JP2006203262A - Light emitting apparatus - Google Patents

Light emitting apparatus Download PDF

Info

Publication number
JP2006203262A
JP2006203262A JP2006123138A JP2006123138A JP2006203262A JP 2006203262 A JP2006203262 A JP 2006203262A JP 2006123138 A JP2006123138 A JP 2006123138A JP 2006123138 A JP2006123138 A JP 2006123138A JP 2006203262 A JP2006203262 A JP 2006203262A
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting element
emitting device
inner peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006123138A
Other languages
Japanese (ja)
Inventor
Toru Miyake
徹 三宅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2006123138A priority Critical patent/JP2006203262A/en
Publication of JP2006203262A publication Critical patent/JP2006203262A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting apparatus improved in radiated light intensity, and reducing radiated light intensity unevenness or color unevenness. <P>SOLUTION: The light emitting apparatus includes: a substrate 2, a light emitting element 4 mounted on the substrate 2; and a reflecting member 3 having a first reflecting surface 6 placed on the substrate 2 side and a second reflecting surface 8 placed on the outer side. The light emitting apparatus also includes a translucent member 5 containing fluorescent substance to change a wavelength of light emitted from the light emitting element 4, mounted inside the reflecting member 3, and having a light emitting surface 7 placed below the second reflecting surface 8. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、発光素子から発光される光を蛍光体で波長変換し外部に発光する発光装置に関する。   The present invention relates to a light emitting device that converts the wavelength of light emitted from a light emitting element with a phosphor and emits light to the outside.

従来の発光ダイオード(LED)等の発光素子14から発光される近紫外光や青色光等の光を赤色,緑色,青色,黄色等の光に変換する蛍光体により任意の色を発光する発光装置11を図2に示す。図2において、発光装置11は、上面の中央部に発光素子14を載置するための載置部12aを有し、載置部12aおよびその周辺から発光装置11の内外を電気的に導通接続するリード端子やメタライズ配線等からなる配線導体(図示せず)が形成された絶縁体からなる基体12と、基体12の上面に接着固定され、上側開口が下側開口より大きい貫通孔が形成されているとともに、内周面が発光素子14から発光される光を反射する反射面とされている枠体13と、枠体13の内部に充填される、発光素子14の光を長波長変換する蛍光体(図示せず)が含有された透光性部材15と、載置部12aに載置固定された発光素子14とから主に構成されている。   A light-emitting device that emits an arbitrary color by a phosphor that converts light such as near-ultraviolet light and blue light emitted from a light-emitting element 14 such as a conventional light-emitting diode (LED) into light of red, green, blue, yellow, etc. 11 is shown in FIG. In FIG. 2, the light emitting device 11 has a mounting portion 12a for mounting the light emitting element 14 at the center of the upper surface, and the inside and outside of the light emitting device 11 are electrically connected electrically from the mounting portion 12a and its periphery. A base 12 made of an insulator on which a wiring conductor (not shown) made of a lead terminal, metallized wiring, or the like is formed, and a through hole that is bonded and fixed to the upper surface of the base 12 and whose upper opening is larger than the lower opening. In addition, the frame 13 whose inner peripheral surface is a reflection surface that reflects the light emitted from the light emitting element 14, and the light of the light emitting element 14 that is filled in the frame 13 is converted to a long wavelength. It is mainly composed of a translucent member 15 containing a phosphor (not shown) and a light emitting element 14 mounted and fixed on the mounting portion 12a.

基体12は、酸化アルミニウム質焼結体(アルミナセラミックス)や窒化アルミニウム質焼結体,ムライト質焼結体,ガラスセラミックス等のセラミックス、またはエポキシ樹脂等の樹脂から成る。基体12がセラミックスから成る場合、その上面に配線導体(図示せず)がタングステン(W),モリブデン(Mo)−マンガン(Mn)等から成る金属ペーストを高温で焼成して形成される。また、基体12が樹脂から成る場合、銅(Cu)や鉄(Fe)−ニッケル(Ni)合金等から成るリード端子がモールド成型されて基体12の内部に設置固定される。   The substrate 12 is made of a ceramic such as an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic, or a resin such as an epoxy resin. When the substrate 12 is made of ceramics, a wiring conductor (not shown) is formed on the upper surface thereof by firing a metal paste made of tungsten (W), molybdenum (Mo) -manganese (Mn), or the like at a high temperature. When the base 12 is made of resin, lead terminals made of copper (Cu), iron (Fe) -nickel (Ni) alloy, etc. are molded and fixed inside the base 12.

また、枠体13は、上側開口が下側開口より大きい貫通孔が形成されるとともに貫通孔の内周面に光を反射する反射面が設けられた枠状となっている。具体的には、アルミニウム(Al)やFe−Ni−コバルト(Co)合金等の金属、アルミナセラミックス等のセラミックスまたはエポキシ樹脂等の樹脂から成り、切削加工や金型成型または押し出し成型等の成形技術により形成される。   Further, the frame body 13 has a frame shape in which a through hole having an upper opening larger than a lower opening is formed and a reflection surface for reflecting light is provided on an inner peripheral surface of the through hole. Specifically, it consists of metals such as aluminum (Al) and Fe-Ni-cobalt (Co) alloys, ceramics such as alumina ceramics or resins such as epoxy resins, and molding technologies such as cutting, die molding or extrusion molding. It is formed by.

さらに、枠体13の反射面は、研磨して平坦化することにより、あるいは、枠体13の内周面にAl等の金属を蒸着法やメッキ法により被着することにより形成される。そして、枠体13は、半田,銀(Ag)ペースト等のロウ材または樹脂接着材等の接合材により、載置部12aを内周面で取り囲むように基体12の上面に接合される。   Further, the reflecting surface of the frame body 13 is formed by polishing and flattening, or by depositing a metal such as Al on the inner peripheral surface of the frame body 13 by vapor deposition or plating. The frame 13 is joined to the upper surface of the base 12 by a brazing material such as solder, silver (Ag) paste, or a joining material such as a resin adhesive so as to surround the mounting portion 12a on the inner peripheral surface.

また、発光素子14は、半田やAgペースト等の導電性を有する接着剤(図示せず)で載置部12aに載置される。   The light emitting element 14 is mounted on the mounting portion 12a with a conductive adhesive (not shown) such as solder or Ag paste.

そして、載置部12aの周辺に配置した配線導体(図示せず)と発光素子14とをボンディングワイヤ(図示せず)を介して電気的に接続し、しかる後、蛍光体を含有するエポキシ樹脂やシリコーン樹脂等の透光性部材15をディスペンサー等の注入機で発光素子14を覆うように枠体13の内部に充填しオーブンで熱硬化させることで、発光素子14からの光を蛍光体により長波長側に波長変換し所望の波長スペクトルを有する光を取り出せる発光装置11となし得る。
特開平10−107325号公報
Then, a wiring conductor (not shown) disposed around the mounting portion 12a is electrically connected to the light emitting element 14 via a bonding wire (not shown), and then an epoxy resin containing a phosphor. A light-transmitting member 15 such as silicone resin or the like is filled in the frame 13 so as to cover the light-emitting element 14 with an injection machine such as a dispenser and thermally cured in an oven, so that the light from the light-emitting element 14 is emitted by the phosphor. The light emitting device 11 can convert the wavelength to the long wavelength side and extract light having a desired wavelength spectrum.
JP-A-10-107325

しかしながら、上記従来の発光装置11は、発光素子14から上方向に発光されて透光性部材15の上面である発光面17から放射される光と、横方向や下側方向に発光されて枠体13で反射された後に発光面17から放射される光とで透光性部材15を透過する行路長が異なるため、放射光強度のむらや色むらが発光面17において生じやすいという問題点を有していた。   However, the conventional light emitting device 11 emits light from the light emitting element 14 in the upward direction and is emitted from the light emitting surface 17 that is the upper surface of the translucent member 15, and is emitted in the lateral direction and the lower direction to form a frame. Since the path length passing through the translucent member 15 is different from the light emitted from the light emitting surface 17 after being reflected by the body 13, there is a problem that unevenness of the emitted light intensity and uneven color are likely to occur on the light emitting surface 17. Was.

このような問題点を解決するために、枠体13の内周面の基体12の上面に対する角度θを大きくし、発光素子14からあらゆる方向に発光される光の行路長差を小さくするという方法がある。しかし、角度θを大きくするに従って、発光素子14の光が枠体13内部で反射する反射回数が増加するために、光の反射損失や透光性部材15内での伝搬損失が増加するという問題点を有していた。 To solve this problem, that by increasing the angle theta 3 with respect to the upper surface of the base body 12 of the inner peripheral surface of the frame body 13, to reduce the path length difference of light emitted from the light emitting element 14 in all directions There is a way. However, as the angle θ 3 is increased, the number of times the light of the light emitting element 14 is reflected inside the frame 13 increases, so that the reflection loss of light and the propagation loss within the translucent member 15 increase. Had problems.

また、枠体13内側における光の反射回数を小さくするために角度θを小さくすると、発光面17の面積が大きくなって発光装置11より発光される光の指向性が低くなり、その結果、指向性を高めるために光学レンズ等の集光部材を発光面17の上面に取着する必要があり、発光装置11の小型化が困難になるという問題点を有していた。 Also, reducing the angle theta 3 in order to reduce the number of reflections of light in the frame body 13 inside area of the light emitting surface 17 is a light emitting device directivity of the emitted light is lower than 11 increases, as a result, In order to improve directivity, it is necessary to attach a condensing member such as an optical lens to the upper surface of the light emitting surface 17, and there is a problem that it is difficult to reduce the size of the light emitting device 11.

さらに、発光素子14から発光される光によって照射される蛍光体の割合を高めて光を効率よく波長変換させるために発光素子14を取り囲む枠体13の内周面の算術平均粗さを大きくして発光素子14からの光を散乱させた場合、波長変換効率は向上して放射光強度が高まるものの、枠体13における散乱により発光装置11の外部へ所望とする放射角度で光を放射させることが困難となり指向性が低下し易いという問題点を有していた。   Furthermore, the arithmetic mean roughness of the inner peripheral surface of the frame 13 surrounding the light emitting element 14 is increased in order to increase the ratio of the phosphor irradiated by the light emitted from the light emitting element 14 and efficiently convert the wavelength of the light. When the light from the light emitting element 14 is scattered, the wavelength conversion efficiency is improved and the emitted light intensity is increased, but the light is emitted to the outside of the light emitting device 11 at a desired radiation angle by scattering in the frame 13. Has a problem that directivity tends to be lowered.

また逆に、発光素子14を取り囲む枠体13の内周面を平滑にして、発光素子14からの光を内周面で正反射させ所望とする放射角度で光を放射させた場合、放射光の指向性は高まるものの、発光素子14の光が内周面で正反射することから、正反射方向以外の蛍光体を照射する光の割合が低下して波長変換効率が低下し、光出力が劣化しやすくなるという問題点を有していた。   Conversely, when the inner peripheral surface of the frame 13 surrounding the light emitting element 14 is smoothed, the light from the light emitting element 14 is regularly reflected on the inner peripheral surface, and light is emitted at a desired radiation angle, the emitted light Although the directivity of the light emitting element 14 is regularly reflected on the inner peripheral surface, the ratio of the light irradiating the phosphor other than the regular reflection direction is reduced, the wavelength conversion efficiency is reduced, and the light output is reduced. It had the problem that it deteriorated easily.

従って、本発明はかかる従来の問題点に鑑み案出されたものであり、その目的は、放射光強度が高いとともに指向性が高く、放射光の強度むらや色むらがきわめて少ない発光装置を提供することにある。   Accordingly, the present invention has been devised in view of such conventional problems, and an object of the present invention is to provide a light emitting device that has high radiated light intensity, high directivity, and very little radiated light intensity unevenness and color unevenness. There is to do.

本発明の発光装置は、基体と、該基体上に搭載された発光素子と、前記基体上に配置されているとともに前記発光素子を囲み、前記基体側に配置された第1の反射面および外部側に配置された第2の反射面を有する反射部材と、前記発光素子から放出された光の波長を変換する蛍光体が含まれており、前記反射部材の内側に設けられているとともに、前記第2の反射面より下方に位置する発光面を有する透光性部材とを備えているものである。   The light-emitting device of the present invention includes a base, a light-emitting element mounted on the base, a first reflecting surface disposed on the base and surrounding the light-emitting element, and an external surface. A reflecting member having a second reflecting surface disposed on the side, and a phosphor that converts the wavelength of light emitted from the light emitting element, are provided inside the reflecting member, and A translucent member having a light emitting surface located below the second reflecting surface.

また、本発明の発光装置は、前記第1の反射面の第1の傾斜角度と前記第2の反射面の第2の傾斜角度とが異なるものである。   In the light emitting device of the present invention, a first inclination angle of the first reflection surface is different from a second inclination angle of the second reflection surface.

また、本発明の発光装置は、前記発光素子が、窒化物半導体からなる発光ダイオードであるものである。   In the light emitting device of the present invention, the light emitting element is a light emitting diode made of a nitride semiconductor.

また、本発明の発光装置は、前記蛍光体が、前記発光素子から放出された光により励起されて、青色,赤色および緑色に発光するものである。また、本発明の発光装置は、前記透光性部材が、前記反射部材の内側に充填された熱硬化性樹脂であるものである。   In the light emitting device of the present invention, the phosphor is excited by light emitted from the light emitting element, and emits light in blue, red and green. In the light emitting device of the present invention, the translucent member is a thermosetting resin filled inside the reflective member.

本発明の発光装置は、基体側に配置された第1の反射面および外部側に配置された第2の反射面を有する反射部材と、前記第2の反射面より下方に位置する発光面を有する透光性部材とを備えている。   The light emitting device of the present invention includes a reflecting member having a first reflecting surface arranged on the base side and a second reflecting surface arranged on the outside side, and a light emitting surface located below the second reflecting surface. The translucent member which has.

本発明の発光装置は、このような構成により、発光輝度を向上させることができるとともに、色むらを低減させることが可能となる。   With such a configuration, the light emitting device of the present invention can improve light emission luminance and reduce color unevenness.

また、本発明の発光装置は、前記第1の反射面の第1の傾斜角度と前記第2の反射面の第2の傾斜角度とが異なることにより、発光特性をさらに向上させることができる。   Further, the light emitting device of the present invention can further improve the light emission characteristics because the first inclination angle of the first reflection surface is different from the second inclination angle of the second reflection surface.

また、本発明の発光装置は、前記発光素子が、窒化物半導体からなる発光ダイオードであることにより、発光効率を向上させることができる。   In the light-emitting device of the present invention, the light-emitting element is a light-emitting diode made of a nitride semiconductor, so that the light emission efficiency can be improved.

また、本発明の発光装置は、前記蛍光体が、前記発光素子から放出された光により励起されて、青色,赤色および緑色に発光することにより、所望の発光スペクトルおよび色を有する光を放射することができる。   In the light-emitting device of the present invention, the phosphor is excited by light emitted from the light-emitting element and emits light having a desired emission spectrum and color by emitting light in blue, red, and green. be able to.

また、本発明の発光装置は、前記透光性部材が、前記反射部材の内側に充填された熱硬化性樹脂であることにより、発光効率を向上させることができる。   Moreover, the light-emitting device of this invention can improve luminous efficiency, when the said translucent member is the thermosetting resin with which the inner side of the said reflection member was filled.

本発明の発光装置について以下に詳細に説明する。図1は本発明の発光装置の実施の形態の一例を示す断面図である。この図において、1は本発明の発光装置、2は基体、3は枠体(反射部材)、4は発光素子、5は蛍光体を含有した透光性部材、6は基体2の上面に対しθの角度(傾斜角度)を成す第1の内周面(反射面)、8は基体2の上面に対しθ2の角度(傾斜角度)を成す第2の内周面(反射面)、2aは基体2の発光素子4の載置部である。 The light emitting device of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing an example of an embodiment of a light emitting device of the present invention. In this figure, 1 is a light emitting device of the present invention, 2 is a substrate, 3 is a frame (reflective member), 4 is a light emitting element, 5 is a translucent member containing a phosphor, and 6 is an upper surface of the substrate 2. theta 1 angle first inner peripheral surface forming a (tilt angle) (reflection surface), 8 the second inner peripheral surface forming an angle (inclination angle) of the theta 2 with respect to the upper surface of the substrate 2 (the reflecting surface), Reference numeral 2 a denotes a mounting portion for the light emitting element 4 of the base 2.

本発明の発光装置1は、上面に発光素子4の載置部2aを有する基体2と、基体2の上面の外周部に載置部2aを取り囲むように樹脂接着剤やろう材等で取着された枠体3と、搭載部2aから基体2の外面にかけて形成された配線導体(図示せず)と、載置部2aに接着剤等で載置されるとともに配線導体にボンディングワイヤ等で電気的に接続された発光素子4と、枠体3の内側に発光素子4を覆うように設けられ、発光素子4が発光する光を波長変換する蛍光体を含有した透光性部材5とを具備している。   The light emitting device 1 of the present invention is attached to the base 2 having the mounting portion 2a of the light emitting element 4 on the upper surface and a resin adhesive or brazing material so as to surround the mounting portion 2a on the outer peripheral portion of the upper surface of the base 2 The frame 3 formed, the wiring conductor (not shown) formed from the mounting portion 2a to the outer surface of the base 2, and the mounting portion 2a is mounted with an adhesive or the like and is electrically connected to the wiring conductor with a bonding wire or the like. Light-emitting elements 4 connected to each other, and a translucent member 5 provided inside the frame 3 so as to cover the light-emitting elements 4 and containing a phosphor that converts the wavelength of light emitted from the light-emitting elements 4. is doing.

基体2は、酸化アルミニウム質焼結体,窒化アルミニウム質焼結体,ムライト質焼結体,ガラスセラミックス等のセラミックス、または、エポキシ樹脂や液晶ポリマー等の樹脂から成る絶縁体から成る。基体2は、その上面に発光素子4を載置するための載置部2aを有しており、発光素子4を支持する支持部材として機能する。   The substrate 2 is made of an insulator made of ceramic such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a glass ceramic, or a resin such as an epoxy resin or a liquid crystal polymer. The base 2 has a placement portion 2 a for placing the light emitting element 4 on the upper surface thereof, and functions as a support member that supports the light emitting element 4.

本発明の枠体3は、その内周面の傾斜角度が互いに異なる下側の第1の内周面6と上側の第2の内周面8とから成り、第1および第2の内周面6,8と基体2の上面との成す角度をそれぞれθ1およびθとしたときに、θ>θである。これにより、発光素子4から横方向や下側方向に発光された光を第1の内周面6で効率よく上方向に反射させ、枠体3内で反射を繰り返すことなく良好に放射させることができ放射光強度をきわめて高くすることができる。また、斜め上方に進む光を第2の内周面8で効果的に発光装置1の発光軸の方向に反射させることができ、放射光の指向性を非常に高めることができる。これらの結果、高い放射光強度と高い指向性とをともに有する発光特性に優れた発光装置1となる。 The frame 3 of the present invention comprises a lower first inner peripheral surface 6 and an upper second inner peripheral surface 8 having different inclination angles of the inner peripheral surface, and the first and second inner peripheral surfaces. When the angles formed by the surfaces 6 and 8 and the upper surface of the substrate 2 are θ 1 and θ 2 , respectively, θ 2 > θ 1 is satisfied. Thereby, the light emitted from the light emitting element 4 in the lateral direction or the downward direction is efficiently reflected upward by the first inner peripheral surface 6 and is radiated well without repeating the reflection in the frame 3. And the emitted light intensity can be made extremely high. Further, light traveling obliquely upward can be effectively reflected by the second inner peripheral surface 8 in the direction of the light emitting axis of the light emitting device 1, and the directivity of the emitted light can be greatly enhanced. As a result, the light emitting device 1 having both high radiation light intensity and high directivity and excellent light emission characteristics is obtained.

枠体3は、AlやFe−Ni−Co合金等の金属、アルミナセラミックス等のセラミックスまたはエポキシ樹脂等の樹脂から成り、切削加工や金型成型または押し出し成型等の成形技術により形成される。   The frame 3 is made of metal such as Al or Fe-Ni-Co alloy, ceramics such as alumina ceramics or resin such as epoxy resin, and is formed by a molding technique such as cutting, die molding or extrusion molding.

また、角度θは、30°〜45°であるのがよく、角度θは、50°〜70°であるのがよい。これにより、高い放射光強度と高い指向性とをより高めることができる。 In addition, the angle θ 1 is preferably 30 ° to 45 °, and the angle θ 2 is preferably 50 ° to 70 °. Thereby, high radiated light intensity and high directivity can be improved more.

本発明の透光性部材5は、好ましくは、第1の内周面6の上端より下側に充填されるのがよい。これにより、発光素子4からあらゆる方向に発光される光の透光性部材5を透過する行路長を均一に近づけることができ、波長変換効率がばらつくのを有効に抑制して放射光強度むらや色むらを非常に少なくすることができる。   The translucent member 5 of the present invention is preferably filled below the upper end of the first inner peripheral surface 6. As a result, the path length of the light emitted from the light emitting element 4 in all directions through the translucent member 5 can be made close to uniform, and the variation in wavelength conversion efficiency can be effectively suppressed and the radiated light intensity unevenness can be reduced. Color unevenness can be greatly reduced.

本発明の第1および第2の内周面6,8は、発光素子4の光を高い反射率で反射させ得る反射面を有している。このような、反射面は、枠体3を切削加工や金型成形、研磨等研磨等の方法で加工して第1および第2の内周面6,8を平坦化することにより形成することができる。特に、光反射効率を高くするため、枠体3としてAl,Ag,金(Au),白金(Pt),チタン(Ti),クロム(Cr),Cu等の高反射率の金属を用い、切削加工や金型成形、研磨等により第1および第2の内周面6,8を平坦化することにより形成するのが好ましい。   The first and second inner peripheral surfaces 6 and 8 of the present invention have reflection surfaces that can reflect the light of the light emitting element 4 with a high reflectance. Such a reflecting surface is formed by flattening the first and second inner peripheral surfaces 6 and 8 by processing the frame 3 by a method such as cutting, die forming, polishing or the like. Can do. In particular, in order to increase the light reflection efficiency, a high-reflectance metal such as Al, Ag, gold (Au), platinum (Pt), titanium (Ti), chromium (Cr), or Cu is used as the frame 3 for cutting. It is preferable to form the first and second inner peripheral surfaces 6 and 8 by flattening them by processing, molding, polishing or the like.

あるいは、反射面は、耐候性や耐湿性に優れるCu−W合金やSUS合金,セラミックスより形成された枠体3の第1,第2の内周面6,8に、Al,Ag,Au等の金属メッキや蒸着等の金属薄膜を形成することにより作製してもよい。なお、反射面がAgやCu等の酸化により変色し易い金属からなる場合には、その表面に、紫外領域から可視光領域にわたり透過率の優れる低融点ガラスやゾル−ゲルガラス、または、シリコーン樹脂やエポキシ樹脂を被着するのが良く、これにより、枠体3の第1の内周面6および第2の内周面8の耐腐食性、耐薬品性、耐候性を向上することができる。   Alternatively, the reflecting surface is formed of Al, Ag, Au, etc. on the first and second inner peripheral surfaces 6 and 8 of the frame 3 made of Cu-W alloy, SUS alloy, or ceramics, which are excellent in weather resistance and moisture resistance. You may produce by forming metal thin films, such as metal plating of this, vapor deposition. When the reflecting surface is made of a metal that is easily discolored by oxidation such as Ag or Cu, low melting point glass or sol-gel glass having excellent transmittance from the ultraviolet region to the visible light region, a silicone resin, It is preferable to apply an epoxy resin, whereby the corrosion resistance, chemical resistance, and weather resistance of the first inner peripheral surface 6 and the second inner peripheral surface 8 of the frame 3 can be improved.

また、第1の内周面6は、好ましくは、算術平均粗さが第2の内周面8よりも大きくなっているのがよい。これにより、第1の内周面6で反射光を良好に散乱させて多くの蛍光体に光を照射させることができ、波長変換効率をより高くすることができるとともに、斜め上方に進行する光を第2の内周面8により、乱反射させることなく上方向に効率よく正反射させて指向性を高めることができ、放射光強度および指向性をともにより向上させることができる。   The first inner peripheral surface 6 preferably has an arithmetic average roughness larger than that of the second inner peripheral surface 8. Thereby, the reflected light can be satisfactorily scattered on the first inner peripheral surface 6 to irradiate many phosphors with light, the wavelength conversion efficiency can be further increased, and the light traveling obliquely upward The second inner peripheral surface 8 can efficiently regularly reflect upward without irregular reflection to increase the directivity, and can further improve the emitted light intensity and directivity.

また、第1および第2の内周面6,8は、その算術平均粗さをそれぞれaおよびaとしたときに、0.4μm≦a≦0.8μm、a≦0.1μmとすることが好ましい。例えば、Raが0.8μm<aの場合、発光素子4の枠体3の第1の内周面6で光の乱反射が必要以上に起こり、枠体3の外部に出射する光が減少しやすくなる。また、a<0.4μmの場合、光が第1の内周面6で正反射しすぎることで一部の蛍光体には強い光が照射し、また一部の蛍光体には光が照射しない現象がおこりやすくなり、蛍光体で効率よく波長変換するのが困難になる。その結果、発光装置1の内部における光の伝搬損失が大きくなり、光を効率よく発光装置1の外部に出射することが困難になる。 Further, the first and second inner peripheral surfaces 6 and 8 are set to 0.4 μm ≦ a 1 ≦ 0.8 μm and a 2 ≦ 0.1 μm when the arithmetic average roughnesses are a 1 and a 2 , respectively. Is preferred. For example, when Ra is 0.8 μm <a 1 , irregular reflection of light occurs more than necessary on the first inner peripheral surface 6 of the frame 3 of the light emitting element 4, and light emitted to the outside of the frame 3 is likely to decrease. Become. In addition, when a 1 <0.4 μm, the light is regularly reflected by the first inner peripheral surface 6, so that some phosphors are irradiated with strong light, and some phosphors are irradiated with light. Phenomenon is not likely to occur, and it is difficult to efficiently perform wavelength conversion with a phosphor. As a result, the propagation loss of light inside the light emitting device 1 increases, and it becomes difficult to efficiently emit light to the outside of the light emitting device 1.

また、0.1μm<aの場合、発光素子4の枠体3の第2の内周面8で光を正反射することが困難になるとともに発光装置1の内部で乱反射しやすくなる。その結果、発光装置1の内部における光の伝搬損失が大きく成りやすいとともに、所望の放射角度で光を発光装置1の外部に出射することが困難になる。 In addition, when 0.1 μm <a 2 , it is difficult to regularly reflect light on the second inner peripheral surface 8 of the frame 3 of the light emitting element 4, and it is easy to diffusely reflect inside the light emitting device 1. As a result, the propagation loss of light inside the light emitting device 1 tends to increase, and it becomes difficult to emit light outside the light emitting device 1 at a desired radiation angle.

蛍光体は、発光素子4の光で励起され電子の再結合により青色,赤色,緑色等に発光する、無機系,有機系の蛍光体が透明性部材5に充填される。これにより、蛍光体を任意の割合で配合することにより、所望の発光スペクトルと色を有する光を出力することができる。   The transparent member 5 is filled with an inorganic or organic phosphor that is excited by light from the light emitting element 4 and emits blue, red, green, or the like by recombination of electrons. Thereby, the light which has a desired emission spectrum and color can be output by mix | blending a fluorescent substance in arbitrary ratios.

発光素子4は、サファイア基板上にGaN,AlGaN,InGaN等から構成されるバッファ層,n型層,発光層,p型層を順次積層した窒化物半導体が用いられる。   The light-emitting element 4 uses a nitride semiconductor in which a buffer layer made of GaN, AlGaN, InGaN or the like, an n-type layer, a light-emitting layer, and a p-type layer are sequentially stacked on a sapphire substrate.

透光性部材5は、発光素子4との屈折率差が小さく、紫外線領域から可視光領域の光に対して透過率の高いものから成るのがよい。例えば、透光性部材5は、シリコーン樹脂やエポキシ樹脂、ユリア樹脂等の透明樹脂や低融点ガラスやゾル−ゲルガラス等から成る。これにより、発光素子4と透光性部材5との屈折率差により光の反射損失が発生するのを有効に抑制するとともに、発光装置1の外部へ高効率で所望の放射強度,角度分布で光を出射する発光装置1を製造できる。   The translucent member 5 is preferably made of a material having a small refractive index difference from the light emitting element 4 and having a high transmittance with respect to light in the ultraviolet region to the visible light region. For example, the translucent member 5 is made of a transparent resin such as a silicone resin, an epoxy resin, or a urea resin, a low-melting glass, a sol-gel glass, or the like. This effectively suppresses the occurrence of light reflection loss due to the difference in refractive index between the light emitting element 4 and the translucent member 5, and at the desired radiation intensity and angular distribution with high efficiency to the outside of the light emitting device 1. The light emitting device 1 that emits light can be manufactured.

かくして、本発明のパッケージは、基体2の搭載部2aに発光素子4を搭載するとともに、発光素子4をボンディングワイヤ(図示せず)と配線導体(図示せず)とを介して外部電気回路基板に電気的に導通させ、しかる後、発光素子4の周囲または表面に蛍光体もしくは蛍光体を混入した透光性部材5を充填し熱硬化させることにより、発光素子4の光を蛍光体により波長変換し所望の波長スペクトルを有する光を発光面7より取り出すことができる発光装置1となる。   Thus, in the package of the present invention, the light emitting element 4 is mounted on the mounting portion 2a of the base 2, and the light emitting element 4 is connected to the external electric circuit board via the bonding wire (not shown) and the wiring conductor (not shown). After that, the phosphor or the translucent member 5 in which the phosphor is mixed is filled around the surface or the surface of the light-emitting element 4 and thermally cured. The light emitting device 1 can convert the light having a desired wavelength spectrum and extract the light from the light emitting surface 7.

なお、本発明は、上記の実施の形態に限定されず、本発明の要旨を逸脱しない範囲内で種々の変更を行うことは何等支障ない。例えば、枠体3の上面に平板状の透光性の蓋体を半田や樹脂接着剤等で接合することにより、発光装置1の内部への耐浸水性が改善され長期信頼性が向上する。   It should be noted that the present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. For example, by joining a flat translucent lid to the upper surface of the frame 3 with solder, a resin adhesive, or the like, water resistance to the inside of the light emitting device 1 is improved and long-term reliability is improved.

本発明の発光装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the light-emitting device of this invention. 従来の発光装置を示す断面図である。It is sectional drawing which shows the conventional light-emitting device.

符号の説明Explanation of symbols

1:発光装置
2:基体
2a:載置部
3:枠体
4:発光素子
5:透光性部材
6:第1の内周面
7:発光面
8:第2の内周面
1: Light emitting device 2: Base 2a: Placement portion 3: Frame body 4: Light emitting element 5: Translucent member 6: First inner peripheral surface 7: Light emitting surface 8: Second inner peripheral surface

Claims (5)

基体と、
該基体上に搭載された発光素子と、
前記基体上に配置されているとともに前記発光素子を囲み、前記基体側に配置された第1の反射面および外部側に配置された第2の反射面を有する反射部材と、
前記発光素子から放出された光の波長を変換する蛍光体が含まれており、前記反射部材の内側に設けられているとともに、前記第2の反射面より下方に位置する発光面を有する透光性部材とを備えた発光装置。
A substrate;
A light emitting device mounted on the substrate;
A reflective member disposed on the base body and surrounding the light emitting element, and having a first reflective surface disposed on the base side and a second reflective surface disposed on the external side;
A light-transmitting light that includes a phosphor that converts the wavelength of light emitted from the light-emitting element, is provided inside the reflective member, and has a light-emitting surface positioned below the second reflective surface. Light-emitting device provided with a conductive member.
前記第1の反射面の第1の傾斜角度と前記第2の反射面の第2の傾斜角度とが異なる請求項1記載の発光装置。   The light emitting device according to claim 1, wherein a first inclination angle of the first reflection surface is different from a second inclination angle of the second reflection surface. 前記発光素子が、窒化物半導体からなる発光ダイオードである請求項1または請求項2記載の発光装置。   The light emitting device according to claim 1, wherein the light emitting element is a light emitting diode made of a nitride semiconductor. 前記蛍光体が、前記発光素子から放出された光により励起されて、青色,赤色および緑色に発光する請求項1乃至請求項3のいずれかに記載の発光装置。   The light-emitting device according to claim 1, wherein the phosphor is excited by light emitted from the light-emitting element and emits blue, red, and green light. 前記透光性部材が、前記反射部材の内側に充填された熱硬化性樹脂である請求項1乃至請求項4のいずれかに記載の発光装置。   The light-emitting device according to claim 1, wherein the translucent member is a thermosetting resin filled inside the reflective member.
JP2006123138A 2006-04-27 2006-04-27 Light emitting apparatus Pending JP2006203262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006123138A JP2006203262A (en) 2006-04-27 2006-04-27 Light emitting apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006123138A JP2006203262A (en) 2006-04-27 2006-04-27 Light emitting apparatus

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003396930A Division JP3906199B2 (en) 2003-11-27 2003-11-27 Light emitting device

Publications (1)

Publication Number Publication Date
JP2006203262A true JP2006203262A (en) 2006-08-03

Family

ID=36960902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006123138A Pending JP2006203262A (en) 2006-04-27 2006-04-27 Light emitting apparatus

Country Status (1)

Country Link
JP (1) JP2006203262A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000269551A (en) * 1999-03-18 2000-09-29 Rohm Co Ltd Chip-type light emitting device
JP2002050797A (en) * 2000-07-31 2002-02-15 Toshiba Corp Semiconductor excitation phosphor light-emitting device and manufacturing method therefor
JP2002094122A (en) * 2000-07-13 2002-03-29 Matsushita Electric Works Ltd Light source and its manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000269551A (en) * 1999-03-18 2000-09-29 Rohm Co Ltd Chip-type light emitting device
JP2002094122A (en) * 2000-07-13 2002-03-29 Matsushita Electric Works Ltd Light source and its manufacturing method
JP2002050797A (en) * 2000-07-31 2002-02-15 Toshiba Corp Semiconductor excitation phosphor light-emitting device and manufacturing method therefor

Similar Documents

Publication Publication Date Title
JP3881653B2 (en) Light emitting device
KR100620844B1 (en) Light-emitting apparatus and illuminating apparatus
JP4747726B2 (en) Light emitting device
TWI433344B (en) Light emitting apparatus and illuminating apparatus
JP4587675B2 (en) Light emitting element storage package and light emitting device
JP4443188B2 (en) Light emitting element storage package and light emitting device
JP2009164157A (en) Light-emitting device
JP3921200B2 (en) Light emitting device
JP2006237264A (en) Light emitting device and lighting apparatus
JP2007109887A (en) Semiconductor light emitting device
JP2005244152A (en) Substrate for mounting light emitting element and light emitting device
JP2007180430A (en) Light-emitting diode device
JP4948841B2 (en) Light emitting device and lighting device
JP2005210042A (en) Light emitting apparatus and illumination apparatus
JP3906199B2 (en) Light emitting device
JP2004327632A (en) Package for housing light emitting element and light emitting device
JP2006229259A (en) Light emitting device
JP2005310911A (en) Package for housing light emitting element, light emitting device, and lighting apparatus
JP4511238B2 (en) Light emitting element storage package, light emitting device, and lighting device
JP2007173875A (en) Light emitting device
JP4206334B2 (en) Light emitting device
JP2005209959A (en) Package for light emitting storage and light emitting device
JP4614679B2 (en) LIGHT EMITTING DEVICE, ITS MANUFACTURING METHOD, AND LIGHTING DEVICE
JP4925346B2 (en) Light emitting device
JP2006093612A (en) Light emitting device and illuminator

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061109

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100804

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100810

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100915

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101026