JPS6267670U - - Google Patents

Info

Publication number
JPS6267670U
JPS6267670U JP15984185U JP15984185U JPS6267670U JP S6267670 U JPS6267670 U JP S6267670U JP 15984185 U JP15984185 U JP 15984185U JP 15984185 U JP15984185 U JP 15984185U JP S6267670 U JPS6267670 U JP S6267670U
Authority
JP
Japan
Prior art keywords
electronic component
laser beam
laser
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15984185U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15984185U priority Critical patent/JPS6267670U/ja
Publication of JPS6267670U publication Critical patent/JPS6267670U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例にかかわるレーザハ
ンダ付け装置の関連部分を示す側面図である。 1……プリント配線板、2……フラツトチツプ
ICで例示される電子部品、10……レーザビー
ム照射用の光学系、20……吸引式排煙機構、2
1……吸引口、22……ホース、23……ポンプ
FIG. 1 is a side view showing relevant parts of a laser soldering device according to an embodiment of the present invention. 1... Printed wiring board, 2... Electronic component exemplified by flat chip IC, 10... Optical system for laser beam irradiation, 20... Suction type smoke exhaust mechanism, 2
1...Suction port, 22...Hose, 23...Pump.

Claims (1)

【実用新案登録請求の範囲】 プリント配線板上のハンダ層が形成された所定
箇所に電子部品を配置し、この電子部品の周辺に
沿つてレーザビームを移動させつつこの周辺部に
形成された複数のリード線上にレーザビームを順
次照射してゆくレーザハンダ付け装置において、 前記レーザビームの移動経路の近傍に配置され
る吸引口を有する吸引式の排煙機構を備えたこと
を特徴とするレーザハンダ付け装置。
[Claim for Utility Model Registration] An electronic component is placed at a predetermined location on a printed wiring board where a solder layer is formed, and while a laser beam is moved along the periphery of the electronic component, a plurality of laser beams are formed around the electronic component. A laser soldering device that sequentially irradiates a laser beam onto a lead wire, comprising: a suction type smoke evacuation mechanism having a suction port disposed near a moving path of the laser beam. attaching device.
JP15984185U 1985-10-18 1985-10-18 Pending JPS6267670U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15984185U JPS6267670U (en) 1985-10-18 1985-10-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15984185U JPS6267670U (en) 1985-10-18 1985-10-18

Publications (1)

Publication Number Publication Date
JPS6267670U true JPS6267670U (en) 1987-04-27

Family

ID=31084653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15984185U Pending JPS6267670U (en) 1985-10-18 1985-10-18

Country Status (1)

Country Link
JP (1) JPS6267670U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277438A (en) * 2007-04-26 2008-11-13 Ricoh Microelectronics Co Ltd Electronic component, substrate, and method of manufacturing electronic component and substrate
JP2009156663A (en) * 2007-12-26 2009-07-16 Tohken Co Ltd X-ray inspecting device having temperature control function of inspection object

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168472A (en) * 1982-03-31 1983-10-04 Toshiba Corp Laser-soldering method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58168472A (en) * 1982-03-31 1983-10-04 Toshiba Corp Laser-soldering method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277438A (en) * 2007-04-26 2008-11-13 Ricoh Microelectronics Co Ltd Electronic component, substrate, and method of manufacturing electronic component and substrate
JP2009156663A (en) * 2007-12-26 2009-07-16 Tohken Co Ltd X-ray inspecting device having temperature control function of inspection object

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