JPH0392076U - - Google Patents
Info
- Publication number
- JPH0392076U JPH0392076U JP15228289U JP15228289U JPH0392076U JP H0392076 U JPH0392076 U JP H0392076U JP 15228289 U JP15228289 U JP 15228289U JP 15228289 U JP15228289 U JP 15228289U JP H0392076 U JPH0392076 U JP H0392076U
- Authority
- JP
- Japan
- Prior art keywords
- board
- wiring board
- conductor lands
- electronic component
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例の裏面図、第２図およ
び第３図はその実施例にデイツプソルダリング法
により半田付けした裏面図および側面図、第４図
および第５図はデイツプソルダリング法による半
田接続作業の説明図である。
１……プリント配線基板、２……本体、３……
導体部分、３ａ……ランド、３ｂ……半田通路、
４……リードレス型電子部品。
Figure 1 is a back view of the embodiment of the present invention, Figures 2 and 3 are back and side views of the embodiment soldered by dip soldering, and Figures 4 and 5 are dip soldering. FIG. 3 is an explanatory diagram of solder connection work using a soldering method. 1...Printed wiring board, 2...Main body, 3...
Conductor portion, 3a...land, 3b...solder passage,
4...Leadless electronic components.
Claims (1)
めの導体ランドが形成されてなる配線基板におい
て、基板上に上記導体ランドから突出する線状の
パターンの導体からなる半田通路を形成したこと
を特徴とするプリント配線基板。 A wiring board having conductor lands for soldering electronic component terminals formed on an insulating board, characterized in that a solder path made of a linear pattern of conductors protruding from the conductor lands is formed on the board. Printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15228289U JPH0392076U (en) | 1989-12-29 | 1989-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15228289U JPH0392076U (en) | 1989-12-29 | 1989-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0392076U true JPH0392076U (en) | 1991-09-19 |
Family
ID=31698553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15228289U Pending JPH0392076U (en) | 1989-12-29 | 1989-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0392076U (en) |
-
1989
- 1989-12-29 JP JP15228289U patent/JPH0392076U/ja active Pending