TWI495165B - Multichip package structure for generating a symmetrical and uniform light-mixing source - Google Patents

Description

Multi-chip package structure for generating a symmetrical uniform light mixing source

The present invention relates to a multi-chip package structure, and more particularly to a multi-chip package structure for producing a symmetrical uniform light-mixing light source.

Regarding the comparison between a light-emitting diode (LED) and a conventional light source, the light-emitting diode has a small volume, power saving, good luminous efficiency, long life, fast operation response, and no pollution of toxic substances such as heat radiation and mercury, etc. advantage. Therefore, in recent years, the application of light-emitting diodes has been extremely extensive. In the past, the brightness of the light-emitting diodes could not replace the traditional illumination source. However, with the continuous improvement of the technical field, high-power light-emitting diodes with high illumination brightness have been developed, which is sufficient to replace the traditional illumination source. However, the conventional light-emitting structure using a plurality of light-emitting diodes still cannot effectively provide a uniform uniform light-mixing light source. Therefore, how to effectively provide a symmetrical uniform light source by improving the structural design has become an important issue that the business person wants to solve.

Embodiments of the present invention provide a multi-chip package structure for generating a symmetrical uniform light mixing source.

A multi-chip package structure for generating a symmetrical uniform light-mixing light source according to an embodiment of the present invention includes: a substrate unit, a light-emitting unit, a frame unit, a package unit, and a lens unit. The substrate unit includes a substrate body and at least one jumper conductive layer disposed on an upper surface of the substrate body. The light emitting unit includes at least two first light emitting elements disposed on the substrate body diagonally and electrically connected to the substrate body, and at least two diagonally disposed on the substrate body And electrically connected to the second light emitting element of the substrate body. The frame unit includes at least two first conductive frames disposed diagonally on the substrate body and surrounding the at least two first light emitting elements and at least two diagonally disposed on the substrate body a second conductive frame surrounding the at least two second light emitting elements, wherein the at least two first conductive frames are electrically connected to each other through the at least one jumper conductive layer, and the at least two second conductive frames are transparent to each other At least one of the jumper wires is electrically connected to each other. The package unit includes at least two first light-transmissive packages respectively covering the at least two first light-emitting elements and surrounded by the at least two first conductive frames, and at least two covering the at least two second light-emitting portions respectively And a second light transmissive package surrounded by the at least two second conductive frames.

Another embodiment of the present invention provides a multi-chip package structure for generating a symmetrical uniform light mixing source, comprising: a substrate unit, a light emitting unit, a frame unit, a package unit, and a lens unit. The substrate unit includes a substrate body. The illuminating unit includes at least two first illuminating elements disposed on the substrate body and electrically connected to the substrate body, and at least two diagonally disposed on the substrate body and electrically connected a second light emitting element of the substrate body. The frame unit includes at least two first conductive frames disposed diagonally on the substrate body and surrounding the at least two first light emitting elements and at least two diagonally disposed on the substrate body a second conductive frame surrounding the at least two second light emitting elements, wherein the at least two first conductive frames are electrically connected to each other, and the at least two second conductive frames are electrically connected to each other. The package unit includes at least two at least two first light-emitting elements respectively covered by the at least two first conductive frames a first light-transmissive package surrounded by the frame and at least two second light-transmissive packages respectively covering the at least two second light-emitting elements and surrounded by the at least two second conductive frames.

The multi-chip package structure provided by the embodiment of the present invention is permeable to the first of the at least two diagonally disposed on the substrate body and electrically connected to the substrate body. a design of the light-emitting element" and the "at least two second light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body" such that the multi-chip package structure of the present invention can be used to generate symmetry Uniform uniform light source.

Furthermore, the multi-chip package structure provided by the embodiment of the present invention is permeable to "the at least two first conductive frames are electrically connected to each other through the at least one jumper-type conductive layer, and the at least two second conductive materials are The frame is electrically connected to each other through at least one of the jumper wires, such that the at least two of the first light-emitting elements are disposed on the substrate body and electrically connected to the substrate body and the at least two The second light-emitting elements disposed diagonally on the substrate body and electrically connected to the substrate body can cooperate to produce a symmetrical uniform light-mixing light source.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

Referring to FIG. 1A to FIG. 5, an embodiment of the present invention may provide a multi-chip package structure Z for generating a symmetrical uniform light mixing source, comprising: a substrate unit 1, a light emitting unit 2, and a light emitting unit The frame unit 3, a package unit 4 and a lens unit 5.

First, as shown in FIG. 1A and FIG. 1B, the substrate unit 1 includes a substrate body 10 and at least one jumper-type conductive layer 11 disposed on the upper surface of the substrate body 10. For example, the upper surface of the substrate body 10 has at least two first crystallized regions A1 designed in a diagonal position and a second crystallized region A2 designed in at least two diagonal positions. The substrate unit 1 includes at least two first top conductive pads 12A disposed diagonally on the upper surface of the substrate body 10 and at least two second disposed on the upper surface of the substrate body 10 diagonally Top conductive pad 13A.

For example, the substrate unit 1 includes at least one heat dissipation layer 14 disposed on the lower surface of the substrate body 10 and corresponding to the light emitting unit 2, and at least two are disposed on the lower surface of the substrate body 10 and are respectively electrically connected correspondingly The first bottom conductive pads 12B of the at least two first top conductive pads 12A and at least two are disposed on the lower surface of the substrate body 10 and are respectively electrically connected to the at least two second tops respectively The second bottom conductive pad 13B of the conductive pad 13A.

For example, the substrate unit 1 includes at least two first conductive bodies 15 that can penetrate the substrate body 10 and at least two second conductive bodies 16 that can penetrate the substrate body 10, wherein each of the first conductive bodies 15 can be electrically Connected between each of the corresponding first top conductive pads 12A and each of the corresponding first bottom conductive pads 12B, and each of the second conductive bodies 16 is electrically connected to each corresponding first Two top conductive pads 13A are disposed between each of the corresponding second bottom conductive pads 13B. In other words, each of the corresponding first top conductive pads 12A and each of the corresponding first bottom conductive pads 12B can be electrically connected to each other through each corresponding first conductive body 15, and each A corresponding second top conductive pad 13A and each corresponding second bottom conductive pad 13B are permeable to each A corresponding second electrical conductor 16 is used to achieve electrical connection to each other. However, the substrate unit 1 used in the present invention is not limited to the above-exemplified examples.

In addition, as shown in FIG. 1A, FIG. 2 and FIG. 3, the light-emitting unit 2 includes at least two first light-emitting elements 21 and at least two disposed on the substrate body 10 and electrically connected to the substrate body 10. The second light emitting element 22 is disposed on the substrate body 10 and electrically connected to the second light emitting element 22 of the substrate body 10, wherein the at least two first light emitting elements 21 are electrically connected to the at least two first top ends The pads 12A are electrically connected to the at least two second light-emitting elements 22 between the at least two second top conductive pads 13A. In addition, the frame unit 3 includes at least two first conductive frames 31 disposed diagonally on the substrate body 10 and surrounding the at least two first light-emitting elements 21, respectively, and at least two diagonally disposed on the substrate a second conductive frame 32 on the body 10 and surrounding the at least two second light-emitting elements 22, wherein the at least two first conductive frames 31 are electrically connected to each other through the jumper conductive layer 11 (as shown in FIG. 2). The at least two second conductive frames 32 are electrically connected to each other through at least one jumper wire W20 (as shown in FIG. 3).

For example, the at least two first light-emitting elements 21 and the at least two second light-emitting elements 22 may be symmetrically arranged in a matrix shape, and the at least two first conductive frames 31 and the at least two second conductive materials The frames 32 may be arranged symmetrically to each other in a matrix shape. In addition, the at least two first light emitting elements 21 are respectively disposed on at least two first crystallized regions A1 of the substrate body 10, and the at least two second light emitting elements 22 are respectively disposed on at least two of the substrate body 10. Two crystal regions A2. In addition, the upper surface of each of the first illuminating elements 21 has at least two first top conductive pads 12A electrically connected to each of the corresponding ones. a first electrode 210 corresponding to each of the first conductive frames 31, and an upper surface of each of the second light-emitting elements 22 has at least two second top conductive pads 13A electrically connected to each of the corresponding ones. The second electrode 220 of each of the corresponding second conductive frames 32. Furthermore, the jumper wire W20 may correspond to the jumper conductive layer 11 and laterally exaggerate the jumper conductive layer 11.

Therefore, when the at least two first light emitting elements 21 are respectively transmitted through the at least two first outer wires W11 to be electrically connected to the at least two first top conductive pads 12A, respectively, and the at least two first light emitting elements 21 When at least two first inner conductive wires 31 are electrically connected to the at least two first conductive frames 31, respectively, at least two first electrodes 210 of each of the first light-emitting elements 21 can be respectively transmitted through each phase. Corresponding first outer wires W11 and corresponding first inner wires W12 are respectively electrically connected to each corresponding first top conductive pad 12A and each corresponding first conductive frame 31. Furthermore, when the at least two second light-emitting elements 22 are respectively transmitted through at least two second outer wires W21 to be electrically connected to the at least two second top conductive pads 13A, respectively, and the at least two second light-emitting elements When each of the at least two second conductive frames 32 is electrically connected to the at least two second conductive frames 32 through the at least two second inner wires W22, respectively, each of the at least two second electrodes 220 of each of the second light-emitting elements 22 can pass through each phase. Corresponding second outer wires W21 and corresponding second inner wires W22 are respectively electrically connected to each corresponding second top conductive pad 13A and each corresponding second conductive frame 32. However, the light-emitting unit 2 and the frame unit 3 used in the present invention are not limited to the above-exemplified examples.

In addition, as shown in FIG. 3 and FIG. 4, the package unit 4 includes at least two a first light-transmissive package 41 and at least two covering the at least two second light-emitting elements 22 respectively covering the at least two first light-emitting elements 21 and respectively surrounded by the at least two first conductive frames 31 a second light transmissive package 42 surrounded by the at least two second conductive frames 32, wherein the at least two first light transmissive packages 41 can be one of a phosphor colloid and a transparent colloid. The at least two second light-transmissive packages 42 may be one of a phosphor colloid and a transparent colloid. For example, when each of the first light-emitting elements 21 is a blue light-emitting diode, and the first light-transmissive package 41 is used to cover each of the corresponding first light-emitting elements 21 (blue light-emitting diodes) When the phosphor colloid is used, the blue light beam generated by each of the first light-emitting elements 21 can be converted into a white light beam through each of the corresponding first light-transmitting packages 41. When each of the second light-emitting elements 22 is a blue light-emitting diode, and the second light-transmissive package 42 is a transparent colloid for covering each of the corresponding second light-emitting elements 22 (blue light-emitting diodes) The blue light beam generated by each of the second light-emitting elements 22 can be directly projected from each of the corresponding second light-transmissive packages 42 without undergoing wavelength conversion.

Finally, as shown in FIG. 4 and FIG. 5, the lens unit 5 includes a lens colloid 50 disposed on the substrate body 10 to cover the frame unit 3 and the package unit 4. For example, the lens colloid 50 may be a transparent colloid having a condensing function, however, the lens unit 5 used in the present invention is not limited to the above-exemplified examples. Furthermore, the present invention has at least three illumination modes: assuming that only the two first light-emitting elements 21 are energized to emit light, the light beams generated by the two first light-emitting elements 21 can pass through the first through The light package 41 and the lens colloid 50 are used to produce a first symmetrical uniform light source. It is assumed that only the above two second light-emitting elements 22 are In the case of being energized and emitting light, the light beams generated by the two second light-emitting elements 22 may sequentially pass through the second light-transmissive package 42 and the lens colloid 50 to generate a second symmetrical uniform light-mixing light source. Assuming that the two first light-emitting elements 21 and the two second light-emitting elements 22 are simultaneously energized to emit light, the light beams generated by the two first light-emitting elements 21 may sequentially pass through the first light-transmitting package 41. And the lens colloid 50, and the light beams generated by the two second light-emitting elements 22 can sequentially pass through the second light-transmissive package 42 and the lens colloid 50 to generate a third symmetrical uniform light-mixing light source.

Furthermore, another embodiment of the present invention provides a multi-chip package structure for generating a symmetrical uniform light-mixing light source, comprising: a substrate unit 1, a light-emitting unit 2, a frame unit 3, and a package unit. 4 and a lens unit 5. The substrate unit 1 includes a substrate body 10. The light emitting unit 2 includes at least two first light emitting elements 21 disposed on the substrate body 10 and electrically connected to the substrate body 10 and at least two diagonally disposed on the substrate body 10 and electrically The second light emitting element 22 is connected to the substrate body 10. The frame unit 3 includes at least two first conductive frames 31 disposed diagonally on the substrate body 10 and surrounding the at least two first light-emitting elements 21 and at least two diagonally disposed on the substrate body 10 And a second conductive frame 32 that surrounds the at least two second light-emitting elements 22, wherein the at least two first conductive frames 31 are electrically connected to each other, and the at least two second conductive frames 32 are electrically connected to each other. The package unit 4 includes at least two first light-transmissive packages 41 respectively covering the at least two first light-emitting elements 21 and surrounded by the at least two first conductive frames 31, and at least two covering at least two of the above The second light emitting element 22 is respectively formed by the at least two second conductive frames 32 The second light transmissive package 42 is surrounded. Therefore, the multi-chip package structure Z provided by the embodiment of the present invention can transmit "the above-mentioned at least two first light-emitting elements 21 disposed diagonally on the substrate body 10 and electrically connected to the substrate body 10" and "the above At least two designs of the second light-emitting elements 22" disposed diagonally on the substrate body 10 and electrically connected to the substrate body 10 are such that the multi-chip package structure Z of the present invention can be used to produce uniform mixing of symmetry Light source.

[Possible effects of the examples]

In summary, the multi-chip package structure provided by the embodiment of the present invention is permeable to "the at least two first light-emitting elements disposed on the substrate body diagonally and electrically connected to the substrate body" and " The above-described design of at least two second light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body is such that the multi-chip package structure of the present invention can be used to generate a uniform uniform light-mixing light source. Further, the multi-chip package structure provided by the embodiment of the present invention is permeable to "the at least two first conductive frames are electrically connected to each other through the at least one jumper-type conductive layer, and the at least two The second conductive frame is electrically connected to each other through at least one of the jumper wires, such that the at least two at least two diagonally disposed on the substrate body and electrically connected to the first light-emitting element of the substrate body and the at least Two illuminating elements disposed diagonally on the substrate body and electrically connected to the substrate body may cooperate to produce a symmetrical uniform light mixing source.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalents of the invention are included in the scope of the invention.

Z‧‧‧Multi-chip package structure

1‧‧‧Substrate unit

10‧‧‧Substrate body

A1‧‧‧first crystal area

A2‧‧‧Second crystal area

11‧‧‧Spanned Conductive Layer

12A‧‧‧First top conductive pad

12B‧‧‧First bottom conductive pad

13A‧‧‧Second top conductive pad

13B‧‧‧Second bottom conductive pad

14‧‧‧heat layer

15‧‧‧First conductor

16‧‧‧Second conductor

2‧‧‧Lighting unit

21‧‧‧First light-emitting element

210‧‧‧First electrode

22‧‧‧Second light-emitting element

220‧‧‧second electrode

3‧‧‧Frame unit

31‧‧‧First conductive frame

32‧‧‧Second conductive frame

4‧‧‧Package unit

41‧‧‧First light-transmissive package

42‧‧‧Second light-transmissive package

5‧‧‧ lens unit

50‧‧‧ lens colloid

W11‧‧‧ first outer conductor

W12‧‧‧First inner wire

W20‧‧‧ jumper wire

W21‧‧‧Second outer conductor

W22‧‧‧second inner wire

1A is a perspective view showing one of viewing angles of a substrate unit of a multi-chip package structure for generating a symmetric uniform light mixing source according to the present invention.

1B is a perspective view showing another viewing angle of a substrate unit of a multi-chip package structure for generating a symmetric uniform light mixing source according to the present invention.

2 is a perspective view showing a multi-chip package structure for generating a symmetrical uniform light-mixing light source according to the present invention, in which a light-emitting unit and a frame unit are disposed on a substrate unit.

3 is a perspective view of a multi-chip package structure for generating a symmetrical uniform light-mixing light source to electrically connect a light-emitting unit to a substrate unit and a frame unit.

4 is a perspective view showing a multi-chip package structure for generating a symmetrical uniform light-mixing light source according to the present invention, wherein a package unit is disposed on a substrate unit to cover the light-emitting unit.

FIG. 5 is a perspective view showing a multi-chip package structure for generating a symmetrical uniform light-mixing light source according to the present invention, wherein a lens unit is disposed on a substrate unit to cover the package unit.

1‧‧‧Substrate unit

10‧‧‧Substrate body

11‧‧‧Spanned Conductive Layer

12A‧‧‧First top conductive pad

13A‧‧‧Second top conductive pad

2‧‧‧Lighting unit

21‧‧‧First light-emitting element

22‧‧‧Second light-emitting element

3‧‧‧Frame unit

31‧‧‧First conductive frame

32‧‧‧Second conductive frame

W11‧‧‧ first outer conductor

W12‧‧‧First inner wire

W20‧‧‧ jumper wire

W21‧‧‧Second outer conductor

W22‧‧‧second inner wire

Claims (9)

A multi-chip package structure for generating a symmetrical uniform light-mixing light source, comprising: a substrate unit comprising a substrate body and at least one jumper-type conductive layer disposed on an upper surface of the substrate body; And comprising at least two first light-emitting elements disposed on the substrate body and electrically connected to the substrate body and at least two diagonally disposed on the substrate body and electrically connected to a second light-emitting element of the substrate body; a frame unit comprising at least two first conductive frames disposed on the substrate body diagonally surrounding the at least two first light-emitting elements and at least two a second conductive frame disposed diagonally on the substrate body and surrounding the at least two second light emitting elements, wherein the at least two first conductive frames are electrically connected to each other through the at least one jumper conductive layer And the at least two second conductive frames are electrically connected to each other through the at least one jumper wire; and a package unit including at least two covers at least two of the above a first light-emitting element and a first light-transmissive package surrounded by the at least two first conductive frames and at least two respectively covering the at least two second light-emitting elements and respectively by the at least two second conductive frames a second light-transmissive package; wherein the at least one jumper wire corresponds to the at least one jumper-type conductive layer and spans the at least one jumper-type conductive layer. The multi-chip package structure for producing a symmetrical uniform light-mixing light source according to claim 1, wherein the substrate unit comprises at least two first diagonally disposed on an upper surface of the substrate body. Top guide An electric pad, wherein the at least two first illuminating elements are electrically connected between the at least two first top conductive pads, wherein the substrate unit comprises at least two diagonally disposed on an upper surface of the substrate body And a second top conductive pad, wherein the at least two second light emitting elements are electrically connected between the at least two second top conductive pads. The multi-chip package structure for generating a symmetrical uniform light-mixing light source according to claim 2, wherein the substrate unit comprises at least one heat dissipation layer disposed on a lower surface of the substrate body and corresponding to the light-emitting unit. And at least two first bottom conductive pads respectively disposed on the lower surface of the substrate body and electrically connected to the at least two first top conductive pads respectively, and at least two disposed on the substrate body The second bottom conductive pads on the lower surface are respectively electrically connected to the at least two second top conductive pads. The multi-chip package structure for generating a symmetrical uniform light-mixing light source according to claim 3, wherein the substrate unit comprises at least two first conductive bodies penetrating the substrate body and at least two through the substrate body a second electrical conductor, each of the first electrical conductors is electrically connected between each of the corresponding first top conductive pads and each of the corresponding first bottom conductive pads, and each of the second electrical conductors Electrically connected between each corresponding second top conductive pad and each corresponding second bottom conductive pad. The multi-chip package structure for generating a symmetrical uniform light-mixing light source according to claim 2, wherein the at least two first light-emitting elements respectively transmit at least two first outer wires to be electrically connected to the above At least two first top conductive pads, and the at least two first light emitting elements respectively pass through at least two first inner wires to be electrically connected The at least two first conductive frames, wherein the at least two second light-emitting elements respectively pass through at least two second outer conductive wires to be electrically connected to the at least two second top conductive pads, respectively, and the at least two The second light emitting elements respectively pass through the at least two second inner wires to be electrically connected to the at least two second conductive frames respectively. The multi-chip package structure for generating a symmetrical uniform light-mixing light source according to claim 2, wherein an upper surface of each of the first light-emitting elements has at least two electrically connected to each corresponding one a top conductive pad and a first electrode of each corresponding first conductive frame, and an upper surface of each of the second light-emitting elements has at least two second top conductive pads electrically connected to each of the corresponding ones a second electrode of the second conductive frame corresponding to each one. The multi-chip package structure for generating a symmetrical uniform light-mixing light source according to claim 2, wherein the at least two first light-emitting elements and the at least two second light-emitting elements are symmetrically arranged in a matrix shape. And the at least two first conductive frames and the at least two second conductive frames are symmetrically arranged in a matrix shape. The multi-chip package structure for generating a symmetrical uniform light-mixing light source according to claim 1, wherein the at least two first light-transmissive packages are both of a phosphor colloid and a transparent colloid. One of the at least two second light-transmissive packages is one of a phosphor colloid and a transparent colloid. The multi-chip package structure for generating a symmetrical uniform light-mixing light source according to claim 1, further comprising: a lens unit including a substrate body disposed on the substrate body to cover the frame unit and the package The lens colloid of the unit.