CN103715187A - Multi-chip packaging structure for generating symmetrical uniform mixed light source - Google Patents
Multi-chip packaging structure for generating symmetrical uniform mixed light source Download PDFInfo
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- CN103715187A CN103715187A CN201310127382.XA CN201310127382A CN103715187A CN 103715187 A CN103715187 A CN 103715187A CN 201310127382 A CN201310127382 A CN 201310127382A CN 103715187 A CN103715187 A CN 103715187A
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Abstract
The invention provides a multi-chip packaging structure. The structure comprises a substrate unit, a luminescence unit and a packaging unit. The substrate unit comprises a substrate body; the luminescence unit comprises two pairs of first luminescence assemblies and second luminescence assemblies which are arranged on the substrate body in a diagonal manner; and the packaging unit comprises two pairs of first light transmission packaging bodies and second light transmission packaging bodies which respectively cover the two first luminescence assemblies and the second luminescence assemblies. The invention can also comprise a frame unit. The frame unit comprises two first insulation frames which are arranged on the substrate body in a diagonal manner and respectively surround the two first luminescence assemblies, and two second insulation frames which are arranged on the substrate body in a diagonal manner and respectively surround the two second luminescence assemblies. The two insulation frames and the two second insulation frames can be combined to a single frame component in an integral molding manner. The multi-chip packaging structure provided by the invention can be applied to generating a symmetrical uniform mixed light source.
Description
Technical field
The present invention relates to LED encapsulating structure, espespecially a kind of multichip packaging structure for generation of symmetry uniform mixed light light source.
Background technology
About the comparison of light-emitting diode (LED) and conventional light source, light-emitting diode has that volume is little, power saving, luminous efficiency is good, the life-span is long, operant response speed soon and the advantages such as pollution of the noxious substance such as non-thermal radiation and mercury.Therefore in recent years, the application surface of light-emitting diode is to the utmost was extensive.The brightness of past due to light-emitting diode also cannot replace traditional lighting source, but along with the continuous lifting of technical merit, has developed the High Power LED of high illumination briliancy at present, and it is enough to replace traditional lighting source.Yet tradition is used the ray structure of many light-emitting diodes still cannot effectively provide symmetric uniform mixed light light source.Therefore, how by the improvement of structural design, effectively provide symmetric uniform mixed light light source, become the important topic that this cause personage institute wish solves.
Summary of the invention
The object of the invention is to overcome above-mentioned the deficiencies in the prior art, and a kind of multichip packaging structure for generation of symmetry uniform mixed light light source is provided.
The multichip packaging structure for generation of symmetry uniform mixed light light source that technical solution of the present invention provides comprises: a base board unit, a luminescence unit and an encapsulation unit.Described base board unit comprise a substrate body, at least two be arranged on the upper surface of described substrate body and the cross connection type conductive layer being electrically connected to each other and at least one upper surface that is arranged on described substrate body on and the interconnection system conductive layer insulated from each other with described at least two cross connection type conductive layers.Described luminescence unit comprises that at least two the first luminescence components that become diagonal and be arranged in described substrate body and be electrically connected at described substrate body and at least two become diagonal and be arranged in described substrate body and be electrically connected at the second luminescence component of described substrate body, described in wherein said at least two cross connection type conductive layers are electrically connected between at least two the first luminescence components, and described at least one interconnection system conductive layer be electrically connected at described between at least two the second luminescence components.Described encapsulation unit comprise at least two cover respectively described in the first light transmission package of at least two the first luminescence components and at least two cover respectively described in the second light transmission package of at least two the second luminescence components.
Technical scheme provided by the invention also can comprise a frame unit, described frame unit comprises that at least two become diagonal and are arranged in described substrate body and around the first Insulating frame of described at least two the first luminescence components and at least two, become diagonal and be arranged in described substrate body and respectively around the second Insulating frame of described at least two the second luminescence components, wherein said at least two the first Insulating frames and described at least two the second Insulating frames are combined into single framing component one-body moldedly respectively.
Beneficial effect of the present invention is, it can see through " described at least two the first luminescence components that become diagonal and be arranged in described substrate body and be electrically connected at described substrate body " and the design of " described at least two the second luminescence components that become diagonal and be arranged in described substrate body and be electrically connected at described substrate body ", so that multichip packaging structure of the present invention can be used for producing symmetric uniform mixed light light source.
Moreover, beneficial effect of the present invention is also, it can see through " described at least two cross connection type conductive layers be electrically connected at described between at least two the first luminescence components, and described in described at least one interconnection system conductive layer is electrically connected between at least two the second luminescence components " design, so that described at least two become diagonal ground to be arranged in described substrate body and be electrically connected at the first luminescence component of described substrate body and described at least two one-tenth diagonal be arranged in described substrate body and the second luminescence component of being electrically connected at described substrate body can cooperatively interact to produce symmetric uniform mixed light light source.
Accompanying drawing explanation
Figure 1A is the present invention for generation of a wherein schematic perspective view of watching visual angle of the base board unit of the multichip packaging structure of symmetry uniform mixed light light source.
To be the present invention watch the schematic perspective view at visual angle for generation of other one of the base board unit of the multichip packaging structure of symmetry uniform mixed light light source to Figure 1B.
To be the present invention be arranged on the schematic perspective view on base board unit for generation of the multichip packaging structure of symmetry uniform mixed light light source by luminescence unit to Fig. 2.
To be the present invention be arranged on base board unit frame unit with the schematic perspective view around luminescence unit for generation of the multichip packaging structure of symmetry uniform mixed light light source Fig. 3.
To be the present invention be arranged on base board unit encapsulation unit to cover the schematic perspective view of luminescence unit for generation of the multichip packaging structure of symmetry uniform mixed light light source Fig. 4.
Primary clustering symbol description:
Multichip packaging structure Z
The second crystal area A2 cross connection type conductive layer 11A, 11B
Interconnection system conductive layer 11C the first top conductive welding pad 12A
First bottom conductive welding pad 12B the second top conductive welding pad 13A
The second bottom conductive welding pad 13B heat dissipating layer 14
The first electric conductor 15 second electric conductors 16
The first luminescence component 21 first electrodes 210
The second luminescence component 22 second electrodes 220
The first Insulating frame 31 first accommodation spaces 310
The second Insulating frame 32 second accommodation spaces 320
Encapsulation unit 4
The first light transmission package 41 second light transmission package 42
First outboard wire W11 the first inboard wire W12
Cross-over connection wire W20 the second outboard wire W21
The second inboard wire W22
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to shown in Figure 1A to Fig. 4, a wherein embodiment of the present invention provides a kind of multichip packaging structure Z for generation of symmetry uniform mixed light light source, and it comprises: a base board unit 1, a luminescence unit 2, a frame unit 3 and an encapsulation unit 4.
First, coordinate shown in Figure 1A and Figure 1B, base board unit 1 comprise a substrate body 10, at least two be arranged on the upper surface of substrate body 10 and the cross connection type conductive layer (11A, 11B) being electrically connected to each other and at least one upper surface that is arranged on substrate body 10 on and the interconnection system conductive layer 11C insulated from each other with described at least two cross connection type conductive layers (11A, 11B).For instance, the upper surface of substrate body 10 has at least two the first crystal area A1 and at least two the second crystal area A2 that become diagonal Position Design that become diagonal Position Design.Base board unit 1 comprises that at least two the first top conductive welding pad 12A on the upper surface that becomes diagonal and be arranged on substrate body 10 and at least two become diagonal and be arranged on the second top conductive welding pad 13A on the upper surface of substrate body 10.
Particularly, base board unit 1 comprises at least one lower surface that is arranged on substrate body 10 and corresponding to the heat dissipating layer 14 of luminescence unit 2, at least two, becomes diagonal and be arranged on the first bottom conductive welding pad 12B of at least two the first top conductive welding pad 12A on the lower surface of substrate body 10 and described in being electrically connected at accordingly respectively and at least two to become diagonal to be arranged on the second bottom conductive welding pad 13B of at least two the second top conductive welding pad 13A on the lower surface of substrate body 10 and described in being electrically connected at accordingly respectively.
Again particularly, base board unit 1 also comprises at least two the first electric conductor 15 and at least two second electric conductors 16 that can run through substrate body 10 that can run through substrate body 10, wherein each first electric conductor 15 can be electrically connected between each the first corresponding top conductive welding pad 12A first bottom conductive welding pad 12B corresponding with each, and each second electric conductor 16 can be electrically connected between each the second corresponding top conductive welding pad 13A second bottom conductive welding pad 13B corresponding with each.In other words, each the first corresponding top conductive welding pad 12A first bottom conductive welding pad 12B corresponding with each can see through each first corresponding electric conductor 15 and reach electric connection each other, and each the second corresponding top conductive welding pad 13A second bottom conductive welding pad 13B corresponding with each can reach electric connection each other through each second corresponding electric conductor 16.Yet base board unit 1 used in the present invention not with above-mentioned for example be limited.
Moreover, coordinate shown in Figure 1A and Fig. 2, luminescence unit 2 comprises that at least two the first luminescence components 21 that become diagonal and be arranged in substrate body 10 and be electrically connected at substrate body 10 and at least two become diagonal and be arranged in substrate body 10 and be electrically connected at the second luminescence component 22 of substrate body 10.Wherein, described in described at least two cross connection type conductive layers (11A, 11B) are electrically connected between at least two the first luminescence components 21, and interconnection system conductive layer 11C be electrically connected at described between at least two the second luminescence components 22.In addition, described in described at least two the first luminescence components 21 can be electrically connected between at least two the first top conductive welding pad 12A, and described at least two the second luminescence components 22 can be electrically connected at described between at least two the second top conductive welding pad 13A.
Particularly, described at least two the first luminescence components 21 can be arranged in a matrix shape (as shown in Figure 2) symmetrically with described at least two the second luminescence components 22.In addition, described at least two the first luminescence components 21 are separately positioned at least two the first crystal area A1 of substrate body 10, and described at least two the second luminescence components 22 are separately positioned at least two the second crystal area A2 of substrate body 10.In addition, the upper surface of each the first luminescence component 21 has at least two the first electrodes 210 that are electrically connected at respectively each the first corresponding top conductive welding pad 12A cross connection type conductive layer 11A corresponding with each, and the upper surface of each the second luminescence component 22 has at least two and is electrically connected at respectively each second corresponding top conductive welding pad 13A and the second electrode 220 of interconnection system conductive layer 11C.
When described at least two the first luminescence components 21 see through respectively at least two the first outboard wire W11 with at least two the first top conductive welding pad 12A described in being electrically connected at respectively, and described at least two the first luminescence components 21 can see through respectively at least two the first inboard wire W12 with at least two cross connection type conductive layer (11A described in being electrically connected at respectively, in the time of 11B), at least two the first electrodes 210 of each the first luminescence component 21 can see through respectively each the first corresponding outboard wire W11 first inboard wire W12 corresponding with each, to be electrically connected at respectively each the first corresponding top conductive welding pad 12A cross connection type conductive layer (11A or 11B) corresponding with each.Moreover, when described at least two the second luminescence components 22 see through respectively at least two the second outboard wire W21 with at least two the second top conductive welding pad 13A described in being electrically connected at respectively, and described at least two the second luminescence components 22 see through respectively at least two the second inboard wire W22 when being electrically connected at respectively the two contrary terminal part of interconnection system conductive layer 11C, at least two the second electrodes 220 of each the second luminescence component 22 can see through respectively each the second corresponding outboard wire W21 second inboard wire W22 corresponding with each, to be electrically connected at respectively each corresponding the second top conductive welding pad 13A and interconnection system conductive layer 11C.In addition, described at least two cross connection type conductive layers (11A, 11B) can see through at least one cross-over connection wire W20 to be electrically connected to each other.Yet luminescence unit used in the present invention 2 and frame unit 3 not with above-mentioned for example be limited.
In addition, frame unit 3 comprises that at least two become diagonal and are arranged in substrate body 10 and around the first Insulating frame 31 of described at least two the first luminescence components 21 and at least two, become diagonal and be arranged in substrate body 10 and around 32, wherein said at least two the first Insulating frames 31 of the second Insulating frame of described at least two the second luminescence components 22, can be combined into single framing component with described at least two the second Insulating frames 32 respectively one-body moldedly respectively.For instance, described at least two the first Insulating frames 31 can be arranged in a matrix shape symmetrically with described at least two the second Insulating frames 32.Moreover, each first Insulating frame 31 has one for accommodating each first corresponding outboard wire W11, the first accommodation space 310 of the first inboard wire W12 that each is corresponding and the first light transmission package 41 that each is corresponding, each second Insulating frame 32 has one for accommodating each second corresponding outboard wire W21, the second accommodation space 320 of the second inboard wire W22 that each is corresponding and the second light transmission package 42 that each is corresponding, and cross-over connection wire W20 is placed in the first accommodation space 310 of one of them the first Insulating frame 31.
In addition, coordinate shown in Fig. 3 and Fig. 4, encapsulation unit 4 comprise at least two cover respectively described at least two the first luminescence components 21 and respectively by 31 of described at least two the first Insulating frames around the first light transmission package 41 and at least two cover respectively described at least two the second luminescence components 22 and respectively by 32 of described at least two the second Insulating frames around the second light transmission package 42, wherein said at least two the first light transmission package 41 all can be wherein a kind of among fluorescent colloid and transparent colloid, and described at least two the second light transmission package 42 all can be wherein a kind of among fluorescent colloid and transparent colloid.For instance, when each first luminescence component 21 is blue LED, and the first light transmission package 41 is one to be used for covering each first corresponding luminescence component 21(blue LED) fluorescent colloid time, the blue light beam that each first luminescence component 21 produces can see through each first corresponding light transmission package 41 convert white light beam to.When each second luminescence component 22 is blue LED, and the second light transmission package 42 is one to be used for covering each second corresponding luminescence component 22(blue LED) transparent colloid time, the blue light beam that each second luminescence component 22 produces can, in the situation that not needing to change through wavelength, directly cast out from each second corresponding light transmission package 42.
Another embodiment of the present invention also provides a kind of another kind of form of the multichip packaging structure for generation of symmetry uniform mixed light light source, and it comprises: a base board unit 1, a luminescence unit 2 and an encapsulation unit 4.Described base board unit 1 comprise a substrate body 10, at least two be arranged on the upper surface of substrate body 10 and the cross connection type conductive layer (11A, 11B) being electrically connected to each other and at least one upper surface that is arranged on substrate body 10 on and the interconnection system conductive layer 11C insulated from each other with described at least two cross connection type conductive layers (11A, 11B).Described luminescence unit 2 comprises that at least two the first luminescence components 21 that become diagonal and be arranged in substrate body 10 and be electrically connected at substrate body 10 and at least two become diagonal and be arranged in substrate body 10 and be electrically connected at the second luminescence component 22 of substrate body 10, described in wherein said at least two cross connection type conductive layers (11A, 11B) are electrically connected between at least two the first luminescence components 21, and described at least one interconnection system conductive layer 11C be electrically connected at described between at least two the second luminescence components 22.Described encapsulation unit 4 comprise at least two cover respectively described in the first light transmission package 41 of at least two the first luminescence components 21 and at least two cover respectively described in the second light transmission package 42 of at least two the second luminescence components 22.
It should be noted that, in this another embodiment of the present invention, the concrete structure setting of base board unit 1, luminescence unit 2 and encapsulation unit 4 can be same as the previously described embodiments.
Therefore, the multichip packaging structure Z that the embodiment of the present invention provides can see through the design of " described at least two the first luminescence components 21 that become diagonal and be arranged in substrate body 10 and be electrically connected at substrate body 10 " and " described at least two the second luminescence components 22 that become diagonal and be arranged in substrate body 10 and be electrically connected at substrate body 10 ", so that multichip packaging structure Z of the present invention can be used for producing symmetric uniform mixed light light source.
In sum, the multichip packaging structure that the embodiment of the present invention provides, it can see through " described at least two the first luminescence components that become diagonal and be arranged in substrate body and be electrically connected at substrate body " and the design of " described at least two the second luminescence components that become diagonal and be arranged in substrate body and be electrically connected at substrate body ", so that multichip packaging structure of the present invention can be used for producing symmetric uniform mixed light light source.Again further, the multichip packaging structure that the embodiment of the present invention provides, it can see through " described at least two cross connection type conductive layers be electrically connected at described between at least two the first luminescence components, and described in described at least one interconnection system conductive layer is electrically connected between at least two the second luminescence components " design, so that described at least two become diagonal ground to be arranged in substrate body and be electrically connected at the first luminescence component of substrate body and described at least two one-tenth diagonal be arranged in substrate body and the second luminescence component of being electrically connected at substrate body can cooperatively interact to produce symmetric uniform mixed light light source.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. for generation of a multichip packaging structure for symmetry uniform mixed light light source, it is characterized in that comprising:
One base board unit, it comprise a substrate body, at least two be arranged on the upper surface of described substrate body and the cross connection type conductive layer being electrically connected to each other, at least one upper surface that is arranged on described substrate body on and the interconnection system conductive layer insulated from each other with described at least two cross connection type conductive layers;
One luminescence unit, it comprises that at least two the first luminescence components that become diagonal and be arranged in described substrate body and be electrically connected at described substrate body and at least two become diagonal and be arranged in described substrate body and be electrically connected at the second luminescence component of described substrate body, described in wherein said at least two cross connection type conductive layers are electrically connected between at least two the first luminescence components, and described at least one interconnection system conductive layer be electrically connected at described between at least two the second luminescence components;
One encapsulation unit, it comprise at least two cover respectively described in the first light transmission package of at least two the first luminescence components and at least two cover respectively described in the second light transmission package of at least two the second luminescence components.
2. the multichip packaging structure for generation of symmetry uniform mixed light light source as claimed in claim 1, it is characterized in that: also comprise a frame unit, described frame unit comprises that at least two become diagonal and are arranged in described substrate body and around the first Insulating frame of described at least two the first luminescence components and at least two, become diagonal and be arranged in described substrate body and respectively around the second Insulating frame of described at least two the second luminescence components respectively, wherein said at least two the first Insulating frames and described at least two the second Insulating frames are combined into single framing component one-body moldedly.
3. the multichip packaging structure for generation of symmetry uniform mixed light light source as claimed in claim 1 or 2, it is characterized in that: described base board unit comprises at least two the first top conductive welding pad on the upper surface that becomes diagonal and be arranged on described substrate body, and described in described at least two the first luminescence components are electrically connected between at least two the first top conductive welding pad, wherein said base board unit comprises at least two the second top conductive welding pad on the upper surface that becomes diagonal and be arranged on described substrate body, and described in described at least two the second luminescence components are electrically connected between at least two the second top conductive welding pad.
4. the multichip packaging structure for generation of symmetry uniform mixed light light source as claimed in claim 3, is characterized in that: described base board unit also comprises at least one lower surface that is arranged on described substrate body and corresponding to the heat dissipating layer of described luminescence unit, at least two, become diagonal and be arranged on the first bottom conductive welding pad of at least two the first top conductive welding pad on the lower surface of described substrate body and described in being electrically connected at accordingly respectively and at least two to become diagonal to be arranged on the second bottom conductive welding pad of at least two the second top conductive welding pad on the lower surface of described substrate body and described in being electrically connected at accordingly respectively.
5. the multichip packaging structure for generation of symmetry uniform mixed light light source as claimed in claim 4, it is characterized in that: described base board unit also comprises at least two the first electric conductor and at least two the second electric conductors that run through described substrate body that run through described substrate body, each first electric conductor is electrically connected between each the first corresponding top conductive welding pad first bottom conductive welding pad corresponding with each, and each second electric conductor is electrically connected between each the second corresponding top conductive welding pad second bottom conductive welding pad corresponding with each.
6. the multichip packaging structure for generation of symmetry uniform mixed light light source as claimed in claim 3, it is characterized in that: described at least two the first luminescence components see through respectively at least two the first outboard wire with at least two the first top conductive welding pad described in being electrically connected at respectively, and described at least two the first luminescence components see through respectively at least two the first inboard wire with at least two cross connection type conductive layers described in being electrically connected at respectively, wherein said at least two the second luminescence components see through respectively at least two the second outboard wire with at least two the second top conductive welding pad described in being electrically connected at respectively, and described at least two the second luminescence components see through respectively at least two the second inboard wire to be electrically connected at respectively two contrary terminal parts of described at least one interconnection system conductive layer, wherein said at least two cross connection type conductive layers see through at least one cross-over connection wire to be electrically connected to each other.
7. the multichip packaging structure for generation of symmetry uniform mixed light light source as claimed in claim 6, it is characterized in that: each first Insulating frame has one for accommodating each first corresponding outboard wire, the first accommodation space of the first inboard wire that each is corresponding and the first light transmission package that each is corresponding, each second Insulating frame has one for accommodating each second corresponding outboard wire, the second accommodation space of the second inboard wire that each is corresponding and the second light transmission package that each is corresponding, and described at least one cross-over connection wire is placed in described first accommodation space of one of them the first Insulating frame.
8. the multichip packaging structure for generation of symmetry uniform mixed light light source as claimed in claim 3, it is characterized in that: the upper surface of each the first luminescence component has at least two the first electrodes that are electrically connected at respectively each the first corresponding top conductive welding pad cross connection type conductive layer corresponding with each, and the upper surface of each the second luminescence component has at least two and is electrically connected at respectively each second corresponding top conductive welding pad and the second electrode of described at least one interconnection system conductive layer.
9. the multichip packaging structure for generation of symmetry uniform mixed light light source as claimed in claim 2, it is characterized in that: described at least two the first luminescence components and described at least two the second luminescence components are arranged in a matrix shape symmetrically, and described at least two the first Insulating frames and described at least two the second Insulating frames are arranged in a matrix shape symmetrically.
10. the multichip packaging structure for generation of symmetry uniform mixed light light source as claimed in claim 1, it is characterized in that: described at least two the first light transmission package are wherein a kind of among fluorescent colloid and transparent colloid, described at least two the second light transmission package are wherein a kind of among fluorescent colloid and transparent colloid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310127382.XA CN103715187A (en) | 2013-04-12 | 2013-04-12 | Multi-chip packaging structure for generating symmetrical uniform mixed light source |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310127382.XA CN103715187A (en) | 2013-04-12 | 2013-04-12 | Multi-chip packaging structure for generating symmetrical uniform mixed light source |
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| CN103715187A true CN103715187A (en) | 2014-04-09 |
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| CN201310127382.XA Pending CN103715187A (en) | 2013-04-12 | 2013-04-12 | Multi-chip packaging structure for generating symmetrical uniform mixed light source |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102024804A (en) * | 2009-09-11 | 2011-04-20 | 柏友照明科技股份有限公司 | Mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness |
| TWM445265U (en) * | 2012-06-04 | 2013-01-11 | Brightek Optoelectronic Co Ltd | Symmetry which projects source for generating a multi-chip package structure |
| TWM445259U (en) * | 2012-06-27 | 2013-01-11 | Brightek Optoelectronic Co Ltd | Method for generating symmetry uniform mixed dispersion source multi-chip package structure |
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2013
- 2013-04-12 CN CN201310127382.XA patent/CN103715187A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102024804A (en) * | 2009-09-11 | 2011-04-20 | 柏友照明科技股份有限公司 | Mixed light type light emitting diode packaging structure capable of increasing color rendering and brightness |
| TWM445265U (en) * | 2012-06-04 | 2013-01-11 | Brightek Optoelectronic Co Ltd | Symmetry which projects source for generating a multi-chip package structure |
| TWM445259U (en) * | 2012-06-27 | 2013-01-11 | Brightek Optoelectronic Co Ltd | Method for generating symmetry uniform mixed dispersion source multi-chip package structure |
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Application publication date: 20140409 |