JP4432275B2 - Light source device - Google Patents

Light source device Download PDF

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Publication number
JP4432275B2
JP4432275B2 JP2001114502A JP2001114502A JP4432275B2 JP 4432275 B2 JP4432275 B2 JP 4432275B2 JP 2001114502 A JP2001114502 A JP 2001114502A JP 2001114502 A JP2001114502 A JP 2001114502A JP 4432275 B2 JP4432275 B2 JP 4432275B2
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Prior art keywords
substrate
led chip
insulating
light source
light
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JP2002094122A (en
Inventor
和也 中川
英二 塩浜
充 小林
秀吉 木村
勝 杉本
拓磨 橋本
二郎 橋爪
俊之 鈴木
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パナソニック電工株式会社
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Priority to JP2000-213218 priority
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Priority to JP2001114502A priority patent/JP4432275B2/en
Priority claimed from CNB018108806A external-priority patent/CN1212676C/en
Publication of JP2002094122A publication Critical patent/JP2002094122A/en
Publication of JP4432275B2 publication Critical patent/JP4432275B2/en
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    • HELECTRICITY
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    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract

PROBLEM TO BE SOLVED: To provide a light source and its manufacturing method which improves luminous efficiency to increase the optical power and prolong the life and raises the mechanical strength. SOLUTION: The light source 1 comprises a board 3 having a thermal conductivity, an insulation member 4 bonded to one surface of the board 3, through- holes 6 passing through parts of the insulation member 4 facing the board 3, LED chips 2 mounted on exposed portions of the board 3 through the through- holes 6, expansions 4a inwardly projecting from the opening edges of the through-holes 6 at the board 3, a wiring pattern 8 provided on the insulation member 4 which electrically insulates the pattern 8 from the board 3, bonding wires 9 which electrically connect extending portions of the pattern 8 onto the expansions 4a to electrodes of the LED chips 2, and a translucent seal resin 10 filled in the through-holes 6 to seal the whole of the LEDs 2 and the bonding wires 9.

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a light source device using a light emitting diode.In placeIt is related.
[0002]
[Prior art]
  As this type of light source device, one using a bullet-type light emitting diode as shown in FIG. 24 has been conventionally provided, and a single light emitting diode is used or a plurality of light emitting diodes are mounted on the substrate 30. Some were used in an array.
[0003]
  In the bullet-type light emitting diode, the LED chip 2 is die-bonded using a die bonding paste 7 such as silver paste or epoxy resin on a recess 31 a provided in a metal lead frame 31, and the LED chip 2 is formed on the upper surface of the LED chip 2. After wire bonding between the provided electrode portion (not shown) and the lead frames 31 and 32 with a bonding wire 9 made of a thin metal wire such as gold, the lead frames 31 and 32 are made with a light-transmitting sealing resin 33. The LED chip 2 and the bonding wire 9 are sealed.
[0004]
  Here, an epoxy resin is mainly used as the sealing resin 33, and the sealing resin 33 has the following three functions. First, the sealing resin 33 has a protective function for protecting components from mechanical shocks and protecting the LED chip 2 from moisture. Further, since the refractive index of the light emitting part of the LED chip 2 is as high as about 2.8, total reflection occurs due to the difference in refractive index at the interface between the LED chip 2 surface and air, and the light extraction efficiency of the LED chip 2 is improved. Although there is a problem that it is low, the sealing resin 33 has a function of improving the light extraction efficiency from the LED chip 2 by covering the surface of the LED chip 2 with an epoxy resin having a refractive index of about 1.8. Furthermore, the sealing resin 33 has a light control function of collecting or diffusing light emitted from the LED chip 2 by the lens effect on the surface of the sealing resin 33.
[0005]
  The lead frames 31 and 32 have a function of supporting the LED chip 2 as a foundation when the LED chip 2 is die-bonded, and an LED chip having a mirror surface around the recess 31a where the LED chip 2 is die-bonded. 2 has a function of efficiently distributing light emitted from 2 forward, and a function of releasing heat generated by the LED chip 2 to the outside through the substrate 30 or the like by heat conduction.
[0006]
[Problems to be solved by the invention]
  By the way, in LED chip 2, in the normal use temperature range as a lighting fixture, luminous efficiency becomes high, so that it becomes low temperature, and luminous efficiency falls, so that it becomes high temperature. This is because non-radiative coupling between electrons and holes increases as lattice vibration increases due to temperature rise. In the light source device using a light emitting diode, the portion that generates heat is mainly the LED chip 2. Therefore, the heat generated in the LED chip 2 is quickly radiated to the outside, and the temperature of the LED chip 2 is reduced. This is a very important issue in improving luminous efficiency.
[0007]
  Moreover, since the temperature rise of the LED chip 2 itself can be suppressed by improving the heat dissipation characteristics from the LED chip 2 to the outside, the LED chip 2 can be used by passing a large forward current. The output can be increased. Furthermore, the effect of extending the lifetime of the LED chip 2 can be obtained by enhancing the heat dissipation characteristics.
[0008]
  In addition, as a reason which the lifetime of LED chip 2 is improved, the following two reasons can be considered. Similarly to a general lighting fixture, when the lifetime of the LED chip 2 is defined as a point in time when the luminous flux is reduced to about 70% at the beginning of lighting, the red light emitting diode is considered to have a lifetime of about 60,000 hours. For example, when a forward current greater than the rated current is applied to the LED chip 2 and the LED chip 2 is used in an overload state, the deterioration of the LED chip 2 is significantly accelerated by the heat generated by the LED chip 2 itself. Therefore, by improving the heat dissipation characteristics, the temperature rise of the LED chip 2 can be suppressed and the life of the LED chip 2 can be prevented from being shortened.
[0009]
  In addition, blue light emitting diodes and white light emitting diodes that use blue light emitting diodes to convert blue light from blue light emitting diodes into white light and output them have higher radiation energy than conventional red light emitting diodes, and therefore LED chips. The sealing resin 33 that seals 2 deteriorates due to the emitted light of the LED chip 2 and is colored brown. When the coloring of the sealing resin 33 starts, it becomes easier to absorb blue light and the coloring of the sealing resin 33 is further accelerated. As a result, the sealing resin 33 near the LED chip 2 is brown. Although the LED chip 2 itself maintains the light flux at the initial lighting, the light emitted from the sealing resin 33 to the outside is significantly reduced. Thus, when the sealing resin 33 is colored brown, in the case of a blue light emitting diode or a white light emitting diode, the lifetime is about 6000 hours, which is significantly shorter than that of a red light emitting diode. By the way, although the color reaction of the sealing resin 33 is a photochemical reaction, it is generally known that when the temperature of the sealing resin 33 increases, the reaction rate of the color reaction increases. By improving the heat dissipation characteristics to the outside, the temperature of the LED chip 2 and the sealing resin 33 can be reduced, and the color reaction of the sealing resin 33 due to the light emission of the LED chip 2 can be suppressed.
[0010]
  As described above, in the light source device using the light emitting diode, it is very important to improve the heat radiation characteristics to the outside from the LED chip 2 from the viewpoint of improving the light emission efficiency, increasing the light output, and extending the life. . However, in the bullet-type light emitting diode, there are two heat dissipation paths for releasing the heat generated by the LED chip 2, the path for releasing to the substrate 30 through the lead frame 31 and the path for releasing into the air through the sealing resin 33. In the path for radiating heat through the stop resin 33, the thermal conductivity of the epoxy resin is low, so that a sufficient heat dissipation effect cannot be obtained. Therefore, the heat dissipation path that radiates heat through the lead frame 31 is mainly used, but since the lead frame 31 itself is thin and the heat dissipation path is as long as about 7 to 10 mm, a larger heat dissipation effect than the path that radiates heat through the sealing resin 33 is obtained. However, a sufficient heat dissipation effect could not be expected, and it was difficult to realize a light source device with improved heat dissipation characteristics.
[0011]
  In order to further improve the heat dissipation characteristics, a light source device in which the LED chip 2 is directly die-bonded to the substrate 34 as shown in FIG. 25 has been proposed. The substrate 34 is made of, for example, an aluminum thin plate, and the substrate 34 is pressed to form the recess 34a. After the insulator thin film 35 is formed on the surface of the substrate 34, the insulating film formed on the bottom surface of the recess 34a. The LED chip 2 is die-bonded on the body thin film 35. Then, the wiring pattern 36 formed on the surface of the substrate 34 via the insulator film layer 35 and the electrode on the surface of the LED chip 2 are electrically connected via the bonding wire 9 and penetrated into the recess 34a. It is formed by filling a sealing resin 37 having optical properties.
[0012]
  In this light source device, the heat generated by the LED chip 2 is radiated from the LED chip 2 through the path of the die bonding paste 7 → the insulator film layer 35 → the substrate 34, and the heat transmitted to the substrate 34 is diffused throughout the substrate 34. Therefore, the heat radiation path is short and the heat radiation performance is very high as compared with a bullet-type light emitting diode. However, also in this heat dissipation path, the die bonding paste 7 and the insulator film layer 35 exist as components that hinder heat dissipation. The die bonding paste 7 is made of resin, and although the paste itself has a small thermal conductivity coefficient, the thickness of the paste is as thin as 5 μm or less. Therefore, it is considered that the influence of the die bonding paste 7 on the heat dissipation is small. On the other hand, the insulator film layer 35 is formed of a resin or a resin in which a ceramic filler is dispersed, and the insulator film layer 35 itself has a smaller thermal conductivity coefficient than that of a metal, and the insulator film layer 35. Since the thickness of the film is as thick as about 300 μm, the influence on the heat dissipation is large. Thus, in the light source device having the structure shown in FIG. 25, although the heat radiation from the LED chip 2 is higher than that of the light source device using the cannonball type LED, the insulator film layer 35 exists in the heat radiation path. Therefore, sufficient heat dissipation was not obtained.
[0013]
  Further, in order to reduce the influence of the insulator film layer 35 in heat radiation from the LED chip 2, the insulator film layer 35 is partially removed from the surface of the substrate 34, and the LED chip 2 is directly attached to the exposed substrate 34. A die-bonded light source device has also been proposed. However, the insulating film layer 35 is partially removed by cutting using an end mill or the like, and the exposed surface of the substrate 34 has severe cutting flaws. As a result of measurement, smoothness of about plus or minus 20 μm is obtained. Met. By the way, when the LED chip 2 is die-bonded, depending on the type of the die-bonding agent, the surface on which the LED chip 2 is mounted needs to have a smoothness of about plus or minus 5 μm. It was difficult to mount, and it was difficult to mount the LED chip 2 on the exposed surface of the substrate 34.
[0014]
  Further, in the light source device shown in FIG. 25, the wiring pattern 36 is formed on the upper surface of the insulator film layer 35, and one end of the bonding wire 9 is connected to the wiring pattern 36. Even if sealed with 37, a part of the bonding wire 9 is exposed to the outside from the sealing resin 37, and there is a problem that the strength of the bonding wire 9 is remarkably lowered against mechanical impact. Therefore, in order to protect the portion of the bonding wire 9 exposed to the outside from the sealing resin 37, it may be possible to separately seal the portion of the bonding wire 9 exposed from the sealing resin 37. Even if resin sealing is performed using the same resin, if resin sealing is performed in two steps, stress remains at the interface between the two resins. The bonding wire 9 may be broken at the interface portion. In particular, when powder such as a phosphor is dispersed in the sealing resin 37 in order to obtain white light emission using the blue light emitting LED chip 2, the sealing is performed by sealing the resin from above the sealing resin 37. There is also a problem that a difference in thermal expansion coefficient occurs between the resin and the possibility that the bonding wire 9 is disconnected at the interface portion.
[0015]
  The present invention has been made in view of the above problems, and the object of the present invention is to improve the light emission efficiency, increase the light output, extend the life, and increase the mechanical strength.PlaceIt is to provide.
[0016]
[Means for Solving the Problems]
  In order to achieve the above object, according to the first aspect of the present invention, an insulating member is provided at a portion of a substrate having thermal conductivity, an insulating member disposed on at least one surface of the substrate, and an insulating member facing the substrate. A hole provided through, an LED chip disposed facing and thermally coupled to a portion of the substrate exposed from the hole, and a wiring portion provided in the insulating member and electrically insulated from the substrate by the insulating member , A connecting member that electrically connects the power feeding unit and the electrode of the LED chip, and a sealing material that has a light-transmitting property that fills the hole and seals the entire LED chip and the connecting member And withA protruding portion that protrudes inwardly is provided at the opening edge on the substrate side of the hole provided in the insulating member, and at least a part of the wiring portion is disposed on the protruding portion, and the portion of the wiring portion that is disposed in the protruding portion The electrode of the LED chip is electrically connected to the substrate, and a protruding portion that protrudes toward the insulating member and is inserted into a hole provided in the insulating member is provided on the substrate, the LED chip is opposed to the protruding portion, and heat is applied. Combined and placedThe LED chip is disposed so as to be opposed to and thermally coupled to the portion of the substrate exposed from the hole provided in the insulating member, so that the heat generated by the LED chip is released through the substrate having thermal conductivity. And a light source device with improved heat dissipation can be realized. Therefore, the temperature rise of the LED chip is suppressed, and a decrease in light emission efficiency due to the temperature rise can be prevented. Moreover, since the temperature rise of the LED chip is reduced, a larger forward current can be applied to the LED chip to increase the light output of the LED chip, and the LED chip and the sealing material are thermally deteriorated. It can be reduced and the life can be extended. Furthermore, even when the LED chip and the entire connection member are sealed with a sealing material filled in the hole, and a metal wire is used as a connection member that electrically connects the LED chip and the power supply unit, There is no fear that the metal wire is broken by the stress generated at the interface of the resin, and the mechanical strength can be improved.Moreover, since the thickness of the protruding portion can be increased by the height of the protruding portion by providing the protruding portion on the substrate, the processing of the protruding portion can be easily performed and the thickness of the protruding portion can be increased. By increasing the dimension, it is possible to increase the rigidity of the overhang portion and prevent a gap from being formed between the overhang portion and the substrate when the substrate and the insulating member are joined.
[0017]
  Claim2In the invention of claim 1, in the invention of claim 1, the portion of the wiring portion that is electrically connected to the LED chip via the connecting member is disposed in the hole, and the sealing material is filled to the vicinity of the opening of the hole. By filling the sealing material until the surface of the sealing material comes close to the opening of the hole, the filling amount of the sealing material can be made substantially constant, and variations in quality can be suppressed.
[0018]
  Claim3In the invention of claim1In the invention, the connecting member is made of a metal wire, and in the joining direction of the substrate and the insulating member, the portion of the LED chip to which one end of the metal wire is connected and the portion of the wiring portion to which the other end of the metal wire is connected. The height is substantially the same, and the length of the metal wire that electrically connects the LED chip and the wiring portion can be shortened, so that the mechanical strength of the metal wire can be increased, and the LED chip. By making the height of the wiring part substantially the same, the bonding operation can be easily performed.
[0019]
  Claim4In the invention of claim1According to the invention, in the bonding direction of the substrate and the insulating member, the height of the projecting portion on which the LED chip is mounted and the portion of the wiring portion electrically connected to the LED chip are substantially the same height. The light radiated from the LED chip is not shielded by the wiring part, and the light extraction efficiency can be reduced by reducing the light scattering.
[0020]
  Claim5In the invention of claim1In the invention of claim 1, the projecting portion is stamped into the insulating member side surface of the substrate by forming a recess by punching from the surface of the substrate opposite to the insulating member. Since the projecting part is formed by performing the above, the processing cost can be reduced as compared with the case where the projecting part is formed by cutting. In addition, when the substrate and the insulating member are bonded together with an adhesive, the entire substrate warps to the insulating member side due to the heat shrinkage of the adhesive, but by forming a recess by punching, the entire substrate is Since it warps on the opposite side to the insulating member, the warpage of the substrate caused by the thermal contraction of the adhesive can be offset and the substrate can be prevented from warping as a whole.
[0021]
  Claim6In the invention of claim1In this invention, the substrate is composed of a base plate in which a communication hole communicating with the hole is formed, and a protrusion that is attached in the communication hole and has a tip projecting toward the insulating member. The protrusion is formed by inserting a protrusion into the hole in the base plate and projecting the tip of the protrusion toward the insulating member, so the protrusion is formed by cutting. Compared with the case where it does, the process of a protrusion part can be performed easily.
[0022]
  Claim7In the invention of claim1In the invention of claim 1, wherein a gap is provided between the hole and the projecting part, and when the substrate and the insulating member are bonded together with an adhesive, excess adhesive is removed from the bonding surface between the substrate and the insulating member. There is a possibility that the LED chip light may be blocked by the protruding adhesive, or the LED chip may not be mounted, but the protruding adhesive accumulates in the gap provided between the hole and the protruding part, so the adhesive Does not crawl up to the upper surface of the protrusion, and it is possible to prevent the LED chip light from being blocked by the protruding adhesive and the LED chip from being unable to be mounted.
[0023]
  Claim8In the present invention, claims 1 toAny one of 7In the invention, the positioning means for positioning the substrate and the insulating member is provided on the joint surface between the substrate and the insulating member, the positioning means can position the substrate and the insulating member, It is possible to easily join the substrate and the insulating member.
[0024]
  Claim9In the present invention, claims 1 toAny one of 7In the invention, characterized in that a reservoir of adhesive used for bonding is provided around the hole of the insulating member on the bonding surface of the substrate and the insulating member, and when the substrate and the insulating member are bonded together with an adhesive, Excess adhesive protrudes from the bonding surface between the substrate and the insulating member, and the LED chip light may be blocked by the protruding adhesive, or the LED chip may not be mounted. Therefore, it is possible to prevent the adhesive from protruding. In addition, if there is a part where the adhesive is insufficient on the joint surface between the substrate and the insulating member, the sealing material may leak out from the gap created in this part, but the reservoir where excess adhesive is stored is insulated. The excess adhesive collected around the hole in the member and placed in the reservoir is placed so as to surround the part of the substrate exposed from the hole, so the weir that the adhesive accumulated in the reservoir blocks the sealing material It is possible to prevent the sealing material from leaking.
[0025]
  Claim10In the invention of claim 1, in the invention of claim 1, the power supply unit includes a substrate formed of a conductive material, and the substrate and the electrode of the LED chip are electrically connected, and the substrate itself is used as the power supply unit. In addition to connecting one electrode of the LED chip to the substrate and connecting the other electrode of the LED chip to the wiring part, power can be supplied to the LED chip, so the wiring part formed on the surface of the insulating member is There is an advantage that only one circuit is required. Further, since the substrate bears a part of the circuit for supplying power to the LED chip, the circuit can be easily pulled out to the substrate side.
[0026]
  Claim11In the invention of claim10In the present invention, the substrate is provided with a plurality of regions that are electrically insulated from each other. By the way, when a plurality of LED chips are mounted on a single substrate, all the LED chips are connected in parallel unless the single substrate is divided into a plurality of regions that are electrically insulated from each other. become. Here, since LED chips have slightly different driving voltages for each individual, if a plurality of LED chips are connected in parallel, a large amount of current flows through the LED chip with the lowest driving voltage, and the LED chips may be damaged. is there. Therefore, in order to equalize the currents flowing through the plurality of LED chips, a method of connecting current limiting resistors in series for each LED chip is conceivable. However, current limiting resistors corresponding to the number of LED chips are required. Thus, the power loss consumed by each resistor increases. On the other hand, in the present invention, the substrate is provided with a plurality of regions that are electrically insulated from each other, LED chips are mounted in each region, and LED chips mounted in each region are connected in series, The current value flowing through each LED chip can be made substantially constant, and if one current limiting resistor is connected to a plurality of LED chips connected in series, the current flowing through each LED chip is limited. Therefore, the power loss consumed by the current limiting resistor can be reduced.
[0027]
  Claim12In the invention of claim 1, in the invention of claim 1, the surface of the sealing material has a lens shape that distributes light emitted from the LED chip in a desired direction, and the surface of the sealing material has a lens shape Thus, the light emission of the LED chip can be distributed in a desired direction without providing a separate lens.
[0028]
  Claim13The invention of claim 1 is characterized in that in the invention of claim 1, a reflection part that reflects light emitted from the LED chip and distributes light in a desired direction is provided on the side wall of the hole, and the light of the LED chip is reflected by the reflection part. The light extraction efficiency can be increased by distributing light in a desired direction.
[0029]
  Claim14In the invention of claim13In this invention, the above-mentioned reflection part is shared by the wiring part, and the wiring part also serves as the reflection part, whereby the pattern of the wiring part and the reflection part formed on the surface of the insulating member can be simplified.
[0030]
  Claim15In the invention of claim13In the invention, the connecting member is made of a metal wire, and a wiring portion is disposed in the extending direction of the metal wire, and light from the LED chip is shielded by the metal wire, but becomes a shadow of the metal wire. Since the wiring part is arranged in the part, the light from the LED chip can be distributed in a desired direction by the reflection part formed in a part other than the wiring part.
[0031]
  Claim16In the invention of claim 1, in the invention of claim 1, the sealing material has a light color conversion function of converting at least a part of the light emitted from the LED chip into a predetermined light color. By mixing the light of which the light color has been converted and the light from the LED chip, light of a desired light color can be obtained.
[0032]
  Claim17In the invention of claim16In this invention, the surface of the sealing material is located on the substrate side of the surface of the insulating member opposite to the substrate, and a reflecting portion that reflects light emitted from the LED chip on the peripheral wall of the hole and distributes the light in a desired direction. Since the light from the LED chip is dispersed by passing through the sealing material and becomes a completely diffusing light distribution, it is easy to control the light distribution, and in a desired direction by the reflecting portion Can distribute light.
[0033]
  Claim18The invention according to claim 1 is characterized in that in the invention of claim 1, a part of the wiring part is extended toward the substrate side, and the extended part constitutes an external connection terminal, and a part of the wiring part is formed on the board side. Since the extended portion is used as an external connection terminal, power can be easily supplied from the substrate side to the wiring portion. Although various forms of extending a part of the wiring part toward the substrate side can be considered, for example, the wiring part is extended to the substrate side along the end of the insulating member, or a through hole is formed in the insulating member. It is conceivable to extend the wiring portion to the substrate side by filling the through hole with a conductive material. In addition, the length of the wiring portion extending toward the substrate side is also determined as necessary, and may be extended to the middle of the insulating member or the surface on the substrate side, or a part of the wiring portion may wrap around the surface on the substrate side. Alternatively, it may be projected to the other side of the substrate.
[0034]
  Claim19In the invention of claim18In the invention, a part of the wiring part is extended to a surface facing the substrate in the insulating member, and a part of the wiring part is extended to the surface facing the substrate. Power can be easily supplied to the part. For example, when this light source device is mounted on an instrument body in which a hole to be fitted to the substrate is formed, a part of the wiring portion extends to the surface of the insulating member facing the substrate, so that the substrate is placed in the hole of the instrument body. If the part is fitted, the electrical connection between the wiring part formed on the instrument body and the wiring part of the light source device can be easily performed, and the board part is fitted in the hole so as to contact the instrument body If it does, heat dissipation will improve.
[0035]
  Claim20In the invention of claim18Or19In the invention, a part of the insulating member is extended toward the substrate side, and the tip of the extended portion is substantially flush with the surface of the substrate opposite to the insulating member. When the light source device is mounted on the instrument body by mounting on the surface of the instrument body on the part extended to the substrate side, the extension part of the insulating member is substantially flush with the surface of the substrate opposite to the insulation member. Since the substrate comes into contact with the surface of the instrument body simply by placing the insulating member on the surface of the instrument body, the heat generated by the LED chip is released to the instrument body through the substrate, thereby improving the cooling effect. . In addition, since a part of the wiring portion is extended to the substrate side to form the external connection terminal, electrical connection between the external connection terminal and the wiring portion formed on the surface of the instrument body can be easily performed. Furthermore, if an external connection terminal is formed on the distal end surface of the portion extending to the substrate side of the insulating member, a surface mount type light source device with improved heat dissipation can be realized.
[0036]
  Claim21According to the invention, in the invention of claim 1, the insulating member, the LED chip, the wiring portion, and the sealing member are provided on both surfaces of the substrate, and the light of the LED chip is radiated from both surfaces of the substrate. And because the same parts are arranged on both sides of the substrate, it is possible to suppress warping of the substrate..
[0037]
DETAILED DESCRIPTION OF THE INVENTION
  Embodiments of the present invention will be described below with reference to the drawings.
[0038]
  (Basic configuration)
  Of the present inventionBasic configurationWill be described with reference to FIGS. The light source device 1 includes a substrate 3 made of a material having high thermal conductivity such as aluminum and a thickness of about 2 mm, and an insulating member 4 made of an insulating material such as a liquid crystal polymer and having a thickness of about 2 mm. It is configured by pasting together.
[0039]
  Two round holes 5 having a diameter of about 3 mm and a depth of about 1.5 mm are formed on the surface of the insulating member 4 opposite to the substrate 3, and the insulating member 4 passes through the center of each round hole 5. Through holes 6 having a substantially circular cross section and a diameter of about 1 mm reaching the substrate 3 are formed. Here, the round hole 5 and the through hole 6 constitute a hole provided through the insulating member 4 at a portion of the insulating member 4 facing the substrate 3, and protrudes inward at the bottom of the round hole 5. The overhanging portion 4 a is formed integrally with the substrate 3. The LED chips 2 are die-bonded to the portions of the substrate 3 exposed from the through holes 6 by using a die bonding paste 7 such as a silver paste. A wiring pattern (wiring portion) 8 made of a conductive material such as copper is formed on the same straight line passing through the mounting portion of the two LED chips 2 on the surface of the insulating member 4 opposite to the substrate 3. . The wiring pattern 8 extends to the side wall and the bottom surface (the overhanging portion 4 a) of the round hole 5, and constitutes a connection portion for wire bonding, and the connection between the electrode (not shown) of the LED chip 2 and the wiring pattern 8 The space is electrically connected through a bonding wire (metal wire) 9 made of a fine metal wire such as gold. Here, at least a portion of the wiring pattern 8 to which the bonding wire 9 is connected is plated with gold so that the bonding wire 9 can be easily bonded. Further, since the upper surface of the LED chip 2 and the portion of the wiring pattern 8 formed on the bottom surface of the round hole 5 are substantially the same height, the length of the bonding wire 9 is shortened, The mechanical strength can be increased and the bonding operation can be easily performed.
[0040]
  After that, by injecting a sealing resin (sealing material) 10 such as a two-liquid curable epoxy resin having translucency into the inside of the round hole 5, the entire LED chip 2 and the bonding wire 9 are made. The resin sealing is performed, and the connecting portion of the bonding wire 9 is protected by the sealing resin 10. Here, when the sealing resin 10 is injected, it may be injected up to the upper surface of the insulating member 4, and the injection amount of the sealing resin 10 can be easily controlled. Further, since the bonding wire 9 is connected to a portion of the wiring pattern 8 extending on the overhanging portion 4a and is accommodated in the round hole 5, the sealing resin filled in the round hole 5 is used. 10 can bond the bonding wire 9 and its connecting portion with resin, and the bonding wire 9 is exposed to the outside from the sealing resin 10, so that the mechanical strength is lowered or the bonding wire 9 is generated on the surface of the sealing resin 10. There is no possibility that the bonding wire 9 is disconnected due to the stress to be generated.
[0041]
  The LED chip 2 is described as an example of a GaN-based LED chip in which two electrodes are formed on the top surface of the chip. An LED chip in which one electrode is formed may be used. In this case, the substrate 3 is used as a wiring, or an electrode is provided on the substrate 3, and the LED chip and the electrode of the substrate 3 and the wiring pattern 8 are connected. What is necessary is just to connect between each with a bonding wire.
[0042]
  As mentioned above,BookIn the light source device 1, since the LED chip 2 is directly die-bonded on the substrate 3 having good thermal conductivity, the heat generated by the LED chip 2 is transmitted to the substrate 3 through the die bonding paste 7 and reaches the substrate 3. The heat generated by the chip 2 quickly spreads over the entire substrate 3. Here, although the die bonding paste 7 having a low thermal conductivity coefficient exists in the heat dissipation path of the heat generated by the LED chip 2, the thickness of the die bonding paste 7 is as thin as several μm, so that the influence on the heat dissipation is small. Sufficient heat dissipation performance can be obtained. For example, when compared with thermal resistance, in the case of the bullet-type LED described in the conventional example, the thermal resistance from the LED chip to the tip of the lead frame was about 350 ° C./W,BookIn the light source device 1, the thermal resistance from the LED chip 2 to the back surface of the substrate 3 is about 90 ° C./W, and the thermal resistance can be reduced to about ¼.
[0043]
  Therefore, compared with the conventional light source device, the heat radiation characteristic from the LED chip 2 to the outside is enhanced and the temperature rise of the LED chip 2 is suppressed, so that the light emission efficiency of the LED chip 2 is improved and the light output is increased. In addition, the service life can be extended.
[0044]
  Moreover, since the LED chip 2 and the bonding wire 9 are sealed with the sealing resin 10 and the connecting portion of the bonding wire 9 is also protected by the sealing resin 10, no stress is applied to the bonding wire 9. The disconnection of the bonding wire 9 can be prevented, and the mechanical strength can be improved.
[0045]
  BookLight source device 1In this case, an aluminum plate is used as the substrate 3. However, the material of the substrate 3 is not limited to aluminum, and may be formed from a metal such as copper or a ceramic having high thermal conductivity such as aluminum nitride. The same effect as described above can be obtained. Also bookLight source device 1In this case, the wiring pattern 8 is formed on the insulating member 4 by using the printed wiring technique. However, instead of the wiring pattern 8, only the connection portion of the bonding wire 9 passes through the insulating member 4 in the vicinity of the LED chip 2. The LED chip 2 may be wired using an exposed lead frame (not shown).
[0046]
  (Embodiment1)
  Embodiment of the present invention1Will be described with reference to FIG. The light source device 1 is formed by bonding a substrate 3 made of a material having high thermal conductivity such as aluminum and an insulating member 4 made of an insulating material such as liquid crystal polymer and having a thickness of about 2 mm. The
[0047]
  The substrate 3 is formed by cutting an aluminum plate having a thickness of about 3 mm, and the surface of the substrate 3 on the insulating member 4 side has a substantially cylindrical protrusion having a diameter of about 1 mm and a height of about 0.9 mm. The base part 11 is protrudingly provided.
[0048]
  On the surface of the insulating member 4 opposite to the substrate 3, a recess 5 ′ is formed at a portion corresponding to the protruding portion 11 of the substrate 3, and the insulating member 4 is penetrated at the bottom of the recess 5 ′. A through hole 6 is formed. Here, the hole diameter of the through hole 6 is about 1 mm, which is substantially the same as the outer diameter of the projecting portion 11. Further, the inner diameter of the bottom surface of the recess 5 ′ is about 2 mm, and the side wall of the recess 5 ′ becomes larger as the distance from the substrate 3 side increases, and the cross-sectional shape is inclined at an angle of about 45 degrees. ing. Here, the recess 5 ′ and the through hole 6 constitute a hole that penetrates the insulating member 4 in the portion of the insulating member 4 that faces the substrate 3, and the bottom of the recess 5 ′ is inward. A protruding portion 4 a that protrudes is formed integrally with the substrate 3.
[0049]
  Here, the substrate 3 and the insulating member 4 are joined in a state in which the through-hole 6 and the protruding portion 11 are fitted, and the thickness of the portion of the protruding portion 11 exposed from the through-hole 6 is about 0. A 2 mm LED chip 2 is die-bonded using a die bonding paste 7 such as a silver paste. A wiring pattern 8 made of a conductive material such as copper is formed on the surface of the insulating member 4 opposite to the substrate 3, and the surface thereof is plated with gold. The wiring pattern 8 extends to the side wall and bottom surface of the recess 5 ′, and is formed on the portion of the wiring pattern 8 that extends to the bottom surface (projecting portion 4 a) of the recess 5 ′ and the upper surface of the LED chip 2. The electrodes are electrically connected via bonding wires 9 made of fine metal wires such as gold.
[0050]
  Thereafter, the LED chip 2 and the bonding wire 9 are resin-sealed by injecting a sealing resin 10 such as a two-liquid curable epoxy resin having translucency into the interior of the recess 5 ′. The connecting portion of the bonding wire 9 is protected by the sealing resin 10. Here, when the sealing resin 10 is injected, it may be injected up to the upper surface of the insulating member 4, and the injection amount of the sealing resin 10 can be easily controlled. Moreover, since the bonding wire 9 is connected to the portion of the wiring pattern 8 extending on the overhanging portion 4a and is accommodated in the recess 5 ′, the sealing wire filled in the recess 5 ′ is used. The bonding wire 9 and its connecting portion can be resin-sealed by the stop resin 10, and the mechanical strength is reduced by exposing the bonding wire 9 to the outside from the sealing resin 10, or the surface of the sealing resin 10 There is no possibility that the bonding wire 9 is broken due to the stress generated by the above.
[0051]
  Further, in the light source device 1 of the present embodiment, the LED chip 2 is directly die-bonded on the substrate 3 having good thermal conductivity.Described in the basic configurationSimilar to the light source device 1, sufficient heat dissipation performance can be obtained and the temperature rise of the LED chip 2 is suppressed, so that the light emission efficiency of the LED chip 2 is improved, the light output is increased, and the life is extended. Can be achieved.
[0052]
  Further, in the light source device 1 according to the present embodiment, since the protruding portion 11 is formed on the substrate 3, the wiring pattern formed on the upper surface of the LED chip 2 and the overhanging portion 4 a in the bonding direction of the substrate 3 and the insulating member 4. Even if the height of 8 is substantially the same, the thickness of the overhanging portion 4a can be increased by the height of the projecting portion 11. Here, in the case where the insulating member 4 is formed of resin, if the thickness of the overhang portion 4a is reduced, the yield increases and the processing of the overhang portion 4a becomes difficult. Further, when the substrate 3 and the insulating member 4 are bonded to each other, a gap may be formed between the substrate 3 and the overhanging portion 4 a if the thickness is small. On the other hand, in the light source device 1 of this embodiment, the width of the overhang portion 4a is about 0.5 mm, whereas the thickness is about 1 mm, so that the overhang portion 4a is easily processed. In addition, the substrate 3 and the insulating member 4 can be bonded together without generating a gap between the substrate 3 and the substrate 3.
[0053]
  Also,Described in the basic configurationSimilar to the light source device 1, the upper surface of the LED chip 2 and the portion of the wiring pattern 8 formed on the bottom surface (projecting portion 4 a) of the recess 5 ′ are substantially the same height. There is an advantage that the mechanical strength of the bonding wire 9 can be increased by shortening the length, and the bonding operation can be easily performed. Moreover, since the side wall of the recess 5 'is a tapered surface, the light emitted from the LED chip 2 is not absorbed or diffusely reflected by the side wall of the recess 5', and can be efficiently reflected forward. it can.
[0054]
  (Embodiment2)
  Embodiment of the present invention2Will be described with reference to FIG. In the light source device 1 of this embodiment, the embodiment1In the light source device 1, the height of the protruding portion 11 provided on the substrate 3 is about 1.1 mm, and the height between the upper surface of the protruding portion 11 and the upper surface of the wiring pattern 8 formed on the overhanging portion 4 a. They are almost the same. The configuration other than the projecting portion 11 is an embodiment.1Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0055]
  Embodiment1In the light source device 1, a part of the light emitted from the LED chip 2 in a direction (horizontal direction) substantially parallel to the upper surface of the LED chip 2 is absorbed by the end face of the overhanging portion 4 a. There is a risk that the light emission efficiency may be reduced because the light is not radiated forward due to irregular reflection. On the other hand, in the light source device 1 of the present embodiment, the height of the upper surface of the projecting portion 11 and the upper surface of the wiring pattern 8 formed on the overhanging portion 4a are made substantially the same, and the LED chip 2 Is die-bonded on a substantially flat surface, so that the light emitted from the LED chip 2 is not absorbed or diffusely reflected by the end surface of the overhanging portion 4a, and the light emission efficiency can be improved.
[0056]
  As shown in FIG. 3B, the upper surface of the protrusion 11 may be protruded upward from the wiring pattern 8 formed in the overhanging portion 4a. There is no possibility that light is absorbed or diffusely reflected by the end face of the overhanging portion 4a, and the luminous efficiency can be improved. In addition, since the wire length of the bonding wire 9 will become long and there exists a possibility that the bonding wire 9 may contact the corner | angular part of the protruding part 11 if the protrusion amount of the protruding part 11 becomes too large, The height is such that the upper surface of the projecting part 11 and the upper surface of the wiring pattern 8 formed on the projecting part 4a are substantially flush, or the upper surface of the projecting part 11 is formed on the projecting part 4a. It is desirable to form the wiring pattern 8 so as to be slightly higher than the upper surface of the wiring pattern 8.
[0057]
  (Embodiment3)
  Embodiment of the present invention3Will be described with reference to FIG. In this embodiment, the embodiment2In the light source device 1, the diameter of the protruding portion 11 provided on the substrate 3 is about 0.5 mm and the height is about 1.1 mm, and the wiring formed on the upper surface of the protruding portion 11 and the overhanging portion 4a. The height of the upper surface of the pattern 8 is substantially the same. It should be noted that the embodiment is other than the arrangement of the substrate 3 and the LED chip 2.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0058]
  The LED chip 2 is made of a transparent sapphire substrate, and the distance between the electrodes is about 1 mm. The LED chip 2 is opposed to the projecting part 11, and the projecting part 11 is located between the electrodes. The electrode surface of the LED chip 2 was mounted face-down on the wiring pattern 8. Here, the LED chip 2 and the wiring pattern 8 were joined by the following method. That is, the solder bumps 21 were formed on the electrodes of the LED chip 2 and joined by heating in a reflow furnace to melt the solder bumps 21. The solder bumps 21 have a height of 2 to 3 μm, and the electrode surfaces of the substrate 3 and the LED chip 2 are also separated by this distance, so that electrical insulation is maintained. Further, the sealing resin 10 is filled in the gap between the substrate 3 and the LED chip 2, but the distance between the substrate 3 and the LED chip 2 is sufficiently short, so the LED chip 2 is thermally coupled to the substrate 3, There is no major obstacle to heat conduction from the LED chip 2 to the substrate 3.
[0059]
  Embodiment2In the light source device 1 described above, since the electrode of the LED chip 2 faces the opening side of the recess 5 ′, a part of the light traveling from the LED chip 2 to the outside is blocked by the electrode of the LED chip 2. Part of the blocked light is repeatedly reflected and extracted to the outside, but the rest is absorbed inside and becomes a loss. On the other hand, in this embodiment, the electrode of the LED chip 2 is disposed on the substrate 3 side, and light emitted from the light emitting portion of the LED chip 2 is taken out through the transparent sapphire substrate. A part of the light emission is not shielded by the wire 9, and it is possible to prevent the light amount from being lowered as a whole. Embodiments2When the light source device 1 is used in combination with an optical component such as a lens, depending on the focal length, there is a problem that the shape of the electrode of the LED chip 2 is projected as a shadow onto the irradiation surface. Since it is arrange | positioned at the side, a front surface can be made into a uniform irradiation surface. Further embodiments2As described above, there is no possibility that the light emitted from the LED chip 2 is absorbed by the end face of the overhanging portion 4a or is irregularly reflected, and the light emission efficiency can be improved.
[0060]
  As shown in FIG. 4B, the upper surface of the projecting portion 11 protrudes about 3 μm above the wiring pattern 8 formed on the projecting portion 4a, and the LED chip 2 is placed on the upper surface of the projecting portion 11. Face-down mounting may be performed in a contact state, and heat dissipation can be improved by bringing the LED chip 2 into direct contact with the projecting portion 11. However, in this case, the LED chip 2 and the substrate 3 are coated by coating the upper surface of the projecting part 11 or the portion of the LED chip 2 in contact with the upper surface of the projecting part 11 with an insulating material such as silicon oxide. Or a non-electrically conductive material must be used as the material of the substrate 3. Further, it is desirable to increase the height of the solder bump 21 in order to absorb the level difference between the protruding portion 11 and the wiring pattern 8, and the electrical connection between the electrode of the LED chip 2 and the wiring pattern 8 can be ensured. .
[0061]
  Here, also when the structure of the light source device 1 is the structure shown in FIG. 4B, the light emitted from the LED chip 2 is absorbed or diffusely reflected by the end face of the overhanging portion 4a as described above. There is no fear, and the luminous efficiency can be improved.
[0062]
  (Embodiment4)
  Embodiment of the present invention4Will be described with reference to FIG. In the light source device 1 of this embodiment, the embodiment2In the light source device 1, a recess 12 is provided in a portion corresponding to the protruding portion 11 on the lower surface of the substrate 3. The configuration other than the recess 12 is the embodiment.2Since it is the same as the light source device 1 of the embodiment, the embodiment2The same reference numerals are given to the same constituent elements as in FIG.
[0063]
  Embodiment2In the light source device 1, the protruding portion 11 is formed by cutting the substrate 3. However, in the light source device 1 of the present embodiment, the substrate 3 is punched from one surface and pressed to form the recess 12. As a result, the projecting base 11 is formed on the opposite surface of the substrate 3, and the processing cost can be reduced as compared with the case where cutting is performed.
[0064]
  Moreover, when bonding the board | substrate 3 and the insulating member 4 using an adhesive agent, there exists a possibility that the board | substrate 3 and the whole insulating member 4 may warp by hardening shrinkage | contraction of an adhesive agent. On the other hand, when the protruding portion 11 is formed by press working, a warp in the direction opposite to the direction warped by the curing shrinkage of the adhesive is generated in the substrate 3. Overall warpage can be suppressed.
[0065]
  In the light source device 1, the heat generated by the LED chip 2 is transmitted to the projecting portion 11 of the substrate 3 through the die bonding paste 7. Although the recess 12 is formed on the back surface of the projecting part 11, the substrate 3 is integrally formed, so that the heat generated by the LED chip 2 transmitted to the projecting part 11 is quickly transmitted to the entire substrate 3. Radiated to the outside. Moreover, since the board | substrate 3 is used in the state contacted to heat radiation components, such as the housing | casing in which the light source device 1 is attached, and a heat radiation fin, the heat_generation | fever of LED chip 2 is rapidly discharge | released to the heat radiation component via the board | substrate 3. Therefore, the heat dissipation performance is substantially the same as the case where the recess 12 is not formed.
[0066]
  (Embodiment5)
  Embodiment of the present invention5Will be described with reference to FIG. Embodiment2In the light source device 1, the protruding portion 11 is formed by cutting the substrate 3. However, in the light source device 1 of the present embodiment, instead of forming the protruding portion 11, the protruding portion 11 has thermal conductivity. A communication hole 13 having a substantially circular cross section communicating with the through hole 6 is formed in a portion corresponding to the through hole 6 of the insulating member 4 in the base plate 3 ′ made of a material, and the communication hole 13 is made of, for example, aluminum. A cylindrical heat conductor (protrusion) 14 formed from a material having excellent heat conductivity is press-fitted. Here, the base plate 3 ′ and the heat conductor 14 constitute a substrate, and the tip portion of the heat conductor 14 protruding from the surface of the base plate 3 ′ to the insulating member 4 side constitutes a projecting portion, and heat conduction. The tip of the body 14 is inserted into the through hole 6, and the LED chip 2 is die-bonded to the tip of the heat conductor 14 using the die bonding paste 7. The configuration other than the base plate 3 ′ and the heat conductor 14 is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0067]
  Embodiment2In the light source device, since the projecting portion 11 is formed on the substrate 3 by cutting the metal plate, the processing cost is increased, but in the present embodiment, the base plate 3 ′ is punched, Since the projecting part is formed by press-fitting the heat conductor 14 into the hole, the processing cost can be reduced as compared with the case where the projecting part 11 is formed by cutting.
[0068]
  Considering the case of using a heat dissipation component such as a housing to which the light source device is attached or a heat dissipation fin in contact with the back surface of the base plate 3 ′, the heat generated by the LED chip 2 is transmitted through the die bonding paste 7 as a heat conductor. 14 Here, since the heat conductor 14 is press-fitted into the communication hole 13 penetrating the base plate 3 ′ and reaches the back surface of the base plate 3 ′, the heat generated by the LED chip 2 is quickly transmitted through the heat conductor 14. It is transmitted to the side and released to the heat dissipation component. Further, since the heat conductor 14 is press-fitted into the communication hole 13 of the base plate 3 ′, and the heat conductor 14 and the base plate 3 ′ are in close contact with each other, sufficient heat conduction is performed between them. Since the heat transmitted to the heat conductor 14 is quickly released to the entire base plate 3 ′, the embodiment in which the projecting portion 11 is integrally formed on the substrate 3.2The same heat radiation characteristic as that of the light source device can be obtained.
[0069]
  (Embodiment6)
  Embodiment of the present invention6Will be described with reference to FIG. In the light source device 1 of this embodiment, the embodiment2In the light source device 1, a gap 15 is provided between the peripheral surface of the protruding portion 11 provided on the substrate 3 and the end surface of the through hole 6 provided in the insulating member 4. In addition, a recess 16 for positioning is formed on the surface (bonding surface) of the insulating member 4 on the substrate 3 side, and a convex portion 17 that engages with the recess 16 is provided on the upper surface (bonding surface) of the substrate 3. Yes. It should be noted that, except for the gap 15, the recess 16, and the convex portion 17, the embodiment2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0070]
  Here, in the case where the substrate 3 and the insulating member 4 are formed by bonding with an adhesive, there is a possibility that excess adhesive may protrude from the adhesive surface.2In this light source device, since the adhesive protrudes in the immediate vicinity of the portion where the LED chip 2 is die-bonded, there is a possibility that part of the light emitted from the LED chip 2 is blocked by the adhesive. Further, the protruding adhesive may adhere to the tip surface of the projecting part 11 and the LED chip 2 cannot be die-bonded. However, in the light source device of this embodiment, the projecting part 11 and the projecting part 4a A gap 15 is provided between them, and the adhesive that protrudes from the adhesive surface accumulates in the gap 15. Therefore, excess adhesive protrudes in the vicinity of the portion where the LED chip 2 is die-bonded, and light emitted from the LED chip 2. Can be prevented from being shielded and the LED chip 2 cannot be die-bonded.
[0071]
  In addition, by aligning the protrusions 17 provided on the substrate 3 and the recesses 16 provided on the insulating member 4, the substrate 3 and the insulating member 4 can be aligned. Positioning when the member 4 is bonded can be easily performed. In this embodiment, the convex portion 17 provided on the substrate 3 and the recess 16 provided on the insulating member 4 constitute positioning means for positioning the substrate 3 and the insulating member 4. The positioning means is not intended to be limited to the convex portions 17 and the recesses 16, and the substrate 3 and the insulating member 4 may be positioned using appropriate means.
[0072]
  (Embodiment7)
  Embodiment of the present invention7Will be described with reference to FIG. In this embodiment, the embodiment2In the light source device 1, a ring-shaped groove 4 d having a width of about 0.5 mm and a depth of about 0.3 mm is provided on the surface of the insulating member 4 on the substrate 3 side at a position of a radius of about 1 mm with the through hole 6 as the center. . The configuration other than the groove 4d is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0073]
  Here, when the substrate 3 and the insulating member 4 are bonded and bonded together with an adhesive, there is a possibility that excess adhesive may protrude from the bonding surface.2In the light source device 1, since the adhesive protrudes in the immediate vicinity of the portion where the LED chip 2 is die-bonded, a part of the light emitted from the LED chip 2 may be blocked by the adhesive. In addition, the protruding adhesive may adhere to the front end surface of the projecting portion 11 and the LED chip 2 may not be die-bonded. On the other hand, in the light source device 1 of the present embodiment, since the groove 4d is formed around the through hole 6 into which the projecting portion 11 is fitted, excess adhesive 22 is accumulated in the groove 4d. Protruding to the vicinity of the projecting portion 11 through the through hole 6 can be prevented.
[0074]
  In addition, when there is unevenness in the application of the adhesive 22, a portion where the adhesive 22 is insufficient is generated on the joint surface between the substrate 3 and the insulating member 4, and a gap is formed. In this embodiment, the groove 4d is formed around the through-hole 6, and the adhesive 22 accumulated in the groove 4d flows out of the sealing resin 10. Therefore, the sealing resin 10 can be prevented from flowing out.
[0075]
  (Embodiment8)
  Embodiment of the present invention8Will be described with reference to FIG. In this embodiment, the embodiment2In the light source device 1, a conductive material such as copper is used as the material of the substrate 3, and a gold plating layer is formed on the upper surface of the protruding portion 11. Further, the wiring pattern 8 is formed with only one electrode in the recess 5 ', and the LED chip 2 is placed at a position straddling the protruding part 11 and the wiring pattern 8 formed on the overhanging part 4a. These electrodes are brought into contact with the upper surface of the projecting portion 11, and the other electrode is mounted face-down so as to be in contact with the wiring pattern 8 formed on the overhanging portion 4a. The embodiment except for the mounting method of the LED chip 22Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0076]
  In the light source device 1 of this embodiment, the embodiment3Similarly to the above, the electrode of the LED chip 2 is arranged on the substrate 3 side., LA part of the light emission is not shielded by the electrodes of the ED chip 2, and it is possible to prevent the light amount from being lowered as a whole. Embodiments2As described above, there is no possibility that the light emitted from the LED chip 2 is absorbed by the end face of the overhanging portion 4a or is irregularly reflected, and the light emission efficiency can be improved. Further, in the present embodiment, the power supply E and the current limiting resistor R are connected between the wiring pattern 8 and the substrate 3 to supply power to the LED chip 2, and the substrate 3 is part of the power supply unit. Therefore, the wiring pattern 8 extending into the recess 5 ′ can be simplified. In addition, since the same effect is obtained as the wiring is drawn out to the back side through the substrate 3, the power of the light source device 1 can be supplied from the back side of the substrate 3.
[0077]
  In the light source device 1 of the present embodiment, the LED chip 2 is mounted face-down, but the LED chip 2 is die-bonded mounted face up, and the electrodes of the LED chip 2 and the wiring pattern 8 are connected via bonding wires. The substrate 3 may be electrically connected.
[0078]
  (Embodiment9)
  Embodiment of the present invention9Will be described with reference to FIG. Embodiment8In the light source device 1, one LED chip 2 is mounted on the substrate 3, but in the present embodiment, a plurality of (for example, two) LED chips 2 are mounted on the substrate 3. A plurality of substrate portions (areas) 3a and 3b that are electrically insulated from each other are provided on the substrate 3, and one LED chip 2 is mounted on each of the substrate portions 3a and 3b. The basic structure is the embodiment.8Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0079]
  By the way, the embodiment8In the light source device 1, a conductive material is used as the material of the substrate 3, and the entire substrate 3 has the same potential. Therefore, when a plurality of LED chips 2 are mounted on the substrate 3, these LED chips 2 are used. Are all connected in parallel. Since the LED chip 2 has a slightly different driving voltage for each individual, when a plurality of LED chips 2 are connected in parallel, a large amount of current flows through the LED chip 2 having the lowest driving voltage, and the LED chip 2 may be damaged. There is. In order to make the currents flowing through the plurality of LED chips 2 uniform, current limiting resistors may be connected in series for each LED chip 2, but current limiting resistors corresponding to the number of LED chips 2 are required. Thus, there is a problem that the power loss consumed by the current limiting resistor increases.
[0080]
  On the other hand, in this embodiment, the substrate 3 is divided into a plurality of substrate portions 3a and 3b that are electrically insulated from each other, and the LED chips 2 and 2 are mounted one by one on each substrate portion 3a and 3b. By connecting the LED chips 2 and 2 mounted on the substrate parts 3a and 3b in series, and connecting the DC power source E through the current limiting resistor R in parallel with the series circuit of the LED chips 2 and 2, The current flowing through each LED chip 2 can be made uniform. Therefore, current does not flow concentrated on a specific LED chip 2, so that damage to the LED chip 2 due to current concentration can be prevented, and only one current limiting resistor R is required for a plurality of LED chips 2. Therefore, the power loss generated by the current limiting resistor R can be reduced.
[0081]
  In the light source device 1 of the present embodiment, the embodiment3Similarly to the above, the electrode of the LED chip 2 is arranged on the substrate 3 side., LA part of the light emission is not shielded by the electrodes of the ED chip 2, and it is possible to prevent the light amount from being lowered as a whole. Embodiments2As described above, there is no possibility that the light emitted from the LED chip 2 is absorbed by the end face of the overhanging portion 4a or is irregularly reflected, and the light emission efficiency can be improved. Further, in the present embodiment, the power supply E and the current limiting resistor R are connected between the wiring pattern 8 and the substrate 3 to supply power to the LED chip 2, and the substrate 3 is part of the power supply unit. Therefore, the wiring pattern extending into the recess 5 ′ can be simplified. In addition, since the same effect is obtained as the wiring is drawn out to the back side through the substrate 3, the power of the light source device 1 can be supplied from the back side of the substrate 3.
[0082]
  (Embodiment10)
  Embodiment of the present invention10Will be described with reference to FIG. Embodiment2In the light source device 1, the sealing resin 10 is injected into the recess 5 ′ provided in the insulating member 4 (casting), and the LED chip 2 and the bonding wire 9 are sealed. In apparatus 1, an embodiment2In the light source device, resin sealing is performed by transfer molding using a mold, and a convex lens 10 a is formed on the surface of the sealing resin 10. The configuration other than the sealing resin 10 is an embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0083]
  Embodiment2When the resin sealing is performed by casting as in the light source device 1 of FIG. 1, the surface of the sealing resin 10 cannot be formed into a desired shape. However, in the light source device 1 of the present embodiment, the substrate 3 and the insulating member 4 is incorporated in a mold (not shown), and resin sealing is performed by transfer molding in which the sealing resin 10 is pushed in by press-fitting. Therefore, the surface of the sealing resin 10 can be easily formed in the shape of a convex lens. The light emitted from the LED chip 2 by the convex lens formed of the sealing resin 10 can be distributed in a desired direction in front of the LED chip 2.
[0084]
  In this embodiment, the surface of the sealing resin 10 is formed in the shape of a convex lens. However, the surface of the sealing resin 10 may be formed in the shape of a concave lens, and diffused light emission is performed by the concave lens. Also good. Further, even when resin sealing is performed by casting, the inner surface of the recess 5 ′ and the sealing resin 10 are used by using conditions such as surface roughness, shape, and surface treatment of the inner surface of the recess 5 ′. It is also possible to control the surface shape of the sealing resin 10 by controlling the wettability of the sealing resin. Generally, when the wettability is good, the surface shape of the sealing resin 10 is concave, and when the wettability is poor, the sealing resin 10 is sealed. The surface shape of the stop resin 10 is a convex surface.
[0085]
  (Embodiment11)
  Embodiment of the present invention11Will be described with reference to FIGS. FIG. 12A is a cross-sectional view of the light source device 1, and FIG. 12B is a plan view of the light source device 1. In this embodiment, the embodiment2In the light source device 1, a highly reflective reflective film (reflective portion) 18 made of a highly conductive material such as silver is formed on the entire inner surface of the recess 5 ′ formed in the insulating member 4. Yes. The reflective film 18 is formed continuously with the wiring patterns 8 and 8 and is divided into two parts by a narrow slit 24 (for example, a width of about 0.2 mm) extending in a direction orthogonal to the extending direction of the wiring pattern 8. Each part is electrically insulated. Then, the electrodes of the LED chip 2 mounted on the upper surface of the protrusion 11 and the respective reflective films 18 and 18 are electrically connected by bonding wires 9. The configuration other than the reflective film 18 is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0086]
  In the light source device 1 of the present embodiment, a part of the light emitted from the LED chip 2 passes through the sealing resin 10 and is directly emitted to the outside, and a part is reflected by the reflective film 18 and emitted to the outside. Is done. Since the reflective film 18 has a higher reflectance than the surface of the insulating member 4, the embodiment2As compared with the light source device 1, the ratio of emitted light is increased. Furthermore, in the light source device 1 of the present embodiment, since the reflective film 18 is also used in a part of the wiring pattern 8, compared to the case where the wiring pattern 8 and the reflective film 18 are separately formed in the recess 5 ′. Thus, the shape of the wiring pattern or the reflective film can be simplified. In order to wire bond the bonding wire 9, it is desirable that the reflective film 18 be made of gold. However, when the reflective film 18 is made of gold, blue light emitted from the blue light emitting LED chip 2 is used. In this embodiment, silver is used as the material of the reflective film 18.
[0087]
  (Embodiment12)
  Embodiment of the present invention12Will be described with reference to FIGS. 13 (a) and 13 (b). Embodiment2In the light source device 1, wiring patterns 8 and 8 having a width substantially the same as the diameter of the protruding portion 11 are formed on the same straight line passing through the protruding portion 11 on the surface of the insulating member 4 opposite to the substrate 3. In addition, the electrodes provided on the upper surface of the LED chip 2 and the wiring patterns 8 are electrically connected via bonding wires 9. On the other hand, in the light source device 1 of the present embodiment, the embodiment2In the light source device, the width dimension of each wiring pattern 8 is set to a sufficiently small width dimension (for example, about 0.5 mm) as compared with the diameter of the protruding portion 11, and the electrode of the LED chip 2 and each wiring pattern 8 are connected. Each wiring pattern 8 is formed so as to extend in the direction in which the bonding wire 9 is extended. A reflective film (reflective portion) 18 having a high reflectivity made of, for example, silver is formed on the inner surface and bottom surface of the recess 5 ′ other than the wiring pattern 8. The configuration other than the wiring pattern 8 and the reflective film 18 is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0088]
  In the light source device 1, a part of the light emitted from the LED chip 2 passes through the sealing resin 10 and is directly emitted to the outside, and a part is reflected by the reflection film 18 and emitted to the outside.
[0089]
  By the way, the embodiment2In the light source device 1, a part of the light emitted from the LED chip 2 is shielded by the bonding wire 9. The wiring pattern 8 formed on the inner side surface and the bottom surface of the recess 5 'is gold-plated on the surface so that wire bonding can be easily performed, but the blue light emitting or green light emitting LED chip 2 is used. When gold is used, the gold plating layer has a low reflectivity with respect to these lights, so that the light output of the light source device 1 is reduced.
[0090]
  On the other hand, in the present embodiment, the width dimension of the wiring pattern 8 having a low reflectance is narrowed and the wiring pattern 8 is formed in the direction in which the bonding wire 9 extends. By matching the wiring pattern 8, the area of the portion where the light from the LED chip 2 is blocked can be reduced. Further, since the reflective film 18 is formed on the inner side surface and the bottom surface of the recess 5 ′ other than the wiring pattern 8, the light from the LED chip 2 can be efficiently reflected, and the light extraction efficiency is improved. be able to.
[0091]
  (Embodiment13)
  Embodiment of the present invention13Will be described with reference to FIG. In the light source device 1 of this embodiment, the embodiment2In the light source device, a blue light emitting LED chip is used as the LED chip 2, and phosphor particles that emit yellow light that is a complementary color excited by the blue light emission of the LED chip 2 are dispersed in the sealing resin 10 ′. The sealing resin 10 'has a light color conversion function. The configuration other than the sealing resin 10 'is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0092]
  In the light source device 1, white light can be obtained by mixing the blue light emitted from the LED chip 2 and the yellow light partially converted by the phosphor particles. In the case of a bullet-type light emitting diode, the lifetime that is reduced to 70% of the initial luminous flux is as short as about 6000 hours. However, in the light source device 1 of the present embodiment, by increasing the heat dissipation of the LED chip 2, a bullet-shaped light emission is achieved. Compared with a diode, the lifetime can be extended significantly, and a long-life white light emitting diode can be realized.
[0093]
  (Embodiment14)
  Embodiment of the present invention14Will be described with reference to FIG. In the light source device 1 of this embodiment, the embodiment13In the light source device, the side surface shape of the recess 5 ′ has a two-stage structure. That is, the inner surface of the recess 5 'has a tapered surface 4b that gradually increases in inner diameter from the bottom surface side to the opening side of the recess 5' and is inclined at an angle of about 45 degrees. A reflection surface 4c having a cross-sectional shape is formed from the tip end portion of the tapered surface 4b to the opening portion so that the light from the LED chip 2 can be reflected and condensed in a desired direction. In addition, a pair of wiring patterns 8 are formed on the same straight line passing through the projecting portion 11 on the surface of the insulating member 4 opposite to the substrate 3. For example, a reflective film 18 made of a highly reflective material such as silver is formed. The sealing resin 10 ′ is injected into the recess 5 ′ until the tip of the tapered surface 4 b is reached. The configuration other than the side shape of the recess 5 'is an embodiment.13Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0094]
  In this light source device 1, the light extracted from the first stage of the recess 5 ′ is completely diffused because the phosphor particles are dispersed in the sealing resin 10 ′. Since the light emitted from the step is very easy to control the light distribution, the light from the LED chip 2 can be distributed in a desired direction by changing the shape of the second reflecting surface 4c. Can do.
[0095]
  (Embodiment15)
  Embodiment of the present invention15Will be described with reference to FIG. The light source device 1 of the present embodiment is an embodiment2Embodiment having the same structure as that of the light source device 1 described in FIG.2In this embodiment, one LED chip 2 is mounted on the substrate 3. In this embodiment, two LED chips 2 are mounted on the substrate 3, and the two LED chips 2 are connected in series via the wiring pattern 8. Yes. The basic configuration of the light source device 1 is an embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0096]
  By the way, it is generally desirable for the light source device 1 to reduce the area of a portion other than the light emitting portion.2In the case of the light source device 1 described above, the portion formed on the upper surface of the insulating member 4 in the wiring pattern 8 is used as an energization unit for connecting to an external power source, and the energization unit is located on the light emission extraction surface side. In addition, it is necessary to arrange components such as a connector for energizing the energizing portion on the front surface (light emitting surface) side of the light source device 1, and the problem is that the area of a portion other than the light emitting portion increases because these components are disposed. was there.
[0097]
  Therefore, in the light source device 1 of the present embodiment, the upper surface of the insulating member 4 in the wiring patterns 8 on both sides that are electrically connected to only one LED chip 2 out of the three wiring patterns 8 provided on the insulating member 4. An opening hole 3c penetrating the substrate 3 is provided in a portion of the substrate 3 corresponding to the flat portion 8c formed on the (front surface), and the insulating member 4 and the wiring pattern are formed in the portion of the insulating member 4 exposed from the opening hole 3c. 8 is provided. An electrode pin 23 formed in a substantially rod shape from a conductive material is inserted into the through-hole 4e from the upper side of the insulating member 4 so that the tip of the electrode pin 23 protrudes from the lower surface of the substrate 3. When the tip of the pin 23 is fixed to the fixed part, the light source device 1 is fixed to the fixed part in a state where the electrode pin 23 and the wiring pattern 8 are electrically connected. In addition, the hole diameter of the through hole 4e is formed to be smaller than the hole diameter of the opening hole 3c.
[0098]
  As described above, in the present embodiment, a part of the wiring portion is extended toward the substrate side by the electrode pins 23 electrically connected to the wiring pattern 8, and the portion extended to the substrate side (that is, the electrode pin) By supplying power from the outside using the front end portion 23 as an external connection terminal, power can be supplied to the LED chip 2 from the substrate 3 side. Accordingly, a power supply component such as a connector can be disposed on the substrate 3 side (opposite side to the light emitting surface), and the ratio of the area other than the light emitting portion to the whole when viewed from the light emitting side can be reduced. The device 1 can be miniaturized, and the light emission output can be increased with the same area.
[0099]
  (Embodiment16)
  Embodiment of the present invention16Will be described with reference to FIG. In this embodiment, the embodiment2In the light source device 1 described above, the portion excluding the projecting portion 11 of the substrate 3 is formed in a columnar shape having a diameter of about 5 mm and a height of about 10 mm, and the projecting portion 11 is provided so as to project substantially at the center of the upper surface. On the other hand, the planar shape of the insulating member 4 is a square having a side of about 10 mm, and the wiring pattern 8 formed on the front surface side of the insulating member 4 is extended to the back surface side through the side surface and is extended to wrap around the back surface side. The part is an external connection terminal 8d. The configuration other than the substrate 3 and the wiring pattern 8 is an embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0100]
  FIG. 17 shows a state in which the light source device 1 of the present embodiment is attached to the instrument main body 40. The instrument main body 40 includes a glass epoxy wiring board 42 having a round hole 41 having a diameter of about 6 mm. The board 3 of the light source device 1 is inserted into the round hole 41 and extended toward the back side of the insulating member 4. The light source device 1 is electrically and mechanically coupled to the instrument main body 40 by soldering the external connection terminals 8d thus formed to the wiring pattern 43 formed on the upper surface of the wiring board 42. At this time, since the lower surface of the substrate 3 protruding downward from the round hole 41 is thermally coupled to the heat radiating component 44 of the instrument body 40, the heat dissipation of the light source device 1 is improved. In this way, the lower surface of the substrate 3 is brought into contact with the heat radiating component 44 prepared separately from the wiring substrate 42, and the heat generated by the LED chip 2 is radiated through the heat radiating component 44. However, a low-priced glass epoxy substrate can be used, and the cost can be reduced.
[0101]
  In the present embodiment, only one LED chip 2 is mounted on the substrate 3, but it goes without saying that a plurality of LED chips 2 may be mounted on the substrate 3.
[0102]
  (Embodiment17)
  Embodiment of the present invention17Will be described with reference to FIG. In this embodiment, the embodiment2In the light source device 1, a portion of the substrate 3 excluding the projecting portion 11 is formed in a columnar shape having a diameter of about 5 mm and a height of about 0.5 mm, and the projecting portion 11 is protruded substantially at the center of the upper surface. On the other hand, the planar shape of the insulating member 4 is a square having a side of about 20 mm, and a recess 27 having a diameter of about 5 mm centered on the through hole 6 and a depth of about 0.5 mm is provided on the surface on the substrate 3 side. . Then, a through hole 28 penetrating the insulating member 4 is provided in a portion of the insulating member 4 outside the recess 27 and corresponding to the wiring pattern 8 provided on the front surface side of the insulating member 4. A wiring pattern 8 formed on the front surface side of the insulating member 4 and a connection terminal 8f formed on the back surface side are electrically connected via a conductive portion 8e formed by filling a conductive material. The configuration other than the substrate 3, the insulating member 4, and the wiring pattern 8 is an embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0103]
  FIG. 18 shows a state in which the light source device 1 of the present embodiment is mounted on the wiring board 42 of the instrument body. Here, the dimensional relationship of each part is set so that the lower surface of the substrate 3 and the lower surface of the insulating member 4 are substantially flush with each other. When the substrate 3 is placed on the wiring substrate 42, the connection provided on the insulating member 4 is set. Since the terminal 8 f is electrically connected to the wiring pattern 43 provided on the wiring substrate 42, power can be supplied from the wiring substrate 42 to the LED chip 2. Therefore, when attaching the light source device 1 to the wiring board 42, the light source device 1 can be mounted on the pattern surface of the wiring board 42 as it is, and the lower surface of the substrate 3 is in contact with the wiring board 42. The heat radiation can be released through the wiring substrate 42, and the surface-mounted light source device 1 with good heat dissipation can be realized.
[0104]
  In the present embodiment, only one LED chip 2 is mounted on the substrate 3, but it goes without saying that a plurality of LED chips 2 may be mounted on the substrate 3.
[0105]
  (Embodiment18)
  Embodiment of the present invention18Will be described with reference to FIG. Embodiment2In the light source device 1, the LED chip 2 is mounted on only one surface of the substrate 3, but in the light source device 1 of the present embodiment, the LED chip 2 is mounted on both surfaces of the substrate 3. The embodiment is the same as the embodiment except that the LED chip 2 is mounted on both surfaces of the substrate 3.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0106]
  In the light source device 1, two protruding base portions 11 are provided so as to protrude from both surfaces of the substrate 3. A recess 5 ′ that is open on the surface opposite to the substrate 3 is formed in a portion of the insulating member 4 corresponding to the protruding portion 11 of the substrate 3, and the insulating member 4 is formed at the bottom of the recess 5 ′. A through hole 6 penetrating through is formed. Here, the hole diameter of the through hole 6 is about 1 mm, which is substantially the same as the outer diameter of the projecting portion 11. Further, the inner diameter of the bottom surface of the recess 5 ′ is about 2 mm, and the side wall of the recess 5 ′ becomes larger as the distance from the substrate 3 side increases, and is formed in a cross-sectional shape that is inclined at an angle of about 45 degrees. Yes.
[0107]
  Here, the substrate 3 and the insulating members 4 and 4 are joined in a state in which the through-hole 6 and the projecting portion 11 are fitted, and the portion of the projecting portion 11 exposed from the through-hole 6 has a thickness. An LED chip 2 of about 0.2 mm is die-bonded using a die bonding paste 7 such as a silver paste. A wiring pattern 8 made of a conductive material such as copper is formed on the surface of the insulating member 4 opposite to the substrate 3, and the surface thereof is plated with gold. The wiring pattern 8 extends to the side wall and bottom surface of the recess 5 ′, and the wiring pattern 8 formed on the overhanging portion 4 a constituting the bottom surface of the recess 5 ′ and the electrode formed on the upper surface of the LED chip 2. Are electrically connected via a bonding wire 9 made of a fine metal wire such as gold.
[0108]
  As described above, in the light source device 1 of the present embodiment, the insulating member 4, the LED chip 2, the wiring pattern 8, and the sealing resin 10 are provided on both surfaces of the substrate 3. 3 can be radiated on both sides. Moreover, since the same components are arrange | positioned on both surfaces of the board | substrate 3, the curvature of the board | substrate 3 can also be suppressed.
[0109]
  (Embodiment19)
  Below, the manufacturing method of the light source device 1 of this embodiment is demonstrated with reference to Fig.20 (a)-(e). In addition, the structure of the light source device 1 of this embodiment is the embodiment.2Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0110]
  As the insulating member 4, for example, a MID (Molded) formed of an insulating material such as liquid crystal polymer, polyphthalamide, polyphthalsulfone, epoxy, syndiotactic polystyrene (hereinafter referred to as SPS), polybutylene terephthalate (hereinafter referred to as PBT), or the like. Interconnect Device) is used, and the recess 5 ′ and the through hole 6 are formed by injection molding or transfer molding (see FIG. 20A). And the copper thin film whose film thickness is 0.3 micrometer is formed in the whole surface of the insulating member 4 using vacuum evaporation, DC sputtering method, or RF sputtering method. Next, the surface of the substrate 3 on which the copper thin film is formed is irradiated with an electromagnetic wave such as a laser, and the plating base layer in the portion irradiated with the electromagnetic wave is removed. As the laser to be irradiated at this time, a laser with good absorption of the plating base material such as second or third harmonic YAG laser or YAG laser is preferable. For example, by scanning with a galvanometer mirror, the circuit portion (wiring pattern 8) By irradiating at least the boundary portion of the non-circuit portion with the circuit portion along the pattern of the non-circuit portion, the non-circuit portion is irradiated. The plating base layer in the boundary region with the circuit unit in the circuit unit is removed. After that, power is supplied to the circuit portion, electrolytic copper plating, electrolytic nickel plating, electrolytic silver plating, etc. are performed to form a wiring pattern 8 on which a metal film having a predetermined thickness is formed, and then the non-circuit portion is soft etched or the like. It is removed (see FIG. 20B). In addition, electro gold plating may be applied instead of electro silver plating, and the plating material and thickness may be appropriately determined in consideration of light reflection efficiency and wiring workability.
[0111]
  Next, the substrate 3 formed of a material having good thermal conductivity such as aluminum, silver, or copper is attached to the lower surface of the insulating member 4 using an adhesive such as an epoxy resin or an acrylic resin (FIG. 20C )reference). At this time, it is desirable to previously form the projecting portion 11 at a portion of the substrate 3 corresponding to the through hole 6 of the insulating member 4. Moreover, you may make it couple | bond the board | substrate 3 and the insulating member 4 by press-fitting the protrusion part 11 in the through-hole 6, instead of bonding together the board | substrate 3 and the insulating member 4 using an adhesive agent.
[0112]
  Thereafter, the blue LED chip 2 is die-bonded to the portion of the substrate 3 exposed from the through hole 6 provided in the insulating member 4 by using a translucent adhesive, and a gold bonding wire 9 having a diameter of, for example, 25 μm is used. Then, wire bonding is performed (see FIG. 20D).
[0113]
  Finally, a sealing resin 10 ′ in which phosphor particles that are excited by the blue light emission of the LED chip 2 and emit yellow light that is a complementary color is dispersed in the resin is injected into the recess 5 ′. 9 is sealed (see FIG. 20E).
[0114]
  In the conventional light source device, the mounting portion of the LED chip 2 is formed by cutting the insulating member, so that the processing cost is high, and the surface roughness is low due to cutting scratches on the mounting portion of the LED chip 2. However, in this embodiment, the substrate 3 and the insulating member 4 are bonded as described above, and the substrate exposed from the through hole 6 of the insulating member 4 is roughened. Since the LED chip 2 is mounted on the part 3, the processing cost can be reduced, the mounting part of the LED chip 2 is flat, and the insulating member 4 is made of MID. The pad surface to be connected is flat and flat, and the LED chip 2 can be easily mounted. Moreover, since the bonding wire 9 is stored in the recess 5 ′, the bonding wire 9 does not protrude from the sealing resin 10 ′ filled in the recess 5 ′, and the probability that the bonding wire 9 is disconnected is reduced. Reliability is improved.
[0115]
  (Embodiment20)
  Below, the manufacturing method of the light source device of this embodiment is demonstrated with reference to Fig.21 (a)-(d). In addition, the structure of the light source device 1 of this embodiment is the embodiment.2The same components are denoted by the same reference numerals, and the description thereof is omitted.
[0116]
  As the insulating member 4, for example, MID formed from an insulating material such as liquid crystal polymer, polyphthalamide, polyphthalsulfone, epoxy, SPS, or PBT is used. Further, a material having good thermal conductivity such as silver, aluminum, copper or the like is used as the material of the substrate 3, and the substrate 3 and the insulating member 4 are simultaneously formed by insert molding (see FIG. 21A).
[0117]
  Thereafter, a copper thin film having a film thickness of, for example, 0.3 μm is formed on the entire surface of the insulating member 4 by using vacuum deposition, DC sputtering, or RF sputtering. Next, the surface of the substrate 3 on which the copper thin film is formed is irradiated with an electromagnetic wave such as a laser, and the plating base layer in the portion irradiated with the electromagnetic wave is removed. As the laser to be irradiated at this time, a laser with good absorption of the plating base material such as second or third harmonic YAG laser or YAG laser is preferable. For example, by scanning with a galvanometer mirror, the circuit portion (wiring pattern 8) By irradiating at least the boundary portion of the non-circuit portion with the circuit portion along the pattern of the non-circuit portion, the non-circuit portion is irradiated. The plating base layer in the boundary region with the circuit unit in the circuit unit is removed. After that, power is supplied to the circuit portion, electrolytic copper plating, electrolytic nickel plating, electrolytic silver plating, etc. are performed to form a wiring pattern 8 on which a metal film having a predetermined thickness is formed, and then the non-circuit portion is soft etched or the like. It is removed (see FIG. 21B). In addition, electro gold plating may be applied instead of electro silver plating, and the plating material and thickness may be appropriately determined in consideration of light reflection efficiency and wiring workability.
[0118]
  Thereafter, the blue LED chip 2 is die-bonded to the portion of the substrate 3 exposed from the through hole 6 provided in the insulating member 4 by using a translucent adhesive, and a gold bonding wire 9 having a diameter of, for example, 25 μm is used. Then, wire bonding is performed (see FIG. 21C).
[0119]
  Finally, a sealing resin 10 ′ in which phosphor particles that are excited by the blue light emission of the LED chip 2 and emit yellow light that is a complementary color is dispersed in the resin is injected into the recess 5 ′. 9 is sealed (see FIG. 21D).
[0120]
  By the way, in the conventional light source device, since the mounting part of the LED chip 2 is formed by cutting the insulating member, the processing cost is high and the surface of the mounting part of the LED chip 2 is cut and rough. However, in this embodiment, the substrate 3 and the insulating member 4 are insert-molded as described above from the through hole 6 of the insulating member 4. Since the LED chip 2 is mounted on the exposed portion of the substrate 3, the portion of the substrate 3 on which the LED chip 2 is mounted is flat and the insulating member 4 is made of MID. The pad surface to which is connected is flat and flat, and the LED chip 2 can be easily mounted. Moreover, since the bonding wire 9 is stored in the recess 5 ′, the bonding wire 9 does not protrude from the sealing resin 10 ′ filled in the recess 5 ′, and the probability that the bonding wire 9 is disconnected is reduced. Reliability is improved. Moreover, since the board | substrate 3 and the insulating member 4 are formed by insert molding, the process of joining the board | substrate 3 and the insulating member 4 can be eliminated, and manufacturing cost can be reduced.
[0121]
  (Embodiment21)
  Below, the manufacturing method of the light source device of this embodiment is demonstrated with reference to Fig.22 (a)-(e). In addition, the structure of the light source device 1 of this embodiment is the embodiment.2The same components are denoted by the same reference numerals, and the description thereof is omitted.
[0122]
  First, the lead frame 20a having a thickness of about 1 mm is punched out to form a bent shape or the like, thereby forming the substrate 3 on which the protruding portion 11 is projected, and the lead frame 20b having a thickness of about 0.2 mm. By punching and forming a shape such as a bend, a wiring portion 8 ′ having an insertion hole 8a through which the protruding portion 11 is inserted is formed (see FIG. 22A). As a material for the lead frames 20a and 20b, a material having excellent conductivity and thermal conductivity such as copper and 42 alloy is used.
[0123]
  Then, nickel electroplating and electrosilver plating are partially performed on the projecting portion 11 to which the LED chip 2 is die-bonded and the wiring portion 8 ′ to which the bonding wire 9 is connected. The wire pad portion 8b to which the bonding wire 9 is connected may be subjected to electro gold plating instead of electro silver plating, and the connection work of the bonding wire 9 can be easily performed (see FIG. 22B).
[0124]
  Next, as the MID material, an insulating material such as liquid crystal polymer, polyphthalamide, polyphthalsulfone, epoxy, SPS, PBT, etc. is used, and the wiring portion 8 ′ and the substrate 3 subjected to partial plating are inserted. Simultaneous molding is performed by molding (see FIG. 22C). At this time, the protruding portion 11 of the substrate 3 and the wire pad portion 8b of the wiring portion 8 'are exposed on the bottom surface of the recess 5' formed in the insulating member 4 made of MID.
[0125]
  Thereafter, the blue LED chip 2 is die-bonded to the protruding portion 11 of the substrate 3 using a translucent adhesive, and wire bonding is performed using a gold bonding wire 9 having a diameter of, for example, 25 μm (FIG. 22D )reference).
[0126]
  Finally, a sealing resin 10 ′ in which phosphor particles that are excited by the blue light emission of the LED chip 2 and emit yellow light that is a complementary color is dispersed in the resin is injected into the recess 5 ′. 9 is sealed (see FIG. 22E).
[0127]
  By the way, in the conventional light source device, since the mounting part of the LED chip 2 is formed by cutting the insulating member, the processing cost is high and the surface of the mounting part of the LED chip 2 is cut and rough. However, in this embodiment, the substrate 3 and the insulating member 4 are insert-molded as described above, and the recess provided in the insulating member 4 is difficult. Since the LED chip 2 is mounted on the part of the substrate 3 exposed in 5 ′, the mounting part of the LED chip 2 is flat and the insulating member 4 is made of MID. The pad surface to be connected is flat and flat, and the LED chip 2 can be easily mounted. In addition, since the bonding wire 9 is stored in the recess 5 ′, the bonding wire 9 does not protrude from the sealing resin 10 ′ filled in the recess 5 ′, and the probability that the bonding wire 9 is disconnected is reduced. Reliability is improved. Moreover, since the board | substrate 3 and the insulating member 4 are formed by insert molding, the process of joining the board | substrate 3 and the insulating member 4 can be eliminated, and manufacturing cost can be reduced.
[0128]
  (Embodiment22)
  Below, the manufacturing method of the light source device of this embodiment is demonstrated with reference to Fig.23 (a)-(f). In addition, the structure of the light source device of this embodiment is the embodiment.5Therefore, the same components are denoted by the same reference numerals, and the description thereof is omitted.
[0129]
  As the insulating member 4, for example, MID formed from an insulating material such as liquid crystal polymer, polyphthalamide, polyphthalsulfone, epoxy, SPS, or PBT is used. Further, as the material of the base plate 3 ′, a material having good thermal conductivity such as silver, aluminum, copper is used, and the base plate 3 ′ and the insulating member 4 are simultaneously formed by insert molding (see FIG. 23A). .
[0130]
  Thereafter, a copper thin film having a film thickness of, for example, 0.3 μm is formed on the entire surface of the insulating member 4 by using vacuum deposition, DC sputtering, or RF sputtering. Next, the surface of the base plate 3 ′ on which the copper thin film is formed is irradiated with an electromagnetic wave such as a laser, and the plating base layer in the portion irradiated with the electromagnetic wave is removed. As the laser to be irradiated at this time, a laser with good absorption of the plating base material such as second or third harmonic YAG laser or YAG laser is preferable. For example, by scanning with a galvanometer mirror, the circuit portion (wiring pattern 8) By irradiating at least the boundary portion of the non-circuit portion with the circuit portion along the pattern of the non-circuit portion, the non-circuit portion is irradiated. The plating base layer in the boundary region with the circuit unit in the circuit unit is removed. After that, power is supplied to the circuit portion, electrolytic copper plating, electrolytic nickel plating, electrolytic silver plating, etc. are performed to form a wiring pattern 8 on which a metal film having a predetermined thickness is formed, and then the non-circuit portion is soft etched or the like. It is removed (see FIG. 23B). In addition, electro gold plating may be applied instead of electro silver plating, and the plating material and thickness may be appropriately determined in consideration of light reflection efficiency and wiring workability.
[0131]
  Next, a columnar (rectangular or cylindrical) thermal conductor 14 is formed from a metal having good thermal conductivity such as aluminum or copper, and a bonding paste having translucency is applied to the LED chip 2 on the upper surface of the thermal conductor 14. After using and die-bonding (see FIG. 24C), heat in which the LED chip 2 is mounted from the base plate 3 ′ side into the communication hole 13 and the through hole 6 formed in the base plate 3 ′ and the insulating member 4 respectively. The conductor 14 is press-fitted (see FIG. 24D). At this time, since the heat conductor 14 is press-fitted into the communication hole 13 provided in the base plate 3 ′, the heat conductor 14 and the base plate 3 ′ are in close contact with each other, and the heat conductor 14 and the base plate 3 ′ Heat conduction between the two increases.
[0132]
  Thereafter, the electrode on the upper surface of the LED chip 2 and the wiring pattern 8 are connected via a gold bonding wire 9 having a diameter of, for example, 25 μm (see FIG. 23E), and excited by the blue light emission of the LED chip 2. Sealing resin 10 'in which phosphor particles that emit yellow light, which is a complementary color, are dispersed in resin is injected into recess 5' to seal LED chip 2 and bonding wire 9 (see FIG. 23 (f)). ).
[0133]
  In the present embodiment, the light source device 1 is manufactured using the above-described manufacturing method, and the LED chip 2 is mounted in advance on the thermal conductor 14, so that the portion of the thermal conductor 14 to be die-bonded on the LED chip 2 is determined. Since the flatness and the flatness can be improved, the LED chip 2 can be easily mounted. Further, since the projecting portion 11 on which the LED chip 2 is mounted is formed by press-fitting the heat conductor 14 into the communication hole 13 provided in the base plate 3 ′, the projecting portion 11 is cut by machining. The processing cost can be reduced compared to the case of forming.
[0134]
  In addition, although the dimension of each part is demonstrated in each embodiment mentioned above, it is not the thing of the meaning which limits the dimension of each part to said dimension, What is necessary is just to set the dimension of each part suitably.
[0135]
【The invention's effect】
  As described above, according to the first aspect of the present invention, the insulating member passes through the insulating member disposed on at least one surface of the substrate, the insulating member disposed on the surface of the substrate, and the insulating member. Power supply including a provided hole, an LED chip arranged to face and thermally couple to a portion of the substrate exposed from the hole, and a wiring portion provided in the insulating member and electrically insulated from the substrate by the insulating member A connecting member that electrically connects the power supply unit and the electrode of the LED chip, and a translucent sealing material that fills the hole and seals the entire LED chip and the connecting memberA protruding portion that protrudes inwardly is provided at the opening edge on the substrate side of the hole provided in the insulating member, and at least a part of the wiring portion is disposed on the protruding portion, and the portion of the wiring portion that is disposed in the protruding portion The electrode of the LED chip is electrically connected to the substrate, and a protruding portion that protrudes toward the insulating member and is inserted into a hole provided in the insulating member is provided on the substrate, the LED chip is opposed to the protruding portion, and heat is applied. Combined and placedThe LED chip is disposed so as to be opposed to and thermally coupled to the portion of the substrate exposed from the hole provided in the insulating member, so that the heat generated by the LED chip is released through the substrate having thermal conductivity. And a light source device with improved heat dissipation can be realized. Therefore, the temperature rise of the LED chip is suppressed, and there is an effect that it is possible to prevent a decrease in light emission efficiency due to the temperature rise. Moreover, since the temperature rise of the LED chip is reduced, a larger forward current can be applied to the LED chip to increase the light output of the LED chip, and the LED chip and the sealing material are thermally deteriorated. This also has the effect of reducing the life and extending the service life. Furthermore, even when the LED chip and the entire connection member are sealed with a sealing material filled in the hole, and a metal wire is used as a connection member that electrically connects the LED chip and the power supply unit, There is no fear that the metal wire is broken by the stress generated at the interface of the resin, and there is an effect that the mechanical strength is improved.Moreover, since the thickness of the projecting portion can be increased by the height of the projecting portion by providing the projecting portion on the substrate, the processing of the projecting portion can be easily performed, and Increasing the thickness dimension has the effect of increasing the rigidity of the overhanging portion and preventing the formation of a gap between the overhanging portion and the substrate when the substrate and the insulating member are joined.
[0136]
  Claim2In the invention of claim 1, in the invention of claim 1, the portion of the wiring portion that is electrically connected to the LED chip via the connection member is disposed in the hole, and the sealing material is filled to the vicinity of the opening of the hole. By filling the sealing material until the surface of the sealing material comes close to the opening of the hole, the filling amount of the sealing material can be made substantially constant, and variations in quality can be suppressed. There is.
[0137]
  Claim3The invention of claim1In the invention, the connecting member is made of a metal wire, and in the joining direction of the substrate and the insulating member, the portion of the LED chip to which one end of the metal wire is connected and the portion of the wiring portion to which the other end of the metal wire is connected. The height is substantially the same, and the length of the metal wire that electrically connects the LED chip and the wiring portion can be shortened, so that the mechanical strength of the metal wire can be increased, and the LED chip. By making the height of the wiring part substantially the same, there is an effect that the bonding work can be easily performed.
[0138]
  Claim4The invention of claim1According to the invention, in the bonding direction of the substrate and the insulating member, the height of the projecting portion on which the LED chip is mounted and the portion of the wiring portion electrically connected to the LED chip are substantially the same height. The light emitted from the LED chip is not shielded by the wiring part, and there is an effect that the light extraction efficiency is improved by reducing the scatter of the light.
[0139]
  Claim5The invention of claim1In the invention of claim 1, the projecting portion is stamped into the insulating member side surface of the substrate by forming a recess by punching from the surface of the substrate opposite to the insulating member. Since the projecting part is formed by performing the above, there is an effect that the processing cost can be reduced as compared with the case where the projecting part is formed by cutting. In addition, when the substrate and the insulating member are bonded together with an adhesive, the entire substrate warps to the insulating member side due to the heat shrinkage of the adhesive, but by forming a recess by punching, the entire substrate is Since it warps on the opposite side to the insulating member, it is possible to cancel the warpage of the substrate caused by the thermal contraction of the adhesive, and to prevent the warpage of the substrate as a whole.
[0140]
  Claim6The invention of claim1In this invention, the substrate is composed of a base plate in which a communication hole communicating with the hole is formed, and a protrusion that is attached in the communication hole and has a tip projecting toward the insulating member. The protrusion is formed by inserting a protrusion into the hole in the base plate and projecting the tip of the protrusion toward the insulating member, so the protrusion is formed by cutting. Compared with the case where it does, there exists an effect that the process of a protrusion part can be performed easily.
[0141]
  Claim7The invention of claim1In the invention of claim 1, wherein a gap is provided between the hole and the projecting part, and when the substrate and the insulating member are bonded together with an adhesive, excess adhesive is removed from the bonding surface between the substrate and the insulating member. There is a possibility that the light from the LED chip may be blocked by the protruding adhesive, or the LED chip may not be mounted, but the protruding adhesive accumulates in the gap provided between the hole and the projecting part. Does not crawl up to the upper surface of the projecting portion, and it is possible to prevent the LED chip light from being blocked by the protruding adhesive or preventing the LED chip from being mounted.
[0142]
  Claim8The invention of claim 1 to claim 17In the invention, the positioning means for positioning the substrate and the insulating member is provided on the joint surface between the substrate and the insulating member, the positioning means can position the substrate and the insulating member, There is an effect that the joining operation between the substrate and the insulating member can be easily performed.
[0143]
  Claim9The invention of claim 1 to claim 17In the invention, characterized in that a reservoir of adhesive used for bonding is provided around the hole of the insulating member on the bonding surface of the substrate and the insulating member, and when the substrate and the insulating member are bonded together with an adhesive, Excess adhesive protrudes from the bonding surface between the substrate and the insulating member, and the LED chip light may be blocked by the protruding adhesive, or the LED chip may not be mounted. Therefore, the adhesive can be prevented from protruding. In addition, if there is a part where the adhesive is insufficient on the joint surface between the substrate and the insulating member, the sealing material may leak out from the gap created in this part, but the reservoir where excess adhesive is stored is insulated. The excess adhesive collected around the hole in the member and placed in the reservoir is placed so as to surround the part of the substrate exposed from the hole, so the weir that the adhesive accumulated in the reservoir blocks the sealing material Thus, the sealing material can be prevented from leaking.
[0144]
  Claim10The invention according to claim 1 is characterized in that, in the invention of claim 1, the power feeding portion includes a substrate formed of a conductive material, and the substrate and the electrode of the LED chip are electrically connected, and the substrate itself is used as the power feeding portion. In addition to connecting one electrode of the LED chip to the substrate and connecting the other electrode of the LED chip to the wiring part, power can be supplied to the LED chip, so the wiring part formed on the surface of the insulating member is There is an advantage that only one circuit is required. Further, since the substrate bears a part of the circuit for supplying power to the LED chip, there is an effect that the circuit can be easily pulled out to the substrate side.
[0145]
  Claim11The invention of claim10In the present invention, the substrate is provided with a plurality of regions that are electrically insulated from each other. By the way, when a plurality of LED chips are mounted on a single substrate, all the LED chips are connected in parallel unless the single substrate is divided into a plurality of regions that are electrically insulated from each other. become. Here, since LED chips have slightly different driving voltages for each individual, if a plurality of LED chips are connected in parallel, a large amount of current flows through the LED chip with the lowest driving voltage, and the LED chips may be damaged. is there. Therefore, in order to equalize the currents flowing through the plurality of LED chips, a method of connecting current limiting resistors in series for each LED chip is conceivable. However, current limiting resistors corresponding to the number of LED chips are required. Thus, the power loss consumed by each resistor increases. On the other hand, in the present invention, the substrate is provided with a plurality of regions that are electrically insulated from each other, LED chips are mounted in each region, and LED chips mounted in each region are connected in series, The current value flowing through each LED chip can be made substantially constant, and if one current limiting resistor is connected to a plurality of LED chips connected in series, the current flowing through each LED chip is limited. Therefore, the power loss consumed by the current limiting resistor can be reduced.
[0146]
  Claim12The invention of claim 1 is characterized in that, in the invention of claim 1, the surface of the sealing material has a lens shape that distributes light emitted from the LED chip in a desired direction, and the surface of the sealing material has a lens shape. Thus, there is an effect that the light emission of the LED chip can be distributed in a desired direction without providing a separate lens.
[0147]
  Claim13The invention is characterized in that, in the invention of claim 1, a reflection part for reflecting light emitted from the LED chip and distributing light in a desired direction is provided on the side wall of the hole, and the light from the LED chip is reflected by the reflection part. By distributing light in a desired direction, there is an effect that the light extraction efficiency is improved.
[0148]
  Claim14The invention of claim13In the invention, the above-mentioned reflection part is also used as a wiring part, and the wiring part and the reflection part are also used, whereby the wiring part and the reflection part pattern formed on the surface of the insulating member can be simplified. There is.
[0149]
  Claim15The invention of claim13In the invention, the connecting member is made of a metal wire, and a wiring portion is disposed in the extending direction of the metal wire, and light from the LED chip is shielded by the metal wire, but becomes a shadow of the metal wire. Since the wiring part is arranged in the part, there is an effect that the light from the LED chip can be distributed in a desired direction by the reflection part formed in a part other than the wiring part.
[0150]
  Claim16The invention of claim 1 is characterized in that, in the invention of claim 1, the sealing material has a light color conversion function of converting at least a part of the light emitted from the LED chip into a predetermined light color. There is an effect that light of a desired light color can be obtained by mixing the light whose color is converted and the light from the LED chip.
[0151]
  Claim17The invention of claim16In this invention, the surface of the sealing material is located on the substrate side of the surface of the insulating member opposite to the substrate, and a reflecting portion that reflects light emitted from the LED chip on the peripheral wall of the hole and distributes the light in a desired direction. Since the light from the LED chip is dispersed by passing through the sealing material and becomes a completely diffusing light distribution, it is easy to control the light distribution, and in a desired direction by the reflecting portion There is an effect that light can be distributed.
[0152]
  Claim18The invention according to claim 1 is characterized in that in the invention of claim 1, a part of the wiring portion is extended toward the substrate side, and the extended portion constitutes an external connection terminal, and a part of the wiring portion is formed on the substrate side. Since the extended portion is used as an external connection terminal, there is an effect that power can be easily supplied from the substrate side to the wiring portion. Although various forms of extending a part of the wiring part toward the substrate side can be considered, for example, the wiring part is extended to the substrate side along the end of the insulating member, or a through hole is formed in the insulating member. It is conceivable to extend the wiring portion to the substrate side by filling the through hole with a conductive material. In addition, the length of the wiring portion extending toward the substrate side is also determined as necessary, and may be extended to the middle of the insulating member or the surface on the substrate side, or a part of the wiring portion may wrap around the surface on the substrate side. Alternatively, it may be projected to the other side of the substrate.
[0153]
  Claim19The invention of claim18In the invention, a part of the wiring part is extended to a surface facing the substrate in the insulating member, and a part of the wiring part is extended to the surface facing the substrate. There is an effect that power can be easily supplied to the part. For example, when this light source device is mounted on an instrument body in which a hole to be fitted to the substrate is formed, a part of the wiring portion extends to the surface of the insulating member facing the substrate, so that the substrate is placed in the hole of the instrument body. If the part is fitted, the electrical connection between the wiring part formed on the instrument body and the wiring part of the light source device can be easily performed, and the board part is fitted in the hole so as to contact the instrument body If it does, heat dissipation will improve.
[0154]
  Claim20The invention of claim18Or19In the invention, a part of the insulating member is extended toward the substrate side, and the tip of the extended portion is substantially flush with the surface of the substrate opposite to the insulating member. When the light source device is mounted on the instrument body by mounting on the surface of the instrument body on the part extended to the substrate side, the extension part of the insulating member is substantially flush with the surface of the substrate opposite to the insulation member. Since the substrate comes into contact with the surface of the instrument body simply by placing the insulating member on the surface of the instrument body, the heat generated by the LED chip is released to the instrument body through the substrate, thereby improving the cooling effect. There is an effect. In addition, since a part of the wiring part is extended to the substrate side to form the external connection terminal, there is an effect that the electrical connection between the external connection terminal and the wiring part formed on the surface of the instrument body can be easily performed. Furthermore, if an external connection terminal is formed on the distal end surface of the portion extending to the substrate side of the insulating member, a surface mount type light source device with improved heat dissipation can be realized.
[0155]
  Claim21The invention of claim 1 is characterized in that, in the invention of claim 1, the insulating member, the LED chip, the wiring portion, and the sealing member are provided on both surfaces of the substrate, and the light of the LED chip is emitted from both surfaces of the substrate. In addition, since the same components are provided on both sides of the substrate, there is an effect that warpage of the substrate can be suppressed.
[Brief description of the drawings]
[Figure 1]Basic configuration of light source device(A) is sectional drawing, (b) is a top view.
FIG. 21It is sectional drawing which shows this light source device.
FIGS. 3A and 3B are embodiments.2It is sectional drawing which shows this light source device.
4 (a) and 4 (b) are embodiments.3It is sectional drawing which shows this light source device.
FIG. 54It is sectional drawing which shows this light source device.
FIG. 6 is an embodiment.5It is sectional drawing which shows this light source device.
FIG. 76It is sectional drawing which shows this light source device.
FIG. 87It is sectional drawing which shows this light source device.
FIG. 98It is sectional drawing which shows this light source device.
FIG. 10 is an embodiment.9It is sectional drawing which shows this light source device.
FIG. 11 Embodiment10It is sectional drawing which shows this light source device.
FIG. 12 is an embodiment.11The light source device of (a) is shown, (a) is sectional drawing, (b) is a top view.
FIG. 13 is an embodiment.12The light source device of (a) is shown, (a) is sectional drawing, (b) is a top view.
FIG. 14 is an embodiment.13It is sectional drawing which shows this light source device.
FIG. 15 is an embodiment.14It is sectional drawing which shows this light source device.
FIG. 16 shows an embodiment.15It is sectional drawing which shows this light source device.
FIG. 17 is an embodiment.16It is sectional drawing which shows this light source device.
FIG. 18 shows an embodiment.17It is sectional drawing which shows this light source device.
FIG. 19 shows an embodiment.18It is sectional drawing which shows this light source device.
FIGS. 20A to 20E are embodiments.19It is sectional drawing which shows each manufacturing process of this light source device.
FIGS. 21A to 21D are embodiments.20It is sectional drawing which shows each manufacturing process of this light source device.
FIGS. 22A to 22E are embodiments.21It is sectional drawing which shows each manufacturing process of this light source device.
23 (a) to (f) are embodiments.22It is sectional drawing which shows each manufacturing process of this light source device.
FIG. 24 is a cross-sectional view of a conventional light source device.
FIG. 25 is a cross-sectional view of another conventional light source device.
[Explanation of symbols]
  1 Light source device
  2 LED chip
  3 Substrate
  4 Insulating material
  4a Overhang
  6 Through hole
  8 Wiring pattern
  9 Bonding wire
  10 Sealing resin

Claims (21)

  1. A substrate having thermal conductivity, an insulating member disposed on at least one surface of the substrate, a hole provided through the insulating member in a portion of the insulating member facing the substrate, and a substrate exposed from the hole An LED chip disposed opposite to and thermally coupled to the region, a power supply unit including a wiring unit provided on the insulating member and electrically insulated from the substrate by the insulating member, and a power supply unit and an electrode of the LED chip A connection member that electrically connects the electrodes, and a light-transmitting sealing material that fills the hole and seals the entire LED chip and the connection member, and the opening on the substrate side of the hole provided in the insulating member An overhanging portion protruding inward at the edge is provided, and at least a part of the wiring portion is arranged on the overhanging portion, and the electrode of the LED chip is electrically connected to the portion of the wiring portion arranged on the overhanging portion. In the hole provided in the insulating member Provided support block which is input to the substrate, the light source apparatus characterized by disposing the LED chips by so and thermally bonded facing the support block.
  2. 2. The light source device according to claim 1, wherein the sealing material is filled up to the vicinity of the opening of the hole .
  3. The connecting member is made of a metal wire, and the height of the portion of the LED chip to which one end of the metal wire is connected and the portion of the wiring portion to which the other end of the metal wire is connected in the joining direction of the substrate and the insulating member is approximately The light source device according to claim 1, wherein the light source devices have the same height .
  4. 2. The height of the projecting part on which the LED chip is mounted and the part of the wiring part electrically connected to the LED chip are set to be substantially the same in the bonding direction of the substrate and the insulating member. The light source device described.
  5. Support block by forming a recess by performing the launch processing from the surface opposite to the insulating member in the substrate, the light source according to claim 1, characterized in that hammered out on the surface of the insulating member side in the substrate apparatus.
  6. The board is composed of a base plate in which a communication hole communicating with the hole is formed, and a protrusion that is attached in the communication hole and has a tip projecting toward the insulating member, and the protrusion base is configured by the tip of the protrusion. The light source device according to claim 1 .
  7. A light source device according to claim 1, characterized in that a gap is provided between the hole and the support block.
  8. 8. The light source device according to claim 1 , wherein positioning means for positioning the substrate and the insulating member is provided on a joint surface between the substrate and the insulating member . 9.
  9. The light source device according to any one of claims 1 to 7, wherein a reservoir portion of an adhesive used for bonding is provided around a hole of the insulating member on a bonding surface between the substrate and the insulating member .
  10. The feeding unit includes a substrate formed of a conductive material, a light source apparatus according to claim 1, characterized in that electrically connects the electrode of the substrate and the LED chip.
  11. The light source device according to claim 10 , wherein the substrate is provided with a plurality of regions electrically insulated from each other .
  12. The surface of the sealing material, the light source apparatus according to claim 1, wherein the light emission of the LED chip and a lens shape light distribution in a desired direction.
  13. The light source device according to claim 1, wherein reflects light emitted from the LED chip on the side walls of the hole, characterized in that a reflection portion for light distribution in a desired direction.
  14. 14. The light source device according to claim 13, wherein the reflecting portion is also used as a wiring portion .
  15. The light source device according to claim 13, wherein the connection member is made of a metal wire, and a wiring portion is disposed in a direction in which the metal wire extends .
  16. Sealing material, the light source apparatus according to claim 1, characterized in that it has a light color converting function for converting at least a portion of light emitted from the LED chip to a predetermined light color.
  17. The surface of the sealing material is located on the substrate side with respect to the surface of the insulating member opposite to the substrate, and a reflection portion that reflects light emitted from the LED chip and distributes light in a desired direction is provided on the peripheral wall of the hole. The light source device according to claim 16, characterized in that:
  18. A part of the wiring portion extending toward the substrate side, the light source apparatus according to claim 1, wherein the configuring the external connection terminals in the stretched portion.
  19. 19. The light source device according to claim 18 , wherein a part of the wiring part is extended to a surface of the insulating member facing the substrate .
  20. 20. A part of the insulating member is extended toward the substrate side, and a tip of the extended part is substantially flush with a surface of the substrate opposite to the insulating member . the light source device according to.
  21. The light source device according to claim 1, wherein the insulating member, the LED chip, the wiring portion, and the sealing member are provided on both surfaces of the substrate .
JP2001114502A 2000-07-13 2001-04-12 Light source device Active JP4432275B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2000213218 2000-07-13
JP2000-213218 2000-07-13
JP2001114502A JP4432275B2 (en) 2000-07-13 2001-04-12 Light source device

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2001114502A JP4432275B2 (en) 2000-07-13 2001-04-12 Light source device
CNB018108806A CN1212676C (en) 2001-04-12 2001-12-03 Light source device using LED, and method of producing same
EP01274117A EP1387412B1 (en) 2001-04-12 2001-12-03 Light source device using led, and method of producing same
DE60137972T DE60137972D1 (en) 2001-04-12 2001-12-03 LIGHT SOURCE ELEMENT WITH LED AND METHOD FOR THE PRODUCTION THEREOF
AT01274117T AT425556T (en) 2001-04-12 2001-12-03 Light source element with led and method for the production thereof
PCT/JP2001/010561 WO2002084750A1 (en) 2001-04-12 2001-12-03 Light source device using led, and method of producing same
US10/398,660 US6874910B2 (en) 2001-04-12 2001-12-03 Light source device using LED, and method of producing same
TW090130969A TW517402B (en) 2001-04-12 2001-12-13 Light source using light emitting diode and method for producing the same

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