JP4389263B2 - Manufacturing method of semiconductor light emitting device - Google Patents

Description

  The present invention relates to a method for manufacturing a light-emitting device, particularly a semiconductor light-emitting device capable of emitting light with high luminance by flowing a relatively large current.

  In recent years, there has been an increasing demand for higher brightness of semiconductor light-emitting devices, but in order to increase the brightness of semiconductor light-emitting devices, a large current flows through the semiconductor light-emitting elements, so a package structure with excellent heat dissipation is required. It is necessary to have.

  As a conventional semiconductor light emitting device, for example, Patent Document 1 below discloses an insulating substrate in which an island wiring conductor (die pad) and a terminal wiring conductor (bonding pad) are individually formed on one main surface, and an island wiring conductor. A semiconductor light-emitting element (light-emitting diode chip) fixed to the electrode, a lead wire (wire) for electrically connecting the electrode formed on the upper surface of the semiconductor light-emitting element and the terminal wiring conductor, and one main surface of the insulating substrate A semiconductor light emitting device is disclosed which includes a part of the island wiring conductor and the terminal wiring conductor, a semiconductor light emitting element, and a resin sealing body covering the lead thin wire.

  In this semiconductor light emitting device, since the semiconductor light emitting element is fixed on the island wiring conductor of the insulating substrate having low thermal conductivity, heat generated when the semiconductor light emitting element emits light cannot be efficiently released to the outside. There has been a problem that it is impossible to emit light with high luminance by passing a large current through the light emitting element. In order to solve this problem, the following Patent Document 2 fixes a semiconductor light emitting element (LED die) on a metal support plate (slag) excellent in heat dissipation and is electrically insulated from the support plate. A semiconductor light emitting device (LED: light emitting diode) is disclosed in which wiring conductors (metal leads) are arranged in a state, and a support plate, a semiconductor light emitting element, and a wiring conductor are integrally sealed with a resin enclosure. In this semiconductor light emitting device, heat generated during light emission of the semiconductor light emitting element can be efficiently emitted to the outside through the support plate, and the semiconductor light emitting element can emit light with high luminance.

Japanese Patent Laid-Open No. 11-340517 (page 10, FIG. 18) JP 2000-150967 A (page 5, FIG. 2)

  However, in the semiconductor light emitting device disclosed in Patent Document 2, a lead frame assembly in which a wiring conductor (metal lead) and a resin enclosure are integrally formed, and a metal support plate to which the semiconductor light emitting element is fixed. (Slag) is prepared, and the lead frame assembly and the support plate need to be arranged and integrated in a predetermined positional relationship, so that the number of parts is large and manufacturing is complicated.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a semiconductor light emitting device that can emit light with high luminance by flowing a relatively large current. It is another object of the present invention to provide a method for manufacturing a semiconductor light emitting device that has a small number of parts and is easy to manufacture.

The method of manufacturing a semiconductor light emitting device according to the present invention includes a recess (5) and an upper surface (8) provided with an annular groove (5a) surrounding the recess (5), and is directed outward from the bottom surface (6) and the bottom surface (6). Preparing a support plate (1) having a reflecting surface (7) that is enlarged in the recess (5), and preparing a mold (30) having a cavity (31) and an annular protrusion (36), and molding and the support plate on the top surface of the cavity (31) of the mold (30) the upper surface (8) of (1) is brought into contact, busy tool support plate a recess (5) of (1) at the top surface of the cavity (31) At the same time, the annular protrusion (36) of the mold (30) is fitted into the annular groove (5a) of the support plate (1), and the support plate (1) is disposed in the cavity (31) of the mold (30). And a step of injecting fluidized resin into the cavity (31) to form a resin between the upper surface (8) of the support plate (1) excluding the recess (5) and at least a pair of side surfaces (11, 12) facing each other. A step of covering with the sealing body (4) and a step of removing the support plate (1) from the mold (30). Since the support plate (1) having the light-reflective reflecting surface (7) can be integrally press-molded, it is not necessary to provide a separate reflecting member, and the number of parts can be reduced. Further, since the resin molding is performed while covering the concave portion (5) of the support plate (1) with the top surface of the cavity (31), it is possible to reliably prevent the resin from flowing into the concave portion (5). Further, since the resin sealing body (4) that integrally covers the support plate (1) and the leads (3, 17) can be formed by using the resin molding technique, the productivity of the light emitting diode device is improved. By fitting the annular groove (5a) and the annular protrusion (36), the resin can be prevented from flowing into the recess (5).

  It is possible to easily manufacture a high-luminance semiconductor light-emitting device that is optimal for a backlight light source and the like.

  An embodiment in which a method for manufacturing a semiconductor light emitting device according to the present invention is applied to a method for manufacturing a light emitting diode (LED) device will be described below with reference to FIGS.

  When manufacturing the light-emitting diode device of the present embodiment, first, a metal plate material having good heat dissipation and conductivity such as copper, aluminum, or an alloy thereof is prepared, and the support plate shown in FIG. (1) is formed, and the first lead (3) and the second lead (17) are separately press-molded. The support plate (1) has a concave portion (5) formed on the upper surface (8), and a first surface on the upper surface (8) and both side surfaces (14) of the support plate (1) spaced apart by sandwiching the concave portion (5). A groove (9), a second groove (16) parallel to the first groove (9), and a pin (18) protruding upward at a predetermined position in the second groove (16); (5) has a circular bottom surface (6) at the center and a reflecting surface (7) whose diameter increases from the bottom surface (6) to the outside in an inverted conical shape. The width and depth of the first groove (9) and the second groove (16) are set to a width and depth that allow the first lead (3) including the spacer (10) to be fitted.

  Next, after attaching an electrically insulating spacer (10) in the groove (9) formed in the upper surface (8) and both side surfaces (14) of the support plate (5), what is the support plate (1)? The first lead (3) is disposed in the groove of the spacer (10) having a groove-shaped cross section in an electrically insulated state, and is fixed in the first groove (9) of the support plate (1). When the spacer (10) is attached to the first groove (9), it is stuck using an adhesive or the spacer (10) is formed with a width slightly larger than that of the first groove (9). The spacer (10) may be press-fitted into the first groove (9) by fitting or tight fitting. A resin film covering the surface of the first lead (3) facing the first groove (9) is applied to the first lead (3) or the first groove (9), or a resin coating is applied. The spacer (10) may be formed by applying. Further, the pin (18) of the second groove (16) is inserted into the hole (20) drilled in the approximate center of the second lead (17), and the head (21) is crimped to expand the diameter. As a result, the second lead (17) is fixed in the second groove (16) formed at a position spaced to the right from the recess (5) of the support plate (1). In this case, the width and depth of the second groove (16) are set so that the head (21) of the pin (18) does not protrude upward from the second groove (16). Accordingly, as shown in FIG. 2, the first lead (3) electrically insulated from the support plate (1) and the second lead (3) electrically connected to the support plate (1) ( And a support plate assembly (25) provided with a recess (5) interposed therebetween.

  Next, the molding die (4) is molded using the molding die (30) as the molding die having the upper die (30a) and the lower die (30b) shown in FIG. The support plate assembly (25) is accommodated in the cavity (vacant space) (31) of 30). The upper die (30a) constituting the molding die (30) has a closing protrusion (32) protruding into the cavity (31) and having a shape complementary to the concave portion (5) of the support plate (1), and a closing A pressing protrusion (33) that is adjacent to the protrusion (32) and forms the wire bonding region (19) of the first lead (3) is provided. The lower mold (30b) constituting the molding die (30) has an enlarged recess (34) having a slightly larger width and depth than the support plate (1), and a support plate formed on the bottom surface of the enlarged recess (34). An engaging recess (35) that contacts the bottom surface (15) of (1) is provided. The bottom surface (15) of the support plate (1) is brought into contact with the engaging recess (35) of the lower die (30b) of the molding die (30) composed of the upper die (30a) and the lower die (30b). The plate assembly (25) is disposed in the enlarged recess (34) of the lower mold (30b). Further, the top surface of the cavity (31) is brought into contact with the upper surface (8) of the support plate (1), the recess (5) of the support plate (1) is covered with the top surface of the cavity (31), and the pressing protrusion ( The support plate (1) is placed in the cavity (31) of the mold (30) while 33) is in contact with the first lead (8). As a result, when the upper mold (30a) and the lower mold (30b) are closed, a cavity (vacant space) (31) that matches the outer shape of the resin sealing body (4) to be formed is formed in the mold (30). Formed.

  Then, a sealing resin such as epoxy resin, polyamide resin or polyimide resin fluidized into the cavity (31) of the molding die (30) through a runner and a gate (not shown) is injected, and the upper mold (30a) is cured after the resin is cured. Then, the lower die (30b) is released, and the support plate assembly (25) is taken out from the molding die (30). As a result, the upper surface of the recess (5) of the support plate (1) and the upper surface (8) of the support plate (1) excluding the wire bonding region (19) on the first lead (3) are paired with each other. A resin sealing body (4) that covers the side surfaces (11, 12) and both side surfaces (14) including the first lead (3) and the second lead (17) is formed. Since the resin sealing body (4) covers substantially the entire surface of the support plate (1) except the bottom surface, the resin sealant (4) is firmly fixed to the support plate (1), and the support plate (1) or the lead (3, 17 ) And an external electrical short-circuit accident can be prevented.

  After covering a part of the support plate assembly (25) with the resin sealing body (4), the light emitting diode chip (2) is placed on the bottom surface (6) of the recess (5) of the support plate (1) and soldered. It adheres with the adhesive material which has electroconductivity. Accordingly, the other electrode on the bottom surface side of the light emitting diode chip (2) is electrically connected to the support plate (1) via the conductive adhesive such as solder. Thereafter, a fine lead wire (13) made of metal such as gold is formed between one electrode on the upper surface side of the light emitting diode chip (2) and the wire bonding region (19) of the first lead (3) by a known wire bonding method. ) To electrically connect one electrode on the upper surface side of the light emitting diode chip (2) to the first lead (3) through the thin lead wire (13). Actually, the resin sealing body (4) including the concave portion (5) of the support plate (1) and the wire bonding region (19) on the first lead (3) has light transmittance such as methacryl and the like. By filling the resin having electrical insulation, the light emitting diode device of the present embodiment shown in FIGS. 5 to 8 is completed. The first lead (3) is electrically connected to a wiring pattern of a wiring board (not shown), and the second lead (17) is electrically connected to another wiring pattern (for example, a ground pattern) of the wiring board (not shown). be able to. As shown in FIG. 7, since the bottom surface (15) of the support plate (1) is not covered with the resin sealing body (4), the bottom surface (15) of the support plate (1) is not connected to another wiring pattern (not shown) of the wiring board. It is also possible to electrically connect to (for example, a ground pattern). Although not particularly illustrated, a lens can be formed on the opening surface (upper surface) of the recess (5).

  In the method of manufacturing the light-emitting diode device according to the present embodiment, the support plate (1) having the light-reflective reflecting surface (7) can be simultaneously press-molded integrally, so there is no need to provide a separate reflecting member and the number of parts can be reduced. Can be reduced. Further, the top surface of the cavity (31) of the mold (30) is brought into contact with the upper surface (8) of the support plate (1), and the concave portion (5) of the support plate (1) is made to be the top surface of the cavity (31). Since the support plate (1) is disposed in the cavity (31) of the mold (30) while being covered with, the inflow of the resin into the recess (5) can be reliably prevented. Since the lead (3) is disposed in the groove (9) formed in the upper surface (8) of the support plate (1), the height of the semiconductor light emitting device can be suppressed and the semiconductor light emitting device can be miniaturized. Further, since the resin sealing body (4) covers at least a pair of side surfaces (11, 12) facing the upper surface (8) of the support plate (1), the resin sealing body (4) and the support plate (1) The connection strength with is sufficiently high. In addition, since the resin sealing body (4) that integrally covers the support plate (1) and the leads (3, 17) can be formed by using the resin molding technique, the productivity of the light-emitting diode device is improved. Further, a closing projection (32) having a shape complementary to the recess (5) of the support plate (1) is mounted in the recess (5) of the support plate (1), so that one part of the support plate assembly (20). Since the portion is covered with the resin sealing body (4), the inflow of the resin into the recess (5) can be reliably prevented.

  The support plate (1) formed of metal has good heat dissipation, high mechanical strength, excellent light reflectivity, and good attachment to a metal lead frame. A reflective surface (7) having a predetermined surface roughness that reflects light from the semiconductor light emitting element (2) with low light loss can be simultaneously formed by press molding of the support plate (1). Since the semiconductor light emitting device (2) is fixed on the metal support plate (1), heat can be favorably released from the semiconductor light emitting device (2) through the support plate (1). For this reason, it is possible to cause the semiconductor light emitting element (2) to emit light with high luminance by flowing a relatively large current through the semiconductor light emitting element (2). Also, the light emitted from the semiconductor light emitting element (2) is reflected in a predetermined direction on the reflecting surface (7), so that the light generated from the semiconductor light emitting element (2) is directed in a certain direction, The brightness can be increased.

  Embodiments of the present invention are not limited to the above-described embodiments, and various modifications can be made. For example, as shown in FIG. 9, without forming the closing protrusion (32) on the upper mold (30a), an annular groove (5a) is formed on the support plate (1) around the inlet of the recess (5), An annular projection (36) that fits into the annular groove (5a) is formed on the upper mold (30a), and the annular groove (5a) and the annular projection (36) are fitted together into the recess (5). The inflow of resin may be prevented. Further, in the above-described embodiment, the recess (5) of the support plate (1) includes the circular bottom surface (6) and the reflection surface (7) whose diameter increases from the bottom surface (6) to the outside in an inverted conical shape. From a pyramid surface such as a triangular pyramid or a quadrangular pyramid that expands in a reverse pyramid shape from the bottom surface to the outside from the bottom surface, a rotating paraboloid, a spheroidal surface, a rotating hyperboloid, or a part of a spherical surface. A selected reflective surface may be provided. The shape of the bottom surface is not limited to a circle or a rectangle, and may be an ellipse, a triangle, or a polygon. Further, if unnecessary, the second groove (16) and the second lead (17) may be omitted. Further, in the above embodiment, the uncovered portion of the resin sealing body (4) in the vicinity of the recess (5) of the support plate (1) is rectangular, but a circular shape similar to the opening of the recess (5). Anyway. Further, an extrusion pin for releasing the support plate assembly (25) after resin sealing from the mold (30) may be provided on the upper mold (30a) or the lower mold (30b).

  The present invention is particularly effective when manufacturing a small, thin and high-luminance semiconductor light emitting device.

The perspective view of the support plate used for the manufacturing method of the semiconductor light-emitting device by this invention The perspective view which shows the support assembly which attached the lead to the support plate shown in FIG. Sectional drawing which shows the state which has arrange | positioned the support assembly of FIG. 2 in the cavity of a shaping | molding die Sectional drawing which shows the state which accommodates a support plate assembly in the cavity of a shaping | molding die, and forms a resin sealing body The perspective view of the light-emitting-diode apparatus manufactured by the manufacturing method of the semiconductor light-emitting device by this invention Plan view of FIG. Sectional drawing which follows the BB line of FIG. Sectional drawing which follows the AA line of FIG. Sectional drawing of the shaping | molding die which shows other embodiment of the manufacturing method by this invention

Explanation of symbols

  (1) ・ ・ Support plate, (2) ・ ・ Light-emitting diode chip (semiconductor light-emitting element), (3) ・ ・ First lead (4) ・ ・ Resin sealing body, (5) ・ ・Recess, (6,15) ・ ・ Bottom surface, (7) ・ ・ Reflective surface, (8) ・ ・ Top surface, (9) ・ ・ First groove, (10) ・ ・ Spacer, (11,12 , 14) ・ ・ Side, (13) ・ ・ Lead wire, (16) ・ ・ Second groove, (17) ・ ・ Second lead, (18) ・ Pin, (19) ・ Wire bonding area (25) ・ ・ Support plate assembly, (30) ・ ・ Molding die, (30a) ・ ・ Upper die, (30b) ・ ・ Lower die, (31) ・ Cavity, (32) ・ ・ Closed projection, (33) ・ ・ Pressing protrusion, (34) ・ ・ Enlarged recess, (35) ・ ・ Engaged recess,

Claims (2)

A mold having a recess and a support plate having an upper surface provided with an annular groove surrounding the recess and having a bottom surface and a reflecting surface that expands outward from the bottom surface, and having a cavity and an annular protrusion A process of preparing
Wherein the top surface of the support plate by abutment on the top surface of the mold cavity, the support plate top surface in busy Gutotomoni the recess of the cavity of the mold annular projection of the annular groove of the support plate Fitting and placing the support plate within the cavity of the mold ; and
Injecting the fluidized resin into the cavity, and covering the upper surface of the support plate excluding the recess with at least a pair of side surfaces facing each other with a resin sealing body,
Preparation of a semiconductor light-emitting device which comprises a step of taking out the support plate from said mold. The step of disposing the support plate in the cavity of the mold includes the step of mounting a protrusion protruding into the cavity of the mold and having a shape complementary to the recess of the support plate in the recess of the support plate. The manufacturing method of the semiconductor light-emitting device of Claim 1 containing.

Images