JP2013171911A - Light radiation module and printing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light radiation device which is not easily affected by heat emitted by an ultraviolet light emitting element itself and realizes relatively high ultraviolet radiation energy even when the mounting density of the ultraviolet light emitting element is set so as to be relatively high.SOLUTION: A light radiation module includes: a light radiation device 2 where light emitting elements 20 are disposed on one main surface 11a of a substrate 10; and a plate like heat radiation member 100 which is disposed on the other main surface 11b side of the substrate 10 to correspond to the light radiation device 2 through an adhesive 120 and is used for radiating heat generated by driving of the light radiation device 2. The heat radiation member 100 includes: through holes 100a disposed at positions corresponding to the light emitting elements 20; and heat transmission members 110 that are inserted into the through holes 100a and may move in an axial direction of the through hole 100a. The heat transmission members 110 contact with the other main surface 11b of the substrate 10 or are adhered to the other main surface 11b through the adhesive 120. This structure makes the light radiation module less likely to be affected by heat emitted by the light emitting elements 20 and realizes relatively high light radiation energy.

Description

  The present invention relates to a light irradiation module and a printing apparatus used for curing an ultraviolet curable resin or a paint.

  2. Description of the Related Art Conventionally, ultraviolet irradiation apparatuses are widely used for the purpose of fluorescence reaction observation in medical and bio fields, sterilization applications, adhesion of electronic components, curing of ultraviolet curable resins and inks, and the like. In particular, the UV light source lamp light source used for curing UV curable resins used for bonding small parts in the field of electronic components, etc., and UV curable ink used for printing, etc. Mercury lamps and metal halide lamps are used.

  In recent years, there has been a strong desire to reduce the global environmental load on a global scale, and there has been an active movement to adopt an ultraviolet light emitting element as a lamp light source capable of suppressing the generation of ozone with a relatively long life, energy saving. .

  However, since the illuminance of the ultraviolet light emitting element is relatively low, for example, as described in Patent Document 1, a device having a plurality of light emitting elements mounted on one substrate is prepared, and the plurality of devices are mounted on a support. The module having the above-described configuration is generally used, thereby ensuring the ultraviolet irradiation energy necessary for the effect of the ultraviolet curable ink.

  However, there is an increasing demand for improvement in ultraviolet irradiation energy, and attempts have been made to increase the mounting density of the ultraviolet light emitting elements. However, although the heat generation from the ultraviolet light emitting elements is relatively small, A device with a higher mounting density has a problem that heat radiation cannot be sufficiently performed, which hinders improvement of ultraviolet irradiation energy.

JP 2008-244165 A

  The present invention has been made in view of the above problems, and even when the mounting density of the ultraviolet light emitting elements is relatively high, the heat emitted from the ultraviolet light emitting elements is efficiently dissipated, so that a relatively high ultraviolet irradiation energy can be obtained. An object of the present invention is to provide a light irradiation device, a module, and a printing apparatus that are realized.

  The light irradiation module of the present invention is a light irradiation device in which a light emitting element is disposed on one main surface of a substrate, and the other main surface side of the substrate is disposed via an adhesive corresponding to the light irradiation device. The light irradiation device has a flat plate-like heat radiating member for radiating heat generated by driving, and the heat radiating member includes a through hole disposed at a position corresponding to the light emitting element, and the through hole. A heat transfer member inserted in the through hole and movable in the axial direction of the through-hole, and the heat transfer member is in contact with the other main surface of the substrate or bonded via the adhesive. It is characterized by that.

  Moreover, the light irradiation module of this invention is the said structure, The said heat transfer member is a columnar member which can slide in the said through-hole, It is characterized by the above-mentioned.

  Furthermore, the light irradiation module of the present invention is characterized in that, in the above configuration, the heat transfer member is a screw screwed into the through hole.

  Moreover, the light irradiation module of the present invention is characterized in that, in the above-described configuration, the substrate further includes a heat conducting member arranged corresponding to the light emitting element.

  Furthermore, the light irradiation module according to the present invention has the above-described configuration, wherein the heat transfer member has a metal as a main component, and the substrate has a metal as a main component disposed on the other main surface so as to correspond to the light emitting element. The bonding pad is further metal-bonded to the heat transfer member.

  Moreover, the light irradiation module of the present invention is characterized in that, in the above-described configuration, the bonding pad and the heat transfer member are metal-bonded via a bonding material containing metal as a main component.

  Furthermore, the light irradiation module according to the present invention has the above-described configuration, wherein the heat dissipating member further includes a flow path that is disposed in the vicinity of the through hole and through which a refrigerant for cooling the light irradiation device can flow. It is characterized by having.

  A printing apparatus according to the present invention includes a printing unit that performs printing on a recording medium, and any one of the light irradiation modules according to the present invention that irradiates light onto the printed recording medium. Printing device.

  According to the light irradiation module of the present invention, the light irradiation device having the light emitting element disposed on one main surface of the substrate and the other main surface side of the substrate are disposed via the adhesive corresponding to the light irradiation device. A flat plate-like heat radiating member for radiating heat generated by the light irradiation device, and the heat radiating member includes a through-hole disposed at a position corresponding to the light-emitting element, A heat transfer member inserted in the through hole and movable in the axial direction of the through hole, and the heat transfer member is in contact with the other main surface of the substrate or bonded via the adhesive. ing. For this reason, the heat transfer member is in contact with or adhered to the position corresponding to the light emitting element on the other main surface of the substrate, the temperature of which is relatively high due to the heat generated by the light emitting element. Therefore, the heat dissipation of the substrate is maintained high. Therefore, according to the light irradiation device of the present invention, even if the mounting density of the light emitting elements is relatively high, the light irradiation device that is not easily affected by the heat generated by the light emitting elements and realizes relatively high light irradiation energy. Can be obtained.

It is a top view which shows an example of the form of the light irradiation module of this invention. It is sectional drawing along the 1I-1I line | wire of the light irradiation module shown in FIG. It is sectional drawing along the 1II-1II line of the light irradiation module shown in FIG. It is a top view of the printing apparatus using the light irradiation module shown in FIG. It is a side view of the printing apparatus shown in FIG. FIG. 6 is a cross-sectional view showing a first modification of the light irradiation device shown in FIG. FIG. 7 is a cross-sectional view showing a second modification of the light irradiation device shown in FIG. FIG. 8 is a cross-sectional view showing a third modification of the light irradiation device shown in FIG.

Hereinafter, examples of embodiments of a light irradiation module and a printing apparatus according to the present invention will be described with reference to the drawings. The following examples illustrate the embodiments of the present invention, and the present invention is not limited to the examples of these embodiments.

  The light irradiation module 1 shown in FIGS. 1, 2, and 3 is incorporated in a printing apparatus such as an offset printing apparatus or an inkjet printing apparatus that uses ultraviolet curable ink, and ultraviolet curable ink is applied to an object (recording medium). By irradiating with ultraviolet light after being applied, it functions as an ultraviolet light generating light source for curing the ultraviolet curable ink.

  The light irradiation module 1 includes a light irradiation device 2 and a flat plate-like heat radiation member 100 for radiating heat generated by driving the light irradiation device 2.

  First, the light irradiation device 2 will be described.

(Light irradiation device)
The light irradiation device 2 is disposed in the substrate 10 having a plurality of openings 12 on one main surface 11a, a plurality of connection pads 13 provided in each opening 12, and each opening 12 of the base body 10, A plurality of light emitting elements 20 electrically connected to the connection pad 13, a plurality of sealing materials 30 filled in each opening 12 and covering the light emitting elements 20, and an optical lens 16 corresponding to each opening 12. And.

  The base 10 includes a laminated body 40 in which a first insulating layer 41 and a second insulating layer 42 are laminated, and an electrical wiring 50 that connects the light emitting elements 20 to each other. The light emitting element 20 is supported in an opening 12 provided on the one main surface 11a.

  The first insulating layer 41 includes, for example, an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, ceramics such as glass ceramics, and resins such as epoxy resins and liquid crystal polymers (LCP). Formed by.

  The electric wiring 50 is formed in a predetermined pattern by a conductive material such as tungsten (W), molybdenum (Mo), manganese (Mn), and copper (Cu), and the electric current to the light emitting element 20 or the light emitting element It functions as a power supply wiring for supplying current from 20.

  In the second insulating layer 42 stacked on the first insulating layer 41, an opening 12 that penetrates the second insulating layer 42 is formed.

  The shape of each opening 12 is such that the inner peripheral surface 14 is inclined so that the hole diameter is larger on the one main surface 11a side of the substrate 10 than the mounting surface of the light emitting element 20, It has a circular shape. The opening shape is not limited to a circular shape, and may be a rectangular shape.

  Such an opening 12 has a function of reflecting light emitted from the light emitting element 20 upward on the inner peripheral surface 14 to improve light extraction efficiency.

  In order to improve the light extraction efficiency, the material of the second insulating layer 42 is a porous ceramic material having a relatively good reflectivity with respect to light in the ultraviolet region, such as an aluminum oxide sintered body, an oxide It is preferable to form a zirconium sintered body and an aluminum nitride sintered body. Further, from the viewpoint of improving the light extraction efficiency, a metal reflection film may be provided on the inner peripheral surface 14 of the opening 12.

  Such openings 12 are arranged vertically and horizontally over the entire main surface 11 a of the base body 10. For example, the light emitting elements 20 are arranged in a zigzag pattern, that is, arranged in a zigzag manner in a plurality of rows. By arranging such an arrangement, the light emitting elements 20 can be arranged with higher density, and the illuminance per unit area Can be increased. Here, to arrange in a zigzag pattern is synonymous with the arrangement so as to be positioned at the lattice points of the diagonal lattice.

  In addition, when sufficient illuminance per unit area can be ensured, it may be arranged in a regular lattice shape or the like, and there is no need to limit the arrangement shape.

  The base 10 provided with the laminate 40 composed of the first insulating layer 41 and the second insulating layer 42 as described above is a case where the first insulating layer 41 and the second insulating layer 42 are made of ceramics or the like. If there is, it is manufactured through the following steps.

  First, a plurality of ceramic green sheets manufactured by a conventionally known method are prepared. A hole corresponding to the opening is formed in the ceramic green sheet corresponding to the opening 12 by a method such as punching. Next, a metal paste to be the electric wiring 50 is printed (not shown) on the green sheet, and then the green sheet is laminated so that the printed metal paste is positioned between the green sheets. Examples of the metal paste used for the electric wiring 50 include a paste containing a metal such as tungsten (W), molybdenum (Mo), manganese (Mn), and copper (Cu). Next, the base body 10 having the electrical wiring 50 and the opening 12 can be formed by firing the laminate and firing the green sheet and the metal paste together.

  Further, if the first insulating layer 41 and the second insulating layer 42 are made of a resin, for example, the following method can be considered as a method for manufacturing the substrate 10.

  First, a precursor sheet of a thermosetting resin is prepared. Next, a plurality of precursor sheets are laminated so that lead terminals made of a metal material to be the electrical wiring 50 are arranged between the precursor sheets and the lead terminals are embedded in the precursor sheets. Examples of the material for forming the lead terminal include copper (Cu), silver (Ag), aluminum (Al), iron (Fe) -nickel (Ni) -cobalt (Co) alloy, and iron (Fe) -nickel (Ni ) Metal materials such as alloys can be mentioned. And after forming the hole corresponding to the opening part 12 in a precursor sheet | seat by methods, such as a laser processing and an etching, the base | substrate 10 is completed by thermosetting this. In addition, when forming the opening part 12 by laser processing, you may process after thermosetting a precursor sheet | seat.

  On the other hand, in the opening 12 of the substrate 10, a connection pad 13 electrically connected to the light emitting element 20 and a first pad such as solder, gold (Au) wire, aluminum (Al) wire, etc. are connected to the connection pad 13. A light emitting element 20 connected by the bonding material 15 and a sealing material 30 for sealing the light emitting element 20 are provided.

  The connection pad 13 is formed of a metal layer made of a metal material such as tungsten (W), molybdenum (Mo), manganese (Mn), and copper (Cu). If necessary, a nickel (Ni) layer, a palladium (Pd) layer, a gold (Au) layer, or the like may be further laminated on the metal layer. The connection pad 13 is connected to the light emitting element 20 by a first bonding material 15 such as solder, gold (Au) wire, or aluminum (Al) wire.

The light emitting element 20 is a light emitting element in which a p-type semiconductor layer and an n-type semiconductor layer made of a semiconductor material such as gallium arsenide (GaAs) or gallium nitride (GaN) are stacked on an element substrate 21 such as a sapphire substrate. A diode or a semiconductor layer is composed of an organic EL element made of an organic material.

  The light emitting element 20 includes a semiconductor layer 22 having a light emitting layer and a connection pad 13 disposed on the base 10 via a first bonding material 15 such as solder, gold (Au) wire, or aluminum (Al) wire. Device electrodes 23 and 24 made of a metal material such as silver (Ag) are connected and connected to the substrate 10 by wire bonding. The light emitting element 20 emits light having a predetermined wavelength with a predetermined luminance according to the current flowing between the element electrodes 23 and 24, and emits the light to the outside through the element substrate 21. As is well known, the element substrate 21 can be omitted. Further, the connection between the element electrodes 23 and 24 of the light emitting element 20 and the connection pad 13 may be performed by a conventionally known flip chip connection technique using solder or the like for the first bonding material 15.

  In the present embodiment, an LED that emits UV light having a wavelength spectrum peak of 250 to 395 [nm] or less is employed. That is, in this embodiment, a UV-LED element is employed as the light emitting element 20. The light emitting element 20 is formed by a conventionally known thin film forming technique.

  And this light emitting element 20 is sealed with the sealing material 30 mentioned above.

  The sealing material 30 is made of an insulating material such as a light-transmitting resin material. By sealing the light-emitting element 20 well, entry of moisture from the outside can be prevented, or from the outside. The light emitting element 20 is protected by absorbing an impact.

  Further, a material having a refractive index between the refractive index of the element substrate 21 constituting the light emitting element 20 (in the case of sapphire: 1.7) and the refractive index of air (about 1.0) is used as the sealing material 30, for example By using a silicone resin (refractive index: about 1.4) or the like, the light extraction efficiency of the light emitting element 20 can be improved.

  The sealing material 30 is formed by mounting the light emitting element 20 on the substrate 10, filling a precursor such as a silicone resin into the opening 12, and curing it.

  The optical lens 16 is disposed on the sealing material 30 so as to cover the light emitting element 20 via the lens adhesive 17. In the light irradiation device 2 of this example, a plano-convex lens is used as the optical lens 16. In other words, the optical lens 16 of the present example has a convex surface on one main surface and a flat surface on the other main surface, and the cross-sectional area decreases from the other main surface toward the main surface.

  The optical lens 16 is formed of, for example, a silicone resin and has a function of collecting light emitted from the light emitting element 20. In addition to the silicone resin described above, the optical lens material is a thermosetting resin such as a urethane resin or an epoxy resin, or a plastic such as a thermoplastic resin such as a polycarbonate resin or an acrylic resin, or sapphire or inorganic glass. Can be mentioned. The optical lens 16 can be omitted if the light irradiation device 2 and the object are close to each other if the light does not need to be collected.

  As described above, the light irradiation device 2 of the present example is a surface light emitting type in which a plurality of light emitting elements 20 are arranged vertically and horizontally over the entire one main surface 11a of the base 10. May be a line light emitting type arranged in a line on the one main surface 11a of the base 10, or the light emitting element 20 may be composed of one. Moreover, the light irradiation module 1 in which a plurality of such light irradiation devices 2 are arranged may be used.

(Light irradiation module)
The light irradiation module 1 shown in FIGS. 1, 2 and 3 includes a heat radiation member 100 and a light irradiation device 2 disposed on the heat radiation member 100. The light irradiation device 2 is made of silicone resin or epoxy. It arrange | positions on the main surface of the member 100 for heat dissipation via adhesive materials 120, such as resin.

  The heat dissipation member 100 of this example has a plurality of through holes 100a arranged at positions corresponding to the plurality of light emitting elements 20, and a heat transfer member 110 is inserted into each of the through holes 100a. The heat transfer member 110 is movable in the axial direction of the through hole 100a. Such a heat dissipation member 100 functions as a support for the light irradiation device 2 and as a heat dissipation body for radiating heat generated by the light irradiation device 2 to the outside. As a material for forming the heat radiating member 100 and the heat transfer member 110, a material having a high thermal conductivity is preferable, and examples thereof include various metal materials, ceramics, and resin materials. The heat dissipation member 100 and the heat transfer member 110 of this embodiment are made of copper. Note that the heat dissipation member 100 and the heat transfer member 110 are not necessarily formed of the same material. The heat transfer member 110 of this example is a columnar member that can slide through the through hole 100a, but may be a screw that engages with the through hole 100a.

  Since the heat dissipation member 100 of this example includes the heat transfer member 110 that can move in the axial direction of the through hole 100a, it is possible to efficiently dissipate heat generated by the light irradiation device 2. This point will be described in detail below.

  The lower surface of the light irradiation device 2 shown in FIG. 2, that is, the other main surface 11b of the substrate 10 has a flat shape, and the distance between the other main surface 11b and the upper surface of the heat dissipation member 100 is constant at any location. However, in practice, various undulations exist on the other main surface 11b, and the distance between the upper surface of the heat dissipation member 100 and the other main surface 11b is not constant. In general, the thermal conductivity of the adhesive 120 that bonds the other main surface 11b of the light irradiation device 2 and the heat radiating member 100 is often smaller than the heat conductivity of the heat radiating member 100. When the distance between the main surface 11b and the heat dissipating member 100 is long, the heat dissipating efficiency is not as good as when the distance between the other main surface 11b and the heat dissipating member 100 is short, and the waviness of the other main surface 11b is extremely high. Is larger, a gap is generated between the other main surface 11b and the heat dissipating member 100, and the heat dissipation efficiency is further reduced.

  In view of this, the heat transfer member 110 is arranged close to the other main surface 11b side, so that the heat generated by the light irradiation device 2 can be efficiently radiated. In particular, it is preferable to efficiently dissipate heat from the region corresponding to the light emitting element 20 where the substrate temperature of the substrate 10 is highest. In order to obtain such a structure, for example, after the light irradiation device 2 is disposed on the heat dissipation member 100 to which the adhesive 120 is applied, the heat transfer member 110 is light-transmitted so that the heat transfer member 110 contacts the other main surface 11b. The adhesive 120 may be cured by moving to the irradiation device 2 side. Here, it is preferable that the heat transfer member 110 is in contact with the other main surface 11b, but it is difficult to make the heat transfer member 110 contact completely depending on the shape variation of the heat transfer member 110 and the shape of the undulation existing on the other main surface 11b. In some cases, there is no need for complete contact. Even if the heat transfer member 110 and the other main surface 11b are partially bonded via the adhesive 120 or entirely bonded via the thin adhesive 120, the heat transfer member is a heat dissipation member. If it protrudes from the through-hole 100a of 100 to the other main surface 11b side, it will contribute to improving the efficiency of heat dissipation.

  Thus, even if the mounting density of the ultraviolet light emitting elements is relatively high and the other main surface 11b has waviness, the other main surface 11b and the heat transfer member in the region corresponding to the light emitting element 20 having a relatively high temperature. Since the distance to 110 can be shortened, variation in heat radiation within the surface of the light irradiation device 2 can be reduced, and efficient heat radiation can be performed.

  Therefore, according to the light irradiation module 1 of this example, even if the mounting density of the ultraviolet light emitting elements is relatively high, the light that is hardly affected by the heat generated by the ultraviolet light emitting elements themselves and that realizes relatively high ultraviolet irradiation energy. An irradiation device can be obtained.

(Embodiment of printing apparatus)
As an example of the embodiment of the printing apparatus of the present invention, the printing apparatus 200 shown in FIGS. 4 and 5 will be described as an example. The printing apparatus 200 includes a conveying unit 210 for conveying the recording medium 250, a printing unit 220 as a printing mechanism for printing on the conveyed recording medium 250, and an ultraviolet ray for the recording medium 250 after printing. The light irradiation module 1 which irradiates light and the control mechanism 230 which controls light emission of this light irradiation module 1 are provided. The recording medium 250 corresponds to the above-described object.

  The transport unit 210 is for transporting the recording medium 250 so as to pass through the printing unit 220 and the light irradiation module 1 in this order. The transport unit 210 and the mounting table 211 are arranged so as to face each other and are rotatably supported. And a roller 212. The transport unit 210 is for sending the recording medium 250 supported by the mounting table 211 between the pair of transport rollers 212 and rotating the transport roller 212 to feed the recording medium 250 in the transport direction. .

  The printing unit 220 has a function of attaching a photosensitive material to the recording medium 250 conveyed via the conveying unit 210. The printing unit 220 is configured to eject droplets containing the photosensitive material toward the recording medium 250 and attach the droplets to the recording medium 250. In this example, ultraviolet curable ink 6 is used as the photosensitive material. Examples of the photosensitive material include, in addition to the ultraviolet curable ink 6, for example, a photosensitive resist or a photocurable resin.

  In this example, a line-type printing unit is employed as the printing unit 220. The printing unit 220 has a plurality of ejection holes 220a arranged in a line, and is configured to eject the ultraviolet curable ink 6 from the ejection holes 220a. The printing unit 220 ejects ink from the ejection holes 220a to the recording medium 250 conveyed in a direction orthogonal to the arrangement of the ejection holes 220a, and deposits the ink on the recording medium, thereby applying the recording medium to the recording medium. Printing is performed.

  In this example, the line-type printing unit is exemplified as the printing mechanism. However, the printing mechanism is not limited to this. For example, a serial-type printing unit may be employed, or a line-type or serial-type printing unit may be used. You may employ | adopt a spray head (for example, inkjet head). Further, as the printing mechanism, an electrostatic head that accumulates static electricity on the recording medium 250 and attaches the photosensitive material with the static electricity may be employed. Alternatively, the recording medium 250 may be immersed in a liquid photosensitive material and the photosensitive medium may be used. An immersion apparatus for attaching a conductive material may be employed. Further, a brush, a brush, a roller, or the like may be employed as a printing mechanism.

  In the printing apparatus 200, the light irradiation module 1 has a function of exposing the photosensitive material attached to the recording medium 250 conveyed via the conveying unit 210. The light irradiation module 1 is provided on the downstream side in the transport direction with respect to the printing unit 220. In the printing apparatus 200, the light emitting element 20 has a function of exposing the photosensitive material attached to the recording medium 250.

The control mechanism 230 has a function of controlling light emission of the light irradiation module 1. The memory of the control mechanism 230 stores information indicating the characteristics of light that makes it relatively good to cure the ink droplets ejected from the printing unit 220. Specific examples of the stored information include wavelength distribution characteristics suitable for curing ejected ink droplets, and numerical values representing emission intensity (emission intensity in each wavelength range). In the printing apparatus 200 of this example, by including the control mechanism 230, the magnitude of the drive current input to the plurality of light emitting elements 20 can be adjusted based on the stored information of the control mechanism 230. Therefore, according to the printing apparatus 200 of this example, it is possible to irradiate light with an appropriate ultraviolet irradiation energy according to the characteristics of the ink to be used, and to cure the ink droplet with a relatively low energy light. it can.

  In the printing apparatus 200, the transport unit 210 transports the recording medium 250 in the transport direction. The printing unit 220 discharges the ultraviolet curable ink 6 to the transported recording medium 250 and causes the ultraviolet curable ink 6 to adhere to the surface of the recording medium 250. At this time, the ultraviolet curable ink 6 to be attached to the recording medium 250 may be attached to the entire surface, partially attached, or attached in a desired pattern. In the printing apparatus 200, the ultraviolet curable ink 6 attached to the recording medium 250 is irradiated with ultraviolet rays emitted from the light irradiation module 1 to cure the ultraviolet curable ink 6.

  According to the printing apparatus 200 of this example, the above-described effects of the light irradiation module 1 can be achieved.

  Although specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the scope of the present invention.

  For example, as in the first modification shown in FIG. 6, the heat conducting member 60 may be provided inside the second insulating layer 42 located between the light emitting element 20 and the heat transfer member 110. The heat conductive member 60 is made of a heat conductive material such as copper (Cu), tungsten (W), molybdenum (Mo), silver (Ag), copper-tungsten (Cu-W), copper-molybdenum (Cu-Mo). It is formed in a predetermined shape. As shown in FIG. 6, the heat conducting member 60 of this example has a cross-sectional area that increases from the light emitting element 20 side toward the heat radiating member 100 side. By adopting such a shape, even with a relatively small heat conducting member 60, the heat generated by the light emitting element 20 can be efficiently transferred to the heat radiating member 100 side. The shape of the heat conducting member 60 may be determined in consideration of heat dissipation, and is not particularly limited. In the first modification, the second insulating layer 42 is interposed between the light emitting element 20 and the heat conducting member 60 and between the heat transfer member 110 and the heat conducting member 60. A structure in which at least one of the element 20 and the heat transfer member 110 is in direct contact with the heat conducting member 60 may be employed. Since the heat conducting member 60 and the light emitting element 20 or the heat transfer member 110 are in direct contact with each other, it is possible to dissipate heat more efficiently.

  Further, as in the second modified example shown in FIG. 7, the connection pad 70 is provided on the other main surface 11 b of the light irradiation device 2 corresponding to the light emitting element 20, and the connection pad 70 and the heat transfer member 110 are made of metal. The connection pad 70 and the heat transfer member 110 may be metal-bonded by the second bonding material 80. The second bonding material 80 may be a brazing material such as solder, or a gold-gold bonding using the connection pad 70 and the heat transfer member 110 as gold and the second bonding material 80 using gold. Any material and joining method may be used as long as they are metal joining. With such a structure, the heat transfer member 110 and the light irradiation device 2 are reliably joined, and the heat generated by the light emitting element 20 can be efficiently transmitted to the heat dissipation member 100.

Further, as in the third modification shown in FIG. 8, a flow path 100b through which the refrigerant can flow may be provided in the heat dissipation member 100 and in the vicinity of the through hole 100a. Although the layout of the flow path 100b is not particularly limited, it is preferably arranged over the entire heat radiation member 100, and the cooling efficiency of the central portion where the temperature of the light irradiation device 2 is relatively high is increased. Therefore, a design such as increasing the cross-sectional area of the flow path disposed in the center of the corresponding heat radiating member may be performed.

  The embodiment of the printing apparatus 200 is not limited to the above embodiment. For example, a so-called offset printing type printer that rotates a shaft-supported roller and conveys a recording medium along the roller surface may exhibit the same effect.

  In the above-described embodiment, an example in which the light irradiation module 1 is applied to the printing apparatus 200 using the inkjet head 220 is shown. The light irradiation module 1 cures, for example, a photocurable resin spin-coated on the surface of the object. It can also be applied to the curing of various types of photo-curing resins such as dedicated devices. Moreover, you may use the light irradiation module 1 for the irradiation light source etc. in an exposure apparatus, for example.

DESCRIPTION OF SYMBOLS 1 Light irradiation module 2 Light irradiation device 10 Board | substrate 11a One main surface 11b The other main surface 12 Opening part 13 Connection pad 14 Inner peripheral surface 15 1st bonding material 16 Optical lens 17 Lens adhesive 20 Light emitting element 21 Element substrate 22 Semiconductor layer 23, 24 Element electrode 30 Sealing material 40 Laminate body 41 First insulating layer 42 Second insulating layer 50 Electric wiring 60 Thermal conduction member 70 Bonding pad 80 Second bonding material 100 Heat radiation member 100a Through hole 100b Flow path DESCRIPTION OF SYMBOLS 110 Heat transfer member 120 Adhesive 200 Printing apparatus 210 Conveying means 211 Loading table 212 Conveying roller 220 Printing means 220a Discharge hole 230 Control mechanism 250

Claims (8)

A light irradiation device having a light emitting element disposed on one main surface of the substrate, and heat generated by driving the light irradiation device disposed on the other main surface side of the substrate in correspondence with the light irradiation device via an adhesive. And a flat plate-like heat radiating member for radiating heat,
The heat dissipating member includes a through hole disposed at a position corresponding to the light emitting element, and a heat transfer member inserted in the through hole and movable in the axial direction of the through hole.
The light irradiation module, wherein the heat transfer member is in contact with the other main surface of the substrate or bonded through the adhesive.   The light irradiation module according to claim 1, wherein the heat transfer member is a columnar member that is slidable in the through hole.   The light irradiation module according to claim 1, wherein the heat transfer member is a screw that is screwed into the through hole.   The light irradiation module according to any one of claims 1 to 3, wherein the substrate further includes a heat conductive member disposed in correspondence with the light emitting element.   The heat transfer member includes a metal as a main component, and the substrate further includes a metal-based bond pad disposed on the other main surface so as to correspond to the light emitting element. The light irradiation module according to claim 1, wherein the heat transfer member is metal-bonded.   The light irradiation module according to claim 5, wherein the bonding pad and the heat transfer member are metal-bonded via a bonding material containing metal as a main component.   The heat radiating member further includes a flow path, which is disposed in the vicinity of the through hole and through which a coolant for cooling the light irradiation device can flow. The light irradiation module of any one of these. Printing means for printing on a recording medium;
A printing apparatus comprising: the light irradiation module according to claim 1, which irradiates light on the printed recording medium.

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