JP2010274256A - Light irradiation head, exposure device, image forming apparatus, liquid droplet curing device, and liquid droplet curing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light irradiation head which irradiates an object with light of relatively high luminous energy, at a relatively small luminous energy distribution; an exposure device; an image forming apparatus; a liquid droplet curing device; and a liquid droplet curing method. <P>SOLUTION: The light irradiation head 10 includes the first substrate 20 and a light emitting element 12 disposed on the first substrate 20. The first substrate 20 has a cooling flow channel through which a cooling medium passes provided inside. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light irradiation head, an exposure device, an image forming apparatus, a droplet curing device, and a droplet curing method.

  Currently, LED elements are used in a wide range of applications such as illumination, image display devices, and optical printer heads of image recording apparatuses. In recent years, the use of LED elements has been advanced as a light source of a light irradiation head for irradiating light to a photosensitive material. For example, ultraviolet curable resins and paints are widely used from the field of resist film formation and printing to the field of adhesive fixing of small parts in an assembly process such as an optical pickup.

  In recent years, printing methods using ultraviolet curable ink (UV ink) have attracted attention because of the diversification of printing media, environmental considerations, and increased printing speed. In printing using UV ink, the UV ink is attached to a print medium, and the attached ink is irradiated with ultraviolet light (UV light) to cure the UV ink in a short time.

  Conventionally, fluorescent lamps such as a high-pressure mercury lamp and a low-pressure mercury lamp have been used as a light source of an ultraviolet irradiation head for curing such ultraviolet-curable ink. 2. Description of the Related Art Recently, for example, an ink jet recording apparatus described in Patent Document 1 is a printing apparatus using, as an irradiation light source, a UV-LED array in which a plurality of UV-LED elements that emit UV light are arranged on one main surface of a substrate. Proposed.

JP 2005-104108 A

  The LED element generates a relatively large amount of heat due to light emission. In an LED array using such LED elements, the temperature of a substrate on which a plurality of LED elements are arranged is likely to rise. In the conventional LED array, as described in Patent Document 1, for example, a heat sink made of a metal member is bonded to a base on which LED elements are arranged. In the conventional LED array having such a configuration, the temperature rise is suppressed by radiating the thermal energy of the substrate to the surroundings through the heat sink to which the LED array is bonded. However, in an LED array, a large number of LED elements may be arranged close to each other in order to make the intensity of light to be irradiated relatively strong and reduce the intensity distribution. Thus, in an LED array in which a large number of LED elements are located close to each other, the degree of suppression of temperature rise may be relatively small only by heat radiation by a heat sink. As a result, in such an LED array that suppresses the temperature rise, the electrical characteristics of the LED element that is driven at a high temperature may be deteriorated.

  For the substrate on which the LED element is mounted, an insulating substrate such as a ceramic substrate having a relatively excellent reflectance is used. This ceramic substrate is relatively different from a heat sink made of a metal member in terms of thermal expansion coefficient. Since an internal stress is generated due to the difference in the degree of expansion between the base and the heat sink, there is a possibility that the base may be deformed or damaged when heat dissipation by the heat sink is insufficient.

  The present invention has been made for the purpose of solving such problems.

  In order to solve the above-mentioned problems, the present invention includes a base and a light emitting element disposed on the one main surface side of the base, and a flow path through which a cooling medium passes is provided inside the base. A light irradiation head is provided.

  Moreover, the exposure device comprised provided with the said light irradiation head is provided.

  In addition, the exposure device, an optical system that guides light emitted from the light irradiation head toward the surface of the photosensitive material that is modified by receiving light emitted from the light emitting element, and the light irradiation according to input image data. There is also provided an image forming apparatus including a control unit that controls light emission of a light emitting element disposed in a head and forms an image pattern corresponding to the image data on the photosensitive material.

  Also, the light irradiation head described above, and discharge means for discharging a droplet of a photocurable material that is cured by receiving light emitted from the light irradiation head to the recording medium, and attaching the droplet to the surface of the recording medium In addition, a droplet curing apparatus comprising:

  In addition, a photocurable material that is cured by receiving light emitted from the light irradiation head described above is attached to the surface of the recording medium, and light emitted from the light irradiation head is irradiated onto the droplets attached to the surface of the object. Also provided is a droplet curing method characterized by curing the droplet.

  The light irradiation head, exposure device, image forming apparatus, and droplet curing apparatus of the present invention have a relatively high heat dissipation efficiency and a relatively small temperature rise during light emission. The light irradiation head, exposure device, image forming apparatus, and droplet curing apparatus of the present invention can stably irradiate light having relatively high intensity and relatively small unevenness in intensity distribution over a long period of time. . According to the droplet curing apparatus and method of the present invention, it is possible to cure a droplet attached to an object in a relatively short time, and relatively little uneven curing on the surface of the object.

It is a schematic perspective view explaining the irradiation head of one Embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of the irradiation head shown in FIG. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is a schematic plan view explaining other embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of the light irradiation head shown in FIG. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is a schematic plan view explaining other embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of the light irradiation head shown in FIG. It is a schematic sectional drawing explaining the structure of the light irradiation head shown in FIG. FIG. 14 is a schematic plan view showing a part of the light irradiation head shown in FIG. 13. FIG. 14 is a schematic plan view showing a part of the light irradiation head shown in FIG. 13. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is a schematic sectional drawing of other embodiment of the light irradiation head of this invention. It is sectional drawing which shows the outline of the light irradiation head of this invention. It is sectional drawing which expands and shows the 1st joining member with which the light irradiation head shown in FIG. 22 is provided. It is a block diagram which simplifies and shows the refrigerant | coolant supply device of other embodiment of this invention. It is a schematic top view explaining the inkjet printer which is an example of the droplet hardening apparatus of this invention comprised including the irradiation head shown in FIG. FIG. 26 is a schematic sectional view of the ink jet printer shown in FIG. 25.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following embodiments are illustrative, and the present invention is not limited to these embodiments.

<First Embodiment of Light Irradiation Head>
FIG. 1 is a schematic perspective view illustrating a light irradiation head 10 which is an embodiment of the light irradiation head of the present invention, and FIG. 2 is a schematic cross-sectional view showing an enlarged part of the light irradiation head 10. .

  The light irradiation head 10 includes an insulating substrate 11 as a substrate, a light emitting element 12, terminal electrodes 131 and 132, and a sealing material 14. The insulating base 11 is made of ceramics such as alumina. A plurality of light emitting elements 12 are arranged in an array on the first main surface of the insulating substrate 11.

  The insulating base 11 includes a first substrate 20. This 1st board | substrate 20 becomes a structure by which the reflection part 22 is arrange | positioned on the said surface 21a of the support part 21 which has the plate-shaped surface 21a. The reflecting portion 22 is provided with a plurality of through holes 22a. One of the openings of the through hole 22a is closed by the surface 21a of the support portion 21. In the first substrate 20, the light emitting element 12 is arranged in a region 21 b surrounded by the through hole 22 a of the reflection portion 22 in the surface 21 a of the support portion 21. In the first substrate, the through hole 22a of the reflection part 22 and the region 21b surrounded by the through hole 22a in the surface 21a of the support part 21 function as a reflection structure that reflects light emitted from the light emitting element 12. ing. On the surface 21 a of the support portion 21, a pair of terminal electrodes 131 and 132 that supply power to the light emitting elements 12 and connect to the light emitting elements 12 are provided. The pair of terminal electrodes 131 and 132 has a first end located in a region 21 b surrounded by the through hole 22 a and is connected to the light emitting element 12. The pair of terminal electrodes 131 and 132 are electrically connected to an input terminal provided outside via a wiring conductor 23 arranged inside the first substrate 20. Moreover, the sealing material 14 is filled in the plurality of through holes 22 a of the reflection portion 22 so as to cover the entire light emitting element 12. As this sealing material 14, a silicone resin is mentioned, for example.

  The support 21 is made of, for example, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, epoxy resin, and resin such as liquid crystal polymer (LCP). It is formed.

  In the manufacturing method of the support part 21 when the support part 21 is made of ceramics or the like, first, a plurality of green sheets to be the support part 21 are prepared by firing. Next, a metal paste that becomes the wiring conductor 23 through the electrical connection between the light emitting element 12 and the input terminal is disposed between the green sheets. Examples of the metal paste that becomes the wiring conductor 23 include a paste containing a metal such as tungsten (W), molybdenum (Mo), manganese (Mn), and copper (Cu). Next, simultaneously with firing the support portion 21, the support portion 21 having the wiring conductor 23 can be formed by firing together with the metal paste. Such terminal electrodes 131 and 132 may be formed using the known metallization method, plating method, or the like.

  Moreover, in the manufacturing method of the said support part 21 in case the support part 21 is the insulator which consists of resin, first, the precursor of the resin used as the support part 21 is prepared by hardening. Next, the lead terminal that becomes the wiring conductor 23 through the electrical connection between the light emitting element 12 and the input terminal is embedded in the resin precursor that becomes the support portion 21. When embedding in this precursor, one end of the lead terminal is led out to the mounting portion on the light emitting element 12 side, and the other end is exposed from the side surface and the lower surface of the support portion 21, so that it is electrically connected to other elements. Can be connected. Examples of the material for forming the lead terminal include metal materials such as Cu, Ag, Al, iron (Fe) -nickel (Ni) -cobalt (Co) alloy, and Fe-Ni alloy.

  In the light irradiation head 10, the light emitted from the light emitting element 12 toward the inner peripheral surface of the through hole 22 a of the reflecting portion 22 is reflected upward by the inner peripheral surface of the through hole 22 a, and the upper portion in FIG. It is comprised so that it may irradiate efficiently toward. The reflection part 22 of this embodiment consists of porous ceramics visually recognized by white under a white light source. This ceramic is selected so as to have a relatively good reflectivity with respect to light in the ultraviolet region, for example. Examples of the ceramic employed as the reflecting portion 22 include an aluminum oxide sintered body, a zirconium oxide sintered body, and an aluminum nitride sintered body. Moreover, the reflection part 22 may be comprised with resin, such as an epoxy resin and a liquid crystal polymer (LCP). Further, in order to achieve the desired reflectivity, a metallic reflective film is provided on the inner peripheral surface of the through hole 22a of the reflective portion 22 according to the material of the reflective portion 22, the wavelength of light emitted from the light emitting element 12, and the like. It may be done. Such a metallic reflective film can be formed by, for example, metal plating, vapor deposition, or the like.

  The light emitting element 12 is configured by providing a light emitting layer 122 on one of the main surfaces of an element substrate 121. Examples of the element substrate 121 include sapphire. As this light emitting layer 122, the well-known thing which consists of compound semiconductors, such as GaN, is mentioned, for example. In the present embodiment, the light emitting layer 122 is formed on one main surface on the side facing the upper surface of the first substrate 20 out of the two main surfaces of the element substrate 121 so that the light emitting element 12 is flip-chip connected. Is provided.

  In the present embodiment, the light emitting layer 122 that emits UV light having a wavelength peak spectrum of 380 [nm] or less is employed. That is, in the present embodiment, a UV-LED element is employed as the light emitting element 12. In the light emitting layer 122, a plurality of semiconductor layers are stacked on one main surface of the element substrate 121 (note that this semiconductor layer is not shown individually). More specifically, for example, the light emitting layer 122 includes, from one main surface of the element substrate 121, a first semiconductor layer of one conductivity type of n-type and p-type, a first contact layer, A semiconductor layer of a second conductivity type opposite to that of the first semiconductor layer and a second contact layer are formed by being stacked in this order.

  In addition, element electrodes 123 and 124 mainly composed of Ag, for example, are provided on the surface of the light emitting layer 122 facing the first substrate 20. These element electrodes 123 and 124 provided on the surface of the light emitting layer 122 are connected to a pair of terminal electrodes 131 and 132 provided on the surface 21 a of the support portion 21 of the first substrate 20. The light emitting element 12 of the present embodiment is arranged in a state where it is flip-chiped on one main surface of the first substrate 20. The light emitting layer 122 emits light having a light amount corresponding to the magnitude of the voltage value when a voltage is applied to the device electrodes 123 and 124. The element substrate 121 of this embodiment is made of sapphire and has relatively good transparency with respect to the light emitted from the light emitting layer 122. In the present embodiment, the light emitting element 12 is controlled by the magnitude of the voltage, but may be controlled by the magnitude of the current.

  In the embodiment shown in FIG. 1, the plurality of light emitting layers 122 include element electrodes 123 and 124, respectively. In such an embodiment, the voltage applied to each of the light emitting layers 122 can be controlled independently for each light emitting layer 122. The configuration of the electrodes is not particularly limited. For example, the long element electrodes 123 and 124 that are simultaneously connected to the plurality of light emitting layers 122 are arranged in the region 21b surrounded by the reflecting portion 22 to form a plurality of light emitting layers. The same voltage may be applied to 122 in a lump. In addition, the light emitting layers 122 may be electrically connected in parallel or may be electrically connected in series.

  As the sealing material 14, a material that favorably transmits light emitted from the light emitting layer 122 is selected. As this sealing material 14, a silicone resin is mentioned, for example. Further, a material closer to the refractive index of the element substrate 121 is selected as the refractive index of the sealing material 14 than about 1.0 which is the refractive index of air. The sealing material 14 of this embodiment is formed of a silicone resin having a refractive index of about 1.4, and is formed of sapphire having a refractive index of 1.7 compared to air having a refractive index of about 1.0. The value is close to that of the element substrate 121.

  In the present embodiment, for example, the light emitting element 122 having a size of about 0.6 [mm] × 0.6 [mm] in a plan view of the light emitting layer 122 is formed on the one main surface of the first substrate 20 with about 2. They are arranged vertically and horizontally at a relatively small mounting interval of 6 mm. In the light irradiation unit 10X of the light irradiation head 10, the intensity of light irradiated from the one main surface of the first substrate 20 is relatively strong, and the variation in intensity distribution is also relatively small. The light irradiation unit 10 </ b> X includes a part of the support unit 21 of the first substrate 20, the reflection unit 22, and the light emitting element 12. On the other hand, the plurality of light emitting elements 12 are arranged close to each other, and the amount of heat per unit time transmitted to the first substrate 20 during the light emission of the light emitting elements 12 is also relatively large.

  The first substrate 20 is provided with a cooling flow path 201 through which a cooling medium that absorbs heat accompanying light emission of the light emitting element 12 passes. The cooling medium may be a liquid, a gas, or a liquid containing a solid component, and is not particularly limited as long as it is a fluid that flows through the cooling flow path 201. Such a cooling medium is supplied to the cooling flow path 201 of the first substrate 20 from a refrigerant supply device 10Y described later. The light irradiation head 10 includes a cooling flow path 201 inside the first substrate 20 of the insulating base 11, and heat generated by light emission of the light emitting element 12 is efficiently absorbed by the cooling medium flowing through the cooling flow path 201. Is done. For this reason, the heat dissipation efficiency from the light emitting element 12 is relatively high, and the temperature rise during light emission is relatively small. Thereby, the light irradiation head 10 can stably irradiate light having relatively high intensity and relatively small unevenness in intensity distribution over a long period of time.

  In addition, the light irradiation head 10 is not restricted to the above-mentioned structure. For example, as illustrated in FIGS. 3 to 5, a heat conductive member 24 having a higher thermal conductivity than the first substrate 20 may be disposed inside the first substrate 20. For example, as illustrated in FIG. 3, the heat conducting member 24 may be entirely disposed in a region sandwiched between each light emitting element 12 and the cooling flow path 201. Further, a configuration in which a part of the heat conducting member 24 is arranged in a region sandwiched between each light emitting element 12 and the cooling flow path 201 may be employed. For example, as shown in FIG. 4, at least a part of the heat conducting member 24 may be exposed inside the cooling channel 201. That is, in this case, a part of the heat conducting member 24 functions as the inner wall of the cooling flow path 201. Further, the heat conducting member 24 may penetrate the cooling flow path 201. Further, the cooling channel 201 may penetrate the heat conducting member 24. When the heat conducting member 24 is in direct contact with the cooling medium passing through the inside of the cooling channel 201, heat exchange is efficiently performed between the cooling medium and the heat conducting member 24, and the light emitting element 12 is efficiently used. To be cooled.

  Further, the shape of the heat conducting member 24 is not particularly limited. For example, as illustrated in FIG. 5, the heat conducting member 24 may have a shape that increases in area parallel to the main surface of the first substrate 20 as it approaches the flow path. In the case of having the shape as shown in FIG. 5, the side close to the light emitting element 12 that is a heat source is set to a size that can sufficiently transfer heat from the light emitting element 12, and the volume of the heat conducting member 24 is relatively large. The heat capacity of the heat conducting member 24 can be made relatively large while keeping it small. In addition, the area on the side from which heat is released (in the example shown in FIGS. 3 to 5, the area exposed to the cooling channel 201) can be made relatively large, and the heat radiation efficiency can be made relatively high. . In this respect, the heat conducting member 24 has a plurality of partial regions each having a different cross-sectional area parallel to the one main surface, and the partial region on the other main surface side is more than the partial region on the one main surface side. It is preferable to have a large diameter-expanded portion. The arrangement and shape of the heat conducting member 24 may be appropriately set according to required characteristics, and are not particularly limited.

  In the light irradiation head 10, as shown in FIGS. 6 and 7, a driving element 15 that supplies power to the light emitting element 12 may be disposed on the other main surface of the insulating base 11. With this configuration, the light irradiation head 10 can be configured relatively compact. Further, the light irradiation head 10 is electrically connected to the light emitting element 12 provided on one main surface via a wiring conductor 23 (not shown in FIGS. 6 and 7) in which the driving element 15 is disposed inside the first substrate 20. In this case, the light irradiation head 10 can be formed more compactly. The drive circuit 150 for causing a relatively large current to flow through the light emitting element 12 generates heat when the light emitting element 12 emits light, and the temperature is likely to rise relatively. In the embodiment shown in FIGS. 6 and 7, the drive circuit 150 can also be cooled with relatively high efficiency by the cooling medium passing through the cooling flow path 201 provided in the first substrate 20.

  Further, as shown in FIGS. 8 to 10, for example, the light irradiation head 10 is compared with the first substrate 20 in a region between the drive circuit 150 and the cooling flow path 201 inside the first substrate 20. The 2nd heat conductive member 25 with high heat conductivity may be arrange | positioned. For example, as shown in FIG. 8, the second heat conducting member 25 may be disposed only in a region sandwiched between the drive circuit 150 and the cooling channel 201. For example, as shown in FIG. The second heat conducting member 25 may be disposed in a region sandwiched between the circuit 150 and the cooling channel 201, and the heat conducting member 24 may be provided between the light emitting element 12 and the cooling channel 201. Further, the second heat conducting member 25 may be exposed on the inner surface of the cooling channel 201. The second heat conducting member 25 is exposed on the other main surface of the first substrate 20, and the drive circuit 150 is placed on the second heat conducting member 25 via an insulating film (not shown). It may be.

  3, 5, 8, and 9 illustrate an example in which one columnar heat conductive member 24 and a second heat conductive member 25 are arranged for one light emitting element 12. The shape and arrangement position of the heat conducting members 24 and 25 are not particularly limited. For example, as shown in FIG. 10, the plurality of columnar heat conducting members 24 and the second heat conducting members 24 and the second light conducting elements 12 are arranged. A heat conducting member 25 may be disposed.

  The heat conductive member 24 and the second heat conductive member 25 are, for example, metals such as tungsten (W), molybdenum (Mo), manganese (Mn), and copper (Cu), and copper (Cu) -tungsten (W). As long as it is made of a material having a relatively high thermal conductivity, such as an alloy of There are no particular limitations on the material, manufacturing method, and the like of the heat conducting member 24 and the second heat conducting member 25. For example, a metal paste containing the above-described metal, alloy, or the like is disposed in the through hole of the ceramic green sheet, and the green sheet is laminated and fired. The first substrate 20 having the second heat conductive member 25 disposed therein can be formed. Further, a well-known metallizing method, plating method, or the like may be used. Further, a block body made of copper (Cu) -tungsten (W) or the like may be disposed in a recess provided on the surface of the first substrate 20.

  In the example shown in FIGS. 1 to 10, the cooling flow path 201 is arranged so that the cooling flow path 201 overlaps with the arrangement position of the light emitting element 12 in a plan view perpendicular to the main surface of the first substrate 20. . The arrangement state of the cooling flow path 201 in the light irradiation head 10 is not particularly limited, and may be arranged so as to bypass the periphery of the light emitting element 12 as shown in FIGS. For example, in this case, the cooling medium in the cooling flow path 201 has a relatively long distance to flow around each light emitting element 12 and the time to flow around each light emitting element 12 is also relatively long. become longer. In this respect, it is preferable that the cooling flow path 201 includes at least one bent portion that bends along the outer surfaces of the heat conducting member 24 and the second heat conducting member 25. For example, you may bend so that the lower surface side of the heat conductive member 24 and the 2nd heat conductive member 25 may be bypassed (not shown), and the upper surface side of the heat conductive member 24 and the 2nd heat conductive member 25 may be It may be bypassed (not shown). The arrangement and shape of the cooling channel 201 are not particularly limited.

  In addition, since the cooling flow path 201 is not disposed directly under the light emitting element 12, a heat conducting member 24 having a relatively large volume (that is, a relatively large heat capacity) is disposed immediately under the light emitting element 12, as shown in FIG. can do. In the form shown in FIG. 12, the heat conductive member 24 is exposed on both one main surface and the other main surface of the first substrate 20, and the cooling flow path 201 is arranged so as to go around the heat conductive member 24. Has been. A driving circuit 150 is placed on the other main surface side of the first substrate 20, and the light emitting element 12 is placed on the one main surface side via a thermal connection member 26 made of, for example, a metal or an alloy to drive the first substrate 20. Heat from the circuit 150 and the light emitting element 12 is efficiently transmitted to the heat conducting member 24.

  FIG. 13 is a diagram illustrating the configuration of the light irradiation head 10 according to the embodiment illustrated in FIG. 12. The light irradiation head 10 shown in FIG. 5 is formed, for example, by laminating a plurality of green sheets in which raw material powders such as aluminum oxide and glass powder are formed in a sheet shape and firing the laminated green sheets. . FIG. 14 is a plan view showing a green sheet 21X for constituting a portion corresponding to the cooling flow path 201 in the light irradiation head 10 shown in FIGS. FIG. 15 is a plan view showing a green sheet 22X for constituting a portion corresponding to the heat conducting member 24 in the light irradiation head 10 shown in FIGS. In FIG. 15, the part corresponding to the wiring conductor 23 is not shown. Thus, the light irradiation head 10 can be formed by laminating a plurality of green sheets 21X and 22X formed in a sheet shape and firing the laminated green sheets 21X and 22X. The arrangement and shape of the heat conducting member 24 and the second heat conducting member 25 can be designed relatively freely according to the required performance.

  In the light irradiation head 10 of the embodiment shown in FIG. 12, the light emitting element 12 is mounted in a flip chip. For example, the element electrodes 123 and 124 are bonded to the terminal electrodes 131 and 132 as shown in FIG. May be electrically connected.

  17 and 18 are cross-sectional views of the light irradiation head 10 and show a range including a cooling medium inlet 201a and an outlet 201b for the cooling flow path 201. FIG. 17 and 18, both the inlet 201a and the outlet 201b of the cooling channel 201 are provided on the other main surface side which is the lower surface in the drawing. However, the positions of the inlet 201a and the outlet 201b are not particularly limited. Further, as shown in FIG. 18, the cooling flow path 201 may be configured to be branched into a plurality, and the three-dimensional arrangement form of the cooling flow path 201 is not particularly limited.

  19 to 21 are plan views of the light irradiation head 10 shown in a range including the inlet 201a and the outlet 201b of the cooling medium to the cooling channel 201. FIG. As shown in FIG. 19, a plurality of inlets 201a and outlets 201b may be provided. As shown in FIG. 20, the cooling channel 201 is divided into a plurality of branches for one inlet 201a. May be. Further, as shown in FIG. 21 (see FIG. 18 for a cross-sectional view), a plurality of branch pipe parts 201d may be branched from one large main pipe part 201c. The three-dimensional arrangement form of the cooling channel 201 is not particularly limited, and may be set as appropriate according to required performance.

  The light irradiation head 10 is not limited to the above embodiment, and the shape, material, and the like may be appropriately set according to required performance. A cooling medium flows into the light irradiation head 10 from the inlet 201a. The refrigerant supply device 10Y that causes the cooling medium to flow into the light irradiation head 10 is not particularly limited.

<Second Embodiment of Light Irradiation Head>
Hereinafter, although the light irradiation head 10 provided with the comparatively small refrigerant | coolant supply device 10Y formed using a ceramic lamination technique is demonstrated referring FIG. 22, 23, it is limited to the following embodiment about a refrigerant | coolant supply device. Not. In addition, about the material and manufacturing method of the refrigerant | coolant supply device 10Y shown below, it can use suitably also for each said embodiment and the light irradiation head 10 of other embodiment. The description of the same configuration as that of the first embodiment is omitted.

  The refrigerant supply device 10Y includes a first structure 11X and a second structure 11Y. The refrigerant supply device 10Y is configured by mechanically connecting the first structural body 11X and the second structural body 11Y.

  The first structure 11 </ b> X includes a part of the support portion 21 of the first substrate 20 and the second substrate 30. The second substrate 30 is provided with a first flow path 301, and has openings 301 a and 301 b communicating with the first flow path 301 on one main surface 30 a.

  The second structural body 11Y includes the mounting substrate 40. The mounting substrate 40 is provided with a second flow path 401, and has openings 401 a and 401 b communicating with the second flow path 401 on one main surface 40 a. The second structure 11 </ b> Y includes a storage unit 51 that stores a cooling medium, and the cooling medium supplied from the storage unit 51 is configured to flow inside the second flow path 401. The openings 301 a and 301 b of the first channel 301 are connected to the openings 401 a and 401 b of the second channel 401. The first flow path 301 and the second flow path 401 are connected to form a supply flow path inside the refrigerant supply device 10Y. Here, “main surface” means two surfaces that intersect perpendicularly in the thickness direction.

  The mounting substrate 40, the first substrate 20, and the second substrate 30 are stacked so that the second substrate 30 is sandwiched between the mounting substrate 40 and the first substrate 20. That is, the second substrate 30 is disposed such that the one main surface 40a of the mounting substrate 40 faces the one main surface 30a and the first substrate 20 faces the other main surface 40b.

  The mounting substrate 40 is a substrate serving as a base of the refrigerant supply device 10Y. As the mounting board 40, for example, a printed board called a wiring board or a board is adopted. One main surface 40a of the mounting substrate 40 corresponds to one main surface of the second component 11Y. The second flow path 401 provided in the mounting substrate 40 is provided as a flow path for the second component 11Y.

  A storage unit 51 is provided in the mounting substrate 40 of the present embodiment. The storage unit 51 may be configured by a recess or an internal space formed in the mounting substrate 40, or may be configured by a container such as a tank mounted on the mounting substrate 40. A second flow path 401 is connected to the storage section 51, and a cooling medium is supplied from the storage section 51 to the second flow path 401. An example of the mounting substrate 40 is a structure in which a wiring made of a conductive material is formed on a main body made of an insulating material such as an epoxy resin.

  The first substrate 20 and the second substrate 30 are mechanically connected to each other. Of the first substrate 20 and the second substrate 30, one main surface 30a of the second substrate 30 corresponds to one main surface of the first component 11X.

  A first flow path 301 is formed at least inside the second substrate 30 among the first substrate 20 and the second substrate 30 constituting the first structure 11X. In the present embodiment, the first flow path 301 and the cooling flow path 201 are formed both inside the second substrate 30 and inside the first substrate 20. The first flow path 301 and the cooling flow path 201 are connected to each other and function as the flow path of the first structural body 11X. Thus, the flow path of the first structural body 11X is configured by connecting the cooling flow path 201 of the first substrate 20 and the first flow path of the second substrate 30. Can be selected with a high degree of freedom.

  The second substrate 30 has openings 301a and 301b communicating with the first flow path 301 on one main surface 30a, and openings 301c and 301d communicating with the first flow path 301 on the other main surface 30b. is doing. The first substrate 20 has an inflow port 201a and an outflow port 201b as openings that communicate with the cooling channel 201 on one main surface 20a. The openings 301c and 301d in the other main surface 30b of the second substrate 30 and the openings 201a and 201b in the one main surface 20a of the first substrate 20 are connected, and the cooling channel 201 and the second substrate of the first substrate 20 are connected. A flow path of the first structural body 11X formed by connecting 30 first flow paths 301 is formed. The openings 301a and 301b on the one main surface 30a of the second substrate 30 correspond to the openings on the one main surface of the first structure 11X. These openings 301 a and 301 b are connected to the openings 401 a and 401 b in the mounting substrate 40.

  The openings 301a and 301d form a first introduction opening and a second introduction opening, and the openings 301b and 301c form a first discharge opening and a second discharge opening. Openings 201a and 201b of the cooling flow path 201 described later form a third introduction opening and a third discharge opening, and openings 401a and 401b of the second flow path 401 correspond to a fourth discharge opening and a fourth introduction. Make an opening.

  Both the first substrate 20 and the second substrate 30 may have a single layer structure, or both may have a multilayer structure, or either one may have a single layer structure and the other may have a multilayer structure. Good. The first substrate 20 and the second substrate 30 are made of an insulating material such as a ceramic material, an organic resin material, and a composite material. The first substrate 20 and the second substrate 30 may be made of the same material or different materials.

  Examples of the ceramic material include an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, a silicon nitride sintered body, and a glass ceramic sintered body. . Examples of the organic resin material include polyimide, glass epoxy resin, and phenol resin. Examples of the composite material include a material obtained by bonding inorganic powders such as ceramics and glass with an organic resin such as an epoxy resin. The first substrate 20 and the second substrate 30 may be made of a semiconductor material such as silicon or glass.

  For example, if the first substrate 20 and the second substrate 30 are made of an aluminum oxide sintered body, a plurality of green sheets in which raw powders such as aluminum oxide and glass powder are formed in a sheet shape are laminated, It is formed by firing the laminated green sheets. The first substrate 20 and the second substrate 30 are not limited to those formed of an aluminum oxide sintered body, and it is preferable to select a suitable one according to the application. The first substrate 20 also functions as a part of the light irradiation unit 10X.

  In addition, the material of the mounting substrate 40, the first substrate 20, and the second substrate 30 is a material suitable in terms of corrosion resistance or the like according to the characteristics of the cooling medium flowing through the first flow path 301 and the second flow path 401. It is preferable to select. In addition, the mounting substrate 40, the first substrate 20, and the second substrate 30 are mechanically connected to each other and are also electrically connected. The mounting substrate 40, the first substrate 20, and the second substrate 30 are reduced so that the thermal stress caused by the difference in thermal expansion coefficient between the mounting substrate 40, the first substrate 20, and the second substrate 30 is reduced. It is preferable to select materials, and it is preferable to select materials for the mounting substrate 40, the first substrate 20, and the second substrate 30 so that the difference in thermal expansion coefficient between the substrates connected to each other is reduced.

  For example, when wiring is formed on the mounting substrate 40, the first substrate 20, and the second substrate 30, polyimide, glass epoxy resin, phenol resin, or the like is used in order to prevent delay of electrical signals transmitted through the wiring. Composite materials made by bonding organic resin materials and inorganic powders such as ceramics and glass with organic resins such as epoxy resins, and sintered glass ceramics such as aluminum oxide-borosilicate glass systems and lithium oxide systems It is preferable to form with a material having a small relative dielectric constant. For example, when the mounting substrate 40, the first substrate 20, and the second substrate 30 are provided with a structure serving as a heat generation source, the heat generated by the heat generation source can be dissipated to the outside. It is preferable to form a material having a high thermal conductivity such as a sintered body of aluminum nitride and a resin material containing a large amount of filler.

  The mounting substrate 40 includes, as openings 401a and 401b on one main surface 40a as one main surface of the second structure 11Y, a fourth discharge opening 401a that discharges the cooling medium from the second flow path 401, and a second flow. The passage 401 has a fourth introduction opening 401b for introducing the cooling medium. The second flow path 401 has a supply flow path portion 401x and a recovery flow path portion 401y. One end of the supply flow path portion 401 x is connected to the storage unit 51. The mounting substrate 40 has an opening 401a communicating with the supply flow path portion 401x on the one main surface 40a, and this opening is a fourth discharge opening. One end portion of the recovery flow path portion 401y is connected to the recovery portion 52. The mounting substrate 40 has an opening 401b communicating with the recovery flow path portion 401y on the one main surface 40a, and this opening is a fourth introduction opening.

  The collection unit 52 is configured to collect the cooling medium discharged from the first flow path 301. The storage unit 51 also serves as the recovery unit 52, and the cooling medium supplied from the storage unit 51 is circulated through the refrigerant supply device 10 </ b> Y by the first flow path 301 and the second flow path 401, and is stored again. The recovery unit 52 may be configured to be different from the storage unit 51.

  The second substrate 30 includes, as openings 301a and 301b on one main surface 30a as one main surface of the first structure 11X, a third introduction opening 301a that introduces a cooling medium into the first flow path 301, and a first A third discharge opening 301b for discharging the cooling medium from the flow path 301; Two first flow paths 301 x and 301 y are formed in the second substrate 30. The first flow paths 301x and 301y are formed through the second substrate 30 in the thickness direction.

  The opening 301 a in the one main surface 30 a of the second substrate 30 becomes a first introduction opening for introducing the cooling medium into the one 301 x of the first flow path 301. The opening 301c in the other main surface 30b of the second substrate 30 serves as a first discharge opening for discharging the cooling medium from the one 301x of the first flow path 301. The opening 301b in the one main surface 30a of the second substrate 30 serves as a second discharge opening for discharging the cooling medium from the other 301y of the first flow path 301. The opening 301 d in the other main surface 30 b of the second substrate 30 serves as a second introduction opening for introducing the cooling medium into the other 301 y of the first flow path 301.

  The first substrate 20 has two openings 201a and 201b on one main surface 20a. Of the two openings 201a and 201b communicating with the cooling flow path 201, the opening 201a on one side serves as a third introduction opening for introducing the cooling medium into the cooling flow path 201, and the opening 201b on the other side serves as a cooling flow. It becomes a third discharge opening for discharging the cooling medium from the path 201.

  The opening 401a as the fourth discharge opening and the opening 301a as the first introduction opening are connected, and the opening 301b as the second discharge opening and the opening 401b as the fourth introduction opening are connected. The opening 301c as the first discharge opening and the opening 201a as the third introduction opening are connected, and the opening 201b as the third discharge opening and the opening 301d as the second introduction opening Is connected. In this way, the supply flow path portion 401x, the recovery flow path portion 401y, the two first flow paths 301x and 301y, and the cooling flow path 201 are connected to form the flow path of the refrigerant supply device 10Y.

  The coolant supply device 10Y includes the mounting substrate 40, the first substrate 20, and the second substrate 30 in which the cooling channel 201, the first channel 301, and the second channel 401 are formed as described above. Is configured to include a composite substrate configured by bonding, a storage unit 51, and a recovery unit 52.

  The mounting substrate 40 that forms the second structure 11Y of the refrigerant supply device 10Y having this configuration is provided with a storage unit 51 and a recovery unit 52, and the entire system through which fluid flows is provided. Therefore, it is not necessary to provide a configuration for supplying the cooling medium outside the refrigerant supply device 10Y, and downsizing can be realized. Further, the exposure of the cooling medium to the outside air is reduced between the storage unit 51 and the recovery unit 52 and the first flow path 301 and the second flow path 401, and the foreign matter is mixed into the cooling medium. It is possible to reduce the contamination of the cooling medium. Here, the “system in which the fluid flows” is a system including the storage unit 51, the recovery unit 52, the first flow path 301, and the second flow path 401.

  Further, in the refrigerant supply device 10Y of this configuration, by reducing the system through which the fluid flows, the volume of the necessary cooling medium can be reduced and the amount of the cooling medium to be handled can be reduced. Therefore, in the refrigerant supply device 10Y of this configuration, the power for flowing the cooling medium can be small, and a small amount of the cooling medium can be flowed at a small flow rate, thereby realizing the highly efficient refrigerant supply device 10Y. it can. Furthermore, since the flow path of the first structure 11X is constituted by the cooling flow path 201 and the first flow path 301 formed inside each of the first substrate 20 and the second substrate 30, the first structure The volume of the cooling medium can be further reduced by reducing the volume of the entire flow path of the body 11X.

  Further, the first flow path 301 and the second flow path 401 allow the cooling medium supplied from the storage unit 51 to be supplied from the supply flow path portion 401 x of the second flow path 401 to the first flow path 301 inside the second substrate 30. One of the first substrate 20 passes through the cooling passage 201 inside the first substrate 20, and passes from the cooling passage 201 inside the first substrate 20 to the other passage 301 y of the first passage 301 inside the second substrate 30. A flow path that returns to the recovery flow path portion 401 y of the second flow path 401 and is recovered by the recovery unit 52 is configured. After being supplied from the storage unit 51 to the second flow path 401 and flowing through the cooling flow path 201, the first flow path 301, and the second flow path 401, the mounting substrate 40 returns to the recovery unit 52. The cooling medium can be flowed so as to be sent to the first substrate 20 via the second substrate 30 and to return to the mounting substrate 40 again from the first substrate 20 via the second substrate 30. In the refrigerant supply device 10Y of the present configuration, the cooling medium can flow in one direction as described above, and the cooling medium smoothly flows inside the first substrate 20, the second substrate 30, and the mounting substrate 40. Can be high.

  The coolant supply device 10 </ b> Y includes a first bonding member 61 and a second bonding member 62 as the first inter-substrate bonding portion 60 that bonds the mounting substrate 40 and the second substrate 30. The first bonding member 61 and the second bonding member 62 are bonding members that bond the first structural body 11X and the second structural body 11Y. The first main surface 40a of the mounting substrate 40 and the one main surface of the second substrate 30. The surface 30a is joined.

  The first joining member 61 and the second joining member 62 have a cylindrical shape, and a first connection channel 611 and a second connection channel 621 that connect the first channel 301 and the second channel 401. Respectively. The first joining member 61 connects the fourth discharge opening 401a and the third introduction opening 301a by the first connection channel 611. The second joining member 62 connects the fourth introduction opening 401b and the third discharge opening 301b by the second connection channel 621.

  The refrigerant supply device 10 </ b> Y includes a third bonding member 71 and a fourth bonding member 74 as the second inter-substrate bonding portion 70 that bonds the first substrate 20 and the second substrate 30. The third bonding member 71 and the fourth bonding member 72 are bonding members that bond the one main surface 20 a of the first substrate 20 and the other main surface 30 b of the second substrate 30.

  The third joint member 71 and the fourth joint member 72 have a cylindrical shape, and a third connection that connects one of the first flow paths 301x and the other 301y of the second substrate to the cooling flow path 201. Each has a flow path 711 and a fourth connection flow path 721. The 3rd junction member 71 connects the 2nd discharge opening 301c and inflow mouth 201a by the 3rd connection channel 711. The fourth joining member 72 connects the second introduction opening 301d and the outlet 201b through the fourth connection flow path 721.

  In this way, the first connection channel 611 and the second connection channel 621 are formed in the first bonding member 61 and the second bonding member 62 that mechanically connect the mounting substrate 40 and the second substrate 30, respectively. Thereby, the mechanical connection of the mounting substrate 40 and the second substrate 30 and the connection of the first flow path 301 to the second flow path 401 are achieved by the same member. Further, a third connection channel 711 and a fourth connection channel 721 are respectively formed in the third bonding member 71 and the fourth bonding member 72 that mechanically connect the first substrate 20 and the second substrate 30. As a result, the mechanical connection between the first substrate 20 and the second substrate 30 and the connection of the cooling channel 201 to the first channel 301 are achieved by the same member. In this way, the number of parts can be reduced, the configuration of the refrigerant supply device 10Y can be simplified, and the number of connection work steps can be reduced to easily manufacture the refrigerant supply device 10Y. In addition, since the first flow path 301 and the cooling flow path 201 are connected by the third connection flow path 711 and the fourth connection flow path 721 of the third bonding member 71 and the fourth bonding member 72, the first substrate 20. It is possible to prevent the cooling medium from being exposed to the outside air between the second substrate 30 and the second substrate 30, and to prevent the cooling medium from being contaminated by foreign matters mixed into the cooling medium.

  A wiring conductor (not shown) is formed on one main surface 40a of the mounting substrate 40, one main surface 30a and the other main surface 30b of the second substrate 30, and one main surface 20a of the first substrate 20. . The wiring conductors on the one main surface 30a and the other main surface 30b of the second substrate 30 are electrically connected to each other by through wirings 31 that penetrate the second substrate 30 in the thickness direction. The wiring conductor on the one main surface 20a of the first substrate 20 is electrically connected to an input terminal provided outside the first substrate 20 by a wiring conductor 23 formed inside the first substrate 20. .

  In this way, wiring conductors are provided on the mounting substrate 40, the first substrate 20, and the second substrate 30, and a first electrical connection portion 63 and a second electrical connection portion 73 that electrically connect these wiring conductors are provided. The mounting substrate 40, the first substrate 20, and the second substrate 30 are electrically connected. Thus, the mounting substrate 40, the first substrate 20, and the second substrate 30 can be electrically connected to an external circuit provided outside the refrigerant supply device 10Y. An external circuit is good also as a structure mounted in the one main surface 40a of the mounting board | substrate 40, for example.

  The wiring conductor of the mounting substrate 40 connected by the first electrical connection portion 63 is formed on one main surface 40a provided with the openings 40a and 40b of the supply flow path portion 401x and the recovery flow path portion 401y of the mounting substrate 40. Yes. The wiring conductor of the second substrate 30 connected by each first electrical connection portion 63 is formed on the one main surface 30a where the openings 301a and 301b are provided.

  Therefore, the mechanical connection of the mounting substrate 40 and the second substrate 30 by the first bonding member 61 and the second bonding member 62, and the supply flow path portion 401 x and the recovery flow path portion 401 y of the second flow path 401 of the mounting substrate 40. The mounting substrate 40 and the second substrate 30 can be electrically connected simultaneously with the connection of the one 301x and the other 301y of the first flow path 301 of the second substrate 30. In addition, it is possible to connect by a so-called surface mounting method or the like, the connection of the second flow path 401 of the mounting substrate 40 and the first flow path 301 of the second substrate 30, and the mounting substrate 40 and the second substrate. Thirty mechanical and electrical connections can be easily performed.

  The wiring conductor of the second substrate 30 connected by the second electrical connection portion 73 is formed on the other main surface 30b where the openings 301c and 301d of the second substrate 30 are provided. The wiring conductor of the first substrate 20 connected by the second electrical connection portion 73 is formed on the one main surface 20 a of the first substrate 20.

  Therefore, the mechanical connection of the first substrate 20 and the second substrate 30 by the third bonding member 71 and the fourth bonding member 72, the one 301x and the other 301y of the first flow path 301 of the second substrate 30, and the first The first substrate 20 and the second substrate 30 can be electrically connected simultaneously with the connection of the substrate 20 to the cooling channel 201. In addition, it is possible to connect by a so-called surface mounting or the like, the connection of the cooling flow path 201 of the first substrate 20 and the first flow path 301 of the second substrate 30, and the first substrate 20 and the second substrate 20. The mechanical and electrical connection of the substrate 30 can be easily performed.

  Each wiring conductor, the through wiring 31, and the wiring conductor are formed of a conductive material, for example, a metal material such as copper, silver, gold, palladium, tungsten, molybdenum, manganese, or nickel. In addition, the conductive material may be a material containing one or more of those metal materials. Each wiring conductor, the through wiring 31, and the wiring conductor 23 are realized by a metal thin film. For example, the metal thin film is coated by a metallization method including a thin film method such as plating or vapor deposition, a thick film method, and a simultaneous firing method. It can be formed by wearing. For example, when a tungsten thin film is used as a wiring conductor and is formed by a metallization method, a tungsten paste is printed on a green sheet to be the first substrate 20, the second substrate 30, and the mounting substrate 40. It is formed by baking together.

  The first electrical connection portion 63 and the second electrical connection portion 73 are formed of a conductive material. As this conductive material, for example, solder such as tin-silver and tin-silver-copper, tin-antimony, low-melting solder such as gold-tin solder, high-melting solder such as silver-germanium, Examples thereof include conductive organic resins and metal materials that can be joined by welding methods such as seam welding and electron beam welding.

  The cooling flow path 201, the first flow path 301, and the second flow path 401 may have a circular cross-sectional shape perpendicular to the direction in which the cooling medium flows, or may be rectangular. It is not limited. Further, the cooling channel 201, the first channel 301, and the second channel 401 may be configured to meander in plan view. In particular, a configuration in which the contact area between the cooling medium and the first substrate 20 is increased by adopting a configuration in which the cooling flow path 201 meanders.

  The 1st joining member 61, the 2nd joining member 62, the 3rd joining member 71, and the 4th joining member 72 may consist of either an electroconductive material and an insulating material. The first joining member 61, the second joining member 62, the third joining member 71, and the fourth joining member 72 are made of, for example, a metal material, a non-metallic inorganic material, a resin material, or the like. The first joining member 61 and the second joining member 62 and the third joining member 71 and the fourth joining member 72 may be made of the same material or different materials. Moreover, the 1st joining member 61 and the 2nd joining member 62 may consist of the mutually same material, and may consist of a different material. The third joining member 71 and the fourth joining member 72 may be made of the same material or different materials.

  Examples of the metal material include iron-nickel alloys such as iron-nickel-cobalt alloy and iron-nickel alloy, oxygen-free copper, aluminum, stainless steel, copper-tungsten alloy, and copper-molybdenum alloy. The metal material is a conductive material.

  Examples of the non-metallic inorganic material include an aluminum oxide sintered body and a glass ceramic sintered body. Examples of the resin material include organic resin materials such as polytetrafluoroethylene (PTFE) and glass epoxy resin, and other resins. The resin material may be, for example, benzocyclobutene and a liquid crystal polymer. The non-metallic inorganic material and resin-based material here are also insulating materials having electrical insulating properties.

  In addition, as a method of bonding the first bonding member 61, the second bonding member 62, the third bonding member 71, and the fourth bonding member 72 to the mounting substrate 40, the first substrate 20, and the second substrate 30, tin is used. -Solder such as silver solder, low melting point solder such as gold-tin solder, high melting point solder such as silver-germanium, joining method such as conductive organic resin, seam welding, electron beam A welding method such as welding can be used.

  When the first joining member 61, the second joining member 62, the third joining member 71, and the fourth joining member 72 are made of a metal material, the first joining member 61, the second joining member 62, the third joining member 71, and The bonding strength by the fourth bonding member 72 can be increased. Further, the internal first connection flow path 611, second connection flow path 621, third connection flow path 711, and fourth connection flow path 721 are well sealed, and the cooling flow path 201 and the first flow path 301 are sealed. , And the second flow path 401 can be connected. Further, it is possible to perform joining by a simple and low temperature processing operation. Moreover, it can join continuously by a reflow process etc. In addition, the mounting substrate 40, the first substrate 20, and the second substrate 30 can be electrically connected by the first bonding member 61, the second bonding member 62, the third bonding member 71, and the fourth bonding member 72. is there.

  Moreover, when the 1st joining member 61, the 2nd joining member 62, the 3rd joining member 71, and the 4th joining member 72 consist of insulating materials, the 1st joining member 61, the 2nd joining member 62, the 3rd joining member 71 And the heat resistance and chemical resistance of the fourth joining member 72 can be increased. In particular, by using a fluororesin such as polytetrafluoroethylene (PTFE), which is a resin material, as the insulating material, high heat resistance and high chemical resistance can be obtained simultaneously. In addition, acrylic resin, epoxy resin, polyimide, and the like can simultaneously obtain high heat resistance and high chemical resistance. When the first joining member 61, the second joining member 62, the third joining member 71, and the fourth joining member 72 are made of high-purity glass such as quartz glass, high silica glass, crystalline glass, etc., high chemical resistance Sex is obtained.

  Furthermore, when the 1st joining member 61, the 2nd joining member 62, the 3rd joining member 71, and the 4th joining member 72 consist of insulating materials, it is good also as a structure which has internal wiring. By having the internal wiring in this way, the first bonding member 61, the second bonding member 62, the third bonding member 71, and the fourth bonding member 72 are made to have high heat resistance and chemical resistance, and then the first bonding member Electrical connection by the member 61, the second joining member 62, the third joining member 71, and the fourth joining member 72 can also be made possible.

  The internal wiring provided in the first joining member 61 and the second joining member 62 functions as the first electrical connection portion 63, and the internal wiring provided in the third joining member 71 and the fourth joining member 72 is the second electrical connection. It functions as a part. When providing internal wiring in the first joining member 61, the second joining member 62, the third joining member 71, and the fourth joining member 72, it is provided in addition to the first electrical connection portion 63 and the second electrical connection portion 73 described above. The structure provided may be sufficient instead of the above-mentioned 1st electrical connection part 63 and the 2nd electrical connection part 73 mentioned above.

  Further, the first joining member 61 and the second joining member 62 and the third joining member 71 and the fourth joining member 72 may be made of different materials, one of which is made of a metal material and the other is made of an insulating material. It may consist of. Thus, when the 1st board | substrate junction part 60 and the 2nd board | substrate junction part 70 are formed with a different material, in the 1st board | substrate junction part 60 and the 2nd board | substrate junction part 70, the process at the time of joining The temperature can be varied. For example, the bonding processing temperature by the second inter-substrate bonding unit 70 is set to be higher than the bonding processing temperature by the first inter-substrate bonding unit 60, and the first substrate 20 and the second substrate 30 are bonded. After forming the first structural body 11X having the internal flow path, the mounting substrate 40 and the second substrate 30 can be joined, and the first structural body 11X and the second structural body 11Y can be joined.

  Thus, in order to make the processing temperature of the bonding by the second inter-substrate bonding unit 70 higher than the processing temperature of the bonding by the first inter-substrate bonding unit 60, for example, the first bonding member 61 and the second bonding member The joining member 62 may be made of tin-lead solder, and the third joining member 71 and the fourth joining member 72 may be made of frit glass having a joining temperature higher than that of the tin-lead solder, or the first joining member. 61 and the second joining member 62 may be made of an epoxy resin, and the third joining member 71 and the fourth joining member 72 may be made of a tin-silver-copper solder having a melting point higher than that of the epoxy resin.

  Moreover, the structure which the inner peripheral part used as the surface part which contacts the cooling medium of the 1st joining member 61 and the 2nd joining member 62 consists of the cylindrical 1st corrosion-resistant member 64 which has corrosion resistance may be sufficient. Furthermore, the inner peripheral part which becomes the surface part which contacts the cooling medium of the 3rd joining member 71 and the 4th joining member 72 is the structure which consists of the cylindrical 1st corrosion-resistant member 64 and the 2nd corrosion-resistant member 74 which have corrosion resistance. Also good. The first corrosion-resistant member 64 and the second corrosion-resistant member 74 are members that have acid resistance and chemical resistance, have resistance to a cooling medium, and are not eroded by the cooling medium. The first corrosion resistant member 64 and the second corrosion resistant member 74 are made of, for example, polytetrafluoroethylene (PTFE). Thus, when a corrosion-resistant member consists of resin, a corrosion-resistant member can be formed simply. By using the first corrosion-resistant member 64 and the second corrosion-resistant member 74 in this way, the acid resistance against the cooling medium of the first joining member 61, the second joining member 62, the third joining member 71, and the fourth joining member 72 and Chemical resistance can be increased and corrosion resistance can be increased.

  FIG. 23 is an enlarged cross-sectional view of the first joining member 61. Drive that causes the cooling medium of the connection flow path in the joining member to migrate and flow through at least one of the first joining member 61, the second joining member 62, the third joining member 71, and the fourth joining member 72 A part 530 may be provided. The drive unit 530 may be provided in only one of the first joining member 61, the second joining member 62, the third joining member 71, and the fourth joining member 72, or may be provided in two. It may be provided in three, or may be provided in all four. The joining member provided with the drive unit 530 can be appropriately selected.

  The drive unit 530 is realized by an electroosmotic flow type pump. The electroosmotic pump has a pair of electrodes 531 and 532 that are exposed to the first connection channel 611 and provided on the inner wall surface, and the electrodes 531 and 532 are spaced apart from each other by the first connection channel 611. Are arranged. The electrodes 531 and 532 are electrically connected to one of the wiring conductors of the mounting substrate 40 and the second substrate 30 by internal wirings 533 and 534.

  When a driving voltage is applied between the electrodes 531 and 532, the electroosmotic pump pumps the liquid in the first connection channel 611 by the surface potential of the inner wall surface of the first bonding member 61. Thus, the liquid can be electrophoresed by applying the electric field to the liquid. When such an electroosmotic pump is provided as the drive unit 530, the inner wall surface of the first joining member 61 is formed of a material having a large surface area, for example, a porous material (porous member), so that a cooling medium can be efficiently provided. Electrophoresis can be performed.

  By providing the driving unit 530 in the first joining member 61 and the second joining member 62, it is possible to supply power to the cooling medium at a position close to the first flow path 301 to flow. In addition, by providing the third joining member 71 and the fourth joining member 72 with the drive unit 530, power can be supplied to the cooling medium in the first flow path 301 to flow. When the drive unit 530 is provided in the first joining member 61, the second joining member 62, the third joining member 71, and the fourth joining member 72, it is not always necessary to provide a fluid supply means for supplying a cooling medium separately.

  Further, by using an electroosmotic flow type pump as the drive unit 530, a means for flowing a cooling medium can be incorporated without increasing the size of the refrigerant supply device 10Y, which can contribute to downsizing.

  In the above description, the mounting substrate 40 and the second substrate 30 are joined by the first joining member 61 and the second joining member 62, and the first substrate 20 and the second substrate 30 are joined by the third joining member 71 and the fourth joining member. The bonding member 72 is used for bonding, but when there is no difference in the thermal expansion coefficient between the mounting substrate 40 and the second substrate 30, the first flow without using the first bonding member 61 and the second bonding member 62 is used. The mounting substrate 40 and the second substrate 30 are disposed such that the opening 301a of the path 301 and the opening 401a of the second flow path 401 are opposed to each other, and the opening 301b and the opening 401b of the second flow path 401 are opposed to each other. You may join directly. Similarly, when there is no difference in thermal expansion coefficient between the first substrate 20 and the second substrate 30, the opening of the first flow path 301 is used without using the third bonding member 71 and the fourth bonding member 72. 301c and the opening part 201a of the cooling flow path 201 are made to oppose, the opening part 301d of the 1st flow path 301 and the opening part 201b of the cooling flow path 201 are made to oppose, and the 1st board | substrate 20 and the 2nd board | substrate 30 are made. You may join directly.

  FIG. 24 is a block diagram schematically illustrating a refrigerant supply device 10Y according to another embodiment of the present invention. In FIG. 24, the refrigerant supply device 10 </ b> Y is viewed in plan, and each component is shown as a block.

  The refrigerant supply device 10Y includes a pump 53 as fluid supply means for supplying a cooling medium to the first flow path 301. The pump 53 is mounted on the mounting substrate 40 so as to be interposed in the second flow path 401, for example, in the supply flow path portion 401x. The pump 53 is used when feeding a cooling medium. In particular, when a small pump 53 is required, for example, the electrophoresis type pump described with reference to FIG. 23 is desired. Further, when a high flow rate is desired, for example, a piezoelectric drive type pump is desired. In the case of an electrophoretic pump, an electrode is formed in the pump, and the material of the electrode surface is desirably a material such as gold or platinum from the viewpoint of corrosion resistance. Moreover, it is preferable that the site | part in which an electrode is formed consists of resin materials, such as a glass epoxy-type material which can form an electrode with a metallizing method, various glass, or a laminated ceramic material. Through such a pump 53, the liquid in the storage part 51 can be flowed into the 1st structure 11X. The cooling medium plays a desired role in the first structure 11 </ b> X, and is then recovered by the recovery unit 52. As shown in FIG. 23, when the drive unit 530 is incorporated in at least one of the first inter-substrate junction 60 and the second inter-substrate junction 70 as shown in FIG. be able to. In addition, when a relatively large flow rate is required, for example, a known bellows pump or the like may be used, and the type of pump is not particularly limited.

  Further, the refrigerant supply device 10Y includes a sensor 54 as detection means for detecting a state quantity related to the cooling medium in the first flow path 301 in the refrigerant supply device 10Y. The sensor 54 is provided on the mounting board 40. The sensor 54 detects a state quantity representing at least one of a physical state and a chemical state of the cooling medium, such as pH (pH), temperature, component, and pressure. The sensor 54 may detect temperature, humidity, and the like, and may quantitatively output environmental changes such as outside air temperature outside the system. The change in the environment is fed back to the electrical operation of the first structure 11X or the operation of the cooling medium inside the first structure 11X.

  Furthermore, the refrigerant supply device 10Y includes a control IC 55 as control means for controlling the pump based on the state quantity detected by the sensor 54. The control IC 55 is provided on the mounting board 40. The pump 53, the sensor 54, and the control IC 55 are electrically connected to each other by connection wirings 56, 57, and 58 that are part of a wiring conductor formed on the one main surface 40 a of the mounting substrate 40.

  The control IC 55 calculates the flow rate of the cooling medium that should flow through the first flow path 301 based on the state quantity detected by the sensor 54, for example, and controls the pump 53 so that the cooling medium flows at that flow rate. Thus, the control IC 55 controls the flow rate of the cooling medium flowing through the first flow path 301, for example. The control IC 55 is not limited to the configuration for controlling the flow rate, and controls the pump 53 in response to the detection result of the sensor 54 to control the state quantity of the cooling medium flowing through the first flow path 301. For example, the configuration may be such that the pressure of the cooling medium flowing through the first flow path 301 is controlled. In this way, a suitable refrigerant supply device 10Y that is small and has a relatively high cooling efficiency can be realized.

  The light irradiation head and the refrigerant supply device described above can be used for various applications such as general illumination and an image display device. For example, you may use as a light emission source of the exposure device which comprises the light source of the exposure apparatus in a semiconductor manufacturing apparatus. For example, compared to a conventional lamp such as a mercury lamp, when an LED or the like is used as an exposure light source, the rise time and fall time are relatively short, and the stability of the emission intensity is relatively high. Also, in the exposure device, an optical system consisting of a lens, a reflecting mirror, and the like that guides toward the surface of a photosensitive material (for example, a photoresist material) that is modified by receiving light emitted from the light emitting element, and depending on input image data And a control unit that controls the light emission of the light emitting element disposed in the light irradiation head and forms an image pattern corresponding to the image data on the photosensitive material, and forms the image pattern on the photosensitive material of the photoresist material. An image forming apparatus can also be configured. In this case, a known computer equipped with data input / output means may be used as the control unit. The optical system may be a reduction optical system or an optical system for projecting this magnification image. According to this configuration, an image pattern can be formed on a photosensitive material such as a photoresist without using an expensive photomask or the like. The present invention also provides such an exposure device and an image forming apparatus.

  The light irradiation head 10 of the present invention has a relatively high heat dissipation efficiency and a relatively small temperature rise during light emission. The light irradiation head 10 of the present invention can stably irradiate light having relatively high intensity and relatively small intensity distribution unevenness over a long period of time.

  Hereinafter, an embodiment of a droplet curing apparatus, which is an example of an apparatus using a light irradiation head, will be described with reference to the drawings.

  FIGS. 25 and 26 are diagrams for explaining an ink jet printer 90 that is an example of the droplet curing apparatus of the present invention that includes the light irradiation head 10, and FIG. 25 is a schematic top view of the ink jet printer 90. It is. FIG. 26 is a schematic cross-sectional view of the ink jet printer 90.

  The ink jet printer 90 ejects ink droplets from the ink jet head 91 onto the surface of the recording medium 99 such as paper, which is transported in one direction (X direction in the figure), and is attached to the surface of the recording medium 99. The ink droplets attached to the recording medium 99 are cured by irradiating the droplets with light having a predetermined wavelength distribution. The ink jet printer 90 includes a platen 92 on which the recording medium 99 is placed, a transport unit 93 having a feed roller 931 and a pressing roller 932, and a movement for moving the ink jet head 91 relative to the platen 92. It has a mechanism 94 and a light irradiation head 10.

  The ink jet head 91 ejects photocurable ink droplets onto the surface of the recording medium 99 that is mounted on the platen 92 and conveyed in accordance with an image signal input from the outside. The inkjet head 91 is a known inkjet head such as a so-called thermal type or bubble type. The inkjet head 91 is reciprocated along the Y direction in the drawing along a guide rail 941 provided in the moving mechanism 94.

  The recording medium 99 is conveyed by the conveying means 93, for example, along the X direction in the figure. As the recording medium 99 moves, the inkjet head 91 is also moved along the Y direction in the drawing. An image signal is sent to the inkjet head 91 from a control unit (not shown) as the recording medium 99 and the inkjet head 91 move. In the ink jet head 91, in response to the image signal, photocurable ink droplets are ejected toward the recording medium, and an image pattern (ink droplet pattern) corresponding to the image signal is formed on the surface of the recording medium 99.

  The light irradiation head 10 is disposed on the downstream side of the recording medium 99 with respect to the inkjet head 91. That is, the ink jet printer 90 is configured to irradiate light from the light irradiation head 10 to ink droplets ejected from the ink jet head 91 and attached to the surface of the recording medium 99. As described above, according to the light irradiation head 10, it is possible to irradiate light having a relatively high light amount with relatively small variations in the light amount distribution of light. That is, it is possible to irradiate the surface of the recording medium 99 ejected from the inkjet head 91 with a relatively high amount of light relatively uniformly. According to the ink jet printer 90 of the present embodiment, ink droplets attached to the surface of the recording medium 99 can be cured in a relatively short time, and ink curing unevenness on the surface of the recording medium 99 is also relatively small. For example, in a specific location along the Y direction in the figure, ink spreading or spreading is greater than the surroundings at this specific location, such as when the ink is locally hardened. In this case, in the image recorded on the recording medium, linear image unevenness along the recording medium conveyance direction (X direction) appearing at a position corresponding to the specific portion may be visually recognized. In the ink jet printer 90 of this embodiment, the occurrence of such image unevenness is also suppressed.

  In addition, the light irradiation head 10 has a relatively high heat dissipation property, so that deterioration of elements due to heat, damage to the structure, and the like are suppressed. The ink jet printer 90 can stably emit a relatively high amount of light over a long period of time.

  In the inkjet printer 90 of the present embodiment, the memory (not shown) of the control unit 95 of the light irradiation head 10 stores data indicating light characteristics that are relatively good for curing the ink droplets ejected from the inkjet head 91. Specifically, data representing wavelength distribution characteristics and emission intensity (emission intensity in each wavelength region) suitable for curing the ejected ink droplet is input. In the light irradiation head 10, the control unit 95 can also adjust the magnitude of the drive current input to the plurality of light emitting layers 122 based on the input data input in advance. According to the inkjet head 91, light can be irradiated with an appropriate amount of light according to the characteristics of the ink used, and ink droplets can be cured with relatively low energy light.

  The form of the ink jet printer is not limited to the above embodiment. For example, a so-called offset printing type printer that rotates a shaft-supported roller and conveys a recording medium along the roller surface may exhibit the same effect.

  In the present embodiment, an example in which an irradiation head is applied to an ink jet printer using an ink jet head is shown. The irradiation head of the present invention can be applied to the curing of various types of photo-curing resins such as a dedicated device for curing a photo-curing resin spin-coated on the surface of an object. Further, for example, it may be used as an irradiation light source in an exposure apparatus. This case is also preferable in that a relatively high light amount can be irradiated with a relatively small light amount distribution. Further, the light emission from a plurality of light emitting elements can be controlled independently, and for example, it can also be used for an image forming apparatus that selectively irradiates light on the surface of a photosensitive material and forms an image corresponding to the irradiated light. it can.

  The irradiation head, the droplet curing device, and the droplet effect method of the present invention have been described above. However, the present invention is not limited to the above-described embodiment, and various improvements can be made without departing from the gist of the present invention. Of course, changes may be made.

DESCRIPTION OF SYMBOLS 10 ... Light irradiation head 10X ... Light irradiation part 10Y ... Refrigerant supply device 11 ... Insulation base | substrate 11X ... 1st structure 11Y ... 2nd structure 12 ... Light emitting element 121 ... Element substrate 122 ... Light emitting layer (light emitter)
123, 124 ... Device electrodes 131, 132 ... Terminal electrodes 14 ... Sealing material 15 ... Drive device 20 ... First substrate (insulating substrate)
201 ... Cooling channel 201a ... Inlet (opening)
201b ... Outlet (opening)
201c ... Main piping part 201d ... Tributary piping part 21 ... Supporting part 21a ... Surface 21b ... Region 22 surrounded by reflecting part ... Reflecting part 22a ... Through hole 23 ..Wiring conductor 24... Thermal conduction member 25... Second thermal conduction member 26... Thermal connection member 30 .. second substrate 30 a. ... first flow path 301x ... one first flow path 301y ... the other first flow path 301a (third introduction) opening 301b (third discharge) opening 301c ... (second discharge) opening 301d ... (second introduction) opening 31 ... penetrating wiring 40 ... mounting substrate 401 ... second flow path 401a ... (fourth discharge) Opening 401b (fourth introduction) opening 401x ... supply flow path portion 401y ... recovery flow path portion 51 · Reservoir 52 ... recovery unit 53 ... pump 530 ... driving unit 531, 532 ... electrode 533 ... internal wiring 54 ... sensor 55 ... control IC
56, 57, 58... Connection wiring 60... First inter-substrate joint 61... First joint member 611... First connection flow path 62. 2 connection flow path 63 ... 1st electrical connection part 64 ... 1st corrosion-resistant member 70 ... 2nd board | substrate joining part 71 ... 3rd joining member 711 ... 3rd connection flow path 72- ··· Fourth joining member 721 ··· Fourth connection flow path 73 ··· Second electrical connection portion 74 ··· Second corrosion resistant member 90 · · · Inkjet printer 91 · · · Inkjet head 92 · · · Platen 93 ... Conveying means 931 ... Feeding roller 932 ... Pressing roller 94 ... Moving mechanism 941 ... Guide rail 95 ... Control unit 99 ... Recording medium

Claims (15)

A substrate and a light emitting element disposed on the first main surface of the substrate;
The said base | substrate is a light irradiation head by which the flow path through which a cooling medium passes is provided in the inside.   The light irradiation head according to claim 1, wherein the base is provided with a heat conductive member having a higher thermal conductivity than the base between the light emitting element and the flow path.   The light irradiation head according to claim 2, wherein the flow path includes at least one bent portion that bends along the outer surface of the heat conducting member.   The light irradiation head according to claim 2, wherein at least a part of the heat conducting member is exposed to the flow path.   The light irradiation head according to claim 4, wherein the heat conducting member passes through the flow path.   The light irradiation head according to claim 4, wherein the flow path penetrates the heat conducting member. The heat conducting member has a plurality of partial regions each having a different cross-sectional area parallel to the first main surface,
The plurality of partial regions include an enlarged-diameter portion having a larger cross-sectional area on the second main surface side that is paired with the first main surface than the cross-sectional area on the first main surface side. The light irradiation head according to any one of claims 2 to 6. The heat conducting member has an exposed surface exposed from the first main surface of the base;
The light emitting head according to claim 2, wherein the light emitting element is placed on the exposed surface of the heat conducting member.   9. The device according to claim 1, further comprising a drive element that is disposed on a side of the second main surface that is paired with the first main surface of the base body and that supplies power to the light emitting element. The light irradiation head of description.   The light irradiation head according to claim 9, wherein the base is provided with a second heat conductive member having a higher thermal conductivity than the base between the drive element and the flow path. The second heat conducting member has a second exposed surface exposed from the second main surface of the base;
11. The light irradiation head according to claim 8, wherein the driving element is placed on the second exposed surface of the heat conducting member.   An exposure device comprising the light irradiation head according to any one of claims 1 to 11. The light irradiation head according to any one of claims 1 to 11,
An optical system that guides light emitted from the light irradiation head toward the surface of the photosensitive material that is modified by receiving light emitted from the light emitting element;
A controller that controls light emission of the light emitting element disposed in the light irradiation head according to input image data, and forms an image pattern according to the image data on the photosensitive material;
An image forming apparatus comprising: The light irradiation head according to any one of claims 1 to 11,
Discharging means for discharging a droplet of a photocurable material that is cured by receiving light emitted from the light irradiation head to a recording medium, and attaching the droplet to the surface of the recording medium;
A droplet curing apparatus comprising: A photocurable material that is cured by receiving light emitted from the light irradiation head according to any one of claims 1 to 11 is attached to the surface of the recording medium,
A droplet curing method in which the photocurable material attached to the surface of the recording medium is irradiated with light emitted from the light irradiation head to cure the curable material.

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