US20170356640A1 - Illumination assembly including thermal energy management - Google Patents
Illumination assembly including thermal energy management Download PDFInfo
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- US20170356640A1 US20170356640A1 US15/178,869 US201615178869A US2017356640A1 US 20170356640 A1 US20170356640 A1 US 20170356640A1 US 201615178869 A US201615178869 A US 201615178869A US 2017356640 A1 US2017356640 A1 US 2017356640A1
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- conductors
- polymeric substrate
- heat spreader
- polymeric
- light source
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
- F21Y2115/15—Organic light-emitting diodes [OLED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Definitions
- the present invention relates to illumination assemblies, and more particularly to illumination assemblies that provide thermal energy management.
- Solid-state lighting such as those utilizing light emitting diodes (LEDs)
- LEDs light emitting diodes
- solid-state lighting design involves a balance of thermal, mechanical, optical, and electrical considerations. In particular, thermal considerations dictate the practical limits of many designs.
- an illumination assembly includes a polymeric substrate and a heat spreader supported by the substrate to provide electrical current and thermal energy management to solid-state lighting applications using LEDs.
- an illumination assembly includes a first polymeric substrate, an electrical circuit including two conductors supported by the first polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader supported by the substrate and thermally coupled to the LED.
- an illumination assembly in another embodiment, includes a first polymeric substrate, an electrical circuit including a first pair of conductors embedded within the first polymeric substrate and a second pair of conductors printed on the first polymeric substrate, an LED electrically coupled to the second pair of conductors, and a heat spreader supported by the substrate and thermally coupled to the LED.
- a method of forming an illumination assembly comprises: (1) forming a polymeric substrate having opposing first and second sides, (2) forming an electrical circuit including two conductors supported on the first side of the polymeric substrate, (3) electrically coupling an LED with the two conductors, (4) thermally coupling a heat spreader with the LED, the heat spreader at least primarily disposed on the second side of the polymeric substrate, and (5) over-molding a first polymeric layer over at least portions of the LED, the two conductors, and the polymeric substrate.
- FIG. 1 is a perspective view of a cross-section of an illumination assembly according to a first embodiment of the invention.
- FIG. 2 is a schematic cross-sectional view of a portion of the illumination assembly of FIG. 1 according one embodiment of the invention.
- FIG. 3 is a schematic cross-sectional view of a portion of the illumination assembly of FIG. 1 according one embodiment of the invention.
- FIG. 4 illustrates a process for forming an illumination assembly according to another embodiment the invention.
- FIG. 5 is a perspective view of an illumination assembly according to another embodiment of the invention.
- FIG. 6 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention.
- FIG. 7 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention.
- FIG. 8 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention.
- FIG. 9 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention.
- FIG. 10 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention.
- FIG. 11 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention.
- the illumination assembly 10 can include an electrical circuit 11 comprising a plurality of circuit traces which include at least two conductors 12 a - b for providing electrical current to connected components and at least one heat spreader 14 for dissipating thermal energy (i.e. heat) generated by an electrical component.
- the conductors 12 a - b can be supported by a polymeric substrate 16 made of a first polymeric material. In the present example in which the conductors 12 a - b are at least partially embedded within the polymeric substrate 16 , the conductors 12 a - b can also be referred to as embedded conductors.
- the electrical circuit 11 can also include a plurality of circuit traces which include printed conductors 18 a - d (see also FIG. 2 ) which are also supported by the polymeric substrate 16 by printing the conductors 18 a - d on an interior surface 20 of the polymeric substrate 16 .
- the illumination assembly 10 can also include a light source 22 , such as a light emitting diode (LED), and additional electrical components 24 - 26 , non-limiting examples of which include a resister, diode, capacitor, conductor, another LED, or any other suitable electrical components.
- LED light emitting diode
- At least a portion of the printed conductors 18 a - d , LED 22 , and electrical components 24 - 26 can be covered by and/or embedded within a first polymeric layer 28 made of a second polymeric material.
- the polymeric substrate 16 can form a first housing portion and the first polymeric layer 28 can form a second housing portion, with the first and second housing portions 16 and 28 encompassing the elements of the electrical circuit 11 .
- the first polymeric layer 28 can include a lens portion 30 adjacent the LED 22 for directing light emitted by the LED 22 .
- the polymeric substrate 16 and/or the first polymeric layer 28 can be formed to include additional structures, non-limiting examples of which include a connector portion 32 , a light blocking feature 34 , and attachment apertures 36 .
- the polymeric substrate 16 and the first polymeric layer 28 can be made from the same or different material. Both the polymeric substrate 16 and the first polymeric layer 28 can be made from an electrically insulating material that can optionally be thermally conductive. Non-limiting examples of materials suitable for the polymeric substrate 16 and/or the first polymeric layer 28 include acrylics, polycarbonates, silicones, polyethylene terephthalate, acrylonitrile butadiene styrene (ABS), polybutylene terephthalate (PBT) based materials, and combinations thereof.
- the polymeric substrate 16 and the first polymeric layer 28 can be made from the same or different materials.
- the first polymeric layer 28 can be made of a transparent moldable material, non-limiting examples of which include acrylics, polycarbonates, silicones, and ABS based materials.
- the electrical circuit 11 includes at least one pair of embedded conductors 12 a - b that are at least partially embedded within the polymeric substrate 16 as well as printed conductors 18 that are printed onto the interior surface 20 of the polymeric substrate 16 .
- the embedded conductors 12 a - b can be made from a single sheet of metal that is cut to isolate various components of the circuit 11 as desired or each trace of the electrical circuit 11 can be independently formed and electrically coupled or isolated as desired depending on the design of the circuit.
- the embedded conductors 12 a - b can be made from metals such as plated steel, brass, copper, or other materials known in the art.
- One or more of the printed conductors 18 a - d can be electrically coupled with the electrical circuit 11 through at least one pair of embedded conductors (such as illustrated in FIG. 5 ) for receiving electrical current from a suitable current source (not shown) coupled with the electrical circuit 11 through the connector portion 32 .
- the printed conductors 18 a - d can be printed using conductive inks, non-limiting examples of which include inks containing graphine or metallic nanoparticles, such as copper nanoparticle-based inks. Examples of commercially available inks include DuPont 5025, PE825, and 5043, all of which are a silver composite conductor ink available from DuPont®, and the ElectrodagTM family of conductive inks available from Henkel.
- the printed conductors 18 a - d can be directly printed onto exposed terminals of embedded conductors of the electrical circuit 11 to electrically couple the printed conductors 18 a - d to the conductors.
- the printed conductors 18 a - b can be coupled to the embedded conductors of the electrical circuit 11 by a solder joint or a conductive epoxy joint.
- the printed conductors 18 a - d can be printed and cured using any suitable technique, non-limiting examples of which include silk screen, stencil, laser sinter, laser etch, chemical etch, and additive printing.
- the LED 22 can be electrically coupled with the printed conductors 18 c - d for receiving electrical current and thermally coupled with the heat spreader 14 for dissipating heat generated by the LED 22 .
- the printed conductors 18 c - d each include terminals 50 and 52 to which the LED 22 can be electrically coupled to allow current to flow through the LED 22 .
- the LED 22 includes connectors 54 and 56 which can be electrically coupled to the adjacent terminals 50 and 52 , respectively.
- the LED connectors 54 and 56 can be in the form of leads that can be coupled with the adjacent terminals 50 and 52 through soldering.
- the LED 22 can be coupled with the terminals 50 and 52 using a conductive epoxy, such as an epoxy doped with silver fragments or particles and/or other conductive metals.
- a conductive epoxy such as an epoxy doped with silver fragments or particles and/or other conductive metals.
- An example of a suitable material includes a heat-bondable, electrically conductive adhesive film, such as Anisotropic Conductive Film 7376 - 10 , available from 3MTM.
- the LED 22 can span a gap 58 between the printed conductors 18 c and 18 d .
- the heat spreader 14 can be thermally coupled with the LED 22 in the gap 58 for dissipating heat generated by the LED 22 .
- the LED 22 can include a heat conducting component 59 , such as a metal plate, joined with or at least partially embedded within the body of the LED 22 component.
- the heat spreader 14 can include an exposed portion 60 that extends beyond the interior surface 20 of the polymeric substrate 16 for direct contact with the metal plate 59 of the LED 22 and an unexposed portion 62 that does not extend beyond the interior surface 20 .
- the heat spreader 14 can be configured such that a majority of the heat spreader 14 does not extend beyond the interior surface 20 and thus the heat spreader 14 can be considered as being predominately disposed exteriorly of the interior surface 20 .
- the unexposed portion 62 can be completely embedded within the polymeric substrate 16 (as shown) or, alternatively, the unexposed portion 62 can extend beyond an exterior surface 64 of the polymeric substrate 16 .
- An additive, such as solder, a thermally conductive epoxy, grease, or other coating can optionally be provided between the exposed portion 60 of the heat spreader 14 and the metal plate 59 to facilitate securing the LED 22 in place and/or to facilitate thermal contact between the LED 22 and the heat spreader 14 .
- the heat spreader 14 is illustrated as having a generally arched-shaped cross-section, it will be understood that the heat spreader 14 can have a variety of different cross-sectional shapes depending on the design of the illumination assembly.
- the heat spreader 14 can be a material having a non-uniform thickness rather than the arched-shape cross-sectional shape illustrated in FIG. 2 .
- the heat spreader 14 does not include a portion that extends beyond the interior surface 20 and thus the heat spreader 14 can be considered as being entirely disposed exteriorly of the interior surface 20 .
- the heat spreader 14 is not in direct contact with the LED 22 , but can be thermally coupled to the LED 22 through the polymeric substrate 16 , which can be made from a thermally conductive and electrically insulating material. Heat generated by the LED 22 transferred to the conductors 18 c - d can also be dissipated by the heat spreader 14 through the polymeric substrate 16 .
- the metal plate 59 of the LED 22 can be configured to be in thermal contact with the polymeric substrate 16 to facilitate heat transfer from the LED 22 to the heat spreader 14 .
- the heat spreader 14 is illustrated as being embedded within the polymeric substrate 16 , the heat spreader 14 can also include a portion that extends beyond the exterior surface 64 of the polymeric substrate 16 to increase the surface area of the heat spreader 14 and increase the amount of heat dissipated.
- the additional electrical components 24 - 26 can be electrically coupled with the printed conductors 18 a - b (e.g. electrical component 24 ) or with the embedded conductors 12 a - b (e.g. electrical component 26 ).
- the embedded conductors 12 a - b and the heat spreader 14 can include exposed portions on the interior surface 20 of the polymeric substrate 16 for coupling with an electrical component, as illustrated in FIGS. 1-2 .
- the embedded conductors 12 a - b and/or heat spreader 14 can be completely encapsulated within the polymeric substrate 16 and an additional component coupled with the embedded conductors 12 a - b and/or heat spreader 14 can project from the interior surface 20 of the polymeric substrate 16 for coupling the electrical component with the embedded conductors 12 a - b and/or heat spreader 14 .
- the polymeric substrate 16 and first polymeric layer 28 can be the same or different and are preferably made from a non-conducting polymeric material that can be molded around the components of the illumination assembly 10 .
- the polymeric substrate 16 and first polymeric layer 28 can be molded around the components of the illumination assembly 10 according to any known method, examples of which are disclosed in U.S. Pat. No. 7,909,482 to Veenstra et al., entitled “Electrical Device Having Boardless Electrical Component Mounting Arrangement,” issued Mar. 22, 2011, which is incorporated herein by reference in its entirety.
- FIG. 4 illustrates an exemplary method 100 for forming the illumination assembly 10 according to a two-shot molding process similar to that which is disclosed in U.S. Pat. No. 7,909,482 to Veenstra et al.
- the method 100 can begin at 102 with forming a metal web that includes at least two conductive circuit elements which will form the basis for the embedded conductors 12 a - b .
- the at least two conductive circuit elements can be made from cutting, bending, and/or stamping a metal sheet to form the metal web having the desired conductors 12 a - b.
- the heat spreader 14 can be positioned adjacent the metal web in a position corresponding to where the LED 22 will be located.
- the heat spreader 14 can be a thermally conductive component that can be made from the same material as the metal web at 102 or a different material.
- the heat spreader 14 is a portion of the metal web that is electrically isolated from current flow through the web.
- the thus assembled web, electrical components, and heat spreader 14 form a circuit pre-form that can be placed within a cavity of a tooling mold having a shape corresponding to the first housing portion that is formed by the polymeric substrate 16 at 108 . While the heat spreader 14 is described as being placed in the mold cavity at the same time as the assembled web, it is also within the scope of the invention for the heat spreader 14 to be a separate element that is placed in the mold cavity before or after the assembled web.
- the first polymeric material is provided in molten form to the mold cavity at 110 in a first molding shot to form the polymeric substrate 16 in which the web, electrical components, and heat spreader 14 are at least partially embedded.
- the mold can be configured to leave at least a portion of the heat spreader 14 exposed on the interior surface 20 of the polymeric substrate 16 , as illustrated in FIG. 2 , or the mold can be figured such that no portion of the heat spreader 14 extends beyond the interior surface 20 , as illustrated in FIG. 3 . Additional portions of the web can also be left exposed as needed for coupling additional electrical components with the web after the first molding shot.
- the printed conductors 18 a - d can be printed onto the interior surface 20 of the polymeric substrate 16 adjacent the heat spreader 14 .
- the conductors 18 a - d can be printed using a printer with a print head with X-Y motion control relative to the polymeric substrate 16 according to an additive screen printing process.
- the LED 22 can be electrically coupled to the printed conductors 18 c - d and thermally coupled with the heat spreader 14 in the manner described above in FIGS. 2 and 3 .
- Additional electrical components 24 can be electrically coupled with the printed conductors 18 a - b as desired to form the completed electrical circuit.
- the completed electrical circuit can be placed within a second mold cavity having a shape corresponding to the second housing portion that is formed by the first polymeric layer 28 .
- the second polymeric material can be provided in molten form to at least partially embed/cover the LED 22 , electrical components 24 , 26 , and printed conductors 18 a - d within the first polymeric layers 28 in a second molding shot.
- the second polymeric material can be the same or different than the first polymeric material in the first molding shot at 110 .
- the second polymeric material can be a material that allows at least a portion of the light emitted from the LED 22 to travel through the second polymeric material to an exterior of the illumination assembly 10 for providing illumination.
- the second polymeric material can be transparent, translucent and/or colored to provide the emitted light with the desired characteristics.
- the method 100 can include an optional additional step 116 for forming the lens portion 30 above the LED 22 .
- the lens portion 30 can be formed in a third molding shot using a third polymeric material that is different from the second polymeric material to provide the desired light emitting characteristics.
- the formation of the lens portion 30 can include treating the polymeric material molded over the LED 22 to provide the desired light emitting characteristics.
- the polymeric material molded over the LED 22 can include a three-dimensional shape and/or texture configured to control the distribution of light emitted through the lens portion 30 .
- the lens portion 30 can be made from any suitable transparent material, non-limiting examples of which include acrylics, polycarbonates, silicones, and ABS based materials.
- the second molding shot at 114 may include leaving an opening in the first polymeric layer 28 in the area above the LED 22 to allow at least a portion of the light emitted by the LED 22 to escape from the lighting assembly 10 unimpeded by the first polymeric layer 28 .
- the lighting assembly 10 can be coupled with a device, such as a vehicle tail light, which includes a component that can operate as a lens for the light emitted by the LED 22 .
- each of the polymeric substrate 16 and the first polymeric layer 28 are described as being formed in a single shot, it is within the scope of the invention that one or more shots may be used to form the polymeric substrate 16 and/or the first polymeric layer 28 .
- each of the steps of the method 100 can be modified depending on the manner in which the electrical circuit 11 , electrical components 22 - 26 , and heat spreader 14 are configured.
- the heat spreader 14 can be assembled with the electrical circuit 11 during the second molding shot at 114 instead of the first molding shot at 110 .
- the first molding shot at 110 can be used to form the polymeric substrate 16 for supporting conductors that are either set down or printed onto the polymeric substrate 16 .
- the illumination assembly 10 can be coupled with a suitable power source through the connector portion 32 to supply electrical current to the electrical circuit 11 .
- Electrical current can flow through the embedded conductors 12 a - b and the printed conductors 18 a - d to provide power to the various electrical components 24 - 26 , including the LED 22 .
- Thermal energy generated by the LED 22 during operation of the LED 22 can be dissipated through the heat spreader 14 , either directly, or through the polymeric substrate 16 .
- the illumination assembly 10 can provide a multi-layer assembly which layers a heat spreader, a non-conductive polymeric material, electrical conductors, and an LED to facilitate thermal energy management. Improved heat management can facilitate forming illumination assemblies having more advanced electronic functionality and higher power levels that do not overheat during use. Generally, an LED is considered high power if it operates at 350 mA or more and consumes greater than 1 watt. For example, improved heat management can allow for the use of thinner polymeric layers forming the polymeric substrate 16 and the first polymeric layer 28 while still enabling advanced circuit functions and high power LEDs without overheating. Decreasing thickness of the polymeric substrate 16 and/or the first polymeric layer 28 can save on material costs and increase flexibility in satisfying the desired form factor of the lighting assembly 10 based on its intended end use.
- the first polymeric layer 28 can provide a mechanical seal for holding elements of the lighting assembly 10 in place and optionally provide a moisture seal to protect the electronics from moisture damage.
- the materials for the polymeric substrate 16 and the first polymeric layer 28 can be selected such that the first polymeric layer 28 is bonded to the exposed surfaces of the polymeric substrate 16 during the molding process.
- the bonded first polymeric layer 28 can facilitate securing the LED 22 and other electrical components 24 , 26 in place, which can decrease the likelihood of these components becoming dislodged and losing their connection to the electrical circuit 11 and/or the heat spreader 14 .
- the bonded first polymeric layer 28 may also facilitate securing the connection between the printed conductors 18 and the embedded conductors 12 .
- the bonded first polymeric layer 28 can also inhibit moisture from infiltrating the circuit and potentially electrically shorting the connection between the electrical components 22 - 26 and the conductors 12 , 18 and between the printed and embedded conductors 12 and 18 .
- FIG. 5 illustrates an example of a lighting assembly 210 that is similar to the lighting assembly 10 except for the configuration of the electrical circuit. Therefore, elements of the lighting assembly 210 similar to those of the lighting assembly 10 are labeled with the prefix 200 .
- the illumination assembly 210 is shown without the first polymeric layer 228 for clarity.
- the polymeric substrate 216 extends in multiple dimensions and includes a connector portion 232 for connecting the illumination assembly 210 to a suitable power source.
- the electrical circuit 211 includes a combination of multiple conductors 212 a - f embedded within the polymeric substrate 216 and multiple printed conductors 218 a - d printed onto the interior surface 220 of the polymeric substrate 216 .
- the printed conductors 218 a - d can be connected to one or more embedded conductors, such as embedded conductors 212 a - b , to provide current flow to the printed conductors 218 a - d.
- the electrical circuit 211 also includes multiple electrical components 222 - 226 connected to the embedded conductors 212 a - f or the printed conductors 218 a - d .
- LEDs 222 a - b can be connected to embedded conductors 212 c - d and 212 e - f and an additional LED 222 c can be connected to printed conductors 218 c - d .
- a heat spreader (not shown) can be thermally coupled to one or more of these LEDs 222 a - c as needed in a manner similar to that discussed above with respect to FIGS. 2 and 3 .
- Additional electrical components, such as electrical components 224 and 226 can be connected to other printed conductors or embedded conductors based on the design of the circuit.
- the embedded and printed conductors 212 and 218 extend across multiple planes of the multi-planar polymeric substrate 216 and thus the illumination assembly 210 can emit light in multiple directions by providing the LEDs 222 in different planes.
- the printed conductors 218 can be printed with narrower widths and higher densities than the embedded conductors 212 and thus facilitate increasing the complexity of the circuit by increasing connector densities and/or decreasing the size of the circuit needed to support the desired electrical components.
- the larger embedded conductors 212 can be used as needed based on the power requirements of the electrical components connected to the embedded conductors 212 .
- the printed conductors 218 are typically more expensive than the embedded conductors 212 and thus the embedded conductors 212 can be used where feasible to decrease costs compared to a circuit made predominately of printed conductors.
- FIG. 6 illustrates an example of a lighting assembly 310 that is similar to the lighting assembly 10 except for the configuration of the electrical circuit and the polymeric substrate. Therefore, elements of the lighting assembly 310 similar to those of the lighting assembly 10 are labeled with the prefix 300 .
- FIG. 6 illustrates a portion of the lighting assembly 310 that includes a single LED; however, the lighting assembly 310 can be part of a more complex lighting assembly that includes a larger electrical circuit and multiple components, such as that shown in FIG. 1 or FIG. 5 , for example.
- the polymeric substrate 316 can be in the form of a film or a layer of molded polymeric material that is thermally conductive and electrically insulating. Generally, the thinner the polymeric substrate 316 , the more efficient the heat transfer is to the adjacent heat spreader 314 . Additional factors, such as the form factor of the device in which the lighting assembly 310 is to be used and/or manufacturing limitations may also effect the thickness of the polymeric substrate 316 .
- the conductors 312 a - b can be printed onto the polymeric substrate 316 in a manner similar to that described above with respect to the printed conductors 18 of the illumination assembly 10 .
- the conductors 312 a - b can be non-printed conductors that are supported by the polymeric substrate 316 by lying on the interior surface 320 or being at least partially embedded within the polymeric substrate 316 .
- the conductors 312 a - b can be formed using a metal web as described above for the method 100 of FIG. 4 .
- the supported conductors 312 a - b can be partially embedded within the polymeric substrate 316 or be supported by the interior surface 320 such that the conductors 312 a - b are predominately disposed on the interior side of the polymeric substrate 316 .
- the LED 322 can be electrically coupled to the conductors 312 a - b in a manner similar to that described above with respect to the illumination assembly 10 of FIG. 1 , such as through soldering or a conductive epoxy.
- the heat spreader 314 can be disposed adjacent the LED 322 for dissipating heat generated by the LED. In the embodiment of FIG. 6 , the heat spreader 314 is not in direct contact with the LED 322 and is located entirely exteriorly of the interior surface 320 of the polymeric substrate 316 . Heat generated by the LED 322 is transferred through the conductors 312 a - b , through the polymeric substrate 316 , and to the heat spreader 314 .
- the first polymeric layer 328 can be molded around the LED 322 , the conductors 312 a - b , the polymeric substrate 316 , and the heat spreader 314 to secure these elements of the lighting assembly 310 together without the use of mechanical fasteners.
- the molded first polymeric layer 328 can also provide a moisture seal to inhibit moisture from interfering with the electrical connections between the LED 322 and the conductors 312 a - b .
- the first polymeric layer 328 can be molded around only a portion of the heat spreader 314 , as illustrated, such that portions of the heat spreader 314 can be exposed to atmosphere or an adjacent component in the end use device to facilitate heat dissipation.
- first polymeric layer 328 could optionally be molded around the entire heat spreader 314 .
- the first polymer layer 328 can be molded at least partially around the heat spreader 314 such that the first polymer layer 328 secures the heat spreader 314 in place and/or an adhesive can be used to secure the heat spreader 314 in place relative to the LED 322 .
- the lighting assembly 310 can be part of a more complex and multi-dimensional circuit that includes multiple electrical components.
- Individual heat spreaders 314 can be provided adjacent each LED or other electrical component, as needed, to dissipate heat, including components positioned in different planes. This allows for the location and/or the size of the heat spreader to be customized for each LED or other electrical component and facilitates forming lighting assemblies that satisfy more complex form factors.
- the lighting assembly 310 can be part of a multi-component and multi-dimensional assembly, similar to those illustrated in FIGS. 1 and 4 .
- the lighting assembly 310 can be used with an electrical circuit that includes conductors supported by the polymeric substrate 316 in the same manner as the conductors 312 a - b or a combination of different types of conductors, including embedded and/or printed conductors.
- FIG. 7 illustrates a lighting assembly 410 similar to that of the lighting assembly 310 except for differences in the electrical circuit and the first polymeric layer. Elements of the lighting assembly 410 similar to those of the lighting assembly 310 are labeled with the prefix 400 .
- the electrical circuit 411 can include conductors 412 a - b supported on the interior surface 420 of the polymeric substrate 416 as well as printed conductors 418 a - b that are printed onto the interior surface 420 .
- the LED 422 can be electrically connected to the conductors 412 a - b and thermally coupled to the heat spreader 422 .
- An additional electrical component 424 can be connected to the printed conductors 418 a - b.
- the polymeric substrate 416 can be in the form of a film or a layer of molded polymeric material having a desired thickness.
- the first polymeric layer 418 can be molded around the LED 422 , the conductors 412 a - b , the conductors 418 a - b , the polymeric substrate 416 , and the heat spreader 414 to secure these elements of the lighting assembly 410 together without the use of mechanical fasteners and to optionally provide a moisture seal to inhibit moisture from interfering with the electrical connections in the circuit 411 .
- the size and the location of the heat spreader 414 can be configured to accommodate only the LED 422 rather than both the LED 422 and the electrical component 424 . Customizing the size and the location of the heat spreader 414 based on the heat dissipation needs of the circuit can decrease the parts and materials used in the lighting assembly 411 and facilitate designing lighting assemblies that are multi-dimensional.
- FIG. 8 illustrates another example of a lighting assembly 510 that is similar to the lighting assemblies 310 and 410 except for differences in the electrical circuit, the heat spreader, and the first polymeric layer. Elements of the lighting assembly 510 similar to those of the lighting assembly 310 and 410 are labeled with the prefix 500 .
- the lighting assembly 510 includes embedded conductors 512 a - b , printed conductors 518 a - b , an LED 522 electrically coupled to the embedded conductors 512 a - b , and an additional electrical component 524 electrically coupled to the printed conductors 518 a - b .
- the first polymeric layer 528 can be molded around the LED 522 , the conductors 512 a - b , the polymeric substrate 516 , the electrical component 524 , and the printed conductors 518 a - b to secure these elements together and optionally inhibit moisture from contacting the circuit.
- the heat spreader 514 in this example is a separate component that is not coupled with the other components of the assembly 510 by the over-molded first polymeric layer 528 .
- the heat spreader 514 can be secured adjacent the exterior surface 564 of the polymeric substrate 516 using an adhesive or mechanical fasteners.
- the heat spreader 514 can be part of the end use device to which the lighting assembly 510 is intended for use and coupling the lighting assembly 510 with the end use device also couples the heat spreader 514 to the lighting assembly 510 .
- the heat spreader 514 could be a thermally conductive part of a lamp which is intended for use with the lighting assembly 510 .
- This configuration can provide a heat spreader having a large surface to facilitate heat dissipation and can also simplify manufacturing of the lighting assembly 510 . It is also within the scope of the invention for the first polymeric layer 528 to be over-molded around the heat spreader 514 to secure the heat spreader 514 in place in a manner similar to that described above for the lighting assembly 310 and 410 .
- FIG. 9 illustrates another example of a lighting assembly 610 that is similar to the lighting assembly 10 except for differences in the electrical circuit, the heat spreader, and the first polymeric layer. Elements of the lighting assembly 610 similar to those of the lighting assembly 10 are labeled with the prefix 600 .
- FIG. 9 illustrates a portion of the lighting assembly 610 that includes a single LED; however, the lighting assembly 610 can be part of a more complex lighting assembly that includes a larger electrical circuit and multiple components, such as that shown in FIG. 1 or FIG. 5 , for example.
- the lighting assembly 610 includes a polymeric substrate 616 in the form of a thin film or sheet of polymeric material. Multiple conductors 618 a - c can be printed onto the interior surface 620 of the polymeric substrate 616 for supplying electrical current to the LED 622 .
- the polymeric substrate 616 can include an aperture 668 adjacent the LED 622 through which a thermal management device 670 extends to thermally couple the LED 622 with the heat spreader 614 disposed on the exterior side 664 of the polymeric substrate 616 .
- the thermal management device 670 can be a separate component or can be integrally formed with the heat spreader 614 .
- the heat spreader 614 can be a molded aluminum or copper heat sink that includes a raised portion forming the thermal management device 670 that is configured to extend through the aperture 668 to thermally couple the LED 622 with the heat spreader 614 .
- the polymeric substrate 616 can be made of a non-conductive material according to any known film-forming process.
- the polymeric substrate 616 can be pre-formed, with or without the aperture 668 , or formed in-line with one or more components of the lighting assembly 610 .
- the conductors 618 a - c can be printed onto the pre-formed polymeric substrate 616
- the thermal management device 670 and the heat spreader 614 can be assembled with the polymeric substrate
- the LED 622 can be electrically coupled to the conductors 618 a - c .
- the polymeric substrate 616 can be formed around the assembled thermal management device 670 and heat spreader 614 .
- FIG. 10 illustrates another example of a lighting assembly 710 that is similar to the lighting assembly 310 of FIG. 6 except for differences in the heat spreader, the polymeric substrate, and the first polymeric layer. Elements of the lighting assembly 710 similar to those of the lighting assembly 310 are labeled with the prefix 700 .
- FIG. 10 illustrates a portion of the lighting assembly 710 that includes a single LED; however, the lighting assembly 710 can be part of a more complex lighting assembly that includes a larger electrical circuit and multiple components, such as that shown in FIG. 1 or FIG. 5 , for example.
- the lighting assembly 710 of FIG. 10 includes a thermal interface layer 780 thermally coupling the heat spreader 714 and the LED 722 that is not a molded polymeric substrate material.
- the thermal interface layer can be a thermal interface material (TIM) that is thermally conductive, but electrically insulating.
- suitable thermal interface materials include copper, aluminum, or ceramic impregnated epoxies or silicones, graphine, carbon nanotubes, nano-glue, ceramic coated copper, ceramic coated aluminum, and oxidized aluminum.
- the thermal interface layer 780 can be applied at least to an interior surface of the heat spreader 714 adjacent the LED 722 in the assembled lighting assembly 710 and can be a separate layer or a layer that is integrally formed with the heat spreader 714 .
- the thermal interface layer 780 can be formed by oxidizing the interior surface of an aluminum heat spreader 714 .
- the first polymeric layer 728 and/or the heat spreader 714 can provide the support structure for the electrical circuit 711 in the absence of a separate polymeric substrate layer (such as the polymeric substrate 316 of FIG. 6 ).
- the first polymeric layer 728 can function as both the over-molded polymeric layer that provides a mechanical seal for holding elements of the lighting assembly 710 together as well as provide a substrate for supporting elements of the electrical circuit 711 .
- the heat spreader 714 can optionally provide additional structural support to one or more components of the electrical circuit 711 . In this manner, the lighting assembly 710 can be formed from a single-shot molding process, rather than a multiple-shot molding process.
- the lighting assembly can include both a thermal interface layer and a polymeric substrate layer.
- FIG. 11 illustrates another example of a lighting assembly 810 that is similar to the lighting assembly 410 of FIG. 7 and 710 of FIG. 10 except for differences in the electrical circuit, heat spreader, thermal interface layer, and the first polymeric layer. Elements of the lighting assembly 810 similar to those of the lighting assemblies 410 and 710 are labeled with the prefix 800 .
- FIG. 11 illustrates a portion of the lighting assembly 810 that includes a single LED; however, the lighting assembly 810 can be part of a more complex lighting assembly that includes a larger electrical circuit and multiple components, such as that shown in FIG. 1 or FIG. 5 , for example.
- the polymeric substrate 816 can include an opening 882 adjacent the heat spreader 814 and the LED 822 in the assembled lighting assembly 810 .
- the thermal interface layer 880 can be provided within the opening 882 to thermally couple the LED 822 and the heat spreader 814 .
- the polymeric substrate 816 can provide structural support for the electrical circuit 811 in a manner similar to that described above for previous embodiments while the thermal interface layer 880 facilitates heat transfer between the LED 822 and the heat spreader 814 .
- any of the lighting assemblies 10 , 210 , 310 , 410 , and 510 described herein can be made in a single-shot molding process without a separate polymeric substrate and including a thermal interface layer for thermally coupling the heat spreader and the electrical component in a manner similar to that described above for the lighting assembly 710 of FIG. 10 .
- any of the lighting assemblies 10 , 210 , 310 , 410 , and 510 described herein can include a polymeric substrate made according to a multiple-shot molding process, in addition to a thermal interface layer for thermally coupling the heat spreader and the electrical component in a manner similar to that described above for the lighting assembly 810 of FIG. 11 .
- the lighting assemblies described herein can address several challenges related to solid-state lighting applications using LEDs.
- the lighting assemblies described herein integrate the electrical circuit with a polymeric substrate that can be formed or molded into a desired three-dimensional shape.
- the heat spreader can also be integrated into the lighting assembly by embedding the heat spreader within the polymeric substrate and/or molding the first polymeric layer around the heat spreader. Integration of the electrical circuit and/or the heat spreader can also decrease labor and manufacturing costs compared to designs which utilize multiple separate components and sub-components.
- integrating the electrical circuit and/or the heat spreader into the polymeric substrate or the first polymeric layer that can be formed or molded into complex and three-dimensional shapes increases the ability to satisfy end use applications requiring complex form factors.
- the ability to place LEDs in different planes can be used to aim light in a desired direction, which can increase efficiency of the end use device.
- a ceiling light that produces an isotropic radiation pattern of light tends to create a hot spot of light directly below it.
- the light bulb in the ceiling light can be replaced with the lighting assembly as described herein which includes multiple LEDs aimed so as to generate a non-isotropic radiation pattern that can create a more uniform distribution of light across the floor. The more uniformly distributed light may appear brighter to the viewer, even if the total light output from the ceiling light is the same.
- the ability to control light patterns could be leveraged to produce lighting products that meet performance specifications while requiring less light, and thus less power.
- a traditional lighting assembly typically includes a printed circuit board and would require multiple boards and circuit jumpers in order to achieve multi-directional lighting where the electronics conform to the form factor of the end use device. Such a device would be limited in terms of the size and complexity of the multi-dimensional shape of the lighting assembly.
- Printed conductors can be used in order to achieve a circuit that can better conform to the contour of the end use device. However, printed conductors can only deliver a small amount of electrical power and dissipate a small amount of heat energy and thus a construction that includes only printed conductors is generally not able to sustain the power levels necessary for achieving general lighting functionality.
- Providing the circuit with a sheet metal only construction can improve the form factor and power handling capacity compared to a device that uses only printed conductors; however the traces are generally too big to support the electronics necessary to achieve the advanced electronic functionality required in more complex lighting designs.
- the lighting assemblies described herein utilize conductors supported by the polymeric substrate in a combination of different ways, such as printing and embedding, in order to provide a circuit that satisfies the electrical current needs of the components as well as component density needs.
- the combination of more traditional types of conductors with printed conductors can save on materials costs by only utilizing the printed conductors where needed.
- the number, size, and location of the heat spreaders can also be customized based on the design of the lighting assembly. Utilizing heat spreaders only where needed can save on materials and manufacturing costs, as well as facilitate satisfying complex three-dimensional form factor requirements.
- the use of heat spreaders with the polymeric substrate and the supported conductors can improve heat management of the assembly, thus allowing more complex and higher current lighting designs.
- the various features of the different embodiments of the illumination assemblies 10 , 210 , 310 , 410 , 510 , 610 , 710 , and 810 may be mixed and matched as desired to form new embodiments, whether or not the new embodiments are expressly disclosed.
- the disclosed embodiment includes a plurality of features that are described in concert and that might cooperatively provide a collection of benefits.
- the present invention is not limited to only those embodiments that include all of these features or that provide all of the stated benefits.
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Abstract
Description
- This invention was made with government support under Contract No. DE-SC0011865 awarded by the U.S. Department of Energy. The government has certain rights in the invention.
- The present invention relates to illumination assemblies, and more particularly to illumination assemblies that provide thermal energy management.
- Solid-state lighting, such as those utilizing light emitting diodes (LEDs), has been adopted for widespread applications. However, solid-state lighting design involves a balance of thermal, mechanical, optical, and electrical considerations. In particular, thermal considerations dictate the practical limits of many designs.
- In solid-state lighting, electronics are assembled on a printed circuit board, which allows component design only in two dimensions. This limitation is generally acceptable where there is a high demand for densely populated components and low demand for populating those components throughout a three-dimensional form factor. In contrast, in LED applications, the demand for high component density is lower, but the need to accommodate complex and three-dimensional form factors is higher.
- Unfortunately, existing technologies do not permit three-dimensional form factors in desired balances with other considerations.
- The aforementioned problems are overcome in the present invention in which an illumination assembly includes a polymeric substrate and a heat spreader supported by the substrate to provide electrical current and thermal energy management to solid-state lighting applications using LEDs.
- According to one embodiment, an illumination assembly includes a first polymeric substrate, an electrical circuit including two conductors supported by the first polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader supported by the substrate and thermally coupled to the LED.
- In another embodiment, an illumination assembly includes a first polymeric substrate, an electrical circuit including a first pair of conductors embedded within the first polymeric substrate and a second pair of conductors printed on the first polymeric substrate, an LED electrically coupled to the second pair of conductors, and a heat spreader supported by the substrate and thermally coupled to the LED.
- In yet another embodiment, a method of forming an illumination assembly comprises: (1) forming a polymeric substrate having opposing first and second sides, (2) forming an electrical circuit including two conductors supported on the first side of the polymeric substrate, (3) electrically coupling an LED with the two conductors, (4) thermally coupling a heat spreader with the LED, the heat spreader at least primarily disposed on the second side of the polymeric substrate, and (5) over-molding a first polymeric layer over at least portions of the LED, the two conductors, and the polymeric substrate.
- These and other advantages and features of the invention will be more fully understood and appreciated by reference to the description of the current embodiments and the drawings.
-
FIG. 1 is a perspective view of a cross-section of an illumination assembly according to a first embodiment of the invention. -
FIG. 2 is a schematic cross-sectional view of a portion of the illumination assembly ofFIG. 1 according one embodiment of the invention. -
FIG. 3 is a schematic cross-sectional view of a portion of the illumination assembly ofFIG. 1 according one embodiment of the invention. -
FIG. 4 illustrates a process for forming an illumination assembly according to another embodiment the invention. -
FIG. 5 is a perspective view of an illumination assembly according to another embodiment of the invention. -
FIG. 6 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention. -
FIG. 7 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention. -
FIG. 8 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention. -
FIG. 9 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention. -
FIG. 10 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention. -
FIG. 11 is a cross-sectional view of a portion of an illumination assembly according to another embodiment of the invention. - With reference to
FIG. 1 , anillumination assembly 10 is illustrated in accordance with a first embodiment of the invention. Theillumination assembly 10 can include anelectrical circuit 11 comprising a plurality of circuit traces which include at least two conductors 12 a-b for providing electrical current to connected components and at least oneheat spreader 14 for dissipating thermal energy (i.e. heat) generated by an electrical component. The conductors 12 a-b can be supported by apolymeric substrate 16 made of a first polymeric material. In the present example in which the conductors 12 a-b are at least partially embedded within thepolymeric substrate 16, the conductors 12 a-b can also be referred to as embedded conductors. Theelectrical circuit 11 can also include a plurality of circuit traces which include printed conductors 18 a-d (see alsoFIG. 2 ) which are also supported by thepolymeric substrate 16 by printing the conductors 18 a-d on aninterior surface 20 of thepolymeric substrate 16. Theillumination assembly 10 can also include alight source 22, such as a light emitting diode (LED), and additional electrical components 24-26, non-limiting examples of which include a resister, diode, capacitor, conductor, another LED, or any other suitable electrical components. - At least a portion of the printed conductors 18 a-d,
LED 22, and electrical components 24-26 can be covered by and/or embedded within a firstpolymeric layer 28 made of a second polymeric material. In this manner, thepolymeric substrate 16 can form a first housing portion and the firstpolymeric layer 28 can form a second housing portion, with the first andsecond housing portions electrical circuit 11. The firstpolymeric layer 28 can include alens portion 30 adjacent theLED 22 for directing light emitted by theLED 22. Thepolymeric substrate 16 and/or the firstpolymeric layer 28 can be formed to include additional structures, non-limiting examples of which include aconnector portion 32, alight blocking feature 34, and attachment apertures 36. Thepolymeric substrate 16 and the firstpolymeric layer 28 can be made from the same or different material. Both thepolymeric substrate 16 and the firstpolymeric layer 28 can be made from an electrically insulating material that can optionally be thermally conductive. Non-limiting examples of materials suitable for thepolymeric substrate 16 and/or the firstpolymeric layer 28 include acrylics, polycarbonates, silicones, polyethylene terephthalate, acrylonitrile butadiene styrene (ABS), polybutylene terephthalate (PBT) based materials, and combinations thereof. Thepolymeric substrate 16 and the firstpolymeric layer 28 can be made from the same or different materials. In one example, the firstpolymeric layer 28 can be made of a transparent moldable material, non-limiting examples of which include acrylics, polycarbonates, silicones, and ABS based materials. - In the embodiment of
FIG. 1 , theelectrical circuit 11 includes at least one pair of embedded conductors 12 a-b that are at least partially embedded within thepolymeric substrate 16 as well as printed conductors 18 that are printed onto theinterior surface 20 of thepolymeric substrate 16. In one example, the embedded conductors 12 a-b can be made from a single sheet of metal that is cut to isolate various components of thecircuit 11 as desired or each trace of theelectrical circuit 11 can be independently formed and electrically coupled or isolated as desired depending on the design of the circuit. The embedded conductors 12 a-b can be made from metals such as plated steel, brass, copper, or other materials known in the art. - One or more of the printed conductors 18 a-d can be electrically coupled with the
electrical circuit 11 through at least one pair of embedded conductors (such as illustrated inFIG. 5 ) for receiving electrical current from a suitable current source (not shown) coupled with theelectrical circuit 11 through theconnector portion 32. The printed conductors 18 a-d can be printed using conductive inks, non-limiting examples of which include inks containing graphine or metallic nanoparticles, such as copper nanoparticle-based inks. Examples of commercially available inks include DuPont 5025, PE825, and 5043, all of which are a silver composite conductor ink available from DuPont®, and the Electrodag™ family of conductive inks available from Henkel. The printed conductors 18 a-d can be directly printed onto exposed terminals of embedded conductors of theelectrical circuit 11 to electrically couple the printed conductors 18 a-d to the conductors. Alternatively, the printed conductors 18 a-b can be coupled to the embedded conductors of theelectrical circuit 11 by a solder joint or a conductive epoxy joint. The printed conductors 18 a-d can be printed and cured using any suitable technique, non-limiting examples of which include silk screen, stencil, laser sinter, laser etch, chemical etch, and additive printing. - Referring now to
FIG. 2 , theLED 22 can be electrically coupled with the printedconductors 18 c-d for receiving electrical current and thermally coupled with theheat spreader 14 for dissipating heat generated by theLED 22. As shown schematically inFIG. 2 , the printedconductors 18 c-d each includeterminals LED 22 can be electrically coupled to allow current to flow through theLED 22. TheLED 22 includesconnectors adjacent terminals LED connectors adjacent terminals LED 22 can be coupled with theterminals - The
LED 22 can span a gap 58 between the printedconductors heat spreader 14 can be thermally coupled with theLED 22 in the gap 58 for dissipating heat generated by theLED 22. TheLED 22 can include a heat conductingcomponent 59, such as a metal plate, joined with or at least partially embedded within the body of theLED 22 component. As illustrated inFIG. 2 , theheat spreader 14 can include an exposedportion 60 that extends beyond theinterior surface 20 of thepolymeric substrate 16 for direct contact with themetal plate 59 of theLED 22 and anunexposed portion 62 that does not extend beyond theinterior surface 20. Theheat spreader 14 can be configured such that a majority of theheat spreader 14 does not extend beyond theinterior surface 20 and thus theheat spreader 14 can be considered as being predominately disposed exteriorly of theinterior surface 20. Theunexposed portion 62 can be completely embedded within the polymeric substrate 16 (as shown) or, alternatively, theunexposed portion 62 can extend beyond anexterior surface 64 of thepolymeric substrate 16. An additive, such as solder, a thermally conductive epoxy, grease, or other coating can optionally be provided between the exposedportion 60 of theheat spreader 14 and themetal plate 59 to facilitate securing theLED 22 in place and/or to facilitate thermal contact between theLED 22 and theheat spreader 14. - While the
heat spreader 14 is illustrated as having a generally arched-shaped cross-section, it will be understood that theheat spreader 14 can have a variety of different cross-sectional shapes depending on the design of the illumination assembly. For example, theheat spreader 14 can be a material having a non-uniform thickness rather than the arched-shape cross-sectional shape illustrated inFIG. 2 . - With reference to
FIG. 3 , in another example, theheat spreader 14 does not include a portion that extends beyond theinterior surface 20 and thus theheat spreader 14 can be considered as being entirely disposed exteriorly of theinterior surface 20. In this example, theheat spreader 14 is not in direct contact with theLED 22, but can be thermally coupled to theLED 22 through thepolymeric substrate 16, which can be made from a thermally conductive and electrically insulating material. Heat generated by theLED 22 transferred to theconductors 18 c-d can also be dissipated by theheat spreader 14 through thepolymeric substrate 16. Themetal plate 59 of theLED 22 can be configured to be in thermal contact with thepolymeric substrate 16 to facilitate heat transfer from theLED 22 to theheat spreader 14. While theheat spreader 14 is illustrated as being embedded within thepolymeric substrate 16, theheat spreader 14 can also include a portion that extends beyond theexterior surface 64 of thepolymeric substrate 16 to increase the surface area of theheat spreader 14 and increase the amount of heat dissipated. - Referring again to
FIG. 1 , the additional electrical components 24-26 can be electrically coupled with the printed conductors 18 a-b (e.g. electrical component 24) or with the embedded conductors 12 a-b (e.g. electrical component 26). The embedded conductors 12 a-b and theheat spreader 14 can include exposed portions on theinterior surface 20 of thepolymeric substrate 16 for coupling with an electrical component, as illustrated inFIGS. 1-2 . Alternatively, the embedded conductors 12 a-b and/orheat spreader 14 can be completely encapsulated within thepolymeric substrate 16 and an additional component coupled with the embedded conductors 12 a-b and/orheat spreader 14 can project from theinterior surface 20 of thepolymeric substrate 16 for coupling the electrical component with the embedded conductors 12 a-b and/orheat spreader 14. - The
polymeric substrate 16 andfirst polymeric layer 28 can be the same or different and are preferably made from a non-conducting polymeric material that can be molded around the components of theillumination assembly 10. Thepolymeric substrate 16 andfirst polymeric layer 28 can be molded around the components of theillumination assembly 10 according to any known method, examples of which are disclosed in U.S. Pat. No. 7,909,482 to Veenstra et al., entitled “Electrical Device Having Boardless Electrical Component Mounting Arrangement,” issued Mar. 22, 2011, which is incorporated herein by reference in its entirety. -
FIG. 4 illustrates an exemplary method 100 for forming theillumination assembly 10 according to a two-shot molding process similar to that which is disclosed in U.S. Pat. No. 7,909,482 to Veenstra et al. The method 100 can begin at 102 with forming a metal web that includes at least two conductive circuit elements which will form the basis for the embedded conductors 12 a-b. The at least two conductive circuit elements can be made from cutting, bending, and/or stamping a metal sheet to form the metal web having the desired conductors 12 a-b. - At 104 any LEDs or other electrical components that are to be electrically coupled directly with the embedded conductors 12 a-b, such as electrical component 26, are coupled with the appropriate conductors using soldering or any other suitable method. At 106 the
heat spreader 14 can be positioned adjacent the metal web in a position corresponding to where theLED 22 will be located. Theheat spreader 14 can be a thermally conductive component that can be made from the same material as the metal web at 102 or a different material. In an exemplary embodiment, theheat spreader 14 is a portion of the metal web that is electrically isolated from current flow through the web. - The thus assembled web, electrical components, and
heat spreader 14 form a circuit pre-form that can be placed within a cavity of a tooling mold having a shape corresponding to the first housing portion that is formed by thepolymeric substrate 16 at 108. While theheat spreader 14 is described as being placed in the mold cavity at the same time as the assembled web, it is also within the scope of the invention for theheat spreader 14 to be a separate element that is placed in the mold cavity before or after the assembled web. - The first polymeric material is provided in molten form to the mold cavity at 110 in a first molding shot to form the
polymeric substrate 16 in which the web, electrical components, andheat spreader 14 are at least partially embedded. The mold can be configured to leave at least a portion of theheat spreader 14 exposed on theinterior surface 20 of thepolymeric substrate 16, as illustrated inFIG. 2 , or the mold can be figured such that no portion of theheat spreader 14 extends beyond theinterior surface 20, as illustrated inFIG. 3 . Additional portions of the web can also be left exposed as needed for coupling additional electrical components with the web after the first molding shot. - At 112, the printed conductors 18 a-d can be printed onto the
interior surface 20 of thepolymeric substrate 16 adjacent theheat spreader 14. In one example, the conductors 18 a-d can be printed using a printer with a print head with X-Y motion control relative to thepolymeric substrate 16 according to an additive screen printing process. TheLED 22 can be electrically coupled to the printedconductors 18 c-d and thermally coupled with theheat spreader 14 in the manner described above inFIGS. 2 and 3 . Additionalelectrical components 24 can be electrically coupled with the printed conductors 18 a-b as desired to form the completed electrical circuit. - At 114, the completed electrical circuit can be placed within a second mold cavity having a shape corresponding to the second housing portion that is formed by the
first polymeric layer 28. The second polymeric material can be provided in molten form to at least partially embed/cover theLED 22,electrical components 24, 26, and printed conductors 18 a-d within the first polymeric layers 28 in a second molding shot. The second polymeric material can be the same or different than the first polymeric material in the first molding shot at 110. In one example, the second polymeric material can be a material that allows at least a portion of the light emitted from theLED 22 to travel through the second polymeric material to an exterior of theillumination assembly 10 for providing illumination. The second polymeric material can be transparent, translucent and/or colored to provide the emitted light with the desired characteristics. - Alternatively, the method 100 can include an optional
additional step 116 for forming thelens portion 30 above theLED 22. In one example, thelens portion 30 can be formed in a third molding shot using a third polymeric material that is different from the second polymeric material to provide the desired light emitting characteristics. Additionally, or alternatively, the formation of thelens portion 30 can include treating the polymeric material molded over theLED 22 to provide the desired light emitting characteristics. For example, the polymeric material molded over theLED 22 can include a three-dimensional shape and/or texture configured to control the distribution of light emitted through thelens portion 30. In one example, thelens portion 30 can be made from any suitable transparent material, non-limiting examples of which include acrylics, polycarbonates, silicones, and ABS based materials. - In another example, the second molding shot at 114 may include leaving an opening in the
first polymeric layer 28 in the area above theLED 22 to allow at least a portion of the light emitted by theLED 22 to escape from thelighting assembly 10 unimpeded by thefirst polymeric layer 28. In this example, thelighting assembly 10 can be coupled with a device, such as a vehicle tail light, which includes a component that can operate as a lens for the light emitted by theLED 22. - While each of the
polymeric substrate 16 and thefirst polymeric layer 28 are described as being formed in a single shot, it is within the scope of the invention that one or more shots may be used to form thepolymeric substrate 16 and/or thefirst polymeric layer 28. - Each of the steps of the method 100 can be modified depending on the manner in which the
electrical circuit 11, electrical components 22-26, andheat spreader 14 are configured. For example, in a configuration in which theheat spreader 14 is embedded within thefirst polymeric layer 28, rather than thepolymeric substrate 16, such as in the embodiment ofFIG. 6 , theheat spreader 14 can be assembled with theelectrical circuit 11 during the second molding shot at 114 instead of the first molding shot at 110. In another example, if theelectrical circuit 11 does not include any embedded conductors, such as the embodiments ofFIGS. 6 and 7 , the first molding shot at 110 can be used to form thepolymeric substrate 16 for supporting conductors that are either set down or printed onto thepolymeric substrate 16. - In use, the
illumination assembly 10 can be coupled with a suitable power source through theconnector portion 32 to supply electrical current to theelectrical circuit 11. Electrical current can flow through the embedded conductors 12 a-b and the printed conductors 18 a-d to provide power to the various electrical components 24-26, including theLED 22. Thermal energy generated by theLED 22 during operation of theLED 22 can be dissipated through theheat spreader 14, either directly, or through thepolymeric substrate 16. - The
illumination assembly 10 can provide a multi-layer assembly which layers a heat spreader, a non-conductive polymeric material, electrical conductors, and an LED to facilitate thermal energy management. Improved heat management can facilitate forming illumination assemblies having more advanced electronic functionality and higher power levels that do not overheat during use. Generally, an LED is considered high power if it operates at 350 mA or more and consumes greater than 1 watt. For example, improved heat management can allow for the use of thinner polymeric layers forming thepolymeric substrate 16 and thefirst polymeric layer 28 while still enabling advanced circuit functions and high power LEDs without overheating. Decreasing thickness of thepolymeric substrate 16 and/or thefirst polymeric layer 28 can save on material costs and increase flexibility in satisfying the desired form factor of thelighting assembly 10 based on its intended end use. - In addition, the
first polymeric layer 28 can provide a mechanical seal for holding elements of thelighting assembly 10 in place and optionally provide a moisture seal to protect the electronics from moisture damage. The materials for thepolymeric substrate 16 and thefirst polymeric layer 28 can be selected such that thefirst polymeric layer 28 is bonded to the exposed surfaces of thepolymeric substrate 16 during the molding process. The bondedfirst polymeric layer 28 can facilitate securing theLED 22 and otherelectrical components 24, 26 in place, which can decrease the likelihood of these components becoming dislodged and losing their connection to theelectrical circuit 11 and/or theheat spreader 14. The bondedfirst polymeric layer 28 may also facilitate securing the connection between the printed conductors 18 and the embedded conductors 12. The bondedfirst polymeric layer 28 can also inhibit moisture from infiltrating the circuit and potentially electrically shorting the connection between the electrical components 22-26 and the conductors 12, 18 and between the printed and embedded conductors 12 and 18. -
FIG. 5 illustrates an example of alighting assembly 210 that is similar to thelighting assembly 10 except for the configuration of the electrical circuit. Therefore, elements of thelighting assembly 210 similar to those of thelighting assembly 10 are labeled with the prefix 200. - The
illumination assembly 210 is shown without the first polymeric layer 228 for clarity. Thepolymeric substrate 216 extends in multiple dimensions and includes aconnector portion 232 for connecting theillumination assembly 210 to a suitable power source. The electrical circuit 211 includes a combination ofmultiple conductors 212 a-f embedded within thepolymeric substrate 216 and multiple printedconductors 218 a-d printed onto theinterior surface 220 of thepolymeric substrate 216. The printedconductors 218 a-d can be connected to one or more embedded conductors, such as embeddedconductors 212 a-b, to provide current flow to the printedconductors 218 a-d. - The electrical circuit 211 also includes multiple electrical components 222-226 connected to the embedded
conductors 212 a-f or the printedconductors 218 a-d. For example,LEDs 222 a-b can be connected to embeddedconductors 212 c-d and 212 e-f and an additional LED 222 c can be connected to printedconductors 218 c-d. A heat spreader (not shown) can be thermally coupled to one or more of theseLEDs 222 a-c as needed in a manner similar to that discussed above with respect toFIGS. 2 and 3 . Additional electrical components, such aselectrical components - The embedded and printed
conductors polymeric substrate 216 and thus theillumination assembly 210 can emit light in multiple directions by providing theLEDs 222 in different planes. The printedconductors 218 can be printed with narrower widths and higher densities than the embeddedconductors 212 and thus facilitate increasing the complexity of the circuit by increasing connector densities and/or decreasing the size of the circuit needed to support the desired electrical components. The larger embeddedconductors 212 can be used as needed based on the power requirements of the electrical components connected to the embeddedconductors 212. The printedconductors 218 are typically more expensive than the embeddedconductors 212 and thus the embeddedconductors 212 can be used where feasible to decrease costs compared to a circuit made predominately of printed conductors. -
FIG. 6 illustrates an example of alighting assembly 310 that is similar to thelighting assembly 10 except for the configuration of the electrical circuit and the polymeric substrate. Therefore, elements of thelighting assembly 310 similar to those of thelighting assembly 10 are labeled with the prefix 300.FIG. 6 illustrates a portion of thelighting assembly 310 that includes a single LED; however, thelighting assembly 310 can be part of a more complex lighting assembly that includes a larger electrical circuit and multiple components, such as that shown inFIG. 1 orFIG. 5 , for example. - In the
lighting assembly 310, thepolymeric substrate 316 can be in the form of a film or a layer of molded polymeric material that is thermally conductive and electrically insulating. Generally, the thinner thepolymeric substrate 316, the more efficient the heat transfer is to theadjacent heat spreader 314. Additional factors, such as the form factor of the device in which thelighting assembly 310 is to be used and/or manufacturing limitations may also effect the thickness of thepolymeric substrate 316. - The conductors 312 a-b can be printed onto the
polymeric substrate 316 in a manner similar to that described above with respect to the printed conductors 18 of theillumination assembly 10. Alternatively, the conductors 312 a-b can be non-printed conductors that are supported by thepolymeric substrate 316 by lying on theinterior surface 320 or being at least partially embedded within thepolymeric substrate 316. For example, the conductors 312 a-b can be formed using a metal web as described above for the method 100 ofFIG. 4 . In this scenario, the supported conductors 312 a-b can be partially embedded within thepolymeric substrate 316 or be supported by theinterior surface 320 such that the conductors 312 a-b are predominately disposed on the interior side of thepolymeric substrate 316. - The
LED 322 can be electrically coupled to the conductors 312 a-b in a manner similar to that described above with respect to theillumination assembly 10 ofFIG. 1 , such as through soldering or a conductive epoxy. Theheat spreader 314 can be disposed adjacent theLED 322 for dissipating heat generated by the LED. In the embodiment ofFIG. 6 , theheat spreader 314 is not in direct contact with theLED 322 and is located entirely exteriorly of theinterior surface 320 of thepolymeric substrate 316. Heat generated by theLED 322 is transferred through the conductors 312 a-b, through thepolymeric substrate 316, and to theheat spreader 314. - The
first polymeric layer 328 can be molded around theLED 322, the conductors 312 a-b, thepolymeric substrate 316, and theheat spreader 314 to secure these elements of thelighting assembly 310 together without the use of mechanical fasteners. The moldedfirst polymeric layer 328 can also provide a moisture seal to inhibit moisture from interfering with the electrical connections between theLED 322 and the conductors 312 a-b. Thefirst polymeric layer 328 can be molded around only a portion of theheat spreader 314, as illustrated, such that portions of theheat spreader 314 can be exposed to atmosphere or an adjacent component in the end use device to facilitate heat dissipation. However, thefirst polymeric layer 328 could optionally be molded around theentire heat spreader 314. Thefirst polymer layer 328 can be molded at least partially around theheat spreader 314 such that thefirst polymer layer 328 secures theheat spreader 314 in place and/or an adhesive can be used to secure theheat spreader 314 in place relative to theLED 322. - The
lighting assembly 310 can be part of a more complex and multi-dimensional circuit that includes multiple electrical components.Individual heat spreaders 314 can be provided adjacent each LED or other electrical component, as needed, to dissipate heat, including components positioned in different planes. This allows for the location and/or the size of the heat spreader to be customized for each LED or other electrical component and facilitates forming lighting assemblies that satisfy more complex form factors. - The
lighting assembly 310 can be part of a multi-component and multi-dimensional assembly, similar to those illustrated inFIGS. 1 and 4 . Thelighting assembly 310 can be used with an electrical circuit that includes conductors supported by thepolymeric substrate 316 in the same manner as the conductors 312 a-b or a combination of different types of conductors, including embedded and/or printed conductors. - For example,
FIG. 7 illustrates alighting assembly 410 similar to that of thelighting assembly 310 except for differences in the electrical circuit and the first polymeric layer. Elements of thelighting assembly 410 similar to those of thelighting assembly 310 are labeled with the prefix 400. - As illustrated in
FIG. 7 , theelectrical circuit 411 can include conductors 412 a-b supported on theinterior surface 420 of thepolymeric substrate 416 as well as printed conductors 418 a-b that are printed onto theinterior surface 420. TheLED 422 can be electrically connected to the conductors 412 a-b and thermally coupled to theheat spreader 422. An additionalelectrical component 424 can be connected to the printed conductors 418 a-b. - The
polymeric substrate 416 can be in the form of a film or a layer of molded polymeric material having a desired thickness. The first polymeric layer 418 can be molded around theLED 422, the conductors 412 a-b, the conductors 418 a-b, thepolymeric substrate 416, and theheat spreader 414 to secure these elements of thelighting assembly 410 together without the use of mechanical fasteners and to optionally provide a moisture seal to inhibit moisture from interfering with the electrical connections in thecircuit 411. - The size and the location of the
heat spreader 414 can be configured to accommodate only theLED 422 rather than both theLED 422 and theelectrical component 424. Customizing the size and the location of theheat spreader 414 based on the heat dissipation needs of the circuit can decrease the parts and materials used in thelighting assembly 411 and facilitate designing lighting assemblies that are multi-dimensional. -
FIG. 8 illustrates another example of alighting assembly 510 that is similar to thelighting assemblies lighting assembly 510 similar to those of thelighting assembly - In the example of
FIG. 8 , thelighting assembly 510 includes embedded conductors 512 a-b, printed conductors 518 a-b, anLED 522 electrically coupled to the embedded conductors 512 a-b, and an additionalelectrical component 524 electrically coupled to the printed conductors 518 a-b. Thefirst polymeric layer 528 can be molded around theLED 522, the conductors 512 a-b, thepolymeric substrate 516, theelectrical component 524, and the printed conductors 518 a-b to secure these elements together and optionally inhibit moisture from contacting the circuit. - The
heat spreader 514 in this example is a separate component that is not coupled with the other components of theassembly 510 by the over-moldedfirst polymeric layer 528. Theheat spreader 514 can be secured adjacent theexterior surface 564 of thepolymeric substrate 516 using an adhesive or mechanical fasteners. In one example, theheat spreader 514 can be part of the end use device to which thelighting assembly 510 is intended for use and coupling thelighting assembly 510 with the end use device also couples theheat spreader 514 to thelighting assembly 510. For example, theheat spreader 514 could be a thermally conductive part of a lamp which is intended for use with thelighting assembly 510. This configuration can provide a heat spreader having a large surface to facilitate heat dissipation and can also simplify manufacturing of thelighting assembly 510. It is also within the scope of the invention for thefirst polymeric layer 528 to be over-molded around theheat spreader 514 to secure theheat spreader 514 in place in a manner similar to that described above for thelighting assembly -
FIG. 9 illustrates another example of alighting assembly 610 that is similar to thelighting assembly 10 except for differences in the electrical circuit, the heat spreader, and the first polymeric layer. Elements of thelighting assembly 610 similar to those of thelighting assembly 10 are labeled with the prefix 600.FIG. 9 illustrates a portion of thelighting assembly 610 that includes a single LED; however, thelighting assembly 610 can be part of a more complex lighting assembly that includes a larger electrical circuit and multiple components, such as that shown inFIG. 1 orFIG. 5 , for example. - The
lighting assembly 610 includes apolymeric substrate 616 in the form of a thin film or sheet of polymeric material. Multiple conductors 618 a-c can be printed onto theinterior surface 620 of thepolymeric substrate 616 for supplying electrical current to theLED 622. Thepolymeric substrate 616 can include anaperture 668 adjacent theLED 622 through which athermal management device 670 extends to thermally couple theLED 622 with theheat spreader 614 disposed on theexterior side 664 of thepolymeric substrate 616. Thethermal management device 670 can be a separate component or can be integrally formed with theheat spreader 614. For example, theheat spreader 614 can be a molded aluminum or copper heat sink that includes a raised portion forming thethermal management device 670 that is configured to extend through theaperture 668 to thermally couple theLED 622 with theheat spreader 614. - The
polymeric substrate 616 can be made of a non-conductive material according to any known film-forming process. Thepolymeric substrate 616 can be pre-formed, with or without theaperture 668, or formed in-line with one or more components of thelighting assembly 610. For example, the conductors 618 a-c can be printed onto the pre-formedpolymeric substrate 616, thethermal management device 670 and theheat spreader 614 can be assembled with the polymeric substrate, and theLED 622 can be electrically coupled to the conductors 618 a-c. In another example, thepolymeric substrate 616 can be formed around the assembledthermal management device 670 andheat spreader 614. -
FIG. 10 illustrates another example of alighting assembly 710 that is similar to thelighting assembly 310 ofFIG. 6 except for differences in the heat spreader, the polymeric substrate, and the first polymeric layer. Elements of thelighting assembly 710 similar to those of thelighting assembly 310 are labeled with the prefix 700.FIG. 10 illustrates a portion of thelighting assembly 710 that includes a single LED; however, thelighting assembly 710 can be part of a more complex lighting assembly that includes a larger electrical circuit and multiple components, such as that shown inFIG. 1 orFIG. 5 , for example. - The
lighting assembly 710 ofFIG. 10 includes athermal interface layer 780 thermally coupling theheat spreader 714 and theLED 722 that is not a molded polymeric substrate material. The thermal interface layer can be a thermal interface material (TIM) that is thermally conductive, but electrically insulating. Non-limiting examples of suitable thermal interface materials include copper, aluminum, or ceramic impregnated epoxies or silicones, graphine, carbon nanotubes, nano-glue, ceramic coated copper, ceramic coated aluminum, and oxidized aluminum. Thethermal interface layer 780 can be applied at least to an interior surface of theheat spreader 714 adjacent theLED 722 in the assembledlighting assembly 710 and can be a separate layer or a layer that is integrally formed with theheat spreader 714. In one example, thethermal interface layer 780 can be formed by oxidizing the interior surface of analuminum heat spreader 714. - In the embodiment of
FIG. 10 , thefirst polymeric layer 728 and/or theheat spreader 714 can provide the support structure for theelectrical circuit 711 in the absence of a separate polymeric substrate layer (such as thepolymeric substrate 316 ofFIG. 6 ). Thefirst polymeric layer 728 can function as both the over-molded polymeric layer that provides a mechanical seal for holding elements of thelighting assembly 710 together as well as provide a substrate for supporting elements of theelectrical circuit 711. Theheat spreader 714 can optionally provide additional structural support to one or more components of theelectrical circuit 711. In this manner, thelighting assembly 710 can be formed from a single-shot molding process, rather than a multiple-shot molding process. - In yet another example, the lighting assembly can include both a thermal interface layer and a polymeric substrate layer.
FIG. 11 illustrates another example of alighting assembly 810 that is similar to thelighting assembly 410 ofFIG. 7 and 710 ofFIG. 10 except for differences in the electrical circuit, heat spreader, thermal interface layer, and the first polymeric layer. Elements of thelighting assembly 810 similar to those of thelighting assemblies FIG. 11 illustrates a portion of thelighting assembly 810 that includes a single LED; however, thelighting assembly 810 can be part of a more complex lighting assembly that includes a larger electrical circuit and multiple components, such as that shown inFIG. 1 orFIG. 5 , for example. - In the embodiment of
FIG. 11 , thepolymeric substrate 816 can include anopening 882 adjacent theheat spreader 814 and theLED 822 in the assembledlighting assembly 810. Thethermal interface layer 880 can be provided within theopening 882 to thermally couple theLED 822 and theheat spreader 814. In this example, thepolymeric substrate 816 can provide structural support for theelectrical circuit 811 in a manner similar to that described above for previous embodiments while thethermal interface layer 880 facilitates heat transfer between theLED 822 and theheat spreader 814. - It will be understood that it is within the scope of the invention that any of the
lighting assemblies lighting assembly 710 ofFIG. 10 . In addition, it will also be understood that it is within the scope of the invention that any of thelighting assemblies lighting assembly 810 ofFIG. 11 . - In addition, while the embodiments of the
lighting assemblies - The lighting assemblies described herein can address several challenges related to solid-state lighting applications using LEDs. For example, the lighting assemblies described herein integrate the electrical circuit with a polymeric substrate that can be formed or molded into a desired three-dimensional shape. The heat spreader can also be integrated into the lighting assembly by embedding the heat spreader within the polymeric substrate and/or molding the first polymeric layer around the heat spreader. Integration of the electrical circuit and/or the heat spreader can also decrease labor and manufacturing costs compared to designs which utilize multiple separate components and sub-components. In addition, integrating the electrical circuit and/or the heat spreader into the polymeric substrate or the first polymeric layer that can be formed or molded into complex and three-dimensional shapes increases the ability to satisfy end use applications requiring complex form factors.
- The ability to place LEDs in different planes can be used to aim light in a desired direction, which can increase efficiency of the end use device. For example, a ceiling light that produces an isotropic radiation pattern of light tends to create a hot spot of light directly below it. The light bulb in the ceiling light can be replaced with the lighting assembly as described herein which includes multiple LEDs aimed so as to generate a non-isotropic radiation pattern that can create a more uniform distribution of light across the floor. The more uniformly distributed light may appear brighter to the viewer, even if the total light output from the ceiling light is the same. The ability to control light patterns could be leveraged to produce lighting products that meet performance specifications while requiring less light, and thus less power.
- A traditional lighting assembly typically includes a printed circuit board and would require multiple boards and circuit jumpers in order to achieve multi-directional lighting where the electronics conform to the form factor of the end use device. Such a device would be limited in terms of the size and complexity of the multi-dimensional shape of the lighting assembly. Printed conductors can be used in order to achieve a circuit that can better conform to the contour of the end use device. However, printed conductors can only deliver a small amount of electrical power and dissipate a small amount of heat energy and thus a construction that includes only printed conductors is generally not able to sustain the power levels necessary for achieving general lighting functionality. Providing the circuit with a sheet metal only construction can improve the form factor and power handling capacity compared to a device that uses only printed conductors; however the traces are generally too big to support the electronics necessary to achieve the advanced electronic functionality required in more complex lighting designs.
- The lighting assemblies described herein utilize conductors supported by the polymeric substrate in a combination of different ways, such as printing and embedding, in order to provide a circuit that satisfies the electrical current needs of the components as well as component density needs. The combination of more traditional types of conductors with printed conductors can save on materials costs by only utilizing the printed conductors where needed.
- The number, size, and location of the heat spreaders can also be customized based on the design of the lighting assembly. Utilizing heat spreaders only where needed can save on materials and manufacturing costs, as well as facilitate satisfying complex three-dimensional form factor requirements. The use of heat spreaders with the polymeric substrate and the supported conductors can improve heat management of the assembly, thus allowing more complex and higher current lighting designs.
- The above description is that of current embodiments of the invention. Various alterations and changes can be made without departing from the spirit and broader aspects of the invention as defined in the appended claims, which are to be interpreted in accordance with the principles of patent law including the doctrine of equivalents. To the extent not already described, the different features and structures of the various embodiments of the
illumination assemblies illumination assemblies - This disclosure should not be interpreted as an exhaustive description of all embodiments of the invention or to limit the scope of the claims to the specific elements illustrated or described in connection with these embodiments. For example, and without limitation, any individual element of the described invention may be replaced by one or more alternative elements that provide substantially similar functionality or otherwise provide adequate operation. This includes, for example, presently known alternative elements, such as those that might be currently known to one skilled in the art, and alternative elements that may be developed in the future, such as those that one skilled in the art might, upon development, recognize as an alternative.
- The invention is not limited to the details of operation or to the details of construction and the arrangement of the components set forth in the above description or illustrated in the drawings. The invention may be implemented in various other embodiments and practiced or carried out in alternative ways not expressly disclosed herein.
- The phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including” and “comprising” and variations thereof is meant to encompass the items listed thereafter and equivalents thereof as well as additional items and equivalents thereof. Further, enumeration may be used in the description of various embodiments. Unless otherwise expressly stated, the use of enumeration should not be construed as limiting the invention to any specific order or number of components. Nor should the use of enumeration be construed as excluding from the scope of the invention any additional steps or components that might be combined with or into the enumerated steps or components.
- The disclosed embodiment includes a plurality of features that are described in concert and that might cooperatively provide a collection of benefits. The present invention is not limited to only those embodiments that include all of these features or that provide all of the stated benefits.
- Any reference to claim elements in the singular, for example, using the articles “a,” “an,” “the” or “said,” is not to be construed as limiting the element to the singular.
- Directional terms, such as “front,” “back,” “vertical,” “horizontal,” “top,” “bottom,” “upper,” “lower,” “inner,” “inwardly,” “outer” and “outwardly,” are used to assist in describing the invention based on the orientation of the embodiments shown in the illustrations. The use of directional terms should not be interpreted to limit the invention to any specific orientation.
Claims (20)
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DE112017002890.6T DE112017002890T5 (en) | 2016-06-10 | 2017-05-22 | Luminaire construction, comprising a heat energy management |
KR1020197000416A KR20190017018A (en) | 2016-06-10 | 2017-05-22 | An illumination assembly including a thermal energy management section |
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US17/669,727 US11619376B2 (en) | 2016-06-10 | 2022-02-11 | Illumination assembly including thermal energy management |
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AU2019269665B2 (en) * | 2018-05-18 | 2021-11-18 | Unifrax I Llc | Fire protective compositions and associated methods |
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Also Published As
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CN109314169A (en) | 2019-02-05 |
US20220170622A1 (en) | 2022-06-02 |
DE112017002890T5 (en) | 2019-02-21 |
CN109314169B (en) | 2022-04-12 |
WO2017213829A1 (en) | 2017-12-14 |
US11619376B2 (en) | 2023-04-04 |
KR20190017018A (en) | 2019-02-19 |
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