JP2013004824A - Led lighting device and method for manufacturing led lighting device - Google Patents

Led lighting device and method for manufacturing led lighting device Download PDF

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JP2013004824A
JP2013004824A JP2011135865A JP2011135865A JP2013004824A JP 2013004824 A JP2013004824 A JP 2013004824A JP 2011135865 A JP2011135865 A JP 2011135865A JP 2011135865 A JP2011135865 A JP 2011135865A JP 2013004824 A JP2013004824 A JP 2013004824A
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led
chip
led chip
lighting device
led lighting
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Kazutaka Ikeda
一貴 池田
Satoshi Nakamura
中村　　聡
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting device capable of improving heat dissipation from an LED chip.SOLUTION: In an LED lighting device 1, an LED chip 1 is housed in an LED mounting concavity 2a formed on a metal plate 2 and adhesively fixed to the LED mounting concavity 2a via adhesive resin 3, the adhesive resin 3 is filled between a rear surface opposing to a light emitting surface of the LED chip 1 and a bottom part 41 of the LED mounting concavity 2a and also filled so as to fill gaps between chip side faces 52 of the LED chip 1 and bottom side faces 42 of the LED mounting concavity 2a, the chip side faces 52 of the LED chip 1 are thermally connected to the metal plate 2 via the adhesive resin 3 and heat is effectively radiated because a heat radiation area of the LED chip 1 increases.

Description

この発明は、照明光源などに使用されるＬＥＤ照明装置に関する。   The present invention relates to an LED lighting device used for an illumination light source or the like.

図７は、発光ダイオードチップ（以下、ＬＥＤチップと称す）を用いた、従来の照明装置の構成を示す図である。図７に示すＬＥＤ照明装置１０は、金属板１２の前面にガラスエポキシ樹脂などの絶縁樹脂からなる絶縁層１３が形成されている。ＬＥＤ照明装置１０は、絶縁層１３上の銅箔からなる配線パターン１４が形成された金属基板１１を備え、絶縁層１３上にＬＥＤチップ１の発光面と反対側の面（裏面）とが、接着樹脂３により接着固定されている。また、ＬＥＤチップ１は、ボンディングワイヤ５を介して配線パターン１４と電気的に接続されている。なお、金属基板１１には、ＬＥＤチップ１を実装した部分の周囲に円形の開口を設けた樹脂製（白色系）の枠部材１５を接着樹脂よりなる接着層１６を介して接着して、枠部材１５の内側にエポキシ樹脂などの透明な封止樹脂１８を流し込んで、ＬＥＤチップ１を封止している。   FIG. 7 is a diagram showing a configuration of a conventional lighting device using a light emitting diode chip (hereinafter referred to as an LED chip). In the LED lighting device 10 shown in FIG. 7, an insulating layer 13 made of an insulating resin such as glass epoxy resin is formed on the front surface of a metal plate 12. The LED lighting device 10 includes a metal substrate 11 on which a wiring pattern 14 made of a copper foil on an insulating layer 13 is formed, and a surface (back surface) opposite to the light emitting surface of the LED chip 1 is formed on the insulating layer 13. The adhesive resin 3 is adhesively fixed. Further, the LED chip 1 is electrically connected to the wiring pattern 14 via the bonding wires 5. A metal (white) frame member 15 having a circular opening around the portion where the LED chip 1 is mounted is bonded to the metal substrate 11 via an adhesive layer 16 made of an adhesive resin. A transparent sealing resin 18 such as an epoxy resin is poured into the member 15 to seal the LED chip 1.

ところで、ＬＥＤチップが発光すると熱を発生するが、一般的にＬＥＤチップの温度が高くなるほど、ＬＥＤチップの発光効率は低下し、発光出力は小さくなる。また、ＬＥＤチップの劣化は、高温に晒されるほど早まるため、ＬＥＤチップの温度上昇は、ＬＥＤチップの寿命低下などを生じさせる。よって、図７に示した従来のＬＥＤ照明装置１０では、ＬＥＤチップ１と放熱部材である金属板１２の間に熱伝導性の悪い絶縁層１３があるなどして、放熱性がよくないという課題があった。   By the way, when the LED chip emits light, heat is generated. Generally, as the temperature of the LED chip increases, the light emission efficiency of the LED chip decreases and the light emission output decreases. Further, since the deterioration of the LED chip is accelerated as it is exposed to a high temperature, the rise in the temperature of the LED chip causes a decrease in the life of the LED chip. Therefore, in the conventional LED lighting device 10 shown in FIG. 7, there is a problem that the heat dissipation is not good because there is an insulating layer 13 with poor thermal conductivity between the LED chip 1 and the metal plate 12 that is a heat dissipation member. was there.

そこで、特許文献１においては、ＬＥＤチップを金属板に直接接合することにより、放熱特性の向上を図っている。その他、特許文献２においても、特許文献１と同様に金属製のベース部材に直接ＬＥＤチップを接着固定することで、放熱特性を向上している。   Therefore, in Patent Document 1, the heat dissipation characteristics are improved by directly bonding the LED chip to the metal plate. In addition, in Patent Document 2, similarly to Patent Document 1, the heat dissipation characteristics are improved by directly bonding and fixing the LED chip to a metal base member.

特開２００３−１５２２２５号公報JP 2003-152225 A 特開２００９−４５０３号公報JP 2009-4503 A

しかしながら、特許文献１や特許文献２などでは、ＬＥＤチップを直接金属板に実装することで、放熱特性を向上させてはいるが、ＬＥＤチップから発生した熱は、金属板と接着樹脂を介して接しているＬＥＤチップの発光面と反対側の面（裏面）からしか放熱できないため、放熱性が十分とはいえない。   However, in Patent Document 1 and Patent Document 2 and the like, the heat dissipation characteristics are improved by mounting the LED chip directly on the metal plate, but the heat generated from the LED chip passes through the metal plate and the adhesive resin. Since heat can be radiated only from the surface (back surface) opposite to the light emitting surface of the LED chip in contact with the LED chip, the heat dissipation is not sufficient.

この発明は、放熱特性に優れたＬＥＤ照明装置を提供することを目的とする。   An object of this invention is to provide the LED illuminating device excellent in the heat dissipation characteristic.

この発明のＬＥＤ照明装置は、
底部と前記底部の周縁から起立する側面である底部側面とを有することで前記底部と前記底部側面とにより相手部品を収納する収納空間を形成する金属製の収納部を持つ金属板と、
前記相手部品として前記収納部に収納されるＬＥＤチップであって、発光光が出射される側の面である上面と、前記上面に対して反対側となる裏面と、前記上面と前記裏面とをつなぐ側面であるチップ側面とを有し、前記裏面が前記底部に対向して前記収納部に収納されると共に、
前記収納部に収納された状態において、前記底部と前記裏面との間と、前記底部側面と前記チップ側面との間とに、接着剤が充填されるＬＥＤチップと
を備えたことを特徴とする。 The LED lighting device of this invention is
A metal plate having a metal storage portion that forms a storage space for storing a mating component by the bottom portion and the bottom side surface by having a bottom portion and a bottom side surface that is a side surface rising from a peripheral edge of the bottom portion;
An LED chip housed in the housing portion as the counterpart component, the upper surface being a surface on the side from which emitted light is emitted, the back surface opposite to the top surface, the top surface and the back surface A chip side surface that is a side surface to be connected, and the back surface is stored in the storage unit facing the bottom,
An LED chip filled with an adhesive is provided between the bottom and the back surface, and between the bottom side surface and the chip side surface in a state of being stored in the storage unit. .

この発明により、放熱特性に優れたＬＥＤ照明装置を提供できる。   According to the present invention, an LED lighting device having excellent heat dissipation characteristics can be provided.

実施の形態１におけるＬＥＤ照明装置１００を示す断面図。Sectional drawing which shows LED lighting apparatus 100 in Embodiment 1. FIG. 図１のＸ方向矢視を示す模式図。The schematic diagram which shows the X direction arrow of FIG. 実施の形態１におけるＬＥＤ照明装置１００のＬＥＤチップ１からの熱伝導を示す模式図。FIG. 3 is a schematic diagram showing heat conduction from the LED chip 1 of the LED lighting device 100 according to the first embodiment. 実施の形態１におけるＬＥＤチップ１の配置バリエーションを示す図。FIG. 6 is a diagram showing an arrangement variation of the LED chip 1 in the first embodiment. 実施の形態１におけるＬＥＤチップ１の収納部品３０を示す図。FIG. 3 shows a storage component 30 of the LED chip 1 in the first embodiment. 実施の形態２におけるＬＥＤ照明装置２００を示す断面図。Sectional drawing which shows the LED lighting apparatus 200 in Embodiment 2. FIG. 従来のＬＥＤ照明装置１０を示す断面図。Sectional drawing which shows the conventional LED lighting apparatus 10. FIG.

実施の形態１．
図１は、実施の形態１に係るＬＥＤ照明装置１００の構成例を示す断面図である。図１において、ＬＥＤ照明装置１００は、熱伝導性の良い金属板２と、金属板２の上に配置された発光ダイオードチップ１（以下、ＬＥＤチップ１と称す）と、金属板２とＬＥＤチップ１を接着固定する接着樹脂３（接着剤）と、金属板２の上に接着樹脂（図示せず）を介して接着固定された回路基板４と、ＬＥＤチップ１と回路基板４を電気的に接続するボンディングワイヤ５と、ＬＥＤチップ１とボンディングワイヤ５を封止する封止樹脂６とからなる。 Embodiment 1 FIG.
FIG. 1 is a cross-sectional view illustrating a configuration example of the LED lighting apparatus 100 according to Embodiment 1. In FIG. 1, an LED lighting device 100 includes a metal plate 2 having good thermal conductivity, a light emitting diode chip 1 (hereinafter referred to as LED chip 1) disposed on the metal plate 2, a metal plate 2 and an LED chip. 1, an adhesive resin 3 (adhesive) for bonding and fixing 1, a circuit board 4 bonded and fixed on the metal plate 2 via an adhesive resin (not shown), and the LED chip 1 and the circuit board 4 are electrically connected It consists of a bonding wire 5 to be connected and a sealing resin 6 for sealing the LED chip 1 and the bonding wire 5.

（金属板２）
金属板２は、銅またはアルミニウムなどの熱伝導性のよい金属から構成される。金属板２には、前面（図１における上方）にＬＥＤチップ１を搭載するＬＥＤ搭載凹部２ａ（収納部）が凹形状に形成されている。ＬＥＤ搭載凹部２ａは、底部４１と底部４１の周縁４１−１から起立する側面である底部側面４２とを有することで底部４１と底部側面４２とにより、相手部品であるＬＥＤチップ１を収納する収納空間４３を形成する。 (Metal plate 2)
The metal plate 2 is made of a metal having good thermal conductivity such as copper or aluminum. In the metal plate 2, an LED mounting recess 2a (housing portion) for mounting the LED chip 1 is formed in a concave shape on the front surface (upper side in FIG. 1). The LED mounting recess 2a has a bottom 41 and a bottom side 42 which is a side rising from the peripheral edge 41-1 of the bottom 41, so that the LED chip 1 as a counterpart component is stored by the bottom 41 and the bottom side 42. A space 43 is formed.

図２は、ＬＥＤ照明装置１００の平面視（図１のＸ方向矢視）であり、ＬＥＤチップ１、ＬＥＤ搭載凹部２ａ、接着樹脂３の関係を模式的に示している。図２に示すように、ＬＥＤ搭載凹部２ａの平面視寸法は、ＬＥＤチップ１のサイズより若干大きい寸法に設定してある。また、図１に示すように、ＬＥＤ搭載凹部２ａの深さ方向の寸法Ｈは、ＬＥＤチップ１の厚みＢよりも小さい寸法に設定している。   FIG. 2 is a plan view of the LED lighting device 100 (as viewed in the X direction in FIG. 1), and schematically shows the relationship between the LED chip 1, the LED mounting recess 2a, and the adhesive resin 3. As shown in FIG. 2, the planar dimension of the LED mounting recess 2 a is set to be slightly larger than the size of the LED chip 1. As shown in FIG. 1, the dimension H in the depth direction of the LED mounting recess 2 a is set to be smaller than the thickness B of the LED chip 1.

（ＬＥＤチップ１）
ＬＥＤチップ１は、図１に示すように、発光面（上面）に対して反対側の面（裏面）を金属板２の前面に対して対向するようにしてＬＥＤ搭載凹部２ａの収納空間４３に収納され、接着樹脂３により接着固定されている。ＬＥＤチップ１は、上面と裏面とをつなぐ側面であるチップ側面５２を有する。接着樹脂３は、底部側面４２とチップ側面５２との間にも充填される。図１のＬＥＤチップ１は、Ｐ電極およびＮ電極が、同一面側（図１に示す上面側）に構成される。 (LED chip 1)
As shown in FIG. 1, the LED chip 1 is placed in the storage space 43 of the LED mounting recess 2 a so that the surface (back surface) opposite to the light emitting surface (upper surface) faces the front surface of the metal plate 2. It is housed and fixed by adhesive resin 3. The LED chip 1 has a chip side surface 52 that is a side surface connecting the upper surface and the back surface. The adhesive resin 3 is also filled between the bottom side surface 42 and the chip side surface 52. In the LED chip 1 of FIG. 1, the P electrode and the N electrode are configured on the same surface side (upper surface side shown in FIG. 1).

（接着樹脂３）
接着樹脂３は、シリコーン樹脂やエポキシ樹脂などの熱硬化型樹脂からなる。接着樹脂３は、ＬＥＤチップ１とＬＥＤ搭載凹部２ａとの間にできる空隙を埋めるように配置され、ＬＥＤチップ１の裏面および側面を接着固定している。すなわち図１に示すように、ＬＥＤチップ１は、ＬＥＤ搭載凹部２ａに収納された状態において、底部４１と裏面との間と、底部側面４２とチップ側面５２との間とに、接着樹脂３が充填される。また、図１に示すように、接着樹脂３はＬＥＤチップ１の発光面よりも低い高さでＬＥＤチップ側面を接着固定している。すなわち、底部側面４２とチップ側面５２との間に充填された接着樹脂３は、ＬＥＤチップ１の裏面から上面に向かう方向を上方（矢印Ｘと反対方向）とした場合に、最も上方となる箇所が上面よりも下方に位置するように充填される。これによって、ＬＥＤチップ１の発光面への接着樹脂３の付着を防止できる。 (Adhesive resin 3)
The adhesive resin 3 is made of a thermosetting resin such as a silicone resin or an epoxy resin. The adhesive resin 3 is disposed so as to fill a gap formed between the LED chip 1 and the LED mounting recess 2a, and the back surface and the side surface of the LED chip 1 are bonded and fixed. That is, as shown in FIG. 1, the LED chip 1 has the adhesive resin 3 between the bottom 41 and the back surface and between the bottom side surface 42 and the chip side surface 52 in the state of being housed in the LED mounting recess 2 a. Filled. Further, as shown in FIG. 1, the adhesive resin 3 adheres and fixes the side surface of the LED chip at a height lower than the light emitting surface of the LED chip 1. That is, the adhesive resin 3 filled between the bottom side surface 42 and the chip side surface 52 is located at the uppermost position when the direction from the back surface to the top surface of the LED chip 1 is upward (opposite the direction of the arrow X). Is filled below the upper surface. Thereby, adhesion of the adhesive resin 3 to the light emitting surface of the LED chip 1 can be prevented.

接着樹脂３に関しては、熱伝導性の良い金属フィラー剤等が入っている接着樹脂（導電性樹脂）が望ましいが絶縁性の接着樹脂であっても、従来のＬＥＤチップ下面からのみ放熱させる方法と比較して、側面部も放熱に使用することで、全体として放熱面積が広くなり、放熱効果が向上する。   As for the adhesive resin 3, an adhesive resin (conductive resin) containing a metal filler agent having good thermal conductivity is desirable, but even if it is an insulating adhesive resin, a method of dissipating heat only from the lower surface of the conventional LED chip In comparison, the side surface portion is also used for heat radiation, so that the heat radiation area is increased as a whole, and the heat radiation effect is improved.

（熱の伝わり方）
図３は、ＬＥＤチップ１から発生する熱の伝わり方を示す模式図である。図３において、矢印ａ，ｂ，ｃ，ｄ，ｅは、熱の伝わる方向を示す。図３に示すように、ＬＥＤチップ１の裏面および側面は、金属板２上に形成されたＬＥＤ搭載凹部２ａに接着樹脂３を介して接着固定されており、ＬＥＤチップ１で発生した熱は、矢印ａ，ｂ，ｃ，ｄ，ｅのように直接金属板２へ伝えられ、外部へ放出される。 (How heat is transmitted)
FIG. 3 is a schematic diagram showing how heat generated from the LED chip 1 is transmitted. In FIG. 3, arrows a, b, c, d, and e indicate directions in which heat is transmitted. As shown in FIG. 3, the back surface and side surface of the LED chip 1 are bonded and fixed to the LED mounting recess 2a formed on the metal plate 2 via the adhesive resin 3, and the heat generated in the LED chip 1 is As indicated by arrows a, b, c, d, and e, it is directly transmitted to the metal plate 2 and discharged to the outside.

（回路基板４）
回路基板４は、ガラスエポキシ基板などの絶縁性を有する基板からなり、金属板２のＬＥＤ搭載凹部２ａの周囲に円形に開口させたＬＥＤ搭載凹部２ａよりも大きい寸法の貫通孔４ｂが形成されている。また、回路基板４は、銅箔からなる配線パターン４ａが設けられた面に対して反対側の面が、金属板２に対向するように、接着樹脂（図示せず）を介して金属板２に接着固定されている。また、回路基板４の前面に設けられた配線パターン４ａは、ボンディングワイヤ５を介してＬＥＤチップ１と電気的に接続されている。 (Circuit board 4)
The circuit board 4 is made of an insulating substrate such as a glass epoxy substrate, and a through hole 4b having a size larger than that of the LED mounting recess 2a opened in a circle around the LED mounting recess 2a of the metal plate 2 is formed. Yes. Further, the circuit board 4 has a metal plate 2 through an adhesive resin (not shown) so that the surface opposite to the surface on which the wiring pattern 4a made of copper foil is provided faces the metal plate 2. It is fixed to the adhesive. Further, the wiring pattern 4 a provided on the front surface of the circuit board 4 is electrically connected to the LED chip 1 through the bonding wires 5.

また、ＬＥＤチップ１とボンディングワイヤ５は、ＬＥＤチップ１からの光を透過する封止樹脂６によって封止されている。ここにおいて、ＬＥＤチップ１としては、窒化ガリウム系化合物半導体よりなる青色系ＬＥＤチップを用いており、封止樹脂６には、ＬＥＤチップ１の青色発光で励起されると黄色系の光を発する蛍光体が配合されている。   The LED chip 1 and the bonding wire 5 are sealed with a sealing resin 6 that transmits light from the LED chip 1. Here, a blue LED chip made of a gallium nitride compound semiconductor is used as the LED chip 1, and the sealing resin 6 emits yellow light when excited by the blue light emission of the LED chip 1. The body is formulated.

（ＬＥＤチップ１の配置バリエーション）
図４は、ＬＥＤチップ１を、接着樹脂３を用いてＬＥＤ搭載凹部２ａに配置する際の配置バリエーションを示す図である。図４は、図１のＸ方向矢視に相当し、図４（ａ）は、図２そのものである。
平面視でＬＥＤチップ１及びＬＥＤ搭載凹部２ａが四角形に見える場合、
図４（ａ）のようにＬＥＤチップ１のチップ側面５２の全周に接着樹脂３を充填してもよいし、
図４（ｂ）のように、隣あう２つのチップ側面５２を底部側面４２に押し当て、残りの２つのチップ側面５２に接着樹脂３を充填してもよいし、
図４（ｃ）のように１つのチップ側面５２を底部側面４２に押し当て、残りの３つのチップ側面５２に接着樹脂３を充填してもよいし、
図４（ｄ）のように向かいあうチップ側面５２を底部側面４２に押し当て、残りの向かいあうチップ側面５２に接着樹脂３を充填してもよいし、
図４（ｅ）のように３つのチップ側面５２を底部側面４２に押し当て、残りの１つのチップ側面５２に接着樹脂３を充填してもよい。
すなわち、図４（ｂ）〜（ｅ）に破線で示す箇所に、チップ側面５２と底部側面４２とが密着する密着領域２１を設け、ＬＥＤチップ１と金属板２とを接着樹脂３を介在せずに直接、接触させても構わない。 (Arrangement variation of LED chip 1)
FIG. 4 is a view showing an arrangement variation when the LED chip 1 is arranged in the LED mounting recess 2 a using the adhesive resin 3. 4 corresponds to the X direction arrow of FIG. 1, and FIG. 4A is FIG. 2 itself.
When the LED chip 1 and the LED mounting recess 2a appear to be square in plan view,
As shown in FIG. 4A, the entire circumference of the chip side surface 52 of the LED chip 1 may be filled with the adhesive resin 3,
As shown in FIG. 4B, the two adjacent chip side surfaces 52 may be pressed against the bottom side surface 42, and the remaining two chip side surfaces 52 may be filled with the adhesive resin 3.
As shown in FIG. 4C, one chip side surface 52 may be pressed against the bottom side surface 42, and the remaining three chip side surfaces 52 may be filled with the adhesive resin 3.
As shown in FIG. 4D, the chip side surfaces 52 facing each other may be pressed against the bottom side surface 42, and the remaining chip side surfaces 52 facing each other may be filled with the adhesive resin 3.
As shown in FIG. 4E, the three chip side surfaces 52 may be pressed against the bottom side surface 42 and the remaining one chip side surface 52 may be filled with the adhesive resin 3.
That is, the contact region 21 where the chip side surface 52 and the bottom side surface 42 are in close contact with each other is provided at a position indicated by a broken line in FIGS. 4B to 4E, and the adhesive resin 3 is interposed between the LED chip 1 and the metal plate 2. You may make it contact directly.

（収納部品３０）
図１のＬＥＤ照明装置１００では、金属板２にＬＥＤ搭載凹部２ａを直接形成する場合を説明したが一例である。
図５は、金属板２とは別部品の金属製の収納部品３０（収納部）にＬＥＤチップ１を配置（収納）した状態を示す図である。収納部品３０は金属板２に熱伝導性を持つ接着剤等により固定される。図５は、図３の破線部３２を抜き出したものに相当し、収納部品３０は破線部３２内の破線３１の部分に対応する。 (Storage part 30)
In the LED lighting device 100 of FIG. 1, the case where the LED mounting recess 2 a is directly formed on the metal plate 2 is described as an example.
FIG. 5 is a diagram illustrating a state in which the LED chip 1 is disposed (stored) in a metal storage component 30 (storage portion) that is a separate component from the metal plate 2. The storage component 30 is fixed to the metal plate 2 with an adhesive having thermal conductivity. FIG. 5 corresponds to an extracted portion of the broken line portion 32 in FIG. 3, and the storage component 30 corresponds to the portion of the broken line 31 in the broken line portion 32.

以上の構成によれば、ＬＥＤチップ１は、ＬＥＤ搭載凹部２ａの底面だけでなく側面も接着樹脂３により接着固定されていることから、チップ側面も接着樹脂３を介して金属板２に熱的に接続している。このためＬＥＤチップ１の放熱面積を大きくすることができ、ＬＥＤチップ１で発生した熱を速やかに放熱できる。つまり、ＬＥＤチップ１の温度上昇を抑えることができることになる。これにより、ＬＥＤ照明装置の長寿命化を図ることができる。   According to the above configuration, since the LED chip 1 is bonded and fixed not only to the bottom surface of the LED mounting recess 2 a but also to the side surface with the adhesive resin 3, the chip side surface is thermally attached to the metal plate 2 via the adhesive resin 3. Connected to. For this reason, the heat dissipation area of the LED chip 1 can be increased, and the heat generated in the LED chip 1 can be quickly dissipated. That is, the temperature rise of the LED chip 1 can be suppressed. Thereby, lifetime improvement of an LED lighting apparatus can be achieved.

なお、実施の形態１で説明したＬＥＤ照明装置１００は、ＬＥＤ照明装置の製造方法の実施の形態としても把握することが可能である。すなわち、底部４１と底部４１の周縁４１−１から起立する側面である底部側面４２とを有することで底部４１と底部側面４２とにより相手部品であるＬＥＤチップを収納する収納空間４３を形成する金属製のＬＥＤ搭載凹部２ａ（収納部）を持つ金属板２のＬＥＤ搭載凹部２ａに、発光光が出射される側の面である上面と、上面に対して反対側となる裏面と、上面と裏面とをつなぐチップ側面５２とを有するＬＥＤチップ１を収納する際に、裏面を底部４１に対向してＬＥＤ搭載凹部２ａに収納すると共に、底部４１と裏面との間と、底部側面４２とチップ側面５２との間とに、接着樹脂を充填する充填工程を備えたＬＥＤ照明装置の製造方法、として把握することもできる。   Note that the LED lighting device 100 described in the first embodiment can also be understood as an embodiment of a method for manufacturing an LED lighting device. That is, the metal which forms the storage space 43 which accommodates the LED chip which is an other component by the bottom part 41 and the bottom part side surface 42 by having the bottom part 41 and the bottom part side surface 42 which is a side surface which stands up from the peripheral edge 41-1 of the bottom part 41. In the LED mounting recess 2a of the metal plate 2 having the LED mounting recess 2a (housing portion) made of metal, an upper surface that is a surface on the side from which emitted light is emitted, a back surface that is opposite to the upper surface, and an upper surface and a back surface When the LED chip 1 having the chip side surface 52 connected with the LED chip 1 is stored, the back surface is stored in the LED mounting recess 2a so as to face the bottom portion 41, and between the bottom portion 41 and the back surface, and between the bottom side surface 42 and the chip side surface. It can also be grasped as a manufacturing method of an LED lighting device provided with a filling step of filling an adhesive resin between 52 and 52.

実施の形態２．
図６は、実施の形態２に係るＬＥＤ照明装置２００の構成例を示す断面図である。ＬＥＤ照明装置２００は、実施の形態１のＬＥＤ照明装置１００と基本的には同一の構成であるが、ＬＥＤチップ１及びボンディングワイヤ５−Ｎが、図６に示す構成になっている点及び接着樹脂３として導電性ペーストを用いる点で、実施の形態１とは相違する。 Embodiment 2. FIG.
FIG. 6 is a cross-sectional view illustrating a configuration example of the LED lighting apparatus 200 according to Embodiment 2. The LED lighting device 200 has basically the same configuration as the LED lighting device 100 of the first embodiment, but the LED chip 1 and the bonding wire 5-N have the configuration shown in FIG. The difference from Embodiment 1 is that a conductive paste is used as the resin 3.

実施の形態１のＬＥＤチップ構造では、導電性ペーストを接着樹脂として使用しても良いし、絶縁性樹脂を接着樹脂として使用してもよい。実施の形態２のＬＥＤチップ構造の場合は、ＬＥＤチップ下面と金属板との間で電気的に導通させる必要があるので、接着樹脂は導電性ペースト（樹脂）に限られ、絶縁性樹脂は使用しない。   In the LED chip structure of the first embodiment, a conductive paste may be used as the adhesive resin, or an insulating resin may be used as the adhesive resin. In the case of the LED chip structure of the second embodiment, since it is necessary to electrically connect the lower surface of the LED chip and the metal plate, the adhesive resin is limited to the conductive paste (resin), and the insulating resin is used. do not do.

具体的には、ＬＥＤチップ１は、両面（上下面）にＰ電極（上面側）、Ｎ電極（下面側）を有するチップとして形成されている。ＬＥＤチップ１は、導電性ペースト７（たとえば、銀ペースト）を介してＬＥＤ搭載凹部２ａと接着固定されている。金属板２と配線パターン４ａ（図の左側）は、ボンディングワイヤ５−Ｎにより電気的に接続されている。また、ＬＥＤチップ１の上面と配線パターン４ａ（図の右側）は、ボンディングワイヤ５−Ｐにより電気的に接続されている。   Specifically, the LED chip 1 is formed as a chip having P electrodes (upper surface side) and N electrodes (lower surface side) on both surfaces (upper and lower surfaces). The LED chip 1 is bonded and fixed to the LED mounting recess 2a via a conductive paste 7 (for example, silver paste). The metal plate 2 and the wiring pattern 4a (left side in the figure) are electrically connected by bonding wires 5-N. Further, the upper surface of the LED chip 1 and the wiring pattern 4a (right side in the figure) are electrically connected by a bonding wire 5-P.

図６の構成によれば、ＬＥＤチップ１として両面（上下面）に電極を有するＬＥＤチップを用いることができる。   According to the configuration of FIG. 6, an LED chip having electrodes on both surfaces (upper and lower surfaces) can be used as the LED chip 1.

１ ＬＥＤチップ、２，１２ 金属板、２ａ ＬＥＤ搭載凹部、３ 接着樹脂、４ 回路基板、４ａ，１４ 配線パターン、４ｂ 貫通孔、５ ボンディングワイヤ、６ 封止樹脂、７ 導電性ペースト、１０ ＬＥＤ照明装置、１１ 金属基板、１３ 絶縁層、１５ 枠部材、１６ 接着層、１７ 封止樹脂、３０ 収納部品、４１ 底部、４２ 底部側面、４３ 収納空間、５２ チップ側面、１００，２００ ＬＥＤ照明装置。   DESCRIPTION OF SYMBOLS 1 LED chip, 2,12 Metal plate, 2a LED mounting recessed part, 3 Adhesive resin, 4 Circuit board, 4a, 14 Wiring pattern, 4b Through-hole, 5 Bonding wire, 6 Sealing resin, 7 Conductive paste, 10 LED illumination Device, 11 Metal substrate, 13 Insulating layer, 15 Frame member, 16 Adhesive layer, 17 Sealing resin, 30 Storage component, 41 Bottom, 42 Bottom side, 43 Storage space, 52 Chip side, 100, 200 LED lighting device.

Claims (6)

底部と前記底部の周縁から起立する側面である底部側面とを有することで前記底部と前記底部側面とにより相手部品を収納する収納空間を形成する金属製の収納部を持つ金属板と、
前記相手部品として前記収納部に収納されるＬＥＤチップであって、発光光が出射される側の面である上面と、前記上面に対して反対側となる裏面と、前記上面と前記裏面とをつなぐ側面であるチップ側面とを有し、前記裏面が前記底部に対向して前記収納部に収納されると共に、
前記収納部に収納された状態において、前記底部と前記裏面との間と、前記底部側面と前記チップ側面との間とに、接着剤が充填されるＬＥＤチップと
を備えたことを特徴とするＬＥＤ照明装置。 A metal plate having a metal storage portion that forms a storage space for storing a mating component by the bottom portion and the bottom side surface by having a bottom portion and a bottom side surface that is a side surface rising from a peripheral edge of the bottom portion;
An LED chip housed in the housing portion as the counterpart component, the upper surface being a surface on the side from which emitted light is emitted, the back surface opposite to the top surface, the top surface and the back surface A chip side surface that is a side surface to be connected, and the back surface is stored in the storage unit facing the bottom,
An LED chip filled with an adhesive is provided between the bottom and the back surface, and between the bottom side surface and the chip side surface in a state of being stored in the storage unit. LED lighting device. 前記収納部は、
前記金属板の表面に、直接、凹形状に形成されると共に、前記凹形状の内部空間が前記収納空間であることを特徴とする請求項１記載のＬＥＤ照明装置。 The storage section is
The LED lighting device according to claim 1, wherein the LED lighting device is formed in a concave shape directly on a surface of the metal plate, and the concave internal space is the storage space. 前記底部側面と前記チップ側面との間に充填された前記接着材は、
前記ＬＥＤチップの裏面から上面に向かう方向を上方とした場合に、最も上方となる箇所が前記上面よりも下方に位置することを特徴とする請求項１または２のいずれかに記載のＬＥＤ照明装置。 The adhesive filled between the bottom side surface and the chip side surface is:
3. The LED lighting device according to claim 1, wherein when the direction from the back surface to the top surface of the LED chip is set to the top, the uppermost portion is positioned below the top surface. 4. . 前記ＬＥＤチップは、
前記チップ側面の一部が前記底部側面の一部と密着する密着領域を形成し、
前記底部側面と前記チップ側面との間に充填される前記接着材は、
前記密着領域以外の、記前記底部側面と前記チップ側面との間の隙間に充填されることを特徴とする請求項１〜３のいずれかに記載のＬＥＤ照明装置。 The LED chip is
Forming a close contact region where a part of the chip side surface is in close contact with a part of the bottom side surface;
The adhesive filled between the bottom side surface and the chip side surface is:
The LED illumination device according to any one of claims 1 to 3, wherein the LED illumination device is filled in a gap between the bottom side surface and the chip side surface other than the contact region. 前記接着材は、
導電性ペーストであることを特徴とする請求項１〜４のいずれかに記載のＬＥＤ照明装置。 The adhesive is
The LED lighting device according to claim 1, wherein the LED lighting device is a conductive paste. 底部と前記底部の周縁から起立する側面である底部側面とを有することで前記底部と前記底部側面とにより相手部品を収納する収納空間を形成する金属製の収納部を持つ金属板の前記収納部に、
前記相手部品として、発光光が出射される側の面である上面と、前記上面に対して反対側となる裏面と、前記上面と前記裏面とをつなぐ側面であるチップ側面とを有するＬＥＤチップを収納する際に、前記裏面を前記底部に対向して前記収納部に収納すると共に、前記底部と前記裏面との間と、前記底部側面と前記チップ側面との間とに、接着剤を充填する充填工程を
備えたことを特徴とするＬＥＤ照明装置の製造方法。 The storage portion of the metal plate having a metal storage portion that forms a storage space for storing a mating component by the bottom portion and the bottom side surface by having a bottom portion and a bottom side surface that is a side surface rising from a peripheral edge of the bottom portion In addition,
As the counterpart component, an LED chip having a top surface that is a surface on the side from which emitted light is emitted, a back surface that is opposite to the top surface, and a chip side surface that is a side surface that connects the top surface and the back surface. When storing, the back surface is stored in the storage portion so as to face the bottom portion, and an adhesive is filled between the bottom portion and the back surface, and between the bottom side surface and the chip side surface. A method for manufacturing an LED lighting device, comprising a filling step.
JP2011135865A 2011-06-20 2011-06-20 Led lighting device and method for manufacturing led lighting device Withdrawn JP2013004824A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103644549A (en) * 2013-11-29 2014-03-19 中国科学院半导体研究所 LED (Light-emitting diode) heat dissipation structure
JP2018181783A (en) * 2017-04-21 2018-11-15 株式会社小糸製作所 Vehicular lighting fixture

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103644549A (en) * 2013-11-29 2014-03-19 中国科学院半导体研究所 LED (Light-emitting diode) heat dissipation structure
JP2018181783A (en) * 2017-04-21 2018-11-15 株式会社小糸製作所 Vehicular lighting fixture
JP7092465B2 (en) 2017-04-21 2022-06-28 株式会社小糸製作所 Vehicle lighting

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