JP4432275B2 - The light source device - Google Patents

The light source device Download PDF

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JP4432275B2
JP4432275B2 JP2001114502A JP2001114502A JP4432275B2 JP 4432275 B2 JP4432275 B2 JP 4432275B2 JP 2001114502 A JP2001114502 A JP 2001114502A JP 2001114502 A JP2001114502 A JP 2001114502A JP 4432275 B2 JP4432275 B2 JP 4432275B2
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substrate
led chip
light source
embodiment
insulating member
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JP2002094122A (en
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和也 中川
英二 塩浜
充 小林
秀吉 木村
勝 杉本
拓磨 橋本
二郎 橋爪
俊之 鈴木
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パナソニック電工株式会社
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Priority claimed from AT01274117T external-priority patent/AT425556T/en
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Abstract

PROBLEM TO BE SOLVED: To provide a light source and its manufacturing method which improves luminous efficiency to increase the optical power and prolong the life and raises the mechanical strength. SOLUTION: The light source 1 comprises a board 3 having a thermal conductivity, an insulation member 4 bonded to one surface of the board 3, through- holes 6 passing through parts of the insulation member 4 facing the board 3, LED chips 2 mounted on exposed portions of the board 3 through the through- holes 6, expansions 4a inwardly projecting from the opening edges of the through-holes 6 at the board 3, a wiring pattern 8 provided on the insulation member 4 which electrically insulates the pattern 8 from the board 3, bonding wires 9 which electrically connect extending portions of the pattern 8 onto the expansions 4a to electrodes of the LED chips 2, and a translucent seal resin 10 filled in the through-holes 6 to seal the whole of the LEDs 2 and the bonding wires 9.

Description

【0001】 [0001]
【発明の属する技術分野】 BACKGROUND OF THE INVENTION
本発明は、発光ダイオードを用いた光源装置に関するものである。 The present invention relates to a light source equipment using a light emitting diode.
【0002】 [0002]
【従来の技術】 BACKGROUND OF THE INVENTION
この種の光源装置としては、図24に示すような砲弾型の発光ダイオードを用いたものが従来より提供されており、発光ダイオードを単数で使用したり、複数個の発光ダイオードを基板30上にアレイ状に配置して使用するものがあった。 As this type of light source apparatus, which is provided from what is conventional using a light emitting diode cannonball type as shown in FIG. 24, a light emitting diode or used in the singular, the plural light-emitting diode on the substrate 30 was something to be used arranged in an array.
【0003】 [0003]
砲弾型の発光ダイオードは、金属製のリードフレーム31に設けた凹所31a上にLEDチップ2を銀ぺーストやエポキシ系樹脂などのダイボンディングペースト7を用いてダイボンドし、LEDチップ2の上面に設けた電極部分(図示せず)とリードフレーム31,32との間を金などの金属細線からなるボンディングワイヤ9でワイヤボンドした後、透光性を有する封止樹脂33でリードフレーム31,32とLEDチップ2とボンディングワイヤ9とを封止して形成されている。 Shell-shaped light-emitting diodes, on the recess 31a provided on the lead frame 31 made of metal of the LED chip 2 using a die bonding paste 7 such as silver paste or epoxy resin die bonding, the upper surface of the LED chip 2 provided the electrode portion after between (not shown) and the lead frame 31 and wire bonding with bonding wires 9 made of thin metal wires such as gold, lead frames 31 and 32 by the sealing resin 33 having translucency It is formed by sealing the LED chip 2 and the bonding wires 9 and.
【0004】 [0004]
ここで、封止樹脂33には主としてエポキシ樹脂が用いられており、この封止樹脂33には以下に挙げる3つの機能がある。 Here, Mainly epoxy resin is used as the sealing resin 33, the sealing resin 33 has three functions listed below. 先ず第1に、封止樹脂33には機械的衝撃から部品を保護したり、水分からLEDチップ2を保護する保護機能がある。 First, protect the components against mechanical shock to the sealing resin 33, there is a protection function of protecting the LED chip 2 from water. また、LEDチップ2の発光部の屈折率は約2.8程度と高いため、LEDチップ2表面と空気との界面では屈折率の差による全反射が発生し、LEDチップ2の光取り出し効率が低いという問題があるが、LEDチップ2の表面を屈折率が約1.8程度のエポキシ樹脂で覆うことによって、LEDチップ2からの光取り出し効率を向上させる機能が封止樹脂33にはある。 Moreover, since the refractive index of the light emitting portion of the LED chip 2 is high and approximately 2.8 degree, at the interface between the LED chip 2 surfaces and air total reflection occurs due to the difference in refractive index, the light extraction efficiency of the LED chip 2 there is a problem that low, but by covering the surface of the LED chip 2 refractive index of about 1.8 of about epoxy resins, functions to improve the light extraction efficiency from the LED chip 2 is in the sealing resin 33. さらに、封止樹脂33には、LEDチップ2から放射された光を封止樹脂33表面のレンズ効果によって集光又は拡散させるといった光制御機能がある。 Furthermore, the sealing resin 33, there is an optical control functions such as to condensing or diffusing light emitted from the LED chip 2 by the lens effect of the sealing resin 33 surface.
【0005】 [0005]
また、リードフレーム31,32の機能としては、LEDチップ2をダイボンドする際の土台となってLEDチップ2を支持する機能と、LEDチップ2がダイボンドされる凹所31aの周りを鏡面としてLEDチップ2からの発光を効率良く前方へ配光させる機能と、LEDチップ2の発熱を熱伝導によって基板30などを通じて外部へ逃がす機能とがある。 As the function of the lead frame 31 and 32, LED chip and function to support the LED chip 2 is the foundation upon die bonding the LED chip 2, around the recess 31a of the LED chip 2 is die-bonded as a mirror a function of light distribution of the light emission from 2 to efficiently forward, the heat generation of the LED chip 2 is the function of escape to the outside through such a substrate 30 by thermal conduction.
【0006】 [0006]
【発明が解決しようとする課題】 [Problems that the Invention is to Solve
ところで、LEDチップ2では、照明器具としての通常の使用温度領域において、低温になるほど発光効率が高く、高温になるほど発光効率が低下する。 Meanwhile, the LED chip 2, in the normal use temperature region of the luminaire, high luminous efficiency as temperature, light emission efficiency decreases as the temperature increases. これは、温度上昇による格子振動の増加に伴って電子とホールとの無輻射結合が増加するからである。 This is because the radiationless combination of electrons and holes with an increase of the lattice vibration due to the temperature rise is increased. 発光ダイオードを用いる光源装置では、発熱する部分は主としてLEDチップ2であるから、LEDチップ2で発生した熱を速やかに外部に放熱し、LEDチップ2の温度を低下させることは、LEDチップ2の発光効率を向上させる上で非常に重要な課題となる。 In the light source device using a light emitting diode, because the portion that generates heat is mainly LED chip 2, the heat generated in the LED chip 2 and rapidly radiated to the outside, reducing the temperature of the LED chip 2, the LED chip 2 It is a very important issue in improving the luminous efficiency.
【0007】 [0007]
また、LEDチップ2から外部への放熱特性を高めることによってLEDチップ2自身の温度上昇を抑制できるから、LEDチップ2に大きな順方向電流を通電して使用することができ、LEDチップ2の光出力を増大させることができる。 Further, since the temperature rise LED chip 2 itself by increasing the heat dissipation properties of the LED chip 2 to the outside can be suppressed, and passing a large forward current to the LED chip 2 can be used, the LED chips 2 Light it can be increased output. さらに、放熱特性を高めることによって、LEDチップ2の寿命を延ばす効果も得られる。 Furthermore, by increasing the heat radiation characteristic, there is also an effect to extend the life of the LED chip 2.
【0008】 [0008]
尚、LEDチップ2の寿命が改善される理由としては、以下に挙げる2つの理由が考えられる。 As the reason why the life of the LED chip 2 is improved, it can be considered for two reasons listed below. 一般的な照明器具と同様に、LEDチップ2の寿命を、光束が点灯初期の約70%に低下した時点と定義すると、赤色発光の発光ダイオードは約6万時間の寿命があると考えられるが、例えばLEDチップ2に定格電流以上の順方向電流を印加して過負荷状態で使用すると、LEDチップ2自身の発熱によってLEDチップ2の劣化が著しく加速されてしまう。 Similar to the general luminaires, the lifetime of the LED chip 2, when the light beam is defined as the time when decreased to about 70% of the initial lighting, it is considered that the light emitting diode emitting red light has lifetime of about 60,000 hours , for example, the LED chip 2 by applying a forward current above the rated current for use in an overload condition, the deterioration of the LED chip 2 from being significantly accelerated by the heat generation of the LED chip 2 itself. したがって、放熱特性を向上させることにより、LEDチップ2の温度上昇が抑制され、LEDチップ2の寿命が短くなるのを防止することができる。 Therefore, by improving the heat dissipation characteristics, the temperature rise of the LED chip 2 is suppressed, the life of the LED chip 2 can be prevented from being shortened.
【0009】 [0009]
また、青色発光ダイオードや、青色発光ダイオードを用い青色発光ダイオードの青色光を白色光に変換して出力する白色発光ダイオードでは、従来の赤色発光ダイオードに比べて放射光のエネルギーが高く、そのためLEDチップ2を封止する封止樹脂33が、LEDチップ2の放射光によって劣化し、褐色に呈色してしまう。 Moreover, and blue light-emitting diodes, the white light emitting diode for converting the white light to blue light of the blue light emitting diode using a blue light-emitting diodes, high energy of the radiation as compared with the conventional red light emitting diode, therefore the LED chip 2 the sealing resin 33 for sealing the can, degraded by light emitted from the LED chip 2, resulting in colored brown. 封止樹脂33の呈色が始まると、青色系の光をより吸収しやすくなり、封止樹脂33の呈色がさらに加速されるため、結果的にLEDチップ2近傍の封止樹脂33が褐色に呈色してしまい、LEDチップ2自身は点灯初期の光束を維持しているにも関わらず、封止樹脂33から外部に放射される光が著しく低下してしまう。 If coloration of the sealing resin 33 starts, becomes easier to absorb light of a blue-based color, for color of the sealing resin 33 is further accelerated, resulting in the LED chip 2 near the sealing resin 33 is brown would then coloration, LED chip 2 itself despite maintains the initial lighting of the light beam, light emitted from the sealing resin 33 to the outside is significantly decreased. このように封止樹脂33が褐色に呈色することによって、青色発光ダイオードや白色発光ダイオードの場合は、その寿命が約6000時間程度となり、赤色発光ダイオードに比べて著しく短くなる。 By this way the sealing resin 33 is colored in brown, in the case of blue light emitting diodes or white light emitting diode, its life becomes about 6000 hours, significantly shorter than the red light emitting diode. ところで、封止樹脂33の呈色反応は光化学反応ではあるが、封止樹脂33の温度が高くなると、呈色反応の反応速度が速くなることが一般的に知られており、LEDチップ2から外部への放熱特性を向上させることによって、LEDチップ2及び封止樹脂33の温度を低減し、LEDチップ2の発光による封止樹脂33の呈色反応を抑制することができる。 Incidentally, although color reaction of the sealing resin 33 is a photochemical reaction, the temperature of the sealing resin 33 is high, the reaction rate of the color reaction is that the faster are generally known, from the LED chip 2 by improving the heat dissipation characteristics of the external, and reduce the temperature of the LED chip 2 and the sealing resin 33, the color reaction of the sealing resin 33 by the light emission of the LED chip 2 can be suppressed.
【0010】 [0010]
上述のように発光ダイオードを用いた光源装置では、その発光効率の向上、光出力の増加、長寿命化といった観点から、LEDチップ2より外部への放熱特性を向上させることが非常に重要になる。 In the light source device using a light emitting diode as described above, improvement of the luminous efficiency, the increase of light output, from the viewpoint of long life, improve the heat dissipation properties of an LED chip 2 to the outside is very important . しかしながら、砲弾型の発光ダイオードでは、LEDチップ2の発熱を逃がすための放熱経路が、リードフレーム31を通じて基板30に逃がす経路と、封止樹脂33を通じて空気中に逃がす経路の2つであり、封止樹脂33を通じて放熱する経路ではエポキシ樹脂の熱伝導率が低いために十分な放熱効果が得られない。 However, the light emitting diode of the shell-shaped, the heat dissipation path for dissipating heat generated by the LED chip 2, and a path to escape to the substrate 30 through the lead frame 31, and two of paths to escape into the air through the sealing resin 33, sealing not provide a sufficient heat dissipation effect because of the low thermal conductivity of the epoxy resin is a path to dissipate through sealing resin 33. したがって、リードフレーム31を通じて放熱する放熱経路が主になるが、リードフレーム31自体が細く、また放熱経路が7〜10mm程度と長いため、封止樹脂33を通じて放熱する経路よりは大きな放熱効果が得られるものの、十分な放熱効果は期待できず、放熱特性を改善した光源装置を実現するのは困難であった。 Thus, although a heat dissipation path for dissipating through the lead frame 31 is mainly because the lead frame 31 itself is thin, and the heat radiation path long and about 7 to 10 mm, to give a large heat dissipation effect than the path for dissipating through the sealing resin 33 although is, sufficient heat dissipation effect can not be expected, it has been difficult to realize a light source device having improved heat dissipation characteristics.
【0011】 [0011]
そこで、放熱特性を更に改善するために、図25に示すようにLEDチップ2を基板34に直接ダイボンドした光源装置も提案されている。 Therefore, in order to further improve the heat dissipation characteristics, the light source device has been proposed which is die-bonded directly to the substrate 34 of the LED chip 2 as shown in FIG. 25. 基板34は例えばアルミニウムの薄板からなり、基板34にプレス加工を施すことによって凹所34aを形成し、基板34の表面に絶縁体薄膜35を形成した後、凹所34aの底面に形成された絶縁体薄膜35上にLEDチップ2をダイボンドしている。 Substrate 34 is made of, for example, aluminum sheet, to form a recess 34a by performing press work on the substrate 34, after forming an insulating thin film 35 on the surface of the substrate 34, formed on the bottom surface of the recess 34a insulation are die-bonded LED chip 2 on the body membrane 35. そして、基板34の表面に絶縁体膜層35を介して形成された配線パターン36とLEDチップ2表面の電極との間をボンディングワイヤ9を介して電気的に接続し、凹所34a内に透光性を有する封止樹脂37を充填して形成される。 Then, electrically coupled between the electrode surface to the insulator layer 35 wiring pattern 36 is formed through the LED chip 2 surface of the substrate 34 through a bonding wire 9, Toru in the recess 34a It is formed by filling a sealing resin 37 having light resistance.
【0012】 [0012]
この光源装置では、LEDチップ2の発熱は、LEDチップ2からダイボンディングペースト7→絶縁体膜層35→基板34の経路で放熱され、基板34に伝わった熱は基板34全体に拡散していくため、砲弾型の発光ダイオードに比べて放熱経路が短く、放熱性が非常に高くなっている。 In this light source device, heat generation of the LED chip 2 is radiated from the LED chip 2 in the path of the die bonding paste 7 → insulating film layer 35 → the substrate 34, heat transferred to the substrate 34 diffuses into the entire substrate 34 Therefore, the heat radiation path compared to the light-emitting diode of the shell-shaped short, heat dissipation is very high. しかしながら、この放熱経路においても、放熱性を阻害する構成要素としてダイボンディングペースト7と絶縁体膜層35とが存在する。 However, even in this heat dissipation path, and die bonding paste 7 and the insulating film layer 35 is present as a component that inhibits heat dissipation. ダイボンディングペースト7は樹脂製であり、ペースト自体の熱伝導係数は小さいものの、ペーストの厚みは5μm以下と薄いため、ダイボンディングペースト7が放熱性に与える影響は小さいものと考えられる。 Die bonding paste 7 is made of resin, although the thermal conductivity coefficient of the paste itself is small, since the thickness of the paste thinner than 5 [mu] m, the influence of the die bonding paste 7 has on heat dissipation is considered to be small. 一方、絶縁体膜層35は樹脂やセラッミックスフィラーを分散させた樹脂などから形成されており、金属に比較して絶縁体膜層35自体の熱伝導係数が小さく、また絶縁体膜層35の厚みも300μm程度と厚くなっているため、放熱性に与える影響が大きくなっている。 On the other hand, the insulator layer 35 is formed of a resin obtained by dispersing the resin and sera Tsu mix filler, compared to the metal small thermal conductivity coefficient of the insulating film layer 35 itself, also the insulating layer 35 since the thickness is as thick as about 300 [mu] m, it is larger effect on heat dissipation. 而して、図25に示す構造の光源装置では、砲弾型LEDを用いた光源装置に比べて、LEDチップ2からの放熱性は高くなっているものの、放熱経路に絶縁体膜層35が存在しているために、十分な放熱性が得られなかった。 And Thus, in a light source device having the structure shown in FIG. 25, as compared with the light source device using a bullet-type LED, although heat dissipation from the LED chip 2 is higher, there is an insulating film layer 35 to the heat dissipation path for you are, sufficient heat dissipation is not obtained.
【0013】 [0013]
また、LEDチップ2からの放熱において、絶縁体膜層35の影響を低減する目的で、基板34の表面から部分的に絶縁体膜層35を除去し、露出した基板34にLEDチップ2を直接ダイボンドした光源装置も提案されている。 Further, in the heat radiation from the LED chip 2, for the purpose of reducing the influence of the insulating layer 35 to remove the partially insulating film layer 35 from the surface of the substrate 34, the LED chip 2 directly to the substrate 34 exposed die bonding the light source device has been proposed. しかしながら、絶縁体膜層35を部分的に除去する方法としては、エンドミルなどによる切削加工によるものであり、露出した基板34の表面は切削傷が著しく、実測した結果、プラスマイナス20μm程度の平滑度であった。 However, as a method of removing the insulating film layer 35 partly is due to cutting due to an end mill, the exposed surface of the substrate 34 is significantly cutting wounds, the actually measured results, plus or minus 20μm approximately smoothness Met. ところで、LEDチップ2をダイボンドする場合、ダイボンド剤の種類にもよるが、LEDチップ2を実装する面にはプラスマイナス5μm程度の平滑度が必要になるため、切削加工した面にLEDチップ2を実装するのは難しく、露出した基板34の表面にLEDチップ2を実装するのは難しかった。 In the case of die-bonding the LED chip 2, depending on the kind of die bonding agent, since it is necessary to smoothness of about plus or minus 5μm on the surface of mounting the LED chip 2, the LED chip 2 to the cutting processed surface to implement difficult, it is difficult to implement LED chip 2 on the exposed surface of the substrate 34.
【0014】 [0014]
また、図25に示す光源装置では、絶縁体膜層35の上面に配線パターン36が形成されており、ボンディングワイヤ9の一端は配線パターン36に接続されているから、LEDチップ2を封止樹脂37で封止したとしても、ボンディングワイヤ9の一部が封止樹脂37から外側に露出することになり、機械的衝撃に対してボンディングワイヤ9の強度が著しく低下するという問題がある。 Further, in the light source device shown in FIG. 25, the wiring pattern 36 on the upper surface of the insulating film layer 35 is formed, from one end of the bonding wire 9 is connected to the wiring pattern 36, the LED chip 2 sealing resin even sealed at 37, will be part of the bonding wire 9 is exposed from the sealing resin 37 on the outside, the strength of the bonding wires 9 to mechanical shocks is lowered significantly. そこで、封止樹脂37から外側に露出しているボンディングワイヤ9の部位を保護するために、封止樹脂37から露出しているボンディングワイヤ9の部位を別途樹脂封止することも考えられるが、同じ樹脂を用いて樹脂封止したとしても、2回に分けて樹脂封止を行った場合は2つの樹脂の界面部分に応力が残存するため、点灯時に発生するLEDチップ2の発熱によって応力が増大し、界面部分でボンディングワイヤ9が断線する虞もある。 Therefore, in order to protect the site of bonding wires 9 from the sealing resin 37 is exposed to the outside, it is conceivable to separately resin sealing portion of the bonding wire 9 which is exposed from the sealing resin 37, even sealed with a resin using the same resin, if the resin sealing was conducted in two stages because the stress remaining in the interface portion of the two resins, the stress by the heat generation of the LED chip 2 generated during lighting increases, the bonding wire 9 in the interface portion is also a possibility to break. 特に青色発光のLEDチップ2を用いて白色発光を得るために、封止樹脂37に蛍光体などの粉体を分散させている場合は、封止樹脂37の上から樹脂封止された封止樹脂との間に熱膨張率の差が生じ、界面部分でボンディングワイヤ9が断線する可能性が増大するという問題もあった。 To obtain particularly white light emission using an LED chip 2 of blue-emitting, sealing if dispersing a powder of such a phosphor in the sealing resin 37 is resin-sealed from above the sealing resin 37 difference in thermal expansion coefficient between the resin occurs, the bonding wire 9 at the interface portion is a problem that a possibility is increased to break.
【0015】 [0015]
本発明は上記問題点に鑑みて為されたものであり、その目的とするところは、発光効率を向上させて光出力を増大させ、長寿命化を図ると共に、機械的強度を高めた光源装置を提供することにある。 The present invention has been made in view of the above problems, it is an object to improve the luminous efficiency by increasing the light output, together with the increase the life of the light source instrumentation with enhanced mechanical strength It is to provide a location.
【0016】 [0016]
【課題を解決するための手段】 In order to solve the problems]
上記目的を達成するために、請求項1の発明では、熱伝導性を有する基板と、基板の少なくとも一方の面に配設された絶縁部材と、基板と対向する絶縁部材の部位に絶縁部材を貫通して設けられた孔と、この孔から露出する基板の部位に対向させ且つ熱結合させて配置されたLEDチップと、絶縁部材に設けられ絶縁部材によって基板と電気的に絶縁された配線部を含む給電部と、給電部とLEDチップの電極との間を電気的に接続する接続部材と、孔内に充填されLEDチップ及び接続部材の全体を封止する透光性を有する封止材料とを備え、絶縁部材に設けた孔の基板側の開口縁に内側に突出する張出部を設け、この張出部に配線部の少なくとも一部を配置し、張出部に配置された配線部の部位にLEDチップの電極を電気的に接続して To achieve the above object, in the invention of claim 1, a substrate having a thermal conductivity, an insulating member disposed on at least one surface of the substrate, the insulating member to the portion of the substrate opposite to the insulating member a hole provided therethrough, an LED chip disposed portion is allowed and thermally coupled opposed to the substrate exposed through the hole, the substrate by an insulating member provided in the insulating member and electrically insulated wire portion sealing material having a feed section, a connecting member for electrically connecting between the feeding portion and the LED chips of the electrode, a light-permeable sealing the entire LED chip and the connecting member is filled in the hole including with the door, the overhang portion protruding inward provided on the substrate side of the opening edge of the hole provided in the insulating member, at least a part of the wiring portion disposed on the projecting portion, which is disposed on the projecting portion wirings electrically connecting the electrode of the LED chip to the site parts り、絶縁部材側に突出し絶縁部材に設けた孔内に挿入される突台部を基板に設け、この突台部にLEDチップを対向させ且つ熱結合させて配置したことを特徴とし、LEDチップは絶縁部材に設けた孔から露出する基板の部位に対向させ且つ熱結合させて配置されているので、熱伝導性を有する基板を介してLEDチップの発熱を放出することができ、放熱性を向上させた光源装置を実現できる。 Ri, provided support block that is inserted into the hole provided in the protruding insulating member to the insulating member side substrate, characterized in that a LED chip by so and thermally coupled opposed to the support block, the LED chip since being placed in the site and thermally bonded is opposed to the substrate which is exposed through a hole provided in the insulating member, it is possible to release the heat generated by the LED chip through the substrate having thermal conductivity, heat dissipation the light source device with improved can be realized. したがって、LEDチップの温度上昇が抑制され、温度上昇による発光効率の低下を防止することができる。 Therefore, the temperature rise of the LED chips is suppressed, it is possible to prevent a reduction in luminous efficiency due to temperature rise. しかもLEDチップの温度上昇が低減されるから、より大きな順方向電流をLEDチップに印加して、LEDチップの光出力を増大させることもでき、またLEDチップや封止材料の熱的な劣化が低減され、長寿命化が図れる。 Moreover since the temperature rise of the LED chips is reduced, a larger forward current is applied to the LED chip, it can also increase the light output of the LED chip, and the thermal degradation of the LED chip and sealing material is reduced, a long life can be achieved. さらに、孔内に充填された封止材料によってLEDチップ及び接続部材の全体を封止しており、LEDチップと給電部とを電気的に接続する接続部材として金属線を用いた場合にも、樹脂の界面で発生する応力によって金属線が断線する虞はなく、機械的強度を向上させることができる。 Furthermore, a completely sealed the LED chip and the connecting member by the sealing material filled in the hole, even in the case of using a metal wire and a LED chip and the power feeding portion as a connection member for electrically connecting, no possibility that the metal wire is broken by the stress generated at the interface of the resin, it is possible to improve the mechanical strength. しかも基板に突台部を設けることによって、突台部の高さ分だけ張出部の厚み寸法を厚くすることができるから、張出部の加工を容易に行え、且つ、張出部の厚み寸法を厚くすることによって、張出部の剛性を高くし、基板と絶縁部材とを接合する際に張出部と基板との間に隙間ができるのを防止できる。 By providing the support block to the substrate addition, since it is possible to increase the thickness dimension of by the height of the overhang portion of the support block, easy to machining of the projecting portion, and the thickness of the overhang portion by thickening the dimensions, the rigidity of the projecting portion, it is possible to prevent the gap is formed between the protruding portion and the substrate when bonding the substrate and the insulating member.
【0017】 [0017]
請求項の発明では、請求項1の発明において、LEDチップに接続部材を介して電気的に接続される配線部の部位は孔内に配置されており、封止材料は孔の開口付近まで充填されたことを特徴とし、封止材料の表面が孔の開口付近にくるまで封止材料を充填することによって、封止材料の充填量を略一定とすることができ、品質のばらつきを抑制できる。 In the invention of claim 2, in the invention of claim 1, part of the wiring portion to be electrically connected via a connecting member to the LED chip is disposed within the bore, to the vicinity of the opening of the sealing material hole and characterized in that it is filled, by filling the sealing material to the surface of the sealing material comes to near the opening of the holes, can be made substantially constant filling amount of the sealing material, suppress the variation in quality it can.
【0018】 [0018]
請求項の発明では、請求項の発明において、上記接続部材は金属線からなり、基板及び絶縁部材の接合方向において、金属線の一端が接続されるLEDチップの部位と、金属線の他端が接続される配線部の部位の高さを略同じ高さとしたことを特徴とし、LEDチップと配線部との間を電気的に接続する金属線の長さを短くできるから、金属線の機械的強度を高くでき、またLEDチップと配線部の高さを略同じ高さとすることにより、ボンディング作業を容易に行うことができる。 In the invention of claim 3, in the invention of claim 1, said connecting member is made of metal wire, in the joining direction of the substrate and the insulating member, and the site of the LED chip to which one end of the metal line is connected, other metal wire characterized in that the height of the portion of the wire portion having one end connected to the substantially same height, since the space between the LED chip and the wiring portion can shorten the length of the metal wire for electrically connecting the metal wire can increase the mechanical strength, also by a substantially same height as the height of the LED chip and the wiring portion, it is possible to perform the bonding work easily.
【0019】 [0019]
請求項の発明では、請求項の発明において、基板及び絶縁部材の接合方向において、LEDチップが実装される突台部と、LEDチップに電気的に接続される配線部の部位の高さを略同じ高さとしたことを特徴とし、LEDチップから放射される光が配線部に遮光されることはなく、光のけられを少なくして、光の取り出し効率を高めることができる。 In the invention of claim 4, in the invention of claim 1, the substrate and the bonding direction of the insulating member, support block and the height of the portion of the wiring portion electrically connected to the LED chip LED chip is mounted substantially characterized in that the same height, rather than the light emitted from the LED chip is shielded wiring portion, with less eclipse of light, it is possible to enhance the light extraction efficiency.
【0020】 [0020]
請求項の発明では、請求項の発明において、突台部は、基板における絶縁部材と反対側の面から打ち出し加工を行って凹所を形成することにより、基板における絶縁部材側の面に打ち出されたことを特徴とし、打ち出し加工を行うことによって突台部を形成しているので、切削加工により突台部を形成する場合に比べて加工費用を低減できる。 In the invention of claim 5, in the invention of claim 1, support block by forming a recess by performing the launch processing from the surface opposite to the insulating member in the substrate, the surface of the insulating member side in the substrate characterized in that punched a so forms a support block by performing embossing processing can be reduced machining costs as compared with the case of forming the support block by cutting. また、基板と絶縁部材とを接着剤で貼り合わせた場合、接着剤の熱収縮によって基板全体が絶縁部材側に反ってしまうが、打ち出し加工を行って凹所を形成することにより、基板全体が絶縁部材と反対側に反るので、接着材の熱収縮によって発生する基板の反りを相殺し、全体として基板が反るのを防止できる。 Also, when bonding the substrate and the insulating member with an adhesive, the entire substrate by the thermal shrinkage of the adhesive warps the insulating member side, by forming a recess performing embossing processing, the entire substrate since warps on the opposite side of the insulating member, to offset the warpage of the substrate caused by thermal contraction of the adhesive material, it is possible to prevent the substrate from warping as a whole.
【0021】 [0021]
請求項の発明では、請求項の発明において、基板を、孔に連通する連通孔が形成されたベース板と、連通孔内に取り付けられ先端が絶縁部材側に突出する突起部とで構成し、突起部の先端により突台部を構成したことを特徴とし、ベース板の孔に突起部を挿入し、突起部の先端を絶縁部材側に突出させることによって突台部を形成しているので、突台部を切削加工により形成する場合に比べて、突台部の加工を容易に行うことができる。 In the invention of claim 6, configured in the invention of claim 1, the substrate, the base plate communicating hole formed which communicates with the hole, the tip is mounted in the communicating hole and the protruding portion protruding insulating member side and characterized by being configured to support block by the tip of the protrusion, inserting the protrusion into the hole of the base plate to form a support block by projecting the tip of the protrusion on the insulating member side since, in comparison with the case of forming by cutting the support block, it can be easily processed in the support block.
【0022】 [0022]
請求項の発明では、請求項の発明において、孔と突台部との間に隙間を設けたことを特徴とし、基板と絶縁部材とを接着剤で貼り合わせた場合、基板と絶縁部材との接合面から余分な接着剤がはみ出し、はみ出した接着剤によってLEDチップの光が遮光されたり、LEDチップを実装できなくなる虞があるが、はみ出した接着剤は孔と突台部との間に設けた隙間に溜まるので、接着剤が突台部の上面まで這い上がってくることはなく、はみ出した接着剤によってLEDチップの光が遮光されたり、LEDチップを実装できなくなるのを防止できる。 In the invention of claim 7, in the invention of claim 1, when characterized in that a gap between the hole and the support block, bonding the substrate and the insulating member with an adhesive, substrate and the insulating member excess adhesive is squeezed out from the joint surface between, or the light from the LED chip is shielded by the adhesive protruding, there is a risk that can not be mounting the LED chip, the adhesive protruding between the hole and the support block since it accumulated in a gap provided in, but not the adhesive comes creeps up to the upper surface of the support block, or the light of the LED chip is shielded by the adhesive protruding, from becoming unable mounting the LED chip can be prevented.
【0023】 [0023]
請求項の発明では、請求項1乃至7の何れか1つの発明において、基板と絶縁部材との位置決めを行うための位置決め手段を基板と絶縁部材との接合面に設けたことを特徴とし、位置決め手段により基板と絶縁部材との位置決めを行うことができ、基板と絶縁部材との接合作業を容易に行える。 In the invention of claim 8, in any one invention of claims 1 to 7, characterized in that a positioning means for positioning the substrate and the insulating member on the junction surface between the substrate and the insulating member can be positioned between the substrate and the insulating member by the positioning means, it can be easily performed joining operation between the substrate and the insulating member.
【0024】 [0024]
請求項の発明では、請求項1乃至7の何れか1つの発明において、基板と絶縁部材との接合面に接合に用いる接着剤の溜まり部を絶縁部材の孔の周りに設けたことを特徴とし、基板と絶縁部材とを接着剤で貼り合わせた場合、基板と絶縁部材との接合面から余分な接着剤がはみ出し、はみ出した接着剤によってLEDチップの光が遮光されたり、LEDチップを実装できなくなる虞があるが、接合時に余分な接着剤は溜まり部に溜まるため、接着剤のはみ出しを防止できる。 In the invention of claim 9, in any one invention of claims 1 to 7, in that a reservoir of the adhesive used in the bonding at the interface between the substrate and the insulating member around the hole of the insulating member characterized, when bonding the substrate and the insulating member with an adhesive, substrate and excess adhesive is squeezed out from the joint surface of the insulating member, or the light from the LED chip is shielded by the adhesive protruding, the LED chip there is a risk that can not be implemented, but since the accumulated extra adhesive reservoir during bonding, thereby preventing protrusion of adhesive. また、基板と絶縁部材との接合面に接着剤が不足している部分があると、この部分にできる隙間から封止材料が漏れ出す虞があるが、余分な接着剤を溜める溜まり部が絶縁部材に設けた孔の周りに設けられ、溜まり部に溜まった余分な接着剤は孔から露出する基板の部位を囲むようにして配置されるので、溜まり部に溜まった接着剤が封止材料をせき止める堰の役割を果たして、封止材料が漏れ出すのを防止できる。 Further, when there is a portion where the adhesive is insufficient at the interface between the substrate and the insulating member, there is a risk that leaking sealing material from a gap can in this portion, the reservoir accumulating excess adhesive insulation provided around the hole provided in the member, since the excess adhesive collected in the collecting portion is disposed so as to surround the portion of the substrate exposed from the hole, the adhesive collected in the collecting portion damming the sealing material weir play a role, it is possible to prevent the leakage of the sealing material.
【0025】 [0025]
請求項10の発明では、請求項1の発明において、上記給電部は導電性材料により形成された基板を含み、基板とLEDチップの電極とを電気的に接続したことを特徴とし、基板そのものを給電部としており、LEDチップの一方の電極を基板に接続するとともに、LEDチップの他方の電極を配線部に接続することによって、LEDチップに給電することができるから、絶縁部材の表面に形成する配線部が1回路分で済むという利点がある。 In the invention of claim 10, in the invention of claim 1, the feeding unit includes a substrate formed of a conductive material, characterized in that electrically connects the electrode of the substrate and the LED chip, the substrate itself and a power supply unit, the one electrode of the LED chip as well as connected to the substrate, by connecting the other electrode of the LED chip to the wiring portion, since it is possible to supply power to the LED chip are formed on the surface of the insulating member wiring portion has the advantage that requires only one circuit. また、LEDチップに給電するための回路の一部を基板が担っているので、回路を基板側に容易に引き出すことができる。 Further, a part of the circuit for powering the LED chip since the substrate plays, can be pulled out of the circuit easily to the substrate side.
【0026】 [0026]
請求項11の発明では、請求項10の発明において、上記基板に、互いに電気的に絶縁された複数の領域を設けたことを特徴としている。 In the invention of claim 11, characterized in that in the invention of claim 10, in the substrate, it is characterized in that a multiple electrically isolated regions with each other. ところで、一枚の基板に複数のLEDチップが実装される場合、一枚の基板が互いに電気的に絶縁された複数の領域に分割されていないと、全てのLEDチップが並列に接続されることになる。 Incidentally, when a plurality of LED chips on one substrate is mounted, the single substrate is not divided into multiple electrically isolated regions with each other, that all the LED chips are connected in parallel become. ここで、LEDチップは個体ごとに駆動電圧が若干異なるため、複数のLEDチップが並列に接続されると、駆動電圧が最も低いLEDチップに多大な電流が流れて、LEDチップが破損する虞がある。 Since LED chip different driving voltages slightly for each individual, the plurality of LED chips are connected in parallel, with considerable current flows to the driving voltage is the lowest LED chip, the fear that the LED chip is damaged is there. そこで、複数のLEDチップに流れる電流を均等にするために、個々のLEDチップ毎に電流制限用の抵抗を直列接続する方法が考えられるが、LEDチップの数だけ電流制限用の抵抗が必要になり、各抵抗で消費される電力ロスが増大する。 Therefore, in order to equalize the current flowing through the plurality of LED chips, the current limiting resistor for each individual LED chips a method of serially connected. However, only the required resistance of the current limiting number of LED chips becomes, the power loss consumed by the resistance increases. それに対して本発明では、基板に、互いに電気的に絶縁された複数の領域を設けており、各領域にそれぞれLEDチップを実装し、各領域に実装されたLEDチップを直列に接続すれば、個々のLEDチップに流れる電流値を略一定にすることができ、且つ、直列接続された複数のLEDチップに対して電流制限用の抵抗を1個接続すれば、各LEDチップに流れる電流を制限できるから、電流制限用の抵抗で消費される電力ロスを小さくできる。 In the present invention, on the other hand, the substrate, and a plurality of regions that are electrically insulated from each other, the LED chip is mounted to each region, by connecting the LED chip mounted in each area in series, It can be the value of the current flowing through the individual LED chips substantially constant, and, if one connects a current limiting resistor for a plurality of LED chips connected in series, limit the current flowing through each LED chip because it can reduce the power loss consumed by a current limiting resistor.
【0027】 [0027]
請求項12の発明では、請求項1の発明において、封止材料の表面を、LEDチップの発光を所望の方向に配光するレンズ形状としたことを特徴とし、封止材料の表面をレンズ形状としたことにより、別途レンズを設けることなく、LEDチップの発光を所望の方向に配光することができる。 In the invention of claim 12, in the invention of claim 1, the surface of the sealing material, the light emission of the LED chip is characterized in that a lens shape light distribution in a desired direction, the lens shape surface of the sealing material by the the, without providing a separate lens, the light emission of the LED chip can be light distribution in a desired direction.
【0028】 [0028]
請求項13の発明では、請求項1の発明において、孔の側壁にLEDチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とし、反射部によってLEDチップの光を反射して所望の方向へ配光することにより、光の取り出し効率を高めることができる。 In the invention of claim 13, in the invention of claim 1, reflects light emitted from the LED chip on the side wall of the hole characterized in that a reflection portion for light distribution in a desired direction, the LED chip by the reflecting portion of light by light distribution reflected by the desired direction, it is possible to enhance the light extraction efficiency.
【0029】 [0029]
請求項14の発明では、請求項13の発明において、上記反射部を配線部で兼用したことを特徴とし、配線部が反射部を兼用することにより、絶縁部材の表面に形成される配線部及び反射部のパターンを簡素化できる。 In the invention of claim 14, in the invention of claim 13, characterized in that also serves the reflecting portion in the wiring portion, by the wiring portion also serves as a reflective portion, the wiring portion is formed on the surface of the insulating member and pattern of the reflection portion can be simplified.
【0030】 [0030]
請求項15の発明では、請求項13の発明において、上記接続部材は金属線からなり、金属線の延びる方向に配線部を配設したことを特徴とし、LEDチップからの光は金属線によって遮光されるが、金属線の影となる部分に配線部を配置しているので、配線部以外の部位に形成された反射部によって、LEDチップからの光を所望の方向に配光することができる。 In the invention of claim 15, in the invention of claim 13, said connecting member is made of metal wire, characterized in that arranged the wiring portion in the extending direction of the metal wire, the light from the LED chips blocked by metal wires but is the, so that by placing the wire at a portion where the shadow of the metal wire, by the reflection portion formed in a portion other than the wiring portion, the light from the LED chip can be light distribution in the desired direction .
【0031】 [0031]
請求項16の発明では、請求項1の発明において、封止材料は、LEDチップから放射された光の少なくとも一部を所定の光色に変換する光色変換機能を有することを特徴とし、封止材料によって光色が変換された光と、LEDチップからの光とを混色することによって、所望の光色の光を得ることができる。 In the invention of claim 16, in the invention of claim 1, the sealing material is characterized by having a light color converting function for converting at least a portion of light emitted from the LED chip to a predetermined light color, sealed and light emission color is converted by a stop material, by mixing the light from the LED chip, it is possible to obtain light having a desired light color.
【0032】 [0032]
請求項17の発明では、請求項16の発明において、封止材料の表面は、絶縁部材における基板と反対側の面よりも基板側に位置し、孔の周壁にLEDチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とし、LEDチップからの光は封止材料を通過することによって分散され、完全拡散配光となっているので、配光制御しやすくなっており、反射部によって所望の方向に配光することができる。 In the invention of claim 17, characterized in that in the invention of claim 16, the surface of the sealing material is located on the substrate side of the surface of the substrate opposite to the insulating member, it reflects light emitted from the LED chip to the peripheral wall of the hole characterized in that a reflection portion for light distribution in a desired direction, light from the LED chip is distributed by passing through the sealing material, since a completely diffused light distribution, it is easier to control the light distribution and it may be light distribution in a desired direction by the reflection portion.
【0033】 [0033]
請求項18の発明では、請求項1の発明において、配線部の一部を基板側に向かって延伸し、この延伸された部分で外部接続端子を構成することを特徴とし、配線部の一部を基板側に向かって延伸し、この延伸された部位を外部接続端子としているので、基板側から配線部への給電を容易に行うことができる。 In the invention of claim 18, in the invention of claim 1, a part of the wiring portion extending toward the substrate side, characterized by constituting the external connection terminal in this stretched portion, a part of the wiring portion It was drawn toward the substrate side, since the the drawn portion and the external connection terminal, it is possible to easily perform the supply of power to the wiring section from the substrate side. なお、配線部の一部を基板側に向かって延伸させる形態としては種々考えられるが、例えば絶縁部材の端部に沿って配線部を基板側に延伸したり、絶縁部材にスルーホールを形成し、このスルーホール内に導電性材料を充填することによって配線部を基板側に延伸することが考えられる。 Although are various in a part of the wiring portion as a form in which stretched toward the substrate side, for example, or the wiring portion along the edge of the insulating member extends to the substrate side, a through hole is formed in the insulating member , it is conceivable to stretch the substrate side wiring portion by filling a conductive material in the through hole. また基板側に向かって延伸する配線部の長さも必要に応じて決定され、絶縁部材の途中まで又は基板側の面まで延伸しても良いし、基板側の面に一部を回り込ませるようにしても良いし、また基板の向こう側まで突出するようにしても良い。 The length of the wiring portion which extends toward the substrate side is determined as necessary, it may be extended to the middle or until the surface of the substrate side of the insulating member, so as to wrap the part surface on the substrate side also it may be, or may be projected to the other side of the substrate.
【0034】 [0034]
請求項19の発明では、請求項18の発明において、上記配線部の一部が、絶縁部材における基板との対向面まで延伸されたことを特徴とし、配線部の一部を基板との対向面まで延伸させているので、この延伸された部分に対して容易に給電することができる。 In the invention of claim 19, characterized in that in the invention of claim 18, the facing surface of the portion of the wiring portion, characterized in that it is stretched to the opposite surface of the substrate in the insulating member, and the substrate a part of the wiring portion since it is extended until it is possible to easily supply power to the stretched portion. 例えば、基板と嵌合する穴の形成された器具本体にこの光源装置を実装する場合、配線部の一部を絶縁部材における基板との対向面まで延伸しているので、器具本体の穴に基板部分を嵌合すれば、器具本体に形成された配線部と光源装置の配線部との電気的接続を容易に行うことができ、さらに基板部分を穴内に嵌め込んで器具本体と接触させるようにすれば、放熱性が向上する。 For example, when implementing this light source device to the instrument body formed of holes substrate mating, since a part of the wiring portion are extended to the opposite surface of the substrate in the insulating member, the substrate in the hole of the instrument body if the fitting portions can be electrically connected to the wiring portion of the wiring portion and the light source device formed on the instrument body easily, so that further contact with the instrument body by fitting the substrate portion in the bore if, improves heat dissipation.
【0035】 [0035]
請求項20の発明では、請求項18又は19の発明において、絶縁部材の一部を基板側に向かって延伸し、この延伸された部分の先端を、基板における絶縁部材と反対側の面と略面一にしたことを特徴とし、絶縁部材の基板側に延伸された部位に器具本体の表面に載置して光源装置を器具本体に実装する際に、絶縁部材の延伸された部位が基板における絶縁部材と反対側の面と略面一になっているので、絶縁部材を器具本体の表面に載置するだけで、基板が器具本体の表面に接触するから、LEDチップの発熱が基板を介して器具本体に放出され、冷却効果が向上する。 In the invention of claim 20, wherein in the invention in claim 18 or 19, a portion of the insulating member extends toward the substrate side, the tip of the stretched portion, opposite surface substantially to the insulating member in the substrate characterized in that the flush, when it is placed on the surface of the equipment main body to the site which is drawn to the substrate side of the insulating member to implement the light source device to the instrument body, stretched portion of the insulating member in the substrate because are substantially flush with the opposite surface to the insulating member, simply placing the insulating member on the surface of the equipment main body, since the substrate contacts the surface of the instrument body, the heat generation of the LED chip through the substrate Te is released into the instrument body, the cooling effect is improved. しかも、配線部の一部を基板側に延伸させて外部接続端子としているので、外部接続端子と器具本体の表面に形成された配線部との電気的接続を容易に行える。 Moreover, since a part of the wiring portion is stretched to the substrate side as an external connection terminal, it facilitates the electrical connection between the external connection terminal and the device wiring section formed on the surface of the body. さらに、絶縁部材の基板側に延伸された部位の先端面に外部接続端子を形成すれば放熱性を向上させた表面実装型の光源装置を実現できる。 Furthermore, it is possible to realize an external connection terminal surface-mounted light source device having improved heat dissipation properties by forming a the distal end surface of the site that was drawn to the substrate side of the insulating member.
【0036】 [0036]
請求項21の発明では、請求項1の発明において、絶縁部材とLEDチップと配線部と封止部材とが基板の両面に設けられたことを特徴とし、基板の両面からLEDチップの光を放射させることができ、且つ、基板の両面に同じ部品が配設されているので、基板の反りを抑制することができる In the present invention of claim 21, radiation in the invention of claim 1, characterized in that insulating the member and the LED chip and the wiring portion and the sealing member is provided on both faces of the substrate, the light from the LED chips from both sides of the substrate is to be able, and, since the same parts on both sides of a substrate is disposed, it is possible to suppress warpage of the substrate.
【0037】 [0037]
【発明の実施の形態】 DETAILED DESCRIPTION OF THE INVENTION
以下に本発明の実施の形態を図面を参照して説明する。 It will be described with reference to the accompanying drawings of embodiments of the present invention are described below.
【0038】 [0038]
(基本構成) (Basic configuration)
本発明の基本構成を図1(a)(b)を参照して説明する。 The basic structure of the present invention with reference to FIG. 1 (a) (b) will be described. この光源装置1は、例えばアルミニウムのような熱伝導性の高い材料から形成された厚さが約2mmの基板3と、例えば液晶ポリマーのような絶縁材料からなる厚さが約2mmの絶縁部材4とを貼り合わせて構成される。 The light source device 1, for example a high thermal conductivity substrate thickness, which is formed of about 2mm from the material 3 such as aluminum, for example, a thickness of about 2mm made of an insulating material such as a liquid crystal polymer insulating member 4 constructed by bonding a door.
【0039】 [0039]
絶縁部材4における基板3と反対側の面には、直径が約3mmで深さが約1.5mmの丸穴5が2箇所形成され、各丸穴5の略中央には絶縁部材4を貫通して基板3に達する断面略円形で直径が約1mmの貫通孔6がそれぞれ穿設されている。 On the opposite side surface to the substrate 3 in the insulating member 4, the diameter is a circular hole 5 is formed in two places of approximately 1.5mm depth of about 3 mm, through the insulating member 4 is substantially at the center of the round holes 5 through hole 6 diameter substantially circular section which reaches the substrate 3 is about 1mm and is bored, respectively. ここに、丸穴5と貫通孔6とで、基板3と対向する絶縁部材4の部位に絶縁部材4を貫通して設けられた孔が構成され、丸穴5の底部には内側に突出する張出部4aが基板3と一体に形成されている。 Here, in a circular hole 5 and the through hole 6, the holes provided through the insulating member 4 to the site of the substrate 3 opposite to the insulating member 4 is formed, the bottom of the circular hole 5 inwardly projecting overhang portion 4a is formed integrally with the substrate 3. そして、貫通孔6から露出する基板3の部位にそれぞれLEDチップ2が、銀ペーストのようなダイボンディングペースト7を用いてダイボンドされている。 Then, each portion the LED chip 2 of the substrate 3 exposed from the through hole 6 are die-bonded using a die bonding paste 7 such as silver paste. また、絶縁部材4における基板3と反対側の面には、2個のLEDチップ2の実装部位を通る同一直線上に銅などの導電材料からなる配線パターン(配線部)8が形成されている。 Further, the surface opposite to the substrate 3 in the insulating member 4, two become collinear through the mounting region of the LED chip 2 of a conductive material such as copper wiring pattern (wiring portion) 8 is formed . 配線パターン8は丸穴5の側壁及び底面(張出部4a)まで延設され、ワイヤーボンディング用の接続部を構成しており、LEDチップ2の電極(図示せず)と配線パターン8との間は、例えば金のような金属細線よりなるボンディングワイヤ(金属線)9を介して電気的に接続されている。 Wiring pattern 8 is extended to the side wall and the bottom surface of the circular hole 5 (protruding portion 4a), constitutes the connecting portion of the wire bonding, the LED chips 2 electrode (not shown) and the wiring pattern 8 during it is electrically connected via a bonding wire (metal wire) 9, for example made of thin metal wires, such as gold. ここで、少なくともボンディングワイヤ9の接続される配線パターン8の部位には金めっきが施されており、ボンディングワイヤ9をボンディングしやすいようになっている。 Here, parts of the wiring pattern 8 connected thereto at least a bonding wire 9 gold plating has been applied, so that the easily bonding the bonding wires 9. また、LEDチップ2の上面と、丸穴5の底面に形成された配線パターン8の部位とは略同じ高さになっているので、ボンディングワイヤ9の長さを短くして、ボンディングワイヤ9の機械的強度を高めることができ、且つ、ボンディング作業を容易に行えるようにしている。 Further, the upper surface of the LED chip 2, since almost become the same height from the site of the wiring pattern 8 formed on the bottom surface of the circular hole 5, by shortening the length of the bonding wires 9, the bonding wires 9 it is possible to enhance the mechanical strength, and, so that enable easy bonding operation.
【0040】 [0040]
その後、丸穴5の内部に透光性を有する2液硬化型注型用エポキシ樹脂のような封止樹脂(封止材料)10を注入することによって、LEDチップ2とボンディングワイヤ9の全体が樹脂封止され、ボンディングワイヤ9の接続部が封止樹脂10によって保護される。 Thereafter, by injecting sealing resin (sealing material) 10, such as the inside of the two-component curable casting epoxy resin having a light-transmitting circular hole 5, the whole of the LED chip 2 and the bonding wires 9 resin sealing, the connection portions of the bonding wires 9 are protected by the sealing resin 10. ここで、封止樹脂10を注入する際には、絶縁部材4の上面まで注入すれば良く、封止樹脂10の注入量を容易に制御することができる。 Here, when injecting the sealing resin 10 may be implanted to the upper surface of the insulating member 4, it is possible to easily control the injection amount of the sealing resin 10. また、ボンディングワイヤ9は、張出部4a上に延設された配線パターン8の部位に接続されており、丸穴5内に納められているので、丸穴5内に充填された封止樹脂10によってボンディングワイヤ9とその接続部位とを樹脂封止することができ、ボンディングワイヤ9が封止樹脂10から外側に露出することによって機械的強度が低下したり、封止樹脂10の表面で発生する応力によってボンディングワイヤ9が断線する虞はない。 The bonding wire 9 is connected to the site of the wiring pattern 8 is extended onto the overhang portion 4a, so are housed in a circular hole 5, a sealing resin filled into the round holes 5 10 bonding wires 9 and their connecting portion can be resin-sealed by, lowered mechanical strength by bonding wires 9 are exposed from the sealing resin 10 to the outside, generated on the surface of the sealing resin 10 stress there is no possibility that the bonding wires 9 are disconnected by the.
【0041】 [0041]
尚、LEDチップ2としては、チップ上面に2つの電極が形成されたGaN系LEDチップを例として説明しているが、AlInGaP系LEDチップのようにチップ下面が一方の電極となり、チップ上面にもう一方の電極が形成されたようなLEDチップを用いても良く、この場合は基板3を配線として用いるか、又は、基板3に電極を設け、LEDチップと基板3の電極及び配線パターン8との間をそれぞれボンディングワイヤで接続すれば良い。 As the LED chip 2, a GaN-based LED chip has two electrodes formed on the upper surface of the chip is described as an example, the chip lower surface as AlInGaP-based LED chip is one electrode and the other to the top surface of the chip be used LED chip, such as one of the electrodes is formed well, whether used as in this case the wiring substrate 3, or the electrode provided on the substrate 3, the LED chip and the substrate 3 electrodes and the wiring pattern 8 between each may be connected by bonding wires.
【0042】 [0042]
上述のように、 光源装置1では、LEDチップ2が熱伝導性の良好な基板3上に直接ダイボンドされているから、LEDチップ2の発熱はダイボンディングペースト7を介して基板3へ伝わり、基板3に到達したLEDチップ2の発熱は速やかに基板3全体に広がる。 As described above, in the light source device 1, because the LED chip 2 is die bonded directly on good substrate 3 of thermal conductivity, heat generated by the LED chip 2 is transmitted to the substrate 3 via a die bonding paste 7, heating of the LED chip 2 which reaches the substrate 3 is quickly spread throughout the substrate 3. ここで、LEDチップ2の発熱の放熱経路には、熱伝導係数の低いダイボンディングペースト7が存在するが、ダイボンディングペースト7の厚さは数μm程度と薄いため、放熱性に与える影響は小さく、十分な放熱性能が得られる。 Here, the heat dissipation path of heat generated by the LED chip 2 is lower die bonding paste 7 having thermal conductivity is present, the thickness of the die bonding paste 7 is thinner as several [mu] m, the effect on heat dissipation small , sufficient heat dissipation performance can be obtained. 例えば熱抵抗で比較すると、従来例で説明した砲弾型LEDの場合は、LEDチップからリードフレームの先端までの熱抵抗が約350℃/Wであったのに対して、 光源装置1では、LEDチップ2から基板3の裏面までの熱抵抗が約90℃/Wであり、熱抵抗を約4分の1に低減することができる。 For example, when compared with the thermal resistance, in the case of bullet type LED described in the conventional example, while the thermal resistance from the LED chip to the tip of the lead frame was about 350 ° C. / W, in the light source apparatus 1, a thermal resistance of about 90 ° C. / W from the LED chip 2 to the back surface of the substrate 3, it is possible to reduce the thermal resistance of about one-quarter.
【0043】 [0043]
したがって、従来の光源装置に比べて、LEDチップ2から外部への放熱特性が高くなり、LEDチップ2の温度上昇が抑制されるから、LEDチップ2の発光効率が向上すると共に、光出力が増加し、且つ、長寿命化を図ることができる。 Therefore, as compared with the conventional light source apparatus, the heat dissipation characteristics of the LED chip 2 to the outside is increased, since the temperature rise of the LED chip 2 is suppressed, the luminous efficiency of the LED chip 2 is improved, the light output is increased and, and, it is possible to increase the life of.
【0044】 [0044]
また、LEDチップ2およびボンディングワイヤ9は封止樹脂10によって封止されており、ボンディングワイヤ9の接続部位も封止樹脂10によって保護されているから、ボンディングワイヤ9に応力が加わることはなく、ボンディングワイヤ9の断線を防止することができ、機械的な強度を向上させることができる。 Further, LED chips 2 and the bonding wires 9 are sealed by the sealing resin 10, because the connection site of the bonding wires 9 are also protected by the sealing resin 10, no stress may be applied to the bonding wire 9, it is possible to prevent disconnection of the bonding wires 9, it is possible to improve the mechanical strength.
【0045】 [0045]
尚、本光源装置1では基板3としてアルミ板を用いているが、基板3の材料をアルミニウムに限定する趣旨のものではなく、銅などの金属や、窒化アルミニウムなどの熱伝導性の高いセラミックスから形成しても良く、上述と同様の効果が得られる。 Although using the aluminum plate as the light source device 1, a substrate 3, a material of the substrate 3 is not intended to limit the aluminum, metal or the like copper, a high thermal conductivity such as aluminum nitride ceramics It may be formed, the same effect as described above can be obtained. また、本光源装置1では絶縁部材4上にプリント配線技術を用いて配線パターン8を形成しているが、配線パターン8の代わりに、絶縁部材4内を通り、ボンディングワイヤ9の接続部位のみをLEDチップ2の近傍に露出させたリードフレーム(図示せず)を用いて、LEDチップ2の配線を行っても良い。 Also, although used on the light source device 1, the insulating member 4 and the printed wiring technique to form a wiring pattern 8, in place of the wiring pattern 8 through the inside insulating member 4, only connecting portions of the bonding wires 9 using a lead frame exposed in the vicinity of the LED chip 2 (not shown), may be performed wiring of the LED chips 2.
【0046】 [0046]
(実施形態 (Embodiment 1)
本発明の実施形態を図2を参照して説明する。 The first embodiment of the present invention will be described with reference to FIG. この光源装置1は、例えばアルミニウムのような熱伝導性の高い材料から形成された基板3と、例えば液晶ポリマーのような絶縁材料からなる厚みが約2mmの絶縁部材4とを貼り合わせて形成される。 The light source device 1, for example a heat substrate 3 formed from a conductive material having high, such as aluminum, for example, the thickness of insulating material such as a liquid crystal polymer is formed by bonding the insulating member 4 of about 2mm that.
【0047】 [0047]
基板3は厚みが約3mmのアルミ板に切削加工を施すことによって形成され、基板3における絶縁部材4側の面には、直径が約1mmで高さが約0.9mmの略円柱状の突台部11が突設されている。 Substrate 3 is formed by performing cutting an aluminum plate having a thickness of approximately 3 mm, on the surface of the insulating member 4 side of the substrate 3, substantially cylindrical collision of approximately 0.9mm in diameter and a height of about 1mm the base portion 11 is projected.
【0048】 [0048]
絶縁部材4における基板3と反対側の面には、基板3の突台部11に対応する部位に凹所5'が形成されており、凹所5'の底には絶縁部材4を貫通する貫通孔6が形成されている。 The surface opposite to the substrate 3 in the insulating member 4, 'are formed, the recess 5' recess 5 at positions corresponding to the support block 11 of the substrate 3 in the bottom of penetrating through the insulating member 4 through hole 6 is formed. ここで、貫通孔6の孔径は約1mmであり、突台部11の外径と略同じになっている。 Here, the diameter of the through hole 6 is about 1 mm, are substantially the same as the outer diameter of the support block 11. また、凹所5'の底面の内径は約2mmであり、凹所5'の側壁は基板3側から遠ざかるにしたがって内径が大きくなり、約45度の角度で傾斜するような断面形状に形成されている。 Moreover, the recess 5 'inner diameter of the bottom surface of about 2 mm, the recess 5' side walls of the inner diameter increases with increasing distance from the substrate 3 side, are formed in the cross-sectional shape as to be inclined at an angle of approximately 45 degrees ing. ここに、凹所5'と貫通孔6とで、基板3と対向する絶縁部材4の部位に絶縁部材4を貫通して設けられた孔が構成され、凹所5'の底部には内側に突出する張出部4aが基板3と一体に形成されている。 Here, the recess 5 'in and through holes 6, is hole configuration provided on the site of the substrate 3 opposite to the insulating member 4 through the insulating member 4, the recess 5' inside the bottom of the projecting portion 4a which protrudes is formed integrally with the substrate 3.
【0049】 [0049]
ここで、基板3及び絶縁部材4は貫通孔6と突台部11とを嵌合させた状態で接合されており、貫通孔6から露出する突台部11の部位には厚さが約0.2mmのLEDチップ2が、銀ペーストのようなダイボンディングペースト7を用いてダイボンドされている。 Here, the substrate 3 and the insulating member 4 are joined in a state where the fitting the through hole 6 and the support block 11, the thickness of the portion of the support block 11 which is exposed from the through hole 6 is about 0 LED chips 2 of .2mm has been die-bonded using a die bonding paste 7 such as silver paste. また絶縁部材4における基板3と反対側の面には、銅などの導電材料からなる配線パターン8が形成され、その表面には金めっきを施してある。 Also in the surface opposite to the substrate 3 in the insulating member 4, is formed a wiring pattern 8 made of a conductive material such as copper, on the surface are plated with gold. 配線パターン8は凹所5'の側壁及び底面まで延設されており、凹所5'の底面(張出部4a)に延設された配線パターン8の部位とLEDチップ2の上面に形成された電極との間は、例えば金のような金属細線からなるボンディングワイヤ9を介して電気的に接続されている。 Wiring pattern 8 is formed on the 'side walls and provided so as to extend to the bottom surface, the recess 5' of the site and the upper surface of the LED chip 2 of the bottom surface (protruding portion 4a) to extend the wiring pattern 8 of the recess 5 and between the electrode are electrically connected via a bonding wire 9 made of a thin metal wire such as gold.
【0050】 [0050]
その後、凹所5'の内部に透光性を有する2液硬化型注型用エポキシ樹脂のような封止樹脂10を注入することによって、LEDチップ2とボンディングワイヤ9とが樹脂封止され、ボンディングワイヤ9の接続部が封止樹脂10によって保護される。 Then, by injecting a sealing resin 10, such as two-component curable casting epoxy resin having a light transmitting property in the interior of the recess 5 ', and the LED chip 2 and the bonding wires 9 are sealed with a resin, connection of the bonding wires 9 are protected by the sealing resin 10. ここで、封止樹脂10を注入する際には、絶縁部材4の上面まで注入すれば良く、封止樹脂10の注入量を容易に制御することができる。 Here, when injecting the sealing resin 10 may be implanted to the upper surface of the insulating member 4, it is possible to easily control the injection amount of the sealing resin 10. しかも、ボンディングワイヤ9は、張出部4a上に延設された配線パターン8の部位に接続されており、凹所5'内に納められているので、凹所5'内に充填された封止樹脂10によってボンディングワイヤ9とその接続部位とを樹脂封止することができ、ボンディングワイヤ9が封止樹脂10から外側に露出することによって機械的強度が低下したり、封止樹脂10の表面で発生する応力によってボンディングワイヤ9が断線する虞はない。 Moreover, sealing the bonding wires 9 are connected to the site of the wiring pattern 8 is extended onto the overhang portion 4a, 'since disposed within, the recess 5' recess 5 filled in the bonding wires 9 and their connecting portion can be resin-sealed by sealing resin 10, it lowered mechanical strength by bonding wires 9 are exposed from the sealing resin 10 on the outer surface of the sealing resin 10 there is no possibility that the bonding wires 9 is disconnected by in generating stress.
【0051】 [0051]
また本実施形態の光源装置1では、LEDチップ2が熱伝導性の良好な基板3上に直接ダイボンドされているから、 基本構成で説明した光源装置1と同様、十分な放熱性能を得ることができ、LEDチップ2の温度上昇が抑制されるから、LEDチップ2の発光効率が向上すると共に、光出力が増加し、且つ、長寿命化を図ることができる。 Also in the light source device 1 of the present embodiment, since the LED chip 2 is directly die-bonded on a good substrate 3 of thermal conductivity, similar to that of the light source apparatus 1 described in the basic configuration, it is possible to obtain a sufficient heat dissipation performance can, because the temperature rise of the LED chip 2 is suppressed, the luminous efficiency of the LED chip 2 is improved, the light output increases, and can increase the life of.
【0052】 [0052]
さらに本実施形態の光源装置1では基板3に突台部11を形成しているので、基板3及び絶縁部材4の接合方向において、LEDチップ2の上面と張出部4aに形成された配線パターン8の高さとを略同じ高さにしたとしても、突台部11の高さ分だけ張出部4aの厚みを厚くすることができる。 Because and moreover, a light source apparatus 1 support block 11 on the substrate 3 in the present embodiment, in the bonding direction of the substrate 3 and the insulating member 4, formed on the upper surface and the projecting portion 4a of the LED chip 2 wiring pattern even 8 of a height as to substantially the same height, it is possible to increase the thickness of only the height of the protruding portion 4a of the support block 11. ここで、絶縁部材4を樹脂から形成する場合、張出部4aの厚みを薄くすると歩留まりが増加するなどして、張出部4aの加工が難しくなる。 Here, in the case of forming the insulating member 4 from a resin, and the like yield is increased when the thickness of the overhang portion 4a, processing of the overhang portion 4a is difficult. また、基板3と絶縁部材4とを貼り合わせて形成する場合、張出部4aの厚みが薄いと、基板3との間に隙間が生じる虞がある。 In the case of forming by bonding the substrate 3 and the insulating member 4, the thickness of the overhang portion 4a is thin, there is a fear that a gap is formed between the substrate 3. それに対して、本実施形態の光源装置1では張出部4aの幅寸法が約0.5mmであるのに対して、厚みが約1mmとなっているので、張出部4aを容易に加工することができ、また基板3との間に隙間を生じることなく、基板3及び絶縁部材4を貼り合わせることができる。 In contrast, while the width of the light source device 1, the overhang portion 4a of the present embodiment is about 0.5 mm, since the thickness becomes about 1 mm, easily processed overhanging portion 4a it can, also without causing a gap between the substrate 3, can be attached to the substrate 3 and the insulating member 4.
【0053】 [0053]
また、 基本構成で説明した光源装置1と同様、LEDチップ2の上面と、凹所5'の底面(張出部4a)に形成された配線パターン8の部位とは略同じ高さになっているので、ボンディングワイヤ9の長さを短くして、ボンディングワイヤ9の機械的強度を高めることができ、且つ、ボンディング作業を容易に行えるという利点もある。 Further, similarly to the light source apparatus 1 described in the basic configuration, the upper surface of the LED chip 2, the site of the bottom surface (protruding portion 4a) which is formed in the wiring pattern 8 of the recess 5 'substantially become the same height because there, by shortening the length of the bonding wires 9, it is possible to increase the mechanical strength of the bonding wire 9, and an advantage that facilitates the bonding operation. また、凹所5'の側壁をテーパ面としているので、LEDチップ2から放射された光が凹所5'の側壁によって吸収されたり、乱反射されることはなく、効率良く前方へ反射させることができる。 Further, 'since the side walls of which a tapered surface, light emitted from the LED chip 2 is the recess 5' recess 5 or absorbed by the side wall of, not to be irregularly reflected, it is reflected efficiently to the front it can.
【0054】 [0054]
(実施形態 (Embodiment 2)
本発明の実施形態を図3(a)を参照して説明する。 The second embodiment of the present invention with reference to FIGS. 3 (a) will be described. 本実施形態の光源装置1では、実施形態の光源装置1において、基板3に設けた突台部11の高さ寸法を約1.1mmとしており、突台部11の上面と張出部4aに形成された配線パターン8の上面との高さを略同じにしている。 In the light source apparatus 1 of this embodiment, the light source device 1 of the first embodiment, the height of the support block 11 provided on the substrate 3 is set to about 1.1 mm, the upper surface and the swollen portion 4a of the support block 11 It is substantially the same height of the formed upper surface of the wiring pattern 8 on. 尚、突台部11以外の構成は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。 Since the configuration other than support block 11 is similar to the first embodiment, the same components are denoted by the same reference numerals, and description thereof is omitted.
【0055】 [0055]
実施形態の光源装置1では、LEDチップ2から放射された光の内、LEDチップ2の上面と略平行な方向(水平方向)に放射された光の一部は、張出部4aの端面によって吸収されたり、乱反射されるなどして、前方へ放射されなくなり発光効率が低下する虞がある。 In the light source apparatus 1 of the first embodiment, among the light emitted from the LED chip 2, a portion of the emitted light to the top surface and substantially parallel to the direction of the LED chips 2 (horizontal direction), the end face of the protruding portion 4a or be absorbed by, and the like are diffused reflection, it may deteriorate the luminous efficiency will not be emitted forward. それに対して、本実施形態の光源装置1では、突台部11の上面と、張出部4aに形成された配線パターン8の上面との高さを略同じ高さにしており、LEDチップ2は略平坦な面にダイボンディングされているので、LEDチップ2から放射された光が張出部4aの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。 In contrast, in the light source apparatus 1 of this embodiment, the upper surface of the support block 11, are at substantially the same height as the height of the upper surface of the wiring pattern 8 formed on the overhanging portion 4a, LED chips 2 since is die-bonded to a substantially flat surface, or light emitted from the LED chip 2 is absorbed to the end surface of the protruding portion 4a, a possibility that the irregular reflection is not, thereby improving the luminous efficiency.
【0056】 [0056]
尚、図3(b)に示すように、突台部11の上面を、張出部4aに形成された配線パターン8よりも上方へ突出させても良く、上述と同様に、LEDチップ2の光が張出部4aの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。 Incidentally, as shown in FIG. 3 (b), the upper surface of the support block 11 may be made to protrude upward from the wiring pattern 8 formed on the overhanging portion 4a, in the same manner as described above, the LED chip 2 or light is absorbed on the end face of the protruding portion 4a, a possibility that the irregular reflection is not, thereby improving the luminous efficiency. 尚、突台部11の突出量が大きくなりすぎると、ボンディングワイヤ9のワイヤ長が長くなって、ボンディングワイヤ9が突台部11の角に接触する虞があるため、突台部11の高さは、突台部11の上面と張出部4aに形成された配線パターン8の上面とが略面一になるような高さか、又は、突台部11の上面が張出部4aに形成された配線パターン8の上面よりも若干高くなるような高さに形成するのが望ましい。 Incidentally, when the amount of protrusion of the support block 11 is too large, longer wire length of the bonding wire 9, since the bonding wire 9 there is a possibility that contacts the corners of the support block 11, the support block 11 high of the top and Do such height becomes substantially flush wiring pattern 8 formed on the upper surface and the swollen portion 4a of the support block 11, or the upper surface of the support block 11 is formed in the protruding portion 4a is preferably formed to have been slightly from the upper surface becomes higher above the height of the wiring pattern 8.
【0057】 [0057]
(実施形態 (Embodiment 3)
本発明の実施形態を図4(a)を参照して説明する。 The third embodiment of the present invention with reference to FIG. 4 (a) will be described. 本実施形態では、実施形態の光源装置1において、基板3に設けた突台部11の直径を約0.5mm、高さ寸法を約1.1mmとしており、突台部11の上面と張出部4aに形成された配線パターン8の上面との高さを略同じにしている。 In the present embodiment, the light source device 1 of the embodiment 2, about 0.5mm in diameter of the support block 11 provided on the substrate 3, are set to about 1.1mm height dimension, top and Zhang support block 11 It is substantially the same height as the upper surface of the detecting portion wiring pattern 8 formed on 4a. 尚、基板3及びLEDチップ2の配置以外は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。 Since other arrangements of the substrate 3 and the LED chip 2 is similar to that of Embodiment 2, the same components are denoted by the same reference numerals, and description thereof is omitted.
【0058】 [0058]
LEDチップ2は透明なサファイア基板からなり、電極間距離が約1mmのものを用いており、LEDチップ2を突台部11と対向させ、突台部11が電極間に位置するようにして、LEDチップ2の電極面を配線パターン8にフェースダウン実装した。 LED chip 2 is made of a transparent sapphire substrate, and the distance between the electrodes is used as approximately 1 mm, the LED chip 2 support block 11 and is opposed, as support block 11 is positioned between the electrodes, and face-down mounting the electrode surface of the LED chip 2 to the wiring pattern 8. ここで、LEDチップ2と配線パターン8とは以下のような方法で接合した。 Here, the LED chip 2 and the wiring pattern 8 was bonded by the following method. すなわち、LEDチップ2の電極上に半田バンプ21を形成し、リフロー炉で加熱して半田バンプ21を溶融させることにより接合した。 That is, the solder bump 21 is formed on the electrode LED chip 2 was bonded by melting the solder bumps 21 are heated in a reflow furnace. なお半田バンプ21の高さは2〜3μmであり、基板3とLEDチップ2の電極面もこの間隔で離れているため電気的絶縁は保たれる。 Note the height of the solder bump 21 is 2 to 3 [mu] m, the electrical insulation for the electrode surface of the substrate 3 and the LED chip 2 is also separated by this interval is kept. また封止樹脂10が基板3とLEDチップ2との隙間に充填されるが、基板3とLEDチップ2との間の距離は十分短いため、LEDチップ2は基板3に熱結合されており、LEDチップ2から基板3への熱伝導に対しては大きな障害とはならない。 Although the sealing resin 10 is filled in the gap between the substrate 3 and the LED chip 2, since the distance between the substrate 3 and the LED chip 2 is sufficiently short, the LED chip 2 is thermally coupled to the substrate 3, not a significant obstacle for heat conduction from the LED chip 2 to the substrate 3.
【0059】 [0059]
また実施形態で説明した光源装置1では、LEDチップ2の電極が凹所5'の開口部側を向いているので、LEDチップ2から外部へと向かう光の一部はLEDチップ2の電極によって遮られる。 Also in the light source device 1 described in the embodiment 2, since the electrode LED chip 2 faces an opening side of the recess 5 ', part of the light traveling from the LED chip 2 to the outside electrode of the LED chip 2 It is blocked by. 遮られた光の一部は反射を繰り返して外部へと取り出されるが、残りは内部で吸収されてロスとなる。 Although some intercepted light is taken out to the outside repeatedly reflected, the rest will be lost by being absorbed internally. それに対して、本実施形態では、LEDチップ2の電極が基板3側に配置されており、LEDチップ2の発光部からの発光は透明なサファイア基板を通じて取り出されるため、LEDチップ2の電極やボンディングワイヤ9によって発光の一部が遮蔽されることがなく、全体として光量が低下するのを防止できる。 In contrast, in the present embodiment, the electrode LED chip 2 is disposed on the substrate 3 side, since the light emission from the light emitting portion of the LED chip 2 to be taken out through the transparent sapphire substrate, electrodes and bonding the LED chip 2 without part of the emission is shielded by the wires 9, it is possible to prevent the light quantity as a whole is lowered. また、実施形態の光源装置1にレンズなどの光学部品を組み合わせて使用する場合、焦点距離によってはLEDチップ2の電極の形状が影として照射面に投影される問題があるが、本実施形態では電極が基板3側に配置されているので、前面が均一な照射面とすることができる。 Also, implementation when using a combination of optical components such as form the second light source device lens 1, there is a problem that the shape of the electrode LED chip 2 is projected to the irradiation surface as a shadow by the focal length, the present embodiment in the electrode is arranged on the substrate 3 side, it is possible front to a uniform irradiation surface. さらに、実施形態で説明したように、LEDチップ2から放射された光が張出部4aの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。 Further, as described in Embodiment 2, or the light emitted from the LED chip 2 is absorbed to the end surface of the protruding portion 4a, a possibility that the irregular reflection is not, thereby improving the luminous efficiency.
【0060】 [0060]
なお、図4(b)に示すように、突台部11の上面を、張出部4aに形成された配線パターン8よりも約3μm上方へ突出させ、LEDチップ2を突台部11上面に接触させた状態でフェースダウン実装しても良く、LEDチップ2を突台部11と直接接触させることによって放熱性を向上させることができる。 Incidentally, as shown in FIG. 4 (b), the upper surface of the support block 11, is projected to approximately 3μm above the wiring pattern 8 formed on the projecting portion 4a, the LED chip 2 to the support block 11 upper surface may be mounted face-down in a state of being contacted, the LED chip 2 can improve heat dissipation properties by direct contact with the support block 11. 但し、この場合には突台部11の上面、又は、突台部11の上面と接触するLEDチップ2の部位を酸化珪素などの絶縁性材料でコーティングするなどしてLEDチップ2と基板3とを絶縁するか、或いは、基板3の材料として電気導電性の無い材料を用いる必要がある。 However, the upper surface of the support block 11 in this case, or, with the LED chip 2 and the substrate 3, for example, by coating a portion of the LED chip 2 in contact with the upper surface of the support block 11 of an insulating material such as silicon oxide the insulating or, alternatively, it is necessary to use a no electrically conductive material as the material of the substrate 3. また、突台部11と配線パターン8との段差を吸収するために、半田バンプ21の高さを高くするのが望ましく、LEDチップ2の電極と配線パターン8との電気的接続を確実にできる。 Further, in order to absorb the difference in level between the support block 11 and the wiring pattern 8, it is desirable to increase the height of the solder bump 21 can be an electrical connection between the electrode LED chip 2 and the wiring pattern 8 reliably .
【0061】 [0061]
ここで、光源装置1の構造を図4(b)に示す構造とした場合にも、上述と同様、LEDチップ2から放射された光が張出部4aの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。 Here, when the structure of the light source device 1 has a structure shown in FIG. 4 (b) also, similarly to the above, or the light emitted from the LED chip 2 is absorbed to the end surface of the protruding portion 4a, it is reflected diffusely fear is not, thereby improving the luminous efficiency.
【0062】 [0062]
(実施形態 (Embodiment 4)
本発明の実施形態を図5を参照して説明する。 The fourth embodiment of the present invention will be described with reference to FIG. 本実施形態の光源装置1では、実施形態の光源装置1において、基板3の下面における突台部11に対応する部位に凹所12を設けている。 In the light source apparatus 1 of this embodiment, the light source device 1 of the embodiment 2 is provided with a recess 12 at positions corresponding to the support block 11 on the lower surface of the substrate 3. 尚、凹所12以外の構成は実施形態の光源装置1と同様であるので、実施形態と同一の構成要素には同一の符号を付して、その説明を省略する。 Since the configuration other than the recess 12 is similar to that of the light source device 1 of the embodiment 2, the same components as Embodiment 2 are denoted by the same reference numerals, and description thereof is omitted.
【0063】 [0063]
実施形態の光源装置1では、基板3に切削加工を施すことによって突台部11を形成しているが、本実施形態の光源装置1では、基板3を一面から打ち出してプレス加工を施し、凹所12を形成することによって、基板3の反対側の面に突台部11を形成しており、切削加工を施す場合に比べて加工費用を低減できる。 In the light source apparatus 1 of Embodiment 2, but forms a support block 11 by performing the cutting in the substrate 3, the light source apparatus 1 of this embodiment, subjected to press working launch the substrate 3 from one side, by forming the recess 12, it forms a support block 11 on the opposite side of the substrate 3 can be reduced machining costs as compared with the case of applying the cutting.
【0064】 [0064]
また、基板3と絶縁部材4とを接着剤を用いて貼り合わせる場合、接着剤の硬化収縮によって基板3及び絶縁部材4全体が反ってしまう虞がある。 Further, when bonding the substrate 3 and the insulating member 4 using an adhesive, there is a fear that warp entire substrate 3 and the insulating member 4 by cure shrinkage of the adhesive. 一方、プレス加工により突台部11を形成すると、接着剤の硬化収縮によって反る方向とは逆方向の反りが基板3に発生するので、両者の反りを相殺することによって基板3及び絶縁部材4全体の反りを抑えることができる。 On the other hand, by forming the support block 11 by pressing, because the reverse direction of the warp to the direction in which the warp by cure shrinkage of the adhesive occurs on the substrate 3, the substrate 3 and the insulating member by offset the warpage of both 4 it is possible to suppress the whole of the warp.
【0065】 [0065]
この光源装置1では、LEDチップ2の発熱はダイボンディングペースト7を介して基板3の突台部11に伝わる。 In the light source apparatus 1, heat generation of the LED chip 2 is transmitted to the support block 11 of the substrate 3 via a die bonding paste 7. 突台部11の裏面には凹所12が形成されているが、基板3は一体に形成されているので、突台部11に伝わったLEDチップ2の発熱は、速やかに基板3全体に伝わり、外部へ放熱される。 Although the rear surface of the support block 11 is formed with a recess 12, since the substrate 3 are formed integrally, the heat generation of the LED chip 2 which transmitted the support block 11 is quickly transmitted to the entire substrate 3 , and it is radiated to the outside. また、基板3は、光源装置1が取り付けられる筐体や放熱フィンなどの放熱部品に接触させた状態で使用されるため、LEDチップ2の発熱は基板3を介して速やかに放熱部品へ放出されることになり、その放熱性能は凹所12が形成されていない場合と略同様である。 The substrate 3, since the light source device 1 is used in a state in contact with the heat radiating parts such as housing and heat radiation fins attached, heat generation of the LED chip 2 is released to rapidly heat radiation member through the substrate 3 becomes Rukoto, the heat dissipation performance are substantially the same as the case where no recess 12 is formed.
【0066】 [0066]
(実施形態 (Embodiment 5)
本発明の実施形態を図6を参照して説明する。 The fifth embodiment of the present invention will be described with reference to FIG. 実施形態の光源装置1では、基板3に切削加工を施すことにより突台部11を形成しているが、本実施形態の光源装置1では、突台部11を形成する代わりに、熱伝導性を有する材料から形成されたベース板3'における絶縁部材4の貫通孔6に対応する部位に、貫通孔6に連通する断面略円形の連通孔13を形成し、この連通孔13内に例えばアルミニウムのような熱伝導性を有する材料から形成された円柱状の熱伝導体(突起部)14を圧入している。 In the light source apparatus 1 of Embodiment 2, but forms a support block 11 by performing cutting on the substrate 3, the light source apparatus 1 of this embodiment, instead of forming the support block 11, the thermal conductivity a portion corresponding to the through hole 6 of the insulating member 4 of the base plate 3 'which is formed from a material having a sex, a substantially circular section communicating holes 13 communicating with the through hole 6 is formed, for example, the communication hole 13 thermally conductive formed from a material having a a cylindrical thermal conductor such as aluminum is press-fitted (projections) 14. ここに、ベース板3'と熱伝導体14とで基板が構成され、ベース板3'の表面から絶縁部材4側に突出する熱伝導体14の先端部から突台部が構成され、熱伝導体14の先端部は貫通孔6内に挿入され、熱伝導体14の先端部にLEDチップ2がダイボンディングペースト7を用いてダイボンドされる。 Here, 'the substrate is composed of a heat conductor 14, the base plate 3' base plate 3 support block is composed of the distal end portion of the heat conductor 14 projecting from the surface of the insulating member 4 side, the thermal conductivity tip body 14 is inserted into the through hole 6, LED chip 2 to the distal end of the heat conductor 14 is die-bonded using a die bonding paste 7. 尚、ベース板3'及び熱伝導体14以外の構成は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。 Note that the configuration other than the base plate 3 'and the thermal conductor 14 is similar to that of Embodiment 2, the same components are denoted by the same reference numerals, and description thereof is omitted.
【0067】 [0067]
実施形態の光源装置では、金属板に切削加工を施すことによって基板3に突台部11を形成しているので、加工費用が高くなるが本実施形態では、ベース板3'に孔開け加工を施し、孔内に熱伝導体14を圧入することによって、突台部を形成しているので、切削加工によって突台部11を形成する場合に比べて、加工費用を低減することができる。 In the light source device embodiment 2, since the forms the support block 11 to the substrate 3 by performing cutting a metal plate, in the although the present embodiment the processing cost is high, drilling the base plate 3 'processing alms, by forcing heat conductor 14 within the hole, so to form a support block, as compared with the case of forming the support block 11 by cutting, it is possible to reduce the processing cost.
【0068】 [0068]
またベース板3'の裏面に、光源装置が取り付けられる筐体や放熱フィンなどの放熱部品を接触させて使用する場合を考えると、LEDチップ2の発熱はダイボンディングペースト7を介して熱伝導体14に伝わる。 Also on the rear surface of the base plate 3 ', considering the case for use in contact with the heat radiating parts such as housing and heat radiation fins light source device is attached, the heat generation of the LED chip 2 via the die bonding paste 7 heat conductor transmitted to the 14. ここで、熱伝導体14は、ベース板3'を貫通する連通孔13内に圧入され、ベース板3'の裏面まで達しているので、LEDチップ2の発熱は熱伝導体14を通じて速やかに裏面側に伝わり、放熱部品へと放出される。 The thermal conductor 14 'is pressed into the communicating hole 13 which penetrates the base plate 3' base plate 3 so that reaches the rear surface of the heat generation of the LED chip 2 is quickly back surface through thermal conductor 14 transmitted to the side, it is released into the heat-radiating element. また、熱伝導体14はベース板3'の連通孔13内に圧入されており、熱伝導体14とベース板3'とは密着しているので、両者の間では十分な熱伝導が行われ、熱伝導体14に伝わった熱はベース板3'全体に速やかに放出されるから、基板3に突台部11を一体に形成した実施形態の光源装置と同様の放熱特性を得ることができる。 Further, the heat conductor 14 'are press-fitted into the communication hole 13 of the heat conductor 14 and the base plate 3' base plate 3 but in adhesion to the, sufficient heat conduction is performed between the two , the heat transferred to the heat conductor 14 from being rapidly released to the entire base plate 3 ', is possible to obtain the same radiation characteristic and a light source device of embodiment 2 which is formed integrally with support block 11 on the substrate 3 it can.
【0069】 [0069]
(実施形態 (Embodiment 6)
本発明の実施形態を図7を参照して説明する。 The sixth embodiment of the present invention will be described with reference to FIG. 本実施形態の光源装置1では、実施形態の光源装置1において、基板3に設けた突台部11の周面と、絶縁部材4に設けた貫通孔6の端面との間に隙間15を設けている。 In the light source apparatus 1 of this embodiment, the light source device 1 of the embodiment 2, and the circumferential surface of the support block 11 provided on the substrate 3, a gap 15 between the end face of the through hole 6 provided in the insulating member 4 It is provided. また、絶縁部材4における基板3側の面(接合面)に位置決め用の凹所16を形成するとともに、凹所16と凹凸係止する凸部17を基板3の上面(接合面)に設けている。 Further, to form a recess 16 for positioning on a surface (bonding surface) of the substrate 3 side of the insulating member 4, provided with a protrusion 17 which irregularities locking and recess 16 on the upper surface of the substrate 3 (the bonding surface) there. 尚、隙間15、凹所16、凸部17以外は実施形態の光源装置1と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。 Incidentally, the gap 15, the recess 16, so other than the projecting portion 17 is similar to that of the light source device 1 of the embodiment 2, the same components are denoted by the same reference numerals, and description thereof is omitted.
【0070】 [0070]
ここで、基板3及び絶縁部材4を接着剤で貼り合わせて形成する場合、余分な接着剤が接着面からはみ出す虞があり、実施形態の光源装置ではLEDチップ2がダイボンドされる部位のすぐ近傍に接着剤がはみ出すため、LEDチップ2から放射される光の一部が接着剤によって遮光される虞がある。 Here, when forming by bonding the substrate 3 and the insulating member 4 with adhesive, there is a possibility that excess adhesive protruding from the adhesive surface, immediately sites LED chip 2 is die-bonded in the light source apparatus of Embodiment 2 since the adhesive in the vicinity protrudes, there is a possibility that a part of the light emitted from the LED chip 2 is blocked by the adhesive. また、はみ出した接着剤が突台部11の先端面に付着して、LEDチップ2をダイボンドできなくなる虞もあるが、本実施形態の光源装置では、突台部11と張出部4aとの間に隙間15を設けており、接着面からはみ出した接着剤は隙間15に溜まるため、LEDチップ2がダイボンドされる部位の近傍に余分な接着剤がはみ出して、LEDチップ2から放射される光が遮光されたり、LEDチップ2をダイボンドできなくなるのを防止できる。 Further, protruding adhesive is adhered to the distal end surface of the support block 11, there is a possibility that it becomes impossible die-bonded LED chip 2, but the light source device of this embodiment, the support block 11 and the protruding portion 4a and a gap 15 between, for accumulating the adhesive gap 15 protruding from the adhesive surface, the LED chip 2 protrudes extra adhesive in the vicinity of the site to be die-bonded, light emitted from the LED chip 2 There can be prevented or protected from light, from becoming impossible die-bonded LED chip 2.
【0071】 [0071]
また、基板3に設けた凸部17と、絶縁部材4に設けた凹所16とを凹凸係止することによって、基板3と絶縁部材4との位置合わせを行うことができ、基板3及び絶縁部材4を貼り合わせる際の位置決めが容易に行える。 Further, a convex portion 17 provided on the substrate 3, by irregularities locking a recess 16 provided in the insulating member 4, it is possible to align the substrate 3 and the insulating member 4, the substrate 3 and the insulating positioning when attaching the member 4 can be easily. 尚、本実施形態では基板3に設けた凸部17と、絶縁部材4に設けた凹所16とで、基板3と絶縁部材4との位置決めを行うための位置決め手段を構成しているが、位置決め手段を凸部17と凹所16とに限定する趣旨のものではなく、適宜の手段を用いて基板3と絶縁部材4との位置決めを行うようにすれば良い。 Incidentally, the convex portion 17 provided on the substrate 3 in the present embodiment, in a recess 16 provided in the insulating member 4 and also forms the positioning means for positioning the substrate 3 and the insulating member 4, not intended to limit the positioning means and the projecting portion 17 and the recess 16, it is only necessary to perform positioning between the substrate 3 and the insulating member 4 with appropriate means.
【0072】 [0072]
(実施形態 (Embodiment 7)
本発明の実施形態を図8を参照して説明する。 The seventh embodiment of the present invention will be described with reference to FIG. 本実施形態では、実施形態の光源装置1において、絶縁部材4の基板3側の面に貫通孔6を中心として半径約1mmの位置に幅約0.5mm、深さ約0.3mmのリング状の溝4dを設けている。 In this embodiment, carried out in the light source device 1 of the embodiment 2, a width of about 0.5mm at the position of radius of about 1mm around the through-hole 6 on the surface of the substrate 3 side of the insulating member 4, a depth of about 0.3mm of the ring the Jo grooves 4d are provided. 尚、溝4d以外の構成は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Note that the configuration other than the groove 4d is similar to that of Embodiment 2, the same components are denoted by the same reference numerals, and a description thereof will be omitted.
【0073】 [0073]
ここで、基板3と絶縁部材4とを接着剤で貼り合わせて接合する場合、余分な接着剤が接着面からはみ出す虞があり、実施形態の光源装置1ではLEDチップ2がダイボンドされる部位のすぐ近傍に接着剤がはみ出すため、LEDチップ2から放射される光の一部が接着剤によって遮光される虞がある。 Here, the site when bonding by bonding the substrate 3 and the insulating member 4 with adhesive, excess adhesive there is a possibility that protrude from the adhesive surface, the LED chip 2 in the light source device 1 of the embodiment 2 is die-bonded because immediately adhesive near protrudes in, there is a possibility that a part of the light emitted from the LED chip 2 is blocked by the adhesive. また、はみ出した接着剤が突台部11の先端面に付着して、LEDチップ2をダイボンドできなくなる虞もある。 The adhesive protruding adheres to the tip surface of the support block 11, there is a possibility that the LED chip 2 can not be die-bonded. それに対して、本実施形態の光源装置1では、突台部11が嵌合される貫通孔6の周囲に溝4dが形成されているため、余分な接着剤22はこの溝4d内に溜まり、貫通孔6を通って突台部11近傍にはみ出すのを防止できる。 In contrast, in the light source apparatus 1 of this embodiment, since the groove 4d about the through hole 6 which support block 11 is fitted is formed, excess adhesive 22 accumulates in the groove 4d, through the through-hole 6 can be prevented from protruding to the support block 11 near.
【0074】 [0074]
また、接着剤22の塗布にムラがある場合、基板3と絶縁部材4との接合面に接着剤22が不足する部位が発生して隙間ができ、封止樹脂10を充填する際にこの隙間を通って封止樹脂10が漏れ出す虞があるが、本実施形態では、貫通孔6の周りに溝4dを形成しており、溝4d内に溜まった接着剤22が封止樹脂10の流出を防止する堰の役割を果たすため、封止樹脂10の流出を防止できる。 When there is unevenness in the application of the adhesive 22, a gap portion that insufficient adhesive 22 at the interface between the substrate 3 and the insulating member 4 occurs, the gap at the time of filling the sealing resin 10 there is a possibility that the sealing resin 10 leaks through, but in the present embodiment, forms a groove 4d about the through hole 6, the adhesive 22 accumulated in the groove 4d outflow of the sealing resin 10 to serve weir to prevent, it is possible to prevent outflow of the sealing resin 10.
【0075】 [0075]
(実施形態 (Embodiment 8)
本発明の実施形態を図9を参照して説明する。 The eighth embodiment of the present invention will be described with reference to FIG. 本実施形態では、実施形態の光源装置1において、基板3の材料として例えば銅のような導電性材料を用い、突台部11の上面に金のめっき層を形成している。 In the present embodiment, the light source device 1 of the second embodiment, a conductive material such as copper as a material of the substrate 3 to form a plating layer of gold on the upper surface of the support block 11. また、配線パターン8は凹所5'内に1電極分のみを形成しており、LEDチップ2を、突台部11と張出部4aに形成された配線パターン8とに跨る位置に、一方の電極を突台部11の上面と接触させるとともに、他方の電極を張出部4aに形成された配線パターン8と接触させるようにしてフェースダウン実装している。 The wiring pattern 8 is formed only by one electrode in the recess 5 ', the LED chip 2, a position spanning the support block 11 and the protruding portion 4a on the formed wiring pattern 8, whereas electrode together with is contacted with the upper surface of the support block 11 of, and mounted face-down and the other electrode so as to contact with the wiring pattern 8 formed on the overhanging portion 4a. 尚、LEDチップ2の実装方法以外は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Since non-implementation of the LED chip 2 is similar to that of Embodiment 2, the same components are denoted by the same reference numerals, and a description thereof will be omitted.
【0076】 [0076]
本実施形態の光源装置1では、実施形態と同様、LEDチップ2の電極が基板3側に配置されており、L EDチップ2の電極によって発光の一部が遮蔽されることがなく、全体として光量が低下するのを防止できる。 In the light source apparatus 1 of this embodiment, as in Embodiment 3, the electrode LED chip 2 and is disposed on the substrate 3 side, without some of the emission is shielded by the electrode L ED chip 2, the entire light quantity can be prevented from being lowered as. また、実施形態で説明したように、LEDチップ2から放射された光が張出部4aの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。 Further, as described in Embodiment 2, or the light emitted from the LED chip 2 is absorbed to the end surface of the protruding portion 4a, a possibility that the irregular reflection is not, thereby improving the luminous efficiency. さらに、本実施形態では配線パターン8と基板3との間に電源Eと電流制限用の抵抗Rとを接続することによって、LEDチップ2に給電することができ、基板3を給電部の一部として利用しているため、凹所5'内へ延伸する配線パターン8を簡略化することができる。 Furthermore, by the present embodiment for connecting the resistance R of the power supply E and the current for limiting between the wiring pattern 8 and the substrate 3, it is possible to power the LED chip 2, a portion of the feed section of the substrate 3 since the use as a, it is possible to simplify the wiring pattern 8 which extends into the recess 5 '. また、基板3を通じて裏面側に配線が引き出されるのと同じ効果があるため、光源装置1の電力を基板3の裏面側から供給することができる。 Moreover, since there is the same effect as the wiring on the back side through the substrate 3 is pulled out, the power of the light source device 1 can be supplied from the back surface side of the substrate 3.
【0077】 [0077]
なお、本実施形態の光源装置1では、LEDチップ2をフェースダウン実装しているが、LEDチップ2をフェースアップでダイボンディング実装し、ボンディングワイヤを介してLEDチップ2の電極と配線パターン8及び基板3とを電気的に接続するようにしても良い。 In the light source apparatus 1 of this embodiment, the LED chip 2 is mounted face down, the LED chip 2 is die-bonded mounted face-up, and the LED chip 2 of the electrode and the wiring pattern 8 via a bonding wire substrate 3 and may be electrically connected to.
【0078】 [0078]
(実施形態 (Embodiment 9)
本発明の実施形態を図10を参照して説明する。 The ninth embodiment of the present invention will be described with reference to FIG. 10. 実施形態の光源装置1では基板3にLEDチップ2を1個実装しているが、本実施形態では複数(例えば2個)のLEDチップ2を基板3に実装している。 Although to a light source apparatus LED chip 2 one implementation to 1, the substrate 3 of the embodiment 8, in the present embodiment implements the LED chip 2 of a plurality (e.g., two) on the substrate 3. また、基板3に互いに電気的に絶縁された複数の基板部(領域)3a,3bを設けており、各基板部3a,3bにそれぞれLEDチップ2を1個づつ実装している。 The plurality of substrate portion that are electrically insulated from each other on the substrate 3 (region) 3a, and provided 3b, each substrate portion 3a, and the LED chip 2 respectively one by one mounted 3b. 尚、基本的な構造は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Since the basic structure is the same as Embodiment 8, the same components are denoted by the same reference numerals, and a description thereof will be omitted.
【0079】 [0079]
ところで、実施形態の光源装置1では、基板3の材料として導電性材料を用いており、基板3は全体が同電位となっているので、基板3に複数のLEDチップ2を実装した場合、これらのLEDチップ2は全て並列に接続されることになる。 Incidentally, in the light source device 1 of the embodiment 8, by using a conductive material as the material of the substrate 3, the entire substrate 3 are at the same potential, when mounting a plurality of LED chips 2 on the substrate 3, these LED chips 2 will be all connected in parallel. LEDチップ2は個体ごとに若干駆動電圧が異なるため、複数のLEDチップ2を並列接続した場合は、駆動電圧が最も低いLEDチップ2に多大な電流が流れて、このLEDチップ2が破損する虞がある。 Since LED chip 2 is slightly driving voltage for each individual are different, when connected in parallel the plurality of LED chips 2, and great current flows to the driving voltage is the lowest LED chip 2, the LED chip 2 from being damaged fear there is. 複数のLEDチップ2に流れる電流を均一にするためには、個々のLEDチップ2毎に電流制限用の抵抗を直列接続すれば良いが、LEDチップ2の数だけ電流制限用の抵抗が必要になり、電流制限用の抵抗で消費される電力損失が増大するという問題がある。 In order to equalize the current flowing through the plurality of LED chips 2, a current limiting resistor for each individual LED chip 2 may be connected in series, as required resistance for only the current limit number of LED chips 2 it, there is a problem that power loss increases consumed by a current limiting resistor.
【0080】 [0080]
それに対して、本実施形態では基板3を互いに電気的に絶縁された複数の基板部3a,3bに分割し、各基板部3a,3bにLEDチップ2,2を1個づつ実装しているので、各基板部3a,3bに実装されたLEDチップ2,2を直列接続し、LEDチップ2,2の直列回路と並列に電流制限用の抵抗Rを介して直流電源Eを接続することにより、個々のLEDチップ2に流れる電流を均一にできる。 In contrast, a plurality of the substrate part 3a which is electrically insulated from the substrate 3 to each other in this embodiment, divided into 3b, each substrate portion 3a, since the LED chip 2, 2 are one by one mounted 3b each substrate portion 3a, an LED chip 2, 2 mounted on 3b are connected in series, by connecting the DC power supply E via a resistor R for limiting current in parallel with the series circuit of the LED chip 2, 2, can be made uniform the current flowing through the individual LED chips 2. したがって、特定のLEDチップ2に集中して電流が流れることがないから、電流集中によるLEDチップ2の破損を防止でき、また電流制限用抵抗Rが複数のLEDチップ2に対して1個で済むから、電流制限用の抵抗Rによって発生する電力損失を低減できる。 Therefore, since there is no possibility that current flows concentrated on a specific LED chip 2, can prevent breakage of the LED chip 2 due to the current concentration also requires only one current limiting resistor R is to a plurality of LED chips 2 from, it is possible to reduce the power loss caused by the resistance R for current limiting.
【0081】 [0081]
また本実施形態の光源装置1では、実施形態と同様、LEDチップ2の電極が基板3側に配置されており、L EDチップ2の電極によって発光の一部が遮蔽されることがなく、全体として光量が低下するのを防止できる。 Also in the light source device 1 of the present embodiment, as in Embodiment 3, the electrode LED chip 2 and is disposed on the substrate 3 side, without some of the emission is shielded by the electrode L ED chip 2, the overall light quantity is reduced can be prevented. また、実施形態で説明したように、LEDチップ2から放射された光が張出部4aの端面に吸収されたり、乱反射される虞はなく、発光効率を向上させることができる。 Further, as described in Embodiment 2, or the light emitted from the LED chip 2 is absorbed to the end surface of the protruding portion 4a, a possibility that the irregular reflection is not, thereby improving the luminous efficiency. さらに、本実施形態では配線パターン8と基板3との間に電源Eと電流制限用の抵抗Rとを接続することによって、LEDチップ2に給電することができ、基板3を給電部の一部として利用しているため、凹所5'内へ延伸する配線パターンを簡略化することができる。 Furthermore, by the present embodiment for connecting the resistance R of the power supply E and the current for limiting between the wiring pattern 8 and the substrate 3, it is possible to power the LED chip 2, a portion of the feed section of the substrate 3 since the use as a, it is possible to simplify the wiring pattern which extends into the recess 5 '. また、基板3を通じて裏面側に配線が引き出されるのと同じ効果があるため、光源装置1の電力を基板3の裏面側から供給することができる。 Moreover, since there is the same effect as the wiring on the back side through the substrate 3 is pulled out, the power of the light source device 1 can be supplied from the back surface side of the substrate 3.
【0082】 [0082]
(実施形態10 (Embodiment 10)
本発明の実施形態10を図11を参照して説明する。 The embodiment 10 of the present invention will be described with reference to FIG. 11. 実施形態の光源装置1では、絶縁部材4に設けた凹所5'内に封止樹脂10を注入し(注型)、LEDチップ2やボンディングワイヤ9を封止しているが、本実施形態の光源装置1では、実施形態の光源装置において、金型を用いたトランスファー成形によって樹脂封止を行っており、封止樹脂10の表面に凸レンズ10aを形成している。 In the light source apparatus 1 of Embodiment 2, in the recess 5 'provided in the insulating member 4 by injecting a sealing resin 10 (cast), although the LED chip 2 and the bonding wires 9 are sealed, this embodiment form in the light source device 1 of the light source unit of an embodiment 2, and subjected to resin sealing by transfer molding using a mold, to form a convex lens 10a on the surface of the sealing resin 10. 尚、封止樹脂10以外の構成は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。 Note that the configuration other than the sealing resin 10 is similar to that of Embodiment 2, the same components are denoted by the same reference numerals, and description thereof is omitted.
【0083】 [0083]
実施形態の光源装置1のように注型により樹脂封止を行う場合は、封止樹脂10の表面を所望の形状に形成することはできないが、本実施形態の光源装置1では、基板3及び絶縁部材4ごと金型(図示せず)内に組み込み、圧入によって封止樹脂10を押し込むトランスファー成形により樹脂封止を行っているので、封止樹脂10の表面を凸レンズの形状に容易に形成することができ、封止樹脂10から構成される凸レンズによってLEDチップ2から放射された光を、LEDチップ2の前方の所望の方向に配光することができる。 When performing resin sealing by casting, such as a light source device 1 of the embodiment 2, it is not possible to form the surface of the sealing resin 10 into a desired shape, the light source apparatus 1 of this embodiment, the substrate 3 and integration in the insulating member 4 Gotokin type (not shown), so that by performing resin sealing by transfer molding to push the sealing resin 10 by press-fitting, readily form a surface of the sealing resin 10 into the shape of convex lens it is possible to, the light emitted from the LED chip 2 by composed convex lens from the sealing resin 10, can be light distribution in a desired direction in front of the LED chip 2.
【0084】 [0084]
尚、本実施形態では封止樹脂10の表面を凸レンズの形状に形成しているが、封止樹脂10の表面を凹レンズの形状に形成しても良く、凹レンズにより拡散光放射を行うようにしても良い。 Incidentally, in the present embodiment forms a surface of the sealing resin 10 into the shape of convex lens, the surface of the sealing resin 10 may be formed in the shape of the concave lens, so as to perform diffused light emitted by the concave lens it may be. また、注型により樹脂封止を行う場合でも、凹所5'の内側面の面粗さや、形状や、表面処理などの条件を用いて、凹所5'の内側面と封止樹脂10との濡れ性を制御することによって、封止樹脂10の表面形状を制御することも可能であり、一般に濡れ性が良い場合は封止樹脂10の表面形状は凹面となり、濡れ性が悪い場合は封止樹脂10の表面形状は凸面となる。 Even when performing resin sealing by casting, recesses 5 'and the inner surface of the surface roughness, shape and, using the conditions of such surface treatment, the recess 5' and the inner surface and the sealing resin 10 by controlling the wettability, it is also possible to control the surface shape of the sealing resin 10, the surface shape of the case generally wettability is good sealing resin 10 becomes concave, when poor wettability sealing the surface shape of the sealing resin 10 becomes convex.
【0085】 [0085]
(実施形態11 (Embodiment 11)
本発明の実施形態11を図12(a)(b)を参照して説明する。 The embodiment 11 of the present invention with reference to FIG. 12 (a) (b) will be described. 図12(a)は光源装置1の断面図、図12(b)は光源装置1の平面図をそれぞれ示す。 12 (a) is a cross-sectional view of the light source apparatus 1, FIG. 12 (b) shows a plan view of the light source apparatus 1, respectively. 本実施形態では、実施形態の光源装置1において、絶縁部材4に形成した凹所5'の内面全体に、例えば銀のような導電性の高い材料により形成された高反射率の反射膜(反射部)18を形成している。 In the present embodiment, the light source device 1 of the second embodiment, the entire inner surface of the recess 5 'formed in the insulating member 4, for example, a reflective film of a highly conductive high reflectivity, which is formed of a material such as silver ( forming a reflection portion) 18. 反射膜18は配線パターン8,8に連続して形成されており、配線パターン8の延びる方向と直交する方向に延びる幅狭(例えば幅約0.2mm)のスリット24によって2つの部位に分割され、それぞれの部位は電気的に絶縁されている。 Reflective film 18 is divided are formed successively on the wiring patterns 8 and 8, the slit 24 in the width extending in a direction orthogonal to the extending direction of the wiring pattern 8 narrow (for example, a width of about 0.2 mm) in two sites , each part is electrically insulated. そして、突台部11の上面に実装されたLEDチップ2の電極と各反射膜18,18とをボンディングワイヤ9によって電気的に接続している。 Then, it is electrically connected by a bonding wire 9 and the electrode LED chip 2 mounted on the upper surface of the support block 11 and the reflection film 18. 尚、反射膜18以外の構成は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Note that the configuration other than the reflective film 18 is the same as in Embodiment 2, the same components are denoted by the same reference numerals, and a description thereof will be omitted.
【0086】 [0086]
本実施形態の光源装置1では、LEDチップ2から放射された光は、一部が封止樹脂10を透過して直接外部へ放射されると共に、一部が反射膜18によって反射され外部へ放射される。 In the light source apparatus 1 of this embodiment, light emitted from the LED chip 2, with a portion is emitted directly outside through the sealing resin 10, the portion of the outside is reflected by the reflective film 18 radiation It is. 絶縁部材4の表面よりも、反射膜18の方が反射率が高いため、実施形態の光源装置1に比べて外部へと取り出される発光の割合が高くなる。 From the surface of the insulating member 4, since towards the reflection film 18 is highly reflective, the proportion of light emission increases to be extracted to the outside compared to the light source device 1 of the second embodiment. さらに、本実施形態の光源装置1では、配線パターン8の一部で反射膜18を兼用しているため、凹所5'内に配線パターン8と反射膜18とを別々に形成する場合に比べて、配線パターン又は反射膜の形状を簡略化できる。 Furthermore, in the light source device 1 of the present embodiment, since also serves as a part by the reflecting film 18 of the wiring pattern 8, compared with the case of forming separately the wiring pattern 8 and the reflective film 18 in the recess 5 ' Te, it can be simplified shape of the wiring pattern or the reflective film. 尚、ボンディングワイヤ9をワイヤボンディングするためには、反射膜18を材料を金とするのが望ましいが、反射膜18を金により形成した場合は、青色発光のLEDチップ2から放射される青色光を吸収してしまうため、本実施形態では反射膜18の材料として銀を用いている。 Incidentally, the bonding wires 9 to wire bonding, it is desirable to the reflecting film 18 of material and money, if the reflective film 18 is formed by gold, blue light emitted from the LED chip 2 of blue-emitting because absorbs the, in this embodiment, using silver as the material of the reflection film 18.
【0087】 [0087]
(実施形態12 (Embodiment 12)
本発明の実施形態12を図13(a)(b)を参照して説明する。 The embodiment 12 of the present invention with reference to FIGS. 13 (a) (b) will be described. 実施形態の光源装置1では、絶縁部材4における基板3と反対側の面に、突台部11の直径と略同じ幅の配線パターン8,8を、突台部11を通る同一直線上に形成しており、LEDチップ2の上面に設けた電極と各配線パターン8との間をボンディングワイヤ9を介して電気的に接続している。 In the light source apparatus 1 of Embodiment 2, on the surface opposite to the substrate 3 in the insulating member 4, the wiring patterns 8 and 8 of substantially the same width as the diameter of the support block 11, on the same line passing through the support block 11 formed and are electrically connected between the electrode and the wiring pattern 8 provided on the upper surface of the LED chip 2 via the bonding wires 9. それに対して、本実施形態の光源装置1では、実施形態の光源装置において、各配線パターン8の幅寸法を突台部11の直径に比べて十分小さい幅寸法(例えば約0.5mm)とし、LEDチップ2の電極と各配線パターン8との間を接続するボンディングワイヤ9の延びる方向に、各配線パターン8を延長して形成している。 In contrast, in the light source apparatus 1 of this embodiment, the light source device of the second embodiment, a sufficiently small width (e.g., about 0.5 mm) than the width of each wiring pattern 8 to the diameter of the support block 11 , in the direction of extension of the bonding wire 9 which connects between the electrode and the wiring pattern 8 of the LED chips 2 are formed by extending the wiring pattern 8. そして、凹所5'の内側面および底面における配線パターン8以外の部位に、例えば銀から形成された高反射率の反射膜(反射部)18を形成している。 Then, to form an inner surface and a part other than the wiring pattern 8 at the bottom, for example, a reflective film of high reflectivity formed of silver (reflective portion) 18 of the recess 5 '. 尚、配線パターン8及び反射膜18以外の構成は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。 Note that the configuration other than the wiring pattern 8 and the reflective film 18 is the same as in Embodiment 2, the same components are denoted by the same reference numerals, and description thereof is omitted.
【0088】 [0088]
この光源装置1では、LEDチップ2から放射された光は、一部が封止樹脂10を透過して直接外部へ放射されると共に、一部が反射膜18によって反射され外部へ放射される。 In the light source device 1, light emitted from the LED chip 2, with a portion is emitted directly outside through the sealing resin 10, a part is emitted to the outside is reflected by the reflection film 18.
【0089】 [0089]
ところで、実施形態の光源装置1では、LEDチップ2から放射された光の一部はボンディングワイヤ9によって遮光される。 Incidentally, in the light source device 1 of the embodiment 2, a portion from the LED chip 2 of the emitted light is blocked by the bonding wires 9. また凹所5'の内側面および底面に形成された配線パターン8には、ワイヤーボンディングを容易に行えるようにするため、表面に金めっきを施しているが、青色発光や緑色発光のLEDチップ2を用いる場合、金のめっき層はこれらの光に対して反射率が低いため、光源装置1の光出力が低下するという問題があった。 Also on the inner surface and the wiring pattern 8 formed on the bottom surface of the recess 5 ', in order to allow a wire bonding easily, but is subjected to gold plating on the surface, the blue light emission and green light emitting LED chip 2 when using a, for plating layer of gold has a low reflectance to these lights, the light output of the light source device 1 is lowered.
【0090】 [0090]
それに対して、本実施形態では、反射率の低い配線パターン8の幅寸法を狭くすると共に、ボンディングワイヤ9の延びる方向に配線パターン8を形成しているので、ボンディングワイヤ9の影となる部分と配線パターン8とを一致させることによって、LEDチップ2からの光が遮光される部位の面積を小さくできる。 In contrast, in the present embodiment, while narrowing the width of the low reflectance wiring pattern 8, since the formation of the wiring pattern 8 in the direction of extension of the bonding wire 9, and the portion to be the shadow of the bonding wire 9 by matching the wiring pattern 8, it is possible to reduce the area of ​​the portion of light from the LED chip 2 is blocked. また、凹所5'の内側面および底面における配線パターン8以外の部位に反射膜18を形成しているので、LEDチップ2からの光を効率良く反射させることができ、光取り出し効率を向上させることができる。 Also, since the forming the reflective film 18 on the portion other than the wiring pattern 8 on the inner surface and the bottom surface of the recess 5 ', the light from the LED chip 2 can be efficiently reflected, thereby improving the light extraction efficiency be able to.
【0091】 [0091]
(実施形態13 (Embodiment 13)
本発明の実施形態13を図14を参照して説明する。 The embodiment 13 of the present invention will be described with reference to FIG. 14. 本実施形態の光源装置1では、実施形態の光源装置において、LEDチップ2として青色発光のLEDチップを用いると共に、封止樹脂10'の中にLEDチップ2の青色発光により励起され補色である黄色発光を行う蛍光体粒子を分散させており、封止樹脂10'に光色変換機能を持たせている。 In the light source apparatus 1 of this embodiment, the light source device of the second embodiment, the use of blue emitting LED chips as the LED chip 2 is the complementary color when excited by the blue emission of the LED chip 2 in the sealing resin 10 ' and dispersing the phosphor particles to perform yellow emission, and to have a light color conversion function in the sealing resin 10 '. 尚、封止樹脂10'以外の構成は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Note that the configuration other than the sealing resin 10 'is similar to that of Embodiment 2, the same components are denoted by the same reference numerals, and a description thereof will be omitted.
【0092】 [0092]
この光源装置1では、LEDチップ2からの青色発光と、蛍光体粒子によって一部変換された黄色光との混色によって、白色光を得ることができる。 In the light source device 1, a blue light emitted from the LED chip 2, by mixing with part converted yellow light by the phosphor particles, it is possible to obtain white light. 砲弾型発光ダイオードの場合は、初期光束の70%にまで低下する寿命が約6000時間程度と短いが、本実施形態の光源装置1では、LEDチップ2の放熱性を高めることにより、砲弾型発光ダイオードに比べて著しく寿命を延ばすことができ、長寿命の白色発光ダイオードを実現することができる。 For shell-type light-emitting diode, although life decreases to 70% of the initial luminous flux is short and about 6000 hours, the light source apparatus 1 of this embodiment, by increasing the heat dissipation of the LED chip 2, bullet type light emitting can be extended significantly life than the diode, it is possible to realize a white light emitting diode of long life.
【0093】 [0093]
(実施形態14 (Embodiment 14)
本発明の実施形態14を図15を参照して説明する。 The embodiment 14 of the present invention will be described with reference to FIG. 15. 本実施形態の光源装置1では、実施形態13の光源装置において凹所5'の側面形状を2段構造としている。 In the light source apparatus 1 of the present embodiment, the side shape of the recess 5 'and two-stage structure in the light source apparatus of Embodiment 13. すな わち、凹所5'の内側面には、凹所5'の底面側から開口側に行くにしたがって内径が徐々に大きくなり、約45度の角度で傾斜するようなテーパ面4bが形成され、テーパ面4bの先端部から開口部にかけて、LEDチップ2からの光を所望の方向に反射して集光できるような断面形状を有する反射面4cが形成されている。 Ie, 'on the inner surface of the recess 5' recess 5 inside diameter gradually increases toward the opening side from the bottom side of the tapered surface 4b as inclined at an angle of approximately 45 degrees is formed, toward the opening from the distal end of the tapered surface 4b, the reflective surface 4c having a cross-sectional shape that allows condensing the light from the LED chip 2 is reflected in a desired direction is formed. また、絶縁部材4における基板3と反対側の面には、一対の配線パターン8が突台部11を通る同一直線上に形成されており、反射面4cにおける配線パターン8以外の部位には、例えば銀などの高反射率の材料から形成された反射膜18が形成されている。 Further, on the opposite side of the substrate 3 in the insulating member 4, a pair of wiring patterns 8 are formed on the same straight line passing through the support block 11, the portion other than the wiring pattern 8 on the reflecting surface 4c is for example, the reflection film 18 formed from a highly reflective material such as silver is formed. そして、凹所5'内にはテーパ面4bの先端部に達するまで封止樹脂10'が注入されている。 And, 'it is in the sealing resin 10 until reaching the distal end of the tapered surface 4b' recess 5 is injected. 尚、凹所5'の側面形状以外の構成は実施形態13と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Note that the configuration other than the side surface shape of the recess 5 'is the same as in Embodiment 13, the same components are denoted by the same reference numerals, and a description thereof will be omitted.
【0094】 [0094]
この光源装置1では、凹所5'の1段目から外部へと取り出される光は、封止樹脂10'中に蛍光体粒子が分散されているため、完全拡散配光となっており、1段目から放射された光は非常に配光制御しやすくなっているので、2段目の反射面4cの形状を変更することによって、LEDチップ2からの光を所望の方向に配光することができる。 In the light source device 1, the recess 5 'light extracted to the outside from the first stage of the sealing resin 10' for the phosphor particles are dispersed in, has a completely diffused light distribution, 1 since light emitted from the stage is very easy to light distribution control, by changing the shape of the second stage of the reflecting surfaces 4c, to direct light from the LED chip 2 in the desired direction can.
【0095】 [0095]
(実施形態15 (Embodiment 15)
本発明の実施形態15を図16を参照して説明する。 The embodiment 15 of the present invention will be described with reference to FIG. 16. 本実施形態の光源装置1は、実施形態で説明した光源装置1と同様の構造を有しており、実施形態では基板3にLEDチップ2を1個実装しているが、本実施形態では基板3にLEDチップ2を2個実装し、2個のLEDチップ2を配線パターン8を介して直列に接続している。 Light source apparatus 1 of this embodiment has the same structure as the light source apparatus 1 described in Embodiment 2, although the LED chip 2 and one implement to Embodiment 2 in the substrate 3, the present embodiment in the LED chip 2 and two mounted on the board 3 are connected two LED chips 2 in series through the wiring pattern 8. 尚、光源装置1の基本的な構成は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Since the basic configuration of the light source apparatus 1 is similar to that of Embodiment 2, the same components are denoted by the same reference numerals, and a description thereof will be omitted.
【0096】 [0096]
ところで、一般に光源装置1としては発光部分以外の部位の面積を小さくするのが望ましいが、実施形態で説明した光源装置1の場合、配線パターン8における絶縁部材4の上面に形成された部位を外部電源に接続するための通電部としており、通電部が発光の取り出し面側に位置しているため、通電部に通電するためのコネクタなどの部品を光源装置1の前面(発光面)側に配置する必要があり、これらの部品を配置するために発光部分以外の部位の面積が増加するという問題があった。 Meanwhile, in general as the light source device 1 it is desirable to reduce the area of the portion other than the light-emitting portion, when the light source apparatus 1 described in the embodiment 2, the portion formed on the upper surface of the insulating member 4 in the wiring pattern 8 has a conducting portion to be connected to an external power source, since the conductive portion is positioned on the extraction surface side of the light emission, the parts, such as connectors for energizing the energized portion front surface (light emitting surface) of the light source device 1 side It should be placed, the area of ​​the portion other than the light-emitting portion is disadvantageously increased in order to place these components.
【0097】 [0097]
そこで、本実施形態の光源装置1では、絶縁部材4に設けた3個の配線パターン8の内、一方のLEDチップ2のみに電気的に接続された両側の配線パターン8における絶縁部材4の上面(前面)に形成された平坦部8cに対応する基板3の部位に基板3を貫通する開口孔3cを設けており、この開口孔3cから露出する絶縁部材4の部位に絶縁部材4と配線パターン8とを貫通する貫通孔4eを設けている。 Therefore, in the light source device 1 of the present embodiment, among the three wiring pattern 8 provided in the insulating member 4, the upper surface of the insulating member 4 in one of the LED chip 2 only electrically connected to both sides of the wiring pattern 8 and an opening hole 3c penetrating the substrate 3 to the site of the substrate 3 corresponding to the flat portion 8c formed on the (front), the wiring and the insulating member 4 to the site of the insulating member 4 exposed from the opening hole 3c pattern It is provided a through hole 4e that penetrates the 8. そして、この貫通孔4e内に、導電材料から略棒状に形成された電極ピン23を絶縁部材4の上側から挿入して、電極ピン23の先端部を基板3の下面から突出させており、電極ピン23の先端を被固定部に固定すると、電極ピン23と配線パターン8とが電気的に接続された状態で光源装置1が被固定部に固定される。 Then, in the through-hole 4e, an electrode pin 23 which is formed in a substantially rod-shaped conductive material is inserted from the upper side of the insulating member 4, which protrudes the tip of the electrode pin 23 from the lower surface of the substrate 3, the electrode When the tip of the pin 23 is fixed to the fixed portion, the light source apparatus 1 in a state in which the electrode pin 23 and the wiring pattern 8 is electrically connected it is fixed to the fixed portion. 尚、貫通孔4eの孔径は開口孔3cの孔径よりも小さい寸法に形成されている。 Incidentally, the diameter of the through-hole 4e is formed in the dimension smaller than the diameter of the opening hole 3c.
【0098】 [0098]
上述のように本実施形態では、配線パターン8に電気的に接続された電極ピン23によって配線部の一部を基板側に向かって延伸させており、基板側に延伸された部分(すなわち電極ピン23の先端部)を外部接続端子として、外部から給電することによって、基板3側からLEDチップ2に給電することができる。 In the present embodiment as described above, and by stretching a part of the wiring portion toward the substrate side by the electrode pins 23 which are electrically connected to the wiring pattern 8, drawn portion to the substrate side (i.e. the electrode pins 23 the leading edge) of the external connecting terminals, by feeding from the outside, can be supplied from the substrate 3 side to the LED chip 2. したがって、コネクタなどの給電部品を基板3側(発光面と反対側)に配置することができ、発光の取り出し側から見た時に発光部分以外の部位の面積が全体に占める割合を低減でき、光源装置1の小型化を図るとともに、同じ面積であれば発光出力を大きくすることができる。 Thus, the feed parts, such as connectors can be arranged on the substrate 3 side (light emitting surface opposite), can reduce the rate of total area of ​​the portion other than the light emitting portion when viewed from the extraction side of light emission, the light source with reduction in size of the apparatus 1, it is possible to increase the light emission output if the same area.
【0099】 [0099]
(実施形態16 (Embodiment 16)
本発明の実施形態16を図17を参照して説明する。 The embodiment 16 of the present invention will be described with reference to FIG. 17. 本実施形態では、実施形態で説明した光源装置1において、基板3の突台部11を除いた部分を直径が約5mm、高さが約10mmの円柱形状として、上面略中央に突台部11を突設している。 In the present embodiment, the light source apparatus 1 described in Embodiment 2, support block 11 excluding the portion on which the diameter of about 5mm of the substrate 3, as a cylinder shape of a height of about 10 mm, support block on the upper surface substantially central 11 are projected to. 一方、絶縁部材4の平面形状を一辺が約10mmの正方形としており、絶縁部材4の前面側に形成した配線パターン8を側面を通って裏面側まで延伸し、裏面側に回り込むように延伸された部位を外部接続端子8dとしている。 On the other hand, one side of the planar shape of the insulating member 4 has a square of approximately 10 mm, the wiring pattern 8 formed on the front side of the insulating member 4 to extend to the rear surface side through the side, which is stretched to wrap around the back side It has a site and the external connection terminal 8d. 尚、基板3及び配線パターン8以外の構成は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Note that the configuration other than the substrate 3 and the wiring pattern 8 is the same as in Embodiment 2, the same components are denoted by the same reference numerals, and a description thereof will be omitted.
【0100】 [0100]
図17は本実施形態の光源装置1を器具本体40に取り付けた状態を示している。 Figure 17 shows a state in which the light source device 1 of the present embodiment attached to the fixture body 40. 器具本体40は、直径が約6mmの丸孔41が開口したガラスエポキシ製の配線基板42を備え、丸孔41内に光源装置1の基板3を挿入して、絶縁部材4の裏面側に延伸された外部接続端子8dを配線基板42の上面に形成された配線パターン43に半田付けすることによって、光源装置1が器具本体40に電気的且つ機械的に結合される。 Instrument body 40 is provided with a wiring board 42 made of glass epoxy having a diameter and a round hole 41 is opened about 6 mm, by inserting the substrate 3 of the light source device 1 to the round hole 41, extending on the rear surface side of the insulating member 4 by soldering to the external connection wiring pattern 43 formed on the upper surface of the terminal 8d wiring board 42, the light source device 1 is electrically and mechanically coupled to the instrument body 40. この時、丸孔41から下方に突出する基板3の下面が器具本体40の放熱部品44に熱結合されるので、光源装置1の放熱性が向上する。 At this time, since the lower surface of the substrate 3 that projects from the round hole 41 downward is thermally coupled to the heat radiation member 44 of the equipment main body 40, heat dissipation of the light source device 1 is improved. このように、基板3の下面を配線基板42とは別に用意した放熱部品44と接触させ、放熱部品44を介してLEDチップ2の発熱を放熱しているので、配線基板42には熱伝導性は低いものの安価なガラスエポキシ基板を用いることができ、コストダウンを図ることができる。 Thus, the lower surface of the substrate 3 is brought into contact with the heat dissipating part 44 which is prepared separately from the wiring board 42, since the heat dissipation of the heat generated in the LED chip 2 via the radiation member 44, the thermal conductivity on the wiring substrate 42 it can be low but can use an inexpensive glass epoxy substrate, reduce costs.
【0101】 [0101]
なお、本実施形態では基板3にLEDチップ2を1個だけ実装しているが、基板3に複数のLEDチップ2を実装しても良いことは言うまでもない。 Although this embodiment implements only one of the LED chips 2 on the substrate 3, it is needless to say that the substrate 3 may be mounted a plurality of LED chips 2.
【0102】 [0102]
(実施形態17 (Embodiment 17)
本発明の実施形態17を図18を参照して説明する。 The embodiment 17 of the present invention will be described with reference to FIG. 18. 本実施形態では、実施形態の光源装置1において、基板3の突台部11を除いた部分を直径が約5mm、高さが約0.5mmの円柱形状として、上面略中央に突台部11を突設している。 In the present embodiment, the light source device 1 of the embodiment 2, support block 11 excluding the portion on which the diameter of about 5mm of the substrate 3, as a cylinder shape of a height of about 0.5 mm, support block on the upper surface substantially central 11 are projected to. 一方、絶縁部材4の平面形状を一辺が約20mmの正方形としており、基板3側の面に貫通孔6を中心とする直径が約5mm、深さが約0.5mmの凹部27を設けている。 On the other hand, one side of the planar shape of the insulating member 4 has a square of approximately 20 mm, diameter around the through-hole 6 on the surface of the substrate 3 side is about 5 mm, a depth is provided with a recess 27 of approximately 0.5mm . そして、絶縁部材4における凹部27の外側の部位であって、絶縁部材4の前面側に設けた配線パターン8に対応する部位に絶縁部材4を貫通するスルーホール28を設け、スルーホール28内に導電材料を充填して形成された導電部8eを介して絶縁部材4の前面側に形成された配線パターン8と裏面側に形成された接続端子8fとを電気的に接続している。 Then, a site outside of the recess 27 in the insulating member 4, through holes 28 passing through the insulating member 4 at positions corresponding to the wiring pattern 8 provided on the front side of the insulating member 4 is provided, in the through holes 28 the conductive material via the conductive portion 8e formed by filling and the connection terminal 8f formed on the back surface side and the wiring pattern 8 formed on the front side of the insulating member 4 and electrically connected. 尚、基板3、絶縁部材4及び配線パターン8以外の構成は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Since the substrate 3, the configuration other than the insulating member 4 and the wiring pattern 8 is the same as in Embodiment 2, the same components are denoted by the same reference numerals, and a description thereof will be omitted.
【0103】 [0103]
図18は本実施形態の光源装置1を器具本体の配線基板42に実装した状態を示している。 Figure 18 shows a state in which the light source apparatus 1 of this embodiment is mounted on the wiring board 42 of the equipment main body. ここで、基板3の下面と絶縁部材4の下面とが略面一になるよう各部の寸法関係が設定されており、基板3を配線基板42上に載置すると、絶縁部材4に設けた接続端子8fが配線基板42に設けた配線パターン43に電気的に接続されるので、配線基板42からLEDチップ2に給電することができる。 Here, when the lower surface of the lower surface and the insulating member 4 of the substrate 3 is set the dimensional relationship of each portion so as to be substantially flush, placing the substrate 3 on the wiring board 42, provided in the insulating member 4 connected since terminal 8f are electrically connected to the wiring pattern 43 provided on the wiring board 42 can be powered from the wiring board 42 to LED chips 2. したがって、この光源装置1を配線基板42に取り付けるにあたり、光源装置1を配線基板42のパターン面にそのまま実装することができ、しかも基板3の下面が配線基板42と接触するので、光源装置1の放熱を配線基板42を通じて放出することができ、放熱性の良好な表面実装形の光源装置1を実現できる。 Therefore, when mounting the light source device 1 to the wiring board 42, the light source device 1 can be directly mounted on the pattern surface of the wiring board 42, and since the lower surface of the substrate 3 is in contact with the wiring board 42, the light source device 1 can release heat dissipation through the wiring board 42, it can be realized the light source device 1 a good surface mount of heat dissipation.
【0104】 [0104]
なお、本実施形態では基板3にLEDチップ2を1個だけ実装しているが、基板3に複数のLEDチップ2を実装しても良いことは言うまでもない。 Although this embodiment implements only one of the LED chips 2 on the substrate 3, it is needless to say that the substrate 3 may be mounted a plurality of LED chips 2.
【0105】 [0105]
(実施形態18 (Embodiment 18)
本発明の実施形態18を図19を参照して説明する。 The embodiment 18 of the present invention will be described with reference to FIG. 19. 実施形態の光源装置1では基板3の一面のみにLEDチップ2を実装しているが、本実施形態の光源装置1では基板3の両面にLEDチップ2を実装している。 While implementing the LED chip 2 only on one side of the light source device 1, the substrate 3 of the embodiment 2, and mounting the LED chip 2 on both sides of the light source device 1, the substrate 3 of the present embodiment. 尚、基板3の両面にLEDチップ2を実装している点以外は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明は省略する。 Since except that implement LED chip 2 on both sides of the substrate 3 is the same as in Embodiment 2, the same components are denoted by the same reference numerals, and a description thereof will be omitted.
【0106】 [0106]
この光源装置1では、基板3の両面に各2個の突台部11を突設している。 In the light source device 1, and projecting the respective two support block 11 on both sides of the substrate 3. 絶縁部材4における基板3の突台部11に対応する部位には、基板3と反対側の面に開放された凹所5'が形成されており、凹所5'の底には絶縁部材4を貫通する貫通孔6が形成されている。 The portion corresponding to the support block 11 of the substrate 3 in the insulating member 4, the substrate 3 and is open on the opposite side the recess 5 'is formed, the recess 5' in the bottom of the insulating member 4 through holes 6 are formed to penetrate the. ここで、貫通孔6の孔径は約1mmであり、突台部11の外径と略同じになっている。 Here, the diameter of the through hole 6 is about 1 mm, are substantially the same as the outer diameter of the support block 11. また凹所5'の底面の内径は約2mmであり、凹所5'の側壁は基板3側から遠ざかるにしたがって内径が大きくなり、約45度の角度で傾斜するような断面形状に形成されている。 The recess 5 'inner diameter of the bottom surface of about 2 mm, the recess 5' side walls of the inner diameter increases with increasing distance from the substrate 3 side, are formed in the cross-sectional shape as to be inclined at an angle of approximately 45 degrees there.
【0107】 [0107]
ここで、基板3及び絶縁部材4,4は貫通孔6と突台部11とを嵌合させた状態で接合されており、貫通孔6から露出する突台部11の部位には厚さが約0.2mmのLEDチップ2が、銀ペーストのようなダイボンディングペースト7を用いてダイボンドされている。 Here, the substrate 3 and the insulating members 4 are joined in a state where the fitting the through hole 6 and the support block 11, part thickness to of the support block 11 which is exposed from the through hole 6 LED chip 2 of about 0.2mm, using a die bonding paste 7 such as silver paste are die-bonded. また絶縁部材4における基板3と反対側の面には、銅などの導電材料からなる配線パターン8が形成され、その表面には金めっきを施してある。 Also in the surface opposite to the substrate 3 in the insulating member 4, is formed a wiring pattern 8 made of a conductive material such as copper, on the surface are plated with gold. 配線パターン8は凹所5'の側壁及び底面まで延設されており、凹所5'の底面を構成する張出部4aに形成された配線パターン8とLEDチップ2の上面に形成された電極との間は、例えば金のような金属細線からなるボンディングワイヤ9を介して電気的に接続されている。 'Side walls and provided so as to extend to the bottom surface, the recess 5 of the' formed on the bottom surface an upper surface of the wiring pattern 8 formed on the overhanging portion 4a constituting the LED chip 2 to the electrode wiring pattern 8 recesses 5 between are electrically connected via a bonding wire 9 made of a thin metal wire such as gold.
【0108】 [0108]
上述のように、本実施形態の光源装置1では、絶縁部材4とLEDチップ2と配線パターン8と封止樹脂10とが基板3の両面に設けられているので、LEDチップ2の発光を基板3の両面に放射させることができる。 As described above, in the light source apparatus 1 of this embodiment, since the insulating member 4 and the LED chip 2 and the wiring pattern 8 and the sealing resin 10 is provided on both surfaces of the substrate 3, the substrate and the light emitting of the LED chip 2 it can be emitted on both sides of the 3. また、基板3の両面に同じ部品が配置されているので、基板3の反りを抑制することもできる。 Further, since the same parts on both sides of a substrate 3 is placed, it is also possible to suppress the warp of the substrate 3.
【0109】 [0109]
(実施形態19 (Embodiment 19)
以下に、本実施形態の光源装置1の製造方法を図20(a)〜(e)を参照して説明する。 Hereinafter, a method for manufacturing the light source apparatus 1 of this embodiment with reference to FIG. 20 (a) ~ (e). 尚、本実施形態の光源装置1の構造は実施形態と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。 Since the structure of the light source apparatus 1 of this embodiment is similar to that of Embodiment 2, the same components are denoted by the same reference numerals, and description thereof is omitted.
【0110】 [0110]
絶縁部材4として例えば液晶ポリマー、ポリフタルアミド、ポリフタルサルフォン、エポキシ、シンジオタクチックポリスチレン(以下SPSと記す)、ポリブチレンテレフタレート(以下PBTと記す)などの絶縁材料から形成されたMID(Molded Interconnect Device)を用いており、射出成形或いはトランスファー成形によって凹所5'及び貫通孔6を形成している(図20(a)参照)。 The insulating member 4 and to for example, a liquid crystal polymer, polyphthalamide, polyphthalamide sulfone, epoxy, (hereinafter referred to as SPS) syndiotactic polystyrene, (hereinafter referred to as PBT) polybutylene terephthalate MID formed of an insulating material such as (Molded Interconnect Device) is used to form a recess 5 'and the through-hole 6 by injection molding or transfer molding reference (FIG. 20 (a)). そして、絶縁部材4の表面全体に、真空蒸着、DCスパッタリング法、或いは、RFスパッタリング法を用いて膜厚が例えば0.3μmの銅薄膜を形成する。 Then, the entire surface of the insulating member 4, vacuum deposition, DC sputtering, or film thickness is formed, for example, 0.3μm thin copper film by RF sputtering. 次に、銅薄膜を形成した基板3の表面にレーザ等の電磁波を照射して、電磁波を照射した部分のめっき下地層を除去する。 Next, the surface of the substrate 3 to form a copper thin film by irradiating an electromagnetic wave such as laser to remove the plating seed layer of the irradiated portion of the electromagnetic wave. 尚、この時照射するレーザとしては、第2或いは第3高調波YAGレーザ、YAGレーザなどめっき下地材の吸収が良いものが好ましく、例えばガルバノミラーで走査することによって、回路部(配線パターン8)以外の絶縁スペースとなる部位(以下、非回路部と言う)に照射されるものであり、少なくとも非回路部における回路部との境界部分に非回路部のパターンに沿って照射することにより、非回路部における回路部との境界領域のめっき下地層を除去するものである。 As the laser to be irradiated at this time, the second or third harmonic YAG laser is preferably one absorption good YAG laser plating base material by scanning by the galvanometer mirror for example, the circuit portion (the wiring pattern 8) site as an insulating space than is intended to be irradiated (hereinafter referred to as non-circuit portion), by irradiating along the pattern of the non-circuit portion at the boundary between the circuit portion in at least the non-circuit portion, the non it is intended to remove the plating seed layer of the boundary region between the circuit section in the circuit section. その後、回路部に給電して、電気銅めっき、電気ニッケルめっき、電気銀めっきなどを行い、所定の膜厚の金属膜を形成した配線パターン8を形成した後、非回路部をソフトエッチングなどで除去する(図20(b)参照)。 Then feeding the circuit, electrolytic copper plating, electrolytic nickel plating is performed and electric silver plating, after forming the wiring pattern 8 forming a predetermined film thickness of the metal film, the non-circuit portion soft etching, etc. removed (see FIG. 20 (b)). 尚、電気銀めっきの代わりに電気金めっきを施しても良く、光の反射効率や配線作業性を考慮してめっきの材料や厚みを適宜決定すれば良い。 Incidentally, may be subjected to electrical gold plating instead of electric silver plating, the plating material and thickness may be suitably determined in consideration of the reflection efficiency and wiring work of the light.
【0111】 [0111]
次に、アルミニウム、銀、銅など熱伝導性の良好な材料から形成された基板3を、エポキシ樹脂やアクリル樹脂などの接着剤を用いて、絶縁部材4の下面に貼り付ける(図20(c)参照)。 Next, aluminum, silver, copper substrate 3 formed of a material having good thermal conductivity such as, by using an adhesive such as an epoxy resin or an acrylic resin, pasted on the lower surface of the insulating member 4 (FIG. 20 (c )reference). この時、絶縁部材4の貫通孔6に対応する基板3の部位に予め突台部11を形成しておくのが望ましい。 At this time, the idea to form a support block 11 in advance in the portion of the substrate 3 corresponding to the through hole 6 of the insulating member 4 desirable. また、接着剤を用い基板3及び絶縁部材4を貼り合わせる代わりに、突台部11を貫通孔6に圧入することによって、基板3及び絶縁部材4を結合するようにしても良い。 Further, instead of attaching the substrate 3 and the insulating member 4 with an adhesive, by forcing support block 11 to the through hole 6 may be bonded to the substrate 3 and the insulating member 4.
【0112】 [0112]
その後、絶縁部材4に設けた貫通孔6から露出する基板3の部位に、青色LEDチップ2を透光性を有する接着剤を用いてダイボンドし、直径が例えば25μmの金のボンディングワイヤ9を用いてワイヤボンディングを行う(図20(d)参照)。 Thereafter, the portion of the substrate 3 exposed from the through hole 6 provided in the insulating member 4, die-bonded using an adhesive having a light-transmitting blue LED chip 2 using a bonding wire 9 of gold diameter eg 25μm wire bonding Te (see FIG. 20 (d)).
【0113】 [0113]
最後に、LEDチップ2の青色発光により励起され補色である黄色発光を行う蛍光体粒子を樹脂中に分散させた封止樹脂10'を凹所5'に注入して、LEDチップ2やボンディングワイヤ9を封止する(図20(e)参照)。 Finally, the phosphor particles to perform yellow light and the complementary color is excited by the blue emission of the LED chip 2 'with a recess 5' sealing resin 10 dispersed in a resin is injected into, the LED chip 2 and the bonding wires 9 is sealed (see FIG. 20 (e)).
【0114】 [0114]
従来の光源装置では絶縁部材に切削加工を施してLEDチップ2の実装部位を形成しているため、加工費用が高く、しかもLEDチップ2の実装部位に切削傷ができるなどして面粗度が粗くなるため、LEDチップ2のボンディング作業がやりにくいという問題があるが、本実施形態では、上述のように基板3と絶縁部材4とを接合し、絶縁部材4の貫通孔6から露出する基板3の部位にLEDチップ2を実装しているので、加工費用を低減でき、またLEDチップ2の実装部位が平坦であり、且つ、絶縁部材4がMIDにより構成されているから、ボンディングワイヤ9が接続されるパッド面が平坦で平面度が良く、LEDチップ2を容易に実装できる。 Since the conventional light source device forms a mounting region of the LED chip 2 is subjected to cutting in the insulating member, the processing cost is high and the surface roughness and the like can cut scratches on the mounting portion of the LED chip 2 to become rough, there is a problem that awkward bonding operation of the LED chip 2 is, in this embodiment, bonded to the substrate 3 and the insulating member 4 as described above, is exposed from the through hole 6 of the insulating member 4 substrate since implements the LED chip 2 to 3 parts, machining costs can be reduced, also mounting region of the LED chip 2 is flat, and, because the insulating member 4 is constituted by a MID, the bonding wire 9 pad surface to be connected well flat flatness, the LED chip 2 can be easily implemented. また、ボンディングワイヤ9は凹所5'内に納められるので、凹所5'内に充填した封止樹脂10'からボンディングワイヤ9がはみ出ることはなく、ボンディングワイヤ9が断線する確率が少なくなり、信頼性が向上する。 The bonding wires 9 'because it is accommodated in the recesses 5' recess 5 never bonding wire 9 protrudes from the sealing resin 10 'filled in the, the less probability of the bonding wires 9 are disconnected, reliability is improved.
【0115】 [0115]
(実施形態20 (Embodiment 20)
以下に、本実施形態の光源装置の製造方法を図21(a)〜(d)を参照して説明する。 Hereinafter, a method for manufacturing the light source apparatus of the present embodiment with reference to FIG. 21 (a) ~ (d). 尚、本実施形態の光源装置1の構造は実施形態の光源装置と同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。 Since the structure of the light source apparatus 1 of this embodiment is the same as the light source apparatus of Embodiment 2, the same components are denoted by the same reference numerals, and description thereof is omitted.
【0116】 [0116]
絶縁部材4として例えば液晶ポリマー、ポリフタルアミド、ポリフタルサルフォン、エポキシ、SPS、PBTなどの絶縁材料から形成されたMIDを用いている。 The insulating member 4 and to for example, a liquid crystal polymer, polyphthalamide, polyphthalamide sulfone, epoxy, SPS, are used MID formed of an insulating material such as PBT. また、基板3の材料として銀、アルミ、銅などの熱伝導性の良好な材料を用い、基板3と絶縁部材4とをインサート成形により同時に形成する(図21(a)参照)。 Further, silver as the material of the substrate 3, using aluminum, a good heat conductivity material such as copper, the substrate 3 and the insulating member 4 are simultaneously formed by insert molding (see FIG. 21 (a)).
【0117】 [0117]
その後、絶縁部材4の表面全体に、真空蒸着、DCスパッタリング法、或いは、RFスパッタリング法を用いて膜厚が例えば0.3μmの銅薄膜を形成する。 Thereafter, the entire surface of the insulating member 4, vacuum deposition, DC sputtering, or film thickness is formed, for example, 0.3μm thin copper film by RF sputtering. 次に、銅薄膜を形成した基板3の表面にレーザ等の電磁波を照射して、電磁波を照射した部分のめっき下地層を除去する。 Next, the surface of the substrate 3 to form a copper thin film by irradiating an electromagnetic wave such as laser to remove the plating seed layer of the irradiated portion of the electromagnetic wave. 尚、この時照射するレーザとしては、第2或いは第3高調波YAGレーザ、YAGレーザなどめっき下地材の吸収が良いものが好ましく、例えばガルバノミラーで走査することによって、回路部(配線パターン8)以外の絶縁スペースとなる部位(以下、非回路部と言う)に照射されるものであり、少なくとも非回路部における回路部との境界部分に非回路部のパターンに沿って照射することにより、非回路部における回路部との境界領域のめっき下地層を除去するものである。 As the laser to be irradiated at this time, the second or third harmonic YAG laser is preferably one absorption good YAG laser plating base material by scanning by the galvanometer mirror for example, the circuit portion (the wiring pattern 8) site as an insulating space than is intended to be irradiated (hereinafter referred to as non-circuit portion), by irradiating along the pattern of the non-circuit portion at the boundary between the circuit portion in at least the non-circuit portion, the non it is intended to remove the plating seed layer of the boundary region between the circuit section in the circuit section. その後、回路部に給電して、電気銅めっき、電気ニッケルめっき、電気銀めっきなどを行い、所定の膜厚の金属膜を形成した配線パターン8を形成した後、非回路部をソフトエッチングなどで除去する(図21(b)参照)。 Then feeding the circuit, electrolytic copper plating, electrolytic nickel plating is performed and electric silver plating, after forming the wiring pattern 8 forming a predetermined film thickness of the metal film, the non-circuit portion soft etching, etc. removed (see FIG. 21 (b)). 尚、電気銀めっきの代わりに電気金めっきを施しても良く、光の反射効率や配線作業性を考慮してめっきの材料や厚みを適宜決定すれば良い。 Incidentally, may be subjected to electrical gold plating instead of electric silver plating, the plating material and thickness may be suitably determined in consideration of the reflection efficiency and wiring work of the light.
【0118】 [0118]
その後、絶縁部材4に設けた貫通孔6から露出する基板3の部位に、青色LEDチップ2を透光性を有する接着剤を用いてダイボンドし、直径が例えば25μmの金のボンディングワイヤ9を用いてワイヤボンディングを行う(図21(c)参照)。 Thereafter, the portion of the substrate 3 exposed from the through hole 6 provided in the insulating member 4, die-bonded using an adhesive having a light-transmitting blue LED chip 2 using a bonding wire 9 of gold diameter eg 25μm wire bonding Te (see FIG. 21 (c)).
【0119】 [0119]
最後に、LEDチップ2の青色発光により励起され補色である黄色発光を行う蛍光体粒子を樹脂中に分散させた封止樹脂10'を凹所5'に注入して、LEDチップ2やボンディングワイヤ9を封止する(図21(d)参照)。 Finally, the phosphor particles to perform yellow light and the complementary color is excited by the blue emission of the LED chip 2 'with a recess 5' sealing resin 10 dispersed in a resin is injected into, the LED chip 2 and the bonding wires 9 is sealed (see FIG. 21 (d)).
【0120】 [0120]
ところで、従来の光源装置では絶縁部材に切削加工を施してLEDチップ2の実装部位を形成しているため、加工費用が高く、しかもLEDチップ2の実装部位に切削傷ができるなどして面粗度が粗くなるため、LEDチップ2のボンディング作業がやりにくいという問題があるが、本実施形態では、上述のように基板3と絶縁部材4とをインサート成形し、絶縁部材4の貫通孔6から露出する基板3の部位にLEDチップ2を実装しているので、LEDチップ2が実装される基板3の部位が平坦であり、且つ、絶縁部材4をMIDにより構成しているので、ボンディングワイヤ9が接続されるパッド面が平坦で平面度が良く、LEDチップ2を容易に実装できる。 Incidentally, in the conventional light source device for forming the mounting region of the LED chip 2 is subjected to cutting in the insulating member, the processing cost is high and to such can cut scratches on the mounting portion of the LED chip 2 roughness since degree becomes rough, there is a problem that awkward bonding operation of the LED chip 2 is, in this embodiment, the substrate 3 and the insulating member 4 by insert molding as described above, the through hole 6 of the insulating member 4 since implements the LED chip 2 to the portion of the substrate 3 exposed, portions of the substrate 3 on which the LED chip 2 is mounted is flat, and, since the insulating member 4 is constituted by a MID, the bonding wire 9 There pad surface to be connected well flat flatness, the LED chip 2 can be easily implemented. また、ボンディングワイヤ9は凹所5'内に納められるので、凹所5'内に充填した封止樹脂10'からボンディングワイヤ9がはみ出ることはなく、ボンディングワイヤ9が断線する確率が少なくなり、信頼性が向上する。 The bonding wires 9 'because it is accommodated in the recesses 5' recess 5 never bonding wire 9 protrudes from the sealing resin 10 'filled in the, the less probability of the bonding wires 9 are disconnected, reliability is improved. また、基板3と絶縁部材4とをインサート成形により形成しているので、基板3及び絶縁部材4を接合する工程を無くすことができ、製造コストを低減できる。 Further, since the substrate 3 and the insulating member 4 is formed by insert molding, it is possible to eliminate the step of bonding the substrate 3 and the insulating member 4, the manufacturing cost can be reduced.
【0121】 [0121]
(実施形態21 (Embodiment 21)
以下に、本実施形態の光源装置の製造方法を図22(a)〜(e)を参照して説明する。 Hereinafter, a method for manufacturing the light source apparatus of the present embodiment with reference to FIG. 22 (a) ~ (e). 尚、本実施形態の光源装置1の構造は実施形態の光源装置と略同様であるので、同一の構成要素には同一の符号を付して、その説明を省略する。 Since the structure of the light source apparatus 1 of this embodiment is substantially the same as the light source apparatus of Embodiment 2, the same components are denoted by the same reference numerals, and description thereof is omitted.
【0122】 [0122]
先ず厚みが約1mmのリードフレーム20aを打ち抜いて、曲げ等の形状を形成することにより、突台部11の突設された基板3を形成すると共に、厚みが約0.2mmのリードフレーム20bを打ち抜いて、曲げ等の形状を形成することにより、突台部11を挿通させる挿通孔8aが形成された配線部8'を形成している(図22(a)参照)。 First punched leadframe 20a having a thickness of about 1 mm, by forming the shape such as bending, to form a projecting from the substrate 3 of the support block 11, the lead frame 20b having a thickness of approximately 0.2mm punched, by forming a shape such as bending, to form a support block 11 wiring section 8 through hole 8a is formed for inserting the '(see FIG. 22 (a)). 尚、リードフレーム20a,20bの材料としては、例えば銅、42アロイなど導電性、熱伝導性の優れた材料を用いている。 Incidentally, the lead frame 20a, as the material of 20b, for example, copper, conductive such as 42 alloy is used a thermally conductive material excellent in.
【0123】 [0123]
そして、LEDチップ2がダイボンドされる突台部11と、ボンディングワイヤ9の接続される配線部8'の部位に部分的に電気ニッケルめっき、電気銀めっきを行う。 Then, the a support block 11 on which the LED chip 2 is die-bonded, site partially electric nickel plating wiring section 8 connected thereto bonding wires 9 ', the electric silver plating. 尚、ボンディングワイヤ9が接続されるワイヤパッド部8bは、電気銀めっきの代わりに電気金めっきを施しても良く、ボンディングワイヤ9の接続作業を容易に行える(図22(b)参照)。 The wire pad portion 8b where the bonding wires 9 are connected may be subjected to electrical gold plating instead of electric silver plating, facilitates the work of connecting the bonding wires 9 (see FIG. 22 (b)).
【0124】 [0124]
次に、MIDの材料として液晶ポリマー、ポリフタルアミド、ポリフタルサルフォン、エポキシ、SPS、PBTなどの絶縁性を有する材料を用い、部分めっきの施された配線部8'と基板3とをインサート成形により同時成形する(図22(c)参照)。 Next, a liquid crystal polymer as the material of the MID, polyphthalamide, polyphthalamide sulfone, epoxy, SPS, using an insulating material such as PBT, insert the partial plating of decorated with wiring section 8 'and the substrate 3 molding simultaneously molded (see FIG. 22 (c)). この時、MIDからなる絶縁部材4に形成された凹所5'の底面に、基板3の突台部11と配線部8'のワイヤパッド部8bとが露出する。 At this time, 'on the bottom surface of the support block 11 of the substrate 3 wiring section 8' recesses formed in the insulating member 4 made of MID 5 and the wire pad portion 8b of exposed.
【0125】 [0125]
その後、基板3の突台部11に青色LEDチップ2を透光性を有する接着剤を用いてダイボンドし、直径が例えば25μmの金のボンディングワイヤ9を用いてワイヤボンディングを行う(図22(d)参照)。 Then, die bonding using an adhesive having a light-transmitting blue LED chip 2 to the support block 11 of the substrate 3, wire bonding using bonding wires 9 gold diameter for example 25 [mu] m (FIG. 22 (d )reference).
【0126】 [0126]
最後に、LEDチップ2の青色発光により励起され補色である黄色発光を行う蛍光体粒子を樹脂中に分散させた封止樹脂10'を凹所5'に注入して、LEDチップ2やボンディングワイヤ9を封止する(図22(e)参照)。 Finally, the phosphor particles to perform yellow light and the complementary color is excited by the blue emission of the LED chip 2 'with a recess 5' sealing resin 10 dispersed in a resin is injected into, the LED chip 2 and the bonding wires 9 is sealed (see FIG. 22 (e)).
【0127】 [0127]
ところで、従来の光源装置では絶縁部材に切削加工を施してLEDチップ2の実装部位を形成しているため、加工費用が高く、しかもLEDチップ2の実装部位に切削傷ができるなどして面粗度が粗くなるため、LEDチップ2のボンディング作業がやりにくいという問題があるが、本実施形態では、上述のように基板3と絶縁部材4とをインサート成形し、絶縁部材4に設けた凹所5'内に露出する基板3の部位にLEDチップ2を実装しているので、LEDチップ2の実装部位が平坦であり、且つ、絶縁部材4がMIDにより構成されているから、ボンディングワイヤ9が接続されるパッド面が平坦で平面度が良く、LEDチップ2を容易に実装できる。 Incidentally, in the conventional light source device for forming the mounting region of the LED chip 2 is subjected to cutting in the insulating member, the processing cost is high and to such can cut scratches on the mounting portion of the LED chip 2 roughness since degree becomes rough, there is a problem that awkward bonding operation of the LED chip 2 is, in this embodiment, the substrate 3 and the insulating member 4 by insert molding as described above, provided in the insulating member 4 recess since the portion of the substrate 3 exposed in the 5 'implements the LED chip 2, mounting portions of the LED chip 2 is flat, and, because the insulating member 4 is constituted by a MID, the bonding wire 9 pad surface to be connected well flat flatness, the LED chip 2 can be easily implemented. また、ボンディングワイヤ9は凹所5'内に納められるので、凹所5'内に充填した封止樹脂10'からボンディングワイヤ9がはみ出ることはなく、ボンディングワイヤ9が断線する確率が少なくなり、信頼性が向上する。 The bonding wires 9 'because it is accommodated in the recesses 5' recess 5 never bonding wire 9 protrudes from the sealing resin 10 'filled in the, the less probability of the bonding wires 9 are disconnected, reliability is improved. また、基板3と絶縁部材4とをインサート成形により形成しているので、基板3及び絶縁部材4を接合する工程を無くすことができ、製造コストを低減できる。 Further, since the substrate 3 and the insulating member 4 is formed by insert molding, it is possible to eliminate the step of bonding the substrate 3 and the insulating member 4, the manufacturing cost can be reduced.
【0128】 [0128]
(実施形態22 (Embodiment 22)
以下に、本実施形態の光源装置の製造方法を図23(a)〜(f)を参照して説明する。 Hereinafter, a method for manufacturing the light source apparatus of the present embodiment with reference to FIG. 23 (a) ~ (f). 尚、本実施形態の光源装置の構造は実施形態の光源装置と同様であるので、同一の構成要素には同一の符号を付してその説明を省略する。 The structure of the light source device of this embodiment is the same as the light source device of Embodiment 5, the same components will not be described with the same reference numerals.
【0129】 [0129]
絶縁部材4として例えば液晶ポリマー、ポリフタルアミド、ポリフタルサルフォン、エポキシ、SPS、PBTなどの絶縁材料から形成されたMIDを用いている。 The insulating member 4 and to for example, a liquid crystal polymer, polyphthalamide, polyphthalamide sulfone, epoxy, SPS, are used MID formed of an insulating material such as PBT. また、ベース板3'の材料として銀、アルミ、銅などの熱伝導性の良好な材料を用い、ベース板3'と絶縁部材4とをインサート成形により同時に形成する(図23(a)参照)。 Also, 'silver, aluminum, a good heat conductivity material such as copper used as the material of the base plate 3' the base plate 3 and the insulating member 4 are simultaneously formed by insert molding (FIG. 23 (a) see) .
【0130】 [0130]
その後、絶縁部材4の表面全体に、真空蒸着、DCスパッタリング法、或いは、RFスパッタリング法を用いて膜厚が例えば0.3μmの銅薄膜を形成する。 Thereafter, the entire surface of the insulating member 4, vacuum deposition, DC sputtering, or film thickness is formed, for example, 0.3μm thin copper film by RF sputtering. 次に、銅薄膜を形成したベース板3'の表面にレーザ等の電磁波を照射して、電磁波を照射した部分のめっき下地層を除去する。 Next, by irradiating the surface of the formed copper thin film base plate 3 'the electromagnetic wave such as laser to remove the plating seed layer of the irradiated portion of the electromagnetic wave. 尚、この時照射するレーザとしては、第2或いは第3高調波YAGレーザ、YAGレーザなどめっき下地材の吸収が良いものが好ましく、例えばガルバノミラーで走査することによって、回路部(配線パターン8)以外の絶縁スペースとなる部位(以下、非回路部と言う)に照射されるものであり、少なくとも非回路部における回路部との境界部分に非回路部のパターンに沿って照射することにより、非回路部における回路部との境界領域のめっき下地層を除去するものである。 As the laser to be irradiated at this time, the second or third harmonic YAG laser is preferably one absorption good YAG laser plating base material by scanning by the galvanometer mirror for example, the circuit portion (the wiring pattern 8) site as an insulating space than is intended to be irradiated (hereinafter referred to as non-circuit portion), by irradiating along the pattern of the non-circuit portion at the boundary between the circuit portion in at least the non-circuit portion, the non it is intended to remove the plating seed layer of the boundary region between the circuit section in the circuit section. その後、回路部に給電して、電気銅めっき、電気ニッケルめっき、電気銀めっきなどを行い、所定の膜厚の金属膜を形成した配線パターン8を形成した後、非回路部をソフトエッチングなどで除去する(図23(b)参照)。 Then feeding the circuit, electrolytic copper plating, electrolytic nickel plating is performed and electric silver plating, after forming the wiring pattern 8 forming a predetermined film thickness of the metal film, the non-circuit portion soft etching, etc. removed (see FIG. 23 (b)). 尚、電気銀めっきの代わりに電気金めっきを施しても良く、光の反射効率や配線作業性を考慮してめっきの材料や厚みを適宜決定すれば良い。 Incidentally, may be subjected to electrical gold plating instead of electric silver plating, the plating material and thickness may be suitably determined in consideration of the reflection efficiency and wiring work of the light.
【0131】 [0131]
次に、アルミニウムや銅などの熱伝導性の良好な金属から柱状(角柱又は円柱)の熱伝導体14を形成し、熱伝導体14の上面にLEDチップ2を透光性を有するボンディングペーストを用いてダイボンドした後(図24(c)参照)、ベース板3'及び絶縁部材4にそれぞれ形成された連通孔13及び貫通孔6内にベース板3'側からLEDチップ2の実装された熱伝導体14を圧入する(図24(d)参照)。 Then, the heat conductor 14 of the columnar from good thermal conductivity metal such as aluminum or copper (prismatic or cylindrical) form, the bonding paste with a light-transmitting property of the LED chip 2 to the upper surface of the heat conductor 14 after die bonding using (see FIG. 24 (c)), the base plate 3 mounted thermal of the LED chip 2 from the side 'and the base plate 3 into the communicating hole 13 and the through holes 6 formed respectively in the insulating member 4' press fitting the conductor 14 (see FIG. 24 (d)). この時、熱伝導体14はベース板3'に設けた連通孔13内に圧入されているので、熱伝導体14とベース板3'とが密着し、熱伝導体14とベース板3'との間の熱伝導が大きくなる。 At this time, 'because it is pressed into the communicating hole 13 provided in the heat conductive member 14 and the base plate 3' the heat conductor 14 is the base plate 3 and is in close contact, the heat conductor 14 and the base plate 3 ' heat conduction is increased between.
【0132】 [0132]
その後、LEDチップ2上面の電極と配線パターン8との間を、直径が例えば25μmの金のボンディングワイヤ9を介して接続し(図23(e)参照)、LEDチップ2の青色発光により励起され補色である黄色発光を行う蛍光体粒子を樹脂中に分散させた封止樹脂10'を凹所5'に注入して、LEDチップ2やボンディングワイヤ9を封止する(図23(f)参照)。 Thereafter, the space between the LED chip 2 the upper surface of the electrode and the wiring pattern 8, (see FIG. 23 (e)) connected via a bonding wire 9 of gold diameter for example 25 [mu] m, it is excited by the blue emission of the LED chip 2 the phosphor particles that performs yellow light and the complementary color is injected 'a recess 5' sealing resin 10 dispersed in a resin to the LED chip 2 and the bonding wires 9 to seal (Fig. 23 (f) see ).
【0133】 [0133]
本実施形態では上述の製造方法を用いて光源装置1を製造しており、熱伝導体14にLEDチップ2を予め実装しているので、LEDチップ2のダイボンドされる熱伝導体14の部位を平坦にし、且つ平面度を良くできるので、LEDチップ2を容易に実装することができる。 It manufactures light source device 1 by a manufacturing method as described above in the present embodiment, since the thermal conductor 14 in advance mounting the LED chip 2, a portion of the thermal conductor 14 to be die-bonded LED chips 2 made flat, so and can improve the flatness, the LED chip 2 can be easily implemented. また、LEDチップ2が実装される突台部11を、熱伝導体14をベース板3'に設けた連通孔13内に圧入することにより形成しているので、突台部11を切削加工により形成する場合に比べて、加工費用を低減できる。 Further, the support block 11 on which the LED chip 2 is mounted, since the formed by press-fitting the heat conductor 14 into the communicating hole 13 provided in the base plate 3 ', by cutting the support block 11 as compared with the case of forming it can be reduced machining costs.
【0134】 [0134]
尚、上述した各実施形態において各部の寸法を説明しているが、各部の寸法を上記の寸法に限定する趣旨のものではなく、各部の寸法は適宜設定すれば良い。 Although not described the dimensions of each part in each of the embodiments described above, the dimensions of the respective parts not intended to limit the dimensions of the above, the size of each part may be appropriately set.
【0135】 [0135]
【発明の効果】 【Effect of the invention】
上述のように、請求項1の発明は、熱伝導性を有する基板と、基板の少なくとも一方の面に配設された絶縁部材と、基板と対向する絶縁部材の部位に絶縁部材を貫通して設けられた孔と、この孔から露出する基板の部位に対向させ且つ熱結合させて配置されたLEDチップと、絶縁部材に設けられ絶縁部材によって基板と電気的に絶縁された配線部を含む給電部と、給電部とLEDチップの電極との間を電気的に接続する接続部材と、孔内に充填されLEDチップ及び接続部材の全体を封止する透光性を有する封止材料とを備え、絶縁部材に設けた孔の基板側の開口縁に内側に突出する張出部を設け、この張出部に配線部の少なくとも一部を配置し、張出部に配置された配線部の部位にLEDチップの電極を電気的に接続しており、絶縁部材 As mentioned above, the invention of claim 1, a substrate having a thermal conductivity, an insulating member disposed on at least one surface of the substrate, through the insulating member to the portion of the substrate opposite to the insulating member feed containing a hole provided, the LED chips disposed opposite to and thermally coupled to the portion of the substrate exposed from the hole, the substrate and electrically insulated wire section by an insulating member provided in the insulating member It includes parts and a connecting member for electrically connecting between the feeding portion and the LED chips of the electrode, and a sealing material having a light-permeable sealing the entire LED chip and the connecting member is filled in the hole the overhang portion protruding inwardly on the substrate side of the opening edge of the hole provided in the insulating member is provided, the site of at least a portion arranged, the wiring portion disposed in overhanging portion of the wiring portion on the projecting portion electrically connects the electrodes of the LED chip, the insulating member に突出し絶縁部材に設けた孔内に挿入される突台部を基板に設け、この突台部にLEDチップを対向させ且つ熱結合させて配置したことを特徴とし、LEDチップは絶縁部材に設けた孔から露出する基板の部位に対向させ且つ熱結合させて配置されているので、熱伝導性を有する基板を介してLEDチップの発熱を放出することができ、放熱性を向上させた光源装置を実現できる。 To provide a support block which is inserted into the provided holes of the projecting insulating member to the substrate, characterized in that a LED chip by so and thermally coupled opposed to the support block, the LED chip is provided in the insulating member and since it is arranged site allowed and thermally bonded is opposed to the substrate to be exposed from the hole, it is possible to release the heat generated by the LED chip through the substrate having thermal conductivity, a light source device having improved heat dissipation It can be realized. したがって、LEDチップの温度上昇が抑制され、温度上昇による発光効率の低下を防止することができるという効果がある。 Therefore, the temperature rise of the LED chips is suppressed, there is an effect that it is possible to prevent a decrease in luminous efficiency due to temperature rise. しかもLEDチップの温度上昇が低減されるから、より大きな順方向電流をLEDチップに印加して、LEDチップの光出力を増大させることもでき、またLEDチップや封止材料の熱的な劣化が低減され、長寿命化が図れるという効果もある。 Moreover since the temperature rise of the LED chips is reduced, a larger forward current is applied to the LED chip, it can also increase the light output of the LED chip, and the thermal degradation of the LED chip and sealing material is reduced, there is also an effect that a long life can be achieved. さらに、孔内に充填された封止材料によってLEDチップ及び接続部材の全体を封止しており、LEDチップと給電部とを電気的に接続する接続部材として金属線を用いた場合にも、樹脂の界面で発生する応力によって金属線が断線する虞はなく、機械的強度が向上するという効果もある。 Furthermore, a completely sealed the LED chip and the connecting member by the sealing material filled in the hole, even in the case of using a metal wire and a LED chip and the power feeding portion as a connection member for electrically connecting, no possibility that the metal wire is broken by the stress generated at the interface of the resin, there is also an effect that the mechanical strength is improved. しかも、基板に突台部を設けることによって、突台部の高さ分だけ張出部の厚み寸法を厚くすることができるから、張出部の加工を容易に行え、且つ、張出部の厚み寸法を厚くすることによって、張出部の剛性を高くし、基板と絶縁部材とを接合する際に張出部と基板との間に隙間ができるのを防止できるという効果がある。 Moreover, by providing the support block to the substrate, because it is possible to increase the thickness dimension of by the height of the overhang portion of the support block, easy to machining of the projecting portion, and, the projecting portion by increasing the thickness dimension, the rigidity of the projecting portion, there is an effect that it is possible to prevent the gap is formed between the protruding portion and the substrate when bonding the substrate and the insulating member.
【0136】 [0136]
請求項の発明は、請求項1の発明において、LEDチップに接続部材を介して電気的に接続される配線部の部位は孔内に配置されており、封止材料は孔の開口付近まで充填されたことを特徴とし、封止材料の表面が孔の開口付近にくるまで封止材料を充填することによって、封止材料の充填量を略一定とすることができ、品質のばらつきを抑制できるという効果がある。 The invention of claim 2 is the invention of claim 1, part of the wiring portion to be electrically connected via a connecting member to the LED chip is disposed within the bore, to the vicinity of the opening of the sealing material hole and characterized in that it is filled, by filling the sealing material to the surface of the sealing material comes to near the opening of the holes, can be made substantially constant filling amount of the sealing material, suppress the variation in quality there is an effect that can be.
【0137】 [0137]
請求項の発明は、請求項の発明において、上記接続部材は金属線からなり、基板及び絶縁部材の接合方向において、金属線の一端が接続されるLEDチップの部位と、金属線の他端が接続される配線部の部位の高さを略同じ高さとしたことを特徴とし、LEDチップと配線部との間を電気的に接続する金属線の長さを短くできるから、金属線の機械的強度を高くでき、またLEDチップと配線部の高さを略同じ高さとすることにより、ボンディング作業を容易に行えるという効果がある。 The invention according to claim 3, characterized in that in the invention of claim 1, said connecting member is made of metal wire, in the joining direction of the substrate and the insulating member, and the site of the LED chip to which one end of the metal line is connected, other metal wire characterized in that the height of the portion of the wire portion having one end connected to the substantially same height, since the space between the LED chip and the wiring portion can shorten the length of the metal wire for electrically connecting the metal wire can increase the mechanical strength, also by a substantially same height as the height of the LED chip and the wiring section, there is an effect that facilitates the bonding operation.
【0138】 [0138]
請求項の発明は、請求項の発明において、基板及び絶縁部材の接合方向において、LEDチップが実装される突台部と、LEDチップに電気的に接続される配線部の部位の高さを略同じ高さとしたことを特徴とし、LEDチップから放射される光が配線部に遮光されることはなく、光のけられを少なくして、光の取り出し効率が向上するという効果がある。 The invention of claim 4 is the invention of claim 1, the substrate and the bonding direction of the insulating member, support block and the height of the portion of the wiring portion electrically connected to the LED chip LED chip is mounted was substantially characterized in that the same height, rather than the light emitted from the LED chip is shielded wiring portion, with less eclipse of light, the light extraction efficiency is advantageously improved.
【0139】 [0139]
請求項の発明は、請求項の発明において、突台部は、基板における絶縁部材と反対側の面から打ち出し加工を行って凹所を形成することにより、基板における絶縁部材側の面に打ち出されたことを特徴とし、打ち出し加工を行うことによって突台部を形成しているので、切削加工により突台部を形成する場合に比べて加工費用を低減できるという効果がある。 The invention of claim 5 is the invention of claim 1, support block by forming a recess by performing the launch processing from the surface opposite to the insulating member in the substrate, the surface of the insulating member side in the substrate characterized in that punched a so forms a support block by performing embossing processing, there is an effect of reducing the processing cost as compared with the case of forming the support block by cutting. また、基板と絶縁部材とを接着剤で貼り合わせた場合、接着剤の熱収縮によって基板全体が絶縁部材側に反ってしまうが、打ち出し加工を行って凹所を形成することにより、基板全体が絶縁部材と反対側に反るので、接着材の熱収縮によって発生する基板の反りを相殺し、全体として基板が反るのを防止できるという効果がある。 Also, when bonding the substrate and the insulating member with an adhesive, the entire substrate by the thermal shrinkage of the adhesive warps the insulating member side, by forming a recess performing embossing processing, the entire substrate since warps on the opposite side of the insulating member, to offset the warpage of the substrate caused by thermal contraction of the adhesive, there is an effect that it prevents the substrate from warping as a whole.
【0140】 [0140]
請求項の発明は、請求項の発明において、基板を、孔に連通する連通孔が形成されたベース板と、連通孔内に取り付けられ先端が絶縁部材側に突出する突起部とで構成し、突起部の先端により突台部を構成したことを特徴とし、ベース板の孔に突起部を挿入し、突起部の先端を絶縁部材側に突出させることによって突台部を形成しているので、突台部を切削加工により形成する場合に比べて、突台部の加工を容易に行えるという効果がある。 The invention of claim 6, configured in the invention of claim 1, the substrate, the base plate communicating hole formed which communicates with the hole, the tip is mounted in the communicating hole and the protruding portion protruding insulating member side and characterized by being configured to support block by the tip of the protrusion, inserting the protrusion into the hole of the base plate to form a support block by projecting the tip of the protrusion on the insulating member side since, in comparison with the case of forming by cutting the support block, there is an effect that facilitates the processing of the support block.
【0141】 [0141]
請求項の発明は、請求項の発明において、孔と突台部との間に隙間を設けたことを特徴とし、基板と絶縁部材とを接着剤で貼り合わせた場合、基板と絶縁部材との接合面から余分な接着剤がはみ出し、はみ出した接着剤によってLEDチップの光が遮光されたり、LEDチップを実装できなくなる虞があるが、はみ出した接着剤は孔と突台部との間に設けた隙間に溜まるので、接着剤が突台部の上面まで這い上がってくることはなく、はみ出した接着剤によってLEDチップの光が遮光されたり、LEDチップを実装できなくなるのを防止できるという効果がある。 The invention of claim 7 is the invention of claim 1, when characterized in that a gap between the hole and the support block, bonding the substrate and the insulating member with an adhesive, substrate and the insulating member excess adhesive is squeezed out from the joint surface between, or the light from the LED chip is shielded by the adhesive protruding, there is a risk that can not be mounting the LED chip, the adhesive protruding between the hole and the support block since it accumulated in a gap provided in, but not the adhesive comes creeps up to the upper surface of the support block, or is light LED chip with an adhesive protruding blackout, that from becoming impossible mounting the LED chip can be prevented effective.
【0142】 [0142]
請求項の発明は、請求項1乃至の発明において、基板と絶縁部材との位置決めを行うための位置決め手段を基板と絶縁部材との接合面に設けたことを特徴とし、位置決め手段により基板と絶縁部材との位置決めを行うことができ、基板と絶縁部材との接合作業を容易に行えるという効果がある。 The invention of claim 8 is the invention of claims 1 to 7, characterized in that a positioning means for positioning the substrate and the insulating member on the junction surface between the substrate and the insulating member, the substrate by the positioning means and it is possible to position the insulating member, there is an effect that the joining operation between the substrate and the insulating member easily.
【0143】 [0143]
請求項の発明は、請求項1乃至の発明において、基板と絶縁部材との接合面に接合に用いる接着剤の溜まり部を絶縁部材の孔の周りに設けたことを特徴とし、基板と絶縁部材とを接着剤で貼り合わせた場合、基板と絶縁部材との接合面から余分な接着剤がはみ出し、はみ出した接着剤によってLEDチップの光が遮光されたり、LEDチップを実装できなくなる虞があるが、接合時に余分な接着剤は溜まり部に溜まるため、接着剤のはみ出しを防止できるという効果がある。 The invention of claim 9 is the invention of claims 1 to 7, characterized in that a reservoir of the adhesive used in the bonding at the interface between the substrate and the insulating member around the hole of the insulating member, and the substrate when bonding the insulating member with an adhesive, substrate and excess adhesive is squeezed out from the joint surface of the insulating member, or the light of the LED chip by the adhesive protruding blackout, it may become impossible to implement LED chip the case, since the accumulated extra adhesive reservoir during bonding, there is an effect that prevents the protrusion of the adhesive. また、基板と絶縁部材との接合面に接着剤が不足している部分があると、この部分にできる隙間から封止材料が漏れ出す虞があるが、余分な接着剤を溜める溜まり部が絶縁部材に設けた孔の周りに設けられ、溜まり部に溜まった余分な接着剤は孔から露出する基板の部位を囲むようにして配置されるので、溜まり部に溜まった接着剤が封止材料をせき止める堰の役割を果たして、封止材料が漏れ出すのを防止できるという効果がある。 Further, when there is a portion where the adhesive is insufficient at the interface between the substrate and the insulating member, there is a risk that leaking sealing material from a gap can in this portion, the reservoir accumulating excess adhesive insulation provided around the hole provided in the member, since the excess adhesive collected in the collecting portion is disposed so as to surround the portion of the substrate exposed from the hole, the adhesive collected in the collecting portion damming the sealing material weir plays a role, there is an effect that it prevents the leakage of the sealing material.
【0144】 [0144]
請求項10の発明は、請求項1の発明において、上記給電部は導電性材料により形成された基板を含み、基板とLEDチップの電極とを電気的に接続したことを特徴とし、基板そのものを給電部としており、LEDチップの一方の電極を基板に接続するとともに、LEDチップの他方の電極を配線部に接続することによって、LEDチップに給電することができるから、絶縁部材の表面に形成する配線部が1回路分で済むという利点がある。 The invention of claim 10 is the invention of claim 1, the feeding unit includes a substrate formed of a conductive material, characterized in that electrically connects the electrode of the substrate and the LED chip, the substrate itself and a power supply unit, the one electrode of the LED chip as well as connected to the substrate, by connecting the other electrode of the LED chip to the wiring portion, since it is possible to supply power to the LED chip are formed on the surface of the insulating member wiring portion has the advantage that requires only one circuit. また、LEDチップに給電するための回路の一部を基板が担っているので、回路を基板側に容易に引き出すことができるという効果がある。 Further, since a part of a circuit for supplying power to the LED chip substrate plays, there is an effect that it is possible to draw easily circuit board side.
【0145】 [0145]
請求項11の発明は、請求項10の発明において、上記基板に、互いに電気的に絶縁された複数の領域を設けたことを特徴としている。 The invention of claim 11 is the invention of claim 10, in the substrate, it is characterized in that a multiple electrically isolated regions with each other. ところで、一枚の基板に複数のLEDチップが実装される場合、一枚の基板が互いに電気的に絶縁された複数の領域に分割されていないと、全てのLEDチップが並列に接続されることになる。 Incidentally, when a plurality of LED chips on one substrate is mounted, the single substrate is not divided into multiple electrically isolated regions with each other, that all the LED chips are connected in parallel become. ここで、LEDチップは個体ごとに駆動電圧が若干異なるため、複数のLEDチップが並列に接続されると、駆動電圧が最も低いLEDチップに多大な電流が流れて、LEDチップが破損する虞がある。 Since LED chip different driving voltages slightly for each individual, the plurality of LED chips are connected in parallel, with considerable current flows to the driving voltage is the lowest LED chip, the fear that the LED chip is damaged is there. そこで、複数のLEDチップに流れる電流を均等にするために、個々のLEDチップ毎に電流制限用の抵抗を直列接続する方法が考えられるが、LEDチップの数だけ電流制限用の抵抗が必要になり、各抵抗で消費される電力ロスが増大する。 Therefore, in order to equalize the current flowing through the plurality of LED chips, the current limiting resistor for each individual LED chips a method of serially connected. However, only the required resistance of the current limiting number of LED chips becomes, the power loss consumed by the resistance increases. それに対して本発明では、基板に、互いに電気的に絶縁された複数の領域を設けており、各領域にそれぞれLEDチップを実装し、各領域に実装されたLEDチップを直列に接続すれば、個々のLEDチップに流れる電流値を略一定にすることができ、且つ、直列接続された複数のLEDチップに対して電流制限用の抵抗を1個接続すれば、各LEDチップに流れる電流を制限できるから、電流制限用の抵抗で消費される電力ロスを小さくできるという効果がある。 In the present invention, on the other hand, the substrate, and a plurality of regions that are electrically insulated from each other, the LED chip is mounted to each region, by connecting the LED chip mounted in each area in series, It can be the value of the current flowing through the individual LED chips substantially constant, and, if one connects a current limiting resistor for a plurality of LED chips connected in series, limit the current flowing through each LED chip because it has the effect that the power loss consumed by a current limiting resistor can be reduced.
【0146】 [0146]
請求項12の発明は、請求項1の発明において、封止材料の表面を、LEDチップの発光を所望の方向に配光するレンズ形状としたことを特徴とし、封止材料の表面をレンズ形状としたことにより、別途レンズを設けることなく、LEDチップの発光を所望の方向に配光することができるという効果がある。 The invention of claim 12 is the invention of claim 1, the surface of the sealing material, the light emission of the LED chip is characterized in that a lens shape light distribution in a desired direction, the lens shape surface of the sealing material by the the, there is an effect that without separately providing a lens, the light emission of the LED chip can be light distribution in a desired direction.
【0147】 [0147]
請求項13発明は、請求項1の発明において、孔の側壁にLEDチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とし、反射部によってLEDチップの光を反射して所望の方向へ配光することにより、光の取り出し効率が向上するという効果がある。 13. invention is the invention of claim 1, reflects light emitted from the LED chip on the side wall of the hole characterized in that a reflection portion for light distribution in a desired direction, the light from the LED chip by the reflective portion by light distribution reflected by the desired direction, the light extraction efficiency is advantageously improved.
【0148】 [0148]
請求項14の発明は、請求項13の発明において、上記反射部を配線部で兼用したことを特徴とし、配線部が反射部を兼用することにより、絶縁部材の表面に形成される配線部及び反射部のパターンを簡素化できるという効果がある。 The invention of claim 14 is the invention of claim 13, characterized in that also serves the reflecting portion in the wiring portion, by the wiring portion also serves as a reflective portion, the wiring portion is formed on the surface of the insulating member and the pattern of the reflective portion has the effect of simplifying.
【0149】 [0149]
請求項15の発明は、請求項13の発明において、上記接続部材は金属線からなり、金属線の延びる方向に配線部を配設したことを特徴とし、LEDチップからの光は金属線によって遮光されるが、金属線の影となる部分に配線部を配置しているので、配線部以外の部位に形成された反射部によって、LEDチップからの光を所望の方向に配光することができるという効果がある。 The invention of claim 15 is the invention of claim 13, said connecting member is made of metal wire, characterized in that arranged the wiring portion in the extending direction of the metal wire, the light from the LED chips blocked by metal wires but is the, so that by placing the wire at a portion where the shadow of the metal wire, by the reflection portion formed in a portion other than the wiring portion, the light from the LED chip can be light distribution in the desired direction there is an effect that.
【0150】 [0150]
請求項16の発明は、請求項1の発明において、封止材料は、LEDチップから放射された光の少なくとも一部を所定の光色に変換する光色変換機能を有することを特徴とし、封止材料によって光色が変換された光と、LEDチップからの光とを混色することによって、所望の光色の光を得ることができるという効果がある。 The invention of claim 16 is the invention of claim 1, the sealing material is characterized by having a light color converting function for converting at least a portion of light emitted from the LED chip to a predetermined light color, sealed and light emission color is converted by a stop material, by mixing the light from the LED chip, there is an effect that it is possible to obtain light having a desired light color.
【0151】 [0151]
請求項17の発明は、請求項16の発明において、封止材料の表面は、絶縁部材における基板と反対側の面よりも基板側に位置し、孔の周壁にLEDチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とし、LEDチップからの光は封止材料を通過することによって分散され、完全拡散配光となっているので、配光制御しやすくなっており、反射部によって所望の方向に配光することができるという効果がある。 The invention of claim 17 is the invention of claim 16, the surface of the sealing material is located on the substrate side of the surface of the substrate opposite to the insulating member, it reflects light emitted from the LED chip to the peripheral wall of the hole characterized in that a reflection portion for light distribution in a desired direction, light from the LED chip is distributed by passing through the sealing material, since a completely diffused light distribution, it is easier to control the light distribution and, there is an effect of being able to light distribution in a desired direction by the reflection portion.
【0152】 [0152]
請求項18の発明は、請求項1の発明において、配線部の一部を基板側に向かって延伸し、この延伸された部分で外部接続端子を構成することを特徴とし、配線部の一部を基板側に向かって延伸し、この延伸された部位を外部接続端子としているので、基板側から配線部への給電を容易に行えるという効果がある。 The invention of claim 18 is the invention of claim 1, a part of the wiring portion extending toward the substrate side, characterized by constituting the external connection terminal in this stretched portion, a part of the wiring portion was drawn toward the substrate side, since the the drawn portion and the external connection terminals, there is an effect that the power supply from the substrate side to the wiring portion easily. なお、配線部の一部を基板側に向かって延伸させる形態としては種々考えられるが、例えば絶縁部材の端部に沿って配線部を基板側に延伸したり、絶縁部材にスルーホールを形成し、このスルーホール内に導電性材料を充填することによって配線部を基板側に延伸することが考えられる。 Although are various in a part of the wiring portion as a form in which stretched toward the substrate side, for example, or the wiring portion along the edge of the insulating member extends to the substrate side, a through hole is formed in the insulating member , it is conceivable to stretch the substrate side wiring portion by filling a conductive material in the through hole. また基板側に向かって延伸する配線部の長さも必要に応じて決定され、絶縁部材の途中まで又は基板側の面まで延伸しても良いし、基板側の面に一部を回り込ませるようにしても良いし、また基板の向こう側まで突出するようにしても良い。 The length of the wiring portion which extends toward the substrate side is determined as necessary, it may be extended to the middle or until the surface of the substrate side of the insulating member, so as to wrap the part surface on the substrate side also it may be, or may be projected to the other side of the substrate.
【0153】 [0153]
請求項19の発明は、請求項18の発明において、上記配線部の一部が、絶縁部材における基板との対向面まで延伸されたことを特徴とし、配線部の一部を基板との対向面まで延伸させているので、この延伸された部分に対して容易に給電することができるという効果がある。 The invention of claim 19 is the invention of claim 18, the facing surface of the portion of the wiring portion, characterized in that it is stretched to the opposite surface of the substrate in the insulating member, and the substrate a part of the wiring portion since it is extended until there is an effect that it is possible to easily supply power to the stretched portion. 例えば、基板と嵌合する穴の形成された器具本体にこの光源装置を実装する場合、配線部の一部を絶縁部材における基板との対向面まで延伸しているので、器具本体の穴に基板部分を嵌合すれば、器具本体に形成された配線部と光源装置の配線部との電気的接続を容易に行うことができ、さらに基板部分を穴内に嵌め込んで器具本体と接触させるようにすれば、放熱性が向上する。 For example, when implementing this light source device to the instrument body formed of holes substrate mating, since a part of the wiring portion are extended to the opposite surface of the substrate in the insulating member, the substrate in the hole of the instrument body if the fitting portions can be electrically connected to the wiring portion of the wiring portion and the light source device formed on the instrument body easily, so that further contact with the instrument body by fitting the substrate portion in the bore if, improves heat dissipation.
【0154】 [0154]
請求項20の発明は、請求項18又は19の発明において、絶縁部材の一部を基板側に向かって延伸し、この延伸された部分の先端を、基板における絶縁部材と反対側の面と略面一にしたことを特徴とし、絶縁部材の基板側に延伸された部位に器具本体の表面に載置して光源装置を器具本体に実装する際に、絶縁部材の延伸された部位が基板における絶縁部材と反対側の面と略面一になっているので、絶縁部材を器具本体の表面に載置するだけで、基板が器具本体の表面に接触するから、LEDチップの発熱が基板を介して器具本体に放出され、冷却効果が向上するという効果がある。 The invention of claim 20, wherein in the invention in claim 18 or 19, a portion of the insulating member extends toward the substrate side, the tip of the stretched portion, opposite surface substantially to the insulating member in the substrate characterized in that the flush, when it is placed on the surface of the equipment main body to the site which is drawn to the substrate side of the insulating member to implement the light source device to the instrument body, stretched portion of the insulating member in the substrate because are substantially flush with the opposite surface to the insulating member, simply placing the insulating member on the surface of the equipment main body, since the substrate contacts the surface of the instrument body, the heat generation of the LED chip through the substrate Te is released into the instrument body, there is an effect that the cooling effect is improved. しかも、配線部の一部を基板側に延伸させて外部接続端子としているので、外部接続端子と器具本体の表面に形成された配線部との電気的接続を容易に行えるという効果がある。 Moreover, since a part of the wiring portion is stretched to the substrate side as an external connection terminal, there is an effect that allows an electrical connection between the wiring portion formed on the surface of the external connection terminals and the instrument body easily. さらに、絶縁部材の基板側に延伸された部位の先端面に外部接続端子を形成すれば放熱性を向上させた表面実装型の光源装置を実現できる。 Furthermore, it is possible to realize an external connection terminal surface-mounted light source device having improved heat dissipation properties by forming a the distal end surface of the site that was drawn to the substrate side of the insulating member.
【0155】 [0155]
請求項21の発明は、請求項1の発明において、絶縁部材とLEDチップと配線部と封止部材とが基板の両面に設けられたことを特徴とし、基板の両面からLEDチップの光を放射させることができ、且つ、基板の両面に同じ部品が配設されているので、基板の反りを抑制することができるという効果がある。 The invention of claim 21 is the invention of claim 1, characterized in that insulating the member and the LED chip and the sealing member wiring portion is provided on both faces of the substrate, emitting light of the LED chips from both sides of the substrate is to be able, and, since the same parts on both sides of a substrate are arranged, there is an effect that it is possible to suppress warpage of the substrate.
【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS
【図1】 光源装置の基本構成を示し、(a)は断面図、(b)は平面図である。 [1] shows the basic configuration of a light source device, (a) shows the cross sectional view, (b) is a plan view.
【図2】 実施形態の光源装置を示す断面図である。 2 is a sectional view showing a light source device of Embodiment 1.
【図3】 (a)(b)は実施形態の光源装置を示す断面図である。 [3] (a) (b) is a sectional view showing a light source device of the second embodiment.
【図4】 (a)(b)は実施形態の光源装置を示す断面図である。 [4] (a) (b) is a sectional view showing a light source device of Embodiment 3.
【図5】 実施形態の光源装置を示す断面図である。 5 is a cross-sectional view showing a light source device of the fourth embodiment.
【図6】 実施形態の光源装置を示す断面図である。 6 is a sectional view showing a light source device of Embodiment 5.
【図7】 実施形態の光源装置を示す断面図である。 7 is a sectional view showing a light source device of Embodiment 6.
【図8】 実施形態の光源装置を示す断面図である。 8 is a sectional view showing a light source device of Embodiment 7.
【図9】 実施形態の光源装置を示す断面図である。 9 is a sectional view showing a light source device of Embodiment 8.
【図10】 実施形態の光源装置を示す断面図である。 10 is a cross-sectional view showing a light source device of Embodiment 9.
【図11】 実施形態10の光源装置を示す断面図である。 11 is a sectional view showing a light source device of Embodiment 10.
【図12】 実施形態11の光源装置を示し、(a)は断面図、(b)は平面図である。 [Figure 12] shows the light source device of the embodiment 11, (a) is a sectional view, (b) is a plan view.
【図13】 実施形態12の光源装置を示し、(a)は断面図、(b)は平面図である。 [Figure 13] shows the light source device of the embodiment 12, (a) is a sectional view, (b) is a plan view.
【図14】 実施形態13の光源装置を示す断面図である。 14 is a cross-sectional view showing a light source device of Embodiment 13.
【図15】 実施形態14の光源装置を示す断面図である。 15 is a sectional view showing a light source device of Embodiment 14.
【図16】 実施形態15の光源装置を示す断面図である。 16 is a sectional view showing a light source device of Embodiment 15.
【図17】 実施形態16の光源装置を示す断面図である。 17 is a sectional view showing a light source device of Embodiment 16.
【図18】 実施形態17の光源装置を示す断面図である。 18 is a sectional view showing a light source device of Embodiment 17.
【図19】 実施形態18の光源装置を示す断面図である。 19 is a sectional view showing a light source device of Embodiment 18.
【図20】 (a)〜(e)は実施形態19の光源装置の各製造工程を示す断面図である。 [Figure 20] (a) ~ (e) are sectional views showing a manufacturing steps of the light source device of Embodiment 19.
【図21】 (a)〜(d)は実施形態20の光源装置の各製造工程を示す断面図である。 [Figure 21] (a) ~ (d) are sectional views showing a manufacturing steps of the light source device of Embodiment 20.
【図22】 (a)〜(e)は実施形態21の光源装置の各製造工程を示す断面図である。 [Figure 22] (a) ~ (e) are sectional views showing a manufacturing steps of the light source device of Embodiment 21.
【図23】 (a)〜(f)は実施形態22の光源装置の各製造工程を示す断面図である。 [Figure 23] (a) ~ (f) are sectional views showing a manufacturing steps of the light source device of Embodiment 22.
【図24】 従来の光源装置の断面図である。 24 is a cross-sectional view of a conventional light source device.
【図25】 従来の別の光源装置の断面図である。 25 is a cross-sectional view of another conventional light source apparatus.
【符号の説明】 DESCRIPTION OF SYMBOLS
1 光源装置 2 LEDチップ 3 基板 4 絶縁部材 4a 張出部 6 貫通孔 8 配線パターン 9 ボンディングワイヤ 10 封止樹脂 1 light source device 2 LED chip 3 substrate 4 insulating member 4a overhanging portion 6 through holes 8 wiring pattern 9 bonding wire 10 sealing resin

Claims (21)

  1. 熱伝導性を有する基板と、基板の少なくとも一方の面に配設された絶縁部材と、基板と対向する絶縁部材の部位に絶縁部材を貫通して設けられた孔と、この孔から露出する基板の部位に対向させ且つ熱結合させて配置されたLEDチップと、絶縁部材に設けられ絶縁部材によって基板と電気的に絶縁された配線部を含む給電部と、給電部とLEDチップの電極との間を電気的に接続する接続部材と、孔内に充填されLEDチップ及び接続部材の全体を封止する透光性を有する封止材料とを備え、絶縁部材に設けた孔の基板側の開口縁に内側に突出する張出部を設け、この張出部に配線部の少なくとも一部を配置し、張出部に配置された配線部の部位にLEDチップの電極を電気的に接続しており、絶縁部材側に突出し絶縁部材に設けた孔内に A substrate having a thermal conductivity, an insulating member disposed on at least one surface of the substrate, the hole provided through the insulating member to the portion of the substrate opposite to the insulating member, the substrate exposed through the hole an LED chip disposed opposite allowed and thermally coupled to a site, and feeding portion including a substrate and electrically insulated wire section by an insulating member provided in the insulating member, the feeding portion and the LED chip electrode a connecting member for electrically connecting, a sealing material having a light-permeable sealing the entire LED chip and the connecting member is filled in the hole, the opening of the substrate side of the hole provided in the insulating member the overhang portion protruding inward edge is provided, disposed at least a portion of the wiring portion to the extended portion, the LED chip electrodes to the site of the wiring portion disposed in projecting portion electrically connected cage, in the hole provided in the projecting insulating member to the insulating member side 入される突台部を基板に設け、この突台部にLEDチップを対向させ且つ熱結合させて配置したことを特徴とする光源装置。 Provided support block which is input to the substrate, the light source apparatus characterized by disposing the LED chips by so and thermally bonded facing the support block.
  2. 封止材料は孔の開口付近まで充填されたことを特徴とする請求項1記載の光源装置。 Sealing material source apparatus according to claim 1, characterized in that it is filled up to the vicinity of the opening of the hole.
  3. 上記接続部材は金属線からなり、基板及び絶縁部材の接合方向において、金属線の一端が接続されるLEDチップの部位と、金属線の他端が接続される配線部の部位の高さを略同じ高さとしたことを特徴とする請求項1記載の光源装置。 The connecting member is made of metal wire, generally at the junction direction of the substrate and the insulating member, and the site of the LED chip to which one end of the metal line is connected, the portion of the wiring portion to which the other end of the metal lines are connected to height a light source apparatus according to claim 1, characterized in that the same height.
  4. 基板及び絶縁部材の接合方向において、LEDチップが実装される突台部と、LEDチップに電気的に接続される配線部の部位の高さを略同じ高さとしたことを特徴とする請求項1記載の光源装置。 In joining direction of the substrate and the insulating member according to claim 1, in which the LED chip is a support block which is mounted, characterized in that a substantially same height as the height of the portion of the wiring portion electrically connected to the LED chip the light source device according.
  5. 突台部は、基板における絶縁部材と反対側の面から打ち出し加工を行って凹所を形成することにより、基板における絶縁部材側の面に打ち出されたことを特徴とする請求項記載の光源装置。 Support block by forming a recess by performing the launch processing from the surface opposite to the insulating member in the substrate, the light source according to claim 1, characterized in that hammered out on the surface of the insulating member side in the substrate apparatus.
  6. 基板を、孔に連通する連通孔が形成されたベース板と、連通孔内に取り付けられ先端が絶縁部材側に突出する突起部とで構成し、突起部の先端により突台部を構成したことを特徴とする請求項記載の光源装置。 The substrate, the base plate communicating hole formed which communicates with the hole, the tip attached to the communicating hole is composed of a projection portion projecting insulating member side, to constitute a support block by the tip of the protrusion the light source device according to claim 1, wherein.
  7. 孔と突台部との間に隙間を設けたことを特徴とする請求項記載の光源装置。 A light source device according to claim 1, characterized in that a gap is provided between the hole and the support block.
  8. 基板と絶縁部材との位置決めを行うための位置決め手段を基板と絶縁部材との接合面に設けたことを特徴とする請求項1乃至7の何れか1項に記載の光源装置。 The light source device according to any one of claims 1 to 7, characterized in that a positioning means for positioning the substrate and the insulating member on the junction surface between the substrate and the insulating member.
  9. 基板と絶縁部材との接合面に接合に用いる接着剤の溜まり部を絶縁部材の孔の周りに設けたことを特徴とする請求項1乃至7の何れか1項に記載の光源装置。 The light source device according to any one of claims 1 to 7, characterized in the reservoir of the adhesive used in bonding at the interface between the substrate and the insulating member that is provided around the hole of the insulating member.
  10. 上記給電部は導電性材料により形成された基板を含み、基板とLEDチップの電極とを電気的に接続したことを特徴とする請求項記載の光源装置。 The feeding unit includes a substrate formed of a conductive material, a light source apparatus according to claim 1, characterized in that electrically connects the electrode of the substrate and the LED chip.
  11. 上記基板に、互いに電気的に絶縁された複数の領域を設けたことを特徴とする請求項10記載の光源装置。 To the substrate, the light source apparatus according to claim 10, characterized in that a plurality of regions that are electrically insulated from each other.
  12. 封止材料の表面を、LEDチップの発光を所望の方向に配光するレンズ形状としたことを特徴とする請求項記載の光源装置。 The surface of the sealing material, the light source apparatus according to claim 1, wherein the light emission of the LED chip and a lens shape light distribution in a desired direction.
  13. 孔の側壁にLEDチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とする請求項記載の光源装置。 The light source device according to claim 1, wherein reflects light emitted from the LED chip on the side walls of the hole, characterized in that a reflection portion for light distribution in a desired direction.
  14. 上記反射部を配線部で兼用したことを特徴とする請求項13記載の光源装置。 A light source apparatus according to claim 13, characterized in that also serves the reflecting portion in the wiring portion.
  15. 上記接続部材は金属線からなり、金属線の延びる方向に配線部を配設したことを特徴とする請求項13記載の光源装置。 The connecting member is made of metal wire, the light source apparatus according to claim 13, characterized in that arranged wiring portion in the extending direction of the metal wire.
  16. 封止材料は、LEDチップから放射された光の少なくとも一部を所定の光色に変換する光色変換機能を有することを特徴とする請求項記載の光源装置。 Sealing material, the light source apparatus according to claim 1, characterized in that it has a light color converting function for converting at least a portion of light emitted from the LED chip to a predetermined light color.
  17. 封止材料の表面は、絶縁部材における基板と反対側の面よりも基板側に位置し、孔の周壁にLEDチップの発光を反射して所望の方向に配光する反射部を設けたことを特徴とする請求項16記載の光源装置。 Surface of the sealing material is located on the substrate side of the surface of the substrate opposite to the insulating member, a reflects light emitted from the LED chip to the peripheral wall of the hole providing the reflective portion of the light distribution in the desired direction the light source device according to claim 16, wherein.
  18. 配線部の一部を基板側に向かって延伸し、この延伸した部分で外部接続端子を構成することを特徴とする請求項記載の光源装置。 A part of the wiring portion extending toward the substrate side, the light source apparatus according to claim 1, wherein the configuring the external connection terminals in the stretched portion.
  19. 上記配線部の一部を、絶縁部材における基板との対向面まで延伸させたことを特徴とする請求項18記載の光源装置。 A part of the wiring part, claim 18 light source device, wherein the allowed extended to the surface facing the substrate in the insulating member.
  20. 絶縁部材の一部を基板側に向かって延伸させ、この延伸した部分の先端を、基板における絶縁部材と反対側の面と略面一にしたことを特徴とする請求項18又は19の何れかに記載の光源装置。 A part of the insulating member is extended toward the substrate side, the tip of the stretched portion, claim 18 or 19, characterized in that the substantially flush with the surface opposite to the insulating member in the substrate the light source device according to.
  21. 絶縁部材とLEDチップと配線部と封止部材とが基板の両面に設けられたことを特徴とする請求項1記載の光源装置 The light source device according to claim 1, wherein the insulating member and the LED chip and the wiring portion and the sealing member is characterized in that provided on both sides of the substrate.
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