TWM445265U - Symmetry which projects source for generating a multi-chip package structure - Google Patents

Description

Multi-chip package structure for generating a symmetrical projection light source

The present invention relates to a multi-chip package structure, and more particularly to a multi-chip package structure for generating a symmetrical projection light source.

Regarding the comparison between a light-emitting diode (LED) and a conventional light source, the light-emitting diode has a small volume, power saving, good luminous efficiency, long life, fast operation response, and no pollution of toxic substances such as heat radiation and mercury, etc. advantage. Therefore, in recent years, the application of light-emitting diodes has been extremely extensive. In the past, the brightness of the light-emitting diodes could not replace the traditional illumination source. However, with the continuous improvement of the technical field, high-power light-emitting diodes with high illumination brightness have been developed, which is sufficient to replace the traditional illumination source. However, the conventional light-emitting structure using a plurality of light-emitting diodes still cannot effectively provide a symmetrical projection light source. Therefore, how to effectively provide a symmetrical projection light source through the improvement of structural design has become an important issue that the business person wants to solve.

The present embodiment is directed to providing a multi-chip package structure for generating a symmetric projection light source.

A multi-chip package structure for generating a symmetrical projection light source according to one embodiment of the present invention includes: a substrate unit, a light-emitting unit, a frame unit, and a package unit. The substrate unit includes a substrate body, at least two jumper conductive layers disposed on the upper surface of the substrate body and electrically connected to each other, and at least one disposed on an upper surface of the substrate body and at least two A connected conductive layer in which the jumper conductive layers are insulated from each other. The lighting unit includes at least two diagonally disposed a first light-emitting element electrically connected to the substrate body and at least two second light-emitting elements disposed on the substrate body and electrically connected to the substrate body, wherein the at least two The jumper conductive layer is electrically connected between the at least two first light emitting elements, and the at least one connected conductive layer is electrically connected between the at least two second light emitting elements. The frame unit includes at least two first insulating frames disposed diagonally on the substrate body and surrounding the at least two first light emitting elements and at least two diagonally disposed on the substrate body And a second insulating frame surrounding the at least two second light emitting elements, wherein the at least two first insulating frames and the at least two second insulating frames are integrally formed into a single frame member. The package unit includes at least two first light-transmissive packages respectively covering the at least two first light-emitting elements and surrounded by the at least two first insulating frames, and at least two covering the at least two second light-emitting portions respectively And a second light transmissive package surrounded by the at least two second insulating frames.

The multi-chip package structure provided by the present embodiment can be transparently disposed through the “at least two at least two diagonally disposed on the substrate body and electrically connected to the substrate body. The design of the light-emitting element and the at least two second light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body, so that the multi-chip package structure of the present invention can be used to generate symmetry Sexual projection source.

Furthermore, the multi-chip package structure provided by the embodiment of the present invention is electrically connectable to the at least two first light-emitting elements via the at least two jumper-type conductive layers, and the at least one connected conductive type a layer electrically connected between the at least two second light-emitting elements" to make The at least two first light-emitting elements disposed on the substrate body and electrically connected to the substrate body and the at least two diagonally disposed on the substrate body and electrically connected to the substrate The second illuminating elements of the substrate body can cooperate to create a symmetrical projection source.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and explanation, and are not intended to limit the creation.

Referring to FIG. 1A to FIG. 4 , an embodiment of the present disclosure may provide a multi-chip package structure Z for generating a symmetrical projection light source, comprising: a substrate unit 1, a light-emitting unit 2, and a frame unit. 3 and a package unit 4.

First, as shown in FIG. 1A and FIG. 1B, the substrate unit 1 includes a substrate body 10, at least two jumper conductive layers (11A, 11B) disposed on the upper surface of the substrate body 10 and electrically connected to each other, and At least one connecting conductive layer 11C disposed on the upper surface of the substrate body 10 and insulated from the at least two jumper conductive layers (11A, 11B). For example, the upper surface of the substrate body 10 has at least two first crystallized regions A1 designed in a diagonal position and a second crystallized region A2 designed in at least two diagonal positions. The substrate unit 1 includes at least two first top conductive pads 12A disposed diagonally on the upper surface of the substrate body 10 and at least two second disposed on the upper surface of the substrate body 10 diagonally Top conductive pad 13A.

For example, the substrate unit 1 includes at least one heat dissipation layer 14 disposed on the lower surface of the substrate body 10 and corresponding to the light emitting unit 2, and at least two diagonally disposed on the lower surface of the substrate body 10 and respectively correspond The first bottom conductive pad 12B electrically connected to the at least two first top conductive pads 12A, and at least two diagonally disposed on the lower surface of the substrate body 10 and respectively correspondingly electrically The second bottom conductive pad 13B is connected to the at least two second top conductive pads 13A.

For example, the substrate unit 1 includes at least two first conductive bodies 15 that can penetrate the substrate body 10 and at least two second conductive bodies 16 that can penetrate the substrate body 10, wherein each of the first conductive bodies 15 can be electrically Connected between each of the corresponding first top conductive pads 12A and each of the corresponding first bottom conductive pads 12B, and each of the second conductive bodies 16 is electrically connected to each corresponding first Two top conductive pads 13A are disposed between each of the corresponding second bottom conductive pads 13B. In other words, each of the corresponding first top conductive pads 12A and each of the corresponding first bottom conductive pads 12B can be electrically connected to each other through each corresponding first conductive body 15, and each A corresponding second top conductive pad 13A and each corresponding second bottom conductive pad 13B can be electrically connected to each other through each corresponding second conductive body 16. However, the substrate unit 1 used in the present creation is not limited to the above-exemplified examples.

In addition, as shown in FIG. 1A and FIG. 2, the light-emitting unit 2 includes at least two first light-emitting elements 21 disposed on the substrate body 10 and electrically connected to the substrate body 10, and at least two pairs. The second light-emitting element 22 is disposed on the substrate body 10 and electrically connected to the substrate body 10 . The at least two jumper conductive layers (11A, 11B) are electrically connected between the at least two first light emitting elements 21, and the connected conductive layer 11C is electrically connected to the at least two second light emitting elements. Between 22. In addition, the at least two first light emitting elements 21 are electrically connected between the at least two first top conductive pads 12A, and the at least two The two light emitting elements 22 are electrically connected between the at least two second top conductive pads 13A.

For example, the at least two first light-emitting elements 21 and the at least two second light-emitting elements 22 may be symmetrically arranged in a matrix shape (as shown in FIG. 2). In addition, the at least two first light emitting elements 21 are respectively disposed on at least two first crystallized regions A1 of the substrate body 10, and the at least two second light emitting elements 22 are respectively disposed on at least two of the substrate body 10. Two crystal regions A2. In addition, the upper surface of each of the first light-emitting elements 21 has at least two first electrodes 210 electrically connected to each of the corresponding first top conductive pads 12A and each of the corresponding jumper conductive layers 11A. The upper surface of each of the second illuminating elements 22 has at least two second electrodes 220 electrically connected to each of the corresponding second top conductive pads 13A and the connecting conductive layer 11C.

For example, when the at least two first light-emitting elements 21 are respectively transmitted through at least two first outer wires W11 to be electrically connected to the at least two first top conductive pads 12A, respectively, and the at least two first When the light emitting elements 21 are respectively transmitted through the at least two first inner wires W12 to be electrically connected to the at least two jumper conductive layers (11A, 11B), respectively, at least two first electrodes of each of the first light emitting elements 21 210, respectively, through each of the corresponding first outer wires W11 and each of the corresponding first inner wires W12, respectively electrically connected to each corresponding first top conductive pad 12A corresponding to each The jumper conductive layer (11A or 11B). Furthermore, when the at least two second light-emitting elements 22 are respectively transmitted through at least two second outer wires W21 to be electrically connected to the at least two second top conductive pads 13A, respectively, and the at least two second light-emitting elements 22 respectively through at least two second inner wires W22 When electrically connected to opposite end portions of the connection conductive layer 11C, at least two second electrodes 220 of each of the second light-emitting elements 22 can respectively correspond to each of the corresponding second outer wires W21. The second inner wire W22 is electrically connected to each of the corresponding second top conductive pads 13A and the connection conductive layer 11C, respectively. In addition, the at least two jumper conductive layers (11A, 11B) may be electrically connected to each other through at least one jumper wire W20. However, the light-emitting unit 2 and the frame unit 3 used in the present creation are not limited to the above-exemplified examples.

In addition, the frame unit 3 includes at least two first insulating frames 31 disposed on the substrate body 10 diagonally and surrounding the at least two first light emitting elements 21 and at least two diagonally disposed on the substrate a second insulating frame 32 on the body 10 and surrounding the at least two second light emitting elements 22, respectively, wherein the at least two first insulating frames 31 and the at least two second insulating frames 32 may be integrally formed into a single frame member. For example, the at least two first insulating frames 31 and the at least two second insulating frames 32 may be symmetrically arranged in a matrix shape. Moreover, each of the first insulating frames 31 has a first outer wire W11 for accommodating each, a corresponding first inner wire W12 and a corresponding first light transmitting package 41. The first accommodating space 310, each of the second insulating frames 32 has a second outer wire W21 for accommodating each, a corresponding second inner wire W22 and a corresponding second one. The second accommodating space 320 of the light-transmitting package 42 and the jumper wire W20 are received in the first accommodating space 310 of one of the first insulating frames 31.

In addition, as shown in FIG. 3 and FIG. 4, the package unit 4 includes at least two covers of the at least two first light-emitting elements 21, respectively, and is respectively a first light-transmissive package 41 surrounded by at least two first insulating frames 31 and at least two second portions respectively covering the at least two second light-emitting elements 22 and surrounded by the at least two second insulating frames 32 The light-transmitting package body 42 may be one of a phosphor colloid and a transparent colloid, and the at least two second light-transmissive packages 42 may be One of a fluorescent colloid and a transparent colloid. For example, when each of the first light-emitting elements 21 is a blue light-emitting diode, and the first light-transmissive package 41 is used to cover each of the corresponding first light-emitting elements 21 (blue light-emitting diodes) When the phosphor colloid is used, the blue light beam generated by each of the first light-emitting elements 21 can be converted into a white light beam through each of the corresponding first light-transmitting packages 41. When each of the second light-emitting elements 22 is a blue light-emitting diode, and the second light-transmissive package 42 is a transparent colloid for covering each of the corresponding second light-emitting elements 22 (blue light-emitting diodes) The blue light beam generated by each of the second light-emitting elements 22 can be directly projected from each of the corresponding second light-transmissive packages 42 without undergoing wavelength conversion.

Furthermore, another embodiment of the present invention provides a multi-chip package structure for generating a symmetrical projection light source, comprising: a substrate unit 1, a light-emitting unit 2, and a package unit 4. The substrate unit 1 includes a substrate body 10, at least two jumper conductive layers (11A, 11B) disposed on the upper surface of the substrate body 10 and electrically connected to each other, and at least one disposed on the upper surface of the substrate body 10. And a connecting conductive layer 11C insulated from the at least two jumper conductive layers (11A, 11B). The light emitting unit 2 includes at least two first light emitting elements 21 disposed on the substrate body 10 and electrically connected to the substrate body 10 and at least two diagonally disposed on the substrate body 10 and electrically Second hair connected to the substrate body 10 The light element 22, wherein the at least two jumper conductive layers (11A, 11B) are electrically connected between the at least two first light emitting elements 21, and the at least one connected conductive layer 11C is electrically connected to the at least one Between the two second light-emitting elements 22. The package unit 4 includes at least two first light-transmissive packages 41 respectively covering the at least two first light-emitting elements 21 and at least two second light-transmissive packages 42 respectively covering the at least two second light-emitting elements 22 . Therefore, the multi-chip package structure Z provided by the present embodiment can be transmitted through the above-mentioned at least two first light-emitting elements 21 disposed diagonally on the substrate body 10 and electrically connected to the substrate body 10 and the above At least two designs of the second light-emitting elements 22" disposed diagonally on the substrate body 10 and electrically connected to the substrate body 10 such that the multi-chip package structure Z of the present invention can be used to generate a symmetrical projection light source .

[Possible effects of the examples]

In summary, the multi-chip package structure provided by the present embodiment is permeable to "the at least two first light-emitting elements disposed diagonally on the substrate body and electrically connected to the substrate body" and " The above-described design of at least two second light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body is such that the inventive multi-chip package structure can be used to generate a symmetrical projection light source. Further, the multi-chip package structure provided by the present embodiment is permeable to the at least two jumper-type conductive layers electrically connected between the at least two first light-emitting elements, and the at least one The connecting conductive layer is electrically connected between the at least two second light emitting elements" such that the at least two of the first light emitting elements are diagonally disposed on the substrate body and electrically connected to the substrate body And the at least two second light-emitting elements disposed on the substrate body diagonally and electrically connected to the substrate body can be matched with each other Together, a symmetrical projection source is produced.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patents of the present invention. Therefore, the equivalent technical changes that are made by using the present specification and the contents of the drawings are included in the scope of the present invention.

Z‧‧‧Multi-chip package structure

1‧‧‧Substrate unit

10‧‧‧Substrate body

A1‧‧‧first crystal area

A2‧‧‧Second crystal area

11A, 11B‧‧‧cross-type conductive layer

11C‧‧‧Connected Conductive Layer

12A‧‧‧First top conductive pad

12B‧‧‧First bottom conductive pad

13A‧‧‧Second top conductive pad

13B‧‧‧Second bottom conductive pad

14‧‧‧heat layer

15‧‧‧First conductor

16‧‧‧Second conductor

2‧‧‧Lighting unit

21‧‧‧First light-emitting element

210‧‧‧First electrode

22‧‧‧Second light-emitting element

220‧‧‧second electrode

3‧‧‧Frame unit

31‧‧‧First insulation frame

310‧‧‧First accommodation space

32‧‧‧Second insulation frame

320‧‧‧Second accommodation space

4‧‧‧Package unit

41‧‧‧First light-transmissive package

42‧‧‧Second light-transmissive package

W11‧‧‧ first outer conductor

W12‧‧‧First inner wire

W20‧‧‧ jumper wire

W21‧‧‧Second outer conductor

W22‧‧‧second inner wire

1A is a perspective view of one of viewing angles of a substrate unit of a multi-chip package structure for creating a symmetric projection light source.

1B is a perspective view of another viewing angle of a substrate unit of a multi-chip package structure for creating a symmetric projection light source.

2 is a perspective view of a multi-chip package structure for creating a symmetrical projection light source, in which a light-emitting unit is disposed on a substrate unit.

3 is a perspective view of a multi-chip package structure for creating a symmetrical projection light source, in which a frame unit is disposed on a substrate unit to surround the light-emitting unit.

4 is a perspective view of a multi-chip package structure for creating a symmetrical projection light source, in which a package unit is disposed on a substrate unit to cover the light-emitting unit.

1‧‧‧Substrate unit

10‧‧‧Substrate body

12A‧‧‧First top conductive pad

13A‧‧‧Second top conductive pad

2‧‧‧Lighting unit

21‧‧‧First light-emitting element

210‧‧‧First electrode

22‧‧‧Second light-emitting element

220‧‧‧second electrode

3‧‧‧Frame unit

31‧‧‧First insulation frame

310‧‧‧First accommodation space

32‧‧‧Second insulation frame

320‧‧‧Second accommodation space

W11‧‧‧ first outer conductor

W12‧‧‧First inner wire

W20‧‧‧ jumper wire

W21‧‧‧Second outer conductor

W22‧‧‧second inner wire

Claims (10)

A multi-chip package structure for generating a symmetrical projection light source, comprising: a substrate unit comprising a substrate body, at least two jumper conductive layers disposed on an upper surface of the substrate body and electrically connected to each other And at least one connected conductive layer disposed on the upper surface of the substrate body and insulated from the at least two jumper conductive layers; a light emitting unit including at least two electrically connected to the substrate body a light-emitting element and at least two second light-emitting elements electrically connected to the substrate body, wherein the at least two jumper-type conductive layers are electrically connected between the at least two first light-emitting elements, and the at least one connection The conductive layer is electrically connected between the at least two second light emitting elements; and a frame unit comprising at least two first insulating frames respectively surrounding the at least two first light emitting elements and at least two respectively surrounding the above a second insulating frame of at least two second light emitting elements, wherein the at least two first insulating frames are integrally formed with the at least two second insulating frames Combined into a single frame member. The multi-chip package structure for producing a symmetrical projection light source according to claim 1, wherein the substrate unit comprises at least two first top conductive layers disposed diagonally on an upper surface of the substrate body. a solder pad, and the at least two first light emitting elements are electrically connected between the at least two first top conductive pads, wherein the substrate unit comprises at least two diagonally disposed on an upper surface of the substrate body And a second top conductive pad, wherein the at least two second light emitting elements are electrically connected between the at least two second top conductive pads. The multi-chip package structure for generating a symmetrical projection light source according to claim 2, wherein the substrate unit comprises at least one heat dissipation layer disposed on a lower surface of the substrate body and corresponding to the light-emitting unit, at least Two first conductive conductive pads disposed on the lower surface of the substrate body and electrically connected to the at least two first top conductive pads, respectively, and at least two pairs of opposite corners The wires are disposed on the lower surface of the substrate body and are respectively electrically connected to the second bottom conductive pads of the at least two second top conductive pads. The multi-chip package structure for generating a symmetrical projection light source according to claim 3, wherein the substrate unit comprises at least two first conductive bodies penetrating the substrate body and at least two through the substrate body a second electrical conductor, each of the first electrical conductors being electrically connected between each of the corresponding first top conductive pads and each of the corresponding first bottom conductive pads, and each of the second electrical conductors Connected between each corresponding second top conductive pad and each corresponding second bottom conductive pad. The multi-chip package structure for generating a symmetrical projection light source according to claim 2, wherein the at least two first light-emitting elements respectively transmit at least two first outer wires to be respectively electrically connected to the at least two The first top conductive pads, wherein the at least two first light emitting elements respectively pass through the at least two first inner wires to be electrically connected to the at least two jumper conductive layers, respectively, wherein the at least two second light emitting The components are respectively electrically connected to the at least two second top conductive pads through the at least two second outer wires, and the at least two second light emitting elements are respectively electrically connected through the at least two second inner wires. And at opposite end portions of the at least one connected conductive layer, wherein the upper portion The at least two jumper conductive layers are electrically connected to each other through the at least one jumper wire. The multi-chip package structure for generating a symmetrical projection light source according to claim 5, wherein each of the first insulation frames has a first outer conductor for accommodating each corresponding one and each corresponding a first accommodating space of the first inner wire, each of the second insulating frames has a second accommodating space for accommodating each of the corresponding second outer wires and each of the corresponding second inner wires, And the at least one jumper wire is received in the first accommodating space of one of the first insulating frames. The multi-chip package structure for generating a symmetrical projection light source according to claim 2, wherein an upper surface of each of the first illuminating elements has at least two first electrically connected to each of the corresponding first top ends. a conductive pad and a first electrode of each of the corresponding jumper conductive layers, and an upper surface of each of the second light-emitting elements has at least two second top conductive pads electrically connected to each of the corresponding ones a second electrode of the at least one connected conductive layer. The multi-chip package structure for generating a symmetrical projection light source according to claim 1, wherein the at least two first illuminating elements and the at least two second illuminating elements are symmetrically arranged in a matrix shape, and The at least two first insulating frames and the at least two second insulating frames are symmetrically arranged in a matrix shape. The multi-chip package structure for generating a symmetrical projection light source according to claim 1, further comprising: a package unit comprising at least two covering the at least two first light-emitting elements respectively and respectively a first light transmissive package surrounded by at least two first insulating frames And at least two second light-transmissive packages respectively covering the at least two second light-emitting elements and surrounded by the at least two second insulating frames, wherein the at least two first light-transmitting packages are all fluorescent One of a colloid and a transparent colloid, and the at least two second transparent packages are one of a phosphor colloid and a transparent colloid. The multi-chip package structure for generating a symmetric projection light source according to claim 1, wherein the at least two first light-emitting elements are diagonally disposed on the substrate body, and the at least two second The light emitting elements are diagonally disposed on the substrate body, the at least two first insulating frames are diagonally disposed on the substrate body, and the at least two second insulating frames are diagonally disposed on On the substrate body.