JP2013115377A - Light radiation device, light radiation module, and printer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light radiation device which effectively extracts light emitted from an ultraviolet light emitting element and realizes high ultraviolet radiation energy.SOLUTION: A light radiation device includes a light emitting element 20 housed in a through hole 12 of a substrate 10. The substrate 10 has: a first substrate 10a having first through holes 12a; a pair of second substrates 10b disposed on both surfaces of the first substrate 10a and each having a second through hole 12b, which is wider than the corresponding first through hole 12a; and a first power supply circuit 40a and a second power supply circuit 40b. The light emitting element 20 has a base substrate 21, a semiconductor layer 22, and a first electrode 23 and a second electrode 24 and is bonded to inner walls of the first through holes 12a through a heat conductive adhesive 50. The first power supply circuit 40a is connected with the first electrode 23 through a first metal wire 15a and the second power supply circuit 40b is connected with the second electrode 24 through a second metal wire 15b.

Description

  The present invention relates to a light irradiation device, a light irradiation module, and a printing apparatus used for curing an ultraviolet curable resin or a paint.

  2. Description of the Related Art Conventionally, ultraviolet irradiation apparatuses are widely used for the purpose of fluorescence reaction observation in medical and bio fields, sterilization applications, adhesion of electronic components, curing of ultraviolet curable resins and inks, and the like. High pressure mercury is used for the lamp light source of the UV irradiation device used for curing UV curable resin used for bonding small parts in the field of electronic parts, etc., and UV curable ink used for printing. Lamps and metal halide lamps are used.

  In recent years, there has been a keen desire to reduce the global environmental burden on a global scale, and there has been an active movement to adopt an ultraviolet light emitting element as a lamp light source that has a relatively long life and energy saving and can suppress ozone generation. It is coming.

  However, since the illuminance of the ultraviolet light emitting element is relatively low, for example, as described in Patent Document 1, a device in which a plurality of light emitting elements are mounted on one substrate is prepared, and the plurality of devices are mounted on a support. A module having a configuration is generally used to secure ultraviolet irradiation energy necessary for curing the ultraviolet curable ink.

  However, since the light from the ultraviolet light emitting element is irradiated not only from the upper surface but also from the lower surface of the light emitting element, there is a problem that the light emitted from the light emitting element cannot be effectively extracted by the above-described light irradiation module.

JP 2008-244165 A

  The present invention has been made in view of the above problems, and provides a light irradiation device, a light irradiation module, and a printing apparatus that can effectively extract light emitted from an ultraviolet light emitting element and realize high ultraviolet irradiation energy. Objective.

  The light irradiation device of the present invention includes a base body having a plurality of through holes and a plurality of light emitting elements accommodated in the respective through holes, and the base body includes a plurality of first elements constituting the plurality of through holes. The first substrate having a through hole and the plurality of first through holes arranged on both surfaces of the first substrate are connected to each of the plurality of first through holes to form the through hole and are thicker than the corresponding first through hole. A pair of second substrates having a plurality of second through-holes, and a first power supply circuit and a second power supply circuit disposed on at least one of the first substrate and the pair of second substrates. The light emitting element includes a base substrate, a semiconductor layer including a light emitting layer formed on an upper surface of the base substrate, a first electrode and a second electrode provided on the base substrate or the semiconductor layer, The light emitting element has a heat conductive contact. The first power supply circuit and the first electrode, and the second power supply circuit and the second electrode, respectively, are bonded to the inner wall of the first through hole via an agent, and the first metal wire, and It is connected through a second metal wire.

  Moreover, the light irradiation device of the present invention is characterized in that, in the above configuration, the diameter of the second through hole gradually increases as the distance from the first substrate increases.

  Furthermore, in the light irradiation device of the present invention, in the above configuration, the first metal line and the second metal line are formed using a conductive paste, and the first metal line is formed of the first power supply circuit. Continuously covering an upper surface, an upper surface of the first electrode, and an upper surface of the thermally conductive adhesive located between the first power supply circuit and the first electrode, and the second metal line is And continuously covering the upper surface of the second power supply circuit, the upper surface of the second electrode, and the upper surface of the thermally conductive adhesive located between the second power supply circuit and the second electrode. It is characterized by being.

  Furthermore, in the light irradiation device of the present invention, in the above configuration, the heat conductive adhesive, the first metal wire, and the second metal wire are formed using a conductive paste, and the heat conductive adhesive Includes a first thermally conductive adhesive for bonding the inner wall of the first through hole on the first power supply circuit side and the light emitting element on the first electrode side, and the first power supply circuit side on the second power supply circuit side. A second heat conductive adhesive that bonds the inner wall of one through-hole and the light emitting element on the second electrode side, the first heat conductive adhesive and the first metal wire, and The second heat conductive adhesive and the second metal wire are integrally formed, and the first heat conductive adhesive and the first metal wire are connected to the upper surface of the first power supply circuit. The upper surface of the first electrode, and the second thermally conductive adhesive and the second metal wire Characterized in that it covers the upper surface of the the upper surface of the second power supply circuit the second electrode, respectively continuously.

  Further, in the light irradiation device of the present invention, in the above configuration, a refrigerant is provided in at least one of the inside of the first substrate, the inside of the second substrate, and the first substrate and the second substrate. A flow path that can be inserted is formed.

  The light irradiation module of the present invention faces one of the light irradiation devices of the present invention described above and both surfaces of the light irradiation device, and reflects light from the plurality of light emitting elements in the side surface direction of the substrate. And reflecting mirrors arranged in such a manner.

  The printing apparatus of the present invention includes a printing unit that performs printing on a recording medium, and any one of the above-described light irradiation devices of the present invention that irradiates light on the printed recording medium. And an irradiation module.

  According to the light irradiation device of the present invention, the light irradiation device includes a base body having a plurality of through holes and a plurality of light emitting elements accommodated in the through holes, and the base body includes a plurality of the plurality of through holes. A first substrate having a first through-hole, and a corresponding first through-hole configured to be connected to each of the plurality of first through-holes disposed on both surfaces of the first substrate, respectively. A pair of second substrates having a plurality of thick second through-holes, and a first power supply circuit and a second power supply circuit disposed on at least one of the first substrate and the pair of second substrates, The light emitting element includes a base substrate, a semiconductor layer including a light emitting layer formed on an upper surface of the base substrate, a first electrode and a second electrode provided on the base substrate or the semiconductor layer. The light emitting element includes a heat transfer element. The first power supply circuit and the first electrode, and the second power supply circuit and the second electrode are respectively bonded to the inner wall of the first through hole via a conductive adhesive. Since the light emitted from the light emitting element is irradiated from both sides of the substrate and the heat emitted from the light emitting element can be effectively dissipated, the light emitting element can be effectively dissipated. As a result, a light irradiation device capable of effectively utilizing the ultraviolet rays emitted from the light source and realizing high ultraviolet irradiation energy is realized.

It is a top view which shows an example of embodiment of the light irradiation device and light irradiation module of this invention. It is sectional drawing along the 1I-1I line | wire of the light irradiation module shown in FIG. It is a side view of the light irradiation module using the light irradiation device shown in FIG. It is a top view which shows an example of the printing apparatus using the light irradiation module shown in FIG. It is a side view of the printing apparatus shown in FIG. It is sectional drawing which shows the 1st modification of the light irradiation device shown in FIG. It is sectional drawing which shows the 2nd modification of the light irradiation device shown in FIG. It is sectional drawing which shows the 3rd modification of the light irradiation device shown in FIG. It is sectional drawing which shows the 4th modification of the light irradiation device shown in FIG. It is sectional drawing which shows the 5th modification of the light irradiation device shown in FIG. It is principal part sectional drawing which shows an example at the time of incorporating the light irradiation module shown in FIG. 1 in the printing apparatus shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a light irradiation device, a light irradiation module, and a printing apparatus according to the present invention will be described with reference to the drawings. In addition, the following examples illustrate embodiments of the present invention, and the present invention is not limited to these embodiments.

(Light irradiation device)
A light irradiation device 1 shown in FIGS. 1 and 2 is incorporated in a printing apparatus such as an offset printing apparatus or an ink jet printing apparatus that uses ultraviolet curable ink, and irradiates ultraviolet rays after the ultraviolet curable ink is deposited on a recording medium. By doing so, it functions as an ultraviolet light generation light source of an ultraviolet irradiation module that cures the ultraviolet curable ink.

  The light irradiation device 1 includes a base body 10 having a plurality of through holes 12, a plurality of connection pads 13 provided in the through holes 12, a light emitting element 20 accommodated in each of the plurality of through holes 12, and each through hole. And a sealing material 30 that fills the hole 12 and covers the light emitting element 20.

  The base 10 is connected to each of a first substrate 10a having a plurality of first through holes 12a constituting the through holes 12 and a plurality of first through holes 12a arranged on both surfaces of the first substrate 10a. A pair of second substrates 10b having a plurality of second through holes 12b constituting the through holes 12, a first power supply circuit 40a for connecting the light emitting elements 20 to one main surface 11 of the first substrate 10a, and a first 2 having a power supply circuit 40b and having a substantially rectangular shape in plan view from the main surface 11 side, and supporting the light emitting element 20 in the through hole 12 via a heat conductive adhesive 50 such as silicone resin. doing.

  The substrate 10a and the substrate 10b constituting the base 10 are, for example, ceramics such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic, an epoxy resin, and a liquid crystal polymer (LCP). And a composite material obtained by coating a metal such as copper (Cu) and aluminum (Al) with a resin such as an epoxy resin or a polyimide resin.

  Next, the first power supply circuit 40a and the second power supply circuit 40b are formed in a predetermined pattern using a conductive material such as tungsten (W), molybdenum (Mo), manganese (Mn), and copper (Cu). It functions as a power supply wiring for supplying a current to the light emitting element 20 or a current from the light emitting element 20.

Next, the outer peripheral surface of the light emitting element 20 facing the inner wall of the first through hole 12a is bonded to the inner wall of the first through hole 12a with a heat conductive adhesive 50 interposed therebetween. Thus, by bonding the outer peripheral surface of the light emitting element 20 with the heat conductive adhesive 50, the heat generated by the light emitting element 20 by driving can be effectively diffused into the base 10.

  Next, the inner peripheral surface of the second through hole 12b is formed such that the diameter of each through hole gradually increases from the first substrate 10a side to the surface side opposite to the first substrate 10a side. 14 is inclined. The diameter of the 2nd through-hole 12b is made thicker than the diameter of the corresponding 1st through-hole 12a. In this example, the shape of the first through hole in plan view is a rectangle, and the shape of the second through hole in plan view is a circle, but the shape of the through hole is any shape such as a rectangle, a circle, or an ellipse. There may be.

  Such a through hole 12b has a function of reflecting light emitted from the light emitting element 20 upward or downward on the inner peripheral surface 14 to improve light extraction efficiency.

  In order to improve the light extraction efficiency, as the material of the second insulating layer 42, a porous ceramic material having a relatively good reflectivity with respect to light in the ultraviolet region, such as an aluminum oxide sintered body, zirconium oxide It is preferable to form either a sintered material or an aluminum nitride material. Further, from the viewpoint of improving the light extraction efficiency, a metal reflection film may be provided on the inner peripheral surface 14 of the through hole 12b.

  The through holes 12 are arranged vertically and horizontally over the entire substrate 10. For example, in this example, they are arranged in a so-called staggered pattern, that is, a plurality of rows of zigzags. By arranging in a staggered manner in this manner, the light emitting elements 20 can be arranged with higher density, and the illuminance per unit area can be made relatively high. Here, to arrange in a zigzag pattern is synonymous with the arrangement so as to be positioned at the lattice points of the diagonal lattice.

  In the light irradiation device 1 of this example, the arrangement of the through-holes 12 is staggered, but it may be arranged at a lattice point of a regular lattice, and how to satisfy the required illuminance and illuminance distribution. You may arrange.

  As a matter of course, the light outputs of the plurality of light emitting elements 20 in this example have substantially the same value. For example, the variation in the light output as a whole of the plurality of light emitting elements 20 in this example is within 10%.

  The base 10 provided with the first substrate 10a and the second substrate 10b as described above is manufactured through the following steps if the first substrate 10a and the second substrate 10b are made of ceramics or the like. . First, a plurality of ceramic green sheets manufactured by a conventionally known method is prepared. A hole corresponding to the through hole 12a is formed in the ceramic green sheet to be the first substrate 10a, and a hole corresponding to the through hole 12b is formed in the ceramic green sheet to be the second substrate 10b by a method such as punching.

  Next, after the metal paste that becomes the first power supply circuit 40a and the second power supply circuit 40b is printed (not shown) on the green sheet, the printed metal paste is positioned between the green sheets. A green sheet is laminated to form a laminate. As the metal paste that becomes the first power supply circuit 40a and the second power supply circuit 40b, for example, a paste containing a metal such as tungsten (W), molybdenum (Mo), manganese (Mn), and copper (Cu) is used. Can be mentioned.

Next, by firing the laminate, the green sheet and the metal paste are fired together, thereby forming the first power supply circuit 40a, the second power supply circuit 40b, and the base body 10 having the through holes 12. Can do.

  Further, if the first substrate 10a and the second substrate 10b are made of a resin, for example, the following method can be considered as a method of manufacturing the base 10. First, a precursor sheet of a thermosetting resin is prepared. Next, a plurality of precursor sheets are arranged so that lead terminals made of a metal material to be the first power supply circuit 40a and the second power supply circuit 40b are arranged between the precursor sheets, and the lead terminals are embedded in the precursor sheets. Are laminated. Examples of the material for forming the lead terminal include copper (Cu), silver (Ag), aluminum (Al), iron (Fe) -nickel (Ni) -cobalt (Co) alloy, and iron (Fe) -nickel (Ni). Examples include metal materials such as alloys.

  And after forming the hole corresponding to the through-hole 12 in the precursor sheet | seat by methods, such as a laser processing and an etching, the board | substrate 10 is completed by thermosetting this. In addition, when forming the through-hole 12 by laser processing, it may be after thermosetting the precursor sheet. Instead of the thermosetting resin, a metal body such as copper (Cu) or aluminum (Al) coated with the thermosetting resin may be used.

  On the other hand, in the through hole 12 of the base body 10, a connection pad 13 formed on one main surface 11 of the first substrate 10 a and electrically connected to the light emitting element 20, and solder, gold (Au ) The light emitting element 20 connected by the first metal line 15a and the second metal line 15b made of a wire, an aluminum (Al) line, and the like, and the heat conductive adhesive for adhering the light emitting element 20 to the inner wall of the first through hole 12a 50 and a sealing material 30 for sealing the light emitting element 20 are provided.

  The connection pad 13 is formed of a metal layer made of a metal material such as tungsten (W), molybdenum (Mo), manganese (Mn), and copper (Cu). If necessary, a nickel (Ni) layer, a palladium (Pd) layer, a gold (Au) layer, or the like may be further stacked on the metal layer. The connection pad 13 is connected to the light emitting element 20 by a first metal line 15a and a second metal line 15b made of solder, gold (Au) wire, aluminum (Al) wire, or the like.

  The light-emitting element 20 is a light-emitting diode in which a p-type semiconductor layer and an n-type semiconductor layer made of a semiconductor material such as GaAs or GaN are stacked on a base substrate 21 such as a sapphire substrate, or a semiconductor layer is organic. An organic EL element made of a material is used.

  The light emitting element 20 includes a semiconductor layer 22 having a light emitting layer, a connection pad 13 disposed on the substrate 10, a first metal line 15 a and a second metal line made of gold (Au) wire, aluminum (Al) wire, or the like. A first electrode 23 and a second electrode 24 made of a metal material such as Ag connected via 15b are provided, and are connected by wire bonding to the connection pads 13 formed on the substrate 10. Here, the first electrode 23 of the light emitting element 20 is connected to the first power supply circuit 40 a via the connection pad 13, and the second electrode 24 is connected to the second power supply circuit 40 b via the connection pad 13. Since the light emitting element 20 emits light having a predetermined wavelength in accordance with the current flowing between the first electrode 23 and the second electrode 24 with a predetermined luminance, the light is transmitted through the base substrate 21 or directly. Output to the outside. As is well known, the base substrate 21 can be omitted.

  In the present example, an LED element that emits UV light having a wavelength spectrum peak of 250 to 395 [nm] or less is employed as the light emitting element 20. That is, in this example, a UV-LED element is adopted as the light emitting element 20. The light emitting element 20 is formed by a conventionally known thin film forming technique.

  And this light emitting element 20 is sealed with the sealing material 30 mentioned above.

  The sealing material 30 is formed of an insulating material such as a light-transmitting resin material, and prevents the ingress of moisture from the outside by satisfactorily sealing the light emitting element 20 or an impact from the outside. And the light emitting element 20 is protected.

  Further, the sealing material 30 is a material having a refractive index between the refractive index of the base substrate 21 constituting the light emitting element 20 (in the case of sapphire: 1.7) and the refractive index of air (about 1.0), For example, the light extraction efficiency of the light emitting element 20 can be improved by being formed of a silicone resin (refractive index: about 1.4) or the like.

  The sealing material 30 is formed by mounting the light emitting element 20 on the substrate 10, filling a through hole 12 b with a precursor such as silicone resin, and curing the precursor.

  The light irradiation device 1 configured in this manner can irradiate light emitted from the light emitting element 20 in both directions from the through holes 12b provided in the substrate 10b disposed on both surfaces of the substrate 10a.

(Embodiment of light irradiation module)
The light irradiation module 100 of the example shown in FIG. 3 faces the light irradiation device 1 described above and both surfaces of the light irradiation device 1, and the light emitted from the light emitting element 20 is directed to the side surface of the substrate 10 constituting the light irradiation device 1. And a pair of reflecting mirrors 110 arranged so as to be reflected on each other.

  The reflecting mirror 110 in the light irradiation module 100 of this example is a pair of plane mirrors, and one side surface of the light irradiation device 1 so as to reflect the light irradiated from both surfaces of the light irradiation device 1 toward one side surface of the substrate 10. Each reflecting mirror is arranged at an angle so that the distance from the light irradiating device 1 is shortened on one end side opposite to the side and the distance from the light irradiating device 1 is increased on the other end side on the same side as the one side surface. ing.

  In such a light irradiation module 100, the light from the light irradiation device 1 is reflected by the reflecting mirror 110 and condensed on one side of the base 10, thereby reducing the size of the light irradiation module 1 and the high illuminance of light. Can be realized at the same time.

(Embodiment of printing apparatus)
As an example of the embodiment of the printing apparatus of the present invention, the printing apparatus 200 shown in FIGS. 4 and 5 will be described as an example. The printing apparatus 200 includes a transport mechanism 210 for transporting the recording medium 250, an inkjet head 220 as a printing mechanism for printing on the transported recording medium 250, and an ultraviolet for the recording medium 250 after printing. The light irradiation module 100 which irradiates light mentioned above and the control mechanism 230 which controls light emission of this light irradiation module 100 are provided.

  The transport mechanism 210 is for transporting the recording medium 250 so as to pass through the inkjet head 220 and the light irradiation module 1 in this order. The transport mechanism 210 and the mounting table 211 are arranged to face each other and are rotatably supported. And a roller 212. The recording medium 250 supported by the mounting table 211 is sent between the pair of transport rollers 212, and the transport roller 212 is rotated to send the recording medium 250 in the transport direction.

The inkjet head 220 has a function of attaching a photosensitive material to the recording medium 250 conveyed via the conveyance mechanism 210. The ink-jet head 220 is configured to eject droplets containing the photosensitive material toward the recording medium 250 and adhere to the recording medium 250. In this example, ultraviolet curable ink is used as the photosensitive material. Examples of the photosensitive material include, in addition to the ultraviolet curable ink, a photosensitive resist or a photocurable resin.

  In this example, a line-type inkjet head is employed as the inkjet head 220. The inkjet head 220 has a plurality of ejection holes 220a arranged in a line, and is configured to eject ultraviolet curable ink from the ejection holes 220a. The inkjet head 220 ejects ink from the ejection holes 220a to the recording medium 250 conveyed in a direction orthogonal to the arrangement of the ejection holes 220a, and deposits the ink on the recording medium, thereby causing the recording medium to adhere to the recording medium. Printing is performed.

  In this example, a line-type inkjet head is used as an example of a printing mechanism. However, the present invention is not limited to this. For example, a serial-type inkjet head may be used, or a line-type or serial-type head may be used. A spray head may be employed. Further, as the printing mechanism, an electrostatic head that accumulates static electricity on the recording medium 250 and attaches the photosensitive material with the static electricity may be employed. Alternatively, the recording medium 250 may be immersed in a liquid photosensitive material and the photosensitive medium may be used. An immersion apparatus for attaching a conductive material may be employed. Further, a brush, a brush, a roller, or the like may be employed as a printing mechanism.

  In the printing apparatus 200, the light irradiation module 100 has a function of exposing the photosensitive material attached to the recording medium 250 conveyed via the conveyance mechanism 210. The light irradiation module 100 is provided on the downstream side in the transport direction with respect to the inkjet head 220. In the printing apparatus 200, the light emitting element 20 and the second light emitting element 30b have a function of exposing the photosensitive material attached to the recording medium 250.

  The control mechanism 230 has a function of controlling the light emission of the light irradiation module 100. The memory of the control mechanism 230 stores information indicating light characteristics that make it relatively good to cure the ink droplets ejected from the inkjet head 220. Specific examples of the stored information include wavelength distribution characteristics suitable for curing ejected ink droplets, and numerical values representing emission intensity (emission intensity in each wavelength range). In the printing apparatus 200 of this example, by including the control mechanism 230, the magnitude of the drive current input to the plurality of light emitting elements 20 can be adjusted based on the stored information of the control mechanism 230. Therefore, according to the printing apparatus 200 of this example, it is possible to irradiate light with an appropriate ultraviolet irradiation energy according to the characteristics of the ink to be used, and to cure the ink droplet with a relatively low energy light. it can.

  In the printing apparatus 200, the transport mechanism 210 transports the recording medium 250 in the transport direction. The inkjet head 220 discharges ultraviolet curable ink to the recording medium 250 being conveyed, and causes the ultraviolet curable ink to adhere to the surface of the recording medium 250. At this time, the ultraviolet curable ink to be attached to the recording medium 250 may be attached to the entire surface, partially attached, or attached in a desired pattern. In the printing apparatus 200, the ultraviolet curable ink attached to the recording medium 250 is irradiated with ultraviolet rays emitted from the light irradiation module 100 to cure the ultraviolet curable ink.

  According to the printing apparatus 200 of this example, the above-described effects of the light irradiation module 100 can be enjoyed.

  As mentioned above, although the example of specific embodiment of this invention was shown, this invention is not limited to this, A various change is possible within the range which does not deviate from the summary of this invention.

  For example, as in the first modification shown in FIG. 6, the first metal line 15a and the second metal line 15b are electrically conductive such as a paste in which a noble metal powder is mixed with a resin such as silver (Ag) paste, carbon paste, and epoxy resin. You may form with an adhesive paste. In this case, the upper surface of the first electrode 23 included in the light emitting element 20, the upper surface of the electrode pad 13 disposed at one end of the first power supply circuit 40a, and one end of the first electrode 23 and the first power supply circuit 40a are disposed. The conductive paste continuously covers the upper surface of the heat conductive adhesive 50 positioned between the electrode pad 13 and the upper surface of the one main surface 11 of the substrate 10a. Similarly, the upper surface of the second electrode 24 included in the light emitting element 20, the upper surface of the electrode pad 13 disposed at one end of the second power supply circuit 40b, and the one end of the second electrode 24 and the second power supply circuit 40b are disposed. The conductive paste continuously covers the upper surface of the heat conductive adhesive 50 positioned between the electrode pad 13 and the upper surface of the one main surface 11 of the substrate 10a. With such a configuration, the first metal line 15a and the second metal line 15b made of gold (Au) wire or aluminum (Al) wire do not exist in the space above the light emitting element 20, and thus the light emitting element Since the light emitted by 20 is not blocked by the first metal line 15a and the second metal line 15b, it is possible to suppress a decrease in the emission intensity.

  Further, for example, as in the second modification shown in FIG. 7, the thermally conductive adhesive 50 and the first metal wire 15a and the second metal wire 15b are replaced with a noble metal such as silver (Ag) paste, carbon paste, and epoxy resin. You may integrally form with electroconductive pastes, such as a paste which mixed powder.

  By adopting such a configuration, it is possible to enjoy the effect when the first metal line 15a and the second metal line 15b are formed of a conductive paste, and the light-emitting element 20 is bonded to the heat conductive adhesive 50. The first bonding between the first electrode 23 and the second electrode 24 and the connection pad 13 formed at one end of the first power supply circuit 40a and the second power supply circuit 40b. Since the connecting step using the metal wire 15a and the second metal wire 15b can be performed at the same time, the manufacturing process can be simplified.

  Further, as in the third, fourth, and fifth modifications shown in FIGS. 8, 9, and 10, for example, the flow path 120 is provided inside the first substrate 10a, and the second substrate 10b is provided inside. You may provide the flow path 120 between the flow path 120 and the 1st board | substrate 10a and the 2nd board | substrate 10b. The flow path 120 is preferably disposed over the entire first substrate 10a or the second substrate 10b, and meanders so that one flow path is inverted at both ends of the first substrate 10a or the second substrate 10b. The plurality of flow paths may be provided linearly from one end to the other end of the first substrate 10a or the second substrate 10b, or the first substrate 10a is driven by the light emitting element 20 being driven. Alternatively, a plurality of flow paths may be provided from the center of the substrate where the substrate temperature of the second substrate 10b is highest toward the outer periphery of the substrate. By flowing a fluid as a coolant through such a flow path 120, heat generated by driving of the light emitting element 20 can be effectively released to the outside.

  Further, the example of the embodiment of the printing apparatus 200 is not limited to the above example. For example, a so-called offset printing type printer that rotates a shaft-supported roller and conveys a recording medium along the surface of the roller may be used. In this case, the same effect can be obtained.

  In this example, the light irradiation module 100 is incorporated into the printing apparatus 200, but the light irradiation device 1 can be incorporated into the printing apparatus 200. FIG. 11 is a cross-sectional view of an essential part of an example of the case where the light irradiation device 1 is incorporated in the printing apparatus 200. The conveyance roller 212 is irradiated after the recording medium 250 is irradiated with ultraviolet rays emitted from one surface of the light irradiation device 1. By inverting the recording medium 250 and irradiating ultraviolet light emitted from the other surface of the light irradiation device 1, the cumulative amount of ultraviolet light can be made relatively large, and the recording medium 250 of the ultraviolet irradiation device can be used. The size in the feed direction can be reduced.

  In this example, an example in which the light irradiation module 100 is applied to the printing apparatus 200 using the inkjet head 220 is shown, but this light irradiation module 1 is dedicated to, for example, curing a photocurable resin spin-coated on the surface of the object. It can also be applied to the curing of various types of photo-curing resins such as devices. Moreover, you may use the light irradiation module 1 for the irradiation light source etc. in exposure apparatus, for example.

DESCRIPTION OF SYMBOLS 1 Light irradiation device 10 Base | substrate 10a 1st board | substrate 10b 2nd board | substrate 11 One main surface 12 Through-hole 13 Connection pad 14 Inner peripheral surface 15a 1st metal line 15b 2nd metal line 20 Light emitting element 21 Base substrate 22 Semiconductor layer 23 1st Element electrode 24 Second element electrode 30 Sealing material 40a First power supply circuit 40b Second power supply circuit 50 Thermally conductive adhesive 100 Light irradiation module 110 Reflective mirror 120 Flow path 200 Printing device 210 Conveying mechanism 211 Mounting table 212 Conveying Roller 220 Inkjet head 220a Discharge hole 230 Control mechanism 250 Recording medium

Claims (7)

A substrate having a plurality of through holes, and a plurality of light emitting elements accommodated in each of the through holes,
The base body includes a first substrate having a plurality of first through holes constituting the plurality of through holes;
A pair having a plurality of second through-holes that are thicker than the corresponding first through-holes, which are arranged on both surfaces of the first substrate, and which are connected to each of the plurality of first through-holes to constitute the through-holes. A second substrate of
A first power supply circuit and a second power supply circuit disposed on at least one of the first substrate and the pair of second substrates;
The light emitting element includes a base substrate;
A semiconductor layer including a light emitting layer formed on the upper surface of the base substrate;
A first electrode and a second electrode provided on the base substrate or the semiconductor layer;
The light emitting element is bonded to the inner wall of the first through hole via a heat conductive adhesive,
The first power supply circuit and the first electrode, and the second power supply circuit and the second electrode are connected via a first metal line and a second metal line, respectively. Light irradiation device.   2. The light irradiation device according to claim 1, wherein the diameter of the second through-hole gradually increases as the distance from the first substrate increases.   The first metal line and the second metal line are formed using a conductive paste, and the first metal line includes an upper surface of the first power supply circuit, an upper surface of the first electrode, and the first electrode. A power supply circuit and an upper surface of the thermally conductive adhesive located between the first electrode and the second metal line continuously covering the upper surface of the second power supply circuit; The upper surface of the electrode and the upper surface of the thermally conductive adhesive located between the second power supply circuit and the second electrode are continuously covered. Light irradiation device. The thermally conductive adhesive, the first metal wire and the second metal wire are formed using a conductive paste,
The thermally conductive adhesive is
A first thermally conductive adhesive that bonds the inner wall of the first through hole on the first power supply circuit side and the light emitting element on the first electrode side;
A second thermally conductive adhesive for bonding the inner wall of the first through hole on the second power supply circuit side and the light emitting element on the second electrode side;
The first thermally conductive adhesive and the first metal wire are integrally formed with the second thermally conductive adhesive and the second metal wire, respectively.
The first thermally conductive adhesive and the first metal line connect the upper surface of the first power supply circuit and the upper surface of the first electrode, and the second thermally conductive adhesive and the second metal wire. The light irradiation device according to claim 1, wherein the light irradiation device continuously covers the upper surface of the second power supply circuit and the upper surface of the second electrode.   A flow path through which a coolant can be inserted is formed in at least one of the first substrate, the second substrate, and the first substrate and the second substrate. The light irradiation device according to any one of claims 1 to 4.   6. The light irradiation device according to claim 1, and the light irradiation device disposed on both sides of the light irradiation device so as to reflect light from the plurality of light emitting elements toward a side surface of the substrate. And a reflecting mirror. Printing means for printing on a recording medium;
A printing apparatus comprising: the light irradiation device according to claim 1 or the light irradiation module according to claim 6, which irradiates light onto the printed recording medium.

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