TWM447458U - Three-dimensional bulb lamp of light emitting element - Google Patents

Three-dimensional bulb lamp of light emitting element Download PDF

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Publication number
TWM447458U
TWM447458U TW101220572U TW101220572U TWM447458U TW M447458 U TWM447458 U TW M447458U TW 101220572 U TW101220572 U TW 101220572U TW 101220572 U TW101220572 U TW 101220572U TW M447458 U TWM447458 U TW M447458U
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Taiwan
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dimensional
light
emitting element
bulb
base
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TW101220572U
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Chinese (zh)
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Hui-Hsiung Chen
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3D Circuit Taiwan
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Priority to TW101220572U priority Critical patent/TWM447458U/en
Publication of TWM447458U publication Critical patent/TWM447458U/en

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Description

一種發光元件立體球泡燈Light-emitting element stereo bulb

本創作係提供一種發光元件立體球泡燈,特別是指一種將發光元件封裝於整合成型立體基板上之立體球泡燈,可增加該發光元件立體球泡燈內該發光元件之出光角度,進而提升該發光元件立體球泡燈之亮度。The present invention provides a three-dimensional bulb of a light-emitting element, in particular, a three-dimensional bulb that encapsulates a light-emitting element on an integrally formed three-dimensional substrate, which can increase the light-emitting angle of the light-emitting element in the three-dimensional bulb of the light-emitting element, and further The brightness of the stereoscopic bulb of the light-emitting element is increased.

隨著科技的日新月異,照明器具從傳統的鎢絲燈到日光燈不斷地推陳出新,近年來發光二極體技術的成熟將會使其逐漸取代日光燈成為最主要之照明光源,因其具有耗電量低、元件壽命長、反應快及體積小的優點,致使其應用範圍相當廣泛。一般習知之發光二極體是將晶粒設置在傳統之平面印刷電路板上,並加以電性連結而後施以電力使其發光,但平面印刷電路板無法進行彎曲,因此將其封裝成為燈泡時,其發光角度將被侷限於某些特定方向,而造成亮度無法提升之困境。而且隨著電子產品體積越做越小,要在狹窄空間安裝印刷電路板更是一大挑戰。因此,為了提升燈泡之亮度,必須將發光二極體設置在具有直接形成如印刷電路板上的訊號線之立體物件上,以取代傳統的印刷電路板,可縮減製程之步驟,因此運用整合成型立體基板(Molded Interconnect Device,MID)的概念孕育而生,改變了長期以來對於「平面」印刷電路板的印象。With the rapid development of technology, lighting fixtures continue to evolve from traditional tungsten lamps to fluorescent lamps. In recent years, the maturity of LED technology will gradually replace fluorescent lamps as the most important lighting source, because of its low power consumption. The advantages of long component life, fast response and small volume make it a wide range of applications. Generally, a conventional light-emitting diode is formed by arranging a crystal grain on a conventional flat printed circuit board, electrically connecting it, and then applying electric power to emit light, but the flat printed circuit board cannot be bent, so when it is packaged into a light bulb The angle of illumination will be limited to certain specific directions, which will cause the brightness to be unable to improve. And as electronic products become smaller and smaller, installing printed circuit boards in tight spaces is a challenge. Therefore, in order to increase the brightness of the light bulb, the light-emitting diode must be disposed on a three-dimensional object having a signal line directly formed on a printed circuit board to replace the conventional printed circuit board, and the process steps can be reduced, thereby using integrated molding. The concept of Molded Interconnect Device (MID) has been born, changing the long-standing impression of "flat" printed circuit boards.

有鑑於此,如何針對上述習知印刷電路板所存在之缺點進行研發改良,利用Molded Interconnect Device的概念進行發光二極體於立體曲面上之封裝,實為相關業界所需努力研發之目標。In view of this, how to improve the shortcomings of the above-mentioned conventional printed circuit boards, and to use the concept of the Molded Interconnect Device to package the LEDs on the solid curved surface is a goal that the related industry needs to develop.

故本創作有鑑於上述的缺失,係提出一種發光元件立體球泡燈,用以解決習知技術的缺點。Therefore, in view of the above-mentioned shortcomings, the present invention proposes a three-dimensional bulb of a light-emitting element for solving the shortcomings of the prior art.

本創作係提供一種發光元件立體球泡燈,其包含有:一立體基板,係呈三維空間配置之立體構形,具有複數個立體基板孔洞;一立體電路布局,係於該立體基板上利用三維雷射雕刻加工將所設計的線路圖案完成以形成一整合成型立體基板(Molded Interconnect Device,MID);一發光元件,係固設於該立體電路布局上,與該立體電路布局電性連接;一底座,係與該立體基板連接,為一中空桶狀結構,具有複數個底座孔洞;一螺牙接頭,係與該底座連接且位於該底座下方;一電源,係與該螺牙接頭電性連接且位於該螺牙接頭上方,以提供該發光元件所需之電源;一底殼,係位於該螺牙接頭上,內含該底座;以及一燈罩,係與該底殼相連接,供包覆該立體基板、該立體電路布局以及該發光元件。The present invention provides a three-dimensional bulb of a light-emitting element, comprising: a three-dimensional substrate, which has a three-dimensional configuration in a three-dimensional configuration, and has a plurality of three-dimensional substrate holes; a three-dimensional circuit layout is used on the three-dimensional substrate to utilize three-dimensional The laser engraving process completes the designed circuit pattern to form a Molded Interconnect Device (MID); a light-emitting component is fixed on the three-dimensional circuit layout and electrically connected to the three-dimensional circuit layout; The base is connected to the three-dimensional substrate and is a hollow barrel structure having a plurality of base holes; a threaded joint is connected to the base and located under the base; and a power source is electrically connected to the screw joint And located above the screw joint to provide the power required for the light-emitting element; a bottom case is disposed on the threaded joint and includes the base; and a lamp cover is connected to the bottom case for covering The three-dimensional substrate, the three-dimensional circuit layout, and the light-emitting element.

與習知技術相較,本創作之一種發光元件立體球泡燈,藉由將發光元件封裝於整合成型立體基板上,可增加該發光元件立體球泡燈內該發光元件之出光角度,進而提升該發光元件立體球泡 燈之亮度。Compared with the prior art, a three-dimensional bulb of the light-emitting component of the present invention can increase the light-emitting angle of the light-emitting component in the three-dimensional bulb of the light-emitting component by encapsulating the light-emitting component on the integrated three-dimensional substrate, thereby improving Stereoscopic bulb of the light-emitting element The brightness of the light.

為充分瞭解本創作之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本創作做一詳細說明,說明如後:In order to fully understand the purpose, features and effects of this creation, the following specific examples, together with the attached drawings, provide a detailed description of the creation, as explained below:

請參考第一圖,係本創作一種發光元件立體球泡燈之發光元件模組橫截面示意圖。一立體基板10,係呈三維空間配置之立體構形,具有複數個立體基板孔洞;一立體電路布局20,係於該立體基板10上利用三維雷射雕刻加工將所設計的線路圖案完成,以形成一整合成型立體基板(Molded Interconnect Device,MID),以及一發光元件30,係固設於該立體電路布局20上,與該立體電路布局20電性連接,而該立體基板10、該立體電路布局20以及該發光元件30係可整合為一發光元件模組40。其中,該立體基板10的材料係為熱固性塑膠聚鄰苯二甲酸二烯丙酯(DAP;Diallyl Phthalate)及熱塑性塑膠聚鄰苯二甲醯胺(PPA;Polyphthalamide)、高性能工程塑料(LCP;Liquid Ciystal Polyester)、聚醯胺6/6(PA6/6;Nylon)、聚碳酸酯(PC;Polycarbonate)、聚碳酸酯/聚丙烯腈(PC/ABS;Polycarbonate/Acrylonitrile Butadiene Styrene)等材質之其中之一者;該立體基板10之形狀係可為正方體、多邊體、角錐、圓錐以及不規則立方體之其中之一者;該發光元件30係可為有機發光二極體、發光二極體或電致發光元件之其中之 一者且該發光元件30之數量係為多個。Please refer to the first figure for a cross-sectional view of a light-emitting element module of a three-dimensional bulb of a light-emitting element. A three-dimensional substrate 10 is configured in a three-dimensional spatial configuration and has a plurality of three-dimensional substrate holes; a three-dimensional circuit layout 20 is formed on the three-dimensional substrate 10 by using three-dimensional laser engraving processing to complete the designed circuit pattern. Forming a Molded Interconnect Device (MID), and a light-emitting component 30 is fixed on the three-dimensional circuit layout 20 and electrically connected to the three-dimensional circuit layout 20, and the three-dimensional substrate 10 and the three-dimensional circuit The layout 20 and the light-emitting element 30 can be integrated into a light-emitting element module 40. The material of the three-dimensional substrate 10 is thermosetting plastic poly(diallyl Phthalate) and thermoplastic polyphthalamide (PPA; Polyphthalamide), high performance engineering plastics (LCP; Liquid Ciystal Polyester), polyamine 6/6 (PA6/6; Nylon), polycarbonate (PC; Polycarbonate), polycarbonate/polyacrylonitrile (PC/ABS; Polycarbonate/Acrylonitrile Butadiene Styrene) The shape of the three-dimensional substrate 10 may be one of a cube, a polygon, a pyramid, a cone, and an irregular cube; the light-emitting element 30 may be an organic light-emitting diode, a light-emitting diode, or an electric One of the light-emitting elements In one case, the number of the light-emitting elements 30 is plural.

請一併參考第二圖,係本創作一種發光元件立體球泡燈之發光元件模組立體俯視圖以及仰視圖。其中,該立體基板10係更具有一立體基板孔洞A102、複數個立體基板孔洞B104以及複數個立體基板孔洞C106於其上。Please refer to the second figure together for a three-dimensional top view and a bottom view of a light-emitting element module of a three-dimensional bulb of a light-emitting element. The three-dimensional substrate 10 further has a three-dimensional substrate hole A102, a plurality of three-dimensional substrate holes B104, and a plurality of three-dimensional substrate holes C106 thereon.

請參考第三圖係本創作一種發光元件立體球泡燈之分解圖。該發光元件立體球泡燈1其包含有:一立體基板10,係呈三維空間配置之立體構形,具有一立體基板孔洞A102、複數個立體基板孔洞B104以及複數個立體基板孔洞C106;一立體電路布局20,係於該立體基板10上利用三維雷射雕刻加工將所設計的線路圖案完成,以形成一整合成型立體基板,與電線(圖未示)電性連接,該電線係貫穿該立體基板孔洞A102而向下延伸;一發光元件30,係固設於該立體電路布局20上,與該立體電路布局20電性連接;一底座50,係與該立體基板10連接,為一中空桶狀結構,該底座50上方具有一底座孔洞A502,供該電線貫穿而過,以及複數個底座孔洞B504,供該立體基板10固鎖於該底座50上;一螺牙接頭60,係與該底座50連接且位於該底座50下方;一電源70,係與該螺牙接頭60電性連接且位於該螺牙接頭60上方並與該電線電性連接,以提供該發光元件30所需之電源;一底殼80,係位於該螺牙接頭60上,內含該底座50,該底殼80之材質係為金屬,可幫助該等發光元件30所產生的熱進行散熱,而該立體基板10之尺寸大小,係可以與該底殼80互相密合;以及一燈罩90,該燈罩 90之材質係為玻璃或壓克力之其中之一者,係與該底殼80相連接,供包覆該立體基板10、該立體電路布局20以及該發光元件30。其中,該立體基板10、該立體電路布局20以及該發光元件30係可整合為一發光元件模組40。特別注意的是,該立體基板孔洞A102與該底座孔洞A502係為相對應之開設,可以提供該電線貫穿而過,該複數個立體基板孔洞B104係提供該發光元件30固設於該立體基板10上,例如以焊接方式將該發光元件30固定於該立體基板10上;以及該立體基板孔洞C106與該底座孔洞B504係為相對應之開設,供該發光元件模組40與該底座50間之固定,例如使用螺絲100固定之。Please refer to the third figure for an exploded view of a three-dimensional bulb of a light-emitting element. The illuminating device stereoscopic bulb 1 includes a three-dimensional substrate 10 having a three-dimensional configuration in a three-dimensional configuration, having a three-dimensional substrate hole A102, a plurality of three-dimensional substrate holes B104, and a plurality of three-dimensional substrate holes C106; The circuit layout 20 is formed on the three-dimensional substrate 10 by three-dimensional laser engraving processing to form an integrated formed three-dimensional substrate, and is electrically connected to a wire (not shown) through which the wire is electrically connected. The substrate hole A102 extends downwardly; a light-emitting element 30 is fixed on the three-dimensional circuit layout 20 and electrically connected to the three-dimensional circuit layout 20; a base 50 is connected to the three-dimensional substrate 10 as a hollow barrel The base 50 has a base hole A502 for the wire to pass through, and a plurality of base holes B504 for the three-dimensional substrate 10 to be fixed on the base 50; a threaded joint 60 is attached to the base 50 is connected and located under the base 50; a power source 70 is electrically connected to the screw connector 60 and is located above the screw connector 60 and electrically connected to the wire to provide the light-emitting component The power supply of the chassis 80 is located on the screw connector 60 and includes the base 50. The material of the bottom case 80 is metal, which can help the heat generated by the light-emitting elements 30 to dissipate heat. The size of the three-dimensional substrate 10 can be closely adhered to the bottom case 80; and a lamp cover 90, the lamp cover The material of 90 is one of glass or acrylic, and is connected to the bottom case 80 for covering the three-dimensional substrate 10, the three-dimensional circuit layout 20, and the light-emitting element 30. The three-dimensional substrate 10, the three-dimensional circuit layout 20, and the light-emitting element 30 can be integrated into one light-emitting element module 40. It is to be noted that the three-dimensional substrate hole A102 is corresponding to the base hole A502, and the wire can be provided. The plurality of three-dimensional substrate holes B104 are provided on the three-dimensional substrate 10. The light-emitting element 30 is fixed to the three-dimensional substrate 10 by soldering, for example, and the three-dimensional substrate hole C106 is corresponding to the base hole B504, and is disposed between the light-emitting element module 40 and the base 50. Fixed, for example fixed with screws 100.

請一併參考第四圖以及第五圖,係本創作一種發光元件立體球泡燈之部份組裝之結構示意圖以及本創作一種發光元件立體球泡燈之組裝完成之結構示意圖。該發光元件模組40與該底座50透過該等立體基板孔洞C106以及該等底座孔洞B504固鎖後,放入該底殼80中,同時將該電源70安裝於該螺牙接頭60上,與該底殼80組裝,並將該底座50與該螺牙接頭60組裝,其中該底座50內具有該延伸之電線,係與該電源70電性連接。最後將該燈罩90由上方將該發光元件模組40包覆,並與該底殼80組裝結合,而完成該發光元件立體球泡燈1。Please refer to the fourth figure and the fifth figure together, which is a schematic structural diagram of a partial assembly of a three-dimensional bulb of a light-emitting element and a structural schematic diagram of the assembly of a three-dimensional bulb of the light-emitting element. The light-emitting device module 40 and the base 50 are locked by the three-dimensional substrate holes C106 and the base holes B504, and then placed in the bottom case 80, and the power source 70 is mounted on the screw joint 60, and The bottom case 80 is assembled, and the base 50 is assembled with the screw joint 60. The base 50 has the extended electric wire and is electrically connected to the power source 70. Finally, the lamp cover 90 is covered by the light-emitting element module 40 from above, and assembled with the bottom case 80 to complete the light-emitting element stereoscopic bulb lamp 1.

本創作在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本創作,而不應解讀為限制本創作之範圍。應注意的是,舉凡與該實施例等 效之變化與置換,均應設為涵蓋於本創作之範疇內。The present invention has been disclosed in the above preferred embodiments, and it should be understood by those skilled in the art that the present invention is only intended to depict the present invention and should not be construed as limiting the scope of the present invention. It should be noted that, etc., etc. Changes and substitutions should be made to cover the scope of this creation.

1‧‧‧發光元件立體球泡燈1‧‧‧Lighting element stereo bulb

10‧‧‧立體基板10‧‧‧Three-dimensional substrate

102‧‧‧立體基板孔洞A102‧‧‧Three-dimensional substrate hole A

104‧‧‧立體基板孔洞B104‧‧‧Stereo substrate hole B

106‧‧‧立體基板孔洞C106‧‧‧Stereo substrate hole C

20‧‧‧立體電路布局20‧‧‧Three-dimensional circuit layout

30‧‧‧發光元件30‧‧‧Lighting elements

40‧‧‧發光元件模組40‧‧‧Lighting element module

50‧‧‧底座50‧‧‧Base

502‧‧‧底座孔洞A502‧‧‧Base hole A

504‧‧‧底座孔洞B504‧‧‧Base hole B

60‧‧‧螺牙接頭60‧‧‧ threaded joint

70‧‧‧電源70‧‧‧Power supply

80‧‧‧底殼80‧‧‧ bottom case

90‧‧‧燈罩90‧‧‧shade

100‧‧‧螺絲100‧‧‧ screws

第一圖 係本創作一種發光元件立體球泡燈之發光元件模組橫截面示意圖。The first figure is a schematic cross-sectional view of a light-emitting element module of a three-dimensional bulb of a light-emitting element.

第二圖 係本創作一種發光元件立體球泡燈之發光元件模組立體俯視圖以及仰視圖。The second figure is a perspective view and a bottom view of a light-emitting element module of a three-dimensional bulb of a light-emitting element.

第三圖 係本創作一種發光元件立體球泡燈之分解圖。The third figure is an exploded view of a three-dimensional bulb of a light-emitting element.

第四圖 係本創作一種發光元件立體球泡燈之部份組裝之結構示意圖。The fourth figure is a schematic structural view of a partial assembly of a three-dimensional bulb of a light-emitting element.

第五圖 係本創作一種發光元件立體球泡燈之組裝完成之結構示意圖。The fifth figure is a structural diagram of the assembly of a three-dimensional bulb of a light-emitting element.

1‧‧‧發光元件立體球泡燈1‧‧‧Lighting element stereo bulb

10‧‧‧立體基板10‧‧‧Three-dimensional substrate

102‧‧‧立體基板孔洞A102‧‧‧Three-dimensional substrate hole A

104‧‧‧立體基板孔洞B104‧‧‧Stereo substrate hole B

106‧‧‧立體基板孔洞C106‧‧‧Stereo substrate hole C

20‧‧‧立體電路布局20‧‧‧Three-dimensional circuit layout

30‧‧‧發光元件30‧‧‧Lighting elements

40‧‧‧發光元件模組40‧‧‧Lighting element module

50‧‧‧底座50‧‧‧Base

502‧‧‧底座孔洞A502‧‧‧Base hole A

504‧‧‧底座孔洞B504‧‧‧Base hole B

60‧‧‧螺牙接頭60‧‧‧ threaded joint

70‧‧‧電源70‧‧‧Power supply

80‧‧‧底殼80‧‧‧ bottom case

90‧‧‧燈罩90‧‧‧shade

100‧‧‧螺絲100‧‧‧ screws

Claims (9)

一種發光元件立體球泡燈,其包含有:一立體基板,係呈三維空間配置之立體構形,具有複數個立體基板孔洞;一立體電路布局,係於該立體基板上利用三維雷射雕刻加工將所設計的線路圖案完成,以形成一整合成型立體基板;一發光元件,係固設於該立體電路布局上,與該立體電路布局電性連接;一底座,係與該立體基板連接,為一中空桶狀結構,具有複數個底座孔洞;一螺牙接頭,係與該底座連接且位於該底座下方;一電源,係與該螺牙接頭電性連接且位於該螺牙接頭上方,以提供該發光元件所需之電源;一底殼,係位於該螺牙接頭上,內含該底座;以及一燈罩,係與該底殼相連接,供包覆該立體基板、該立體電路布局以及該發光元件。A three-dimensional bulb of a light-emitting element, comprising: a three-dimensional substrate, which is in a three-dimensional configuration, has a plurality of three-dimensional substrate holes; and a three-dimensional circuit layout is processed on the three-dimensional substrate by using three-dimensional laser engraving The designed circuit pattern is completed to form an integrated formed three-dimensional substrate; a light-emitting element is fixed on the three-dimensional circuit layout and electrically connected to the three-dimensional circuit layout; a base is connected to the three-dimensional substrate, a hollow barrel-like structure having a plurality of base holes; a threaded joint connected to the base and located under the base; a power source electrically connected to the screw joint and located above the screw joint to provide a power source required for the light-emitting element; a bottom case disposed on the threaded joint and including the base; and a lamp cover connected to the bottom case for covering the three-dimensional substrate, the three-dimensional circuit layout, and the Light-emitting element. 如申請專利範圍第1項所述之一種發光元件立體球泡燈,其中該立體基板的材料係為熱固性塑膠DAP及熱塑性塑膠PPA、LCP、PA6/6、PC或PC/ABS之其中之一者。The one-dimensional bulb of the light-emitting element according to claim 1, wherein the material of the three-dimensional substrate is one of thermosetting plastic DAP and thermoplastic plastic PPA, LCP, PA6/6, PC or PC/ABS. . 如申請專利範圍第2項所述之一種發光元件立體球泡燈,其中該立體基板之形狀係可為正方體、多邊體、角錐、圓錐以及不規則立方體之其中之一者。A light-emitting element stereoscopic bulb according to claim 2, wherein the shape of the three-dimensional substrate is one of a cube, a polygon, a pyramid, a cone, and an irregular cube. 如申請專利範圍第1項所述之一種發光元件立體球泡燈,其中該發光元件係可為有機發光二極體、發光二極體或電致發光元件之其中之一者。A light-emitting element stereoscopic bulb according to claim 1, wherein the light-emitting element is one of an organic light-emitting diode, a light-emitting diode or an electroluminescent element. 如申請專利範圍第4項所述之一種發光元件立體球泡燈,其中該發光元件之數量係為多個。A light-emitting element stereoscopic bulb as described in claim 4, wherein the number of the light-emitting elements is plural. 如申請專利範圍第1項所述之一種發光元件立體球泡燈,其中該立體基板、該立體電路布局以及該發光元件係可整合為一發光元件模組。The illuminating element stereoscopic bulb of claim 1, wherein the three-dimensional substrate, the three-dimensional circuit layout and the illuminating element are integrated into a illuminating element module. 如申請專利範圍第1項所述之一種發光元件立體球泡燈,其中該底座上方具有複數個立體基板孔洞,供該立體基板固鎖於該底座上。The one-dimensional bulb of the light-emitting component of claim 1, wherein the base has a plurality of three-dimensional substrate holes for locking the three-dimensional substrate on the base. 如申請專利範圍第1項所述之一種發光元件立體球泡燈,其中該底殼之材質係為金屬。The one-dimensional bulb of the light-emitting element according to claim 1, wherein the material of the bottom case is metal. 如申請專利範圍第1項所述之一種發光元件立體球泡燈,其中該燈罩之材質係為玻璃或壓克力之其中之一者。The one-dimensional bulb of the light-emitting element according to claim 1, wherein the material of the lampshade is one of glass or acrylic.
TW101220572U 2012-10-25 2012-10-25 Three-dimensional bulb lamp of light emitting element TWM447458U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104061457A (en) * 2013-03-22 2014-09-24 新世纪光电股份有限公司 Light emitting device
US9499911B2 (en) 2013-11-01 2016-11-22 Industrial Technology Research Institute Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure
US9772101B2 (en) 2013-09-06 2017-09-26 Molex, Llc LED device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104061457A (en) * 2013-03-22 2014-09-24 新世纪光电股份有限公司 Light emitting device
US9772101B2 (en) 2013-09-06 2017-09-26 Molex, Llc LED device
US9499911B2 (en) 2013-11-01 2016-11-22 Industrial Technology Research Institute Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure
US9683292B2 (en) 2013-11-01 2017-06-20 Industrial Technology Research Institute Metal circuit structure

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