US20170343204A1 - Led device - Google Patents

Led device Download PDF

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Publication number
US20170343204A1
US20170343204A1 US15/681,989 US201715681989A US2017343204A1 US 20170343204 A1 US20170343204 A1 US 20170343204A1 US 201715681989 A US201715681989 A US 201715681989A US 2017343204 A1 US2017343204 A1 US 2017343204A1
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United States
Prior art keywords
heat dissipating
base body
pattern
carrying
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/681,989
Inventor
Yi-Tse Ho
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Molex LLC
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Molex LLC
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Publication date
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Priority to US15/681,989 priority Critical patent/US20170343204A1/en
Assigned to MOLEX INCORPORATED reassignment MOLEX INCORPORATED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HO, YI-TSE
Assigned to MOLEX, LLC reassignment MOLEX, LLC CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: MOLEX INCORPORATED
Publication of US20170343204A1 publication Critical patent/US20170343204A1/en
Abandoned legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0284Details of three-dimensional rigid printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/09154Bevelled, chamferred or tapered edge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09645Patterning on via walls; Plural lands around one hole
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854Hole or via having special cross-section, e.g. elliptical
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10113Lamp
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10409Screws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0014Shaping of the substrate, e.g. by moulding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Definitions

  • the present disclosure relates to a holder for providing a light emitting element and an illumination device, and particularly relates to a holder having a three-dimensional metallic heat dissipating pattern and an illumination device.
  • Taiwanese patent No. TWM447458 disclose a bulb lamp, in which molded interconnect device (MID) technology is used to form a three-dimensional circuit board and a light emitting element is mounted to the three-dimensional circuit board.
  • MID molded interconnect device
  • a board body of the three-dimensional circuit board is made by a material which is not electrically conductive, the heat dissipation efficiency is not high, heat energy generated by the light emitting element during light emission is not easily dissipated rapidly and is built up in the light emitting element and a region near the light emitting element, thus the light emitting efficiency and the service life of the light emitting element would be effected.
  • an object of the present disclosure is to provide a holder for providing a light emitting element and capable of improving heat dissipation efficiency.
  • Another object of the present disclosure is to provide an illumination device which has a better heat dissipation efficiency.
  • an illumination device of the present disclosure comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure.
  • the holder comprises a heat dissipating base body and a carrying unit.
  • the carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body.
  • the plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern.
  • the translucent cover is assembled to the holder and covers the carrying unit and the plurality of light emitting elements.
  • the lamp cap structure is assembled to the heat dissipating base body.
  • the carrying base body has a plurality of mounting faces which are not parallel to each other, and the plurality of the mounting positions are distributed on the plurality of mounting faces.
  • the heat dissipating base body has a surrounding wall and a top platform connected to a top side of the surrounding wall, the carrying base body is assembled to and engaged with the heat dissipating base body and has a bottom face in contact with the top platform
  • At least a part of the heat dissipating pattern extends to the bottom face so as to contact the top platform.
  • the carrying base body further has at least a heat dissipating hole, at least a part of the heat dissipating pattern extends through a wall surface defining the heat dissipating hole to the bottom face so as to contact the top platform of the heat dissipating base body.
  • the heat dissipating base body is integrally formed with the carrying base body and is hollow.
  • a part of the heat dissipating pattern covers a boundary between the carrying base body and the heat dissipating base body.
  • the part of the heat dissipating pattern further extends to at least a part of an outer surface of the heat dissipating base body.
  • the carrying base body has at least a heat dissipating hole, at least a part of the heat dissipating pattern extends to an inner surface of the carrying base body and an inner surface of the heat dissipating base body via a wall surface defining the heat dissipating hole.
  • heat generated by the light emitting element can be directly conducted to the heat dissipating base body via the heat dissipating pattern, and in turn can be dissipated by the heat dissipating base body, so that the dissipation efficiency can be significantly improved.
  • the heat dissipating base body may be made by a material which is lower in cost but poorer in heat efficiency so as to meet different requirements.
  • FIG. 1 is an exploded perspective view illustrating a first embodiment of an illumination device of the present disclosure
  • FIG. 2 is an exploded perspective view illustrating a holder of the first embodiment
  • FIG. 3 is a perspective view illustrating a carrying unit of the holder of the first embodiment
  • FIG. 4 is a perspective view illustrating the carrying unit of the holder of the first embodiment
  • FIG. 5 is a perspective view illustrating an assembly relationship between a holder of and light emitting elements of an illumination device of a second embodiment of the present disclosure
  • FIG. 6 is a perspective view illustrating the holder of the second embodiment.
  • FIG. 7 is a view of FIG. 6 , viewed from another angle, illustrating the holder of the second embodiment.
  • an illumination device 100 of a first embodiment of the present disclosure comprises a holder 1 , a plurality of light emitting elements 2 , a translucent cover 3 and a lamp cap structure 4 .
  • the holder 1 comprises a heat dissipating base body 11 and a carrying unit 12 connected to a top portion of the heat dissipating base body 11 .
  • the heat dissipating base body 11 is hollow in interior thereof, and has a surrounding wall 111 and a top platform 112 connected to a top side of the surrounding wall 111 .
  • the surrounding wall 111 is formed with a plurality of heat dissipating fins 113 spaced apart from each other and arranged on an outer periphery of the surrounding wall 111 .
  • the carrying unit 12 comprises a carrying base body 121 , a circuit pattern 122 and a heat dissipating pattern 123 .
  • the carrying base body 121 is assembled to and engaged with the heat dissipating base body 11 and has a bottom face 1211 in contact with the top platform 112 , a plurality of mounting faces 1212 which are not parallel to each other, and a plurality of heat dissipating holes 1213 .
  • the mounting faces 1212 of the carrying base body 121 comprise a horizontal mounting face parallel to the bottom face 1211 and a plurality of oblique mounting faces connected between the horizontal mounting face and the bottom face 1211
  • the heat dissipating holes 1213 pass through the horizontal mounting face 1212 and the bottom face 1211 and comprise one heat dissipating hole which is circular and positioned at the center and the other heat dissipating holes which are rectangular.
  • the circuit pattern 122 and the heat dissipating pattern 123 are directly formed to a surface of the carrying base body 121 .
  • the circuit pattern 122 and the heat dissipating pattern 123 are formed by laser direct structuring (LDS) technology and directly formed on the carrying base body 121 by using steps of laser eroding, metallizing and the like so as to form a three-dimensional arrangement pattern.
  • metallic materials used in the circuit pattern 122 and the heat dissipating pattern 123 have good electrical conductivity and thermal conductivity.
  • the circuit pattern 122 has a plurality of mounting positions 1221 to provide the plurality of light emitting elements 2 and establish an electrical connection, the heat dissipating pattern 123 at least extends from regions close to the plurality of mounting positions 1221 to regions where the heat dissipating pattern 123 can contact the heat dissipating base body 11 .
  • the plurality of mounting positions 1221 are distributed on the plurality of mounting faces 1212 , wherein the horizontal mounting face is provided with the mounting positions and the oblique mounting faces each are provided with one mounting position, the plurality of light emitting elements 2 emit lights from different angles via the plurality of mounting faces 1212 .
  • the circuit pattern 122 is interrupted at each mounting position 1221 to allow a positive electrode and a negative electrode of the light emitting element 2 to be electrically connected to the circuit pattern 122 at both sides of the each mounting position 1221 .
  • a part of the heat dissipating pattern 123 extends through a wall surface defining the heat dissipating hole 1213 to the bottom face 1211 so as to contact the top platform 112 of the heat dissipating base body 11
  • a part of the heat dissipating pattern 123 extends from a region close to the mounting position 1221 to the bottom face 1211 so as to contact the top platform 112 .
  • heat dissipating pattern 123 extends from the region close to each mounting position 1221 to the bottom face 1211 of the carrying base body 121 so as to contact the top platform 112 of the heat dissipating base body 11 , heat generated by the each light emitting element 2 is rapidly transferred to the heat dissipating base body 11 in a direct thermal conduction manner, and in turn is dissipated by the heat dissipating base body 11 , so that the dissipation efficiency is significantly improved.
  • the heat dissipating base body 11 may be made by a material which is lower in cost but poorer in heat efficiency, such as plastic material, so as to meet different requirements.
  • the heat dissipating base body 11 may be also made by a metallic material, such as aluminum alloy.
  • the carrying base body 121 is made by a material which is not electrically conductive, such as plastic material or ceramic material.
  • the plurality of light emitting elements 2 are respectively provided at the plurality of the mounting positions 1221 and establish an electrical connection with the circuit pattern 122 .
  • the plurality of light emitting elements 2 are connected in series.
  • the translucent cover 3 is assembled to the holder 1 , and covers the carrying unit 12 and the plurality of light emitting elements 2 .
  • the lamp cap structure 4 is assembled to the heat dissipating base body 11 and is used to electrically connect an external power.
  • the carrying base body 121 is formed with two through holes 1214 and one wire aperture 1215
  • the top platform 112 of the heat dissipating base body 11 is correspondingly formed with two through holes 1121 and one wire aperture 1122 .
  • the through holes 1214 , 1121 are used to engage fasteners 5 so as to fix the assembly of the carrying base body 121 and the heat dissipating base body 11 .
  • the wire apertures 1215 , 1122 are used to pass through wires 6 .
  • the heat dissipating base body 11 is provided with a driving plate (not shown) therein, and the circuit pattern 122 is connected to the driving plate via the wires 6 , the driving plate is connected to the lamp cap structure 4 via, for example, a wire (not shown), so as to transmit the external power to the plurality of light emitting elements 2 .
  • the plurality of light emitting elements 2 are provided in the embodiment, it can be understood that only one light emitting element 2 may be provided in a modified embodiment.
  • an illumination device 100 of a second embodiment of the present disclosure is substantially the same as the first embodiment, however, in the second embodiment, the heat dissipating base body 11 is integrally formed with the carrying base body 121 , a part of the heat dissipating pattern 123 extends from a region close to the mounting position 1221 and covers a boundary between the carrying base body 121 and the heat dissipating base body 11 , and further extends to a part of an outer surface of the heat dissipating base body 11 , another part of the heat dissipating pattern 123 extends to an inner surface of the carrying base body 121 and an inner surface of the heat dissipating base body 11 via a wall surface defining the heat dissipating hole 1213 .
  • the carrying base body 121 is only formed with one heat dissipating hole 1213 which is circular and positioned at the center.
  • the heat dissipating pattern 123 extends from the region close to the light emitting element 2 to the heat dissipating base body 11 , heat generated by the light emitting element 2 is rapidly conducted to the heat dissipating base body 11 , and in turn is dissipated by the heat dissipating base body 11 , so that the dissipation efficiency is significantly improved.
  • heat generated by the light emitting element 2 can be directly conducted to the heat dissipating base body 11 via the heat dissipating pattern 123 , and in turn can be dissipated by the heat dissipating base body 11 , so that the dissipation efficiency can be significantly improved.
  • the heat dissipating base body 11 may be made by a material which is lower in cost but poorer in heat efficiency so as to meet different requirements.

Abstract

An illumination device comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern.

Description

    RELATED APPLICATIONS
  • This application is a continuation of U.S. application Ser. No. 14/478,327, filed Sep. 5, 2014 which, in turn, claims priority to Taiwanese Application No. 102216833, filed Sep. 6, 2013, each of which are incorporated herein by reference in their entireties.
  • FIELD OF THE PRESENT DISCLOSURE
  • The present disclosure relates to a holder for providing a light emitting element and an illumination device, and particularly relates to a holder having a three-dimensional metallic heat dissipating pattern and an illumination device.
  • BACKGROUND OF THE PRESENT APPLICATION
  • Recently, a light emitting element which is most interested is a light emitting diode (LED), the LED has been widely applied in many fields due to its advantages of energy saving, environmental protection, long service life and the like, especially many types of products in the illumination field have been developed, and one type is a bulb lamp. There are many manners to mount the light emitting element in the existing bulb lamps. For example, Taiwanese patent No. TWM447458 disclose a bulb lamp, in which molded interconnect device (MID) technology is used to form a three-dimensional circuit board and a light emitting element is mounted to the three-dimensional circuit board.
  • Since a board body of the three-dimensional circuit board is made by a material which is not electrically conductive, the heat dissipation efficiency is not high, heat energy generated by the light emitting element during light emission is not easily dissipated rapidly and is built up in the light emitting element and a region near the light emitting element, thus the light emitting efficiency and the service life of the light emitting element would be effected.
  • SUMMARY OF THE PRESENT DISCLOSURE
  • Therefore, an object of the present disclosure is to provide a holder for providing a light emitting element and capable of improving heat dissipation efficiency.
  • Another object of the present disclosure is to provide an illumination device which has a better heat dissipation efficiency.
  • Accordingly, an illumination device of the present disclosure comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern. The translucent cover is assembled to the holder and covers the carrying unit and the plurality of light emitting elements. The lamp cap structure is assembled to the heat dissipating base body.
  • In an embodiment of the illumination device of the present disclosure, the carrying base body has a plurality of mounting faces which are not parallel to each other, and the plurality of the mounting positions are distributed on the plurality of mounting faces.
  • In an embodiment of the illumination device of the present disclosure, the heat dissipating base body has a surrounding wall and a top platform connected to a top side of the surrounding wall, the carrying base body is assembled to and engaged with the heat dissipating base body and has a bottom face in contact with the top platform
  • In an embodiment of the illumination device of the present disclosure, at least a part of the heat dissipating pattern extends to the bottom face so as to contact the top platform.
  • In an embodiment of the illumination device of the present disclosure, the carrying base body further has at least a heat dissipating hole, at least a part of the heat dissipating pattern extends through a wall surface defining the heat dissipating hole to the bottom face so as to contact the top platform of the heat dissipating base body.
  • In an embodiment of the illumination device of the present disclosure, the heat dissipating base body is integrally formed with the carrying base body and is hollow.
  • In an embodiment of the illumination device of the present disclosure, a part of the heat dissipating pattern covers a boundary between the carrying base body and the heat dissipating base body.
  • In an embodiment of the illumination device of the present disclosure, the part of the heat dissipating pattern further extends to at least a part of an outer surface of the heat dissipating base body.
  • In an embodiment of the illumination device of the present disclosure, the carrying base body has at least a heat dissipating hole, at least a part of the heat dissipating pattern extends to an inner surface of the carrying base body and an inner surface of the heat dissipating base body via a wall surface defining the heat dissipating hole.
  • The effects of the present disclosure are as follows: heat generated by the light emitting element can be directly conducted to the heat dissipating base body via the heat dissipating pattern, and in turn can be dissipated by the heat dissipating base body, so that the dissipation efficiency can be significantly improved. Furthermore, as the dissipation efficiency is increased, the heat dissipating base body may be made by a material which is lower in cost but poorer in heat efficiency so as to meet different requirements.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • The other features and effects of the present disclosure will be apparent through embodiments with reference to the Figures, and in which:
  • FIG. 1 is an exploded perspective view illustrating a first embodiment of an illumination device of the present disclosure;
  • FIG. 2 is an exploded perspective view illustrating a holder of the first embodiment;
  • FIG. 3 is a perspective view illustrating a carrying unit of the holder of the first embodiment;
  • FIG. 4 is a perspective view illustrating the carrying unit of the holder of the first embodiment;
  • FIG. 5 is a perspective view illustrating an assembly relationship between a holder of and light emitting elements of an illumination device of a second embodiment of the present disclosure;
  • FIG. 6 is a perspective view illustrating the holder of the second embodiment; and
  • FIG. 7 is a view of FIG. 6, viewed from another angle, illustrating the holder of the second embodiment.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Before the present disclosure is described in detail, it should be noted that similar elements are indicated by the same reference numeral in the following description.
  • Referring to FIG. 1 through FIG. 4, an illumination device 100 of a first embodiment of the present disclosure comprises a holder 1, a plurality of light emitting elements 2, a translucent cover 3 and a lamp cap structure 4.
  • The holder 1 comprises a heat dissipating base body 11 and a carrying unit 12 connected to a top portion of the heat dissipating base body 11. The heat dissipating base body 11 is hollow in interior thereof, and has a surrounding wall 111 and a top platform 112 connected to a top side of the surrounding wall 111. The surrounding wall 111 is formed with a plurality of heat dissipating fins 113 spaced apart from each other and arranged on an outer periphery of the surrounding wall 111. The carrying unit 12 comprises a carrying base body 121, a circuit pattern 122 and a heat dissipating pattern 123. The carrying base body 121 is assembled to and engaged with the heat dissipating base body 11 and has a bottom face 1211 in contact with the top platform 112, a plurality of mounting faces 1212 which are not parallel to each other, and a plurality of heat dissipating holes 1213. Specifically, the mounting faces 1212 of the carrying base body 121 comprise a horizontal mounting face parallel to the bottom face 1211 and a plurality of oblique mounting faces connected between the horizontal mounting face and the bottom face 1211, and the heat dissipating holes 1213 pass through the horizontal mounting face 1212 and the bottom face 1211 and comprise one heat dissipating hole which is circular and positioned at the center and the other heat dissipating holes which are rectangular. The circuit pattern 122 and the heat dissipating pattern 123 are directly formed to a surface of the carrying base body 121. In the embodiment, the circuit pattern 122 and the heat dissipating pattern 123 are formed by laser direct structuring (LDS) technology and directly formed on the carrying base body 121 by using steps of laser eroding, metallizing and the like so as to form a three-dimensional arrangement pattern. In the embodiment, metallic materials used in the circuit pattern 122 and the heat dissipating pattern 123 have good electrical conductivity and thermal conductivity.
  • The circuit pattern 122 has a plurality of mounting positions 1221 to provide the plurality of light emitting elements 2 and establish an electrical connection, the heat dissipating pattern 123 at least extends from regions close to the plurality of mounting positions 1221 to regions where the heat dissipating pattern 123 can contact the heat dissipating base body 11. Specifically, the plurality of mounting positions 1221 are distributed on the plurality of mounting faces 1212, wherein the horizontal mounting face is provided with the mounting positions and the oblique mounting faces each are provided with one mounting position, the plurality of light emitting elements 2 emit lights from different angles via the plurality of mounting faces 1212. The circuit pattern 122 is interrupted at each mounting position 1221 to allow a positive electrode and a negative electrode of the light emitting element 2 to be electrically connected to the circuit pattern 122 at both sides of the each mounting position 1221. Moreover, in the embodiment, a part of the heat dissipating pattern 123 extends through a wall surface defining the heat dissipating hole 1213 to the bottom face 1211 so as to contact the top platform 112 of the heat dissipating base body 11, a part of the heat dissipating pattern 123 extends from a region close to the mounting position 1221 to the bottom face 1211 so as to contact the top platform 112.
  • By that heat dissipating pattern 123 extends from the region close to each mounting position 1221 to the bottom face 1211 of the carrying base body 121 so as to contact the top platform 112 of the heat dissipating base body 11, heat generated by the each light emitting element 2 is rapidly transferred to the heat dissipating base body 11 in a direct thermal conduction manner, and in turn is dissipated by the heat dissipating base body 11, so that the dissipation efficiency is significantly improved. As the dissipation efficiency is increased, the heat dissipating base body 11 may be made by a material which is lower in cost but poorer in heat efficiency, such as plastic material, so as to meet different requirements. Naturally, the heat dissipating base body 11 may be also made by a metallic material, such as aluminum alloy. The carrying base body 121 is made by a material which is not electrically conductive, such as plastic material or ceramic material.
  • The plurality of light emitting elements 2 are respectively provided at the plurality of the mounting positions 1221 and establish an electrical connection with the circuit pattern 122. In the embodiment, the plurality of light emitting elements 2 are connected in series. The translucent cover 3 is assembled to the holder 1, and covers the carrying unit 12 and the plurality of light emitting elements 2. The lamp cap structure 4 is assembled to the heat dissipating base body 11 and is used to electrically connect an external power. In the embodiment, the carrying base body 121 is formed with two through holes 1214 and one wire aperture 1215, the top platform 112 of the heat dissipating base body 11 is correspondingly formed with two through holes 1121 and one wire aperture 1122. The through holes 1214, 1121 are used to engage fasteners 5 so as to fix the assembly of the carrying base body 121 and the heat dissipating base body 11. The wire apertures 1215, 1122 are used to pass through wires 6. The heat dissipating base body 11 is provided with a driving plate (not shown) therein, and the circuit pattern 122 is connected to the driving plate via the wires 6, the driving plate is connected to the lamp cap structure 4 via, for example, a wire (not shown), so as to transmit the external power to the plurality of light emitting elements 2. Although the plurality of light emitting elements 2 are provided in the embodiment, it can be understood that only one light emitting element 2 may be provided in a modified embodiment.
  • Referring to FIG. 5 through FIG. 7, an illumination device 100 of a second embodiment of the present disclosure is substantially the same as the first embodiment, however, in the second embodiment, the heat dissipating base body 11 is integrally formed with the carrying base body 121, a part of the heat dissipating pattern 123 extends from a region close to the mounting position 1221 and covers a boundary between the carrying base body 121 and the heat dissipating base body 11, and further extends to a part of an outer surface of the heat dissipating base body 11, another part of the heat dissipating pattern 123 extends to an inner surface of the carrying base body 121 and an inner surface of the heat dissipating base body 11 via a wall surface defining the heat dissipating hole 1213. In the embodiment, the carrying base body 121 is only formed with one heat dissipating hole 1213 which is circular and positioned at the center.
  • Similarly, by that the heat dissipating pattern 123 extends from the region close to the light emitting element 2 to the heat dissipating base body 11, heat generated by the light emitting element 2 is rapidly conducted to the heat dissipating base body 11, and in turn is dissipated by the heat dissipating base body 11, so that the dissipation efficiency is significantly improved.
  • In conclusion, heat generated by the light emitting element 2 can be directly conducted to the heat dissipating base body 11 via the heat dissipating pattern 123, and in turn can be dissipated by the heat dissipating base body 11, so that the dissipation efficiency can be significantly improved. Furthermore, as the dissipation efficiency is increased, the heat dissipating base body 11 may be made by a material which is lower in cost but poorer in heat efficiency so as to meet different requirements.
  • The above described are only the embodiments of the present disclosure, which cannot limit the scope of the implementation of the present disclosure, that is, simple equivalent variations and modifications made according to the scope of the Claims and the description content of the present disclosure are still fallen within the scope of the present disclosure.

Claims (23)

What is claimed is:
1. A holder, comprising:
a heat dissipating base body with a top portion; and
a carrying unit connected to the top portion and comprising a carrying base body, a circuit pattern and a heat dissipating pattern, the carrying unit being formed of a non-electrically conductive material, the circuit pattern and the heat dissipating pattern being directly formed to a surface of the carrying base body, the circuit pattern defining a mounting position where a light emitting element is configured to be mounted to the surface of the carrying base body to establish an electrical connection with the circuit pattern, the heat dissipating pattern at least extending from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body.
2. The holder of claim 1, wherein the circuit pattern defines a plurality of mounting positions where respective light emitting elements are configured to be mounted to the surface of the carrying base body to establish an electrical connection with the circuit pattern, the heat dissipating pattern at least extends from regions respectively close to the plurality of mounting positions to regions where the heat dissipating pattern can contact the heat dissipating base body.
3. The holder of claim 2, wherein the carrying base body has a plurality of mounting faces which are not parallel to each other, and the plurality of the mounting positions are distributed on the plurality of mounting faces.
4. The holder of claim 2, wherein the heat dissipating base body has a surrounding wall and a top platform connected to a top side of the surrounding wall, the carrying base body is assembled to and engaged with the heat dissipating base body and has a bottom face in contact with the top platform.
5. The holder of claim 4, wherein at least a part of the heat dissipating pattern extends to the bottom face so as to contact the top platform.
6. The holder of claim 5, wherein the carrying base body further has at least a heat dissipating hole, at least a part of the heat dissipating pattern extends through a wall surface defining the heat dissipating hole to the bottom face so as to contact the top platform of the heat dissipating base body.
7. The holder of claim 2, wherein the heat dissipating base body is integrally formed with the carrying base body and is hollow.
8. The holder of claim 7, wherein a part of the heat dissipating pattern covers a boundary between the carrying base body and the heat dissipating base body.
9. The holder of claim 8, wherein the part of the heat dissipating pattern further extends to at least a part of an outer surface of the heat dissipating base body.
10. The holder of claim 9, wherein the carrying base body has at least a heat dissipating hole, at least a part of the heat dissipating pattern extends to an inner surface of the carrying base body and an inner surface of the heat dissipating base body via a wall surface defining the heat dissipating hole.
11. The holder of claim 1, wherein the heat dissipating base body has a surrounding wall which is formed with a plurality of heat dissipating fins.
12. The holder of claim 1, wherein the circuit pattern and the heat dissipating pattern are formed of metallic materials.
13. An illumination device, comprising:
a holder, comprising:
a heat dissipating base body with a top portion; and
a carrying unit connected to the top portion and comprising a carrying base body, a circuit pattern and a heat dissipating pattern, the carrying unit being formed of a non-electrically conductive material, the circuit pattern and the heat dissipating pattern being directly formed to a surface of the carrying base body, the circuit pattern defining a plurality of mounting positions, the heat dissipating pattern at least extending from a region close to the mounting positions to a region where the heat dissipating pattern can contact the heat dissipating base body;
a plurality of light emitting elements respectively mounted to the surface of the carrying base body at the plurality of the mounting positions, the plurality of light emitting elements electrically connected with the circuit pattern;
a translucent cover assembled to the holder and covering the carrying unit and the plurality of light emitting elements; and
a lamp cap structure assembled to the heat dissipating base body.
14. The illumination device of claim 13, wherein the carrying base body has a plurality of mounting faces which are not parallel to each other, and the plurality of the mounting positions are distributed on the plurality of mounting faces.
15. The illumination device of claim 13, wherein the heat dissipating base body has a surrounding wall and a top platform connected to a top side of the surrounding wall, the carrying base body is assembled to and engaged with the heat dissipating base body and has a bottom face in contact with the top platform.
16. The illumination device of claim 15, wherein at least a part of the heat dissipating pattern extends to the bottom face so as to contact the top platform.
17. The illumination device of claim 16, wherein the carrying base body further has at least a heat dissipating hole, at least a part of the heat dissipating pattern extends through a wall surface defining the heat dissipating hole to the bottom face so as to contact the top platform of the heat dissipating base body.
18. The illumination device of claim 13, wherein the heat dissipating base body is integrally formed with the carrying base body and is hollow.
19. The illumination device of claim 18, wherein a part of the heat dissipating pattern covers a boundary between the carrying base body and the heat dissipating base body.
20. The illumination device of claim 19, wherein the part of the heat dissipating pattern further extends to at least a part of an outer surface of the heat dissipating base body.
21. The illumination device of claim 20, wherein the carrying base body has at least a heat dissipating hole, at least a part of the heat dissipating pattern extends to an inner surface of the carrying base body and an inner surface of the heat dissipating base body via a wall surface defining the heat dissipating hole.
22. The illumination device of claim 13, wherein the heat dissipating base body has a surrounding wall which is formed with a plurality of heat dissipating fins.
23. The illumination device of claim 13, wherein the circuit pattern and the heat dissipating pattern are formed of metallic materials.
US15/681,989 2013-09-06 2017-08-21 Led device Abandoned US20170343204A1 (en)

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TW102216833U TWM475552U (en) 2013-09-06 2013-09-06 Mounting base for mounting light emitting device and lighting device
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US14/478,327 US9772101B2 (en) 2013-09-06 2014-09-05 LED device
US15/681,989 US20170343204A1 (en) 2013-09-06 2017-08-21 Led device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018009292A1 (en) * 2018-11-26 2020-05-28 Harting Ag Electro-optical assembly with heat dissipation and method for producing such an assembly

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101740589B1 (en) * 2016-12-28 2017-05-26 몰렉스 엘엘씨 LED lamp using MID technology
KR102522041B1 (en) * 2022-08-16 2023-04-18 주식회사 하스인더스트리 Automotive led lamp using mid technology

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040184272A1 (en) * 2003-03-20 2004-09-23 Wright Steven A. Substrate for light-emitting diode (LED) mounting including heat dissipation structures, and lighting assembly including same
US8282250B1 (en) * 2011-06-09 2012-10-09 Elumigen Llc Solid state lighting device using heat channels in a housing

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8143769B2 (en) * 2008-09-08 2012-03-27 Intematix Corporation Light emitting diode (LED) lighting device
US8382333B2 (en) * 2011-06-03 2013-02-26 Kuei-Fang Chen Light emitting device
TWM447458U (en) 2012-10-25 2013-02-21 3D Circuit Taiwan Three-dimensional bulb lamp of light emitting element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040184272A1 (en) * 2003-03-20 2004-09-23 Wright Steven A. Substrate for light-emitting diode (LED) mounting including heat dissipation structures, and lighting assembly including same
US8282250B1 (en) * 2011-06-09 2012-10-09 Elumigen Llc Solid state lighting device using heat channels in a housing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018009292A1 (en) * 2018-11-26 2020-05-28 Harting Ag Electro-optical assembly with heat dissipation and method for producing such an assembly
US11942588B2 (en) 2018-11-26 2024-03-26 Harting Ag Electro-optical assembly having heat dissipation, and method for producing such an assembly

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US20150131300A1 (en) 2015-05-14
TWM475552U (en) 2014-04-01

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