JP4432275B2 - Light source device - Google Patents

Light source device Download PDF

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Publication number
JP4432275B2
JP4432275B2 JP2001114502A JP2001114502A JP4432275B2 JP 4432275 B2 JP4432275 B2 JP 4432275B2 JP 2001114502 A JP2001114502 A JP 2001114502A JP 2001114502 A JP2001114502 A JP 2001114502A JP 4432275 B2 JP4432275 B2 JP 4432275B2
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JP
Japan
Prior art keywords
substrate
led chip
insulating member
light source
source device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001114502A
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Japanese (ja)
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JP2002094122A (en
Inventor
秀吉 木村
英二 塩浜
勝 杉本
拓磨 橋本
俊之 鈴木
和也 中川
充 小林
二郎 橋爪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Electric Works Co Ltd
Original Assignee
Panasonic Corp
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to JP2001114502A priority Critical patent/JP4432275B2/en
Application filed by Panasonic Corp, Matsushita Electric Works Ltd filed Critical Panasonic Corp
Priority to US10/398,660 priority patent/US6874910B2/en
Priority to EP01274117A priority patent/EP1387412B1/en
Priority to AT01274117T priority patent/ATE425556T1/en
Priority to DE60137972T priority patent/DE60137972D1/en
Priority to PCT/JP2001/010561 priority patent/WO2002084750A1/en
Priority to CNB018108806A priority patent/CN1212676C/en
Priority to TW090130969A priority patent/TW517402B/en
Publication of JP2002094122A publication Critical patent/JP2002094122A/en
Application granted granted Critical
Publication of JP4432275B2 publication Critical patent/JP4432275B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract

PROBLEM TO BE SOLVED: To provide a light source and its manufacturing method which improves luminous efficiency to increase the optical power and prolong the life and raises the mechanical strength. SOLUTION: The light source 1 comprises a board 3 having a thermal conductivity, an insulation member 4 bonded to one surface of the board 3, through- holes 6 passing through parts of the insulation member 4 facing the board 3, LED chips 2 mounted on exposed portions of the board 3 through the through- holes 6, expansions 4a inwardly projecting from the opening edges of the through-holes 6 at the board 3, a wiring pattern 8 provided on the insulation member 4 which electrically insulates the pattern 8 from the board 3, bonding wires 9 which electrically connect extending portions of the pattern 8 onto the expansions 4a to electrodes of the LED chips 2, and a translucent seal resin 10 filled in the through-holes 6 to seal the whole of the LEDs 2 and the bonding wires 9.

Description

【０００１】
【発明の属する技術分野】
本発明は、発光ダイオードを用いた光源装置に関するものである。
【０００２】
【従来の技術】
この種の光源装置としては、図２４に示すような砲弾型の発光ダイオードを用いたものが従来より提供されており、発光ダイオードを単数で使用したり、複数個の発光ダイオードを基板３０上にアレイ状に配置して使用するものがあった。
【０００３】
砲弾型の発光ダイオードは、金属製のリードフレーム３１に設けた凹所３１ａ上にＬＥＤチップ２を銀ぺーストやエポキシ系樹脂などのダイボンディングペースト７を用いてダイボンドし、ＬＥＤチップ２の上面に設けた電極部分（図示せず）とリードフレーム３１，３２との間を金などの金属細線からなるボンディングワイヤ９でワイヤボンドした後、透光性を有する封止樹脂３３でリードフレーム３１，３２とＬＥＤチップ２とボンディングワイヤ９とを封止して形成されている。
【０００４】
ここで、封止樹脂３３には主としてエポキシ樹脂が用いられており、この封止樹脂３３には以下に挙げる３つの機能がある。先ず第１に、封止樹脂３３には機械的衝撃から部品を保護したり、水分からＬＥＤチップ２を保護する保護機能がある。また、ＬＥＤチップ２の発光部の屈折率は約２．８程度と高いため、ＬＥＤチップ２表面と空気との界面では屈折率の差による全反射が発生し、ＬＥＤチップ２の光取り出し効率が低いという問題があるが、ＬＥＤチップ２の表面を屈折率が約１．８程度のエポキシ樹脂で覆うことによって、ＬＥＤチップ２からの光取り出し効率を向上させる機能が封止樹脂３３にはある。さらに、封止樹脂３３には、ＬＥＤチップ２から放射された光を封止樹脂３３表面のレンズ効果によって集光又は拡散させるといった光制御機能がある。
【０００５】
また、リードフレーム３１，３２の機能としては、ＬＥＤチップ２をダイボンドする際の土台となってＬＥＤチップ２を支持する機能と、ＬＥＤチップ２がダイボンドされる凹所３１ａの周りを鏡面としてＬＥＤチップ２からの発光を効率良く前方へ配光させる機能と、ＬＥＤチップ２の発熱を熱伝導によって基板３０などを通じて外部へ逃がす機能とがある。
【０００６】
【発明が解決しようとする課題】
ところで、ＬＥＤチップ２では、照明器具としての通常の使用温度領域において、低温になるほど発光効率が高く、高温になるほど発光効率が低下する。これは、温度上昇による格子振動の増加に伴って電子とホールとの無輻射結合が増加するからである。発光ダイオードを用いる光源装置では、発熱する部分は主としてＬＥＤチップ２であるから、ＬＥＤチップ２で発生した熱を速やかに外部に放熱し、ＬＥＤチップ２の温度を低下させることは、ＬＥＤチップ２の発光効率を向上させる上で非常に重要な課題となる。
【０００７】
また、ＬＥＤチップ２から外部への放熱特性を高めることによってＬＥＤチップ２自身の温度上昇を抑制できるから、ＬＥＤチップ２に大きな順方向電流を通電して使用することができ、ＬＥＤチップ２の光出力を増大させることができる。さらに、放熱特性を高めることによって、ＬＥＤチップ２の寿命を延ばす効果も得られる。
【０００８】
尚、ＬＥＤチップ２の寿命が改善される理由としては、以下に挙げる２つの理由が考えられる。一般的な照明器具と同様に、ＬＥＤチップ２の寿命を、光束が点灯初期の約７０％に低下した時点と定義すると、赤色発光の発光ダイオードは約６万時間の寿命があると考えられるが、例えばＬＥＤチップ２に定格電流以上の順方向電流を印加して過負荷状態で使用すると、ＬＥＤチップ２自身の発熱によってＬＥＤチップ２の劣化が著しく加速されてしまう。したがって、放熱特性を向上させることにより、ＬＥＤチップ２の温度上昇が抑制され、ＬＥＤチップ２の寿命が短くなるのを防止することができる。
【０００９】
また、青色発光ダイオードや、青色発光ダイオードを用い青色発光ダイオードの青色光を白色光に変換して出力する白色発光ダイオードでは、従来の赤色発光ダイオードに比べて放射光のエネルギーが高く、そのためＬＥＤチップ２を封止する封止樹脂３３が、ＬＥＤチップ２の放射光によって劣化し、褐色に呈色してしまう。封止樹脂３３の呈色が始まると、青色系の光をより吸収しやすくなり、封止樹脂３３の呈色がさらに加速されるため、結果的にＬＥＤチップ２近傍の封止樹脂３３が褐色に呈色してしまい、ＬＥＤチップ２自身は点灯初期の光束を維持しているにも関わらず、封止樹脂３３から外部に放射される光が著しく低下してしまう。このように封止樹脂３３が褐色に呈色することによって、青色発光ダイオードや白色発光ダイオードの場合は、その寿命が約６０００時間程度となり、赤色発光ダイオードに比べて著しく短くなる。ところで、封止樹脂３３の呈色反応は光化学反応ではあるが、封止樹脂３３の温度が高くなると、呈色反応の反応速度が速くなることが一般的に知られており、ＬＥＤチップ２から外部への放熱特性を向上させることによって、ＬＥＤチップ２及び封止樹脂３３の温度を低減し、ＬＥＤチップ２の発光による封止樹脂３３の呈色反応を抑制することができる。
【００１０】
上述のように発光ダイオードを用いた光源装置では、その発光効率の向上、光出力の増加、長寿命化といった観点から、ＬＥＤチップ２より外部への放熱特性を向上させることが非常に重要になる。しかしながら、砲弾型の発光ダイオードでは、ＬＥＤチップ２の発熱を逃がすための放熱経路が、リードフレーム３１を通じて基板３０に逃がす経路と、封止樹脂３３を通じて空気中に逃がす経路の２つであり、封止樹脂３３を通じて放熱する経路ではエポキシ樹脂の熱伝導率が低いために十分な放熱効果が得られない。したがって、リードフレーム３１を通じて放熱する放熱経路が主になるが、リードフレーム３１自体が細く、また放熱経路が７〜１０ｍｍ程度と長いため、封止樹脂３３を通じて放熱する経路よりは大きな放熱効果が得られるものの、十分な放熱効果は期待できず、放熱特性を改善した光源装置を実現するのは困難であった。
【００１１】
そこで、放熱特性を更に改善するために、図２５に示すようにＬＥＤチップ２を基板３４に直接ダイボンドした光源装置も提案されている。基板３４は例えばアルミニウムの薄板からなり、基板３４にプレス加工を施すことによって凹所３４ａを形成し、基板３４の表面に絶縁体薄膜３５を形成した後、凹所３４ａの底面に形成された絶縁体薄膜３５上にＬＥＤチップ２をダイボンドしている。そして、基板３４の表面に絶縁体膜層３５を介して形成された配線パターン３６とＬＥＤチップ２表面の電極との間をボンディングワイヤ９を介して電気的に接続し、凹所３４ａ内に透光性を有する封止樹脂３７を充填して形成される。
【００１２】
この光源装置では、ＬＥＤチップ２の発熱は、ＬＥＤチップ２からダイボンディングペースト７→絶縁体膜層３５→基板３４の経路で放熱され、基板３４に伝わった熱は基板３４全体に拡散していくため、砲弾型の発光ダイオードに比べて放熱経路が短く、放熱性が非常に高くなっている。しかしながら、この放熱経路においても、放熱性を阻害する構成要素としてダイボンディングペースト７と絶縁体膜層３５とが存在する。ダイボンディングペースト７は樹脂製であり、ペースト自体の熱伝導係数は小さいものの、ペーストの厚みは５μｍ以下と薄いため、ダイボンディングペースト７が放熱性に与える影響は小さいものと考えられる。一方、絶縁体膜層３５は樹脂やセラッミックスフィラーを分散させた樹脂などから形成されており、金属に比較して絶縁体膜層３５自体の熱伝導係数が小さく、また絶縁体膜層３５の厚みも３００μｍ程度と厚くなっているため、放熱性に与える影響が大きくなっている。而して、図２５に示す構造の光源装置では、砲弾型ＬＥＤを用いた光源装置に比べて、ＬＥＤチップ２からの放熱性は高くなっているものの、放熱経路に絶縁体膜層３５が存在しているために、十分な放熱性が得られなかった。
【００１３】
また、ＬＥＤチップ２からの放熱において、絶縁体膜層３５の影響を低減する目的で、基板３４の表面から部分的に絶縁体膜層３５を除去し、露出した基板３４にＬＥＤチップ２を直接ダイボンドした光源装置も提案されている。しかしながら、絶縁体膜層３５を部分的に除去する方法としては、エンドミルなどによる切削加工によるものであり、露出した基板３４の表面は切削傷が著しく、実測した結果、プラスマイナス２０μｍ程度の平滑度であった。ところで、ＬＥＤチップ２をダイボンドする場合、ダイボンド剤の種類にもよるが、ＬＥＤチップ２を実装する面にはプラスマイナス５μｍ程度の平滑度が必要になるため、切削加工した面にＬＥＤチップ２を実装するのは難しく、露出した基板３４の表面にＬＥＤチップ２を実装するのは難しかった。
【００１４】
また、図２５に示す光源装置では、絶縁体膜層３５の上面に配線パターン３６が形成されており、ボンディングワイヤ９の一端は配線パターン３６に接続されているから、ＬＥＤチップ２を封止樹脂３７で封止したとしても、ボンディングワイヤ９の一部が封止樹脂３７から外側に露出することになり、機械的衝撃に対してボンディングワイヤ９の強度が著しく低下するという問題がある。そこで、封止樹脂３７から外側に露出しているボンディングワイヤ９の部位を保護するために、封止樹脂３７から露出しているボンディングワイヤ９の部位を別途樹脂封止することも考えられるが、同じ樹脂を用いて樹脂封止したとしても、２回に分けて樹脂封止を行った場合は２つの樹脂の界面部分に応力が残存するため、点灯時に発生するＬＥＤチップ２の発熱によって応力が増大し、界面部分でボンディングワイヤ９が断線する虞もある。特に青色発光のＬＥＤチップ２を用いて白色発光を得るために、封止樹脂３７に蛍光体などの粉体を分散させている場合は、封止樹脂３７の上から樹脂封止された封止樹脂との間に熱膨張率の差が生じ、界面部分でボンディングワイヤ９が断線する可能性が増大するという問題もあった。
【００１５】
本発明は上記問題点に鑑みて為されたものであり、その目的とするところは、発光効率を向上させて光出力を増大させ、長寿命化を図ると共に、機械的強度を高めた光源装置を提供することにある。
【００１６】
【課題を解決するための手段】
上記目的を達成するために、請求項１の発明では、熱伝導性を有する基板と、基板の少なくとも一方の面に配設された絶縁部材と、基板と対向する絶縁部材の部位に絶縁部材を貫通して設けられた孔と、この孔から露出する基板の部位に対向させ且つ熱結合させて配置されたＬＥＤチップと、絶縁部材に設けられ絶縁部材によって基板と電気的に絶縁された配線部を含む給電部と、給電部とＬＥＤチップの電極との間を電気的に接続する接続部材と、孔内に充填されＬＥＤチップ及び接続部材の全体を封止する透光性を有する封止材料とを備え、絶縁部材に設けた孔の基板側の開口縁に内側に突出する張出部を設け、この張出部に配線部の少なくとも一部を配置し、張出部に配置された配線部の部位にＬＥＤチップの電極を電気的に接続しており、絶縁部材側に突出し絶縁部材に設けた孔内に挿入される突台部を基板に設け、この突台部にＬＥＤチップを対向させ且つ熱結合させて配置したことを特徴とし、ＬＥＤチップは絶縁部材に設けた孔から露出する基板の部位に対向させ且つ熱結合させて配置されているので、熱伝導性を有する基板を介してＬＥＤチップの発熱を放出することができ、放熱性を向上させた光源装置を実現できる。したがって、ＬＥＤチップの温度上昇が抑制され、温度上昇による発光効率の低下を防止することができる。しかもＬＥＤチップの温度上昇が低減されるから、より大きな順方向電流をＬＥＤチップに印加して、ＬＥＤチップの光出力を増大させることもでき、またＬＥＤチップや封止材料の熱的な劣化が低減され、長寿命化が図れる。さらに、孔内に充填された封止材料によってＬＥＤチップ及び接続部材の全体を封止しており、ＬＥＤチップと給電部とを電気的に接続する接続部材として金属線を用いた場合にも、樹脂の界面で発生する応力によって金属線が断線する虞はなく、機械的強度を向上させることができる。しかも基板に突台部を設けることによって、突台部の高さ分だけ張出部の厚み寸法を厚くすることができるから、張出部の加工を容易に行え、且つ、張出部の厚み寸法を厚くすることによって、張出部の剛性を高くし、基板と絶縁部材とを接合する際に張出部と基板との間に隙間ができるのを防止できる。
【００１７】
請求項２の発明では、請求項１の発明において、ＬＥＤチップに接続部材を介して電気的に接続される配線部の部位は孔内に配置されており、封止材料は孔の開口付近まで充填されたことを特徴とし、封止材料の表面が孔の開口付近にくるまで封止材料を充填することによって、封止材料の充填量を略一定とすることができ、品質のばらつきを抑制できる。
【００１８】
請求項３の発明では、請求項１の発明において、上記接続部材は金属線からなり、基板及び絶縁部材の接合方向において、金属線の一端が接続されるＬＥＤチップの部位と、金属線の他端が接続される配線部の部位の高さを略同じ高さとしたことを特徴とし、ＬＥＤチップと配線部との間を電気的に接続する金属線の長さを短くできるから、金属線の機械的強度を高くでき、またＬＥＤチップと配線部の高さを略同じ高さとすることにより、ボンディング作業を容易に行うことができる。
【００１９】
請求項４の発明では、請求項１の発明において、基板及び絶縁部材の接合方向において、ＬＥＤチップが実装される突台部と、ＬＥＤチップに電気的に接続される配線部の部位の高さを略同じ高さとしたことを特徴とし、ＬＥＤチップから放射される光が配線部に遮光されることはなく、光のけられを少なくして、光の取り出し効率を高めることができる。
【００２０】
請求項５の発明では、請求項１の発明において、突台部は、基板における絶縁部材と反対側の面から打ち出し加工を行って凹所を形成することにより、基板における絶縁部材側の面に打ち出されたことを特徴とし、打ち出し加工を行うことによって突台部を形成しているので、切削加工により突台部を形成する場合に比べて加工費用を低減できる。また、基板と絶縁部材とを接着剤で貼り合わせた場合、接着剤の熱収縮によって基板全体が絶縁部材側に反ってしまうが、打ち出し加工を行って凹所を形成することにより、基板全体が絶縁部材と反対側に反るので、接着材の熱収縮によって発生する基板の反りを相殺し、全体として基板が反るのを防止できる。
【００２１】
請求項６の発明では、請求項１の発明において、基板を、孔に連通する連通孔が形成されたベース板と、連通孔内に取り付けられ先端が絶縁部材側に突出する突起部とで構成し、突起部の先端により突台部を構成したことを特徴とし、ベース板の孔に突起部を挿入し、突起部の先端を絶縁部材側に突出させることによって突台部を形成しているので、突台部を切削加工により形成する場合に比べて、突台部の加工を容易に行うことができる。
【００２２】
請求項７の発明では、請求項１の発明において、孔と突台部との間に隙間を設けたことを特徴とし、基板と絶縁部材とを接着剤で貼り合わせた場合、基板と絶縁部材との接合面から余分な接着剤がはみ出し、はみ出した接着剤によってＬＥＤチップの光が遮光されたり、ＬＥＤチップを実装できなくなる虞があるが、はみ出した接着剤は孔と突台部との間に設けた隙間に溜まるので、接着剤が突台部の上面まで這い上がってくることはなく、はみ出した接着剤によってＬＥＤチップの光が遮光されたり、ＬＥＤチップを実装できなくなるのを防止できる。
【００２３】
請求項８の発明では、請求項１乃至７の何れか１つの発明において、基板と絶縁部材との位置決めを行うための位置決め手段を基板と絶縁部材との接合面に設けたことを特徴とし、位置決め手段により基板と絶縁部材との位置決めを行うことができ、基板と絶縁部材との接合作業を容易に行える。
【００２４】
請求項９の発明では、請求項１乃至７の何れか１つの発明において、基板と絶縁部材との接合面に接合に用いる接着剤の溜まり部を絶縁部材の孔の周りに設けたことを特徴とし、基板と絶縁部材とを接着剤で貼り合わせた場合、基板と絶縁部材との接合面から余分な接着剤がはみ出し、はみ出した接着剤によってＬＥＤチップの光が遮光されたり、ＬＥＤチップを実装できなくなる虞があるが、接合時に余分な接着剤は溜まり部に溜まるため、接着剤のはみ出しを防止できる。また、基板と絶縁部材との接合面に接着剤が不足している部分があると、この部分にできる隙間から封止材料が漏れ出す虞があるが、余分な接着剤を溜める溜まり部が絶縁部材に設けた孔の周りに設けられ、溜まり部に溜まった余分な接着剤は孔から露出する基板の部位を囲むようにして配置されるので、溜まり部に溜まった接着剤が封止材料をせき止める堰の役割を果たして、封止材料が漏れ出すのを防止できる。
【００２５】
請求項１０の発明では、請求項１の発明において、上記給電部は導電性材料により形成された基板を含み、基板とＬＥＤチップの電極とを電気的に接続したことを特徴とし、基板そのものを給電部としており、ＬＥＤチップの一方の電極を基板に接続するとともに、ＬＥＤチップの他方の電極を配線部に接続することによって、ＬＥＤチップに給電することができるから、絶縁部材の表面に形成する配線部が１回路分で済むという利点がある。また、ＬＥＤチップに給電するための回路の一部を基板が担っているので、回路を基板側に容易に引き出すことができる。
【００２６】
請求項１１の発明では、請求項１０の発明において、上記基板に、互いに電気的に絶縁された複数の領域を設けたことを特徴としている。ところで、一枚の基板に複数のＬＥＤチップが実装される場合、一枚の基板が互いに電気的に絶縁された複数の領域に分割されていないと、全てのＬＥＤチップが並列に接続されることになる。ここで、ＬＥＤチップは個体ごとに駆動電圧が若干異なるため、複数のＬＥＤチップが並列に接続されると、駆動電圧が最も低いＬＥＤチップに多大な電流が流れて、ＬＥＤチップが破損する虞がある。そこで、複数のＬＥＤチップに流れる電流を均等にするために、個々のＬＥＤチップ毎に電流制限用の抵抗を直列接続する方法が考えられるが、ＬＥＤチップの数だけ電流制限用の抵抗が必要になり、各抵抗で消費される電力ロスが増大する。それに対して本発明では、基板に、互いに電気的に絶縁された複数の領域を設けており、各領域にそれぞれＬＥＤチップを実装し、各領域に実装されたＬＥＤチップを直列に接続すれば、個々のＬＥＤチップに流れる電流値を略一定にすることができ、且つ、直列接続された複数のＬＥＤチップに対して電流制限用の抵抗を１個接続すれば、各ＬＥＤチップに流れる電流を制限できるから、電流制限用の抵抗で消費される電力ロスを小さくできる。
【００２７】
請求項１２の発明では、請求項１の発明において、封止材料の表面を、ＬＥＤチップの発光を所望の方向に配光するレンズ形状としたことを特徴とし、封止材料の表面をレンズ形状としたことにより、別途レンズを設けることなく、ＬＥＤチップの発光を所望の方向に配光することができる。
【００２８】
請求項１３の発明では、請求項１の発明において、孔の側壁にＬＥＤチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とし、反射部によってＬＥＤチップの光を反射して所望の方向へ配光することにより、光の取り出し効率を高めることができる。
【００２９】
請求項１４の発明では、請求項１３の発明において、上記反射部を配線部で兼用したことを特徴とし、配線部が反射部を兼用することにより、絶縁部材の表面に形成される配線部及び反射部のパターンを簡素化できる。
【００３０】
請求項１５の発明では、請求項１３の発明において、上記接続部材は金属線からなり、金属線の延びる方向に配線部を配設したことを特徴とし、ＬＥＤチップからの光は金属線によって遮光されるが、金属線の影となる部分に配線部を配置しているので、配線部以外の部位に形成された反射部によって、ＬＥＤチップからの光を所望の方向に配光することができる。
【００３１】
請求項１６の発明では、請求項１の発明において、封止材料は、ＬＥＤチップから放射された光の少なくとも一部を所定の光色に変換する光色変換機能を有することを特徴とし、封止材料によって光色が変換された光と、ＬＥＤチップからの光とを混色することによって、所望の光色の光を得ることができる。
【００３２】
請求項１７の発明では、請求項１６の発明において、封止材料の表面は、絶縁部材における基板と反対側の面よりも基板側に位置し、孔の周壁にＬＥＤチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とし、ＬＥＤチップからの光は封止材料を通過することによって分散され、完全拡散配光となっているので、配光制御しやすくなっており、反射部によって所望の方向に配光することができる。
【００３３】
請求項１８の発明では、請求項１の発明において、配線部の一部を基板側に向かって延伸し、この延伸された部分で外部接続端子を構成することを特徴とし、配線部の一部を基板側に向かって延伸し、この延伸された部位を外部接続端子としているので、基板側から配線部への給電を容易に行うことができる。なお、配線部の一部を基板側に向かって延伸させる形態としては種々考えられるが、例えば絶縁部材の端部に沿って配線部を基板側に延伸したり、絶縁部材にスルーホールを形成し、このスルーホール内に導電性材料を充填することによって配線部を基板側に延伸することが考えられる。また基板側に向かって延伸する配線部の長さも必要に応じて決定され、絶縁部材の途中まで又は基板側の面まで延伸しても良いし、基板側の面に一部を回り込ませるようにしても良いし、また基板の向こう側まで突出するようにしても良い。
【００３４】
請求項１９の発明では、請求項１８の発明において、上記配線部の一部が、絶縁部材における基板との対向面まで延伸されたことを特徴とし、配線部の一部を基板との対向面まで延伸させているので、この延伸された部分に対して容易に給電することができる。例えば、基板と嵌合する穴の形成された器具本体にこの光源装置を実装する場合、配線部の一部を絶縁部材における基板との対向面まで延伸しているので、器具本体の穴に基板部分を嵌合すれば、器具本体に形成された配線部と光源装置の配線部との電気的接続を容易に行うことができ、さらに基板部分を穴内に嵌め込んで器具本体と接触させるようにすれば、放熱性が向上する。
【００３５】
請求項２０の発明では、請求項１８又は１９の発明において、絶縁部材の一部を基板側に向かって延伸し、この延伸された部分の先端を、基板における絶縁部材と反対側の面と略面一にしたことを特徴とし、絶縁部材の基板側に延伸された部位に器具本体の表面に載置して光源装置を器具本体に実装する際に、絶縁部材の延伸された部位が基板における絶縁部材と反対側の面と略面一になっているので、絶縁部材を器具本体の表面に載置するだけで、基板が器具本体の表面に接触するから、ＬＥＤチップの発熱が基板を介して器具本体に放出され、冷却効果が向上する。しかも、配線部の一部を基板側に延伸させて外部接続端子としているので、外部接続端子と器具本体の表面に形成された配線部との電気的接続を容易に行える。さらに、絶縁部材の基板側に延伸された部位の先端面に外部接続端子を形成すれば放熱性を向上させた表面実装型の光源装置を実現できる。
【００３６】
請求項２１の発明では、請求項１の発明において、絶縁部材とＬＥＤチップと配線部と封止部材とが基板の両面に設けられたことを特徴とし、基板の両面からＬＥＤチップの光を放射させることができ、且つ、基板の両面に同じ部品が配設されているので、基板の反りを抑制することができる。
【００３７】
【発明の実施の形態】
以下に本発明の実施の形態を図面を参照して説明する。
【００３８】
（基本構成）
本発明の基本構成を図１（ａ）（ｂ）を参照して説明する。この光源装置１は、例えばアルミニウムのような熱伝導性の高い材料から形成された厚さが約２ｍｍの基板３と、例えば液晶ポリマーのような絶縁材料からなる厚さが約２ｍｍの絶縁部材４とを貼り合わせて構成される。
【００３９】
絶縁部材４における基板３と反対側の面には、直径が約３ｍｍで深さが約１．５ｍｍの丸穴５が２箇所形成され、各丸穴５の略中央には絶縁部材４を貫通して基板３に達する断面略円形で直径が約１ｍｍの貫通孔６がそれぞれ穿設されている。ここに、丸穴５と貫通孔６とで、基板３と対向する絶縁部材４の部位に絶縁部材４を貫通して設けられた孔が構成され、丸穴５の底部には内側に突出する張出部４ａが基板３と一体に形成されている。そして、貫通孔６から露出する基板３の部位にそれぞれＬＥＤチップ２が、銀ペーストのようなダイボンディングペースト７を用いてダイボンドされている。また、絶縁部材４における基板３と反対側の面には、２個のＬＥＤチップ２の実装部位を通る同一直線上に銅などの導電材料からなる配線パターン（配線部）８が形成されている。配線パターン８は丸穴５の側壁及び底面（張出部４ａ）まで延設され、ワイヤーボンディング用の接続部を構成しており、ＬＥＤチップ２の電極（図示せず）と配線パターン８との間は、例えば金のような金属細線よりなるボンディングワイヤ（金属線）９を介して電気的に接続されている。ここで、少なくともボンディングワイヤ９の接続される配線パターン８の部位には金めっきが施されており、ボンディングワイヤ９をボンディングしやすいようになっている。また、ＬＥＤチップ２の上面と、丸穴５の底面に形成された配線パターン８の部位とは略同じ高さになっているので、ボンディングワイヤ９の長さを短くして、ボンディングワイヤ９の機械的強度を高めることができ、且つ、ボンディング作業を容易に行えるようにしている。
【００４０】
その後、丸穴５の内部に透光性を有する２液硬化型注型用エポキシ樹脂のような封止樹脂（封止材料）１０を注入することによって、ＬＥＤチップ２とボンディングワイヤ９の全体が樹脂封止され、ボンディングワイヤ９の接続部が封止樹脂１０によって保護される。ここで、封止樹脂１０を注入する際には、絶縁部材４の上面まで注入すれば良く、封止樹脂１０の注入量を容易に制御することができる。また、ボンディングワイヤ９は、張出部４ａ上に延設された配線パターン８の部位に接続されており、丸穴５内に納められているので、丸穴５内に充填された封止樹脂１０によってボンディングワイヤ９とその接続部位とを樹脂封止することができ、ボンディングワイヤ９が封止樹脂１０から外側に露出することによって機械的強度が低下したり、封止樹脂１０の表面で発生する応力によってボンディングワイヤ９が断線する虞はない。
【００４１】
尚、ＬＥＤチップ２としては、チップ上面に２つの電極が形成されたＧａＮ系ＬＥＤチップを例として説明しているが、ＡｌＩｎＧａＰ系ＬＥＤチップのようにチップ下面が一方の電極となり、チップ上面にもう一方の電極が形成されたようなＬＥＤチップを用いても良く、この場合は基板３を配線として用いるか、又は、基板３に電極を設け、ＬＥＤチップと基板３の電極及び配線パターン８との間をそれぞれボンディングワイヤで接続すれば良い。
【００４２】
上述のように、本光源装置１では、ＬＥＤチップ２が熱伝導性の良好な基板３上に直接ダイボンドされているから、ＬＥＤチップ２の発熱はダイボンディングペースト７を介して基板３へ伝わり、基板３に到達したＬＥＤチップ２の発熱は速やかに基板３全体に広がる。ここで、ＬＥＤチップ２の発熱の放熱経路には、熱伝導係数の低いダイボンディングペースト７が存在するが、ダイボンディングペースト７の厚さは数μｍ程度と薄いため、放熱性に与える影響は小さく、十分な放熱性能が得られる。例えば熱抵抗で比較すると、従来例で説明した砲弾型ＬＥＤの場合は、ＬＥＤチップからリードフレームの先端までの熱抵抗が約３５０℃／Ｗであったのに対して、本光源装置１では、ＬＥＤチップ２から基板３の裏面までの熱抵抗が約９０℃／Ｗであり、熱抵抗を約４分の１に低減することができる。
【００４３】
したがって、従来の光源装置に比べて、ＬＥＤチップ２から外部への放熱特性が高くなり、ＬＥＤチップ２の温度上昇が抑制されるから、ＬＥＤチップ２の発光効率が向上すると共に、光出力が増加し、且つ、長寿命化を図ることができる。
【００４４】
また、ＬＥＤチップ２およびボンディングワイヤ９は封止樹脂１０によって封止されており、ボンディングワイヤ９の接続部位も封止樹脂１０によって保護されているから、ボンディングワイヤ９に応力が加わることはなく、ボンディングワイヤ９の断線を防止することができ、機械的な強度を向上させることができる。
【００４５】
尚、本光源装置１では基板３としてアルミ板を用いているが、基板３の材料をアルミニウムに限定する趣旨のものではなく、銅などの金属や、窒化アルミニウムなどの熱伝導性の高いセラミックスから形成しても良く、上述と同様の効果が得られる。また、本光源装置１では絶縁部材４上にプリント配線技術を用いて配線パターン８を形成しているが、配線パターン８の代わりに、絶縁部材４内を通り、ボンディングワイヤ９の接続部位のみをＬＥＤチップ２の近傍に露出させたリードフレーム（図示せず）を用いて、ＬＥＤチップ２の配線を行っても良い。
【００４６】
（実施形態１）
本発明の実施形態１を図２を参照して説明する。この光源装置１は、例えばアルミニウムのような熱伝導性の高い材料から形成された基板３と、例えば液晶ポリマーのような絶縁材料からなる厚みが約２ｍｍの絶縁部材４とを貼り合わせて形成される。
【００４７】
基板３は厚みが約３ｍｍのアルミ板に切削加工を施すことによって形成され、基板３における絶縁部材４側の面には、直径が約１ｍｍで高さが約０．９ｍｍの略円柱状の突台部１１が突設されている。
【００４８】
絶縁部材４における基板３と反対側の面には、基板３の突台部１１に対応する部位に凹所５’が形成されており、凹所５’の底には絶縁部材４を貫通する貫通孔６が形成されている。ここで、貫通孔６の孔径は約１ｍｍであり、突台部１１の外径と略同じになっている。また、凹所５’の底面の内径は約２ｍｍであり、凹所５’の側壁は基板３側から遠ざかるにしたがって内径が大きくなり、約４５度の角度で傾斜するような断面形状に形成されている。ここに、凹所５’と貫通孔６とで、基板３と対向する絶縁部材４の部位に絶縁部材４を貫通して設けられた孔が構成され、凹所５’の底部には内側に突出する張出部４ａが基板３と一体に形成されている。
【００４９】
ここで、基板３及び絶縁部材４は貫通孔６と突台部１１とを嵌合させた状態で接合されており、貫通孔６から露出する突台部１１の部位には厚さが約０．２ｍｍのＬＥＤチップ２が、銀ペーストのようなダイボンディングペースト７を用いてダイボンドされている。また絶縁部材４における基板３と反対側の面には、銅などの導電材料からなる配線パターン８が形成され、その表面には金めっきを施してある。配線パターン８は凹所５’の側壁及び底面まで延設されており、凹所５’の底面（張出部４ａ）に延設された配線パターン８の部位とＬＥＤチップ２の上面に形成された電極との間は、例えば金のような金属細線からなるボンディングワイヤ９を介して電気的に接続されている。
【００５０】
その後、凹所５’の内部に透光性を有する２液硬化型注型用エポキシ樹脂のような封止樹脂１０を注入することによって、ＬＥＤチップ２とボンディングワイヤ９とが樹脂封止され、ボンディングワイヤ９の接続部が封止樹脂１０によって保護される。ここで、封止樹脂１０を注入する際には、絶縁部材４の上面まで注入すれば良く、封止樹脂１０の注入量を容易に制御することができる。しかも、ボンディングワイヤ９は、張出部４ａ上に延設された配線パターン８の部位に接続されており、凹所５’内に納められているので、凹所５’内に充填された封止樹脂１０によってボンディングワイヤ９とその接続部位とを樹脂封止することができ、ボンディングワイヤ９が封止樹脂１０から外側に露出することによって機械的強度が低下したり、封止樹脂１０の表面で発生する応力によってボンディングワイヤ９が断線する虞はない。
【００５１】
また本実施形態の光源装置１では、ＬＥＤチップ２が熱伝導性の良好な基板３上に直接ダイボンドされているから、基本構成で説明した光源装置１と同様、十分な放熱性能を得ることができ、ＬＥＤチップ２の温度上昇が抑制されるから、ＬＥＤチップ２の発光効率が向上すると共に、光出力が増加し、且つ、長寿命化を図ることができる。
【００５２】
さらに本実施形態の光源装置１では基板３に突台部１１を形成しているので、基板３及び絶縁部材４の接合方向において、ＬＥＤチップ２の上面と張出部４ａに形成された配線パターン８の高さとを略同じ高さにしたとしても、突台部１１の高さ分だけ張出部４ａの厚みを厚くすることができる。ここで、絶縁部材４を樹脂から形成する場合、張出部４ａの厚みを薄くすると歩留まりが増加するなどして、張出部４ａの加工が難しくなる。また、基板３と絶縁部材４とを貼り合わせて形成する場合、張出部４ａの厚みが薄いと、基板３との間に隙間が生じる虞がある。それに対して、本実施形態の光源装置１では張出部４ａの幅寸法が約０．５ｍｍであるのに対して、厚みが約１ｍｍとなっているので、張出部４ａを容易に加工することができ、また基板３との間に隙間を生じることなく、基板３及び絶縁部材４を貼り合わせることができる。
【００５３】
また、基本構成で説明した光源装置１と同様、ＬＥＤチップ２の上面と、凹所５’の底面（張出部４ａ）に形成された配線パターン８の部位とは略同じ高さになっているので、ボンディングワイヤ９の長さを短くして、ボンディングワイヤ９の機械的強度を高めることができ、且つ、ボンディング作業を容易に行えるという利点もある。また、凹所５’の側壁をテーパ面としているので、ＬＥＤチップ２から放射された光が凹所５’の側壁によって吸収されたり、乱反射されることはなく、効率良く前方へ反射させることができる。
【００５４】
（実施形態２）
本発明の実施形態２を図３（ａ）を参照して説明する。本実施形態の光源装置１では、実施形態１の光源装置１において、基板３に設けた突台部１１の高さ寸法を約１．１ｍｍとしており、突台部１１の上面と張出部４ａに形成された配線パターン８の上面との高さを略同じにしている。尚、突台部１１以外の構成は実施形態１と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。
【００５５】
実施形態１の光源装置１では、ＬＥＤチップ２から放射された光の内、ＬＥＤチップ２の上面と略平行な方向（水平方向）に放射された光の一部は、張出部４ａの端面によって吸収されたり、乱反射されるなどして、前方へ放射されなくなり発光効率が低下する虞がある。それに対して、本実施形態の光源装置１では、突台部１１の上面と、張出部４ａに形成された配線パターン８の上面との高さを略同じ高さにしており、ＬＥＤチップ２は略平坦な面にダイボンディングされているので、ＬＥＤチップ２から放射された光が張出部４ａの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。
【００５６】
尚、図３（ｂ）に示すように、突台部１１の上面を、張出部４ａに形成された配線パターン８よりも上方へ突出させても良く、上述と同様に、ＬＥＤチップ２の光が張出部４ａの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。尚、突台部１１の突出量が大きくなりすぎると、ボンディングワイヤ９のワイヤ長が長くなって、ボンディングワイヤ９が突台部１１の角に接触する虞があるため、突台部１１の高さは、突台部１１の上面と張出部４ａに形成された配線パターン８の上面とが略面一になるような高さか、又は、突台部１１の上面が張出部４ａに形成された配線パターン８の上面よりも若干高くなるような高さに形成するのが望ましい。
【００５７】
（実施形態３）
本発明の実施形態３を図４（ａ）を参照して説明する。本実施形態では、実施形態２の光源装置１において、基板３に設けた突台部１１の直径を約０．５ｍｍ、高さ寸法を約１．１ｍｍとしており、突台部１１の上面と張出部４ａに形成された配線パターン８の上面との高さを略同じにしている。尚、基板３及びＬＥＤチップ２の配置以外は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。
【００５８】
ＬＥＤチップ２は透明なサファイア基板からなり、電極間距離が約１ｍｍのものを用いており、ＬＥＤチップ２を突台部１１と対向させ、突台部１１が電極間に位置するようにして、ＬＥＤチップ２の電極面を配線パターン８にフェースダウン実装した。ここで、ＬＥＤチップ２と配線パターン８とは以下のような方法で接合した。すなわち、ＬＥＤチップ２の電極上に半田バンプ２１を形成し、リフロー炉で加熱して半田バンプ２１を溶融させることにより接合した。なお半田バンプ２１の高さは２〜３μｍであり、基板３とＬＥＤチップ２の電極面もこの間隔で離れているため電気的絶縁は保たれる。また封止樹脂１０が基板３とＬＥＤチップ２との隙間に充填されるが、基板３とＬＥＤチップ２との間の距離は十分短いため、ＬＥＤチップ２は基板３に熱結合されており、ＬＥＤチップ２から基板３への熱伝導に対しては大きな障害とはならない。
【００５９】
また実施形態２で説明した光源装置１では、ＬＥＤチップ２の電極が凹所５’の開口部側を向いているので、ＬＥＤチップ２から外部へと向かう光の一部はＬＥＤチップ２の電極によって遮られる。遮られた光の一部は反射を繰り返して外部へと取り出されるが、残りは内部で吸収されてロスとなる。それに対して、本実施形態では、ＬＥＤチップ２の電極が基板３側に配置されており、ＬＥＤチップ２の発光部からの発光は透明なサファイア基板を通じて取り出されるため、ＬＥＤチップ２の電極やボンディングワイヤ９によって発光の一部が遮蔽されることがなく、全体として光量が低下するのを防止できる。また、実施形態２の光源装置１にレンズなどの光学部品を組み合わせて使用する場合、焦点距離によってはＬＥＤチップ２の電極の形状が影として照射面に投影される問題があるが、本実施形態では電極が基板３側に配置されているので、前面が均一な照射面とすることができる。さらに、実施形態２で説明したように、ＬＥＤチップ２から放射された光が張出部４ａの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。
【００６０】
なお、図４（ｂ）に示すように、突台部１１の上面を、張出部４ａに形成された配線パターン８よりも約３μｍ上方へ突出させ、ＬＥＤチップ２を突台部１１上面に接触させた状態でフェースダウン実装しても良く、ＬＥＤチップ２を突台部１１と直接接触させることによって放熱性を向上させることができる。但し、この場合には突台部１１の上面、又は、突台部１１の上面と接触するＬＥＤチップ２の部位を酸化珪素などの絶縁性材料でコーティングするなどしてＬＥＤチップ２と基板３とを絶縁するか、或いは、基板３の材料として電気導電性の無い材料を用いる必要がある。また、突台部１１と配線パターン８との段差を吸収するために、半田バンプ２１の高さを高くするのが望ましく、ＬＥＤチップ２の電極と配線パターン８との電気的接続を確実にできる。
【００６１】
ここで、光源装置１の構造を図４（ｂ）に示す構造とした場合にも、上述と同様、ＬＥＤチップ２から放射された光が張出部４ａの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。
【００６２】
（実施形態４）
本発明の実施形態４を図５を参照して説明する。本実施形態の光源装置１では、実施形態２の光源装置１において、基板３の下面における突台部１１に対応する部位に凹所１２を設けている。尚、凹所１２以外の構成は実施形態２の光源装置１と同様であるので、実施形態２と同一の構成要素には同一の符号を付して、その説明を省略する。
【００６３】
実施形態２の光源装置１では、基板３に切削加工を施すことによって突台部１１を形成しているが、本実施形態の光源装置１では、基板３を一面から打ち出してプレス加工を施し、凹所１２を形成することによって、基板３の反対側の面に突台部１１を形成しており、切削加工を施す場合に比べて加工費用を低減できる。
【００６４】
また、基板３と絶縁部材４とを接着剤を用いて貼り合わせる場合、接着剤の硬化収縮によって基板３及び絶縁部材４全体が反ってしまう虞がある。一方、プレス加工により突台部１１を形成すると、接着剤の硬化収縮によって反る方向とは逆方向の反りが基板３に発生するので、両者の反りを相殺することによって基板３及び絶縁部材４全体の反りを抑えることができる。
【００６５】
この光源装置１では、ＬＥＤチップ２の発熱はダイボンディングペースト７を介して基板３の突台部１１に伝わる。突台部１１の裏面には凹所１２が形成されているが、基板３は一体に形成されているので、突台部１１に伝わったＬＥＤチップ２の発熱は、速やかに基板３全体に伝わり、外部へ放熱される。また、基板３は、光源装置１が取り付けられる筐体や放熱フィンなどの放熱部品に接触させた状態で使用されるため、ＬＥＤチップ２の発熱は基板３を介して速やかに放熱部品へ放出されることになり、その放熱性能は凹所１２が形成されていない場合と略同様である。
【００６６】
（実施形態５）
本発明の実施形態５を図６を参照して説明する。実施形態２の光源装置１では、基板３に切削加工を施すことにより突台部１１を形成しているが、本実施形態の光源装置１では、突台部１１を形成する代わりに、熱伝導性を有する材料から形成されたベース板３’における絶縁部材４の貫通孔６に対応する部位に、貫通孔６に連通する断面略円形の連通孔１３を形成し、この連通孔１３内に例えばアルミニウムのような熱伝導性を有する材料から形成された円柱状の熱伝導体（突起部）１４を圧入している。ここに、ベース板３’と熱伝導体１４とで基板が構成され、ベース板３’の表面から絶縁部材４側に突出する熱伝導体１４の先端部から突台部が構成され、熱伝導体１４の先端部は貫通孔６内に挿入され、熱伝導体１４の先端部にＬＥＤチップ２がダイボンディングペースト７を用いてダイボンドされる。尚、ベース板３’及び熱伝導体１４以外の構成は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。
【００６７】
実施形態２の光源装置では、金属板に切削加工を施すことによって基板３に突台部１１を形成しているので、加工費用が高くなるが本実施形態では、ベース板３’に孔開け加工を施し、孔内に熱伝導体１４を圧入することによって、突台部を形成しているので、切削加工によって突台部１１を形成する場合に比べて、加工費用を低減することができる。
【００６８】
またベース板３’の裏面に、光源装置が取り付けられる筐体や放熱フィンなどの放熱部品を接触させて使用する場合を考えると、ＬＥＤチップ２の発熱はダイボンディングペースト７を介して熱伝導体１４に伝わる。ここで、熱伝導体１４は、ベース板３’を貫通する連通孔１３内に圧入され、ベース板３’の裏面まで達しているので、ＬＥＤチップ２の発熱は熱伝導体１４を通じて速やかに裏面側に伝わり、放熱部品へと放出される。また、熱伝導体１４はベース板３’の連通孔１３内に圧入されており、熱伝導体１４とベース板３’とは密着しているので、両者の間では十分な熱伝導が行われ、熱伝導体１４に伝わった熱はベース板３’全体に速やかに放出されるから、基板３に突台部１１を一体に形成した実施形態２の光源装置と同様の放熱特性を得ることができる。
【００６９】
（実施形態６）
本発明の実施形態６を図７を参照して説明する。本実施形態の光源装置１では、実施形態２の光源装置１において、基板３に設けた突台部１１の周面と、絶縁部材４に設けた貫通孔６の端面との間に隙間１５を設けている。また、絶縁部材４における基板３側の面（接合面）に位置決め用の凹所１６を形成するとともに、凹所１６と凹凸係止する凸部１７を基板３の上面（接合面）に設けている。尚、隙間１５、凹所１６、凸部１７以外は実施形態２の光源装置１と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。
【００７０】
ここで、基板３及び絶縁部材４を接着剤で貼り合わせて形成する場合、余分な接着剤が接着面からはみ出す虞があり、実施形態２の光源装置ではＬＥＤチップ２がダイボンドされる部位のすぐ近傍に接着剤がはみ出すため、ＬＥＤチップ２から放射される光の一部が接着剤によって遮光される虞がある。また、はみ出した接着剤が突台部１１の先端面に付着して、ＬＥＤチップ２をダイボンドできなくなる虞もあるが、本実施形態の光源装置では、突台部１１と張出部４ａとの間に隙間１５を設けており、接着面からはみ出した接着剤は隙間１５に溜まるため、ＬＥＤチップ２がダイボンドされる部位の近傍に余分な接着剤がはみ出して、ＬＥＤチップ２から放射される光が遮光されたり、ＬＥＤチップ２をダイボンドできなくなるのを防止できる。
【００７１】
また、基板３に設けた凸部１７と、絶縁部材４に設けた凹所１６とを凹凸係止することによって、基板３と絶縁部材４との位置合わせを行うことができ、基板３及び絶縁部材４を貼り合わせる際の位置決めが容易に行える。尚、本実施形態では基板３に設けた凸部１７と、絶縁部材４に設けた凹所１６とで、基板３と絶縁部材４との位置決めを行うための位置決め手段を構成しているが、位置決め手段を凸部１７と凹所１６とに限定する趣旨のものではなく、適宜の手段を用いて基板３と絶縁部材４との位置決めを行うようにすれば良い。
【００７２】
（実施形態７）
本発明の実施形態７を図８を参照して説明する。本実施形態では、実施形態２の光源装置１において、絶縁部材４の基板３側の面に貫通孔６を中心として半径約１ｍｍの位置に幅約０．５ｍｍ、深さ約０．３ｍｍのリング状の溝４ｄを設けている。尚、溝４ｄ以外の構成は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
【００７３】
ここで、基板３と絶縁部材４とを接着剤で貼り合わせて接合する場合、余分な接着剤が接着面からはみ出す虞があり、実施形態２の光源装置１ではＬＥＤチップ２がダイボンドされる部位のすぐ近傍に接着剤がはみ出すため、ＬＥＤチップ２から放射される光の一部が接着剤によって遮光される虞がある。また、はみ出した接着剤が突台部１１の先端面に付着して、ＬＥＤチップ２をダイボンドできなくなる虞もある。それに対して、本実施形態の光源装置１では、突台部１１が嵌合される貫通孔６の周囲に溝４ｄが形成されているため、余分な接着剤２２はこの溝４ｄ内に溜まり、貫通孔６を通って突台部１１近傍にはみ出すのを防止できる。
【００７４】
また、接着剤２２の塗布にムラがある場合、基板３と絶縁部材４との接合面に接着剤２２が不足する部位が発生して隙間ができ、封止樹脂１０を充填する際にこの隙間を通って封止樹脂１０が漏れ出す虞があるが、本実施形態では、貫通孔６の周りに溝４ｄを形成しており、溝４ｄ内に溜まった接着剤２２が封止樹脂１０の流出を防止する堰の役割を果たすため、封止樹脂１０の流出を防止できる。
【００７５】
（実施形態８）
本発明の実施形態８を図９を参照して説明する。本実施形態では、実施形態２の光源装置１において、基板３の材料として例えば銅のような導電性材料を用い、突台部１１の上面に金のめっき層を形成している。また、配線パターン８は凹所５’内に１電極分のみを形成しており、ＬＥＤチップ２を、突台部１１と張出部４ａに形成された配線パターン８とに跨る位置に、一方の電極を突台部１１の上面と接触させるとともに、他方の電極を張出部４ａに形成された配線パターン８と接触させるようにしてフェースダウン実装している。尚、ＬＥＤチップ２の実装方法以外は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
【００７６】
本実施形態の光源装置１では、実施形態３と同様、ＬＥＤチップ２の電極が基板３側に配置されており、ＬＥＤチップ２の電極によって発光の一部が遮蔽されることがなく、全体として光量が低下するのを防止できる。また、実施形態２で説明したように、ＬＥＤチップ２から放射された光が張出部４ａの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。さらに、本実施形態では配線パターン８と基板３との間に電源Ｅと電流制限用の抵抗Ｒとを接続することによって、ＬＥＤチップ２に給電することができ、基板３を給電部の一部として利用しているため、凹所５’内へ延伸する配線パターン８を簡略化することができる。また、基板３を通じて裏面側に配線が引き出されるのと同じ効果があるため、光源装置１の電力を基板３の裏面側から供給することができる。
【００７７】
なお、本実施形態の光源装置１では、ＬＥＤチップ２をフェースダウン実装しているが、ＬＥＤチップ２をフェースアップでダイボンディング実装し、ボンディングワイヤを介してＬＥＤチップ２の電極と配線パターン８及び基板３とを電気的に接続するようにしても良い。
【００７８】
（実施形態９）
本発明の実施形態９を図１０を参照して説明する。実施形態８の光源装置１では基板３にＬＥＤチップ２を１個実装しているが、本実施形態では複数（例えば２個）のＬＥＤチップ２を基板３に実装している。また、基板３に互いに電気的に絶縁された複数の基板部（領域）３ａ，３ｂを設けており、各基板部３ａ，３ｂにそれぞれＬＥＤチップ２を１個づつ実装している。尚、基本的な構造は実施形態８と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
【００７９】
ところで、実施形態８の光源装置１では、基板３の材料として導電性材料を用いており、基板３は全体が同電位となっているので、基板３に複数のＬＥＤチップ２を実装した場合、これらのＬＥＤチップ２は全て並列に接続されることになる。ＬＥＤチップ２は個体ごとに若干駆動電圧が異なるため、複数のＬＥＤチップ２を並列接続した場合は、駆動電圧が最も低いＬＥＤチップ２に多大な電流が流れて、このＬＥＤチップ２が破損する虞がある。複数のＬＥＤチップ２に流れる電流を均一にするためには、個々のＬＥＤチップ２毎に電流制限用の抵抗を直列接続すれば良いが、ＬＥＤチップ２の数だけ電流制限用の抵抗が必要になり、電流制限用の抵抗で消費される電力損失が増大するという問題がある。
【００８０】
それに対して、本実施形態では基板３を互いに電気的に絶縁された複数の基板部３ａ，３ｂに分割し、各基板部３ａ，３ｂにＬＥＤチップ２，２を１個づつ実装しているので、各基板部３ａ，３ｂに実装されたＬＥＤチップ２，２を直列接続し、ＬＥＤチップ２，２の直列回路と並列に電流制限用の抵抗Ｒを介して直流電源Ｅを接続することにより、個々のＬＥＤチップ２に流れる電流を均一にできる。したがって、特定のＬＥＤチップ２に集中して電流が流れることがないから、電流集中によるＬＥＤチップ２の破損を防止でき、また電流制限用抵抗Ｒが複数のＬＥＤチップ２に対して１個で済むから、電流制限用の抵抗Ｒによって発生する電力損失を低減できる。
【００８１】
また本実施形態の光源装置１では、実施形態３と同様、ＬＥＤチップ２の電極が基板３側に配置されており、ＬＥＤチップ２の電極によって発光の一部が遮蔽されることがなく、全体として光量が低下するのを防止できる。また、実施形態２で説明したように、ＬＥＤチップ２から放射された光が張出部４ａの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。さらに、本実施形態では配線パターン８と基板３との間に電源Ｅと電流制限用の抵抗Ｒとを接続することによって、ＬＥＤチップ２に給電することができ、基板３を給電部の一部として利用しているため、凹所５’内へ延伸する配線パターンを簡略化することができる。また、基板３を通じて裏面側に配線が引き出されるのと同じ効果があるため、光源装置１の電力を基板３の裏面側から供給することができる。
【００８２】
（実施形態１０）
本発明の実施形態１０を図１１を参照して説明する。実施形態２の光源装置１では、絶縁部材４に設けた凹所５’内に封止樹脂１０を注入し（注型）、ＬＥＤチップ２やボンディングワイヤ９を封止しているが、本実施形態の光源装置１では、実施形態２の光源装置において、金型を用いたトランスファー成形によって樹脂封止を行っており、封止樹脂１０の表面に凸レンズ１０ａを形成している。尚、封止樹脂１０以外の構成は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。
【００８３】
実施形態２の光源装置１のように注型により樹脂封止を行う場合は、封止樹脂１０の表面を所望の形状に形成することはできないが、本実施形態の光源装置１では、基板３及び絶縁部材４ごと金型（図示せず）内に組み込み、圧入によって封止樹脂１０を押し込むトランスファー成形により樹脂封止を行っているので、封止樹脂１０の表面を凸レンズの形状に容易に形成することができ、封止樹脂１０から構成される凸レンズによってＬＥＤチップ２から放射された光を、ＬＥＤチップ２の前方の所望の方向に配光することができる。
【００８４】
尚、本実施形態では封止樹脂１０の表面を凸レンズの形状に形成しているが、封止樹脂１０の表面を凹レンズの形状に形成しても良く、凹レンズにより拡散光放射を行うようにしても良い。また、注型により樹脂封止を行う場合でも、凹所５’の内側面の面粗さや、形状や、表面処理などの条件を用いて、凹所５’の内側面と封止樹脂１０との濡れ性を制御することによって、封止樹脂１０の表面形状を制御することも可能であり、一般に濡れ性が良い場合は封止樹脂１０の表面形状は凹面となり、濡れ性が悪い場合は封止樹脂１０の表面形状は凸面となる。
【００８５】
（実施形態１１）
本発明の実施形態１１を図１２（ａ）（ｂ）を参照して説明する。図１２（ａ）は光源装置１の断面図、図１２（ｂ）は光源装置１の平面図をそれぞれ示す。本実施形態では、実施形態２の光源装置１において、絶縁部材４に形成した凹所５’の内面全体に、例えば銀のような導電性の高い材料により形成された高反射率の反射膜（反射部）１８を形成している。反射膜１８は配線パターン８，８に連続して形成されており、配線パターン８の延びる方向と直交する方向に延びる幅狭（例えば幅約０．２ｍｍ）のスリット２４によって２つの部位に分割され、それぞれの部位は電気的に絶縁されている。そして、突台部１１の上面に実装されたＬＥＤチップ２の電極と各反射膜１８，１８とをボンディングワイヤ９によって電気的に接続している。尚、反射膜１８以外の構成は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
【００８６】
本実施形態の光源装置１では、ＬＥＤチップ２から放射された光は、一部が封止樹脂１０を透過して直接外部へ放射されると共に、一部が反射膜１８によって反射され外部へ放射される。絶縁部材４の表面よりも、反射膜１８の方が反射率が高いため、実施形態２の光源装置１に比べて外部へと取り出される発光の割合が高くなる。さらに、本実施形態の光源装置１では、配線パターン８の一部で反射膜１８を兼用しているため、凹所５’内に配線パターン８と反射膜１８とを別々に形成する場合に比べて、配線パターン又は反射膜の形状を簡略化できる。尚、ボンディングワイヤ９をワイヤボンディングするためには、反射膜１８を材料を金とするのが望ましいが、反射膜１８を金により形成した場合は、青色発光のＬＥＤチップ２から放射される青色光を吸収してしまうため、本実施形態では反射膜１８の材料として銀を用いている。
【００８７】
（実施形態１２）
本発明の実施形態１２を図１３（ａ）（ｂ）を参照して説明する。実施形態２の光源装置１では、絶縁部材４における基板３と反対側の面に、突台部１１の直径と略同じ幅の配線パターン８，８を、突台部１１を通る同一直線上に形成しており、ＬＥＤチップ２の上面に設けた電極と各配線パターン８との間をボンディングワイヤ９を介して電気的に接続している。それに対して、本実施形態の光源装置１では、実施形態２の光源装置において、各配線パターン８の幅寸法を突台部１１の直径に比べて十分小さい幅寸法（例えば約０．５ｍｍ）とし、ＬＥＤチップ２の電極と各配線パターン８との間を接続するボンディングワイヤ９の延びる方向に、各配線パターン８を延長して形成している。そして、凹所５’の内側面および底面における配線パターン８以外の部位に、例えば銀から形成された高反射率の反射膜（反射部）１８を形成している。尚、配線パターン８及び反射膜１８以外の構成は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。
【００８８】
この光源装置１では、ＬＥＤチップ２から放射された光は、一部が封止樹脂１０を透過して直接外部へ放射されると共に、一部が反射膜１８によって反射され外部へ放射される。
【００８９】
ところで、実施形態２の光源装置１では、ＬＥＤチップ２から放射された光の一部はボンディングワイヤ９によって遮光される。また凹所５’の内側面および底面に形成された配線パターン８には、ワイヤーボンディングを容易に行えるようにするため、表面に金めっきを施しているが、青色発光や緑色発光のＬＥＤチップ２を用いる場合、金のめっき層はこれらの光に対して反射率が低いため、光源装置１の光出力が低下するという問題があった。
【００９０】
それに対して、本実施形態では、反射率の低い配線パターン８の幅寸法を狭くすると共に、ボンディングワイヤ９の延びる方向に配線パターン８を形成しているので、ボンディングワイヤ９の影となる部分と配線パターン８とを一致させることによって、ＬＥＤチップ２からの光が遮光される部位の面積を小さくできる。また、凹所５’の内側面および底面における配線パターン８以外の部位に反射膜１８を形成しているので、ＬＥＤチップ２からの光を効率良く反射させることができ、光取り出し効率を向上させることができる。
【００９１】
（実施形態１３）
本発明の実施形態１３を図１４を参照して説明する。本実施形態の光源装置１では、実施形態２の光源装置において、ＬＥＤチップ２として青色発光のＬＥＤチップを用いると共に、封止樹脂１０’の中にＬＥＤチップ２の青色発光により励起され補色である黄色発光を行う蛍光体粒子を分散させており、封止樹脂１０’に光色変換機能を持たせている。尚、封止樹脂１０’以外の構成は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
【００９２】
この光源装置１では、ＬＥＤチップ２からの青色発光と、蛍光体粒子によって一部変換された黄色光との混色によって、白色光を得ることができる。砲弾型発光ダイオードの場合は、初期光束の７０％にまで低下する寿命が約６０００時間程度と短いが、本実施形態の光源装置１では、ＬＥＤチップ２の放熱性を高めることにより、砲弾型発光ダイオードに比べて著しく寿命を延ばすことができ、長寿命の白色発光ダイオードを実現することができる。
【００９３】
（実施形態１４）
本発明の実施形態１４を図１５を参照して説明する。本実施形態の光源装置１では、実施形態１３の光源装置において凹所５’の側面形状を２段構造としている。すな わち、凹所５’の内側面には、凹所５’の底面側から開口側に行くにしたがって内径が徐々に大きくなり、約４５度の角度で傾斜するようなテーパ面４ｂが形成され、テーパ面４ｂの先端部から開口部にかけて、ＬＥＤチップ２からの光を所望の方向に反射して集光できるような断面形状を有する反射面４ｃが形成されている。また、絶縁部材４における基板３と反対側の面には、一対の配線パターン８が突台部１１を通る同一直線上に形成されており、反射面４ｃにおける配線パターン８以外の部位には、例えば銀などの高反射率の材料から形成された反射膜１８が形成されている。そして、凹所５’内にはテーパ面４ｂの先端部に達するまで封止樹脂１０’が注入されている。尚、凹所５’の側面形状以外の構成は実施形態１３と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
【００９４】
この光源装置１では、凹所５’の１段目から外部へと取り出される光は、封止樹脂１０’中に蛍光体粒子が分散されているため、完全拡散配光となっており、１段目から放射された光は非常に配光制御しやすくなっているので、２段目の反射面４ｃの形状を変更することによって、ＬＥＤチップ２からの光を所望の方向に配光することができる。
【００９５】
（実施形態１５）
本発明の実施形態１５を図１６を参照して説明する。本実施形態の光源装置１は、実施形態２で説明した光源装置１と同様の構造を有しており、実施形態２では基板３にＬＥＤチップ２を１個実装しているが、本実施形態では基板３にＬＥＤチップ２を２個実装し、２個のＬＥＤチップ２を配線パターン８を介して直列に接続している。尚、光源装置１の基本的な構成は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
【００９６】
ところで、一般に光源装置１としては発光部分以外の部位の面積を小さくするのが望ましいが、実施形態２で説明した光源装置１の場合、配線パターン８における絶縁部材４の上面に形成された部位を外部電源に接続するための通電部としており、通電部が発光の取り出し面側に位置しているため、通電部に通電するためのコネクタなどの部品を光源装置１の前面（発光面）側に配置する必要があり、これらの部品を配置するために発光部分以外の部位の面積が増加するという問題があった。
【００９７】
そこで、本実施形態の光源装置１では、絶縁部材４に設けた３個の配線パターン８の内、一方のＬＥＤチップ２のみに電気的に接続された両側の配線パターン８における絶縁部材４の上面（前面）に形成された平坦部８ｃに対応する基板３の部位に基板３を貫通する開口孔３ｃを設けており、この開口孔３ｃから露出する絶縁部材４の部位に絶縁部材４と配線パターン８とを貫通する貫通孔４ｅを設けている。そして、この貫通孔４ｅ内に、導電材料から略棒状に形成された電極ピン２３を絶縁部材４の上側から挿入して、電極ピン２３の先端部を基板３の下面から突出させており、電極ピン２３の先端を被固定部に固定すると、電極ピン２３と配線パターン８とが電気的に接続された状態で光源装置１が被固定部に固定される。尚、貫通孔４ｅの孔径は開口孔３ｃの孔径よりも小さい寸法に形成されている。
【００９８】
上述のように本実施形態では、配線パターン８に電気的に接続された電極ピン２３によって配線部の一部を基板側に向かって延伸させており、基板側に延伸された部分（すなわち電極ピン２３の先端部）を外部接続端子として、外部から給電することによって、基板３側からＬＥＤチップ２に給電することができる。したがって、コネクタなどの給電部品を基板３側（発光面と反対側）に配置することができ、発光の取り出し側から見た時に発光部分以外の部位の面積が全体に占める割合を低減でき、光源装置１の小型化を図るとともに、同じ面積であれば発光出力を大きくすることができる。
【００９９】
（実施形態１６）
本発明の実施形態１６を図１７を参照して説明する。本実施形態では、実施形態２で説明した光源装置１において、基板３の突台部１１を除いた部分を直径が約５ｍｍ、高さが約１０ｍｍの円柱形状として、上面略中央に突台部１１を突設している。一方、絶縁部材４の平面形状を一辺が約１０ｍｍの正方形としており、絶縁部材４の前面側に形成した配線パターン８を側面を通って裏面側まで延伸し、裏面側に回り込むように延伸された部位を外部接続端子８ｄとしている。尚、基板３及び配線パターン８以外の構成は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
【０１００】
図１７は本実施形態の光源装置１を器具本体４０に取り付けた状態を示している。器具本体４０は、直径が約６ｍｍの丸孔４１が開口したガラスエポキシ製の配線基板４２を備え、丸孔４１内に光源装置１の基板３を挿入して、絶縁部材４の裏面側に延伸された外部接続端子８ｄを配線基板４２の上面に形成された配線パターン４３に半田付けすることによって、光源装置１が器具本体４０に電気的且つ機械的に結合される。この時、丸孔４１から下方に突出する基板３の下面が器具本体４０の放熱部品４４に熱結合されるので、光源装置１の放熱性が向上する。このように、基板３の下面を配線基板４２とは別に用意した放熱部品４４と接触させ、放熱部品４４を介してＬＥＤチップ２の発熱を放熱しているので、配線基板４２には熱伝導性は低いものの安価なガラスエポキシ基板を用いることができ、コストダウンを図ることができる。
【０１０１】
なお、本実施形態では基板３にＬＥＤチップ２を１個だけ実装しているが、基板３に複数のＬＥＤチップ２を実装しても良いことは言うまでもない。
【０１０２】
（実施形態１７）
本発明の実施形態１７を図１８を参照して説明する。本実施形態では、実施形態２の光源装置１において、基板３の突台部１１を除いた部分を直径が約５ｍｍ、高さが約０．５ｍｍの円柱形状として、上面略中央に突台部１１を突設している。一方、絶縁部材４の平面形状を一辺が約２０ｍｍの正方形としており、基板３側の面に貫通孔６を中心とする直径が約５ｍｍ、深さが約０．５ｍｍの凹部２７を設けている。そして、絶縁部材４における凹部２７の外側の部位であって、絶縁部材４の前面側に設けた配線パターン８に対応する部位に絶縁部材４を貫通するスルーホール２８を設け、スルーホール２８内に導電材料を充填して形成された導電部８ｅを介して絶縁部材４の前面側に形成された配線パターン８と裏面側に形成された接続端子８ｆとを電気的に接続している。尚、基板３、絶縁部材４及び配線パターン８以外の構成は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
【０１０３】
図１８は本実施形態の光源装置１を器具本体の配線基板４２に実装した状態を示している。ここで、基板３の下面と絶縁部材４の下面とが略面一になるよう各部の寸法関係が設定されており、基板３を配線基板４２上に載置すると、絶縁部材４に設けた接続端子８ｆが配線基板４２に設けた配線パターン４３に電気的に接続されるので、配線基板４２からＬＥＤチップ２に給電することができる。したがって、この光源装置１を配線基板４２に取り付けるにあたり、光源装置１を配線基板４２のパターン面にそのまま実装することができ、しかも基板３の下面が配線基板４２と接触するので、光源装置１の放熱を配線基板４２を通じて放出することができ、放熱性の良好な表面実装形の光源装置１を実現できる。
【０１０４】
なお、本実施形態では基板３にＬＥＤチップ２を１個だけ実装しているが、基板３に複数のＬＥＤチップ２を実装しても良いことは言うまでもない。
【０１０５】
（実施形態１８）
本発明の実施形態１８を図１９を参照して説明する。実施形態２の光源装置１では基板３の一面のみにＬＥＤチップ２を実装しているが、本実施形態の光源装置１では基板３の両面にＬＥＤチップ２を実装している。尚、基板３の両面にＬＥＤチップ２を実装している点以外は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。
【０１０６】
この光源装置１では、基板３の両面に各２個の突台部１１を突設している。絶縁部材４における基板３の突台部１１に対応する部位には、基板３と反対側の面に開放された凹所５’が形成されており、凹所５’の底には絶縁部材４を貫通する貫通孔６が形成されている。ここで、貫通孔６の孔径は約１ｍｍであり、突台部１１の外径と略同じになっている。また凹所５’の底面の内径は約２ｍｍであり、凹所５’の側壁は基板３側から遠ざかるにしたがって内径が大きくなり、約４５度の角度で傾斜するような断面形状に形成されている。
【０１０７】
ここで、基板３及び絶縁部材４，４は貫通孔６と突台部１１とを嵌合させた状態で接合されており、貫通孔６から露出する突台部１１の部位には厚さが約０．２ｍｍのＬＥＤチップ２が、銀ペーストのようなダイボンディングペースト７を用いてダイボンドされている。また絶縁部材４における基板３と反対側の面には、銅などの導電材料からなる配線パターン８が形成され、その表面には金めっきを施してある。配線パターン８は凹所５’の側壁及び底面まで延設されており、凹所５’の底面を構成する張出部４ａに形成された配線パターン８とＬＥＤチップ２の上面に形成された電極との間は、例えば金のような金属細線からなるボンディングワイヤ９を介して電気的に接続されている。
【０１０８】
上述のように、本実施形態の光源装置１では、絶縁部材４とＬＥＤチップ２と配線パターン８と封止樹脂１０とが基板３の両面に設けられているので、ＬＥＤチップ２の発光を基板３の両面に放射させることができる。また、基板３の両面に同じ部品が配置されているので、基板３の反りを抑制することもできる。
【０１０９】
（実施形態１９）
以下に、本実施形態の光源装置１の製造方法を図２０（ａ）〜（ｅ）を参照して説明する。尚、本実施形態の光源装置１の構造は実施形態２と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。
【０１１０】
絶縁部材４として例えば液晶ポリマー、ポリフタルアミド、ポリフタルサルフォン、エポキシ、シンジオタクチックポリスチレン（以下ＳＰＳと記す）、ポリブチレンテレフタレート（以下ＰＢＴと記す）などの絶縁材料から形成されたＭＩＤ（Molded Interconnect Device）を用いており、射出成形或いはトランスファー成形によって凹所５’及び貫通孔６を形成している（図２０（ａ）参照）。そして、絶縁部材４の表面全体に、真空蒸着、ＤＣスパッタリング法、或いは、ＲＦスパッタリング法を用いて膜厚が例えば０．３μｍの銅薄膜を形成する。次に、銅薄膜を形成した基板３の表面にレーザ等の電磁波を照射して、電磁波を照射した部分のめっき下地層を除去する。尚、この時照射するレーザとしては、第２或いは第３高調波ＹＡＧレーザ、ＹＡＧレーザなどめっき下地材の吸収が良いものが好ましく、例えばガルバノミラーで走査することによって、回路部（配線パターン８）以外の絶縁スペースとなる部位（以下、非回路部と言う）に照射されるものであり、少なくとも非回路部における回路部との境界部分に非回路部のパターンに沿って照射することにより、非回路部における回路部との境界領域のめっき下地層を除去するものである。その後、回路部に給電して、電気銅めっき、電気ニッケルめっき、電気銀めっきなどを行い、所定の膜厚の金属膜を形成した配線パターン８を形成した後、非回路部をソフトエッチングなどで除去する（図２０（ｂ）参照）。尚、電気銀めっきの代わりに電気金めっきを施しても良く、光の反射効率や配線作業性を考慮してめっきの材料や厚みを適宜決定すれば良い。
【０１１１】
次に、アルミニウム、銀、銅など熱伝導性の良好な材料から形成された基板３を、エポキシ樹脂やアクリル樹脂などの接着剤を用いて、絶縁部材４の下面に貼り付ける（図２０（ｃ）参照）。この時、絶縁部材４の貫通孔６に対応する基板３の部位に予め突台部１１を形成しておくのが望ましい。また、接着剤を用い基板３及び絶縁部材４を貼り合わせる代わりに、突台部１１を貫通孔６に圧入することによって、基板３及び絶縁部材４を結合するようにしても良い。
【０１１２】
その後、絶縁部材４に設けた貫通孔６から露出する基板３の部位に、青色ＬＥＤチップ２を透光性を有する接着剤を用いてダイボンドし、直径が例えば２５μｍの金のボンディングワイヤ９を用いてワイヤボンディングを行う（図２０（ｄ）参照）。
【０１１３】
最後に、ＬＥＤチップ２の青色発光により励起され補色である黄色発光を行う蛍光体粒子を樹脂中に分散させた封止樹脂１０’を凹所５’に注入して、ＬＥＤチップ２やボンディングワイヤ９を封止する（図２０（ｅ）参照）。
【０１１４】
従来の光源装置では絶縁部材に切削加工を施してＬＥＤチップ２の実装部位を形成しているため、加工費用が高く、しかもＬＥＤチップ２の実装部位に切削傷ができるなどして面粗度が粗くなるため、ＬＥＤチップ２のボンディング作業がやりにくいという問題があるが、本実施形態では、上述のように基板３と絶縁部材４とを接合し、絶縁部材４の貫通孔６から露出する基板３の部位にＬＥＤチップ２を実装しているので、加工費用を低減でき、またＬＥＤチップ２の実装部位が平坦であり、且つ、絶縁部材４がＭＩＤにより構成されているから、ボンディングワイヤ９が接続されるパッド面が平坦で平面度が良く、ＬＥＤチップ２を容易に実装できる。また、ボンディングワイヤ９は凹所５’内に納められるので、凹所５’内に充填した封止樹脂１０’からボンディングワイヤ９がはみ出ることはなく、ボンディングワイヤ９が断線する確率が少なくなり、信頼性が向上する。
【０１１５】
（実施形態２０）
以下に、本実施形態の光源装置の製造方法を図２１（ａ）〜（ｄ）を参照して説明する。尚、本実施形態の光源装置１の構造は実施形態２の光源装置と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。
【０１１６】
絶縁部材４として例えば液晶ポリマー、ポリフタルアミド、ポリフタルサルフォン、エポキシ、ＳＰＳ、ＰＢＴなどの絶縁材料から形成されたＭＩＤを用いている。また、基板３の材料として銀、アルミ、銅などの熱伝導性の良好な材料を用い、基板３と絶縁部材４とをインサート成形により同時に形成する（図２１（ａ）参照）。
【０１１７】
その後、絶縁部材４の表面全体に、真空蒸着、ＤＣスパッタリング法、或いは、ＲＦスパッタリング法を用いて膜厚が例えば０．３μｍの銅薄膜を形成する。次に、銅薄膜を形成した基板３の表面にレーザ等の電磁波を照射して、電磁波を照射した部分のめっき下地層を除去する。尚、この時照射するレーザとしては、第２或いは第３高調波ＹＡＧレーザ、ＹＡＧレーザなどめっき下地材の吸収が良いものが好ましく、例えばガルバノミラーで走査することによって、回路部（配線パターン８）以外の絶縁スペースとなる部位（以下、非回路部と言う）に照射されるものであり、少なくとも非回路部における回路部との境界部分に非回路部のパターンに沿って照射することにより、非回路部における回路部との境界領域のめっき下地層を除去するものである。その後、回路部に給電して、電気銅めっき、電気ニッケルめっき、電気銀めっきなどを行い、所定の膜厚の金属膜を形成した配線パターン８を形成した後、非回路部をソフトエッチングなどで除去する（図２１（ｂ）参照）。尚、電気銀めっきの代わりに電気金めっきを施しても良く、光の反射効率や配線作業性を考慮してめっきの材料や厚みを適宜決定すれば良い。
【０１１８】
その後、絶縁部材４に設けた貫通孔６から露出する基板３の部位に、青色ＬＥＤチップ２を透光性を有する接着剤を用いてダイボンドし、直径が例えば２５μｍの金のボンディングワイヤ９を用いてワイヤボンディングを行う（図２１（ｃ）参照）。
【０１１９】
最後に、ＬＥＤチップ２の青色発光により励起され補色である黄色発光を行う蛍光体粒子を樹脂中に分散させた封止樹脂１０’を凹所５’に注入して、ＬＥＤチップ２やボンディングワイヤ９を封止する（図２１（ｄ）参照）。
【０１２０】
ところで、従来の光源装置では絶縁部材に切削加工を施してＬＥＤチップ２の実装部位を形成しているため、加工費用が高く、しかもＬＥＤチップ２の実装部位に切削傷ができるなどして面粗度が粗くなるため、ＬＥＤチップ２のボンディング作業がやりにくいという問題があるが、本実施形態では、上述のように基板３と絶縁部材４とをインサート成形し、絶縁部材４の貫通孔６から露出する基板３の部位にＬＥＤチップ２を実装しているので、ＬＥＤチップ２が実装される基板３の部位が平坦であり、且つ、絶縁部材４をＭＩＤにより構成しているので、ボンディングワイヤ９が接続されるパッド面が平坦で平面度が良く、ＬＥＤチップ２を容易に実装できる。また、ボンディングワイヤ９は凹所５’内に納められるので、凹所５’内に充填した封止樹脂１０’からボンディングワイヤ９がはみ出ることはなく、ボンディングワイヤ９が断線する確率が少なくなり、信頼性が向上する。また、基板３と絶縁部材４とをインサート成形により形成しているので、基板３及び絶縁部材４を接合する工程を無くすことができ、製造コストを低減できる。
【０１２１】
（実施形態２１）
以下に、本実施形態の光源装置の製造方法を図２２（ａ）〜（ｅ）を参照して説明する。尚、本実施形態の光源装置１の構造は実施形態２の光源装置と略同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。
【０１２２】
先ず厚みが約１ｍｍのリードフレーム２０ａを打ち抜いて、曲げ等の形状を形成することにより、突台部１１の突設された基板３を形成すると共に、厚みが約０．２ｍｍのリードフレーム２０ｂを打ち抜いて、曲げ等の形状を形成することにより、突台部１１を挿通させる挿通孔８ａが形成された配線部８’を形成している（図２２（ａ）参照）。尚、リードフレーム２０ａ，２０ｂの材料としては、例えば銅、４２アロイなど導電性、熱伝導性の優れた材料を用いている。
【０１２３】
そして、ＬＥＤチップ２がダイボンドされる突台部１１と、ボンディングワイヤ９の接続される配線部８’の部位に部分的に電気ニッケルめっき、電気銀めっきを行う。尚、ボンディングワイヤ９が接続されるワイヤパッド部８ｂは、電気銀めっきの代わりに電気金めっきを施しても良く、ボンディングワイヤ９の接続作業を容易に行える（図２２（ｂ）参照）。
【０１２４】
次に、ＭＩＤの材料として液晶ポリマー、ポリフタルアミド、ポリフタルサルフォン、エポキシ、ＳＰＳ、ＰＢＴなどの絶縁性を有する材料を用い、部分めっきの施された配線部８’と基板３とをインサート成形により同時成形する（図２２（ｃ）参照）。この時、ＭＩＤからなる絶縁部材４に形成された凹所５’の底面に、基板３の突台部１１と配線部８’のワイヤパッド部８ｂとが露出する。
【０１２５】
その後、基板３の突台部１１に青色ＬＥＤチップ２を透光性を有する接着剤を用いてダイボンドし、直径が例えば２５μｍの金のボンディングワイヤ９を用いてワイヤボンディングを行う（図２２（ｄ）参照）。
【０１２６】
最後に、ＬＥＤチップ２の青色発光により励起され補色である黄色発光を行う蛍光体粒子を樹脂中に分散させた封止樹脂１０’を凹所５’に注入して、ＬＥＤチップ２やボンディングワイヤ９を封止する（図２２（ｅ）参照）。
【０１２７】
ところで、従来の光源装置では絶縁部材に切削加工を施してＬＥＤチップ２の実装部位を形成しているため、加工費用が高く、しかもＬＥＤチップ２の実装部位に切削傷ができるなどして面粗度が粗くなるため、ＬＥＤチップ２のボンディング作業がやりにくいという問題があるが、本実施形態では、上述のように基板３と絶縁部材４とをインサート成形し、絶縁部材４に設けた凹所５’内に露出する基板３の部位にＬＥＤチップ２を実装しているので、ＬＥＤチップ２の実装部位が平坦であり、且つ、絶縁部材４がＭＩＤにより構成されているから、ボンディングワイヤ９が接続されるパッド面が平坦で平面度が良く、ＬＥＤチップ２を容易に実装できる。また、ボンディングワイヤ９は凹所５’内に納められるので、凹所５’内に充填した封止樹脂１０’からボンディングワイヤ９がはみ出ることはなく、ボンディングワイヤ９が断線する確率が少なくなり、信頼性が向上する。また、基板３と絶縁部材４とをインサート成形により形成しているので、基板３及び絶縁部材４を接合する工程を無くすことができ、製造コストを低減できる。
【０１２８】
（実施形態２２）
以下に、本実施形態の光源装置の製造方法を図２３（ａ）〜（ｆ）を参照して説明する。尚、本実施形態の光源装置の構造は実施形態５の光源装置と同様であるので、同一の構成要素には同一の符号を付してその説明を省略する。
【０１２９】
絶縁部材４として例えば液晶ポリマー、ポリフタルアミド、ポリフタルサルフォン、エポキシ、ＳＰＳ、ＰＢＴなどの絶縁材料から形成されたＭＩＤを用いている。また、ベース板３’の材料として銀、アルミ、銅などの熱伝導性の良好な材料を用い、ベース板３’と絶縁部材４とをインサート成形により同時に形成する（図２３（ａ）参照）。
【０１３０】
その後、絶縁部材４の表面全体に、真空蒸着、ＤＣスパッタリング法、或いは、ＲＦスパッタリング法を用いて膜厚が例えば０．３μｍの銅薄膜を形成する。次に、銅薄膜を形成したベース板３’の表面にレーザ等の電磁波を照射して、電磁波を照射した部分のめっき下地層を除去する。尚、この時照射するレーザとしては、第２或いは第３高調波ＹＡＧレーザ、ＹＡＧレーザなどめっき下地材の吸収が良いものが好ましく、例えばガルバノミラーで走査することによって、回路部（配線パターン８）以外の絶縁スペースとなる部位（以下、非回路部と言う）に照射されるものであり、少なくとも非回路部における回路部との境界部分に非回路部のパターンに沿って照射することにより、非回路部における回路部との境界領域のめっき下地層を除去するものである。その後、回路部に給電して、電気銅めっき、電気ニッケルめっき、電気銀めっきなどを行い、所定の膜厚の金属膜を形成した配線パターン８を形成した後、非回路部をソフトエッチングなどで除去する（図２３（ｂ）参照）。尚、電気銀めっきの代わりに電気金めっきを施しても良く、光の反射効率や配線作業性を考慮してめっきの材料や厚みを適宜決定すれば良い。
【０１３１】
次に、アルミニウムや銅などの熱伝導性の良好な金属から柱状（角柱又は円柱）の熱伝導体１４を形成し、熱伝導体１４の上面にＬＥＤチップ２を透光性を有するボンディングペーストを用いてダイボンドした後（図２４（ｃ）参照）、ベース板３’及び絶縁部材４にそれぞれ形成された連通孔１３及び貫通孔６内にベース板３’側からＬＥＤチップ２の実装された熱伝導体１４を圧入する（図２４（ｄ）参照）。この時、熱伝導体１４はベース板３’に設けた連通孔１３内に圧入されているので、熱伝導体１４とベース板３’とが密着し、熱伝導体１４とベース板３’との間の熱伝導が大きくなる。
【０１３２】
その後、ＬＥＤチップ２上面の電極と配線パターン８との間を、直径が例えば２５μｍの金のボンディングワイヤ９を介して接続し（図２３（ｅ）参照）、ＬＥＤチップ２の青色発光により励起され補色である黄色発光を行う蛍光体粒子を樹脂中に分散させた封止樹脂１０’を凹所５’に注入して、ＬＥＤチップ２やボンディングワイヤ９を封止する（図２３（ｆ）参照）。
【０１３３】
本実施形態では上述の製造方法を用いて光源装置１を製造しており、熱伝導体１４にＬＥＤチップ２を予め実装しているので、ＬＥＤチップ２のダイボンドされる熱伝導体１４の部位を平坦にし、且つ平面度を良くできるので、ＬＥＤチップ２を容易に実装することができる。また、ＬＥＤチップ２が実装される突台部１１を、熱伝導体１４をベース板３’に設けた連通孔１３内に圧入することにより形成しているので、突台部１１を切削加工により形成する場合に比べて、加工費用を低減できる。
【０１３４】
尚、上述した各実施形態において各部の寸法を説明しているが、各部の寸法を上記の寸法に限定する趣旨のものではなく、各部の寸法は適宜設定すれば良い。
【０１３５】
【発明の効果】
上述のように、請求項１の発明は、熱伝導性を有する基板と、基板の少なくとも一方の面に配設された絶縁部材と、基板と対向する絶縁部材の部位に絶縁部材を貫通して設けられた孔と、この孔から露出する基板の部位に対向させ且つ熱結合させて配置されたＬＥＤチップと、絶縁部材に設けられ絶縁部材によって基板と電気的に絶縁された配線部を含む給電部と、給電部とＬＥＤチップの電極との間を電気的に接続する接続部材と、孔内に充填されＬＥＤチップ及び接続部材の全体を封止する透光性を有する封止材料とを備え、絶縁部材に設けた孔の基板側の開口縁に内側に突出する張出部を設け、この張出部に配線部の少なくとも一部を配置し、張出部に配置された配線部の部位にＬＥＤチップの電極を電気的に接続しており、絶縁部材側に突出し絶縁部材に設けた孔内に挿入される突台部を基板に設け、この突台部にＬＥＤチップを対向させ且つ熱結合させて配置したことを特徴とし、ＬＥＤチップは絶縁部材に設けた孔から露出する基板の部位に対向させ且つ熱結合させて配置されているので、熱伝導性を有する基板を介してＬＥＤチップの発熱を放出することができ、放熱性を向上させた光源装置を実現できる。したがって、ＬＥＤチップの温度上昇が抑制され、温度上昇による発光効率の低下を防止することができるという効果がある。しかもＬＥＤチップの温度上昇が低減されるから、より大きな順方向電流をＬＥＤチップに印加して、ＬＥＤチップの光出力を増大させることもでき、またＬＥＤチップや封止材料の熱的な劣化が低減され、長寿命化が図れるという効果もある。さらに、孔内に充填された封止材料によってＬＥＤチップ及び接続部材の全体を封止しており、ＬＥＤチップと給電部とを電気的に接続する接続部材として金属線を用いた場合にも、樹脂の界面で発生する応力によって金属線が断線する虞はなく、機械的強度が向上するという効果もある。しかも、基板に突台部を設けることによって、突台部の高さ分だけ張出部の厚み寸法を厚くすることができるから、張出部の加工を容易に行え、且つ、張出部の厚み寸法を厚くすることによって、張出部の剛性を高くし、基板と絶縁部材とを接合する際に張出部と基板との間に隙間ができるのを防止できるという効果がある。
【０１３６】
請求項２の発明は、請求項１の発明において、ＬＥＤチップに接続部材を介して電気的に接続される配線部の部位は孔内に配置されており、封止材料は孔の開口付近まで充填されたことを特徴とし、封止材料の表面が孔の開口付近にくるまで封止材料を充填することによって、封止材料の充填量を略一定とすることができ、品質のばらつきを抑制できるという効果がある。
【０１３７】
請求項３の発明は、請求項１の発明において、上記接続部材は金属線からなり、基板及び絶縁部材の接合方向において、金属線の一端が接続されるＬＥＤチップの部位と、金属線の他端が接続される配線部の部位の高さを略同じ高さとしたことを特徴とし、ＬＥＤチップと配線部との間を電気的に接続する金属線の長さを短くできるから、金属線の機械的強度を高くでき、またＬＥＤチップと配線部の高さを略同じ高さとすることにより、ボンディング作業を容易に行えるという効果がある。
【０１３８】
請求項４の発明は、請求項１の発明において、基板及び絶縁部材の接合方向において、ＬＥＤチップが実装される突台部と、ＬＥＤチップに電気的に接続される配線部の部位の高さを略同じ高さとしたことを特徴とし、ＬＥＤチップから放射される光が配線部に遮光されることはなく、光のけられを少なくして、光の取り出し効率が向上するという効果がある。
【０１３９】
請求項５の発明は、請求項１の発明において、突台部は、基板における絶縁部材と反対側の面から打ち出し加工を行って凹所を形成することにより、基板における絶縁部材側の面に打ち出されたことを特徴とし、打ち出し加工を行うことによって突台部を形成しているので、切削加工により突台部を形成する場合に比べて加工費用を低減できるという効果がある。また、基板と絶縁部材とを接着剤で貼り合わせた場合、接着剤の熱収縮によって基板全体が絶縁部材側に反ってしまうが、打ち出し加工を行って凹所を形成することにより、基板全体が絶縁部材と反対側に反るので、接着材の熱収縮によって発生する基板の反りを相殺し、全体として基板が反るのを防止できるという効果がある。
【０１４０】
請求項６の発明は、請求項１の発明において、基板を、孔に連通する連通孔が形成されたベース板と、連通孔内に取り付けられ先端が絶縁部材側に突出する突起部とで構成し、突起部の先端により突台部を構成したことを特徴とし、ベース板の孔に突起部を挿入し、突起部の先端を絶縁部材側に突出させることによって突台部を形成しているので、突台部を切削加工により形成する場合に比べて、突台部の加工を容易に行えるという効果がある。
【０１４１】
請求項７の発明は、請求項１の発明において、孔と突台部との間に隙間を設けたことを特徴とし、基板と絶縁部材とを接着剤で貼り合わせた場合、基板と絶縁部材との接合面から余分な接着剤がはみ出し、はみ出した接着剤によってＬＥＤチップの光が遮光されたり、ＬＥＤチップを実装できなくなる虞があるが、はみ出した接着剤は孔と突台部との間に設けた隙間に溜まるので、接着剤が突台部の上面まで這い上がってくることはなく、はみ出した接着剤によってＬＥＤチップの光が遮光されたり、ＬＥＤチップを実装できなくなるのを防止できるという効果がある。
【０１４２】
請求項８の発明は、請求項１乃至７の発明において、基板と絶縁部材との位置決めを行うための位置決め手段を基板と絶縁部材との接合面に設けたことを特徴とし、位置決め手段により基板と絶縁部材との位置決めを行うことができ、基板と絶縁部材との接合作業を容易に行えるという効果がある。
【０１４３】
請求項９の発明は、請求項１乃至７の発明において、基板と絶縁部材との接合面に接合に用いる接着剤の溜まり部を絶縁部材の孔の周りに設けたことを特徴とし、基板と絶縁部材とを接着剤で貼り合わせた場合、基板と絶縁部材との接合面から余分な接着剤がはみ出し、はみ出した接着剤によってＬＥＤチップの光が遮光されたり、ＬＥＤチップを実装できなくなる虞があるが、接合時に余分な接着剤は溜まり部に溜まるため、接着剤のはみ出しを防止できるという効果がある。また、基板と絶縁部材との接合面に接着剤が不足している部分があると、この部分にできる隙間から封止材料が漏れ出す虞があるが、余分な接着剤を溜める溜まり部が絶縁部材に設けた孔の周りに設けられ、溜まり部に溜まった余分な接着剤は孔から露出する基板の部位を囲むようにして配置されるので、溜まり部に溜まった接着剤が封止材料をせき止める堰の役割を果たして、封止材料が漏れ出すのを防止できるという効果がある。
【０１４４】
請求項１０の発明は、請求項１の発明において、上記給電部は導電性材料により形成された基板を含み、基板とＬＥＤチップの電極とを電気的に接続したことを特徴とし、基板そのものを給電部としており、ＬＥＤチップの一方の電極を基板に接続するとともに、ＬＥＤチップの他方の電極を配線部に接続することによって、ＬＥＤチップに給電することができるから、絶縁部材の表面に形成する配線部が１回路分で済むという利点がある。また、ＬＥＤチップに給電するための回路の一部を基板が担っているので、回路を基板側に容易に引き出すことができるという効果がある。
【０１４５】
請求項１１の発明は、請求項１０の発明において、上記基板に、互いに電気的に絶縁された複数の領域を設けたことを特徴としている。ところで、一枚の基板に複数のＬＥＤチップが実装される場合、一枚の基板が互いに電気的に絶縁された複数の領域に分割されていないと、全てのＬＥＤチップが並列に接続されることになる。ここで、ＬＥＤチップは個体ごとに駆動電圧が若干異なるため、複数のＬＥＤチップが並列に接続されると、駆動電圧が最も低いＬＥＤチップに多大な電流が流れて、ＬＥＤチップが破損する虞がある。そこで、複数のＬＥＤチップに流れる電流を均等にするために、個々のＬＥＤチップ毎に電流制限用の抵抗を直列接続する方法が考えられるが、ＬＥＤチップの数だけ電流制限用の抵抗が必要になり、各抵抗で消費される電力ロスが増大する。それに対して本発明では、基板に、互いに電気的に絶縁された複数の領域を設けており、各領域にそれぞれＬＥＤチップを実装し、各領域に実装されたＬＥＤチップを直列に接続すれば、個々のＬＥＤチップに流れる電流値を略一定にすることができ、且つ、直列接続された複数のＬＥＤチップに対して電流制限用の抵抗を１個接続すれば、各ＬＥＤチップに流れる電流を制限できるから、電流制限用の抵抗で消費される電力ロスを小さくできるという効果がある。
【０１４６】
請求項１２の発明は、請求項１の発明において、封止材料の表面を、ＬＥＤチップの発光を所望の方向に配光するレンズ形状としたことを特徴とし、封止材料の表面をレンズ形状としたことにより、別途レンズを設けることなく、ＬＥＤチップの発光を所望の方向に配光することができるという効果がある。
【０１４７】
請求項１３発明は、請求項１の発明において、孔の側壁にＬＥＤチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とし、反射部によってＬＥＤチップの光を反射して所望の方向へ配光することにより、光の取り出し効率が向上するという効果がある。
【０１４８】
請求項１４の発明は、請求項１３の発明において、上記反射部を配線部で兼用したことを特徴とし、配線部が反射部を兼用することにより、絶縁部材の表面に形成される配線部及び反射部のパターンを簡素化できるという効果がある。
【０１４９】
請求項１５の発明は、請求項１３の発明において、上記接続部材は金属線からなり、金属線の延びる方向に配線部を配設したことを特徴とし、ＬＥＤチップからの光は金属線によって遮光されるが、金属線の影となる部分に配線部を配置しているので、配線部以外の部位に形成された反射部によって、ＬＥＤチップからの光を所望の方向に配光することができるという効果がある。
【０１５０】
請求項１６の発明は、請求項１の発明において、封止材料は、ＬＥＤチップから放射された光の少なくとも一部を所定の光色に変換する光色変換機能を有することを特徴とし、封止材料によって光色が変換された光と、ＬＥＤチップからの光とを混色することによって、所望の光色の光を得ることができるという効果がある。
【０１５１】
請求項１７の発明は、請求項１６の発明において、封止材料の表面は、絶縁部材における基板と反対側の面よりも基板側に位置し、孔の周壁にＬＥＤチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とし、ＬＥＤチップからの光は封止材料を通過することによって分散され、完全拡散配光となっているので、配光制御しやすくなっており、反射部によって所望の方向に配光することができるという効果がある。
【０１５２】
請求項１８の発明は、請求項１の発明において、配線部の一部を基板側に向かって延伸し、この延伸された部分で外部接続端子を構成することを特徴とし、配線部の一部を基板側に向かって延伸し、この延伸された部位を外部接続端子としているので、基板側から配線部への給電を容易に行えるという効果がある。なお、配線部の一部を基板側に向かって延伸させる形態としては種々考えられるが、例えば絶縁部材の端部に沿って配線部を基板側に延伸したり、絶縁部材にスルーホールを形成し、このスルーホール内に導電性材料を充填することによって配線部を基板側に延伸することが考えられる。また基板側に向かって延伸する配線部の長さも必要に応じて決定され、絶縁部材の途中まで又は基板側の面まで延伸しても良いし、基板側の面に一部を回り込ませるようにしても良いし、また基板の向こう側まで突出するようにしても良い。
【０１５３】
請求項１９の発明は、請求項１８の発明において、上記配線部の一部が、絶縁部材における基板との対向面まで延伸されたことを特徴とし、配線部の一部を基板との対向面まで延伸させているので、この延伸された部分に対して容易に給電することができるという効果がある。例えば、基板と嵌合する穴の形成された器具本体にこの光源装置を実装する場合、配線部の一部を絶縁部材における基板との対向面まで延伸しているので、器具本体の穴に基板部分を嵌合すれば、器具本体に形成された配線部と光源装置の配線部との電気的接続を容易に行うことができ、さらに基板部分を穴内に嵌め込んで器具本体と接触させるようにすれば、放熱性が向上する。
【０１５４】
請求項２０の発明は、請求項１８又は１９の発明において、絶縁部材の一部を基板側に向かって延伸し、この延伸された部分の先端を、基板における絶縁部材と反対側の面と略面一にしたことを特徴とし、絶縁部材の基板側に延伸された部位に器具本体の表面に載置して光源装置を器具本体に実装する際に、絶縁部材の延伸された部位が基板における絶縁部材と反対側の面と略面一になっているので、絶縁部材を器具本体の表面に載置するだけで、基板が器具本体の表面に接触するから、ＬＥＤチップの発熱が基板を介して器具本体に放出され、冷却効果が向上するという効果がある。しかも、配線部の一部を基板側に延伸させて外部接続端子としているので、外部接続端子と器具本体の表面に形成された配線部との電気的接続を容易に行えるという効果がある。さらに、絶縁部材の基板側に延伸された部位の先端面に外部接続端子を形成すれば放熱性を向上させた表面実装型の光源装置を実現できる。
【０１５５】
請求項２１の発明は、請求項１の発明において、絶縁部材とＬＥＤチップと配線部と封止部材とが基板の両面に設けられたことを特徴とし、基板の両面からＬＥＤチップの光を放射させることができ、且つ、基板の両面に同じ部品が配設されているので、基板の反りを抑制することができるという効果がある。
【図面の簡単な説明】
【図１】 光源装置の基本構成を示し、（ａ）は断面図、（ｂ）は平面図である。
【図２】 実施形態１の光源装置を示す断面図である。
【図３】 （ａ）（ｂ）は実施形態２の光源装置を示す断面図である。
【図４】 （ａ）（ｂ）は実施形態３の光源装置を示す断面図である。
【図５】 実施形態４の光源装置を示す断面図である。
【図６】 実施形態５の光源装置を示す断面図である。
【図７】 実施形態６の光源装置を示す断面図である。
【図８】 実施形態７の光源装置を示す断面図である。
【図９】 実施形態８の光源装置を示す断面図である。
【図１０】 実施形態９の光源装置を示す断面図である。
【図１１】 実施形態１０の光源装置を示す断面図である。
【図１２】 実施形態１１の光源装置を示し、（ａ）は断面図、（ｂ）は平面図である。
【図１３】 実施形態１２の光源装置を示し、（ａ）は断面図、（ｂ）は平面図である。
【図１４】 実施形態１３の光源装置を示す断面図である。
【図１５】 実施形態１４の光源装置を示す断面図である。
【図１６】 実施形態１５の光源装置を示す断面図である。
【図１７】 実施形態１６の光源装置を示す断面図である。
【図１８】 実施形態１７の光源装置を示す断面図である。
【図１９】 実施形態１８の光源装置を示す断面図である。
【図２０】 （ａ）〜（ｅ）は実施形態１９の光源装置の各製造工程を示す断面図である。
【図２１】 （ａ）〜（ｄ）は実施形態２０の光源装置の各製造工程を示す断面図である。
【図２２】 （ａ）〜（ｅ）は実施形態２１の光源装置の各製造工程を示す断面図である。
【図２３】 （ａ）〜（ｆ）は実施形態２２の光源装置の各製造工程を示す断面図である。
【図２４】 従来の光源装置の断面図である。
【図２５】 従来の別の光源装置の断面図である。
【符号の説明】
１ 光源装置
２ ＬＥＤチップ
３ 基板
４ 絶縁部材
４ａ 張出部
６ 貫通孔
８ 配線パターン
９ ボンディングワイヤ
１０ 封止樹脂[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a light source device using a light emitting diode.In placeIt is related.
[0002]
[Prior art]
  As this type of light source device, one using a bullet-type light emitting diode as shown in FIG. 24 has been conventionally provided, and a single light emitting diode is used or a plurality of light emitting diodes are mounted on the substrate 30. Some were used in an array.
[0003]
  In the bullet-type light emitting diode, the LED chip 2 is die-bonded using a die bonding paste 7 such as silver paste or epoxy resin on a recess 31 a provided in a metal lead frame 31, and the LED chip 2 is formed on the upper surface of the LED chip 2. After wire bonding between the provided electrode portion (not shown) and the lead frames 31 and 32 with a bonding wire 9 made of a thin metal wire such as gold, the lead frames 31 and 32 are made with a light-transmitting sealing resin 33. The LED chip 2 and the bonding wire 9 are sealed.
[0004]
  Here, an epoxy resin is mainly used as the sealing resin 33, and the sealing resin 33 has the following three functions. First, the sealing resin 33 has a protective function for protecting components from mechanical shocks and protecting the LED chip 2 from moisture. Further, since the refractive index of the light emitting part of the LED chip 2 is as high as about 2.8, total reflection occurs due to the difference in refractive index at the interface between the LED chip 2 surface and air, and the light extraction efficiency of the LED chip 2 is improved. Although there is a problem that it is low, the sealing resin 33 has a function of improving the light extraction efficiency from the LED chip 2 by covering the surface of the LED chip 2 with an epoxy resin having a refractive index of about 1.8. Furthermore, the sealing resin 33 has a light control function of collecting or diffusing light emitted from the LED chip 2 by the lens effect on the surface of the sealing resin 33.
[0005]
  The lead frames 31 and 32 have a function of supporting the LED chip 2 as a foundation when the LED chip 2 is die-bonded, and an LED chip having a mirror surface around the recess 31a where the LED chip 2 is die-bonded. 2 has a function of efficiently distributing light emitted from 2 forward, and a function of releasing heat generated by the LED chip 2 to the outside through the substrate 30 or the like by heat conduction.
[0006]
[Problems to be solved by the invention]
  By the way, in LED chip 2, in the normal use temperature range as a lighting fixture, luminous efficiency becomes high, so that it becomes low temperature, and luminous efficiency falls, so that it becomes high temperature. This is because non-radiative coupling between electrons and holes increases as lattice vibration increases due to temperature rise. In the light source device using a light emitting diode, the portion that generates heat is mainly the LED chip 2. Therefore, the heat generated in the LED chip 2 is quickly radiated to the outside, and the temperature of the LED chip 2 is reduced. This is a very important issue in improving luminous efficiency.
[0007]
  Moreover, since the temperature rise of the LED chip 2 itself can be suppressed by improving the heat dissipation characteristics from the LED chip 2 to the outside, the LED chip 2 can be used by passing a large forward current. The output can be increased. Furthermore, the effect of extending the lifetime of the LED chip 2 can be obtained by enhancing the heat dissipation characteristics.
[0008]
  In addition, as a reason which the lifetime of LED chip 2 is improved, the following two reasons can be considered. Similarly to a general lighting fixture, when the lifetime of the LED chip 2 is defined as a point in time when the luminous flux is reduced to about 70% at the beginning of lighting, the red light emitting diode is considered to have a lifetime of about 60,000 hours. For example, when a forward current greater than the rated current is applied to the LED chip 2 and the LED chip 2 is used in an overload state, the deterioration of the LED chip 2 is significantly accelerated by the heat generated by the LED chip 2 itself. Therefore, by improving the heat dissipation characteristics, the temperature rise of the LED chip 2 can be suppressed and the life of the LED chip 2 can be prevented from being shortened.
[0009]
  In addition, blue light emitting diodes and white light emitting diodes that use blue light emitting diodes to convert blue light from blue light emitting diodes into white light and output them have higher radiation energy than conventional red light emitting diodes, and therefore LED chips. The sealing resin 33 that seals 2 deteriorates due to the emitted light of the LED chip 2 and is colored brown. When the coloring of the sealing resin 33 starts, it becomes easier to absorb blue light and the coloring of the sealing resin 33 is further accelerated. As a result, the sealing resin 33 near the LED chip 2 is brown. Although the LED chip 2 itself maintains the light flux at the initial lighting, the light emitted from the sealing resin 33 to the outside is significantly reduced. Thus, when the sealing resin 33 is colored brown, in the case of a blue light emitting diode or a white light emitting diode, the lifetime is about 6000 hours, which is significantly shorter than that of a red light emitting diode. By the way, although the color reaction of the sealing resin 33 is a photochemical reaction, it is generally known that when the temperature of the sealing resin 33 increases, the reaction rate of the color reaction increases. By improving the heat dissipation characteristics to the outside, the temperature of the LED chip 2 and the sealing resin 33 can be reduced, and the color reaction of the sealing resin 33 due to the light emission of the LED chip 2 can be suppressed.
[0010]
  As described above, in the light source device using the light emitting diode, it is very important to improve the heat radiation characteristics to the outside from the LED chip 2 from the viewpoint of improving the light emission efficiency, increasing the light output, and extending the life. . However, in the bullet-type light emitting diode, there are two heat dissipation paths for releasing the heat generated by the LED chip 2, the path for releasing to the substrate 30 through the lead frame 31 and the path for releasing into the air through the sealing resin 33. In the path for radiating heat through the stop resin 33, the thermal conductivity of the epoxy resin is low, so that a sufficient heat dissipation effect cannot be obtained. Therefore, the heat dissipation path that radiates heat through the lead frame 31 is mainly used, but since the lead frame 31 itself is thin and the heat dissipation path is as long as about 7 to 10 mm, a larger heat dissipation effect than the path that radiates heat through the sealing resin 33 is obtained. However, a sufficient heat dissipation effect could not be expected, and it was difficult to realize a light source device with improved heat dissipation characteristics.
[0011]
  In order to further improve the heat dissipation characteristics, a light source device in which the LED chip 2 is directly die-bonded to the substrate 34 as shown in FIG. 25 has been proposed. The substrate 34 is made of, for example, an aluminum thin plate, and the substrate 34 is pressed to form the recess 34a. After the insulator thin film 35 is formed on the surface of the substrate 34, the insulating film formed on the bottom surface of the recess 34a. The LED chip 2 is die-bonded on the body thin film 35. Then, the wiring pattern 36 formed on the surface of the substrate 34 via the insulator film layer 35 and the electrode on the surface of the LED chip 2 are electrically connected via the bonding wire 9 and penetrated into the recess 34a. It is formed by filling a sealing resin 37 having optical properties.
[0012]
  In this light source device, the heat generated by the LED chip 2 is radiated from the LED chip 2 through the path of the die bonding paste 7 → the insulator film layer 35 → the substrate 34, and the heat transmitted to the substrate 34 is diffused throughout the substrate 34. Therefore, the heat radiation path is short and the heat radiation performance is very high as compared with a bullet-type light emitting diode. However, also in this heat dissipation path, the die bonding paste 7 and the insulator film layer 35 exist as components that hinder heat dissipation. The die bonding paste 7 is made of resin, and although the paste itself has a small thermal conductivity coefficient, the thickness of the paste is as thin as 5 μm or less. Therefore, it is considered that the influence of the die bonding paste 7 on the heat dissipation is small. On the other hand, the insulator film layer 35 is formed of a resin or a resin in which a ceramic filler is dispersed, and the insulator film layer 35 itself has a smaller thermal conductivity coefficient than that of a metal, and the insulator film layer 35. Since the thickness of the film is as thick as about 300 μm, the influence on the heat dissipation is large. Thus, in the light source device having the structure shown in FIG. 25, although the heat radiation from the LED chip 2 is higher than that of the light source device using the cannonball type LED, the insulator film layer 35 exists in the heat radiation path. Therefore, sufficient heat dissipation was not obtained.
[0013]
  Further, in order to reduce the influence of the insulator film layer 35 in heat radiation from the LED chip 2, the insulator film layer 35 is partially removed from the surface of the substrate 34, and the LED chip 2 is directly attached to the exposed substrate 34. A die-bonded light source device has also been proposed. However, the insulating film layer 35 is partially removed by cutting using an end mill or the like, and the exposed surface of the substrate 34 has severe cutting flaws. As a result of measurement, smoothness of about plus or minus 20 μm is obtained. Met. By the way, when the LED chip 2 is die-bonded, depending on the type of the die-bonding agent, the surface on which the LED chip 2 is mounted needs to have a smoothness of about plus or minus 5 μm. It was difficult to mount, and it was difficult to mount the LED chip 2 on the exposed surface of the substrate 34.
[0014]
  Further, in the light source device shown in FIG. 25, the wiring pattern 36 is formed on the upper surface of the insulator film layer 35, and one end of the bonding wire 9 is connected to the wiring pattern 36. Even if sealed with 37, a part of the bonding wire 9 is exposed to the outside from the sealing resin 37, and there is a problem that the strength of the bonding wire 9 is remarkably lowered against mechanical impact. Therefore, in order to protect the portion of the bonding wire 9 exposed to the outside from the sealing resin 37, it may be possible to separately seal the portion of the bonding wire 9 exposed from the sealing resin 37. Even if resin sealing is performed using the same resin, if resin sealing is performed in two steps, stress remains at the interface between the two resins. The bonding wire 9 may be broken at the interface portion. In particular, when powder such as a phosphor is dispersed in the sealing resin 37 in order to obtain white light emission using the blue light emitting LED chip 2, the sealing is performed by sealing the resin from above the sealing resin 37. There is also a problem that a difference in thermal expansion coefficient occurs between the resin and the possibility that the bonding wire 9 is disconnected at the interface portion.
[0015]
  The present invention has been made in view of the above problems, and the object of the present invention is to improve the light emission efficiency, increase the light output, extend the life, and increase the mechanical strength.PlaceIt is to provide.
[0016]
[Means for Solving the Problems]
  In order to achieve the above object, according to the first aspect of the present invention, an insulating member is provided at a portion of a substrate having thermal conductivity, an insulating member disposed on at least one surface of the substrate, and an insulating member facing the substrate. A hole provided through, an LED chip disposed facing and thermally coupled to a portion of the substrate exposed from the hole, and a wiring portion provided in the insulating member and electrically insulated from the substrate by the insulating member , A connecting member that electrically connects the power feeding unit and the electrode of the LED chip, and a sealing material that has a light-transmitting property that fills the hole and seals the entire LED chip and the connecting member And withA protruding portion that protrudes inwardly is provided at the opening edge on the substrate side of the hole provided in the insulating member, and at least a part of the wiring portion is disposed on the protruding portion, and the portion of the wiring portion that is disposed in the protruding portion The electrode of the LED chip is electrically connected to the substrate, and a protruding portion that protrudes toward the insulating member and is inserted into a hole provided in the insulating member is provided on the substrate, the LED chip is opposed to the protruding portion, and heat is applied. Combined and placedThe LED chip is disposed so as to be opposed to and thermally coupled to the portion of the substrate exposed from the hole provided in the insulating member, so that the heat generated by the LED chip is released through the substrate having thermal conductivity. And a light source device with improved heat dissipation can be realized. Therefore, the temperature rise of the LED chip is suppressed, and a decrease in light emission efficiency due to the temperature rise can be prevented. Moreover, since the temperature rise of the LED chip is reduced, a larger forward current can be applied to the LED chip to increase the light output of the LED chip, and the LED chip and the sealing material are thermally deteriorated. It can be reduced and the life can be extended. Furthermore, even when the LED chip and the entire connection member are sealed with a sealing material filled in the hole, and a metal wire is used as a connection member that electrically connects the LED chip and the power supply unit, There is no fear that the metal wire is broken by the stress generated at the interface of the resin, and the mechanical strength can be improved.Moreover, since the thickness of the protruding portion can be increased by the height of the protruding portion by providing the protruding portion on the substrate, the processing of the protruding portion can be easily performed and the thickness of the protruding portion can be increased. By increasing the dimension, it is possible to increase the rigidity of the overhang portion and prevent a gap from being formed between the overhang portion and the substrate when the substrate and the insulating member are joined.
[0017]
  Claim2In the invention of claim 1, in the invention of claim 1, the portion of the wiring portion that is electrically connected to the LED chip via the connecting member is disposed in the hole, and the sealing material is filled to the vicinity of the opening of the hole. By filling the sealing material until the surface of the sealing material comes close to the opening of the hole, the filling amount of the sealing material can be made substantially constant, and variations in quality can be suppressed.
[0018]
  Claim3In the invention of claim1In the invention, the connecting member is made of a metal wire, and in the joining direction of the substrate and the insulating member, the portion of the LED chip to which one end of the metal wire is connected and the portion of the wiring portion to which the other end of the metal wire is connected. The height is substantially the same, and the length of the metal wire that electrically connects the LED chip and the wiring portion can be shortened, so that the mechanical strength of the metal wire can be increased, and the LED chip. By making the height of the wiring part substantially the same, the bonding operation can be easily performed.
[0019]
  Claim4In the invention of claim1According to the invention, in the bonding direction of the substrate and the insulating member, the height of the projecting portion on which the LED chip is mounted and the portion of the wiring portion electrically connected to the LED chip are substantially the same height. The light radiated from the LED chip is not shielded by the wiring part, and the light extraction efficiency can be reduced by reducing the light scattering.
[0020]
  Claim5In the invention of claim1In the invention of claim 1, the projecting portion is stamped into the insulating member side surface of the substrate by forming a recess by punching from the surface of the substrate opposite to the insulating member. Since the projecting part is formed by performing the above, the processing cost can be reduced as compared with the case where the projecting part is formed by cutting. In addition, when the substrate and the insulating member are bonded together with an adhesive, the entire substrate warps to the insulating member side due to the heat shrinkage of the adhesive, but by forming a recess by punching, the entire substrate is Since it warps on the opposite side to the insulating member, the warpage of the substrate caused by the thermal contraction of the adhesive can be offset and the substrate can be prevented from warping as a whole.
[0021]
  Claim6In the invention of claim1In this invention, the substrate is composed of a base plate in which a communication hole communicating with the hole is formed, and a protrusion that is attached in the communication hole and has a tip projecting toward the insulating member. The protrusion is formed by inserting a protrusion into the hole in the base plate and projecting the tip of the protrusion toward the insulating member, so the protrusion is formed by cutting. Compared with the case where it does, the process of a protrusion part can be performed easily.
[0022]
  Claim7In the invention of claim1In the invention of claim 1, wherein a gap is provided between the hole and the projecting part, and when the substrate and the insulating member are bonded together with an adhesive, excess adhesive is removed from the bonding surface between the substrate and the insulating member. There is a possibility that the LED chip light may be blocked by the protruding adhesive, or the LED chip may not be mounted, but the protruding adhesive accumulates in the gap provided between the hole and the protruding part, so the adhesive Does not crawl up to the upper surface of the protrusion, and it is possible to prevent the LED chip light from being blocked by the protruding adhesive and the LED chip from being unable to be mounted.
[0023]
  Claim8In the present invention, claims 1 toAny one of 7In the invention, the positioning means for positioning the substrate and the insulating member is provided on the joint surface between the substrate and the insulating member, the positioning means can position the substrate and the insulating member, It is possible to easily join the substrate and the insulating member.
[0024]
  Claim9In the present invention, claims 1 toAny one of 7In the invention, characterized in that a reservoir of adhesive used for bonding is provided around the hole of the insulating member on the bonding surface of the substrate and the insulating member, and when the substrate and the insulating member are bonded together with an adhesive, Excess adhesive protrudes from the bonding surface between the substrate and the insulating member, and the LED chip light may be blocked by the protruding adhesive, or the LED chip may not be mounted. Therefore, it is possible to prevent the adhesive from protruding. In addition, if there is a part where the adhesive is insufficient on the joint surface between the substrate and the insulating member, the sealing material may leak out from the gap created in this part, but the reservoir where excess adhesive is stored is insulated. The excess adhesive collected around the hole in the member and placed in the reservoir is placed so as to surround the part of the substrate exposed from the hole, so the weir that the adhesive accumulated in the reservoir blocks the sealing material It is possible to prevent the sealing material from leaking.
[0025]
  Claim10In the invention of claim 1, in the invention of claim 1, the power supply unit includes a substrate formed of a conductive material, and the substrate and the electrode of the LED chip are electrically connected, and the substrate itself is used as the power supply unit. In addition to connecting one electrode of the LED chip to the substrate and connecting the other electrode of the LED chip to the wiring part, power can be supplied to the LED chip, so the wiring part formed on the surface of the insulating member is There is an advantage that only one circuit is required. Further, since the substrate bears a part of the circuit for supplying power to the LED chip, the circuit can be easily pulled out to the substrate side.
[0026]
  Claim11In the invention of claim10In the present invention, the substrate is provided with a plurality of regions that are electrically insulated from each other. By the way, when a plurality of LED chips are mounted on a single substrate, all the LED chips are connected in parallel unless the single substrate is divided into a plurality of regions that are electrically insulated from each other. become. Here, since LED chips have slightly different driving voltages for each individual, if a plurality of LED chips are connected in parallel, a large amount of current flows through the LED chip with the lowest driving voltage, and the LED chips may be damaged. is there. Therefore, in order to equalize the currents flowing through the plurality of LED chips, a method of connecting current limiting resistors in series for each LED chip is conceivable. However, current limiting resistors corresponding to the number of LED chips are required. Thus, the power loss consumed by each resistor increases. On the other hand, in the present invention, the substrate is provided with a plurality of regions that are electrically insulated from each other, LED chips are mounted in each region, and LED chips mounted in each region are connected in series, The current value flowing through each LED chip can be made substantially constant, and if one current limiting resistor is connected to a plurality of LED chips connected in series, the current flowing through each LED chip is limited. Therefore, the power loss consumed by the current limiting resistor can be reduced.
[0027]
  Claim12In the invention of claim 1, in the invention of claim 1, the surface of the sealing material has a lens shape that distributes light emitted from the LED chip in a desired direction, and the surface of the sealing material has a lens shape Thus, the light emission of the LED chip can be distributed in a desired direction without providing a separate lens.
[0028]
  Claim13The invention of claim 1 is characterized in that in the invention of claim 1, a reflection part that reflects light emitted from the LED chip and distributes light in a desired direction is provided on the side wall of the hole, and the light of the LED chip is reflected by the reflection part. The light extraction efficiency can be increased by distributing light in a desired direction.
[0029]
  Claim14In the invention of claim13In this invention, the above-mentioned reflection part is shared by the wiring part, and the wiring part also serves as the reflection part, whereby the pattern of the wiring part and the reflection part formed on the surface of the insulating member can be simplified.
[0030]
  Claim15In the invention of claim13In the invention, the connecting member is made of a metal wire, and a wiring portion is disposed in the extending direction of the metal wire, and light from the LED chip is shielded by the metal wire, but becomes a shadow of the metal wire. Since the wiring part is arranged in the part, the light from the LED chip can be distributed in a desired direction by the reflection part formed in a part other than the wiring part.
[0031]
  Claim16In the invention of claim 1, in the invention of claim 1, the sealing material has a light color conversion function of converting at least a part of the light emitted from the LED chip into a predetermined light color. By mixing the light of which the light color has been converted and the light from the LED chip, light of a desired light color can be obtained.
[0032]
  Claim17In the invention of claim16In this invention, the surface of the sealing material is located on the substrate side of the surface of the insulating member opposite to the substrate, and a reflecting portion that reflects light emitted from the LED chip on the peripheral wall of the hole and distributes the light in a desired direction. Since the light from the LED chip is dispersed by passing through the sealing material and becomes a completely diffusing light distribution, it is easy to control the light distribution, and in a desired direction by the reflecting portion Can distribute light.
[0033]
  Claim18The invention according to claim 1 is characterized in that in the invention of claim 1, a part of the wiring part is extended toward the substrate side, and the extended part constitutes an external connection terminal, and a part of the wiring part is formed on the board side. Since the extended portion is used as an external connection terminal, power can be easily supplied from the substrate side to the wiring portion. Although various forms of extending a part of the wiring part toward the substrate side can be considered, for example, the wiring part is extended to the substrate side along the end of the insulating member, or a through hole is formed in the insulating member. It is conceivable to extend the wiring portion to the substrate side by filling the through hole with a conductive material. In addition, the length of the wiring portion extending toward the substrate side is also determined as necessary, and may be extended to the middle of the insulating member or the surface on the substrate side, or a part of the wiring portion may wrap around the surface on the substrate side. Alternatively, it may be projected to the other side of the substrate.
[0034]
  Claim19In the invention of claim18In the invention, a part of the wiring part is extended to a surface facing the substrate in the insulating member, and a part of the wiring part is extended to the surface facing the substrate. Power can be easily supplied to the part. For example, when this light source device is mounted on an instrument body in which a hole to be fitted to the substrate is formed, a part of the wiring portion extends to the surface of the insulating member facing the substrate, so that the substrate is placed in the hole of the instrument body. If the part is fitted, the electrical connection between the wiring part formed on the instrument body and the wiring part of the light source device can be easily performed, and the board part is fitted in the hole so as to contact the instrument body If it does, heat dissipation will improve.
[0035]
  Claim20In the invention of claim18Or19In the invention, a part of the insulating member is extended toward the substrate side, and the tip of the extended portion is substantially flush with the surface of the substrate opposite to the insulating member. When the light source device is mounted on the instrument body by mounting on the surface of the instrument body on the part extended to the substrate side, the extension part of the insulating member is substantially flush with the surface of the substrate opposite to the insulation member. Since the substrate comes into contact with the surface of the instrument body simply by placing the insulating member on the surface of the instrument body, the heat generated by the LED chip is released to the instrument body through the substrate, thereby improving the cooling effect. . In addition, since a part of the wiring portion is extended to the substrate side to form the external connection terminal, electrical connection between the external connection terminal and the wiring portion formed on the surface of the instrument body can be easily performed. Furthermore, if an external connection terminal is formed on the distal end surface of the portion extending to the substrate side of the insulating member, a surface mount type light source device with improved heat dissipation can be realized.
[0036]
  Claim21According to the invention, in the invention of claim 1, the insulating member, the LED chip, the wiring portion, and the sealing member are provided on both surfaces of the substrate, and the light of the LED chip is radiated from both surfaces of the substrate. And because the same parts are arranged on both sides of the substrate, it is possible to suppress warping of the substrate..
[0037]
DETAILED DESCRIPTION OF THE INVENTION
  Embodiments of the present invention will be described below with reference to the drawings.
[0038]
  (Basic configuration)
  Of the present inventionBasic configurationWill be described with reference to FIGS. The light source device 1 includes a substrate 3 made of a material having high thermal conductivity such as aluminum and a thickness of about 2 mm, and an insulating member 4 made of an insulating material such as a liquid crystal polymer and having a thickness of about 2 mm. It is configured by pasting together.
[0039]
  Two round holes 5 having a diameter of about 3 mm and a depth of about 1.5 mm are formed on the surface of the insulating member 4 opposite to the substrate 3, and the insulating member 4 passes through the center of each round hole 5. Through holes 6 having a substantially circular cross section and a diameter of about 1 mm reaching the substrate 3 are formed. Here, the round hole 5 and the through hole 6 constitute a hole provided through the insulating member 4 at a portion of the insulating member 4 facing the substrate 3, and protrudes inward at the bottom of the round hole 5. The overhanging portion 4 a is formed integrally with the substrate 3. The LED chips 2 are die-bonded to the portions of the substrate 3 exposed from the through holes 6 by using a die bonding paste 7 such as a silver paste. A wiring pattern (wiring portion) 8 made of a conductive material such as copper is formed on the same straight line passing through the mounting portion of the two LED chips 2 on the surface of the insulating member 4 opposite to the substrate 3. . The wiring pattern 8 extends to the side wall and the bottom surface (the overhanging portion 4 a) of the round hole 5, and constitutes a connection portion for wire bonding, and the connection between the electrode (not shown) of the LED chip 2 and the wiring pattern 8 The space is electrically connected through a bonding wire (metal wire) 9 made of a fine metal wire such as gold. Here, at least a portion of the wiring pattern 8 to which the bonding wire 9 is connected is plated with gold so that the bonding wire 9 can be easily bonded. Further, since the upper surface of the LED chip 2 and the portion of the wiring pattern 8 formed on the bottom surface of the round hole 5 are substantially the same height, the length of the bonding wire 9 is shortened, The mechanical strength can be increased and the bonding operation can be easily performed.
[0040]
  After that, by injecting a sealing resin (sealing material) 10 such as a two-liquid curable epoxy resin having translucency into the inside of the round hole 5, the entire LED chip 2 and the bonding wire 9 are made. The resin sealing is performed, and the connecting portion of the bonding wire 9 is protected by the sealing resin 10. Here, when the sealing resin 10 is injected, it may be injected up to the upper surface of the insulating member 4, and the injection amount of the sealing resin 10 can be easily controlled. Further, since the bonding wire 9 is connected to a portion of the wiring pattern 8 extending on the overhanging portion 4a and is accommodated in the round hole 5, the sealing resin filled in the round hole 5 is used. 10 can bond the bonding wire 9 and its connecting portion with resin, and the bonding wire 9 is exposed to the outside from the sealing resin 10, so that the mechanical strength is lowered or the bonding wire 9 is generated on the surface of the sealing resin 10. There is no possibility that the bonding wire 9 is disconnected due to the stress to be generated.
[0041]
  The LED chip 2 is described as an example of a GaN-based LED chip in which two electrodes are formed on the top surface of the chip. An LED chip in which one electrode is formed may be used. In this case, the substrate 3 is used as a wiring, or an electrode is provided on the substrate 3, and the LED chip and the electrode of the substrate 3 and the wiring pattern 8 are connected. What is necessary is just to connect between each with a bonding wire.
[0042]
  As mentioned above,BookIn the light source device 1, since the LED chip 2 is directly die-bonded on the substrate 3 having good thermal conductivity, the heat generated by the LED chip 2 is transmitted to the substrate 3 through the die bonding paste 7 and reaches the substrate 3. The heat generated by the chip 2 quickly spreads over the entire substrate 3. Here, although the die bonding paste 7 having a low thermal conductivity coefficient exists in the heat dissipation path of the heat generated by the LED chip 2, the thickness of the die bonding paste 7 is as thin as several μm, so that the influence on the heat dissipation is small. Sufficient heat dissipation performance can be obtained. For example, when compared with thermal resistance, in the case of the bullet-type LED described in the conventional example, the thermal resistance from the LED chip to the tip of the lead frame was about 350 ° C./W,BookIn the light source device 1, the thermal resistance from the LED chip 2 to the back surface of the substrate 3 is about 90 ° C./W, and the thermal resistance can be reduced to about ¼.
[0043]
  Therefore, compared with the conventional light source device, the heat radiation characteristic from the LED chip 2 to the outside is enhanced and the temperature rise of the LED chip 2 is suppressed, so that the light emission efficiency of the LED chip 2 is improved and the light output is increased. In addition, the service life can be extended.
[0044]
  Moreover, since the LED chip 2 and the bonding wire 9 are sealed with the sealing resin 10 and the connecting portion of the bonding wire 9 is also protected by the sealing resin 10, no stress is applied to the bonding wire 9. The disconnection of the bonding wire 9 can be prevented, and the mechanical strength can be improved.
[0045]
  BookLight source device 1In this case, an aluminum plate is used as the substrate 3. However, the material of the substrate 3 is not limited to aluminum, and may be formed from a metal such as copper or a ceramic having high thermal conductivity such as aluminum nitride. The same effect as described above can be obtained. Also bookLight source device 1In this case, the wiring pattern 8 is formed on the insulating member 4 by using the printed wiring technique. However, instead of the wiring pattern 8, only the connection portion of the bonding wire 9 passes through the insulating member 4 in the vicinity of the LED chip 2. The LED chip 2 may be wired using an exposed lead frame (not shown).
[0046]
  (Embodiment1)
  Embodiment of the present invention1Will be described with reference to FIG. The light source device 1 is formed by bonding a substrate 3 made of a material having high thermal conductivity such as aluminum and an insulating member 4 made of an insulating material such as liquid crystal polymer and having a thickness of about 2 mm. The
[0047]
  The substrate 3 is formed by cutting an aluminum plate having a thickness of about 3 mm, and the surface of the substrate 3 on the insulating member 4 side has a substantially cylindrical protrusion having a diameter of about 1 mm and a height of about 0.9 mm. The base part 11 is protrudingly provided.
[0048]
  On the surface of the insulating member 4 opposite to the substrate 3, a recess 5 ′ is formed at a portion corresponding to the protruding portion 11 of the substrate 3, and the insulating member 4 is penetrated at the bottom of the recess 5 ′. A through hole 6 is formed. Here, the hole diameter of the through hole 6 is about 1 mm, which is substantially the same as the outer diameter of the projecting portion 11. Further, the inner diameter of the bottom surface of the recess 5 ′ is about 2 mm, and the side wall of the recess 5 ′ becomes larger as the distance from the substrate 3 side increases, and the cross-sectional shape is inclined at an angle of about 45 degrees. ing. Here, the recess 5 ′ and the through hole 6 constitute a hole that penetrates the insulating member 4 in the portion of the insulating member 4 that faces the substrate 3, and the bottom of the recess 5 ′ is inward. A protruding portion 4 a that protrudes is formed integrally with the substrate 3.
[0049]
  Here, the substrate 3 and the insulating member 4 are joined in a state in which the through-hole 6 and the protruding portion 11 are fitted, and the thickness of the portion of the protruding portion 11 exposed from the through-hole 6 is about 0. A 2 mm LED chip 2 is die-bonded using a die bonding paste 7 such as a silver paste. A wiring pattern 8 made of a conductive material such as copper is formed on the surface of the insulating member 4 opposite to the substrate 3, and the surface thereof is plated with gold. The wiring pattern 8 extends to the side wall and bottom surface of the recess 5 ′, and is formed on the portion of the wiring pattern 8 that extends to the bottom surface (projecting portion 4 a) of the recess 5 ′ and the upper surface of the LED chip 2. The electrodes are electrically connected via bonding wires 9 made of fine metal wires such as gold.
[0050]
  Thereafter, the LED chip 2 and the bonding wire 9 are resin-sealed by injecting a sealing resin 10 such as a two-liquid curable epoxy resin having translucency into the interior of the recess 5 ′. The connecting portion of the bonding wire 9 is protected by the sealing resin 10. Here, when the sealing resin 10 is injected, it may be injected up to the upper surface of the insulating member 4, and the injection amount of the sealing resin 10 can be easily controlled. Moreover, since the bonding wire 9 is connected to the portion of the wiring pattern 8 extending on the overhanging portion 4a and is accommodated in the recess 5 ′, the sealing wire filled in the recess 5 ′ is used. The bonding wire 9 and its connecting portion can be resin-sealed by the stop resin 10, and the mechanical strength is reduced by exposing the bonding wire 9 to the outside from the sealing resin 10, or the surface of the sealing resin 10 There is no possibility that the bonding wire 9 is broken due to the stress generated by the above.
[0051]
  Further, in the light source device 1 of the present embodiment, the LED chip 2 is directly die-bonded on the substrate 3 having good thermal conductivity.Described in the basic configurationSimilar to the light source device 1, sufficient heat dissipation performance can be obtained and the temperature rise of the LED chip 2 is suppressed, so that the light emission efficiency of the LED chip 2 is improved, the light output is increased, and the life is extended. Can be achieved.
[0052]
  Further, in the light source device 1 according to the present embodiment, since the protruding portion 11 is formed on the substrate 3, the wiring pattern formed on the upper surface of the LED chip 2 and the overhanging portion 4 a in the bonding direction of the substrate 3 and the insulating member 4. Even if the height of 8 is substantially the same, the thickness of the overhanging portion 4a can be increased by the height of the projecting portion 11. Here, in the case where the insulating member 4 is formed of resin, if the thickness of the overhang portion 4a is reduced, the yield increases and the processing of the overhang portion 4a becomes difficult. Further, when the substrate 3 and the insulating member 4 are bonded to each other, a gap may be formed between the substrate 3 and the overhanging portion 4 a if the thickness is small. On the other hand, in the light source device 1 of this embodiment, the width of the overhang portion 4a is about 0.5 mm, whereas the thickness is about 1 mm, so that the overhang portion 4a is easily processed. In addition, the substrate 3 and the insulating member 4 can be bonded together without generating a gap between the substrate 3 and the substrate 3.
[0053]
  Also,Described in the basic configurationSimilar to the light source device 1, the upper surface of the LED chip 2 and the portion of the wiring pattern 8 formed on the bottom surface (projecting portion 4 a) of the recess 5 ′ are substantially the same height. There is an advantage that the mechanical strength of the bonding wire 9 can be increased by shortening the length, and the bonding operation can be easily performed. Moreover, since the side wall of the recess 5 'is a tapered surface, the light emitted from the LED chip 2 is not absorbed or diffusely reflected by the side wall of the recess 5', and can be efficiently reflected forward. it can.
[0054]
  (Embodiment2)
  Embodiment of the present invention2Will be described with reference to FIG. In the light source device 1 of this embodiment, the embodiment1In the light source device 1, the height of the protruding portion 11 provided on the substrate 3 is about 1.1 mm, and the height between the upper surface of the protruding portion 11 and the upper surface of the wiring pattern 8 formed on the overhanging portion 4 a. They are almost the same. The configuration other than the projecting portion 11 is an embodiment.1Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0055]
  Embodiment1In the light source device 1, a part of the light emitted from the LED chip 2 in a direction (horizontal direction) substantially parallel to the upper surface of the LED chip 2 is absorbed by the end face of the overhanging portion 4 a. There is a risk that the light emission efficiency may be reduced because the light is not radiated forward due to irregular reflection. On the other hand, in the light source device 1 of the present embodiment, the height of the upper surface of the projecting portion 11 and the upper surface of the wiring pattern 8 formed on the overhanging portion 4a are made substantially the same, and the LED chip 2 Is die-bonded on a substantially flat surface, so that the light emitted from the LED chip 2 is not absorbed or diffusely reflected by the end surface of the overhanging portion 4a, and the light emission efficiency can be improved.
[0056]
  As shown in FIG. 3B, the upper surface of the protrusion 11 may be protruded upward from the wiring pattern 8 formed in the overhanging portion 4a. There is no possibility that light is absorbed or diffusely reflected by the end face of the overhanging portion 4a, and the luminous efficiency can be improved. In addition, since the wire length of the bonding wire 9 will become long and there exists a possibility that the bonding wire 9 may contact the corner | angular part of the protruding part 11 if the protrusion amount of the protruding part 11 becomes too large, The height is such that the upper surface of the projecting part 11 and the upper surface of the wiring pattern 8 formed on the projecting part 4a are substantially flush, or the upper surface of the projecting part 11 is formed on the projecting part 4a. It is desirable to form the wiring pattern 8 so as to be slightly higher than the upper surface of the wiring pattern 8.
[0057]
  (Embodiment3)
  Embodiment of the present invention3Will be described with reference to FIG. In this embodiment, the embodiment2In the light source device 1, the diameter of the protruding portion 11 provided on the substrate 3 is about 0.5 mm and the height is about 1.1 mm, and the wiring formed on the upper surface of the protruding portion 11 and the overhanging portion 4a. The height of the upper surface of the pattern 8 is substantially the same. It should be noted that the embodiment is other than the arrangement of the substrate 3 and the LED chip 2.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0058]
  The LED chip 2 is made of a transparent sapphire substrate, and the distance between the electrodes is about 1 mm. The LED chip 2 is opposed to the projecting part 11, and the projecting part 11 is located between the electrodes. The electrode surface of the LED chip 2 was mounted face-down on the wiring pattern 8. Here, the LED chip 2 and the wiring pattern 8 were joined by the following method. That is, the solder bumps 21 were formed on the electrodes of the LED chip 2 and joined by heating in a reflow furnace to melt the solder bumps 21. The solder bumps 21 have a height of 2 to 3 μm, and the electrode surfaces of the substrate 3 and the LED chip 2 are also separated by this distance, so that electrical insulation is maintained. Further, the sealing resin 10 is filled in the gap between the substrate 3 and the LED chip 2, but the distance between the substrate 3 and the LED chip 2 is sufficiently short, so the LED chip 2 is thermally coupled to the substrate 3, There is no major obstacle to heat conduction from the LED chip 2 to the substrate 3.
[0059]
  Embodiment2In the light source device 1 described above, since the electrode of the LED chip 2 faces the opening side of the recess 5 ′, a part of the light traveling from the LED chip 2 to the outside is blocked by the electrode of the LED chip 2. Part of the blocked light is repeatedly reflected and extracted to the outside, but the rest is absorbed inside and becomes a loss. On the other hand, in this embodiment, the electrode of the LED chip 2 is disposed on the substrate 3 side, and light emitted from the light emitting portion of the LED chip 2 is taken out through the transparent sapphire substrate. A part of the light emission is not shielded by the wire 9, and it is possible to prevent the light amount from being lowered as a whole. Embodiments2When the light source device 1 is used in combination with an optical component such as a lens, depending on the focal length, there is a problem that the shape of the electrode of the LED chip 2 is projected as a shadow onto the irradiation surface. Since it is arrange | positioned at the side, a front surface can be made into a uniform irradiation surface. Further embodiments2As described above, there is no possibility that the light emitted from the LED chip 2 is absorbed by the end face of the overhanging portion 4a or is irregularly reflected, and the light emission efficiency can be improved.
[0060]
  As shown in FIG. 4B, the upper surface of the projecting portion 11 protrudes about 3 μm above the wiring pattern 8 formed on the projecting portion 4a, and the LED chip 2 is placed on the upper surface of the projecting portion 11. Face-down mounting may be performed in a contact state, and heat dissipation can be improved by bringing the LED chip 2 into direct contact with the projecting portion 11. However, in this case, the LED chip 2 and the substrate 3 are coated by coating the upper surface of the projecting part 11 or the portion of the LED chip 2 in contact with the upper surface of the projecting part 11 with an insulating material such as silicon oxide. Or a non-electrically conductive material must be used as the material of the substrate 3. Further, it is desirable to increase the height of the solder bump 21 in order to absorb the level difference between the protruding portion 11 and the wiring pattern 8, and the electrical connection between the electrode of the LED chip 2 and the wiring pattern 8 can be ensured. .
[0061]
  Here, also when the structure of the light source device 1 is the structure shown in FIG. 4B, the light emitted from the LED chip 2 is absorbed or diffusely reflected by the end face of the overhanging portion 4a as described above. There is no fear, and the luminous efficiency can be improved.
[0062]
  (Embodiment4)
  Embodiment of the present invention4Will be described with reference to FIG. In the light source device 1 of this embodiment, the embodiment2In the light source device 1, a recess 12 is provided in a portion corresponding to the protruding portion 11 on the lower surface of the substrate 3. The configuration other than the recess 12 is the embodiment.2Since it is the same as the light source device 1 of the embodiment, the embodiment2The same reference numerals are given to the same constituent elements as in FIG.
[0063]
  Embodiment2In the light source device 1, the protruding portion 11 is formed by cutting the substrate 3. However, in the light source device 1 of the present embodiment, the substrate 3 is punched from one surface and pressed to form the recess 12. As a result, the projecting base 11 is formed on the opposite surface of the substrate 3, and the processing cost can be reduced as compared with the case where cutting is performed.
[0064]
  Moreover, when bonding the board | substrate 3 and the insulating member 4 using an adhesive agent, there exists a possibility that the board | substrate 3 and the whole insulating member 4 may warp by hardening shrinkage | contraction of an adhesive agent. On the other hand, when the protruding portion 11 is formed by press working, a warp in the direction opposite to the direction warped by the curing shrinkage of the adhesive is generated in the substrate 3. Overall warpage can be suppressed.
[0065]
  In the light source device 1, the heat generated by the LED chip 2 is transmitted to the projecting portion 11 of the substrate 3 through the die bonding paste 7. Although the recess 12 is formed on the back surface of the projecting part 11, the substrate 3 is integrally formed, so that the heat generated by the LED chip 2 transmitted to the projecting part 11 is quickly transmitted to the entire substrate 3. Radiated to the outside. Moreover, since the board | substrate 3 is used in the state contacted to heat radiation components, such as the housing | casing in which the light source device 1 is attached, and a heat radiation fin, the heat_generation | fever of LED chip 2 is rapidly discharge | released to the heat radiation component via the board | substrate 3. Therefore, the heat dissipation performance is substantially the same as the case where the recess 12 is not formed.
[0066]
  (Embodiment5)
  Embodiment of the present invention5Will be described with reference to FIG. Embodiment2In the light source device 1, the protruding portion 11 is formed by cutting the substrate 3. However, in the light source device 1 of the present embodiment, instead of forming the protruding portion 11, the protruding portion 11 has thermal conductivity. A communication hole 13 having a substantially circular cross section communicating with the through hole 6 is formed in a portion corresponding to the through hole 6 of the insulating member 4 in the base plate 3 ′ made of a material, and the communication hole 13 is made of, for example, aluminum. A cylindrical heat conductor (protrusion) 14 formed from a material having excellent heat conductivity is press-fitted. Here, the base plate 3 ′ and the heat conductor 14 constitute a substrate, and the tip portion of the heat conductor 14 protruding from the surface of the base plate 3 ′ to the insulating member 4 side constitutes a projecting portion, and heat conduction. The tip of the body 14 is inserted into the through hole 6, and the LED chip 2 is die-bonded to the tip of the heat conductor 14 using the die bonding paste 7. The configuration other than the base plate 3 ′ and the heat conductor 14 is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0067]
  Embodiment2In the light source device, since the projecting portion 11 is formed on the substrate 3 by cutting the metal plate, the processing cost is increased, but in the present embodiment, the base plate 3 ′ is punched, Since the projecting part is formed by press-fitting the heat conductor 14 into the hole, the processing cost can be reduced as compared with the case where the projecting part 11 is formed by cutting.
[0068]
  Considering the case of using a heat dissipation component such as a housing to which the light source device is attached or a heat dissipation fin in contact with the back surface of the base plate 3 ′, the heat generated by the LED chip 2 is transmitted through the die bonding paste 7 as a heat conductor. 14 Here, since the heat conductor 14 is press-fitted into the communication hole 13 penetrating the base plate 3 ′ and reaches the back surface of the base plate 3 ′, the heat generated by the LED chip 2 is quickly transmitted through the heat conductor 14. It is transmitted to the side and released to the heat dissipation component. Further, since the heat conductor 14 is press-fitted into the communication hole 13 of the base plate 3 ′, and the heat conductor 14 and the base plate 3 ′ are in close contact with each other, sufficient heat conduction is performed between them. Since the heat transmitted to the heat conductor 14 is quickly released to the entire base plate 3 ′, the embodiment in which the projecting portion 11 is integrally formed on the substrate 3.2The same heat radiation characteristic as that of the light source device can be obtained.
[0069]
  (Embodiment6)
  Embodiment of the present invention6Will be described with reference to FIG. In the light source device 1 of this embodiment, the embodiment2In the light source device 1, a gap 15 is provided between the peripheral surface of the protruding portion 11 provided on the substrate 3 and the end surface of the through hole 6 provided in the insulating member 4. In addition, a recess 16 for positioning is formed on the surface (bonding surface) of the insulating member 4 on the substrate 3 side, and a convex portion 17 that engages with the recess 16 is provided on the upper surface (bonding surface) of the substrate 3. Yes. It should be noted that, except for the gap 15, the recess 16, and the convex portion 17, the embodiment2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0070]
  Here, in the case where the substrate 3 and the insulating member 4 are formed by bonding with an adhesive, there is a possibility that excess adhesive may protrude from the adhesive surface.2In this light source device, since the adhesive protrudes in the immediate vicinity of the portion where the LED chip 2 is die-bonded, there is a possibility that part of the light emitted from the LED chip 2 is blocked by the adhesive. Further, the protruding adhesive may adhere to the tip surface of the projecting part 11 and the LED chip 2 cannot be die-bonded. However, in the light source device of this embodiment, the projecting part 11 and the projecting part 4a A gap 15 is provided between them, and the adhesive that protrudes from the adhesive surface accumulates in the gap 15. Therefore, excess adhesive protrudes in the vicinity of the portion where the LED chip 2 is die-bonded, and light emitted from the LED chip 2. Can be prevented from being shielded and the LED chip 2 cannot be die-bonded.
[0071]
  In addition, by aligning the protrusions 17 provided on the substrate 3 and the recesses 16 provided on the insulating member 4, the substrate 3 and the insulating member 4 can be aligned. Positioning when the member 4 is bonded can be easily performed. In this embodiment, the convex portion 17 provided on the substrate 3 and the recess 16 provided on the insulating member 4 constitute positioning means for positioning the substrate 3 and the insulating member 4. The positioning means is not intended to be limited to the convex portions 17 and the recesses 16, and the substrate 3 and the insulating member 4 may be positioned using appropriate means.
[0072]
  (Embodiment7)
  Embodiment of the present invention7Will be described with reference to FIG. In this embodiment, the embodiment2In the light source device 1, a ring-shaped groove 4 d having a width of about 0.5 mm and a depth of about 0.3 mm is provided on the surface of the insulating member 4 on the substrate 3 side at a position of a radius of about 1 mm with the through hole 6 as the center. . The configuration other than the groove 4d is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0073]
  Here, when the substrate 3 and the insulating member 4 are bonded and bonded together with an adhesive, there is a possibility that excess adhesive may protrude from the bonding surface.2In the light source device 1, since the adhesive protrudes in the immediate vicinity of the portion where the LED chip 2 is die-bonded, a part of the light emitted from the LED chip 2 may be blocked by the adhesive. In addition, the protruding adhesive may adhere to the front end surface of the projecting portion 11 and the LED chip 2 may not be die-bonded. On the other hand, in the light source device 1 of the present embodiment, since the groove 4d is formed around the through hole 6 into which the projecting portion 11 is fitted, excess adhesive 22 is accumulated in the groove 4d. Protruding to the vicinity of the projecting portion 11 through the through hole 6 can be prevented.
[0074]
  In addition, when there is unevenness in the application of the adhesive 22, a portion where the adhesive 22 is insufficient is generated on the joint surface between the substrate 3 and the insulating member 4, and a gap is formed. In this embodiment, the groove 4d is formed around the through-hole 6, and the adhesive 22 accumulated in the groove 4d flows out of the sealing resin 10. Therefore, the sealing resin 10 can be prevented from flowing out.
[0075]
  (Embodiment8)
  Embodiment of the present invention8Will be described with reference to FIG. In this embodiment, the embodiment2In the light source device 1, a conductive material such as copper is used as the material of the substrate 3, and a gold plating layer is formed on the upper surface of the protruding portion 11. Further, the wiring pattern 8 is formed with only one electrode in the recess 5 ', and the LED chip 2 is placed at a position straddling the protruding part 11 and the wiring pattern 8 formed on the overhanging part 4a. These electrodes are brought into contact with the upper surface of the projecting portion 11, and the other electrode is mounted face-down so as to be in contact with the wiring pattern 8 formed on the overhanging portion 4a. The embodiment except for the mounting method of the LED chip 22Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0076]
  In the light source device 1 of this embodiment, the embodiment3Similarly to the above, the electrode of the LED chip 2 is arranged on the substrate 3 side., LA part of the light emission is not shielded by the electrodes of the ED chip 2, and it is possible to prevent the light amount from being lowered as a whole. Embodiments2As described above, there is no possibility that the light emitted from the LED chip 2 is absorbed by the end face of the overhanging portion 4a or is irregularly reflected, and the light emission efficiency can be improved. Further, in the present embodiment, the power supply E and the current limiting resistor R are connected between the wiring pattern 8 and the substrate 3 to supply power to the LED chip 2, and the substrate 3 is part of the power supply unit. Therefore, the wiring pattern 8 extending into the recess 5 ′ can be simplified. In addition, since the same effect is obtained as the wiring is drawn out to the back side through the substrate 3, the power of the light source device 1 can be supplied from the back side of the substrate 3.
[0077]
  In the light source device 1 of the present embodiment, the LED chip 2 is mounted face-down, but the LED chip 2 is die-bonded mounted face up, and the electrodes of the LED chip 2 and the wiring pattern 8 are connected via bonding wires. The substrate 3 may be electrically connected.
[0078]
  (Embodiment9)
  Embodiment of the present invention9Will be described with reference to FIG. Embodiment8In the light source device 1, one LED chip 2 is mounted on the substrate 3, but in the present embodiment, a plurality of (for example, two) LED chips 2 are mounted on the substrate 3. A plurality of substrate portions (areas) 3a and 3b that are electrically insulated from each other are provided on the substrate 3, and one LED chip 2 is mounted on each of the substrate portions 3a and 3b. The basic structure is the embodiment.8Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0079]
  By the way, the embodiment8In the light source device 1, a conductive material is used as the material of the substrate 3, and the entire substrate 3 has the same potential. Therefore, when a plurality of LED chips 2 are mounted on the substrate 3, these LED chips 2 are used. Are all connected in parallel. Since the LED chip 2 has a slightly different driving voltage for each individual, when a plurality of LED chips 2 are connected in parallel, a large amount of current flows through the LED chip 2 having the lowest driving voltage, and the LED chip 2 may be damaged. There is. In order to make the currents flowing through the plurality of LED chips 2 uniform, current limiting resistors may be connected in series for each LED chip 2, but current limiting resistors corresponding to the number of LED chips 2 are required. Thus, there is a problem that the power loss consumed by the current limiting resistor increases.
[0080]
  On the other hand, in this embodiment, the substrate 3 is divided into a plurality of substrate portions 3a and 3b that are electrically insulated from each other, and the LED chips 2 and 2 are mounted one by one on each substrate portion 3a and 3b. By connecting the LED chips 2 and 2 mounted on the substrate parts 3a and 3b in series, and connecting the DC power source E through the current limiting resistor R in parallel with the series circuit of the LED chips 2 and 2, The current flowing through each LED chip 2 can be made uniform. Therefore, current does not flow concentrated on a specific LED chip 2, so that damage to the LED chip 2 due to current concentration can be prevented, and only one current limiting resistor R is required for a plurality of LED chips 2. Therefore, the power loss generated by the current limiting resistor R can be reduced.
[0081]
  In the light source device 1 of the present embodiment, the embodiment3Similarly to the above, the electrode of the LED chip 2 is arranged on the substrate 3 side., LA part of the light emission is not shielded by the electrodes of the ED chip 2, and it is possible to prevent the light amount from being lowered as a whole. Embodiments2As described above, there is no possibility that the light emitted from the LED chip 2 is absorbed by the end face of the overhanging portion 4a or is irregularly reflected, and the light emission efficiency can be improved. Further, in the present embodiment, the power supply E and the current limiting resistor R are connected between the wiring pattern 8 and the substrate 3 to supply power to the LED chip 2, and the substrate 3 is part of the power supply unit. Therefore, the wiring pattern extending into the recess 5 ′ can be simplified. In addition, since the same effect is obtained as the wiring is drawn out to the back side through the substrate 3, the power of the light source device 1 can be supplied from the back side of the substrate 3.
[0082]
  (Embodiment10)
  Embodiment of the present invention10Will be described with reference to FIG. Embodiment2In the light source device 1, the sealing resin 10 is injected into the recess 5 ′ provided in the insulating member 4 (casting), and the LED chip 2 and the bonding wire 9 are sealed. In apparatus 1, an embodiment2In the light source device, resin sealing is performed by transfer molding using a mold, and a convex lens 10 a is formed on the surface of the sealing resin 10. The configuration other than the sealing resin 10 is an embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0083]
  Embodiment2When the resin sealing is performed by casting as in the light source device 1 of FIG. 1, the surface of the sealing resin 10 cannot be formed into a desired shape. However, in the light source device 1 of the present embodiment, the substrate 3 and the insulating member 4 is incorporated in a mold (not shown), and resin sealing is performed by transfer molding in which the sealing resin 10 is pushed in by press-fitting. Therefore, the surface of the sealing resin 10 can be easily formed in the shape of a convex lens. The light emitted from the LED chip 2 by the convex lens formed of the sealing resin 10 can be distributed in a desired direction in front of the LED chip 2.
[0084]
  In this embodiment, the surface of the sealing resin 10 is formed in the shape of a convex lens. However, the surface of the sealing resin 10 may be formed in the shape of a concave lens, and diffused light emission is performed by the concave lens. Also good. Further, even when resin sealing is performed by casting, the inner surface of the recess 5 ′ and the sealing resin 10 are used by using conditions such as surface roughness, shape, and surface treatment of the inner surface of the recess 5 ′. It is also possible to control the surface shape of the sealing resin 10 by controlling the wettability of the sealing resin. Generally, when the wettability is good, the surface shape of the sealing resin 10 is concave, and when the wettability is poor, the sealing resin 10 is sealed. The surface shape of the stop resin 10 is a convex surface.
[0085]
  (Embodiment11)
  Embodiment of the present invention11Will be described with reference to FIGS. FIG. 12A is a cross-sectional view of the light source device 1, and FIG. 12B is a plan view of the light source device 1. In this embodiment, the embodiment2In the light source device 1, a highly reflective reflective film (reflective portion) 18 made of a highly conductive material such as silver is formed on the entire inner surface of the recess 5 ′ formed in the insulating member 4. Yes. The reflective film 18 is formed continuously with the wiring patterns 8 and 8 and is divided into two parts by a narrow slit 24 (for example, a width of about 0.2 mm) extending in a direction orthogonal to the extending direction of the wiring pattern 8. Each part is electrically insulated. Then, the electrodes of the LED chip 2 mounted on the upper surface of the protrusion 11 and the respective reflective films 18 and 18 are electrically connected by bonding wires 9. The configuration other than the reflective film 18 is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0086]
  In the light source device 1 of the present embodiment, a part of the light emitted from the LED chip 2 passes through the sealing resin 10 and is directly emitted to the outside, and a part is reflected by the reflective film 18 and emitted to the outside. Is done. Since the reflective film 18 has a higher reflectance than the surface of the insulating member 4, the embodiment2As compared with the light source device 1, the ratio of emitted light is increased. Furthermore, in the light source device 1 of the present embodiment, since the reflective film 18 is also used in a part of the wiring pattern 8, compared to the case where the wiring pattern 8 and the reflective film 18 are separately formed in the recess 5 ′. Thus, the shape of the wiring pattern or the reflective film can be simplified. In order to wire bond the bonding wire 9, it is desirable that the reflective film 18 be made of gold. However, when the reflective film 18 is made of gold, blue light emitted from the blue light emitting LED chip 2 is used. In this embodiment, silver is used as the material of the reflective film 18.
[0087]
  (Embodiment12)
  Embodiment of the present invention12Will be described with reference to FIGS. 13 (a) and 13 (b). Embodiment2In the light source device 1, wiring patterns 8 and 8 having a width substantially the same as the diameter of the protruding portion 11 are formed on the same straight line passing through the protruding portion 11 on the surface of the insulating member 4 opposite to the substrate 3. In addition, the electrodes provided on the upper surface of the LED chip 2 and the wiring patterns 8 are electrically connected via bonding wires 9. On the other hand, in the light source device 1 of the present embodiment, the embodiment2In the light source device, the width dimension of each wiring pattern 8 is set to a sufficiently small width dimension (for example, about 0.5 mm) as compared with the diameter of the protruding portion 11, and the electrode of the LED chip 2 and each wiring pattern 8 are connected. Each wiring pattern 8 is formed so as to extend in the direction in which the bonding wire 9 is extended. A reflective film (reflective portion) 18 having a high reflectivity made of, for example, silver is formed on the inner surface and bottom surface of the recess 5 ′ other than the wiring pattern 8. The configuration other than the wiring pattern 8 and the reflective film 18 is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0088]
  In the light source device 1, a part of the light emitted from the LED chip 2 passes through the sealing resin 10 and is directly emitted to the outside, and a part is reflected by the reflection film 18 and emitted to the outside.
[0089]
  By the way, the embodiment2In the light source device 1, a part of the light emitted from the LED chip 2 is shielded by the bonding wire 9. The wiring pattern 8 formed on the inner side surface and the bottom surface of the recess 5 'is gold-plated on the surface so that wire bonding can be easily performed, but the blue light emitting or green light emitting LED chip 2 is used. When gold is used, the gold plating layer has a low reflectivity with respect to these lights, so that the light output of the light source device 1 is reduced.
[0090]
  On the other hand, in the present embodiment, the width dimension of the wiring pattern 8 having a low reflectance is narrowed and the wiring pattern 8 is formed in the direction in which the bonding wire 9 extends. By matching the wiring pattern 8, the area of the portion where the light from the LED chip 2 is blocked can be reduced. Further, since the reflective film 18 is formed on the inner side surface and the bottom surface of the recess 5 ′ other than the wiring pattern 8, the light from the LED chip 2 can be efficiently reflected, and the light extraction efficiency is improved. be able to.
[0091]
  (Embodiment13)
  Embodiment of the present invention13Will be described with reference to FIG. In the light source device 1 of this embodiment, the embodiment2In the light source device, a blue light emitting LED chip is used as the LED chip 2, and phosphor particles that emit yellow light that is a complementary color excited by the blue light emission of the LED chip 2 are dispersed in the sealing resin 10 ′. The sealing resin 10 'has a light color conversion function. The configuration other than the sealing resin 10 'is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0092]
  In the light source device 1, white light can be obtained by mixing the blue light emitted from the LED chip 2 and the yellow light partially converted by the phosphor particles. In the case of a bullet-type light emitting diode, the lifetime that is reduced to 70% of the initial luminous flux is as short as about 6000 hours. However, in the light source device 1 of the present embodiment, by increasing the heat dissipation of the LED chip 2, a bullet-shaped light emission is achieved. Compared with a diode, the lifetime can be extended significantly, and a long-life white light emitting diode can be realized.
[0093]
  (Embodiment14)
  Embodiment of the present invention14Will be described with reference to FIG. In the light source device 1 of this embodiment, the embodiment13In the light source device, the side surface shape of the recess 5 ′ has a two-stage structure. That is, the inner surface of the recess 5 'has a tapered surface 4b that gradually increases in inner diameter from the bottom surface side to the opening side of the recess 5' and is inclined at an angle of about 45 degrees. A reflection surface 4c having a cross-sectional shape is formed from the tip end portion of the tapered surface 4b to the opening portion so that the light from the LED chip 2 can be reflected and condensed in a desired direction. In addition, a pair of wiring patterns 8 are formed on the same straight line passing through the projecting portion 11 on the surface of the insulating member 4 opposite to the substrate 3. For example, a reflective film 18 made of a highly reflective material such as silver is formed. The sealing resin 10 ′ is injected into the recess 5 ′ until the tip of the tapered surface 4 b is reached. The configuration other than the side shape of the recess 5 'is an embodiment.13Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0094]
  In this light source device 1, the light extracted from the first stage of the recess 5 ′ is completely diffused because the phosphor particles are dispersed in the sealing resin 10 ′. Since the light emitted from the step is very easy to control the light distribution, the light from the LED chip 2 can be distributed in a desired direction by changing the shape of the second reflecting surface 4c. Can do.
[0095]
  (Embodiment15)
  Embodiment of the present invention15Will be described with reference to FIG. The light source device 1 of the present embodiment is an embodiment2Embodiment having the same structure as that of the light source device 1 described in FIG.2In this embodiment, one LED chip 2 is mounted on the substrate 3. In this embodiment, two LED chips 2 are mounted on the substrate 3, and the two LED chips 2 are connected in series via the wiring pattern 8. Yes. The basic configuration of the light source device 1 is an embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0096]
  By the way, it is generally desirable for the light source device 1 to reduce the area of a portion other than the light emitting portion.2In the case of the light source device 1 described above, the portion formed on the upper surface of the insulating member 4 in the wiring pattern 8 is used as an energization unit for connecting to an external power source, and the energization unit is located on the light emission extraction surface side. In addition, it is necessary to arrange components such as a connector for energizing the energizing portion on the front surface (light emitting surface) side of the light source device 1, and the problem is that the area of a portion other than the light emitting portion increases because these components are disposed. was there.
[0097]
  Therefore, in the light source device 1 of the present embodiment, the upper surface of the insulating member 4 in the wiring patterns 8 on both sides that are electrically connected to only one LED chip 2 out of the three wiring patterns 8 provided on the insulating member 4. An opening hole 3c penetrating the substrate 3 is provided in a portion of the substrate 3 corresponding to the flat portion 8c formed on the (front surface), and the insulating member 4 and the wiring pattern are formed in the portion of the insulating member 4 exposed from the opening hole 3c. 8 is provided. An electrode pin 23 formed in a substantially rod shape from a conductive material is inserted into the through-hole 4e from the upper side of the insulating member 4 so that the tip of the electrode pin 23 protrudes from the lower surface of the substrate 3. When the tip of the pin 23 is fixed to the fixed part, the light source device 1 is fixed to the fixed part in a state where the electrode pin 23 and the wiring pattern 8 are electrically connected. In addition, the hole diameter of the through hole 4e is formed to be smaller than the hole diameter of the opening hole 3c.
[0098]
  As described above, in the present embodiment, a part of the wiring portion is extended toward the substrate side by the electrode pins 23 electrically connected to the wiring pattern 8, and the portion extended to the substrate side (that is, the electrode pin) By supplying power from the outside using the front end portion 23 as an external connection terminal, power can be supplied to the LED chip 2 from the substrate 3 side. Accordingly, a power supply component such as a connector can be disposed on the substrate 3 side (opposite side to the light emitting surface), and the ratio of the area other than the light emitting portion to the whole when viewed from the light emitting side can be reduced. The device 1 can be miniaturized, and the light emission output can be increased with the same area.
[0099]
  (Embodiment16)
  Embodiment of the present invention16Will be described with reference to FIG. In this embodiment, the embodiment2In the light source device 1 described above, the portion excluding the projecting portion 11 of the substrate 3 is formed in a columnar shape having a diameter of about 5 mm and a height of about 10 mm, and the projecting portion 11 is provided so as to project substantially at the center of the upper surface. On the other hand, the planar shape of the insulating member 4 is a square having a side of about 10 mm, and the wiring pattern 8 formed on the front surface side of the insulating member 4 is extended to the back surface side through the side surface and is extended to wrap around the back surface side. The part is an external connection terminal 8d. The configuration other than the substrate 3 and the wiring pattern 8 is an embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0100]
  FIG. 17 shows a state in which the light source device 1 of the present embodiment is attached to the instrument main body 40. The instrument main body 40 includes a glass epoxy wiring board 42 having a round hole 41 having a diameter of about 6 mm. The board 3 of the light source device 1 is inserted into the round hole 41 and extended toward the back side of the insulating member 4. The light source device 1 is electrically and mechanically coupled to the instrument main body 40 by soldering the external connection terminals 8d thus formed to the wiring pattern 43 formed on the upper surface of the wiring board 42. At this time, since the lower surface of the substrate 3 protruding downward from the round hole 41 is thermally coupled to the heat radiating component 44 of the instrument body 40, the heat dissipation of the light source device 1 is improved. In this way, the lower surface of the substrate 3 is brought into contact with the heat radiating component 44 prepared separately from the wiring substrate 42, and the heat generated by the LED chip 2 is radiated through the heat radiating component 44. However, a low-priced glass epoxy substrate can be used, and the cost can be reduced.
[0101]
  In the present embodiment, only one LED chip 2 is mounted on the substrate 3, but it goes without saying that a plurality of LED chips 2 may be mounted on the substrate 3.
[0102]
  (Embodiment17)
  Embodiment of the present invention17Will be described with reference to FIG. In this embodiment, the embodiment2In the light source device 1, a portion of the substrate 3 excluding the projecting portion 11 is formed in a columnar shape having a diameter of about 5 mm and a height of about 0.5 mm, and the projecting portion 11 is protruded substantially at the center of the upper surface. On the other hand, the planar shape of the insulating member 4 is a square having a side of about 20 mm, and a recess 27 having a diameter of about 5 mm centered on the through hole 6 and a depth of about 0.5 mm is provided on the surface on the substrate 3 side. . Then, a through hole 28 penetrating the insulating member 4 is provided in a portion of the insulating member 4 outside the recess 27 and corresponding to the wiring pattern 8 provided on the front surface side of the insulating member 4. A wiring pattern 8 formed on the front surface side of the insulating member 4 and a connection terminal 8f formed on the back surface side are electrically connected via a conductive portion 8e formed by filling a conductive material. The configuration other than the substrate 3, the insulating member 4, and the wiring pattern 8 is an embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0103]
  FIG. 18 shows a state in which the light source device 1 of the present embodiment is mounted on the wiring board 42 of the instrument body. Here, the dimensional relationship of each part is set so that the lower surface of the substrate 3 and the lower surface of the insulating member 4 are substantially flush with each other. When the substrate 3 is placed on the wiring substrate 42, the connection provided on the insulating member 4 is set. Since the terminal 8 f is electrically connected to the wiring pattern 43 provided on the wiring substrate 42, power can be supplied from the wiring substrate 42 to the LED chip 2. Therefore, when attaching the light source device 1 to the wiring board 42, the light source device 1 can be mounted on the pattern surface of the wiring board 42 as it is, and the lower surface of the substrate 3 is in contact with the wiring board 42. The heat radiation can be released through the wiring substrate 42, and the surface-mounted light source device 1 with good heat dissipation can be realized.
[0104]
  In the present embodiment, only one LED chip 2 is mounted on the substrate 3, but it goes without saying that a plurality of LED chips 2 may be mounted on the substrate 3.
[0105]
  (Embodiment18)
  Embodiment of the present invention18Will be described with reference to FIG. Embodiment2In the light source device 1, the LED chip 2 is mounted on only one surface of the substrate 3, but in the light source device 1 of the present embodiment, the LED chip 2 is mounted on both surfaces of the substrate 3. The embodiment is the same as the embodiment except that the LED chip 2 is mounted on both surfaces of the substrate 3.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0106]
  In the light source device 1, two protruding base portions 11 are provided so as to protrude from both surfaces of the substrate 3. A recess 5 ′ that is open on the surface opposite to the substrate 3 is formed in a portion of the insulating member 4 corresponding to the protruding portion 11 of the substrate 3, and the insulating member 4 is formed at the bottom of the recess 5 ′. A through hole 6 penetrating through is formed. Here, the hole diameter of the through hole 6 is about 1 mm, which is substantially the same as the outer diameter of the projecting portion 11. Further, the inner diameter of the bottom surface of the recess 5 ′ is about 2 mm, and the side wall of the recess 5 ′ becomes larger as the distance from the substrate 3 side increases, and is formed in a cross-sectional shape that is inclined at an angle of about 45 degrees. Yes.
[0107]
  Here, the substrate 3 and the insulating members 4 and 4 are joined in a state in which the through-hole 6 and the projecting portion 11 are fitted, and the portion of the projecting portion 11 exposed from the through-hole 6 has a thickness. An LED chip 2 of about 0.2 mm is die-bonded using a die bonding paste 7 such as a silver paste. A wiring pattern 8 made of a conductive material such as copper is formed on the surface of the insulating member 4 opposite to the substrate 3, and the surface thereof is plated with gold. The wiring pattern 8 extends to the side wall and bottom surface of the recess 5 ′, and the wiring pattern 8 formed on the overhanging portion 4 a constituting the bottom surface of the recess 5 ′ and the electrode formed on the upper surface of the LED chip 2. Are electrically connected via a bonding wire 9 made of a fine metal wire such as gold.
[0108]
  As described above, in the light source device 1 of the present embodiment, the insulating member 4, the LED chip 2, the wiring pattern 8, and the sealing resin 10 are provided on both surfaces of the substrate 3. 3 can be radiated on both sides. Moreover, since the same components are arrange | positioned on both surfaces of the board | substrate 3, the curvature of the board | substrate 3 can also be suppressed.
[0109]
  (Embodiment19)
  Below, the manufacturing method of the light source device 1 of this embodiment is demonstrated with reference to Fig.20 (a)-(e). In addition, the structure of the light source device 1 of this embodiment is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0110]
  As the insulating member 4, for example, a MID (Molded) formed of an insulating material such as liquid crystal polymer, polyphthalamide, polyphthalsulfone, epoxy, syndiotactic polystyrene (hereinafter referred to as SPS), polybutylene terephthalate (hereinafter referred to as PBT), or the like. Interconnect Device) is used, and the recess 5 ′ and the through hole 6 are formed by injection molding or transfer molding (see FIG. 20A). And the copper thin film whose film thickness is 0.3 micrometer is formed in the whole surface of the insulating member 4 using vacuum evaporation, DC sputtering method, or RF sputtering method. Next, the surface of the substrate 3 on which the copper thin film is formed is irradiated with an electromagnetic wave such as a laser, and the plating base layer in the portion irradiated with the electromagnetic wave is removed. As the laser to be irradiated at this time, a laser with good absorption of the plating base material such as second or third harmonic YAG laser or YAG laser is preferable. For example, by scanning with a galvanometer mirror, the circuit portion (wiring pattern 8) By irradiating at least the boundary portion of the non-circuit portion with the circuit portion along the pattern of the non-circuit portion, the non-circuit portion is irradiated. The plating base layer in the boundary region with the circuit unit in the circuit unit is removed. After that, power is supplied to the circuit portion, electrolytic copper plating, electrolytic nickel plating, electrolytic silver plating, etc. are performed to form a wiring pattern 8 on which a metal film having a predetermined thickness is formed, and then the non-circuit portion is soft etched or the like. It is removed (see FIG. 20B). In addition, electro gold plating may be applied instead of electro silver plating, and the plating material and thickness may be appropriately determined in consideration of light reflection efficiency and wiring workability.
[0111]
  Next, the substrate 3 formed of a material having good thermal conductivity such as aluminum, silver, or copper is attached to the lower surface of the insulating member 4 using an adhesive such as an epoxy resin or an acrylic resin (FIG. 20C )reference). At this time, it is desirable to previously form the projecting portion 11 at a portion of the substrate 3 corresponding to the through hole 6 of the insulating member 4. Moreover, you may make it couple | bond the board | substrate 3 and the insulating member 4 by press-fitting the protrusion part 11 in the through-hole 6, instead of bonding together the board | substrate 3 and the insulating member 4 using an adhesive agent.
[0112]
  Thereafter, the blue LED chip 2 is die-bonded to the portion of the substrate 3 exposed from the through hole 6 provided in the insulating member 4 by using a translucent adhesive, and a gold bonding wire 9 having a diameter of, for example, 25 μm is used. Then, wire bonding is performed (see FIG. 20D).
[0113]
  Finally, a sealing resin 10 ′ in which phosphor particles that are excited by the blue light emission of the LED chip 2 and emit yellow light that is a complementary color is dispersed in the resin is injected into the recess 5 ′. 9 is sealed (see FIG. 20E).
[0114]
  In the conventional light source device, the mounting portion of the LED chip 2 is formed by cutting the insulating member, so that the processing cost is high, and the surface roughness is low due to cutting scratches on the mounting portion of the LED chip 2. However, in this embodiment, the substrate 3 and the insulating member 4 are bonded as described above, and the substrate exposed from the through hole 6 of the insulating member 4 is roughened. Since the LED chip 2 is mounted on the part 3, the processing cost can be reduced, the mounting part of the LED chip 2 is flat, and the insulating member 4 is made of MID. The pad surface to be connected is flat and flat, and the LED chip 2 can be easily mounted. Moreover, since the bonding wire 9 is stored in the recess 5 ′, the bonding wire 9 does not protrude from the sealing resin 10 ′ filled in the recess 5 ′, and the probability that the bonding wire 9 is disconnected is reduced. Reliability is improved.
[0115]
  (Embodiment20)
  Below, the manufacturing method of the light source device of this embodiment is demonstrated with reference to Fig.21 (a)-(d). In addition, the structure of the light source device 1 of this embodiment is the embodiment.2The same components are denoted by the same reference numerals, and the description thereof is omitted.
[0116]
  As the insulating member 4, for example, MID formed from an insulating material such as liquid crystal polymer, polyphthalamide, polyphthalsulfone, epoxy, SPS, or PBT is used. Further, a material having good thermal conductivity such as silver, aluminum, copper or the like is used as the material of the substrate 3, and the substrate 3 and the insulating member 4 are simultaneously formed by insert molding (see FIG. 21A).
[0117]
  Thereafter, a copper thin film having a film thickness of, for example, 0.3 μm is formed on the entire surface of the insulating member 4 by using vacuum deposition, DC sputtering, or RF sputtering. Next, the surface of the substrate 3 on which the copper thin film is formed is irradiated with an electromagnetic wave such as a laser, and the plating base layer in the portion irradiated with the electromagnetic wave is removed. As the laser to be irradiated at this time, a laser with good absorption of the plating base material such as second or third harmonic YAG laser or YAG laser is preferable. For example, by scanning with a galvanometer mirror, the circuit portion (wiring pattern 8) By irradiating at least the boundary portion of the non-circuit portion with the circuit portion along the pattern of the non-circuit portion, the non-circuit portion is irradiated. The plating base layer in the boundary region with the circuit unit in the circuit unit is removed. After that, power is supplied to the circuit portion, electrolytic copper plating, electrolytic nickel plating, electrolytic silver plating, etc. are performed to form a wiring pattern 8 on which a metal film having a predetermined thickness is formed, and then the non-circuit portion is soft etched or the like. It is removed (see FIG. 21B). In addition, electro gold plating may be applied instead of electro silver plating, and the plating material and thickness may be appropriately determined in consideration of light reflection efficiency and wiring workability.
[0118]
  Thereafter, the blue LED chip 2 is die-bonded to the portion of the substrate 3 exposed from the through hole 6 provided in the insulating member 4 by using a translucent adhesive, and a gold bonding wire 9 having a diameter of, for example, 25 μm is used. Then, wire bonding is performed (see FIG. 21C).
[0119]
  Finally, a sealing resin 10 ′ in which phosphor particles that are excited by the blue light emission of the LED chip 2 and emit yellow light that is a complementary color is dispersed in the resin is injected into the recess 5 ′. 9 is sealed (see FIG. 21D).
[0120]
  By the way, in the conventional light source device, since the mounting part of the LED chip 2 is formed by cutting the insulating member, the processing cost is high and the surface of the mounting part of the LED chip 2 is cut and rough. However, in this embodiment, the substrate 3 and the insulating member 4 are insert-molded as described above from the through hole 6 of the insulating member 4. Since the LED chip 2 is mounted on the exposed portion of the substrate 3, the portion of the substrate 3 on which the LED chip 2 is mounted is flat and the insulating member 4 is made of MID. The pad surface to which is connected is flat and flat, and the LED chip 2 can be easily mounted. Moreover, since the bonding wire 9 is stored in the recess 5 ′, the bonding wire 9 does not protrude from the sealing resin 10 ′ filled in the recess 5 ′, and the probability that the bonding wire 9 is disconnected is reduced. Reliability is improved. Moreover, since the board | substrate 3 and the insulating member 4 are formed by insert molding, the process of joining the board | substrate 3 and the insulating member 4 can be eliminated, and manufacturing cost can be reduced.
[0121]
  (Embodiment21)
  Below, the manufacturing method of the light source device of this embodiment is demonstrated with reference to Fig.22 (a)-(e). In addition, the structure of the light source device 1 of this embodiment is the embodiment.2The same components are denoted by the same reference numerals, and the description thereof is omitted.
[0122]
  First, the lead frame 20a having a thickness of about 1 mm is punched out to form a bent shape or the like, thereby forming the substrate 3 on which the protruding portion 11 is projected, and the lead frame 20b having a thickness of about 0.2 mm. By punching and forming a shape such as a bend, a wiring portion 8 ′ having an insertion hole 8a through which the protruding portion 11 is inserted is formed (see FIG. 22A). As a material for the lead frames 20a and 20b, a material having excellent conductivity and thermal conductivity such as copper and 42 alloy is used.
[0123]
  Then, nickel electroplating and electrosilver plating are partially performed on the projecting portion 11 to which the LED chip 2 is die-bonded and the wiring portion 8 ′ to which the bonding wire 9 is connected. The wire pad portion 8b to which the bonding wire 9 is connected may be subjected to electro gold plating instead of electro silver plating, and the connection work of the bonding wire 9 can be easily performed (see FIG. 22B).
[0124]
  Next, as the MID material, an insulating material such as liquid crystal polymer, polyphthalamide, polyphthalsulfone, epoxy, SPS, PBT, etc. is used, and the wiring portion 8 ′ and the substrate 3 subjected to partial plating are inserted. Simultaneous molding is performed by molding (see FIG. 22C). At this time, the protruding portion 11 of the substrate 3 and the wire pad portion 8b of the wiring portion 8 'are exposed on the bottom surface of the recess 5' formed in the insulating member 4 made of MID.
[0125]
  Thereafter, the blue LED chip 2 is die-bonded to the protruding portion 11 of the substrate 3 using a translucent adhesive, and wire bonding is performed using a gold bonding wire 9 having a diameter of, for example, 25 μm (FIG. 22D )reference).
[0126]
  Finally, a sealing resin 10 ′ in which phosphor particles that are excited by the blue light emission of the LED chip 2 and emit yellow light that is a complementary color is dispersed in the resin is injected into the recess 5 ′. 9 is sealed (see FIG. 22E).
[0127]
  By the way, in the conventional light source device, since the mounting part of the LED chip 2 is formed by cutting the insulating member, the processing cost is high and the surface of the mounting part of the LED chip 2 is cut and rough. However, in this embodiment, the substrate 3 and the insulating member 4 are insert-molded as described above, and the recess provided in the insulating member 4 is difficult. Since the LED chip 2 is mounted on the part of the substrate 3 exposed in 5 ′, the mounting part of the LED chip 2 is flat and the insulating member 4 is made of MID. The pad surface to be connected is flat and flat, and the LED chip 2 can be easily mounted. In addition, since the bonding wire 9 is stored in the recess 5 ′, the bonding wire 9 does not protrude from the sealing resin 10 ′ filled in the recess 5 ′, and the probability that the bonding wire 9 is disconnected is reduced. Reliability is improved. Moreover, since the board | substrate 3 and the insulating member 4 are formed by insert molding, the process of joining the board | substrate 3 and the insulating member 4 can be eliminated, and manufacturing cost can be reduced.
[0128]
  (Embodiment22)
  Below, the manufacturing method of the light source device of this embodiment is demonstrated with reference to Fig.23 (a)-(f). In addition, the structure of the light source device of this embodiment is the embodiment.5Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0129]
  As the insulating member 4, for example, MID formed from an insulating material such as liquid crystal polymer, polyphthalamide, polyphthalsulfone, epoxy, SPS, or PBT is used. Further, as the material of the base plate 3 ′, a material having good thermal conductivity such as silver, aluminum, copper is used, and the base plate 3 ′ and the insulating member 4 are simultaneously formed by insert molding (see FIG. 23A). .
[0130]
  Thereafter, a copper thin film having a film thickness of, for example, 0.3 μm is formed on the entire surface of the insulating member 4 by using vacuum deposition, DC sputtering, or RF sputtering. Next, the surface of the base plate 3 ′ on which the copper thin film is formed is irradiated with an electromagnetic wave such as a laser, and the plating base layer in the portion irradiated with the electromagnetic wave is removed. As the laser to be irradiated at this time, a laser with good absorption of the plating base material such as second or third harmonic YAG laser or YAG laser is preferable. For example, by scanning with a galvanometer mirror, the circuit portion (wiring pattern 8) By irradiating at least the boundary portion of the non-circuit portion with the circuit portion along the pattern of the non-circuit portion, the non-circuit portion is irradiated. The plating base layer in the boundary region with the circuit unit in the circuit unit is removed. After that, power is supplied to the circuit portion, electrolytic copper plating, electrolytic nickel plating, electrolytic silver plating, etc. are performed to form a wiring pattern 8 on which a metal film having a predetermined thickness is formed, and then the non-circuit portion is soft etched or the like. It is removed (see FIG. 23B). In addition, electro gold plating may be applied instead of electro silver plating, and the plating material and thickness may be appropriately determined in consideration of light reflection efficiency and wiring workability.
[0131]
  Next, a columnar (rectangular or cylindrical) thermal conductor 14 is formed from a metal having good thermal conductivity such as aluminum or copper, and a bonding paste having translucency is applied to the LED chip 2 on the upper surface of the thermal conductor 14. After using and die-bonding (see FIG. 24C), heat in which the LED chip 2 is mounted from the base plate 3 ′ side into the communication hole 13 and the through hole 6 formed in the base plate 3 ′ and the insulating member 4 respectively. The conductor 14 is press-fitted (see FIG. 24D). At this time, since the heat conductor 14 is press-fitted into the communication hole 13 provided in the base plate 3 ′, the heat conductor 14 and the base plate 3 ′ are in close contact with each other, and the heat conductor 14 and the base plate 3 ′ Heat conduction between the two increases.
[0132]
  Thereafter, the electrode on the upper surface of the LED chip 2 and the wiring pattern 8 are connected via a gold bonding wire 9 having a diameter of, for example, 25 μm (see FIG. 23E), and excited by the blue light emission of the LED chip 2. Sealing resin 10 'in which phosphor particles that emit yellow light, which is a complementary color, are dispersed in resin is injected into recess 5' to seal LED chip 2 and bonding wire 9 (see FIG. 23 (f)). ).
[0133]
  In the present embodiment, the light source device 1 is manufactured using the above-described manufacturing method, and the LED chip 2 is mounted in advance on the thermal conductor 14, so that the portion of the thermal conductor 14 to be die-bonded on the LED chip 2 is determined. Since the flatness and the flatness can be improved, the LED chip 2 can be easily mounted. Further, since the projecting portion 11 on which the LED chip 2 is mounted is formed by press-fitting the heat conductor 14 into the communication hole 13 provided in the base plate 3 ′, the projecting portion 11 is cut by machining. The processing cost can be reduced compared to the case of forming.
[0134]
  In addition, although the dimension of each part is demonstrated in each embodiment mentioned above, it is not the thing of the meaning which limits the dimension of each part to said dimension, What is necessary is just to set the dimension of each part suitably.
[0135]
【The invention's effect】
  As described above, according to the first aspect of the present invention, the insulating member passes through the insulating member disposed on at least one surface of the substrate, the insulating member disposed on the surface of the substrate, and the insulating member. Power supply including a provided hole, an LED chip arranged to face and thermally couple to a portion of the substrate exposed from the hole, and a wiring portion provided in the insulating member and electrically insulated from the substrate by the insulating member A connecting member that electrically connects the power supply unit and the electrode of the LED chip, and a translucent sealing material that fills the hole and seals the entire LED chip and the connecting memberA protruding portion that protrudes inwardly is provided at the opening edge on the substrate side of the hole provided in the insulating member, and at least a part of the wiring portion is disposed on the protruding portion, and the portion of the wiring portion that is disposed in the protruding portion The electrode of the LED chip is electrically connected to the substrate, and a protruding portion that protrudes toward the insulating member and is inserted into a hole provided in the insulating member is provided on the substrate, the LED chip is opposed to the protruding portion, and heat is applied. Combined and placedThe LED chip is disposed so as to be opposed to and thermally coupled to the portion of the substrate exposed from the hole provided in the insulating member, so that the heat generated by the LED chip is released through the substrate having thermal conductivity. And a light source device with improved heat dissipation can be realized. Therefore, the temperature rise of the LED chip is suppressed, and there is an effect that it is possible to prevent a decrease in light emission efficiency due to the temperature rise. Moreover, since the temperature rise of the LED chip is reduced, a larger forward current can be applied to the LED chip to increase the light output of the LED chip, and the LED chip and the sealing material are thermally deteriorated. This also has the effect of reducing the life and extending the service life. Furthermore, even when the LED chip and the entire connection member are sealed with a sealing material filled in the hole, and a metal wire is used as a connection member that electrically connects the LED chip and the power supply unit, There is no fear that the metal wire is broken by the stress generated at the interface of the resin, and there is an effect that the mechanical strength is improved.Moreover, since the thickness of the projecting portion can be increased by the height of the projecting portion by providing the projecting portion on the substrate, the processing of the projecting portion can be easily performed, and Increasing the thickness dimension has the effect of increasing the rigidity of the overhanging portion and preventing the formation of a gap between the overhanging portion and the substrate when the substrate and the insulating member are joined.
[0136]
  Claim2In the invention of claim 1, in the invention of claim 1, the portion of the wiring portion that is electrically connected to the LED chip via the connection member is disposed in the hole, and the sealing material is filled to the vicinity of the opening of the hole. By filling the sealing material until the surface of the sealing material comes close to the opening of the hole, the filling amount of the sealing material can be made substantially constant, and variations in quality can be suppressed. There is.
[0137]
  Claim3The invention of claim1In the invention, the connecting member is made of a metal wire, and in the joining direction of the substrate and the insulating member, the portion of the LED chip to which one end of the metal wire is connected and the portion of the wiring portion to which the other end of the metal wire is connected. The height is substantially the same, and the length of the metal wire that electrically connects the LED chip and the wiring portion can be shortened, so that the mechanical strength of the metal wire can be increased, and the LED chip. By making the height of the wiring part substantially the same, there is an effect that the bonding work can be easily performed.
[0138]
  Claim4The invention of claim1According to the invention, in the bonding direction of the substrate and the insulating member, the height of the projecting portion on which the LED chip is mounted and the portion of the wiring portion electrically connected to the LED chip are substantially the same height. The light emitted from the LED chip is not shielded by the wiring part, and there is an effect that the light extraction efficiency is improved by reducing the scatter of the light.
[0139]
  Claim5The invention of claim1In the invention of claim 1, the projecting portion is stamped into the insulating member side surface of the substrate by forming a recess by punching from the surface of the substrate opposite to the insulating member. Since the projecting part is formed by performing the above, there is an effect that the processing cost can be reduced as compared with the case where the projecting part is formed by cutting. In addition, when the substrate and the insulating member are bonded together with an adhesive, the entire substrate warps to the insulating member side due to the heat shrinkage of the adhesive, but by forming a recess by punching, the entire substrate is Since it warps on the opposite side to the insulating member, it is possible to cancel the warpage of the substrate caused by the thermal contraction of the adhesive, and to prevent the warpage of the substrate as a whole.
[0140]
  Claim6The invention of claim1In this invention, the substrate is composed of a base plate in which a communication hole communicating with the hole is formed, and a protrusion that is attached in the communication hole and has a tip projecting toward the insulating member. The protrusion is formed by inserting a protrusion into the hole in the base plate and projecting the tip of the protrusion toward the insulating member, so the protrusion is formed by cutting. Compared with the case where it does, there exists an effect that the process of a protrusion part can be performed easily.
[0141]
  Claim7The invention of claim1In the invention of claim 1, wherein a gap is provided between the hole and the projecting part, and when the substrate and the insulating member are bonded together with an adhesive, excess adhesive is removed from the bonding surface between the substrate and the insulating member. There is a possibility that the light from the LED chip may be blocked by the protruding adhesive, or the LED chip may not be mounted, but the protruding adhesive accumulates in the gap provided between the hole and the projecting part. Does not crawl up to the upper surface of the projecting portion, and it is possible to prevent the LED chip light from being blocked by the protruding adhesive or preventing the LED chip from being mounted.
[0142]
  Claim8The invention of claim 1 to claim 17In the invention, the positioning means for positioning the substrate and the insulating member is provided on the joint surface between the substrate and the insulating member, the positioning means can position the substrate and the insulating member, There is an effect that the joining operation between the substrate and the insulating member can be easily performed.
[0143]
  Claim9The invention of claim 1 to claim 17In the invention, characterized in that a reservoir of adhesive used for bonding is provided around the hole of the insulating member on the bonding surface of the substrate and the insulating member, and when the substrate and the insulating member are bonded together with an adhesive, Excess adhesive protrudes from the bonding surface between the substrate and the insulating member, and the LED chip light may be blocked by the protruding adhesive, or the LED chip may not be mounted. Therefore, the adhesive can be prevented from protruding. In addition, if there is a part where the adhesive is insufficient on the joint surface between the substrate and the insulating member, the sealing material may leak out from the gap created in this part, but the reservoir where excess adhesive is stored is insulated. The excess adhesive collected around the hole in the member and placed in the reservoir is placed so as to surround the part of the substrate exposed from the hole, so the weir that the adhesive accumulated in the reservoir blocks the sealing material Thus, the sealing material can be prevented from leaking.
[0144]
  Claim10The invention according to claim 1 is characterized in that, in the invention of claim 1, the power feeding portion includes a substrate formed of a conductive material, and the substrate and the electrode of the LED chip are electrically connected, and the substrate itself is used as the power feeding portion. In addition to connecting one electrode of the LED chip to the substrate and connecting the other electrode of the LED chip to the wiring part, power can be supplied to the LED chip, so the wiring part formed on the surface of the insulating member is There is an advantage that only one circuit is required. Further, since the substrate bears a part of the circuit for supplying power to the LED chip, there is an effect that the circuit can be easily pulled out to the substrate side.
[0145]
  Claim11The invention of claim10In the present invention, the substrate is provided with a plurality of regions that are electrically insulated from each other. By the way, when a plurality of LED chips are mounted on a single substrate, all the LED chips are connected in parallel unless the single substrate is divided into a plurality of regions that are electrically insulated from each other. become. Here, since LED chips have slightly different driving voltages for each individual, if a plurality of LED chips are connected in parallel, a large amount of current flows through the LED chip with the lowest driving voltage, and the LED chips may be damaged. is there. Therefore, in order to equalize the currents flowing through the plurality of LED chips, a method of connecting current limiting resistors in series for each LED chip is conceivable. However, current limiting resistors corresponding to the number of LED chips are required. Thus, the power loss consumed by each resistor increases. On the other hand, in the present invention, the substrate is provided with a plurality of regions that are electrically insulated from each other, LED chips are mounted in each region, and LED chips mounted in each region are connected in series, The current value flowing through each LED chip can be made substantially constant, and if one current limiting resistor is connected to a plurality of LED chips connected in series, the current flowing through each LED chip is limited. Therefore, the power loss consumed by the current limiting resistor can be reduced.
[0146]
  Claim12The invention of claim 1 is characterized in that, in the invention of claim 1, the surface of the sealing material has a lens shape that distributes light emitted from the LED chip in a desired direction, and the surface of the sealing material has a lens shape. Thus, there is an effect that the light emission of the LED chip can be distributed in a desired direction without providing a separate lens.
[0147]
  Claim13The invention is characterized in that, in the invention of claim 1, a reflection part for reflecting light emitted from the LED chip and distributing light in a desired direction is provided on the side wall of the hole, and the light from the LED chip is reflected by the reflection part. By distributing light in a desired direction, there is an effect that the light extraction efficiency is improved.
[0148]
  Claim14The invention of claim13In the invention, the above-mentioned reflection part is also used as a wiring part, and the wiring part and the reflection part are also used, whereby the wiring part and the reflection part pattern formed on the surface of the insulating member can be simplified. There is.
[0149]
  Claim15The invention of claim13In the invention, the connecting member is made of a metal wire, and a wiring portion is disposed in the extending direction of the metal wire, and light from the LED chip is shielded by the metal wire, but becomes a shadow of the metal wire. Since the wiring part is arranged in the part, there is an effect that the light from the LED chip can be distributed in a desired direction by the reflection part formed in a part other than the wiring part.
[0150]
  Claim16The invention of claim 1 is characterized in that, in the invention of claim 1, the sealing material has a light color conversion function of converting at least a part of the light emitted from the LED chip into a predetermined light color. There is an effect that light of a desired light color can be obtained by mixing the light whose color is converted and the light from the LED chip.
[0151]
  Claim17The invention of claim16In this invention, the surface of the sealing material is located on the substrate side of the surface of the insulating member opposite to the substrate, and a reflecting portion that reflects light emitted from the LED chip on the peripheral wall of the hole and distributes the light in a desired direction. Since the light from the LED chip is dispersed by passing through the sealing material and becomes a completely diffusing light distribution, it is easy to control the light distribution, and in a desired direction by the reflecting portion There is an effect that light can be distributed.
[0152]
  Claim18The invention according to claim 1 is characterized in that in the invention of claim 1, a part of the wiring portion is extended toward the substrate side, and the extended portion constitutes an external connection terminal, and a part of the wiring portion is formed on the substrate side. Since the extended portion is used as an external connection terminal, there is an effect that power can be easily supplied from the substrate side to the wiring portion. Although various forms of extending a part of the wiring part toward the substrate side can be considered, for example, the wiring part is extended to the substrate side along the end of the insulating member, or a through hole is formed in the insulating member. It is conceivable to extend the wiring portion to the substrate side by filling the through hole with a conductive material. In addition, the length of the wiring portion extending toward the substrate side is also determined as necessary, and may be extended to the middle of the insulating member or the surface on the substrate side, or a part of the wiring portion may wrap around the surface on the substrate side. Alternatively, it may be projected to the other side of the substrate.
[0153]
  Claim19The invention of claim18In the invention, a part of the wiring part is extended to a surface facing the substrate in the insulating member, and a part of the wiring part is extended to the surface facing the substrate. There is an effect that power can be easily supplied to the part. For example, when this light source device is mounted on an instrument body in which a hole to be fitted to the substrate is formed, a part of the wiring portion extends to the surface of the insulating member facing the substrate, so that the substrate is placed in the hole of the instrument body. If the part is fitted, the electrical connection between the wiring part formed on the instrument body and the wiring part of the light source device can be easily performed, and the board part is fitted in the hole so as to contact the instrument body If it does, heat dissipation will improve.
[0154]
  Claim20The invention of claim18Or19In the invention, a part of the insulating member is extended toward the substrate side, and the tip of the extended portion is substantially flush with the surface of the substrate opposite to the insulating member. When the light source device is mounted on the instrument body by mounting on the surface of the instrument body on the part extended to the substrate side, the extension part of the insulating member is substantially flush with the surface of the substrate opposite to the insulation member. Since the substrate comes into contact with the surface of the instrument body simply by placing the insulating member on the surface of the instrument body, the heat generated by the LED chip is released to the instrument body through the substrate, thereby improving the cooling effect. There is an effect. In addition, since a part of the wiring part is extended to the substrate side to form the external connection terminal, there is an effect that the electrical connection between the external connection terminal and the wiring part formed on the surface of the instrument body can be easily performed. Furthermore, if an external connection terminal is formed on the distal end surface of the portion extending to the substrate side of the insulating member, a surface mount type light source device with improved heat dissipation can be realized.
[0155]
  Claim21The invention of claim 1 is characterized in that, in the invention of claim 1, the insulating member, the LED chip, the wiring portion, and the sealing member are provided on both surfaces of the substrate, and the light of the LED chip is emitted from both surfaces of the substrate. In addition, since the same components are provided on both sides of the substrate, there is an effect that warpage of the substrate can be suppressed.
[Brief description of the drawings]
[Figure 1]Basic configuration of light source device(A) is sectional drawing, (b) is a top view.
FIG. 21It is sectional drawing which shows this light source device.
FIGS. 3A and 3B are embodiments.2It is sectional drawing which shows this light source device.
4 (a) and 4 (b) are embodiments.3It is sectional drawing which shows this light source device.
FIG. 54It is sectional drawing which shows this light source device.
FIG. 6 is an embodiment.5It is sectional drawing which shows this light source device.
FIG. 76It is sectional drawing which shows this light source device.
FIG. 87It is sectional drawing which shows this light source device.
FIG. 98It is sectional drawing which shows this light source device.
FIG. 10 is an embodiment.9It is sectional drawing which shows this light source device.
FIG. 11 Embodiment10It is sectional drawing which shows this light source device.
FIG. 12 is an embodiment.11The light source device of (a) is shown, (a) is sectional drawing, (b) is a top view.
FIG. 13 is an embodiment.12The light source device of (a) is shown, (a) is sectional drawing, (b) is a top view.
FIG. 14 is an embodiment.13It is sectional drawing which shows this light source device.
FIG. 15 is an embodiment.14It is sectional drawing which shows this light source device.
FIG. 16 shows an embodiment.15It is sectional drawing which shows this light source device.
FIG. 17 is an embodiment.16It is sectional drawing which shows this light source device.
FIG. 18 shows an embodiment.17It is sectional drawing which shows this light source device.
FIG. 19 shows an embodiment.18It is sectional drawing which shows this light source device.
FIGS. 20A to 20E are embodiments.19It is sectional drawing which shows each manufacturing process of this light source device.
FIGS. 21A to 21D are embodiments.20It is sectional drawing which shows each manufacturing process of this light source device.
FIGS. 22A to 22E are embodiments.21It is sectional drawing which shows each manufacturing process of this light source device.
23 (a) to (f) are embodiments.22It is sectional drawing which shows each manufacturing process of this light source device.
FIG. 24 is a cross-sectional view of a conventional light source device.
FIG. 25 is a cross-sectional view of another conventional light source device.
[Explanation of symbols]
  1 Light source device
  2 LED chip
  3 Substrate
  4 Insulating material
  4a Overhang
  6 Through hole
  8 Wiring pattern
  9 Bonding wire
  10 Sealing resin

Claims (21)

熱伝導性を有する基板と、基板の少なくとも一方の面に配設された絶縁部材と、基板と対向する絶縁部材の部位に絶縁部材を貫通して設けられた孔と、この孔から露出する基板の部位に対向させ且つ熱結合させて配置されたＬＥＤチップと、絶縁部材に設けられ絶縁部材によって基板と電気的に絶縁された配線部を含む給電部と、給電部とＬＥＤチップの電極との間を電気的に接続する接続部材と、孔内に充填されＬＥＤチップ及び接続部材の全体を封止する透光性を有する封止材料とを備え、絶縁部材に設けた孔の基板側の開口縁に内側に突出する張出部を設け、この張出部に配線部の少なくとも一部を配置し、張出部に配置された配線部の部位にＬＥＤチップの電極を電気的に接続しており、絶縁部材側に突出し絶縁部材に設けた孔内に挿入される突台部を基板に設け、この突台部にＬＥＤチップを対向させ且つ熱結合させて配置したことを特徴とする光源装置。A substrate having thermal conductivity, an insulating member disposed on at least one surface of the substrate, a hole provided through the insulating member in a portion of the insulating member facing the substrate, and a substrate exposed from the hole An LED chip disposed opposite to and thermally coupled to the region, a power supply unit including a wiring unit provided on the insulating member and electrically insulated from the substrate by the insulating member, and a power supply unit and an electrode of the LED chip A connection member that electrically connects the electrodes, and a light-transmitting sealing material that fills the hole and seals the entire LED chip and the connection member, and the opening on the substrate side of the hole provided in the insulating member An overhanging portion protruding inward at the edge is provided, and at least a part of the wiring portion is arranged on the overhanging portion, and the electrode of the LED chip is electrically connected to the portion of the wiring portion arranged on the overhanging portion. In the hole provided in the insulating member Provided support block which is input to the substrate, the light source apparatus characterized by disposing the LED chips by so and thermally bonded facing the support block. 封止材料は孔の開口付近まで充填されたことを特徴とする請求項１記載の光源装置。 2. The light source device according to claim 1, wherein the sealing material is filled up to the vicinity of the opening of the hole . 上記接続部材は金属線からなり、基板及び絶縁部材の接合方向において、金属線の一端が接続されるＬＥＤチップの部位と、金属線の他端が接続される配線部の部位の高さを略同じ高さとしたことを特徴とする請求項１記載の光源装置。 The connecting member is made of a metal wire, and the height of the portion of the LED chip to which one end of the metal wire is connected and the portion of the wiring portion to which the other end of the metal wire is connected in the joining direction of the substrate and the insulating member is approximately The light source device according to claim 1, wherein the light source devices have the same height . 基板及び絶縁部材の接合方向において、ＬＥＤチップが実装される突台部と、ＬＥＤチップに電気的に接続される配線部の部位の高さを略同じ高さとしたことを特徴とする請求項１記載の光源装置。 2. The height of the projecting part on which the LED chip is mounted and the part of the wiring part electrically connected to the LED chip are set to be substantially the same in the bonding direction of the substrate and the insulating member. The light source device described. 突台部は、基板における絶縁部材と反対側の面から打ち出し加工を行って凹所を形成することにより、基板における絶縁部材側の面に打ち出されたことを特徴とする請求項１記載の光源装置。 Support block by forming a recess by performing the launch processing from the surface opposite to the insulating member in the substrate, the light source according to claim 1, characterized in that hammered out on the surface of the insulating member side in the substrate apparatus. 基板を、孔に連通する連通孔が形成されたベース板と、連通孔内に取り付けられ先端が絶縁部材側に突出する突起部とで構成し、突起部の先端により突台部を構成したことを特徴とする請求項１記載の光源装置。 The board is composed of a base plate in which a communication hole communicating with the hole is formed, and a protrusion that is attached in the communication hole and has a tip projecting toward the insulating member, and the protrusion base is configured by the tip of the protrusion. The light source device according to claim 1 . 孔と突台部との間に隙間を設けたことを特徴とする請求項１記載の光源装置。A light source device according to claim 1, characterized in that a gap is provided between the hole and the support block. 基板と絶縁部材との位置決めを行うための位置決め手段を基板と絶縁部材との接合面に設けたことを特徴とする請求項１乃至７の何れか１項に記載の光源装置。 8. The light source device according to claim 1 , wherein positioning means for positioning the substrate and the insulating member is provided on a joint surface between the substrate and the insulating member . 9. 基板と絶縁部材との接合面に接合に用いる接着剤の溜まり部を絶縁部材の孔の周りに設けたことを特徴とする請求項１乃至７の何れか１項に記載の光源装置。The light source device according to any one of claims 1 to 7, wherein a reservoir portion of an adhesive used for bonding is provided around a hole of the insulating member on a bonding surface between the substrate and the insulating member . 上記給電部は導電性材料により形成された基板を含み、基板とＬＥＤチップの電極とを電気的に接続したことを特徴とする請求項１記載の光源装置。 The feeding unit includes a substrate formed of a conductive material, a light source apparatus according to claim 1, characterized in that electrically connects the electrode of the substrate and the LED chip. 上記基板に、互いに電気的に絶縁された複数の領域を設けたことを特徴とする請求項１０記載の光源装置。 The light source device according to claim 10 , wherein the substrate is provided with a plurality of regions electrically insulated from each other . 封止材料の表面を、ＬＥＤチップの発光を所望の方向に配光するレンズ形状としたことを特徴とする請求項１記載の光源装置。 The surface of the sealing material, the light source apparatus according to claim 1, wherein the light emission of the LED chip and a lens shape light distribution in a desired direction. 孔の側壁にＬＥＤチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とする請求項１記載の光源装置。The light source device according to claim 1, wherein reflects light emitted from the LED chip on the side walls of the hole, characterized in that a reflection portion for light distribution in a desired direction. 上記反射部を配線部で兼用したことを特徴とする請求項１３記載の光源装置。 14. The light source device according to claim 13, wherein the reflecting portion is also used as a wiring portion . 上記接続部材は金属線からなり、金属線の延びる方向に配線部を配設したことを特徴とする請求項１３記載の光源装置。 The light source device according to claim 13, wherein the connection member is made of a metal wire, and a wiring portion is disposed in a direction in which the metal wire extends . 封止材料は、ＬＥＤチップから放射された光の少なくとも一部を所定の光色に変換する光色変換機能を有することを特徴とする請求項１記載の光源装置。 Sealing material, the light source apparatus according to claim 1, characterized in that it has a light color converting function for converting at least a portion of light emitted from the LED chip to a predetermined light color. 封止材料の表面は、絶縁部材における基板と反対側の面よりも基板側に位置し、孔の周壁にＬＥＤチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とする請求項１６記載の光源装置。 The surface of the sealing material is located on the substrate side with respect to the surface of the insulating member opposite to the substrate, and a reflection portion that reflects light emitted from the LED chip and distributes light in a desired direction is provided on the peripheral wall of the hole. The light source device according to claim 16, characterized in that: 配線部の一部を基板側に向かって延伸し、この延伸した部分で外部接続端子を構成することを特徴とする請求項１記載の光源装置。 A part of the wiring portion extending toward the substrate side, the light source apparatus according to claim 1, wherein the configuring the external connection terminals in the stretched portion. 上記配線部の一部を、絶縁部材における基板との対向面まで延伸させたことを特徴とする請求項１８記載の光源装置。19. The light source device according to claim 18 , wherein a part of the wiring part is extended to a surface of the insulating member facing the substrate . 絶縁部材の一部を基板側に向かって延伸させ、この延伸した部分の先端を、基板における絶縁部材と反対側の面と略面一にしたことを特徴とする請求項１８又は１９の何れかに記載の光源装置。 20. A part of the insulating member is extended toward the substrate side, and a tip of the extended part is substantially flush with a surface of the substrate opposite to the insulating member . the light source device according to. 絶縁部材とＬＥＤチップと配線部と封止部材とが基板の両面に設けられたことを特徴とする請求項１記載の光源装置。 The light source device according to claim 1, wherein the insulating member, the LED chip, the wiring portion, and the sealing member are provided on both surfaces of the substrate .
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EP01274117A EP1387412B1 (en) 2001-04-12 2001-12-03 Light source device using led, and method of producing same
AT01274117T ATE425556T1 (en) 2001-04-12 2001-12-03 LIGHT SOURCE COMPONENT WITH LED AND METHOD FOR PRODUCING IT
DE60137972T DE60137972D1 (en) 2001-04-12 2001-12-03 LIGHT SOURCE ELEMENT WITH LED AND METHOD FOR THE PRODUCTION THEREOF
US10/398,660 US6874910B2 (en) 2001-04-12 2001-12-03 Light source device using LED, and method of producing same
PCT/JP2001/010561 WO2002084750A1 (en) 2001-04-12 2001-12-03 Light source device using led, and method of producing same
CNB018108806A CN1212676C (en) 2001-04-12 2001-12-03 Light source device using LED, and method of producing same
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