the side 49c (the base of the recess 498) on the third component mounting surface 491, and the terminals 481b to 487b are disposed on the third component mounting surface 491. The upper side is disposed along the side 49 b (the base of the recess 499). Furthermore, in the third support substrate 49, the connector 47 is disposed on the third component mounting surface 491.

  In a state where these first, second and third support substrates 29, 39 and 49 are assembled, as shown in FIG. 27, the first, second and third component mounting surfaces 291, 391 and 491 are respectively pocket spaces S1. Facing the outside of the Therefore, the first, second, and third sensor components 21, 31, 41 are located outside the pocket space S1.

  In the assembled state, the concave portion 293 of the first support substrate 29 and the convex portion 394 of the second support substrate 39 are engaged with each other, whereby the first and second support substrates 29 and 39 are positioned. . At the same time, the convex portion 297 of the first support substrate 29 and the recess 498 of the third support substrate 49 are engaged, whereby the first and third support substrates 29 and 49 are positioned. Furthermore, the convex portion 397 of the second support substrate 39 and the recess 499 of the third support substrate 49 are engaged with each other, whereby the second and third support substrates 39, 49 are positioned. Thus, the first, second, and third support substrates 29, 39, 49 are positioned more accurately by the first, second, and third support substrates 29, 39, 49 engaging with each other in a concavo-convex manner. ing.

  Further, to describe the connecting portions of the first and third support substrates 29 and 49 in detail, as shown in FIG. 28, the length of the convex portion 297 is longer than the thickness of the third support substrate 49. Therefore, in a state in which the first and third support substrates 29 and 49 are engaged, the convex portion 297 protrudes from the third component mounting surface 491, and the corner portion 106 is formed by the third component mounting surface 491 and the convex portion 297. There is. The terminals 281a to 287a and the terminals 481a to 487a are arranged side by side at the corner portion 106. Furthermore, solders H11 to H17 are provided in the corner portion 106 so as to extend across the first support substrate 29 and the third support substrate 49. The first supporting substrate 29 and the third supporting substrate 49 are fixed (joined) by the solders H11 to H17, and the terminals 281a to 287a and the terminals 481a to 487a are electrically connected.

  Next, the connection portions of the second and third support substrates 39 and 49 will be described in detail. As shown in FIG. 28, the length of the convex portion 397 is longer than the thickness of the third support substrate 49. Therefore, in a state where the second and third support substrates 39 and 49 are engaged, the convex portion 397 protrudes from the third component mounting surface 491, and the corner portion 107 is formed by the third component mounting surface 491 and the convex portion 397. There is. The terminals 381a to 387a and the terminals 481b to 487b are arranged side by side at the corner portion 107. Furthermore, solders H 21 to H 27 are provided at the corner portion 107 so as to extend across the second support substrate 39 and the third support substrate 49. The second support substrate 39 and the third support substrate 49 are fixed (joined) by the solders H21 to H27, and the terminals 381a to 387a and the terminals 481b to 487b are electrically connected.

Further, although not shown, at the connection portion of the first and second support substrates 29 and 39, the terminal 281d and the terminal 381b are arranged side by side as in the fourth embodiment described above, and these are joined by the solder H31. ing.
The sensor device 1 has been described above.

  According to such a fifth embodiment, the same effect as that of the first embodiment described above can be exhibited.

(Electronics)
Next, the electronic device of the present invention will be described.

  FIG. 29 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic device of the present invention is applied.

  In this figure, the personal computer 1100 comprises a main unit 1104 having a keyboard 1102 and a display unit 1106 having a display unit 1108. The display unit 1106 is rotated relative to the main unit 1104 via a hinge structure. It is supported movably. Such a personal computer 1100 is equipped with a sensor device 1 for measuring its drop and inclination. As described above, by mounting the above-described sensor device 1, a highly reliable personal computer 1100 can be obtained.

  FIG. 30 is a perspective view showing the configuration of a mobile phone (including PHS) to which the electronic device of the present invention is applied.

  In this figure, the cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation button 1202 and the earpiece 1204. Such a mobile phone 1200 is equipped with a sensor device 1 for measuring its drop and tilt. As described above, by mounting the above-described sensor device 1, it is possible to obtain the highly reliable mobile phone 1200.

  FIG. 31 is a perspective view showing the configuration of a digital still camera to which the electronic device of the present invention is applied. Note that in this figure, the connection to an external device is also shown in a simplified manner.

  The digital still camera 1300 photoelectrically converts an optical image of a subject with an imaging device such as a CCD (Charge Coupled Device) to generate an imaging signal (image signal). A display unit 1310 is provided on the back of the case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal by a CCD, and the display unit is a finder that displays an object as an electronic image Act as. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the rear side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit and depresses the shutter button 1306, the imaging signal of the CCD at that time is transferred and stored in the memory 1308. In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side of the case 1302. As shown, a television monitor 1430 is connected to the video signal output terminal 1312, and a personal computer 1440 is connected to the data communication input / output terminal 1314 as necessary. Furthermore, the imaging signal stored in the memory 1308 is configured to be output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital still camera 1300 is equipped with a sensor device 1 for measuring its drop and inclination, and this sensor device 1 can be used for image stabilization. As described above, by mounting the above-described sensor device 1, it is possible to obtain the digital still camera 1300 with high reliability.

  In addition to the personal computer shown in FIG. 29, the mobile phone shown in FIG. 30, and the digital still camera shown in FIG. 31, the electronic device of the present invention is, for example, a smartphone, an inkjet type ejection device (eg, an inkjet printer), a television, and a video camera. , Video tape recorders, car navigation devices, pagers, electronic organizers (including communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, video phones, television monitors for crime prevention, electronic binoculars, POS terminals, medical Equipment (for example, electronic thermometer, sphygmomanometer, blood glucose meter, electrocardiogram measurement device, ultrasound diagnostic device, electronic endoscope), fish finder, various measuring devices, instruments (for example, instruments of vehicles, aircraft, ships), The present invention can be applied to electronic devices such as flight simulators.

(Mobile)
Next, the mobile unit of the present invention will be described.

FIG. 32 is a perspective view showing an automobile to which the mobile unit of the present invention is applied.
The sensor device 1 is incorporated in the automobile 1500, and the attitude of the vehicle body 1501 can be detected by the sensor device 1, for example. The detection signal of the sensor device 1 is supplied to the vehicle body posture control device 1502, and the vehicle body posture control device 1502 detects the posture of the vehicle body 1501 based on the signal, and controls the hardness of the suspension according to the detection result. The brakes of the individual wheels 1503 can be controlled. In addition, the sensor device 1 is also keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), air bag, tire pressure monitoring system (TPMS: Tire Pressure Monitoring System), engine It can be widely applied to electronic control units (ECUs) such as control and battery monitors of hybrid vehicles and electric vehicles.

  As mentioned above, although the sensor device of the present invention, a support substrate assembly, electronic equipment, and a mobile were explained based on an embodiment of illustration, the present invention is not limited to this, and composition of each part has the same function. Can be replaced by any configuration having In addition, any other component may be added to the present invention. The present invention may be a combination of any two or more configurations (features) of the above-described embodiments.

  In the above-described embodiment, the first, second, and third sensor units included in the sensor device detect the angular velocity. However, the physical quantity to be detected is not limited to the angular velocity, and may be acceleration. Good. That is, for example, at least one of the first, second and third sensor components may be an acceleration sensor. In addition, the first, second and third sensor components are components for detecting angular velocity, and at least one sensor component for detecting acceleration is mounted on at least one of the first, second and third support substrates. You may This provides a composite sensor capable of detecting angular velocity and acceleration.

  In the first to third embodiments described above, the first support substrate is provided with the concave portion, the second support substrate is provided with the convex portion, and these are engaged with each other. A configuration may be adopted in which a convex portion is provided on the substrate, a concave portion is provided on the second support substrate, and these are engaged. Similarly, in the engagement of the first and second support substrates and the third support substrate in the fourth embodiment, the positions of the convex portions and the concave portions may be reversed. Further, in the embodiment described above, the configuration in which the detection axes Jx, Jy and (Jz) are orthogonal is described, but the respective axes may not be orthogonal as long as they intersect.

  In the embodiment described above, the recess of the first support substrate is open at the end face, but the recess may not be open at the end face. That is, it may be a through hole penetrating in the thickness direction of the first support substrate. Also, the through hole may not penetrate the first support substrate, and may have a bottom.

  In the first to third embodiments described above, engagement of the first and second support substrates separately from the first and second sensor components in order to engage the first sensor unit and the second sensor unit Although the structure using the joint portion has been described, the first and second sensor components may be provided with the engaging portion in the package without using the first and second support substrates. That is, the first sensor unit and the second sensor unit are engaged by the engaging unit formed on the package of the first and second sensor components without using the first and second support substrates on which the engaging unit is formed. You may agree. Similarly for the engagement between the first and second sensor parts and the third sensor part in the fourth embodiment, without using the engaging parts of the first to third support substrates, as the first to third sensor parts. What provided the engaging part in the package of the 1st-3rd sensor components may be used.

In the first to third embodiments described above, the interface unit provided in the first sensor component and the interface unit provided in the second sensor component each communicate with the host device by the SPI communication method. Although the configuration has been described, communication with the host device may be performed using an I ² C (Inter-Integrated Circuit (registered trademark)) communication method instead of the SPI. Similarly, in the fourth embodiment, the interface unit provided in the first sensor component, the interface unit provided in the second sensor component, and the interface unit provided in the third sensor component each have I ² C communication Communication with the host device may be performed according to a scheme.

DESCRIPTION OF SYMBOLS 1 ...... Sensor device 10 ...... Support substrate assembly 101, 102, 103, 104, 105, 106, 107 ...... Corner part 2 ...... 1st sensor part 21 ...... 1st sensor component 22 ...... Package 23, 33 43: angular velocity sensor element 231: base 232a: first detection arm 232b: second detection arm 233a: first connecting arm 233b: second connecting arm 234a: first driving arm 234b: first 2 Drive arm 234c ··· Third drive arm 234 d · · · Fourth drive arm 24 ··· IC chip 241 ··· Interface section 242 ··· Drive / detection circuit 243 ··· Storage section 25 ··· Base substrate 251 ··························· ... Externally mounted terminal 26 ... Lid 27 ... Support substrate 271 ... Base 272 to 277 ... Bonding lead 28 ... Wiring group 281 ... Ground Wirings 282 to 285: digital signal wiring 286, 287: power signal wiring 281a to 287a, 281b to 287b, 281d: terminals 281c to 287c: test terminal 29: first support substrate 29a, 29b, 29c, 29d ...... Side 291 ... 1st component mounting surface 292 ... back surface 293 ... recessed section 293a ... bottom surface 294 ... convex section 295 ... recessed section 295 a ... bottom surface 296 ... projecting section 296a ... main surface 297 ... convex Section 3 ... 2nd sensor section 31 ... 2nd sensor part 34 ... IC chip 341 ... Interface section 342 ... Drive / detection circuit 343 ... Storage section 38 ... Wiring group 381 ... Ground wiring 382-385 ...... Digital signal wiring 386, 387 ...... Power signal wiring 381a to 387a, 381b to 387b, 381d ... terminals 381c to 387c ... test terminals 39 ... second support substrate 39a, 39b, 39c, 39d ... side 391 ... second component mounting surface 392 ... back surface 393 ... recess 394 ... projection 394a ... Main surface 395 ...... Concave portion 395a ...... Bottom surface 396 ...... Protrusion portion 396a ...... Main surface 399 ............ End surface 4 第 Third sensor portion 41 第 Third sensor component 44 IC IC chip 441 ...... Interface portion 442 ... ... Drive / detection circuit 443 ... Memory section 47 ... Connector 48 ... Wiring group 481 ... Ground wiring 482-485 ... Digital signal wiring 486, 487 ... Power signal wiring 481a to 487a, 481b to 487b ... Terminal 49 ...... Third support substrate 49a 49b, 49c, 49d ...... Side 491 ... Third component mounting surface 492 ... Back surface 493 ... Recesses 493a ... Bottom surface 494 ... Convex part 494a ... Principal surface 495 ... Concave portion 495a ... Bottom surface 496 ... Convex part 496a ... Principal surface 498, 499 ... Concave portion 6 ... Connector 7 ... Flexible wiring board 100 ... host device 1100 ... personal computer 1102 ... keyboard 1104 ... main unit 1106 ... display unit 1108 ... display section 1200 ... mobile phone 1202 ... operation button 1204 ... earpiece 1206 ... mouthpiece 1208: Display 1300: digital still camera 1302: Case 1304: light receiving unit 1306: shutter button 1308: memory 1310: display 1312: video signal output terminal 1314: input / output terminal 1430 ...... TV monitor 1440 ... personal computer 1500 ... automobile 1501 ... vehicle body 1502 ... vehicle body posture control device 1503 ... wheel A ... object B ... anisotropic conductive adhesive F1, F2, F3 ... virtual plane H1 to H7, H11 ~ H17, H21-H27, H31 ... solder J, Jx, Jy, Jz ... detection axis L ₁ , L ₁₁ , L ₁₂ , L ₂ , L ₂₁ , L ₂₂ , L ₃₁ , L ₃₂ ... length T ₁ , T ₁₁ , T ₁₂ , T ₂ , T ₂₁ , T ₂₂ , T ₃₁ , T ₃₂ ... Thickness S ...... Internal space S 1 ...... Pocket space W ₁ , W ₁₁ , W ₁₂ , W ₂ , W _{21 , W 22, W 31, W} 32 ...... width ω, ωx, ωy, ωz ...... angular velocity GND ...... ground MOSI ...... data input signal MISO ...... data output signal SCLK ...... clock signal SS ...... slave Select signal VDDI ...... power supply VDDM ...... power

Claims (13)

A first sensor unit in which a first engagement unit is formed;
And a second sensor unit in which a second engagement unit is formed,
The detection axis of the first sensor unit and the detection axis of the second sensor unit intersect with each other, and the first engagement unit and the second engagement unit engage with each other.
The first sensor unit is
A first sensor component having the detection axis;
A first support substrate having a first component mounting surface on which the first engagement portion is formed and the first sensor component is disposed;
Have
The second sensor unit is
A second sensor component having the detection axis;
A second support substrate having a second component mounting surface on which the second engagement portion is formed and the second sensor component is disposed;
Have
A first virtual plane including the first component mounting surface intersects with a second virtual plane including the second component mounting surface,
Part between the first support substrate and the second support substrate is enclosed, has a pocket space which is open to the outside,
Wherein the first sensor component and the second sensor component are respectively disposed before and SL side surfaces defining the pocket space on the opposite side, it is not exposed to the surface on the side defining the pocket space Sensor device characterized by   The sensor device according to claim 1, wherein one of the first engagement portion and the second engagement portion includes a protrusion, and the other includes a recess that engages the protrusion. The first support substrate is electrically connected to the first sensor component and electrically connected to a power signal terminal to which a power supply voltage of the first sensor component is applied, and to the first sensor component, and is a digital signal. And a digital signal terminal to which
The power signal terminal and the digital signal terminal are disposed along one side forming the outer shape of the first support substrate,
The sensor device according to claim 1, wherein the first engaging portion includes a recess formed between the power signal terminal and the digital signal terminal in the first support substrate. The second support substrate is electrically connected to the second sensor component, and is electrically connected to a power signal terminal to which a power supply voltage of the second sensor component is applied, and to the second sensor component, and is a digital signal. And a digital signal terminal to which
The power signal terminal and the digital signal terminal are disposed along one side forming the outer shape of the second support substrate.
The sensor device according to claim 3, wherein the second engagement portion includes a convex portion protruding from a portion between the power signal terminal and the digital signal terminal in the second support substrate. And a bonding member for bonding the first support substrate and the second support substrate.
The said joining member is arrange | positioned at the surface on the opposite side to the surface which defines the said pocket space, It is not exposed to the surface which defines the said pocket space , It is described in any one of Claim 1 thru | or 4. Sensor device. The bonding member has conductivity.
Wiring is provided on each of the first support substrate and the second support substrate, and the wiring of the first support substrate and the wiring of the second support substrate are electrically connected through the bonding member. The sensor device according to claim 5. The first sensor unit and the second sensor unit respectively perform detection processing based on a sensor element and a signal from the sensor element, and output detection data, and communication with a host device that is a master. An interface unit to perform, and a storage unit that stores information of its own data transmission order;
When the host device issues a read command by designating a common address having the first sensor unit and the second sensor unit as common destinations, the interface unit transmits the read command to the host device in the data transmission order. The sensor device according to any one of claims 1 to 6, which transmits detection data.   When the host device issues a read command by specifying an individual address, the interface unit transmits the detection data to the host device when the individual address matches the individual address of the host device. Sensor device described in. It further comprises a third sensor part in which a third engagement part is formed,
A fourth engagement portion is formed on the first sensor portion,
The detection axis of the first sensor portion, the detection axis of the second sensor portion, and the detection axis of the third sensor portion intersect with each other, and the first engagement portion and the second engagement portion are engaged with each other The sensor device according to any one of claims 1 to 8, wherein the third engaging portion and the fourth engaging portion are engaged with each other. A fifth engagement portion is formed on the third sensor portion,
A sixth engagement portion is formed on the second sensor portion,
The sensor device according to claim 9, wherein the fifth engagement portion and the sixth engagement portion are engaged with each other. The third sensor unit includes a third sensor component having the detection axis, and a third support substrate having a third component mounting surface on which the third engagement component is formed and the third sensor component is disposed. And have
The part of the pocket space, the first supporting substrate, surrounded by the second supporting substrate and the third supporting substrate,
The sensor device according to claim 9 or 10, wherein the third sensor component is disposed on the side opposite to the side defining the pocket space and is not exposed on the side defining the pocket space. .   An electronic device comprising the sensor device according to any one of claims 1 to 11.   A mobile body comprising the sensor device according to any one of claims 1 to 11.

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