JP2008277438A - Electronic component, substrate, and method of manufacturing electronic component and substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component with a photoelectric conversion element which can be reduced in size and manufacturing cost and can be improved in installation accuracy, to provide a substrate equipped with the electronic component, and also to provide methods of manufacturing the electronic component and the substrate. <P>SOLUTION: In the electronic component 1 equipped with the photoelectric conversion element (VCSEL) 10, a driving electrode formed in an edge portion of the surface whereon a light-emitting portion of the photoelectric conversion element 10 exists and an electrode for element connection formed in a light-transmitting member 20 so disposed as to face the surface whereon the light-emitting portion of the photoelectric conversion element 10 exists are laser-bonded via a conductive bonding material 40. On the surface of the light-transmitting member 20, an antireflection film 21 may be formed. On the photoelectric conversion element-side surface of the light-transmitting member 20, an interconnection 30 consisting of the electrode for element connection, an electrode for substrate connection, and an electrode connecting portion is formed. As a material of the interconnection 30, a material which allows easy transmission of laser light used for laser bonding (for example, aluminum, gold, or copper) can be used. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a photoelectric conversion element that emits light based on an electric signal, an electronic component that includes a photoelectric conversion element that receives light and outputs an electric signal, a substrate including the electronic component, and the electronic component and the substrate. It relates to a manufacturing method.

  As a photoelectric conversion element constituting this type of electronic component, for example, a vertical-cavity surface-emitting laser (VCSEL: hereinafter referred to as “VCSEL element”) is known. This VCSEL element is a surface emitting laser that is manufactured by laminating compound semiconductors, resonates light in a direction perpendicular to the substrate surface of the element, and emits laser light in a direction perpendicular to the substrate surface. This VCSEL element is attracting attention as a light source for various devices because its manufacturing process is suitable for mass production and can be manufactured at low cost, and its beam shape is close to a circle and optical coupling with a fiber is easy.

  Conventionally, in the electronic component including the VCSEL element, the VCSEL element 10 is mounted in a resin package 900 as shown in FIG. 30, and the ground electrode on the back surface of the VCSEL element 10 is connected to the ground electrode on the inner surface of the package 900. At the same time, the drive electrode on the upper surface of the VCSEL element 10 and the electrode of the package 900 are connected by a wire 901. Then, a glass plate 902 as a light transmitting member that closes the opening of the package 900 is attached so that the VCSEL element 10 is not exposed to the atmosphere, and the electrode on the back surface of the package 90 and the electrode on the substrate 903 are joined by solder 904.

In the electronic component having the conventional VCSEL element, since the package 900 is used, the size is increased by the size of the package, and the material cost of the package and the cost for producing the mold are increased, resulting in an increase in the manufacturing cost. End up. Further, since the VCSEL element 10 is mounted inside the package 900, it is difficult to ensure the mounting accuracy.
Such a problem can occur not only in the case of an electronic component including the VCSEL element but also in an electronic component including a photoelectric conversion element having a similar shape.

  The present invention has been made under the above background, and an object of the present invention is to provide an electronic component equipped with a photoelectric conversion element, which can reduce the size, reduce the manufacturing cost, and improve the mounting accuracy. It is an object of the present invention to provide a board provided with the electronic component and a method for manufacturing the board.

An electronic component according to the present invention is an electronic component including a photoelectric conversion element that emits light based on an electrical signal, and a drive electrode provided at an end of a surface where a light emitting portion of the photoelectric conversion element is provided; An element connection electrode provided on a light transmitting member disposed so as to face the surface where the light emitting portion of the photoelectric conversion element is located is bonded via a conductive bonding material.
In this electronic component, a photoelectric conversion element that can be mounted on a substrate by bonding a driving electrode of a photoelectric conversion element and an element connection electrode of a light transmitting member via a conductive bonding material without using a package. Since the electronic component which consists of a light transmissive member provided with this can be manufactured, size reduction of this electronic component and reduction of manufacturing cost can be aimed at. In addition, the bonding enables the photoelectric conversion element to be accurately positioned and attached to the light transmission member without using a package, so that the accuracy of attaching the photoelectric conversion element in the electronic component can be improved.

  In the electronic component, the driving electrode of the photoelectric conversion element and the element connection electrode of the light transmitting member may be bonded by melting the bonding material with laser light. In this case, unlike the case where the entire electronic component is heated and bonded by irradiating the bonding material with a laser beam and locally heating only the bonding material and its periphery to melt the bonding material. In addition, while suppressing deterioration of the photoelectric conversion element due to heating, the drive electrode of the photoelectric conversion element and the element connection electrode of the light transmitting member are securely bonded via a conductive bonding material, and the electrical continuity of both electrodes is ensured. Can be secured.

  In the electronic component, an antireflection film for preventing reflection of light emitted from the photoelectric conversion element may be formed on the surface of the light transmission member. In this case, the reflection when the light emitted from the photoelectric conversion element passes through the light transmitting member is prevented by the antireflection film, and the light from the photoelectric conversion element can be efficiently extracted to the outside.

  In the electronic component, a protective layer may be provided on the surface of the antireflection film. In this case, it is possible to suppress deterioration of the surface of the antireflection film at the time of manufacturing or using the electronic component.

  In the electronic component, the protective layer may be formed of a resin tape such as polyimide, a TSA (adhesive for semiconductor manufactured by Toray Industries, Inc.) sheet, or a highly transparent film without filler. In this case, the antireflection film is protected with a resin tape such as polyimide having a long-term high heat resistance and high thermal conductivity, a TSA (adhesive for semiconductor manufactured by Toray Industries, Inc.) sheet, or a highly transparent film without filler. Therefore, it is possible to suppress the deterioration of the antireflection film due to heat treatment during production and heat generation during operation of the photoelectric conversion element, and to maintain the function of suppressing the deterioration of the surface of the antireflection film over a long period of time, thereby extending the life. In addition, the heat generated during operation of the photoelectric conversion element can be transmitted to the light transmitting member side without being shielded, thereby contributing to good heat dissipation. Furthermore, since the material of these protective layers is also excellent in transparency, when the laser beam is irradiated from the light transmitting member side to the bonding material on the drive electrode of the photoelectric conversion element during the laser bonding, the laser is used. A decrease in the amount of light can be suppressed.

  In the electronic component, a drive circuit component that drives the photoelectric conversion element may be mounted on the surface of the light transmitting member. In this case, the length of the wiring between the photoelectric conversion element and the drive circuit part that drives the photoelectric conversion element is shorter than when the drive circuit part is mounted on the substrate on which the electronic component is mounted. The photoelectric conversion element can be driven at high speed.

  In the electronic component, the bonding material may be a metal material having an electrical resistance equal to or lower than that of solder. In this case, conductivity equal to or higher than that of solder can be secured in the bonding between the element connection electrode of the light transmitting member and the drive electrode of the photoelectric conversion element.

  In the electronic component, the bonding material may be a metal material having a crystal structure other than the face-centered cubic lattice structure. In this case, better electrical conductivity can be ensured in the above bonding.

  In the electronic component, the bonding material may be Sn—Ag—Cu solder, Sn—Bi solder, molybdenum, zinc, cobalt, tungsten, tin, or cadmium. In this case, by using the predetermined material as the bonding material, the bonding material can be easily provided on the element connection electrode of the light transmitting member or the driving electrode of the photoelectric conversion element by printing, vapor deposition, or plating. be able to.

  In the electronic component, the gap between the light transmitting member and the photoelectric conversion element is sealed by laser bonding of the driving electrode of the photoelectric conversion element and the element connection electrode of the light transmitting member via the bonding material. The surface of the light transmitting member and the end of the photoelectric conversion element may be sealed with the bonding material melted by laser irradiation so that a space is formed. In this case, since the light emitting portion of the photoelectric conversion element is in the sealed space and is not exposed to the space outside the sealed space, deterioration of the photoelectric conversion element due to moisture or the like existing in the outer space can be prevented. Further, since sealing is performed with a bonding material melted by laser irradiation at the time of the laser bonding, there is no need to provide a separate sealing step.

  In the electronic component, an end portion of the photoelectric conversion element facing the light transmitting member and a surface of the light transmitting member may be sealed with a resin. Also in this case, since the light emitting portion of the photoelectric conversion element is in the sealed space and is not exposed to the space outside the sealed space, deterioration of the photoelectric conversion element due to moisture or the like existing in the outer space can be prevented. Further, the softened resin can be spread over the gap so as to securely seal the gap between the end of the photoelectric conversion element and the surface of the light transmitting member, and the sealing state is improved by subsequent curing. Since it is fixed, the sealing can be performed more reliably and maintained for a long time.

  Further, in the electronic component, a resin inflow prevention portion that prevents the resin from flowing into the light emitting portion of the photoelectric conversion element when sealed with the resin may be provided on the surface of the light transmitting member. . In this case, deterioration of the photoelectric conversion element due to the resin flowing into the light emitting portion of the photoelectric conversion element can be prevented.

  In the electronic component, the resin inflow blocking portion may be a portion on the surface of the light transmitting member that has improved water repellency with respect to the resin. In this case, the resin can be prevented from flowing into the light emitting portion of the photoelectric conversion element without mechanically processing the surface of the light transmitting member.

  Moreover, the said electronic component WHEREIN: The convex part or recessed part provided in the surface of the said light transmissive member may be sufficient as the said resin inflow prevention part. In this case, the inflow of the resin to the light emitting portion of the photoelectric conversion element can be reliably prevented by the convex portion or the concave portion provided on the surface of the light transmitting member.

  In the electronic component, a dry gas may be filled in a sealed space in a gap between the light transmitting member and the photoelectric conversion element. In this case, it can prevent that the light emission part of the photoelectric conversion element exposed to sealed space deteriorates with a water | moisture content.

  In the electronic component, the dry gas may be a dry nitrogen gas. In this case, it is possible to prevent the light emitting portion of the photoelectric conversion element from being deteriorated by moisture with a relatively inexpensive dry nitrogen gas.

  In the electronic component, the photoelectric conversion element may be a vertical cavity surface emitting laser. In this case, the electronic component having the light transmitting member and the vertical cavity surface emitting laser can be miniaturized and the manufacturing cost can be reduced, and the mounting accuracy of the vertical cavity surface emitting laser can be improved. Can be planned.

  In the electronic component, the emission wavelength of the vertical cavity surface emitting laser may be 780 nm. In this case, it is possible to reduce the size and manufacturing cost of an electronic component that emits laser light having a wavelength of 780 nm.

  In the electronic component, the material of the light transmitting member may be BK7, D263, CG-1, synthetic quartz, or soda lime glass. In this case, by using a light transmitting member made of BK7, D263, CG-1, synthetic quartz or soda lime glass having excellent transmittance with respect to a laser beam having a wavelength of 780 nm, it is emitted from the vertical cavity surface emitting laser. Laser light can be efficiently extracted outside. In particular, when a relatively inexpensive synthetic quartz or soda lime glass is used, the manufacturing cost of an electronic component equipped with the vertical cavity surface emitting laser can be further reduced.

  In the electronic component, an antireflection film for preventing reflection of light having a wavelength of 780 nm may be formed on both surfaces of the light transmitting member. In this case, the antireflection film prevents reflection when light having a wavelength of 780 nm emitted from the vertical cavity surface emitting laser passes through the light transmitting member, and allows light from the vertical cavity surface emitting laser to pass through. It can be taken out efficiently.

  In the electronic component, the photoelectric conversion element is a light receiving element that receives light and outputs an electrical signal, and the light emitting unit is a light incident part through which light from the outside passes to the photoelectric conversion element. The drive electrode may be an output electrode for the electric signal. In this case, the electronic component having the light transmitting member and the light receiving element can be reduced in size and the manufacturing cost can be reduced, and the mounting accuracy of the light receiving element can be improved.

  In the electronic component, on the surface of the light transmission member on the photoelectric conversion element side, an element connection electrode connected to a drive electrode of the photoelectric conversion element, and a substrate connection electrode at an end of the light transmission member The wiring which consists of an electrode and the electrode connection part which connects this element connection electrode and this board | substrate connection electrode may be formed. In this case, the substrate connection electrode is formed at a position distant from the element connection electrode, and the substrate connection electrode and the element connection electrode are connected by the electrode connection portion. Increased freedom.

  In the electronic component, when laser bonding using the bonding material is performed, the wiring material may be a material that easily transmits laser light used for the laser bonding. In this case, the laser beam used for the laser bonding can be irradiated from the surface of the light transparent member, and the wiring portion can be efficiently passed to reach the bonding material portion. Therefore, it is possible to reduce the power of the laser beam necessary for the purpose.

  In the electronic component, the wiring material may be aluminum, gold, or copper. In this case, by using aluminum, gold, or copper, the wiring can be easily formed by a method such as vapor deposition or plating.

  In the electronic component, an anchor layer may be provided between the wiring and the light transmission member. In this case, the adhesion of the wiring to the light transmitting member can be enhanced by the anchor layer.

  In the electronic component, a tape, a sheet, or a film having a metal film on the surface is attached to the surface of the light transmitting member on the photoelectric conversion element side, and the wiring is formed by removing unnecessary portions of the metal film. The surface of the metal film formed on the portion constituting the element connection electrode of the wiring is solder-plated, and the element connection electrode of the wiring and the drive electrode of the photoelectric conversion element are laser-bonded via the solder It may be what has been done. In this case, the wiring can be formed by a simple method of attaching a tape or the like with a metal film to the surface of the light transmitting member.

  Moreover, in the electronic component, what is attached to the surface of the light transmitting member on the photoelectric conversion element side is a resin tape such as polyimide having a metal film on the surface, TSA (adhesive for semiconductor manufactured by Toray Industries, Inc.) It may be a sheet or a filler-less highly transparent type film. In this case, stick a resin tape such as polyimide with a metal film having a long-term high heat resistance and high thermal conductivity, a TSA (adhesive for semiconductor manufactured by Toray Industries, Inc.) sheet or a highly transparent film without filler. Thus, the wiring base layer made of the tape or the like is not deteriorated due to heat treatment during manufacturing of the wiring or operation of the photoelectric conversion element, and the function of the wiring is maintained over a long period of time, thereby extending the life. In addition, the heat generated during the operation of the photoelectric conversion element can be transmitted to the light transmitting member side without being shielded, thereby contributing to good heat dissipation. Furthermore, since the tape as the base layer of the wiring is excellent in transparency, when the laser beam is irradiated to the bonding material on the drive electrode of the photoelectric conversion element from the light transmitting member side during the laser bonding. , It is possible to suppress a decrease in the amount of laser light.

  In the electronic component, the wiring may include an intermediate pad for supplying solder in the middle of the electrode connecting portion that connects the element connecting electrode and the substrate connecting electrode. In this case, after supplying the solder to the intermediate pad in the middle of the electrode connection portion, by heating, the solder on the intermediate pad is melted and moved on the wiring, thereby plating the surface of the wiring with the solder. it can. In particular, even when the size of the element connection electrode or the width of the wiring is small and it is difficult to directly apply solder to the surface, by extending and supplying the molten solder from the intermediate pad, the element connection electrode of the wiring and The electrode connecting portion extending therefrom can be surely plated with solder.

  In the electronic component, a plurality of drive electrodes of the photoelectric conversion element are provided, and a plurality of sets of the element connection electrodes and the substrate connection electrodes connected by the wiring correspond to the drive electrodes. When provided, the intermediate pads may be provided so that the distance between the solder supplying intermediate pad and the element connecting electrode in the plurality of wirings is equal to each other. In this case, since the distance between the intermediate pad for supplying solder and the element connecting electrode in the plurality of wirings is equal to each other, after supplying the solder to the intermediate pad, the molten solder on the intermediate pad is connected to the element under the same heat treatment conditions. Therefore, the plurality of element connection electrodes can be surely solder-plated.

  In the electronic component, on the surface of the light transmission member on the photoelectric conversion element side, an element connection electrode connected to a drive electrode of the photoelectric conversion element, and a substrate connection electrode at an end of the light transmission member An aluminum wiring comprising an electrode and an electrode connecting portion connecting the element connecting electrode and the substrate connecting electrode is formed, and a plating process for forming a nickel plating layer and a gold plating layer are formed on the surface of the wiring A plating process or a plating process for further forming a gold plating layer on the nickel plating layer is performed, and at least a portion of the surface of the light transmission member through which light emitted from the photoelectric conversion element passes is provided from the photoelectric conversion element. An antireflection film that prevents reflection of emitted light may be formed. In this case, since the antireflection film is formed after the aluminum wiring is formed on the surface of the light transmitting member on the photoelectric conversion element side, the antireflection film is formed on the light transmitting member before forming the aluminum wiring. Compared to the above, the adhesion between the aluminum wiring and the light transmitting member can be improved. In addition, a nickel plating layer is formed on the aluminum wiring, and a gold plating layer with high solder adhesion is formed on the aluminum wiring. The fixing force can be increased.

  In the electronic component, a plurality of drive electrodes of the photoelectric conversion element are provided, and a plurality of sets of the element connection electrodes and the substrate connection electrodes connected by the wiring correspond to the drive electrodes. It may be provided and the width and length of each wiring may be set so that the electrical characteristics of each wiring are equal. In this case, since the electrical characteristics of each wiring in the electronic component are equal, it becomes easy to design a drive control circuit or a drive control program on the drive circuit side for driving the photoelectric conversion element.

  In the electronic component, the plurality of wirings are formed so as to extend in a fan shape from the element connection electrode toward the outer substrate connection electrode so that the lengths of the respective wirings are equal to each other. The substrate connecting electrode may be arranged in an arc shape at an end of the surface of the light transmitting member on the photoelectric conversion element side. In this case, since the plurality of substrate connection electrodes are arranged in an arc shape, the bonding process between each substrate connection electrode and the substrate-side electrode is facilitated.

  In the electronic component, the photoelectric conversion element includes a plurality of light emitting units that are driven independently from each other by the light emitting unit, and the plurality of light emitting units and the plurality of driving electrodes are respectively connected to the element wiring. In other words, the width and length of each intra-element wiring may be set such that the electrical characteristics of each intra-element wiring are equal. In this case, since the electrical characteristics of each wiring in the electronic component including the wiring in each element inside the photoelectric conversion element are equal, the drive control circuit on the side of the driving circuit that drives the photoelectric conversion element or The design of the drive control program is further facilitated.

  Further, in the electronic component, the plurality of element internal wirings are formed so as to extend in a fan shape from the light emitting portion toward the outer drive electrode so that the lengths of the respective element internal wirings are equal to each other. The drive electrode may be arranged in an arc shape at the end of the surface where the light emitting portion of the photoelectric conversion element is provided. In this case, since the plurality of drive electrodes are arranged in an arc shape in this case, the bonding process between each drive electrode and the element bonding electrode on the light transmitting member side is facilitated.

  In the electronic component, a preflux coating may be applied to the surface of the substrate connection electrode. In this case, the pre-flux coated on the surface of the substrate connection electrode can increase the wettability of the solder, so that the substrate connection electrode on the light transmitting member side and the electrode on the substrate side can be securely connected via the solder. Can connect.

  In the electronic component, the surface of the substrate connection electrode may be plated with gold. In this case, the adhesion of solder to the substrate connection electrode can be increased by gold plating on the surface of the substrate connection electrode.

  The substrate according to the present invention is one in which any one of the electronic components is mounted and the substrate connecting electrode formed on the light transmitting member of the electronic component is soldered. In this case, it is possible to reduce the size of the substrate with the electronic component and reduce the manufacturing cost.

  In the substrate, an end portion of the electronic component on which the electrode for connecting the substrate of the light transmitting member is formed is exposed to the outside of a portion facing the photoelectric conversion element, and the photoelectric conversion element is An opening in which the photoelectric conversion element can be inserted without interference when the electronic component is mounted toward the substrate may be formed. In this case, by mounting the electronic component so that the photoelectric conversion element is inserted into the opening formed in the substrate, the portion protruding from the substrate can be reduced, so the size of the substrate on which the electronic component is mounted can be reduced. Can be planned.

  In the substrate, the back surface of the photoelectric conversion element inserted into the opening of the substrate and the back surface of the substrate may be connected with an adhesive. In this case, since the back surface of the photoelectric conversion element and the back surface of the substrate are connected by an adhesive, wobbling of the photoelectric conversion element can be suppressed, the strength of the photoelectric conversion element is increased, and the light is emitted from the photoelectric conversion element. The optical axis can be prevented from blurring.

  In the substrate, the ground electrode on the back surface of the photoelectric conversion element and the ground electrode on the back surface of the substrate may be connected with a conductive adhesive. In this case, since the conductive adhesive for fixing the photoelectric conversion element can also be used for the connection between the ground electrode of the photoelectric conversion element and the ground electrode of the substrate, it is not necessary to separately provide wiring for connecting both ground electrodes. .

A method of manufacturing an electronic component according to the present invention is a method of manufacturing an electronic component including a photoelectric conversion element that emits light based on an electrical signal, and is provided at an end of a surface where the light emitting portion of the photoelectric conversion element is provided. The drive electrode and the element connection electrode provided on the light transmission member arranged so as to face the surface where the light emitting portion of the photoelectric conversion element is provided are laser-bonded via a conductive bonding material. Is.
This electronic component manufacturing method can be mounted on a substrate by laser bonding the drive electrode of the photoelectric conversion element and the element connection electrode of the light transmitting member via a conductive bonding material without using a package. Since the electronic component which consists of a light transmissive member provided with a photoelectric conversion element can be manufactured, size reduction of this electronic component and reduction of manufacturing cost can be aimed at. In addition, the laser bonding enables the photoelectric conversion element to be accurately positioned and attached to the light transmission member without using a package, so that the accuracy of attaching the photoelectric conversion element in the electronic component can be improved.

  In the method for manufacturing the electronic component, an element connection electrode is formed on the light transmission member, and the element connection electrode of the light transmission member and the drive electrode of the photoelectric conversion element are brought into contact with each other through the bonding material. The light transmissive member and the photoelectric conversion element are disposed to face each other, and the light transmissive member is passed through the surface of the light transmissive member opposite to the surface facing the photoelectric conversion element to the bonding material. A laser beam having a wavelength that can be transmitted through the light transmitting member is irradiated so as to reach the device, and the element connecting electrode of the light transmitting member and the photoelectric conversion element are driven through the bonding material irradiated with the laser light. You may join an electrode. In this case, in a state where the light transmitting member and the photoelectric conversion element are aligned and opposed to each other, the bonding material is irradiated with laser light, and light is transmitted through the bonding material irradiated with the laser light. Since the element connection electrode of the member and the drive electrode of the photoelectric conversion element can be joined, both electrodes can be reliably joined.

  In the electronic component manufacturing method, the element connection electrode of the light transmitting member and the drive electrode of the photoelectric conversion element may be bonded by melting the bonding material by irradiation with the laser beam. In this case, unlike the case where the entire electronic component is heated and bonded by irradiating the bonding material with a laser beam and locally heating only the bonding material and its periphery to melt the bonding material. In addition, while suppressing deterioration of the photoelectric conversion element due to heating, the drive electrode of the photoelectric conversion element and the element connection electrode of the light transmitting member are securely bonded via a conductive bonding material, and the electrical continuity of both electrodes is ensured. Can be secured.

  In the electronic component manufacturing method, a bonding layer made of the bonding material may be formed on the element connection electrode of the light transmission member before the light transmission member and the photoelectric conversion element are arranged to face each other. Good. In this case, when the light transmission member and the photoelectric conversion element are aligned and face each other, the bonding material is positioned and interposed between the element connection electrode of the light transmission member and the drive electrode of the photoelectric conversion element. The process of making it unnecessary becomes unnecessary.

  In the method for manufacturing an electronic component, a bonding layer made of the bonding material may be formed on the drive electrode of the photoelectric conversion element before the light transmitting member and the photoelectric conversion element are arranged to face each other. Also in this case, when the light transmitting member and the photoelectric conversion element are aligned and face each other, the bonding material is positioned and interposed between the element connecting electrode of the light transmitting member and the driving electrode of the photoelectric conversion element. The process of making it unnecessary becomes unnecessary.

  Further, in the method for manufacturing an electronic component, an antireflection film for preventing reflection of light emitted from the photoelectric conversion element is formed on the surface of the light transmitting member before forming the element connection electrode on the light transmitting member. It may be formed. In this case, the reflection when the light emitted from the photoelectric conversion element passes through the light transmitting member is prevented by the antireflection film, and the light from the photoelectric conversion element can be efficiently extracted to the outside.

  In the method for manufacturing an electronic component, a protective layer may be provided on the surface of the antireflection film before the element connection electrode is formed on the light transmitting member. In this case, it is possible to suppress deterioration of the surface of the antireflection film at the time of manufacturing or using the electronic component.

  In the method for manufacturing an electronic component, the protective layer may be formed of a resin tape such as polyimide, a TSA (adhesive for semiconductor manufactured by Toray Industries, Inc.) sheet, or a filler-less highly transparent film. . In this case, the antireflection film is protected with a resin tape such as polyimide having a long-term high heat resistance and high thermal conductivity, a TSA (adhesive for semiconductor manufactured by Toray Industries, Inc.) sheet, or a highly transparent film without filler. Therefore, it is possible to suppress the deterioration of the antireflection film due to heat treatment during production and heat generation during operation of the photoelectric conversion element, and to maintain the function of suppressing the deterioration of the surface of the antireflection film over a long period of time, thereby extending the life. In addition, the heat generated during operation of the photoelectric conversion element can be transmitted to the light transmitting member side without being shielded, thereby contributing to good heat dissipation. Furthermore, since the material of these protective layers is also excellent in transparency, when the laser beam is irradiated from the light transmitting member side to the bonding material on the drive electrode of the photoelectric conversion element during the laser bonding, the laser is used. A decrease in the amount of light can be suppressed.

  In the electronic component manufacturing method, a driving circuit component for driving the photoelectric conversion element may be mounted on the surface of the light transmitting member. In this case, the length of the wiring between the photoelectric conversion element and the drive circuit part that drives the photoelectric conversion element is shorter than when the drive circuit part is mounted on the substrate on which the electronic component is mounted. The photoelectric conversion element can be driven at high speed.

  In the electronic component manufacturing method, when the laser beam is irradiated, the light transmitting member and the photoelectric conversion member are connected so that the element connecting electrode of the light transmitting member and the driving electrode of the photoelectric conversion element are in close contact with each other. Pressure may be applied to at least one of the conversion elements. In this case, since the adhesion force between the element connecting electrode of the light transmitting member and the drive electrode of the photoelectric conversion element by the laser bonding is increased, the bonding quality is improved.

  In the electronic component manufacturing method, the bonding material may be a metal material having an electrical resistance equal to or lower than that of solder. In this case, conductivity equal to or higher than that of solder can be secured in the bonding between the element connection electrode of the light transmitting member and the drive electrode of the photoelectric conversion element.

  In the electronic component manufacturing method, the bonding material may be a metal material having a crystal structure other than the face-centered cubic lattice structure. In this case, better electrical conductivity can be ensured in the above bonding.

  In the electronic component manufacturing method, the bonding material may be Sn—Ag—Cu solder, Sn—Bi solder, molybdenum, zinc, cobalt, tungsten, tin, or cadmium. In this case, by using the predetermined material as the bonding material, the bonding material can be easily provided on the element connection electrode of the light transmitting member or the driving electrode of the photoelectric conversion element by printing, vapor deposition, or plating. be able to.

  In the method for manufacturing an electronic component, the surface of the bonding material may be subjected to an antioxidant treatment before the laser bonding. In this case, bonding failure due to surface oxidation of the bonding material can be prevented in advance.

  Further, in the method for manufacturing the electronic component, by forming a through hole penetrating at least the light transmitting member and the element connecting electrode, and sealing the through hole with the bonding material at the time of the laser bonding, You may seal the surface of this light transmissive member, and the edge part of this photoelectric conversion element so that sealed space may be formed in the clearance gap between this light transmissive member and this photoelectric conversion element. In this case, since the light emitting portion of the photoelectric conversion element is in the sealed space and is not exposed to the space outside the sealed space, deterioration of the photoelectric conversion element due to moisture or the like existing in the outer space can be prevented. Further, since sealing is performed with a bonding material melted by laser irradiation at the time of the laser bonding, there is no need to provide a separate sealing step.

  In the method for manufacturing the electronic component, the laser bonding may be performed after the dry gas is fed into the gap between the light transmitting member and the photoelectric conversion element through the through hole before the laser bonding. In this case, since the inside of the sealed space is filled with dry gas, the light emitting portion of the photoelectric conversion element exposed to the sealed space can be prevented from being deteriorated by moisture.

  In the method for manufacturing an electronic component, an end portion of the photoelectric conversion element facing the light transmitting member and a surface of the light transmitting member may be sealed with a resin. In this case, since the light emitting portion of the photoelectric conversion element is in the sealed space and is not exposed to the space outside the sealed space, deterioration of the photoelectric conversion element due to moisture or the like existing in the outer space can be prevented. Further, the softened resin can be spread over the gap so as to securely seal the gap between the end of the photoelectric conversion element and the surface of the light transmitting member, and the sealing state is improved by subsequent curing. Since it is fixed, the sealing can be performed more reliably and maintained for a long time.

  Further, in the method of manufacturing the electronic component, a resin inflow prevention portion that prevents the resin from flowing into the light emitting portion of the photoelectric conversion element when sealed with the resin is provided on the surface of the light transmitting member. May be. In this case, deterioration of the photoelectric conversion element due to the resin flowing into the light emitting portion of the photoelectric conversion element can be prevented.

  In the electronic component manufacturing method, the resin inflow blocking portion may be a portion on the surface of the light transmitting member that has improved water repellency with respect to the resin. In this case, the resin can be prevented from flowing into the light emitting portion of the photoelectric conversion element without mechanically processing the surface of the light transmitting member.

  In the electronic component manufacturing method, the resin inflow prevention portion may be a convex portion or a concave portion provided on the surface of the light transmitting member. In this case, the inflow of the resin to the light emitting portion of the photoelectric conversion element can be reliably prevented by the convex portion or the concave portion provided on the surface of the light transmitting member.

  In the method for manufacturing an electronic component, a dry gas may be filled in a space sealed with the resin in a gap between the light transmitting member and the photoelectric conversion element. In this case, it can prevent that the light emission part of the photoelectric conversion element exposed to sealed space deteriorates with a water | moisture content.

  In the electronic component manufacturing method, the dry gas may be a dry nitrogen gas. In this case, it is possible to prevent the light emitting portion of the photoelectric conversion element from being deteriorated by moisture with a relatively inexpensive dry nitrogen gas.

  In the electronic component manufacturing method, the photoelectric conversion element may be a vertical cavity surface emitting laser. In this case, the electronic component having the light transmitting member and the vertical cavity surface emitting laser can be miniaturized and the manufacturing cost can be reduced, and the mounting accuracy of the vertical cavity surface emitting laser can be improved. Can be planned.

  In the electronic component manufacturing method, the emission wavelength of the vertical cavity surface emitting laser may be 780 nm. In this case, it is possible to reduce the size and manufacturing cost of an electronic component that emits laser light having a wavelength of 780 nm.

  In the electronic component manufacturing method, the material of the light transmitting member may be BK7, D263, CG-1, synthetic quartz, or soda lime glass. In this case, by using a light transmitting member made of BK7, D263, CG-1, synthetic quartz or soda lime glass having excellent transmittance with respect to a laser beam having a wavelength of 780 nm, it is emitted from the vertical cavity surface emitting laser. Laser light can be efficiently extracted outside. In particular, when a relatively inexpensive synthetic quartz or soda lime glass is used, the manufacturing cost of an electronic component equipped with the vertical cavity surface emitting laser can be further reduced.

  In the method for manufacturing an electronic component, an antireflection film that prevents reflection of light having a wavelength of 780 nm may be formed on both surfaces of the light transmitting member. In this case, the antireflection film prevents reflection when light having a wavelength of 780 nm emitted from the vertical cavity surface emitting laser passes through the light transmitting member, and allows light from the vertical cavity surface emitting laser to pass through. It can be taken out efficiently.

  In the method for manufacturing an electronic component, the photoelectric conversion element is a light receiving element that receives light and outputs an electrical signal, and the light emitting unit receives light from which light from the outside passes through the photoelectric conversion element. The drive electrode may be an output electrode for the electrical signal. In this case, the electronic component having the light transmitting member and the light receiving element can be reduced in size and the manufacturing cost can be reduced, and the mounting accuracy of the light receiving element can be improved.

  In the method for manufacturing an electronic component, an element connection electrode connected to an electrode of the photoelectric conversion element and a substrate connection at an end of the light transmission member on a surface of the light transmission member on the photoelectric conversion element side You may form the wiring which connects the electrode for an object. In this case, the substrate connection electrode is formed at a position distant from the element connection electrode, and the substrate connection electrode and the element connection electrode are connected by the electrode connection portion. Increased freedom.

  In the electronic component manufacturing method, when laser bonding is performed using the bonding material, a material that easily transmits laser light used for the laser bonding may be used as the wiring material. In this case, the laser beam used for the laser bonding can be irradiated from the surface of the light transparent member, and the wiring portion can be efficiently passed to reach the bonding material portion. Therefore, it is possible to reduce the power of the laser beam necessary for the purpose.

  In the electronic component manufacturing method, the wiring material may be aluminum, gold, or copper. In this case, by using aluminum, gold, or copper, the wiring can be easily formed by a method such as vapor deposition or plating.

  In the electronic component manufacturing method, an anchor layer may be provided between the wiring and the light transmitting member. In this case, the adhesion of the wiring to the light transmitting member can be enhanced by the anchor layer.

  In the method for manufacturing the electronic component, after the wiring is formed through the anchor layer, a laser beam is applied from the surface opposite to the surface on which the wiring is formed to the formation region of the wiring. May be removed to remove the anchor layer. in this case,

  Moreover, in the manufacturing method of the electronic component, an anti-glare process may be performed on a region of the light transmitting member opposite to the surface on which the wiring is formed, on a region facing the wiring. In this case, after forming a conductive film such as a metal film on the entire surface of the light transmitting member on which the wiring is formed, a laser beam for wiring patterning is used to remove the conductive film from the opposite surface. When irradiating, the anti-glare processing makes it difficult for the laser light to reach the part where the wiring is to be formed, so the wiring of the light transmitting member can be easily and reliably formed.

  In the electronic component manufacturing method, the anti-glare processing may be performed by irradiating a laser beam of an ultraviolet laser. In this case, by selectively irradiating the laser beam of the ultraviolet laser, the process of partially anti-glare processing the surface of the light transmitting member can be performed accurately and easily. For example, an excimer laser can be used as the ultraviolet laser.

  In the electronic component manufacturing method, the surface of the wiring may be subjected to solder plating. In this case, solder plated on the surface of the wiring of the light transmitting member is used as a bonding material for laser bonding to the drive electrode of the photoelectric conversion element and a bonding material to the electrode of the substrate at each electrode at both ends of the wiring. Can do.

  Further, in the method of manufacturing the electronic component, a portion of the wiring surface where the solder is to be attached is plated with gold, a portion where the solder is not desired to be oxidized is oxidized, and a portion of the wiring is plated with gold. Solder plating may be applied to the wiring by attaching an amount of solder necessary for solder plating of the wiring and melting the attached solder. In this case, the solder can be easily attached to a desired portion of the wiring by supplying the solder to the gold-plated portion of the wiring and melting it.

  In the method for manufacturing an electronic component, the outer peripheral portions of the element connection electrode and the substrate connection electrode of the wiring may be oxidized before the melting of the solder. In this case, it is possible to prevent the molten solder from excessively protruding from the outer peripheral portions of the element connecting electrode and the substrate connecting electrode and short-circuiting the electrodes.

  In the electronic component manufacturing method, the solder plating may be performed so that the solder protrudes in the surface direction from the outer peripheral portions of the element connecting electrode and the substrate connecting electrode of the wiring. In this case, when laser bonding is performed on the element connection electrode and the substrate connection electrode, the laser beam for laser bonding that has passed through the light transmitting member is applied to the solder as a bonding material protruding from each electrode. By direct contact, the solder is easily melted, so that laser joining can be performed efficiently.

  In the method for manufacturing an electronic component, after a tape, a sheet, or a film having a metal film is pasted on the surface of the light transmitting member on the photoelectric conversion element side, and unnecessary portions of the metal film are removed. By solder plating the surface of the metal film, a wiring connecting the element connection electrode connected to the electrode of the photoelectric conversion element and the substrate connection electrode at the end of the light transmitting member may be formed. Good. In this case, the wiring can be formed by a simple method of attaching a tape or the like with a metal film to the surface of the light transmitting member.

  Moreover, in the said manufacturing method of an electronic component, what is affixed on the surface by the side of the said photoelectric conversion element of the said light transmissive member is resin tape, such as a polyimide which has a metal film on the surface, TSA (for semiconductors by Toray Industries, Inc.) An adhesive) sheet or a filler-less highly transparent film may be used. In this case, stick a resin tape such as polyimide with a metal film having a long-term high heat resistance and high thermal conductivity, a TSA (adhesive for semiconductor manufactured by Toray Industries, Inc.) sheet or a highly transparent film without filler. Thus, the wiring base layer made of the tape or the like is not deteriorated due to heat treatment during manufacturing of the wiring or operation of the photoelectric conversion element, and the function of the wiring is maintained over a long period of time, thereby extending the life. In addition, the heat generated during the operation of the photoelectric conversion element can be transmitted to the light transmitting member side without being shielded, thereby contributing to good heat dissipation. Furthermore, since the tape as the base layer of the wiring is excellent in transparency, when the laser beam is irradiated to the bonding material on the drive electrode of the photoelectric conversion element from the light transmitting member side during the laser bonding. , It is possible to suppress a decrease in the amount of laser light.

  In the method of manufacturing an electronic component, the wiring has an intermediate pad for supplying solder in the middle of the electrode connecting portion connecting the element connecting electrode and the substrate connecting electrode. After supplying the solder, the surface of the wiring may be solder-plated by melting the supplied solder and extending it toward the element connecting electrode and the substrate connecting electrode. In this case, after supplying the solder to the intermediate pad in the middle of the electrode connection portion, by heating, the solder on the intermediate pad is melted and moved on the wiring, thereby plating the surface of the wiring with the solder. it can. In particular, even when the size of the element connection electrode or the width of the wiring is small and it is difficult to directly apply solder to the surface, by extending and supplying the molten solder from the intermediate pad, the element connection electrode of the wiring and The surface of the electrode connecting portion extending therefrom can be reliably plated with solder.

  In the electronic component manufacturing method, a plurality of drive electrodes of the photoelectric conversion element are provided, and a set of the element connection electrode and the substrate connection electrode connected by the wiring corresponds to each of the drive electrodes. In such a case, the intermediate pads may be provided so that the distance between the solder supplying intermediate pad and the element connecting electrode in the plurality of wirings is equal to each other. In this case, since the distance between the intermediate pad for supplying solder and the element connecting electrode in the plurality of wirings is equal to each other, after supplying the solder to the intermediate pad, the molten solder on the intermediate pad is connected to the element under the same heat treatment conditions. Therefore, the plurality of element connection electrodes can be surely solder-plated.

  In the method for manufacturing an electronic component, an element connection electrode connected to an electrode of the photoelectric conversion element and a substrate connection at an end of the light transmission member on a surface of the light transmission member on the photoelectric conversion element side Forming a wiring made of aluminum connecting the electrode for plating, and forming a nickel plating layer on the surface of the wiring, a plating process forming a gold plating layer, or forming a gold plating layer on the nickel plating layer An antireflection film for preventing reflection of light emitted from the photoelectric conversion element may be formed on at least a portion of the surface of the light transmitting member through which light emitted from the photoelectric conversion element passes, by plating. In this case, since the antireflection film is formed after the aluminum wiring is formed on the surface of the light transmitting member on the photoelectric conversion element side, the antireflection film is formed on the light transmitting member before forming the aluminum wiring. Compared to the above, the adhesion between the aluminum wiring and the light transmitting member can be improved. In addition, a nickel plating layer is formed on the aluminum wiring, and a gold plating layer with high solder adhesion is formed on the aluminum wiring. The fixing force can be increased.

  In the electronic component manufacturing method, a plurality of drive electrodes for the photoelectric conversion element are provided, and a set of the element connection electrode and the substrate connection electrode connected by the wiring corresponds to each of the drive electrodes. A plurality of wirings may be provided, and the width and length of each wiring may be set so that the electrical characteristics of each wiring are equal. In this case, since the electrical characteristics of each wiring in the electronic component are equal, it becomes easy to design a drive control circuit or a drive control program on the drive circuit side for driving the photoelectric conversion element.

  In the electronic component manufacturing method, the plurality of wirings are formed so as to extend in a fan shape from the element connection electrodes toward the outer substrate connection electrodes so that the lengths of the respective wirings are equal. The plurality of substrate connection electrodes may be arranged in an arc shape at an end portion of the surface of the light transmission member on the photoelectric conversion element side. In this case, since the plurality of substrate connection electrodes are arranged in an arc shape, the bonding process between each substrate connection electrode and the substrate-side electrode is facilitated.

  In the electronic component manufacturing method, the photoelectric conversion element includes a plurality of light emitting units that are driven independently of each other by the light emitting unit, and the plurality of light emitting units and the plurality of driving electrodes are respectively elements. The width and length of each element internal wiring may be set so that the electrical characteristics of each element internal wiring are equal. In this case, since the electrical characteristics of each wiring in the electronic component including the wiring in each element inside the photoelectric conversion element are equal, the drive control circuit on the side of the driving circuit that drives the photoelectric conversion element or The design of the drive control program is further facilitated.

  Further, in the method of manufacturing the electronic component, the plurality of element wirings are formed so as to extend in a fan shape from the light emitting portion toward the outer drive electrode so that the lengths of the respective element wirings are equal, The plurality of drive electrodes may be arranged in an arc shape at an end of a surface where the light emitting portion of the photoelectric conversion element is provided. In this case, since the plurality of drive electrodes are arranged in an arc shape, the bonding process between each drive electrode and the element bonding electrode on the light transmitting member side is facilitated.

  In the electronic component manufacturing method, a preflux coating may be applied to the surface of the substrate connection electrode. In this case, the pre-flux coated on the surface of the substrate connection electrode can increase the wettability of the solder, so that the substrate connection electrode on the light transmitting member side and the electrode on the substrate side can be securely connected via the solder. Can connect.

  In the electronic component manufacturing method, the surface of the substrate connection electrode may be plated with gold. In this case, the adhesion of solder to the substrate connection electrode can be increased by gold plating on the surface of the substrate connection electrode.

  In the electronic component manufacturing method, a laser beam having a uniform laser energy distribution in a cross-sectional direction may be used as the laser beam for performing the laser bonding. In this case, even if the relative movement distance of the laser beam with respect to the electronic component when performing laser bonding is short, a plurality of laser bonding locations can be bonded uniformly.

  Further, in the method for manufacturing an electronic component, when there are a plurality of laser bonding portions for performing the laser bonding, the laser beam for performing the laser bonding is irradiated so as to irradiate at least one of the plurality of laser bonding portions. Using a pulsed laser beam having a spot size and intermittently output at a predetermined repetition frequency, the electronic component and the electronic component The relative movement between the laser beam and the repetition frequency of the laser beam may be synchronized. In this case, since the irradiation energy of the laser beam to each of the plurality of laser bonding portions can be increased, even when the bonding material hardly absorbs the laser beam, it can be melted well and laser bonding can be reliably performed.

  In the electronic component manufacturing method, a plurality of the photoelectric conversion elements are mounted on a plate material or a sheet material of the light transmission member and the laser bonding is performed, and the plate material or the sheet material of the light transmission member is attached to each photoelectric conversion element. A plurality of electronic components provided with photoelectric conversion elements may be manufactured together by cutting them so as to be separated. In this case, since the several electronic component provided with the photoelectric conversion element can be manufactured collectively on the board | plate material or sheet | seat material of the said light transmissive member, the manufacture efficiency of this electronic component can be improved.

  In the electronic component manufacturing method, a gas around the electronic component irradiated with the laser light is sucked, and a substance released from the electronic component by the laser light irradiation is sucked from the sucked gas. It may be removed. In this case, even if a harmful substance is released from the electronic component when the laser beam used for laser bonding is irradiated to the electronic component, the gas containing the substance is sucked and the harmful substance is extracted from the sucked gas. Therefore, it is possible to maintain a good working environment in a place where the electronic parts are laser-joined.

  The substrate manufacturing method according to the present invention is the above-described substrate connection formed on the light transmission member of the electronic component by manufacturing the electronic component by any one of the electronic component manufacturing methods, mounting the electronic component on the substrate, and The electrode for use and the electrode of the substrate are soldered. In this case, it is possible to reduce the size of the substrate with the electronic component and reduce the manufacturing cost.

  In the method for manufacturing the substrate, the electronic component has an end portion where the electrode for connecting the substrate of the light transmitting member is formed outside the portion facing the photoelectric conversion element, and the electronic component is exposed to the substrate. May be formed with an opening that allows the photoelectric conversion element to be inserted without interference when the electronic component is mounted with the photoelectric conversion element facing the substrate. In this case, by mounting the electronic component so that the photoelectric conversion element is inserted into the opening formed in the substrate, the portion protruding from the substrate can be reduced, so the size of the substrate on which the electronic component is mounted can be reduced. Can be planned.

  Moreover, in the manufacturing method of the said board | substrate, you may connect the back surface of the said photoelectric conversion element inserted in opening of the said board | substrate, and the back surface of this board | substrate with an adhesive agent. In this case, since the back surface of the photoelectric conversion element and the back surface of the substrate are connected by an adhesive, wobbling of the photoelectric conversion element can be suppressed, the strength of the photoelectric conversion element is increased, and the light is emitted from the photoelectric conversion element. The optical axis can be prevented from blurring.

  Moreover, in the manufacturing method of the said board | substrate, you may connect the ground electrode in the back surface of the said photoelectric conversion element, and the ground electrode in the back surface of the said board | substrate with a conductive adhesive. In this case, since the conductive adhesive for fixing the photoelectric conversion element can also be used for the connection between the ground electrode of the photoelectric conversion element and the ground electrode of the substrate, it is not necessary to separately provide wiring for connecting both ground electrodes. .

  According to the present invention, a photoelectric conversion element that can be mounted on a substrate by bonding a driving electrode of a photoelectric conversion element and an element connection electrode of a light transmission member via a conductive bonding material without using a package. And since the electronic component provided with the light transmissive member can be manufactured, it is possible to reduce the size and the manufacturing cost of the electronic component including the photoelectric conversion element and the like. In addition, the bonding enables the photoelectric conversion element to be positioned and attached to the light transmission member with high accuracy without using a package, so that there is an effect that the attachment accuracy of the photoelectric conversion element can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view showing a configuration example of an electronic component according to this embodiment. The electronic component 1 includes a vertical cavity surface emitting laser (hereinafter referred to as a “VCSEL element”) 10 as a photoelectric conversion element that emits light based on an electrical signal, and light provided on the light emitting part side of the VCSEL element 10. The cap glass 20 which is a glass plate as a transmissive member is provided.

  The VCSEL element 10 emits laser light having a predetermined wavelength from the semiconductor substrate surface orthogonal to the thickness direction, not from the end surface. In this embodiment, an electronic component having a VCSEL element 10 that outputs a laser beam having a wavelength of 780 nm as a photoelectric conversion element with a structure in which compound semiconductors are stacked will be described. However, the present invention is limited to this VCSEL element 10. The present invention can be applied to an electronic component having another photoelectric conversion element.

  The cap glass 20 is made of a material that transmits laser light output from the VCSEL element 10 (laser light having a wavelength of 780 nm in the present embodiment), and reflects the laser light from the VCSEL element 10 on both sides thereof. An antireflection film 21 is formed to prevent it. On the surface of the cap glass 20 on the VCSEL element 10 side, an element connection electrode connected to the drive electrode of the VCSEL element 10, a substrate connection electrode at the end of the cap glass 20, and these element connection electrodes, A wiring 30 including an electrode connecting portion that connects the substrate connecting electrodes is formed. Further, a drive electrode is provided at the end of the surface (upper surface in FIG. 1) where the light emitting portion of the VCSEL element 10 is provided. The drive electrode of the VCSEL element 10 and the element connection electrode of the wiring of the cap glass 20 are laser bonded via a conductive bonding material 40. Moreover, the edge part of the VCSEL element 10 and the surface of the cap glass 20 are sealed with the resin 50, and a sealed space 70 is formed in the gap between the VCSEL element 10 and the cap glass 20. The sealed space 70 is filled with a dry gas such as a dry nitrogen gas so that the VCSEL element 10 does not deteriorate. In addition, a solder layer 60 by solder plating for connecting to the electrode on the substrate side is formed on the substrate connection electrode at the outer end of the wiring 30 on the cap glass 20.

  As a material of the cap glass 20, a material specified by the symbols BK7, D263, or CG-1, or a relatively inexpensive synthetic quartz or soda lime glass can be used. As the cap glass such as BK7, D263, CG-1, etc., those manufactured by Kyocera Corporation can be used, for example, which are good in a wide wavelength range including 780 nm as shown in FIGS. 2 (a) and 2 (b). It has spectral transmittance.

Further, as the antireflection film 21 formed on both surfaces of the cap glass 20, for example, the antireflection film 21 having a two-layer structure composed of the SiO layer 21a and the SiO ₂ film 21b as shown in FIG. 3 may be formed. it can. In the illustrated example, first, a SiO layer 21a (for example, thickness: 100 nm) is formed on the surface of the cap glass 20 (for example, material: D263, thickness: 0.55 mm), and further, a SiO ₂ film 21b ( For example, a thickness: 100 nm) is formed. The antireflection film 21 may be formed on both surfaces of the cap glass 20 in advance before forming the wiring 30 or the like, or after forming the wiring 30 or the like, a bonding material for laser bonding may be formed on the wiring electrode. You may form before providing. The antireflection film 21 may be formed on the entire surface of the cap glass, or may be selectively formed on at least a surface portion through which the laser light from the VCSEL element 10 is transmitted.

  In order to prevent the deterioration of the antireflection film 12, the surface of the antireflection film 12 is made of a resin tape (for example, a resin tape made of polyimide, a TSA (Toray Semiconductor Adhesive) sheet, or a filler-less highly transparent film. The TSA sheet is an adhesive sheet for semiconductors manufactured by Toray Industries, Inc. having a reflow resistance of 240 ° C. or 260 ° C., and is a thermoplastic resin, an epoxy resin, inorganic particles, and a curing agent. The adhesive layer (thickness: 30, 50, 100 μm) is sandwiched between cover films (PET film, thickness: 38, 75 μm), and this TSA sheet is reflowed, etc. Even after the high-temperature treatment, high transparency (spectral transmittance for wavelength 780 nm: 97%). The type of film, for example, it is possible to use a resin film lubricant is made of a material that is not kneaded.

  As the material of the wiring 30, a conductive material that easily transmits laser light used for the laser bonding (for example, YAG laser light having a wavelength of 1064 nm) can be used. Specific examples of the material of the wiring 30 include aluminum, gold, copper, and the like, and an anchor layer may be provided between the wiring 30 and the antireflection film 12 on the cap glass 20 as necessary. . For example, when copper is used as the material of the wiring 30, for example, a Cr layer or a Ti layer of about several tens nm to several hundreds nm may be provided as the anchor layer.

  Examples of the bonding material 40 include a metal material that absorbs and melts laser light used for laser bonding (for example, YAG laser light having a wavelength of 1064 nm) and has an electrical resistance equal to or lower than that of solder, and a crystal structure having a face-centered cubic lattice structure. Other metal materials can be used. In addition, the VCSEL element 10 may expand and contract along the surface direction due to heat generated during laser light emission driving, and even when such expansion and contraction occurs, the VCSEL element 10 is located between the drive electrode on the VCSEL element 10 side and the element connection electrode of the cap glass 20. As the bonding material 40, a ductile metal material is preferable.

  Specific examples of the metal material that can be used as the bonding material 40 include solder, molybdenum, zinc, cobalt, tungsten, tin, and cadmium. In the case where “solder” is used as the bonding material 40, it is preferable that the light emitting surface from which the laser light of the VCSEL element 10 is emitted is used in a flux-free manner so as not to be contaminated with the flux.

As the “solder” used for the laser bonding, Sn—Ag—Cu solder, Sn—Bi solder, or the like having a relatively low melting temperature can be used. More specifically, the solder paste shown in the following (1) to (5) can be used.
(1) Product number manufactured by Senju Metal Industry Co., Ltd .: M705
Alloy composition: Sn-3Ag-0.5Cu, melting temperature (solidus: 217 ° C, liquidus: 220 ° C)
(2) Product number manufactured by Senju Metal Industry Co., Ltd .: L20
Alloy composition: Sn-58Bi, melting temperature (solidus: 139 ° C, liquidus: 141 ° C)
(3) Product number manufactured by Senju Metal Industry Co., Ltd .: L23
Alloy composition: Sn-57Bi-1Ag, melting temperature (solidus: 138 ° C, liquidus: 204 ° C)
(4) Product number manufactured by Tamura Corporation: # 402
Alloy composition: 42Sn / Ag / 57Bi, melting temperature (138 ° C)
(5) Product number manufactured by Arakawa Chemical Industries, Ltd .: LLS140
Alloy composition: Sn / Bi / Cu, melting temperature (solidus: 139 ° C, liquidus: 170 ° C)

  As the material of the sealing resin 50, for example, an epoxy resin can be used. More specifically, a black one-pack epoxy resin (product number: XNR5163NF, XNR5163) manufactured by Nagase ChemteX Corporation is applied and cured under curing conditions (for example, 100 ° C / 1 hour + 150 ° C / 1 hour). Let it be used.

  In addition, a resin (eg, polyimide, TSA) tape with a metal film such as a copper foil or an aluminum foil is attached to the surface of the cap glass 20 facing the VCSEL element 10, and an unnecessary portion of the copper foil is removed with an excimer laser (eg, a wavelength). The wiring 30 may be formed by selective removal with an ultraviolet laser such as 248 nm) or a YAG triple wave laser (for example, wavelength 355 nm). Then, the surface of the metal film in the portion constituting the element connection electrode of the wiring 30 is solder-plated, and the element connection electrode of the wiring 30 and the drive electrode of the VCSEL element 10 are laser-bonded via the solder. It may be.

  In addition, on the surface of the cap glass 20 facing the VCSEL element 10, an aluminum wiring comprising an element connection electrode connected to the drive electrode of the VCSEL element 10 and an electrode connection portion connecting the substrate connection electrode and both electrodes. 30 is formed, the surface of the wiring 30 is plated with at least one of nickel and gold, and the reflection of the laser light emitted from the VCSEL element is prevented on the entire surface of the cap glass 20 including the plated surface. An antireflection film may be formed.

  FIG. 4 is a plan view showing a configuration example of the VCSEL element 10. The VCSEL element 10 is a plate-like element having a side length of, for example, about 1 mm. The VCSEL element 10 includes a light emitting unit 11 including a plurality of laser emitting units at the center, and each laser emitting unit of the light emitting unit 11. In-element wiring 13 is formed extending to the vicinity of the four sides on the outside. The drive electrode 12 to be laser-bonded is provided at the end of each of the plurality of intra-element wires 13.

  FIG. 5A is a plan view showing a configuration example of the cap glass 20. As shown in FIG. 5, the surface of the cap glass 20 is so exposed that the end portion of the cap glass 20 on which the substrate connection electrode is formed is exposed to the outside of the facing portion 20 ′ facing the VCSEL element 10. The size in the direction is larger than that of the VCSEL element 10. Also, an element connection electrode 31 that is laser-bonded to the drive electrode of the VCSEL element 10 is formed on the surface (back side of the paper) of the facing portion 20 ′ facing the VCSEL element 10 in the center of the cap glass 20. (See FIG. 5B). The element connection electrode 31, the substrate connection electrode 32 formed at the end near the four sides of the cap glass 20, and the electrode connection portion 33 connecting the electrodes 31, 32 constitute the wiring 30. ing.

  The wiring 30 may be provided with an intermediate pad for supplying solder in the middle of the electrode connecting portion connecting the element connecting electrode connected to the VCSEL element 10 side and the substrate connecting electrode connected to the substrate side. Good. In this case, after supplying the solder to the intermediate pad in the middle of the electrode connection portion, by heating, the solder on the intermediate pad is melted and moved on the wiring, thereby plating the surface of the wiring with the solder. it can. In particular, even when the size of the element connection electrode and the width of the wiring are small and it is difficult to apply solder directly to the surfaces thereof, the molten solder from the intermediate pad is extended and supplied, thereby connecting the elements of the wiring 30 The surface of the electrode and the electrode connecting portion extending therefrom can be reliably plated with solder.

  Further, the intermediate pad may be provided so that the distance between the intermediate pad and the element connection electrode is equal to each other in each wiring 30. In this case, since the distance between the solder supply intermediate pad and the element connection electrode in the plurality of wirings 30 is equal to each other, after supplying the solder to the intermediate pad, the molten solder on the intermediate pad is applied to the element under the same heat treatment conditions. Since the connection electrodes can be extended, the element connection electrodes of the plurality of wirings can be surely solder-plated.

  FIGS. 6A to 6D are explanatory views showing a configuration example of the wiring 30 having the intermediate pad 34 for supplying the solder. An intermediate pad 34 is formed on the wiring 30 in FIG. 6A so as to extend in parallel and linearly from the element connection electrode 31 toward the outer substrate connection electrode 32. In this case, the widths of the element connection electrode 31 and the intermediate pad 34 are set to be approximately the same, and the plurality of wirings 30 can be compactly collected. In addition, square and circular intermediate pads 34 are formed in the wirings 30 of FIGS. 6B and 6C, respectively. 6D, an intermediate pad 34 extending in a wedge shape from the element connection electrode 31 toward the outer substrate connection electrode 32 is formed. Each of the wirings 30 shown in FIGS. 6A to 6D is configured such that the distances between the solder supply intermediate pads 34 and the element connection electrodes 31 in the plurality of wirings 30 are substantially equal to each other. The element connection electrode 31 of each wiring 30 can be reliably solder-plated.

  FIGS. 7A and 7B are plan views showing a configuration example of the wiring 30 in which the intermediate pad is not formed and the wiring 30 in which the intermediate pad is formed in the square cap glass 20, respectively. In the example of FIG. 7B, the circular intermediate pad 34 is formed. However, as shown in FIG. 8, an intermediate pad 34 having another shape such as a square may be formed.

  The intermediate pad of the wiring 30 can also serve as a test pad. For example, after joining the electrode of the VCSEL element 10 and the electrode of the cap glass 20, contact the tip of the inspection probe of the inspection apparatus with the intermediate pad of the wiring 30 before mounting the electronic component including them on the substrate. By doing so, the VCSEL element 10 can be inspected. In particular, after an electronic component including the VCSEL element 10 and the cap glass 20 is mounted on a substrate, the electrode of the VCSEL element 10 and the electrode of the cap glass 20 are not exposed. High utility value as a test pad. In this case, the substrate is mounted on the electronic component so that the intermediate pad of the wiring 30 is exposed, and the tip of the inspection probe of the inspection apparatus is brought into contact with the intermediate pad of the electronic component.

  Further, the width, length, and electrode shape of each wiring 30 may be set so that the electrical characteristics of the plurality of wirings 30 are equal. In this case, the synchronization of driving each of the plurality of laser light emitting units in the light emitting unit 11 of the VCSEL element 10 at a predetermined timing without adopting a complicated drive signal control circuit or control program in a laser drive unit (not shown). Drive can be performed.

  As an example of the configuration in which the plurality of wirings 30 are configured so that the lengths of the electrode connection portions 33 of the respective wirings are equal, for example, a fan shape extends from the element connection electrode 31 toward the outer substrate connection electrode 32. Thus, the electrode connection portion 33 is formed, and the plurality of substrate connection electrodes 32 are arranged in an arc shape at the end of the surface of the cap glass 20 facing the VCSEL element 10. Various shapes can be adopted as the shape of the substrate connection electrode 32 at the outer end of each wiring 30. For example, the substrate connection electrode 32 having a quadrangular shape, a circular shape, a wedge shape, or the like exemplified in the above-described intermediate pad may be formed.

  Note that the plurality of intra-element wirings 13 of the VCSEL element 10 may also be formed so that the electrical characteristics of the intra-element wirings 13 are equal. For example, a plurality of in-element wirings 13 are fan-shaped from each laser light emitting part of the light emitting part 11 at the center of the VCSEL element 10 toward the outer drive electrode 12 so that the lengths of the in-element wirings are equal. The plurality of drive electrodes 12 are formed in an arc shape at the end of the surface where the light emitting portion 11 of the VCSEL element is provided. In this case, the synchronous drive of each laser light emission part can be performed more accurately.

  FIG. 9 is a cross-sectional view of the substrate 90 on which the electronic component 1 having the VCSEL element 10 is mounted. The substrate 90 is formed with an opening 90a into which the VCSEL element 10 can be inserted without interference when the electronic component 1 is mounted with the VCSEL element 10 facing the substrate. The substrate connection electrode 32 formed at the end of the surface of the cap glass 20 constituting the electronic component 1 on the VCSEL element side is connected to the substrate via the solder 60 plated in advance on the substrate connection electrode 32. It is connected to the electrode on the 90 side. The ground electrode 14 on the back surface of the VCSEL element 10 and the ground electrode 91 on the back surface of the substrate 90 are connected by a conductive adhesive 93. At the time of this connection, a gas layer 80 made of air or the like is formed so that the conductive adhesive 93 and the sealing resin 50 do not come into contact with each other.

  FIG. 10 is a cross-sectional view of the substrate 90 on which the electronic component 1 having the drive IC 95 as the drive circuit component attached to the surface of the cap glass 20 is mounted. In this electronic component 1, a drive IC 95 that drives the VCSEL element 10 is mounted on a portion of the front surface of the cap glass 20 where the VCSEL element 10 is not opposed to the laser light from the VCSEL element 10. . The electrode of the drive IC 95 and the electrode of the cap glass 20 are joined with solder or the like, and the wiring between the electrode of the cap glass 20 and the substrate 90 passes, for example, through a through hole (not shown) formed in the cap glass 20 in advance. It is formed. When the drive IC 95 is mounted on the cap glass 20 in this way, the distance from the drive IC 95 can be shortened, and high-speed drive processing of laser emission of the VCSEL element 10 can be performed. Note that the driving IC 95 may be mounted not in the front surface of the cap glass 20 but in a free space on the back surface on the VCSEL element 10 side.

  FIG. 11 is an explanatory diagram showing a configuration example of a light source device in which a substrate 90 on which the electronic component 1 is mounted is incorporated. In this light source device, the optical system 2 is disposed above the electronic component 1 including the VCSEL element 10 mounted on the substrate 90. The optical system 2 includes an imaging lens 201 that forms an image of the laser light L from the VCSEL element 10 on an irradiation target, and a beam splitter 202 that divides a part of the laser light L from the VCSEL element 10 in a substantially perpendicular direction. And a laser beam detector 203 for energy monitoring that detects the laser beam Ls divided by the beam splitter 202. The output signal of the laser light detection device 203 is fed back to the drive control circuit on the substrate 90 side on which the electronic component 1 is mounted.

  FIG. 12 is an explanatory diagram illustrating another configuration example of the light source device in which the substrate 90 on which the electronic component 1 is mounted is incorporated. In this configuration example, the substrate 90 on which the electronic component 1 including the VCSEL element 10 is mounted is fixed to the substrate holding member 3 by the mounting screws 301. The optical axis of the laser beam Ls emitted from the VCSEL element 10 and split by the beam splitter 202 can be adjusted by adjusting the tilt angle of the beam splitter holder 2a of the optical system 2 with respect to the upper surface of the substrate holding member 3. It is like that. The turning angle of the beam splitter holding portion 2a of the optical system 2 is adjusted by turning the turning angle adjusting screw 303 so that the shaft 302 disposed in the gap between the upper surface of the substrate holding member 3 and the lower surface of the optical system 2 is a fulcrum. This can be done by tilting the beam splitter holder 2a of the system 2. In the configuration example of FIG. 12, the imaging lens 201 is provided in an imaging lens holding unit 2b separate from the beam splitter holding unit 2a, and the optical axis of the beam splitter holding unit 2a and the imaging lens holding unit 2b. These optical axes can be adjusted independently of each other.

  FIGS. 13A to 13E are explanatory views showing an example of a manufacturing process of an electronic component. First, the antireflection film 21 is coated on both sides of the cap glass 20 made of BK7, D263, CG-1, synthetic quartz or soda lime glass (see FIG. 13A). When the cap glass 20 coated with the antireflection film 21 is used, this antireflection film coating process can be omitted.

Next, at the end of one side (lower surface) of the cap glass 20 near the four sides, a low-resistance metal material that is a conductive material (for example, aluminum or copper with Cr or Ti as an anchor layer) A plurality of wirings 30 are formed by patterning (see FIG. 13B). When forming an aluminum layer as a base layer of wiring, it can be formed, for example, with the following vapor deposition (sputtering) apparatus and conditions.
(1) Vapor deposition equipment:
-Manufacturer name: Shinko Seiki Co., Ltd.-Model: SRV4311
・ Performance: 3 source magnetron sputtering source (500W or more),
Substrate cooling heating rotation mechanism (300 ° C normal use or more)
(2) Deposition conditions ・ Vacuum degree: 3.7 × 10 ⁻⁵ Pa
・ Target: Pure aluminum ・ Sputtering conditions (see Table 1)
Film formation thickness: The aluminum film formation condition based on experience was 0.66 μm / h, and an aluminum layer of 0.99 μm≈1 μm was formed by the film formation process for 90 minutes.

  In addition, when an aluminum layer is formed as the base layer of the wiring 30 and solder is used as the bonding material, it is difficult to bond aluminum and solder. Therefore, as shown in FIG. 14, nickel having a predetermined thickness is formed on the aluminum layer 30a. It is preferable to first form a plating layer 30b (for example, thickness: 3 μm), and further form a gold plating layer 30c (for example, thickness: 450 nm) thereon. The pattern of the solder 60 as the bonding material is formed on the gold plating layer 30c. This gold-plated layer acts as a catalyst to help solder joining.

The nickel plating can be performed in the following steps (1) to (8). Here, the reason for performing the zinc substitution twice is to make the zinc coating uniform and improve the adhesion.
(1) Degreasing: Removes processing oil and dirt adhering to the surface to be plated.
(2) Etching: The surface is dissolved thinly to remove a natural oxide film or the like.
(3) Desmut: removing impurities generated on the surface by etching.
(4) First zinc substitution: a thin zinc coating is formed on the surface of aluminum.
(5) Substitution layer peeling: Zinc coating is removed.
(6) Second zinc substitution: Again, a thin zinc coating is formed on the aluminum surface.
(7) Electroless Ni plating: Nickel is plated by a reduction reaction with hypophosphorous acid.
(8) Drying: removing moisture.

  Next, a low-resistance metal material (for example, the above-described solder, which is a conductive material that can be melted by absorbing laser light for bonding as a bonding material on the surface of the element connection electrode 31 at the inner end of each wiring 30. A bonding layer made of cream, molybdenum, zinc, or the like) is formed by a method such as printing, vapor deposition, or plating (see FIG. 13C). In addition, a preflux (PF) is applied to the surface of the substrate connection electrode 32 at the outer end of each wiring 30 in order to prevent oxidation of the surface of the wiring electrode material and to improve solderability at the time of connection to the substrate. Coat (see FIG. 13C). Instead of coating preflux (PF), a gold plating layer or the like may be provided. For example, when the aluminum layer 30a is formed as the base layer of the wiring 30 as shown in FIG. 14, the nickel layer 30b and the gold layer 30c are further provided on the surface of the aluminum layer 30a, and the surface of the gold layer 30c is further provided. You may coat with 60 layers of solder. The drive electrode 12 on the VCSEL element 10 side shown in FIG. 14 is composed of a Cr layer (eg, 2 nm thick), an Au / Zn layer (eg, 12 nm thick), and an Au layer (eg, 450 nm thick) from the bottom. It has a layered structure.

  Next, the drive electrode of the VCSEL element 10 is brought into close contact with the element connection electrode 31 of the wiring 30 of the cap glass 20 through the bonding material 40, and the opposite surface of the cap glass 20 opposite to the opposite surface facing the VCSEL element 10. A processing laser beam (for example, YAG laser beam) Lp having a wavelength that can be transmitted through the cap glass 20 is irradiated so as to pass the cap glass 20 from the surface and reach the bonding material 40 (FIG. 13D). 15). During the irradiation of the processing laser beam Lp, pressure may be applied so as to increase the adhesion between the element connection electrode 31 of the wiring 30 of the cap glass 20 and the drive electrode of the VCSEL element 10 through the bonding material 40. The bonding material 40 is melted by irradiation with the processing laser beam Lp, and the element connection electrode 31 of the wiring 30 of the cap glass 20 and the drive electrode of the VCSEL element 10 can be bonded.

  Next, the end portion of the VCSEL element 10 and the surface of the cap glass 20 are bonded to the resin 50 so that a sealed space 70 is formed in the gap between the surface where the light output portion of the VCSEL element 10 is exposed and the cap glass 20. (See FIG. 13E). In this case, a resin inflow prevention portion that prevents the resin 50 from flowing into the light emitting portion of the VCSEL element 10 when sealing with the resin 50 may be provided on the surface of the facing surface of the cap glass 20. For example, as the resin inflow blocking portion, a portion of the surface of the cap glass 20 (the surface of the antireflection film 21) with increased water repellency with respect to the resin 50 is provided, or a convex portion or a concave portion is provided.

  Alternatively, the dry gas may be sent into the sealed space in advance before the sealing so that the sealed space sealed with the resin 50 is filled with a dry gas such as dry nitrogen gas. For example, the sealed space 70 is formed in the gap between the cap glass 20 and the VCSEL element 10 by laser bonding of the drive electrode of the VCSEL element 10 and the element connection electrode 31 of the cap glass 20 through the bonding material 40. Alternatively, the surface of the cap glass 20 and the end of the VCSEL element 10 may be sealed. More specifically, as shown in FIG. 16A, a through hole 55 that penetrates the cap glass 20 and the wiring 30 (element connection electrode 31) is formed, and the sealed space is formed after joining through the through hole 55. A dry gas 56 such as dry nitrogen gas is fed into the space 71 to be formed. Then, as shown in FIG. 16B, by performing laser bonding in a state where the space 71 is filled with the dry gas 56, the through hole 55 is sealed with the bonding material 40, and the sealing formed by laser bonding. The space 70 is filled with a dry gas 56.

  17A to 17E are explanatory views showing examples of other manufacturing steps of the electronic component. In this example, when the wiring 30 is formed of an aluminum layer, the aluminum layer is easily peeled off by the antireflection film 21 on the surface of the cap glass 20, so the antireflection film 21 is formed after the wiring 30 is formed. Yes. First, a plurality of wirings 30 are patterned with aluminum, which is a conductive material, at end portions near the four sides of one surface (lower surface) of cap glass 20 made of BK7, D263, CG-1, synthetic quartz or soda lime glass. (See FIG. 17A). A nickel plating layer is formed on the aluminum layer of the wiring 30 as described above, and a gold plating layer is further formed thereon. When the aluminum layer is directly formed on the surface of the cap glass 20 as in this example of the manufacturing process, the adhesion between the surface of the cap glass 20 and the aluminum layer is good, and therefore copper is used as the material of the wiring 30. It is not necessary to provide a Ti or Cr anchor layer like that on the cap glass surface.

  Next, the antireflection film 21 is formed on a portion where the surface of the cap glass 20 is exposed (see FIG. 17B). In the illustrated example, the antireflection film 21 is formed on the entire upper surface (front surface) of the cap glass 20 and on the lower surface (back surface) where the wiring 30 is not formed. In the illustrated example, since there is a gold plating layer on which the antireflection film 21 is difficult to adhere to the surface of the wiring 30, even if the antireflection film 21 is formed on the entire lower surface (back surface) of the cap glass 20, the wiring surface As a result, the antireflection film 21 is formed only on the lower surface (back surface) of the cap glass 20 where the wiring 30 is not formed. Further, the antireflection film 21 may be formed only on the surface through which the laser light from the VCSEL element 10 passes.

  The subsequent solder layer (joining material) formation, laser joining, and the like shown in FIGS. 17C to 17E can be performed in the same manner as in FIGS. 13C to 13E.

  18A to 18E are explanatory views showing examples of still another manufacturing process for electronic components. In this example, the wiring 30 is formed using the sheet | seat (for example, above-mentioned TSA sheet) 35 with metal films, such as copper foil and aluminum foil. First, the TSA sheet 35 with a metal film is affixed on the entire surface of the cap glass 20 made of BK7, D263, CG-1, synthetic quartz or soda lime glass (see FIG. 18A). At this time, the metal film 35a side of the TSA sheet with metal film 35 is attached so as to be exposed on the surface.

  Next, an excimer laser (for example, wavelength 248 nm) for wiring patterning that removes the metal film, a YAG triple wave laser (for example, wavelength 355 nm), or the like on the portion other than the wiring formation portion of the TSA sheet 35 with a metal film of the cap glass 20 UV laser Lp (UV) is irradiated (see FIG. 18B). Thereby, the wiring 30 having a predetermined pattern can be formed on the surface of the cap glass 20. In the illustrated example, an ultraviolet laser for wiring patterning is a laser beam that passes through the cap glass 20, and the wiring patterning is performed from the opposite side of the surface of the cap glass 20 to which the TSA sheet with metal film 35 is attached. Irradiation with ultraviolet laser.

  Here, the surface opposite to the surface of the cap glass 20 opposite to the surface on which the wiring is formed is irradiated with ultraviolet laser light such as an excimer laser (for example, wavelength 248 nm) having a predetermined power in advance. You may give the glare-proof processing which roughens. In this case, even if a relatively large ultraviolet laser for irradiation spot wiring patterning is irradiated from the side opposite to the surface on which the TSA sheet 35 with the metal film of the cap glass 20 is attached, wiring is performed by the above antiglare processing. Since it becomes difficult for the laser beam to reach the portion to be formed, the wiring of the cap glass 10 can be easily and reliably formed. When the wiring patterning ultraviolet laser does not pass through the cap glass 20, the wiring patterning ultraviolet laser is irradiated from the surface of the cap glass 20 to which the TSA sheet 35 with the metal film is attached.

  The subsequent solder layer (joining material) formation, laser joining, and the like shown in FIGS. 18C to 18E can be performed in the same manner as in FIGS. 13C to 13E. Instead of the TSA sheet 35 with a metal film, a resin tape such as polyimide with a metal film, or a fillerless highly transparent film with a metal film may be attached.

  FIG. 19 is an explanatory view showing a configuration example of a laser processing apparatus used for laser joining of electronic components. This laser processing apparatus holds a YAG (yttrium, aluminum, garnet) laser apparatus 101 that emits laser light having a wavelength of 1064 nm, an incident optical system 102, a step index optical fiber 103, an imaging optical system 104, and a workpiece W. An XY table 105 on which a work holding device 106 is mounted, a main controller (not shown) that constitutes a machining control unit, and the like are provided. The workpiece holding device 105 and the XY table are used as relative movement means for moving the laser light irradiation point and the workpiece W relative to the workpiece W having the VCSEL element 10 and the cap glass 20.

  The YAG laser device 101 includes a laser chamber which is a rod rod crystal of YAG to which an appropriate amount of Nd (neodymium) is added, a laser chamber containing a pump for excitation thereof, and an optical path of stimulated emission light emitted therefrom. And a front mirror and a rear mirror arranged to face each other at a predetermined distance. A shutter and a Q switch are attached between the rear mirror and the laser chamber. The front mirror is a mirror having a reflectivity capable of transmitting a part of light, and is attached to the optical path of the laser chamber with the center of the mirror surface facing it. The rear mirror has a mirror surface capable of substantial total reflection, and is attached to face the front mirror. The shutter blocks the optical path of the laser chamber. The Q switch instantaneously increases the Q value of the resonator between the front mirror and the rear mirror, and takes out a high-power laser pulse.

  As the YAG laser device 101, for example, one having a maximum output of 40 W, a maximum processing frequency of 50 kHz, and a beam size of 3 mm can be used. Depending on the processing conditions, this Q switch may not be used. The configuration of the YAG laser device 101 is an example, and is not limited to this. As another configuration, for example, there is a configuration using LD excitation.

  The incident optical system 102 includes a laser beam expander and a condenser lens. The laser beam emitted from the YAG laser device 101 and having a beam diameter of about 3 mm is expanded by a laser beam expander, and then the light incident end (core portion) of the step index type optical fiber 103 by a condenser lens. The beam is condensed and guided to a beam diameter of about 0.8 mm on the end face. Laser light emitted from the light emitting end (core end face) of the optical fiber 103 is irradiated to the workpiece W on the XY table 105 through an imaging optical system 104 described later.

  In the step index type optical fiber 103, the core of the axial core portion having a predetermined diameter (for example, 0.8 mm) has a higher refractive index than the cladding layer of the outer peripheral portion, and is refracted at the boundary between the core and the cladding layer The rate is changing on the step. When the laser light is focused and incident on the core of the step index type optical fiber 103, a plurality of light components incident at different angles of the laser light are transmitted through the core while being reflected multiple times at the boundary between the core and the cladding layer. Is done. As described above, the plurality of light components of the laser light are transmitted while being reflected in the core of the optical fiber 103 in a multiple manner, so that the energy density in the cross section of the laser light emitted from the light emitting end of the optical fiber 103 becomes uniform. ing. That is, even if the laser beam emitted from the YAG laser device 101 is a single mode laser beam having a Gaussian energy distribution shown in FIG. 20A or a multimode laser beam shown in FIG. After passing through 103, the laser beam has a uniform energy density as shown in FIG.

  FIG. 21 is a side view showing one configuration of the work holding device 106. The work holding device 106 serves to hold the work W on the work set unit 111 at the center of the work table 110 so that the position is not shifted during processing. The position of the workpiece W set on the workpiece setting unit 111 of the workpiece table 110 is finely adjusted by the position adjustment unit 112 using an XYθ manual stage. The XY table 105 that moves the entire work holding device 106 mainly includes an XY table main body and an XY table controller that controls the XY table main body. The work holding device 106 is attached on the XY table main body.

  Further, in the region 111a around the work of the work set unit 111, as shown in FIG. 22, in the case of an element using a toxic substance (for example, a GaAs compound semiconductor) that may be generated from the work W during laser bonding. Are provided with a plurality of suction ports 115 for sucking arsenic (As) together with gas. The gas sucked from the suction port 115 is guided from the joint 114 to the suction device 120 having a predetermined filter shown in FIG. The suction device 120 removes toxic substances such as arsenic by passing the gas sucked from the work set unit 111 through a plurality of filters 121. The gas that has passed through the filter device 120 is guided to the exhaust duct after other dust is removed by the dust collector 125. As the filter 121, for example, a mechanical filter (model: RL3-N3) manufactured by Shigematsu Corporation can be used.

  Further, the work set unit 111 is provided with a work pressing mechanism using a spring or the like shown in FIG. In this work pressing mechanism, the intermediate pressing member 119 is floated so that the work W composed of the VICSEL element 10 and the cap glass 20 is held by the work holder 116 and comes into contact with the upper surface of the cap glass 20 positioned above the work W. Set in state. By pressing a plurality of ends (two or three or more) of the intermediate pressing member 119 via the spring 118 by the pressing member 117, the cap glass 20 can be removed without applying excessive stress to the VICSEL element 10. The VICSEL element 10 can be uniformly pressed. By performing laser bonding in this state, a bonding material (for example, at a plurality of bonding points between the element connection electrode of the cap glass 20 and the drive electrode of the VICSEL element 10 without generating cracks in the VICSEL element 10). Even if there is a variation in the thickness of the solder), the pressing force between the electrodes at each joining portion becomes substantially equal, and uniform laser joining can be performed.

  The imaging optical system 104 includes a fiber holding unit that holds the tip of the optical fiber 7 and a plurality of lenses, and focuses the laser light Lp that has passed through the optical fiber 103 to form an image on the workpiece W. It is. The magnification of the imaging optical system 66 is set to 1/2, for example, but is not limited to this magnification.

  The main controller controls the entire laser processing apparatus, and is connected to a YAG laser apparatus 101, an XY table controller, and the like.

  FIG. 25 is a graph showing the relationship between the repetition frequency (processing frequency) of Q-switched YAG laser light used for laser bonding, peak energy, and pulse width. The lower the repetition frequency, the larger the energy per shot, and the higher the repetition frequency, the smaller the energy per shot. Therefore, when melting the bonding material or solder at the time of laser bonding in this embodiment, a high repetition frequency is used. On the other hand, when a part of the metal film of the wiring is skipped and removed, a low repetition frequency is used. Note that the peak energy in FIG. 25 is obtained by dividing the energy per shot of the laser pulse by the pulse width.

  FIG. 26 is a graph showing the relationship between the lamp current value of Q-switched YAG laser light used for laser bonding and the output power. The laser output emitted from the YAG laser device 101 varies depending on the lamp current value as shown, and can be adjusted in the range of, for example, 23 W to 40 W. Here, the laser output in FIG. 26 can be obtained by applying the energy per shot of the laser pulse to the repetition frequency.

FIG. 27 is an explanatory diagram of the beam size of laser light used for laser bonding.
When a laser beam having a beam size LB1 (for example, about φ30 μm) comparable to that of the drive electrode 12 of the VCSEL element 10 is used, the pulsed laser beam is irradiated onto each laser junction (drive electrode 12). The relative moving speed between the workpiece W and the laser beam Lp is synchronized with the repetition frequency of the laser beam.
Further, a laser beam having a beam size LB2 (for example, about φ400 μm) that covers the plurality of drive electrodes 12 of the VCSEL element 10 may be used. In this case, laser bonding can be reliably performed on the plurality of drive electrodes 12 on the entire surface of the VCSEL element 10 with a relatively small number of scans of laser light. In particular, when a laser beam having a large beam size LB2 with a uniform energy distribution is used as in the present embodiment, the laser beam is emitted while partially overlapping the irradiation spot S of the laser beam as shown in FIG. By scanning about four times, laser bonding can be reliably performed on the plurality of drive electrodes 12 on the entire surface of the VCSEL element 10.

FIG. 29 is an explanatory diagram of a manufacturing process of an electronic component using a glass wafer according to another embodiment. In this manufacturing method, each VCSEL element 10 separated from the semiconductor wafer 110 on which a plurality of VCSEL elements 10 are formed is mounted on a glass wafer 22 as a base material (plate material) of the cap glass 20, and the laser bonding and drying are performed. Seal with gas. Thereafter, the glass wafer 22 is cut so as to be separated for each mounting portion of each VCSEL element 10. Thereby, many electronic components 1 each provided with the VCSEL element 10 can be manufactured collectively. As the cutting method of the glass wafer 22, (1) a dicing method in which a disk blade is rotated at a high speed, (2) a wafer scribing method in which a scratch is made while pulling with a non-rotating diamond blade, and then a breaking method is applied. There is a method of cutting with an ultraviolet laser such as an excimer laser. In the method of cutting using the laser, a laser that can output laser light having a wavelength that is well absorbed by the glass wafer 22 that is a material of the cap glass is used as a laser light source. For example, when the glass material is D263, an excimer laser that can output a laser beam having a wavelength of 248 nm that D263 absorbs well is used. As processing conditions in this case, processing frequency: 100 Hz, output: 350 mJ, number of irradiations: 700 shots, processing spot: 0.5 × 1 mm are preferable. By irradiating a laser beam under these processing conditions, the cut portion is penetrated by the rectangle (0.5 × 1 mm) and processed into a cross beam shape. It is also possible to perform half machining instead of through machining, and then break by braking. Moreover, you may make it mount in a board | substrate, dividing with a mounter in a mounting process. In place of the excimer laser, a laser beam of a fourth harmonic wave (wavelength: 255 nm) of a YAG laser combined with a nonlinear optical crystal may be used. In particular, in the case of a laser device in which a nonlinear optical crystal and a YAG laser are combined, one of the following (1) to (3) serves as three roles and is economical.
(1) YAG (fundamental wave: 1064 nm): Laser junction (2) YAG (2nd harmonic: 532 nm, 3rd harmonic: 355 nm): Wiring patterning by laser (3) YAG (4th harmonic: 255 nm): Laser dicing

Sectional drawing which shows the example of 1 structure of the electronic component which concerns on this embodiment. (A), (b) is a characteristic view which shows the spectral transmittance of a cap glass, respectively. Sectional drawing which shows one structural example of the anti-reflective film formed in both surfaces of the cap glass. The top view which shows the example of 1 structure of a VCSEL element. The top view which shows the example of 1 structure of cap glass. (A)-(d) is explanatory drawing which shows the structural example of the wiring which has the intermediate pad for solder supply, respectively. (A) And (b) is explanatory drawing which shows the structural example of the wiring which formed the intermediate pad and the wiring which does not form an intermediate pad, respectively in square cap glass. Explanatory drawing which shows the other structural example of the wiring which has the intermediate pad for solder supply. Sectional drawing of the board | substrate which mounted the electronic component 1 which has a VCSEL element. Sectional drawing of the board | substrate which mounted the electronic component which attached the drive IC to the surface of the cap glass. Explanatory drawing which shows the example of 1 structure of the light source device incorporating the board | substrate which mounted the electronic component. Explanatory drawing which shows the other structural example of the light source device incorporating the board | substrate which mounted the electronic component. (A) thru | or (e) is explanatory drawing which shows an example of the manufacturing process of an electronic component. Sectional drawing which shows one structural example of the wiring provided with the plating layer on the aluminum layer. Explanatory drawing which shows a mode that it joins by irradiating a laser through cap glass. Explanatory drawing which shows a mode that it joins by irradiating a laser through the cap glass which has a through-hole. (A) thru | or (e) is explanatory drawing which shows the example of the other manufacturing process of an electronic component. (A) thru | or (e) is explanatory drawing which shows the example of the further another manufacturing process of an electronic component. Explanatory drawing which shows the example of 1 structure of the laser processing apparatus used for the laser joining of an electronic component. (A) thru | or (c) is explanatory drawing which shows the energy distribution of the cross-sectional direction of the laser beam which can be used for a laser joining, respectively. The side view which shows one structure of a workpiece | work holding apparatus. The top view of a workpiece holding apparatus. Explanatory drawing which shows schematic structure of a suction device. Explanatory drawing which shows the example of 1 structure of a workpiece | work press mechanism. The characteristic view which shows the relationship between the repetition frequency (processing frequency) of Q switch YAG laser beam used for laser joining, peak energy, and a pulse width. The characteristic view which shows the relationship between the lamp current value of Q switch YAG laser beam used for laser joining, and output power. Explanatory drawing of the beam size of the laser beam used for laser joining. Explanatory drawing which shows the mode of the scanning of the laser beam at the time of laser joining. Explanatory drawing of the manufacturing process of the electronic component using the glass wafer concerning other embodiment. Sectional drawing of the electronic component provided with the VCSEL element which concerns on a prior art example.

Explanation of symbols

1 Electronic component 10 VICSEL element (photoelectric conversion element)
20 Cap glass (light transmission member)
90 substrates

Claims (97)

An electronic component including a photoelectric conversion element that emits light based on an electrical signal,
A drive electrode provided at the end of the surface where the light emitting portion of the photoelectric conversion element is provided, and an element connection provided on a light transmitting member disposed so as to face the surface where the light emitting portion of the photoelectric conversion element is provided An electronic component, characterized in that the electrode for use is joined via a conductive joining material. The electronic component according to claim 1.
An electronic component, wherein the driving electrode of the photoelectric conversion element and the element connection electrode of the light transmitting member are bonded by melting the bonding material with a laser beam. The electronic component according to claim 1 or 2,
An electronic component, wherein an antireflection film for preventing reflection of light emitted from the photoelectric conversion element is formed on a surface of the light transmitting member. The electronic component according to claim 3.
An electronic component, wherein a protective layer is provided on a surface of the antireflection film. The electronic component according to claim 4.
The electronic component, wherein the protective layer is formed of a resin tape, a TSA (adhesive for semiconductor manufactured by Toray Industries, Inc.) sheet, or a filler-less highly transparent film. The electronic component according to any one of claims 1 to 5,
An electronic component, wherein a drive circuit component for driving the photoelectric conversion element is mounted on a surface of the light transmitting member. The electronic component according to any one of claims 1 to 6,
An electronic component, wherein the bonding material is a metal material having an electrical resistance equal to or lower than that of solder. The electronic component according to any one of claims 1 to 6,
The electronic component according to claim 1, wherein the bonding material is a metal material having a crystal structure other than a face-centered cubic lattice structure. The electronic component according to any one of claims 1 to 6,
The electronic component, wherein the bonding material is Sn-Ag-Cu solder, Sn-Bi solder, molybdenum, zinc, cobalt, tungsten, tin, or cadmium. The electronic component according to claim 1,
As a result of laser bonding between the drive electrode of the photoelectric conversion element and the element connection electrode of the light transmission member via the bonding material, a sealed space is formed in the gap between the light transmission member and the photoelectric conversion element. An electronic component, wherein a surface of the light transmitting member and an end of the photoelectric conversion element are sealed with the bonding material melted by laser irradiation. The electronic component according to claim 1,
An electronic component, wherein an end portion of the photoelectric conversion element facing the light transmitting member and a surface of the light transmitting member are sealed with a resin. The electronic component of claim 11.
An electronic component comprising a resin inflow prevention portion provided on a surface of the light transmitting member for preventing the resin from flowing into the light emitting portion of the photoelectric conversion element during sealing with the resin. The electronic component of claim 12,
The electronic component according to claim 1, wherein the resin inflow blocking portion is a portion of the surface of the light transmitting member that has improved water repellency with respect to the resin. The electronic component of claim 12,
The electronic component, wherein the resin inflow blocking portion is a convex portion or a concave portion provided on the surface of the light transmitting member. The electronic component according to any one of claims 10 to 14,
An electronic component, wherein a sealed space in a gap between the light transmitting member and the photoelectric conversion element is filled with a dry gas. The electronic component of claim 15,
The electronic component according to claim 1, wherein the dry gas is dry nitrogen gas. The electronic component according to any one of claims 1 to 16,
The electronic component is a vertical cavity surface emitting laser. The electronic component of claim 17.
An electronic component characterized in that an emission wavelength of the vertical cavity surface emitting laser is 780 nm. The electronic component of claim 18,
The material for the light transmitting member is BK7, D263, CG-1, synthetic quartz or soda lime glass. The electronic component according to claim 18 or 19,
An electronic component, wherein an antireflection film for preventing reflection of light having a wavelength of 780 nm is formed on both surfaces of the light transmitting member. The electronic component according to any one of claims 1 to 16,
The photoelectric conversion element is a light receiving element that receives light and outputs an electrical signal, and the light emitting part is a light incident part through which light from the outside to the photoelectric conversion element passes,
The electronic component according to claim 1, wherein the drive electrode is an output electrode of the electric signal. The electronic component according to any one of claims 1 to 21,
On the surface of the light transmission member on the photoelectric conversion element side, an element connection electrode connected to the drive electrode of the photoelectric conversion element, a substrate connection electrode at an end of the light transmission member, and the element connection An electronic component comprising a wiring formed of an electrode connecting portion connecting the electrode and the substrate connecting electrode. The electronic component of claim 22,
An electronic component characterized in that when laser bonding is performed using the bonding material, the material of the wiring is a material that easily transmits laser light used for the laser bonding. 24. The electronic component of claim 22 or 23.
An electronic component, wherein the wiring material is aluminum, gold, or copper. The electronic component according to any one of claims 22 to 24,
An electronic component, wherein an anchor layer is provided between the wiring and the light transmitting member. 24. The electronic component of claim 23.
The wiring is formed by attaching a tape, sheet or film having a metal film on the surface of the light transmissive member on the photoelectric conversion element side and removing unnecessary portions of the metal film. The surface of the metal film in the portion constituting the connection electrode is solder-plated, and the element connection electrode of the wiring and the drive electrode of the photoelectric conversion element are laser-bonded via the solder Electronic parts. The electronic component of claim 26.
What is pasted on the surface of the light transmissive member on the photoelectric conversion element side is a resin tape, TSA (adhesive for semiconductor manufactured by Toray Industries, Inc.) sheet or filler-less highly transparent film having a metal film on the surface. An electronic component characterized by being The electronic component according to any one of claims 22 to 27,
2. The electronic component according to claim 1, wherein the wiring has an intermediate pad for supplying solder in the middle of the electrode connecting portion connecting the element connecting electrode and the substrate connecting electrode. The electronic component of claim 28,
When a plurality of drive electrodes of the photoelectric conversion element are provided, and a plurality of sets of the element connection electrodes and the substrate connection electrodes connected by the wiring are provided so as to correspond to the drive electrodes, An electronic component, wherein the intermediate pad is provided so that the distance between the solder supplying intermediate pad and the element connecting electrode in a plurality of wirings is equal to each other. The electronic component according to claim 1 or 2,
On the surface of the light transmission member on the photoelectric conversion element side, an element connection electrode connected to the drive electrode of the photoelectric conversion element, a substrate connection electrode at an end of the light transmission member, and the element connection An aluminum wiring comprising an electrode connecting portion connecting the electrode and the substrate connecting electrode is formed,
A plating process for forming a nickel plating layer, a plating process for forming a gold plating layer, or a plating process for further forming a gold plating layer on the nickel plating layer is performed on the surface of the wiring,
An electronic component, wherein an antireflection film for preventing reflection of light emitted from the photoelectric conversion element is formed on at least a portion of the surface of the light transmitting member through which light emitted from the photoelectric conversion element passes . The electronic component according to any one of claims 22 to 30,
A plurality of drive electrodes of the photoelectric conversion element are provided,
A plurality of sets of the element connection electrodes and the substrate connection electrodes connected by the wiring are provided so as to correspond to the drive electrodes,
An electronic component characterized in that the width and length of each wiring are set so that the electrical characteristics of each wiring are equal. The electronic component of claim 31,
The plurality of wirings are formed so as to extend in a fan shape from the element connection electrodes toward the outer substrate connection electrodes so that the lengths of the respective wirings are equal.
The plurality of substrate connection electrodes are arranged in an arc shape at an end of a surface of the light transmission member on the photoelectric conversion element side. The electronic component of claim 31 or 32,
The photoelectric conversion element includes a plurality of light emitting units that are driven independently from each other at the light emitting unit, and the plurality of light emitting units and the plurality of driving electrodes are respectively connected by internal wiring.
An electronic component characterized in that the width and length of each intra-element wiring are set so that the electrical characteristics of each intra-element wiring are equal. 34. The electronic component of claim 33.
The plurality of element internal wirings are formed so as to extend in a fan shape from the light emitting portion toward the outer drive electrode so that the length of each element internal wiring is equal.
The electronic component, wherein the plurality of drive electrodes are arranged in an arc shape at an end of a surface where the light emitting portion of the photoelectric conversion element is provided. The electronic component according to any one of claims 22 to 34,
An electronic component, wherein a preflux coating is applied to a surface of the substrate connecting electrode. The electronic component according to any one of claims 22 to 34,
An electronic component, wherein the surface of the substrate connecting electrode is gold-plated.   37. A substrate, wherein the electronic component according to claim 22 is mounted, and the substrate connection electrode formed on the light transmission member of the electronic component is soldered. 38. The substrate of claim 37.
An end portion of the light transmitting member of the electronic component where the substrate connection electrode is formed is exposed to the outside of a portion facing the photoelectric conversion element,
A substrate having an opening in which the photoelectric conversion element can be inserted without interference when the electronic component is mounted with the photoelectric conversion element facing the substrate. 40. The substrate of claim 38.
A substrate, wherein the back surface of the photoelectric conversion element inserted into the opening of the substrate and the back surface of the substrate are connected by an adhesive. 40. The substrate of claim 39.
A substrate, wherein a ground electrode on a back surface of the photoelectric conversion element and a ground electrode on a back surface of the substrate are connected by a conductive adhesive. A method of manufacturing an electronic component including a photoelectric conversion element that emits light based on an electrical signal,
A drive electrode provided at the end of the surface where the light emitting portion of the photoelectric conversion element is provided, and an element connection provided on a light transmitting member disposed so as to face the surface where the light emitting portion of the photoelectric conversion element is provided A method for manufacturing an electronic component, characterized in that a laser electrode is bonded to a working electrode via a conductive bonding material. In the manufacturing method of the electronic component of Claim 41,
Forming an element connecting electrode on the light transmitting member;
The light transmission member and the photoelectric conversion element are arranged to face each other so that the element connection electrode of the light transmission member and the drive electrode of the photoelectric conversion element are brought into contact with each other via the bonding material.
Laser light having a wavelength that can be transmitted through the light transmitting member so as to pass through the light transmitting member from the surface opposite to the surface facing the photoelectric conversion element of the light transmitting member and reach the bonding material. Irradiate
A method for manufacturing an electronic component, comprising: bonding an element connecting electrode of the light transmitting member and a driving electrode of the photoelectric conversion element through the bonding material irradiated with the laser beam. In the manufacturing method of the electronic component of Claim 42,
A method for manufacturing an electronic component, comprising: bonding an element connecting electrode of the light transmitting member and a driving electrode of the photoelectric conversion element by melting the bonding material by irradiation with the laser beam. In the manufacturing method of the electronic component of Claim 42 or 43,
A method for manufacturing an electronic component, comprising: forming a bonding layer made of the bonding material on an element connection electrode of the light transmitting member before the light transmitting member and the photoelectric conversion element are arranged to face each other. In the manufacturing method of the electronic component of Claim 42 or 43,
A method for manufacturing an electronic component, comprising: forming a bonding layer made of the bonding material on a drive electrode of the photoelectric conversion element before the light transmitting member and the photoelectric conversion element are arranged to face each other. In the manufacturing method of the electronic component in any one of Claims 41 thru | or 45,
An antireflection film for preventing reflection of light emitted from the photoelectric conversion element is formed on the surface of the light transmission member before forming the element connection electrode on the light transmission member. Production method. In the manufacturing method of the electronic component of Claim 46,
A method for manufacturing an electronic component, comprising: providing a protective layer on a surface of the antireflection film before forming an electrode for element connection on the light transmitting member. The method of manufacturing an electronic component according to claim 47,
The said protective layer is formed with the resin tape, TSA (Toray Industries, Inc. semiconductor adhesive), or a filler-less highly transparent type film, The manufacturing method of the electronic component characterized by the above-mentioned. (Mounting IC mounted on cap glass)
In the manufacturing method of the electronic component in any one of Claims 41 thru / or 48,
A method of manufacturing an electronic component comprising mounting a drive circuit component for driving the photoelectric conversion element on a surface of the light transmitting member. 50. The method of manufacturing an electronic component according to claim 41,
When irradiating the laser beam, pressure is applied to at least one of the light transmission member and the photoelectric conversion element so that the element connection electrode of the light transmission member and the drive electrode of the photoelectric conversion element are in close contact with each other. A method of manufacturing an electronic component characterized by the above. In the manufacturing method of the electronic component in any one of Claims 41 thru | or 50,
The method for manufacturing an electronic component, wherein the bonding material is a metal material having an electrical resistance equal to or lower than that of solder. In the manufacturing method of the electronic component in any one of Claims 41 thru | or 50,
The method of manufacturing an electronic component, wherein the bonding material is a metal material having a crystal structure other than a face-centered cubic lattice structure. In the manufacturing method of the electronic component in any one of Claims 41 thru | or 50,
The method for manufacturing an electronic component, wherein the bonding material is Sn—Ag—Cu solder, Sn—Bi solder, molybdenum, zinc, cobalt, tungsten, tin, or cadmium. In the manufacturing method of the electronic component in any one of Claims 41 thru | or 53,
A method for manufacturing an electronic component, wherein the surface of the bonding material is subjected to an antioxidant treatment before the laser bonding. In the manufacturing method of the electronic components in any one of Claims 41 thru / or 54,
Forming a through hole penetrating at least the light transmitting member and the element connecting electrode;
By sealing the through hole with the bonding material at the time of laser bonding, the surface of the light transmitting member and the photoelectrical member are formed so that a sealed space is formed in the gap between the light transmitting member and the photoelectric conversion element. A method for manufacturing an electronic component, comprising sealing an end portion of a conversion element with the bonding material melted by laser irradiation. The method of manufacturing an electronic component according to claim 55,
A method of manufacturing an electronic component, wherein the laser bonding is performed after a dry gas is fed into a gap between the light transmitting member and the photoelectric conversion element through the through hole before the laser bonding. In the manufacturing method of the electronic components in any one of Claims 41 thru / or 54,
An electronic component manufacturing method, wherein an end portion of the photoelectric conversion element facing the light transmitting member and a surface of the light transmitting member are sealed with a resin. The method of manufacturing an electronic component according to claim 57,
A method for manufacturing an electronic component, comprising: a resin inflow blocking portion that prevents the resin from flowing into the light emitting portion of the photoelectric conversion element when sealed with the resin, on the surface of the light transmitting member. . The method of manufacturing an electronic component according to claim 58,
The method of manufacturing an electronic component, wherein the resin inflow prevention portion is a portion on the surface of the light transmission member that has improved water repellency with respect to the resin. The method of manufacturing an electronic component according to claim 58,
The method of manufacturing an electronic component, wherein the resin inflow blocking portion is a convex portion or a concave portion provided on the surface of the light transmitting member. In the manufacturing method of the electronic component in any one of Claims 57 thru | or 60,
A method for producing an electronic component, wherein a dry gas is filled in a space sealed with the resin in a gap between the light transmitting member and the photoelectric conversion element. In the manufacturing method of the electronic component of Claim 56 or 61,
The method for manufacturing an electronic component, wherein the dry gas is dry nitrogen gas. In the manufacturing method of the electronic component in any one of Claims 41 thru | or 62,
The method of manufacturing an electronic component, wherein the photoelectric conversion element is a vertical cavity surface emitting laser. The method of manufacturing an electronic component according to claim 63,
An electronic component manufacturing method, wherein the vertical cavity surface emitting laser has an emission wavelength of 780 nm. In the manufacturing method of the electronic component of Claim 64,
The method of manufacturing an electronic component, wherein the material of the light transmitting member is BK7, D263, CG-1, synthetic quartz or soda lime glass. In the manufacturing method of the electronic component of Claim 64 or 65,
A method of manufacturing an electronic component, comprising forming an antireflection film for preventing reflection of light having a wavelength of 780 nm on both surfaces of the light transmitting member. In the manufacturing method of the electronic component in any one of Claims 41 thru | or 62,
The photoelectric conversion element is a light receiving element that receives light and outputs an electrical signal, and the light emitting part is a light incident part through which light from the outside to the photoelectric conversion element passes,
The method of manufacturing an electronic component, wherein the drive electrode is an output electrode of the electrical signal. In the manufacturing method of the electronic component in any one of Claims 41 thru | or 67,
Forming a wiring connecting an element connection electrode connected to the electrode of the photoelectric conversion element and a substrate connection electrode at an end of the light transmission member on a surface of the light transmission member on the photoelectric conversion element side; A method of manufacturing an electronic component characterized by the above. The method of manufacturing an electronic component according to claim 68, wherein
A method of manufacturing an electronic component, wherein when performing laser bonding using the bonding material, a material that easily transmits laser light used for the laser bonding is used as the material of the wiring. The method of manufacturing an electronic component according to claim 68 or 69,
The method of manufacturing an electronic component, wherein the wiring material is aluminum, gold, or copper. In the manufacturing method of the electronic component in any one of Claims 68 thru / or 70,
An electronic component manufacturing method comprising providing an anchor layer between the wiring and the light transmitting member. In the manufacturing method of the electronic component of Claim 71,
After forming the wiring via the anchor layer, the formation region of the wiring is irradiated with laser light from the surface opposite to the surface on which the wiring is formed of the light transmitting member, and the anchor layer is removed. An electronic component manufacturing method characterized by the above. In the manufacturing method of the electronic component in any one of Claims 68 thru / or 72,
An anti-glare process is performed on an area of the surface of the light transmissive member opposite to the surface on which the wiring is formed, the area facing the wiring. In the manufacturing method of the electronic component of Claim 73,
An anti-glare process is performed by irradiating a laser beam of an ultraviolet laser. In the manufacturing method of the electronic component in any one of Claims 68 thru / or 74,
A method of manufacturing an electronic component, wherein the surface of the wiring is subjected to solder plating. In the manufacturing method of the electronic component in any one of Claims 68 thru / or 74,
Plating the part of the wiring surface where you want to attach the solder with gold, oxidizing the part you do not want to attach the solder,
The amount of solder necessary for solder plating of the wiring is attached to a part of the portion plated with gold of the wiring,
A method of manufacturing an electronic component, wherein the solder is plated on the wiring by melting the adhered solder. In the manufacturing method of the electronic component of Claim 75 or 76,
Before the melting of the solder, the outer peripheral portions of the element connection electrode and the substrate connection electrode of the wiring are oxidized, and the method for manufacturing an electronic component is characterized in that: In the manufacturing method of the electronic component of Claim 75 or 76,
A method of manufacturing an electronic component, wherein the solder plating is performed so that the solder protrudes in the surface direction from the outer peripheral portions of the element connection electrode and the substrate connection electrode of the wiring. The method of manufacturing an electronic component according to claim 68, wherein
A tape, sheet, or film having a metal film on the surface is attached to the surface of the light transmissive member on the photoelectric conversion element side, and the surface of the metal film after the unnecessary portion of the metal film is removed is solder plated. By doing so, a wiring connecting the element connection electrode connected to the electrode of the photoelectric conversion element and the substrate connection electrode at the end of the light transmitting member is formed. The method of manufacturing an electronic component according to claim 79,
What is pasted on the surface of the light transmissive member on the photoelectric conversion element side is a resin tape, TSA (adhesive for semiconductor manufactured by Toray Industries, Inc.) sheet or filler-less highly transparent film having a metal film on the surface. The manufacturing method of the electronic component characterized by these. In the manufacturing method of the electronic component in any one of Claims 75 thru | or 80,
The wiring has an intermediate pad for supplying solder in the middle of the electrode connecting portion connecting the element connecting electrode and the substrate connecting electrode,
After the solder is supplied to the intermediate pad, the supplied solder is melted and extended toward the element connection electrode and the substrate connection electrode, thereby solder-plating the surface of the wiring. Manufacturing method of electronic components. The method of manufacturing an electronic component according to claim 81,
When a plurality of drive electrodes of the photoelectric conversion element are provided, and a plurality of sets of the element connection electrodes and the substrate connection electrodes connected by the wiring are provided so as to correspond to the drive electrodes, A method of manufacturing an electronic component, characterized in that the intermediate pads are provided so that the distances between the solder supplying intermediate pads and the element connecting electrodes in a plurality of wirings are equal to each other. In the manufacturing method of the electronic component of Claim 41,
On the surface of the light transmissive member on the photoelectric conversion element side, a wiring made of aluminum that connects an element connection electrode connected to the electrode of the photoelectric conversion element and a substrate connection electrode at an end of the light transmissive member. Forming,
The surface of the wiring is subjected to a plating process for forming a nickel plating layer, a plating process for forming a gold plating layer, or a plating process for further forming a gold plating layer on the nickel plating layer,
Manufacturing an electronic component, wherein an antireflection film for preventing reflection of light emitted from the photoelectric conversion element is formed on at least a portion of the surface of the light transmitting member through which light emitted from the photoelectric conversion element passes. Method. In the manufacturing method of the electronic component in any one of Claims 68 thru / or 83,
Provide a plurality of drive electrodes of the photoelectric conversion element,
A plurality of sets of the element connection electrode and the substrate connection electrode connected by the wiring are provided so as to correspond to the drive electrodes,
A method of manufacturing an electronic component, wherein the width and length of each wiring are set so that the electrical characteristics of each wiring are equal. In the method of manufacturing an electronic component according to claim 84,
The plurality of wirings are formed so as to extend in a fan shape from the element connection electrodes toward the outer substrate connection electrodes so that the lengths of the respective wirings are equal.
The method of manufacturing an electronic component, wherein the plurality of substrate connection electrodes are arranged in an arc shape at an end of a surface of the light transmission member on the photoelectric conversion element side. In the manufacturing method of the electronic component of Claim 84 or 85,
The photoelectric conversion element includes a plurality of light emitting units that are driven independently from each other at the light emitting unit, and the plurality of light emitting units and the plurality of driving electrodes are respectively connected by internal wiring.
A method of manufacturing an electronic component, wherein the width and length of each intra-element wiring are set so that the electrical characteristics of each intra-element wiring are equal. The method of manufacturing an electronic component according to claim 86,
The plurality of element wirings are formed so as to extend in a fan shape from the light emitting portion toward the outer drive electrode so that the lengths of the respective element wirings are equal,
The method of manufacturing an electronic component, wherein the plurality of drive electrodes are arranged in an arc shape at an end of a surface where the light emitting portion of the photoelectric conversion element is provided. The method of manufacturing an electronic component according to any one of claims 68 to 87,
A method of manufacturing an electronic component, wherein a preflux coating is applied to a surface of the substrate connecting electrode. The method of manufacturing an electronic component according to any one of claims 68 to 87,
A method of manufacturing an electronic component, wherein the surface of the substrate connecting electrode is gold-plated. The method of manufacturing an electronic component according to any one of claims 41 to 89,
A method of manufacturing an electronic component, wherein a laser beam having a uniform laser energy distribution in a cross-sectional direction is used as the laser beam for performing the laser bonding. The method of manufacturing an electronic component according to any one of claims 41 to 89,
When there are a plurality of laser joining locations between the drive electrode of the photoelectric conversion element and the element connecting electrode of the light transmitting member via the joining material, the plurality of laser joining locations are used as laser light for performing the laser joining. Using a pulsed laser beam that has an irradiation spot size that irradiates at least one spot of the laser beam and that is intermittently output at a predetermined repetition frequency,
Electrons characterized in that the relative movement between the electronic component and the laser beam is synchronized with the repetition frequency of the laser beam so that the laser beam is irradiated with the pulsed laser beam. A manufacturing method for parts. In the manufacturing method of the electronic component in any one of Claims 41 thru | or 91,
By mounting a plurality of the photoelectric conversion elements on the plate material or sheet material of the light transmissive member and performing the laser bonding, cutting the plate material or sheet material of the light transmissive member so as to be separated for each photoelectric conversion element, A method of manufacturing an electronic component, wherein a plurality of electronic components each including a photoelectric conversion element are manufactured together. 93. A method of manufacturing an electronic component according to any one of claims 41 to 92.
A gas around the electronic component irradiated with the laser light is sucked, and a substance released from the electronic component by the laser light irradiation is removed from the sucked gas. Production method. The electronic component is manufactured by the method for manufacturing an electronic component according to any one of claims 41 to 93,
The electronic component is mounted on a substrate,
A method of manufacturing a substrate, comprising: soldering the substrate connecting electrode formed on the light transmitting member of the electronic component to the electrode of the substrate. 95. The method of manufacturing a substrate of claim 94,
The electronic component has an end where the substrate connection electrode of the light transmitting member is formed exposed outside a portion facing the photoelectric conversion element,
The substrate is formed with an opening into which the photoelectric conversion element can be inserted without interference when the electronic component is mounted with the photoelectric conversion element facing the substrate. Method. The method of manufacturing a substrate of claim 95,
A method for producing a substrate, comprising: connecting a back surface of the photoelectric conversion element inserted into an opening of the substrate and a back surface of the substrate with an adhesive. 97. The method of manufacturing a substrate of claim 96,
A method for manufacturing a substrate, comprising: connecting a ground electrode on a back surface of the photoelectric conversion element and a ground electrode on a back surface of the substrate with a conductive adhesive.