CN101639170B - Lamp and lighting equipment - Google Patents

Lamp and lighting equipment Download PDF

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Publication number
CN101639170B
CN101639170B CN2009101608704A CN200910160870A CN101639170B CN 101639170 B CN101639170 B CN 101639170B CN 2009101608704 A CN2009101608704 A CN 2009101608704A CN 200910160870 A CN200910160870 A CN 200910160870A CN 101639170 B CN101639170 B CN 101639170B
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China
Prior art keywords
portion
radiator
main body
lamp
lighting
Prior art date
Application number
CN2009101608704A
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Chinese (zh)
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CN101639170A (en
Inventor
久安武志
大泽滋
田中敏也
Original Assignee
东芝照明技术株式会社
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Priority to JP2008196678A priority Critical patent/JP5218751B2/en
Priority to JP2008-196678 priority
Priority to JP2008-303794 priority
Priority to JP2008303794A priority patent/JP5163896B2/en
Application filed by 东芝照明技术株式会社 filed Critical 东芝照明技术株式会社
Publication of CN101639170A publication Critical patent/CN101639170A/en
Application granted granted Critical
Publication of CN101639170B publication Critical patent/CN101639170B/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The present invention relates to a lamp and a lighting equipment. A plurality of LEDs are provided to an outer edge side of a center position of one main surface of an LED substrate main body in a deviated manner respectively. The wiring part including the connector receiving part and the wiring hole are provided at a position that overlaps the center position of the one main surface side of the LED substrate main body. Since the power feeding part is inserted into the wiring hole, the connection part and the connector receiving part can be easily connected and therefore it becomes possible to ensure ease in assembly. Since the connector receiving part is kept away from each of the LEDs with substantially equal distance so that emitted light is hardly blocked, decrease in uniformity of light distribution can be suppressed.

Description

灯装置及照明器具 Lamp unit and the lighting

技术领域 FIELD

[0001] 本发明涉及一种具备配置着多个发光元件的元件基板的灯装置及照明器具。 [0001] The present invention relates to a lamp device comprising disposed luminaire element substrate and a plurality of light emitting elements.

[0002] 背景技术 [0002] BACKGROUND OF THE INVENTION

[0003] 先前,关于使用发光二极管(Light Emitting Diode, LED)来作为发光元件的灯装置即LED灯(lamp),例如像日本专利特开2006-313718号公报所揭示,将在外周缘部均勻地安装着LED的元件基板即LED基板安装在散热部的一端侧,灯罩(globe)覆盖所述LED基板而安装在散热部的一端侧。 [0003] previously, on a light emitting diode lamp means (Light Emitting Diode, LED) as the light emitting element, i.e., the LED lamp (LAMP), for example, as Japanese Patent Laid-Open Publication No. 2006-313718 disclosed the uniformity of the outer peripheral edge portion the substrate for an LED element is mounted i.e. the LED board mounted on one end portion of the heat dissipation side of the globe (Globe) covering the LED substrate is mounted on one end side of the heat radiating portion. 而且,在此散热部的另一端侧,插入了收容有对LED基板进行点灯控制的点灯装置的收容盒(case),在该收容盒的散热部的相反侧安装着灯口。 Further, the other end portion side of this heat, the LED is inserted accommodating cassette accommodating a substrate (Case) of the lighting control of the lighting device, the cap is mounted on the opposite side of the heat radiating portion of the storage case.

[0004] 在将点灯装置与LED基板加以连接时,考虑到组装性,优选将从点灯装置侧导出的供电线连接于LED基板侧,而且,考虑到供电线的连接性,优选在供电线的前端侧设置连接器部,将此连接器部与LED基板侧的连接器架连接。 [0004] When the lighting device to be connected to the LED substrate, considering the assembling, preferably derived from the lighting device side power supply line connected to the LED substrate side, and, given the connection of the power supply line, the supply line preferably the distal end portion side of the connector, this connector holder connector portion connected to the LED substrate side.

[0005] 然而,此种灯泡型灯有如下的问题点:连接器架会遮挡从LED发出的光,配光的均勻性有可能会下降。 [0005] However, such a self-ballasted lamp has the following problems: a connector frame will block light emitted from the LED, with uniformity of light may be decreased.

[0006] 发明内容 [0006] SUMMARY OF THE INVENTION

[0007] 本发明的目的在于,提供一种可一方面确保组装的容易性、一方面抑制配光均勻性的下降的灯装置及照明器具。 Objective [0007] The present invention is to provide a hand ensures ease of assembly, the light distribution uniformity while inhibiting a decrease in the lamp device and a lighting fixture. 本发明中包括:元件基板,具备元件基板本体、分别配置在从该元件基板本体的一主面的中心位置向外缘侧偏移的位置的多个发光元件、以及配线部,该配线部具有与所述发光元件电连接的连接支承部、以及与该连接支承部相邻接地形成且贯通元件基板本体的配线孔,并且所述配线部的至少一部分是与元件基板本体的一主面侧的中心位置相重叠而配置;散热体,在一端侧紧贴地安装着元件基板的元件基板本体的另一主面侧;灯口,安装在散热体的另一端侧;以及点灯装置,具备供电部,并对发光元件进行点灯控制,所述供电部收容在散热体和灯口之间,具有供电线、以及连接于此供电线的前端且与连接支承部相连接的连接部,并且可插通到配线孔中,其中,所述连接支承部配置在所述元件基板本体的中心位置,所述配线孔以偏移方式而与所述连接 The present invention comprises: an element substrate provided with the element substrate main body, a plurality of light emitting elements are arranged in the outer edge from the center position of one main surface of the element substrate main body side shifted position, and the wiring portion, the wire supporting portion has a connecting portion electrically connected to the light emitting element, and is connected with the support portion and formed adjacent to the through-hole wiring substrate body element, and at least a portion of the wiring portion of the element is a substrate body the center position of the main surface side overlaps arranged; radiator, mounted at one end against the other main surface of the element substrate main body of the element substrate side; the cap attached to the other end of the radiator side; and a lighting means , includes a power supply unit, and controls lighting of the light emitting element, the power supply unit accommodated between the radiator and the cap, having a power supply line, and a power supply line connected thereto and is connected to the front end portion of the connecting portion connected to the support, and the wiring may be inserted through the hole, wherein said connection support portion placed at the center of the element substrate main body, said wiring hole is connected in an offset manner with the 承部邻接配置。 Supporting section is disposed adjacent.

[0008] 本发明中,灯装置可构成为和普通白炽灯泡的形状相近似的灯泡形的灯装置(A 形)、反射(reflx)形灯泡形的灯装置(R形)、球(ball)形灯泡形的灯装置(G形)、以及圆柱形灯泡形的灯装置(T形)等。 [0008] In the present invention, the lamp device can be configured as a general incandescent bulb and a shape approximating the bulb-shaped lamp means (A type), reflection (RefLX) bulb-shaped lamp type device (R type), a ball (Ball) shaped bulb-shaped lamp device (G type), and a cylindrical bulb-shaped lamp device (T type) or the like. 进而,也可以是构成无灯罩的灯泡形的灯装置。 Further, the bulb may be constituted without the globe-shaped lamp device. 而且, 本发明并不限于和普通白炽灯泡的形状相近似的灯装置,也可应用于形成其它各种外观形状、用途的灯装置。 Further, the present invention is not limited and the shape approximating a general incandescent lamp apparatus may be applied to form the appearance of various other shapes, the use of the lamp device.

[0009] 元件基板本体例如是由散热性良好的铝等的金属所形成。 [0009] The element substrate main body, for example, is formed of a metal having good heat dissipation such as aluminum.

[0010] 发光元件例如可以是发光二极管(LED)、有机电致发光(Electroluminescence, EL)或半导体激光(laser)等的将半导体等作为发光源的发光元件。 [0010] The light emitting element may be, for example, a light emitting diode (LED), organic EL (Electroluminescence, EL) or a semiconductor laser (Laser) or the like as a light emitting element like a semiconductor light emitting source. 可根据照明的用途来选择发光元件的必需个数。 The number may be selected according to the required use of the light emitting element lighting. 发光元件优选以白色来发光,但也可根据照明器具的用途来以红色、蓝色、绿色等进行发光,进而还可将各种颜色加以组合而构成。 The light emitting element to emit light is preferably white, but may be red, blue, green, etc. The use of the light emitting luminaire, and thus may also be configured to be a combination of various colors.

[0011] 所谓配线部的至少一部分与元件基板本体的一主面侧的中心位置相重叠而配置,是指例如连接支承部及配线孔中的任一方的一部分与元件基板本体的一主面侧的中心位置相重叠的位置,或者连接支承部和配线孔之间的区域的一部分与元件基板本体的一主面侧的中心位置相重叠的位置等。 [0011] The center position of one main surface side of the substrate main body portion of the element overlaps at least a portion of the wiring is arranged a so-called, for example, refers to either a primary support portion and the connecting portion of the wiring hole of the element substrate main body the center position of the side position overlapping the center position of one main surface side of the substrate main body portion of the element region or the connection between the support portions and the wiring hole overlaps location.

[0012] 连接支承部例如是具有连接器支承部等的机械性保持机构的部分,除此之外,也可以是像端子台那样地插入着供电线而进行电连接的部分。 [0012] connected to the support portion has a portion, for example, a mechanical connector receiving portion of the holding means and the like, in addition, may be inserted into the terminal block so as to partially supply lines are electrically connected.

[0013] 关于供电部,例如在连接支承部具有连接器支承部等的机械性保持机构的情况下,可在供电线的前端具有与连接器支承部相连接的连接部,而在连接支承部为端子台等的情况下,可将插入到此端子台等中的供电线的前端侧作为连接部。 [0013] For the power supply unit, for example, a mechanical connector receiving portion such as the connection support portion while maintaining mechanism, may have a connection portion to the connector receiving portion connected to the front end of the supply line, and the connection support portions for the case where the terminal station or the like, may be inserted into the distal end side of the supply line to this terminal block and the like as a connection portion.

[0014] 散热体例如优选由含有导热性良好的铝(Al)、铜(Cu)、铁(Fe)、镍(Ni)中的至少一种的金属而形成。 [0014] For example the cooling body is preferably formed by a copper (Cu), iron (Fe), nickel (Ni) at least one metal-containing aluminum with good thermal conductivity (Al). 此外,此散热体也可由氮化铝(AlN)、碳化硅(silicone carbide, SiC) 等的工业材料而构成,还可由高导热树脂等的合成树脂而构成。 In addition, the radiator may also be an aluminum nitride (AlN), silicon carbide (silicone carbide, SiC) and other industrial materials and constituted of a synthetic resin may be highly thermally conductive resin or the like is configured. 外观形状优选形成为直径从一端部向另一端部依次变小的与普通白炽灯泡的颈部分的轮廓(silhouette)相近似的形状,此提高了应用到现有照明器具中的应用率,但此处,与普通白炽灯泡相近似并不是条件,不限定于有限的特定的外观形状。 External shape preferably has a diameter from one end of successively smaller toward the other end portion of the contour of the neck portion of a general incandescent bulb (Silhouette) approximating the shape of this application to improve the application of existing lighting fixture, but here, a general incandescent bulb phase approximation is not a condition, is not limited to a certain limited external shape.

[0015] 点灯装置包括例如具有恒定电流的直流电源等的点灯电路。 [0015] for example, the lighting apparatus comprises a DC power supply having a constant current lighting circuit.

[0016] 而且,将多个发光元件分别配置在从元件基板本体的一主面的中心位置向外缘侧偏移的位置,并且使配线部的至少一部分位于与元件基板本体的一主面侧的中心位置相重叠的位置,所述配线部包括:连接支承部,可连接与来自点灯装置的供电线的前端相连接的连接部;以及配线孔,与所述连接支承部相邻接地贯通元件基板本体,且可供点灯装置的供电部插通,借此来使供电部插通到配线孔中,从而可容易地将连接部连接到连接支承部上, 因此,可一方面确保组装的容易性,一方面使连接支承部大致均勻地远离各发光元件,不易遮挡所述各发光元件发出的光,从而可抑制配光均勻性的下降。 A main surface of [0016] Furthermore, a plurality of light emitting elements are arranged at a position outward from the edge of the center position of one main surface of the element substrate main body side offset, and the wiring portion of the element and at least a portion of the substrate body side of the center position of a position overlapping the wiring portion includes: a support portion connected to, may be connected with the front end portion is connected from the power supply line connected to the lighting device; and a wiring hole, the connection support portions adjacent ground penetrating the element substrate main body, and a power supply unit for the lighting means is inserted, whereby the power supply to the wiring portion is inserted into the hole so as to be easily connected to the connection portion connecting the support portions, therefore, can on the one hand easiness of assembly, the support on the one hand the connecting portion is substantially uniformly away from each light emitting element, the light is hardly blocked emitted from each light emitting element, the light distribution can be suppressed so as to decrease uniformity.

[0017] 而且,本发明中,散热体包括可供点灯装置的供电部插通的插通孔部,在散热体的一端侧安装着元件基板的元件基板本体的状态下,该插通孔部位于该元件基板的配线孔相对应的位置。 State [0017] Further, the present invention, the heat sink comprises a body portion of the power supply insertion hole for insertion of the lighting device, at one end of the radiator mounting element substrate main body of the element substrate, the insertion hole portion the wiring hole of the element located at a position corresponding to the substrate.

[0018] 插通孔部形成为例如具有与配线孔大致相同的直径尺寸的圆形状。 [0018] The insertion hole portion formed in a circular shape such as wiring hole having substantially the same diameter size.

[0019] 而且,在散热体的一端侧安装着元件基板的元件基板本体的状态下,在与该元件基板的配线孔相对应的位置设置插通孔部,由此可经由该插通孔部而将来自点灯装置的供电线插通到散热体内,并且可使元件基板本体与散热体一端侧的接触面积增大。 State [0019] Further, one end side of the radiator mounting element substrate main body of the element substrate provided with the insertion hole portion in the wiring hole of the element substrate corresponding to the positions, whereby the insertion hole via the power supply line portion from the lighting device is inserted into the heat dissipation body, and allows one end of the element substrate main body and the body of the contact area is increased.

[0020] 而且,本发明中包括收容盒,此收容盒使散热体与灯口绝缘,配置在所述散热体和灯口之间,且收容着点灯装置。 [0020] Further, the present invention includes a storage cartridge, the storage case body and the cap so that heat insulation is disposed between the radiator and the cap, and stores the lighting device.

[0021] 收容盒较佳是由具有电气绝缘性及耐热性的合成树脂、例如聚对苯二甲酸丁二醇酯(polybutylene terephthalate, PBT)而构成,但也可由丙烯酸树脂或丙烯腈-苯乙烯-丁二烯共聚物(acrylonitrile butadienestyrene,ABS)等的其他合成树脂而构成。 [0021] Preferably the storage case, for example polyethylene terephthalate, polybutylene terephthalate (polybutylene terephthalate, PBT) is configured having electrical insulating properties and heat resistance of synthetic resin, but may be an acrylic resin or an acrylonitrile - benzene ethylene - butadiene copolymer (acrylonitrile butadienestyrene, ABS) or the like other synthetic resin. 此收容盒的形状例如较佳是形成为有底的圆柱体,但为了节减材料费或提高散热效果等,在不破坏电气绝缘的范围内,例如也可由设有格子状等其它开口的圆柱体、棱柱体等而构成。 The shape of this example, the cartridge housing is preferably formed as a bottomed cylinder, but the material cost savings to improve the heat dissipation effect or the like, electrical insulation is not impaired in the range, for example, may also be provided with other openings lattice like cylindrical body , prism like configuration.

[0022] 而且,将点灯装置收容到配置在散热体和灯口之间且使散热体与灯口绝缘的收容盒中,由此,可容易地使点灯装置与散热体绝缘,并且点灯装置的配置变得容易。 [0022] Furthermore, the lighting device is housed and disposed between the radiator and the cap so that the cap and the heat insulating storage case, whereby the lighting device can be readily and the heat insulating member, and the lighting device configuration easier.

[0023] 而且,本发明中,散热体在一端部包括配置着元件基板的支承部,在另一端部包括配置着点灯装置的收纳凹部,在收容盒的一部分中包括连通于收纳凹部的开口部,此收容盒以介于点灯装置和散热体的收纳凹部之间的方式而配置,本发明中包括导热构件,此导热构件经由收容盒的开口部而将点灯装置与散热体的收纳凹部的表面形成热连接。 [0023] Further, the present invention, the end portion of the heat dissipation member comprises a support part where the element substrate, the other end portion comprises a storage concave portion where the lighting apparatus, includes an opening portion communicating with the accommodating recessed portion in a part of the housing of the cartridge , the storage case in a manner interposed between the storage concave portion where the lighting device and the radiator is disposed, while the surface of the storage recessed portion of the lighting device and the radiator of the present invention comprises a thermally conductive member thermally conductive member through the opening of the storage case thermally connected.

[0024] 为了提高散热性,点灯装置优选由例如铝等的导热性良好的金属来构成基板部分但也可由玻璃环氧(glass epoxy)材料、酚醛纸(paper phenol)材料、玻璃复合物(glass composite)等非金属性的构件来构成基板部分,更可由陶瓷(ceramics)等来构成基板部分。 [0024] In order to improve the heat dissipation, the lighting device is preferably made of aluminum or the like, for example, a metal excellent in thermal conductivity but also the substrate section is constituted by a glass epoxy (glass epoxy) material, phenolic paper (paper phenol) material, a glass composite (Glass composite) and other non-metallic substrate constituted section member, more be made of ceramic (ceramics) or the like constituting the substrate portion. 而且,为了实现小型化,点灯装置优选大致沿着散热体的中心轴方向而配设在收纳凹部中,但此处,可以是和中心轴正交的方向,也可以倾斜地配设。 Further, in order to achieve miniaturization of the lighting device is preferably substantially along the center axis direction of the radiator and disposed in the housing recess, but here, and may be perpendicular to the direction of the central axis, may be disposed obliquely. 进而,在散热体的收纳凹部中配设着点灯装置的内部的状态可以是气密的状态,也可以形成用以散热或排出压力的空气孔等而与外部连通的状态。 Further, in the housing recess in the radiator is disposed inside the lighting device status may be an airtight state, and the state may be formed in communication with the outside air holes or the like for cooling the discharge pressure.

[0025] 点灯装置可以是构成例如将100V的交流电压转换成24V的直流电压并供给至发光元件的点灯电路的装置。 [0025] The lighting device may be configured, for example, converting an AC voltage into a DC voltage of 100V and 24V lighting circuit means is supplied to the light emitting element. 而且,点灯装置也可以是具有用以对半导体发光元件进行调光的调光电路的装置。 Further, the lighting device may be a device having a dimmer circuit for semiconductor light emitting element of dimming.

[0026] 导热构件优选例如由导热性良好且具有电气绝缘性的耐热性的有机硅树脂(silicone resin)、环氧树月旨(印oxy resin)或聚氨基甲酸酯树月旨(urethane resin)等的合成树脂制的粘合剂而构成,并经由收容盒的开口部而填充到点灯装置和散热体的收纳凹部之间以进行热连接,但所述导热构件的材质并不限于这些合成树脂,例如也可使铝或铜等的导热性良好的金属介于点灯装置和散热体的收纳凹部之间来进行连接,还可将所述金属与合成树脂制的粘合剂加以组合来进行连接。 [0026] Preferably the thermally conductive member, for example, having an excellent thermal conductivity and electrical insulating properties of heat resistance silicone resin (silicone resin), epoxy month purpose (printing oxy resin) or polyurethane months purpose tree (Urethane resin binder) made of a synthetic resin or the like is configured, and filled into thermally connected to the storage concave portion between the lighting device and the radiator via the opening portion of the storage box, but the material of the thermally conductive member is not limited to these synthetic resins such as aluminum or copper can also good thermal conductivity metal interposed to connect between the lighting device and the storage concave portion of the radiator, the adhesive may also be made of metal and a synthetic resin composition to be to connect.

[0027] 而且,利用导热构件来对点灯装置与收纳凹部的表面进行热连接时,形成贯通于收容盒的开口部,以不使热绝缘构件介于点灯装置和收纳凹部的表面之间的方式来连通。 An opening portion [0027] Further, when to thermally connected to the surface of the lighting device and the storage concave portion of the thermally conductive member, is formed through in the storage case, so as not to thermally insulating member interposed manner between the surface lighting device and the storage concave portion to communicate. 但是,只要能确保散热性能,则也可不将开口部贯通而是残留下薄膜,使该薄膜介于所述点灯装置和收纳凹部的表面之间来进行连接,总之,使开口部的导热性比收容盒的其它部分的导热性更好。 However, as long as heat radiation performance can be ensured, it may not, but the opening through the residual film so that the film is interposed between the surface to connect the lighting device and the storage concave portion is short, so that thermal conductivity than the opening portion better thermal conductivity cassette accommodating the other part.

[0028] 进而,利用导热构件来对点灯装置与收纳凹部的表面进行热连接时,例如也可在收纳凹部的表面上形成突出部,或在点灯装置中形成突出部,进而在点灯装置与收纳凹部的表面此两者上形成突出部,通过这些方法来使点灯装置和收纳凹部的表面之间的距离接近而进行连接,从而进一步提高导热性。 [0028] Further, when to be thermally connected to the surface of the lighting device and the storage concave portion of the thermally conductive member, for example, may be formed on the housing surface of the recess of the projection or protrusion is formed in the lighting device, and thus the lighting device and the storage both the surface of the recess is formed on this protruding part, by these methods to make the distance between the surface lighting device and the storage concave portion of the proximity of the connection, thereby further improving the thermal conductivity.

[0029] 而且,本发明可提供一种灯装置,在介于点灯装置和散热体的收纳凹部之间的收容盒的一部分中,形成着连通于收纳凹部的开口部,经由该开口部并通过导热构件来将点灯装置与散热体的收纳凹部的表面进行热连接,由此来使从点灯装置产生的热有效地散热,从而可提高可靠性。 [0029] Further, the present invention provides a lamp device, in a portion of the cartridge housing between the housing recess between the lighting device and the radiator is formed with an opening portion communicating with the accommodating recess, and through the opening by the thermally conductive member to the surface of the storage recessed portion of the lighting device and the radiator thermally connected, thereby the heat generated from the lighting device efficiently dissipated, so that reliability can be improved.

[0030] 而且,本发明中,点灯装置大致沿着散热体的中心轴方向而配置在收容盒中,收纳凹部一体地具有向点灯装置突出的突出部,导热构件经由开口部而将点灯装置与突出部加以连接。 [0030] Further, the present invention, the lighting device substantially along the central axis direction of the radiator is arranged in the storage case, the storage concave portion has a protrusion protruding toward the lighting device integrally heat conducting member via the opening and the lighting device protrusion to be connected.

[0031] 本发明中,点灯装置是大致沿着散热体的中心轴方向而配置在收容盒中,但也可不必严格地与中心轴平行地配设此点灯装置,例如也可在相对于中心轴倾斜的状态下配置此点灯装置,总之,以点灯装置的基板部分的较广的板面与收纳凹部的突出部相向的方式, 大致沿着中心轴方向来配设此点灯装置即可。 [0031] In the present invention, the lighting means is disposed substantially along the central axis direction of the radiator in the storage box, but may not necessarily be strictly in parallel with the central axis of this lighting device is provided, for example, it may be with respect to the center axis inclined under this configuration the lighting means, in short, a wide portion projecting plate surface of the storage concave portion of the substrate portion opposite to the lighting apparatus of the embodiment, substantially along the central axis direction with this lighting device can be provided. [0032] 而且,也可使向点灯装置突出的突出部的表面形成为凹状,或形成凹凸部,以进一步增大与导热构件的接触面积。 [0032] Further, the surface can also protruding toward the lighting device projecting portion formed in a concave shape, or a convex portion is formed to further increase the contact area with the heat conducting member.

[0033] 而且,本发明可提供一种灯装置,由于将点灯装置大致沿着散热体的中心轴方向而配置在收容盒中,因此可构成小型的灯装置,并且能够使点灯装置位于纵方向上,使较广的面积与散热体的收纳凹部相对向,从而可增大与导热构件连接的面积,由此,可使从点灯装置产生的热更有效地散热,从而提高可靠性。 [0033] Further, the present invention provides a lamp device, since the lighting device substantially along the central axis direction of the radiator is disposed in the accommodating cassette, it can be configured compact lamp device and the lighting device can be positioned in the longitudinal direction on the wider area of ​​the housing recess portion relative to the radiator, thereby increasing the area of ​​the connection to the heat conducting member, thereby, it allows the heat generated from the lighting apparatus more effectively dissipate heat, thereby improving reliability.

[0034] 而且,由于收纳凹部一体地形成向点灯装置突出的突出部,因此,可使点灯装置与收纳凹部的距离接近,并且能够减少粘合剂的使用量,从而在成本方面也有利。 [0034] Further, since the protruding portion protrudes toward the lighting device integrally housing recess, thus, it allows the lighting means from the proximity of the storage concave portion, and the amount of adhesive used can be reduced, so is also advantageous in terms of cost.

[0035] 而且,本发明中包括:具备插座(socket)的器具本体、以及在此器具本体的插座上安装着灯口的LED灯。 [0035] Further, the present invention comprises: a socket (Socket) apparatus body, and the cap is mounted on the socket of this LED light fixture body.

[0036] 本发明中,照明器具可以是顶棚直接安装型、顶棚垂吊型或壁面安装型的筒灯(down light),进而可以是顶棚埋入型的筒灯等。 [0036] In the present invention, the lighting fixture may be ceiling mounting type, a ceiling hanging type or wall installation type downlight (down light), and thus may be a ceiling type downlight. 可在器具本体上安装灯罩、遮光物(shade)、反射体等来作为限光体,也可使灯装置露出。 Fixture body may be mounted on the globe, a shade (Shade), a reflector or the like as a light limiter, also allows the lamp device is exposed. 而且,照明器具并不限于在器具本体上安装1个灯装置,也可以安装多个灯装置。 Further, the lighting apparatus is not limited to a lamp device mounted on the fixture main body, a plurality of lamps may be mounted devices. 进而,还可以构成办公室(office)等设施、业务用的大型照明器具等。 Furthermore, it can also constitute Office (office) facilities, business with large-scale lighting equipment.

[0037] 而且,可利用装入到器具本体中的灯装置,来构成能一方面确保组装的容易性,一方面抑制配光均勻性的下降且可提高可靠性的照明器具。 [0037] Further, use may be loaded into the fixture lamp device body, can be formed on the one hand to ensure ease of assembly, while inhibiting the light distribution uniformity decreases and improve the reliability of the lighting fixture.

附图说明 BRIEF DESCRIPTION

[0038] [0038]

[0039] [0039]

[0040] [0040]

[0041]图。 [0041] FIG.

[0042] [0042]

[0043]体图。 [0043] FIG thereof.

[0044] [0044]

[0045] [0045]

[0046] [0046]

图1是表示本发明的第一实施方式的灯装置的纵剖面图。 FIG 1 is a longitudinal sectional view of a lamp device according to the first embodiment of the present invention. 图2是所述灯装置的元件基板的平面图。 FIG 2 is a plan view of the element substrate of the lamp device. 图3是所述灯装置的侧视图。 FIG 3 is a side view of the lamp unit.

图4是示意地表示将安装着所述灯装置的照明器具设置于顶棚面的状态的说明 4 is a schematic showing the mounting of the luminaire described lamp unit is provided in a state of the roof surface

图5是表示本发明的第二实施方式的灯装置的纵剖面图。 FIG 5 is a longitudinal sectional view of a lamp device according to a second embodiment of the present invention. 图6表示本发明的第三实施方式的灯装置,图6A是纵剖面图,图6B是收容盒的立 FIG. 6 shows a third embodiment of the present invention, the embodiment of the lamp device, FIG. 6A is a vertical sectional view, FIG. 6B is a vertical storage case

图7是将图6的灯装置(拆除了电路基板的状态)纵向切断而表示的立体图。 FIG 7 is a perspective view of the lamp device (circuit substrate removed) of FIG. 6 and indicated by the longitudinal cutting. 图8是表示所述灯装置的点灯装置的温度与先前例的点灯装置的温度的图表。 FIG 8 is a graph showing the temperature of the temperature of the lamp lighting device of the lighting device of the apparatus of the previous embodiment. 图9表示所述灯装置的变形例,图9A是将第一变形例切缺一部分而表示的纵剖面图,图9B是将第二变形例切缺一部分而表示的纵剖面图,图9C是表示第三变形例中的突出部的立体图,图9D是表示第四变形例中的突出部的立体图。 9 shows a modified embodiment of the lamp device, FIG 9A is a first modification in which a longitudinal sectional view showing a part, FIG. 9B is a second modification in which a longitudinal sectional view showing a part, FIG. 9C is a third modification of the perspective projection of FIG embodiment, and FIG. 9D is a perspective view of the protruding portion of the fourth modification.

[0047] 11:灯泡型LED灯 [0047] 11: compact LED lamp

[0048] 13,61 :散热体 [0048] 13,61: radiator

[0049] 14a、16a、31a、65a :—端 [0049] 14a, 16a, 31a, 65a: - end

[0050] 15:点灯电路基板 [0050] 15: lighting circuit substrate

[0051] 16b:阻塞板 [0051] 16b: blocking plate

[0052] 16e:凸缘部 [0052] 16e: flange portion

[0053] 18 :器具本体 [0053] 18: an equipment main body

12 =LED基板14 :灯罩14b、16d、31b、65b :另- 12 = LED substrate 14: lampshade 14b, 16d, 31b, 65b: the other -

16,62 :收容盒16c :连通孔17 :灯口 16,62: housing box 16c: communication hole 17: the cap

18a、62a、62b :开口部 18a, 62a, 62b: opening portion

端1[0054] 19 :筒灯 21 =LED基板本体[0055] 21a、21b :主面 22 =LED[0056] 23 :连接器支承部 24 :配线孔[0057] 25 :配线部 27 :螺钉[0058] 28 :螺钉切缺部 31 :散热体本体[0059] 32 :扩径部 32a :基板安装面[0060] 32b :螺钉固定孔 32c :凹槽部[0061] 33,66 :散热片 34 :插通孔部[0062] 37,72 :嵌合凹部 41 :点灯电路基板〕[0063] 45:供电线 46 :连接部[0064] 47:供电部 51 :壳体[0065] 52 :绝缘部 53 :眼孔[0066] 55 :反射体 56 :插座[0067] 62c :卡止部 62d :灯口安装部[0068] 62e:排除空气用的孔 65f:引导槽[0069] 62g :连通孔 62h :螺钉孔[0070] 63 :导热构件 65 :散热体本体[0071] 71、72a :开口部 74,81b :凹部[0072] 75 :支承部 75a :段部[0073] 77 :插通孔 81 :突出部[0074] 81a:凸状部 91,92 :零件[0075] 94 :粘合剂 A :光源部[0076] A:尺寸 C :中心位置[0077] E :接地线 MD :最大径位置[0078] x、y、z End 1 [0054] 19: Down 21 = LED substrate main body [0055] 21a, 21b: 22 = LED [0056] 23 main surface: the connector receiving part 24: wiring hole [0057] 25: wire portion 27: screw [0058] 28: screw cutout 31: radiator main body [0059] 32: enlarged diameter portion 32a: substrate attachment surface [0060] 32b: screw hole 32c: groove portion [0061] 33, 66: fin 34: insertion hole portion [0062] 37, 72: fitting recess portion 41: lighting circuit board] [0063] 45: power feed line 46: connection portion [0064] 47: power unit 51: housing [0065] 52: insulating 53: eyelet [0066] 55: reflector 56: outlet [0067] 62c: engagement portion 62d of: mounting the cap portion [0068] 62e: to exclude the air hole 65f with: guide groove [0069] 62g: communication hole 62 h: screw hole [0070] 63: heat conducting member 65: radiator main body [0071] 71, 72a: opening portion 74,81b: a concave portion [0072] 75: bearing portion 75a: segment portion [0073] 77: insertion hole 81 : projecting portion [0074] 81a: convex portions 91 and 92: parts [0075] 94: pressure-sensitive adhesive A: light source unit [0076] A: size C: center position of [0077] E: a ground line MD: maximum diameter position [0078] x, y, z :轴线 : Axis

5/15 页 5/15 page

具体实施方式 Detailed ways

[0079] 以下,参照附图来对本发明的一实施方式进行说明。 [0079] Hereinafter, with reference to the drawings of an embodiment of the present invention will be described.

[0080] 图1至图4中表示出第一实施方式,图1是灯装置的纵剖面图,图2是灯装置的元件基板的平面图,图3是灯装置的侧视图,图4是示意地表示将安装着所述灯装置的照明器具设置于顶棚面的状态的说明图。 [0080] Figures 1 to 4 shows a first embodiment, FIG. 1 is a longitudinal sectional view of a lamp device, FIG. 2 is a plan view of the element substrate of the lamp device, FIG. 3 is a side view of the lamp device, FIG 4 is a schematic explanatory view showing a lamp of the luminaire means is provided in the ceiling surface state will be mounted.

[0081] 在图1及图3中,11表示作为灯装置的灯泡型灯即灯泡型LED灯,此灯泡型LED灯11的构成如下:作为元件基板的LED基板12安装在散热体13的一端侧,灯罩14覆盖LED 基板12而安装在此散热体13的一端侧,在此散热体13的另一端侧,安装着收容有作为点灯装置的点灯电路基板15的绝缘盒即收容盒16,在此收容盒16上安装着灯口17。 [0081] In FIG 1 and FIG 3, 11 denotes constituting a lamp device-ballasted lamp i.e. bulb-type LED lamp, the bulb-type LED lamp 11 as follows: an LED board element substrate is mounted at one end of the radiator 13 of 12 side, the globe 14 covers the LED substrate 12 is attached at one end side of this radiator 13 is, in this other end 13 side of the radiator, mounted accommodating a lighting circuit substrate lighting device of the insulating case 15, i.e., the storage case 16, in this housing 17 mounted on the cap 16 cassette. 此外, 该灯泡型LED灯11具有与所谓的迷你氪气(mini krypton)灯泡相同的全长。 In addition, the LED lamp bulb 11 has a so-called mini-krypton (mini krypton) bulb same total length. 而且,如图4所示,该灯泡型LED灯11例如是以可装卸的方式安装在器具本体18中,从而构成作为照明器具的筒灯19,其中该器具本体18埋入设置在商店等的顶棚面X内。 Further, as shown, the bulb type LED lamp 11 is, for example, 4 may be detachably mounted in the fixture main body 18, thereby forming a lamp 19 as a lighting fixture, wherein the fixture main body 18 is provided at the store or the like is buried a ceiling surface X.

[0082] 如图1及图3所示,LED基板12包括:俯视时呈圆形状的元件基板本体即LED基板本体21 ;安装在此LED基板本体21的一主面21a侧的多个、例如8个作为发光元件的半导体发光元件即LED22 ;以及配线部25,所述配线部25具有安装在LED基板本体21的另一主面21b侧的作为连接支承部的连接器支承部23、以及贯通LED基板本体21的圆孔状的配线孔24。 [0082] As shown in FIG. 1 and FIG. 3, the LED substrate 12 includes: a circular shape, i.e., a plan view of the element substrate main body 21 of the LED substrate main body; a plurality of the one main surface 21a side of the LED substrate main body 21 is installed, e.g. 8 as the semiconductor light-emitting elements, i.e., LED 22; 25 and the wiring connector unit 25 has a support portion 23 connected to a support portion attached to the other main surface 21b side of the LED substrate main body 21 of the wiring portion, and a through-hole-shaped LED substrate main body 24 of the wiring hole 21.

[0083] 如图1及图2所示,LED基板本体21例如是由散热性良好的铝等的金属材料或者绝缘材料等所形成的金属(metal)基板,在两侧部上分别切缺形成了螺钉切缺部观,此螺钉切缺部观是以面接触的方式,通过作为固定机构的热结合机构即螺钉27而紧贴固定在散热体13上。 [0083] As shown in FIG. 1 and FIG. 2, the metal LED substrate main body 21, for example made of heat resistant metal material such as aluminum or the like formed by an insulating material (Metal) substrate, on both sides of each cutout portion is formed a screw concept cutout portion, by way of the contact surface of this screw concept cutout portion, by means of a heat fixing means binding that is fixed in close contact screw 27 and the radiator 13. 而且,在此LED基板本体21的一主面21a上,例如经由有机硅树脂等的未图示的电气绝缘层而形成着由铜箔等的导电构件所组成的配线图案。 Further, in the LED substrate main body 21 of the one main surface 21a, for example, silicone resin (not shown) such as an electrical insulating layer is formed with the wiring pattern via a conductive member composed of a copper foil or the like. 进而,在此LED基板本体21的另一主面21b上形成着未图示的电气绝缘层。 Further, on the other main surface 21b of the LED substrate main body 21 is formed with an electrically insulating layer (not shown). 也可以根据需要来贴附绝缘片材, 从而形成该电气绝缘层。 May also be attached to the insulating sheet is required to form the electrically insulating layer. 再者,该LED基板本体21也可以通过例如散热性优异的有机硅(silicone)类的粘合剂等而粘合到散热体13上。 Furthermore, the LED substrate main body 21 may be, for example, by a silicone adhesive or the like having excellent heat dissipation (Silicone) class adhered to the radiator 13.

[0084] 各LED22是彼此具有大致相同性能的高亮度、高输出的发光二极管,包括例如发出蓝色光的未图示的裸芯片(bare chip)、以及覆盖该裸芯片的由有机硅树脂等所形成的未图示的树脂部,在此树脂部内混入着未图示的荧光体,该荧光体是被裸芯片发出的蓝色光的一部分激发而主要放射出蓝色的补色即黄色的光,各LED22可获得白色系的照明光, 并具有例如0. 5W左右的消耗电力。 [0084] LED22 each having substantially the same properties of another light emitting diode of high luminance, high-output, including, for example emitting blue light (not shown) of the bare chip (bare chip), and covering the bare chip of a silicone resin or the like (not shown) formed in the resin portion, the resin portion is mixed in the phosphor (not shown), which is part of the phosphor excited by the blue light emitted from the bare chip mainly emits yellow light complementary Seji blue, each LED22 obtained whitish light illumination, and power consumption has, for example about 0. 5W. 而且,这些LED22被安装在LED基板本体21的一主面21a的配线图案中而彼此串联地电连接,在LED基板本体21的一主面21a的外缘部上,在彼此大致等间隔地分开的状态下,这些LED22配置在以LED基板本体21的中心位置C为中心的同一圆周上。 Furthermore, these LED22 is mounted on a main surface of the wiring pattern 21a of the LED substrate main body 21 are electrically connected in series to each other, the outer edge portion 21a on one main surface of the LED substrate main body 21, at substantially equal intervals from each other the separate state, the LED22 arranged on the same circumference to the center position C LED substrate main body 21 as a center. 而且,这些LED22向与LED基板本体21的一主面21a大致垂直的方向放射出光。 Further, the light is emitted to LED22 LED substrate main body 21 of the one main surface 21a substantially perpendicular direction.

[0085] 连接器支承部23是成为与各LED22电连接,并且与点灯电路基板15侧相连接的受电端子的连接器极板(连接器架),该连接器支承部23例如是由合成树脂等所形成,且中心位置对准LED基板本体21的一主面21a的中心位置C而配置着。 [0085] The connector receiving part 23 is to be electrically connected to each LED22, and the connector plate (connector frame) and the receiving terminal side of the lighting circuit board 15 is connected to the connector receiving portion 23, for example, a synthetic resin or the like is formed, and the center position of one main surface 21a is aligned with the center position C LED substrate main body 21 is disposed. 而且,该连接器支承部23为朝向上方形成开口的立式配置。 Moreover, the connector receiving part 23 is formed an opening configured for vertical upward.

[0086] 配线孔M是与连接器支承部23相邻接地配置,例如具有比所述连接器支承部23 的最大外形更大的直径尺寸。 [0086] M is a ground wiring holes 23 disposed adjacent to the connector receiving portion, for example greater than a maximum outer shape of the connector receiving portion 23 having a diameter dimension. 因此,配线孔M配置在LED基板本体21的中心位置C的附近,且配置于在直径方向(LED基板本体21的外圆周方向)上与此中心位置C偏离(偏移(offset))尺寸a的位置。 Thus, the wiring hole M disposed in the vicinity of the center position C of the LED substrate main body 21, and is disposed offset from the central position C (offset (offset)) dimension in the diameter direction (outer circumferential direction of the LED substrate main body 21) a position.

[0087] 此外,如图1及图3所示,散热体13包括:大致圆柱状的散热体本体31 ;在该散热体本体31的一端31a侧以扩径状而连续的扩径部32 ;以及遍及所述散热体本体31与扩径部32的外周面而连续的多个散热片(radiating fin) 33,所述散热体本体31、扩径部32及各散热片33例如是利用导热性良好的铝等的金属材料或者树脂材料等,通过铸造、锻造或者切削加工等经加工之后,一体地成形为内部有空洞的内壁厚的构件。 [0087] Further, as shown in FIG. 1 and FIG. 3, the radiator 13 comprises: a substantially cylindrical radiator main body 31; 31a at one side of the radiator main body 31 to form the enlarged diameter portion 32 continuous diameter; and the radiator main body 31 over the outer peripheral surface of the enlarged diameter portion 32 and a plurality of continuous fins (radiating fin) 33, the radiator main body 31, the enlarged diameter portion 32 and each fin 33 is in thermal conductivity e.g. good metal material such as aluminum or a resin material or the like, by casting, forging or the like by machining after machining, is integrally formed inside the wall of the internal hollow member. 而且,该散热体13 的横剖面形状大致呈圆形,外周面形成为直径从一端向另一端依次变小的大致圆锥状的锥形(taper)面,从而外观上构成为与普通白炽灯泡的颈部的轮廓相近似的形状。 Further, the radiator 13 is cross-sectional shape substantially circular outer peripheral surface having a diameter substantially successively smaller conical taper (taper) from one end to the other end surface, thereby forming the appearance of a general incandescent bulb approximating the shape of the contour of the neck. 而且,贯通散热体本体31及扩径部32而形成着插通孔部34。 Further, through the radiator main body 31 and the enlarged diameter portion 32 is formed with the insertion hole portion 34.

[0088] 在散热体本体31的另一端31b侧,沿着中心轴而设置有插入收容盒16的一端16a 侧的作为收纳凹部的嵌合凹部37。 [0088] In the other end of the radiator main body 31 of side 31b, along the central axis 16 is provided with an insertion end 16a of the cartridge accommodating side fitting recess portion 37 as a storage concave portion. 该嵌合凹部37的横剖面形成为以散热体13的中心轴yy为中心的大致圆形,且与插通孔部34连通。 The cross section of the fitting recessed portion 37 is formed as a central axis yy radiator 13 as its center substantially circular and communicating with the insertion hole portion 34.

[0089] 扩径部32是从散热体本体31侧以扩径的方式而形成为扁平的球体状,该扩径部32的上端侧成为作为载置着LED基板12的LED基板本体21的支承部的平坦状的基板安装面32a。 [0089] The enlarged diameter portion 32 is from 31 side of the radiator main body as to diameter is formed in a flattened spherical shape, an upper end 32 of the side of the enlarged diameter portion has become as a support mounting the LED substrate main body LED substrate 12 21 flat surface 32a of the substrate mounting portion. 而且,插通孔部34的上端部面向所述基板安装面32a,并且在所述基板安装面3¾ 中,与LED基板12的螺钉切缺部观相对应地穿设着用以固定所述螺钉27的螺钉固定孔32b。 Further, the upper end portion of the insertion hole portion 34 facing the substrate mounting surface 32a, and the mounting surface of the substrate in 3¾, screw the LED substrate 12 corresponding to the cutout portion Concept disposed through the screw 27 to fix the the screw hole 32b. 即,插通孔部34是形成于在直径方向上与基板安装面32a的中心位置稍有偏离(偏移)的位置。 That is, the insertion hole 34 is formed in a portion in the diameter direction is slightly deviated from the center position of the substrate attachment surface 32a (offset) position. 进而,在扩径部32的基板安装面32a的外缘部附近,将灯罩14的一端1½侧的端部嵌合卡止的凹槽部32c沿着圆周方向而连续地形成为圆形状。 Further, in the vicinity of the outer edge portion of the substrate attachment surface 32a of the enlarged diameter portion, the end portion of the fitting groove portion of the one end side of the card 1½ stopper 32c of the globe 14 in the circumferential direction continuously formed into a circular shape.

[0090] 以直径方向上的突出量从散热体本体31向扩径部32侧逐渐变大的方式,倾斜地形成着散热片33。 [0090] In the diameter direction of the protrusion amount from the radiator main body 31 to the enlarged diameter portion 32 side gradually becomes larger, the fins 33 are formed with the inclination. 而且,这些散热片33是彼此大致相距等间隔地形成在散热体13的圆周方向上。 Further, these fins 33 are spaced from each other substantially in the circumferential direction like the radiator 13 intervals.

[0091] 插通孔部34形成为具有与配线孔M大致相等的直径尺寸的圆孔状。 [0091] The insertion hole 34 is formed as a circular hole having a wiring hole with a diameter substantially equal to M size.

[0092] 灯罩14是由透明或乳白色等的具有光扩散性的玻璃或者合成树脂等而形成为扁平的球面状,并成为与散热体13的扩径部32的上端侧连续的形状,即,成为与普通白炽灯泡的球状部分的轮廓相近似的光滑的曲面状。 [0092] The globe 14 is made of glass having a light diffusion property or the like of a transparent or opalescent or a synthetic resin or the like is formed in a flat spherical shape and become a continuous shape the upper end 32 side of the enlarged diameter portion of the radiator 13, i.e., It is similar to the contour of the bulbous portion of the common filament lamp like a smooth curved surface. 而且,该灯罩14是以从一端1½侧逐渐扩开的方式而形成,并以直径从最大径位置MD向另一端14b侧逐渐缩小的方式而形成,最大径位置MD是比LED基板12的各LED22更靠上方的位置。 Moreover, the globe 14 is formed from one end side is gradually widened 1½ manner and diameter is formed from the maximum diameter position MD to the other end 14b side of the tapering embodiment, the maximum diameter position MD of each LED board 12 than the LED22 position above the. 进而,该灯罩14覆盖LED基板12 的发光面,一端Ha侧利用例如有机硅树脂或者环氧树脂等的粘合剂而固定在散热体13的扩径部32的周缘上。 Further, the globe 14 covers the light emitting surface of the LED substrate 12, one end side of Ha using an adhesive such as silicone resin, epoxy resin, or the like is fixed on the periphery of the radiator 13 of the enlarged diameter portion 32. 结果,借由灯罩14来覆盖且保护LED基板12,并且散热体13的外周面形状成为与灯罩14的外周面形状一体地大致连续的外观形状,灯泡型LED灯11的整体形状构成为与普通白炽灯泡整体的轮廓更近似的形状。 As a result, covered by the globe 14 and protect the LED substrate 12 and the radiator outer circumferential surface shape 13 becomes an outer peripheral surface shape of the globe 14 integrally a substantially continuous external shape, a bulb-type LED lamp overall shape 11 is configured with common incandescent bulbs outline of the overall shape more closely.

[0093] 点灯电路基板15包括:例如由玻璃环氧材料等而形成为平板状的点灯装置本体即点灯电路基板本体41 ;安装在此点灯电路基板本体41中的构成点灯电路的未图示的多个电子零件即电路元件;以及供电部47,该供电部47具备基端侧电连接于点灯电路的供电线45、及电连接于该供电线45的前端侧的连接部46,所述点灯电路基板15沿着轴方向而收容在收容盒16内。 [0093] The lighting circuit substrate 15 comprises: for example, a glass epoxy material or the like is formed as a flat plate-like lighting device body i.e. the lighting circuit substrate main body 41; constituting the lighting circuit (not shown) mounted in this lighting circuit substrate main body 41 a plurality of electronic circuit elements i.e. parts; and a power supply unit 47, the power supply unit 47 includes a base end electrically connected to the power supply line of the lighting circuit 45, and is electrically connected to the distal end of the feed line 45 of the connecting portion 46, the lighting circuit board 15 along the axial direction housed in the housing box 16. 而且,在此点灯电路基板15的输入端子上连接着输入线(未图示)。 Moreover, in this lighting circuit substrate 15 on the input terminal is connected to the input line (not shown).

[0094] 点灯电路例如是对LED22供给恒定电流的电路等,该点灯电路将100V的交流电压转换成MV的直流电压并供给至各LED22。 [0094] The lighting circuit is a circuit example, a constant current is supplied to the LED 22 and the like, a lighting circuit which converts 100V AC voltage into a DC voltage and supplied to each MV LED22.

[0095] 供电线45是用以将来自点灯电路侧的电力供给至LED基板12侧的供电线,该供电线45的长度相对于直到LED基板12为止的距离有余量。 [0095] The feed line 45 is used for electric power supplied from the lighting circuit side to the power supply line LED 12 side of the substrate, the length of the supply line 45 with respect to the distance up to the margin 12 LED substrate. 再者,该供电线45的剩余的长度部分可收容在所述插通孔部;34内。 Further, the length of the remaining portion of the power supply line 45 may be accommodated in said insertion hole portion; within 34.

[0096] 连接部46是成为连接着供电线45的前端侧的供电端子的连接器外壳(connector housing),该连接部46从上方向下方插入并固定在LED基板12侧的连接器支承部23上, 即,插入并固定在与LED基板本体21交叉(垂直)的方向上,借此来将供电线45(点灯电路)经由连接器支承部23而电连接于LED22侧。 [0096] connection portion 46 is to be connected to the distal side of the power supply line 45 of the connector housing power supply terminal (connector housing), the connecting portion 46 is inserted from the top to the bottom and the connector receiving part 23 is fixed to 12 side of the LED substrate , i.e., inserted and fixed in a direction crossing the LED substrate main body 21 (vertical), whereby the feed line 45 to the (lighting circuit) via the connector receiving part 23 is electrically connected to LED22 side. 而且,该连接部46的最大外形被设定得比配线孔M及插通孔部34的直径尺寸更小。 Further, the maximum outer connecting portion 46 is set larger than M and the wiring hole diameter of the insertion hole portion 34 smaller. 因此,供电线45及连接部46 (供电部47)可插通到配线孔M及插通孔部34中。 Thus, the power supply line 45 and the connection portion 46 (the power supply portion 47) may be inserted into the wiring hole portion M and the insertion hole 34. 另外,在本实施方式中,该连接部46是设为与供电线45不同的另外的构件,但例如在连接支承部是端子台等的情况下,该连接部46也可设为供电线45的前端侧本身。 Further, in the present embodiment, the connecting portion 46 are different additional member 45 to the power supply line, but for example in connection receiving part is a terminal station such case, the connecting portion 46 may be set to the power supply line 45 the distal side themselves. [0097] 收容盒16是用以使点灯电路基板15和散热体13之间电气绝缘的构件,利用例如PBT树脂等的具有绝缘性的材料,沿着嵌合凹部37内的形状而形成为大致圆柱状。 [0097] The storage box 16 is used to make the electrically insulating member 13 between the lighting circuit substrate 15 and the radiator, for example, using an insulating material such as a PBT resin, is formed along the shape of the fitting recess 37 of a substantially cylindrical. 而且,利用作为盒阻塞部的阻塞板16b来阻塞该收容盒16的一端16a侧,在此阻塞板16b上,开口形成着具有与插通孔部34大致相等的直径尺寸且连通于该插通孔部34的连通孔16c。 Further, by using as the blocking plate cassette blocking portion 16b to block the end 16 of the housing box 16a side, on this obstruction plate 16b, an opening is formed with having 34 insertion hole portion is substantially equal to the diameter and communicating with the inserted the hole portion of the communication hole 16c 34. 进而,在此收容盒16的一端16a侧和另一端16d侧的中间部的外周面上,用以使散热体13的散热体本体31的另一端31b和灯口17之间绝缘的绝缘部即凸缘(flange)部16e朝直径方向突出,并连续地形成在整个圆周方向上。 Further, the outer peripheral surface of this intermediate housing portion 16a side and the other end side of the end 16d of the cartridge 16 to the radiating body radiator main body 13 of the insulation between the insulating portion 1731 and the other end of the cap 31b i.e. flange (flange) portion 16e projecting toward the radial direction, and is continuously formed over the entire circumferential direction. 再者,也可以埋没该点灯电路基板15的方式, 将具有散热性及绝缘性的填充材料即有机硅系的树脂等填充到收容盒16的内部。 Further, the embodiment may be buried in the lighting circuit substrate 15, having a heat insulating property and a filler that is a silicone-based resin or the like is filled into the interior of the housing 16 of the cassette.

[0098] 灯口17例如是爱迪生型(Edison type)的E17型的灯口,该灯口17通过未图示的配线而与点灯电路基板15侧电连接,且包括:柱状的壳体(shell)51,具备旋入到未图示的照明器具的灯插座中的螺纹;以及眼孔(eyelet)53,经由绝缘部52而设置在所述壳体51 的一端侧的顶部,该灯口17例如通过粘合或者敛合等方法而固着在收容盒16上。 [0098] The cap 17 is, for example, an Edison-type (Edison type) lamp base of E17 type, the cap 17 is electrically connected to the lighting circuit substrate 15 side by a wiring (not shown), and comprising: a cylindrical housing ( the shell) 51, is provided (not shown) screwed into the lamp socket of the lighting fixture; and eye (eyelet) 53, 52 via an insulating portion 51 provided at the top end side of the housing, which the cap 17, for example by an adhesive or a caulking and the like fixed in the cartridge housing 16.

[0099] 壳体51与未图示的电源侧电连接,在此壳体51的内部,在与收容盒16之间,夹入着用以对点灯电路基板15的点灯电路供电的未图示的电源线并与壳体51导通。 [0099] housing 51 is electrically connected to the power side, not shown, in the interior of this housing 51, and between the cartridge housing 16, not shown for sandwiching the lighting circuit of the lighting circuit substrate 15 is powered the housing and the power cord 51 is turned on.

[0100] 眼孔53与未图示的接地(ground)电位电连接,与点灯电路基板15的点灯电路的接地电位电连接的接地线E通过焊接等方法而电连接于此眼孔53。 [0100] eyelet 53 is electrically connected to the ground potential (not shown) of the (ground), the ground line E connected to the ground potential of the lighting circuit of the lighting circuit substrate 15 by soldering or the like eyelet 53 is electrically connected thereto.

[0101] 而且,器具本体18是将例如具有E17型的灯口的普通白炽灯泡作为光源的筒灯式的现有照明器具用的构件,且形成为在下表面具有开口部18a的金属制的盒状,在开口部18a中嵌合着金属制的反射体55,并且安装着可供灯口17旋入的插座56。 [0101] Further, the equipment main body 18 is, for example, an ordinary incandescent lamp having the E17 port member as bubbles existing downlight type lighting apparatus using a light source, and having an opening formed in the metal portion 18a as the lower surface of the cartridge shaped, it is fitted in the opening portion 18a of the reflector 55 made of metal, and for the cap 17 screwed into socket 56 mounted.

[0102] 反射体55例如是由不锈钢(stainless)等的金属板所构成,在上面板的中央部设置着插座56。 [0102] The reflector 55 is constituted by, for example, a metal plate of stainless steel (Stainless) or the like, at a central portion of the upper panel 56 is provided with the socket.

[0103] 另外,筒灯19是普通白炽灯泡用的现有的构件,为了节能及长寿命化等,使用所述灯泡型LED灯11来代替白炽灯泡。 [0103] Further, the downlight 19 is an existing member used in common incandescent bulbs, for energy saving and long life, etc., using the self-ballasted LED lamp 11 in place of incandescent bulbs. 即,由于灯泡型LED灯11的灯口17为E17型,因此, 可直接插入到所述插座56中。 That is, since the LED lamp bulb 11 the cap 17 is E17 type, therefore, can be directly inserted into the socket 56. 此时,散热体13形成为大致圆锥状的锥形面,外观上构成为与白炽灯泡的颈部的轮廓相近似的形状,因此,颈部可不与插座56周边的反射体55等接触而顺利地插入到所述插座56中,从而在现有的器具本体18中应用灯泡型LED灯11的应用率提高,构成了设置着所述灯泡型LED灯11的节能型的筒灯19。 In this case, the radiator 13 is formed in a substantially conical tapered surface, and configured to contour the neck of the incandescent bulb shape approximating the appearance, therefore, the neck portion 56 may not be outside the receptacle contacts and the like of the reflector 55 smoothly inserted into the socket 56, so that the application in the bulb-shaped body 18 is a conventional LED light fixture 11 the application rate increased, the configuration is provided with the energy-saving lamp bulb 11 of the LED lamp 19.

[0104] 接下来,对所述第一实施方式的作用进行说明。 [0104] Next, the operation of the first embodiment will be described.

[0105] 在对灯泡型LED灯11进行组装时,首先,将安装了LED22及连接器支承部23等的LED基板12的LED基板本体21的另一主面21b侧,载置到散热体13的基板安装面32a上, 使配线孔24的位置与插通孔部34的位置对准,并且使LED基板本体21侧的各螺钉切缺部28的位置与散热体13侧的各螺钉固定孔32b的位置对准,同时,通过螺钉27来将LED基板12固定到散热体13上,使LED基板12与散热体13热结合。 The other main surface 21b side of the LED substrate main body 12 of the LED substrate [0105] When the self-ballasted LED lamp 11 is assembled, first, the LED22 of the supporting portion 23 and the connector 21 and the like is mounted, the radiator 13 is placed on the substrate mounting surface 32a, the position of the wiring hole portion insertion hole 34 aligned positions 24, each of the screw and the LED substrate main body 21 side cutout portion 13 and the radiator 28-side position of the respective screws the positioning hole 32b, while by screws 27 to the LED board 12 is fixed to the radiator 13, the LED 13 and the substrate 12 to the heat radiator.

[0106] 而且,将在前端侧设置着连接部46的供电线45的基端侧,电连接于点灯电路基板15的点灯电路的输出端子。 [0106] Further, the setting of the base end side connecting portion 45 power supply line 46 at the front end side, electrically connected to the output terminal of the lighting circuit substrate 15 of the lighting circuit.

[0107] 接着,将收容着点灯电路基板15的收容盒16插入到散热体13的嵌合凹部37内, 使得连通孔16c与插通孔部34连通,利用未图示的凹凸构造等来将收容盒16卡止固定在散热体13上。 [0107] Next, the cassette housing is accommodated lighting circuit substrate 15 is inserted into the fitting recess 16 of the inner portion 37 of the radiator 13, so that the communication hole 16c communicates with the insertion hole 34, concave-convex structure (not shown) like the engaging the cartridge housing 16 is fixed to the radiator 13. 此时,让供电部47穿过插通孔部34,使供电线45的前端侧及连接部46从LED基板12的LED基板本体21的一主面21a突出,并将连接部46从上方插入到所述连接器支承部23中,从而使连接器支承部23与连接部46形成电连接及机械连接。 In this case, so that the power supply portion 47 of the through hole 34 so that the front side and the connecting portion 46 of feed line 45 projecting from a main surface of the LED substrate main body 21 of the LED substrate 12 21a, and the connecting portion 46 is inserted from above into the connector receiving portion 23, so that the connector receiving part 23 and the connecting portion 46 is formed an electrical and mechanical connection.

[0108] 此后,在将与点灯电路基板15侧电连接的电源线导出到壳体51的外侧的状态下, 将经由接地线E而使点灯电路基板15与眼孔53连接的灯口17从收容盒16的另一端16d 侧插入,将电源线夹在收容盒16和壳体51之间。 The [0108] Thereafter, the power line is electrically connected to the lighting circuit substrate 15 side is exported to the outside of the housing 51 in a state, so that the lighting circuit substrate 15 and the cap eyelet 53 is connected through the grounding line from E 17 another end 16d of the storage box 16 side is inserted, the power supply 16 between the clamp and the cassette accommodating housing 51. 此时,利用未图示的凹凸构造等来将收容盒16与灯口17卡止固定。 At this time, the concavo-convex structure (not shown) to the cartridge housing 16 and the cap 17 locked and fixed.

[0109] 接着,将灯罩14的一端14a侧嵌入到散热体13的凹槽部32c内,以将灯罩14固定在散热体13上,并利用粘合剂等来固定加强,从而完成灯泡型LED灯11。 [0109] Next, one end 14a side of the globe 14 is fitted into the recess portion 32c of the radiator 13, the globe 14 is fixed to the radiator 13, and is fixed with an adhesive or the like to strengthen, to complete the self-ballasted LED lamp 11.

[0110] 在将该灯泡型LED灯11安装到插座56上之后,如果对筒灯19接通电源,则电源会从插座56经由灯口17而供给至灯泡型LED灯11,从而使点灯电路基板15的点灯电路进行动作,输出24V的直流电压。 [0110] After the self-ballasted LED lamp 11 is mounted to the socket 56, if the power of the lamp 19, the power will be supplied from the outlet 56 to the bulb-type LED lamp 11 via the cap 17, so that the lighting circuit lighting circuit substrate 15 is operated, the output DC voltage of 24V. 该直流电压经由与点灯电路的输出端子连接的供电线45而将电力供给至LED基板12侧。 The DC voltage to supply power to LED 12 via the board-side power supply line connected to the output terminal of the lighting circuit 45. 由此,所有的LED22会同时发光,放射出白色的光。 Thus, all the LED22 will emit light simultaneously emits white light.

[0111] 此时,将各LED22以形成大致同心圆状的方式,大致等间隔地安装并配置到LED基板本体21的一主面21a上,因此,从各LED22放射出的光大致均勻地向灯罩14的整个内面放射而不会被连接器支承部23等遮挡,光在乳白色的灯罩14上扩散,从而进行具有与普通白炽灯泡相近似的配光特性的照明。 [0111] In this case, each LED22 to form a substantially concentric manner, and arranged substantially like are mounted on the LED substrate main body 21 of the one main surface 21a at equal intervals, therefore, the light emitted from each of substantially uniformly to LED22 the entire inner surface of the globe 14 is radiated without being connected to the support portion 23 is blocked and the like, the light-diffusing milky white shade at the 14, thereby illuminating a general incandescent bulb having a light distribution characteristic approximating.

[0112] 特别是由于成为光源的灯泡型LED灯11的配光接近于普通白炽灯泡的配光,因而,向配置在筒灯19内的插座56附近的反射体55照射的光的照射量增大,从而可大致获得构成为普通白炽灯泡用的反射体55的符合光学设计的器具特性。 [0112] In particular, since become compact LED lamp illumination source 11 increase in volume of the light distribution close to the light distribution of the general incandescent bulb, and therefore, the light reflector disposed in the vicinity of the lamp socket 56 19 55 irradiated large, so that the appliance can obtain substantially in line with the characteristics of the optical design of the reflector is configured with a general incandescent bulb 55.

[0113] 而且,通过灯泡型LED灯11的点灯而在LED基板12上由各LED22产生的热,会经由基板安装面32a而传递到散热体13上,并经由该散热体13的各散热片33、散热体本体31及扩径部32而散热。 [0113] Further, heat generated on each LED22 LED substrate 12 by a lighting bulb type LED lamp 11 will be transmitted via the substrate attachment surface 32a to the radiator 13, and each of the fins 13 of the heat dissipating body via 33, the enlarged diameter portion 31 and the radiator main body 32 and radiated. 进而,充斥在收容盒16内的热会传递到灯口17而散热。 Further, in the full heat of the storage case 16 will be transmitted to the cap 17 and the heat dissipation.

[0114] 如上所述,将多个LED22分别配置在从LED基板本体21的一主面21a的中心位置C向外缘侧偏移的位置,并且使配线部25位于与LED基板本体21的一主面21a侧的中心位置C相重叠的位置,所述配线部25包括:连接器支承部23,可连接与来自点灯电路基板15的供电线45的前端相连接的连接部46 ;以及配线孔24,与所述连接器支承部23相邻接地贯通LED基板本体21,且可供点灯电路基板15的供电部47插通,借此来使供电部47 插通到配线孔24中,从而可容易地将连接部46连接到连接器支承部23上,因此,可一方面确保组装的容易性,一方面使连接器支承部23大致均勻地远离各LED22,不易遮挡所述各LED22发出的光,从而可抑制配光均勻性的下降。 [0114] As described above, a plurality of position LED22 are arranged outwardly from the edges of a main surface of the central position C 21a of the LED substrate main body 21 side of the offset, and the wiring portion 25 is located at the LED substrate main body 21 a main surface 21a side of the center position C position overlapping the wiring section 25 includes: a connector support section 23, may be connected to the connection portion from the lighting circuit substrate 15 of the power supply line 45 is connected to the distal end 46; and wiring hole 24, and the ground 23 adjacent the connector receiving part 21 through the LED substrate main body, and a power supply circuit substrate 15 for lighting portion 47 is inserted, thereby to cause the power supply portion 47 inserted into the wiring hole 24 thereby can be easily connected to the connection portion 46 is connected to the supporting portion 23, therefore, it may be an aspect of easiness of assembly, on the one hand the support of the connector portion 23 substantially uniformly away from each LED 22, each of the hardly blocked LED22 of the light emitted, the light distribution can be suppressed so as to decrease uniformity.

[0115] 另外,将连接器支承部23竖立地配置在LED基板12的LED基板本体21的一主面21a上,借此,可容易地将插通在插通孔部34及配线孔24中的供电部47的连接部46连接到连接器支承部23上,并且在已将连接部46连接到连接器支承部23上的状态下,负荷不易被施加到供电线45与连接部46的连接位置附近,因此,例如在将连接部46连接到连接器支承部23上时,不易损坏供电线45。 [0115] Further, the connector receiving portion 23 is disposed upright on the LED substrate main body 12 of the LED substrate main surface 21 a 21a, thereby, can be easily inserted through the insertion hole 34 and the wiring hole 24 the lower portion 46 connected to the power supply unit 47 is connected to the connector receiving portion 23, and has the connecting portion 46 is connected to the connector receiving part 23 a state, a load is not easily applied to the power supply line 45 and the connecting portion 46 near the connection position, for example when the connector 46 is connected to the connecting portion support portion 23, power supply line 45 is not easily damaged.

[0116] 进而,在已将LED基板12的LED基板本体21安装到散热体13— 端侧的基板安装面32a上的状态下,在与所述LED基板12的配线孔24相对应的位置处设置插通孔部34,借此,可经由该插通孔部34而将来自点灯电路基板15的供电线45插通到散热体13内,并且可最大限度地使LED基板本体21与散热体13 —端侧的基板安装面32a的接触面积增大。 [0116] Further, in a state where the LED substrate main body 12 of the LED board 21 has been mounted to the end of the radiator 13- substrate mounting surface 32a, in the LED 24 of the wiring hole of the substrate 12 at positions corresponding to a through hole provided at the insertion portion 34, whereby the lighting may be through the insertion hole 34 from the power supply line 15 of the circuit board 45 is inserted into the radiator 13, and can maximize the LED substrate main body 21 and the heat dissipation body 13 - the area of ​​the contact surface 32a of the substrate mounting end side is increased.

[0117] 而且,在配置于散热体13和灯口17之间并使散热体13和灯口17绝缘的收容盒16中收容着点灯电路基板15,借此,可容易地使点灯电路基板15与散热体13绝缘,并且点灯电路基板15的配置变得容易。 [0117] Further, the heat dissipation member disposed between the cap 13 and the cooling body 17 and the housing case 16 and the cap 13 of insulating housing 17 with the lighting circuit substrate 15, whereby the lighting circuit can be readily substrate 15 and the heat insulating member 13, and the lighting circuit substrate 15 is arranged easily.

[0118] 而且,将LED基板12 (LED22)配置在比灯罩14的最大径位置MD更靠下侧处,借此, 从各LED22发出的光的一部分会由于从灯罩14的一端1½侧到最大径位置MD为止的弯曲形状而向下侧照射,因此,可使光照射到更广的范围。 [0118] Moreover, the LED substrate 12 (LED22) disposed than the maximum diameter position MD of the globe 14 closer to the lower side, whereby the part of the light emitted from the LED 22 due to the respective end side of the globe 14 from 1½ to maximum until the radial position of the curved shape of the downward irradiation MD, therefore, it allows a wider range of incident light.

[0119] 接下来,在图5中表示第二实施方式,该图5是灯装置的纵剖面图。 [0119] Next, in FIG. 5 shows a second embodiment, FIG. 5 is a longitudinal sectional view of a lamp device. 另外,关于与所述第一实施方式相同的构成及作用,标注相同符号而省略其说明。 Further, with respect to the first embodiment configured in the same manner and function are denoted by the same reference numerals and the description thereof is omitted.

[0120] 根据所述第一实施方式,在该第二实施方式中,使连接器支承部23为卧式配置。 [0120] According to the first embodiment, in this second embodiment, the connector receiving part 23 is a horizontal configuration.

[0121] S卩,在LED基板12的LED基板本体21的一主面21a上,连接器支承部23在配线孔M侧朝向沿着该一主面21a的方向(水平方向)而形成开口,从而可将连接部46沿着LED基板本体21而插入并固定到所述连接器支承部23中。 [0121] S Jie, on the LED substrate main body 12 of the LED substrate main surface 21 a 21a, toward the connector receiving part 23 is formed along an opening direction (horizontal direction) of the one main surface 21a side of the wiring hole M so that the connector 46 can be inserted into and 21 fixed to the connector receiving part 23 along the LED substrate main body.

[0122] 这样,通过使连接器支承部23为卧式配置,便可减小连接器支承部23从LED基板本体21突出的突出量,所以来自LED22的光更不易被连接器支承部23遮挡,从而可进一步抑制配光均勻性的下降。 [0122] Thus, by making the connector receiving part 23 is a horizontal configuration, will be reduced from the connector receiving portion 23 projecting amount of the LED substrate main body 21, the light from LED22 is more difficult to be shielded connector receiving portion 23 , thereby further suppressing decrease uniformity of light distribution.

[0123] 再者,在所述各实施方式中,连接器支承部23与配线孔M只要彼此邻接,且将整个配线部25配置成至少一部分与LED基板12的LED基板本体21的中心位置相重叠,则可任意地设定。 [0123] Further, in the above embodiments, the connector receiving part 23 and the wiring aperture M may abut one another, and the whole wiring portion 25 configured to at least a portion of the center of the LED substrate 12 of the LED substrate main body 21 overlapping position, can be arbitrarily set. 即,连接器支承部23与配线孔M即便形成为任一方的一部分与LED基板本体21的中心位置C重叠而配置的状态,或者形成为连接器支承部23和配线孔M之间的区域的一部成为与LED基板本体21的中心位置C相重叠的附近部分的状态等,也可发挥同样的作用效果。 That is, the connector receiving part and the wiring hole 23 is formed even if the M state to any one of the LED substrate main body portion 21 of the center position C is arranged to overlap, or are formed between the support portion 23 and connector wiring hole of M a region of a state of the vicinity of the center position C LED substrate main body 21 that overlaps the like, can also exhibit the same effects.

[0124] 接着,在图6A、图(b)及图7中表示第三实施方式,图6表示灯装置,图6A是纵剖面图,图6B是收容盒的立体图,图7是将显示图6的灯装置纵向切断而表示的立体图,图8 是表示灯装置的点灯装置的温度与先前例的点灯装置的温度的图表。 [0124] Next, in FIG. 6A, FIG. (B) and FIG. 7 shows a third embodiment, FIG. 6 shows a lamp device, FIG. 6A is a vertical sectional view, FIG. 6B is a perspective view of the accommodating cassette, FIG. 7 is a graph showing lamp longitudinal cutting device 6 and a perspective view, while FIG. 8 is a diagram showing the temperature of the lamp lighting device means the temperature graph of the lighting apparatus of the previous embodiment. 再者,关于与所述各实施方式相同的构成及作用,标注相同的符号并省略其说明。 Further, with respect to each of the embodiments of the same configuration and function are denoted by the same reference numerals and the description thereof will be omitted.

[0125] 根据所述第一实施方式,在该第三实施方式中,使用作为本体的散热体61及作为绝缘盒的收容盒62来代替散热体13及收容盒16,通过导热构件63来将点灯电路基板15 与散热体61热连接。 [0125] According to the first embodiment, in this third embodiment, the radiator main body is used as a storage box 61 and the insulating case 62 instead of 13 and the cassette 16 accommodating the radiator, the heat conducting member 63 to the lighting circuit substrate 61 and the radiator 15 is connected to the heating medium.

[0126] 散热体61是由导热性良好的金属、例如铝所构成,横剖面形状大致呈圆形,外周面形成为直径从一端向另一端依次变小的大致圆锥状的锥形(taper)面,从而外观上形成为与普通白炽灯泡的颈部的轮廓相近似的形状。 [0126] radiator 61 is formed of, for example, aluminum with good thermal conductivity metal, a substantially circular cross-sectional shape, an outer peripheral surface successively smaller diameter substantially conical tapered from one end to the other end (taper) surface, thereby forming the contour of the neck portion of a general incandescent bulb shape approximating appearance. 而且,该散热体61包括:大致圆柱状的散热体本体65、以及一体地形成于该散热体本体65的外周面上的多个散热片66。 Further, the radiator 61 comprises: a substantially cylindrical radiator main body 65, and a plurality of integrally formed fins 66 on the outer circumferential surface of the radiator main body 65. 而且,该散热体61例如通过铸造、锻造或者切削加工等经加工之后,构成为内部无空洞的壁厚的构件。 Further, the radiator 61, for example by casting, forging, or cutting processing after processed, no internal voids configured member wall thickness.

[0127] 在散热体本体65的一端6¾中形成着直径较大的开口部71,并且在另一端6¾中形成着具有直径较小的开口部72a的作为收纳凹部的嵌合凹部72。 [0127] an opening 71 formed in the larger diameter portion at one end 6¾ radiator main body 65, and the opening has a smaller diameter portion 72a of the housing recess portion as a fitting recess portion 72 is formed at the other end in the 6¾.

[0128] 在开口部71中,以形成安装着LED基板12的凹部74的方式一体地形成支承部75, 该支承部75的表面形成为平滑的面。 [0128] In the opening portion 71, mounted to form an LED substrate 12 of the embodiment 74 of the supporting recess portions 75 are integrally formed, the surface of the support portion 75 is formed into a smooth surface. 即,在经由以具有导热性且具有电气绝缘性的有机硅树脂等所形成的绝缘片材或粘合剂等,来使LED基板本体21的另一主面21b侧紧贴于支承部75的状态下,LED基板12通过螺钉等的固定机构而支承在散热体本体65上。 That is, the via having heat conductivity and having electrically insulating sheet or insulating adhesive such as silicon resin or the like is formed to the LED substrate main body 21 of the other main surface 21b side of the close contact portion 75 of the support state, LED board 12 is supported on the radiator main body 65 by fixing means such as screws. 由此,LED基板12的光轴xx与散热体61的中心轴yy大致吻合,从而构成了具有在俯视时整体大致呈圆形的发光面的光源部A。 Thus, LED optical axis xx yy central axis 61 of the radiator 12 substantially match the substrate, thereby forming a light source portion having a substantially circular overall light emitting surface in plan view A.

[0129] 进而,在散热体本体65中,形成着使供电线45插通的插通孔77。 [0129] Furthermore, in the radiator main body 65 is formed with the power supply line 45 is inserted through the insertion hole 77. 该插通孔77是从支承部75的中央部分朝向开口部72a,并大致沿着中心轴y_y方向贯通地形成。 The insertion hole 77 is an opening portion 72a toward the central portion from the support portion 75, and formed through substantially along the center axis direction y_y. 而且,为了与LED基板本体21的配线孔24连通,该插通孔77的中心轴z_z形成在从散热体61的中心轴1-1向外圆周方向偏移尺寸a的位置。 Further, in order to communicate with the wiring hole 21 of the LED substrate main body 24, the central shaft is inserted through hole 77 is formed at a position shifted from z_z 1-1 radiating outward circumferential direction of the central axis 61 of the dimension a.

[0130] 嵌合凹部72是用以将点灯电路基板15配置在自身内部的凹部,横剖面呈以散热体61的中心轴y_y为中心的大致圆形,且在底面上贯通着所述插通孔77。 [0130] fitting recess portion 72 is used for the lighting circuit substrate 15 is disposed inside the recess itself, the central axis transverse section y_y center of the radiator 61 is substantially circular and through the bottom surface of the insertion hole 77. 进而,在此嵌合凹部72的表面上,在圆周上的一部分中从底面到内侧面的大致中间部分之间,横剖面形状并不形成为圆形,而是以壁厚的方式一体地形成有突出部81。 Further, on the surface of this fitting recess portion 72, a part of the circumference from the bottom surface to a substantially intermediate portion between the inner surface, a circular cross-sectional shape is not formed, but the wall thickness is formed integrally a protrusion 81.

[0131] 而且,散热片66是从一端65a向另一端65b放射状地突出而形成在散热体本体65 的外周面上。 [0131] Further, the fins 66 from one end 65a projecting radially toward the other end 65b is formed on the outer circumferential surface of the radiator main body 65.

[0132] 而且,收容盒62形成为与散热体61的嵌合凹部72的内面形状大致吻合的呈有底圆柱状的形状,在此收容盒62的一端部形成着开口部62a,而另一端部被阻塞。 [0132] Further, the storage case 62 forming the opening portion 62a to form the inner surface shape of the fitting concave portion of the radiator 61 72 substantially coincide bottomed cylindrical shape, in the storage case end portion 62 and the other end Ministry is blocked.

[0133] 而且,在收容盒62的内侧面上,在圆周上的一部分中从底面横跨内侧面的大致中间部分而部分地形成了成矩形状的开口部62b。 [0133] Further, in the inner surface of the storage case 62 is formed into a rectangular opening portion 62b from the bottom surface and a generally intermediate portion of the inner surface partially across a portion of the circumference. 该开口部62b是以与所述散热体61的嵌合凹部72连通的方式而形成,并形成为可与嵌合凹部72的突出部81嵌合的形状及大小, 当将收容盒62的底面朝上插入到嵌合凹部72内时,突出部81会自动地嵌合到开口部62b 中,突出部81突出地露出到收容盒62的内面。 The opening portion 62b is formed as to communicate with the fitting recess 61 of the radiator 72, and is formed to be fitted with the shape and size of the protruding portion 81 of the fitting recess portion 72, when the bottom surface 62 of the cartridge housing when inserted upwardly into the fitting recess portion 72, the protruding portion 81 is automatically fitted into the opening portion 62b, the projection portion 81 projecting into the exposed surface of the accommodating case 62.

[0134] 而且,在收容盒62的外周面的大致中间部分,一体地形成着以形成环状的凸缘的方式而突出的卡止部62c,在从该卡止部62c向前端突出的部分,一体地形成着外周为段状的灯口安装部62d,且在卡止部62c的形成凸缘状的部分的下表面,形成着排除空气用的孔62e,此孔62e在收容盒62内的压力上升时使此收容盒62内与外部空气连通。 [0134] Further, the storage case 62 in a substantially intermediate portion of an outer circumferential surface is integrally formed with a flange formed so as to protrude annular locking portion 62c, the forward end portion 62c projecting from the engaging portion integrally formed with the outer periphery of the cap mounting portion 62d as a segment-shaped, and in engaging a lower surface portion of a flange-shaped portion 62c is formed with the exclusion of the hole 62e of air used, the hole 62e in the housing box 62 this makes the inner housing 62 communicates with the outside air pressure rise cartridge.

[0135] 此外,在收容盒62的内面上,沿着圆柱的轴方向而一体地形成着引导槽65f,平板状的点灯电路基板15的点灯电路基板本体41沿着纵方向,即,大致沿着散热体61的中心轴y_y而嵌合并支承于此弓丨导槽65f中。 [0135] Further, the inner surface of the storage case 62 along the axial direction of the cylinder is integrally formed with the guide grooves 65f, the plate-shaped lighting circuit substrate 15 of the lighting circuit substrate main body 41 along the longitudinal direction, i.e., substantially along y_y the central axis of the heat sink 61 and the support fitted thereto Shu bow in the guide groove 65f. 引导槽65f是从形成圆柱的收容盒62的轴线、换言之是从散热体61的中心轴yy偏向一侧而形成的,在本实施方式中,此引导槽65f是偏向形成着开口部62b及突出部81的一侧(偏移)而形成的,点灯电路基板本体41纵向地嵌合于该偏移形成的引导槽65f,借此,点灯电路基板本体41的较广的板面从开口部62b向突出部81而配置,同时被支承在与突出部81近接的位置。 From the axis of the guide groove 65f is formed in a cylindrical accommodating case 62, in other words from the central axis yy one side of the radiator 61 is formed, in the present embodiment, the guide groove 65f is formed with an opening toward the protruding portion 62b and side (offset) portion 81 is formed, the lighting circuit substrate main body 41 is longitudinally fitted in the guide groove 65f formed in the offset, whereby the lighting circuit substrate main body 41 of the wide plate face portion 62b from the opening the projecting portion 81 is disposed while being supported in contact with the projecting portion 81 near the location.

[0136] 而且,本实施方式中,在LED基板12中,四个LED22安装在LED基板本体21的一主面21a上。 [0136] Further, in this embodiment, in the LED substrate 12, four LED22 mounted on the LED substrate main body 21 of the one main surface 21a.

[0137] 而且,点灯电路基板15的构成如下:例如电解电容器(electrolyticcondenser) 等的比较大的零件91集中地配置在点灯电路基板本体41的其中一个面上,比较小的芯片(chip)零件或晶体管(transistor)等的比较伴有发热的零件92安装在另一个面上。 [0137] Further, the lighting circuit substrate 15 is configured as follows: for example, an electrolytic capacitor (electrolyticcondenser) like large parts 91 collectively disposed on one surface of the lighting circuit substrate main body 41, a relatively small chip (Chip) or part transistors (transistor) or the like fever comparison part 92 is mounted on the other surface. 当将点灯电路基板本体41纵向地插入到收容盒62的引导槽65f中时,使芯片零件或晶体管等的比较伴有发热的零件92位于狭窄的空间内,S卩,位于有开口部62b与突出部81的一侧的空间内,使较大的零件91位于另一方的较广的空间内,从而插入并嵌合该点灯电路基板15。 When the lighting circuit substrate main body 41 is longitudinally inserted into the guide groove 65f 62 receiving the cartridge in which the chip parts such as a transistor or fever comparison part 92 is located in a narrow space, S Jie, an opening portion 62b is located the inner space side of the projecting portion 81, so that the larger part located in the other large space 91, to be inserted and fitted to the lighting circuit substrate 15. 再者,当将电路元件安装到点灯电路基板本体41中时,优选预先使晶体管等的比较伴有发热的零件92位于与开口部62b及突出部81相向的位置而安装。 Further, when the circuit element is mounted to the lighting circuit substrate main body 41, it is preferable that the transistor or the like fever comparison part 92 located at the opening portion 62b and the protrusion 81 faces the position of installation. 在此情况下,如果将点灯电路基板15收容到收容盒62内,则通过收容盒62来使散热体61和点灯电路基板15 之间电气绝缘,并且晶体管等的比较伴有发热的零件92会自动地与开口部62b及突出部81 相向。 In this case, if the lighting circuit substrate 62 accommodated in the storage case 15, to make the radiator 61 and the lighting circuit substrate 62 via electrical insulation between the cartridge housing 15, and the transistor and the like fever comparison part 92 will automatically face the aperture 62b and the protrusion 81. 在该发热的零件92与开口部62b及突出部81相向的状态下,在点灯电路基板本体41的含有发热的零件92的板面、与从开口部62b露出的嵌合凹部72表面的突出部81之间, 填充导热性构件,在本实施方式中是填充例如由有机硅树脂所形成的具有电气绝缘性的耐热性的粘合剂94。 In the heating part 92 and the opening portion 62b and the protrusion 81 faces a state in the plate surface of the part comprising the heat generating lighting circuit substrate main body 41, 92, the surface of the fitting recess portion 72 exposed from the opening portion 62b of the projecting portion between 81, filling heat conductive member, it is filled with an adhesive such as heat resistance electrically insulated by a silicone resin 94 is formed in the present embodiment.

[0138] 借此,利用由有机硅树脂所形成的粘合剂94来使由铝所形成的散热体61和点灯电路基板15电气绝缘,同时,使点灯电路基板15、特别是发热零件92与散热体61的突出部81形成热连接,并且点灯电路基板15也通过粘合剂94而被牢固地固着在收容盒62及散热体61上。 [0138] Accordingly, an adhesive silicone resin 94 is formed to make the radiator 61 and the lighting circuit substrate 15 is formed of an aluminum electric insulation, while the lighting circuit substrate 15, heat generating component 92 and especially projecting portion 81 of the radiator 61 is thermally connected, and the lighting circuit substrate 15 by adhesive 94 can be firmly fixed on the radiator 62 and the cartridge 61 in the housing.

[0139] 再者,图6B中的62g是形成在底面上且与散热体61的插通孔77相对应地形成的连通孔,供电线45被弓I出到收容盒62内,62h是用以将收容盒62固着到嵌合凹部72的底面上的螺钉孔。 [0139] Further, FIG. 6B communication hole 62g is formed on the bottom surface and the insertion hole 77 of the radiator 61 is formed corresponding to the power supply line 45 is I bow out into the housing box 62, 62h is in the storage case 62 fixed to the fitting recess portion of the bottom surface of the screw hole 72.

[0140] 进而,在收容盒62的在从散热体61的另一端部的开口部7¾所突出的灯口安装部62d的外周面中,嵌入了灯口17,并通过敛合或者使用有机硅树脂或环氧树脂等的具有耐热性的粘合剂而进行固着。 [0140] Further, in the storage case 62 on the outer circumferential surface of the 7¾ highlighted by the cap mounting portion of the opening portion and the other end portion of the radiator 61 and 62d, the insert of the cap 17, by caulking or silicone epoxy resin or the like having heat resistance and adhesive for fixing. 借此,从散热体61过渡到灯口17的外周面的外观形状构成为与普通白炽灯泡的颈部的轮廓相近似的形状。 Accordingly, the transition from the radiator 61 to the outer peripheral surface of the cap 17 is configured similar to the outer shape profile of the neck-like shape of a general incandescent bulb.

[0141] 而且,灯口17例如是使用爱迪生型的似6型的灯口。 [0141] Further, the cap 17 is an Edison type, for example, like the cap 6 type. 因此,照明器具18的各部分的大小及形状与E^型相对应。 Thus, the size and shape of each part of the lighting fixture 18 correspond with the E ^ type.

[0142] 接下来,对所述第三实施方式的组装顺序进行说明。 [0142] Next, an assembling procedure of the third embodiment will be described.

[0143] 首先,将收容盒62嵌入到散热体61的嵌合凹部72内,通过螺钉并使用螺钉孔62h 来将此收容盒62固着到嵌合凹部72的底面。 [0143] First, the accommodating cassette 62 fitted into the fitting recessed portion 61 of the radiator 72, by using screws and screw holes 62h to this storage case 62 fixed to the bottom surface 72 of the fitting recess portion. 此时,使嵌合凹部72的突出部81嵌合于收容盒62的开口部62b,并且使连通孔62g对准并固着于散热体61的插通孔77。 In this case, the fitting recess portion 72 is fitted into the protrusion 81 in the opening portion 62b of the storage case 62, and the communicating hole 62g is aligned and fixed in the insertion hole 77 of the radiator 61.

[0144] 然后,将预先连接到点灯电路基板15的输出端子上的供电线45从收容盒62的连通孔62g穿过散热体61的插通孔77,同时,将点灯电路基板15竖立地插入到收容盒62内, 使点灯电路基板本体41嵌合并支承于引导槽65f。 [0144] Then, connect the power supply line to advance the output terminal of the lighting circuit substrate 15 through the insertion hole 45 of the radiator 61 from the communication hole 62g 62 accommodating case 77, while the lighting circuit substrate 15 is inserted upright the housing box 62, so that the lighting circuit substrate main body 41 is fitted and supported in the guide groove 65f. 此时,使发热零件92朝向开口部62b及突出部81,从而将点灯电路基板15插入到所述收容盒62内。 In this case, the heat generating part 92 toward the opening portion 62b and the protrusion 81, so that the lighting circuit substrate 15 is inserted into the housing box 62. 此时,供电线45的包含连接部46的前端是从安装着LED22的LED基板本体21的配线孔M中引出。 At this time, the power supply line 45 connected to the tip portion comprises 46 is drawn out from the wiring hole M 21 mounted in the LED22 LED substrate main body.

[0145] 接着,在已将点灯电路基板15支承在收容盒62内的状态下,将粘合剂94注入并填充到收容盒62内的点灯电路基板15和突出部81之间。 [0145] Next, the lighting circuit substrate 15 has been supported in a state where the housing box 62, the adhesive 94 is injected and filled into between the lighting circuit substrate 62 within the cartridge housing 15 and the protruding portion 81. 由此,通过粘合剂94来将包含安装在点灯电路基板15的点灯电路基板本体41上的发热零件92、以及点灯电路基板本体41的板面与散热体61的突出部81连接。 Thus, 92, and a lighting circuit substrate main body by an adhesive board 94 is connected to the heat generating part comprising a lighting circuit substrate mounted on the lighting circuit board 15 of the body 41 and the projecting portion 41 of the radiator 81 61.

[0146] 接着,使LED基板12载置并紧贴在散热体61的支承部75上,并通过螺钉等的固定机构而将所述LED基板12从LED基板本体21的一主面21a侧向周围四个部位左右进行固定。 [0146] Next, the LED substrate 12 and is placed against the support portion 75 of the radiator 61, and is fixed by means of screws or the like and the LED substrate 12 side from the one main surface 21a of the LED substrate main body 21 left and right four locations around the fixing. 此时,将LED基板本体21的配线孔对的位置与散热体61的插通孔77的位置对准并加以固定。 At this time, the position of the position of the insertion hole 61 of the radiator LED substrate main body 21 of the wiring hole 77 is aligned and fixed. 由此,LED基板本体21的另一主面21b与支承部75的平滑的面紧贴地受到固定。 Thus, LED substrate main body 21 of the other main surface 21b of the support portion 75 is a smooth surface snugly be fixed.

[0147] 接下来,将一端已被从LED基板本体21的配线孔M中引出的供电线45向LED基板本体21侧弯折,将连接部46与连接器支承部23电连接及机械连接。 [0147] Next, one end has been bent power supply lines 4521 drawn from the wiring hole M LED substrate main body 21 to the LED substrate main body, the connecting portion 46 and the connector receiving part 23 is connected electrically and mechanically .

[0148] 接着,将从点灯电路基板15的输入端子导出的输入线(未图示)连接于灯口17 的壳体51及眼孔53,在此连接状态下,将壳体51的开口部嵌入到收容盒62的灯口安装部62d中,并利用粘合剂来固着。 [0148] Next, input terminal derived from the lighting circuit substrate 15 of the input line (not shown) connected to the housing 51 and the eyelet 53 of the cap 17, in this connected state, the opening portion 51 of the housing fitted into the cap mounting portion 62d of the storage case 62 and fixed using adhesive.

[0149] 接下来,准备灯罩14,以覆盖散热体61的光源部A的方式,将灯罩14的一端14a 侧嵌入到散热体61的支承部75上所形成的段部75a中,并利用粘合剂来固定。 [0149] Next, prepare the globe 14, so as to cover the light source portion A of the radiator 61, the globe 14 is fitted one end 14a side of the support portion 75a to the stepped portion 61 of the radiator 75 formed on, and a Viscosity mixture fixed.

[0150] 借此来构成灯泡型LED灯11,在此灯泡型LED灯11的一端部具有灯罩14,在另一端部设置着灯口17,整体的外观形状与普通白炽灯泡的轮廓相近似,且此灯泡型LED灯11 的额定电力约为4W左右,亮度相当于40W白炽灯泡的亮度。 [0150] whereby to form the self-ballasted LED lamp 11, one end portion of this bulb type LED lamp 11 with the globe 14, is provided at the other end portion of the cap 17, the overall external shape of a general incandescent bulb contour approximation, this LED lamp and the lamp of the rated power 11 is about 4W, brightness corresponding to brightness 40W incandescent bulbs.

[0151] 接着,在将该灯泡型LED灯11安装到插座56上之后,如果对筒灯19接通电源,则电源会从插座56经由灯口17而供给至灯泡型LED灯11,从而使点灯电路进行动作,输出24V的直流电压。 [0151] Next, after the self-ballasted LED lamp 11 is mounted to the socket 56, if the power of the lamp 19, the power will be supplied from the outlet 56 to the bulb-type LED lamp 11 via the cap 17, so that lighting circuit is operated, the output DC voltage of 24V. 该直流电压经由与点灯电路的输出端子连接的供电线45而被施加到串联连接的各LED22上。 The DC voltage via supply lines connected to the output terminal of the lighting circuit 45 is applied to each LED22 connected in series. 由此,所有的LED22会同时点灯,并放射出白色的光。 As a result, all LED22 will light up simultaneously, and emits white light.

[0152] 由于该灯泡型LED灯11的点灯,使得点灯电路的电路元件、特别是晶体管等的零件92发热。 [0152] Since the bulb type LED lighting lamp 11, so that the circuit element of the lighting circuit, especially the parts 92 such as transistors heat. 所产生的热经由作为导热构件的由有机硅树脂所形成的粘合剂94而传递到嵌合凹部72的突出部81,并从由铝所形成的壁厚的散热体61经由散热片66而向外部空气中散热。 Heat generated by a silicone resin adhesive 94 is formed as the thermally conductive member is transmitted to the protruding portion 81 of the fitting recess portion 72, and wall thickness from the radiator 61 made of aluminum is formed by the fins 66 heat to the outside air. 同时,由于零件的热而引起温度上升的点灯电路基板15的热也会经由粘合剂94而传递到突出部81。 Meanwhile, since the heat caused by the heat of the part temperature rise of the lighting circuit substrate 15 is also transmitted to the projecting portion 81 via an adhesive 94. 进而,收容盒62内充斥的热会传递到灯口17而散热,并且也会通过对流作用而从收容盒62的卡止部62c上所形成的排除空气用的孔62e而向外部排出。 Further, in the storage case 62 will be filled with the heat transmitted to the cap 17 and heat, and also while the cartridge 62 on the exclusion of air holes 62e of the engaging portion 62c is formed with the housing by convection from the discharged to the outside.

[0153] 此时,因为收容盒62上设置有开口部62b,并利用粘合剂94来将点灯电路基板15 与嵌合凹部72的突出部81直接连接着,所以可减少传导损失而进行有效的散热。 [0153] At this time, since the receiving opening portion 62b provided on the cartridge 62, and an adhesive 94 to the protruding portion 81 and the lighting circuit substrate 15 of the fitting recess portion 72 is directly connected, the conduction loss can be reduced effectively heat dissipation. 如先前那样,对从点灯电路基板向收容盒、再从收容盒经由外罩构件而向外部空气中散热时的点灯电路基板的温度进行测定之后,如图8的图表所示,先前,热电阻变大而点灯电路基板的温度约为185°C左右(图表中的a点),相对于此,在本实施方式中,热电阻变小而点灯电路基板15的温度约为110°C左右(图表中的b点),温度降低了约75°C左右。 After as previously, of the cassette from the housing to the lighting circuit substrate, and then measuring the outside air temperature when the lighting circuit board via the heat dissipation from the storage cassette cover member, shown in the graph of FIG. 8, previously, heat resistance becomes about large lighting circuit substrate temperature of about 185 ° C (a point on the graph), whereas, in the present embodiment, the heat resistance becomes small and the lighting circuit substrate 15 temperature of about about 110 ° C (chart in point b), the temperature was lowered by about 75 ° C.

[0154] 而且,各LED22的温度也同时上升而产生热。 [0154] Further, the temperature rise of each LED22 is also generate heat. 该热会从由铝所形成的圆板状的LED 基板本体21传递到该LED基板本体21所紧贴固着的支承部75,并从由铝所形成的散热体61经由散热片66而向外部空气中散热。 The heat will be transferred from the disk-shaped LED substrate main body 21 formed from aluminum to the LED substrate main body 21 is fixed against the support portion 75, and from the radiator 61 made of aluminum is formed through the fins 66 to the outside air cooling. 此时,因为由导热性良好的铝来构成LED基板本体21及散热体61,所以能够以传导损失较少的方式,对各LED22产生的热进行有效的散热。 At this time, since the good thermal conductivity of aluminum to form the LED substrate main body 21 and heat sink 61, it is possible to lower conduction losses in a manner, heat generated by each LED22 effective heat dissipation.

[0155] 由此,可防止各LED22的温度上升及温度不均,抑制发光效率的下降,防止由光束下降所引起的照度的下降,同时可设法延长LED22的寿命。 [0155] Accordingly, to prevent the temperature rise of each LED22 and temperature unevenness, to suppress a decrease in luminous efficiency, prevent a decrease in the illuminance of the light beam caused by the drop, while trying to extend the life of LED22. 而且,可通过铝来实现轻量化, 不会有灯泡变重的情况。 Further, weight reduction can be achieved by aluminum, will not have a bulb becomes heavy.

[0156] 根据所述第三实施方式,在收纳着点灯电路基板15的收容盒62中,部分地形成了与嵌合凹部72连通的开口部62b,并经由该开口部62b,通过作为导热构件的由有机硅树脂所形成的粘合剂94来将点灯电路基板15与散热体61的嵌合凹部72热连接,因此,可对由点灯电路基板15的电路元件所产生的热进行有效的散热,从而抑制电路元件的温度上升。 [0156] According to the third embodiment, the housing case 62 accommodating the lighting circuit substrate 15, the partially formed opening portion 62b communicates with the fitting recess portion 72, and through the opening portion 62b, through a heat conducting member a silicone resin adhesive 94 is formed to the lighting circuit substrate 15 is connected to the fitting recess portion 72 heat radiator 61, and therefore, heat generated by the circuit elements may be of the lighting circuit substrate 15 of the generated heat effectively , thereby suppressing the temperature rise of the circuit elements. 由此,可提供一种由于排除了电路故障的要因而使得可靠性变高且可抑制寿命下降的灯泡型LED灯11及筒灯19。 Thus, possible to provide a circuit fault due to the elimination of high reliability to thereby making it possible to suppress reduction in the life of the lamp and the LED lamp 11 and the lamp 19.

[0157] 特别是因为点灯电路基板15大致沿着散热体61的中心轴yy方向而配设在嵌合凹部72中,所以对于以中心轴作为长度方向的灯泡型LED灯11,可将与普通白炽灯泡的颈部相当的部分构成为细小形,从而可构成与灯泡的轮廓相近似的小型的灯泡型LED灯11。 [0157] In particular since the lighting circuit substrate 15 substantially along a central axis yy direction of the radiator 61 and disposed in the fitting recess portion 72, so as for the longitudinal direction of the central axis of the bulb type LED lamp 11 may be an ordinary corresponding to an incandescent light bulb is small portion of the neck-shaped configuration so as to be similar to the profile configuration like a small bulb-type LED lamp bulb 11. 同时,在点灯电路基板15中,可将点灯电路基板本体41配置在纵方向上,使较广的板面与散热体61的嵌合凹部72的表面相对向,借此,可增大与导热构件63进行热连接的部分的面积,且可使传导损失更少,从而将点灯电路基板15的热更有效地传递到散热体61侧。 Meanwhile, in the lighting circuit substrate 15 may be disposed lighting circuit substrate main body 41 in the longitudinal direction of the plate surface and the wide fitting recess portion 61 of the radiator 72 opposite to the surface, whereby the thermal conductivity can be increased member 63 is thermally connected to the area portion, and allow less transmission loss, so that heat of the lighting circuit substrate 15 is more efficiently transmitted to the radiator 61 side.

[0158] 而且,因为在嵌合凹部72的表面上一体地形成着向点灯电路基板15突出的突出部81,所以可使点灯电路基板15与嵌合凹部72的距离接近,由此可将点灯电路基板15的热更有效地传递到散热体61侧,且可以减少昂贵的有机硅树脂等的粘合剂94的使用量,因而在成本方面也有利。 [0158] Moreover, since the projection is integrally formed with the lighting circuit substrate 15 to the projection 81 on the upper surface of the fitting recess portion 72, so that the distance allows the lighting circuit substrate 15 and the fitting recess portion 72 is close, whereby the lighting thermal circuit board 15 is efficiently transmitted to the radiator 61 side, and can reduce the amount of expensive silicone resin adhesive 94 and the like, and thus is advantageous in terms of cost. 进而,可在构成散热体61时,同时一体地形成嵌合凹部72的突出部81,因此,可提供一种无需准备特别的专用零件而可简化组装作业,从而适合于量产化的灯泡型LED灯11。 Further, when the configuration may be the radiator 61, while the protruding portion 81 is formed integrally fitting recess portion 72, thus, may be prepared without the need to provide a special exclusive part and the assembling work can be simplified, thus suitable for mass production of the bulb-shaped LED lamp 11.

[0159] 而且,因为点灯电路基板15是在纵方向上且偏向于形成着开口部62b及突出部81的一侧而配置,所以在更接近于突出部81的位置处受到支承,从而能够以传导损失更少的方式来将点灯电路基板15的热传递到散热体61侧,且也可进一步减少粘合剂94的使用量。 [0159] Further, since the lighting circuit substrate 15 in the longitudinal direction and is biased to the side of the opening portion 62b is formed and the projecting portion 81 is disposed, so is supported at a position closer to the projecting portion 81, it is possible to less conduction losses way to transfer heat of the lighting circuit substrate 15 to the radiator 61 side, and may further reduce the amount of adhesive 94.

[0160] 而且,在点灯电路基板15与开口部62b及突出部81相向的状态下,将由有机硅树脂所形成的粘合剂94填充到点灯电路基板15的板面与从开口部62b突出并露出的突出部81之间,因此,通过粘合剂94来使由铝所形成的散热体61与点灯电路基板15电气绝缘,同时使点灯电路基板15与散热体61的突出部81形成热连接,进而点灯电路基板15也通过粘合剂94而被牢固地固着在收容盒62及散热体61上,由此可提供一种电性安全、且可靠性也高、进而相对于振动等也显得牢固的灯泡型LED灯11。 94 adhesive [0160] Further, in the portion facing the opening 62b and the protrusion 81 of the state of the lighting circuit substrate 15, formed by silicone resin is filled into the plate surface of the lighting circuit substrate 15 and the opening portion 62b and projecting from the between the projecting portion 81 is exposed, therefore, to make the radiator 61 and the lighting circuit substrate made of aluminum formed by an electrically insulating adhesive 9415, while the lighting circuit substrate 15 is formed with a projecting portion 81 is thermally connected to the radiator 61 , and thus also the lighting circuit substrate 15 via an adhesive 94 is firmly fixed on the cartridge housing 62 and heat sink 61, thereby providing an electrical security, and reliability is high, and thus with respect to the vibration or the like also appears solid-ballasted LED lamp 11.

[0161] 再者,在所述第三实施方式中,将作为导热性构件的由有机硅树脂等所形成的粘合剂94仅填充到点灯电路基板15和突出部81之间,但也可向包含该部分及安装着较大的零件91的背面侧在内的所有部分中填充粘合剂94。 [0161] Further, in the third embodiment, the adhesive 94 is filled as a silicone resin or the like is formed of only thermal conductive member between the lighting circuit substrate 15 and the protrusion portion 81, but may also to fill all parts of the binder comprises a larger portion and a mounting part 91 of the inner side of the back surface 94.

[0162] 进而,虽已将点灯电路基板15纵向地收纳在嵌合凹部72中,但例如也可如图9A 所示的第一变形例那样,使点灯电路基板15倾斜,以增大点灯电路基板15与粘合剂94的粘合面积的方式进行收纳。 [0162] Further, Although the lighting circuit substrate 15 is longitudinally accommodated in the fitting recess portion 72, but for example, a first modification of the embodiment shown in FIG. 9A, as may be the lighting circuit substrate 15 is inclined, to increase the lighting circuit bond area of ​​substrate 15 and adhesive 94 embodiment is accommodated. 而且,如图9B所示的第二变形例那样,也可构成更小型的点灯电路基板15,以将此点灯电路基板15收纳在横方向(水平方向)上。 Also, the second modification shown in FIG. 9B above, may also constitute a more compact lighting circuit substrate 15, to this lighting circuit substrate 15 accommodated in the lateral direction (horizontal direction). 在此情况下,在收容盒62的底面上形成开口部62b,在嵌合凹部72的底面上形成突出部81,将粘合剂94填充到横卧着的点灯电路基板15的上表面和嵌合凹部72底面的突出部81之间。 In this case, the storage case is formed on the bottom surface 62 of the opening portion 62b, the protruding portion 81 is formed on the bottom surface of the fitting recess portion 72, the adhesive 94 is filled to the upper surface of a lying lighting circuit substrate 15 is fitted and engagement between the projecting portion 81 of the bottom surface of the concave portion 72.

[0163] 而且,虽已由平坦的面来构成一体地形成于嵌合凹部72的突出部81的表面,但也可如图9C所示的第三变形例那样,在纵方向上,S卩,在模具的抽出方向上一体地形成出成行的凸状部81a,以增大与有机硅树脂等的作为导热性构件的粘合剂94的接触面积。 Third Modification [0163] Further, Although a flat surface configured to be integrally formed on the surface of the protruding portion 81 of the fitting recess portion 72, it is also possible, as shown in FIG. 9C, in the longitudinal direction, S Jie integrally forming the convex portion 81a of the rows in the withdrawal direction of the mold, to increase a contact area with the silicone resin or the like as the binder of the heat conductive member 94. 进而, 如图9D所示的第四变形例那样,也可形成呈曲面的凹部81b,以增大接触面积。 Further, in a fourth modification shown in FIG. 9D as a recess portion 81b may be formed of a curved surface, in order to increase the contact area.

[0164] 而且,灯口17是由可安装在普通白炽灯泡所安装的插座上的爱迪生型的似6型灯口所构成,但也可以是E17型等,另外,在材质方面,由金属构成了整个灯口,但也可以是树脂制的灯口,此树脂制的灯口的电连接的部分是由铜板等的金属所构成,除此之外的部分是由合成树脂所构成。 [0164] Further, the cap 17 is an Edison-type-like 6-type lamp base is composed of may be installed on a general incandescent bulb mounted socket, but may be a type or the like E17, additionally, in the material, made of metal throughout the cap, but may be the cap is made of resin, the resin portion is electrically connected to the cap is made of is made of a metal such as a copper plate, the other portions are composed of a synthetic resin. 进而,可以是具有荧光灯所使用的销(Pin)形端子的灯口,也可以是具有天花板悬吊灯所使用的L形端子的灯口。 Further, it may be a pin (Pin) fluorescent-shaped terminal used for the cap, the cap may be a L-shaped terminal used for a ceiling lamp suspension.

16[0165] 再者,在表示上述变形例的图9中,对与所述各实施方式相同的部分标注了相同的符号,并省略其详细说明。 16 [0165] Further, in the embodiment represented in the modification of FIG. 9, each of the embodiments of the same portions are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0166] 以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。 [0166] The above are only preferred embodiments of the present invention only, not limitation of the present invention in any form, although the invention has been disclosed above by the preferred embodiments, but not intended to limit the present invention, anyone familiar with Those skilled in the art, without departing from the scope of the technical solution of the present invention, when the techniques disclosed above can be utilized with some minor modifications to the content as equivalent variations or modifications equivalent embodiments, but all without departing from the technical solutions of the present invention, any simple modifications based on the technical essence of the present invention is made to the above embodiment of the embodiment, the equivalent changes and modifications, provided they fall within the scope of the present invention.

Claims (6)

1. 一种灯装置,其特征在于包括:元件基板,具备元件基板本体、分别配置在从所述元件基板本体的一主面的中心位置向外缘侧偏移的位置的多个发光元件、以及配线部,所述配线部具有与所述发光元件电连接的连接支承部、以及与所述连接支承部相邻接地形成且贯通元件基板本体的配线孔,并且所述配线部的至少一部分是与元件基板本体的一主面侧的中心位置相重叠而配置;散热体,在一端侧紧贴地安装着元件基板的元件基板本体的另一主面侧;灯口,安装在散热体的另一端侧;以及点灯装置,具备供电部,并对发光元件进行点灯控制,所述供电部收容在散热体和灯口之间,具有供电线、以及连接于所述供电线的前端且与连接支承部相连接的连接部,并且可插通到配线孔中,其中,所述连接支承部配置在所述元件基板本体的中心位置,所述配线 A lamp apparatus, comprising: an element substrate provided with the element substrate main body, a plurality of light emitting elements are arranged at positions of the outer edge from the center position of one main surface of the element substrate main body side offset and a wiring section, the wiring connecting portion having a support portion electrically connected to the light emitting element, and the connection portion formed adjacent to the support and through the wiring hole of the element substrate main body, and the wiring portion at least a part of the center position of one main surface side of the element substrate main body disposed to overlap; radiator, mounted at one end against the other main surface of the element substrate main body of the element substrate side; the cap, mounted a front end and a lighting apparatus includes a power supply unit, and controls lighting of the light emitting element, the power supply unit accommodated between the radiator and the cap, having a power supply line, and connected to the power supply line; the other end side of the radiator and connected to the support portion and the connecting portion are connected, and the wiring may be inserted through the hole, wherein said connection support portion arranged at the center position of the element substrate main body of the wiring 以偏移方式而与所述连接支承部邻接配置。 Arranged in an offset manner with the connecting portion adjacent to the support.
2.根据权利要求1所述的灯装置,其特征在于:所述散热体包括可供点灯装置的供电线插通的插通孔部,在所述散热体的一端侧安装着元件基板的元件基板本体的状态下,所述插通孔部位于与所述元件基板的配线孔相对应的位置。 2. The lamp device according to claim 1, wherein: said radiator comprises a feed line insertion hole for insertion of the lighting device, the element mounting element substrate on one end side of the heat sink the state of the substrate main body, said insertion hole section located at the wiring hole of the substrate member corresponding to the position.
3.根据权利要求1或2所述的灯装置,其特征在于:包括收容盒,所述收容盒使散热体与灯口绝缘,配置在所述散热体和灯口之间,并收容着点灯装置。 The lamp device according to claim 1, wherein: a storage cartridge, said cartridge accommodating the radiator and the cap insulation, disposed between the radiator and the cap, and stores the lighting device.
4.根据权利要求3所述的灯装置,其特征在于:所述散热体在一端部包括配置着元件基板的支承部,在另一端部包括配置着点灯装置的收纳凹部;在所述收容盒的一部分中包括连通于收纳凹部的开口部,所述收容盒以介于点灯装置和散热体的收纳凹部之间的方式而配置着;所述灯装置包括导热构件,所述导热构件经由收容盒的开口部而将点灯装置与散热体的收纳凹部的表面形成热连接。 4. The lamp device according to claim 3, wherein: at an end portion of said radiator comprises a support part where the element substrate, the other end portion comprises a storage concave portion where the lighting device; said housing box includes a portion communicating with the opening of the recess of the housing, the cartridge housing in a manner interposed between the lighting device and the storage concave portion of the radiator disposed; said lamp means comprises a thermally conductive member, via the thermally conductive member accommodating cassette an opening portion forming surface of the storage recessed portion of the heat lighting device and the radiator is connected.
5.根据权利要求4所述的灯装置,其特征在于:所述点灯装置大致沿着散热体的中心轴方向而配置在收容盒中;所述收纳凹部一体地具有向点灯装置突出的突出部;所述导热构件经由开口部而将点灯装置与突出部加以连接。 The lamp device according to claim 4, wherein: the lighting device substantially along the central axis direction of the radiator is arranged in the cassette housing; the housing has a recessed portion integrally protruding portion protruding toward the lighting device ; the heat conducting member via the opening portion and the protruding portion of the lighting device to be connected.
6. 一种照明器具,其特征在于包括:具备插座的器具本体;以及在所述器具本体的插座上安装着灯口的权利要求1所述的灯装置。 A lighting fixture, comprising: a socket main body of the appliance; rights and the cap is mounted on the socket of the fixture body lamp device according to claim 1.
CN2009101608704A 2008-07-30 2009-07-28 Lamp and lighting equipment CN101639170B (en)

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