JP6925694B2 - Light emitting device - Google Patents

Description

The present invention relates to a light emitting device having a light emitting element.

A light emitting device having a light emitting diode (LED) element as a light emitting element is used in a mobile terminal such as a smartphone, for example. A light emitting device having an LED element as a light emitting element is used as, for example, a flash light emitting device for photographing. Further, it is used in various display devices as a light emitting device for a backlight of a color display device. Further, a light emitting device having an LED element is also mounted on an indoor lighting fixture or an outdoor lighting fixture. Further, in recent years, a light emitting device having an LED element has also been used for lighting equipment such as an in-vehicle lamp and a projector, which are required to have high brightness. In a light emitting device including an LED element, which is required to emit high-intensity light, how to dissipate the heat generated when the LED element emits light can be one of the problems. Further, when the lens is arranged above the light emitting device, it may be one of the problems to suppress the increase in size of the lens.

The light emitting device of Patent Document 1 has a reflective layer arranged on the upper surface of the light emitting element. The reflection layer arranged on the upper surface of the light emitting element reflects the emitted light on the upper surface of the light emitting element to obtain the light emitted from the side surface of the light emitting element. The light emitting area of this light emitting device is limited to a light emitting area having a smaller area in the lateral direction by reflecting light toward the top surface. As a result, when the lens is arranged above the light emitting device, it is possible to suppress the increase in size of the lens.

The light emitting device of Patent Document 2 includes a substrate, a plurality of LED elements mounted on the upper surface thereof, and a transparent cover covering the upper surface of the substrate. A reflective layer is provided on the upper surface of the LED element, and a phosphor layer is provided on the side surface of the LED element. The direction of the light emitted from the plurality of LED elements is limited by the reflective layer. Further, the light emitted from the LED element is repeatedly reflected between the reflective layer and the transparent cover, so that light emission without uneven illumination is realized.

The light emitting device of Patent Document 3 includes a light emitting element arranged on the upper surface of the substrate, a resin encapsulant for sealing the light emitting element, and a reflection cup arranged so as to surround the light emitting element and the resin encapsulating body. Be prepared. The reflective cup enhances the directivity of the light emitted from the light emitting element.

The light emitting device of Patent Document 4 includes a substrate having a mounting portion, a light emitting element mounted on the mounting portion, and a reflective frame body arranged so as to surround the mounting portion. The mounting portion is formed so as to project to the central portion of the upper main surface of the substrate. The light emitted from the light emitting element is reflected on the inner peripheral surface of the reflective frame to increase the radiant intensity.

Japanese Unexamined Patent Publication No. 2004-152840 (Fig. 1) JP-A-2015-95488 (Fig. 4) Japanese Unexamined Patent Publication No. 2005-109172 (Fig. 1) Japanese Unexamined Patent Publication No. 2005-310912 (Fig. 1)

In the light emitting device of Patent Document 1-2, a reflective layer is provided on the upper surface of the light emitting element. Since this reflective layer does not have a heat dissipation path to the outside, the heat generated by the light emitting element cannot be efficiently dissipated to the outside. Since the light emitting device of Patent Document 3-4 has a structure in which the upper surface of the light emitting element is coated with resin, the heat generated by the light emitting element is not efficiently dissipated to the outside from the upper surface of the light emitting element.

The light emitting device according to the present invention secures heat dissipation paths for radiating heat generated when the light emitting element emits light on the upper surface side and the lower surface side of the light emitting element, and improves the heat dissipation efficiency to improve the light emitting efficiency of the light emitting element. One of the purposes is to prevent the decrease of. Further, in the present invention, the emitted light is emitted from the peripheral side surface of the light emitting element to obtain parallel light upward by the reflector. One of the objects of the light emitting device according to the present invention is to facilitate the design of an optical element including a lens.

The light emitting device according to an embodiment of the present invention emits light having a first surface, a second surface opposite to the first surface, and a peripheral side surface between the peripheral edge of the first surface and the peripheral edge of the second surface. the element, the second surface of the light emitting element includes a first element electrode and the second element electrode, a light emitting element, a substrate including a first electrode and a second electrode, in contact with the first surface of the light emitter array It has a light reflecting layer is, the first heat radiating body arranged in contact with the light-reflecting layer, is arranged below the substrate, and the second heat radiating member which is connected to the light emitting element and the thermal and, The first element electrode and the second element electrode of the light emitting element are electrically mounted on the first electrode and the second electrode of the substrate , the first radiator has a rectangular shape, and the first surface of the light emitting element. Has a bottom surface of the same size as .

Further, it has been proposed that the light emitting device according to another embodiment of the present invention has a base substrate under the second radiator, and the second radiator is thermally connected to the connection electrode of the base substrate. NS.

Further, in the light emitting device according to another embodiment of the present invention, it is proposed that the first radiator body has a hemispherical dome shape at the upper part.

Further, in the light emitting device according to another embodiment of the present invention, it is proposed to have heat radiating fins on at least the upper surface of the first heat radiating body.

Further, in the light emitting device according to the embodiment of the present invention, it is proposed that the second heat radiating body has a rectangular parallelepiped shape.

Further, in the light emitting device according to the embodiment of the present invention, it is proposed that the second radiator has an insulating layer and electrically insulates the first electrode and the second electrode of the substrate.

Further, it has been proposed that the light emitting device according to another embodiment of the present invention has a base substrate under the second radiator, and the second radiator is thermally connected to the connection electrode of the base substrate. NS.

Further, it is proposed that the light emitting device according to the embodiment of the present invention includes a reflector having a cup shape surrounding the light emitting element. It is also proposed that the reflector is integrally formed with the second radiator.

Further, in the light emitting device according to the embodiment of the present invention, it is proposed that the light emitting element is located at a height within a range of one-fourth to one-half the height of the reflector.

According to the light emitting device according to the present invention, the heat generated by the light emission of the light emitting element is generated by the first heat radiating body arranged on the first surface side of the light emitting element and the second heat radiating body arranged on the second surface side of the light emitting element. Heat is dissipated through and, and a heat dissipation path is secured on the upper and lower surfaces of the light emitting element. Since the heat generated from the light emitting element is dissipated through the upper and lower heat dissipation paths, the heat dissipation efficiency is good, and it is possible to prevent a decrease in the light emission efficiency of the light emitting element. Further, since the light emitting area is emitted from the peripheral side surface of the light emitting element, which has a smaller light emitting area than the light emitting area of the first surface of the light emitting element, in the lateral direction, the emitted light can be easily converted into a point light source, and the design of the lens system is easy. It becomes.

Further, when the base substrate is provided below the second heat radiating body, the heat radiating path is secured from the second heat radiating body to the base board, so that the heat radiating efficiency is further improved.

Further, when the reflector having a cup shape surrounding the light emitting element and the second heat radiating body are integrally formed, a heat radiating path from the second heat radiating body to the reflector having a large volume is secured, so that the heat radiating efficiency is improved. It gets even better.

It is a perspective view of the light emitting device which concerns on 1st Embodiment of this invention. FIG. 3 is a cross-sectional view taken along the line IB-IB of the perspective view shown in FIG. 1A. It is an enlarged view of the part circled in FIG. 1B. It is a perspective view of the light emitting device which concerns on 2nd Embodiment of this invention. FIG. 2 is a cross-sectional view taken along the line IIB-IIB of the perspective view shown in FIG. 2A. FIG. 5 is a cross-sectional view of a first radiator body having a hemispherical dome shape at the top in the light emitting device according to the third embodiment of the present invention. FIG. 5 is a perspective view of a first heat radiating body provided with heat radiating fins at least on the upper surface of the light emitting device according to the fourth embodiment of the present invention. It is a partial cross-sectional view of the light emitting device which provided the phosphor layer on the peripheral side surface of the light emitting element in the light emitting device which concerns on 5th Embodiment of this invention.

Hereinafter, embodiments of the light emitting device according to the present invention will be described in detail with reference to the drawings. The drawings schematically represent the light emitting device of the present invention. The dimensions and dimensional ratios of these actual objects do not always match the dimensions and dimensional ratios on the drawings. Further, the duplicate description may be omitted as appropriate, and the same member may be given the same reference numeral. Furthermore, it should be noted that the technical scope of the present invention is not limited to the embodiments described below, but extends to the inventions described in the claims and their equivalents.

(First Embodiment)
1A to 1C show a light emitting device 100 according to a first embodiment of the present invention. The light emitting device 100 has a first surface 1a, a second surface 1b on the opposite side of the first surface 1a, and a peripheral side surface 1c between the peripheral edge of the first surface 1a and the peripheral edge of the second surface 1b. Includes element 1. A first element electrode 1d and a second element electrode 1e are provided on the second surface 1b of the light emitting element 1. Further, the light emitting device 100 includes a substrate 2 having a first electrode 2c and a second electrode 2d on the first surface 2a and a third electrode 2e and a fourth electrode 2f on the second surface 2b. The first element electrode 1d and the second element electrode 1e of the light emitting element 1 are electrically mounted on the first electrode 2c and the second electrode 2d of the substrate 2. Further, the first electrode 2c and the second electrode 2d of the substrate 2 are electrically connected to the third electrode 2e and the fourth electrode 2f on the second surface 2b via the first through-hole electrode 2g and the second through-hole electrode 2h. It is connected to the. The first element electrode 1d on the second surface 1b of the light emitting element 1 can be electrically connected to the first electrode 2c of the substrate 2 via the bump 1d'or the conductive paste. The second element electrode 1e on the second surface 1b of the light emitting element 1 can be electrically connected to the second electrode 2d of the substrate 2 via the bump 1e'or the conductive paste.

In the light emitting device 100 of the present embodiment, as shown in FIG. 1A, the outline of the substrate 2 including the first electrode 2c and the second electrode 2d, the outline of the light emitting element 1, and the outline of the light reflecting layer 3 are viewed from above. Is the same.

The light emitting device 100 includes a light reflecting layer 3 arranged on the first surface 1a of the light emitting element 1. The light reflecting layer 3 may have a thin film of aluminum or silver having high reflectance formed on the surface of a metal plate, a metal film, a resin film, or the like. The thin film can be formed by vapor deposition or the like. The reflecting surface 3a of the light reflecting layer 3 is formed of a thin film. The area of the reflecting surface 3a has the same size as that of the first surface 1a of the light emitting element 1. Therefore, in the light reflecting layer 3, the entire reflecting surface 3a is in contact with the entire first surface 1a of the light emitting element 1.

The first heat radiating body 4 is arranged on the light reflecting layer 3. The first heat radiating body 4 may have a rectangular parallelepiped shape. The area of the bottom surface 4a of the first heat radiating body 4 has the same area as that of the first surface 1a of the light emitting element 1. Therefore, the light reflecting layer 3 located between the bottom surface 4a of the first heat radiating body 4 and the first surface 1a of the light emitting element 1 covers the first surface 1a of the light emitting element 1. The first heat radiating body 4 may be made of a block-shaped metal material such as aluminum, copper, or silver having high thermal conductivity. The heat generated from the light emitting element 1 is conducted to the entire block-shaped first heat radiating body 4.

A second heat radiating body 5 that is thermally connected to the light emitting element 1 is arranged below the substrate 2. In this embodiment, the second heat radiating body 5 may be integrally formed with the reflector 6 having a cup shape surrounding the light emitting element 1. That is, the reflector 6 has a cup-shaped recess 7 at the center of the reflector 6. Further, the outer shape of the reflector 6 may have a block-shaped cube or a rectangular parallelepiped. A second heat radiating body 5 connected to the reflector 6 projects upward at the center of the recess 7 located at the center of the reflector 6. The second heat radiating body 5 may have a rectangular parallelepiped shape like the first heat radiating body 4. The area of the upper surface 5a of the second heat radiating body 5 has the same size as the second surface 1b of the light emitting element 1. The substrate 2 on which the second surface 1b of the light emitting element 1 is electrically mounted is electrically mounted on the upper surface 5a of the second heat radiating body 5.

The reflector 6 has a first reflector portion 6a and a second reflector portion 6b that are plane-symmetrical with the insulating layer 8 interposed therebetween. The first reflector portion 6a is the first half of a cube or rectangular parallelepiped having a cup shape at the center. The second reflector portion 6b is a second half of a cube or rectangular parallelepiped having a cup shape at the center. The insulating layer 8 is provided at a joint portion between the first reflector portion 6a and the second reflector portion 6b. That is, the insulating layer 8 is provided in the central portion of the reflector 6 so as to divide the reflector 6 into two, and electrically insulates the first reflector portion 6a and the second reflector portion 6b. Correspondingly, the second heat radiating body 5 on which the light emitting element 1 is mounted is electrically separated into the first heat radiating part 5b and the second heat radiating part 5c by the insulating layer 8, and the upper surface of the first heat radiating part 5b. Is provided with a first upper surface electrode 5d, and a second upper surface electrode 5e is provided on the upper surface of the second heat radiating portion 5c. A third electrode 2e provided on the second surface 2b of the substrate 2 is electrically mounted on the first upper surface electrode 5d, and a second electrode 2e provided on the second surface 2b of the substrate 2 is provided on the second upper surface electrode 5e. The four electrodes 2f are electrically mounted. The inner peripheral side surface 7a of the recess 7 of the reflector 6 is a reflective surface coated or plated with a reflective paint, a reflective material, or the like. Further, the second heat radiating body 5 and the reflector 6 may be integrally formed of a metal material such as aluminum, copper, or silver having high thermal conductivity.

In this embodiment, the recess 7 of the reflector 6 has a circular opening. Further, the inner peripheral side surface 7a of the recess 7 has a cup shape having a curved surface close to a parabola. The height of the first heat radiating body 4 is not particularly specified, and may be substantially the same height as the upper surface 6c of the reflector 6 as in this embodiment. Since the light emitted from the light emitting element 1 is emitted from the reflector 6 as parallel light, the height of the first heat radiating body 4 does not get in the way. Therefore, by increasing the height of the first heat radiating body 4 as much as possible, further heat radiating efficiency can be obtained. The height position on which the light emitting element 1 is mounted is not particularly specified, but the height of the reflector 6, that is, the height within the range of one-fourth to one-half of the depth of the recess 7. By setting to, the reflection efficiency of the reflector 6 becomes good.

Therefore, in the light emitting device 100 according to this embodiment, the first surface 1a of the light emitting element 1 comes into contact with the bottom surface 4a of the first heat radiating body 4 via the light reflecting layer 3, and the second surface of the light emitting element 1 1b is in contact with the upper surface 5a of the second radiator 5 via the substrate 2. Therefore, heat dissipation paths are secured from both the first surface 1a and the second surface 1b of the light emitting element 1, and the heat generated by the light emission of the light emitting element 1 is efficiently dissipated from both heat dissipation paths. Become. As a result, it is possible to effectively prevent a decrease in the luminous efficiency of the light emitting element 1.

Further, in the light emitting device 100 according to this embodiment, since the second heat radiating body 5 is integrally formed with the reflector 6 having a large volume, the heat generated by the light emitting element 1 is large in volume via the second heat radiating body 5. It is widely transmitted to the reflector 6 and more efficient heat dissipation can be obtained.

Further, in the light emitting device 100 according to this embodiment, the light emitted from the first surface 1a of the light emitting element 1 is reflected by the light reflecting layer 3 and emitted laterally from the peripheral side surface 1c of the light emitting element 1. The light emitted from the peripheral side surface 1c of the light emitting element 1 is reflected upward by the inner peripheral side surface 7a of the recess 7 of the reflector 6 to be parallel light. The parallel light is emitted from the opening of the upper surface 6c of the upper part of the reflector 6. As described above, in the light emitting device 100 according to this embodiment, since the light emitting area is emitted from the peripheral side surface 1c of the light emitting element 1 which is smaller than the light emitting area of the first surface 1a of the light emitting element 1, the emitted light is emitted. It becomes easy to make a point light source. The light that has been turned into a point light source leads to miniaturization of the reflector 6 itself, such as the fact that parallel light can be easily obtained by the reflector 6, and the design of the lens system becomes easy.

(Second Embodiment)
2A and 2B show a light emitting device 200 according to a second embodiment of the present invention. The light emitting device 200 has the same structure as the light emitting device 100 in the first embodiment except that the base substrate 10 is arranged below the second heat radiating body 5 and the reflector 6. Therefore, detailed description will be omitted by using the same reference numerals in the drawings.

The base substrate 10 can have a quadrangular flat plate shape having the same size as the planar shape of the reflector 6. The base substrate 10 has an upper surface 10a, a lower surface 10b, and a peripheral side surface 10c between the peripheral edge of the upper surface 10a and the peripheral edge of the lower surface 10b. A pair of connection electrodes are formed on the upper surface 10a, the lower surface 10b, and the peripheral side surface 10c of the base substrate 10. The pair of connection electrodes is composed of a first connection electrode 11a and a second connection electrode 11b, and is intended to be electrically connected to the outside such as a motherboard (not shown). The first connection electrode 11a and the second connection electrode 11b have a gap between the electrodes on the upper surface 10a and the lower surface 10b of the base substrate 10. An upper gap 12a is provided on the upper surface 10a of the base substrate 10, and a lower gap 12b is provided on the lower surface 10b of the base substrate 10. These gaps 12a and 12b maintain electrical insulation between the connection electrodes on the upper surface 10a and the lower surface 10b of the base substrate 10. The width of the upper gap 12a provided on the upper surface 10a of the base substrate 10 is substantially the same as the width of the insulating layer 8 provided on the second radiator 5 and the reflector 6, and the upper gap 12a and the insulating layer 8 have the same axis. Located on top.

Therefore, when the base substrate 10 is arranged below the reflector 6, the first reflector portion 6a of the reflector 6 is placed on the first connection electrode 11a of the base substrate 10, and the second connection electrode 11b of the base substrate 10 is placed. The second reflector portion 6b of the reflector 6 is placed on the reflector portion 6. At the same time, the first heat radiating portion 5b of the second heat radiating body 5 integrally formed with the first reflector portion 6a of the reflector 6 is placed on the first connecting electrode 11a of the base substrate 10, and the second reflector of the reflector 6 is placed. The second heat radiating portion 5c of the second heat radiating body 5 integrally formed with the portion 6b is placed on the second connecting electrode 11b of the base substrate 10.

In this way, the first connection electrode 11a of the base substrate 10, the first reflector portion 6a of the reflector 6, and the first heat radiating portion 5b of the second heat radiating body 5 are electrically connected. Further, the second connection electrode 11b of the base substrate 10, the second reflector portion 6b of the reflector 6, and the second heat radiating portion 5c of the second heat radiating body 5 are electrically connected. Therefore, the power supplied from the outside such as the motherboard supplies the current to the light emitting element 1 via the electrodes provided on the base substrate 10, the second radiator 5, and the substrate 2.

The light emitting device 200 according to this embodiment has the same effect as the light emitting device 100 according to the first embodiment. In addition, since the base substrate 10 is arranged below the second radiator body 5, the second radiator body 5 is thermally connected to the base substrate 10. Therefore, a heat dissipation path is secured from the second heat radiating body 5 to the first connection electrode 11a and the second connection electrode 11b of the base substrate 10, and heat is efficiently radiated from the first connection electrode 11a and the second connection electrode 11b to the reflector 6. Will be done.

(Third Embodiment)
FIG. 3 shows a part of the light emitting device 300 according to the third embodiment of the present invention. In this embodiment, the first heat radiating body 14 has the same structure as the light emitting device 100 in the first embodiment except that it has a hemispherical dome shape 14a at the upper part. Therefore, detailed description will be omitted by using the same reference numerals in the drawings. Since the upper corner of the first heat radiating body 14 according to this embodiment is cut off, the linearity of the parallel light emitted from the reflector 6 is not hindered by the dome shape 14a of the first heat radiating body 14a.

(Fourth Embodiment)
FIG. 4 shows a part of the light emitting device 400 according to the fourth embodiment of the present invention. In this embodiment, the heat radiating fins 24a may be arranged on at least the upper surface of the first heat radiating body 24. Further, a plurality of heat radiating fins 24b may be arranged not only on the upper surface of the first heat radiating body 24 but also on the peripheral side surface. The light emitting device 400 according to the fourth embodiment has the same structure as the light emitting device 100 in the first embodiment, except that it has heat radiation fins 24a and 24b. Therefore, detailed description will be omitted by using the same reference numerals in the drawings. In the first heat radiating body 24 according to this embodiment, the surface area of the first heat radiating body 24 can be significantly increased by the fins 24a provided on the upper surface of the main body and the fins 24b provided on the peripheral side surface, so that the heat radiating efficiency is increased accordingly. Will rise dramatically.

(Fifth Embodiment)
FIG. 5 shows a light emitting device 500 according to a fifth embodiment of the present invention. In this embodiment, the light emitting device 100 according to the first embodiment has the same structure as the light emitting device 100 according to the first embodiment except that the phosphor layer 9 is provided around the peripheral side surface 1c of the light emitting element 1. Have. Therefore, detailed description will be omitted by using the same reference numerals in the drawings. The phosphor layer 9 may be a phosphor-containing resin in which phosphor particles are uniformly dispersed in the resin. The resin of the phosphor layer 9 may be a silicone resin that allows light to pass through. Further, as the phosphor, for example, YAG (yttrium aluminum garnet) may be used to obtain white light. Further, as in this embodiment, the phosphor layer 9 can be provided around the peripheral side surface of the light reflecting layer 3.

In the light emitting device 500 according to this embodiment, the light emitted from the peripheral side surface 1c of the light emitting element 1 passes through the phosphor layer 9. The light wavelength-converted by the phosphor layer 9 is reflected upward by the inner peripheral side surface 7a of the recess 7 of the reflector 6, and is emitted as white light from the opening of the upper surface 6c of the upper part of the reflector 6. In this embodiment, not only the heat generated from the light emitting element 1 but also the heat generated when the phosphor layer 9 emits light is radiated through the first heat radiating body 4 and the second heat radiating body 5. As a result, not only the decrease in the luminous efficiency of the light emitting element 1 can be prevented, but also the deterioration of the phosphor contained in the phosphor layer 9 can be effectively prevented.

As for the fluorescent material of the fluorescent material layer 9, various types of fluorescent materials can be used. The YAG phosphor was given as an example in the above embodiment. For example, as a phosphor that emits green light, an active lutetium aluminum garnet phosphor with cerium is known. Further, as a phosphor that emits red light, for example, a phosphor having a basic composition of _{CaAlSiN 3: Eu is known.} These are examples, and various types of phosphors can be used as the phosphors contained in the phosphor layer 9 in the embodiment of the present invention.

1 Light emitting element 1a First surface of light emitting element 1b Second surface of light emitting element 1c Peripheral side surface of light emitting element 1d First element electrode of light emitting element 1d'bump (conductive paste)
1e 2nd element electrode of light emitting element 1e'bump (conductive paste)
2 Substrate 2a 1st surface of the substrate 2b 2nd surface of the substrate 2c 1st electrode of the substrate 2d 2nd electrode of the substrate 2e 3rd electrode of the substrate 2f 4th electrode of the substrate 2g 1st through hole electrode of the substrate 2h 1st of the substrate 2 Through-hole electrode 3 Light reflecting layer 3a Reflecting surface of light reflecting layer 4, 14, 24 First radiator 4a Bottom of first radiator 5 Second radiator 5a Upper surface of second radiator 5b Second radiator 1 Heat dissipation part 5c Second heat dissipation part of the second radiator 5d First upper surface electrode of the second radiator 5e Second upper surface electrode of the second radiator 6 Reflector 6a First reflector part of the reflector 6b Second reflector part of the reflector 6c Upper surface of reflector 7 Recessed part of reflector 7a Inner peripheral side surface of concave part 8 Insulation layer 9 Luminescent layer 10 Base substrate 10a Upper surface of base substrate 10b Lower surface of base substrate 10c Peripheral side surface of base substrate 11a First connection electrode of base substrate 11b Base substrate 2nd connection electrode 12a Upper gap between the first connection electrode and the second connection electrode 12b Lower gap between the first connection electrode and the second connection electrode 14a Dome shape of the first radiator 24a Heat dissipation on the upper surface of the first radiator Fins 24b Heat dissipation fins on the peripheral side surface of the first radiator 100, 200, 300, 400, 500 Light emitting device

Claims (10)

A light emitting element having a first surface, a second surface opposite to the first surface, and a peripheral side surface between the peripheral edge of the first surface and the peripheral edge of the second surface, and the second surface of the light emitting element is a second surface. A light emitting element including a one-element electrode and a second element electrode,
A substrate containing a first electrode and a second electrode,
A light reflecting layer disposed on and in contact with the first surface of the light emitting element,
A first heat radiating body arranged in contact on the light reflecting layer,
It has a second radiator, which is located below the substrate and is thermally coupled to the light emitting element.
The first element electrode and the second element electrode of the light emitting element are electrically mounted on the first electrode and the second electrode of the substrate .
A light emitting device having a rectangular parallelepiped shape and having a bottom surface having the same size as the first surface of the light emitting element. The light emitting device according to claim 1, wherein the first heat radiating body has a hemispherical dome shape at the upper part. The light emitting device according to claim 1, wherein the first heat radiating body has heat radiating fins at least on the upper surface. The light emitting device according to claim 1, wherein the second radiator has a rectangular parallelepiped shape. The light emitting device according to claim 1, wherein the second radiator has an insulating layer and electrically insulates the first electrode and the second electrode of the substrate. The light emitting device according to claim 1, wherein the area of the upper surface of the second heat radiating body has the same area as the second surface of the light emitting element. The light emitting device according to claim 1, further comprising a base substrate below the second radiator, and the second radiator is thermally connected to a connection electrode of the base substrate. The light emitting device according to claim 1, further comprising a reflector having a cup shape surrounding the light emitting element. The light emitting device according to claim 7 or 8, wherein the second heat radiating body is integrally formed with a reflector. The light emitting device according to claim 8, wherein the light emitting element is located at a height within a range of one quarter to one half of the height of the reflector.

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