JP3163703U - Semiconductor light source - Google Patents

Abstract

A light source including a semiconductor light emitting element capable of irradiating a wide range is provided. A semiconductor light source includes a pedestal having metal wiring therein and having a plurality of side surfaces facing different directions, and a plurality of semiconductor light emitting elements that are flip-chip mounted on the plurality of side surfaces of the pedestal. The sealing member 12 that covers the semiconductor light emitting element and is formed in parallel on a plurality of side surfaces of the pedestal, and below the position where the semiconductor light emitting element is mounted, and on the surface of the sealing member, And a reflecting member 13 having a material different from that of the base. [Selection] Figure 2

Description

  The present invention relates to a semiconductor light source, and more particularly to a semiconductor light source having a semiconductor light emitting element mounted on a pedestal.

  As a semiconductor light source device, a plurality of semiconductor light emitting elements are arranged in a planar shape on a mounting substrate, and fluorescence that converts the wavelength of light emitted from the semiconductor light emitting element at a predetermined distance from the surface of the semiconductor light emitting element. A structure including a wavelength conversion cover provided with a member is known (for example, see Patent Document 1). By providing a plurality of semiconductor light emitting elements, the emission intensity is increased. Furthermore, the wavelength conversion cover can emit light of a color that is difficult to emit light alone or a subtle hue.

JP 2006-156187 A

  However, although the semiconductor light emitting element exhibits high light distribution characteristics in the vertical direction with respect to the mounting surface, the light distribution characteristics in the side surface direction of the semiconductor light emitting elements are low and the light output is small. Therefore, the irradiation direction is limited in the conventional semiconductor light source arranged on the mounting substrate in a planar shape, and it cannot be irradiated over a wide range like a light bulb.

  Therefore, the present invention has been made in view of such circumstances, and an object thereof is to provide a light source composed of a semiconductor light emitting element that can irradiate a wide range.

  According to the present invention, the above problem is solved by the following means.

A semiconductor light source of the present invention includes a pedestal having metal wiring inside and having a plurality of side faces facing different directions, a plurality of semiconductor light emitting elements mounted on a plurality of side faces of the pedestal, and the semiconductor light emitting elements A sealing member formed in parallel on a plurality of side surfaces of the pedestal, and a material different from the pedestal on the lower side of the mounting position of the semiconductor light emitting element and on the surface of the sealing member And a reflective member.
As a result, the emission intensity can be increased and light can be emitted in a wide range of directions. Furthermore, the semiconductor light-emitting element can be arranged in a space smaller than that in which the semiconductor light-emitting element is arranged in a planar shape, and the semiconductor light source can be downsized.

Moreover, it is preferable that the said base consists of a metal material which comprises the wiring of a positive electrode or a negative electrode, and is provided with an insulating layer between the said base and the said metal wiring.
As a result, the pedestal itself has the role of wiring, and no new wiring material is required. Further, since the pedestal is made of a metal material, the heat dissipation is excellent, and light from the semiconductor light emitting element can be reflected to emit light in a wider range.

Moreover, it is preferable that the said base has an unevenness | corrugation on the surface.
Thereby, the heat generated by the light emission of the semiconductor light emitting element can be radiated efficiently.

Moreover, it is preferable that the semiconductor light source is a light emitting device provided with a plurality.
Thus, a light emitting device that can emit light in a wide range of directions and can be downsized can be obtained.

  According to the semiconductor light source of the present invention, it is possible to provide a light source including a semiconductor light emitting element that can irradiate a wide range.

It is a schematic perspective view which shows the semiconductor light source which concerns on 1st embodiment. It is a schematic perspective view which shows the inside of the sealing member of the semiconductor light source which concerns on 1st embodiment. It is a schematic top view which shows the inside of the sealing member of the semiconductor light source which concerns on 1st embodiment. It is a schematic perspective view which shows the inside of the base of the semiconductor light source which concerns on 1st embodiment. It is a schematic perspective view which shows the inside of the base of the semiconductor light source which concerns on 2nd embodiment. It is a schematic perspective view which shows the semiconductor light source which concerns on 3rd embodiment. It is a schematic perspective view of the semiconductor light source which concerns on 4th embodiment. It is a schematic perspective view which shows the light-emitting device which concerns on 5th embodiment. It is a schematic sectional drawing which shows the light-emitting device which concerns on 5th embodiment.

<First embodiment>
The first embodiment will be described in detail with reference to the drawings. FIG. 1 is a schematic perspective view showing a semiconductor light source according to the first embodiment. FIG. 2 is a schematic perspective view showing the inside of the sealing member of the semiconductor light source according to the first embodiment. FIG. 3 is a schematic top view showing the inside of the sealing member of the semiconductor light source according to the first embodiment. FIG. 4 is a schematic perspective view showing the inside of the base of the semiconductor light source according to the first embodiment, in which the semiconductor light emitting element, the sealing member, and the reflecting member are omitted.

The semiconductor light source 100 according to the first embodiment includes at least a semiconductor light emitting element 10, a pedestal 11 having a through hole 14 therein, a sealing member 12, and a reflecting member 13.
The pedestal 11 is made of a highly heat conductive material such as AlN or ceramics having side surfaces facing different directions, and includes electrodes (not shown) for mounting and conducting the semiconductor light emitting element 10 on the side surfaces. The pedestal 11 has a through hole 14, and a metal wiring (not shown) for energizing the semiconductor light emitting element 10 is connected to the electrode on the side surface of the pedestal 11 through the through hole 14. A plurality of semiconductor light emitting elements 10 are flip-chip mounted on the side surface of the pedestal 11 so as to be connected to electrode portions via conductive bumps such as metal so that the semiconductor light emitting elements 10 face in many directions. An electrode may be provided on the upper surface of the pedestal 11 to mount the semiconductor light emitting device 10, or a plurality of semiconductor light emitting devices 10 may be mounted on one or the upper surface of the side surface. The semiconductor light emitting element 10 is covered with a sealing member 12, and the sealing member 12 is also formed in parallel on a plurality of side surfaces and an upper surface of the base 11 on which the semiconductor light emitting element 10 is mounted. “Parallel” described in the claims and the specification does not mean parallel without any difference in size, but means that it seems to be roughly parallel in appearance. For example, the angle between the side surface of the base 11 and the surface of the sealing member 12 may be within 10 degrees. Further, the surface of the sealing member 12 may be uneven. The sealing member 12 may contain a phosphor or a diffusing agent that can convert the wavelength of the light emitted from the semiconductor light emitting element 10. Further, a reflective member 13 made of a material different from the base 11 is provided on the surface of the sealing member 12 below the position where the semiconductor light emitting element 10 is mounted, and the reflective member 13 is also in contact with the base 11. As the reflecting member 13, a resin molded body containing a metal such as Al or Au, or a filler, a diffusing agent, a phosphor, a reflective substance, or the like can be used.

  Thereby, the heat generated by the light emission of the semiconductor light emitting element 10 is radiated to the base 11 via the bumps. Further, since the reflecting member 13 is provided below the mounting position of the semiconductor light emitting element 10, light that passes downward, that is, toward the installation surface of the base 11 is suppressed. Further, the plurality of semiconductor light emitting elements 10 can be arranged in a smaller space than that arranged in a plane, and light can be emitted in many directions. Therefore, the heat radiation is excellent, the emission intensity is improved, the irradiation can be performed over a wide range, and the semiconductor light source can be miniaturized.

<Second Embodiment>
Next, a semiconductor light source according to the second embodiment will be described. FIG. 5 is a schematic perspective view showing the inside of the base of the semiconductor light source according to the second embodiment. The semiconductor light source according to the second embodiment is the same as the semiconductor light source except that the pedestal 11 is made of a metal material constituting the positive or negative wiring, and the insulating layer 15 is provided between the metal wiring in the through hole 14 and the pedestal 11. This is substantially the same as one embodiment.

In the semiconductor light source according to the second embodiment, since the pedestal 11 is made of a metal material, the pedestal 11 itself also serves as an electrode. Therefore, no electrode is required on the side surface of the base 11. Further, the metal wiring in the through hole 14 and the pedestal 11 are electrically insulated by the insulating layer 15.
Thereby, the pedestal 11 is excellent in heat dissipation, and light emitted from the semiconductor light emitting element 10 can be reflected by the pedestal 11.

<Third embodiment>
Next, a semiconductor light source according to the third embodiment will be described. FIG. 6 is a schematic perspective view showing a semiconductor light source according to the third embodiment. The semiconductor light source according to the third embodiment is substantially the same as the first or second embodiment except that the shape of the base 11 is different.

As for the semiconductor light source which concerns on 3rd embodiment, the base 11 has an unevenness | corrugation on the surface.
Thereby, the heat generated by the light emission of the semiconductor light emitting element 10 can be efficiently radiated.

<Fourth embodiment>
Next, a semiconductor light source according to the fourth embodiment will be described. FIG. 7 is a schematic perspective view of a semiconductor light source according to the fourth embodiment. In the semiconductor light source according to the fourth embodiment, a plurality of semiconductor light sources 100 according to the first to third embodiments are arranged, and the sealing member 12, the reflecting member 13, and the through hole 14 are provided for the explanation to be described later. Omitted.

When a plurality of semiconductor light sources 100 are arranged, the semiconductor light emitting elements 10 are mounted on the base 11 so as not to face each other.
Thereby, since all the semiconductor light emitting elements 10 mounted on the pedestal 11 do not block light on the light emitting surface side, the light emission of the semiconductor light emitting elements 10 can be used efficiently.

<Fifth embodiment>
Next, a light emitting device according to a fifth embodiment will be described. FIG. 8 is a schematic perspective view showing a light emitting device according to the fifth embodiment. FIG. 9 shows a light emitting device according to the fifth embodiment, and is a schematic cross-sectional view taken along line AA ′ of FIG.

The light emitting device 200 according to the fifth embodiment includes at least a semiconductor light source 100, a translucent cover 101, a semiconductor light source mounting substrate 102, a storage member 103, and a base 104.
A plurality of semiconductor light sources 100 are mounted on the semiconductor light source mounting substrate 102. In the light emitting device 200 according to the fifth embodiment, the semiconductor light source 100 is substantially the same as in the first to third embodiments, and the mounting form of the semiconductor light emitting element 10 is substantially the same as in the fourth embodiment. It is. Each semiconductor light source 100 includes a metal wiring, and the metal wiring penetrates the semiconductor light source mounting substrate 102 and is stored in the storage member 103. A base 104 to which power is supplied via the storage member 103 is provided, and a hemispherical translucent cover 101 is disposed in a large-diameter opening of the storage member 103. As the translucent cover 101, glass, a casting case in which silicone resin is compression-molded, or the like can be used. The translucent cover 101 may have a phosphor, a filler, a diffusing agent, or the like on the inside or inside / outside surface thereof.

  As a result, a light-emitting device that has excellent heat dissipation, high emission intensity, and can be irradiated over a wide range can be obtained. Further, dust and the like can be prevented from adhering to the semiconductor light source 100 from the outside, and since there is no direct contact with the semiconductor light source 100, there is no risk of electric shock for the user.

  The light emitting device of the embodiment will be described with reference to FIGS. FIG. 8 is a schematic perspective view showing a light emitting device according to the fifth embodiment. FIG. 9 shows a light emitting device according to the fifth embodiment, and is a schematic sectional view taken along line A-A ′ of FIG. 8.

  The light emitting device 200 according to the embodiment includes a semiconductor light source 100 including the semiconductor light emitting element 10, a pedestal 11 having a through hole 14 therein, a sealing member 12, and a reflecting member 13. A cover 101, a semiconductor light source mounting substrate 102, a storage member 103, and a base 104 are included.

The semiconductor light emitting device 10 of the embodiment is a device having a substantially square shape in plan view, and has a GaN-based semiconductor layer laminated structure. A plurality of semiconductor light emitting elements 10 are flip-chip mounted on the side surface and the upper surface of a base 11 made of AlN, and sealed with a sealing member 12 containing a phosphor that converts the wavelength of light emitted from the semiconductor light emitting element 10. The sealing member 12 covers the semiconductor light emitting element 10 and is formed in parallel on the plurality of side surfaces and the upper surface of the base 11. Further, a silicone resin mixed with TiO ₂ is disposed as the reflecting member 13 on the surface of the sealing member 12 below the position where the semiconductor light emitting element 10 is mounted, thereby forming the semiconductor light source 100.

  The semiconductor light source 100 has metal wiring inside the pedestal 11 and is disposed on the semiconductor light source mounting substrate 102. The metal wiring penetrates the semiconductor light source mounting substrate 102 and is stored in the storage member 103. A cap 104 to which power is supplied via the storage member 103 is provided, and a hemispherical casting case in which silicone resin is compression-molded is disposed as a translucent cover 101 in a large-diameter opening of the storage member 103.

  The semiconductor light source and the light emitting device of the present invention can be suitably used for general illumination or the like.

DESCRIPTION OF SYMBOLS 10 Semiconductor light-emitting element 11 Base 12 Sealing member 13 Reflecting member 14 Through-hole 15 Insulating layer 100 Semiconductor light source 101 Translucent cover 102 Semiconductor light source mounting board 103 Housing member (housing)
104 Base 200 Light-emitting device

Claims (4)

A pedestal having metal wiring inside and having side surfaces facing different directions;
A plurality of semiconductor light emitting elements flip-chip mounted on a plurality of side surfaces of the pedestal;
A sealing member that covers the semiconductor light emitting element and is formed in parallel on a plurality of side surfaces of the pedestal;
A reflective member having a material different from that of the pedestal on the lower side of the position where the semiconductor light emitting element is mounted and on the surface of the sealing member;
A semiconductor light source comprising: The pedestal is made of a metal material constituting the positive or negative wiring,
The semiconductor light source according to claim 1, further comprising an insulating layer between the pedestal and the metal wiring.   The semiconductor light source according to claim 1, wherein the pedestal has an uneven surface.   The light emitting device according to claim 1, wherein a plurality of the semiconductor light sources are provided.

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