JP5400289B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device in which a light emitting element such as an LED chip is mounted on a substrate.

  In recent years, light-emitting diodes have attracted attention as illumination / light-emitting means that can be reduced in weight, thickness, and power. As a mounting form of the light emitting diode, a method of directly mounting the bare chip (LED chip) of the light emitting diode on the wiring board, and bonding the LED chip to a small board so as to easily mount the LED chip on the wiring board are packaged. A method of mounting an LED package on a wiring board is known.

  The conventional LED package has a structure in which the LED chip is die-bonded to a small substrate, the electrode part of the LED chip and the electrode part of the lead are connected by wire bonding or the like, and sealed with a sealing resin having translucency. there were.

  On the other hand, the LED chip has the property that in a normal use temperature range as a lighting fixture, the luminous efficiency increases as the temperature decreases, and the luminous efficiency decreases as the temperature increases. For this reason, in a light source device using a light emitting diode, it is very important to improve the light emission efficiency of the LED chip by quickly radiating the heat generated in the LED chip to the outside and lowering the temperature of the LED chip. It becomes. In addition, by increasing the heat dissipation characteristics, a large current can be applied to the LED chip and the light output of the LED chip can be increased.

  Patent Document 1 discloses a light emitting diode package capable of reducing the mounting area on a mounting substrate and improving the light extraction efficiency to the outside, and a light emitting device using the same. That is, in the package, a housing recess for housing the light emitting diode chip is formed on one surface side in the thickness direction of the silicon substrate as a semiconductor substrate, and an external connection electrode is formed on the other surface side, and the inner bottom surface of the housing recess A chip connecting electrode for connecting the light emitting diode chip through the gold bump is formed, and a wiring for connecting the chip connecting electrode and the external connecting electrode is formed between the inner bottom surface of the housing recess in the silicon substrate and the other surface. It is penetrated in the mounting part which consists of the part between. A reflective film is formed on the inner peripheral surface of the storage recess.

Japanese Patent Laid-Open No. 2005-19609

  However, the package for a light emitting diode disclosed in Patent Document 1 has a problem in its formation because the recess for housing the light emitting diode chip is formed in the silicon substrate. In addition, the heat dissipation structure of the light-emitting diode chip is a structure in which a heat dissipation metal part that is in direct contact with the chip is connected to a heat dissipation electrode through a thermal coupling part that is provided through the mounting part. There are problems such as low processing cost and low heat dissipation performance. Further, since the electrode portion of the light emitting diode chip is configured to be in contact with the inner bottom surface side of the housing recess, there is a problem from the viewpoint of light extraction efficiency.

  Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to obtain a sufficient heat dissipation effect with a simple structure, high light extraction efficiency, and downsizing and manufacturing cost of the entire apparatus. It is an object of the present invention to provide a light-emitting device that can keep the above low.

  The light emitting device of the present invention includes a light emitting element, a substrate on which the light emitting element is mounted via at least a first metal layer having a metal thick part, and the light emitting element provided on the top of the metal thick part. And a resin base material layer provided on the substrate, the first pattern metal portion electrically connected to the electrode portion of the light emitting element is formed on the resin base. Formed on the upper surface side of the material layer, the first pattern metal portion is electrically connected to the second pattern metal portion formed on the lower surface side of the resin base material layer, and the second pattern metal portion is located on the upper side of the substrate. It is comprised so that it may be electrically connected with the 2nd metal layer provided in this.

  According to this configuration, since the light emitting element is installed on the substrate through at least the metal layer, heat from the light emitting element can be suitably transferred to the substrate through the metal layer, and the heat dissipation is high. Become. Moreover, since it is the structure by which the light emitting element is provided in the top part of the metal thick part located in the inside of the through-hole formed in the resin base material layer, toward the opening direction of a through-hole of the light from a light-emitting element Therefore, the light extraction efficiency is high. Furthermore, since the height and position of the light emitting element in the through hole can be adjusted with the metal thick portion, there are effects of arbitrary adjustment of the light irradiation angle, improvement of reflection efficiency, and improvement of luminance. In addition, since the opening diameter of the through hole can be set small according to the outer diameter size of the light emitting element, the entire apparatus can be easily downsized. The basic structural elements of the light-emitting device are a light-emitting element, a resin base material layer, and a substrate. Since the configuration of each is simple, the processing cost can be kept low.

  In the above light emitting device, the substrate is made of a composite material of graphite and an aluminum alloy.

  According to this configuration, since the substrate is composed of a composite material of graphite and an aluminum alloy, the heat transfer effect is high, and thus the heat of the light emitting element can be suitably radiated.

  In the light emitting device, the substrate is made of a composite material of graphite, ceramics, and aluminum alloy.

  According to this configuration, since the substrate is made of a composite material of graphite, ceramics, and aluminum alloy, the heat transfer efficiency is high, and thus the heat of the light emitting element can be suitably radiated. Furthermore, the composite material of graphite, ceramics, and aluminum alloy is superior in mechanical properties such as strength than those composed of composite material of graphite and aluminum alloy, so that it can be used for in-vehicle applications that require mechanical properties. Suitable for light emitting devices.

  In the light-emitting device, a reflective layer that reflects light is formed on the surface of the through hole.

  According to this configuration, the reflection layer formed on the inner surface of the through hole can more preferably guide light from the light emitting element toward the opening direction of the through hole and improve the reflection efficiency, which is preferable.

  Further, in the above light emitting device, a reflection part formed on the resin base layer is provided to reflect light, the inside of the through hole is sealed with a resin containing a phosphor, and the reflection part is sealed with a transparent resin as a wall. It is characterized by doing.

  According to this configuration, the light from the light emitting element is applied to the phosphor, the light emission wavelength is converted into light of a desired color by the action of the phosphor, and the light is suitable for the outside by the lens body formed of the transparent resin. Can be emitted.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view showing an example of a light emitting device of the present invention. 2 and 3 show other examples of the light emitting device.

  As shown in FIG. 1, the light emitting device 1 includes a light emitting element 11, a substrate 14 on which the light emitting element 11 is mounted via a metal layer 12 having a metal thick portion 121 and an insulating layer 13, and the light emitting element 11. A through-hole 15a is formed so as to guide emitted light in a predetermined direction, and the resin base layer 15 provided on the substrate 14 and the resin base layer 15 are formed to reflect light from the light emitting element 11. The reflection part 16 is provided. The light emitting element 11 is provided at the top of the thick metal portion 121 and is disposed inside the through hole 15a.

  The light emitting element 11 is an element that emits light, and examples thereof include an LED chip and a semiconductor laser chip. The LED chip includes a face-up type in which both electrodes are present on the upper surface, a cathode type, an anode type, a face-down type (flip chip type), etc., depending on the electrode on the back surface. In the present invention, the use of the face-up type is excellent from the viewpoint of heat dissipation.

  The board | substrate 14 is a board | substrate for mounting the light emitting element 11, and is comprised with the material with favorable heat conductivity. Examples of the material having good thermal conductivity include metals, ceramics, and resins containing thermal conductive fillers. In the present invention, a composite material of graphite and aluminum alloy, a composite material of graphite, ceramics, and aluminum alloy is used. The substrate 14 is preferably configured. In particular, the composite material of graphite, ceramics, and aluminum alloy is more preferable than the composite material of graphite and aluminum alloy from the viewpoint of mechanical properties such as strength.

  A graphite-aluminum alloy composite (composite material) and a graphite-ceramic-aluminum alloy composite (composite material) are obtained by melting a graphite molded body or an aluminum alloy containing aluminum as a main component into a graphite-ceramic molded body, It can be produced by pressure impregnation at a pressure of 20 MPa or more. As the graphite molded body, a commercially available artificial graphite molded body can be used, or an artificial graphite powder can be molded and used. In addition, the graphite-ceramic shaped body can be used after being formed by mixing graphite powder and ceramic powder such as silicon carbide at a predetermined ratio. 10-35 volume% is preferable and, as for the porosity of the molded object used for this invention, 15-25 volume% is more preferable.

  The aluminum alloys of graphite-aluminum alloy composite and graphite-ceramics-aluminum alloy composite sufficiently infiltrate the aluminum alloy into the voids of the preform when impregnated. Therefore, the melting point of the aluminum alloy is preferably as low as possible. An aluminum alloy containing 5 to 25% by mass may be used. The metal component other than silicon in the aluminum alloy is not particularly limited as long as the characteristics do not change extremely, and may contain, for example, magnesium, copper, or the like.

  The graphite-aluminum alloy composite and the graphite-ceramics-aluminum composite can be prepared by preparing a block-shaped composite by the above-described method and cutting it into a plate-shaped composite, or a plate-shaped molded body Then, a plate-like composite can be produced by pressure impregnation with an aluminum alloy. Further, the graphite-aluminum alloy composite and the graphite-ceramic-aluminum alloy composite are excellent in workability and can be easily processed by ordinary machining. In this case, the ceramic particles in the composite material of graphite, ceramics, and aluminum alloy preferably have a median diameter of 100 μm or less and an addition amount of 10 to 30% by volume from the viewpoint of workability. Further, when a composite material of graphite and aluminum alloy and a composite material of graphite, ceramics, and aluminum alloy are used as a substrate, there are a case where the raw material is used as it is and a case where the surface is plated.

  As a characteristic of the graphite-aluminum alloy composite and the graphite-ceramic-aluminum alloy composite, the thermal conductivity is preferably 200 W / mK or more. In the present invention, since the composite material is used as a heat dissipation component, sufficient heat dissipation characteristics cannot be exhibited when the thermal conductivity is less than 200 W / mK.

  When the substrate 14 is made of a conductive material from the viewpoint of heat dissipation, an insulating layer 13 is provided on the substrate 14 as shown in FIG. The insulating layer 13 is made of a material having high heat conductivity, and examples thereof include a resin containing a heat conductive filler. As a method of forming the insulating layer 13 on the substrate 14, a known printing method, coating method, or adhesion method can be applied.

  The insulating layer 13 has a thermal conductivity of 1.0 W / mK or higher, preferably has a thermal conductivity of 1.2 W / mK or higher, and more preferably has a thermal conductivity of 1.5 W / mK or higher. preferable. Thereby, the heat from the metal layer 12 can be efficiently radiated to the substrate 14 side. Here, the thermal conductivity of the insulating layer 13 is appropriately determined by selecting a formulation in consideration of the blending amount of the thermally conductive filler and the particle size distribution, but the applicability of the insulating adhesive before curing is determined. In consideration, generally, the upper limit is preferably about 10 W / mK.

  The insulating layer 13 is preferably composed of a thermally conductive filler that is a metal oxide and / or a metal nitride and a resin. Metal oxides and metal nitrides are preferably excellent in thermal conductivity and electrically insulating. Aluminum oxide, silicon oxide, beryllium oxide, and magnesium oxide are selected as the metal oxide, and boron nitride, silicon nitride, and aluminum nitride are selected as the metal nitride. These can be used alone or in combination of two or more. . In particular, among the metal oxides, aluminum oxide can easily obtain an insulating adhesive layer having good electrical insulation and thermal conductivity, and can be obtained at low cost. Of these materials, boron nitride is preferable because it is excellent in electrical insulation and thermal conductivity and has a low dielectric constant.

  As a heat conductive filler, what contains a small diameter filler and a large diameter filler is preferable. Thus, by using two or more kinds of particles having different sizes (particles having different particle size distributions), the heat transfer function by the large-diameter filler itself and the function of increasing the heat transfer property of the resin between the large-diameter fillers by the small-diameter filler. Further, the thermal conductivity of the insulating layer 13 can be further improved. From such a viewpoint, the median diameter of the small-diameter filler is preferably 0.5 to 2 μm, and more preferably 0.5 to 1 μm. Moreover, 10-40 micrometers is preferable and, as for the median diameter of a large diameter filler, 15-20 micrometers is more preferable.

  As the resin constituting the insulating layer 13, a resin that includes a metal oxide and / or a metal nitride but has excellent bonding strength with the metal layer 12 in a cured state and that does not impair withstand voltage characteristics or the like is selected. Is done. As such a resin, an epoxy resin, a phenol resin, a polyimide resin, and various engineering plastics can be used singly or as a mixture of two or more, and among them, an epoxy resin is excellent in bonding strength between metals. preferable. In particular, among epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, hydrogenated bisphenol A-type epoxy resins, hydrogenated, which have high fluidity and excellent mixing properties with the above metal oxides and metal nitrides. Bisphenol F type epoxy resins, triblock polymers having bisphenol A type epoxy resin structures at both ends, and triblock polymers having bisphenol F type epoxy resin structures at both ends are more preferred resins.

  As shown in FIG. 1, a metal layer 12 having high heat transfer efficiency is provided on the upper surface of the insulating layer 13 from the viewpoint of heat dissipation at the mounting position of the light emitting element 11 on the substrate 14. The metal layer 12 has a mounting portion 12a (corresponding to the first metal layer) provided with a metal thick portion 121 on which the light emitting element 11 is mounted, and is electrically separated from the mounting portion 12a. A pattern is formed having an electrode portion 12b (corresponding to a second metal layer) electrically connected to the pattern metal portion 153. The wiring pattern is not limited to that shown in FIG. 1, but can be changed according to the purpose.

  The metal layer 12 can be composed of various metals, but usually, any of copper, aluminum, nickel, iron, tin, silver, titanium, or an alloy containing these metals can be used. In view of electrical conductivity, copper is preferable.

  As a method of forming the metal layer 12 on the insulating layer 13, a known method can be applied, and adhesion, printing, etching, or the like of a metal foil can be used. In addition, after the metal layer 12 and the insulating layer 13 are formed on the substrate 14, the pattern of the metal layer 12 can be formed. Further, the metal layer 12 is formed in advance in the insulating layer 13 in the B-stage state of the insulating adhesive, and then hot-pressed with the substrate 14 so that the substrate 14, the insulating layer 13, and the metal layer 12 are integrally formed. You can also.

  The metal thick portion 121 provided in the metal layer 12 is preferably formed of the same material as that of the metal layer 12 from the viewpoints of electrical conductivity and thermal conductivity (heat dissipation). The method for forming the metal thick portion 121 is not particularly limited, and a known forming method can be adopted, and examples thereof include a metal bump forming method. Although the metal thick part 121 is arrange | positioned inside the through-hole 15a, the position can be designed suitably. From the viewpoint of heat dissipation and light extraction efficiency, it is preferable to set the height and position of the thick metal portion 121 so that the light emitting element 11 is disposed at the approximate center of the height of the through hole 15a and the center of the opening.

  The resin base material layer 15 uses the insulating resin part 151 as a base material, and the first pattern metal part electrically connected to the electrode part of the light emitting element 11 on the upper surface side (surface on which the reflection part 16 is installed). 152 is formed, and a second pattern metal portion 153 is formed on the lower surface side (substrate 14 side) of the resin portion 151. The first pattern metal part 152 is electrically connected to the second pattern metal part 153 via an interlayer connection part (not shown) penetrating the resin part 151. Examples of the interlayer connection include plated through holes, laser vias, metal bumps, and the like. Details of a method for forming a conductive connection structure in that case are described in International Publication No. WO 00/52977, and all of these are applied. can do.

  The resin constituting the resin part 151 is excellent in bonding strength with the first and second pattern metal parts 152 and 153 in a cured state and includes a metal oxide and / or metal nitride, and withstand voltage. Those that do not impair the properties and the like are selected. As such a resin, an epoxy resin, a phenol resin, a polyimide resin, and various engineering plastics can be used singly or as a mixture of two or more, and among them, an epoxy resin is excellent in bonding strength between metals. preferable. In particular, among epoxy resins, a resin mainly composed of bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, and bisphenol A-type epoxy resin having high fluidity and excellent mixing with the metal oxide and metal nitride. Hydrogenated bisphenol A type epoxy resin and hydrogenated bisphenol F type epoxy resin are more preferable resins.

  The first and second pattern metal portions 152 and 153 can be made of various metals, but are usually copper, aluminum, nickel, iron, tin, silver, titanium, or an alloy containing these metals. In particular, copper is preferable from the viewpoint of thermal conductivity and electrical conductivity.

  As a method of forming the first and second pattern metal portions 152 and 153 on the resin portion 151, a known method can be applied, and examples thereof include methods such as printing and etching by photolithography.

  Further, as shown in FIG. 2, the second pattern metal portion 153 can be formed of a lead frame 1531 made of thick copper. In this case, in order to solve the problem of flatness caused by the adhesion between the resin portion 151 and the lead frame 1531, it is preferable to provide the resin material 21 for embedding purposes from the viewpoint of the bondability with the base material 14.

  A through hole 15a is formed in the resin base layer 15 so as to guide light emitted from the light emitting element 11 in a predetermined direction. The through hole 15a can be formed by a known method, and examples thereof include a laser, a drill, and a punching press.

  A reflective layer 154 that reflects light is formed on the surface of the through hole 15a. The reflective layer 154 is preferably made of a noble metal material such as silver, gold, or nickel having high reflection efficiency, and is preferably formed by plating. As shown in FIG. 1, the reflective layers 154 and 154a are also formed on the upper surface of the first pattern metal part 152, but the present invention is not limited thereto.

  Further, the inside of the through-hole 15a is sealed with a resin 18 containing a phosphor, and the reflective portion 16 is sealed with a transparent resin 19 so that light from the light emitting element 11 is applied to the phosphor. The light emission wavelength is converted into light of a desired color by the action of the above, and the light can be suitably emitted to the outside by the lens body formed of the transparent resin 19. Further, the inside of the through hole 15 a can be sealed with the transparent resin 19.

  Although the thickness of the metal layer 12 and the 1st, 2nd pattern metal parts 152 and 153 can illustrate about 25-70 micrometers, for example, it sets suitably according to the objective.

  Below, an example of the suitable manufacturing method of the light-emitting device 1 is demonstrated. First, (1) the substrate 14 is prepared. An insulating layer 13 and a metal foil are provided on the substrate 14, and a metal layer 12 in which the metal foil is patterned is formed. Further, a thick metal portion 121 is formed in the metal layer 12.

  (2) The resin base material layer 15 is prepared. Metal foil is formed on both surfaces of the resin portion 151, and then the through hole 15a is formed. Next, the whole is plated to form a reflective layer 154 on the inner surface of the through hole 15a and the surface of the metal foil. Next, the reflective layer 154 and the metal foil are etched to form the first and second pattern metal portions 152 and 153, and the resin base layer 15 is manufactured. Next, the resin base material layer 15 is cut into a predetermined size according to the purpose by using a cutting device such as a dicer, a router, a line cutter, or a slitter.

  (3) The reflection part 16 is provided in the upper surface side of the resin base material layer 15 (refer FIG. 1). The reflecting portion 16 is made of a material that reflects light, and is preferably a metal such as aluminum, and more preferably, the reflecting surface is plated with a noble metal material such as silver, gold, or nickel having high reflection efficiency. . The reflection part 16 can be provided in the resin base material layer 15 by well-known methods, such as adhesion | attachment.

  (4) The light emitting element 11 is mounted on the metal thick part 121. The light-emitting element 11 can be mounted on the metal thick portion 121 by any method such as conductive paste, double-sided tape, solder bonding, a heat-dissipating sheet (preferably a silicone-based heat-dissipating sheet), a method using a silicone-based or epoxy-based resin material. Although a bonding method may be used, metal bonding is preferable from the viewpoint of heat dissipation.

  (5) The resin base material layer 15 is provided on the substrate 14. The resin base material layer 15 is attached to the substrate 14 so that the light emitting element 11 is accommodated in the through hole 15a. Examples of the second pattern metal portion 153 and the electrode portion 12b of the metal layer 12 include connection by conductive paste and solder.

  (6) Conductively connect the electrode part of the light emitting element 11 and the first pattern metal parts 152 on both sides. This conductive connection can be performed by connecting the upper electrode of the light emitting element 11 and each of the first pattern metal portions 152 by wire bonding or the like using the thin metal wires 17 through the reflective layers 154a and 154b. As wire bonding, ultrasonic waves or a combination of this and heating can be used. In the case of FIG. 1, it is connected via the reflective layers 154a and 154b, but the present invention is not limited to this, and the reflective layers 154a and 154b may not be provided.

  (7) The inside of the through hole 15a is sealed with a resin 18 containing a phosphor, and then the inside is sealed with a transparent sealing resin 19 with the reflecting portion 16 as a wall. As the sealing resin, a silicone resin, an epoxy resin, or the like can be suitably used. In the potting of the sealing resin, the upper surface is preferably formed in a convex shape from the viewpoint of imparting the function of a convex lens, but the upper surface may be formed in a flat shape or a concave shape. The top surface shape of the potting sealing resin can be controlled by the viscosity of the material used, the coating method, the affinity with the coating surface, and the like.

Next, an example of a method for manufacturing the substrate 14 will be described below.
(Example 1 of substrate)
A block of 100 mm × 100 mm × 70 mm was cut out from a commercially available artificial graphite material (density: 1.85 g / cm ³ ) so that the graphite particles were oriented in the 70 mm thickness direction. The obtained molded body was preheated to a temperature of 700 ° C. in a nitrogen atmosphere in an electric furnace, and then placed in a pre-heated press mold having an inner diameter of Φ300 mm × 300 mmt, and an aluminum alloy containing 12% by mass of silicon. The molten metal was poured and pressurized at 100 MPa for 20 minutes to impregnate the compact with the aluminum alloy. Next, after cooling to room temperature, the aluminum alloy and the iron container portion were cut with a wet band saw to obtain a graphite-aluminum alloy composite of 100 mmL × 100 mmW × 70 mmH. The obtained composite was annealed at a temperature of 500 ° C. for 2 hours in order to remove strain during impregnation.

  Next, from the obtained composite, a thermal conductivity measurement test specimen (25 mm × 25 mm × 1 mm) and a strength test specimen (3 mm × 4 mm, length 40 mm) were prepared by grinding, and the temperature was measured at 25 ° C. The thermal conductivity was measured by a laser flash method (manufactured by ULVAC; TC3000) and a three-point bending strength (based on JIS-R1601). As a result of measuring the thermal conductivity and the three-point bending strength, the thermal conductivity at a temperature of 25 ° C. was 350 W / mK in the 70 mmH direction, 215 W / mK in the 100 mmL direction, and 210 W / mK in the 100 mmW direction. The three-point bending strength was 15 MPa.

  The obtained graphite-aluminum alloy composite was cut into a plate shape having a thickness of 1.2 mmt with a diamond cutter so that it was parallel to the surface of 100 mmW × 70 mmH, and the outer peripheral portion was further cut to 95 mm × 65 mm. After that, grinding was performed with a surface grinder so that the thickness became 1 mmt. Next, the obtained plate-like composite was subjected to electroless Ni—P plating to form a 6 μm-thick plating layer on the composite surface.

(Example 2 of substrate)
After mixing 1600 g of artificial graphite powder with a particle diameter of 0.1 mm to 2 mm and 600 g of silicon carbide powder with a median diameter of 7 μm (manufactured by Taiyo Random Co., Ltd./NC#2000) using a V-type mixer, the inner diameter is 100 mmL × 100 mmW. It filled with the iron container of * 150mmH, and it shape | molded with the pressure of the surface pressure of 100MPa, and produced the molded object of 100mmLx100mmWx90mmH. The obtained molded body was preheated to a temperature of 700 ° C. in a nitrogen atmosphere in an electric furnace together with an iron container, and then stored in a preheated press mold having an inner diameter of Φ300 mm × 300 mmt, and contains 12% by mass of silicon. The molten aluminum alloy was poured and pressurized at 100 MPa for 20 minutes to impregnate the compact with the aluminum alloy. Next, after cooling to room temperature, the aluminum alloy and the iron container portion were cut with a wet band saw to obtain a graphite-silicon carbide-aluminum alloy composite of 100 mmL × 100 mmW × 90 mmH. The obtained composite was annealed at a temperature of 500 ° C. for 2 hours in order to remove strain during impregnation.

  Next, a thermal conductivity measurement test specimen (25 mm × 25 mm × 1 mm) and a strength test specimen (3 mm × 4 mm length 40 mm) are prepared from the obtained composite by grinding, and heat at a temperature of 25 ° C. The conductivity was measured by laser flash method (manufactured by ULVAC; TC3000) and three-point bending strength (based on JIS-R1601). As a result, the thermal conductivity at a temperature of 25 ° C. was 220 W / mK in the 90 mmH direction, 280 W / mK in the 100 mmL direction, and 275 W / mK in the 100 mmW direction. The three-point bending strength was 70 MPa.

  The obtained graphite-silicon carbide-aluminum alloy composite was cut into a plate having a thickness of 1.2 mmt with a diamond cutter so as to be parallel to the surface of 100 mmW × 90 mmH, and the outer peripheral portion was further cut. After setting to 95 mm × 85 mm, grinding was performed with a surface grinder so that the thickness would be 1 mmt.

(Another embodiment)
(1) It can be configured by applying an adhesive to the laminated surface side of the metal layer 12 and / or the insulating layer 13 to provide an adhesive layer, thereby enhancing the bonding strength. In addition, as shown in FIG. 3, the adhesive layer 31 can be formed by applying an adhesive to both or one of the laminated surfaces of the resin portion 151 and the first and second pattern metal portions 152 and 153. This can strengthen the bonding force.

  (2) The light-emitting device 1 of FIG. 1 is configured to mount a single light-emitting element, but a plurality of light-emitting elements can also be mounted.

  (3) The light-emitting element 11 in FIG. 1 has a configuration in which a metallic reflecting portion 16 is provided and a sealing resin is potted, but instead of the metallic reflecting portion 16, an annular shape is previously formed with a sealing resin. The formed annular body can be adhered to the resin base material layer 15, and an annular body can be formed by applying and curing an ultraviolet curable resin or the like in a three-dimensional manner with a dispenser. It is preferable to form a reflective layer on the inner surface of the annular body.

  (4) A convex transparent resin lens may be provided above the sealing resin. Since the transparent resin lens has a convex surface, light may be efficiently emitted upward from the substrate. Examples of the lens having a convex surface include a circular shape and an elliptical shape in plan view. The transparent resin and the transparent resin lens may be colored or contain a fluorescent material. In particular, when a yellow fluorescent material is included, white light can be generated using a blue light emitting diode.

  (5) Although the example in which the light-emitting device 1 in FIG. 1 is mounted with the face-up type light-emitting element is shown, in the present invention, a face-down type light-emitting element having a pair of electrodes on the bottom surface may be mounted. In that case, wire bonding or the like may be unnecessary by performing solder bonding or the like. Further, when electrodes are provided on the front and back surfaces of the light emitting element, it is possible to use one wire bonding or the like.

  (6) The light emitting device 1 in FIG. 1 shows an example of a device in which the light emitting element 11 is mounted on the substrate 14 provided with the single metal layer 12 corresponding to the wiring layer. However, the light emitting element may be mounted on a multilayer wiring board having two or more layers. Details of the method of forming the conductive connection structure in that case are described in International Publication No. WO 00/52977, and any of these can be applied.

Sectional drawing which shows an example of the light-emitting device of this invention Sectional drawing which shows an example of the light-emitting device of this invention Sectional drawing which shows an example of the light-emitting device of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light emitting device 11 Light emitting element 12 Metal layer 121 Metal thick part 13 Insulating layer 14 Board | substrate 15 Resin base material layer 15a Through-hole 16 Reflecting part 151 Resin 152 1st pattern metal part 153 2nd pattern metal part 154 Reflective layer

Claims (7)

A light emitting element;
A substrate made of a conductive material on which the light emitting element is mounted, via a first metal layer and an insulating layer provided with a metal thick part on which the light emitting element is mounted on the top;
A through hole is formed so that the light emitting element provided at the top of the thick metal portion is disposed at the approximate center of the height and the center of the opening, and is provided on the substrate and the insulating layer. A resin base material layer,
A first pattern metal part electrically connected to the electrode part of the light emitting element is formed on the upper surface side of the resin base material layer, and the first pattern metal part is formed by an interlayer connection part formed in the resin base material layer. A second pattern metal portion that is electrically connected to the lower surface side of the resin base material layer, and the second pattern metal portion is formed by patterning from the same metal layer; and A light emitting device configured to be electrically connected to a second metal layer provided on the upper side of the substrate so as to be electrically separated from the first metal layer among the second metal layer.   The light emitting device according to claim 1, wherein the substrate is made of a composite material of graphite and an aluminum alloy.   The light emitting device according to claim 1, wherein the substrate is made of a composite material of graphite, ceramics, and aluminum alloy.   The light emitting device according to any one of claims 1 to 3, wherein a reflective layer that reflects light is formed on a surface of the through hole. Formed on the resin base layer, and provided with a reflective portion for reflecting the light,
The light-emitting device according to claim 1, wherein the inside of the through hole is sealed with a resin containing a phosphor, and the reflective portion is sealed with a transparent resin.   The light-emitting device according to claim 1, wherein the insulating layer has a thermal conductivity of 1.0 W / mK or more.   The light emitting device according to claim 1, wherein the substrate has a thermal conductivity of 200 W / mK or more.

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