CN205678450U - Illumination light source and illuminator - Google Patents
Illumination light source and illuminator Download PDFInfo
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- CN205678450U CN205678450U CN201620135671.3U CN201620135671U CN205678450U CN 205678450 U CN205678450 U CN 205678450U CN 201620135671 U CN201620135671 U CN 201620135671U CN 205678450 U CN205678450 U CN 205678450U
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- radiator
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Abstract
This utility model provides can suppress to produce illumination light source and the illuminator in crack in the framework integrally formed with radiator.LED bulb of the present utility model (1) possesses: LED module (10);For making the drive circuit (30) of LED module (10) luminescence;Radiator (40), be surround drive circuit (30) cylinder and with LED module (10) hot combination;Framework (50), is the cylinder of radiator cover (40) and integrally formed with radiator (40), and the outer peripheral face (40a) in radiator (40) is formed with multiple recess (41).
Description
Technical field
This utility model relates to illumination light source and possesses the illuminator of this illumination light source.
Background technology
The semiconductor light-emitting elements of light emitting diode (LED:Light Emitting Diode) etc. is small-sized and the long-life
Light-emitting component, so being expected the light source as various products.Wherein, the bulb-shaped lamp (bulb of LED is employed
Type lamp) (LED bulb) the most known lamp-bulb type fluorescent lamp, the illumination light source of incandescent lamp bulb, the most actively
Develop (for example, referring to patent documentation 1).
LED bulb such as has: LED module (light emitting module), the enclosed globe shade (globe) (cover body) of covering LED module, use
In the module board of mounting LED module, for making the drive circuit of LED module luminescence and accepting for making LED module send out from outside
The lamp holder of the electric power of light.
Citation
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2011-146241 publication
Utility model content
Additionally, be configured with radiator and the encirclement radiator of the heat heat radiation for being produced by LED module in LED bulb
Framework.Here, in the case of radiator and framework are integrally formed, due to the difference of radiator Yu the thermal expansion of framework, load
The heart produces crack in framework.
Therefore, the purpose of this utility model is, it is provided that can suppress to produce in the framework integrally formed with radiator
The illumination light source in crack and illuminator.
In order to reach above-mentioned purpose, the illumination light source involved by a form of the present utility model, possess: luminous mould
Block;Drive circuit, is used for making described light emitting module luminous;Radiator, is the cylinder surrounding described drive circuit, and with described
The hot combination of light emitting module;And framework, it is the cylinder covering described radiator, and integrally formed with described radiator,
The outer peripheral face of described radiator is formed multiple concavo-convex.
Preferably, uniform position on the plurality of concavo-convex circumferencial direction being formed at described radiator.
Preferably, the plurality of concavo-convex each concavo-convex have on the direction orthogonal with the circumferencial direction of described radiator
The linear structure extended.
Preferably, the plurality of concavo-convex part ratio near away from described light emitting module at described radiator is at this radiator
Other part is formed close.
Preferably, the plurality of concavo-convex each concavo-convex in, by this concavo-convex jump formed described radiator away from
The near part of described light emitting module is formed greatly than other the part at this radiator.
Preferably, the plurality of concavo-convex in the same circle of the concavo-convex outer peripheral face being formed at described radiator of more than 2
Zhou Shang.
Preferably, on the multiple different circumference of the plurality of concavo-convex outer peripheral face being formed at described radiator.
Preferably, the inner peripheral surface of described radiator is formed as smooth.
Preferably, described radiator is metal, and described framework is resinous containing glass fibre.
Illuminator involved by another form of the present utility model, possesses: the illumination described in described arbitrary form is used
Light source.
The effect of utility model
According to this utility model, it is possible to suppression produces crack in the framework integrally formed with radiator.
Accompanying drawing explanation
Fig. 1 is the sectional view of the LED bulb involved by embodiment.
Fig. 2 is the exploded perspective view of the LED bulb involved by embodiment.
Fig. 3 is the axonometric chart of the radiator in embodiment.
Fig. 4 is the sectional view of the radiator at the IV-IV line of Fig. 3.
Fig. 5 is the integrally formed radiator in embodiment and the axonometric chart of framework.
Fig. 6 be in embodiment integrally formed go out radiator and framework the figure that is indicated of operation, wherein, (a)
Represent and be prepared forming the radiator before framework, (b) represent one-body molded go out radiator and framework concrete operation, (c)
Expression is pulled down the metal pattern of ester moulding thus is produced the framework formed integrally with radiator.
Fig. 7 is the sectional view of the radiator in the LED bulb that comparative example relates to and framework.
Fig. 8 is the figure that the structure of the variation to radiator is indicated.
Fig. 9 is the axonometric chart of the variation of other of radiator.
Figure 10 is the general profile chart of the illuminator involved by embodiment.
Label declaration:
1 LED bulb (illumination light source)
2 illuminators
10 LED modules (light emitting module)
30 drive circuits
40,40A, 140,940 radiator
40a, 140a, 940a outer peripheral face
40b inner peripheral surface
41,41A, 141 recesses (concavo-convex)
50,950 framework.
Detailed description of the invention
(embodiment)
Hereinafter, embodiment of the present utility model is illustrated.It addition, embodiments described below is all to represent this
The embodiment of a preferred concrete example of utility model.Therefore, the following numerical value shown in embodiment, shape, material
Material, element, the allocation position of element and connected mode and operation and the order etc. of operation, be an example, and
Do not limit purport of the present utility model.It is not documented in this reality accordingly, with respect in the element in following embodiment
Element in the independent claims being indicated by novel upper concept, says as arbitrary element
Bright.Additionally, below, numerical range is that A~B is expressed as more than A and below B.
[LED bulb]
In the following embodiments, as an example of illumination light source, to becoming lamp-bulb type fluorescent lamp or electric filament lamp
The LED (LED bulb) of the bulb-shaped of the substitute of bubble illustrates.
First, use Fig. 1 and Fig. 2 that the overall structure of the LED bulb 1 involved by embodiment is illustrated.Fig. 1 is real
Execute the sectional view of LED bulb 1 involved by mode.Fig. 2 is the exploded perspective view of the LED bulb 1 involved by embodiment.
It addition, in FIG, the single dotted broken line along the description of paper above-below direction represents the central shaft J of LED bulb 1.At this
In embodiment, central shaft J is the optical axis (lamp axle) of LED bulb 1, and consistent with the axle of enclosed globe shade 20 (enclosed globe shade axle).This
Outward, central shaft J is as the axle of center of rotation when LED bulb 1 is installed on the lamp socket of ligthing paraphernalia (not shown), with lamp holder 60
Rotary shaft consistent.
As shown in Figures 1 and 2, LED bulb 1 have LED module 10, cover LED module 10 enclosed globe shade 20, for making
The drive circuit 30 of LED module 10 luminescence and the radiator 40 of the hot combination of LED module 10 and surround the frame of drive circuit 30
Body 50.LED bulb 1 also has lamp holder 60, module board 70 and screw 80.
In the present embodiment, LED bulb 1 constitutes peripheral components by enclosed globe shade 20 and framework 50 and lamp holder 60.
Hereinafter, with reference to Fig. 1 and Fig. 2, each structure member of LED bulb 1 is described in detail.
[LED module]
LED module 10 is the light-emitting device (light emitting module) of the light of the color (wavelength) releasing regulation.LED module 10 is constituted
For releasing such as white light.
LED module 10 is arranged in the inner side of enclosed globe shade 20, utilizes the electric power supplied by drive circuit 30 and luminous.
LED module 10 is fixed in module board 70, and has substrate 11 and be configured at the light-emitting component 12 of substrate 11.
Substrate 11 is the installation base plate for installing light-emitting component 12.Substrate 11 is e.g. substantially round in shape when overlooking
Plate-like substrate, and it is fixed on module board 70.Specifically, the through hole for inserting screw 80 it is provided with on the substrate 11 (not
Diagram), substrate 11 screws tight fixing with module board 70 by screw 80.In the present embodiment, use 2 screws 80, but at figure
1 screw 80 is illustrate only in 1.It addition, the fixing means of substrate 11 and module board 70 is not limited to screw tight, it is possible to use viscous
Connect other fixing means of agent etc..
Additionally, at the central part of substrate 11, it is provided with and (does not schemes for inserting the couple of conductor derived from drive circuit 30
Show) through hole 11a.It addition, the position of through hole 11a can not also be at the central part of substrate 11.In addition it is also possible to not at base
Through hole 11a is set on plate 11, but notch is set at the edge part etc. of substrate 11, insert couple of conductor to this notch and
It is connected to the pair of electrodes terminal of substrate 11.
As substrate 11, such as, the base material of the metal to aluminum etc. is used to impose insulating coating and the Metal Substrate base that obtains
Plate, as the ceramic substrate of sintered body of ceramic material of aluminium oxide etc. or the resin substrate etc. that is made up of resin material.Separately
Outward, the shape of substrate 11 is not limited to circle, it is possible to use the substrate of rectangular shape.
On the surface of substrate 11, it is provided with pair of electrodes terminal (not shown) as current feed department.On pair of electrodes terminal
Connect the couple of conductor derived from drive circuit 30 respectively.Additionally, on the surface of substrate 11, formed with the pattern of the shape of regulation
There is the metal line (not shown) for electrode terminal and multiple light-emitting component 12 being electrically connected.
Light-emitting component 12 is provided with multiple on the one side of substrate 11.It addition, the arrangement of multiple light-emitting components 12 is the most special
Limit, the most both can be configured to concentric annular, it is also possible to be configured to rectangular.Additionally, the installation quantity of light-emitting component 12 is not
It is defined in multiple, it is also possible to be 1.
Light-emitting component 12 in present embodiment, (SMD:Surface Mount is installed on the surface for individually packedization
Device) LED element of type, possesses as the resin forming product formed by white resin or the appearance of the device for ceramic shaped products of white
Device (encapsulation), the LED chip of once mounting semiconductor light-emitting elements etc. in container and for by LED chip seal
The seal member formed by the insulative resin material of light transmission.Light-emitting component 12 as the LED element of SMD type is pacified by secondary
It is loaded on substrate 11.
The multiple light-emitting components 12 so constituted such as are connected in series, and utilize and supply from drive circuit 30 via couple of conductor
The direct current power given and luminous.It addition, the form of the connection of multiple light-emitting components 12 (is connected in series, is connected in parallel and the company of series connection
The connection etc. of the combination connect and be connected in parallel) it is not particularly limited.
[enclosed globe shade]
Enclosed globe shade 20 is the light transmission cover body covering LED module 10, is configured to be fetched into the light released from LED module 10
Outside lamp.It is to say, the light of the LED module 10 to the inner face incidence of enclosed globe shade 20, after transmission enclosed globe shade 20, it is fetched to ball
The outside of shape cover 20.
Enclosed globe shade 20 is the hollow part with peristome 21, and is that the top with peristome 21 opposite side is closed
The most spherical, peristome 21 is fixed on the peristome of the enclosed globe shade side of framework 50.As it is shown in figure 1, enclosed globe shade 20 e.g. with
Central shaft J is the rotary body of the hollow of rotary shaft, for peristome 21 by the shape of undergauge.
Material as enclosed globe shade 20, it is possible to use by the quartz glass etc. for visible transparent glass material or
The translucent material that the resin material of acrylic resin (PMMA), Merlon (PC) etc. etc. are constituted.
Preferably, enclosed globe shade 20 is implemented the DIFFUSION TREATMENT for making the light released from LED module 10 spread.Such as,
By forming optical diffusion film (light diffusion layer) at the inner surface of enclosed globe shade 20 or outer surface, it is possible to make enclosed globe shade 20 have light and expand
Dissipate function.
Specifically, by the resin containing the photodiffusion material such as silicon dioxide, calcium carbonate, Chinese white etc. are coated on
The inner face of enclosed globe shade 20 or whole of outside, it is possible to form milky optical diffusion film.Or, by shape on enclosed globe shade 20
Become multiple light diffusion point or multiple small depression, it is also possible to make enclosed globe shade 20 have light diffusion function.So, owing to passing through
Enclosed globe shade 20 is made to have light diffusion function, it is possible to make to spread, it is possible to make to join from LED module 10 to the light of enclosed globe shade 20 incidence
Optic angle broadens.
Alternatively, it is also possible to do not make enclosed globe shade 20 have light diffusion function and make enclosed globe shade 20 transparent, so as to vision is distinguished
Recognize the LED module 10 of inside.Additionally, the shape of enclosed globe shade 20 can be ellipsoid of revolution or spheroid, can also be in addition
Shape on the basis of the ball cover of general bulb-shaped i.e. A type.
[drive circuit]
Drive circuit 30 is for driving the power circuit of LED module 10 (power subsystem), will be used for making LED module 10
The power supply of (light-emitting component 12) luminescence is to LED module 10.Drive circuit 30 will such as from lamp holder 60 via couple of conductor (not
Diagram) and the alternating electromotive force that supplies is transformed to direct current power, and by this direct current power via other couple of conductor (not shown)
Supply is to LED module 10.By the direct current power supplied from drive circuit 30 (lighting circuit), LED module 10 (light-emitting component
12) light and extinguish.
Drive circuit 30 have circuit substrate 31 and the multiple electronic unit 32a being installed on this circuit substrate 31~
32c.Drive circuit 30 is configured between LED module 10 and lamp holder 60.Specifically, drive circuit 30 is accommodated in and radiator 40
In integrally formed framework 50, and it is fixed on framework 50 by screwing tight fixing, bonding or engaging etc..
Circuit substrate 31 is the tellite of metal line being patterned with Copper Foil etc. a face (solder side)
(PCB).Multiple electronic unit 32a~32c being installed on circuit substrate 31 are mutual by the metal line being formed at circuit substrate 31
It is electrically connected.Circuit substrate 31 such as configures with the posture (placing vertically) that the interarea of this circuit substrate 31 is almost parallel with central shaft J.
It addition, circuit substrate 31 is not limited to the configuration placed vertically, it is also possible to be substantially orthogonal with central shaft J with the interarea of this circuit substrate 31
Posture (traverse) configuration.
Electronic unit 32a~32c installed to circuit substrate 31 is the multiple circuit elements for being lighted by LED module 10
The resistive element of the capacity cell of part, e.g. electrolysis condenser, ceramic capacitor etc., resistor etc., convertor circuit element, line
The semiconductor element of coil element, choking-winding (choke transformer), noise filter, diode or integrated circuit component etc.
Deng.
The drive circuit 30 so constituted is by specifying the state of above distance, utilize by insulating leaving radiator 40
Property the framework 50 that constitutes of resin material receive, so that it is guaranteed that insulating properties.It addition, light modulation can also be combined in drive circuit 30
Circuit, booster circuit etc..
[radiator]
The thermal component that the heat produced by LED module 10 is mainly dispelled the heat by radiator 40.Therefore, radiator 40 preferably by
The material that the thermal conductivity of metal etc. is high is constituted.In the present embodiment, radiator 40 is metal, it is possible to by such as aluminum
The metallic plate of plate etc. carries out punch process and shapes.It addition, the heat produced by drive circuit 30 can also also be dissipated by radiator 40
Heat.
Additionally, radiator 40 also serves as the supporting parts function for support module plate 70, fixing on radiator 40
There is module board 70.
Radiator 40 is configured to surround drive circuit 30, is configured at LED module 10 and lamp holder 60 on the direction of central shaft J
Between.
Radiator 40 is generally cylindrical member, be cylinder axle with central shaft J cylinder, in the present embodiment, pass through example
As insert molding (insert molding) etc. and formed integrally with framework 50.
Radiator 40 is connected with module board 70, and is configured to surround drive circuit 30.The outer peripheral face 40a of radiator 40 and frame
The inner peripheral surface of body 50 abuts.
The cylindric metal parts that radiator 40 is is cylinder axle with central shaft J, as an example, by thickness one
Form multiple recess described later on the metallic plate of fixed (such as, about 1mm) and constitute.
[framework]
Framework 50 is to be configured to surround the cylinder of drive circuit 30, in the present embodiment, integrally formed with radiator 40.
Additionally, be provided with for by the fixing structure of circuit substrate 31 of drive circuit 30 in framework 50.It is to say, framework 50 is also made
For keeping maintaining part (support) function of drive circuit 30.
Framework 50 is e.g. by the wall thickness certain (such as 1.0~the 1.5mm that are formed in the way of the extension of the direction of central shaft J
Left and right) substantially cylindrical shape.It addition, the inner peripheral surface of framework 50 and outer peripheral face are structures in the way of tilting relative to central shaft J
The conical surface (inclined plane) become.
Owing to framework 50 is integrally formed with radiator 40, therefore the inner peripheral surface of framework 50 is constituted with the outer peripheral face of radiator 40
For contact of practising physiognomy mutually.
Framework 50 can be made up of the insulative resin material of such as polybutylene terephthalate (PBT) (PBT) etc..Additionally,
In the present embodiment, framework 50 can be resinous containing glass fibre, and such as polybutylene terephthalate (PBT) contains
There is the glass fibre of 25~30%.
[lamp holder]
Lamp holder 60 is the power receiving section from the outside electric power accepted for making LED module 10 (light-emitting component 12) luminescence of lamp.Lamp
60 lamp sockets being such as installed on ligthing paraphernalia.Thus, lamp holder 60 can be when LED bulb 1 to be lighted from ligthing paraphernalia
Lamp socket accepts electric power.
Lamp holder 60 is such as supplied to alternating electromotive force by source power supply.Lamp holder 60 in present embodiment is connect by two contacts
By alternating electromotive force, lamp holder 60 electric power received is input to drive circuit 30 via couple of conductor.
Lamp holder 60 is metal to have end cylindrical shape, and possessing outer peripheral face is externally threaded shell portion 61 and across insulation division
62 clavus (eyelet) portions 63 being installed on shell portion 61.Insulation division 62 is made up of such as sheet glass.
At the outer peripheral face of lamp holder 60, it is formed with the screw part for screwing togather with the lamp socket of ligthing paraphernalia.Additionally, at lamp holder 60
Inner peripheral surface, be formed with the screw part for screwing togather with the screw part 51 of framework 50.Lamp holder 60 is by being screwed into and embed this framework
The screw part 51 of 50 and be embedded in outward framework 50.
The kind of lamp holder 60 is not particularly limited, but in the present embodiment, uses the Edison-type (E type) of the formula that is screwed into
Lamp holder.Such as, as lamp holder 60, list E26 shape, E17 shape or E16 shape etc..Additionally, as lamp holder 60, it is possible to use
Plug-type lamp holder.
[module board]
Module board 70 be mounting LED module 10 mounting portion, such as interarea be the vertical view being substantially orthogonal with central shaft J be big
Cause circular plate-shaped member.LED module 10 is placed in module board 70, thus combination hot with radiator 40.Module board 70 and LED
Module 10 is fixed, so being provided with the through hole (not shown) for inserting screw 80 on module board 70 by screw 80.
Module board 70 e.g. discoideus metallic plate centered by central shaft J, is blocked with radiator 40 by circumference
Only fix.It addition, module board 70 and the fixing means of radiator 40 are not limited to based on locking fixing, it is possible to use
Other fixing means of bonding agent or screw etc..
Additionally, at the central part of module board 70, be provided with for making the couple of conductor derived from drive circuit 30 (not scheme
Show) the through hole 70a that inserts.It addition, the position of through hole 70a can not also be at the central part of module board 70.In addition it is also possible to
Through hole 70a is not set on module board 70, but notch is set at the edge part etc. of module board 70 and couple of conductor is inserted
Lead in this notch.
As module board 70, such as, use sintered body or the resin of the ceramic material of the metal of aluminum etc., aluminium oxide etc.
Deng.It addition, the shape of module board 70 is not limited to circle, it is also possible to be rectangular shape.
< feature structure >
LED bulb 1 involved by present embodiment, it is characterised in that radiator 40 and integrally formed with this radiator 40
The structure aspect of framework 50.Hereinafter, use Fig. 3~Fig. 5 further, these distinctive structures are illustrated.
Fig. 3 is the axonometric chart of radiator 40.Additionally, Fig. 4 is the sectional view of the radiator 40 at the IV-IV line of Fig. 3.This
Outward, Fig. 5 is integrally formed radiator 40 and the axonometric chart of framework 50.Specifically, Fig. 3 and Fig. 4 is to become from one
The axonometric chart that is indicated of structure under state after making framework 50 separate in the radiator 40 of shape and framework 50 and sectional view.
As shown in Fig. 1~5, radiator 40 is the cylinder surrounding drive circuit 30, and combination hot with LED module 10.
At the outer peripheral face 40a of this radiator 40, it is formed with multiple recess 41.
Such as, as shown in Figure 4, each recess 41 is formed as cross section is roughly triangular shape.It addition, the cross section shape of each recess 41
Shape without particular limitation of, for example, it may be substantially semi-circular shape or rectangular shape, but by being set to roughly triangular shape,
The demoulding of the stamped metal mould in the case of metallic plate being carried out punch process and shapes radiator 40 becomes easy, therefore
Can easily make radiator 40.Additionally, by this cross sectional shape is set to triangle, becoming for radiator 40 one
During shape framework 50, framework 50 is formed as wedge-like at each recess 41, therefore, it is possible to limit the framework 50 circle at radiator 40 more reliably
Motion in circumferential direction.
It is that 0.2mm is left that each recess 41 is formed at the small depressed part of the outer peripheral face 40a of radiator 40, the such as degree of depth
Right.It is to say, the wall thickness (such as, about 1mm) of the degree of depth of recess 41 e.g. radiator 40 substantially less than half.
Additionally, as shown in Figure 4, multiple recesses 41 are formed at position mutually different on the circumferencial direction of this radiator 40,
Specifically, uniform position it is formed on this circumferencial direction.In the present embodiment, 18 recesses 41 are with the cylinder of radiator 40
Every 20 ° of formation centered by axle (central shaft J).Here, uniform position may not be complete equally spaced position, but greatly
Cause equally spaced position, such as, as long as in the range of the error away from complete equally spaced position about 10%.
Additionally, as it is shown on figure 3, multiple recess 41 is respectively provided with in the direction extension orthogonal with the circumferencial direction of radiator 40
Linear structure.It is to say, each recess 41 extends towards LED module 10 from lamp holder 60 side of radiator 40.
So, the outer peripheral face 40a at radiator 40 is formed with multiple recess 41.On the other hand, as shown in Fig. 3~Fig. 5,
The inner peripheral surface 40b of radiator 40 does not forms recess or protuberance.It is to say, the inner peripheral surface 40b of radiator 40 is formed as smooth.
Here, " being formed as smooth ", can be formed than outer peripheral face 40a concavo-convex little concavo-convex, if such as with outer peripheral face 40a phase
Fineness degree Ra is less for specific surface.
Owing to radiator 40 is integrally formed with framework 50, therefore as it is shown in figure 5, be configured to inner peripheral surface and the heat radiation of framework 50
The outer peripheral face 40a of device 40 practises physiognomy contact mutually.It is to say, framework 50 is formed as being attached at the outer peripheral face 40a of radiator 40.
It follows that the manufacture method of the radiator 40 so constituted and framework 50 is illustrated.Fig. 6 is to integrally formed
Go out the figure that the operation of the radiator 40 in the LED bulb 1 involved by present embodiment and framework 50 is indicated.
First, as shown in (a) in Fig. 6, the radiator 40 (radiator 40 of monomer) before forming framework 50 is prepared.
It follows that as shown in (b) in Fig. 6, this radiator 40 is arranged in the metal pattern 50M of ester moulding, for radiator 40
With the gap of metal pattern 50M, the resin before the material such as installing lamp holder 60 side injection framework 50 i.e. solidifies.Then, exist
After resin solidification, by pulling down the metal pattern 50M of ester moulding, as shown in (c) in Fig. 6, produce and radiator
40 frameworks 50 formed integrally.
So, radiator 40 and framework 50 are integrally formed by such as insert molding.
[effect etc.]
Above, the LED bulb 1 involved by present embodiment is illustrated.It follows that use the figure representing comparative example
The effect that LED bulb 1 involved by 7 pairs of present embodiments plays illustrates.Fig. 7 is in the LED bulb that comparative example relates to
Radiator 940 and the sectional view of framework 950.It addition, in the figure 7, indicated by an arrow when shrinking, framework 950 produces should
Power.
Radiator 940 shown in Fig. 7 is compared with the radiator 40 in embodiment, and difference is not form recess 41.
It is to say, in a comparative example, the outer peripheral face 940a of radiator 940 is formed as smooth.
In recent years, about LED bulb, propose radiator integrally formed with framework from the viewpoint of assembling easiness
Structure.In such an embodiment, integrally formed front radiator is injected to the material i.e. resin etc. of framework from such as lamp holder side, by
This is integrally formed with framework by radiator.
But, the framework so formed, due to the impact of the pressure etc. during resin by injection, worry that thickness has deviation.Specifically
For, from being provided with in the case of lamp holder side is filled with resin, easy at the thickness of the circumferencial direction upper frame body of radiator
There is deviation.
Additionally, framework and radiator respectively due to the impact of the heat produced by LED module and expand and shrink.Now, by
Different from the linear expansion coefficient of radiator in framework, between framework and radiator, produce thermal expansion difference and thermal contraction is poor.Therefore,
When shrinking, the framework that resin material is constituted deform in the way of in the slip of the outer peripheral face of radiator.Now, in framework,
Produce from the thin part of thickness to the thick merosystolic this stress of thickness.
Thus, as it is shown in fig. 7, the framework 950 in comparative example, when shrinking, from the part 951 (thickness d min) that thickness is little
The part 952 (meet thickness d max of dmax > dmin) big to thickness is shunk.Specifically, integrally formed framework 950 with
The inner peripheral surface of radiator 940 only framework 950 contacts with the outer peripheral face 940a face of radiator 940.Therefore, expand time and
During contraction, framework 950 is to deform in the way of the outer peripheral face 940a of radiator 940 slip.Therefore, in framework 950, shrinking
Time produce tensile stress (tensile stress) in a circumferential direction.
Here, in a comparative example, the outer peripheral face 940a of radiator 940 is formed as smooth, and therefore framework 950 entirety produces
Above-mentioned stress concentrates on the part 951 that the thickness of framework 950 is less.Therefore, in a comparative example, easily produce in this part 951
Raw such as orthogonal with circumferencial direction crack (crackle).
This problem is using the feelings as the material of framework 950 of the resin (containing glass fiber resin) containing glass fibre
Become notable under condition.Generally, for containing glass fiber resin, resin, by the high fiber reinforcement of intensity and rigidity, thus becomes
For tough thermostability moulding material.But, when shaping, glass fibre orients on the flow direction of resin, therefore after solidification
Although framework 950 intensity and rigidity on this flow direction uprise, but on the direction orthogonal with this flow direction intensity and
The easy step-down of rigidity.
Therefore, in the case of by forming framework 950 from the injection of such as lamp holder side containing glass fiber resin, framework
The intensity of the circumferencial direction of 950 and rigidity step-down, the position therefore concentrated at stress easily produces orthogonal with circumferencial direction
Crack.
For this comparative example, according to the LED bulb 1 involved by present embodiment, as described below, it is possible to suppression
Crack is produced in the framework 50 integrally formed with radiator 40.
That is, according to the LED bulb 1 involved by present embodiment, possess the framework 50 integrally formed with radiator 40, dissipating
The outer peripheral face 40a of hot device 40 is formed with multiple concavo-convex (in the present embodiment for multiple recesses 41).
Thereby, it is possible to suppression is with the stress of the thermal contraction difference caused by the linear expansion coefficient difference of radiator 40 with framework 50
Concentrate on the specific part of framework 50.Specifically, by arranging multiple recess 41, frame at the outer peripheral face 40a of radiator 40
The motion of body 50 is limited by each recess of multiple recesses 41.Therefore, the overall stress produced of framework 50 is disperseed, and therefore can
Enough suppression stress concentrates on specific part.Therefore, it is possible to suppression produces crack in the framework 50 integrally formed with radiator 40.
It is to say, according to present embodiment, it is possible to realize to end-of-life framework 50 and be all not likely to produce the LED bulb 1 in crack.
Additionally, according to the LED bulb 1 involved by present embodiment, multiple recesses 41 are formed at the circumference at radiator 40
Uniform position on direction.Thus, the overall stress produced of framework 50 is uniformly dispersed, therefore, it is possible to suppress framework further
50 produce crack.
Additionally, according to the LED bulb 1 involved by present embodiment, multiple recesses 41 be respectively provided with radiator 40
The upwardly extending linear structure in side that circumferencial direction is orthogonal.Thereby, it is possible to effectively limit framework 50 fortune in a circumferential direction
It is dynamic, therefore, it is possible to suppression framework 50 produces crack further.
Additionally, according to the LED bulb 1 involved by present embodiment, the inner peripheral surface 40b of radiator 40 is formed as smooth.
Here, show concavo-convex degree with the inner peripheral surface 40b at radiator 40 to make the irregular situation of outer peripheral face 40a
Under, have framework 50 outer peripheral face produce " shrinkage cavity " situation.In the case of Gai, due to " shrinkage cavity " that produce at outer peripheral face and at frame
Body 50 produces residual stress, therefore worries easily to produce crack in framework 50.Additionally, due to " shrinkage cavity " and damage outside framework 50
Attractive in appearance in sight.On the other hand, in the present embodiment, the journey of " shrinkage cavity " is not produced by being formed at the outer peripheral face of framework 50
The small recess 41 of degree, it is possible to suppression produces crack in framework 50, is furthermore possible to ensure apparent attractive in appearance.
Additionally, according to the LED bulb 1 involved by present embodiment, framework 50 is resinous containing glass fibre.By
This, it is possible to suppression produces crack in framework 50, and can improve intensity and the rigidity of framework 50.
Additionally, according to the LED bulb 1 involved by present embodiment, it is not provided with the inner peripheral surface of radiator 40 and outer peripheral face
Through such as through hole or gap etc., is not arranged in the inside of radiator 40 by the metal pattern of ester moulding, and
Can integrally formed go out radiator 40 and framework 50.To this end, can low cost and the most integrally formed go out radiator 40 He
Framework 50.
[variation of radiator]
It follows that use Fig. 8 that the variation of radiator is illustrated.Fig. 8 is the structure of the variation to radiator 40A
The figure being indicated.Specifically, in Fig. 8, it is shown that radiator 40A and the axonometric chart of framework 50 and sectional view.
As shown in Figure 8, in radiator 40A, each recess of multiple recess 41A is formed as: the rank formed by this recess 41A
The poor part near away from LED module 10 at radiator 40A other the part compared to radiator 40A is bigger.Specifically, exist
In present embodiment, LED module 10 is configured at the top (the positive side of Z-direction in figure) of radiator 40A, and recess 41A is formed as
The degree of depth of the top of radiator 40A then this recess 41A is the deepest.
By the radiator 40A so constituted, it is possible to suppression produces crack in framework 50 further.
This is because, the thermal expansion that produces of radiator 40A and framework 50 and thermal contraction are due to by lighting LED module 10
Produce heat and occur.To this end, away from the part that LED module 10 is near, radiator 40A receives with thermal expansion difference and the heat of framework 50
Contracting difference is the biggest.Therefore, the part that LED module 10 away from framework 50 is near, the most easily produce the tensile stress of circumferencial direction, more
Easily produce crack.
Therefore, by as shown in the radiator 40A of this variation, with away from the part then rank that LED module 10 is near
The biggest mode of difference forms concavo-convex (here, forming recess 41 in the way of deepening), in the part easily producing stress, it is possible to enter
The one step suppression framework 50 motion relative to radiator 40A.Thus, can reliably make in the part easily producing stress should
Power is disperseed, therefore, it is possible to the generation in this crack of the position easily producing crack in suppression framework 50.
[other variation of radiator]
It follows that use Fig. 9 that other variation of radiator is illustrated.Fig. 9 is other change of radiator 140
The axonometric chart of shape example.
Radiator 140 as shown in Figure 9, compared with the radiator 40 of described above, difference is, each recess 141 shape
Become the most coniform.Specifically, multiple recesses 141 are formed at the outer peripheral face 140a of radiator 140, in this variation,
It is formed at position mutually different on the circumferencial direction of this radiator 140.Additionally, the recess of more than 2 in multiple recesses 141
141 (being 18 recesses 141 at this), are formed on the same circumference on the outer peripheral face 140a of radiator 140.Here, such as shape
Become the group that 18 recesses 141 having 3 groups to be formed from same circumference are constituted.It is to say, multiple recesses 141 are formed at heat radiation
On multiple different circumference on the outer peripheral face 140a of device 140.
Additionally, multiple recesses 141 in the part near away from LED module 10 of radiator 140 compared to its of this radiator 140
His part forms get Geng Mi.Specifically, in the present embodiment, LED module 10 is configured at the top (figure of radiator 140
In the positive side of Z-direction), multiple recesses 141 are thickly formed on the top of radiator 140, in the bottom of radiator 140 sparsely
Formed.Here, " sparsely being formed ", as long as less than the density of multiple recesses 141 on the top of radiator 140, also wrap
Containing the structure not forming recess 141.
Even if the radiator being formed by 140, also in the same manner as the radiator 40 of described above, it is possible to suppression is in framework
50 produce crack.
Additionally, according to the radiator 140 of this variation, near away from LED module 10 at radiator 140 of multiple recesses 141
Part is formed close, it is possible to suppress further to produce crack in framework 50.
Its reason is as it has been described above, framework 50 the most easily produces circumferencial direction away from the part that LED module 10 is near
Tensile stress, the most easily produces crack.Therefore, by making multiple recess 141 be formed close in the part near away from LED module 10,
In the part easily producing stress, it is possible to limit the framework 50 motion relative to radiator 140 further.Thus, easily producing
The part of raw stress can reliably make stress disperse, therefore, it is possible to suppression easily produces being somebody's turn to do of the position in crack in framework 50
The generation in crack.
It addition, multiple recesses 141 can not also be formed close, such as in the part near away from LED module 10 of radiator 140
Can also be to be formed uniformly at the outer peripheral face 140a of radiator 140.
Additionally, according to the radiator 140 of this variation, multiple recesses 141 are formed at the multiple differences on outer peripheral face 140a
Circumference on, the scope being thus formed with multiple recess 141 on the cylinder axis direction (Z-direction) of radiator 140 becomes big.For
This, it is possible to the broader scope suppression on the cylinder axis direction of radiator 140 produces crack in framework 50.
Alternatively, it is also possible to multiple recesses 141 are entirely formed on the same circumference of outer peripheral face 140a.
Additionally, the shape of each recess 141 is not limited to coniform, such as, can be rectangle taper, rectangular cylindrical or substantially
Hemispherical.But, as it has been described above, from the making easiness of radiator 140 and limit the framework 50 circumferencial direction at radiator 140
On motion from the viewpoint of, it is preferred that the cross sectional shape of the recess 141 orthogonal with the cylinder axle of radiator 140 is triangle
Shape.
[illuminator]
Figure 10 is the general profile chart of the illuminator 2 involved by embodiment.
As shown in Figure 10, the illuminator 2 involved by present embodiment is such as installed on the ceiling etc. of indoor and uses.
Illuminator 2 possesses the LED bulb 1 involved by above-mentioned embodiment and ligthing paraphernalia 3.
Ligthing paraphernalia 3 is used for making LED bulb 1 extinguish and light, and possesses and is installed on the appliance body 4 of ceiling and covers
The lampshade 5 of LED bulb 1.
Appliance body 4 has the lamp socket 4a that the lamp holder 60 for LED bulb 1 is installed and fed LED bulb 1.Lamp
Seat 4a is threaded into the lamp holder 60 of LED bulb 1, via this lamp socket 4a, LED bulb 1 is supplied electric power.Alternatively, it is also possible at lampshade
The peristome of 5 arranges light transmission plate.
(other variation etc.)
Above, based on embodiment and variation, the illumination light source involved by this utility model and illuminator are carried out
Explanation, but this utility model is not limited to above-mentioned embodiment and each variation.
Such as, in the above-described embodiment, radiator 40 and module board 70 are illustrated as different parts, but
They can also be same parts.It is to say, radiator 40 can also be by the punch process etc. of metallic plate with module board 70
And it is formed integrally.
Additionally, in the above-described embodiment, as outer peripheral face 40a multiple concavo-convex with multiple being formed at radiator 40
Be illustrated as a example by recess 41, but they to be not limited to concave shape can also be convex form.Even this structure, by dissipating
The outer peripheral face 40a of hot device 40 forms multiple concavo-convex (at this for multiple protuberances), it is also possible to suppression is with by radiator 40 and framework
The stress of the thermal contraction difference that the linear expansion coefficient difference of 50 causes concentrates on the specific part of framework 50.Therefore, with above-mentioned enforcement
Mode is similarly, it is possible to suppression produces crack in the framework 50 integrally formed with radiator 40.
But, radiator 40 is carried out punch process and in the case of shaping, from the viewpoint of shaping easiness, excellent
Choosing, makes to be formed at outer peripheral face 40a multiple concavo-convex for concave shape of radiator 40.Additionally, it is multiple concavo-convex as convex setting
In the case of shape, the lower thickness of the part opposed with this convex form of framework 50, therefore there is the intensity producing such as framework 50
The bad situation of reduction etc..Therefore, multiple concavo-convex can be any shape of concave shape and convex form, but it is preferred that spill
Shape.
Additionally, multiple, concavo-convex can also to be one be convex form for concave shape and another part.Additionally, multiple concavo-convex not
The structure being limited by the stamped metal mould of the punch process etc. of metallic plate and formed, it is also possible to by such as sandblasting, etching etc.
Implement and make shaggy process (surface coarsening) be formed.
Additionally, in the above-described embodiment, it is set to the multiple recesses 41 the outer peripheral face 40a of radiator 40 is formed and is formed at
Uniform position on the circumferencial direction of this radiator 40, but the configuration of multiple recess 41 is not limited to this, it is also possible to it is any configuration.
But, from making from the viewpoint of the stress dispersion that framework 50 produces, it is preferred that be formed on this circumferencial direction mutually different
Position, more preferably, it is also possible to be formed on this circumferencial direction uniform position.
Additionally, in the above-described embodiment, being set to light-emitting component 12 is SMD type LED element, but is not limited to this.Such as
Bare chip can also be used to be mounted directly (once mounting) COB (Chip On Board: chip on board) type on substrate
LED module.It is to say, as light-emitting component 12, it would however also be possible to employ LED chip itself.In such a case it is possible to by close
Multiple LED chip are sealed by envelope parts in the lump or individually.Seal member can also contain yellow fluorescence as described above
The wavelength conversion member of body etc..
Additionally, in the above-described embodiment, being set to light-emitting component 12 is to be put by blue LED die and yellow fluorophor
Go out the White LED element of the B-Y type of white light, but be not limited to this.For example, it is also possible to be configured to, use containing red fluorescence
Body and green-emitting phosphor containing fluorophor resin, and release white light by it being combined with blue LED die.Additionally, go out
Purpose in the tonal effect improving light source, it is also possible to be also mixed into red-emitting phosphors or green fluorescence except being mixed into yellow fluorophor
Body.Further, it is also possible to be configured to, it is possible to use send the LED chip of the light of color beyond blueness, such as use release than by
The UV LED chip of the short ultraviolet light of blue light wavelength that blue LED die is released, is mainly released by by uv light induction
The blue emitting phophor of blue light, red light and green light, green-emitting phosphor and red-emitting phosphors release white light.
Additionally, in above-mentioned embodiment and each variation, as light-emitting component exemplified with LED but it also may use
The semiconductor light-emitting elements of semiconductor laser etc., organic EL (Electro Luminescence: electroluminescent) or inorganic
The light-emitting component of EL etc., solid-state light emitting element in addition.
In addition, above-mentioned embodiment is implemented the various deformation that those skilled in the art expect and the mode obtained
Or without departing from the range of purport of the present utility model by any to the element in above-mentioned embodiment and function group
The mode closed and realize, is also contained in this utility model.
Claims (9)
1. an illumination light source, possesses:
Light emitting module;
Drive circuit, is used for making described light emitting module luminous;
Radiator, is the cylinder surrounding described drive circuit, and combination hot with described light emitting module;And
Framework, is the cylinder covering described radiator, and integrally formed with described radiator,
Outer peripheral face at described radiator is formed multiple concavo-convex.
2. illumination light source as claimed in claim 1,
Uniform position on the plurality of concavo-convex circumferencial direction being formed at described radiator.
3. illumination light source as claimed in claim 1,
The plurality of concavo-convex each concavo-convex have in the side upwardly extending wire orthogonal with the circumferencial direction of described radiator
Structure.
4. illumination light source as claimed in claim 1,
The plurality of concavo-convex part near away from described light emitting module at described radiator is than other the part at this radiator
Formed close.
5. illumination light source as claimed in claim 1,
The plurality of concavo-convex each concavo-convex it is, by near away from described light emitting module at described radiator of this concavo-convex jump formed
Part formed greatly than other the part at this radiator.
6. illumination light source as claimed in claim 1,
The plurality of concavo-convex in more than 2 the concavo-convex outer peripheral face being formed at described radiator same circumference on.
7. illumination light source as claimed in claim 6,
On the multiple different circumference of the plurality of concavo-convex outer peripheral face being formed at described radiator.
8. illumination light source as claimed in claim 1,
The inner peripheral surface of described radiator is formed as smooth.
9. an illuminator, possesses:
The illumination light source described in any one of claim 1~8.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015049410A JP2016170950A (en) | 2015-03-12 | 2015-03-12 | Light source for illumination and luminaire |
JP2015-049410 | 2015-03-12 |
Publications (1)
Publication Number | Publication Date |
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CN205678450U true CN205678450U (en) | 2016-11-09 |
Family
ID=56983986
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Application Number | Title | Priority Date | Filing Date |
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CN201620135671.3U Expired - Fee Related CN205678450U (en) | 2015-03-12 | 2016-02-23 | Illumination light source and illuminator |
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JP (1) | JP2016170950A (en) |
CN (1) | CN205678450U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110230784A (en) * | 2019-07-01 | 2019-09-13 | 红壹佰照明有限公司 | A kind of LED bulb |
-
2015
- 2015-03-12 JP JP2015049410A patent/JP2016170950A/en active Pending
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2016
- 2016-02-23 CN CN201620135671.3U patent/CN205678450U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110230784A (en) * | 2019-07-01 | 2019-09-13 | 红壹佰照明有限公司 | A kind of LED bulb |
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Publication number | Publication date |
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JP2016170950A (en) | 2016-09-23 |
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