TWI476968B - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
TWI476968B
TWI476968B TW100136713A TW100136713A TWI476968B TW I476968 B TWI476968 B TW I476968B TW 100136713 A TW100136713 A TW 100136713A TW 100136713 A TW100136713 A TW 100136713A TW I476968 B TWI476968 B TW I476968B
Authority
TW
Taiwan
Prior art keywords
conductive
layer
heat conducting
electrode layer
heat
Prior art date
Application number
TW100136713A
Other languages
Chinese (zh)
Other versions
TW201316572A (en
Inventor
Shih Chang Hsu
Tsung Chi Lee
Po Wei Li
Original Assignee
Lite On Electronics Guangzhou
Lite On Technology Corp
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Application filed by Lite On Electronics Guangzhou, Lite On Technology Corp filed Critical Lite On Electronics Guangzhou
Priority to TW100136713A priority Critical patent/TWI476968B/en
Publication of TW201316572A publication Critical patent/TW201316572A/en
Application granted granted Critical
Publication of TWI476968B publication Critical patent/TWI476968B/en

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Description

Illuminating device

The invention relates to a light-emitting device, in particular to a light-emitting device which can effectively improve heat dissipation performance.

According to the light-emitting diode (LED), compared with the traditional light source, the light-emitting diode system has the advantages of small volume, power saving, good luminous efficiency, long service life, fast operation response, and no pollution of toxic substances such as heat radiation and mercury. Therefore, in recent years, the application of light-emitting diodes has been extremely extensive. In the past, the brightness of the light-emitting diodes could not replace the traditional illumination source. However, with the continuous improvement of the technical field, high-power light-emitting diodes with high illumination brightness have been developed, which is sufficient to replace the traditional illumination source.

However, conventionally used light-emitting diode devices (especially for a light-emitting diode device in the form of "thermoelectric integration"), the heat dissipation performance cannot be effectively improved. Therefore, how to improve the heat dissipation performance of the light-emitting diode device by improving the structural design has become an important issue to be solved by the business personnel.

An embodiment of the present invention provides a light-emitting device that plans a heat-conducting path and a conductive path of the light-emitting unit, and further improves the light-emitting efficiency of the light-emitting device.

According to one aspect of the present invention, the present invention provides a light emitting device comprising: a light emitting unit and a heat conducting insulating unit. The light emitting unit includes at least one first conductive support, at least one second conductive support adjacent to the first conductive support, a housing between the first conductive support and the second conductive support, and at least one disposed on the first conductive support Light-emitting element, where A conductive bracket has at least one first conductive portion exposed from the housing and at least one heat conducting portion exposed from the housing, and the second conductive bracket has at least one second conductive portion exposed from the housing. The thermally conductive insulating unit includes at least one thermally conductive insulating layer disposed on the thermally conductive portion.

In summary, the illuminating device provided by the embodiment of the present invention can plan the heat conduction path and the conductive path of the illuminating element through the design of the “thermally conductive insulating layer disposed on the heat conducting portion”, so that the heat emitting performance of the illuminating device of the present invention is Heat transfer efficiency) can be effectively improved. In addition, due to the design of the "thermally conductive insulating layer disposed on the heat conducting portion", when the vertical type wafer is used, the heat dissipation design of the through hole structure can also be made in the substrate unit.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

[First Embodiment]

1A to FIG. 1D, FIG. 1A is a side cross-sectional view showing a heat conducting and insulating unit disposed at a bottom end of the light emitting unit, FIG. 1B is a side cross-sectional view of the substrate unit, and FIG. 1C is a top view of the substrate unit, FIG. It is a side cross-sectional view of the light-emitting device. As shown in the above figure, the first embodiment of the present invention provides a light emitting device comprising: a light emitting unit 1, a heat conducting and insulating unit 2, and a substrate unit 3.

First, as shown in FIG. 1A, the light-emitting unit 1 includes at least one first conductive support 11, at least one second conductive support 12, a housing 14, at least one light-emitting element 15, and an encapsulant 16.

The first conductive bracket 11 and the second conductive bracket 12 can be separated from each other by a predetermined distance and adjacent to each other, and according to different design requirements, A conductive support 11 and a second conductive support 12 are selectively defined as a positive support and a negative support, respectively, or as a negative support and a positive support, respectively. The first conductive support 11 has at least one first conductive portion 110 exposed from the housing 14 and at least one heat conducting portion 111 exposed from the housing 14 and close to the light emitting element 15 , and the second conductive bracket 12 has at least one slave housing 14 . The exposed second conductive portion 120, wherein the first conductive portion 110 and the second conductive portion 120 can serve as two "electrode paths" for conducting the conductive use to the light-emitting unit 1, and the heat-conductive portion 111 is very close to the light-emitting element 15, Therefore, it is possible to provide the shortest "heat dissipation path" to the light-emitting unit 1.

For example, since the first embodiment adopts a light-emitting unit 1 in the form of a quad flat no-lead (QFN), a first conductive region 1100 located at the bottom of the first conductive portion 110 is located at the second A second conductive region 1200 at the bottom of the conductive portion 120 and a heat conductive region 1110 at the bottom of the heat conducting portion 111 can be exposed from the bottom surface 1400 of the housing 14 , and the first conductive region 1100 of the first conductive portion 110 and the second conductive portion The second conductive region 1200 of the portion 120 and the heat conductive region 1110 of the heat transfer portion 111 are substantially flush with the bottom surface 1400 of the housing 14. However, the first conductive support 11 and the second conductive support 12 used in the present invention are not limited by the above-mentioned examples.

Furthermore, the housing 14 can be used to join the first conductive bracket 11 and the second conductive bracket 12 such that the relative positions of the first conductive bracket 11 and the second conductive bracket 12 are fixed to each other. In addition, the housing 14 is interposed between the first conductive bracket 11 and the second conductive bracket 12, and the housing 14 may be an insulating material for insulating both the first conductive bracket 11 and the second conductive bracket 12 from each other. . For example, the housing 14 can be designed as an annular reflective frame surrounding the light-emitting element 15 such that the light beam projected by the light-emitting element 15 ( Not shown) a concentrating effect can be produced via a reflective surface located inside the housing 14. However, the housing 14 used in the present invention is not limited to the above-exemplified examples.

In addition, the light-emitting element 15 can be a vertical light-emitting diode bare chip, and the light-emitting element 15 can be disposed on the first conductive support 11 and electrically connected to the first conductive support 11 and the second conductive support 12. For example, the bottom surface of the light-emitting element 15 can directly electrically contact the first conductive support 11 , and the top surface of the light-emitting element 15 can be electrically connected to the second conductive support 12 through a wire W (for example, a metal wire). Since the first conductive support 11 is electrically charged, the through-type heat conductive structure 35 cannot be disposed on the substrate unit 3 because the through-heat conductive structure 35 of the substrate unit 3 breaks the conductive path. However, by providing the insulating and thermally conductive layer 20 on the heat conducting portion 111 of the first conductive support 11, the heat conducting portion 111 of the first conductive support 11 is uncharged, so that the through-type heat conducting structure 35 can be disposed on the substrate unit 3 to enhance heat dissipation. Improve the heat dissipation performance of the illuminating device. However, the light-emitting element 15 used in the present invention is not limited to the above-described example, and the light-emitting element 15 may be a horizontal light-emitting diode bare wafer. Therefore, the present invention can be designed such that the "thermally conductive insulating layer 20 is disposed on the heat conducting portion 111", and any light emitting diode bare wafer can be provided with the through hole heat conducting structure 35 on the substrate unit 3, which increases the adaptability of the wafer selection.

In a preferred embodiment, the insulating and thermally conductive layer 20 is disposed only on the heat conducting portion 111 of the first conductive support 11 and is not disposed on any of the first conductive support 11 and the second conductive support 12, and is preferably electrically conductive. Path and heat conduction path to improve the luminous efficacy of the illumination device of the present invention.

In addition, the encapsulant 16 is formed in a space surrounded by the housing 14 In the meantime, the light-emitting element 15 is covered, which can be used to change the light shape projected by the light-emitting unit 1 in addition to the light-emitting element 15 which can be used to protect the finished wire. For example, the encapsulant 16 can be planar or convex lenticular...etc. In addition, according to different design requirements, the encapsulant 16 may be a transparent colloid formed of silicone or epoxy resin, or the encapsulant 16 may be a phosphor or a gel or a phosphor and epoxy. A blend of fluorescent colloids. When the light-emitting element 15 is a white light-emitting diode bare wafer that can directly emit a white light source and the encapsulant 16 is a transparent colloid, the light beam generated by the light-emitting element 15 can pass through the transparent colloid to project a white light source. When the light-emitting element 15 is a blue light-emitting diode bare wafer and the encapsulant 16 is a fluorescent colloid, the light beam generated by the light-emitting element 15 can pass through the phosphor colloid to project a white light source. However, the light-emitting element 15 and the encapsulant 16 used in the present invention are not limited to the above-exemplified examples.

Furthermore, as shown in FIG. 1A, the thermally conductive insulating unit 2 includes at least one thermally conductive insulating layer 20 previously disposed on the thermally conductive portion 111, and the thermally conductive insulating layer 20 may completely cover the thermally conductive portion 111 of the first electrically conductive portion 110. For example, the thermally conductive insulating layer 20 can be directly formed on the thermally conductive portion 111 (as shown in FIG. 1A) by direct application through coating, printing, or any other forming means. In addition, the thermally conductive insulating layer 20 may be made of a thermally conductive insulating material having a thermal conductivity substantially between 120 and 500 W/mK, such as alumina, aluminum nitride, or diamond-like carbon (DLC). and many more. However, the thermally conductive insulating layer 20 used in the present invention is not limited by the above-exemplified examples.

In general, the material of the housing 14 is made of epoxy and silicone, and the thermal conductivity is about 0.2 to 0.3 W/mK, and the thermal conductivity of the ceramic material is about 2 to Between 40W/mK, The diamond-like carbon material has a three-dimensional thermal conductivity, such as a thermal conductivity of 475 W/mK in the X direction, a thermal conductivity of 475 W/mK in the Y direction, and a thermal conductivity of 120 W/mK in the Z direction. When diamond-like carbon is selected as the thermal conductive insulating layer, the heat dissipation capability of the light-emitting device of the present invention can be greatly improved.

In addition, as shown in FIG. 1B and FIG. 1C , the substrate unit 3 includes a substrate body 30 , at least one first electrode layer 31 , at least one second electrode layer 32 , at least one top heat conduction layer 33 , and at least one bottom heat conduction layer 34 . And a plurality of through heat conducting structures 35. The first electrode layer 31, the second electrode layer 32, and the top heat conduction layer 33 are all disposed at the top end of the substrate body 30, and the top heat conduction layer 33 may be located between the first electrode layer 31 and the second electrode layer 32. The first electrode layer 31, the second electrode layer 32, and the top heat conduction layer 33 are insulated from each other and separated from each other by a predetermined distance, and the first electrode layer 31 and the second electrode layer 32 are selectively different according to different design requirements. They are defined as a positive electrode and a negative electrode, respectively, or as a negative electrode and a positive electrode, respectively. In addition, the bottom heat conduction layer 34 is disposed at the bottom end of the substrate body 30 and at least corresponds to the top heat conduction layer 33. The plurality of through heat conducting structures 35 penetrate the substrate body 30 and are connected between the top heat conducting layer 33 and the bottom heat conducting layer 34.

For example, the first electrode layer 31, the second electrode layer 32, the top thermally conductive layer 33, and the bottom thermally conductive layer 34 may each be a copper foil layer. The upper surface of the top heat conduction layer 33 has a contact region 33A between the first electrode layer 31 and the second electrode layer 32. The plurality of through heat conducting structures 35 are disposed between the contact region 33A and the bottom heat conducting layer 34. Furthermore, each of the through heat conducting structures 35 has a through hole 35A penetrating through the substrate body 30 and a heat conductor 35B for completely filling the through hole 35A, and the heat conductor 35B is connected to the top heat conducting layer 33 and the bottom heat conducting layer. Between 34. Therefore, since the heat conductor 35B is finished The through holes 35A are completely filled, so that each of the through heat conducting structures 35 can provide an optimum heat conduction speed and heat conduction effect. However, the substrate unit 3 used in the first embodiment of the present invention is not limited to the above-exemplified examples.

Furthermore, as shown in FIGS. 1A, 1B, and 1D, when the light emitting unit 1 is disposed on the substrate unit 3 (as shown in FIG. 1D), the first conductive portion 110 may correspond to the first electrode layer 31 and be electrically The first conductive layer 120 is connected to the second electrode layer 32 and electrically connected to the second electrode layer 32 , and the heat conductive insulating layer 20 can correspond to the top heat conductive layer 33 and be disposed on the heat conducting portion 111 . Between the top heat conducting layer 33 and the top. For example, the first conductive portion 110 and the second conductive portion 120 can pass through the corresponding solder paste S to be electrically connected to the first electrode layer 31 and the second electrode layer 32, respectively, and the thermal conductive layer 20 can also be The solder paste S having a heat conducting function is provided on the top heat conductive layer 33.

In addition, as shown in FIG. 1C and FIG. 1D, since the thermal conductive insulating layer 20 having a higher thermal conductivity can be directly disposed between the heat conducting portion 111 of the first conductive portion 110 and the contact region 33A of the top heat conductive layer 33, the light is emitted. The heat generated by the element 15 (shown by a downward arrow as shown in FIG. 1D) can be transmitted to the thermally conductive insulating layer 20 via the heat conducting portion 111, and the heat absorbed by the thermally conductive insulating layer 20 can be sequentially passed through the top thermally conductive layer 33. The contact area 33A and the plurality of through-type heat conducting structures 35 are guided and efficiently transferred to the bottom heat conducting layer 34 for heat dissipation. In other words, when the above-described thermally conductive insulating layer 20 having a higher thermal conductivity is disposed between the heat conducting portion 111 and the contact region 33A, since the plurality of through heat conducting structures 35 are disposed at the contact region 33A and the bottom of the top heat conducting layer 33 Between the end heat conducting layers 34, heat transferred from the thermally conductive insulating layer 20 to the contact region 33A of the top heat conducting layer 33 can be guided through the plurality of through heat conducting structures 35, and efficiently It is transferred to the bottom heat conducting layer 34 for heat dissipation.

Since the thermally conductive insulating layer 20 is disposed on the heat conducting portion 111 of the first conductive support 11, the insulating property of the thermally conductive insulating layer 20 can be utilized to block the current from flowing below the thermally conductive portion 111. In addition, the heat conduction property of the heat conductive insulating layer 20 can be utilized to provide the shortest heat conduction path to the light emitting element 15. Therefore, the heat conductive insulating layer 20 can be disposed to freely plan the heat conduction path and the conductive path, thereby improving the light emitting efficiency of the light emitting device 1.

In summary, the heat generated by the light-emitting element 15 (as indicated by the blank arrow pointing downward in FIG. 1D) can be thermally transmitted through the heat conducting portion 111 of the first conductive support 11, the thermal conductive insulating layer 20, the solder paste S, and the top end. The contact region 33A of the layer 33 and the plurality of through-type heat conducting structures 35 are guided to be efficiently transferred from the light-emitting element 15 to the bottom heat-conducting layer 34 for heat dissipation. In other words, the present invention transmits the above-described heat conductive insulating layer 20 having a higher thermal conductivity so that the heat generated by the light-emitting element 15 can be efficiently conducted from the heat conducting portion 111 of the first conductive support 11 to the contact of the top heat-conducting layer 33. Zone 33A. The present invention then re-uses the use of the plurality of through-heat conducting structures 35 described above such that heat absorbed by the contact regions 33A of the top thermally conductive layer 33 can be efficiently conducted to the bottom thermally conductive layer 34 for heat dissipation.

Therefore, the present invention can be used in conjunction with the use of the thermally conductive insulating layer 20 and the plurality of through heat conducting structures 35 to efficiently enhance the heat dissipation effect of the light emitting device. In particular, as shown in the first embodiment, when the light-emitting unit 1 adopts the light-emitting element 15 in the form of a "vertical wafer", the present invention cooperates with the shortest heat conduction path that can be provided to the light-emitting unit 1 to the substrate unit 3 and has the above-mentioned The use of the thermally conductive insulating layer 20 having a high thermal conductivity makes the heat dissipation effect of the illuminating device of the present invention more remarkable.

[Second embodiment]

Referring to FIG. 2, a second embodiment of the present invention provides another substrate unit 3. 2 and FIG. 1B, the second embodiment of the present invention is different from the first embodiment in that, in the second embodiment, the area of the bottom heat conduction layer 34 is larger than the area of the top heat conduction layer 33. To increase the overall heat dissipation effect of the present invention. For example, the bottom heat conducting layer 34 can cover the entire bottom surface 1400 of the substrate body 30, so that when the heat absorbed by the top heat conducting layer 33 is conducted to the bottom heat conducting layer 34 through the plurality of through heat conducting structures 35, the larger The bottom thermally conductive layer 34 of the area provides better heat dissipation.

[Third embodiment]

Referring to FIG. 3, a third embodiment of the present invention provides a further substrate unit 3. 3 and FIG. 1B, the third embodiment of the present invention is different from the first embodiment in that, in the third embodiment, each of the through heat conducting structures 35 has a through hole 35A penetrating through the substrate body 30. And a heat conductor 35B for partially filling the through hole 35A, and the heat conductor 35B is connected between the top heat conduction layer 33 and the bottom heat conduction layer 34. For example, the heat conductor 35B does not completely fill the through hole 35A, but is formed only on the inner surface of the through hole 35A. Therefore, since the heat conductor 35B only partially fills the through hole 35A, the material cost used for the heat conductor 35B can be effectively reduced in the fabrication of each through heat conducting structure 35.

[Fourth embodiment]

Referring to FIG. 4, a fourth embodiment of the present invention provides a further substrate unit 3. 4 and FIG. 1C, the fourth embodiment of the present invention is different from the first embodiment in that, in the fourth embodiment, the upper surface of the top heat conduction layer 33 has a first electrode layer 31 and a first electrode layer. a contact region 33A between the two electrode layers 32 and at least two two connected to the contact region 33A, respectively The opposite side end extension 33B, and the plurality of through heat conduction structures 35 are disposed between the contact area 33A and the bottom end heat conduction layer 34. The contact region 33A and the extension region 33B may be combined into a shape of an I-type or an H-shape. In other words, since the fourth embodiment increases the design of the two extension regions 33B, the area of the top heat conduction layer 33 will be larger than the area of the thermally conductive insulating layer 20. Therefore, the fourth embodiment can transmit a design in which the area of the top heat conduction layer 33 is larger than the area of the heat conductive insulation layer 20, so that the present invention can provide a better heat conduction effect.

[Fifth Embodiment]

Referring to FIG. 5, a fifth embodiment of the present invention provides a further substrate unit 3. It can be seen from the comparison between FIG. 5 and FIG. 4 that the fifth embodiment of the present invention differs greatly from the fourth embodiment in that, in the fifth embodiment, the plurality of through-type heat conducting structures 35 can be simultaneously disposed on the contact area 33A and the bottom. The end heat conducting layers 34 are disposed between each of the extending regions 33B and the bottom end heat conducting layer 34. In other words, since the fifth embodiment has the through-type heat conducting structure 35 disposed between each of the extending regions 33B and the bottom heat conducting layer 34, there is more heat conduction path between the top heat conducting layer 33 and the bottom heat conducting layer 34. . Therefore, the fifth embodiment can transmit a design of "increasing the number of through-type heat conducting structures 35 between the top heat conducting layer 33 and the bottom heat conducting layer 34" so that the present invention can provide a better heat conducting effect.

[Sixth embodiment]

Referring to FIG. 6A and FIG. 6B, a sixth embodiment of the present invention provides another illuminating device, comprising: a light emitting unit 1, a heat conducting and insulating unit 2, and a substrate unit 3. From the comparison of FIG. 6A with FIG. 1A and the comparison of FIG. 6B with FIG. 1D, it is understood that the sixth embodiment of the present invention is most different from the first embodiment in that, in the sixth embodiment, since the sixth embodiment adopts a surface Light-emitting form in the form of a Surface Mounted Device (SMD) Element 1, so that the first conductive portion 110 and the second conductive portion 120 can be exposed from the opposite side ends 1401 of the housing 14, respectively. For example, the heat conductive portion 1110 of the heat conducting portion 111 can be exposed from the bottom surface 1400 of the housing 14 , and the first conductive region 1100 of the first conductive portion 110 , the second conductive region 1200 of the second conductive portion 120 , and the heat conducting portion 111 The thermally conductive region 1110 can be substantially flush with the bottom surface 1400 of the housing 14. However, the light-emitting unit 1 used in the present invention is not limited to the above-exemplified examples.

[Seventh embodiment]

Referring to FIG. 7A to FIG. 7D, a seventh embodiment of the present invention provides another illuminating device, which is different from the other embodiments described above in that the design of at least one third conductive bracket 13 is added, and the housing 14 is integrated. The light-emitting element 15 is electrically connected to the first conductive support 11 , the second conductive support 12 and the third conductive support 13 , wherein the light-emitting element 15 is electrically connected to the second conductive support 12 through the wire W. The first conductive bracket 11 and the second conductive bracket 12 are provided. Therefore, the thermally conductive insulating layer 20 of the present invention can be applied not only to the light-emitting unit 1 having at least two conductive supports but also to the light-emitting unit 1 having at least three conductive supports.

Furthermore, as shown in FIG. 7B, FIG. 7C and FIG. 7D, the position of the first conductive portion 110 of the first conductive support 11 for providing the conductive path and the second conductive portion 120 of the second conductive support 12 is designed and The position of the heat conducting portion 111 for providing the shortest heat dissipation path, the positions of the first electrode layer 31, the second electrode layer 32, and the top heat conducting layer 33 can be adjusted correspondingly. For example, according to the positions of the first conductive portion 110, the second conductive portion 120, and the heat conducting portion 111 of the seventh embodiment, the first electrode layer 31 and the second electrode layer 32 may be disposed on the substrate body 30. The same side position, and the thermal conductive layer 20 is disposed on the heat conducting portion 111, and the top end conducts heat. Layer 33 can then be disposed at the other side location on substrate body 30.

In addition, as shown in FIG. 7D, the area of the top heat conduction layer 33 may be greater than or equal to the area of the heat conductive insulating layer 20, and the larger the area of the top heat conduction layer 33, the better the heat dissipation effect can be provided. Of course, as with the other embodiments described above, the seventh embodiment can also be used with a plurality of through heat conducting structures 35 and a larger area of the bottom heat conducting layer 34 for increasing the heat dissipation effect of the present invention. The through heat conducting structure 35 may be located only below the thermally conductive insulating layer 20, or the through heat conducting structure 35 may be located below the entire top thermally conductive layer 33. However, the area in which the through-type heat conducting structure 35 is disposed may also be changed according to different design requirements, and thus is not limited to the above.

[Eighth Embodiment]

Referring to FIG. 8A to FIG. 8B , an eighth embodiment of the present invention provides a further illuminating device, which is the most different from the seventh embodiment in that the illuminating element 15 is electrically connected to the third conductive bracket 13 through the wire W. Therefore, the light-emitting element 15 is electrically connected to the first conductive support 11 and the third conductive support 13 , and the third conductive support 13 has a third conductive portion 130 . Therefore, according to the positions of the first conductive portion 110, the third conductive portion 130, and the heat conducting portion 111 of the eighth embodiment, the heat conductive insulating layer 20 is disposed on the heat conducting portion 111, the first electrode layer 31 and the second electrode layer. 32 may be respectively disposed at two opposite side positions on the substrate body 30, and the top heat conduction layer 33 may be disposed on the substrate body 30 and substantially at a position between the first electrode layer 31 and the second electrode layer 32. In other words, when the thermally conductive insulating layer 20 of the present invention is applied to the light-emitting unit 1 having at least three conductive supports, the light-emitting element 15 can be electrically connected to the second conductive support 12 or the third conductive support 13 according to the light-transmitting element 15 . To plan the first electrode layer 31 and the second electrode The layer 32 and the position of the top thermally conductive layer 33 on the substrate body 30.

In addition, as shown in FIG. 8B, the area of the top heat conduction layer 33 may be greater than or equal to the area of the heat conductive insulating layer 20, and the larger the area of the top heat conduction layer 33, the better the heat dissipation effect can be provided. Of course, as with the other embodiments described above, the eighth embodiment can also be used with a plurality of through heat conducting structures 35 and a larger area of the bottom heat conducting layer 34 for increasing the heat dissipation effect of the present invention. The through heat conducting structure 35 may be located only below the thermally conductive insulating layer 20, or the through heat conducting structure 35 may be located below the entire top thermally conductive layer 33. However, the area in which the through-type heat conducting structure 35 is disposed may also be changed according to different design requirements, and thus is not limited to the above.

[Possible effects of the examples]

In summary, the illuminating device provided by the embodiment of the present invention can plan the heat conduction path and the conductive path of the illuminating element through the design of the “thermally conductive insulating layer disposed on the heat conducting portion”, so that the heat emitting performance of the illuminating device of the present invention is Heat transfer efficiency) can be effectively improved. Furthermore, in the prior art, the through-type heat-conducting structure can be disposed on the substrate unit only when the horizontal wafer is used, so that the insulating and thermally conductive layer is disposed under the first conductive support, further increasing the adaptability of the wafer selection. Whether it is a horizontal wafer or a vertical wafer, a through-type heat conduction structure may be disposed under the first conductive bracket to improve the heat dissipation capability of the light-emitting device.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalents of the invention are included in the scope of the invention.

1‧‧‧Lighting unit

11‧‧‧First conductive bracket

110‧‧‧First Conductive Department

1100‧‧‧First conductive area

111‧‧‧Transfer Department

1110‧‧‧ Heat conduction area

12‧‧‧Second conductive bracket

120‧‧‧Second Conductive Department

1200‧‧‧Second conductive area

13‧‧‧ Third conductive bracket

130‧‧‧ Third Conductive Department

14‧‧‧Shell

1400‧‧‧ bottom

1401‧‧‧ side

15‧‧‧Lighting elements

16‧‧‧Package colloid

2‧‧‧thermal insulation unit

20‧‧‧ Thermal insulation

3‧‧‧Substrate unit

30‧‧‧Substrate body

31‧‧‧First electrode layer

32‧‧‧Second electrode layer

33‧‧‧Top thermal layer

33A‧‧‧Contact area

33B‧‧‧Extension

34‧‧‧Bottom heat conduction layer

35‧‧‧through heat conduction structure

35A‧‧‧through holes

35B‧‧‧ Thermal Conductor

W‧‧‧ wire

S‧‧‧ solder paste

1A is a heat conduction and insulation unit according to a first embodiment of the present invention, which is disposed on a light emitting unit A side cross-sectional view of the bottom end.

1B is a side cross-sectional view of a substrate unit according to a first embodiment of the present invention.

1C is a top plan view of a substrate unit according to a first embodiment of the present invention.

1D is a side cross-sectional view of a light emitting device according to a first embodiment of the present invention.

2 is a side cross-sectional view showing a substrate unit of a second embodiment of the present invention.

3 is a side cross-sectional view showing a substrate unit of a third embodiment of the present invention.

4 is a top plan view of a substrate unit according to a fourth embodiment of the present invention.

Figure 5 is a top plan view of a substrate unit in accordance with a fifth embodiment of the present invention.

6A is a side cross-sectional view showing the heat conducting and insulating unit of the sixth embodiment of the present invention disposed at the bottom end of the light emitting unit.

6B is a side cross-sectional view of a light emitting device according to a sixth embodiment of the present invention.

7A is a perspective view of a first, second, and third conductive bracket according to a seventh embodiment of the present invention.

FIG. 7B is a schematic perspective view of a light emitting unit according to a seventh embodiment of the present invention (after removing the encapsulant).

7C is a perspective view showing the heat conducting and insulating unit of the seventh embodiment of the present invention disposed at the bottom end of the light emitting unit.

7D is a top plan view showing the heat conducting and insulating unit of the seventh embodiment of the present invention disposed at the top end of the substrate unit.

FIG. 8A is a schematic perspective view of a light emitting unit according to an eighth embodiment of the present invention (after removing the encapsulant).

8B is a top plan view showing the heat conducting and insulating unit of the eighth embodiment of the present invention disposed at the top end of the substrate unit.

1‧‧‧Lighting unit

11‧‧‧First conductive bracket

110‧‧‧First Conductive Department

1100‧‧‧First conductive area

111‧‧‧Transfer Department

1110‧‧‧ Heat conduction area

12‧‧‧Second conductive bracket

120‧‧‧Second Conductive Department

1200‧‧‧Second conductive area

14‧‧‧Shell

1400‧‧‧ bottom

15‧‧‧Lighting elements

16‧‧‧Package colloid

2‧‧‧thermal insulation unit

20‧‧‧ Thermal insulation

3‧‧‧Substrate unit

30‧‧‧Substrate body

31‧‧‧First electrode layer

32‧‧‧Second electrode layer

33‧‧‧Top thermal layer

34‧‧‧Bottom heat conduction layer

35‧‧‧through heat conduction structure

35A‧‧‧through holes

35B‧‧‧ Thermal Conductor

W‧‧‧ wire

S‧‧‧ solder paste

Claims (12)

  1. A light emitting device in the form of a quad flat no-lead package (QFN), comprising: a light emitting unit comprising at least one first conductive support, at least one second conductive support adjacent to the at least one first conductive support, a housing between the first conductive bracket and the at least one second conductive bracket, and at least one light emitting component disposed on the at least one first conductive bracket, wherein the at least one first conductive bracket has at least one a first conductive portion exposed by the housing and at least one heat conducting portion exposed from the housing, and the at least one second conductive bracket has at least one second conductive portion exposed from the housing, the bottom portion of the first conductive portion having a first conductive region, a bottom portion of the second conductive portion has a second conductive region, a bottom portion of the heat conducting portion has a first heat conducting region, the first conductive region, the second conductive region and the first heat conducting region The bottom surface of the housing is flush; and a thermally conductive insulating unit includes at least one thermally conductive insulating layer disposed on the at least one thermally conductive portion.
  2. The illuminating device of claim 1, further comprising: a substrate unit comprising a substrate body, at least one first electrode layer disposed on a top end of the substrate body, and at least one disposed on a top end of the substrate body a second electrode layer, at least one top heat conducting layer disposed on the top end of the substrate body, at least one bottom heat conducting layer disposed on the bottom end of the substrate body and corresponding to the at least one top heat conducting layer, and a plurality of through the substrate body And a through heat conducting structure connected between the at least one top heat conducting layer and the at least one bottom heat conducting layer.
  3. The illuminating device of claim 2, wherein the illuminating unit The at least one light-emitting element is electrically connected to the at least one first conductive support and the at least one second conductive support, and the at least one first conductive portion corresponds to the at least one first electrode layer. Electrically connecting to the at least one first electrode layer, the at least one second conductive portion corresponding to the at least one second electrode layer and electrically connected to the at least one second electrode layer, and the at least one thermally conductive insulating layer corresponds to The at least one top heat conducting layer is disposed between the at least one heat conducting portion and the at least one top heat conducting layer.
  4. The illuminating device of claim 2, wherein the upper surface of the at least one top heat conducting layer has a contact area between the at least one first electrode layer and the at least one second electrode layer and at least two And extending to the opposite ends of the contact regions, and the at least one thermally conductive insulating layer is disposed between the at least one heat conducting portion and the contact region.
  5. The illuminating device of claim 4, wherein the plurality of through heat conducting structures are disposed between the contact region and the at least one bottom heat conducting layer, or the plurality of through heat conducting structures are simultaneously disposed at the contact The region is disposed between the at least one bottom thermally conductive layer and between each of the extension regions and the at least one bottom thermally conductive layer.
  6. The illuminating device of claim 2, wherein the at least one bottom heat conducting layer has an area larger than an area of the at least one top heat conducting layer.
  7. The light-emitting device of claim 2, wherein each of the through-type heat-conducting structures has a through hole penetrating the substrate body and a heat conductor for completely filling the through hole, and the heat conductor is connected to the above Between at least one top thermally conductive layer and the at least one bottom thermally conductive layer.
  8. The light-emitting device of claim 2, wherein each of the through-type heat-conducting structures has a through hole penetrating the substrate body and a heat conductor for partially filling the through hole, and the heat conductor is connected to the above Between at least one top thermally conductive layer and the at least one bottom thermally conductive layer.
  9. The illuminating device of claim 2, wherein the at least one illuminating element is electrically connected to the at least one first conductive bracket and the at least one second conductive bracket, and the at least one first conductive portion corresponds to the above At least one first electrode layer electrically connected to the at least one first electrode layer, the at least one second conductive portion corresponding to the at least one second electrode layer and electrically connected to the at least one second electrode layer, the at least A first electrode layer and the at least one second electrode layer are located on the same side of the top end of the substrate body, and the at least one top heat conducting layer is located on the other side of the top end of the substrate body.
  10. The illuminating device of claim 2, wherein the illuminating unit comprises at least one third conductive bracket adjacent to the at least one first conductive bracket, the housing being interposed between the at least one first conductive bracket and the at least one Between the second conductive support and the at least one third conductive support, the at least one light-emitting component is electrically connected to the at least one first conductive support and the at least one third conductive support, and the at least one third conductive support has at least a third conductive portion exposed from the housing.
  11. The illuminating device of claim 10, wherein the at least one first conductive portion corresponds to the at least one first electrode layer and is electrically connected to the at least one first electrode layer, the at least one third conductive portion Corresponding to the at least one second electrode layer and electrically connected to the at least one second electrode layer, the at least one first electrode layer and the at least one second electrode layer are respectively located on opposite sides of the top end of the substrate body And above The at least one top thermally conductive layer is substantially between the at least one first electrode layer and the at least one second electrode layer.
  12. The illuminating device of claim 1, wherein the at least one thermally conductive insulating layer has a thermal conductivity substantially between 120 and 500 W/mK.
TW100136713A 2011-10-11 2011-10-11 Light-emitting device TWI476968B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200814368A (en) * 2006-09-15 2008-03-16 Everlight Electronics Co Ltd High thermal dissipation LED package structure
TW201103172A (en) * 2008-12-31 2011-01-16 Intematix Corp Light emitting device with phosphor wavelength conversion
TWM401200U (en) * 2010-09-13 2011-04-01 Ho Cheng Industrial Co Ltd Heat conduction and heat sink structure for LED

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200814368A (en) * 2006-09-15 2008-03-16 Everlight Electronics Co Ltd High thermal dissipation LED package structure
TW201103172A (en) * 2008-12-31 2011-01-16 Intematix Corp Light emitting device with phosphor wavelength conversion
TWM401200U (en) * 2010-09-13 2011-04-01 Ho Cheng Industrial Co Ltd Heat conduction and heat sink structure for LED

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