JPS6267670U - - Google Patents
Info
- Publication number
- JPS6267670U JPS6267670U JP15984185U JP15984185U JPS6267670U JP S6267670 U JPS6267670 U JP S6267670U JP 15984185 U JP15984185 U JP 15984185U JP 15984185 U JP15984185 U JP 15984185U JP S6267670 U JPS6267670 U JP S6267670U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- laser beam
- laser
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000779 smoke Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 1
Description
第1図は本考案の一実施例にかかわるレーザハ
ンダ付け装置の関連部分を示す側面図である。
1……プリント配線板、2……フラツトチツプ
ICで例示される電子部品、10……レーザビー
ム照射用の光学系、20……吸引式排煙機構、2
1……吸引口、22……ホース、23……ポンプ
。
FIG. 1 is a side view showing relevant parts of a laser soldering device according to an embodiment of the present invention. 1... Printed wiring board, 2... Electronic component exemplified by flat chip IC, 10... Optical system for laser beam irradiation, 20... Suction type smoke exhaust mechanism, 2
1...Suction port, 22...Hose, 23...Pump.
Claims (1)
箇所に電子部品を配置し、この電子部品の周辺に
沿つてレーザビームを移動させつつこの周辺部に
形成された複数のリード線上にレーザビームを順
次照射してゆくレーザハンダ付け装置において、 前記レーザビームの移動経路の近傍に配置され
る吸引口を有する吸引式の排煙機構を備えたこと
を特徴とするレーザハンダ付け装置。[Claim for Utility Model Registration] An electronic component is placed at a predetermined location on a printed wiring board where a solder layer is formed, and while a laser beam is moved along the periphery of the electronic component, a plurality of laser beams are formed around the electronic component. A laser soldering device that sequentially irradiates a laser beam onto a lead wire, comprising: a suction type smoke evacuation mechanism having a suction port disposed near a moving path of the laser beam. attaching device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15984185U JPS6267670U (en) | 1985-10-18 | 1985-10-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15984185U JPS6267670U (en) | 1985-10-18 | 1985-10-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6267670U true JPS6267670U (en) | 1987-04-27 |
Family
ID=31084653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15984185U Pending JPS6267670U (en) | 1985-10-18 | 1985-10-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6267670U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008277438A (en) * | 2007-04-26 | 2008-11-13 | Ricoh Microelectronics Co Ltd | Electronic component, substrate, and method of manufacturing electronic component and substrate |
JP2009156663A (en) * | 2007-12-26 | 2009-07-16 | Tohken Co Ltd | X-ray inspecting device having temperature control function of inspection object |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58168472A (en) * | 1982-03-31 | 1983-10-04 | Toshiba Corp | Laser-soldering method |
-
1985
- 1985-10-18 JP JP15984185U patent/JPS6267670U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58168472A (en) * | 1982-03-31 | 1983-10-04 | Toshiba Corp | Laser-soldering method |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008277438A (en) * | 2007-04-26 | 2008-11-13 | Ricoh Microelectronics Co Ltd | Electronic component, substrate, and method of manufacturing electronic component and substrate |
JP2009156663A (en) * | 2007-12-26 | 2009-07-16 | Tohken Co Ltd | X-ray inspecting device having temperature control function of inspection object |
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