JP2004170380A - Orthogonal triaxial acceleration measuring instrument - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To ensure the structure obtained by assembling two substrates orthogonally crossing each other without any auxiliary parts and also share an information processing circuit and/or a memory circuit among three acceleration sensors orthogonally crossing each other, in an orthogonal acceleration measuring instrument. <P>SOLUTION: A convex part for insertion is formed at an end of a substrate mounted with two orthogonal acceleration sensors and an information processing circuit/memory circuit of three acceleration sensors orthogonally crossing each other. A slit is formed in a substrate mounted with a third acceleration sensor. The convex part for insertion is pressed into the slit, thereby assembling the two substrates. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a three-axis orthogonal accelerometer.
[0002]
[Prior art]
In a conventional orthogonal triaxial acceleration measuring device, an acceleration sensor is fixed on a hybrid board and stored in an acceleration sensor housing, and three acceleration sensor housings are further fixed to a housing having surfaces perpendicular to each other. It has a very complicated structure such that a connection is made in a housing having a cavity and a lead wire is drawn out (see Japanese Patent Application Laid-Open No. 05-172842).
As an improvement of this complicated structure, there is known an orthogonal three-axis accelerometer in which a substrate on which an acceleration sensor is mounted is orthogonalized (see Japanese Patent Application Laid-Open No. 08-21732).
[0003]
[Patent Document 1]
JP 05-172842 A [Patent Document 2]
JP 08-21732 A
[Problems to be solved by the invention]
However, in the prior art, although an orthogonal three-axis accelerometer in which the board on which the acceleration sensor is mounted is orthogonal is disclosed, a specific method of assembling the board orthogonally and a common information processing circuit are described. There is no suggestion. The conventional orthogonal three-axis accelerometer has the disadvantage that the assembling structure is not simple, and furthermore, an information processing circuit and a memory circuit are required for three acceleration sensors.
The present invention remedies such disadvantages of the prior art. A first object of the present invention is to assemble two orthogonal substrates with a small number of components to reduce the number of components and the number of assembling steps. A second object is to provide an information processing circuit for three orthogonal acceleration sensors. A common object is to reduce the number of components and simplify the circuit by sharing a memory circuit and the like, and a third object is to reduce the outer shape of the orthogonal three-axis accelerometer.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, an orthogonal three-axis accelerometer according to the present invention is an orthogonal three-axis accelerometer side device in which three acceleration sensors are mounted orthogonally, and a first acceleration sensor and a second acceleration sensor Is mounted on the first substrate, the third acceleration sensor is mounted on the second substrate, and the information processing units of the first acceleration sensor, the second acceleration sensor, and the third acceleration sensor are disposed on the first substrate. I do. By adopting such a structure, the information processing circuit and the memory circuit conventionally used for each of the three acceleration sensors are combined into one to reduce the number of semiconductor chips used and to reduce the number of wiring circuits. A simplified orthogonal three-axis accelerometer side device can be used. Further, since the information processing circuit and the memory circuit are not mounted on the second substrate, the shape of the second substrate can be made smaller, thereby providing a thin orthogonal three-axis accelerometer.
[0005]
Further, according to the present invention, a first substrate terminal is disposed on a first substrate, a second substrate terminal is disposed on a second substrate, and the first substrate terminal and the second substrate terminal are connected by solder or a conductive adhesive. Good. With such a structure, the mechanical bonding strength can be increased simultaneously with the electrical bonding between the two substrates.
[0006]
Further, in the present invention, it is preferable that the external connection terminal and the battery are provided on the first substrate. With this configuration, the orthogonal three-axis acceleration measuring device can be made smaller and a stand-alone type.
[0007]
Further, the orthogonal triaxial acceleration measuring device of the present invention is an orthogonal triaxial acceleration measuring device in which three acceleration sensors are mounted orthogonally, and includes a first acceleration sensor, a second acceleration sensor, and a first substrate terminal. And a first substrate having an insertion protrusion, a third acceleration sensor, a second substrate terminal, a second substrate having a slit, and fitting the slit and the insertion protrusion to form a first substrate and a second substrate. It is characterized by an assembling structure for assembling substrates at substantially right angles. By adopting such a structure, it is not necessary to align the two substrates, and since there is no need for an auxiliary component for assembling the two substrates at a right angle, the number of components and the number of assembling steps can be reduced.
[0008]
Further, the present invention includes a first acceleration sensor, a second acceleration sensor, a first substrate terminal, a first substrate having a slit, a third acceleration sensor, a second substrate terminal, and a projection for insertion. It is characterized by an assembling structure in which the first substrate and the second substrate are assembled substantially at right angles by fitting the second substrate, the slit and the projection for insertion. By adopting such a structure, it is not necessary to align the two substrates, and since there is no need for an auxiliary component for assembling the two substrates at a right angle, the number of components and the number of assembling steps can be reduced.
[0009]
Further, it is preferable that the depth of the slit is 0.5 mm to 3 mm and smaller than the thickness of the projection for insertion. With such dimensions, the two substrates can be fixed more perpendicularly and more firmly.
[0010]
In addition, the first substrate and the second substrate may have a thickness of 0.5 mm to 3 mm, and the length of the insertion protrusion may be substantially the same as the thickness of the second substrate. With such dimensions, the projection for insertion does not protrude from the back surface of another substrate, and a thin orthogonal triaxial acceleration measuring device can be put to practical use.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Embodiments of the present invention will be described based on examples with reference to the drawings.
As shown in FIG. 1, the circuit board includes a first substrate 1 and a second substrate 2. The first substrate 1 includes a first acceleration sensor 3, a second acceleration sensor 4, a semiconductor integrated circuit 6, two insertion protrusions (7, 8), a first substrate terminal 11, and an external connection terminal 13. And a display / alarm circuit 14. The wiring between those elements is shown in FIG. The first acceleration sensor 3 and the second acceleration sensor 4 are responsible for XY biaxial acceleration detection, and are mounted on the board 1 so as to be orthogonal to each other. The direction in which the acceleration is detected is indicated by an arrow. As the acceleration sensor, a sensor formed on a silicon substrate by a micromachining technique may be used, and a semiconductor element may be formed monolithically on the silicon substrate.
[0012]
A signal output from the acceleration sensor corresponding to the acceleration is sent to the semiconductor integrated circuit 6. The semiconductor integrated circuit 6 is a SIP (System In Package) and includes an information processing circuit for acceleration signals and the like and a memory circuit. The combination of the information processing circuit and the memory circuit is an information processing unit, which is shown in one package. The information processing circuit is a macro processor, and the memory circuit is an EEPROM. Note that the semiconductor integrated circuit 6 may be divided into two or more packages.
[0013]
The first acceleration sensor 3 and the second acceleration sensor 4 are sampled in a time-division manner, the respective acceleration signals are sent to the semiconductor integrated circuit 6, subjected to arithmetic processing, and stored in the memory circuit. The acceleration data stored in the memory circuit is sent to the outside via the external connection terminal 13. The external connection terminal 13 is a connector for RS232C. The external connection terminal 13 serves as a communication antenna when wirelessly exchanging signals with an external device. As described above, the external connection terminal 13 may be configured to include not only the connector but also the communication antenna. Reference numeral 14 denotes a warning / display circuit of the orthogonal triaxial acceleration measuring device. The display / warning is performed using an LED, a buzzer, or the like. The display / warning circuit is optional and can be attached as necessary. ing.
[0014]
The second substrate 2 includes a third acceleration sensor 5, a second substrate terminal 12, and two slits (9, 10). The third acceleration sensor 5 is responsible for detecting Z-axis acceleration. The second substrate terminal 12 is connected to the first substrate terminal 11 by soldering, and the acceleration signal generated by the third acceleration sensor 5 is processed in the same manner as the first acceleration sensor 3 and the second acceleration sensor 4, and is stored in the memory. Stored in the circuit. Further, if there is room in the second substrate, a temperature sensor or the like may be mounted to expand other functions.
[0015]
The insertion protrusions (7, 8) of the first substrate 1 are press-fitted into the slits (9, 10) of the second substrate 2, and the first substrate 1 and the second substrate 2 are fixed substantially orthogonally. Is done. The insertion protrusion 7 is provided at one end of the first substrate 1, and the insertion protrusion 8 is provided at the other end of the first substrate 1. The insertion protrusion 7 and the insertion protrusion 8 have the same shape, and are arranged at symmetrical positions. The dimensions of the insertion protrusion 7 are 1.6 mm, the thickness is the same as the first substrate, the width 7a is 20 mm, and the length 7b is 3 mm. The dimensions of the projections 8 for insertion are the same as the dimensions of the projections 7 for insertion except for the sign.
[0016]
The slit 9 is provided at one end of the second substrate 2, and the slit 10 is provided at the other end of the second substrate 2. The dimensions of the slit 9 are 1.6 mm in depth, the same as the thickness of the second substrate 2, 1.6 mm in the width 9 b, the same as the thickness of the projection for insertion, and 20 mm in the length 9 a. The slit width 9b has a minus tolerance of 0.05 to 0.2 mm in order to secure the interference with the insertion convex portion 7.
[0017]
In addition, if it is difficult to make the dimensions of the projections 7 for insertion and the projections 8 for insertion difficult due to the circuit arrangement, the dimensions do not have to be the same. However, in order to enhance the reliability of the electrical connection with the second substrate terminal 12, it is preferable to dispose the first substrate terminal 11 at a position between the projection 7 for insertion and the projection 8 for insertion.
[0018]
Similarly, if it is difficult to make the dimensions of the slit 9 and the slit 10 the same due to the circuit arrangement, the dimensions need not be the same as long as the conditions for fitting with the insertion projection are satisfied. However, it is preferable to arrange the second substrate terminal 12 at a position between the slit 9 and the slit 10 in order to increase the reliability of the electrical connection with the first substrate terminal 11.
[0019]
FIG. 2 is a perspective view showing a state where the first substrate 1 and the second substrate 2 are assembled. The first substrate terminal 11 and the second substrate terminal 12 are connected by solder 15 and a state where soldering is partially performed is shown. Soldering increases the mechanical connection strength as well as the electrical connection. Although a power source is not shown, a battery terminal is provided on the first substrate 1 to arrange a battery. A conductive adhesive can be used instead of the solder. Further, when assembled, the adhesive strength can be further increased by applying an adhesive to or near the surface where the first substrate and the second substrate are in contact with each other.
[0020]
The first substrate terminal 11 and the second substrate terminal 12 are provided so as to be close to each other in a state where the first substrate 1 and the second substrate 2 are assembled. It is preferable to make contact with the surface of the substrate terminal. Further, it is preferable that a part of the second substrate terminal extends to a position connecting the two slits. This increases the amount of solder wraparound and improves reliability.
[0021]
FIG. 3 is a block diagram of main components constituting the orthogonal triaxial acceleration measuring device. Although the components are connected by solid lines, signals are exchanged in both directions. Although the semiconductor integrated circuit 6 is shown as a single unit, a part corresponding to the information processing circuit and a part corresponding to the memory for storing acceleration data may be provided in different packages.
[0022]
FIG. 4 shows a state in which the same first substrate and second substrate as in FIG. 2 are assembled, but the first substrate is provided with a slit, the second substrate is provided with an insertion projection, and the insertion projection is formed. The length is made the same as the thickness of the first substrate, so that the tip of the projection for insertion does not protrude to the back side of the first substrate. With such a structure, the device can be made thinner and can be easily attached to the outer case.
[0023]
FIG. 5 shows an example of a rectangular hole instead of interrupting the shape of the slit from the side end. The number of slits may be one or more, and is appropriately selected according to the size and thickness of the substrate. The shape of the projection for insertion is rectangular to fit into the slit. The dimensions of the slits are the same as the dimensions of the projections for insertion and have a tolerance of 0.02 to 0.5 mm.
[0024]
In the present invention, the semiconductor integrated circuit 6 constituting the information processing circuit is composed of a plurality of semiconductor chips, is composed of one semiconductor chip, and is composed of three processing circuits corresponding to three acceleration sensors. , And three acceleration sensors are controlled in a time-division manner, and one processing circuit is included. As described above, a monolithic semiconductor element for processing the signal of the third acceleration sensor may be provided on the second substrate together with the sensor. Further, the information processing unit may process not only the processing and storage of the acceleration but also the processing of an alarm / display. Further, when a thermometer or a barometer is attached, part or all of the processing may be performed.
[0025]
In the present invention, the thickness of the substrate in the slit portion where the slit is provided is the same as the thickness of the other portion of the substrate, but need not be the same as the thickness of the substrate. If the depth of the slit is small, it is difficult for the two substrates to go straight. When the substrate is thin, the thickness of the slit may be greater than that of the substrate. When the substrate is too thick, the insertion protrusion may be thinner. The thickness of the substrate in the slit portion is preferably 0.5 to 3 mm, more preferably 1.5 to 2.5 mm, in order to assemble the two substrates at right angles. Further, the thickness of the first substrate and the second substrate is preferably 0.5 to 3 mm, more preferably 1 to 2 mm.
[0026]
The orthogonal three-axis accelerometer according to the present invention is completed by attaching an exterior to an assembly of two substrates. Since the orthogonal three-axis acceleration measuring device can be made small in size and low in cost, it can be used as an acceleration detector by attaching it to a package being transported. When the transportation of the package is completed, the orthogonal three-axis acceleration measuring device is detached and connected to an external device via an external connection terminal, so that the acceleration during transportation can be read in time series. Then, the used orthogonal triaxial acceleration measuring device resets the memory circuit and reuses it.
[0027]
【The invention's effect】
With such a configuration, the two substrates can be assembled without auxiliary parts, and furthermore, the information processing / storage circuit, the communication terminal, and the like are concentrated on the first substrate, and only the sensor is disposed on the second substrate. , And could be made thinner.
[Brief description of the drawings]
FIG. 1 is an example of a substrate showing an embodiment of the present invention.
FIG. 2 is an assembled perspective view of the substrate shown in FIG. 1;
FIG. 3 is a block diagram of main components of the present invention.
FIG. 4 is a view showing another shape of the insertion projection.
FIG. 5 is a view showing another shape of the slit.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 1st board | substrate 2 2nd board | substrate 3 1st acceleration sensor 4 2nd acceleration sensor 5 3rd acceleration sensor 6 Semiconductor integrated circuit 7, 8 Insertion convex part 7a, 8a Insertion convex part width 7b, 8b Insertion convex part length 9, 10 Slit 9a, 10a Slit length 9b, 10b Slit width 11 First substrate terminal 12 Second substrate terminal 13 External connection terminal 14 Warning / display circuit 15 Solder

Claims (7)

In a three-axis accelerometer side device in which three acceleration sensors are mounted orthogonally, a first acceleration sensor and a second acceleration sensor are mounted on a first substrate, and a third acceleration sensor is mounted on a second substrate. An orthogonal three-axis acceleration measuring device, wherein information processing units of a first acceleration sensor, the second acceleration sensor, and the third acceleration sensor are provided on the first substrate. A first substrate terminal is disposed on the first substrate, a second substrate terminal is disposed on the second substrate, and the first substrate terminal and the second substrate terminal are connected by solder or a conductive adhesive. 3. The orthogonal three-axis acceleration measuring device according to claim 1, wherein: The orthogonal three-axis acceleration measuring device according to claim 1, wherein an external connection terminal and a battery are provided on the first substrate. An orthogonal three-axis accelerometer side unit in which three acceleration sensors are mounted orthogonally, a first substrate having a first acceleration sensor, a second acceleration sensor, a first substrate terminal, an insertion protrusion, and a third acceleration sensor A second substrate having a slit, a second substrate terminal, and a slit; and an assembling structure for assembling the first substrate and the second substrate at a substantially right angle by fitting the slit and the projection for insertion. Triaxial accelerometer. In the orthogonal triaxial accelerometer side device in which three acceleration sensors are mounted orthogonally, a first substrate having a first acceleration sensor, a second acceleration sensor, a first substrate terminal, a slit, a third acceleration sensor, and a second acceleration sensor are provided. An orthogonal structure characterized by an assembling structure for assembling the first substrate and the second substrate at a substantially right angle by fitting the substrate and a second substrate having an insertion projection, the slit and the insertion projection to fit each other. Triaxial accelerometer. The orthogonal three-axis accelerometer according to claim 4 or 5, wherein the depth of the slit is set to 0.5 mm to 3 mm and smaller than the thickness of the insertion projection. The thickness of the said 1st board | substrate and the said 2nd board | substrate was 0.5 mm-3 mm, The length of the said convex part for insertion was made substantially the same as the said thickness, The Claims 4 or 5 characterized by the above-mentioned. Orthogonal triaxial accelerometer.

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